Substrate holding mechanism and substrate mounting method

Abstract

To provide a substrate holding mechanism, a substrate placing method, and a substrate releasing method that can suction and hold a warped substrate on a placing board.SOLUTION: A substrate holding mechanism 100 has a placing board 110 on which a substrate is placed, a plurality of holding sections 120 including an upper surface 121 that holds the lower surface of a peripheral edge of the substrate and a lower surface 122 that presses down on the upper surface of the peripheral edge of the substrate placed on the placing board, a protruding section 130 provided on the plurality of holding sections that contacts an edge surface of the substrate placed on the placing board to correct the position of the substrate, a lifting mechanism 140 that raises and lowers the plurality of holding sections, and a horizontal movement mechanism 150 that moves the plurality of holding sections horizontally.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present disclosure relates to a substrate holding mechanism. and How to place the board By law Regarding. [Background technology]

[0002] There is known a stage having a substrate holding surface that suction-holds the bottom surface of a substrate, and the substrate holding surface is provided with suction grooves divided into multiple regions for suctioning a wafer (see, for example, Patent Document 1). In Patent Document 1, after a portion of the substrate is sucked into at least one of the multiple regions, another portion of the substrate is sucked into a region adjacent to the first region, and this process is repeated, so that the entire substrate is sucked and held on the stage. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-197707 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that allows a warped substrate to be adsorbed and held on a mounting table. [Means for solving the problem]

[0005] A substrate holding mechanism according to one aspect of the present disclosure includes a mounting table on which a substrate is placed, a plurality of holding parts including an upper surface that holds the underside of a peripheral portion of the substrate and a lower surface that presses down on the upper surface of the peripheral portion of the substrate placed on the mounting table, protrusions provided on the plurality of holding parts that contact an edge surface of the substrate placed on the mounting table to correct a position of the substrate, a lifting mechanism that raises and lowers the plurality of holding parts, and a horizontal movement mechanism that moves the plurality of holding parts horizontally. Effect of the Invention

[0006] According to the present disclosure, a warped substrate can be adsorbed and held on a mounting table. [Brief description of the drawings]

[0007] [Figure 1] Diagram for explaining warpage of a board [Diagram 2] A diagram for explaining problems that may arise due to warping of a substrate. [Diagram 3] A diagram for explaining problems that may arise due to warping of a substrate. [Figure 4] A diagram for explaining problems that may arise due to warping of a substrate. [Diagram 5] A diagram for explaining problems that may arise due to warping of a substrate. [Figure 6] FIG. 1 is a diagram showing an example of an inspection apparatus including a substrate holding mechanism according to an embodiment; [Figure 7] FIG. 7 is a plan view of the inspection device of FIG. [Figure 8] FIG. 1 is a schematic plan view showing an example of a substrate holding mechanism according to an embodiment; [Figure 9] FIG. 1 is a schematic cross-sectional view showing an example of a substrate holding mechanism according to an embodiment; [Figure 10] FIG. 1 is a diagram showing an example of a substrate mounting method according to an embodiment; [Figure 11] FIG. 1 is a diagram showing an example of a substrate mounting method according to an embodiment; [Figure 12] FIG. 1 is a diagram showing an example of a substrate mounting method according to an embodiment; [Figure 13] FIG. 1 is a diagram showing an example of a substrate mounting method according to an embodiment; [Figure 14] FIG. 1 is a diagram showing an example of a substrate mounting method according to an embodiment; [Figure 15] FIG. 1 is a diagram showing an example of a substrate mounting method according to an embodiment; [Figure 16] FIG. 1 is a diagram showing an example of a substrate mounting method according to an embodiment; [Figure 17] 1 is a diagram showing an example of a substrate removal method according to an embodiment; [Figure 18] 1 is a diagram showing an example of a substrate removal method according to an embodiment; [Figure 19] 1 is a diagram showing an example of a substrate removal method according to an embodiment; [Figure 20]1 is a diagram showing an example of a substrate removal method according to an embodiment; [Figure 21] 1 is a diagram showing an example of a substrate removal method according to an embodiment; [Figure 22] 1 is a diagram showing an example of a substrate removal method according to an embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all of the accompanying drawings, the same or corresponding members or parts are designated by the same or corresponding reference numerals, and duplicated descriptions will be omitted.

[0009] [Board warpage] Warping of a substrate will be described with reference to Fig. 1. Fig. 1 is a diagram for explaining warping of a substrate, and is a diagram of the substrate as viewed from the side.

[0010] As shown in Fig. 1(a), the substrate W may have an upwardly curved shape that is convex upward. Also, as shown in Fig. 1(b), the substrate W may have a downwardly curved shape that is convex downward. For example, in the case of a rectangular substrate having a size of 300 mm x 300 mm, a thickness of 500 μm to 3000 μm, and a weight of 100 g to 1000 g, the substrate warpage amount P may be about 10 mm.

[0011] Problems that may arise due to warping of the substrate W will be described with reference to Fig. 2 to Fig. 5. Fig. 2 to Fig. 5 are diagrams for explaining problems that may arise due to warping of the substrate W, and are views of the substrate W as viewed from the side. The following describes, as an example, a case in which the substrate W is placed on the mounting surface 911 of the mounting table 910 and vacuum-adsorbed.

[0012] 2, when the substrate W transported above a mounting table 910 by a transport arm (not shown) is received by three support pins 912 that support the lower surface of the substrate W near the center thereof, the substrate W may slip on the three support pins 912 due to the influence of warping of the substrate W. This makes it difficult to transport the substrate W stably.

[0013] 3(a), when the substrate W has an upwardly curved shape, vacuum may leak from a gap 913 between the mounting surface 911 and the substrate W when the substrate W is vacuum-sucked. This makes it difficult to adsorb the substrate W to the mounting surface 911. Similarly, when the substrate W has a downwardly curved shape, vacuum may leak from a gap 913 between the mounting surface 911 and the substrate W when the substrate W is vacuum-sucked. This makes it difficult to adsorb the substrate W to the mounting surface 911.

[0014] 4, when the substrate W has a downwardly curved shape, the contact area between the mounting surface 911 and the substrate W is small when the substrate W is placed on the mounting surface 911, and therefore the substrate W may slide on the mounting surface 911 (see arrow 914). Therefore, it is difficult to place the substrate W at a desired position on the mounting table 910.

[0015] Furthermore, as shown in FIG. 5(a), when the substrate W vacuum-adsorbed onto the support surface 911 is released, the substrate W may bounce or slip due to the restoring force of the warp, as shown in FIG. 5(b).

[0016] Hereinafter, a substrate holding mechanism, a substrate mounting method, and a substrate removal method according to an embodiment capable of suction-holding a warped substrate on a mounting table will be described.

[0017] [Inspection equipment] 6 and 7, an inspection device will be described as an example of a device to which the substrate holding mechanism of the embodiment is applied, although the substrate holding mechanism of the embodiment can also be applied to devices other than the inspection device.

[0018] The inspection apparatus 1 has a loader unit 10, an inspection unit 20, and an equipment controller 30. Under the control of the equipment controller 30, the inspection apparatus 1 transports a substrate W to be inspected from the loader unit 10 to the inspection unit 20, and inspects various electrical characteristics by applying electrical signals to a device under test (DUT) formed on the substrate W. The substrate W may be, for example, a rectangular substrate. An example of a rectangular substrate is a PLP (Panel Level Package).

[0019] The loader section 10 has a load port 11, an aligner 12, and a substrate transport mechanism 13. The load port 11 places a cassette C containing a substrate W therein. The aligner 12 aligns the substrate W. The substrate transport mechanism 13 transports the substrate W between the cassette C placed on the load port 11, the aligner 12, and a mounting table 21 described below. In the loader section 10, first, the substrate transport mechanism 13 transports the substrate W contained in the cassette C to the aligner 12. Next, the aligner 12 aligns the substrate W. Next, the substrate transport mechanism 13 transports the aligned substrate W from the aligner 12 to the mounting table 21 provided in the inspection section 20.

[0020] The inspection unit 20 is disposed adjacent to the loader unit 10. The inspection unit 20 includes a mounting table 21, a lifting mechanism 22, an XY stage 23, a probe card 24, and an alignment mechanism 25.

[0021] The mounting table 21 has a rectangular mounting surface. The mounting table 21 mounts the substrate W on the mounting surface. The mounting table 21 includes, for example, a vacuum chuck.

[0022] The lifting mechanism 22 is provided below the mounting table 21, and raises and lowers the mounting table 21 relative to the XY stage 23. The lifting mechanism 22 includes, for example, a stepping motor.

[0023] The XY stage 23 is provided below the lifting mechanism 22 and moves the mounting table 21 and the lifting mechanism 22 in two axial directions (X and Y directions in the figure). The XY stage 23 is fixed to the bottom of the inspection unit 20. The XY stage 23 includes, for example, a stepping motor.

[0024] The probe card 24 is disposed above the mounting table 21. A plurality of probes 24a are formed on the mounting table 21 side of the probe card 24. The probe card 24 is detachably attached to a head plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T.

[0025] The alignment mechanism 25 includes a camera 25a, a guide rail 25b, and an alignment bridge 25c. The camera 25a is attached facing downward in the center of the alignment bridge 25c, and captures images of the mounting table 21, the substrate W, and the like. The camera 25a is, for example, a CCD camera or a CMOS camera. The guide rail 25b supports the alignment bridge 25c so that it can move in the horizontal direction (Y direction in the figure). The alignment bridge 25c is supported by a pair of left and right guide rails 25b, and moves in the horizontal direction (Y direction in the figure) along the guide rails 25b. As a result, the camera 25a moves between a standby position and directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via the alignment bridge 25c. During alignment, the camera 25a located at the probe center captures images of the electrode pads of the substrate W on the mounting table 21 from above while the mounting table 21 moves in the XY directions, processes the images, and displays the captured images on the display device 40.

[0026] In the inspection section 20, first, the alignment mechanism 25 aligns the electrode pads of the device to be inspected formed on the substrate W on the mounting table 21 with the multiple probes 24a of the probe card 24. Next, the lifting mechanism 22 raises the mounting table 21 to bring the multiple probes 24a of the probe card 24 into contact with the corresponding electrode pads. Next, the equipment controller 30 applies a test signal from the tester to the device to be inspected formed on the substrate W via the test head T and the multiple probes 24a of the probe card 24, thereby inspecting the electrical characteristics of the device to be inspected.

[0027] The equipment controller 30 is provided below the mounting table 21, and controls the overall operation of the inspection equipment 1. A CPU provided in the equipment controller 30 executes a desired inspection according to the product parameters stored in a memory such as a ROM or RAM. The product parameters may be stored in a hard disk or a semiconductor memory other than a ROM or RAM. The product parameters may be recorded on a computer-readable recording medium such as a CD-ROM or DVD, which is inserted into a predetermined position and read out.

[0028] [Substrate holding mechanism] An example of a substrate holding mechanism of an embodiment will be described with reference to Fig. 8 and Fig. 9. Fig. 8 is a schematic plan view showing an example of a substrate holding mechanism of an embodiment. Fig. 9 is a schematic cross-sectional view showing an example of a substrate holding mechanism of an embodiment, showing a cross-section taken along dashed line IX-IX in Fig. 8. The substrate holding mechanism of the embodiment can be applied, for example, as the mounting table 21 of the inspection device 1 described above.

[0029] The substrate holding mechanism 100 includes a mounting table 110 , a plurality of holding portions 120 , a protruding portion 130 , a lifting mechanism 140 , and a horizontal movement mechanism 150 .

[0030] The mounting table 110 has a rectangular mounting surface 111. The mounting table 110 mounts a substrate W on the mounting surface 111. The substrate W may be, for example, a rectangular substrate. The mounting table 110 includes, for example, a vacuum chuck. The mounting table 110 is raised and lowered by a lifting mechanism 112 connected to the lower portion.

[0031] The multiple holding parts 120 are provided corresponding to the four sides of the placement surface 111. The multiple holding parts 120 include holding parts 120a to 120e. Of the four sides of the placement surface 111, the holding part 120a is provided corresponding to one of two sides that face each other in a first direction, and the holding part 120c is provided corresponding to the other side. That is, the holding part 120a and the holding part 120c are arranged opposite each other across the placement surface 111. Also, of the four sides of the placement surface 111 that face each other in a second direction perpendicular to the first direction, the holding part 120b is provided corresponding to one of two sides, and the holding parts 120d and 120e are provided corresponding to the other side. That is, the holding part 120b and the holding parts 120d and 120e are arranged opposite each other across the placement surface 111. The holding portions 120a to 120e have a substantially rectangular shape with the longitudinal direction parallel to the sides of the mounting surface 111. The longitudinal length of each of the holding portions 120a to 120c is substantially the same as one side of the mounting surface 111. The longitudinal length of each of the holding portions 120d and 120e is approximately ⅓ of one side of the mounting surface 111. The holding portion 120d is provided at one end side of one side of the mounting surface 111, and the holding portion 120e is provided at the other end side of the one side of the mounting surface 111. As a result, a gap D is formed between the holding portion 120d and the holding portion 120e, and a transfer arm (not shown) is inserted above the mounting table 110 through the gap D. Each of the holding portions 120a to 120e includes an upper surface 121, a lower surface 122, and a wall portion 123. The upper surface 121 holds the lower surface of the peripheral portion of the substrate W. The lower surface 122 presses down the upper surface of the peripheral portion of the substrate W placed on the placement table 110. The wall portion 123 extends upward from the upper surface 121 and is configured to be able to come into contact with the edge surface of the substrate W held by the upper surface 121.

[0032] The protrusions 130 protrude from the lower surface of each of the holders 120a to 120e and come into contact with the edge surface of the substrate W placed on the mounting table 110 to correct the position of the substrate W. The protrusions 130 have, for example, a rod shape. Two protrusions 130 are provided symmetrically with respect to the center in the longitudinal direction of each of the holders 120a to 120c. Furthermore, the protrusions 130 are provided approximately at the center in the longitudinal direction of each of the holders 120d, 120e. However, the number of the protrusions 130 is just an example and is not limited thereto. Furthermore, the protrusions 130 may have, for example, a plate shape extending along the longitudinal direction of each of the holders 120a to 120e.

[0033] The lifting mechanism 140 is fixed to the outer peripheral wall of the mounting table 110. The lifting mechanism 140 raises and lowers the multiple holders 120 relative to the mounting table 110. The lifting mechanism 140 may be, for example, a guided cylinder.

[0034] The horizontal movement mechanism 150 is attached to the lifting mechanism 140 so as to be able to move up and down freely. The horizontal movement mechanism 150 horizontally moves the multiple holders 120 between a closed position and an open position. The closed position is a position where the lower surface of the peripheral portion of the substrate W is held or the upper surface of the peripheral portion of the substrate W is pressed down, and is a position where the multiple holders 120 are closer to the mounting table 110. The open position is a position farther outward from the mounting table 110 than the closed position. The horizontal movement mechanism 150 may be, for example, a rotary actuator.

[0035] [Substrate mounting method] 10 to 16, a method of placing a substrate W on the placement table 110 (hereinafter referred to as a "substrate placement method") will be described as an example of the operation of the substrate holding mechanism 100 of the embodiment.

[0036] As shown in FIG. 10(a), in the initial state, no substrate W is placed on the mounting surface 111 of the mounting table 110, and the multiple holders 120 are lowered and in the closed position, in a standby state.

[0037] First, as shown in FIG. 10(b), the apparatus controller 30 controls the lifting mechanism 140 to lift the multiple holders 120.

[0038] 10(c) and 11(a), the transport arm 200 holding the substrate W is inserted above the mounting table 110. In the embodiment, the substrate W has a downwardly curved shape. The transport arm 200 corresponds to the substrate transport mechanism 13 in the inspection apparatus 1 shown in FIGS. 6 and 7.

[0039] 11(b), when the transport arm 200 descends, the lower surface of the peripheral portion of the substrate W held by the transport arm 200 is held by the upper surfaces 121 of the multiple holders 120. At this time, the multiple holders 120 hold the lower surface of the peripheral portion of the substrate W, so that the substrate W can be securely held even if the substrate W is warped. In addition, the transport arm 200 descends through the gap D between the holders 120d and 120e, so that the transport arm 200 does not come into contact with the holders 120d and 120e.

[0040] 11(c), when the transfer arm 200 is further lowered, the substrate W is separated from the transfer arm 200 and the substrate W is transferred from the transfer arm 200 to the multiple holders 120.

[0041] 12(a) and 12(b), the transfer arm 200 retreats from above the mounting table 110. At this time, the transfer arm 200 retreats through the gap D between the holders 120d and 120e, and therefore does not come into contact with the holders 120d and 120e.

[0042] 12(c), the apparatus controller 30 controls the lifting mechanism 140 to lower the multiple holders 120. At this time, the multiple holders 120 hold the lower surface of the peripheral portion of the substrate W with their upper surfaces 121, and the movement of the substrate W can be restricted with the wall portions 123, so that the substrate W can be lowered in a stable state.

[0043] 13(a), when the multiple holders 120 are further lowered, the substrate W is placed on the mounting surface 111 of the mounting table 110.

[0044] Next, as shown in FIG. 13(b), the apparatus controller 30 controls the horizontal movement mechanism 150 to horizontally move the multiple holding parts 120 from the closed position to the open position.

[0045] 13(c), the apparatus controller 30 controls the lifting mechanism 140 to lift the multiple holders 120 until the lower surfaces 122 thereof are positioned above the uppermost part Wa of the substrate W.

[0046] 14(a) to 14(c), the apparatus controller 30 controls the horizontal movement mechanism 150 to gradually close the multiple holders 120 from the open position. As a result, the protrusion 130 comes into contact with the edge surface of the substrate W, and the position of the substrate W is corrected. For example, if the center position of the substrate W is deviated from the center position of the mounting table 110, when the multiple holders 120 start to close, the protrusion 130 protruding from the lower surface of at least one of the holders 120b of the multiple holders 120 comes into contact with the edge surface of the substrate W, as shown in FIG. 14(a). Then, when the multiple holders 120 are further closed, the protrusion 130 protruding from the lower surface of the holder 120b moves the substrate W toward the holder 120d facing the holder 120b, as shown in FIG. 14(b). 14(c), when the multiple holders 120 are further closed, the protrusions 130 protruding from the lower surfaces of all of the holders 120a to 120e of the multiple holders 120 come into contact with the edge surfaces of the substrate W. This causes the center of the substrate W to be aligned with the center of the mounting table 110.

[0047] Next, as shown in Figures 15(a) and 15(b), the equipment controller 30 controls the lifting mechanism 140 to lower the multiple holding parts 120, thereby pressing down the upper surface of the peripheral part of the substrate W placed on the mounting table 110 with the lower surface 122.

[0048] 15(b), the apparatus controller 30 causes the substrate W, whose upper surface of the peripheral portion is pressed down, to be adsorbed onto the mounting surface 111 of the mounting table 110 by starting suction with the vacuum chuck.

[0049] Next, as shown in FIG. 15(c), the apparatus controller 30 controls the lifting mechanism 140 to lift the multiple holders 120.

[0050] Next, as shown in FIG. 16(a), the apparatus controller 30 controls the horizontal movement mechanism 150 to horizontally move the multiple holding parts 120 from the closed position to the open position.

[0051] Next, as shown in FIG. 16(b), the apparatus controller 30 controls the lifting mechanism 140 to lower the multiple holders 120.

[0052] 16(c), the apparatus controller 30 controls the horizontal movement mechanism 150 to move the multiple holders 120 from the open position to the closed position. This causes the substrate holding mechanism 100 to return to the standby state. This completes the substrate mounting method of the embodiment.

[0053] As described above, according to the substrate mounting method of the embodiment, when receiving the substrate W from the transport arm 200, the multiple holders 120 hold the lower surface of the peripheral portion of the substrate W with their upper surfaces 121. This allows the substrate W to be reliably held even if the substrate W is warped.

[0054] Furthermore, according to the substrate mounting method of the embodiment, the multiple holding parts 120 are lowered while holding the lower surface of the peripheral portion of the substrate W with the upper surfaces 121 of the multiple holding parts 120, to mount the substrate W on the mounting surface 111. This allows the substrate W to be lowered in a stable state.

[0055] Furthermore, according to the substrate mounting method of the embodiment, the protrusion 130 contacts the end face of the substrate W mounted on the mounting surface 111 to correct the position of the substrate W. As a result, even if the substrate W slides on the mounting surface 111 when mounted on the mounting surface 111 and the center of the substrate W deviates from the center of the mounting table 110, the center of the substrate W can be made to coincide with the center of the mounting table 110.

[0056] Furthermore, according to the substrate mounting method of the embodiment, the substrate W is adsorbed to the mounting surface 111 by the vacuum chuck while the lower surfaces 122 of the multiple holders 120 press down on the upper surface of the peripheral portion of the substrate W mounted on the mounting surface 111. This makes it possible to prevent the vacuum from leaking when the substrate W is adsorbed by the vacuum chuck.

[0057] [Substrate Removal Method] 17 to 22, a method for releasing the substrate W vacuum-adsorbed on the mounting table 110 (hereinafter referred to as a "substrate releasing method") will be described as another example of the operation of the substrate holding mechanism 100 of the embodiment.

[0058] As shown in FIG. 17(a), in an initial state, a substrate W is placed on the placement surface 111 of the placement table 110, and the multiple holders 120 are lowered and in the closed position, in a standby state.

[0059] First, as shown in FIG. 17(b), the device controller 30 controls the horizontal movement mechanism 150 to move the multiple holding parts 120 from the closed position to the open position.

[0060] 17(c), the apparatus controller 30 controls the lifting mechanism 140 to lift the multiple holders 120 until their lower surfaces 122 are positioned above the upper surface of the substrate W.

[0061] Next, as shown in FIG. 18(a), the equipment controller 30 controls the horizontal movement mechanism 150 to gradually close the multiple holding portions 120 from the open position, thereby bringing the protrusion 130 into contact with the edge surface of the substrate W and lightly pressing the substrate W.

[0062] 18(b), the apparatus controller 30 releases the suction by the vacuum chuck. At this time, since the end face of the substrate W is lightly pressed by the protrusions 130, even if the substrate W is warped, the substrate W can be prevented from bouncing or slipping due to the restoring force of the warp. Even if the substrate W bounces, the substrate W is held down by the lower surfaces 122 of the multiple holders 120, so that displacement due to bouncing is prevented.

[0063] Next, as shown in FIG. 18(c), the apparatus controller 30 controls the horizontal movement mechanism 150 to move the multiple holders 120 to the open position.

[0064] Next, as shown in FIG. 19(a), the apparatus controller 30 controls the lifting mechanism 140 to lower the multiple holders 120.

[0065] Next, as shown in FIG. 19(b), the device controller 30 controls the horizontal movement mechanism 150 to move the multiple holding parts 120 from the open position to the closed position.

[0066] 19(c), the apparatus controller 30 controls the lifting mechanism 140 to raise the multiple holders 120. At this time, the multiple holders 120 hold the lower surface of the peripheral portion of the substrate W with their upper surfaces 121, and the movement of the substrate W can be restricted with the wall portions 123, so that the substrate W can be raised in a stable state.

[0067] 20(a) and 20(b), the transport arm 200 not holding the substrate W is inserted between the mounting surface 111 of the mounting table 110 and the lower surface of the substrate W. At this time, the transport arm 200 is inserted through the gap D between the holders 120d and 120e, and therefore does not come into contact with the holders 120d, 120e.

[0068] 20(c), when the transport arm 200 rises, the substrate W held by the multiple holders 120 is held by the transport arm 200. At this time, the transport arm 200 rises through the gap D between the holders 120d and 120e, and therefore the transport arm 200 does not come into contact with the holders 120d and 120e.

[0069] Next, as shown in FIG. 21( a ), when the transport arm 200 is further raised, the substrate W is separated from the multiple holders 120 and the substrate W is transferred from the multiple holders 120 to the transport arm 200 .

[0070] 21(b) and 21(c), the transport arm 200 holding the substrate W is withdrawn from above the mounting table 110.

[0071] 22, the apparatus controller 30 controls the lifting mechanism 140 to lower the multiple holders 120. This causes the substrate holding mechanism 100 to return to the standby state. This completes the substrate release method of the embodiment.

[0072] As described above, according to the substrate releasing method of the embodiment, the plurality of holding parts 120 are raised while holding the lower surface of the peripheral portion of the substrate W with the upper surfaces 121 of the plurality of holding parts 120, to separate the substrate W from the placement surface 111. This allows the substrate W to be raised in a stable state.

[0073] Moreover, according to the substrate detachment method of the embodiment, the suction by the vacuum chuck is released in a state where the edge face of the substrate W is lightly pressed by the protrusion 130. This makes it possible to prevent the substrate W from bouncing or slipping due to the restoring force of the warp even if the substrate W is warped.

[0074] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0075] In the above embodiment, the substrate W is a rectangular substrate, but the present disclosure is not limited thereto. For example, the substrate W may be a circular substrate. An example of a circular substrate is a WLP (Wafer Level Package). When the substrate W is a circular substrate, for example, the mounting table is configured to have a circular mounting surface, and the multiple holding parts are configured to have a substantially arc shape. [Explanation of symbols]

[0076] 100 Board holding mechanism 110 Placement table 120 Holding part 130 Protrusion 140 Lifting mechanism 150 Horizontal movement mechanism W substrate

Claims

1. a mounting table on which a substrate is placed; a plurality of holders each including an upper surface that holds a lower surface of a peripheral portion of the substrate and a lower surface that presses down the upper surface of the peripheral portion of the substrate placed on the mounting table; a protrusion provided on each of the plurality of holders, the protrusion contacting an edge surface of the substrate placed on the stage to correct a position of the substrate; A lifting mechanism that lifts and lowers the plurality of holding parts; a horizontal movement mechanism for horizontally moving the plurality of holding units; The substrate holding mechanism has a

2. The protrusions are provided so as to protrude downward from the lower surfaces of the respective holding portions. The substrate holding mechanism of claim 1 .

3. The mounting table has a rectangular mounting surface. The substrate holding mechanism according to claim 1 .

4. The plurality of holding portions are provided to correspond to at least two opposing sides of the four sides of the placement surface. The substrate holding mechanism according to claim 3 .

5. The plurality of holding portions are provided corresponding to all four sides of the mounting table. The substrate holding mechanism according to claim 3 or 4.

6. Each of the plurality of holding portions extends upward from the upper surface and has a wall portion capable of contacting an edge surface of the substrate held on the upper surface. The substrate holding mechanism according to claim 1 .

7. The lifting mechanism lifts and lowers the holding portion, the protruding portion, and the horizontal movement mechanism. The substrate holding mechanism according to claim 1 .

8. The mounting table includes a vacuum chuck that adsorbs the substrate. A substrate holding mechanism according to claim 1 .

9. A method for placing a substrate on a placement table using a plurality of holders including an upper surface that holds a lower surface of a peripheral portion of the substrate and a lower surface that presses down the upper surface of the peripheral portion of the substrate placed on the placement table, comprising: holding a lower surface of a peripheral portion of the substrate with the upper surfaces of the plurality of holding parts above the mounting table; a step of lowering the plurality of holders holding a lower surface of the peripheral portion of the substrate to place the substrate on the mounting table; a step of contacting protrusions provided on the plurality of holders with an end surface of the substrate placed on the placement table to correct a position of the substrate; pressing an upper surface of the peripheral portion of the substrate whose position has been corrected with the lower surfaces of the plurality of holding parts; adsorbing the substrate with the upper surface of the peripheral portion pressed down onto the mounting table; The substrate mounting method includes the steps of:

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