Circuit structure

Abstract

To provide a circuit structure capable of improving heat dissipation property without widening a bus bar or increasing a thickness.SOLUTION: The present invention relates to a circuit structure 100 for a vehicle comprising a relay 3 including a plurality of terminals. The circuit structure comprises an insulation plate 10 in which the relay 3 is mounted on one face, and a first radiator plate 4 provided on the other face of the insulation plate 10. A first through hole 11 in which a first bus bar 21 connected with a first terminal 31 of the relay 3 is stored is formed in the insulation plate 10, and the first bus bar 21 is in contact with the first radiator plate 4.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a circuit structure including a bus bar. [Background technology]

[0002] Conventionally, a circuit structure having a circuit using a bus bar for conducting a relatively large current has been mounted on a vehicle. In recent years, the value of the current used has been increasing along with the expansion of vehicle functions.

[0003] Patent Document 1 discloses a power supply device that includes a relay having openable and closable contacts and an excitation coil that switches the open and closed state of the contacts, electrically connecting the contacts of the relay to a bus bar and equipping the bus bar with a heat dissipation mechanism, thereby allowing the bus bar to serve as both a current path and a heat dissipation path. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-79093 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, as the current used increases, the electrical resistance also increases in proportion to the current value, which leads to an increase in the amount of heat generated in the circuit elements and bus bars. To address this issue, a common approach is to increase the width or thickness of the bus bars in order to improve heat dissipation.

[0006] However, wide bus bars or thick bus bars are difficult to process, making mass production difficult, resulting in high processing costs and low yields. However, the power supply device disclosed in Patent Document 1 does not take such problems into consideration and is unable to solve them.

[0007] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a circuit structure that can improve heat dissipation without increasing the width or thickness of the bus bar. [Means for solving the problem]

[0008] A circuit structure according to an embodiment of the present disclosure is a circuit structure for a vehicle including a circuit element having a plurality of terminals, and includes an insulating plate material having the circuit element mounted on one side thereof, and a first heat dissipation plate material provided on the other side of the insulating plate material, wherein a first through hole is formed in the insulating plate material to accommodate a first bus bar connected to a first terminal of the circuit element, and the first bus bar is in contact with the first heat dissipation plate material. Effect of the Invention

[0009] According to the present disclosure, heat dissipation can be improved without increasing the width or thickness of the bus bar. [Brief description of the drawings]

[0010] [Figure 1] 1 is a perspective view illustrating an example of a circuit structure according to a first embodiment. [Diagram 2] 2 is a perspective view showing the circuit structure of the first embodiment, viewed from the other surface side of the insulating plate material. FIG. [Diagram 3] FIG. 2 is an exploded view of the circuit structure of the first embodiment. [Figure 4] FIG. 2 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 11 is a perspective view illustrating an example of a circuit structure according to a second embodiment. [Figure 6] 11 is a perspective view showing the circuit structure of the second embodiment, viewed from the other surface side of the insulating plate material. FIG. [Figure 7] FIG. 11 is an exploded view of the circuit structure of the second embodiment. [Figure 8] FIG. 11 is a perspective view showing a circuit structure according to a second embodiment with some parts omitted. [Figure 9] FIG. 11 is a perspective view showing a first modified example of the circuit structure of the second embodiment. [Figure 10] FIG. 11 is a perspective view showing a second modified example of the circuit structure of the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] [Description of the embodiment of the present invention] First, embodiments of the present disclosure will be listed and described. In addition, at least some of the embodiments described below may be arbitrarily combined.

[0012] (1) A circuit structure according to an embodiment of the present disclosure is a circuit structure for a vehicle including a circuit element having a plurality of terminals, the circuit element being mounted on one side of an insulating plate material, and a first heat dissipation plate material being provided on the other side of the insulating plate material, the insulating plate material having a first through hole formed therein to accommodate a first bus bar connected to a first terminal of the circuit element, the first bus bar being in contact with the first heat dissipation plate material.

[0013] In this embodiment, the first bus bar is received in the first through hole of the insulating plate, and the first bus bar is in contact with the first heat dissipation plate. Therefore, the heat generated by the circuit element is dissipated through the first terminal and the first bus bar to the first heat dissipation plate. board material is directly transmitted to the

[0014] (2) In a circuit structure according to an embodiment of the present disclosure, a second through hole is formed in the insulating plate material, and the first heat dissipation plate material is exposed from one surface side of the insulating plate material through the second through hole.

[0015] In this embodiment, the first heat dissipation plate is exposed to the outside from one surface side of the insulating plate through the second through hole. Therefore, the heat generated by the circuit element is dissipated to the first heat dissipation plate through the first bus bar. board material and is air-cooled via the second through hole.

[0016] (3) In the circuit structure according to the embodiment of the present disclosure, a recess is formed on the one surface of the insulating plate material, on which a second bus bar that connects to a second terminal of the circuit element is placed.

[0017] In this embodiment, the second bus bar is placed in the recess of the insulating plate, and therefore, heat generated by the circuit element is transferred to the second bus bar via the second terminal, and then transferred to the first heat sink through the bottom of the recess. board material and is dissipated.

[0018] (4) In a circuit structure according to an embodiment of the present disclosure, the second bus bar has a connection through hole used for connecting to the second terminal, a third through hole is formed in the bottom of the recess at a position corresponding to the connection through hole, a rib protrudes from the other surface of the insulating plate along an edge of the third through hole, and the first heat dissipation plate has a mating through hole into which the rib is fitted.

[0019] In this embodiment, the third through hole is formed in the bottom of the recess, and the rib of the third through hole is fitted into the fitting through hole of the first heat dissipation plate material. Therefore, even if a screw is inserted into the connection through hole of the second bus bar to connect the second bus bar and the second terminal, the screw is surrounded by the rib of the third through hole and insulated from the first heat dissipation plate material.

[0020] (5) In the circuit structure according to the embodiment of the present disclosure, the first terminal generates more heat than the second terminal when the circuit element is in operation.

[0021] In this embodiment, in preparation for the first terminal generating more heat than the second terminal during operation of the circuit element, the heat of the first terminal is radiated from the first bus bar to the first heat sink. board material The heat of the second terminal is directly transferred to the second bus bar through the bottom of the recess, and the heat of the second terminal is indirectly transferred to the first heat sink plate material from the second bus bar through the bottom of the recess. Therefore, heat can be dissipated primarily from the first terminal, which generates more heat than the second terminal.

[0022] (6) In the circuit structure according to an embodiment of the present disclosure, the insulating plate material has a fourth through hole formed therein for accommodating a second bus bar connected to a second terminal of the circuit element, the fourth through hole accommodates a second heat dissipation plate material in contact with the second bus bar, and an insulating strip is interposed between the first heat dissipation plate material and the second heat dissipation plate material on the other surface of the insulating plate material.

[0023] In this embodiment, the second bus bar is received in the fourth through hole of the insulating plate, and the second bus bar is in contact with the second heat dissipation plate. Therefore, the heat generated by the circuit element is dissipated through the second terminal and the second bus bar to the second heat dissipation plate. board material The heat is directly transferred to the first heat sink and dissipated. board material and the second heat sink board material is insulated by the insulating strip.

[0024] (7) In the circuit structure according to the embodiment of the present disclosure, when the circuit element is in operation, the first terminal generates more heat than the second terminal, and the first heat dissipation plate material is larger than the second heat dissipation plate material.

[0025] In the present embodiment, the first terminal generates more heat than the second terminal during operation of the circuit element, and the first heat sink transmits heat from the first terminal through the first bus bar. board material The size of the second heat dissipation board material Therefore, heat can be dissipated primarily from the first terminal, which generates more heat than the second terminal.

[0026] (8) In the circuit structure according to the embodiment of the present disclosure, the first heat dissipation plate material is conductive.

[0027] In this embodiment, for example, when the first terminals or the second terminals of a plurality of circuit elements are connected in series, the first heat dissipation plate material is conductive, so that the first terminals or the second terminals can be electrically connected via the first heat dissipation plate material or the second heat dissipation plate material. Therefore, the first bus bar interposed between the first terminals and the first heat dissipation plate material, and the second bus bar interposed between the second terminals and the second heat dissipation plate material can be partially omitted.

[0028] [Details of the embodiment of the present invention] Circuit structures according to embodiments of the present disclosure will be described below with reference to the drawings. Note that the present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0029] (Embodiment 1) 1 is a perspective view illustrating an example of a circuit structure 100 of the first embodiment. The circuit structure 100 is mounted on a vehicle. The circuit structure 100 has, for example, a rectangular insulating plate material 10, and, for example, two relays 3 (circuit elements) are mounted on one surface of the insulating plate material 10. The insulating plate material 10 is made of an insulating resin.

[0030] FIG. 2 is an oblique view showing the circuit structure 100 of embodiment 1 from the other side of the insulating plate material 10, FIG. 3 is an exploded view of the circuit structure 100 of embodiment 1, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1.

[0031] Each relay 3 has a first terminal 31 and a second terminal 32 extending along one surface of the insulating plate 10 and having a rectangular shape. The relay 3 is switched to an ON state when the vehicle is running, and is switched to an OFF state when the vehicle is not running. When the relay 3 is in operation, the first terminal 31 generates more heat than the second terminal 32. A through hole 311 and a through hole 321 are formed at the ends of the first terminal 31 and the second terminal 32, respectively. The relay 3 is fixed to the insulating plate 10 by screws using the first terminal 31 and the second terminal 32.

[0032] The insulating plate material 10 is provided with a bus bar 2 connected to a first terminal 31 and a second terminal 32 of the relay 3. The first terminal 31 is connected to the first bus bar 21, and the second terminal 32 is connected to the second bus bar 22. The first terminals 31 of the two relays 3 are both connected to the first bus bar 21. That is, the insulating plate material 10 is provided with one first bus bar 21 and two second bus bars 22. The first bus bar 21 and the second bus bar 22 are made of a metal plate material with good electrical conductivity. The first bus bar 21 and the second bus bar 22 are made of, for example, copper. Although not shown in FIG. 1, the first bus bar 21 and the second bus bar 22 are electrically connected to other circuit elements or circuits.

[0033] The insulating plate 10 has a first through hole 11 formed therein, penetrating in the thickness direction. The first through hole 11 has a shape corresponding to the shape of the first bus bar 21. The first through hole 11 accommodates the first bus bar 21 from one surface side of the insulating plate 10. That is, one surface of the first bus bar 21 is exposed from one surface of the insulating plate 10. The other surface of the first bus bar 21 is in contact with a first heat dissipation plate 4, which will be described later. Furthermore, first bus bar 21 has through holes 211 formed therein, penetrating first bus bar 21 in the thickness direction, at positions corresponding to through holes 311 of first terminals 31 of each relay 3 (see FIG. 3).

[0034] Further, a second through hole 12 is formed in the insulating plate 10, penetrating the plate in the thickness direction. The second through hole 12 is, for example, rectangular, and is formed in the vicinity of the first terminal 31 of the relay 3. The first heat dissipation plate 4 is exposed from one surface of the insulating plate 10 through the second through hole 12.

[0035] 3, recesses 14 are formed in two locations on one surface of insulating plate 10. Recesses 14 are shaped to correspond to the shape of second bus bars 22, and second bus bars 22 are housed in recesses 14. Further, each second bus bar 22 has a through hole 221 (connection through hole) formed at a position corresponding to through hole 321 of second terminal 32 of each relay 3, which passes through second bus bar 22 in the thickness direction.

[0036] Further, a third through hole 13 is formed at the bottom of each recess 14 at a position facing the through hole 221 of the second bus bar 22, penetrating the insulating plate 10 in the thickness direction. A rib 15 is provided around the third through hole 13 on the other side of the insulating plate 10 (see Figs. 2 and 4). In other words, the rib 15 has a cylindrical shape. The through hole 321 of the relay 3, the through hole 221 of the second bus bar 22, and the third through hole 13 (rib 15) of the recess 14 are aligned in the thickness direction of the insulating plate 10, and the diameter of the third through hole 13 is the largest, being larger than the diameter of a nut 51 described later.

[0037] As shown in FIG. 2, a recess 18 is formed over the substantially entire other surface of the insulating plate 10, and the first heat dissipation plate 4 is provided in the recess 18. The first heat dissipation plate 4 is rectangular in shape following the insulating plate 10 and slightly smaller than the insulating plate 10. That is, the first heat dissipation plate 4 covers most of the other surface of the insulating plate 10, and one surface of the first heat dissipation plate 4 is exposed from the other surface of the insulating plate 10. As described above, a part of the other surface of the first heat dissipation plate 4 is exposed from the one surface of the insulating plate 10 through the second through hole 12. The first heat dissipation plate 4 is electrically conductive and has excellent thermal conductivity, and is made of the same material (copper) as the first bus bar 21 and the second bus bar 22, for example.

[0038] The first heat dissipation plate material 4 has a through hole 41 (fitting through hole) penetrating in the thickness direction at a position corresponding to the third through hole 13 of the recess 14. The through hole 41 has a larger diameter than the third through hole 13, and the rib 15 of the third through hole 13 is fitted into the through hole 41.

[0039] As described above, the other surface of first heat dissipation plate 4 is in contact with first bus bar 21. In first heat dissipation plate 4, at a position corresponding to through hole 211 of first bus bar 21, through hole 42 is formed penetrating in the thickness direction.

[0040] During assembly, a screw 50 is inserted from the through hole 311 of the first terminal 31 of each relay 3, passes through the through hole 211 of the first bus bar 21 and the through hole 42 of the first heat dissipation plate material 4, and is screwed into the nut 51. Another screw 50 is inserted from the through hole 321 of the second terminal 32 of each relay 3, passes through the through hole 221 of the second bus bar 22, the third through hole 13 of the recess 14, and the rib 15, and is screwed into the nut 51.

[0041] At this time, the first terminal 31 of the relay 3 is electrically connected to the first bus bar 21, and the first bus bar 21 is in contact with the first heat dissipation plate material 4. The second terminal 32 of the relay 3 is electrically connected to the second bus bar 22, and the insulating plate material 10 (recess 14) is interposed between the second bus bar 22 and the first heat dissipation plate material 4. As described above, the first bus bar 21 is in contact with the first heat dissipation plate material 4, and the second bus bar 22 is in contact with the nut 51, but as shown in Figures 2 and 4, the nut 51 related to the second bus bar 22 is positioned within the rib 15. Therefore, a sufficient spatial distance and creepage distance can be secured between the nut 51 and the first heat dissipation plate material 4, and they are insulated from each other.

[0042] In the circuit structure 100 of embodiment 1 having the above-described configuration, when the relay 3 generates heat during operation, the heat is transferred to the first bus bar 21 and the second bus bar 22 via the first terminal 31 and the second terminal 32, respectively.

[0043] The heat transferred to the first busbar 21 is transferred to the first heat dissipation plate 4 because the first busbar 21 is in contact with the first heat dissipation plate 4, and is air-cooled from one surface of the first heat dissipation plate 4. The heat transferred to the second busbar 22 is transferred to the first heat dissipation plate 4 via the insulating plate 10 (the bottom of the recess 14), and is air-cooled from one surface of the first heat dissipation plate 4.

[0044] As described above, the first heat dissipation plate 4 has excellent thermal conductivity, and one surface covering most of the insulating plate 10 is exposed to the outside, so that the heat of the relay 3 can be dissipated efficiently.

[0045] Furthermore, a portion of the heat transferred to first heat dissipation plate 4 via first bus bar 21 and second bus bar 22 is also air-cooled from the other surface of first heat dissipation plate 4 via second through-hole 12 .

[0046] In the circuit structure 100 of the first embodiment, the first terminal 31 is in direct contact with the first heat dissipation plate material 4 via the first bus bar 21, and the second terminal 32 is in indirect contact with the first heat dissipation plate material 4 via the insulating plate material 10. This makes it possible to focus on dissipating heat from the first terminal 31, which generates more heat than the second terminal 32 during operation of the relay 3, and thus makes it possible to dissipate heat from the relay 3 more efficiently.

[0047] As a result, it is no longer necessary to increase the width or thickness of the bus bar in order to improve the heat dissipation of the bus bar, which increases the number of mountable bus bars, making it possible to make circuit structure 100 more compact, and reducing the manufacturing cost of circuit structure 100.

[0048] In the above, the first heat dissipation plate 4 is provided in the recess 18 formed on the other surface of the insulating plate 10, but the present invention is not limited to this. For example, the first heat dissipation plate 4 may be provided on the other surface of the insulating plate 10 by using insert molding.

[0049] Further, in the above, an example has been described in which one second through hole 12 is formed, but the present invention is not limited to this, and a plurality of second through holes may be provided.

[0050] (Embodiment 2) FIG. 5 is a perspective view illustrating an example of a circuit structure 100 of embodiment 2, FIG. 6 is a perspective view showing the circuit structure 100 of embodiment 2 from the other side of the insulating plate material 10, and FIG. 7 is an exploded view of the circuit structure 100 of embodiment 2.

[0051] As in the first embodiment, the circuit structure 100 of the second embodiment has a rectangular insulating plate 10, and two relays 3 are mounted on one surface of the insulating plate 10. Each relay 3 has a first terminal 31 and a second terminal 32. The first terminal 31 is connected to the first bus bar 21, and the second terminal 32 is connected to the second bus bar 22. The insulating plate 10 is provided with one first bus bar 21 and two second bus bars 22, and the first terminals 31 of the two relays 3 are both connected to the first bus bar 21, and the second terminals 32 are each connected to a different second bus bar 22.

[0052] In the circuit structure 100 of the second embodiment, the first bus bar 21 has a bent portion 212 in the middle, and the bent portion 212 is separated from one surface of the insulating plate 10. That is, the insulating plate 10 is formed with a first through hole 11 penetrating in the thickness direction, and the first bus bar 21 is accommodated in the first through hole 11 from one surface side of the insulating plate 10, but the bent portion 212 is not accommodated in the first through hole 11. More specifically, the bent portion 212 has a substantially inverted U-shape, and a central portion is spaced a predetermined distance from one surface of the insulating plate 10. The portion of the first bus bar 21 accommodated in the first through hole 11 is in contact with the other surface of the first heat dissipation plate 4A.

[0053] Further, a second through hole 12 is formed in the insulating plate 10 so as to penetrate therethrough in the thickness direction, and the first heat dissipation plate 4A is exposed from one surface of the insulating plate 10 through the second through hole 12.

[0054] Furthermore, two fourth through holes 17 are formed on one surface of the insulating plate 10. The fourth through holes 17 have a shape corresponding to the shape of the second bus bars 22. The second bus bars 22 are respectively housed in the fourth through holes 17 from one surface side of the insulating plate 10. As a result, one surface of the second bus bars 22 is exposed from one surface of the insulating plate 10, and the other surface is in contact with a second heat dissipation plate 4B described later.

[0055] 6, a recess 18A is formed on the other surface of the insulating plate 10, and a first heat dissipation plate 4A is provided within the recess 18A. The recess 18A has a shape following the shape of the first heat dissipation plate 4A. The recess 18A is provided in a part of the other surface of the insulating plate 10, and one surface of the first heat dissipation plate 4A is exposed from the other surface of the insulating plate 10. That is, since the fourth through hole 17 is opened on the other surface of the insulating plate 10, the recess 18A is formed in a portion where the fourth through hole 17 is not formed.

[0056] Further, the second heat dissipation plate 4B is housed in each of the fourth through holes 17 from the other surface side of the insulating plate 10. The second heat dissipation plate 4B has a shape corresponding to the shape of the fourth through hole 17, and is smaller than the first heat dissipation plate 4A. The second heat dissipation plate 4B has excellent thermal conductivity and is made of the same material (copper) as the first bus bar 21 and the second bus bar 22, for example. One surface of the second heat dissipation plate 4B is exposed from the other surface of the insulating plate 10, and the other surface is in contact with the second bus bar 22. In each second heat dissipation plate 4B, at a position corresponding to the through hole 221 of the second bus bar 22, a through hole 43 is formed penetrating in the thickness direction.

[0057] Furthermore, insulating strips 16 for insulation are provided between the second heat dissipation plate 4B and the first heat dissipation plate 4A and between the second heat dissipation plates 4B on the other surface of the insulating plate 10. In other words, insulating strips 16 are provided around the edge of the fourth through hole 17 on the other surface of the insulating plate 10.

[0058] Fig. 8 is a partially omitted perspective view of the circuit structure 100 of the embodiment 2. For convenience, the relay 3 and the screw 50 are not shown in Fig. 8. In the circuit structure 100 of embodiment 2, as described above, the first bus bar 21 has a bent portion 212 that is a predetermined distance away from one surface of the insulating plate material 10. Therefore, for example, if there is an obstacle (see the dashed line portion in Figure 8) on one surface of the insulating plate material 10, the first bus bar 21 can be assembled by bypassing such obstacle.

[0059] During assembly, a screw 50 is inserted from the through hole 311 of the first terminal 31 of each relay 3, passed through the through hole 211 of the first bus bar 21 and the through hole 42 of the first heat dissipation plate material 4A, and screwed into the nut 51. Another screw 50 is inserted from the through hole 321 of the second terminal 32 of each relay 3, passed through the through hole 221 of the second bus bar 22 and the through hole 43 of the second heat dissipation plate material 4B, and screwed into the nut 51.

[0060] At this time, the first terminal 31 of the relay 3 is electrically connected to the first bus bar 21, and the first bus bar 21 is in contact with the first heat dissipation plate material 4A. In addition, the second terminal 32 of the relay 3 is electrically connected to the second bus bar 22, and the second bus bar 22 is in contact with the second heat dissipation plate material 4B.

[0061] In the circuit structure 100 of embodiment 2 having the above-mentioned configuration, when the relay 3 generates heat during operation, the heat is transferred to the first bus bar 21 and the second bus bar 22 via the first terminal 31 and the second terminal 32, respectively.

[0062] The heat transferred to the first busbar 21 is transferred to the first heat dissipation plate 4A because the first busbar 21 is in contact with the first heat dissipation plate 4A, and is air-cooled from one surface of the first heat dissipation plate 4A. The heat transferred to the second busbar 22 is transferred to the second heat dissipation plate 4B because the second busbar 22 is in contact with the second heat dissipation plate 4B, and is air-cooled from one surface of the second heat dissipation plate 4B. This allows the heat of the relay 3 to be dissipated efficiently. Furthermore, a portion of the heat transferred to first heat dissipation plate 4A via first bus bar 21 and second bus bar 22 is also air-cooled from the other surface of first heat dissipation plate 4A via second through-hole 12.

[0063] In the circuit structure 100 of the second embodiment, the first terminal 31, which generates more heat than the second terminal 32, is connected to the first heat dissipation plate material 4A via the first bus bar 21, and the second terminal 32 is connected to the second heat dissipation plate material 4B via the second bus bar 22. The size of the first heat dissipation plate material 4A is larger than the second heat dissipation plate material 4B. This makes it possible to dissipate heat in a focused manner from the first terminal 31, which generates more heat than the second terminal 32 when the relay 3 is in operation, and thus makes it possible to dissipate heat from the relay 3 more efficiently.

[0064] As a result, it is no longer necessary to increase the width or thickness of the bus bar in order to improve the heat dissipation of the bus bar, and therefore the circuit structure 100 can be made more compact, and the manufacturing costs of the circuit structure 100 can be reduced.

[0065] (Variation 1) Fig. 9 is a perspective view showing a first modified example of the circuit structure 100 of the embodiment 2. For convenience, the relay 3 and the second bus bar 22 are omitted from Fig. 9. As described above, in the circuit structure 100, the first bus bar 21 has a bent portion 212 that is a predetermined distance away from one surface of the insulating plate material 10, and even if an obstacle (see the dotted line portion in Figure 8) is present on one surface of the insulating plate material 10, the first bus bar 21 can be assembled by bypassing such obstacle. In contrast, in circuit structure 100 according to the first modification, first bus bar 21 does not have bent portion 212, and is divided into two portions by removing the portion corresponding to bent portion 212.

[0066] However, as described above, the first heat dissipation plate material 4A is conductive, and both portions of the divided first bus bar 21 are in contact with the first heat dissipation plate material 4A and are electrically connected to the first heat dissipation plate material 4A. Therefore, even if the bent portion 212 is removed and the first bus bar 21 is divided into two, the separated portions are electrically connected via the first heat dissipation plate material 4A, and this does not cause any hindrance.

[0067] Therefore, the circuit structure 100 according to the first modification can accommodate an obstacle (see the dashed line in FIG. 9) present on one surface of the insulating plate 10 with a simpler configuration in which the bent portion 212 is removed.

[0068] (Variation 2) Fig. 10 is a perspective view showing Modification 2 of the circuit structure 100 of the embodiment 2. For convenience, the relay 3 and the second bus bar 22 are omitted from Fig. 10. In the above-mentioned first modification, the case where the circuit structure 100 has a simpler configuration in which the bent portion 212 is eliminated has been described. In contrast, in the circuit structure 100 according to the second modification, the first bus bar 21 does not have the bent portion 212, and is divided into three or more portions. For example, the first bus bar 21 is divided into four portions including portions connected to the first terminals 31 of the relays 3, and the portions are scattered at predetermined intervals. As a result, a predetermined region of the first heat dissipation plate material 4A (see the region surrounded by the dashed line in FIG. 10) is exposed from one surface of the insulating plate material 10 through the first through hole 11.

[0069] However, as described above, the first heat dissipation plate 4A is conductive, and each portion of the first bus bar 21 is in contact with the first heat dissipation plate 4A, so that the first bus bar 21 is also electrically connected to the first heat dissipation plate 4A. Therefore, each portion of the first bus bar 21 is electrically connected to each other via the first heat dissipation plate 4A, and this does not cause any hindrance.

[0070] Therefore, in the circuit structure 100 according to the second modification, the first bus bar 21 is omitted only from the portion corresponding to the exposed region of the first heat dissipation plate material 4A, thereby making it possible to reduce the weight and cost of the circuit structure 100.

[0071] It should be noted that the present invention is not limited to the above description, and the first terminals 31 of the relays 3 may be directly connected to the first heat dissipation plate material 4A, and the first bus bar 21 may be omitted.

[0072] The same parts as those in the first embodiment are given the same reference numerals and detailed description thereof will be omitted.

[0073] The technical features (constituent elements) described in the embodiments 1 and 2 can be combined with each other, and by combining them, new technical features can be formed. The embodiments disclosed herein are illustrative in all respects and should not be considered as limiting. The scope of the present invention is defined by the claims, not by the above meaning, and is intended to include all modifications within the scope and meaning equivalent to the claims. [Explanation of symbols]

[0074] 3 Relay 4,4A 1st heat sink material 4B 2nd heat sink material 10. Insulating plate material 11 First through hole 12 Second through hole 13 Third through hole 14 Recess 15 Ribs 16 Insulation strip 17 4th Through Hole 18 Recess 21 No. 1 bus bar 22 No. 2 bus bar 31 1st terminal 32 2nd terminal 41 Through hole (fitting through hole) 42 Through hole 51 Nut 100 circuit structures 211 Through hole 212 Bend 221 Through hole (connection through hole) 321 Through hole

Claims

1. A circuit structure for a vehicle including a circuit element having a plurality of terminals, an insulating plate material having the circuit element mounted on one surface thereof; a first heat dissipation plate member provided on the other surface of the insulating plate member and configured to dissipate heat from the terminals; a first through hole for receiving a first bus bar connected to a first terminal of the circuit element is formed in the insulating plate; The first bus bar is in direct contact with the first heat sink plate.

2. A second through hole is formed in the insulating plate, The circuit structure according to claim 1 , wherein the first heat dissipation plate is exposed from one surface side of the insulating plate through the second through hole.

3. 3. The circuit structure according to claim 1, wherein the one surface of the insulating plate is formed with a recess in which a second bus bar connected to a second terminal of the circuit element is placed.

4. the second bus bar has a connection through hole used for connection to the second terminal, a third through hole is formed in a bottom of the recess at a position corresponding to the connection through hole; a rib is provided on the other surface of the insulating plate along an edge of the third through hole, 4. The circuit structure according to claim 3, wherein the first heat sink member has a fitting through hole into which the rib is fitted.

5. 5. The circuit structure according to claim 3, wherein the first terminal generates more heat than the second terminal during operation of the circuit element.

6. a fourth through hole for accommodating a second bus bar connected to a second terminal of the circuit element is formed in the insulating plate; a second heat dissipation plate material in contact with the second bus bar is accommodated in the fourth through hole, 3. The circuit structure according to claim 1, wherein an insulating strip is interposed between the first heat dissipation plate material and the second heat dissipation plate material on the other surface of the insulating plate material.

7. When the circuit element is in operation, the first terminal generates more heat than the second terminal; 7. The circuit structure of claim 6, wherein said first heat sink material is larger than said second heat sink material.

8. The circuit structure according to claim 1 , wherein the first heat sink material is electrically conductive.

9. A circuit structure for a vehicle including a circuit element having a plurality of terminals, an insulating plate material having the circuit element mounted on one surface thereof; a first heat dissipation plate member that is accommodated in a recess provided on the other surface of the insulating plate member and dissipates heat from the terminals; a first through hole for receiving a first bus bar connected to a first terminal of the circuit element is formed in the insulating plate; The first bus bar is in direct contact with the first heat sink plate.

10. The insulating plate material has a second through hole formed therein, The circuit structure according to claim 9 , wherein the first heat dissipation plate is exposed from one surface side of the insulating plate through the second through hole.

11. A circuit structure as described in claim 9 or 10, wherein another recess is formed on the one surface of the insulating plate material in which a second bus bar connecting to a second terminal of the circuit element is placed.

12. The second bus bar has a connection through hole used for connection to the second terminal, a third through hole is formed in a bottom of the other recess at a position corresponding to the connection through hole; a rib is provided on the other surface of the insulating plate along an edge of the third through hole, The circuit structure according to claim 11 , wherein the first heat sink material has a fitting through hole into which the rib is fitted.

13. The circuit element according to claim 11, wherein the first terminal generates more heat than the second terminal during operation of the circuit element. Or the circuit structure according to 12.

14. The insulating plate material has a fourth through hole formed therein to accommodate a second bus bar connected to the second terminal of the circuit element, a second heat dissipation plate material in contact with the second bus bar is accommodated in the fourth through hole, 11. The circuit structure according to claim 9, wherein an insulating strip is interposed between the first heat dissipation plate material and the second heat dissipation plate material on the other surface of the insulating plate material.

15. When the circuit element is in operation, the first terminal generates more heat than the second terminal; 15. The circuit structure of claim 14, wherein the first heat sink material is larger than the second heat sink material.

16. A circuit structure described in any one of claims 9 to 15, wherein the first heat dissipation plate material is conductive.

17. A circuit structure for a vehicle including a circuit element having a plurality of terminals, an insulating plate material having the circuit element mounted on one surface thereof; a first heat dissipation plate provided on the other surface of the insulating plate, a first through hole for receiving a first bus bar connected to a first terminal of the circuit element is formed in the insulating plate; the first bus bar is in contact with the first heat sink plate; a recessed portion is formed on the one surface of the insulating plate material, and a second bus bar connected to a second terminal of the circuit element is placed thereon; the second bus bar has a connection through hole used for connection to the second terminal, a third through hole is formed in a bottom of the recess at a position corresponding to the connection through hole; a rib is provided on the other surface of the insulating plate along an edge of the third through hole, The first heat sink material is a circuit structure having a fitting through hole into which the rib is fitted.

18. A circuit structure for a vehicle including a circuit element having a plurality of terminals, an insulating plate material having the circuit element mounted on one surface thereof; a first heat dissipation plate provided on the other surface of the insulating plate, a first through hole for receiving a first bus bar connected to a first terminal of the circuit element is formed in the insulating plate; the first bus bar is in contact with the first heat sink plate; a fourth through hole for accommodating a second bus bar connected to a second terminal of the circuit element is formed in the insulating plate; a second heat dissipation plate material in contact with the second bus bar is accommodated in the fourth through hole, A circuit structure in which an insulating strip is interposed between the first heat dissipation plate material and the second heat dissipation plate material on the other surface of the insulating plate material.

19. The insulating plate material has a second through hole formed therein, 19. The circuit structure according to claim 17, wherein the first heat dissipation plate is exposed from one surface side of the insulating plate through the second through hole.

20. A circuit structure as described in claim 17 or 19, wherein when the circuit element is operating, the first terminal emits more heat than the second terminal.

21. When the circuit element is in operation, the first terminal generates more heat than the second terminal; 20. The circuit structure of claim 18, wherein the first heat sink material is larger than the second heat sink material.

22. A circuit structure described in any one of claims 17 to 21, wherein the first heat dissipation plate material is conductive.

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