Laser heating module, centralized uniform heat dissipation device, laser heating device, and circuit drive box

Abstract

The high-power laser heating module includes a heat dissipation block (1), a drive circuit board (11), a flexible circuit board (12), and a plurality of laser tool components (2). The heat dissipation block (1) has heat conduction bosses (14) formed thereon, the drive circuit board (11) is mounted on the heat dissipation block (1), the flexible circuit board (12) is attached to the heat dissipation block (1), the flexible circuit board (12) has a recess groove (122) formed thereon, and has bent portions (121) extending from the heat dissipation block (1) on both sides, used for electrical connection to the drive circuit board (11). Multiple laser tool components (2) are arranged in an array on the heat conduction bosses (14) of the heat dissipation block (1) and on the flexible circuit board (12). A laser tip (6) is installed inside each laser tool component (2), and the laser tip (6) of the laser tool component (2) is electrically connected to the flexible circuit board (12). The heat conduction bosses (14) are fitted into the insertion grooves (122) of the flexible circuit board (12), and the laser tool components (2) are thermally coupled to the heat dissipation block (1) without going through the flexible circuit board (12).

Description

Technical Field

[0001] This application relates to the field of laser application technologies, and particularly to a laser heating module, a concentrated and uniform heat dissipation device, a laser heating device, and a circuit drive box.

Background Art

[0002] With the development of laser devices such as semiconductor lasers and vertical cavity surface emitting lasers, the heating scenarios of high-power lasers are increasing, but factors such as high power consumption, difficult heat dissipation, and large volume restrict the development of products. The industry urgently demands an integrated and simple product solution considering each factor.

Summary of the Invention

[0003] A high-power laser heating module includes a heat dissipation block, a drive circuit board, a flexible circuit board, and a plurality of laser tool components. A cooling water channel is installed in the heat dissipation block, and a plurality of heat conduction bosses are integrally formed on the upper surface of the heat dissipation block. The drive circuit board is installed on the bottom surface of the heat dissipation block. The flexible circuit board is adhered to the heat dissipation block. An insertion groove through which the heat conduction boss passes is opened on the flexible circuit board. Both sides of the flexible circuit board have bending portions extending from the heat dissipation block, which are bent to the bottom surface of the heat dissipation block and electrically connected to the drive circuit board. The plurality of laser tool components are installed in an array on the heat conduction bosses of the heat dissipation block and on the flexible circuit board. A laser chip is installed in the laser tool component. The laser chip of the laser tool component is electrically connected to the flexible circuit board. The heat conduction boss is inserted into the insertion groove of the flexible circuit board. The laser tool component is thermally coupled and connected to the heat dissipation block without passing through the flexible circuit board.

[0004] The irradiation heating device for surface heating includes at least one set of module units, each set of module units including a fixed beam and a plurality of high-power laser heating modules as described above, the plurality of laser heating modules being installed along the longitudinal direction of the fixed beam, a mounting block being fixedly installed at the bottom of the heat dissipation block, mounting blocks being installed along both ends of the bent portion of the heat dissipation block in the longitudinal direction, and the mounting blocks being fixedly connected to the fixed beam.

[0005] The centralized uniform heat dissipation device includes a water supply mechanism, a water discharge mechanism, and at least one multi-channel macrochannel mechanism. The single multi-channel macrochannel mechanism includes a base plate and a plurality of multi-channel macrochannel modules, each of which has a single housing chamber, and a plurality of pairs of first water inlets and first water outlets are provided on the base plate, each pair of first water inlets and first water outlets communicating with a housing chamber, and a water channel is provided in the housing chamber such that water flows in from the first water inlets and out from the first water outlets, and the plurality of multi-channel macrochannel modules are distributed symmetrically on the base plate, the base plates of the plurality of multi-channel macrochannel mechanisms are aligned and in contact with each other, The water supply mechanism and the water discharge mechanism are each used to supply water to the multi-channel macrochannel modules and to discharge water from the multi-channel macrochannel modules, by communicating with the first water inlet and first water outlet of the multi-channel macrochannel modules, respectively.

[0006] The laser heating device includes a housing, a laser component, and a heat dissipation unit. The housing has a housing chamber, an opening that communicates with the housing chamber, and a gas filling port. The laser component is installed in the containment chamber, and the laser component includes an irradiating element, the irradiating element is provided corresponding to the aperture, and the irradiating element is capable of emitting a light ray through the aperture. The heat dissipation unit is installed in the containment chamber and used to dissipate heat from the irradiation element. Here, the gas filling port is used to connect to a gas filling device.

[0007] The circuit drive box includes a base, in which component devices are installed, and a plug-in section electrically connected to an external power supply is installed on the outer wall of the base, the component devices are electrically connected to the plug-in section, and the base is filled with thermally conductive silicone grease, which covers the component devices so as to conduct heat from the component devices to the base.

[0008] The laser module includes the circuit drive boxes and a plurality of chip lamp beads, wherein the plurality of circuit drive boxes are arranged in parallel on the surface of the water cooling plate and are electrically connected to an external power supply, and the plurality of chip lamp beads are arranged in parallel on the side of the water cooling plate away from the circuit drive boxes and are electrically connected in a one-to-one correspondence to the positions of the plurality of circuit drive boxes. [Brief explanation of the drawing]

[0009] To more clearly illustrate the embodiments of the present application or the technical means in the prior art, the drawings used in the description of the embodiments or the prior art are briefly described below. However, the drawings in the following description are merely embodiments of the present application, and those skilled in the art can obtain other drawings based on the disclosed drawings without any creative work. [Figure 1] This is a schematic diagram of the overall structure, mainly showing the heating module in some embodiments of the present invention. [Figure 2] This diagram primarily shows the structural schematic of laser tool components in several embodiments of the present invention. [Figure 3] This diagram primarily shows the heat dissipation block and flexible circuit board in some embodiments of the present invention. [Figure 4] This is an enlarged view of section A in Figure 3. [Figure 5] This is a cross-sectional view of a heat dissipation block in one of several embodiments of the present application. [Figure 6] This diagram primarily shows the structure of the housing in several embodiments of the present invention. [Figure 7] This is an explosion diagram of the housing in some embodiments of the present invention. [Figure 8] This is a cross-sectional view mainly showing the housing in some embodiments of the present application. [Figure 9] This is a schematic diagram of the structure of a centralized uniform heat dissipation device in several embodiments of the present invention. [Figure 10] This is a schematic diagram of the structure of a multi-channel macrochannel mechanism in several embodiments of the present invention. [Figure 11] This is a schematic diagram of the bottom plate structure of a multi-channel macrochannel mechanism in several embodiments of the present invention. [Figure 12] This is a schematic diagram of the structure of the top plate of a multi-channel macrochannel mechanism in several embodiments of the present invention. [Figure 13] This is a schematic diagram of the water supply mechanism in some embodiments of the present invention. [Figure 14] This is a schematic diagram of the water supply mechanism from a different angle in some embodiments of the present invention. [Figure 15] This is a cross-sectional view of a water supply mechanism in several embodiments of the present application. [Figure 16] This is a schematic diagram of the water discharge mechanism in some embodiments of the present invention. [Figure 17] This is a cross-sectional view of a water discharge mechanism in several embodiments of the present application. [Figure 18] This is a schematic diagram of the structure of a water discharge connection block in several embodiments of the present invention. [Figure 19] This is a schematic diagram of the structure of a laser heating device in several embodiments of the present invention. [Figure 20] Figure 19 is a schematic diagram of the laser heating device from a different viewpoint. [Figure 21] Figure 19 is a schematic diagram of the internal structure of the laser heating device. [Figure 22]It is a schematic assembly diagram of a heat dissipation component and a laser component in the laser heating device of FIG. 19. [Figure 23] It is a schematic structural diagram of a laser component in the laser heating device of FIG. 19. [Figure 24] It is a schematic structural diagram of a control component in the laser heating device of FIG. 19. [Figure 25] It is a schematic structural diagram of a laser module in some embodiments of the present application. [Figure 26] It is a schematic structural diagram of another laser module in some embodiments of the present application. [Figure 27] It is a schematic structural diagram III of another laser module in some embodiments of the present application. [Figure 28] It is a schematic structural diagram of another circuit drive box in some embodiments of the present application. [Figure 29] It is a cross-sectional view of a circuit drive box in some embodiments of the present application.

Mode for Carrying Out the Invention

[0010] Hereinafter, in accordance with the drawings in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described do 。

[0011] Referring to FIG. 1, the high-power laser heating module includes a heat dissipation block 1 And the drive circuit board 11 and the flexible circuit board 12 On the heat dissipation block 1, a plurality of laser tool components 2 are installed in an array. The heat dissipation block 1 Made from metal materials with high thermal conductivity For ease of any joining, the heat dissipation block 1 is installed in a square structure, that is, the surface of the heat dissipation block 1 for attaching the laser tool component 2 is square. The laser tool components 2 are distributed in an array at equal intervals on the heat dissipation block 1, and the area of the heat dissipation block 1 coincides with the light emitting surface.

[0012] Referring to Figure 1, a drive circuit board 11 is installed on the side wall of the heat dissipation block 1 away from the laser tool component 2. The drive circuit board 11 is fixed to the bottom wall of the heat dissipation block 1 with bolts, and the bottom wall of the heat dissipation block 1 is the side wall away from the laser tool component 2. The drive circuit board 11 is connected to an external power supply with wires.

[0013] Referring to Figures 1 and 3, a flexible circuit board 12 is installed between the heat dissipation block 1 and the laser tool component 2. Bent portions 121 for bonding to the side walls of the heat dissipation block 1 are connected to both ends of the flexible circuit board 12, and the bent portions 121 are electrically connected to the drive circuit board 11. Positioning notches 1211 are installed at both ends of the bent portions 121, and positioning ribs 13 for engaging with the notches are fixedly installed on the heat dissipation block 1. Both sides of the bent portions 121 abut against the positioning ribs 13, exerting a positioning effect on the bent portions 121, preventing loosening and displacement of the bent portions 121, and further preventing displacement of the entire flexible circuit board 12.

[0014] Referring to Figure 2, a laser chip 6 is installed inside the laser tool component 2, and the flexible circuit board 12 is electrically connected to the laser chip 6. The flexible circuit board 12 is a flexible circuit board, and an insulating layer 17 is installed between the flexible circuit board 12 and the heat dissipation block 1. The laser tool component 2 includes a substrate 21 and a box body 22. A transmission layer 211 is fixedly installed on the substrate 21, and the laser chip 6 is fixedly installed on the transmission layer 211. The substrate 21 is made of aluminum nitride, which has good thermal conductivity, a low coefficient of thermal expansion, is an electrical insulator, and has good dielectric properties. The box body 22 is fixedly installed on the substrate 21, and a glass piece 221 is installed on top of the box body 22 to allow laser light to pass through easily. A first pad 212 and a second pad 213 are fixedly installed on the bottom wall of the substrate 21. Both the first pad 212 and the second pad 213 are made of copper. Two first pads 212 are installed, and the two first pads 212 are distributed on both sides of the second pad 213. The first pads 212 are electrically connected to the flexible circuit board 12, and the laser chip 6 is electrically connected to the first pads 212 via the transmission layer 211. The laser chip 6 is connected to the flexible circuit board 12 via the first pads 212, and the laser chip 6 is located within the laser package, achieving thermoelectric isolation of the laser chip 6 and improving the heat dissipation effect of the laser chip 6.

[0015] Referring to Figure 2, a heat conduction boss 14 is integrally molded on the top wall of the heat dissipation block 1. The top wall of the heat dissipation block 1 is the side wall closest to the laser tool component 2. Multiple heat conduction bosses 14 are arranged parallel to each other and spaced apart. The length of the heat conduction bosses 14 is smaller than the width of the heat dissipation block 1, such that there is a certain distance between both ends of the heat conduction bosses 14 and the side wall of the heat dissipation block 1. The substrate 21 is fixedly installed on the heat conduction bosses 14. The heat conduction bosses 14 are fixed by welding to a second pad 213. By installing the second pad 213 at the bottom of the substrate 21, it is made easier to weld and fix the substrate 21 onto the heat conduction bosses 14.

[0016] Referring to Figures 2 and 4, the heat conduction boss 14 is installed parallel to the length direction of the bent portion 121, and an insertion groove 122 is provided on the flexible circuit board 12 for the heat conduction boss 14 to pass through. By fitting the heat conduction boss 14 into both sides of the insertion groove 122 of the flexible circuit board 12, the laser tool component 2 is thermally coupled and connected to the heat dissipation block 1 without going through the flexible circuit board 12, thereby improving heat dissipation efficiency. The heat conduction boss 14 engages with the insertion groove 122, and the length and width of the heat conduction boss 14 fit into the insertion groove 122, exerting a positional limiting effect on the flexible circuit board 12, effectively preventing displacement of the flexible circuit board 12. Furthermore, the heat conduction boss 14 passes directly through the flexible circuit board 12, thereby quickly transferring heat from the laser tip 6 into the heat dissipation block 1 via the heat conduction boss 14, effectively improving the heat dissipation effect.

[0017] In some embodiments, The thermal conductive boss 14 is aligned with the surface of the flexible circuit board 12, or is higher than the surface of the flexible circuit board 12. Refer to Figure 2, Since the heat conduction boss 14 is installed on the heat dissipation block 1 and the heat conduction boss 14 protrudes from the surface of the flexible circuit board 12, interference with the flexible circuit board 12 is prevented, the laser tool component 2 can be mounted flat on the heat conduction boss 14, and both the laser tool component 2 and the laser chip 6 on the entire heat dissipation block 1 can be kept flat. In addition, there is a gap between the laser tool component 2 and the flexible circuit board 12, so that the heat from the laser chip 6 is directly transferred to the heat conduction boss 14, making heat dissipation easier.

[0018] Referring to Figure 3, a mounting block 3 is fixedly installed at the bottom of the heat dissipation block 1. Mounting blocks 3 are installed along both ends of the bent portion 121 in the longitudinal direction of the heat dissipation block 1. Screw holes 33 are provided on the mounting blocks 3, and fitting grooves 34 are provided on the mounting blocks 3.

[0019] Referring to Figure 5, a cooling water supply 15 is installed inside the heat dissipation block 1, and a water supply pipe 31 and a water discharge pipe 32 are installed on the heat dissipation block 1. The water supply pipe 31 and the water discharge pipe 32 are in communication with the cooling water supply 15, and the water supply pipe 31 and the water discharge pipe 32 are located at opposite ends of the diagonal of the heat dissipation block 1, respectively. A heat dissipation structure of fin pins 16 is installed inside the cooling water supply 15, and the heat dissipation structure of fin pins 16 includes a plurality of vertically installed fin pins 16, the fin pins 16 are made of copper, the cross-section of the fin pins 16 is rhombic or rectangular, one end of the fin pins 16 is fixed and connected to the top wall of the heat dissipation block 1, and the other end is inserted into the cooling water supply 15 and in contact with the cooling water.

[0020] The heat generated by the laser tip 6 is transferred to the heat conduction boss 14, and then to the cooling water in the cooling water channel 15 via the heat dissipation structure of the fin pins 16, increasing the contact area with the cooling water. The heat dissipation structure of the fin pins 16 is installed in the cooling water channel 15 to increase the contact time between the cooling water and the heat dissipation block 1, thereby improving the heat dissipation effect.

[0021] This application Examples include Each heating module includes multiple laser chips 6, which are packaged within the workpiece 2. The laser chips 6 are distributed at equal intervals on a square-shaped heat dissipation block 1, with a drive circuit board 11 placed at the bottom of the heat dissipation block 1, and a flexible circuit board 12 positioned between the laser tool component 2 and the heat dissipation block 1. This facilitates the joining of the laser tool component 2 and achieves a seamless joining without any noticeable steps.

[0022] At the same time, the bent portion 121 formed on the flexible circuit board 12 is connected to the drive circuit board 11 at the bottom of the heat dissipation block 1, reducing the space occupied by the flexible circuit board 12, allowing the drive circuit board 11 to be placed at the bottom of the heat dissipation block 1, reducing the overall occupied area of ​​the module, and making the entire module more compact. Also,The circuit structures, including multiple laser chips 6, flexible circuit boards 12, and drive circuit boards 11, are all mounted on the same heat dissipation block 1, and by aligning the area of ​​the heat dissipation block 1 with the light-emitting surface, it becomes easy to freely join multiple laser heating modules to each other.

[0023] Examples of the present invention include: moreover, An irradiation heating device for surface heating is disclosed.

[0024] Refer to Figures 6 and 7, The device This includes at least one set of module units include Each set of module units includes a housing 4, a fixed beam 5, and multiple laser heating modules. The number of laser heating modules in each set of module units can be arbitrarily adjusted according to the actual needs, and in this embodiment, there are five laser heating modules.

[0025] Referring to Figures 7 and 8, multiple laser heating modules are installed along the longitudinal direction of the fixed beam 5, and the fixed beam 5 and the mounting block 3 are fixed and connected with bolts. The fixed beam 5 is installed in the middle of the heat dissipation block 1 and is positioned between the water supply pipe 31 and the water discharge pipe 32 to avoid interference. Furthermore, a fitting block 51 for insertion into a fitting groove 34 is fixedly installed on the fixed beam 5, and during installation, the fitting block 51 is inserted into the fitting groove 34 of the mounting block 3, playing a role in positioning relative to the fixed beam 5 and the heat dissipation block 1, and facilitating installation and fixing.

[0026] Referring to Figures 7 and 8, the housing 4 includes a bottom plate 41, an upper cover plate 42, and a lower cover plate 43. Both the upper cover plate 42 and the lower cover plate 43 are fixedly installed on the bottom plate 41. The housing 4 has a cavity, and the laser heating module is located within the cavity. The upper cover plate 42 is provided in an opening, and a window piece 421 is installed in the opening. Multiple window pieces 421 are installed along the length of the upper cover plate 42. The laser package faces the window pieces 421, and the irradiated laser can be emitted from the window pieces 421. A pressing ring 44 is fixedly installed on the top wall of the upper cover plate 42. The top wall of the upper cover plate 42 is a side wall that separates from the lower cover plate 43, and the pressing ring 44 is fixed to the top wall of the upper cover plate 42 via fixing bolts.

[0027] Specifically, referring to Figures 7 and 8, the side wall of the upper cover plate 42 has an engagement groove 422 along the length of the upper cover plate 42, and a first sealing ring 4221 is installed on the side wall of the engagement groove 422 away from the pressing ring 44. window The side wall of piece 421 engages with the engagement groove 422, and the pressing ring 44 presses the window piece 421 onto the first sealing ring 4221, thereby providing sealing and buffering effects.

[0028] Referring to Figures 7 and 8, a second sealing ring 411 is installed between the upper cover plate 42 and the top wall of the bottom plate 41, and a third sealing ring 412 is installed between the lower cover plate 43 and the bottom wall of the bottom plate 41. The sealing ring Both are made of rubber. Specifically, fitting grooves are provided in both the top wall and bottom wall of the base plate 41, the second sealing ring 411 is fitted into the fitting groove located in the top wall of the base plate 41, and the third sealing ring 412 is fitted into the fitting groove located in the bottom wall of the base plate 41.

[0029] Referring to Figures 9, 10, and 11, the present invention provides a centralized uniform heat dissipation device for a high-power multi-module chip, the centralized uniform heat dissipation device comprising a water supply mechanism 2, two water discharge mechanisms 3, a chip 6, and eight multi-channel macro-channel mechanisms 1.

[0030] Here, a single multi-channel macrochannel mechanism 1 includes a base plate 105 and four multi-channel macrochannel modules. Each multi-channel macrochannel module has one containment chamber 101. Eight pairs of first water inlets 102 and first water outlets 103 are provided on the base plate 105, with two pairs of first water inlets 102 and first water outlets 103 corresponding to each multi-channel macrochannel module. Each pair of first water inlets 102 and first water outlets 103 communicates with one containment chamber 101, and a water channel is provided within the containment chamber 101 so that water flows in from the first water inlets 102 and flows out from the first water outlets 103. The containment chamber 101 becomes a multi-channel macrochannel, where the water channels are densely distributed within the containment chamber 101, the heat of the water is completely absorbed within it, and sufficient heat dissipation is achieved. The four multi-channel macrochannel modules are symmetrically distributed on the base plate 105, and the base plates 105 of the eight multi-channel macrochannel mechanisms 1 are aligned and in parallel contact with each other. The symmetrical distribution of the multi-channel macrochannel modules and the parallel contact of the multi-channel macrochannel mechanisms 1 make full use of the space, and the heat dissipation surfaces are aligned, allowing for large-area and uniform heat dissipation simply by placing the chip 6 flat on the multi-channel macrochannel mechanisms 1.

[0031] The water supply mechanism 2 and the water discharge mechanism 3 described above are connected to the first water inlet 102 and the first water discharge 103 of the 32 multi-channel macrochannel modules of the eight multi-channel macrochannel mechanisms 1, respectively, thereby supplying water to the multi-channel macrochannel modules and discharging water from the multi-channel macrochannel modules.

[0032] 8By arranging the multi-channel macrochannel mechanisms 1 side by side, each multi-channel macrochannel mechanism 1 dissipates heat to the chip 6 attached to its upper surface. The multi-channel macrochannel modules in each multi-channel macrochannel mechanism 1 have a housing chamber 101 that stores water, and the water flows through it, thereby achieving a heat dissipation effect. Furthermore, the multi-channel macrochannel mechanisms 1, which are arranged in a flat line, have a small volume and a large surface area. As the water flows through the housing chamber 101, heat is absorbed and discharged, and the water circulates through the housing chamber 101 repeatedly before being discharged, thereby achieving continuous heat dissipation. In addition, in this invention, water is supplied to the multi-channel macrochannel modules via a water supply mechanism 2 and then discharged from a water discharge mechanism 3. The water supply mechanism 2 ensures that the amount of water supplied to each multi-channel macrochannel mechanism 1 is the same, and uniform heat dissipation is ensured. Furthermore, the multi-channel macrochannel mechanism 1 is equipped with four multi-channel macrochannel modules, which distribute the size of each containment chamber 101, allowing for rapid water exchange within the containment chamber 101 and achieving a good heat dissipation effect.

[0033] In order to achieve a good heat dissipation effect, the first water inlet 102 and the first water outlet 103, which are opened on the bottom plate 105, are located on both sides of the housing chamber 101, and the path diameter through which water flows through the housing chamber 101 is maximized, thereby achieving an optimal heat dissipation effect. Here, the first water inlet 102 is located in the middle of the bottom plate 105, and the first water outlet 103 is located on both sides of the bottom plate 105, and the corresponding multi-channel macrochannel modules are distributed in a line on the bottom plate 105, and here, the first water inlet 102 and the first water outlet 103 on both sides of the housing chamber 101 of the multi-channel macrochannel modules are located correspondingly on both sides of the bottom plate 105.

[0034] Furthermore, the multi-channel macrochannel mechanism 1 in the device provided in this application further includes one top plate 4 and 48 partition plates 104, the 48 partition plates 104 mounted vertically on a bottom plate 105 and partitioning 32 housing chambers 101, and the top plate 4 is placed flat on the partition plates 104 and is located on the side of the housing chambers 101 away from the bottom plate 105. As shown in Figure 10, six partition plates 104 are mounted corresponding to each multi-channel macrochannel module, where four partition plates 104 surround a rectangular shape on the outside, and the other two partition plates 104 intersect in a cross shape, dividing the multi-channel macrochannel mechanism 1 into four regions, each region corresponding to one housing chamber 101. The partition plates 104 and the top plate 4 surround the space above the housing chambers 101, increasing the airflow range, thereby achieving a good heat dissipation effect. Furthermore, as shown in Figure 12, 22 protruding strips 401 are arranged in a row on the top plate 4, and the protruding strips 401 are located on the surface of the top plate 4 that is separated from the bottom plate 105. When the chip 6 is placed on the protruding strips 401, there is space below the chip 6, allowing air to flow and resulting in a higher heat dissipation effect for the chip 6.

[0035] Referring to Figures 13 and 14, the present invention provides a specific implementation method for the water supply mechanism. The water supply mechanism 2 has a first housing, which has two parallel side walls. Each of the two side walls has an inlet 201 and an outlet 202, which corresponds to the number of first inlets 102. The outlet 202 communicates with the first inlets 102 on the bottom plate 105. As a result, water flows into the water supply mechanism 2 from the inlets 201 and then into the multi-channel macrochannel module. By supplying water centrally to all multi-channel macrochannel modules with a single water supply mechanism 2, it is possible to ensure uniform water supply to each multi-channel macrochannel module and achieve uniform heat dissipation.

[0036] Furthermore, referring to Figure 15, the first housing has a first water storage chamber 204 and a second water storage chamber 203 arranged side by side, with a communication port 205 between the two water storage chambers, a water inlet 201 communicating with the first water storage chamber 204, and the second water storage chamber 203 communicating with 16 outlets 202. In the water supply mechanism 2, the water flow enters from the water inlet 201, passes through the first water storage chamber 204, enters the second water storage chamber 203 through the communication port 205, and the water from the second water storage chamber 203 flows out through the outlets 202. In this process, the direction of the water flow and the outlets can be aligned through the cooperation of the first water storage chamber 204, the communication port 205, and the second water storage chamber 203. Furthermore, the storage function of the second water storage chamber 203 allows the water flow velocity from many outlets 202 to be matched, thereby ensuring consistent water flow rates in the 32 multi-channel macrochannel modules and achieving consistent heat dissipation performance.

[0037] Figure 16 Referring to the above, the water discharge mechanism 3 has a second housing, the second housing has two side walls perpendicular to each other, and the two side walls each have openings, a second water outlet 301 and a second water inlet 302 which corresponds to the number of first water outlets 103, the second water inlet 302 of the water discharge mechanism communicates with the first water outlet 103 of the multi-channel macrochannel module, and the second water outlet 302 discharges water from within the water discharge mechanism 3. The number is 2, and the two The water discharge mechanism 3 is distributed symmetrically on both sides of the water supply mechanism 2.

[0038] Furthermore, referring to Figure 17, the second housing has a third water storage chamber 303 and a fourth water storage chamber 304 arranged side by side, with a connection port 305 between the two water storage chambers. The third water storage chamber 303 communicates with the second water inlet 302, and the fourth water storage chamber 304 communicates with the second water outlet 301. The water flow enters the third water storage chamber 303 from the second water inlet 302 and then flows out through the connection port 305 to the second water outlet 301 in the fourth water storage chamber 304. This process ensures that the water pressure experienced by the water flow entering from each second water inlet 302 is equal, thereby ensuring that the water flow through each second water inlet 302 is equal. This is an active cooperation with the water supply mechanism 2, thereby achieving better uniform heat dissipation.

[0039] Referring to Figure 18, the centralized uniform heat dissipation device for a high-power multi-module chip provided in the present invention further includes a water discharge connection block 5, which has a fifth water storage chamber, and the water discharge connection block 5 is provided with a drain port 501 and a butt connection port 502 corresponding to the number of water discharge mechanisms 3, the butt connection port 502 is in communication with the second water discharge port 301 and the fifth water storage chamber, and the drain port 501 is used to discharge water from within the water discharge connection block. The water discharge connection block 5 merges the water flows from the two left and right water discharge mechanisms 3 and discharges them centrally, thereby making the structure rationally compact.

[0040] Based on the above, the device provided in this application is installed by arranging multiple multi-channel macrochannel mechanisms 1 side by side, thereby increasing the heat dissipation area while reducing the volume occupied. Furthermore, each multi-channel macrochannel mechanism 1 is equipped with four multi-channel macrochannel modules, further subdividing the water flow into four parts. The smaller the amount of water flowing through the containment chamber 101, the faster the flow velocity, and thus achieving an excellent heat dissipation effect. In addition, the more multi-channel macrochannel modules there are, the more uniform the heat dissipation effect of each multi-channel macrochannel module can be ensured by unified water supply and drainage by the water supply mechanism 2 and the water discharge mechanism 3, thereby achieving a uniform heat dissipation effect.

[0041] As shown in Figures 19 and 20, the present invention provides a laser heating device comprising a housing 10, a laser component, and a heat dissipation unit. The housing 10 has a housing chamber 11, an opening communicating with the housing chamber 11, and a gas filling port 12. The laser component is installed in the housing chamber 11 and includes an irradiating element, which is installed corresponding to the opening and can emit light through the opening. The heat dissipation unit is installed in the housing chamber 11 and is used to dissipate heat from the irradiating element, and the gas filling port 12 is used to connect a gas filling device.

[0042] By applying the present invention, a gas-filling component is installed on the device, and when the device is in operation, the gas-filling component can be used to fill the containment chamber 11 with gas. This reduces the probability of outside air entering the containment chamber 11 and minimizes the possibility of outside air contaminating the environment inside the containment chamber 11. This protects the laser component, allows the laser component to operate in a relatively safe environment, and is also advantageous for the stable operation of the laser component.

[0043] In the embodiment of the present invention, the gas-filled component is supplied with an inert gas into the containment chamber 11, and two gas filling ports 12 are provided. This allows the amount of gas filled into the gas-filled component to be maximized, and because the arrangement of electrons in each electron layer of the atoms of the inert gas has reached a stable number, the atoms are less likely to lose or gain electrons and are less likely to chemically react with other substances. As a result, the properties of the inert gas are extremely inert. This reduces the probability of the laser component coming into contact with the outside air, avoids the risk of oxidation of the laser component, and ensures the normal operation of the device.

[0044] Simultaneously, the opening is provided at the bottom of the housing 10, and the irradiation direction of the irradiation element is set from the top of the housing 10 toward the bottom of the housing, thereby allowing the device to irradiate and heat an object at the bottom of the housing. As an option, the opening may be provided at other locations on the housing 10, and the specific installation situation should be selected according to the operating environment of the device.

[0045] In other embodiments of the present application, the gas filling port 12 The number can also be set to any other number. The specific installation configuration should be selected according to the device's operating environment, thereby expanding the device's applicability and meeting the user's needs.

[0046] As shown in Figure 20, the laser heating device further includes a sealing member 20, which is installed in the opening to seal the containment chamber 11, and is configured to allow light emitted from the irradiation element to pass through. By installing the above structure, when the gas-filled component fills the containment chamber 11 with gas, the pressure inside the containment chamber 11 can be made greater than the pressure of the outside air, thereby reducing the risk of outside air flowing into the containment chamber 11, further protecting the laser unit and improving the protective effect of the gas-filled component.

[0047] In the embodiment of the present invention, the sealing member 20 is specifically installed as a transparent window member, thereby not only satisfying the sealing requirement of the device but also allowing light from the irradiation element to pass through the window member and irradiate and heat the object. At the same time, seven sealing members 20 are provided in the present invention, and the seven sealing members 20 are joined together to seal the opening, thereby making it easy to replace the sealing members 20, improving the efficiency of attachment and detachment by workers and improving the maintenance efficiency of the device.

[0048] As shown in Figures 21 and 22, the heat dissipation unit includes a liquid supply line 31 and a drainage line 32. Here, the second discharge port 321 of the liquid supply line 31 is in communication with the first water supply port 311 of the drainage line 32, and the heat dissipation medium can flow through the liquid supply line 31 and the drainage line 32, with the liquid supply line 31 being used to dissipate heat from the irradiation element.

[0049] In this embodiment of the present invention, the outer wall of the drainage pipe 32 is bonded to the back of the irradiation element, and the laser heating device further includes a water pump, which is connected in series between the supply pipe 31 and the drainage pipe 32. The heat dissipation medium is circulated and flowed within the supply pipe 31 and the drainage pipe 32, and by utilizing the water pump, the heat dissipation medium can be recycled, thereby reducing the operating cost of the device.

[0050] The heat dissipation unit can also be configured as an air-cooled type, and the specific installation configuration should be selected according to the operating environment of the device, as long as it can meet the heat dissipation requirements of the device.

[0051] Specifically, the extending directions of the liquid supply line 31, the drainage line 32, and the laser component are parallel to each other, and at the same time, the end of the first water inlet 311 of the liquid supply line 31 and the end of the second water outlet 321 of the drainage line 32 both penetrate the housing 10. In this application, the extending direction of the liquid supply line 31 is the same as the extending direction of the housing chamber 11. By setting it in this way, the internal space of the housing chamber 11 can be used rationally, reducing the mounting space for the liquid supply line 31, the drainage line 32, and the laser component, thereby reducing the overall volume of the device, which is advantageous for miniaturizing the actual device.

[0052] At the same time, drainage pipes 32 are installed on both sides of the supply pipe 31, thereby increasing the outflow rate of the heat dissipation medium, improving the circulation efficiency of the heat dissipation medium, and enhancing the heat dissipation effect of the heat dissipation components. Here, the heat dissipation medium includes water, ethylene glycol, and additives. The water and ethylene glycol are mainly used to lower the temperature of the laser components, and the additives suppress corrosion and oxidation inside the pipes, preventing damage to the inner walls of the pipes after the heat dissipation medium has been used for a long time.

[0053] As shown in Figure 23, the laser component further includes a circuit board 41 electrically connected to the irradiating element, the circuit board 41 having a first plate 411, a second plate 412 and a third plate 413 connected sequentially, the second plate 412 having a first side installed away from the opening and a second side installed facing the opening, the first plate 411 and the third plate 413 are located on the first side, the irradiating element is installed on the second side, and the heat dissipation unit is located between the first plate 411 and the third plate 413. In this application, the irradiating element is composed of a plurality of chip lamp beads 42, and the chip lamp beads 42 The secondPackaged on a plate 412, and with a maximum power of 8W per chip, a single module can achieve a laser power output of 2816W. The chip lamp bead 42 consists of a laser chip, a 5050 heatsink, and a protective sheet. The laser chip is packaged on the 5050 heatsink, and the protective sheet protects the laser chip. At the same time, the laser chip in this application is a vertical cavity surface-emitting laser chip. be Furthermore, the threshold current of the vertical cavity surface-emitting laser is small (1mA), and at the same output power, it is more efficient than the laser efficiency of distributed feedback semiconductor lasers and semiconductor lasers. It is also less prone to generating chirps than distributed feedback semiconductor lasers, so even with data speeds of 10Gbps, laser modulation of the vertical cavity surface-emitting laser can be directly employed. Compared to other lasers, the manufacturing and adjustment of collimated vertical cavity surface-emitting lasers are both easy, which can reduce the production cost of the equipment. Moreover, the oscillation wavelength of the vertical cavity surface-emitting laser is very stable, ensuring stability during equipment operation.

[0054] As an option, the laser tip can also be selected with other power specifications, such as 10W or 12W, provided that it meets the device's usage requirements.

[0055] Furthermore, the laser heating device further includes a control unit, which is electrically connected to the circuit board 41 and controls the operating state of the laser component. This configuration makes it easy for the user to control the device via the control unit and ensures safety during device operation.

[0056] Specifically, the control unit includes multiple control panels 51, and the laser component includes multiple circuit boards 41, with each control panel 51 corresponding to each circuit board 41 on a one-to-one basis. This configuration allows for individual control of each circuit board 41 by a single control panel 51, preventing mutual interference between circuit components and maintaining stability during device operation. In this application, the number of circuit boards 41 is set to 16, allowing for a total power of 45 kW and meeting ultra-high power heating requirements.

[0057] In the embodiment of the present invention, the control unit further includes a drive panel 53, which is electrically connected to a circuit board and a control panel, respectively, and eight conductive pillars 52 are installed between the control panel 51 and the drive panel 53. This configuration increases the current flow rate and facilitates power supply from the power supply device to the circuit board 41.

[0058] As shown in Figure 24, the laser heating device further includes an adapter component, which is installed in the housing chamber 11. One end of the adapter component is electrically connected to a power supply, and the other end of the adapter component is electrically connected to a control component and a laser unit, respectively. The adapter component is used to supply power to the control component and the laser unit. By installing the above structure, external voltages can be converted to voltages suitable for device operation, protecting internal components and preventing damage to them. This is advantageous for the normal use of the device and extends its lifespan.

[0059] As shown in Figures 20 and 21, the adapter component includes a conductive member 60, an insulating member 70, and an adapter member 80. Conductive members 60 are installed on both sides of the laser component, the insulating member 70 is installed between the conductive member 60 and the housing 10, one end of the adapter member 80 is electrically connected to the conductive member 60, and the other end of the adapter member 80 is electrically connected to the outside. In the embodiment of the present application, both the conductive member 60 and the adapter member 80 are made of copper blocks. Copper has low resistivity, excellent ductility (ductility of electrical copper is 30% or more), high strength, excellent fatigue resistance, and high current capacity. Low voltage loss Because it possesses these characteristics, it not only satisfies the conductivity requirements of the device but also reduces the production cost of the device and is advantageous in improving the conductivity of the device. Furthermore, the insulating member 70 can prevent current leakage, which is advantageous in ensuring the safety of the device during use.

[0060] As one option, aluminum can be selected as the material for the conductive component 60, and the specific installation conditions should be selected according to the operating environment of the device.

[0061] Simultaneously, the laser heating device further includes a heavy-duty connector, which is connected to three long cables supplied from the outside and to adapter members 80 via short cables. The three adapter members 80 are mounted on a conductive member 60, thereby enabling the introduction of external current into the product. By installing a heavy-duty connector, This can improve the safety performance of the device.

[0062] Specifically, the conductive member 60 extends along the length of the housing 10, and the electrodes of the conductive member 60 located on both sides of the laser component are different, and the conductive member 60 is installed in a one-to-one correspondence with the adapter member 80. By installing the above structure, not only can the internal space of the housing chamber 11 be utilized more effectively, but at the same time, the introduction and outflow of external positive and negative power supplies can be realized, thereby meeting the power supply requirements of the device.

[0063] In this application, the upper part of the housing 10 has four handles. An installation is provided to facilitate the transport of the equipment by the user. .

[0064] Furthermore, one side of the housing 10 has a control panel, which has multiple communication interfaces and signal lights. This allows the user to connect to an external control host via the communication interfaces and perform functional control of the product. The signal lights can display the operating status of the product in a timely manner, minimizing equipment failure.

[0065] Referring to Figures 28 and 29, one embodiment of the present invention provides a circuit drive box 100, which includes a base 110, in which component devices are installed, and a plug-in section electrically connected to an external power supply is installed on the outer wall of the base 110, the component devices are electrically connected to the plug-in section, the base 110 is filled with thermally conductive silicone grease 130, the thermally conductive silicone grease 130 covers the component devices, thereby conducting heat from the component devices to the base 110.

[0066] This invention provides a circuit drive box 100, which has a base 110 installed inside the base 110, and inside the base 110 there is a housing cavity in which component devices are arranged, and the component devices can ensure high power consumption application scenes. A plug-in part is installed on the outer wall of the base 110, and the plug-in part is electrically connected to an external power supply, and the component devices are electrically connected to the plug-in part, and the plug-in part enables circuit conductivity. The housing cavity inside the base 110 is filled with thermally conductive silicone grease 130, and the thermally conductive silicone grease 130 is an organic silicon material with high thermal conductivity insulation that can exert good heat conduction effect on the component devices. The thermally conductive silicone grease 130 covers the component devices, and when the component devices are in a high-power application scene, they release a large amount of heat, and at this time the thermally conductive silicone grease 130 can conduct heat well to the outside of the base 110, thereby achieving good heat dissipation inside the circuit drive box 100.

[0067] The circuit drive box 100 provided in the embodiment of the present invention includes a base 110, in which component devices are installed, and a plug-in section electrically connected to an external power supply is installed on the outer wall of the base 110. The component devices are electrically connected to the plug-in section, enabling conductivity between the circuit of the circuit drive box 100 and the external power supply. Thermally conductive silicone grease 130 is filled inside the base 110, and the thermally conductive silicone grease 130 covers the component devices, conducting heat from the component devices to the base 110. The installation of thermally conductive silicone grease 130 enables good heat conduction to high-power component devices. The circuit drive box 100 obtained by the above design achieves good conductivity with the circuit of the external power supply, improves heat conduction performance, safety and reliability of the circuit drive box 100, and extends the lifespan of the circuit drive box 100.

[0068] one In a feasible embodiment, as shown in Figure 29, the component device includes a drive element 141 and a first circuit board 142 electrically connected to the drive element 141, the first circuit board 142 being installed in the base 110.

[0069] Furthermore, as shown in Figure 29, the circuit drive box 100 further includes a cover plate 150 which is installed covering the base 110, and the component assembly further includes a second circuit board 143 which is electrically connected to the drive element 141, the second circuit board 143 which is installed within the cover plate 150 and electrically connected to the drive element 141 via a conductive copper column 1431.

[0070] Specifically, the component device includes a drive element 141 and a first circuit board 142 electrically connected to the drive element 141. The drive element 141 and the first circuit board 142 are installed in a base 110, and the circuit drive box 100 further includes a cover plate 150, which is installed covering the base 110 and communicates with a housing cavity in the base 110. A second circuit board 143 is installed in the cover plate 150, and the second circuit board 143 is electrically connected to the drive element 141 via a conductive copper column 1431. The plug-in section is electrically connected to the second circuit board 143 to ensure good conductivity of the circuit.

[0071] With this type of installation, if circuit continuity is ensured, the components of the device inside the circuit drive box 100 are stacked sequentially, reducing the volume of the circuit drive box 100 and making the structure more compact.

[0072] For example, as shown in Figures 28 and 29, the plug-in section includes a plug 122 and a socket 121 that are inserted and removed from each other. One side of the socket 121 is fixedly connected to the cover plate 150 and protrudes into the cover plate 150, enabling an electrical connection with the second circuit board 143. The other end of the plug 122, away from the socket 121, is electrically connected to an external power supply, enabling circuit conductivity.

[0073] Specifically, the plug-in section includes a plug 122 and a socket 121. The plug 122 and the socket 121 are connected by insertion and removal. The far end of the socket 121 is fixedly connected to the cover plate 150 and electrically connected to a second circuit board 143 that protrudes into the cover plate 150 and is installed inside the cover plate 150, thereby creating electrical conductivity between the plug-in section and the component device circuit. The end of the plug 122 that is not connected to the socket 121 is electrically connected to an external power supply. When the plug 122 is inserted into the socket 121, the circuit is made conductive, and when the plug 122 is disconnected from the socket 121, the circuit is disconnected. The insertion and removal connection method of the plug-in section makes it more convenient to connect or disconnect the circuit, and the plug-in section is bonded and fixed to the cover plate 150, allowing the structure of the circuit drive box 100 to be more compact and smaller.

[0074] Examples of the present invention Furthermore, A laser module 200 is provided, which includes the circuit drive box 100 and a plurality of chip lamp beads 210, wherein the plurality of circuit drive boxes 100 are arranged in parallel on the surface of the water cooling plate 220 and are electrically connected to an external power supply, and the plurality of chip lamp beads 210 are arranged in parallel on the side of the water cooling plate 220 away from the circuit drive boxes 100 and are electrically connected in a one-to-one correspondence to the positions of the plurality of circuit drive boxes 100.

[0075] Specifically, as shown in Figures 25 and 27, the present invention provides a laser module 200 which includes a plurality of circuit drive boxes 100 and a plurality of chip lamp beads 210, wherein the number of circuit drive boxes 100 and chip lamp beads 210 are the same. In a preferred embodiment of the present invention, as shown in Figure 25, there are eight circuit drive boxes 100 and eight chip lamp beads 210, the eight circuit drive boxes 100 are arranged in parallel on the surface of a water-cooling plate 220, the chip lamp beads 210 are arranged in parallel on the surface of the water-cooling plate 220 away from the circuit drive boxes 100, and each circuit drive box 100 corresponds to one chip lamp bead 210, and the two are electrically connected via circular holes opened on the water-cooling plate 220. The circuit drive boxes 100 are electrically connected to an external power supply, and the chip lamp beads 210 can be lit by the conduction of the circuit of the external power supply. The water cooling plate 220 can provide a good heat dissipation environment for the circuit drive box 100 and the chip lamp beads 210. In a high-power operating environment, the heat released from the electrical component structure inside the circuit drive box 100 is conducted to the base 110 via the thermally conductive silicone grease 130, and further heat can be transferred from the base 110 to the water cooling plate 220. The specific structure and beneficial effects of the circuit drive box 100 have already been described in detail, so they will not be described here.

[0076] The laser module 200 provided in the embodiment of the present invention has a more compact structure by arranging a plurality of circuit drive boxes 100 in parallel on the surface of a water cooling plate 220. The water cooling plate 220 also cools the circuit drive boxes 100, improving the thermal conductivity, safety and reliability of the laser module 200, and extending the lifespan of the circuit drive boxes 100. Each circuit drive box 100 is electrically connected to an external power supply and a chip lamp bead 210, ensuring circuit conductivity. The laser module 200 obtained by the above design achieves good conductivity with the circuits of the external power supply and chip lamp beads 210, has a more compact structure, improves thermal conductivity, safety and reliability of the laser module 200, and extends the lifespan of the laser module 200.

[0077] For example, as shown in Figure 26, a water supply pipe 221 and a water discharge pipe 222 are installed on the water cooling plate 220, and the water supply pipe 221 and the water discharge pipe 222 are used to connect to the cooling water pipeline, respectively.

[0078] Specifically, as shown in Figure 26, the water cooling pipe is equipped with a water supply pipe 221 and a water discharge pipe 222. The water supply pipe 221 and the water discharge pipe 222 are connected to the cooling water pipeline, and the cooling water pipeline allows the cooling water inside the pipe to flow into the water supply pipe 221, and the cooling water that has absorbed heat is continuously discharged from the water discharge pipe 222. By installing the water supply pipe 221 and the water discharge pipe 222, the cooling water in the water cooling plate 220 can be continuously replaced, ensuring a good cooling effect for the water cooling plate 220, further improving the heat dissipation efficiency of the laser module 200, and extending the lifespan of the laser module 200.

[0079] In one feasible embodiment, the laser module 200 further includes a mounting base 230, the side of the water-cooling plate 220 away from the circuit drive box 100 fixedly connected to the mounting base 230, the mounting base 230 exhibiting a hollow annular structure, the hollow portion of which is used to mount a plurality of chip lamp beads 210 installed in parallel.

[0080] Specifically, the laser module 200 further includes a mounting base 230, which has a rectangular hollow annular structure. The side of the water-cooling plate 220 away from the circuit drive box 100 is fixedly connected to the mounting base 230, and the hollow portion is used to mount multiple chip lamp beads 210 installed in parallel, ensuring that light can be emitted without obstruction when the chip lamp beads 210 are lit. The installation of the mounting base 230 provides a fixed role for mounting each component and improves connection stability.

[0081] one In a feasible embodiment, the laser module 200 further includes a positive copper block 240 and a negative copper block 250, wherein the positive copper block 240 is attached to one side of the circuit drive boxes 100 along the direction of arrangement of the multiple circuit drive boxes 100, and the negative copper block 250 is attached to the side of the circuit drive boxes 100 away from the positive copper block 240 along the direction of arrangement of the multiple circuit drive boxes 100, and the sides of the positive copper block 240 and the negative copper block 250 closer to the mounting seat 230 are fixedly connected to the mounting seat 230 via insulating seats 231.

[0082] Specifically, the laser module 200 further includes a positive copper block 240 and a negative copper block 250, the positive copper block 240 and the negative copper block 250 being attached to opposite sides of a plurality of circuit drive boxes 100, and the positive copper block 240 and the negative copper block 250 being attached along the arrangement direction of the plurality of circuit drive boxes 100, an insulating seat 231 being installed on the side of the positive copper block 240 and the negative copper block 250 closest to the mounting seat 230, the insulating seat 231 being used to fix the positive copper block 240 and the negative copper block 250 to the insulating seat 231, respectively.

[0083] Furthermore, the circuit drive box 100 includes a plug-in section, which includes a socket 121 and a plug 122. Positive electrode cable 241 and negative electrode cable 251 extend from the plug 122. The positive electrode cable 241 is connected to the positive electrode copper block 240 via a cable lock block 252, and the negative electrode cable 251 is connected to the negative electrode copper block 250 via a cable lock block 252.

[0084] Specifically, the circuit drive box 100 includes a plug-in section, which includes a socket 121 and a plug 122 that are plugged in and unplugged. A positive electrode cable 241 and a negative electrode cable 251 extend from one end of the plug 122 away from the socket 121, and these cables are electrically connected to a positive electrode copper block 240 and a negative electrode copper block 250, respectively, via a cable lock block 252. This configuration ensures good circuit conductivity in the laser module 200 while also maintaining a compact structure.

[0085] one In a feasible embodiment, an external connection conductive block 260 is fixedly connected to the positive copper block 240 and the negative copper block 250, respectively.

[0086] Specifically, an external connection conductive block 260 is fixedly connected to the positive copper block 240 and the negative copper block 250, respectively. The external connection conductive block 260 is connected to the positive and negative cables of the external power supply, respectively, and can finally be connected to the plug 122 of the plug-in section of the circuit drive box 100. When the plug 122 of the plug-in section is inserted into the socket 121, the circuit becomes conductive, and the circuit drive box 100 is driven to light up the chip lamp bead 210. When the plug 122 and socket 121 of the plug-in section are disconnected, the circuit is disconnected, and at this time the chip lamp bead 210 turns off. The installation of the external connection conductive block 260 ensures good conductivity between the laser module 200 and the external power supply, improving the reliability of the laser module 200.

[0087] The above-described embodiments represent only a few embodiments of the present application, and although the descriptions are relatively specific and detailed, they should not be understood as limiting the scope of the claims. Furthermore, those skilled in the art can make several modifications and improvements without departing from the idea of ​​the present application, and these fall within the scope of protection. Therefore, the scope of protection of this patent application shall be based on the attached claims.

Claims

1. It includes a heat dissipation block, a drive circuit board, a flexible circuit board, and multiple laser tool components, Cooling water is installed inside the heat dissipation block, and multiple heat conduction bosses are integrally formed on the upper surface of the heat dissipation block. The drive circuit board is installed on the bottom surface of the heat dissipation block. The flexible circuit board is attached to a heat dissipation block, and the flexible circuit board has a groove through which a heat conduction boss passes. The flexible circuit board has bent portions extending from the heat dissipation block on both sides, and is bent to the bottom surface of the heat dissipation block and electrically connected to the drive circuit board. The plurality of laser tool components are arranged in an array on the heat conduction bosses of the heat dissipation block and on a flexible circuit board, a laser chip is installed inside each laser tool component, the laser chip of each laser tool component is electrically connected to the flexible circuit board, the heat conduction boss is fitted into the fitting groove of the flexible circuit board, and the laser tool components are thermally coupled to the heat dissipation block without going through the flexible circuit board. High-power laser heating module.

2. The side wall of the heat conduction boss abuts against the side wall of the fitting groove. The high-power laser heating module according to feature 1.

3. The laser tool component includes a substrate for mounting the laser chip, the substrate being fixedly mounted on a thermal conductive boss. The high-power laser heating module according to feature 1.

4. A transmission layer is installed between the substrate and the laser chip, and a first pad for electrical connection to a flexible circuit board is fixedly installed on the bottom wall of the substrate. The high-power laser heating module according to feature 3.

5. The heat conduction boss is aligned with the surface of the flexible circuit board, or is higher than the surface of the flexible circuit board. The high-power laser heating module according to feature 4.

6. Positioning notches are provided at both ends of the bent portion, and positioning ribs are fixedly installed on the heat dissipation block to engage with the positioning notches. The high-power laser heating module according to feature 1.

7. A water supply pipe and a water discharge pipe are installed on the heat dissipation block, and the water supply pipe and the water discharge pipe are each connected to a cooling water supply. The high-power laser heating module according to feature 1.

8. A fin-pin heat dissipation structure is installed in the aforementioned cooling water supply. The high-power laser heating module according to feature 7.

9. The present invention comprises at least one set of module units, each set of module units comprising a fixed beam and a plurality of the high-power laser heating modules as described in any one of claims 1 to 8, wherein the plurality of laser heating modules are installed along the longitudinal direction of the fixed beam, a mounting block is fixedly installed at the bottom of the heat dissipation block, mounting blocks are installed along both ends of the bent portion of the heat dissipation block in the longitudinal direction, and the mounting blocks are fixedly connected to the fixed beam. Irradiation heating device for surface heating.

10. The mounting block has a fitting groove, and a fitting block for insertion into the fitting groove is fixedly installed on the fixed beam. The irradiation heating device according to feature 9.

11. It includes a water supply mechanism, a water discharge mechanism, and at least one multi-channel macrochannel mechanism, The single multi-channel macrochannel mechanism includes one base plate and a plurality of multi-channel macrochannel modules, each of which has one housing chamber, and a plurality of pairs of first water inlets and first water outlets are provided on the base plate, each pair of first water inlets and first water outlets communicating with a housing chamber, and a water channel is provided in the housing chamber such that water flows in from the first water inlets and out from the first water outlets, and the plurality of multi-channel macrochannel modules are distributed symmetrically on the base plate, the orientation of the base plates of the plurality of multi-channel macrochannel mechanisms is the same, and they are in contact with each other side by side. The water supply mechanism and the water discharge mechanism are each used to supply water to and discharge water from the multi-channel macrochannel modules, by communicating with the first water inlet and first water discharge port of a plurality of multi-channel macrochannel modules, respectively. Centralized uniform heat dissipation device.

12. The first water inlet and first water outlet, which are provided in the bottom plate, are located on both sides of the containment chamber. The centralized uniform heat dissipation device according to feature 11.

13. The multi-channel macrochannel mechanism further includes a top plate and a plurality of partition plates, the plurality of partition plates mounted vertically on the bottom plate and partitioning a plurality of storage chambers, and the top plate is placed flat on the partition plates and positioned on the side away from the bottom plate of the storage chambers. The centralized uniform heat dissipation device according to feature 11.

14. Multiple protruding strips are arranged in a row on the top plate, and the protruding strips are located on the surface of the top plate that is separated from the bottom plate. The centralized uniform heat dissipation device according to feature 13.

15. The water supply mechanism has a first housing, the first housing has two parallel side walls, and on each of the two side walls there are openings for a water inlet and an outlet corresponding to the number of first water inlets, and the outlet communicates with the first water inlet on the bottom plate so that water flows into the water supply mechanism from the water inlet and then further into the multi-channel macrochannel module. The centralized uniform heat dissipation device according to feature 11.

16. The first housing contains a first water storage chamber and a second water storage chamber arranged side by side, with a communication port between the two water storage chambers. The water supply port communicates with the first water storage chamber, and the second water storage chamber communicates with multiple outlets. The centralized uniform heat dissipation device according to claim 15.

17. The water discharge mechanism has a second housing, the second housing has two mutually perpendicular side walls, and on each of the two side walls there are openings: a second water outlet and a second water inlet, the same number as the first water outlet. The second water inlet of the water discharge mechanism communicates with the first water outlet of the multi-channel macrochannel module, and the second water outlet discharges water from within the water discharge mechanism. The centralized uniform heat dissipation device according to feature 11.

18. The second housing contains a third water storage chamber and a fourth water storage chamber arranged side by side, with a connection port between the two water storage chambers. The third water storage chamber communicates with the second water supply port, and the fourth water storage chamber communicates with the second water discharge port. The centralized uniform heat dissipation device according to feature 17.

19. The number of the aforementioned water discharge mechanisms is at least one pair, and each pair of water discharge mechanisms is distributed symmetrically on both sides of the water supply mechanism. The centralized uniform heat dissipation device according to feature 18.

20. The aforementioned centralized uniform heat dissipation device further includes a water discharge connection block, the water discharge connection block having a fifth water storage chamber, the water discharge connection block having a drain port and a butt connection port corresponding to the number of water discharge mechanisms, the butt connection port communicating with the second water discharge port and the fifth water storage chamber, and the drain port is used to discharge water from the water discharge connection block. The centralized uniform heat dissipation device according to feature 19.

21. It includes a housing, a laser component, and a heat dissipation unit. The housing has a housing chamber, an opening that communicates with the housing chamber, and a gas filling port. The laser component is installed in the containment chamber, and the laser component includes an irradiating element, the irradiating element is provided corresponding to the aperture, and the irradiating element is capable of emitting a light ray through the aperture. The heat dissipation unit is installed in the containment chamber and used to dissipate heat from the irradiation element. Here, the gas filling port is used to connect to a gas filling device. Laser heating device.

22. The laser heating device further includes a sealing member, the sealing member being installed in the opening and sealing the housing chamber, and the sealing member being configured to transmit light emitted from the irradiation element. The laser heating apparatus according to feature 21.

23. The heat dissipation unit includes a liquid supply line and a drainage line, the second discharge port of the liquid supply line communicates with the first water supply port of the drainage line, and the heat dissipation medium can flow through the liquid supply line and the drainage line. The aforementioned liquid supply line is used to dissipate heat from the irradiation element. The laser heating apparatus according to feature 21.

24. The extending direction of the liquid supply line, the extending direction of the drainage line, and the extending direction of the laser component are parallel to each other, and / or The first water inlet end of the liquid supply pipeline and the second water outlet end of the drainage pipeline both penetrate the housing. The laser heating apparatus according to feature 23.

25. The laser component further includes a circuit board electrically connected to the irradiating element, the circuit board having a first plate, a second plate, and a third plate connected sequentially, the second plate having a first side provided away from the opening and a second side provided toward the opening, the first plate and the third plate being located on the first side, the irradiating element being installed on the second side, and the heat dissipation unit being located between the first plate and the third plate. A laser heating apparatus according to any one of claims 21 to 24.

26. The laser heating device further includes a control unit, which is electrically connected to the circuit board and controls the operating state of the laser component. The laser heating apparatus according to feature 25.

27. The control unit includes a plurality of control panels, the laser component includes a plurality of circuit boards, and the control panels are installed in a one-to-one correspondence with the circuit boards. The laser heating apparatus according to feature 26.

28. The laser heating device further includes an adapter component, the adapter component is installed in the housing chamber, one end of the adapter component is electrically connected to a power supply, and the other end of the adapter component is electrically connected to the control panel and the circuit board, respectively, and the adapter component is used to supply power to the control component and the circuit board. The laser heating apparatus according to feature 27.

29. The adapter component includes a conductive member, an insulating member, and an adapter member, wherein the conductive member is installed on both sides of the laser component, the insulating member is installed between the conductive member and the housing, one end of the adapter member is electrically connected to the conductive member, and the other end of the adapter member is electrically connected to the outside. The laser heating apparatus according to feature 28.

30. The conductive member extends along the length of the housing, and the electrodes of the conductive member located on both sides of the laser component are different, and the conductive member is installed in a one-to-one correspondence with the adapter member. The laser heating apparatus according to feature 29.

31. Including a base, a component device is installed inside the base, a plug-in section electrically connected to an external power supply is installed on the outer wall of the base, the component device is electrically connected to the plug-in section, the base is filled with thermally conductive silicone grease, and the thermally conductive silicone grease covers the component device so as to conduct heat from the component device to the base. Circuit drive box.

32. The component device includes a drive element and a first circuit board electrically connected to the drive element, wherein the first circuit board is installed within the base. The circuit drive box according to feature 31.

33. The circuit drive box further includes a cover plate which is installed covering the base, a second circuit board which is installed inside the cover plate, and the second circuit board which is electrically connected to the drive element via a conductive copper column. The circuit drive box according to feature 32.

34. The plug-in section includes a plug and socket that are inserted and removed, the side of the socket away from the plug being fixed to the cover plate and protruding into the cover plate to provide electrical connection with the second circuit board, and the other end of the plug away from the socket being electrically connected to an external power supply to provide electrical continuity to the circuit. The circuit drive box according to feature 33.

35. The invention comprises the circuit drive box and a plurality of chip lamp beads according to any one of claims 31 to 34, wherein the plurality of circuit drive boxes are arranged in parallel on the surface of a water cooling plate and are electrically connected to an external power supply, and the plurality of chip lamp beads are arranged in parallel on the side of the water cooling plate away from the circuit drive boxes and are electrically connected in a one-to-one correspondence to the positions of the plurality of circuit drive boxes. Laser module.

36. A water supply pipe and a water discharge pipe are installed on the water cooling plate, and the water supply pipe and the water discharge pipe are used to connect to the cooling water pipeline, respectively. The laser module according to feature 35.

37. The laser module further includes a mounting base, the side of the water-cooling plate away from the circuit drive box being fixedly connected to the mounting base, the mounting base having a hollow annular structure, and the hollow portion of the mounting base being used to mount a plurality of the chip lamp beads arranged in parallel. The laser module according to feature 35.

38. The laser module further includes a positive copper block and a negative copper block, wherein the positive copper block is attached to one side of the circuit drive boxes along the direction of arrangement of the plurality of circuit drive boxes, and the negative copper block is attached to the side of the circuit drive box away from the positive copper block along the direction of arrangement of the plurality of circuit drive boxes, and the sides of the positive copper block and the negative copper block closer to the mounting seat are fixedly connected to the mounting seat via insulating seats. The laser module according to feature 37.

39. The circuit drive box includes a plug-in section, the plug-in section includes a socket and a plug, one end of the socket is connected to the cover plate of the circuit drive box, and a positive electrode cable and a negative electrode cable extend from the other end of the plug away from the socket, the positive electrode cable is connected to the positive electrode copper block via a cable lock block, and the negative electrode cable is connected to the negative electrode copper block via a cable lock block. The laser module according to feature 38.

40. The positive copper block and the negative copper block are each fixedly connected to an external conductive connection block. The laser module according to feature 38.

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