Cleaning wafer with adjustable surface adhesion

Abstract

To provide a cleaning wafer with partially adjustable surface adhesion. [Solution] This invention is a cleaning wafer with adjustable surface adhesiveness, comprising a substrate 1 and an adhesive cleaning layer 2 bonded to one side of the substrate 1. The feature of this invention is the improved design of the surface adhesive area of ​​the adhesive cleaning layer, which is composed of some adhesive areas and some non-adhesive areas. This prevents interference with or damage to the functional structure of the wafer stage being cleaned during cleaning by the cleaning wafer, improving cleaning efficiency.

Description

[Technical Field]

[0001] The present invention relates to a maintenance technique for semiconductor manufacturing equipment, and more particularly to a cleaning wafer used in semiconductor manufacturing or inspection equipment equipped with a wafer chuck. More specifically, the present invention relates to a cleaning wafer capable of partially adjusting the adhesiveness of its surface, which effectively removes contaminants while preventing damage to functional areas. [Background technology]

[0002] In semiconductor manufacturing and inspection equipment, various wafer chucks (e.g., those in exposure, etching, deposition, metrology, and probe test equipment) are prone to the accumulation of particles, polymer residues, chemical deposits, and other contaminants on their surfaces after extended operation. In conventional technology, cleaning wafers with an adhesive layer applied to their surfaces are commonly used to remove contaminants. However, in many cases, conventional cleaning wafers have uniform adhesiveness across the entire wafer surface, which presents the following problems: [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-171171 Summary of the Invention [Problem to be solved by the invention]

[0004] (1) Risk of damage to functional areas: The chuck often has vacuum suction holes, gas passages, optical inspection windows, alignment marks, electrode contacts, etc., and if the entire surface comes into contact with the adhesive layer, it may cause clogging, contamination, or damage. (2) Wear of vulnerable areas: Some chuck coatings and materials are vulnerable, and prolonged contact with sticky cleaning wafers can accelerate wear and peeling. (3) Reduced cleaning efficiency: Contamination often concentrates in specific contact zones or edges, so full-surface adhesive contact is unnecessary and increases the wear and tear of consumable materials. [Means for solving the problem]

[0005] In order to solve the above problems, the present invention has been developed through further research and improvement in consideration of the above-mentioned drawbacks. The main purpose of the present invention is to provide a cleaning wafer with locally adjustable adhesiveness that can selectively clean only contaminated areas and protect functional areas, which is a technical problem to be solved in this field. The present invention relates to a cleaning wafer with locally adjustable surface adhesiveness, which comprises a substrate and an adhesive cleaning layer bonded to one side of the substrate. A key feature of the present invention is the improved design of the adhesive area on the surface of the adhesive cleaning layer, which is composed of a partially adhesive area and a partially non-adhesive area. This prevents interference with or damage to the functional structures on the wafer support platform when cleaning with the cleaning wafer, thereby improving cleaning efficiency. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 2 is a cross-sectional view of the present invention. [Figure 2] FIG. 1 is a plan view of a first embodiment of the present invention. [Figure 3] FIG. 2 is a plan view of a second embodiment of the present invention. [Figure 4] FIG. 10 is a plan view of a third embodiment of the present invention. [Figure 5] FIG. 10 is a plan view of a fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0007] 1, the present invention relates to a cleaning wafer with adjustable surface adhesion, which includes a substrate 1 and an adhesive cleaning layer 2 bonded to one side of the substrate 1. The substrate 1 can be a silicon wafer, quartz, glass, or other supporting substrate. The main feature of this invention is the improved surface adhesive design of the adhesive cleaning layer (2), which consists of a partial adhesive area (21) and a partial non-adhesive area (22). The locations and sizes of these two areas can be adjusted according to the structure of the wafer chuck to be cleaned. For example, a non-adhesive area is provided in the area corresponding to the vacuum suction holes to prevent clogging. A non-adhesive area is provided in the area corresponding to the optical or electronic inspection window to prevent contamination. A highly adhesive area is provided in the edge contact zone to focus on cleaning areas where contamination is concentrated. A non-adhesive area is provided in the area corresponding to the electrodes and temperature control contacts to prevent functional interference. 2 to 5 are diagrams illustrating embodiments of the present invention, but they are merely examples and do not limit the arrangement or size of the adhesive and non-adhesive areas. Furthermore, the adhesive areas of the present invention can be configured as high-adhesive or low-adhesive areas according to the actual needs of the product to be cleaned, thereby achieving more efficient cleaning results.

[0008] By implementing the structural features of the present invention, the following advantages can be achieved: Contamination and clogging of vacuum holes, optical windows, gas passages, electrode contacts, etc. can be prevented. Protects areas with weak or special coatings and reduces wear. Improves cleaning efficiency and allows for focus on areas with high contamination levels. Extends the life of cleaning wafers and reduces consumable costs. Applicable to various equipment with wafer chucks (exposure equipment, etching equipment, deposition equipment, metrology equipment, test equipment, etc.).

[0009] As described above, this invention meets the requirements of inventive step and novelty for a patent, and an application is being filed based on this. [Explanation of symbols]

[0010] (1) Circuit board (2) Adhesive cleaning layer (21) Sticky area (22) Non-adhesive area

Claims

1. A cleaning wafer with partially adjustable surface adhesion, comprising a substrate and an adhesive cleaning layer bonded to one side thereof, the surface of the adhesive cleaning layer being composed of some adhesive areas and some non-adhesive areas.

2. The cleaning wafer described in claim 1 has adjustable surface adhesion, characterized in that the position and size of the adhesive and non-adhesive areas on the surface of the adhesive cleaning layer can be adjusted depending on the wafer chuck structure to be cleaned.

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