Flexible Substrate Coating Equipment

The flexible substrate coating apparatus addresses issues of uniformity, adhesion, and density in thin film coatings by controlling temperature and degassing, resulting in improved coating quality and efficiency.

JP3249503UActive Publication Date: 2024-12-18JIANGYIN NANOPORE INNOVATIVE MATERIALS TECH LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2024600131U
Authority / Receiving Office
JP · JP
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2022-02-28
Filing Date
2022-05-25
Publication Date
2024-12-18
Estimated Expiration
2032-05-25

AI Technical Summary

Technical Problem

Existing coating technologies for flexible substrates face issues with poor uniformity, adhesion, and density of thin film coating layers, leading to potential detachment and reduced quality.

Method used

A flexible substrate coating apparatus with a vacuum chamber, partition plate, unwinding and take-up rollers, heating and cooling members, and coating rollers, which controls temperature and degassing to enhance bonding and uniformity of thin film layers.

Benefits of technology

Improves the uniformity, adhesion, and density of thin film coating layers on flexible substrates, maintaining continuous crystallization and reducing stress, thereby enhancing coating quality and efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0003249503000001_ABST
    Figure 0003249503000001_ABST
Patent Text Reader

Abstract

The present invention relates to a flexible substrate coating apparatus and a coating method. The flexible substrate coating apparatus includes a vacuum chamber, a partition plate, an unwinding roller, a heating member, a coating roller, a coating member, and a winding roller. The partition plate is located in the vacuum chamber and is used to divide the vacuum chamber into a heating chamber and a coating chamber. The partition plate is provided with a first through hole for conveying the substrate from the heating chamber to the coating chamber and a second through hole for conveying the substrate from the coating chamber to the heating chamber. The unwinding roller, the heating member, and the winding roller are located in the heating chamber, the unwinding roller is used to unwind the substrate, the heating member is used to heat the substrate in the heating chamber, and the winding roller is used to wind the substrate. The coating roller and the coating member are located in the coating chamber, and the coating member is used to coat the substrate on the surface of the coating roller in close proximity to the coating roller to form a thin coating layer on the surface of the substrate. The use of the apparatus can increase the adhesion, density, and thickness uniformity of the thin coating layer on the surface of the substrate.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to the technical field of coating, and in particular to a flexible substrate coating apparatus and coating method. [Background technology]

[0002] With the continuous improvement of material processing technology, it is widely used to coat a thin film on the surface of a flexible substrate to impart corresponding properties to the flexible substrate. In the process of coating a thin film on the surface of a flexible substrate, the flexible substrate and the thin film are often made of different materials, so that when coating a thin film on the surface of a flexible substrate, problems such as poor thickness uniformity of the thin film coating layer, poor adhesion, and poor density are likely to occur. Summary of the Invention [Problem to be solved by the invention]

[0003] In light of this, there is a need to provide a coating apparatus and method that can improve the adhesion, density, and thickness uniformity of a thin coating layer on the surface of a flexible substrate. [Means for solving the problem]

[0004] In order to solve the above problems, the technical solution of this invention is as follows: a vacuum chamber; a partition plate located within the vacuum chamber and used to divide the vacuum chamber into a heating chamber and a coating chamber, the partition plate having a first through hole for conveying a substrate from the heating chamber to the coating chamber and a second through hole for conveying a substrate from the coating chamber to the heating chamber; an unwinding roller; a heating member; a coating roller; a coating implementation member; and a winding roller; the unwinding roller, the heating member and the winding roller are located in the heating chamber, the unwinding roller is used to unwind the substrate, the heating member is used to heat the substrate in the heating chamber, and the winding roller is used to wind the substrate; the coating roller and the coating member are located in the coating chamber, and the coating member is used to apply coating to a substrate on a surface of the coating roller in close proximity to the coating roller to form a thin coating layer on the surface of the substrate; A flexible substrate coating device.

[0005] In one embodiment thereof, the flexible substrate coating apparatus further comprises a cooling member located in the coating chamber and used to cool water vapor in the coating chamber.

[0006] In one embodiment thereof, the flexible substrate coating apparatus further comprises a coating baffle located inside the coating chamber and between the coating roller and the coating implementation member, the baffle having a coating opening, the coating roller being located at the coating opening, and the coating layer material formed by the coating implementation member leaking out from the coating opening onto the surface of the substrate on the coating roller.

[0007] In one embodiment, the diameter of the coating opening gradually increases in the direction from the coating roller to the coating member.

[0008] In one embodiment thereof, the coating baffle divides the coating chamber into a cooling chamber and a coating chamber, the cooling member is located within the cooling chamber, and the coating member is located within the coating chamber.

[0009] In one embodiment thereof, the heating element is a hollow heating tube in which a heating medium is placed.

[0010] In one embodiment thereof, the flexible substrate coating apparatus further comprises a heating roller located in the heating chamber and positioned between the coating roller and the winding roller and used to heat the substrate after it has been coated and before it is wound up.

[0011] Adopting the flexible substrate coating apparatus according to any one of the above embodiments, The method for coating a flexible substrate includes a step of unwinding the substrate by the unwinding roller so that the substrate passes through the first through hole, the coating roller, and the second through hole in that order, and then winding the substrate by the winding roller.

[0012] In one embodiment, the temperature of the substrate in the heating chamber is controlled to 20°C to 100°C by the heating member.

[0013] In one embodiment, the temperature of the substrate on the surface of the coating roller is controlled to be between −30° C. and 30° C.; And / or, the flexible substrate coating device is further provided with a heating roller located in the heating chamber between the coating roller and the winding roller, the temperature of the substrate on the surface of which is controlled to 30°C to 120°C. Effect of the Invention

[0014] The flexible substrate coating device includes a vacuum chamber, a partition plate, an unwinding roller, a heating member, a coating roller, a coating member, and a winding roller. The partition plate is located in the vacuum chamber and is used to divide the vacuum chamber into a heating chamber and a coating chamber. The partition plate is provided with a first through hole for conveying the substrate from the heating chamber to the coating chamber and a second through hole for conveying the substrate from the coating chamber to the heating chamber. The unwinding roller, the heating member, and the winding roller are located in the heating chamber, the unwinding roller is used to unwind the substrate, the heating member is used to heat the substrate in the heating chamber, and the winding roller is used to wind the substrate. The coating roller and the coating member are located in the coating chamber, and the coating member is used to coat the substrate on the surface of the coating roller in close proximity to the coating roller to form a thin coating layer on the surface of the substrate. In the flexible substrate coating device, the substrate is unwound by the unwinding roller, passes through the coating roller, and is then wound by the winding roller. In this process, the substrate is first heated in the heating chamber, and the heating process can achieve a good degassing effect on the substrate, thus enhancing the bonding strength and density between the thin coating layer and the surface of the substrate during the coating process, and further improving the uniformity of the thickness of the thin coating layer on the surface of the substrate. Then, as the substrate is further conveyed, the substrate is conveyed to the surface of the coating roller, and the coating layer material formed is sent to the surface of the substrate by the action of the coating implementation member, and deposited on the surface of the substrate to form a thin coating layer. After the coating is completed, the substrate with the thin coating layer formed on its surface passes through the second through hole of the partition plate and enters the heating chamber again, and is heated again in the heating chamber, at this time, the continuous crystallization of the thin coating layer can be effectively maintained, the density of the thin film can be improved, and the stress of the thin coating layer can be fully released, which can better match the internal stress of the thin coating layer and the internal stress of the substrate, which is favorable to improving the quality of the thin coating layer and further improving the uniformity of the thickness of the thin coating layer on the surface of the substrate.The substrate with the thin coating layer formed on its surface is heated again in the heating chamber and then wound up by a winding roller, completing the coating and winding of the flexible substrate. By using the flexible substrate coating device, the uniformity of the thickness of the thin coating layer on the substrate surface can be effectively improved, while the temperature at each stage in the coating process can be controlled to effectively maintain and increase the bonding force of the thin coating layer on the substrate surface, making it difficult for the thin coating layer to fall off from the substrate surface. At the same time, when the flexible substrate coating device is used to coat the flexible substrate, the thin coating layer can be continuously crystallized, improving the density and quality of the thin coating layer, and the thin coating layer can be continuously crystallized during the coating process, thereby avoiding a separate crystallization process and flow time, and improving the efficiency of the coating process.

[0015] Furthermore, the flexible substrate coating apparatus further includes a cooling member located in the coating chamber and used to cool the water vapor in the coating chamber. After the substrate is heated and degassed in the heating chamber, it passes through the first through-hole in the partition plate and enters the coating chamber, and at this time, the water vapor in the coating chamber can be condensed by the cooling action of the cooling member in the coating chamber, for example, the water vapor can be condensed into solid ice to remove the water vapor in the coating chamber. This avoids the movement of water vapor in the coating chamber from adversely affecting the vacuum effect of the coating chamber, and thus the substrate can be stably coated in the coating chamber, and the bonding strength and compactness between the thin coating layer and the surface of the substrate during the coating process can be further increased.

[0016] The flexible substrate coating method employs the flexible substrate coating device, and includes the steps of unwinding the substrate by an unwinding roller to pass through a first through hole, a coating roller, and a second through hole in sequence, and winding the substrate by a winding roller. The flexible substrate coating method can effectively improve the uniformity of the thickness of the thin film coating layer on the surface of the flexible substrate, increase the bonding strength between the thin film coating layer and the surface of the substrate, improve the quality of the thin film coating layer, and increase the processing efficiency of the coating of the flexible substrate. [Brief description of the drawings]

[0017] [Figure 1] 1 is a structural schematic diagram of a coating device for flexible substrates according to an embodiment of the present invention; [Explanation of symbols]

[0018] Reference Signs List 100: flexible substrate coating device, 101: partition plate, 102: unwinding roller, 103: heating member, 104: cooling member, 105: coating roller, 106: coating implementation member, 107: take-up roller, 108: heating chamber, 109: cooling chamber, 110: coating implementation chamber, 111: coating baffle plate, 112: coating opening, 113: coating layer material, 114: heating roller, 115: temperature sensor, 116: substrate guide roller, 200: substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] In order to make the above objects, features and advantages of the present invention more clearly understandable, the following detailed description of the specific embodiments of the present invention will be given with reference to the drawings. In the following description, many specific details are described in order to fully understand the present invention. However, the present invention can be embodied in many other forms different from those described herein, and those skilled in the art can make similar improvements without violating the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

[0020] In describing the present invention, it should be understood that the orientations or positional relationships indicated by the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are based on the orientations or positional relationships shown in the drawings, and are merely intended to facilitate and simplify the description of the present invention, and do not indicate or imply that such devices or elements must have a specific orientation or be configured and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0021] Moreover, the terms "first" and "second" are for descriptive purposes only and cannot be understood as indicating or implying the relative importance or the quantity of the technical features indicated. Thus, a feature qualified as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the invention, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.

[0022] In the present invention, unless otherwise clearly specified and limited, the terms "attach", "connect", "connect", "fixed", etc. should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or it may be integrated, it may be a mechanical connection, it may be an electrical connection, it may be a direct connection, it may be an indirect connection via an intermediate medium, it may be an internal communication between two elements, or an interactive relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific situation.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0024] 1, one embodiment of the present invention provides a flexible substrate coating apparatus 100. The flexible substrate coating apparatus 100 includes a vacuum chamber, a partition plate 101, an unwinding roller 102, a heating member 103, a coating roller 105, a coating member 106, and a winding roller 107, the partition plate 101 is located in the vacuum chamber and is used to divide the vacuum chamber into a heating chamber 108 and a coating chamber, and the partition plate 101 is provided with a first through hole for conveying the substrate from the heating chamber 108 to the coating chamber, and a second through hole for conveying the substrate from the coating chamber to the heating chamber 108. The unwinding roller 102, the heating member 103, and the winding roller 107 are located in the heating chamber 108, the unwinding roller 102 is used to unwind the substrate, the heating member 103 is used to heat the substrate in the heating chamber 108, and the winding roller 107 is used to wind the substrate. The coating roller 105 and the coating member 106 are located in the coating chamber, and the coating member 106 is used to apply a coating to a substrate on the surface of the coating roller 105 in close proximity to the coating roller 105 to form a thin coating layer on the surface of the substrate.

[0025] In the flexible substrate coating apparatus 100 of this embodiment, the substrate 200 is unwound by the unwinding roller 102, passes through the coating roller 105, and is then wound by the winding roller 107. In this process, the substrate is first heated in the heating chamber 108, which can achieve good degassing effect on the substrate during the heating process, thus improving the bonding strength and density between the thin coating layer and the substrate surface during the coating process, and further improving the thickness uniformity of the thin coating layer on the substrate surface. Then, as the substrate is further transported, it is transported to the surface of the coating roller 105, and at this time, the coating layer material 113 formed is sent to the substrate surface by the action of the coating implementation member 106, and deposited on the substrate surface to form a thin coating layer. After the coating is completed, the substrate with the thin film coating layer formed on the surface passes through the second through hole of the partition plate 101 and enters the heating chamber 108 again, and is heated again in the heating chamber 108, which effectively maintains the continuous crystallization of the thin film coating layer and allows the stress of the thin film coating layer to be fully released, and the internal stress of the thin film coating layer can be better matched with the internal stress of the substrate, which is favorable for improving the quality of the thin film coating layer and further improving the uniformity of the thickness of the thin film coating layer on the surface of the substrate. The substrate with the thin film coating layer formed on the surface is heated again in the heating chamber 108 and then wound by the winding roller 107, thereby completing the coating and winding of the flexible substrate. The flexible substrate coating apparatus 100 in this embodiment can effectively improve the uniformity of the thickness of the thin film coating layer on the surface of the substrate, while controlling the temperature of each step in the coating process, effectively maintaining and increasing the binding force of the thin film coating layer on the surface of the substrate, and making the thin film coating layer on the surface of the substrate less likely to fall off. At the same time, when the flexible substrate coating apparatus 100 is used to coat a flexible substrate, the thin coating layer can be kept crystallized continuously, the quality of the thin coating layer can be improved, and the efficiency of the coating process can be further improved.

[0026] It is understood that the coating member 106 may be, but is not limited to, a coating member by vacuum evaporation, a coating member by vacuum sputtering, and a coating member by vacuum ions. Through the action of the coating member 106, a coating layer material 113, which may be a material formed by the collision of a target, can be formed on the surface of the substrate to form a thin coating layer. In the actual coating process, a suitable target can be selected according to the coating requirements, and a thin coating layer that meets the requirements can be formed on the surface of the substrate.

[0027] In one specific example, the flexible substrate coating apparatus 100 further includes a cooling member 104 located in the coating chamber and used to cool the water vapor in the coating chamber. After the substrate is heated and degassed in the heating chamber 103, it passes through the first through hole in the partition plate 101 to enter the coating chamber, and at this time, the water vapor in the coating chamber can be condensed by the cooling action of the cooling member in the coating chamber, and the water vapor can be condensed into solid ice by the cooling action of the cooling member, so that the water vapor in the coating chamber can be removed. The movement of the water vapor in the coating chamber is prevented from adversely affecting the vacuum effect of the coating chamber, so that the substrate can be stably coated in the coating chamber, and the bonding strength and compactness between the thin coating layer and the surface of the substrate during the coating process can be further increased.

[0028] In a specific example, the flexible substrate coating apparatus 100 further includes a coating baffle 111, which is located inside the coating chamber and disposed between the coating roller 105 and the coating member 106, and is provided with a coating opening 112, the coating roller 105 is located at the coating opening 112, and the coating layer material 113 formed by the coating member 106 escapes from the coating opening 112 onto the substrate surface of the coating roller 105. During the coating process, the coating member 106 knocks out the material on the target surface to form the coating layer material 113, and the coating layer material 113 escapes onto the substrate surface of the coating roller 105 to deposit on the substrate surface to form a thin coating layer. Due to the installation of the coating baffle 111 with the coating opening 112 open, the coating layer material 113 escapes from the coating opening 112 onto the substrate surface of the coating roller 105. The excess coating layer material 113 can be blocked by the coating baffle plate 111, and thus the accuracy of depositing the coating layer material 113 on the surface of the substrate can be improved. In addition, the coating layer material 113 blocked by the coating baffle plate 111 can be recycled and reused, and the utilization rate of the coating layer material 113 is improved. In particular, when the coating layer material 113 is a precious metal, the installation of the coating baffle plate 111 can effectively reduce the cost of the coating process by recovering the precious metal.

[0029] Furthermore, the diameter of the coating opening 112 gradually increases in the direction from the coating roller 105 to the coating member 106. In this way, the coating layer material 113 formed by the coating member 106 can be fully applied to the surface of the substrate exposed at the coating opening 112, which is advantageous in further improving the uniformity of the thickness of the thin coating layer on the surface of the substrate.

[0030] Furthermore, the coating baffle 111 divides the coating chamber into the cooling chamber 109 and the coating chamber 110, the cooling member 104 is located in the cooling chamber 109, and the coating member 106 is located in the coating chamber 110. At this time, the coating baffle 111 divides the coating chamber into the cooling chamber 109 and the coating chamber 110, that is, the cooling of the substrate and the coating of the substrate can be separately performed by coating, in order to avoid the mutual interference between the coating member 106 and the cooling member 104. At the same time, the position of the excess coating layer material 113 during the coating process can be better controlled, and the excess coating layer material 113 can be effectively prevented from escaping into the cooling chamber 109 and causing adverse effects on the cooling chamber 109.

[0031] As one specific choice of the heating element 103, the heating element 103 is a hollow heating tube in which a heating medium is placed. The combination of the hollow heating tube and the heating medium can stably heat the substrate in the heating chamber 108, and the temperature of the substrate is conveniently controlled. Specifically, the use of the heating element 103 controls the temperature of the substrate in the heating chamber 108 to 20°C to 100°C, for example, the temperature of the substrate in the heating chamber 108 to 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C or 100°C. When the heating element 103 is employed to heat the substrate in the heating chamber 108, it can be understood that the temperature of the substrate in the heating chamber 108 may be controlled to other temperature values ​​within the range of 20°C to 100°C. Furthermore, the shape of the heating element 103 is serpentine. At this time, the serpentine heating member 103 exhibits a more uniform heating effect, makes it easier to heat the heating chamber 108 sufficiently, and can maintain the substrate in the heating chamber 108 in a stable temperature atmosphere, which is advantageous in improving the heating effect.

[0032] As a specific choice of the cooling member 104, the cooling member 104 is a hollow cooling tube in which a cooling medium is placed. The combination of the hollow cooling tube and the cooling medium can stably cool the water vapor in the coating chamber, and the temperature of the water vapor can be conveniently controlled. Specifically, the cooling member 104 is used to control the temperature in the coating chamber to -100°C or lower. Preferably, the cooling member 104 is used to control the temperature in the coating chamber to -100°C to -150°C. For example, the temperature in the coating chamber is controlled to -100°C, -105°C, -110°C, -115°C, -120°C, -125°C, -130°C, -135°C, -140°C, -145°C or -150°C. When the cooling member 104 is employed to cool the water vapor in the coating chamber, it can be understood that the temperature in the coating chamber may be controlled to other temperature values ​​below -100°C. Moreover, the shape of the cooling member 104 is serpentine. At this time, the serpentine cooling element 104 can provide a more uniform cooling effect, facilitate the sufficient cooling of the coating chamber, and keep the substrate in the coating chamber in a stable temperature atmosphere, which is favorable for improving the cooling effect. Preferably, the hollow cooling tube is a copper tube.

[0033] In one specific example, the coating roller 105 is a coating roller 105 having a heating function. For example, the coating roller 105 is provided with a heating assembly for heating the substrate on the surface of the coating roller 105. Specifically, the heating function of the coating roller 105 controls the temperature of the substrate on the surface of the coating roller 105 to -30°C to 30°C. For example, the heating function of the coating roller 105 controls the temperature of the substrate on the surface of the coating roller 105 to -30°C, -25°C, -20°C, -15°C, -10°C, 0°C, 5°C, 10°C, 15°C, 20°C, 20°C, or 30°C. When the heating function of the coating roller 105 controls the temperature of the substrate on the surface of the coating roller 105, it can be understood that the temperature of the substrate on the surface of the coating roller 105 may be controlled to other temperature values ​​within the range of -30°C to 30°C.

[0034] In one specific example, the first through hole and the second through hole communicate with each other.

[0035] In another specific example, the flexible substrate coating apparatus 100 further includes a heating roller 114 located in the heating chamber 108, which is located between the coating roller 105 and the winding roller 107 and is used to heat the substrate after coating and before winding. The installation of the heating roller 114 can better release the stress of the thin coating layer, better balance the internal stress between the thin coating layer and the substrate, and improve the quality of the thin coating layer. Furthermore, the heating roller 114 controls the temperature of the substrate on the surface of the heating roller 114 to 30°C to 120°C. Preferably, the heating roller 114 controls the temperature of the substrate on the surface of the heating roller 114 to 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, or 120°C. It is understood that the temperature to which the substrate on the surface of the heating roller 114 is controlled by the heating roller 114 may be other temperature values ​​within the range of 30°C to 120°C.

[0036] In another specific example, the flexible substrate coating apparatus 100 further includes a temperature sensor 115 located in the heating chamber 108 and / or the coating chamber and used to detect the temperature of the substrate in the heating chamber 108 and / or the coating chamber. The installation of the temperature sensor 115 can conveniently detect the temperature of the substrate in the heating chamber 108 and / or the coating chamber, facilitating monitoring of the coating process.

[0037] Specifically, in the flexible substrate coating apparatus 100 shown in FIG. 1, there are two temperature sensors 115, which are located at the unwinding roller 102 and the winding roller 107, respectively, and are used to detect the temperatures of the unwound substrate and the wound substrate, respectively. It can be understood that the number of temperature sensors 115 may be other values. For example, the number of temperature sensors 115 is 1 to 10, such as 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc. The position of the temperature sensor 115 can be set to an appropriate position of the heating chamber 108 and / or the coating chamber according to the requirements of temperature measurement.

[0038] In another specific example, the flexible substrate coating apparatus 100 further includes a substrate guide roller 116 located in the heating chamber 108 and / or the coating chamber and used to guide the substrate. The substrate guide roller 116 can be installed to effectively control the conveying direction of the substrate. In the flexible substrate coating apparatus 100 shown in FIG. 1, the number of substrate guide rollers 116 is 10. Of course, it can be understood that the number and position of the substrate guide rollers 116 can be further appropriately set according to actual conveying needs.

[0039] Another embodiment of the present invention provides a method for coating a flexible substrate, which employs the above-mentioned flexible substrate coating apparatus 100, and includes the steps of unwinding the substrate by the unwinding roller 102 to pass through the first through-hole, the coating roller 105, and the second through-hole in sequence, and winding the substrate by the winding roller 107. The flexible substrate coating method can effectively improve the uniformity of the thickness of the thin coating layer on the surface of the flexible substrate, increase the bonding strength between the thin coating layer and the surface of the substrate, improve the quality of the thin coating layer, and increase the processing efficiency of the coating of the flexible substrate.

[0040] In one specific example, the temperature of the substrate in the heating chamber 108 is controlled to 20° C. to 100° C. by the heating member 103. For example, the temperature of the substrate in the heating chamber 108 is controlled to 20° C., 25° C., 30° C., 35° C., 40° C., 45° C., 50° C., 55° C., 60° C., 65° C., 70° C., 75° C., 80° C., 85° C., 90° C., 95° C., or 100° C. It can be understood that when the heating member 103 is employed to heat the substrate in the heating chamber 108, the temperature of the substrate in the heating chamber 108 may be controlled to other temperature values ​​within the range of 20° C. to 100° C.

[0041] In one specific example, the cooling member 104 controls the temperature in the coating chamber to -100°C or lower. Preferably, the cooling member 104 is used to control the temperature in the coating chamber to -100°C to -150°C. For example, the temperature in the coating chamber is controlled to -100°C, -105°C, -110°C, -115°C, -120°C, -125°C, -130°C, -135°C, -140°C, -145°C or -150°C. It can be understood that when the cooling member 104 is employed to cool the water vapor in the coating chamber, the temperature of the water vapor in the coating chamber may be controlled to other temperature values ​​below -100°C.

[0042] In one specific example, the coating roller 105 controls the temperature of the substrate on the surface of the coating roller 105 to -30°C to 30°C. For example, the heating function of the coating roller 105 controls the temperature of the substrate on the surface of the coating roller 105 to -30°C, -25°C, -20°C, -15°C, -10°C, 0°C, 5°C, 10°C, 15°C, 20°C, 20°C, or 30°C. When the heating function of the coating roller 105 controls the temperature of the substrate on the surface of the coating roller 105, it can be understood that the temperature of the substrate on the surface of the coating roller 105 may be controlled to other temperature values ​​within the range of -30°C to 30°C.

[0043] In one specific example, the heating roller 114 controls the temperature of the substrate on the surface of the heating roller 114 to 30° C. to 120° C. Preferably, the heating roller 114 controls the temperature of the substrate on the surface of the heating roller 114 to 30° C., 35° C., 40° C., 45° C., 50° C., 55° C., 60° C., 65° C., 70° C., 75° C., 80° C., 85° C., 90° C., 95° C., 100° C., 105° C., 110° C., 115° C., or 120° C. It is understood that the temperature at which the substrate on the surface of the heating roller 114 is controlled by the heating roller 114 may be other temperature values ​​within the range of 30° C. to 120° C.

[0044] The technical features of the embodiments described above can be combined in any combination. For the sake of brevity, not all possible combinations of the technical features in the embodiments described above are described. However, combinations of these technical features should be considered within the scope described in this specification unless they are inconsistent.

[0045] The above-described examples merely show some embodiments of the present invention, and the description is specific and detailed, but it cannot be understood as limiting the scope of the invention. It should be noted that a person skilled in the art can make some modifications and improvements without departing from the concept of the present invention, and all of these belong to the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be governed by the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. a partition plate located within the vacuum chamber and used to divide the vacuum chamber into a heating chamber and a coating chamber, the partition plate having a first through hole for conveying a substrate from the heating chamber to the coating chamber and a second through hole for conveying the substrate from the coating chamber to the heating chamber; an unwinding roller; a heating member; a coating roller; a coating implementation member; and a winding roller; the unwinding roller, the heating member and the winding roller are located in the heating chamber, the unwinding roller is used to unwind the substrate, the heating member is used to heat the substrate in the heating chamber, and the winding roller is used to wind the substrate; the coating roller and the coating member are located in the coating chamber, and the coating member is used to apply coating to a substrate on a surface of the coating roller in close proximity to the coating roller to form a thin coating layer on the surface of the substrate; A flexible substrate coating apparatus comprising:

2. a cooling member located in the coating chamber and used to cool water vapor within the coating chamber; 2. The flexible substrate coating apparatus of claim 1.

3. The coating chamber further includes a coating baffle plate disposed between the coating roller and the coating member, the baffle plate having a coating opening, the coating roller being disposed at the coating opening, and a coating layer material formed by the coating member leaks from the coating opening onto a surface of the substrate on the coating roller.

3. The flexible substrate coating apparatus of claim 2.

4. The diameter of the coating opening gradually increases in the direction from the coating roller to the coating member.

4. The flexible substrate coating apparatus of claim 3.

5. the coating baffle divides the coating chamber into a cooling chamber and a coating chamber, the cooling member is located within the cooling chamber, and the coating member is located within the coating chamber.

4. The flexible substrate coating apparatus of claim 3.

6. The heating element is a hollow heating tube in which a heating medium is placed.

2. The flexible substrate coating apparatus of claim 1.

7. a heating roller located in the heating chamber and positioned between the coating roller and the winding roller for heating the substrate after coating and before winding; 7. The flexible substrate coating apparatus according to claim 1, wherein the flexible substrate coating apparatus is a coating apparatus for coating a flexible substrate.

8. The flexible substrate coating device according to any one of claims 1 to 7 is adopted, The substrate is unwound by the unwinding roller so as to pass through the first through hole, the coating roller, and the second through hole in sequence, and the substrate is wound up by the winding roller. A method for coating a flexible substrate comprising the steps of:

9. The temperature of the substrate in the heating chamber is controlled to 20°C to 100°C by the heating member.

9. The method of claim 8, wherein the coating is performed on a flexible substrate.

10. The temperature of the substrate on the surface of the coating roller is controlled to −30° C. to 30° C.; and / or a heating roller disposed in the heating chamber between the coating roller and the winding roller, the heating roller being disposed in the heating chamber and configured to control the temperature of the substrate on the surface of the heating roller to 30° C. to 120° C.

9. The method of claim 8, wherein the coating is performed on a flexible substrate.