Glass substrate with positioning holes

Abstract

A glass substrate having a positioning hole that can eliminate the need for replacing a jig and improve positioning accuracy is provided. [Solution] A glass substrate 100 is a rectangular substrate having two long sides and two short sides. The two long sides are a first long side 111 and a second long side 112, and the two short sides are a first short side 113 and a second short side 114. A line connecting the centers of the first long side and the second long side is defined as a center line 110. Two circular first positioning holes 121 are provided in the glass substrate, and are disposed on both sides of the center line. The distance from the center points of these first positioning holes to the center line of the first long side is greater than 1.0 mm and smaller than the distance to the center line of the second long side.

Description

[Technical field]

[0001] The present invention relates to a glass substrate, and more particularly to a glass substrate with positioning holes. [Background technology]

[0002] Current glass substrates do not have a positioning design for the solder hole formation process, so a jig with positioning holes must be installed separately and the glass substrate must be placed on it.Then, the solder hole formation device positions the substrate and performs the solder hole formation work.After the solder hole formation work is completed, the jig must be removed before proceeding to the next process.

[0003] Figure 1 shows the procedure for a conventional solder hole formation process for a glass substrate. First, the glass substrate is placed on a jig equipped with positioning holes (step S110). After that, a solder hole formation device performs positioning and performs the solder hole formation operation (step S120). Next, a reflow operation is performed to fix the solder balls to the glass substrate (step S130). After that, the flux remaining on the glass substrate is cleaned (step S140). Next, the product is recovered (step S150). Finally, the glass substrate is separated from the jig (step S160). Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, an object of the present invention is to provide a glass substrate having positioning holes that allows a solder hole forming device to directly perform a solder hole forming operation on the glass substrate. [Means for solving the problem]

[0005] In order to achieve the above object, the glass substrate of the present invention is a rectangular glass substrate having two long sides and two short sides, the two long sides being the same length and the two short sides being the same length. The length of the long sides is longer than the length of the short sides, the two long sides being defined as a first long side and a second long side, respectively, the two short sides being defined as a first short side and a second short side, respectively, and a line connecting the centers of the first long side and the second long side is defined as a center line. The glass substrate of the present invention is characterized in that it has two circular first positioning holes arranged on both sides of the center line. The distance from the center of the two first positioning holes to the first long side is 1.0 mm or more and is shorter than the distance to the second long side.

[0006] The glass substrate with positioning holes of the present invention eliminates the need for additional jigs with positioning holes, and subsequent processes such as drilling, printing, solder hole formation, molding, etc. can be performed directly on the glass substrate, which eliminates the need to replace jigs and improves positioning accuracy.

[0007] In order to clarify the objects, features, and advantages of the present invention, the present invention will be described in detail with reference to the accompanying drawings. In addition, it will be clearly stated that the same parts are denoted by the same reference numerals in the description of the present invention. Effect of the Invention

[0008] According to the glass substrate having the positioning holes of the present invention, the solder hole forming device can directly perform the solder hole forming operation on the glass substrate. [Brief description of the drawings]

[0009] [Figure 1] 1A to 1C are process diagrams of a conventional process for forming solder holes in a glass substrate. [Diagram 2] 1 is a schematic diagram of a glass substrate with a positioning hole according to the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The contents of this specification provide many different embodiments for implementing different features. In the following description, examples of specific components and arrangements are shown to simplify the disclosure. Of course, these components and arrangements are merely examples and should not be dismissed as limiting. For example, in the following description, when it is stated that "a first member is formed above or on a second member," it includes an embodiment in which the first member is in direct contact with the second member, and also includes an embodiment in which an additional member is formed between the first member and the second member, and the two are not in direct contact with each other. In addition, the same reference numbers and symbols may be used repeatedly in this specification to simplify and clarify the description of various examples and configurations. This repetition is for convenience and does not indicate a relationship between the specific examples and configurations.

[0011] Furthermore, for ease of explanation, spatial relative terms such as "lower", "bottom", "upper", and "top" may be used in this specification to describe the positional relationship of parts and components shown in the drawings. However, these spatial relative terms are not limited to the directions shown in the drawings, and may include different directions depending on the use and operation of the device. Even if the device is placed in a different direction (e.g., rotated 90 degrees or oriented in another direction), the spatial descriptions in this specification will be interpreted in the same way.

[0012] Referring to FIG. 2, the glass substrate 100 with the positioning holes of the present invention is a rectangular glass substrate that has been subjected to a sealing process and then a peeling process to separate the carrier plate (glass). This glass substrate has two long sides and two short sides, the short sides are parallel to each other, and the short sides are connected perpendicularly to the long sides. In the present invention, the long sides are the first long side 111 and the second long side 112, and the short sides are the first short side 113 and the second short side 114. The first long side 111 and the second long side 112 have the same length, and the first short side 113 and the second short side 114 have the same length. The line connecting the centers of the long sides is defined as the "center line 110", and the center line 110 is parallel to the short sides. Therefore, the length of the glass substrate 100 is the length of the first long side 111 or the second long side 112, and the width of the glass substrate 100 is the length of the first short side 113 or the second short side 114. Also, the length of the glass substrate 100 is longer than the width.

[0013] The size of the glass substrate of the fan-out flip chip chip size package (FOFCCSP) product is 155×85 mm after the de-bonding process. Therefore, the glass substrate 100 with the positioning holes of the present invention has a length of 155 mm and a width of 85 mm, but the size of the glass substrate of the present invention is not limited to this and glass substrates of other sizes can also be applied. For example, the size of the glass substrate 100 of the present invention can be 800×800 mm or less.

[0014] The glass substrate 100 with tooling holes of the present invention includes two first tooling holes 121 and two second tooling holes 122. The first tooling holes 121 and the second tooling holes 122 are circular, and each has a diameter of 1.0 mm or more.

[0015] The distance from the center point of the first positioning hole 121 to the first long side 111 is 1.0 mm or more and is shorter than the distance to the second long side 112. In addition, the distance between the centers of the first positioning holes 121 is ½ or more the length of the first long side 111, and the distance from the center point of the first positioning hole 121 to the center line 110 is ¼ or more the length of the first long side 111.

[0016] The distance from the center point of the second positioning hole 122 to the second long side 112 is 1.0 mm or more and is shorter than the distance to the first long side 111. In addition, the distance between the center points of the second positioning holes 122 is ½ or more of the length of the second long side 112, and the distance from the center point of the second positioning hole 122 to the center line 110 is ¼ or more of the length of the second long side 112.

[0017] The glass substrate 100 with the positioning holes of the present invention can be positioned more accurately by providing two or more positioning holes. In addition, providing additional positioning points makes it easier to recognize the direction and position. Therefore, the glass substrate 100 of the present invention can be provided with only two first positioning holes 121 or only two second positioning holes 122.

[0018] The glass substrate with the positioning holes of the present invention does not require additional installation of a jig with a positioning hole, so that the subsequent drilling, printing, solder hole formation, and molding processes can be performed directly on the glass substrate, which eliminates the need for a jig replacement process and improves positioning accuracy.

[0019] The present invention has been described based on the above embodiment, but is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is defined by the following utility model registration claims. [Explanation of symbols]

[0020] 110 Center line 111 First long side 112 Second long side 113 First short side 114 Second short side 121 First positioning hole 122 Second positioning hole

Claims

1. A rectangular glass substrate having two long sides and two short sides, The two long sides have the same length, and the two short sides have the same length, The length of the long side is longer than the length of the short side, The two long sides are a first long side and a second long side, The two short sides are a first short side and a second short side, A line connecting the centers of the first long side and the second long side is defined as a center line, two first circular positioning holes are provided on the glass substrate; A glass substrate having positioning holes, characterized in that the two first positioning holes are arranged on both sides of the center line, and the distance from the center point of the first positioning holes to the first long side is greater than 1.0 mm and shorter than the distance to the second long side.

2. 2. The glass substrate having positioning holes according to claim 1, wherein the diameter of the two first positioning holes is greater than 1.0 mm.

3. 3. The glass substrate having positioning holes according to claim 1, wherein the distance between the center points of the two first positioning holes is greater than half the length of the first long side.

4. Two circular second positioning holes are further provided on the glass substrate; A glass substrate having a positioning hole as described in claim 1 or 2, wherein the two second positioning holes are arranged on both sides of the center line, and the distance from the center point of the second positioning hole to the second long side is greater than 1.0 mm and shorter than the distance to the first long side.

5. 5. The glass substrate having positioning holes according to claim 4, wherein the diameter of the two second positioning holes is greater than 1.0 mm.

6. The glass substrate having positioning holes according to claim 4 , wherein a distance from a center point of the two first positioning holes to the center line is greater than ¼ of a length of the first long side.

7. 5. The glass substrate having positioning holes according to claim 4, wherein a distance from the center points of the two second positioning holes to the center line is greater than 1 / 4 of the length of the second long side.

8. The glass substrate having positioning holes according to claim 5 , wherein the distance between the center points of the two first positioning holes is greater than half the length of the first long side.

9. The glass substrate having positioning holes according to claim 5 , wherein the distance between the center points of the two second positioning holes is greater than half the length of the second long side.

10. 2. The glass substrate having a positioning hole according to claim 1, wherein the size of the glass substrate is less than 800 mm x 800 mm.

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