Vapor chamber module and liquid-cooled vapor chamber heat dissipation device including the vapor chamber module

Abstract

A vapor chamber module that integrates a heat sink and a vapor chamber into an integrated, highly efficient heat dissipation module, and a liquid-cooled vapor chamber heat dissipation device including the vapor chamber module are provided. [Solution] The vapor chamber module includes a metal upper cover plate and a metal lower cover plate. The heat-dissipating outer surface of the metal upper cover plate has a plurality of sheet-shaped heat-dissipating structures. The evaporating inner surface of the metal lower cover plate has a plurality of parallel-arranged lower grooves and a plurality of support structures protruding between the lower grooves. The metal upper cover plate and the metal lower cover plate are joined together to form a vapor chamber module. A liquid-cooled vapor chamber heat-dissipating device is constructed after a liquid-cooled cover is installed on the heat-dissipating outer surface of the metal upper cover plate of the vapor chamber module. The sheet-shaped heat-dissipating structures are installed in the storage space of the liquid-cooled cover, and cooling liquid enters the storage space through the liquid supply port, flows between the sheet-shaped heat-dissipating structures, and flows out through the liquid discharge port.

Description

[Technical Field]

[0001] The present invention relates to the field of heat dissipation technology, and more particularly to a vapor chamber module and a liquid-cooled vapor chamber heat dissipation device including the vapor chamber module. [Background technology]

[0002] The explosive development of generative artificial intelligence (generative AI) or AI-generated content (AIGC) is significantly increasing the demand for high-speed computing capabilities and high-end computing chip modules. The massive data volumes and processing speeds required for AIGC applications are driving increasing demand for high-end AI servers. High-end AI servers simultaneously utilize a relatively large number of central processing units (CPUs) and graphics processors (GPUs). To meet the high-speed, massive computing demands of generative AI (e.g., ChatGPT), the number of transistors in the high-end chips used has reached 175 billion. As AI server chips become more efficient and consume more power, the large, high-density heat sources pose a major challenge to heat dissipation. For example, while server processor power consumption in 2018 was only around 180W to 280W, it is expected to double to over 500W by 2023. For example, the AMD 5nm Genoa processor and the A100 chip released by NVIDIA, a leading GPU manufacturer, in 2022 consume a maximum of 400W of power, approximately 40-50% higher than the previous generation of processors. In 2023, the power consumption of the Bergamo processor is expected to exceed 500W. The new generation of high-end GPUs, the H100 chips, which NVIDIA will build specifically for AI servers, will have a maximum power consumption of 700W. The number of chips used in servers will increase in line with the number used by clients, which will increase power consumption and make the modular design of heat dissipation solutions more complex.

[0003] With the upgrade of new generation GPUs and CPUs, server computing, AI image generation, and e-sports applications are the main growth drivers for the heat dissipation industry. From the perspective of server heat dissipation technology, it can be mainly divided into air cooling, liquid cooling, and immersion cooling. Currently, air cooling is the mainstream for mid-range computing servers.

[0004] To quickly dissipate large amounts of heat generated in a concentrated manner across a wider area on the heat sink, manufacturers replace the copper base plate originally in contact with the heat-generating component with a copper vapor chamber. The heat-generating component is attached to the heat-absorbing surface of the vapor chamber, and the heat sink is bonded to the heat-dissipating surface of the vapor chamber with thermal paste. When a large amount of heat is rapidly generated from the power component and transferred to the vapor chamber, the working fluid in the vapor chamber rapidly absorbs the heat and vaporizes to form vapor. The other side of the vapor chamber is connected to the heat sink, so when the vapor rises rapidly and contacts the cooling surface connected to the heat sink, it condenses into working fluid, rapidly absorbing and releasing large amounts of heat through this phase change cycle. Compared to a conventional copper base plate, the vapor chamber allows the concentrated heat source to be more quickly dispersed across a wider area on the heat sink, resulting in a larger effective heat dissipation area and faster heat dissipation.

[0005] Vapor chambers utilize the phase change of the working fluid within a sealed working chamber to rapidly dissipate heat, making them the most efficient heat dissipation method available today. They achieve this goal by utilizing the large amount of latent heat of vaporization associated with the rapid evaporation and condensation of the working fluid within a near-vacuum chamber. The thermal conductivity of vapor chambers can reach over 10,000 W / (m²·℃), several dozen times higher than that of conventional air or liquid convection. When the heat sink is integrated into the vapor chamber's heat dissipation surface, it quickly and effectively transfers and dissipates the large amount of heat from within the vapor chamber to the heat dissipation structure, significantly improving heat dissipation efficiency.

[0006] However, as the computing power of ChatGPT or high-end AI servers continues to expand, their heat dissipation capacity must be at least 700W. NVIDIA's A100 or H100 AI servers typically contain four to eight GPUs, each generating an additional 300 to 700W of heat energy, bringing the overall thermal power consumption of the AI server to over 3,000W. Given that traditional air cooling cannot provide such efficient heat dissipation, the industry currently uses traditional single-phase immersion cooling technology to solve the heat dissipation problem of high-density heat-generating server components, but this remains limited to a 600W limit.

[0007] To solve heat dissipation problems such as high heat energy consumption of high-speed computing components, insufficient heat dissipation capacity, and excessive energy consumption, the introduction of "liquid cooling" technology has become a new trend. Liquid cooling utilizes the fact that liquid conducts heat more easily than gas, and quickly transfers the high-density heat energy generated by heat-generating components to the cooling liquid through the liquid cooling host. The cooling liquid then absorbs heat and is directed to an outdoor cooling tower or heat dissipation module, which then dissipates the heat energy into the atmosphere, achieving rapid cooling and reducing energy consumption.

[0008] A typical liquid cooling module typically consists of a heat sink with a liquid cooling cover covering the heat dissipation structure, which is then fastened together with screws to form a cavity. The liquid cooling cover has an inlet and an outlet. The coolant flows through the inlet into the cavity formed by the attachment of the liquid cooling cover and the heat sink, passes through the heat dissipation structure, and then flows out the outlet and through a conduit to an external heat dissipation system, dissipating the heat carried by the coolant. The continuous and rapid circulation of the coolant quickly removes the large amount of heat generated by the heat-generating component, achieving rapid heat dissipation. However, when the metal base plate of the heat sink contacts the heat-generating component, the lateral heat conduction rate of the metal base plate is limited by its cross-sectional area. This prevents the large amount of heat rapidly generated by the heat-generating component from being efficiently conducted laterally across the entire metal base plate of the heat sink. Instead, the heat accumulates in the local contact area between the heat sink and the heat-generating component. Even with liquid cooling, the heat dissipation performance improvement is very limited.

[0009] In view of the above problems, the inventors of this invention replaced the metal base plate of the heat sink with a copper vapor chamber, integrally molding the heat sink's heat dissipation structure and integrating it into the vapor chamber's heat dissipation surface. When a heat-generating component attached to the heat-absorbing surface of the vapor chamber generates a large amount of heat, the heat is rapidly transferred to the vapor chamber, where the working fluid present in the vapor chamber's interior space quickly absorbs the heat and rapidly evaporates to form vapor. Because the vapor chamber's heat dissipation surface is connected to the heat sink, the vapor rises rapidly and contacts the cold metal surface in contact with the heat sink, where it condenses again to form working fluid, quickly absorbing and releasing a large amount of heat through this liquid-gas-liquid phase change cycle. Compared to a conventional copper base plate, the vapor chamber can more quickly diffuse a large amount of concentrated heat source over a wider area of the heat sink, resulting in a larger effective heat dissipation area and faster heat dissipation.

[0010] However, the AI servers mentioned above often have many high-power chip modules installed, and these AI servers are often densely packed in machine rooms. In such situations, the ambient temperature also rises, making it difficult for the air-cooled heat dissipation method to effectively dissipate the large amount of heat generated by the heat sink, and the heat dissipation efficiency of the heat dissipation modules cannot fully meet demands.

[0011] Therefore, in order to further improve the heat dissipation capacity of the vapor chamber, the present inventor further provides a liquid-cooled vapor chamber heat dissipation device, which uses a vapor chamber in which the heat dissipation structure including the above-mentioned heat sink is integrated into the heat dissipation surface of the vapor chamber through integral molding, and further adds a liquid-cooled cover to cover the heat sink to form a liquid-cooled vapor chamber heat dissipation device. Summary of the Invention [Problem to be solved by the invention]

[0012] In view of the above problems, the present invention provides a vapor chamber module that integrates a heat sink and a vapor chamber into a single, highly efficient heat dissipation module. Furthermore, the vapor chamber module of the present invention integrates the heat sink's heat dissipation structure and the vapor chamber's metal top cover plate from the same metal sheet, eliminating the thermal resistance that exists between the vapor chamber and the heat sink due to the low thermal conductivity of the thermal paste, thereby improving heat dissipation efficiency. At the same time, the improved heat dissipation efficiency effectively reduces the temperature-induced deformation stress between the heat dissipation member and the vapor chamber. The vapor chamber module provided by the present invention integrates the heat sink and vapor chamber into a single unit, eliminating the interface that originally existed between the heat sink and vapor chamber and the thermal resistance that results from the use of thermally conductive paste.

[0013] The vapor chamber module of the present invention can be manufactured by metal processing methods such as stamping, extrusion, milling, casting, and forging, or by cold forging a metal sheet / block (e.g., copper). Cold forging eliminates the need for preheating the metal during the forging process and annealing it after forging, as is the case with conventional forging. Therefore, the internal crystalline structure of the metal processed by cold forging does not suffer from annealing-induced pores or enlargement of the structure, which reduces thermal conductivity. In other words, since the metal processed by cold forging does not undergo a heating process, the internal crystalline structure remains very dense, which further enhances the rigidity and density of the forged metal. Tests have shown that the thermal conductivity of the metal can be further improved. [Means for solving the problem]

[0014] According to one embodiment of the present invention, the cooling system includes at least a metal upper cover plate, a metal lower cover plate, a working space, an intake passage, and a working fluid. The metal upper cover plate includes a heat-dissipating outer surface and a condensing inner surface. The heat-dissipating outer surface has a plurality of sheet-shaped heat-dissipating structures. An upper frame of appropriate height is provided around the periphery of the condensing inner surface, and the upper frame is provided with an upper channel groove, and the condensing inner surface has a plurality of upper grooves arranged parallel to each other. The metal lower cover plate includes a heat-absorbing outer surface and an evaporating inner surface. The heat-absorbing outer surface is used to contact at least one heat-dissipating electronic component. A lower frame of appropriate height is provided around the periphery of the evaporating inner surface, and the lower frame is provided with a lower channel groove. The evaporating inner surface has a plurality of lower grooves arranged parallel to each other and a plurality of support structures protruding between the lower grooves. The working space is an airtight space formed by the upper frame of the upper metal cover plate and the lower frame of the lower metal cover plate being joined together. The condensing inner surface of the upper metal cover plate and the evaporating inner surface of the lower metal cover plate face each other, and the upper grooves and the lower grooves can be aligned by mapping and overlapping with each other. A plurality of support structures protrude from the evaporating inner surface and abut between the upper grooves of the condensing inner surface to support the working space. The intake passage is formed by joining the upper channel grooves and the lower channel grooves correspondingly, and is used to draw air into the working space and seal it after intake. A capillary structure is installed in the lower groove or the upper and lower grooves. A working fluid is present in the working space and the capillary structure. The entire upper metal plate, including the sheet-shaped heat dissipation structure, is manufactured by being integrally molded on a metal sheet, and the entire lower metal cover plate, including the support structure, is manufactured by being integrally molded on a metal sheet.

[0015] To further improve heat dissipation efficiency, the present inventors also provide a highly efficient liquid-cooled vapor chamber heat dissipation device constructed by combining a liquid-cooled cover and a heat sink module. The liquid-cooled vapor chamber heat dissipation device of the present invention further includes a liquid-cooled cover and a vapor chamber module. The liquid-cooled cover includes an upper portion and a sidewall connected to the upper portion, the sidewall surrounding the upper portion to form a storage space. The liquid-cooled cover is provided with at least one liquid inlet and at least one liquid outlet, which communicate with the storage space. The vapor chamber module includes a metal upper cover plate, a metal lower cover plate, an intake passage, a capillary structure, and a working fluid. The metal upper cover plate includes a heat-dissipating outer surface and a condensing inner surface. The heat-dissipating outer surface has multiple sheet-shaped heat-dissipating structures. An upper frame of an appropriate height is provided around the condensing inner surface. The upper frame is provided with upper channel grooves, and the condensing inner surface has multiple upper grooves arranged parallel to each other. The metal lower cover plate includes a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface being used for contacting a heat-dissipating electronic component. A lower frame of an appropriate height is provided around the evaporation inner surface, the lower frame is provided with a lower channel groove. The evaporation inner surface has a plurality of parallel arranged lower grooves and a plurality of support structures protruding between the lower grooves. The upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate are joined to form a working space, and the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate face each other. The upper and lower grooves can be arranged in a mutually overlapping manner. The support structures protrude from the evaporation inner surface and abut between the upper grooves on the condensation inner surface to support the working space. An intake passage is formed by the corresponding joining of the upper channel groove and the lower channel groove, and is used for drawing air into the working space and sealing it after drawing air. A capillary structure is provided in the lower groove or in both the upper and lower grooves, and a working fluid is present in the working space and the capillary structure. The liquid-cooled cover is made of a metal sheet, and the upper metal cover plate is made of a metal sheet. The lower metal cover plate is made of a metal sheet. The lower metal cover plate is made of a metal sheet. The liquid-cooled cover is joined to the outer heat-dissipating surface of the upper metal cover plate, and the sheet-shaped heat-dissipating structure is installed in the storage space. The liquid coolant flows into the storage space through the liquid supply port, passes through the sheet-shaped heat-dissipating structure, and flows out through the liquid discharge port. [Effects of the Invention]

[0016] According to an embodiment of the present invention, a liquid-cooled vapor chamber heat dissipation device is provided, which includes a liquid-cooled cover bonded to the heat-dissipating outer surface of a metal top cover plate, a sheet-shaped heat dissipation structure disposed in the accommodation space, and a sealed liquid-cooled chamber formed in the accommodation space. Coolant enters the accommodation space through a liquid inlet, flows between the sheet-shaped heat dissipation structure to accelerate cooling, and then exits through a liquid outlet. An external pipeline guides the heat-absorbing coolant to an external heat dissipation system to dissipate heat, allowing the coolant to cool and then be recirculated. The liquid-cooled cover is combined with a vapor chamber module (formed by joining a metal top cover plate and a metal bottom cover plate) to form the liquid-cooled vapor chamber heat dissipation device of the present invention, providing a more efficient heat dissipation solution using liquid-cooled heat dissipation through liquid circulation, thereby alleviating the problem of poor air-cooled heat dissipation efficiency in high-end servers and large server machine rooms due to liquid-cooled heat dissipation. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a structural diagram of a vapor chamber module according to an embodiment of the present invention; FIG. [Figure 2] 1 is a side cross-sectional view illustrating the structure of a vapor chamber module according to an embodiment of the present invention; [Figure 3] 3 is a structural diagram of a metal top cover plate of a vapor chamber module according to an embodiment of the present invention; FIG. [Figure 4] 3 is a structural diagram of the metal bottom cover plate of the vapor chamber module according to one embodiment of the present invention; FIG. [Figure 5A] 10 is a structural view of the metal bottom cover plate of the vapor chamber module according to another embodiment of the present invention; FIG. [Figure 5B] FIG. 5B is an explanatory view of the cross-sectional structure of the embodiment of FIG. 5A. [Figure 6A] 10 is a structural view of the metal bottom cover plate of a vapor chamber module according to yet another embodiment of the present invention; FIG. [Figure 6B] FIG. 6B is a cross-sectional view illustrating the embodiment of FIG. 6A. [Figure 7A]10 is a diagram illustrating the application of a metal bottom cover plate of an integrated vapor chamber according to yet another embodiment of the present invention; FIG. [Figure 7B] 10 is a diagram illustrating the application of a metal bottom cover plate of an integrated vapor chamber according to yet another embodiment of the present invention; FIG. [Figure 8] 1 is a structural diagram of a liquid-cooled vapor chamber heat dissipation device according to one embodiment of the present invention; [Figure 9] 1 is a side cross-sectional view illustrating the structure of a liquid-cooled vapor chamber heat dissipation device according to one embodiment of the present invention; [Figure 10] 10 is a structural diagram of a cooling cover of a liquid-cooled vapor chamber heat dissipation device according to another embodiment of the present invention; FIG. [Figure 11] 10 is a structural diagram of a cooling cover of a liquid-cooled vapor chamber heat dissipation device according to another embodiment of the present invention; FIG. [Figure 12] 10 is a structural diagram of a cooling cover of a liquid-cooled vapor chamber heat dissipation device according to still another embodiment of the present invention; [Figure 13] 9 is a structural diagram of the liquid-cooled vapor chamber heat dissipation device of the present invention, where the metal bottom cover plate of FIG. 5B is replaced. [Figure 14] 9 is a structural diagram of the liquid-cooled vapor chamber heat dissipation device of the present invention, where the metal bottom cover plate of FIG. 6B is replaced. [Figure 15] 10 is a structural view of the metal top cover plate of the vapor chamber module according to another embodiment of the present invention; FIG. [Figure 16] 10 is a structural view of a metal top cover plate of a vapor chamber module according to yet another embodiment of the present invention; FIG. [Figure 17] 10 is a structural view of a metal top cover plate of a vapor chamber module according to yet another embodiment of the present invention; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, with reference to the accompanying drawings, embodiments of the vapor chamber heat dissipation module of the present invention and a liquid-cooled vapor chamber heat dissipation device including the vapor chamber heat dissipation module will be described. For clarity and convenience of the drawings, the dimensions and proportions of the various components in the drawings may be exaggerated or reduced. In the following description and / or claims, technical terms used should be interpreted in the sense well known and commonly used in the art. For ease of understanding, the same components in the following embodiments will be denoted by the same reference numerals. The term "about" used herein typically indicates that an actual value is within ±10%, 5%, 1%, or 0.5% of a particular value or range. The term "about" used herein indicates that the actual value is within an acceptable standard error of the mean, which can be determined by one of ordinary skill in the art. Except in the embodiments, or unless otherwise clearly stated, all ranges, quantities, values, and percentages used herein should be understood to be modified by "about." Therefore, unless otherwise stated, all numerical values or parameters disclosed in the specification and claims are approximate values and can be changed as necessary.

[0019] 1 to 4 are explanatory diagrams of a vapor chamber module 10 according to one embodiment of the present invention. As shown in the figures, the vapor chamber module 10 of the present invention includes at least a metal upper cover plate 100, a metal lower cover plate 200, a working space 211, an intake passage 400, a capillary structure 500, and a working fluid W. The metal upper cover plate 100 includes a heat-dissipating outer surface 110 and a condensing inner surface 120. The heat-dissipating outer surface 110 has a plurality of sheet-shaped heat-dissipating structures 111. An upper frame 122 of an appropriate height is provided around the periphery of the condensing inner surface 120. The upper frame is provided with an upper channel groove 123. The condensing inner surface 120 has a plurality of upper grooves 121 arranged parallel to each other. The metal bottom cover plate 200 comprises a metal top cover plate 100, a heat-absorbing outer surface 210 and an evaporation inner surface 220, the heat-absorbing outer surface 210 is used to contact at least one heat-dissipating electronic component, a lower frame 222 of an appropriate height is provided around the periphery of the evaporation inner surface 220, the lower frame 222 is provided with a lower channel groove 223, and the evaporation inner surface 220 has a plurality of parallel lower grooves 221 and a plurality of support structures 224 protruding between the lower grooves 221. The working space 211 is an airtight space formed by the joining of the upper frame 122 of the metal top cover plate 100 and the lower frame 222 of the metal bottom cover plate 200. The condensing inner surface 120 of the metal top cover plate 100 and the evaporating inner surface 220 of the metal bottom cover plate 200 face each other, and the upper grooves 121 and lower grooves 221 are arranged to overlap each other. A plurality of support structures 224 protrude from the evaporating inner surface 220 and contact between the condensing inner surface 120 and the upper groove 121 to support the working space 211. The intake passage 400 is formed by the joining of the upper channel groove 123 and the lower channel groove 223, and can be used to draw air into the working space 211 and seal it after intake. A capillary structure 500 is installed in the lower groove 221 or the upper groove 121 and the lower groove 221. A working fluid W is present in the working space 211 and the capillary structure 500.

[0020] In one embodiment, the upper frame 122 and the lower frame 222 of the vapor chamber module 10 of the present invention further have a welding groove 1010 used to join the metal upper cover plate 100 and the metal lower cover plate 200 by welding to form the vapor chamber module 10 of the present invention.

[0021] 2 and 3, in one embodiment, the vapor chamber module 10 of the present invention is characterized in that the shape and sheet-shaped heat dissipation structures 111 included in the metal top cover plate 100 are directly and integrally formed from the same metal sheet (or metal block) rather than being externally connected. In other words, the metal top cover plate 100 is manufactured by integrally forming the shape and structural features described above from a metal sheet (or metal block). More specifically, the plurality of sheet-shaped heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal top cover plate 100 of the vapor chamber module 10 of this embodiment are directly formed on the heat dissipation outer surface 110 and are inseparable from the heat dissipation outer surface 110 of the metal top cover plate 100, with no heterogeneous or homogeneous boundary surface. Unlike the commonly seen prior art in which a heat sink is attached to the heat dissipation surface of the vapor chamber with heat dissipation paste, the heat dissipation structures are formed on the heat dissipation surface of the vapor chamber by welding or sintering. In other words, the vapor chamber module of the present invention creates a heat dissipation structure directly on the metal top cover plate of the vapor chamber, thereby eliminating the heterogeneous interface and thermal resistance that exists between the heat sink and the vapor chamber, and improving heat dissipation efficiency.

[0022] 2 and 4, in one embodiment, the vapor chamber module 10 of the present invention is characterized in that the shape and structural features included in the metal bottom cover plate 200 are integrally formed directly from the same metal sheet (or metal block). In other words, the multiple support structures 224 on the evaporation inner surface 220 of the metal bottom cover plate 200 of the vapor chamber module 10 of this embodiment are directly formed on the evaporation inner surface 220 and are made of the same metal as the evaporation inner surface 220 of the metal bottom cover plate 200, so there is no heterogeneous or homogeneous boundary surface. Instead, the support structures 224 are sintered to the evaporation inner surface 220 by sintering, as in the commonly seen prior art.

[0023] Generally speaking, the method for manufacturing the integrated metal top cover plate 100 and bottom cover plate 200 of the vapor chamber module 10 of the present invention described above can employ an etching process or a combined machining process (e.g., integrating milling and stamping or extrusion processes). The advantage of the etching process is that it can etch more complex structures and is typically used for products that are difficult to manufacture using traditional machining processes. The advantage of the combined machining process is that most of the manufacturing methods used are mature and can be manufactured without much development. However, the etching process is time-consuming and has the problem of not achieving a smooth surface, requiring two machining steps, while the combined machining process requires many steps and time for manufacturing.

[0024] In one embodiment, the vapor chamber module 10 of the present invention employs cold forging to produce the shape and structure of the metal top cover plate 100 and the metal bottom cover plate 200, which can then be further modified by combining CNC processes, cutting processes, etc. Unlike etching or combined machining processes, cold forging involves placing the metal sheet (or metal block) to be processed into a female die, and then continuously forging and shaping the metal sheet with a male die at room temperature. Those skilled in the art will appreciate that the cold forging method does not require preheating, softening, and annealing the metal during the forging process, as is the case with common stamping processes. Therefore, the internal crystalline grain structure of the forged metal will develop pores and enlargement of the structure due to annealing, which reduces the thermal conductivity coefficient. Because the metal after cold forging has not undergone a heating process, its internal grain structure can still maintain a considerable degree of density, and defects such as internal porosity can be reduced. This has the advantages of making the metal surface smoother after forging, improving rigidity and density, and making it less susceptible to deformation. Tests have shown that the thermal conductivity and thermal diffusion coefficient of the metal after forging are higher than before forging. That is, in this embodiment, the heat dissipation efficiency of the vapor chamber module of the present invention is higher than that of general conventional processes.

[0025] In one embodiment, the metal top cover plate 100 of the vapor chamber module 10 of the present invention is manufactured by cold forging, and multiple sheet-shaped heat dissipation structures 111 are machined and formed on the heat dissipation outer surface 110 of the metal top cover plate 100 by cutting or shovel tooth cutting in a CNC process.

[0026] In one embodiment, the metal bottom cover plate 200 of the vapor chamber module 10 of the present invention is manufactured by cold forging, characterized in that the shape and structural features of the metal bottom cover plate 200 described above are all formed directly on the same metal sheet by cold forging, including a plurality of protruding support structures 224 on the evaporation inner surface 220 of the metal bottom cover plate 200. That is, like the same metal top cover plate 100, the plurality of protruding support structures 224 on the evaporation inner surface 220 of the metal bottom cover plate 200 are not formed externally or by conventional sintering, but are integrally formed with the metal bottom cover plate by forging. In one embodiment, the plurality of protruding support structures 224 are columnar structures.

[0027] In one optional embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the vapor chamber module 10 of the present invention are made of a metal sheet (e.g., pure copper) with a high thermal conductivity and thermal diffusion coefficient, and the above structure is integrally formed by cold forging. In one embodiment, the metal sheet is pure copper.

[0028] As will be understood by those skilled in the art, in the above embodiment, when pure copper is used as the raw material and the metallic top cover plate 100 and the metallic bottom cover plate 200 are manufactured by cold forging, the pure copper material is continuously forged in a mold at room temperature, and the physical properties of the resulting metallic top cover plate 100 and the metallic bottom cover plate 200, such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient, are all higher than those of pure copper material that has not undergone cold forging, and are also higher than those of metallic top cover plate 100 and metallic bottom cover plate 200 obtained by other manufacturing methods (e.g., etching, stamping, extrusion, or general forging processes). In other words, after the pure copper material has undergone cold forging, it has relatively high physical properties such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient, which are different from the material properties obtained by other processing methods.

[0029] In any one of the above embodiments, the vapor chamber module 10 is joined by welding after the metal upper cover plate 100 and the metal lower cover plate 200 are joined together.

[0030] In any one of the above embodiments, the working fluid W used in the vapor chamber module 10 of the present invention is pure water.

[0031] In any one of the above embodiments, the working space 211 described in the vapor chamber module 10 of the present invention has a post-inhalation air pressure of 1×10 ‐3 Less than 1×10 torr, e.g., ‐4 torr, or 1×10 ‐5 It's torr.

[0032] 5A and 5B show the metal bottom cover plate 200A of the vapor chamber module of the present invention. In this embodiment, the shape and structural features of the metal bottom cover plate 200A are formed on the same sheet of metal, including the recessed space 225 on the heat-absorbing outer surface 210, and then modified by CNC machining. Furthermore, the recessed space 225 on the heat-absorbing outer surface 210 of the metal bottom cover plate 200A manufactured by cold forging is recessed from the heat-absorbing outer surface 210 toward the evaporation inner surface 220, but does not protrude from the corresponding evaporation inner surface 220. This is used to accommodate electronic components, which differs from the general stamping process in which one surface is recessed and the other surface has a corresponding protrusion.

[0033] Referring to Figures 6A and 6B, another embodiment of the vapor chamber module of the present invention is shown, which is a metal bottom cover plate 200B, in which the heat-absorbing outer surface 210 of the metal bottom cover plate 200B further includes a plurality of recessed spaces 225, which are recessed from the heat-absorbing outer surface 210 toward the evaporation inner surface 220 and do not protrude from the evaporation inner surface 220, and can accommodate a plurality of electronic components.

[0034] 7A and 7B, a metal bottom cover plate 200C according to another embodiment of the integrated vapor chamber of the present invention is shown. As shown, the recessed spaces 225 can have the same or different shapes and volumes, and can be customized based on the size and shape of each sub-chip on the circuit board to simultaneously accommodate a variety of electronic components of the same or different shapes and volumes, such as an integrated vapor chamber for a 5G server chipset (see FIG. 7A). When accommodating external electronic components in the recessed spaces 225 of the heat-absorbing outer surface 210, a thermally conductive material with good thermal conductivity can be added between the electronic components and the heat-absorbing outer surface 210 to reduce thermal resistance caused by slight unevenness on the contact surface, such as thermal paste or graphite, and to closely contact the electronic components with the heat-absorbing outer surface 210, thereby improving heat dissipation efficiency.

[0035] In any embodiment of the integrated vapor chamber of the present invention, the metal bottom cover plates 200, 200A, 200B, and 200C shown in Figures 1, 5A, 6A, and 7A can be integrally formed by cold forging. In one embodiment, pure copper, which has a high thermal diffusion coefficient and thermal conductivity, is integrally formed by cold forging. Therefore, the hardness and rigidity of the pure copper metal bottom cover are both higher than those produced by conventional processing, and the pure copper metal bottom cover is less likely to deform.

[0036] Referring to Figures 8 and 9 in conjunction with Figures 3 and 4, Figure 8 is an explanatory diagram of a liquid-cooled vapor chamber heat dissipation device 10A according to one embodiment of the present invention, and Figure 9 is an explanatory side cross-sectional view of the structure of Figure 8. First, referring to Figures 8 and 9, as shown, the liquid-cooled vapor chamber heat dissipation device 10A according to the present invention includes a liquid-cooled cover 300, a metal upper cover plate 100, and a metal lower cover plate 200. The liquid-cooled cover 300 includes an upper portion 301 and a side wall 302 connected to the upper portion 301. The liquid-cooled cover 300 surrounds the upper portion 301 to form an accommodating space 303. The side wall 302 is provided with at least one liquid supply port 304 and at least one liquid drain port 305, which are connected to the accommodating space 303. In this embodiment, the liquid-cooled cover 303 has the liquid supply port 304 and the liquid drain port 305 on opposite sides of the side wall 302. The metal top cover plate 100 (see Figures 8, 9 and 3) includes a heat dissipating outer surface 110 and a condensing inner surface 120, the heat dissipating outer surface 110 has a plurality of sheet-shaped heat dissipating structures 111, an upper frame 122 of an appropriate height is provided around the periphery of the condensing inner surface 120, the upper frame is provided with upper channel grooves 123, the condensing inner surface 120 has a plurality of upper grooves 121 arranged parallel to each other, and the entire metal top cover plate 100 including the sheet-shaped heat dissipating structures 111 is manufactured by being integrally molded from a metal sheet. The metal bottom cover plate 200 (see Figures 8, 9 and 4) includes a heat-absorbing outer surface 210 and an evaporation inner surface 220, the heat-absorbing outer surface 210 is used for contact with heat-dissipating electronic components, a lower frame 222 of an appropriate height is provided around the evaporation inner surface 220, the lower frame 222 is provided with a lower channel groove 223, the evaporation inner surface 220 has a plurality of lower grooves 221 arranged parallel to each other and a plurality of support structures 224 protruding between the lower grooves 221, and the entire metal bottom cover plate 200 including the support structures 224 is integrally formed from a metal sheet.The upper frame 122 of the metal top cover plate 100 and the lower frame 222 of the metal bottom cover plate 200 are joined together to form the working space 211, and the condensation inner surface 120 of the metal top cover plate 100 and the evaporation inner surface 220 of the metal bottom cover plate 200 face each other. The upper grooves 121 and the lower grooves 221 are arranged in a mutually mapped and overlapping manner. The support structure 224 protrudes and extends from the evaporation inner surface 220 and abuts between the upper grooves 121 of the condensation inner surface 120 to support the working space 211. The intake passage 400 is formed by the corresponding joining of the upper channel groove 123 and the lower channel groove 223, and is used to intake air into the working space 211 and seal it after intake. The capillary structure 500 is installed in the lower groove 221 or in the upper groove 121 and the lower groove 221, and the working fluid is present in the working space 211 and the capillary structure 500. Here, the liquid cooling cover 300 is joined to the heat dissipating outer surface 110 of the metal top cover plate 100, and a sheet-shaped heat dissipation structure 111 is installed in the storage space 303, and the cooling liquid enters the storage space 303 from the liquid supply port 304, passes through the sheet-shaped heat dissipation structure 111, and flows out from the liquid discharge port 305.

[0037] After joining the metal upper cover plate 100 and the metal lower cover plate 200, a vapor chamber module is formed, and this vapor chamber module is characterized by being an integrated vapor chamber module in which the sheet-shaped heat dissipation structure 111 and the metal upper cover plate 100 are integrated into one unit.

[0038] Note that Figures 8 and 9 use the same metal upper cover plate 100 and metal lower cover plate 200 as Figures 1 and 2, and therefore the metal lower cover plate 200 shown in Figures 9 and 10 and the metal upper cover plate 100 and metal lower cover plate 200 shown in Figures 1 and 2 have the same metal properties.

[0039] In one embodiment, the upper frame 122 and the lower frame 222 of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention further include a welding groove 1010 for joining the metal upper cover plate 100 and the metal lower cover plate 200 by welding.

[0040] 9 and 3, in one embodiment, the liquid-cooled vapor chamber heat dissipation device 10A of the present invention is characterized by the shape of the metal top cover plate 100 and the sheet-shaped heat dissipation structures 111, which are not externally attached but are directly and integrally formed from the same metal sheet (or metal block). That is, the entire metal top cover plate 100 is manufactured by integrally molding a metal sheet (or metal block). More specifically, the plurality of sheet-shaped heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal top cover plate 100 of the liquid-cooled vapor chamber heat dissipation device 10A of this embodiment are directly formed on the heat dissipation outer surface 110 and are inseparable from the heat dissipation outer surface 110 of the metal top cover plate 100, with no heterogeneous or homogeneous boundary surface. Unlike the commonly used prior art in which a heat sink is attached to the heat dissipation surface of the vapor chamber with heat dissipation paste, nor is a heat dissipation structure formed on the heat dissipation surface of the vapor chamber by welding or sintering, In other words, the sheet-shaped heat dissipation structure 111 is formed directly on the heat dissipation outer surface 110 of the metal top cover plate 100 of the vapor chamber, thereby eliminating the heterogeneous boundary surface and its associated thermal resistance between the heat sink and the vapor chamber, thereby improving heat dissipation efficiency.

[0041] 9 and 4, in one embodiment, the liquid-cooled vapor chamber heat dissipation device 10A of the present invention is characterized by the shape and structure of the metal lower cover plate 200, which is integrally formed directly from the same metal sheet (or metal block). In other words, the multiple support structures 224 on the evaporation inner surface 220 of the metal lower cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10A of this embodiment are directly formed on the evaporation inner surface 220 and are made of the same metal as the evaporation inner surface 220 of the metal lower cover plate 200, and are inseparable, with no heterogeneous or homogeneous interface. The support structures 224 are not sintered to the evaporation inner surface 220 by the commonly used sintering method of the prior art.

[0042] In any one of the above embodiments, the liquid-cooled vapor chamber heat dissipation device 10A is joined by welding after the metal upper cover plate 100 and the metal lower cover plate 200 are joined together.

[0043] In any one of the above embodiments, the working fluid W used in the liquid-cooled vapor chamber heat dissipation device 10A of the present invention is pure water.

[0044] In any one of the above embodiments, the air pressure of the working space 211 in the liquid-cooled vapor chamber heat dissipation device 10A of the present invention is 1×10 after the air is drawn into the working space 211 through the intake passage 400 and sealed. ‐3 Less than 1×10 torr, e.g., ‐4 torr, or 1×10 ‐5 torr. Note that the sealing performed after the above intake is a well-known technique and is not limited to this. For example, after air is drawn into the working space 211 through a metal intake pipe up to a set pressure, the intake pipe can be sealed by pressing, sintering, or welding with a jig.

[0045] Referring to FIG. 9, in one embodiment, the liquid-cooled cover 300 of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention has at least one liquid supply port 304 and at least one liquid drain port 305, and as shown in the figure, the liquid supply port 304 and the liquid drain port 305 are arranged on different sides of the side wall. In this embodiment, the liquid supply port 304 and the liquid drain port 305 are arranged on opposite sides of the side wall 302.

[0046] Referring to FIG. 10, in another embodiment of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention, the liquid-cooled cover 310 has at least one liquid supply port 304 and at least one liquid drain port 305, and the liquid supply port 304 and the liquid drain port 305 are arranged on the same side of the side wall 302 of the liquid-cooled cover 310.

[0047] To accommodate the mechanical layout or stacking method of the server, the liquid cooling cover 300 or 310 described in the liquid-cooled vapor chamber heat dissipation device 10A of the present invention has at least one liquid inlet 304 and at least one liquid outlet 305. The liquid inlet 304 and the liquid outlet 305 can be located on the same side or on different sides according to customer requirements. In another embodiment, to accelerate the flow of the coolant and improve cooling efficiency, the number of liquid inlet 304 is two or more, and the number of liquid outlet 305 is also two or more. The number of liquid inlet 304 and the number of liquid outlet 305 may be equal or unequal, and the liquid inlet 304 and the liquid outlet 305 may be partially on the same side and partially on different sides, and this is not limited thereto.

[0048] In order to further improve the heat dissipation efficiency of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention, the inventors of the present invention have proposed another embodiment of a liquid-cooled cover 320, 330, which is characterized in that at least one guide plate is further installed in the accommodating space 303, so that the coolant enters the accommodating space 303 through the liquid supply port 304 and is quickly and evenly guided between the multiple sheet-shaped heat dissipating structures 111, quickly removing the heat distributed on the surface of the sheet-shaped heat dissipating structure and quickly discharging it through the liquid discharge port 305 to the external heat dissipation system, thereby avoiding the coolant from forming turbulence or uneven temperature within the accommodating space, thereby further improving the heat dissipation efficiency. 11 , in one embodiment, the liquid-cooled cover 320 of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention has a liquid inlet 304 and a liquid outlet 305, respectively, located on opposite sides of the side wall 302. A pair of guide plates 3201 is provided at the liquid inlet 304 and the liquid outlet 305 in the receiving space 303, respectively. The pair of guide plates 3201 extend to both sides of the liquid inlet 304 and the liquid outlet 305, forming a V-shape. Without the guide plates 3201, when the sheet-shaped heat dissipation structures 111 are densely arranged and concentrated in the middle region of the heat dissipation outer surface 110, the flow of the liquid coolant from the liquid inlet 304 into the receiving space 303 would be blocked by the sheet-shaped heat dissipation structures and flow to both sides. As a result, the flow rate of the liquid coolant between the sheet-shaped heat dissipation structures 111 would be slowed down. The temperature of the liquid coolant in the center region would be high, preventing it from quickly dissipating heat, resulting in a low liquid-cooled heat dissipation efficiency. Therefore, by installing a pair of guide plates 3201 at the liquid inlet 304 and the liquid drainage port 305, the coolant is guided from the liquid inlet 304 toward the sheet-shaped heat dissipation structure 111, thereby improving heat dissipation efficiency. Referring to FIG. 12 , in another embodiment, when the liquid inlet 304 and the liquid drainage port 305 are located on the same side of the liquid cooling cover 330 and the side wall 302, a guide plate 3301 is placed between the liquid inlet 304 and the liquid drainage port 305 to ensure that the coolant flows quickly and evenly between the sheet-shaped heat dissipation structure 111, quickly carrying away heat, and smoothly discharging it from the liquid drainage port 305 to the external cooling system.

[0049] It should be noted that the liquid-cooled covers 300, 310, 320, and 330 disclosed in any of the above embodiments are merely illustrative and do not limit the scope of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention. After considering the embodiments of the present invention, those skilled in the art can set different numbers, positions, sizes, and shapes of guide plates according to actual application situations to improve the flow pattern of the coolant, make the coolant flow more smoothly, and increase heat dissipation efficiency.

[0050] In any of the above embodiments, the liquid-cooled covers 300, 310, 320, 330 of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention are joined to the heat-dissipating outer surface 110 of the metal top cover plate 100 by welding.

[0051] In any of the above embodiments, the metal upper cover plate 100 and the metal lower cover plate 200 of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention may be replaced with the metal upper cover plate 100 and the metal lower cover plate 200 of Figure 1, or the metal lower cover plates 200A, 200B, and 200C of Figures 5A, 6A, and 7A.

[0052] 13 shows that the metal bottom cover plate 200 of the liquid-cooled vapor chamber heat dissipation device 10A of FIG. 9 of the present invention is replaced with the metal bottom cover plate 200A of FIG. 5A, and the heat-absorbing outer surface 210 of the metal bottom cover plate 200A has a recessed space 225 for accommodating electronic components.

[0053] Referring to Figure 14, the metal bottom cover plate 200 of the liquid-cooled vapor chamber heat dissipation device 10A of Figure 9 of the present invention is replaced with the metal bottom cover plate 200B of Figure 6A, and the heat-absorbing outer surface 210 of the metal bottom cover plate 200B has multiple recessed spaces 225, each of which has the same or different shape and volume and is used to accommodate multiple electronic components of different shapes or volumes.

[0054] In addition, the metal bottom cover plate 200 of the liquid-cooled vapor chamber heat dissipation device 10A of the present invention shown in FIG. 9A may be replaced with the metal bottom cover plate 200C shown in FIG. 7A.

[0055] The sheet-shaped heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal top cover plate 100 shown in Figures 1 and 8 may have other different variations and are not limited to the structures shown. Referring to the embodiments shown in Figures 15 to 17, the arrangement direction of the sheet-shaped heat dissipation structure 111A on the heat dissipation outer surface 110 of the metal top cover plate 102 shown in Figure 15 is different from the arrangement direction of the sheet-shaped heat dissipation structure 111 shown in Figures 1 and 8. The arrangement direction of the sheet-shaped heat dissipation structure 111B on the heat dissipation outer surface 110 of the metal top cover plate 103 shown in Figure 16 is the same as the arrangement direction of the sheet-shaped heat dissipation structure 111 shown in Figures 1 and 8, but a rectangular groove 112 is formed in the center of the sheet-shaped heat dissipation structure 111B by machining (e.g., milling). 1 and 8, the arrangement direction of the sheet-shaped heat dissipation structure 111C on the heat dissipation outer surface 110 of the metal top cover plate 104 shown in Fig. 17 is the same as the arrangement direction of the sheet-shaped heat dissipation structure 111 shown in Fig. 1 and 8, but a V-shaped groove 113 is machined (for example, milled) in the center of the sheet-shaped heat dissipation structure 111C. The groove depth of the rectangular groove 112 and the V-shaped groove 113 described in the above embodiment is aligned with the heat dissipation outer surface 110, allowing two or three rows of sheet-shaped heat dissipation structures to be formed in each of the sheet-shaped heat dissipation structures 111B and 111C.

[0056] The shape and directionality of the sheet-shaped heat dissipation structure of the metal top cover plate of the present invention described in each of the above embodiments are not limited, and the sheet-shaped heat dissipation structures 111, 111A to 111C shown in Figures 1, 8, and 15 to 17 are merely illustrative and are not limited thereto.

[0057] The above-mentioned embodiments are only used for illustrative purposes and do not limit the scope of the present invention. Any equivalent modifications or variations based on the liquid-cooled vapor chamber heat dissipation module of the above-mentioned embodiments should still fall within the scope of protection of the present invention.

[0058] Most conventional heat dissipation modules use an external heat sink, which adds thermal resistance to the heat sink at the thermal interface, reducing heat dissipation efficiency. The vapor chamber module and liquid-cooled vapor chamber heat dissipation device incorporating the vapor chamber module of the present invention integrate the vapor chamber's top cover with the heat sink, eliminating the thermal resistance of the conductive interface and further improving heat dissipation efficiency by incorporating a liquid-cooled cover and combining the vapor chamber's already ultra-high heat dissipation efficiency with more efficient liquid-cooled heat dissipation. Furthermore, the installation of large server machine rooms and high-density high-end chip modules can easily reduce air-cooled heat dissipation efficiency due to high ambient air temperatures. The liquid-cooled vapor chamber heat dissipation device of the present invention incorporates liquid-cooled heat dissipation, eliminating the impact of ambient air temperatures on heat dissipation efficiency. At the same time, the location and number of liquid inlet and outlet ports can be adjusted according to the machine or chip module stack, allowing for a more systematic and efficient heat dissipation solution. Furthermore, in addition to being manufactured by etching processes or combined processing processes (such as casting, forging, milling, punching, or extrusion), the liquid-cooled vapor chamber heat dissipation device of the present invention can also be manufactured by cold forging, which can further refine the grain structure of the material and reduce internal porosity defects, resulting in the material having excellent mechanical properties such as relatively high strength, deformation resistance, and fatigue resistance, as well as improving the material's heat conduction efficiency and heat diffusion efficiency, making the resulting liquid-cooled vapor chamber heat dissipation device superior in heat dissipation efficiency, durability, and reliability to general heat dissipation modules of similar structure.

[0059] From the above, we can see that this invention overcomes the problems of the prior art, truly achieves the desired effect, and is not something that a person skilled in the art would easily have thought of. It is therefore inventive and practical, and meets the requirements for a utility model registration. We have filed a utility model application in accordance with the law, and we sincerely request that your office grant the application for utility model of this invention in order to encourage invention.

[0060] The above description is merely illustrative and not limiting. Any other equivalent modifications or variations that do not depart from the spirit and scope of the present invention should be included in the scope of the following utility model claims. [Explanation of symbols]

[0061] 10 Vapor Chamber Module 10A Liquid-cooled Vapor Chamber Heat Dissipation Device 100 Metal top cover plate 101 Metal top cover plate 102 Metal top cover plate 103 Metal top cover plate 104 Metal top cover plate 110 Heat dissipation outer surface 111 Sheet-shaped heat dissipation structure 111A Sheet-shaped heat dissipation structure 111B Sheet-shaped heat dissipation structure 111C Sheet-shaped heat dissipation structure 112 Groove 113 Groove 120 Condensation inner surface 121 Kamimizo 122 Upper Frame 123 Upper channel groove 200 Metal lower cover plate 200A metal lower cover plate 200B Metal lower cover plate 200C metal lower cover plate 210 Endothermic outer surface 211 Working Space 220 Evaporation inner surface 221 Lower groove 222 Lower Frame 223 Lower channel groove 224 Support structure 225 Recessed Space 300 Liquid Cooling Cover 310 Liquid Cooling Cover 320 Liquid Cooling Cover 330 Liquid Cooling Cover 301 Upper 302 Side wall 303 Containment Space 304 Liquid supply port 305 drain outlet 3201 Guide plate 3301 Guide plate 400 intake passage 500 capillary structure 1010 Welding groove W working fluid

Claims

1. a metal top cover plate including a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface having a plurality of sheet-shaped heat dissipation structures, and an upper frame of an appropriate height is provided around the condensation inner surface, the upper frame is provided with an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other; a metal lower cover plate including a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface being adapted to contact at least one heat-dissipating electronic component, a lower frame having an appropriate height disposed around the evaporation inner surface, the lower frame being provided with a lower channel groove, and the evaporation inner surface having a plurality of lower grooves arranged parallel to each other and a plurality of support structures protruding between the lower grooves; an operating space, which is an airtight space formed by combining the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate, wherein the condensing inner surface of the metal upper cover plate and the evaporating inner surface of the metal lower cover plate face each other, and the arrangements of the upper grooves and the lower grooves can be mutually mapped and superimposed to align, and the plurality of support structures protrude and extend from the evaporating inner surface and are supported by abutting between the upper grooves of the condensing inner surface; an intake passage formed by joining the upper channel groove and the lower channel groove corresponding to each other, the intake passage being used to draw air into the working space and seal it after the intake; a capillary structure disposed in the lower groove or the upper groove and the lower groove; a working fluid present in the working space and the capillary structure; Including, A vapor chamber module in which the entire upper metal plate includes a sheet-shaped heat dissipation structure and is manufactured by being integrally formed from the same metal sheet, and the entire lower metal cover plate includes the support structure and is manufactured by being integrally formed from the same metal sheet.

2. 2. The vapor chamber module according to claim 1, wherein the upper metal cover plate and the lower metal cover plate are made of pure copper.

3. The vapor chamber module of claim 1 , wherein the working fluid is pure water.

4. 2. The vapor chamber module of claim 1, wherein the working space has a pressure of less than 1×10 −3 Torr.

5. 2. The vapor chamber module according to claim 1, wherein the heat-absorbing outer surface of the metal bottom cover plate has at least one recessed space for accommodating at least one heat-dissipating member.

6. The vapor chamber module according to claim 5 , wherein the recessed spaces are plural and are used to accommodate plural electronic components.

7. The vapor chamber module according to claim 6 , wherein each of the recessed spaces has the same or different shape and volume and is used to simultaneously accommodate a plurality of electronic components of the same or different shape and volume.

8. The vapor chamber module according to claim 5 , wherein the recessed space is recessed from the heat-absorbing outer surface toward the evaporating inner surface but does not protrude from the corresponding evaporating inner surface.

9. A vapor chamber module according to any one of claims 1 to 8; a liquid-cooled cover including a top portion and a sidewall connected to the top portion; Including, the sidewall surrounds the upper portion to form an accommodation space, and the liquid cooling cover is provided with at least one liquid supply port and at least one liquid drain port, the liquid supply port and the liquid drain port being in communication with the accommodation space; The liquid-cooled vapor chamber heat dissipation device has a liquid-cooled cover joined to the heat dissipating outer surface of the metal top cover plate, and a sheet-shaped heat dissipation structure arranged within the storage space, allowing the cooling liquid to enter the storage space through the liquid supply port, flow between the sheet-shaped heat dissipation structure, and flow out through the liquid discharge port.

10. The liquid-cooled vapor chamber heat dissipation device according to claim 9 , wherein the liquid supply port and the liquid discharge port are arranged on the same side or on different sides of the side wall.

11. 10. The liquid-cooled vapor chamber heat dissipation device according to claim 9, wherein the liquid supply ports are multiple and the liquid drain ports are multiple, and the multiple liquid supply ports and the multiple liquid drain ports are arranged on the same side or different sides of the liquid-cooled cover.

12. The liquid-cooled vapor chamber heat dissipation device according to claim 9 , wherein the accommodating space is provided with at least one guide plate.

13. The liquid-cooled vapor chamber heat dissipation device according to claim 9 , wherein the liquid-cooled cover is joined to the heat-dissipating outer surface of the metal top cover plate by welding.

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