Dicing device and dicing method

Abstract

To provide a dicing device and a dicing method which stabilize the processing quality without being affected by surface undulation of a work table or thickness variation of a dicing tape.SOLUTION: A dicing device comprises: a map creation part (58) which creates a map for calibration indicating the shape of a surface of a work table (12) from a measurement result of a shape of a surface of a workpiece for calibration; blade shape determination parts (22, 56) which acquire a plane image of a groove with a clear contour by imaging the groove formed on the surface of a workpiece for blade determination with higher reflectance than a surface of a workpiece being a processing object by using a blade (18), and determine the tip shape of the blade from the plane image; and a control part (56) which controls the height of the blade when processing the workpiece being the processing object on the basis of the map for calibration, the tip shape of the blade, and a table showing a relation between the tip shape of the blade and a correction amount of the height of the blade.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a dicing apparatus and a dicing method, and more particularly to a dicing apparatus and a dicing method for dividing a workpiece such as a wafer on which semiconductor devices or electronic components are formed into individual chips. [Background technology]

[0002] A dicing machine that divides workpieces such as semiconductor devices and wafers on which electronic components are formed into individual chips is equipped with a blade that is rotated at high speed by a spindle, a worktable that suctions and holds the workpiece, and X, Y, Z, and θ drive units that change the relative position between the worktable and the blade. This dicing machine performs dicing (cutting) by cutting into the workpiece with the blade while the blade and the workpiece are moved relatively by the respective drive units.

[0003] In a dicing machine, it is important to ensure that the amount of cutting in of the blade matches the set value. To achieve this, it is necessary to repeatedly and precisely position the Z-axis, which is the direction in which the blade cuts into the workpiece, and to detect and correct blade wear.

[0004] For example, as described in Patent Document 1, in the conventional method of positioning the Z axis, the blade is first brought into contact with the upper surface of the work table to detect electrical continuity, and the center position of the blade at this time is used as the reference position to control the Z axis. This operation of bringing the blade into contact with the upper surface of the work table to detect electrical continuity is called cutter setting. In addition, blade wear correction is performed by bringing the blade into contact with the work table and correcting the reference position every time a set number of lines of the work are machined. However, this method involves bringing the blade into contact with the work table, which may damage the blade.

[0005] To solve this problem with contact-type cutter setting, for example, an optical cutter setting device is proposed in Patent Document 2. This optical cutter setting device moves a blade in the Z-axis direction perpendicular to the optical axis between the light projecting means and the light receiving means, gradually blocks the detection light with the blade, and positions the blade based on the blade center position when a preset amount of received light is reached. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2003-211350 A [Patent Document 2] JP 2003-234309 A Summary of the Invention [Problem to be solved by the invention]

[0007] There are three types of blade dicing: half cut, semi-full cut, and full cut. In recent years, as the diameter of the workpiece has increased, the full cut method, which completely cuts the workpiece, has become mainstream. In the full cut method, the workpiece is placed on a worktable with the dicing tape attached, and the blade cuts from the surface side of the workpiece to the dicing tape while the blade and the worktable are moved relative to each other, dividing the workpiece into individual chips.

[0008] However, the above-mentioned conventional techniques have a problem in that they are not adequately suited to dicing, which involves full cutting of a workpiece.

[0009] That is, in the case of the full cut method, it is necessary to control the cutting depth (cutting amount) of the blade so that the blade fully penetrates the workpiece but does not reach the worktable.

[0010] 18, when a full cut is performed on the workpiece W, the height H of the blade 90 (the height from the surface of the worktable to the center position of the blade 90) is positioned so that the cutting depth D into the workpiece W is greater than the thickness M of the workpiece W. Then, the worktable (not shown) is fed in the X direction relative to the blade 90 rotated at high speed, so that a cutting groove 92 for one line is formed in the workpiece W.

[0011] However, if the surface of the work table is wavy or if there is variation in the thickness of the dicing tape T, for example, as shown in Fig. 19, in a portion where the dicing tape thickness K1 is thinner than the dicing tape thickness K shown in Fig. 18, the cutting depth D1 into the workpiece W will be smaller than the cutting depth D shown in Fig. 18. That is, the blade 90 will make shallow cuts into the workpiece W. In this case, the blade 90 will not cut sufficiently into the workpiece W, which will cause poor cutting.

[0012] On the other hand, as shown in FIG. 20, in a portion where the dicing tape thickness K2 is thicker than the dicing tape thickness K shown in FIG. 18, the cutting depth D2 into the workpiece W becomes larger than the cutting depth D shown in FIG. 18. That is, the blade 90 cuts deeper into the workpiece W. In this case, the blade 90 cuts into the dicing tape T more than necessary. Therefore, the blade 90 is likely to become clogged with adhesive on the surface of the dicing tape, which causes the blade 90 to lose its sharpness. Alternatively, this may cause the tape to break during the expanding process carried out after the dicing process.

[0013] Thus, even if the blade is set to a specified height, if there is variation in the thickness of the dicing tape, the depth at which the blade cuts into the dicing tape will vary, which can cause problems with unstable processing quality. Note that similar problems can occur not only due to variation in the thickness of the dicing tape, but also due to undulations on the surface of the work table and wear of the blade.

[0014] In particular, in recent years, there has been a trend for the blade width to become thinner as the number of chips per wafer increases. As the blade width becomes thinner, the number of abrasive grains on the blade also decreases, making the blade more susceptible to clogging due to the adhesive on the surface of the dicing tape, and the above-mentioned problems become more pronounced.

[0015] The present invention has been made in consideration of the above circumstances, and aims to provide a dicing apparatus and a dicing method that can stabilize processing quality without being affected by undulations on the surface of the work table or variations in the thickness of the dicing tape. [Means for solving the problem]

[0016] In order to achieve the above object, the following invention is provided.

[0017] A dicing apparatus according to a first aspect of the present invention is a dicing apparatus that performs dicing by moving a blade rotating by a spindle and the worktable relative to one another while a workpiece to be processed is held on the worktable via a dicing tape, and is equipped with a map creation unit that creates a calibration map indicating the shape of the surface of the worktable from measurement results of the shape of the surface of a calibration workpiece held on the worktable, a blade shape determination unit that obtains an image of a groove formed on the surface of a blade determination workpiece using the blade and determines the tip shape of the blade from the image, and a control unit that controls the height of the blade when processing the workpiece to be processed based on the calibration map and the tip shape of the blade.

[0018] A dicing apparatus according to a second aspect of the present invention is the first aspect, wherein the control unit determines the wear state of the blade from the shape of the tip of the blade, and reduces the height of the blade as the wear progresses.

[0019] A dicing apparatus according to a third aspect of the present invention, in the first or second aspect, further includes a cutting mark detection unit that detects cutting mark information formed on a surface area of ​​the dicing tape where no workpiece is attached, and a control unit controls the height of the blade based on the cutting mark information detected by the cutting mark detection unit so that the cutting depth into the dicing tape is constant.

[0020] In a dicing apparatus according to a fourth aspect of the present invention, in the third aspect, a cutting mark detection unit calculates a cutting mark formation rate in the surface area of ​​the dicing tape based on cutting mark information, and a control unit controls the blade height so that the cutting mark formation rate is within a certain range based on the cutting mark formation rate calculated by the cutting mark detection unit.

[0021] A dicing method according to a fifth aspect of the present invention is a dicing method in which a blade rotating by a spindle and the worktable are moved relative to each other to perform dicing while a workpiece to be processed is held on the worktable via a dicing tape, and the method includes a calibration map creation process for creating a calibration map indicating the shape of the surface of the worktable from measurement results of the shape of the surface of a calibration workpiece held on the worktable, a blade shape determination process for obtaining an image of a groove formed on the surface of a blade determination workpiece using the blade and determining the tip shape of the blade from the image, and a control process for controlling the height of the blade when processing the workpiece to be processed based on the calibration map and the tip shape of the blade.

[0022] A dicing method according to a sixth aspect of the present invention is the dicing method of the fifth aspect, wherein the calibration workpiece has a uniform thickness.

[0023] A seventh aspect of the present invention relates to a dicing method according to the fifth or sixth aspect, wherein the blade determination workpiece has a mirror-finished surface or is a glass plate. Effect of the Invention

[0024] According to the present invention, it is possible to stabilize the processing quality without being affected by undulations on the surface of the work table and variations in the thickness of the dicing tape. [Brief description of the drawings]

[0025] [Figure 1] FIG. 1 is a schematic diagram showing a configuration of a dicing device according to an embodiment of the present invention; [Diagram 2] Plan view showing the workpiece [Diagram 3] A diagram showing an example of a calibration map [Figure 4] A plan view showing the planar shape of the kerf [Diagram 5] A table showing an example of the amount of blade height correction for each blade tip shape determination result [Figure 6] Schematic diagram showing how dicing is performed on a workpiece [Figure 7] Schematic diagram showing how an imaging device captures an image of a dicing tape area. [Figure 8] Schematic diagram showing how the line sensor camera captures the dicing tape area [Figure 9] FIG. 1 is a diagram showing an example of a correction table. [Figure 10] FIG. 1 is a diagram showing a specific example of operation in this embodiment. [Figure 11] A diagram showing the trajectory of the tip (-Z side end) of the blade 18. [Figure 12] Flowchart showing the flow of blade height correction operation [Figure 13] Flowchart showing the calibration map creation process [Figure 14] Flowchart showing the blade shape determination process [Figure 15] Flowchart showing the dicing process [Figure 16] FIG. 13 is a schematic diagram showing a configuration of a dicing device according to another embodiment; [Figure 17] A diagram showing an example of a height graph generated by the cutting mark detection unit. [Figure 18] A diagram for explaining the conventional problems [Figure 19] A diagram for explaining the conventional problems [Figure 20] A diagram for explaining the conventional problems DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A dicing apparatus and a dicing method according to an embodiment of the present invention will now be described with reference to the accompanying drawings.

[0027] [Configuration of dicing device 10] FIG. 1 is a schematic diagram showing the configuration of a dicing device 10 according to the present embodiment.

[0028] As shown in FIG. 1, dicing apparatus 10 includes a work table 12, a sub-table 13, a θ table 14, an X-table 16, a blade 18, a spindle 20, a Y-table (not shown), a Z-table (not shown), an imaging device 22, a displacement sensor 25, and a control device 50.

[0029] In this embodiment, before the dicing process, a calibration map is created that reflects the undulations on the surface of the work table 12. In addition, before the dicing process, the tip shape of the blade 18 is determined. Then, when the dicing process is performed, the height of the blade 18 is controlled so that the cutting depth into the dicing tape T is constant based on the calibration map, the determination result of the tip shape of the blade 18, and the cutting mark formation rate described later.

[0030] The X-table 16 is provided on the upper surface of an X-base (not shown). The X-table 16 is configured to be movable in the X-direction by an X-drive unit (not shown) including a motor, a ball screw, etc. The θ-table 14 is placed on the X-table 16, and the work table 12 is attached to the θ-table 14. The θ-table 14 is configured to be rotatable in the θ-direction (rotation direction about the Z-axis) by a rotation drive unit (not shown) including a motor, etc.

[0031] The Y table is provided on the side of a Y base (not shown). The Y table is configured to be movable in the Y direction by a Y drive unit (not shown) including a motor, a ball screw, etc. A Z table (not shown) is attached to the Y table. The Z table is configured to be movable in the Z direction by a Z drive unit (not shown) including a motor, a ball screw, etc. A high-frequency motor-integrated spindle 20 with a blade 18 attached to the tip is fixed to the Z table.

[0032] With this configuration, the blade 18 is indexed in the Y direction and cuts in the Z direction. The work table 12 is rotated in the θ direction and cuts in the X direction.

[0033] The spindle 20 is rotated at a high speed, for example, of 30,000 rpm to 60,000 rpm.

[0034] The blade 18 is a cutting blade formed in a thin disk shape. As the blade 18, an electroplated blade in which diamond abrasive grains or CBN (Cubic form of Boron Nitride) abrasive grains are electroplated with nickel, or a resin blade bonded with resin is used. The dimensions of the blade 18 are selected according to the processing contents, but when dicing a normal semiconductor wafer as the workpiece W, a blade with a diameter of about 50 mm and a thickness of about 30 μm is used.

[0035] When creating the calibration map, the work table 12 adsorbs and holds a calibration workpiece. As the calibration workpiece, it is preferable to use a workpiece (e.g., a silicon wafer) having a uniform thickness and a planar shape that is substantially the same as or larger than the workpiece W to be processed. The calibration workpiece may be adsorbed and held on the surface of the work table 12 in a state where it is attached to the same dicing tape T as that used for dicing the workpiece W to be processed.

[0036] The displacement sensor 25 measures the shape (irregularities) of each position on the surface of the calibration workpiece while the calibration workpiece is held by suction on the worktable 12. As the displacement sensor 25, for example, a laser displacement sensor, an optical or contact type displacement sensor, or a TOF (Time of Flight) camera can be used. The displacement sensor 25 is movable relative to the worktable 12. The displacement sensor 25 may be attached to the Y table together with the spindle 20, or a separate drive mechanism for moving the displacement sensor 25 in the X, Y, and Z directions may be provided.

[0037] Data on the shape of the surface of the calibration workpiece measured by the displacement sensor 25 is input to a map creation unit 58 of the control device 50. The map creation unit 58 creates calibration map data by, for example, calculating the Z coordinate (actual measurement value) of each position on the surface of the worktable 12 when the surface of the worktable 12 (design value) is set to the XY plane (Z=0), and stores the data in the memory unit 54.

[0038] Next, a description will be given of the determination of the tip shape of the blade 18. When determining the tip shape of the blade 18, a groove is formed by the blade 18 in the blade determination workpiece W0 that is suction-held on the sub-table 13. Then, an image of this groove is captured by the imaging device 22, and the tip shape of the blade 18 is determined based on the planar shape of the groove.

[0039] The sub-table 13 is fixed by a holding member (arm) near the work table 12 and is movable integrally with the work table 12. The sub-table 13 adsorbs and holds the blade evaluation workpiece W0.

[0040] The imaging device 22 is disposed at a position opposite to the work table 12. The imaging device 22 captures an image of the surface of the workpiece W in order to determine the tip shape of the blade 18, align the workpiece W, and evaluate the machining state (kerf check). The imaging device 22 is an example of an imaging device (alignment camera) of the present invention.

[0041] The imaging device 22 is composed of a microscope, a camera, etc., and can capture images of the surface of the workpiece W at high magnification (e.g., 8.0x) or low magnification (e.g., 1.0x) by switching the lens of the microscope, etc. An area sensor camera is used as the camera.

[0042] The imaging device 22 is fixed to the spindle 20 via a holding member 24, and is movable in the Y and Z directions together with the spindle 20. Two stages may be provided to separately control the positions of the microscope of the imaging device 22 and the spindle 20. In this case, a drive shaft for the microscope is provided in addition to the drive shaft for the spindle 20, and the spindle 20 and the microscope are moved separately along their respective drive shafts.

[0043] When determining the tip shape of the blade 18, the Z table moves the blade 18 in the -Z direction relative to the blade determination workpiece W0 adsorbed and held on the sub-table 13. Then, the tip (cutting edge) of the blade 18 is brought into contact with the blade determination workpiece W0 substantially perpendicularly to form a groove (kerf) of a predetermined depth that does not penetrate the blade determination workpiece W0 (chop cut or chop processing). After that, the Z table moves the blade 18 in the +Z direction. During this time, the relative position of the sub-table 13 with respect to the blade 18 remains unchanged. Note that the relative position may be corrected so that the relative position of the sub-table 13 with respect to the blade 18 is always constant according to the temperature characteristics of both the blade 18 and the sub-table 13.

[0044] The imaging device 22 includes a light projecting unit that projects light onto an object to be imaged, projects light onto the blade determination workpiece W0, and receives reflected light from the blade determination workpiece W0 to capture a planar image of the kerf. This planar image of the kerf is input to the control unit 56, which determines the tip shape of the blade 18. Here, the blade determination workpiece W0 is a workpiece with a mirror-finished surface (mirror workpiece) or a workpiece with a high surface reflectance such as a glass plate. This makes the outline of the kerf clear due to the difference in reflectance between the surface of the blade determination workpiece W0 and the kerf, making it possible to accurately determine the tip shape of the blade 18. The control unit 56 and the imaging device 22 are an example of a blade shape determination unit of the present invention.

[0045] During dicing, the work table 12 adsorbs and holds the work W to be processed. The work W is attached to a frame F via a dicing tape T having an adhesive on its surface, and is adsorbed and held on the work table 12. The frame F to which the dicing tape T is attached is held by a frame holding means (not shown) disposed on the work table 12.

[0046] Fig. 2 is a plan view showing a workpiece W to be processed. As shown in Fig. 2, processing lines (planned division lines) S are formed in a lattice pattern on the surface of the workpiece W, and devices are formed in each of a plurality of regions (device formation regions) C partitioned by these processing lines S.

[0047] The control device 50 controls the operation of each part of the dicing device 10. The control device 50 is realized by a general-purpose computer such as a personal computer or a microcomputer.

[0048] The control device 50 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk, etc. In the control device 50, various programs such as a control program stored in the ROM are loaded into the RAM, and the programs loaded into the RAM are executed by the CPU, thereby realizing the functions of the various parts shown in the control device 50 in FIG.

[0049] The control device 50 functions as a cutting mark detection unit 52, a memory unit 54, a map creation unit 58, and a control unit 56.

[0050] The control unit 56 controls the operation of each unit of the control device 50. Specifically, the control unit 56 controls the cutting feed in the X direction of the work table 12 via the X drive unit, and the rotation in the θ direction of the work table 12 via the θ drive unit. The control unit 56 also controls the index feed in the Y direction of the spindle 20 via the Y drive unit, and the incision feed in the Z direction of the spindle 20 via the Z drive unit. The control unit 56 also controls the rotation operation of the spindle 20 and the imaging operation of the imaging device 22.

[0051] The storage unit 54 stores various data necessary for the operation of the dicing device 10. The various data stored in the storage unit 54 include data related to the workpiece W, data related to alignment, and the thickness of the dicing tape T. For example, the data related to the workpiece W includes the product number, material, external dimensions, thickness, chip size, etc. The various data stored in the storage unit 54 also includes data on a calibration map and data on the determination result of the tip shape of the blade 18. The various data stored in the storage unit 54 further includes a cutting mark formation rate Q and a correction table (see FIG. 9), which will be described later.

[0052] The cutting mark detection unit 52 receives image data captured by the imaging device 22 during dicing, and detects cutting mark information, which will be described later, by image processing or the like.

[0053] [Function of dicing device 10] Next, the operation of the dicing device 10 thus configured will be described.

[0054] First, the workpiece W to be processed, which is attached to the frame F via the dicing tape T, is transported by a transport means (not shown) and placed on the worktable 12. The workpiece W placed on the worktable 12 is imaged by the imaging device 22, and an alignment operation is started to align the workpiece W and the blade 18 relative to each other.

[0055] When the alignment operation is completed, the spindle 20 starts to rotate the blade 18, and cutting water and cooling water are supplied from various nozzles (not shown) provided on a wheel cover (not shown) that covers the blade 18. In this state, the work table 12 is fed for cutting in the X direction, and the spindle 20 is fed for cutting in the Z direction, so that the work W is diced along the processing line S. The spindle 20 is indexed in the Y direction for each line processed, and when processing in one direction is completed, the work table 12 rotates 90 degrees and the work W is diced into a lattice pattern.

[0056] In this embodiment, before the dicing process of the workpiece W to be processed, a calibration map is created and the tip shape of the blade 18 is determined. During the dicing process of the workpiece W, a cutting mark detection operation and a blade height correction operation, which will be described later, are performed for each processing line S.

[0057] In this embodiment, the cutting mark detection operation and the blade height correction operation described later are performed for each processing line S, but this is not limited to the above, and they may be performed for every number of processing lines specified by the user (for example, every five processing lines). Also, they may be performed for processing lines S specified by the user (for example, the first, fifth, seventh, and other processing lines S).

[0058] (Creating a calibration map) Next, the creation of the calibration map will be described.

[0059] In this embodiment, the shape (unevenness) of the surface of the work table 12 on which the workpiece W to be processed is placed is measured in advance to create a calibration map. Then, the height of the blade 18 is controlled using this calibration map. This makes it possible to make the cutting depth of the blade 18 into the dicing tape T constant.

[0060] When creating a calibration map, the shape (unevenness) at each position on the surface of the calibration workpiece held by suction on the worktable 12 is measured while scanning the displacement sensor 25 in the X and Y directions. At this time, the scanning of the displacement sensor 25 in the X and Y directions is performed by the X-table 16 and the Y-table.

[0061] The map creation unit 58 determines the height position (Z coordinate) of the surface of the calibration work from the detection signal output from the displacement sensor 25. Then, the map creation unit 58 subtracts the thickness of the calibration work from the height position (Z coordinate) of the surface of the calibration work to calculate the height position (Z coordinate) of each position on the surface of the work table 12, and creates a calibration map that indicates the shape of each position on the surface of the work table 12.

[0062] Fig. 3 is a diagram showing an example of a calibration map. In the example shown in Fig. 3, the shape of each position on the surface of the work table 12 is expressed as the Z coordinate of each position on the surface of the work table 12 when the work table 12 is on the XY plane (Z=0).

[0063] In this embodiment, a calibration workpiece having substantially the same shape as the workpiece W to be processed or a calibration workpiece larger than the workpiece W to be processed is used, and a calibration map of the entire surface on which the calibration workpiece is adsorbed and held is created while scanning the displacement sensor 25 in the XY directions. Then, the height of the blade 18 relative to the workpiece W to be processed is controlled using this calibration map (see FIG. 11). This makes it possible to control the height of the blade 18 in accordance with the shape of the surface of the work table 12 on which the workpiece W to be processed is adsorbed and held.

[0064] (Determining the blade tip shape) Next, the determination of the tip shape of the blade 18 will be described.

[0065] When the blade 18 is worn, the blade 18 cuts the workpiece W to be processed, and the blade 18 becomes thinner in the annular cutting edge portion formed on the blade 18, or the blade 18 becomes smaller in diameter. Then, the amount of cutting on the back side (the surface to which the dicing tape T is attached) of the workpiece W to be processed decreases. For this reason, if the height control is performed in the same manner as for the blade 18 before the wear, the workpiece W is cut insufficiently due to the reduction in the amount of cutting on the back side of the workpiece W, and the back side of the workpiece W is likely to be chipped or cracked (chipping). Therefore, in this embodiment, the tip shape of the blade 18, that is, the shape of the outer periphery including the outer periphery of the cutting edge portion of the blade 18, is determined before the dicing process. Then, the height of the blade 18 during the dicing process is controlled based on the determination result of the tip shape of the blade 18 in addition to the calibration map. This makes it possible to prevent chipping caused by the wear of the blade 18.

[0066] The tip shape of the blade 18 is determined by forming a groove (kerf) using the blade 18 on the surface of the blade determination workpiece W0 that is suction-held on the sub-table 13. Then, the control unit 56 captures an image of the kerf with the imaging device 22, and determines the tip shape of the blade 18 based on the planar shape of the captured kerf.

[0067] Specifically, when the blade 18 is not worn, the variation in the kerf width along the length of the kerf is small, and both ends of the kerf have a generally rectangular shape (see kerf C1 in FIG. 4). On the other hand, when the blade 18 is worn, the thickness of the cutting edge of the blade 18 decreases, and the kerf width narrows toward both ends of the kerf, forming a triangular shape. As the blade 18 is worn, the width of both ends of the kerf becomes narrower and the angle of both ends of the kerf becomes smaller (see kerfs C2 and C3 in FIG. 4).

[0068] The tip shape of the blade 18 may also be determined by measuring the kerf depth using the displacement sensor 25 or the like. When the blade 18 is not worn, the variation in the kerf depth in the width direction of the kerf is small. In contrast, as the blade 18 wears more, the thickness of the cutting edge portion of the blade 18 becomes thinner or the diameter of the blade 18 decreases, so that the variation in the kerf depth in the width direction of the kerf becomes larger and the kerf depth becomes shallower.

[0069] In this embodiment, the tip shape of the blade 18 is determined by utilizing the characteristics of the kerf formed in the blade determination workpiece W0. The tip shape of the blade 18 can be determined by applying, for example, the blade diagnosis method described in JP 2017-164843 A. The method of determining the tip shape of the blade 18 is not limited to using an image of the kerf. For example, it is also possible to photograph the tip part including the outer peripheral end of the cutting edge part of the blade 18 from a direction parallel to the blade 18 using a camera, and to determine the tip shape of the blade 18 by analyzing the image. For example, images of the tip part of the blade 18 may be stored, and the tip shape of the blade 18 may be determined from the change over time in the image of the tip part of the blade 18.

[0070] Fig. 4 is a plan view showing the planar shape of the kerf. Fig. 5 is a table showing an example of the amount of correction for the height of the blade 18 for each determination result of the tip shape of the blade 18.

[0071] 4 has a substantially rectangular planar shape at both ends, minimizing the amount of wear of the blade 18. In this case, as shown in FIG 5, the amount of cutting of the blade 18 into the dicing tape T is increased by 5 μm.

[0072] On the other hand, the kerf indicated by reference symbol C3 in Fig. 4 has a planar shape at both ends that is a substantially triangular shape with acute angles, and the amount of wear of the blade 18 is maximum. In this case, as shown in Fig. 5, the amount of cutting of the blade 18 into the dicing tape T is increased by 15 µm.

[0073] 4, the planar shape of both ends is a roughly triangular shape with acute angles, but the angles of both ends are smaller than those of C3, and the amount of wear of the blade 18 is intermediate between the examples of C1 and C3. In this case, as shown in FIG. 5, the amount of cutting of the blade 18 into the dicing tape T is increased by 7.5 μm.

[0074] In this embodiment, the greater the amount of wear of the blade 18, the lower the height of the blade 18 during dicing processing, and the greater the amount of cut into the dicing tape T. This makes it possible to prevent chipping caused by wear of the blade 18.

[0075] It is not necessary to create the calibration map and determine the tip shape of the blade 18 every time a dicing process is performed, and may be performed, for example, every time a predetermined number of dicing processes are performed. Also, since wear of the blade 18 is considered to occur more easily than changes in the shape of the surface of the work table 12, the calibration map may be created less frequently than the determination of the tip shape of the blade 18.

[0076] (Cutting mark detection operation) Next, the cutting mark detection operation will be described.

[0077] FIG. 6 is a schematic diagram showing how the workpiece W is diced.

[0078] 6, in this embodiment, dicing is performed while the blade 18 moves relatively to the workpiece W from a cutting start position P1 on one side to a cutting end position P4 on the other side, sandwiching the workpiece W. At this time, a cutting groove 26 is formed in the workpiece W, and cutting marks 28 caused by the blade 18 are formed in a surface region R of the dicing tape T to which the workpiece W is not attached (hereinafter referred to as the "dicing tape region R").

[0079] For example, when the cutting marks 28 in the dicing tape region R are generally short and choppy (see FIG. 6), or when there are no cutting marks 28 at all, the blade 18 makes shallow cuts. In this case, the blade 18 does not cut sufficiently into the workpiece W, which can cause poor cutting.

[0080] On the other hand, if the cutting marks 28 in the dicing tape region R are long and continuous overall, the blade 18 makes deep cuts. In this case, the blade 18 may become clogged and lose its sharpness.

[0081] After much investigation, the inventors found that in order to stabilize the processing quality, it is sufficient to correct the height (position in the Z direction) of the blade 18 based on the cutting mark formation rate Q in the dicing tape region R. Here, the cutting mark formation rate Q refers to the proportion of the region (length in the cutting feed direction) in the dicing tape region R where the cutting marks 28 are formed to the whole (total length of the dicing tape region R in the cutting feed direction).

[0082] In the cutting mark detection operation in this embodiment, the dicing tape region R is imaged by the imaging device 22.

[0083] Fig. 7 is a schematic diagram showing how the imaging device 22 images the dicing tape region R. As shown in Fig. 7, the imaging device 22 images multiple locations of the dicing tape region R at high magnification while shifting its position relative to the dicing tape region R in the X direction, and divides the dicing tape region R into multiple divided images and images the entire region. The image data captured by the imaging device 22 is output to the control device 50. The imaging device 22 may also image a wide range of the dicing tape region R at once at low magnification.

[0084] In this embodiment, an area sensor camera is used as the camera constituting the imaging device 22, but the present invention is not limited to this, and for example, a line sensor camera may be used.

[0085] Fig. 8 is a schematic diagram showing how the line sensor camera 30 captures an image of the dicing tape area R. As shown in Fig. 8, the line sensor camera 30 has a plurality of light receiving elements (not shown) arranged in a row in the Y direction, and captures an image of the entire dicing tape area R while scanning in the X direction.

[0086] The cutting mark detection unit 52 performs image processing using a known method on the image data captured by the imaging device 22 to detect the length (length in the cutting feed direction) of the cutting marks 28 formed in the dicing tape region R. In addition, the cutting mark detection unit 52 calculates the cutting mark formation rate Q in the dicing tape region R based on the detected length of the cutting marks 28.

[0087] Here, a method for calculating the cutting mark formation rate Q in the dicing tape region R will be described.

[0088] In Figure 6, when the blade 18 moves relative to the workpiece W from the cutting start position P1 to the cutting end position P4, the position where the blade 18 starts cutting into the workpiece W is the work entry position P2, and the position where the blade 18 ends cutting into the workpiece W is the work exit position P3.

[0089] At this time, cutting marks 28 are formed in a dicing tape region R1 between the cutting start position P1 and the work entry position P2, and in a dicing tape region R2 between the work exit position P3 and the cutting end position P4.

[0090] Moreover, the total lengths of the dicing tape regions R1 and R2 in the cutting feed direction (X direction) are respectively designated as L1 and L2, and the sums of the lengths of the cutting marks 28 formed in the dicing tape regions R1 and R2 are respectively designated as l1 and l2. For example, as shown in Fig. 6, when a plurality of cutting marks 28 are formed in the dicing tape region R1, the sum of the lengths of the cutting marks 28 is designated as l1. The same applies to the dicing tape region R2.

[0091] The cutting mark detection unit 52 calculates the cutting mark formation rate Q by the following formula (1). This cutting mark formation rate Q is stored in the storage unit 54 in association with the processing line information (processing line number, etc.) when the cutting mark 28 was formed. The cutting mark formation rate Q is expressed in %.

[0092] Q={(l1+l2) / (L1+L2)}×100 ···(1) (Blade height correction operation) Next, the blade height correction operation will be described.

[0093] In the blade height correction operation, the control unit 56 acquires the cutting mark formation rate Q of the reference line from the memory unit 54. The reference line is the processing line S on which dicing processing was performed immediately before the current processing line S, and the cutting mark formation rate Q has already been calculated by the above-mentioned cutting mark detection operation.

[0094] The control unit 56 further determines a blade height correction amount G corresponding to the cutting mark formation rate Q of the reference line according to the correction table (see FIG. 9) stored in the storage unit 54. Then, the control unit 56 controls the height (Z direction position) of the blade 18 based on the determined blade height correction amount G.

[0095] (Correction table) FIG. 9 is a diagram showing an example of the correction table. As shown in FIG. 9, the correction table shows the correspondence relationship between the cutting mark formation rate Q and the blade height correction amount G. This correction table also includes the target cutting mark formation rate (target formation rate) and its allowable range (target formation rate allowable range). Each numerical value in the correction table can be appropriately set by the user via an operation unit (not shown) connected to the control device 50. In addition, when the blade height correction amount G is a positive value, it indicates a correction in the direction in which the cutting depth into the workpiece W becomes deeper from the set value, and when it is a negative value, it indicates a correction in the direction in which the cutting depth into the workpiece W becomes shallower from the set value.

[0096] (Specific operation example) Fig. 10 is a diagram showing a specific operation example in this embodiment. Fig. 11 is a diagram showing the trajectory of the tip (-Z side end) of the blade 18. Note that, in order to simplify the explanation, a case will be explained in which dicing is performed on four processing lines S1 to S4 along the cutting feed direction (X direction) in the order of line numbers.

[0097] As shown in Fig. 10, first, dicing is performed on the first processing line S1. In this case, since there is no reference line, the control unit 56 sets the blade height correction amount G to 0 and does not correct the height of the blade 18, leaving it at the set value. Then, dicing is started from the cut side of the workpiece W to be processed.

[0098] When the blade 18 reaches the workpiece W to be processed, the control unit 56 performs dicing while correcting the height of the blade 18 based on the calibration map and the result of the determination of the tip shape of the blade 18. Reference numeral 18T in FIG. 11 indicates the trajectory of the tip of the blade 18. Specifically, as shown in FIG. 11, the control unit 56 detects that the cutting edge of the blade 18 has come into contact with the upper end of the workpiece W to be processed based on the change in torque applied to the spindle 20 or the like. The control unit 56 may detect that the cutting edge of the blade 18 has come into contact with the upper end of the workpiece W to be processed based on the positional relationship between the workpiece W to be processed and the blade 18 detected by the imaging device 22 or a position sensor or the like. Then, the blade 18 is gradually pushed down to the -Z side while scanning in the X direction. Then, dicing is performed while controlling the position of the blade 18 so that the height position is the result of adding the correction amount of the height of the blade 18 based on the calibration map and the correction amount based on the result of the determination of the tip shape of the blade 18 (see FIG. 5) to the blade height correction amount G.

[0099] Next, when the control unit 56 detects that the blade 18 has left (cut through) the workpiece W to be processed, it gradually raises the blade 18 to the +Z side and transitions to height control based only on the blade height correction amount G (G=0 in the first processing line S1). Here, the cut-through can also be detected based on a change in the torque applied to the spindle 20 or the positional relationship between the workpiece W to be processed and the blade 18.

[0100] The cutting mark detection unit 52 calculates the cutting mark formation rate of the first processing line S1 (23% in this example) based on image data captured by the imaging device 22 on the cut-out side of the workpiece W to be processed, and stores the calculated value in the memory unit 54.

[0101] Next, the dicing process is performed on the second processing line S2. In this case, the control unit 56 acquires the cutting mark formation rate Q (23%) of the first processing line S1, which is the reference line, from the memory unit 54. Then, the control unit 56 determines the blade height correction amount G to be +0.006 mm, controls the height of the blade 18 according to the blade height correction amount G, and starts the dicing process from the cut side of the workpiece W to be processed.

[0102] When the blade 18 reaches the workpiece W to be processed, the blade 18 is gradually pushed down to the -Z side while being scanned in the X direction. Then, dicing is performed while controlling the position of the blade 18 so that the height position is the sum of the blade height correction amount G and the correction amount of the blade 18 based on the calibration map and the correction amount based on the determination result of the tip shape of the blade 18 (see FIG. 5). When the control unit 56 detects that the blade 18 has left (cut through) the workpiece W to be processed, the control unit 56 gradually pulls the blade 18 up to the +Z side and transitions to height control using only the blade height correction amount G.

[0103] The cutting mark detection unit 52 calculates the cutting mark formation rate (78% in this example) of the second processing line S2 based on image data captured by the imaging device 22 on the cut-through side (+X side) of the workpiece W to be processed, and stores the calculated value in the memory unit 54.

[0104] Next, dicing is performed on the third processing line S3. In this case, the control unit 56 acquires the cutting mark formation rate (78%) of the second processing line S2, which is the reference line, from the memory unit 54. At this time, since the cutting mark formation rate (78%) exceeds the allowable range (±5%) of the target rate (70%), the control unit 56 determines the blade height correction amount G to be −0.001 mm, controls the height of the blade 18 according to the blade height correction amount G, and starts dicing from the cut side of the workpiece W to be processed.

[0105] When the blade 18 reaches the workpiece W to be processed, similarly to the above case, dicing is performed while controlling the position of the blade 18 so that the height position is obtained by adding the amount of correction for the height of the blade 18 based on the calibration map and the amount of correction based on the determination result of the tip shape of the blade 18 (see FIG. 5) to the blade height correction amount G. When the control unit 56 detects that the blade 18 has left (cut through) the workpiece W to be processed, it transitions to height control using only the blade height correction amount G.

[0106] The cutting mark detection unit 52 calculates the cutting mark formation rate of the third processing line S3 (73% in this example) based on image data captured by the imaging device 22 on the cut-through side (+X side) of the workpiece W to be processed, and stores the calculated value in the memory unit 54.

[0107] Next, dicing is performed on the fourth processing line S4. In this case, the control unit 56 acquires the cutting mark formation rate (73%) of the third processing line S3, which is the reference line, from the memory unit 54. At this time, since the cutting mark formation rate (73%) is within the allowable range (±5%) of the target rate (70%), the control unit 56 determines the blade height correction amount G to be 0 mm, and controls the height of the blade 18 according to the blade height correction amount G. The subsequent control is similar to that of the first to third processing lines S1 to S3, and therefore a description thereof will be omitted.

[0108] In this embodiment, the blade height correction amount of the blade 18 is controlled based on the calibration map, the tip shape of the blade 18, and the cutting mark formation rate, but the present invention is not limited to this. For example, the blade 18 may be offset by a predetermined amount to the -Z side in order to reliably perform dicing processing on the workpiece W regardless of the wear state of the blade 18.

[0109] (flowchart) Fig. 12 is a flowchart showing the flow of the blade height correction operation. As shown in Fig. 12, in this embodiment, prior to the dicing process (step S30), a calibration map is created (step S10) and the tip shape of the blade 18 is determined (step S20).

[0110] (Calibration map creation process) FIG. 13 is a flowchart showing the calibration map creation process.

[0111] First, as shown in FIG. 13, a calibration work is adsorbed and held (placed) on the surface of the work table 12 via a dicing tape T (step S100), and the shape of the surface of the calibration work is measured by the displacement sensor 25.

[0112] Next, the map creation unit 58 calculates the shape of the surface of the work table 12 based on the measurement results of the shape of the surface of the calibration work (step S102). Then, the map creation unit 58 creates data of a calibration map indicating the shape of the surface of the work table 12, and stores it in the memory unit 54 (step S104).

[0113] (Blade shape determination process) FIG. 14 is a flowchart showing the blade shape determination process.

[0114] First, the blade determination workpiece W0 is suction-held on the sub-table 13. Then, the blade 18 is brought into contact with the blade determination workpiece W0 to form a kerf of a predetermined depth on the surface of the blade determination workpiece W0 (step S200).

[0115] Next, the imaging device 22 captures a planar image of the kerf (step S202). The cutting mark detection unit 52 extracts the contour of the kerf from the planar image of the kerf and measures the dimensions of the kerf (step S204). Then, the control unit 56 calculates the shape of the tip of the blade 18 based on the dimensions of the kerf (step S206).

[0116] (Dicing process) FIG. 15 is a flowchart showing the dicing process.

[0117] First, the workpiece W to be machined is suction-held on the surface of the worktable 12. Then, cutting is started from the first machining line S(i) (i=1) (step S300).

[0118] When cutting the processing line S(i), a blade height correction amount G is determined on the cutting side of the workpiece W based on the cutting mark formation rate, and the processing line S(i) is cut while controlling the height of the blade 18 (step S302).

[0119] When it is detected that the blade 18 has reached the workpiece W to be machined (Yes in step S304), the control unit 56 cuts the machining line S(i) while controlling the height of the blade 18 based on the blade height correction amount G determined based on the cutting mark formation rate, as well as the calibration map and the tip shape of the blade 18 (step S306: control step). Then, when it is detected that the blade 18 has cut through the workpiece W (Yes in step S308), the control unit 56 transitions to height control of the blade 18 based on the cutting mark formation rate (step S310).

[0120] Next, the cutting mark detection unit 52 detects cutting mark information on the cut-out side of the processing line S(i) (Yes in step S312, step S314). Then, the cutting mark detection unit 52 calculates the cutting mark formation rate Q in the dicing tape region R based on the detected cutting mark information. Then, the cutting mark detection unit 52 stores the calculated cutting mark formation rate Q in the storage unit 54 in association with information (line information) related to the processing line S.

[0121] Next, i=i+1 is set, and the process moves to the next processing line S(i) (step S316), and cutting is performed (steps S302 to S312). Then, steps S302 to S312 are repeated, and when cutting of all processing lines S(i) (see FIG. 2) in the XY directions is completed (Yes in step S312), the dicing process is terminated.

[0122] [Effects of this embodiment] Next, the effects of this embodiment will be described.

[0123] According to this embodiment, the height of the blade 18 is controlled based on the shape of the surface of the work table 12 on which the work W to be processed is held by suction, and the cutting depth of the blade 18 is adjusted in consideration of the progress of wear of the blade 18. Furthermore, according to this embodiment, the height of the blade 18 is controlled so that the cutting depth into the dicing tape T is constant based on cutting trace information in the dicing tape region R (the surface region of the dicing tape T on which the work W is not attached). This makes it possible to make the cutting depth of the blade 18 into the dicing tape T relatively shallow and constant without being affected by the undulation of the work table 12 and the thickness variation of the dicing tape T, and therefore it is possible to stabilize the processing quality. Furthermore, since the cutting depth of the blade 18 is adjusted in consideration of the progress of wear of the blade 18, it is possible to prevent chipping on the back side of the work W.

[0124] Furthermore, according to this embodiment, the cutting mark detection unit 52 is adapted to detect cutting mark information in the dicing tape region R based on image data captured by the imaging device 22. This imaging device 22 is composed of an alignment camera, and is originally provided in the dicing device 10, so that problems such as complication of the device configuration or increased costs do not occur.

[0125] In this embodiment, the cutting mark information is detected based on image data captured by the imaging device 22, but the present invention is not limited to this, and the cutting mark information may be detected, for example, by using a distance measuring device 32 (see FIG. 16) described later. Also, the cutting mark information may be detected visually.

[0126] Furthermore, when there are a large number of processing lines (for example, 2067 lines), the amount of blade wear until the dicing process of all processing lines S is completed cannot be ignored. Therefore, in the past, it was necessary to perform cutter setting many times during dicing to measure the current amount of blade wear and adjust the height of the blade 18. In contrast, in this embodiment, a cutting mark detection operation is performed for each processing line S during dicing of the workpiece W. Therefore, since the current amount of blade wear can be grasped in real time, there is an advantage that it is not necessary to frequently perform the measurement operation of the amount of blade wear as in the past, and the time until the dicing process is completed can be reduced.

[0127] In addition, in this embodiment, when performing dicing on the current processing line S, the immediately preceding processing line S is used as a reference line, and the blade height correction amount G is determined using the cutting mark formation rate Q of the reference line. However, this is not limited to this, and a processing line S adjacent or close to the current processing line S in time or space may be used as the reference line. The adjacent processing line S means a processing line adjacent to the current processing line S in time or space. The close processing line S means a processing line S that is within a range of several lines (for example, 1 to 5 lines) from the current processing line in time or space. The reference line is not limited to one processing line S, and may be multiple processing lines S. In this case, for example, the blade height correction amount G may be determined based on the average value of the cutting mark formation rate Q corresponding to each of the multiple processing lines S.

[0128] Furthermore, in this embodiment, there is a possibility that the cutting quality of the diced processing lines S (first 1 to 3 lines) may deteriorate until the height of the blade 18 stabilizes. This problem can be solved by performing air cutting several times on the dicing tape T before actually starting the dicing process, and then performing the dicing process after adjusting the height of the blade 18 in advance.

[0129] In addition, in this embodiment, in the cutting mark detection operation, the length of the cutting marks 28 in both the dicing tape area R1 on the cut-in side and the dicing tape area R2 on the cut-out side are measured, but depending on the cutting conditions, the following operation is also possible.

[0130] (For workpieces with high cutting load) Because the blade 18 wears more during the dicing process, only the length of the cutting marks 28 present in the dicing tape region R2, which is the cut-out side, is measured. Because the blade 18 wears more during the dicing process, measuring the length of the cutting marks 28 in the dicing tape region R1, which is the cut-in side, does not provide any reference for correcting the height of the blade 18.

[0131] (If you want to improve overall throughput) Only the cutting marks 28 in the dicing tape area R1 on the cut-in side or the dicing tape area R2 on the cut-out side are measured, and the time required for the cutting mark detection operation is shortened compared to measuring both sides. In this case, since there is no need to leave the cutting marks 28 on the dicing tape T on the side where the cutting marks 28 are not measured, cutting can be performed at the very limit of where the workpiece W can be cut, further shortening the cutting time.

[0132] (When considering the rigidity of dicing tape T) The rigidity of the dicing tape T may change depending on the temperature. Specifically, when the temperature of the environment in which cutting is performed is high, the rigidity of the dicing tape T decreases. If the rigidity of the dicing tape T decreases, when cutting the workpiece W using the blade 18, the blade 18 may push the workpiece W to the -Z side, and cutting may not be performed sufficiently. For this reason, in addition to the above conditions, the amount of pressing down of the blade 18 may be adjusted taking into consideration the temperature dependency of the rigidity of the dicing tape T.

[0133] Specifically, the temperature dependency of the rigidity of the dicing tape T (for example, the relationship between temperature and the amount the workpiece W is pressed in) may be experimentally determined in advance, and the amount the workpiece W is pressed in may be estimated according to the temperature of the environment in which cutting is performed, and the amount by which the blade 18 is pressed down may be added. For example, if the temperature of the environment in which cutting is performed is high, the rigidity of the dicing tape T decreases, so the higher the temperature of the environment in which cutting is performed, the larger the added amount by which the blade 18 is pressed down is made. On the other hand, the lower the temperature of the environment in which cutting is performed, the smaller the added amount by which the blade 18 is pressed down is made.

[0134] [Other embodiments] Fig. 16 is a schematic diagram showing the configuration of a dicing apparatus 10A according to another embodiment. In Fig. 16, components common to Fig. 1 are given the same reference numerals and description thereof will be omitted.

[0135] As shown in FIG. 16, a dicing apparatus 10A according to another embodiment includes a distance measuring device 32 in addition to the configuration of the dicing apparatus 10 according to this embodiment.

[0136] The distance measuring device 32 is disposed at a position opposite to the work table 12. The distance measuring device 32 measures the distance to the surface of the dicing tape region R, which is the measurement object, and is composed of, for example, a laser displacement meter or an interference microscope. The measurement result of the distance measuring device 32 is output to the cutting mark detection unit 52 as distance data.

[0137] Further, the distance measuring device 32 is fixed to the side surface of the imaging device 22, and is movable integrally with the spindle 20 and the imaging device 22 in the Y direction and the Z direction.

[0138] With this configuration, as a cutting mark detection operation performed while the workpiece W is diced, the distance measuring device 32 measures the distance to the dicing tape area R while shifting its position relative to the dicing tape area R in the X direction. The distance data, which is the measurement result of the distance measuring device 32, is output to the cutting mark detection unit 52.

[0139] The cutting mark detection unit 52 generates a height graph showing the change in height (unevenness) in the dicing tape region R based on the distance data acquired from the distance measuring device 32.

[0140] Fig. 17 is a diagram showing an example of a height graph generated by the cutting mark detection unit 52. As shown in Fig. 17, the cutting mark detection unit 52 detects an area in the generated height graph that is lower than a predetermined threshold height (height indicated by a dashed line in Fig. 17) as a cutting mark formation area K (area where the cutting mark 28 is formed). Then, the cutting mark detection unit 52 calculates a cutting mark formation rate Q based on the detected cutting mark formation area K. Subsequent processing is the same as in this embodiment.

[0141] According to another embodiment, cutting mark information in the dicing tape area R (the surface area of ​​the dicing tape T where the workpiece W is not attached) can be detected based on the measurement results of the distance measuring device 32, making it possible to stabilize the processing quality in the same manner as in the present embodiment described above.

[0142] Although an example of the present invention has been described in detail, the present invention is not limited to this example, and various improvements and modifications may be made without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0143] 10... dicing device, 12... work table, 13... sub table, 14... θ table, 16... X table, 18... blade, 20... spindle, 22... imaging device, 24... holding member, 26... cutting groove, 28... cutting mark, 30... line sensor camera, 32... distance measuring device, 50... control device, 52... cutting mark detection unit, 54... memory unit, 56... control unit, 58... map creation unit, 90... blade, 92... cutting groove, W... work, W0... work for blade judgment, T... dicing tape, Q... cutting mark formation rate, G... blade height correction amount

Claims

1. A dicing device that performs dicing by moving a blade and a work table relative to each other while holding a workpiece to be processed on a work table via a dicing tape, a map creation unit that creates a calibration map indicating the shape of the surface of the work table from a measurement result of the shape of the surface of the calibration work held on the work table; a blade shape determination unit that uses the blade to capture an image of a groove formed on a surface of a blade determination workpiece having a higher reflectivity than the surface of the workpiece to be machined, thereby obtaining a planar image of the groove with a clear outline, and determines a tip shape of the blade from the planar image; a control unit that controls the height of the blade when machining the workpiece based on the calibration map, the tip shape of the blade, and a table that indicates a relationship between the tip shape of the blade and a correction amount of the blade height; and A dicing apparatus comprising:

2. The control unit determines a state of wear of the blade from a tip shape of the blade, and reduces the height of the blade as the wear progresses.

2. The dicing apparatus according to claim 1.

3. A cutting mark detection unit is further provided for detecting cutting mark information formed on a surface area of ​​the dicing tape to which the workpiece is not attached, the control unit controls a height of the blade based on the cutting mark information detected by the cutting mark detection unit so that a cutting depth into the dicing tape is constant.

3. The dicing device according to claim 1 or 2.

4. the cutting mark detection unit calculates a cutting mark formation rate in a surface region of the dicing tape based on the cutting mark information; the control unit controls a height of the blade based on the cutting mark formation rate calculated by the cutting mark detection unit so that the cutting mark formation rate falls within a certain range. The dicing apparatus according to claim 3 .

5. A dicing method in which a dicing process is performed by moving a blade and a work table relative to each other while a workpiece to be processed is held on a work table via a dicing tape, comprising: a calibration map creation step of creating a calibration map indicating the shape of the surface of the work table from the measurement results of the shape of the surface of the calibration work held on the work table; a blade shape determination process in which a groove is formed on a surface of a blade determination workpiece having a higher reflectivity than the surface of the workpiece to be machined using the blade to obtain a planar image of the groove with a clear outline, and a tip shape of the blade is calculated from the planar image; a control step of controlling the height of the blade when machining the workpiece based on the calibration map, the tip shape of the blade, and a table showing the relationship between the tip shape of the blade and a correction amount of the blade height; A dicing method comprising:

6. The calibration workpiece has a uniform thickness. The dicing method according to claim 5.

7. The blade evaluation workpiece has a mirror-finished surface or is a glass plate. The dicing method according to claim 5 or 6.

Images