Improved reflector for processing chamber

Abstract

A reflector for use in a semiconductor processing chamber is provided, comprising a body and a bottom plate connected to the lower part of the body, the bottom plate having a bottom surface, a top surface, and one or more sides connecting the bottom surface to the top surface. The cross-section of the bottom plate, extending to the opposing positions of one or more sides, includes a center. The cross-section is divided into two or more sectors extending from the center of the cross-section. The cross-section also includes a cooling channel having an inlet and one or more outlets.

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure generally relate to an improved reflector for use in a processing chamber, such as a semiconductor processing chamber.

Background Art

[0002]

[0002] By cleaning the interior of a processing chamber, such as a semiconductor processing chamber, the product quality of substrates processed within the processing chamber can be improved. Since heat can assist in removing deposits on the surfaces of components inside the processing chamber, the interior of the processing chamber is often heated during such cleaning procedures. Generally, the higher the temperature, the higher the cleanliness that can be obtained and / or the more rapid completion of the cleaning procedure becomes possible.

[0003]

[0003] High temperature can improve the cleaning of the processing chamber, but high temperature can also damage components within the chamber that are exposed to the high temperature of the cleaning process. As the dimensions of semiconductor components continue to increase, the requirements for cleanliness also continue to increase. Therefore, there is a continuing need for methods and related apparatus that enable improved cleaning procedures.

Summary of the Invention

[0004]

[0004] In one embodiment, a reflector for use in a semiconductor processing chamber is provided, having a body and a bottom plate connected to the lower part of the body, the bottom plate having a bottom surface, a top surface, and one or more side surfaces connecting the bottom surface to the top surface. Here, the cross-section of the bottom plate extending to opposite positions of the one or more side surfaces includes a center. The cross-section is divided into two or more sectors extending from the center of the cross-section. The cross-section also includes a cooling channel having an inlet and one or more outlets.

[0005]

[0005] In another embodiment, a processing chamber is provided comprising a chamber body disposed around a processing space, a substrate support within the processing space, and a reflector positioned on the substrate support, the reflector including a bottom plate having a bottom surface facing the substrate support, a top surface, and one or more sides connecting the bottom surface to the top surface. Here, the cross section of the bottom plate, extending to the opposing positions of one or more sides, includes a center, and the cross section is divided into two or more sectors extending from the center of the cross section. The cross section also includes a cooling channel having an inlet and one or more outlets.

[0006]

[0006] In another embodiment, a processing chamber is provided comprising a chamber body disposed around a processing space, a substrate support within the processing space, and a reflector positioned on the substrate support, the reflector including a bottom plate having a bottom surface facing the substrate support, a top surface, and one or more sides connecting the bottom surface to the top surface. Here, the cross-section of the bottom plate, extending to the opposing positions of one or more sides, includes a center. The cross-section is divided into four or more sectors extending from the center of the cross-section. The cross-section also includes an inlet and one or more outlets, and a plurality of sections, each section being entirely located within one of the four or more sectors of the cross-section of the bottom plate, and each section including three or more 180-degree turns radially outward.

[0007]

[0007] To better understand the features of the present disclosure described above, a more detailed description of the present disclosure, which has been briefly summarized above, can be obtained by referring to the embodiments. Some of these embodiments are shown in the accompanying drawings. However, it should be noted that the accompanying drawings show only exemplary embodiments and should not be considered to limit the scope of the present disclosure, and other equally valid embodiments may also be permitted. [Brief explanation of the drawing]

[0008] [Figure 1]

[0008] This is a cross-sectional view of a processing system according to one embodiment. [Figure 2]

[0009] This is a top view showing a cross-sectional view of the inside of the bottom plate of the reflector shown in Figure 1, according to one embodiment. [Figure 3]

[0010] This is a top view showing an internal cross-section of the bottom plate of an alternative reflector according to another embodiment. [Figure 4]

[0011] This is a top view showing an internal cross-section of the bottom plate of an alternative reflector according to another embodiment. [Figure 5]

[0012] This is a top view showing an internal cross-section of the bottom plate of an alternative reflector according to another embodiment. [Modes for carrying out the invention]

[0009]

[0013] For ease of understanding, the same reference numerals have been used to indicate identical elements common to the figures, where possible. It is assumed that elements and features of one embodiment may be usefully incorporated into other embodiments without further description.

[0010]

[0014] Embodiments of this disclosure generally relate to improved reflectors for use in processing chambers, such as semiconductor processing chambers. Each reflector described in this disclosure includes one or more cooling channels, which enable the flow of coolant through one or more channels during cleaning procedures and other procedures. The flow of coolant through one or more cooling channels allows the reflector to have a lower maximum temperature during high-temperature processes (e.g., high-temperature cleaning processes), as well as a more uniform temperature across different parts of the reflector, compared to other similar reflectors that do not have one or more cooling channels during the same high-temperature process. The one or more cooling channels improve the temperature uniformity of the reflector and reduce the maximum temperature of the reflector during high-temperature processes, so that the process can be performed at higher internal temperatures without any part of the reflector rising to a temperature that would lead to damage to the reflector (e.g., above 700°C or above 800°C). These higher internal temperatures for the cleaning process may result in a cleaner and / or more rapidly cleaned processing chamber compared to a similar cleaning process performed on a chamber having other similar reflectors that do not have one or more cooling channels as described in this disclosure.

[0011]

[0015] Figure 1 is a cross-sectional view of a processing system 100 according to one embodiment. The processing system 100 includes a processing chamber 101, one or more gas sources 140, an exhaust pump 145, a coolant source 190, and a controller 155. The processing system 100 can be configured to perform an epitaxial deposition process within the processing chamber 101 and to perform one or more cleaning processes to clean the inside of the processing chamber 101. The processing chamber 101 includes an inner reflector 200, which includes a bottom reflector plate 200A. The bottom reflector plate described herein (e.g., bottom reflector plate 200A) includes cooling channels that enable high-temperature processes (e.g., cleaning) to be performed inside the processing chamber 101 at higher temperatures than would otherwise be possible without damaging components within the processing chamber. Enabling these cleaning processes to be performed at higher temperatures enhances the cleaning of the processing chamber and / or allows the cleaning procedure to be completed more quickly. Refer to Figures 2-5 below for further details regarding the cooling channels of different embodiments of the bottom reflector plate.

[0012]

[0016] The processing chamber 101 includes a housing structure 102 made of a process-resistant material such as aluminum or stainless steel, for example, 316L stainless steel. The housing structure 102 encloses various functional elements of the processing chamber 101, such as a quartz chamber 104, which includes an upper quartz chamber 105 and a lower quartz chamber 106. The quartz chamber 104 encloses an internal space 110 (also referred to as the processing space). One or more liners 136, 137 can insulate the quartz chamber 104 from the housing structure 102.

[0013]

[0017] The processing chamber 101 includes a substrate support assembly 116. The substrate support assembly 116 may include a support 117 and a shaft 118. The susceptor 115 may be positioned on the support 117. The substrate support assembly 116 may further include an actuator 119 for rotating the shaft 118 and the susceptor 115. The substrate 50 may be positioned on the susceptor 115 during processing such as epitaxial deposition. Generally, the substrate is not positioned on the susceptor 115 during the cleaning process described herein.

[0014]

[0018] Gas may be supplied from a gas source 140 to the internal space 110 during the deposition and washing processes. These gases may be exhausted from the internal space 110 by an exhaust pump 145. The processing chamber may further include a preheating ring 114 which may be positioned around the susceptor 115.

[0015]

[0019] The processing chamber 101 may further include an upper lamp module 124A and a lower lamp module 124B for heating the substrate 50 and / or the internal space 110. In one embodiment, the upper lamp module 124A and the lower lamp module 124B are infrared (IR) lamps.

[0016]

[0020] The processing chamber 101 further includes an outer reflector 170 and the aforementioned inner reflector 200. The outer reflector 170 may be positioned around the inner reflector 200. In some embodiments, one or more upper lamp modules 124A may be positioned inside the outer reflector 170.

[0017]

[0021] The inner reflector 200 includes a body 209 and a bottom plate 200A connected to the bottom of the body 209. The bottom plate 200A includes a bottom surface 201, a top surface 202, and one or more sides 203 connecting the bottom surface 201 to the top surface 202. The bottom surface 201, the top surface 202, and one or more sides 203 may enclose the interior 205 of the bottom plate 200A. A coolant (e.g., cooling water) may be supplied from a coolant source 190 to a cooling channel 206 (Figure 2) in the interior 205 of the inner reflector 200. In some embodiments, the bottom surface 201 is formed of gold. In some embodiments, the bottom surface 201 is a gold coating formed on a copper or aluminum base.

[0018]

[0022] The processing chamber 101 further includes a temperature sensor 230. In some embodiments, the temperature sensor 230 may be a thermocouple. The temperature sensor 230 may be used to monitor the temperature of the bottom surface 201 of the bottom plate 200A, for example, during a high-temperature cleaning process. The controller 155 may use the measurements from the temperature sensor 230 to control the temperature of the bottom plate 200A. For example, in some embodiments, the controller 155 may adjust the position of a valve or the speed of one or more pumps to control the temperature of the bottom plate 200A during a high-temperature process such as a cleaning process by adjusting the flow rate of coolant through the bottom plate 200A.

[0019]

[0023] The processing system 100 also includes a controller 155 for controlling the processes performed by the processing system 100. The controller 155 may be any type of controller used in an industrial environment, such as a programmable logic controller (PLC). The controller 155 includes a processor 157, memory 156, and input / output (I / O) circuits 158. The controller 155 may further include one or more of the following components (not shown): one or more power supplies, a clock, communication components (e.g., a network interface card), and a user interface commonly found in controllers for semiconductor devices.

[0020]

[0024] Memory 156 may include non - volatile memory. The non - volatile memory can be used to store programs and settings described below. Memory 156 can include one or more readily available types of memory, such as read - only memory (ROM) (e.g., electrically erasable programmable read - only memory (EEPROM)), flash memory, floppy disk, hard disk, or random access memory (RAM) (e.g., non - volatile random access memory (NVRAM)).

[0021]

[0025] Processor 157 is configured to execute various programs stored in memory 156, such as an epitaxial deposition process and a high - temperature cleaning process. During the execution of these programs, controller 155 can communicate with I / O devices through I / O circuit 158. For example, during the execution of these programs and communication through I / O circuit 158, controller 155 can control the power supplied to lamp modules 124A, 124B to heat components within internal space 110, as well as the position of valves and / or the speed of pumps for controlling the flow rate of coolant through reflector 200. Memory 156 may further include various operating set values used to control processing system 100. For example, the set value may include a temperature set value for the bottom surface 201 of bottom plate 200A of reflector 200 during different processes. Continuing with the example, controller 155 can adjust the position of one or more valves and / or the speed of one or more pumps to adjust the flow rate of coolant through bottom plate 200A based on the measured value from temperature sensor 230 so that the temperature of the bottom surface 201 of bottom plate 200A is reliably maintained within the allowable threshold of the temperature set value during the high - temperature cleaning process.

[0022]

[0026] FIG. 2 is a top view showing a cross - section 205C of the interior 205 of the bottom plate 200A of the reflector 200 of FIG. 1 according to one embodiment. The view of cross - section 205C is taken along section line 2 of FIG. 1.

[0023]

[0027] The bottom plate 200A includes a cooling channel 206 that extends through the interior 205 of the bottom plate 200A. The cross-section 205C of the interior 205 of the bottom plate 200A includes a center C, and the cross-section 205C includes a first sector 205C1 and a second sector 205C2. The first sector 205C1 is on the first side of a virtual dividing line 220 that bisects the cross-section 205C through the center C, and the second sector 205C2 is on the second side of the dividing line 220. The cooling channel 206 includes a first section 2061 located within the first sector 205C1. The cooling channel 206 includes a second section 2062 located within the second sector 205C2.

[0024]

[0028] The cooling channel 206 includes an inlet 210 configured for coolant to enter the cooling channel 206. The inlet 210 is partially located in the first sector 205C1 and partially located in the second sector 205C2. The cooling channel 206 further includes a first outlet 211 and a second outlet 212 configured for coolant to exit the cooling channel 206. The first outlet 211 is located in the first sector 205C1. The second outlet 212 is located in the second sector 205C2.

[0025]

[0029] Optionally, the first section 2061 can be, for example as shown in FIG. 2, a mirror image of the second section 2062. The cooling channel 206 includes a central loop 225 that surrounds the center C of the cross-section 205C. In some embodiments, the central loop 225 is the first portion of the cooling channel 206 downstream from the inlet 210 and can extend around the center C of the cross-section 205C by at least 30 degrees (e.g., at least 90 degrees, e.g., at least 180 degrees, e.g., 360 degrees, etc.). Other central loops described in this disclosure, such as central loops 325, 425, and 525 (see FIGS. 3, 4, and 5), can also be the first portions downstream from their respective inlets and extend around the center C of the corresponding cross-sections by at least 30 degrees, at least 90 degrees, at least 180 degrees, e.g., 360 degrees.

[0026]

[0030] The central loop 225 may further include a first segment 221 connecting the inlet 210 to the central loop 225. In some embodiments, the first segment 221 may be a straight, unfolded segment from the inlet 210 to the central loop 225. By directly connecting the central loop 225 to the inlet 210 in a straight path, the coolant having the coldest portion within the cooling channel 206 can be made to flow around the portion of the cooling channel 206 closest to the center C (i.e., the central loop 225) during high-temperature processing being performed in the processing chamber 101, such as a high-temperature cleaning process. This may be useful, for example, when the center of the bottom surface 201 of the reflector's bottom plate 200A is heated to a higher temperature than other parts of the bottom surface 201 when cooling is not used during other similar high-temperature processes.

[0027]

[0031] The cooling channel 206 extends downstream from the central loop 225 to the second segment 222. From the second segment 222, the cooling channel 206 extends along the downstream path in each section 2061, 2062, each section 2061, 2062 including a series of folds extending radially outward from the center C and terminating at one of the corresponding outlets 211, 212. For example, the first section 2061 includes five folds 21-25, each fold 21-25 providing a path for moving the coolant radially outward downstream. Although not referenced in Figure 2, the second section 2062 includes the same five folds 21-25. In some embodiments, each section includes at least two radially outward folds (e.g., at least three folds, or six or more folds).

[0028]

[0032] Each of the five folds 21–25 is configured to change the direction of the coolant and the cooling channel by 180 degrees with respect to the direction of the cooling channel 206 prior to the corresponding fold. While folds 21–25 change the direction of the coolant channel by 180 degrees, other folds may change the direction of the cooling channel by a smaller angle (e.g., 90 degrees, 45 degrees, or 30 degrees). In this specification, a fold corresponds to a section of the cooling channel that changes the preceding direction of the downstream path by at least 30 degrees, using a radius of curvature less than 50% of the radius between the center C and the position of the fold (e.g., a radius of curvature less than 25% of the radius between the center C and the position of the fold, e.g., a radius of curvature less than 10% of the radius between the center C and the position of the fold).

[0029]

[0033] All of the folds 21-25 extend radially outward from upstream to downstream, but in some embodiments, some of the folds extend radially inward from upstream to downstream. In some of these embodiments, the number of radially outward folds from upstream to downstream is greater than the number of radially inward folds from upstream to downstream, which can help expose more of the coolant with lower temperatures to radially inward positions and more of the coolant with higher temperatures to radially outward positions.

[0030]

[0034] The cooling channels 206 in each section 2061, 2062 extend from folds 21-25 toward corresponding arcs 2A-6A, with each arc 2A-6A located radially outward from the center C relative to another arc. In some embodiments, arcs 2A-6A may all be concentric arcs, such as arcs centered at the center C of section 205C. Furthermore, each arc 2A-6A may be concentric with arc 1A, which forms part of the central loop 225. Arc 1A is the radially inward arc among arcs 1A-6A. In this disclosure, portions of the cooling channels are described as having the shape of arcs (e.g., arcs 2A-6A), but these portions do not need to have an arc shape, and many, if not all, of the advantages of the cooling channels described herein can be obtained using portions of cooling channels having other shapes.

[0031]

[0035] Each arc 1A-6A (also referred to as one or more or three or more parts) also extends through a first angular position 291 in the sector with respect to the center C of the cross section 205C, and each arc 1A-6A may extend at different radial distances from the center C. The first angular position 291 is shown in the second sector 205C2, but the corresponding angle is also located in the first sector 205C1. In some embodiments, each arc 2A-6A may extend at least 15 degrees in the angular direction around the center C of the cross section 205C (e.g., at least 30 degrees, e.g., at least 45 degrees, e.g., at least 90 degrees, e.g., at least 120 degrees, e.g., at least 180 degrees) (e.g., each arc starts and ends on the dividing line 220).

[0032]

[0036] For each section 2061, 2062, each fold 22-25 connects to arcs 2A-6A located at a greater radial distance from the center C compared to arcs 2A-6A connected to the previous folds 21-24. For example, the second fold 22 connects to arc 3A located at a greater radial distance from the center C compared to arc 2A connected to the first fold 21.

[0033]

[0037] Furthermore, each of the arcs 2A to 6A is located downstream of the corresponding next closest radially inward arcs 1A to 5A. For example, arc 2A is located downstream of the next radially inward arc 1A, arc 3A is located downstream of the next radially inward arc 2A, arc 4A is located downstream of the next radially inward arc 3A, arc 5A is located downstream of the next radially inward arc 4A, and arc 6A is located downstream of the next radially inward arc 5A. In this configuration, where the arcs are progressively positioned radially outward as the coolant flows downstream, the coolant can remove more heat from a position closer to the center C per unit area of ​​the cooling channel 206. This is because the coolant, which is at a lower temperature, first flows through the radially inward position, and then, as the coolant passes through each arc 1A-6A and the folds, it is gradually heated and flows radially outward through the corresponding parts of sections 2061 and 2062. All arcs 2A-6A are located downstream of the next radially inward arcs 1A-5A, however, in some embodiments, more than half, but not all, of the arcs (also referred to as parts) are located downstream of the next nearest radially inward arc.

[0034]

[0038] Furthermore, although Figure 2 shows a configuration with two sectors, other embodiments may use three or more sectors. For example, Figures 4 and 5 show embodiments in which the cooling channel is arranged in four sectors, but five or more sectors may be used. Similarly, although not shown, embodiments including a single sector may also be used (for example, a cooling channel that extends spirally outward from an inward position around a center C as it extends downstream, creating a number of loops around the center C in a 360-degree pattern).

[0035]

[0039] While not mandatory, in some embodiments, each section, such as sections 2061, 2062, may be entirely located within its corresponding sector, such as sectors 205C1, 205C2, without entering other sectors. As a result, each section is more easily controlled for the temperature of its corresponding sector. Furthermore, in some embodiments, each section, such as sections 2061, 2062, may have independent inlets and outlets. As a result, different flow rates may be used through each section to isolate the temperature control of each section from the temperature control of other sections. In some embodiments, the outlet may be located at the maximum radial distance from the center C of the entire cooling channel. This ensures that the coolant with the highest temperature is located at the maximum radial distance from the center C. Where applicable, all modifications described with reference to bottom plate 200A can also be applied to bottom plates 300A-500A, which are described below with reference to Figures 3-5.

[0036]

[0040] Figure 3 is a top view of the internal cross-section 305C of the bottom plate 300A of an alternative reflector according to another embodiment. The bottom plate 300A may be the same as the bottom plate 200A described above, except that the bottom plate 300A includes a different cooling channel configuration.

[0037]

[0041] The bottom plate 300A includes a cooling channel 306 that extends through the interior of the bottom plate 300A. The cross section 305C inside the bottom plate 300A includes a center C. This cross section 305C includes a first sector 305C1 and a second sector 305C2, each extending from the center C. The first sector 305C1 is on the first side of a virtual dividing line 320 that bisects the cross section 305C through the center C, and the second sector 305C2 is on the second side of the dividing line 320. The cooling channel 306 includes a first section 3061 located within the first sector 305C1. The cooling channel 306 includes a second section 3062 located within the second sector 305C2.

[0038]

[0042] The cooling channel 306 includes an inlet 310 configured for coolant to enter the cooling channel 306. The cooling channel 306 further includes an outlet 311 configured for coolant to exit the cooling channel 306. The inlet 310 and the outlet 311 are each located partly in the first sector 305C1 and partly in the second sector 305C2.

[0039]

[0043] Although not required, the first section 3061 may be a mirror image of the second section 3062, as shown, for example, in Figure 3. The cooling channel 306 includes a central loop 325 surrounding the center C of the cross-section 305C. The cooling channel 306 may further include a first segment 321 connecting the inlet 310 to the central loop 325. In some embodiments, the first segment 321 may be a straight, unfolded segment from the inlet 310 to the central loop 325. By directly connecting the central loop 325 to the inlet 310 in a straight path, the coolant having the coldest portion within the cooling channel 306 can be made to flow around the portion of the cooling channel 306 closest to the center C (i.e., the central loop 325) during high-temperature processing being performed in the processing chamber, such as a high-temperature cleaning process.

[0040]

[0044] The cooling channel 306 extends from the central loop 325 to the second segment 322. From the second segment 322, the cooling channel 306 extends along a path that includes a series of folds in each section 3061, 3062, extending radially outward or radially inward from the center C, with each section 3061, 3062 terminating at the exit 311. For example, the first section 3061 includes five folds 31-35, each of which provides a path for moving the coolant radially outward or radially inward. For example, the first, second, and third folds 31-33 each move the coolant and extend the cooling channel 306 radially outward, while the fourth and fifth folds 34, 35 each move the coolant and extend the cooling channel 306 radially inward. The three radially outward folds 31-33 and the two radially inward folds 34, 35 mean that more than half of the folds extend radially outward, which can help provide more cooling toward the central region than in the region near the outer edge.

[0041]

[0045] Having one or more folds extending the cooling channel 306 radially outward and one or more folds extending the cooling channel 306 radially inward can be used to (1) increase the temperature of the coolant radially toward a greater radial distance from the center C after each radially outward fold, and then (2) increase the temperature of the coolant radially toward a smaller radial distance from the center C after each radially inward fold. Increasing the temperature of the coolant radially outward and then radially inward can be used to reduce the difference in the heat transfer coefficient per unit area around the center C (e.g., around the central loop 325) compared to the portion of the cooling channel 306 near the edge 303 of the bottom plate 300A, such as the arc 4B described later. This can be useful for removing more heat near the edge 303 of the bottom plate 300A compared to a cooling channel that folds mainly or only radially outward at each consecutive fold, such as the folds 21-25 of the cooling channel 206 in Figure 2.

[0042]

[0046] Although not labeled in Figure 3, the second section 3062 includes the same five folds 31–35. Each of the five folds 31–35 is configured to change the direction of the coolant and the cooling channel 306 by 180 degrees with respect to the direction of the cooling channel 306 prior to the corresponding fold. Sections 3061, 3062 include two folds of approximately 90 degrees between the third fold 33 and the fourth fold 34, but these two folds result in a section that extends substantially in the same direction as immediately after the third fold 33.

[0043]

[0047] Each of the folds 31-35 extends toward arcs 2B-6B. The first fold 31 extends radially outward toward arc 2B. The second fold 32 extends radially outward toward arc 3B. The third fold 33 extends radially outward toward arc 4B. The fourth fold 34 extends radially inward toward arc 5B. The fifth fold 35 extends radially inward toward arc 6B.

[0044]

[0048] In some embodiments, arcs 2B to 6B may all be concentric arcs, such as arcs centered at the center C of section 305C. Furthermore, each arc 2B to 6B may be concentric with arc 1B, which forms part of the central loop 325. In some embodiments, each arc 2B to 6B may extend at least 15 degrees in the angular direction around the center C of section 305C (e.g., at least 30 degrees, e.g., at least 45 degrees, e.g., at least 90 degrees, e.g., at least 120 degrees, e.g., at least 180 degrees) (e.g., each arc starts and ends on the dividing line 320). Each arc 1B to 6B may also extend through the same first angular position 391 in the sector relative to the center C of section 305C. In this case, each arc 1B to 6B extends at different radial distances from the center C. The first angular position 391 is shown in the second sector 305C2, but the corresponding angle is also located in the first sector 305C1.

[0045]

[0049] Figure 4 is a top view of the internal cross-section 405C of the bottom plate 400A of an alternative reflector according to another embodiment. The bottom plate 400A may be the same as the bottom plate 200A described above (see Figure 2), except that the bottom plate 400A includes a different cooling channel configuration.

[0046]

[0050] The bottom plate 400A includes a cooling channel 406 that extends through the interior of the bottom plate 400A. The cross section 405C inside the bottom plate 400A includes a center C. The cross section 405C includes a first sector 405C1, a second sector 405C2, a third sector 405C3, and a fourth sector 405C4. Each sector extends from the center C of the cross section 405C. To illustrate how the different sectors 405C1-405C4 are arranged, hypothetical vertical division lines 431, 432 extending through the center C of the cross section 405C are shown in Figure 4.

[0047]

[0051] The dividing lines 431 and 432 divide the section 405C into four sectors of equal size. The first sector 405C1 is above the first dividing line 431 and to the left of the second dividing line 432. The second sector 405C2 is above the first dividing line 431 and to the right of the second dividing line 432. The third sector 405C3 is below the first dividing line 431 and to the left of the second dividing line 432. The fourth sector 405C4 is below the first dividing line 431 and to the right of the second dividing line 432.

[0048]

[0052] The cooling channel 406 includes a first section 4061 located in the first sector 405C1. The cooling channel 406 includes a second section 4062 located in the second sector 405C2. The cooling channel 406 includes a third section 4063 located in the third sector 405C3. The cooling channel 406 includes a fourth section 4064 located in the fourth sector 405C4.

[0049]

[0053] The four sections 4061-4064 have highly similar shapes. The first section 4061 may be a mirror image of the third section 4063. The second section 4062 may be a mirror image of the fourth section 4064. In some embodiments, the outer regions of each section 4061-4064 may be identical in each section 4061-4064 with respect to a radial distance from the center C that is larger than the third section 3C of each section 4061-4064, as described below.

[0050]

[0054] The cooling channel 406 includes an inlet 410 configured for coolant to enter the cooling channel 406. The inlet 410 is located partly in the first sector 405C1 and partly in the third sector 405C3. The cooling channel 406 further includes a first outlet 411 and a second outlet 412 configured for coolant to exit the cooling channel 406. The first outlet 411 is located partly in the first sector 405C1 and partly in the second sector 405C2. The second outlet 412 is located partly in the third sector 405C3 and partly in the fourth sector 405C4.

[0051]

[0055] The cooling channel 406 includes a central loop 425 surrounding the center C of the cross-section 405C. The cooling channel 406 may further include a first segment 421 connecting the inlet 410 to the central loop 425. In some embodiments, the first segment 421 may be a straight, unfolded segment from the inlet 410 to the central loop 425. By directly connecting the central loop 425 to the inlet 410 in a straight path, the coolant having the coldest portion within the cooling channel 406 can be made to flow around the portion of the cooling channel 406 closest to the center C (i.e., the central loop 425) during high-temperature processing being performed in the processing chamber, such as a high-temperature cleaning process.

[0052]

[0056] Each section 4061-4064 includes four radially outward folds 41-44 and two radially inward folds 45, 46. Furthermore, each section 4061-4064 includes a central portion 1C that forms part of the central loop 425. The central portions 1C of each section 4061-4064 can be combined to form a complete loop (i.e., 360 degrees around the center C). Each section 4061-4064 includes a second portion 2C that has an arc shape and extends to a radial distance from the center C greater than the radial distance from the center C of the central portion 1C.

[0053]

[0057] Referencing the first section 4061 for folds 41-46 and the fourth section 4064 for parts 1C-6C, in each section 4061-4064, (1) the first fold 41 connects the second part 2C to the third part 3C which is more radially outward; (2) the second fold 42 connects the third part 3C to the fourth part 4C which is more radially outward; (3) the third fold 43 connects the fourth part 4C to the fifth part 5C which is more radially outward; (4) the fourth fold 44 connects the fifth part 5C to the sixth part 6C which is more radially outward; (5) the fifth fold 45 connects the sixth part 6C to the fourth part 7C which is more radially inward; and (6) the sixth fold 46 connects the seventh part 7C to the eighth part 8C which is more radially inward. The eighth part 8C of each section 4061-4064 is connected to one of the outlets 411 and 412.

[0054]

[0058] By moving the coolant radially outward from the first central section 1C to the sixth section 6C, more heat transfer per unit area by the coolant can be achieved at the radially inward position compared to the radially outward position. Furthermore, by positioning the last two sections 7C and 8C radially inward relative to the sixth section 6C, it is possible to help prevent the position on the bottom plate 400A near the outer edge 403 from becoming too hot. This is because the coolant in the sixth section 6C (i.e., the outermost section closest to the edge 403) has a lower temperature than the coolant in the seventh section 7C and the eighth section 8C, as the coolant temperature rises in each section from the inlet 410 to one of the outlets 411 or 412.

[0055]

[0059] In some embodiments, portions 1C-8C (also referred to as arcs 1C-8C) may all be concentric arcs, such as arcs centered at the center C of section 405C. Each arc 1C-8C may extend at least 15 degrees (e.g., at least 30 degrees, e.g., at least 45 degrees, e.g., at least 90 degrees) in the angular direction around the center C of section 405C. In embodiments where each arc 1C-8C extends at least 90 degrees, each arc 1C-8C may be located at different radial distances from the center C, in contrast to arcs located at the same radial distance from the center C (e.g., arcs 4C and 8C). In some embodiments, each of two or more or three or more of the arcs 1C-8C may extend through the same angular position in a sector, such as a first angular position 491, but at different radial distances from the center C. For example, each of the arcs 1C to 6C extends through a first angular position 491 within the sector, but with different radial distances from the center C. At the first angular position 491, each of the arcs 2C to 6C lies downstream of the next nearest radially inward portion of the arcs 1C to 5C. At some angular positions in each section 4061 to 4064, more than half of three or more of the arcs 1C to 8C lies downstream of three or more of the next nearest radially inward arcs. The first angular position 491 is shown in the fourth sector 405C4, but the corresponding angles are also shown in each other sector 405C1-3 It is also placed in each of them.

[0056]

[0060] Figure 5 is a top view of the internal cross-section 505C of the bottom plate 500A of an alternative reflector according to another embodiment. The bottom plate 500A may be the same as the bottom plate 400A described above (see Figure 4), except that the bottom plate 500A includes a different cooling channel configuration.

[0057]

[0061] The bottom plate 500A includes a cooling channel 506 that extends through the interior of the bottom plate 500A. The cross section 505C inside the bottom plate 500A includes a center C. The cross section 505C includes a first sector 505C1, a second sector 505C2, a third sector 505C3, and a fourth sector 505C4. Each sector 505C1 to 505C4 may extend from the center C of the cross section 505C. To illustrate how the different sectors 505C1 to 505C4 are arranged, hypothetical vertical division lines 531, 532 extending through the center C of the cross section 505C are shown in Figure 5.

[0058]

[0062] The dividing lines 531 and 532 divide the section 505C into four equally sized sectors 505C1 to 505C4. The first sector 505C1 is above the first dividing line 531 and to the left of the second dividing line 532. The second sector 505C2 is above the first dividing line 531 and to the right of the second dividing line 532. The third sector 505C3 is below the first dividing line 531 and to the left of the second dividing line 532. The fourth sector 505C4 is below the first dividing line 531 and to the right of the second dividing line 532.

[0059]

[0063] The cooling channel 506 includes a first section 5061 located in the first sector 505C1. The cooling channel 506 includes a second section 5062 located in the second sector 505C2. The cooling channel 506 includes a third section 5063 located in the third sector 505C3. The cooling channel 506 includes a fourth section 5064 located in the fourth sector 505C4.

[0060]

[0064] The four sections 5061-5064 have highly similar shapes. The first section 5061 may be a mirror image of the second section 5062. The third section 5063 may be a mirror image of the fourth section 5064. In some embodiments, the outer regions of each section 5061-5064 may be identical in each section 5061-5064 with respect to the radial distance from the center C, which is larger than the third section 3D described later for each section 5061-5064.

[0061]

[0065] The cooling channel 506 includes an inlet 510 configured for coolant to enter the cooling channel 506. The inlet 510 is partially located in the third sector 505C3 and partially in the fourth sector 505C4. The cooling channel 506 further includes outlets 511 to 514 for each sector 505C1 to 505C4, configured for coolant to exit the cooling channel 506. The first outlet 511 is located in the first sector 505C1. The second outlet 512 is located in the second sector 505C2. The third outlet 513 is located in the third sector 505C3. The fourth outlet 514 is located in the fourth sector 505C4. The outlets 511 to 514 for each section 5061 to 5064 are located in the outermost radial positions of the corresponding sections 5061 to 5064.

[0062]

[0066] The cooling channel 506 includes a central loop 525 that partially surrounds the center C of the cross-section 505C for more than 180 degrees. The cooling channel 506 may further include a first segment 521 that connects the inlet 510 to the central loop 525. In some embodiments, the first segment 521 may be a straight, unfolded segment from the inlet 510 to the central loop 525. By directly connecting the central loop 525 to the inlet 510 in a straight path, the coolant having the coldest portion within the cooling channel 506 can be made to flow around the portion of the cooling channel 506 closest to the center C (i.e., the central loop 525) during high-temperature processing being performed in the processing chamber, such as a high-temperature cleaning process.

[0063]

[0067] Each section 5061-5064 of the cooling channel 506 may include a central portion 1D that forms part of the central loop 525. The inlet 510 may be directly connected to the central portions 1D of the third section 5063 and the fourth section 5064 through the first segment 521.

[0064]

[0068] Referring to the first section 5061 and the fourth section 5064, in each section 5061-5064, (1) the first fold 51 connects the first portion 1D to a second portion 2D that is more radially outward, and (2) the second fold 52 connects the second portion 2D to a third portion 3D that is more radially outward, dividing the second portion 2D into a first segment 3D1 and a second segment 3D2. (3) A pair of third folds 53A, 53B connect to the corresponding third segments 3D1, 3D2, to the corresponding pair of radially outer fourth segments 4D1, 4D2; (4) A pair of fourth folds 54A, 54B connect to the corresponding fourth segments 4D1, 4D2, to the corresponding pair of radially outer fifth segments 5D1, 5D2; (5) A pair of fifth folds 55A, 55B connect to the corresponding fifth segments 5D1, 5D2, to the corresponding pair of radially outer sixth segments 6D1, 6D2, which are joined at the exits 511, 514 of the corresponding sections 5061, 5064.

[0065]

[0069] Each section 5061-5064 of the cooling channel 506 includes only radially outward folds. Using sections that include only radially outward folds can contribute to more cooling per unit area of ​​the cooling channel 506 at more radially inward locations. This configuration may be useful when cooling the center of the reflector is significantly more important than cooling the outer edges of the reflector (e.g., edge 503).

[0066]

[0070] In some embodiments, two or more or three or more parts or segments may each extend through the same angular position within a given sector, such as a first angular position 591, but with different radial distances from the center C. For example, each of parts and segments 1D, 2D, 3D1, 4D1, 5D1, and 6D1 extends through the first angular position 591 within the sector, but with different radial distances from the center C. At the first angular position 591, each part 2D-6D1 is downstream of the next nearest radially inward part 1D-5D1. At some angular positions of each section 5061-5064, more than half of parts 1D-6D are downstream of the next nearest radially inward part 1D-6D. The first angular position 591 is shown in the fourth sector 505C4, but the corresponding angles are also shown in each of the other sectors 505C4. 1-3 It is also placed in each of them.

[0067]

[0071] Embodiments of cooling channels provided in this disclosure are generally configured to provide a flow path through which coolant moves entirely or primarily radially outward across the bottom plate. This flow path may be used to improve the cooling performance per unit area of ​​a cooling channel near the center of the bottom plate compared to the cooling performance per unit area of ​​a cooling channel further from the center of the bottom plate and a cooling channel closer to the outer edge of the bottom plate. Such radially outward cooling flow paths may help maintain the center of the bottom plate of the reflector below a temperature threshold beyond which damage to the bottom plate may occur. By supplying coolant through these radially outward cooling flow paths, it becomes possible to perform a higher-temperature cleaning process inside the processing chamber containing these reflectors. This allows the processing chamber to be cleaned to a higher degree of cleanliness and / or the cleaning process to be performed more quickly.

[0068]

[0072] In each of the embodiments and modifications described above, one or more inlets and outlets may be switched to reverse the cooling channels described above. For example, referring to Figure 2, the coolant may be supplied to inlets 211 and 212 (previously described as outlets) and flow through the cooling channel to a common outlet 210 (previously described as an inlet). Reversing these coolant channels may be useful in embodiments to enhance cooling of the edge regions of the reflector compared to the central region of the reflector.

[0069]

[0073] While the above applies to embodiments of the present disclosure, other embodiments and further embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is determined by the following claims.

Claims

1. A reflector for use in a semiconductor processing chamber, The main unit and A bottom plate connected to the lower part of the main body, having a bottom surface, a top surface, and one or more sides connecting the bottom surface to the top surface, and Equipped with, The cross-section of the bottom plate extending to the opposing positions of one or more of the aforementioned sides includes the center, The cross-section is divided into two or more sectors extending from the center of the cross-section, A reflector whose cross-section includes a cooling channel having an inlet and one or more outlets.

2. The cooling channel, Multiple sections, each section located within one of the two or more sectors of the cross-section of the bottom plate. Furthermore, Each section includes three or more parts that are spaced apart from each other at different radial distances from the center at a first angular position within the sector relative to the center, The reflector according to claim 1, wherein more than half of the three or more portions are located downstream of the next nearest radially inward portion of the three or more portions.

3. The cooling channel includes a central loop which is a first portion of the cooling channel, located downstream from the inlet and extending at least 30 degrees around the center of the cross-section. The reflector according to claim 2, wherein the central loop is the radially innermost portion of the three or more portions at the first angular position.

4. The reflector according to claim 3, wherein the central loop extends more than 180 degrees around the center of the cross-section.

5. The reflector according to claim 2, wherein each of the three or more portions is located downstream of the corresponding next nearest radially inward portion of the three or more portions.

6. The reflector according to claim 1, wherein at least one of the one or more outlets is located at the maximum radial distance from the center of the cooling channel.

7. The reflector according to claim 2, wherein the two or more sectors include four or more sectors.

8. The reflector according to claim 2, wherein each section of the cooling channel includes three or more 180-degree folds radially outward.

9. Each section contains three or more 180-degree turns. The reflector according to claim 2, wherein the number of three or more folds radially outward from the upstream side to the downstream side is greater than the number of three or more folds radially inward from the upstream side to the downstream side.

10. The reflector according to claim 1, wherein the bottom surface of the bottom plate is made of gold.

11. A processing chamber, A chamber body arranged around the processing space, The substrate support in the processing space, A reflector positioned on the substrate support, wherein the reflector is A bottom plate having a bottom surface facing the substrate support, a top surface, and one or more sides connecting the bottom surface to the top surface. Includes, The cross-section of the bottom plate extending to the opposing positions of one or more of the aforementioned sides includes the center, The cross-section is divided into two or more sectors extending from the center of the cross-section, The cross-section includes a reflector and a cooling channel having an inlet and one or more outlets. A processing chamber equipped with the following:

12. The cooling channel further comprises a plurality of sections, each section located within one of the two or more sectors of the cross-section of the bottom plate. Each section includes three or more parts that are spaced apart from each other at different radial distances from the center at a first angular position with respect to the center, The processing chamber according to claim 11, wherein more than half of the three or more portions are located downstream of the next nearest radially inward portion of the three or more portions.

13. The cooling channel includes a central loop which is a first portion of the cooling channel, located downstream from the inlet and extending at least 30 degrees around the center of the cross-section. The processing chamber according to claim 12, wherein the central loop is the radially innermost portion of the three or more portions at the first angular position.

14. The processing chamber according to claim 13, wherein the central loop extends more than 180 degrees around the center of the cross-section.

15. The processing chamber according to claim 12, wherein each of the three or more parts is located downstream of the corresponding next nearest radially inward part of the three or more parts.

16. The processing chamber according to claim 11, wherein at least one of the one or more outlets is located at the maximum radial distance from the center of the cooling channel.

17. The processing chamber according to claim 12, wherein the two or more sectors include four or more sectors.

18. The processing chamber according to claim 12, wherein each section includes three or more 180-degree folds radially outward.

19. Each section contains three or more 180-degree turns. The processing chamber according to claim 12, wherein the number of three or more folds on the radially outward side is greater than the number of three or more folds on the radially inward side.

20. A processing chamber, A chamber body arranged around the processing space, The substrate support in the processing space, A reflector positioned on the aforementioned substrate support and The reflector is equipped with, A bottom plate having a bottom surface facing the substrate support, a top surface, and one or more sides connecting the bottom surface to the top surface. Includes, The cross-section of the bottom plate extending to the opposing positions of one or more of the aforementioned sides includes the center, The cross-section is divided into four or more sectors extending from the center of the cross-section, The cross section includes a cooling channel, and the cooling channel is An entrance and one or more exits, Multiple sections, each section being entirely located within one of the four or more sectors of the cross-section of the bottom plate, and each section including three or more folds of 180 degrees radially outward. A process chamber, including a process chamber.

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