Multi-layered structure

Abstract

The present invention provides a multilayer structure that allows connecting elements to be attached to the second surface of the substrate film, reduces the time required for manufacturing, completely seals the vicinity of the connecting elements, and avoids or reduces wrinkles or pinning of the substrate film when a polymer layer is provided on the first surface of the substrate film. [Solution] The multilayer structure includes a substrate film 102, at least one functional element 108, at least one polymer layer 110, and at least one connecting element 118. The substrate film has a conductor 104 on its first surface and further comprises vias 106, the vias comprising a conductive material, the conductive material being bonded to the conductor. The functional element is at least one optical and / or electrical functional element on the first surface of the substrate film, bonded to the conductor. The polymer layer is on the first surface of the substrate film and at least partially embeds the conductor and the at least one functional element. The connecting element is located on the first surface of the substrate film and is bonded to the conductive material of the via.

Description

Technical Field

[0001] The present invention generally relates to a multilayer structure incorporating functional features such as electronic elements. In particular, the present invention relates to a multilayer structure including a substrate film having vias provided with a conductive material. The functional elements are provided on the first surface of the substrate film, and the connection elements are disposed on the second surface of the substrate film. The connection elements may be provided after assembly or in a post-processing step.

Background Art

[0002] Molded structural electronic devices characterized by a high degree of integration of materials and electronic components have various applications in various fields. Usually, on a substrate, particularly a substrate film, conductors and functional components are disposed on the first surface of the substrate, and this first surface is oriented towards the environment or the user.

[0003] Connection elements such as connectors for external connection can be disposed on the first surface or the second surface of the substrate. Conventionally, the connection elements are press-fitted and attached to the substrate. As the press-fitting attachment method, there are a method of forming a connector body by a molding process such as injection molding after press-fitting each pin, a method of press-fitting to a pre-molded connector assembly, or alternatively a method using "flexible connection", and the flexible connection is performed by inserting a "tail" of a flexible PI circuit board through a slit of the substrate. In some embodiments, it is worth noting that in the case of a press-fit connector provided on the first "functional" side of the substrate, the effective surface area required by the connection element on the functional side becomes quite large.

[0004] When a connection element is required at the center of the substrate, the connection element is assembled by, for example, a surface mounting technology (SMT) process using a conductive adhesive. This is only achievable in a single substrate configuration where the connection element is provided on the first surface of the substrate. When the substrate film is molded by, for example, high-pressure thermoforming, components cannot be disposed on both surfaces of the substrate film in the molding process, so a configuration in which the connection element penetrates the substrate cannot be adopted.

[0005] Crimped connecting elements restrict the movement of the substrate during molding processes such as injection molding, potentially leading to wrinkles and cracks in the substrate film. The process of crimping individual pins can be a slow process. Furthermore, typically only side-escaping connecting elements are feasible.

[0006] When using molded connectors, molding the connecting elements may require complex and specialized molding tools.

[0007] Flexible connections can sometimes be difficult to make watertight. This is because the PI flex is not wetted by the molded plastic, and there is a thin gap of air through which water can penetrate due to capillary action. [Overview of the project]

[0008] The object of the present invention is to mitigate at least one or more drawbacks associated with known solutions, or to provide a novel solution for achieving a particular function. This object can be achieved by various embodiments of the present invention.

[0009] According to one aspect of the present invention, a multilayer structure is provided. This multilayer structure is A substrate film having a conductor on a first surface of the substrate film, the substrate film further comprising vias, the vias comprising a conductive material, and the conductive material being bonded to the conductor, At least one optical and / or electrical functional element on the first surface of a substrate film, wherein the functional element is coupled to a conductor, A polymer layer on the first surface of a substrate film, wherein a conductor and a functional element are embedded in at least partially the polymer layer, At least one connecting element disposed on the first surface of a substrate film, wherein the connecting element is bonded to the conductive material of a via, Includes.

[0010] According to the present invention, connectivity to conductors and / or functional elements (multiple) arranged on the first surface of a substrate film can be provided via vias. In this case, the connecting elements are arranged on the second surface of the substrate film. Here, the connecting elements do not require surface area on the first surface (functional surface) of the substrate film. The first surface of the substrate film is configured to face the environment / user and may therefore be the "visible surface" of the multilayer structure. By providing the connecting elements on the second surface of the substrate film, the connecting elements can be hidden from the user.

[0011] Molding, such as injection molding, onto the first surface of the substrate, or formation, such as high-pressure forming of the substrate film, can be carried out without considering connecting elements. Connecting elements can be provided after assembly or in a post-processing step. This means that connecting elements can be provided after at least the conductor and functional elements(s) are provided on the first surface of the substrate, preferably after the polymer layer is provided on the first surface of the substrate film. Furthermore, optionally, they may be provided after a forming step such as high-pressure forming, which can be carried out after the conductor and / or functional elements(s) are provided.

[0012] In the manufacturing process, a first mold shot, and possibly a second or more, may be performed on the first surface of the substrate film. This first surface is configured to face the environment or the user. The structure may then be rotated to expose the second surface, i.e., the back surface, of the substrate film for processing. The multilayer structure may be supplied to a fixture that allows, for example, an assembly machine to attach standard or custom-designed connecting elements to the second surface of the substrate film (e.g., on contact pads, if any). The time required for manufacturing may be reduced compared to the prior art.

[0013] Depending on the application, the present invention can provide a structure that is completely sealed at least in the vicinity of the connection element, where the connection element body can cover the via. An optional structural adhesive may be provided in an amount sufficient to seal the conductive material of the via and any additional conductive material bonded to the connection element. The present invention can use the same structural and conductive adhesives used in the assembly of standard electronic devices.

[0014] The present invention allows for free movement of the substrate film during molding, such as injection molding, related to the first surface of the substrate film, i.e., when providing at least one polymer layer to the first surface of the substrate film. Wrinkling or pinning of the substrate film can be avoided or reduced during this process step. Note that the selection of connection elements used is relatively flexible, and for example, most SMD connectors can be used.

[0015] The connecting element may be a film-through connector. In this case, a thicker conductive material may be provided on the first surface of the substrate film.

[0016] An additional film may be provided on the polymer layer.

[0017] The conductor may be a printed conductive trace.

[0018] At least one contact pad may be located on the first or second surface of the substrate film, and this contact pad(s) may be coupled to the conductive material of the via.

[0019] At least one second connecting element may be positioned on the first surface of the substrate film. The second connecting element may be positioned to cover the via on the first surface of the substrate film and may provide conductive material for the via. Here, the shape of the connecting element preferably matches at least partially the shape of the via. The second connecting element may include a contact pad shaped to match the shape of the via.

[0020] The second surface of the substrate film may include printed conductive features such as printed conductive traces and / or printed conductive pads. If the first surface of the substrate film includes printed conductive features (e.g., printed conductive traces), this type of multilayer structure can integrate the connection elements on the back of the substrate film by utilizing double-sided conductive printing (with conductive adhesive as needed) to ensure reliable electrical and mechanical connections from the connection elements to the first surface of the substrate film. This allows for flexible placement of the connection elements on the second surface of the substrate film, as the connection elements do not need to be placed vias or in close proximity to vias. Furthermore, since a narrow pitch can be achieved through printing, it is possible to use connection elements with narrow pin spacing relative to each other. A larger contact area with the connection elements can be achieved.

[0021] The multilayer structure may further include at least one conductive film or tape between at least a portion of the connecting elements and the second surface of the substrate film, including a structural adhesive, a conductive adhesive, a low-temperature solder paste, and an anisotropic conductive film (ACF) tape.

[0022] The multilayer structure may include at least one contact pad on the second surface of the substrate film, and the connecting element on the second surface of the substrate film is coupled to the conductive material of the via via the contact pad. The contact pad on the second surface of the substrate film may be an add-on contact pad, i.e., it may be provided after the electronic equipment and polymer layer have been provided on the first surface of the substrate film. The type of connecting element used in this case can be freely selected and may include, for example, pins, pogo pins, or any other contact method. Abrasion resistance and mechanical durability associated with different contact methods may be improved compared to a solution in which the connecting element is provided on the functional surface of the substrate film. The position of the connecting element can be more freely selected and does not need to be immediately adjacent to the via. Compared to a solution in which the connecting element is directly coupled to the conductive material of the via, a larger contact area with the connecting element is also provided via the contact pad. This type of structure can be mounted, for example, using SMT mounting, automated adhesive dispensing and assembly robots, or entirely by hand. This solution can also allow for multiple types of contact interfaces to the functional surface of the substrate film, such as soldering or spring-loaded contacts.

[0023] Contact pads may be provided even if the second surface of the substrate film does not contain conductive features such as printed conductive features. In other embodiments, contact pads may also be provided even if the second surface of the substrate film has conductive features such as printed conductive features.

[0024] The multilayer structure may include an additional polymer layer on the second surface of the substrate film. The additional polymer layer may at least partially embed or surround the connecting elements. The additional polymer layer may be formed by a second molding shot after a first molding shot is used to form a polymer layer on the first surface of the substrate film.

[0025] The substrate film may include a formable material, preferably a thermoformable material, and optionally may include at least one of a polymer, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyester, copolyester resin, polyimide, a copolymer of methyl methacrylate and styrene (MS resin), glass, and polyethylene terephthalate (PET).

[0026] The connecting element may include a connector or may be a connecting element configured to couple a multilayer structure to an external object in another manner, for example. The connecting element may be a through-film connector.

[0027] The connecting element may include a surface mount device (SMD) connector.

[0028] Exemplary embodiments of the present invention should not be construed as imposing limitations on the applicability of the appended claims. The verb "comprising" is used herein as an open limitation that does not exclude the presence of features not described herein. The various embodiments and features described, for example, in the dependent claims are freely combinable with each other unless expressly stated otherwise.

[0029] The novel features considered to be characteristic of the present invention are particularly set forth in the appended claims. However, the invention itself will be best understood from the following description of certain embodiments, read in conjunction with the accompanying drawings, with respect to both its structure and its method of operation, as well as additional objects and advantages thereof.

Brief Description of the Drawings

[0030] Some embodiments of the present invention are illustrated by way of example in the figures of the accompanying drawings.

[0031] [Figure 1] A cross-sectional view of a multilayer structure is shown. <​​​​​​A cross-sectional view of a multi-layered structure is shown. [Figure 5] A cross-sectional view of a multi-layered structure is shown. [Figure 6] A cross-sectional view of a multi-layered structure is shown. [Figure 7] A cross-sectional view of a multi-layered structure is shown. [Figure 8] A flowchart illustrating the method for manufacturing a multilayer structure is shown. [Modes for carrying out the invention]

[0032] Figure 1 shows a cross-sectional view of the multilayer structure. Note that the figures in this document are not drawn to scale. The multilayer structure includes a substrate film 102 having a first surface and a second surface.

[0033] The substrate film may comprise a moldable material, preferably a thermoformable material, and optionally comprises polymers, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, and / or polyethylene terephthalate (PET).

[0034] The substrate film can be molded into a selected three-dimensional non-planar shape.

[0035] The conductor 104 is provided on the first surface of the substrate film 102. The conductor 104 may also be a printed conductive trace.

[0036] The first surface of the substrate film 102 may include other printed conductive features. Furthermore, a conventional conductive pad may be provided on the first surface of the substrate film.

[0037] Conductive materials such as conductive traces and / or conductive pads may include at least one material selected from the group consisting of conductive inks, conductive nanoparticle inks, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fibers, alloys, silver alloys, zinc, brass, titanium, solder, and any component thereof. The conductive material used may be optically opaque, translucent, and / or transparent to light of a desired wavelength, such as visible light, and may, for example, reflect, absorb, or transmit radiation such as visible light. In particular, the conductor 104 may be a silver conductive trace.

[0038] The substrate film 102 includes at least one via 106, the via 106 containing a conductive material. The via may be filled with the conductive material. Although the via 106 in Figure 1 is shown as being filled with the conductive material, this is not necessarily required. The via 106 may be partially filled, or at least partially coated with the conductive material.

[0039] In the case of filled vias 106, the substrate film 102 can be processed as if the vias were not present. This is beneficial in manufacturing methods that use molding, such as high-pressure molding, where unfilled vias can tolerate the leakage of pressurized air. Filled vias may also be beneficial in manufacturing methods that use molding, such as injection molding, because if plastic material is forced into unfilled vias, the injected plastic material may cause localized collapse of the substrate film 102.

[0040] The conductive material of via 106 is bonded to a conductor 104 provided on the first surface of the substrate film 102.

[0041] At least one optical and / or electrical functional element 108 is further provided on the first surface of the substrate film 102, and the functional element 108 is coupled to a conductor 104 provided on the first surface of the substrate film 102.

[0042] Functional elements may include, for example, electrodes, electronic components, electromechanical components, electro-optical or optoelectronic components, radiation-emitting components, light-emitting components (e.g., LEDs (light-emitting diodes), OLEDs (organic LEDs), bottom-shooting LEDs, or other light sources), radiation detection components, light detection components, photodiodes, phototransistors, photovoltaic devices, sensors, micromechanical components, switches, touch switches, proximity switches, touch sensors, proximity sensors, capacitive switches, capacitive sensors, projected capacitive sensors or switches, single-electrode capacitive switches or sensors, multi-electrode capacitive switches or sensors, self-capacitive sensors, mutual capacitive sensors, induction sensors, sensor electrodes, UI elements, user input elements, vibration elements, communication elements, data processing elements, data storage elements, or electronic subassemblies.

[0043] At least one polymer layer 110 is further provided on the first surface of the substrate film 102 to at least partially embed the conductor 104. The polymer layer 110 can at least partially embed at least one of the provided functional elements 108.

[0044] The polymer layer 110 may be a molded polymer layer formed, for example, by injection molding.

[0045] The polymer layer 110 may include, for example, a thermoplastic material. The polymer layer 110 may include at least one material selected from the group consisting of elastomer resins, thermosetting materials, thermoplastic materials, PC, PMMA, ABS, PET, copolyester, copolyester resin, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanized product), and MS resin. The thickness of the molded polymer layer may vary depending on the embodiment, and may be, for example, less than 1 millimeter, several millimeters, or tens of millimeters. The polymer layer may include at least a partially transparent or translucent material.

[0046] The first surface of the substrate film may constitute a functional or visible surface of the multilayer structure, and may be a surface configured to face the environment and / or the user. Functional elements may implement indicators (such as indicator lights) intended for user accessibility or visibility. The visible / functional surface of the multilayer structure may implement a user interface, for example.

[0047] The multilayer structure further includes at least one connecting element 112 located on the second surface of the substrate film, the connecting element 112 being bonded to the conductive material of the via 106.

[0048] The connecting element 112 may be positioned to bond directly to the conductive material of the via. Alternatively, the connecting element 112 may be bonded to the conductive material of the via 106 via a provided conductive feature. In yet another embodiment, the connecting element 112 may be bonded to the conductive material of the via 106 via, for example, a low-temperature solder paste and / or a conductive film or tape (e.g., an anisotropic conductive film (ACF) tape).

[0049] The second surface of the substrate film 102 constitutes the physical interface surface of the multilayer structure, and the physical interface surface is intended to provide external connectivity to the multilayer structure via the connecting element 112.

[0050] The connecting element 112 may be a through-film connector or an on-film connector. The connecting element may include, for example, pins or pogo pins for connectivity. The connecting element 112 may be an SMD connector.

[0051] The multilayer structure may further include an additional film 113 provided on the polymer layer 110. The additional film 113 may include, for example, the same or similar material as the substrate film 102. The additional film 113 may include selected properties with respect to opacity and may constitute a masking layer that blocks light at least partially. The additional film 113 may include, for example, icons, text, indicators, or other graphical features, which may be obtained in addition to or instead of the light-blocking portion in the material of the additional film 113, for example, using one or more inks. The additional film 113 may further include optical features such as surface relief features.

[0052] In a multilayer structure, for example, any number of additional films may be provided on any number of additional polymer layers, and a laminated structure can be formed in which polymer layers and additional film layers are alternately stacked.

[0053] The multilayer structure may include structural and / or conductive adhesives for attaching one or more components of the multilayer structure (e.g., connecting element 112).

[0054] The connecting element 112 can be fixed to the substrate film 102 using a structural adhesive, but the fixing can be done by heat staking or ultrasonic welding.

[0055] An additional polymer layer 114 may be provided on the second surface of the substrate film 102, the additional polymer layer 114 at least partially embedding or surrounding the connecting element 112. The additional polymer layer 114 may contain the same material as the polymer layer 110. Note that the additional polymer layer 114 is optional and not required in the multilayer structure.

[0056] As described above, the first surface of the substrate film 102 may be provided with conductive features such as printed conductive features. In some embodiments, the second surface of the substrate film 102 may also be provided with conductive features such as printed conductive features. The printed conductive features on the second surface of the substrate film 102 may include, for example, printed conductive traces and / or printed conductive contact pads. At least a portion of the printed conductive features may be bonded to the conductive material of the via 106 and the connecting element 112. This allows for more flexible placement of the connecting element 112 on the second surface of the substrate film 102.

[0057] Figure 2 shows a cross-sectional view of another multilayer structure. At least one second connecting element is positioned on the first surface of a substrate film 102, and the second connecting element includes a contact pad 116 positioned to cover a via 106 on the first surface of the substrate film 102. Here, the contact pad 116 provides conductive material for the via and conforms at least partially to the shape of the via 106, at least partially filling the via 106 or at least partially covering the wall of the via 106. A conductive adhesive may be provided between the substrate film 102 and the contact pad 116.

[0058] Figure 2 shows an example of a multilayer structure obtained after the process of providing the indicated elements. The shape of the contact pad 116 can be obtained through the manufacturing process of the multilayer structure.

[0059] Figure 3 shows a portion of the multilayer structure of Figure 2 during the manufacturing process. The substrate film 102 comprises at least one via 106. The via 106 may be formed, for example, by punching after the conductor 104 has been provided. The conductor 104 may be formed by printing.

[0060] Next, the substrate film 102 is provided with a second connecting element, which is a contact pad 116. The contact pad 116 is positioned to cover at least one via 106. The contact pad 116 can be provided, for example, using SMD technology. At this point, a functional element 108 may also be provided.

[0061] The multilayer structure (or at least a portion of the structure manufactured up to this point) can then be molded into a desired 3D shape.

[0062] After a molding process such as injection molding in which the polymer layer 110 is provided, the structure in Figure 3 may be similar to the structure in Figure 2 in terms of the shape of the contact pad 116. The pressure during molding, such as high-pressure molding, deforms the contact pad 116 so that it takes on a shape that at least partially conforms to the shape of the via. Subsequently, the manufacturing process can continue to form at least the connecting element 112.

[0063] Figure 4 shows a multilayer structure in which a second connecting element containing a conductive material is provided on the first surface of the substrate film 102. Here, the second connecting element is a spacer 118. The shape of the spacer 118 conforms to the shape of the via 106 and provides the conductive material for the via. Here, the via 106 can be completely filled with the conductive material.

[0064] Figure 5 shows a multilayer structure in which multiple functional elements 108 (e.g., LEDs) are provided on the first surface of a substrate film 102. Of course, any number of functional elements 108, any number of vias 106, and a conductive material to which the functional elements 108 are coupled can be provided.

[0065] Furthermore, the multilayer structure in Figure 5 includes an optional superimposed polymer layer 124 provided on the polymer layer 110. The superimposed polymer layer 124 can be molded in a second molding shot, for example, in a molding process such as injection molding.

[0066] The embodiment in Figure 5 may further include a sealing structure 126 provided between the second surface of the substrate film 102, at least a portion of the connecting element 112, and the external structure 128. The external structure may be, for example, the hood of a vehicle. The sealing structure 126 may be, for example, a commercially available sealing ring structure or a sealing ring structure manufactured in another manufacturing process, or the sealing structure 126 may be provided in a molding process and may correspond to an additional polymer layer 114.

[0067] Figure 6 shows an example of a multilayer structure. The multilayer structure includes at least one add-on contact pad 130 located on the second surface of the substrate film 102. The contact pad 130 is positioned to bond to the conductive material of the via 106. The contact pad 130 is further bonded to a connecting element 112. A multilayer structure including the contact pad 130 as shown in Figure 6 is also applicable when the second surface of the substrate film 102 does not have conductive features. The contact pad 130 may be bonded directly to the connecting element 112, for example. For example, a conductive adhesive may be provided on at least the first surface of the substrate film 102, for example, in relation to the via 106. A conductive and / or structural adhesive may be provided on the second surface of the substrate film to fix at least the contact pad 130 to the substrate film 102.

[0068] Figure 7 shows a multilayer structure similar to that in Figure 6. However, in Figure 7, the contact pad 130 is positioned at a distance from the via 106, while being coupled to the conductive material of the via 106 via a conductor 132 provided on the second surface of the substrate film 102, for example by printing.

[0069] Figure 8 shows a flowchart of a method for manufacturing a multilayer structure. This method may include an initiation step 002. In the initiation step, tasks such as the selection, acquisition, calibration, and other setup work of materials (e.g., substrates), components, and tools may be performed. For example, the selection of individual elements and materials may be ensured to be compatible with each other and to withstand the selected manufacturing and installation processes. The selection may be confirmed, for example, based on the specifications of the manufacturing process or component data sheets, or by examining and testing a fabricated prototype. The equipment to be used, such as molding / IMD (in-mold decoration), lamination, bonding, (thermo)forming, electronic assembly, cutting, drilling, and / or printing equipment, may be brought into operation at this stage.

[0070] The initial stage may also include acquiring and setting up the various mold tools and / or drilling tools to be used.

[0071] In step 004, a substrate film can be obtained that is moldable and optionally high-pressure moldable.

[0072] In step 004, the conductor 104 is provided on the first surface of the substrate film 102, and optionally on the second surface of the substrate film. Step 008 may refer to printing conductive traces. Optionally, step 006 may include providing other conductive features.

[0073] In step 008, at least one via 106 is provided in the substrate film 102. The via may be provided, for example, by a standard punching process, i.e., laser cutting, cutting or similar methods.

[0074] In step 010, at least one optical and / or electrical functional element 108 is provided on the first surface of the substrate film. This method may include SMD technology. Step 010 may further provide, for example, SMD components. For example, an unprinted contact pad may also be provided.

[0075] This method may include, for example, applying a structural adhesive and / or conductive adhesive between the substrate film 102 and the functional element 108.

[0076] This method includes providing a conductive material to the via in step 012. The via may be filled with the conductive material at least partially. The conductive material for the via may be provided at different stages of the manufacturing process.

[0077] In step 014, one or more second connecting elements may be provided. Additionally or alternatively, one or more contact pads 116 may be provided.

[0078] This method may optionally include shaping the substrate film 102 into a desired three-dimensional non-planar shape by molding such as high-pressure molding (step 016).

[0079] This method further includes forming a polymer layer 110 on the first surface of the substrate film 102, preferably by injection molding (step 018). The polymer layer is provided to at least partially embed the conductor 104, and optionally to embed the conductor 104 and at least one functional element 108.

[0080] After the molding process, this method may include adding an additional film 113 (which may be, for example, a decorative film) or further additional films.

[0081] Step 018 may further include utilizing one or more additional mold shots to further form the superimposed polymer layer 124.

[0082] Further additional films may be provided on top of the additional polymer layer that has been formed.

[0083] In step 020, at least one connecting element 112 is provided on the second surface of the substrate film 102. The connecting element 112 is coupled to the conductive material of the via 106. Step 020 may be carried out using SMD technology. In step 020, one or more add-on contact pads 130 may be provided on the second surface of the substrate film 102. Of course, any further elements such as electronic components may be provided. Fixing means such as conductive adhesive and / or structural adhesive may also be provided during step 020.

[0084] This method may optionally include molding an additional polymer layer 114(or more) onto the second surface of the substrate film 102 (step 022). The additional polymer layer 114 may at least partially embed or surround the connecting element 112.

[0085] Step 024 completes the execution of the method.

[0086] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will understand that the disclosed embodiments are constructed for illustrative purposes only, and that other configurations applying many of the above principles can be readily prepared to best suit each potential use scenario.

Claims

1. A substrate film (102) having a conductor (104) on a first surface of the substrate film, wherein the substrate film further comprises vias (106), the vias comprising a conductive material, and the conductive material being bonded to the conductor, At least one optical and / or electrical functional element (108) on the first surface of the substrate film, wherein the functional element is coupled to the conductor, At least one polymer layer (110) on the first surface of the substrate film, the at least one polymer layer (110) that at least partially embeds the conductor and the at least one functional element, At least one connecting element (112) disposed on the first surface of the substrate film, wherein the connecting element is bonded to the conductive material of the via, A multilayer structure characterized by including

2. The multilayer structure according to claim 1, wherein an additional film (113) is provided on the polymer layer.

3. The multilayer structure according to claim 1, wherein the conductor is a printed conductive trace.

4. The multilayer structure according to claim 1, wherein at least one contact pad is disposed on the first surface of the substrate film and bonded to the conductive material of the via.

5. The multilayer structure according to claim 1, wherein at least one second connecting element is disposed on the first surface of the substrate film, the second connecting element optionally includes a contact pad, the second connecting element is disposed on the first surface of the substrate film to cover the via and to provide the conductive material for the via, and optionally the shape of the contact pad matches the shape of the via.

6. The multilayer structure according to claim 1, wherein the second surface of the substrate film has conductive features including at least one of a printed conductive trace and a printed conductive pad.

7. The multilayer structure according to claim 1, further comprising at least one conductive film or tape containing a structural adhesive, a conductive adhesive, a low-temperature solder paste, and an anisotropic conductive film (ACF) tape between at least a portion of the connecting element and the second surface of the substrate film.

8. The multilayer structure according to claim 1, further comprising at least one contact pad (130) on the second surface of the substrate film, wherein the connecting element on the second surface of the substrate film is bonded to the conductive material of the via via the contact pad.

9. The multilayer structure according to claim 1, further comprising an additional polymer layer (114) on the second surface of the substrate film, wherein the additional polymer layer at least partially embeds or surrounds the connecting element.

10. The multilayer structure according to claim 1, wherein the substrate film comprises a moldable material, preferably a thermoformable material, and optionally comprises at least one of a polymer, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, and polyethylene terephthalate (PET).

11. The multilayer structure according to claim 1, wherein the connecting element includes a surface mount device (SMD) connector.

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