Hybrid Test Socket

Abstract

An exemplary embodiment of the present invention discloses a hybrid test socket comprising: a body having a hole formed through a first surface facing the terminals of a semiconductor device and a second surface facing the pads of a test apparatus; a contact inserted into the hole, with one end in contact with the terminals of the semiconductor device and the other end in contact with the pads of the test apparatus and having elastic force in the pressing direction; and a first member bonded to one end of the contact.

Description

Technical Field

[0005]

[0001] The present invention relates to a hybrid test socket including a socket body made of an elastic insulator and contact pins having an elastic force.

Background Art

[0002] Generally, semiconductor ICs of the BGA (ball grid array) or LGA (Land Grid Array) type are ultimately subjected to measurement of characteristics or defect inspection by various electrical tests using an inspection apparatus. Here, a test socket is used to electrically connect the circuit pattern of the inspection printed circuit board installed in the inspection apparatus and the lead (contact ball) or land of the BGA type or LGA type semiconductor IC.

[0003] The contact used in a test socket must be subjected to sufficient pressing force for reliable contact with the lead (terminal) of the IC. Therefore, the contact needs to have sufficient elastic contact force within an appropriate range. To satisfy such conditions, there are various forms of contacts.

[0004] On the other hand, a large number of spring contacts are installed in a housing of the test socket according to a predetermined rule. Recently, various semiconductor elements have been developed, and customer needs for spring contacts of various lengths have been increasing. Conventionally, pogo pin type spring contacts often cannot meet the required performance of customers.

[0005] For example, conventionally, when manufacturing a pogo pin type spring contact to meet customer requirements, the length of the contact pins constituting the spring contact must be increased. Furthermore, when designing the test socket, the depth of the pinhole into which the spring contact is inserted must be machined to accommodate the width of the contact pin tip, taking the length of the contact pin into consideration.

[0006] As spring contact pins are gradually becoming smaller for faster data processing and lower power consumption, it is not only difficult to machine long pin holes with a diameter that accommodates the width of the contact pin tip, but even if it is possible to machine long pin holes with a relatively small diameter that accommodates the width of the contact pin tip, the machining costs are high and it is difficult to guarantee quality.

[0007] In other words, conventional spring contacts have difficulty meeting the requirements of customers who demand spring contacts of various lengths.

[0008] On the other hand, another conventional technology is the rubber type socket, which consists of an insulating body made of solidified insulating silicone that is elastic, and a conductive silicone part that is formed perpendicularly through the insulating body to correspond to the terminals of the device.

[0009] In this type of rubber socket, a silicone mixture, in which insulating silicone and conductive powder are mixed in a predetermined ratio, is placed in a mold. When a strong magnetic field is formed at the location where the conductive silicone portion is to be formed, the conductive powder of the silicone mixture gathers at the magnetic field formation location, and finally the molten silicone mixture solidifies, forming conductive silicone portions in a predetermined arrangement on the insulating body.

[0010] These rubber-type sockets have a slower elastic response speed compared to pin-type contacts (spring contacts), and their elasticity is lost during repeated testing, resulting in a significantly reduced service life. Consequently, they are used for a short number of times, leading to increased costs due to frequent replacement. Furthermore, due to the characteristic of decreasing elastic durability over time, the elastic rebound force becomes zero or extremely low during long-term (more than one week) continuous compression tests, causing short circuits and making them unsuitable for long-term testing.

[0011] Furthermore, rubber-type sockets have the problem that their elastic properties are greatly affected by temperature, and the uniformity of resistance can be reduced by the mixing of insulating silicone or elastomer. [Overview of the project] [Problems that the invention aims to solve]

[0012] Therefore, the present invention aims to provide a hybrid test socket that combines the advantages of both pogo pin type and rubber type in order to solve the above-mentioned problems.

[0013] One of the various objectives of this invention is to provide a test socket suitable for testing high-speed signal semiconductor devices. Another objective is to provide a test socket with improved noise shielding performance between adjacent contact pins and improved coaxial alignment performance of the contact pins.

[0014] Furthermore, one of the various challenges of the present invention is to provide a test socket that can minimize the effects of temperature changes (high temperature stability).

[0015] One of the various challenges of the present invention is to provide a hybrid test socket equipped with various types of contact pins to meet customer performance requirements. [Means for solving the problem]

[0016] Various embodiments for solving the problems of the present invention can disclose a hybrid test socket comprising: a body having a hole formed through a first surface facing the terminals of a semiconductor device and a second surface facing the pads of a test apparatus; a contact inserted into the hole, with one end in contact with the terminals of the semiconductor device and the other end in contact with the pads of the test apparatus and having elastic force in the pressing direction; and a first member bonded to one end of the contact.

[0017] The first member may also be provided between the inner surface of the hole on the first surface side and the periphery of one end of the contact.

[0018] The body may include a base that forms the outer shape of the test socket, and an elastic insulator that is filled inside the base and then hardened to form elastic force, wherein the hole is formed through the elastic insulator.

[0019] The contact may be characterized by including a pair of contact pins and a spring coupled between the pair of contact pins to provide elastic force.

[0020] The pair of contact pins may be characterized by being of the same shape and being coupled in directions that intersect each other.

[0021] The contact pin may be characterized by including a main body portion that forms a predetermined width and thickness, a head portion formed at one end of the main body portion that contacts the object to be inspected, and a leg portion that extends along the longitudinal direction of the main body portion in a direction opposite to the head portion.

[0022] The head portion may be characterized by being formed by rolling a plate-shaped strip that is integrally molded with the main body portion.

[0023] The head can be characterized by having multiple tip portions formed at its upper end.

[0024] The first member can be provided between at least a part of the circumferential surface of the head and the inner surface of the hole.

[0025] The second surface can be characterized in that a stepped hole is formed so as to form a step toward the first surface.

[0026] The stepped hole can be formed with a diameter larger than the diameter of the hole.

[0027] The first member can be adhered in a state of being provided on one end surface of the contact, and can be pushed between the peripheral edge of one end of the contact and the hole and cured.

[0028] The contact can include a contact pin and an elastic member including conductive particles filled between the contact pin and the hole.

[0029] The contact pin can be formed by rolling a plate-shaped strip.

[0030] The conductive particles can be aligned by applying a magnetic force to the elastic member simultaneously with the adhesion of the first member.

[0031] Each feature of the above-described embodiments can be realized in combination in other embodiments as long as it does not conflict with or is not exclusive of other embodiments.

Advantages of the Invention

[0032] According to various embodiments of the present invention, it is possible to easily control the upper contraction of the socket body made of an elastic insulator.

[0033] In addition, it is easy to align the contact pin contact portions provided inside the socket body, and the coaxial alignment of the contact pins can be improved.

[0034] Furthermore, improved insulation between fine pitches reduces noise during testing of high-speed signal semiconductor devices.

[0035] The effects of the present invention are not limited to those described above, and other effects not mentioned can be clearly seen by a person of the ordinary skill from the following description. [Brief explanation of the drawing]

[0036] [Figure 1] This figure shows a hybrid test socket, which is one embodiment of the present invention. [Figure 2] This figure shows the spring contact pins in Figure 1. [Figure 3] Figure 2 is an exploded perspective view. [Figure 4] This figure shows the contact pins in Figure 2. [Figure 5] This figure shows the contact pins in Figure 2. [Figure 6] This figure shows the contact pins in Figure 2. [Figure 7] This figure shows the contact pins in Figure 2. [Figure 8] This figure shows the contact pins in Figure 2. [Figure 9] This diagram shows the manufacturing process of the hybrid test socket shown in Figure 1. [Figure 10] This figure shows a hybrid test socket, which is another embodiment of the present invention. [Figure 11] This figure shows the contact pins in Figure 10. [Modes for carrying out the invention]

[0037] Specific embodiments of the present invention will be described below with reference to the drawings. The following detailed description is provided to aid in a comprehensive understanding of the methods, apparatus and / or systems described herein. However, this is illustrative only, and the present invention is not limited thereto.

[0038] In describing embodiments of the present invention, if it is determined that a specific explanation of known technologies related to the present invention may obscure the gist of the invention, such detailed explanation will be omitted. Furthermore, terms used later are defined in consideration of the functions of the present invention, and these may vary depending on the intent or conventions of the user or operator. Therefore, their definitions should be based on the overall content of this specification.

[0039] The terms used in the detailed description are solely for the purpose of describing embodiments of the invention and should not be restrictive. Unless otherwise explicitly stated, singular expressions include the plural meaning.

[0040] In this description, expressions such as “includes” or “comes with” are intended to indicate a certain characteristic, number, step, action, element, part thereof, or combination thereof, and should not be interpreted as excluding the existence or possibility of one or more other characteristics, numbers, steps, actions, elements, part thereof, or combination thereof, other than those described.

[0041] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are used to distinguish a component from other components, and the terms do not limit the essence, procedure, or order of the component.

[0042] Figure 1 shows a hybrid test socket, which is one embodiment of the present invention.

[0043] The following describes a hybrid test socket, which is one embodiment of the present invention, with reference to Figure 1.

[0044] The hybrid test socket may include a body 10 and contacts 30. The body 10 may be formed of a material that is elastic under pressure from a semiconductor device, and the contacts 30 may be provided with a physically elastic configuration (e.g., a spring) or be formed of a materially elastic configuration (e.g., silicon powder mixed with conductive particles).

[0045] More specifically, the body 10 may have holes formed through a first surface 11 facing the terminals of a semiconductor device and a second surface 12 facing the pads of a test device. The diameter d1 of the holes is formed to be the same as or larger than the maximum diameter of the contact 30, and the contact 30 can be inserted into the holes.

[0046] In other words, the contact 30 is inserted into the hole, with one end in contact with the terminal of the semiconductor device and the other end in contact with the pad of the test apparatus, and can have elastic force in the pressing direction. The detailed configuration of the contact 30 according to an exemplary embodiment of the present invention will be described in more detail below with reference to Figures 2 to 8.

[0047] On the other hand, the body 10 may include bases 11, 12 that form the outer shape of the test socket, and an elastic insulator 13 that is filled inside the bases 11, 12 and then cured to form an elastic force.

[0048] The bases 11 and 12 can be formed by a first surface 11 and a second surface 12, and the holes can be formed while penetrating the elastic insulator filled inside the bases 11 and 12, since the holes penetrate the first surface 11 and the second surface 12.

[0049] On the other hand, the first member 50 can be bonded to one end of the contact 30. The one end of the contact 30 may refer to the contact end of the contact 30 located on the first surface 11 side that contacts the terminal of the semiconductor device when the contact 30 is inserted into the hole.

[0050] The first member 50 can be provided between the inner surface of the hole formed on the first surface 11 and the periphery of one end of the contact 30. The first member 50 is made of a flexible material and is bonded to one end surface of the contact 30, then pressed between the periphery of one end of the contact 30 and the hole and hardened, thereby providing the space between the inner surface of the hole formed on the first surface 11 and the periphery of one end of the contact 30. Therefore, the first member 50 can be made of a silicon-based material whose properties change with heat.

[0051] The inclusion of the first member 50 makes it easy to control the upper contraction of the socket body 10, which includes the elastic insulator 13.

[0052] If the socket body 10 were made of a material that does not have elasticity, unlike a typical spring contact pin type socket, then the socket body would not contract, and if the first member 50 were provided, it could actually act as a factor that hinders the contraction force of the spring contact pin. However, as described above, this embodiment is a hybrid test socket that combines the advantages of a typical spring contact pin type socket (a type of socket with a small spring contact pin) and a silicone rubber type socket. Therefore, by controlling the upper contraction of the socket body 10 via the first member 50, durability can be increased.

[0053] Furthermore, the first member 50 improves the coaxial alignment of the contacts 30 inside the body 10 which includes the elastic material, thereby improving the positioning of the contact points of the contacts 30.

[0054] Furthermore, since the first component 50 is formed from silicon, the insulation between fine pitches is improved, and noise can be reduced when testing high-speed signal semiconductor devices.

[0055] Such a first member 50 can be appropriately selected to meet customer needs, with a Shore hardness between 20A and 80A. If the hardness of the first member 50 deviates from this range, it may be difficult to achieve the effects described above.

[0056] For example, if the hardness of the first member 50 is higher than the aforementioned range, it acts as a factor that inhibits the elastic force of the contact 30, and a larger load may be required during testing. In such cases, the load-related performance requirements requested by the customer may not be met, or the durability of the test socket may be reduced.

[0057] On the other hand, a step hole h2 can be formed on the second surface 12. The step hole h2 can be provided by forming a step in the direction from the second surface 12 toward the first surface 11. In such a shape of step hole h2, the diameter d2 of the step hole h2 can be formed to be larger than the diameter d1 of the hole.

[0058] Such step holes h2 can further enhance the durability of the hybrid test socket, an exemplary embodiment of the present invention, by distributing the load of the test socket that is repeatedly pressed between the terminals of the semiconductor device and the pads of the test equipment. If step holes h2 as in this embodiment are not provided, the body would have to absorb all of the load around the contacts, which could reduce durability.

[0059] Figure 2 shows the spring contact pin of Figure 1, Figure 3 is an exploded perspective view of Figure 2, and Figures 4 to 8 show the contact pin of Figure 2.

[0060] The following describes a hybrid test socket and contacts applied to the hybrid test socket, which are embodiments of one invention, with reference to Figures 1 to 8.

[0061] The contact 30 in this embodiment may include a spring contact pin configuration. That is, it may include two contact pins 31 and 35 and a spring 33 that provides physical elastic force to the contact 30.

[0062] More specifically, the contact 30 may include a pair of contact pins 31, 35 and a spring 33, the spring 33 being coupled between the pair of contact pins 31, 35 and providing elastic force to the contact 30.

[0063] A coil-type compression spring having a predetermined length along the longitudinal direction of the contact 30 can be applied to the contact 33, which is located between the first contact pin 31 and the second contact pin 35 in the contact 30, and when the first contact pin 31 and the second contact pin 35 are compressed in the longitudinal direction, the spring 33 can provide a restoring force to return each contact pin 31 and 35 to their positions before compression, with respect to the spring 33.

[0064] In this embodiment, the pair of contact pins 31 and 35 are provided with the same shape and can be connected in a direction that intersects each other. It goes without saying that they may also be provided with different shapes and connected with a spring in between.

[0065] Hereinafter, the pair of contact pins will be referred to as the first contact pin 31 and the second contact pin 35. In this embodiment, the pair of contact pins 31 and 35 are provided with the same shape, so the configuration of the contact pins will be described with the first contact pin 31 as the reference.

[0066] The contact pin 31 may include a main body 312, a head 311, and a leg 313.

[0067] The main body portion 312 has a space S1 formed in the center of each of its two sides, with a predetermined width and length in the longitudinal direction. The lower end of the space S1 can have a stepped locking step (not shown) formed thereon, and the upper end of the space S1 extends to the upper end of the head portion 311. The locking step (not shown) means that when the second contact pin 35 is coupled to the first contact pin 31 in a direction that intersects with it, the end of the leg portion 353 of the second contact pin 35 is locked.

[0068] The head portion 311 can be composed of a plate-shaped strip at the upper end of the main body portion 312, having the same length on both sides relative to the center of the main body portion 312, with an upper tip portion 3110 formed along the upper tip. The plate-shaped strip may include a first strip section 311a and a second strip section 311b, both having the same distance on both sides from the central portion 3111 of the main body portion 312.

[0069] In other words, the head 311 can be provided with a cylindrical shape having an overall diameter d3, formed by rolling the first strip section 311a and the second strip section 311b in a semi-circular arc shape relative to the central portion 3111. Furthermore, it is preferable that the width W1 of the central portion 3111, which forms the reference point for each strip to be rolled, corresponds to the width of the space S1. This is because if the width W1 of the central portion 3111 is smaller or larger than the width of the space S1, the defect rate in sheet metal fabrication (stamping) of the contact pin may increase.

[0070] On the other hand, the head portion 311 can be provided with a cylindrical crown shape by the tip portion 3110. With such a shape or configuration of the head portion 311, the ball portion of the BGA can be stably grounded and press against the test socket, thereby improving the accuracy of the test.

[0071] On the other hand, the legs 313 can be a pair formed as symmetrical extensions from the main body 312, and a predetermined space S2 is formed between the pair of legs, which can guide each leg when the first contact pin 31 and the second contact pin 35 are connected in a direction that intersects with each other.

[0072] Furthermore, in order to easily assemble the contact 30 so that the second contact pin 35 intersects the first contact pin 31, an inclined surface 3120 can be formed on the portion where the pair of legs 313 extend from the main body 312.

[0073] More specifically, the leg portion 313 may have a locking member formed at its end, and the locking member may include a corner portion 3131 that is in the same plane as the tip portion 3110 and electrically contacts the terminal when the contact 30 is compressed in the pressing direction, a guide surface 3132 that extends from the corner portion 3131 while forming a predetermined incline and facing each other, and an inflection end 3133 that forms a step toward the outside of the space S2 from the guide surface 3132.

[0074] In this structure, the guide surface 3132 contacts and connects with the inclined surface 3120 when each contact pin is assembled, allowing the pair of contact pins to be easily assembled. The inflected end 3133 engages with a locking step (not shown) when each contact pin is assembled, preventing the pair of contact pins from unintentionally separating after they have been connected.

[0075] Figure 9 shows the fabrication process for the hybrid test socket shown in Figure 1.

[0076] The following describes the manufacturing process of a hybrid test socket, which is one embodiment of the present invention, with reference to Figure 9.

[0077] Referring to Figure 9(a), the body of the test socket can have holes h1 formed in the hardened elastic insulator 13 by jig work or laser processing. The formed holes can have a diameter d1 that is the same as or larger than the diameter d3 of the contact pin head.

[0078] Referring to Figures 9(b) and 9(c), after the contact 30 is inserted into the hole h1, the film 51 on which the first member 50 is laminated is bonded to the upper part of the first surface 11, so that the first member 50 is positioned between the inner surface of the hole on the first surface 11 side and the periphery of one end of the contact 30.

[0079] More specifically, the film 51 can be heat-pressed to ensure that the first member 50 is well pressed between the inner surface of the hole on the first surface 11 and the periphery of one end of the contact 30. The heat-pressed first member 50 can be provided between at least a portion of the circumferential surface of the head 311 and the inner surface of the hole h1. The tip portion 3110 can also be exposed to the outside by penetrating the first member 50 during the pressing of the first member 50, depending on its shape.

[0080] In this state, the first member 50 hardens, and the manufacturing process of a hybrid test socket, which is an exemplary embodiment of the present invention, can be completed as shown in Figure 9(d).

[0081] Figure 10 shows a hybrid test socket, which is another embodiment of the present invention, and Figure 11 shows the contact pins of Figure 10.

[0082] Figures 10 and 11 below show a hybrid test socket with a different contact configuration than those shown in Figures 1 to 9, and will be explained focusing on the differences from the embodiments described above.

[0083] The contact 70 applied to the hybrid test socket of this embodiment is formed by rolling a contact pin 71 which is made of sheet metal in the form of a plate material. The contact pin 71 is formed in a shape similar to a coil-type compression spring, and its end can be formed in a crown shape by a plurality of tip portions 711.

[0084] In this shape or structure, the contact 70 of this embodiment can have the role of a spring applied to a spring contact pin performed by the contact pin 71.

[0085] Furthermore, as the plate material is rolled to form the contact 70, a space can be created inside it, and this space can be filled with an elastic member 73 containing conductive particles. More specifically, the elastic member 73 can be formed by filling the space between the contact pin 71 and the hole with silicon containing metallic conductive particles and then curing it.

[0086] On the other hand, the first member 50 can be provided between the end of the contact 70, including the tip portion 711, and the hole. For such a structure, the first member 50 can be heat-pressed on the first surface 11 as described above.

[0087] However, since the contact 70 in this embodiment is filled with an elastic member 73 containing conductive particles, it is necessary to align the conductive particles by magnetism in order to improve the electrical contact capability of the contact 70.

[0088] Therefore, in this embodiment, in order to simplify the process and to allow the first member 50 to be easily pressed and positioned between the end of the contact 70 and the hole, the conductive particles can be aligned by applying a magnetic force to the elastic member 73 at the same time as the adhesion of the first member 50. That is, the process of heat-pressing the film and the process of applying magnetism to the conductive particles can be performed simultaneously.

[0089] Although various embodiments of the present invention have been described in detail above, a person with ordinary skill in the art to which the present invention pertains will understand that various modifications are possible to the above embodiments without departing from the scope of the present invention. Therefore, the scope of the rights of the present invention should not be limited to the above embodiments, but should be defined not only by the claims described later, but also by equivalent claims, etc.

Claims

1. A body having a hole formed through the first surface facing the terminals of a semiconductor device and the second surface facing the pads of a test device, A contact is inserted into the aforementioned hole, with one end in contact with the terminal of the semiconductor device and the other end in contact with the pad of the test apparatus, and having elastic force in the pressing direction. A hybrid test socket comprising a first member bonded to one end of the aforementioned contact.

2. The hybrid test socket according to claim 1, characterized in that the first member is also provided between the inner surface of the hole on the first surface side and the periphery of one end of the contact.

3. The aforementioned body is A base that forms the outer shape of the test socket, The base includes an elastic insulator that is filled inside the base and then hardened to form an elastic force, The hybrid test socket according to claim 2, characterized in that the hole is formed through the elastic insulator.

4. The aforementioned contact is A pair of contact pins, The hybrid test socket according to claim 3, further comprising a spring coupled between the pair of contact pins to provide elastic force.

5. The hybrid test socket according to claim 4, characterized in that the pair of contact pins are of the same shape and are coupled in directions that intersect each other.

6. The aforementioned contact pin is A main body that forms a predetermined width and thickness, A head is formed at one end of the main body and comes into contact with the object to be inspected, The hybrid test socket according to claim 5, characterized in that it includes a leg portion extending in a direction opposite to the head portion along the longitudinal direction of the main body portion.

7. The aforementioned head is The hybrid test socket according to claim 6, characterized in that a plate-shaped strip, which is integrally molded with the main body, is formed by rolling.

8. The hybrid test socket according to claim 7, characterized in that the head has a plurality of tip portions formed at its upper end.

9. The hybrid test socket according to claim 8, characterized in that the first member is provided between at least a portion of the circumferential surface of the head and the inner surface of the hole.

10. The hybrid test socket according to claim 3, characterized in that the second surface has step holes formed such that they form a step toward the first surface.

11. The hybrid test socket according to claim 10, characterized in that the step hole is formed with a diameter larger than the diameter of the hole.

12. The hybrid test socket according to claim 2, characterized in that the first member is bonded to one end face of the contact and is pressed between the periphery of one end of the contact and the hole and hardened.

13. The aforementioned contact is Contact pin and, The hybrid test socket according to claim 3, further comprising an elastic member containing conductive particles that are filled between the contact pin and the hole.

14. The hybrid test socket according to claim 13, characterized in that the contact pin is formed by rolling a plate-shaped strip.

15. The hybrid test socket according to claim 13, characterized in that the conductive particles are aligned by applying a magnetic force to the elastic member at the same time as the adhesion of the first member.

Images