Peelable adhesive system

Abstract

This specification provides a peelable adhesive system.

Description

[Technical Field]

[0001] This specification provides peelable adhesive systems. [Background technology]

[0002] Peelable adhesive systems have been sought for quite some time. Such systems are recognized as useful when the positioning of the substrates to be bonded is inaccurate, when the wrong substrates are selected, and / or when one of the substrates to be bonded is deemed defective and needs to be replaced.

[0003] Despite much effort in this field, a long-standing but unmet need remains for a suitable system with broad applicability. Such a system is expected to be welcomed by both industry and consumers.

[0004] Such a system had not been discovered until now, but it has finally been realized with this invention. [Overview of the Initiative] [Means for solving the problem]

[0005] In one embodiment, what is provided herein are particles implanted with an ionic liquid. In other words, what is provided herein is a composition comprising an ionic liquid and particles, wherein the ionic liquid is supported within or on the particles.

[0006] In one embodiment, the ionic liquids described herein are a type of liquid composed of positively charged and negatively charged ions. These have low melting points (e.g., less than about 100°C) and are often liquid at or near room temperature.

[0007] In another embodiment, an ionic liquid is a compound composed of dissolved positively charged and negatively charged ions. In this embodiment, the ionic compound itself may be a solid at or near room temperature and may dissolve in a solvent to form an ionic liquid. The selected solvent may be polar (or nonpolar or hypopolar), and may be protic or aprotic. When dissolved in such a solvent, the compound may release its (positively charged, negatively charged) ions.

[0008] In yet another embodiment, the ionic liquid is composed of a salt in which a group IA or group IIA element is a cation and a group VIIA element or a compound containing one or more group VIIA elements is an anion, optionally an organic solvent, and optionally water.

[0009] In yet another embodiment, the inorganic ionic liquid may be a salt having an alkali metal (e.g., lithium or sodium), an alkaline earth metal (e.g., beryllium or magnesium), a transition metal (e.g., iron or copper), or another metallic element (e.g., aluminum or zinc) as a cation. The ionic liquid may be a salt having a halogen (e.g., fluorine or chlorine), a group 16 element (e.g., oxygen or sulfur), a group 15 element (e.g., nitrogen or phosphorus), or another nonmetallic element (e.g., carbon or silicon) as an anion.

[0010] In yet another embodiment, the organic ionic liquid may be a salt having a positively charged organic cation such as imidazolium, pyridinium, phosphonium, ammonium, morpholinium, allyl cation, or benzyl cation. The ionic liquid may be a salt having a negatively charged organic anion such as tetrafluoroborate, hexafluorophosphate, trifluoromethanesulfonate (also known as triflate), bis(trifluoromethylsulfonyl)imide ("TFSI"), acetate, carboxylate, phenolate, or sulfonate.

[0011] In another embodiment, provided herein are curable compositions comprising a curable component (e.g., (meth)acrylate, epoxy, alkoxy-functionalized siloxane, silane-functionalized monomer, oligomer and polymer, isocyanate-functionalized monomer, oligomer and polymer, and combinations thereof) and particles injected with the ionic liquid described above.

[0012] In another embodiment, provided herein is a method for peeling off one or more substrates bonded together by an adhesive composition, The process of providing an assembly comprising two or more conductive substrates bonded together on their inward-facing surfaces by the reaction product of the curable composition as described above, A step of providing a power supply, comprising the steps of creating a first connection from the power supply to a first conductive substrate and creating a second connection from the power supply to a second conductive substrate, The process involves applying a DC current of approximately 3 volts to approximately 75 volts from the power supply to the conductive substrate for a period of approximately 0.1 seconds to approximately 3 hours at room temperature, for example, a period of approximately 5 minutes to approximately 3 hours. A step of separating at least one conductive substrate from the reaction product, This method includes [something].

[0013] In another embodiment, provided herein is a method for reversibly bonding one or more substrates with a curable composition, A step of providing one or more conductive substrates, The process involves placing the curable composition described above on at least one surface of at least one of the one or more conductive substrates, A step of forming an adhesively bonded assembly by joining the at least one surface on which the curable composition is disposed to another surface of a conductive substrate, and exposing the joined surfaces to conditions suitable for curing the curable composition, A step of providing a power source and connecting the power source to the bonded assembly, wherein a first connection is made from the power source to a first conductive substrate, and a second connection is made from the power source to a second conductive surface, Applying a DC current of about 3 volts to about 75 volts, for example about 30 volts, from the power supply to the conductive substrate for a period of about 0.1 second to about 3 hours at room temperature, for example for a period of about 5 minutes to about 3 hours; Separating at least one conductive substrate from the cured composition; A method comprising the above. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] [Figure 1] FIG. 1 shows a bar graph of the relative strength (measured in MPa) of a control formulation and a formulation of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] As described above, in one embodiment provided herein are particles infused with an ionic liquid. In other words, provided herein is a composition comprising an ionic liquid and particles, wherein the ionic liquid is supported within or on the particles.

[0016] In one aspect, the ionic liquids described herein are a type of liquid composed of positively charged ions and negatively charged ions. These have a low melting point (e.g., less than about 100 °C) and are often liquid at room temperature or near it.

[0017] In another aspect, an ionic liquid is a compound consisting of dissolved positively charged ions and negatively charged ions. In this aspect, the ionic compound itself may be solid at room temperature or near it, or may be dissolved in a solvent to form an ionic liquid. The solvent selected may be polar (or nonpolar or low-polar), and may be protic or aprotic. When dissolved in such a solvent, the compound may release its (positively charged, negatively charged) ions.

[0018] In yet another aspect, the ionic liquid is composed of either a salt having an element of Group IA or Group IIA as a cation and a compound containing an element of Group VIIA or one or more elements of Group VIIA as an anion.

[0019] In yet another aspect, the inorganic ionic liquid may be a salt having an alkali metal such as lithium or sodium, an alkaline earth metal such as beryllium or magnesium, a transition metal such as iron or copper, or another metal element such as aluminum or zinc as a cation. The ionic liquid may be a salt having a halogen such as fluorine or chlorine, a Group 16 element such as oxygen or sulfur, a Group 15 element such as nitrogen or phosphorus, or another non-metal element such as carbon or silicon as an anion.

[0020] In yet another aspect, the organic ionic liquid may be a salt having an organic positively charged cation such as imidazolium, pyridinium, phosphonium, ammonium, morpholinium, allyl cation, or benzyl cation. The ionic liquid may be a salt having an organic negatively charged anion such as tetrafluoroborate, hexafluorophosphate, trifluoromethanesulfonate (also known as triflate), bis(trifluoromethylsulfonyl)imide ("TFSI"), acetate, carboxylate, phenolate, or sulfonate.

[0021] An organic solvent may be present, and if present, it may be selected from polyethylene glycols such as PEG400, PEG200, or PEG600, tetraglyme, tetrahydrofuran ("THF"), dimethylformamide ("DMF"), hydroxyethyl acrylate ("HEA"), hydroxyethyl methacrylate ("HEMA"), methacrylic acid ("MAA"), alcohols such as ethanol or isopropanol, acetone, or acrylamide.

[0022] Water may also be present.

[0023] In an ionic liquid, especially if the salt is liquid at room temperature, the salt may constitute the entirety of the ionic liquid. Alternatively, the salt may be present in the ionic liquid in amounts of about 0.1% to about 99.9% by weight, for example, about 1% to about 50% by weight, preferably about 5% to about 35% by weight, for example, about 15% to about 30% by weight, optionally together with an organic solvent and / or water. Here, the organic solvent is present in the ionic liquid in amounts of about 25% to about 85% by weight, for example, about 50% to about 75% by weight, preferably about 55% to about 65% by weight. And water is present in the ionic liquid in amounts of about 1% to about 50% by weight, for example, about 5% to about 25% by weight, preferably about 10% to about 20% by weight.

[0024] The absorbency of the particles is beneficial to the present invention. The extent to which the ionic liquid can bind or associate with the particles, whether in terms of surface area (determined by BET measurement), porosity, or surface affinity, affects the performance, particularly in terms of delamination after adhesive bonds are formed and a voltage is applied to those bonds.

[0025] The particles are typically in the size range of approximately 50 nm to 200 μm. Absorption is typically defined by surface area, at least approximately 20 m². 2 / g~about 500m 2 It is desirable that the density be / g (determined by BET measurement). The particles may also be characterized by tap density, which is a measure of the bulk density of the powder or granular material, and this is usually in the range of about 0.01 g / mL to about 3.0 g / mL.

[0026] The ionic liquid should be present in the voids, on the surface, and / or in the gaps between layers of the ionic liquid-implanted particles in an amount of about 1% to about 500% by weight, depending on the design or structure of the particles. Preferably, the ionic liquid should be present in the ionic liquid-implanted particles in an amount of about 5% to about 200% by weight, for example, about 25% to about 125% by weight, and more preferably 50% to about 100% by weight.

[0027] The particles may be inorganic or organic. For example, the particles may be silica (such as fused silica), calcium carbonate, carbon black, alumina, molecular sieve, clay, titanium dioxide, mica, cellulose, talc, graphite, or glass particles. Alternatively, the particles may be sawdust, cellulose, polymethyl methacrylate ("PMMA"), polysulfone ("PS"), polypropylene ("PP"), polyethylene terephthalate ("PET"), or nylon.

[0028] A commercially available example of silica particles is Solesphere, sold by AGC Chemicals America, Inc. in Exton, Pennsylvania. For example, Solesphere H-51 (size 5 μm, surface area 800 m²). 2 / g, oil absorption 150mL / 100g), L-51 (size 5μm, surface area 300m 2 / g, oil absorption 150mL / 100g), and H-121 (size 12μm, surface area 800m 2 ( / g, oil absorption capacity 150mL / 100g), and Cypernut 22 from Evonik (size 120μm, surface area 180m²) 2 / g, oil absorption 235mL / 100g), 50S (size 18μm, surface area 500m 2 / g, oil absorption 280mL / 100g), and 500LS (size 10.5μm, surface area 500m 2 Examples include ( / g, oil absorption capacity 270mL / 100g).

[0029] As described above, in another embodiment, a curable composition is provided comprising a curable component [for example, (meth)acrylate, epoxy, alkoxy-functionalized siloxane, silane-functionalized monomer, oligomer and polymer, isocyanate-functionalized monomer, oligomer and polymer, and combinations thereof] and particles injected with the ionic liquid described above.

[0030] (Meth)acrylate may be selected from monofunctional (meth)acrylate, difunctional (meth)acrylate, or polyfunctional (meth)acrylate, and these may be monomers, oligomers, or polymers. Thus, difunctional (meth)acrylate or polyfunctional (meth)acrylate may have (meth)acrylate functional groups terminally or pendantly along the chain or backbone between its terminals.

[0031] (Meth)acrylate may be represented by H2C=CGCO2R 1 where G is selected from H, halogen, and alkyl having 1 to about 4 carbon atoms, and R 1 is selected from alkyl, cycloalkyl, alkenyl, cycloalkenyl, alkaryl, and aryl groups having 6 to about 16 carbon atoms, and these may or may not have substitution or interruption by members selected from the group consisting of silane, silicon, oxygen, halogen, carbonyl, hydroxyl, ester, carboxylic acid, urea, urethane, carbamate, amine, amide, sulfur, sulfonate, and sulfone.

[0032] More specifically, (meth)acrylates include silicone (meth)acrylate, polyethylene glycol di(meth)acrylate, tetrahydrofuran (meth)acrylate and di(meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, isobornyl acrylate, hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene diglycol di(meth)acrylate, and diglycerol tetra(meth)acrylate. The following may be selected: tetramethylenedi(meth)acrylate, ethylenedi(meth)acrylate, neopentyl glycol di(meth)acrylate, butanediol di(meth)acrylate, bisphenol A-(meth)acrylate, ethoxylated bisphenol A-(meth)acrylate, bisphenol F-(meth)acrylate, ethoxylated bisphenol F-(meth)acrylate, bisphenol A di(meth)acrylate, ethoxylated bisphenol A-di(meth)acrylate, bisphenol F-di(meth)acrylate, and ethoxylated bisphenol F-di(meth)acrylate.

[0033] More specifically, the (meth)acrylate may be selected from commercially available products including polyfunctional (meth)acrylates [e.g., SR368 (trifunctional acrylate) and / or SR248 (neopentyl glycol dimethacrylate) from Arkema], monofunctional (meth)acrylates [e.g., SR506A (isobornyl acrylate) from Arkema], 2-(4-benzoyl-3-hydroxyphenoxy)ethyl acrylate, BAC-45 (polybutadiene diacrylate from Osaka Organic Chemical Industry Co., Ltd.), polybutadiene diacrylate (CN302 or CN303 from Arkema), polybutadiene urethane acrylate (SUO-8130LVH from SHIN-A T&C), and combinations thereof.

[0034] (Meth)acrylate should be present in an amount of about 1% to about 95% by weight, for example, about 25% to about 80% by weight, preferably about 50% to about 75% by weight, based on the total weight of the composition.

[0035] The epoxy may be a monofunctional epoxy, a difunctional epoxy, or a polyfunctional epoxy, which may be a monomer, oligomer, or polymer. Therefore, a difunctional epoxy or a polyfunctional epoxy may have epoxy functional groups pendant-like at its ends or along the chain or skeleton between its ends.

[0036] For example, examples of epoxy include monofunctional epoxy compounds such as C4-C28 alkylglycidyl ethers; C2-C28 alkyl- and alkenyl-glycidyl esters; and C1-C28 alkyl- and mono-phenol glycidyl ethers; polyglycidyl ethers of pyrocatechol, resorcinol, hydroquinone, 4,4'-dihydroxydiphenylmethane (or bisphenol F, e.g., RE-303-S or RE-404-S, commercially available from Nippon Kayaku); polyglycidyl ethers of pyrocatechol, resorcinol, hydroquinone, 4,4'-dihydroxydiphenylmethane (or bisphenol A); polyglycidyl ethers of transition metal complexes; and chlorination of the above diphenols. Examples include brominated products; polyglycidyl ethers of novolacs; polyglycidyl ethers of diphenols obtained by esterifying ethers of diphenols obtained by esterifying salts of aromatic hydrocarboxylic acids with dihaloalkanes or dihalogenated dialkyl ethers; polyglycidyl ethers of polyphenols obtained by condensing phenol with long-chain halogenated paraffins containing at least two halogen atoms; N,N'-diglycidyl-aniline; N,N'-dimethyl-N,N'-diglycidyl-4,4'-diaminodiphenylmethane; N,N,N',N'-tetraglycidyl-4,4-diaminodiphenylmethane; N,N'-diglycidyl-4-aminophenylglycidyl ether; N,N,N',N'-tetraglycidyl-1,3-propylenebis-4-aminobenzoate; phenol novolac epoxy resins; cresol novolac epoxy resins; and polyfunctional epoxy compounds which are combinations thereof.

[0037] Useful commercially available epoxy components include polyglycidyl derivatives of phenol compounds, such as those available under the trade name ePON from Resolution Performance, e.g., ePON 1009F [Bisphenol A epoxy resin (CAS number 25036-25-3)], ePON 1001F, ePON 1002F, ePON 1004F, ePON 1007F, ePON 3001, ePON 3002, ePON 2002, ePON 2003, ePON 2004, ePON PON 2005, E-PON 2012, E-PON 2014, E-PON 2024, and E-PON 2042; available from Dow Chemical Company under the trading designation DER, e.g., DER331, DER332, DER383, DER354, and DER542; available from Huntsman under the trade name Araldite, e.g., Araldite [phenol-4,4'-(1-methylethylidene)bis(chloromethyl)oxirane (CAS number 25068-38-6)], Araldite E CN1299 [polymer of formaldehyde, (chloromethyl)oxirane and 2-methylphenol, melting point 85-100°C (CAS number 29690-82-2)] and Araldite ECN1285 [polymer of formaldehyde, (chloromethyl)oxirane and 2-methylphenol, melting point 80-90°C (CAS number 29690-82-2)], and Araldite CT7097US [(phenol, 4-(1,1-dimethylethyl), (chloromethyl)oxirane and 4 Examples include polymers with 4-(1-(1-methylethylidene)bis, melting point 113-123°C (CAS number 67924-34-9)); and BREN-S from Nippon Kayaku (Japan). Other suitable epoxy resins include polyepoxides prepared from polyols, etc., and polyglycidyl derivatives of phenol-formaldehyde novolac, the latter of which are commercially available from Dow Chemical under the trade name DEN, for example, DEN431, DEN438, and DEN439.

[0038] Polyglycidyl adducts of amines, amino alcohols, and polycarboxylic acids are also useful in the present invention, and commercially available resins include Araldite 135, Glyamine 125, and Glyamine 115 from BP Chemicals; and Araldite MY720, Araldite MY721, Araldite MY0500, and Araldite MY0510 from Huntsman.

[0039] The epoxy may be present in an amount of about 1% to about 95% by weight, for example, about 25% to about 80% by weight, preferably about 50% to about 75% by weight, based on the total weight of the composition.

[0040] Alkyloxy-functionalized siloxanes may be selected from monofunctional alkoxy-functionalized siloxanes, difunctional alkoxy-functionalized siloxanes, or polyfunctional alkoxy-functionalized siloxanes, each of which may be a monomer, oligomer, or polymer. Therefore, difunctional alkoxy-functionalized siloxanes or polyfunctional alkoxy-functionalized siloxanes may have alkoxy functional groups pendant-like at their terminals or along the chain or skeleton between their terminals.

[0041] Examples of commercially available alkoxy-functionalized siloxanes include those sold by Wacker under the trade names Silless, Geniosil, and Elastosil, such as Silless BS220, Geniosil XM20, Elastosil LR3003 / 60, and Silless® IC235; those from Dow Corning, such as Dow Corning 200 and Dow Corning 890-SL; those from Momentive, such as the Siloprene LSR27XX series and Silplus HCR series; and those from Shin-Etsu Chemical, such as KF-96, X-34-202, and KR-5200.

[0042] Silane-functionalized monomers may be selected from monofunctional, difunctional, or polyfunctional silane-functionalized monomers, which may also be oligomers or polymers (however, for simplicity, they are referred to as monomers herein). Thus, difunctional or polyfunctional silane-functionalized monomers may have silane functional groups pendant-like at their terminals or along the chains or skeletons between their terminals.

[0043] Examples of commercially available silane-functionalized monomers include those from Kaneka, such as MS Polymer, S203H, S303H, S227, and S327; and those from Wacker, such as Geniosil STP-E10, STP-E15, STP-E30, and STP-E35.

[0044] The silane-functionalized monomer may be present in an amount of about 1% to about 95% by weight, for example, about 25% to about 80% by weight, preferably about 50% to about 75% by weight, based on the total weight of the composition.

[0045] The isocyanate-functionalized monomers and oligomers may be selected from monofunctional isocyanate-functionalized monomers, difunctional isocyanate-functionalized monomers, or polyfunctional isocyanate-functionalized monomers, which may also be oligomers or polymers (however, for simplicity, they will be referred to as monomers herein). Thus, difunctional isocyanate-functionalized monomers or polyfunctional isocyanate-functionalized monomers may have isocyanate functional groups pendant-like at their terminals or along the chain or skeleton between their terminals.

[0046] Isocyanate-functionalized components include monomeric or polymeric diphenylmethane diisocyanate ("MDI"), isocyanate-functionalized prepolymers, or mixtures thereof. Such components are understood to have, on average, two or more isocyanate groups. Polymeric MDI is a known commercial variant of MDI. It is not a prepolymer, but rather a "linked" MDI molecule. Polyisocyanate components that are 100% monomeric polyisocyanate do not exhibit remarkable advantages. However, polyisocyanate components containing up to about 50% by weight of monomeric polyisocyanate exhibit favorable properties. In some embodiments, the polyisocyanate component contains about 50% by weight or less of monomeric polyisocyanate relative to the weight of the polyisocyanate component. Monomeric MDI and its isomers are preferred and may be used exclusively if monomeric polyisocyanate is present in the polyisocyanate component. In some embodiments, the polyisocyanate component preferably comprises polymeric MDI, MDI prepolymer, monomeric MDI, or a mixture thereof.

[0047] Some suitable polyisocyanates include hydrogenated MDI ("HMDI"), xylylene diisocyanate ("XDI"), tetramethyl xylylene diisocyanate ("TMXDI"), 4,4'-diphenyldimethyl-methane diisocyanate, di- and tetra-alkylenediphenylmethane diisocyanate, 4,4'-dibenzyle diisocyanate, 1,3-phenylenediisocyanate, 1,4-phenylenediisocyanate, 1-methyl-2,4-diisocyanatocyclohexane, 1,6-diisocyanato-2, 2,4-trimethylhexane, 1,6-diisocyanato-2,4,4-trimethylhexane, 1-isocyanatomethyl-3-isocyanato-1,5,5-trimethylcyclohexane ("IPDI"), chlorinated and brominated diisocyanates, phosphorus-containing diisocyanates, 4,4'-diisocyanatophenyl perfluoroethane, tetramethoxybutane-1,4-diisocyanate, butane-1,4-diisocyanate, hexane-1,6-diisocyanate ("HDI"), dicyclohexylmethane diisocyanate, cyclohex Sun-1,4-diisocyanate, ethylene diisocyanate, bis-isocyanatoethyl phthalate; diisocyanates containing reactive halogen atoms, e.g., 1-chloromethylphenyl-2,4-diisocyanate, 1-bromomethylphenyl-2,6-diisocyanate, or 3,3-bis-chloromethyl ether 4,4'-diphenyl diisocyanate, trimethylhexamethylene diisocyanate, 1,4-diisocyanatobutane, 1,12-diisocyanatododecane, dimer fatty acid diisocyanate, tetra Examples include lamethylene diisocyanate, hexamethylene diisocyanate, undecane diisocyanate, dodecamethylene diisocyanate, 2,2,4-trimethylhexane-2,3,3-trimethylhexamethylene diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, 1,3- and 1,4-tetramethylxylene diisocyanate, isophorone, 4,4-dicyclohexylmethane, tetramethylxylylene (TMXDI), and lysine ester diisocyanates.

[0048] Some suitable polyisocyanates include aromatic polyisocyanates, characterized by the isocyanate group being directly positioned on a benzene ring. Suitable aromatic diisocyanates include MDI and its isomers, toluene diisocyanate ("TDI") and its isomers, and naphthalene-1,5-diisocyanate ("NDI").

[0049] Other suitable polyisocyanates include, for example, sulfur-containing polyisocyanates obtained by the reaction of 2 moles of hexamethylene diisocyanate with 1 mole of thiodiglycol or dihydroxydihexyl sulfide.

[0050] Aliphatic polyisocyanates having two or more isocyanate functional groups formed by biuret bonds, uretdione bonds, allophanate bonds, and / or trimerization are suitable.

[0051] The polyisocyanate component includes a single polyisocyanate or a mixture of two or more polyisocyanates.

[0052] Useful polyisocyanates include MDI, TDI, 1,4-diisocyanatobenzene ("PPDI"); 2,4'-diphenylmethane diisocyanate; 1,5-naphthalene diisocyanate, polymeric MDI, vitrine diisocyanate, 1,3-xylene diisocyanate, p-TMXDI, 1,6-diisocyanato-2,4,4-trimethylhexane, CHDI, BDI, H6XDI, IPDI, H 12 Examples of diisocyanates include MDI, any of the polymer versions of the above (e.g., polymeric MDI), modified versions thereof (e.g., allophanate, carbodiimide, and biuret), and mixtures thereof.

[0053] Examples of commercially available isocyanate-functionalized monomers, oligomers, polymers, and prepolymers include those from Evonik sold under the trade name Vestanat (including Vestanat IPDI, TMDI, and A95); and those from Covestro sold under the trade names Desmodul and Mondour (including Desmodul VK5, Desmodul 44V, Desmodul, and Mondour MR).

[0054] Isocyanate-functionalized monomers, oligomers, polymers, and prepolymers may be present in amounts of about 1% to about 95% by weight, for example, about 25% to about 80% by weight, preferably about 50% to about 75% by weight, based on the total weight of the composition.

[0055] The composition may also include peroxides, nitrogen-containing compounds (such as amines), catalysts, and curing agents such as azo compounds.

[0056] Examples of peroxides include hydrogen peroxide, benzoyl peroxide, cumene hydroperoxide, sodium peroxide, acetyl peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, calcium peroxide, and peracetic acid, with cumene hydroperoxide and sodium peroxide being preferred.

[0057] Examples of nitrogen-containing compounds suitable as curing agents, particularly for use with epoxy, include amines marketed by BASF under the trade names Jefamine and Baxodur, such as Jefamine D400, M600, and M1000, and Baxodur EC130, EC303, and EC310; as well as ethylenediamine ("EDA"), diethylenetriamine ("DETA"), and triethylenetetramine ("TETA").

[0058] Examples of catalysts include tin, potassium, alumina, zirconium dioxide, copper chromate, and sodium hydroxide.

[0059] Examples of azo compounds include 2,2'-azobis(2-methylpropionitrile), 2,2'-azobis(isobutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(2-methylbutyronitrile).

[0060] The curing component may be present in an amount of about 25% to about 99% by weight of the composition; the curing agent may be present in an amount of about 0.1% to about 50% by weight of the composition; and the particles injected with the ionic liquid may be present in an amount of about 0.9% to about 70% by weight of the composition, with the total amount being 100% by weight of the composition.

[0061] Alternatively, the curing component may be present in an amount of about 25% to about 95% by weight of the composition; the curing agent may be present in an amount of about 5% to about 40% by weight of the composition; and the particles injected with the ionic liquid may be present in an amount of about 2% to about 65% by weight of the composition, where the total amount is 100% by weight of the composition.

[0062] The composition may be useful as an adhesive or coating.

[0063] In another embodiment, provided herein is a method for peeling off one or more substrates bonded together by an adhesive composition, The process of providing an assembly comprising two or more conductive substrates bonded together on their inward-facing surfaces by the reaction product of the curable composition as described above, A step of providing a power supply, comprising the steps of creating a first connection from the power supply to a first conductive substrate and creating a second connection from the power supply to a second conductive substrate, A step of applying a DC current of approximately 3 volts to approximately 75 volts, for example, approximately 30 volts, from the power supply to the conductive substrate for a period of approximately 0.1 seconds to approximately 3 hours at room temperature, for example, a period of approximately 5 minutes to approximately 3 hours. A step of separating at least one conductive substrate from the reaction product, This method includes [something].

[0064] When carrying out this method, at least one conductive substrate may be separated from the reaction product with little or no residual reaction product remaining on the surface of the separated substrate.

[0065] When implementing this method, at least one conductive substrate may be separated from the reaction product using a force less than approximately 50% of the force required in the absence of applied voltage.

[0066] Furthermore, when this method is implemented, at least one of the substrates to be separated will be separated with little or no curable composition remaining on the substrate under such conditions.

[0067] In another embodiment, provided herein is a method for reversibly bonding one or more substrates with a curable composition, A step of providing one or more conductive substrates, The process involves placing the curable composition described above on at least one surface of at least one of the one or more conductive substrates, A step of forming an adhesively bonded assembly by joining the at least one surface on which the curable composition is disposed to another surface of a conductive substrate, and exposing the joined surfaces to conditions suitable for curing the curable composition, A step of providing a power source and connecting the power source to the bonded assembly, wherein a first connection is made from the power source to a first conductive substrate, and a second connection is made from the power source to a second conductive surface, A step of applying a DC current of approximately 3 volts to approximately 75 volts, for example, approximately 30 volts, from the power supply to the conductive substrate for a period of approximately 0.1 seconds to approximately 3 hours at room temperature, for example, a period of approximately 5 minutes to approximately 3 hours. A step of separating at least one conductive substrate from the cured composition, This method includes [something].

[0068] The following examples are provided for illustrative purposes only. [Examples]

[0069] In these examples, the compositions to be evaluated were prepared using the following components listed in Table 1 below.

[0070] [Table 1]

[0071] Samples 1-4 were prepared by combining the materials listed in Table 1 (based on weight percent) in the amounts indicated. Here, ionic liquid A is a salt compound partially dissolved in water and further dissolved in the solvent. The composition of the ionic liquid is 30 wt% lithium perchlorate dissolved in 10 wt% water and 60 wt% PEG400. The ionic compounds were added to the solvent while rapidly mixing for about 3 minutes at room temperature, or until no identifiable ionic compounds were visible.

[0072] Subsequently, the ionic liquid A formed in this manner was added to the absorbent particles (Solessphere L-51) in an amount of 35% by weight of ionic liquid and 65% by weight of particles to create particles infused with the ionic liquid used in Sample 4. The mixture was rapidly mixed at room temperature for approximately 1 minute, or until all the liquid was absorbed. It was determined that the particles infused with the ionic liquid contained 1.4 g of ionic liquid per gram of particle.

[0073] Subsequently, parts A and B of the epoxy adhesive system were mixed, and samples 1 to 4 were prepared by adding either particles (sample 2), ionic liquid (sample 3), or particles injected with ionic liquid (sample 4) to samples 2 to 4. The prepared samples were applied to cleaned galvanized steel sheet substrates, then joined together and cured at room temperature for approximately 24 hours to form joined assemblies. Three sets of each assembly were prepared.

[0074] After forming the assembly, the power supply was connected to the substrate and voltage was applied. The force required to separate the substrate is shown in Table 2 below and visually represented in Figure 1.

[0075] [Table 2]

[0076] When particles injected with ionic liquid are added to an adhesive system, it is observed that the force required to separate the bonded substrates is significantly reduced.

Claims

1. Particles injected with ionic liquid.

2. The particle according to claim 1, wherein the ionic liquid is a salt that is in a liquid state at room temperature.

3. The particles according to claim 1, wherein the ionic liquid is a salt having a melting point of less than about 100°C.

4. The particle according to claim 1, wherein the ionic liquid is composed of a salt in which a group IA or group IIA element is used as a cation and a group VIIA element or a compound containing one or more group VIIA elements is used as an anion, optionally an organic solvent, and optionally water.

5. The particles according to claim 4, wherein an organic solvent is present.

6. The particles according to claim 5, wherein the organic solvent is PEG400, PEG200, or PEG600, tetraglyme, tetrahydrofuran ("THF"), dimethylformamide ("DMF"), hydroxyethyl acrylate ("HEA"), hydroxyethyl methacrylate ("HEMA"), methacrylic acid ("MAA"), or acrylamide.

7. The particle according to claim 4, wherein water is present.

8. The particles according to claim 1, wherein the ionic liquid contains a salt in which an alkali metal selected from the group consisting of lithium, sodium, beryllium, magnesium, iron, copper, aluminum, or zinc is used as a cation, and fluorine, chlorine, oxygen, sulfur, nitrogen, phosphorus, carbon, or silicon is used as an anion.

9. The particles according to claim 1, wherein the ionic liquid comprises a salt in which imidazolium, pyridinium, phosphonium, ammonium, morpholinium, allyl cation, or benzyl is used as the cation, and tetrafluoroborate, hexafluorophosphate, trifluoromethanesulfonate, bis(trifluoromethylsulfonyl)imide ("TFSI"), acetate, carboxylate, phenolate, or sulfonate is used as the anion.

10. The particles according to claim 1, wherein the ionic liquid contains salt in an amount of about 15% to about 50% by weight, organic solvent in an amount of about 50% to about 75% by weight, and water in an amount of about 5% to about 15% by weight.

11. The particles according to claim 1, wherein the ionic liquid contains salt in an amount of about 30% by weight, organic solvent in an amount of about 60% by weight, and water in an amount of about 10% by weight.

12. The particle according to claim 1, wherein the ionic liquid is present in the particle injected with the ionic liquid in an amount of about 50% to about 75% by weight, and the particle is present in the particle injected with the ionic liquid in an amount of about 25% to about 50% by weight.

13. The particle according to claim 1, wherein the particle has a size in the range of about 50 nm to about 200 μm.

14. The particle according to claim 1, wherein the particle is inorganic.

15. The particles according to claim 1, wherein the particles are fused silica, calcium carbonate, carbon black, alumina, molecular sieve, clay, titanium dioxide, mica, talc, graphite, and glass particles.

16. The aforementioned particles are approximately 20 m ２ / g ~ approx. 500m ２ The particle according to claim 1, having a surface area per g (determined by BET measurement).

17. The particle according to claim 1, wherein the particle is organic.

18. The particles according to claim 1, wherein the particles are selected from the group consisting of sawdust, cellulose, PMMA, PS, PP, PET, and nylon.

19. A composition comprising an ionic liquid and particles, wherein the ionic liquid is supported within or on the particles.

20. A curable composition comprising a curable component and particles into which the ionic liquid of claim 1 has been injected.

21. The composition according to claim 20, wherein the curable component is one selected from the group consisting of (meth)acrylate, epoxy, alkoxy-functionalized siloxane, silane-functionalized monomer, oligomer and polymer, isocyanate-functionalized monomer, oligomer and polymer, and combinations thereof.

22. The composition according to claim 20, further comprising a curing agent.

23. The composition according to claim 20, wherein the curable component is present in an amount of about 25% to about 99% by weight of the composition, the curing agent is present in an amount of about 0.1% to about 20% by weight of the composition, and the particles injected with the ionic liquid are present in an amount of about 0.9% to about 70% by weight of the composition, with the total amount being 100% by weight of the composition.

24. The composition according to claim 20, wherein the curable component is present in an amount of about 25% to about 40% by weight of the composition, the curing agent is present in an amount of about 5% to about 20% by weight of the composition, and the particles injected with the ionic liquid are present in an amount of about 35% to about 65% by weight of the composition, with the total amount being 100% by weight of the composition.

25. The composition according to claim 20, wherein the composition is an adhesive or a coating.

26. A method for peeling off one or more substrates bonded together with an adhesive composition, A step of providing an assembly comprising two or more conductive substrates bonded together on their inward-facing surfaces by a reaction product of the curable composition of claim 20, A step of providing a power supply, comprising the steps of creating a first connection from the power supply to a first conductive substrate and creating a second connection from the power supply to a second conductive substrate, A step of applying a DC current of approximately 3 volts to approximately 75 volts from the power supply to the conductive substrate for a period of approximately 0.1 seconds to approximately 3 hours at room temperature, A step of separating at least one conductive substrate from the reaction product, Methods that include...

27. The method according to claim 26, wherein the DC current applied is 30 volts.

28. The method according to claim 26, wherein the period is approximately 0.1 seconds to approximately 3 hours.

29. The method according to claim 26, wherein the temperature exceeds room temperature.

30. The method according to claim 26, wherein the at least one conductive substrate is separated from the reaction product such that little or no residual reaction product remains on the surface of the separated substrate.

31. The method according to claim 26, wherein the at least one conductive substrate is separated from the reaction product using a force less than approximately 50% of the force required in the absence of applied voltage.

32. A method for reversibly bonding one or more substrates with a curable composition, A step of providing one or more conductive substrates, A step of placing the curable composition of claim 1 on at least one surface of at least one of the one or more conductive substrates, A step of forming an adhesively bonded assembly by joining the at least one surface on which the curable composition is disposed to another surface of a conductive substrate, and exposing the joined surfaces to conditions suitable for curing the curable composition, A step of providing a power source and connecting the power source to the bonded assembly, wherein a first connection is made from the power source to a first conductive substrate, and a second connection is made from the power source to a second conductive surface, A step of applying approximately 3 volts to approximately 75 volts from the power supply to the conductive substrate for a period of approximately 0.1 seconds to approximately 3 hours at room temperature, A step of separating at least one conductive substrate from the cured composition, Methods that include...

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