Carbon-containing alumina powder, resin composition, heat dissipation part, and method for producing carbon-containing alumina powder
Carbon-containing alumina powder with controlled sphericity and carbon content improves fluidity and adhesion, addressing moldability and thermal conductivity issues in resin compositions.
Patent Information
- Application Number
- JP2022512028
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-03-31
- Filing Date
- 2021-03-24
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2041-03-24
AI Technical Summary
Existing alumina powders with alkoxysilane treatment have low sphericity and high specific surface area, leading to difficulties in filling density, moldability, thermal conductivity, and adhesion to adherends in resin compositions.
Carbon-containing alumina powder with specific sphericity, surface area, and carbon content ratio, treated with alkoxysilane compounds under controlled conditions, to enhance fluidity and adhesion while maintaining thermal conductivity.
The carbon-containing alumina powder suppresses viscosity increase, improves adhesion, and enhances thermal conductivity in resin compositions, facilitating better moldability and adherence.
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Abstract
Description
[Technical field]
[0001] The present invention relates to a carbon-containing alumina powder, a resin composition, a heat dissipation part, and a method for producing the carbon-containing alumina powder. [Background technology]
[0002] In recent years, with the progress of miniaturization, thinning and high functionality of heat-generating electronic components such as ICs and MPUs, the amount of heat generated by electronic devices equipped with electronic components has increased, and the development of an efficient heat dissipation method is still expected. Heat dissipation from electronic devices is performed by attaching a heat sink to a board on which heat-generating electronic components are mounted, or, when the space for attaching a heat sink cannot be secured, by directly attaching the board to the metal chassis of the electronic device. In this case, the heat sink is attached via a heat dissipation component such as a sheet formed by filling inorganic powder with good electrical insulation and thermal conductivity, such as inorganic powder such as boron nitride powder, aluminum nitride powder and alumina powder, into silicone rubber, or a flexible sheet with an Asker-C hardness of 25 or less (for example, Patent Document 1).
[0003] The quality of the heat dissipation in a resin composition after molding is largely dependent on the thermal conductivity of the resin composition after molding and its adhesion to the adherend (shape conformity), and is also affected by the presence or absence of voids (air layers) contained in the resin composition. Thermal conductivity is ensured by filling a high proportion of inorganic powder, but when inorganic powder is filled in a resin or the like at a high proportion, the fluidity of the resin composition before molding is greatly reduced, so that moldability is impaired and adhesion is significantly reduced. On the other hand, as the viscosity of the resin composition before molding increases, the voids contained therein become difficult to remove, so that the thermal conductivity is also reduced. Therefore, the use of spherical alumina powder and an alkoxysilane compound has been proposed as a method for maintaining a certain level of filling rate of inorganic powder, achieving both the fluidity and high thermal conductivity of the resin composition before molding, and not significantly impairing moldability and adhesion (for example, Patent Document 2).
[0004] Furthermore, high loading of inorganic powder not only impairs the fluidity of the resin composition before molding, but also significantly reduces the heat resistance reliability of the mechanical properties of the resin composition after molding, such as an increase in compression set and a decrease in tensile strength. As a method for improving the heat resistance reliability of the mechanical properties, it has been proposed to treat the surface of the inorganic powder with an alkoxysilane compound having a long-chain alkyl group (for example, Patent Document 3). [Prior art documents] [Patent documents]
[0005] [Patent Document 1] Japanese Patent Application Publication No. 9-296114 [Patent Document 2] JP 2000-1616 A [Patent Document 3] Japanese Patent Application Publication No. 11-209618 Summary of the Invention [Problem to be solved by the invention]
[0006] However, the spherical alumina powder surface-treated with the above-mentioned alkoxysilane compound has a problem that the viscosity increases when the spherical alumina powder is filled into a resin, and it is difficult to highly fill the alumina particles, due to the fact that the specific surface area is high, the average sphericity is low, and the shape is distorted, etc. Therefore, the moldability is low and the thermal conductivity of the obtained heat dissipation parts is also low. Furthermore, molded articles obtained by filling resin with this spherical alumina powder have a problem in that they have low tackiness and therefore insufficient adhesion (shape conformity) to the substrate.
[0007] The present invention has been made in consideration of the above problems, and has an object to provide a carbon-containing alumina powder that can suppress an increase in viscosity when filled into a resin and can achieve high thermal conductivity of a resin composition containing the resin, as well as a resin composition and a heat dissipation part that contain the carbon-containing alumina powder. [Means for solving the problem]
[0008] Means for Solving the Problems The present inventors have conducted extensive research in order to achieve the above object, and as a result have discovered that by using a carbon-containing alumina powder containing specific carbon-containing alumina particles, it is possible to suppress an increase in viscosity when filling a resin, to achieve high thermal conductivity of a resin composition containing the resin, and to improve the adhesion of the resin composition to an adherend, thereby completing the present invention.
[0009] That is, the present invention is as follows. [1] A carbon-containing alumina powder containing carbon-containing alumina particles having a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by a microscopic method, the carbon-containing alumina particles having an average sphericity of 0.85 or more and a specific surface area of 0.05 m 2 / g or more 1.0m 2 / g or less, and a ratio B / A of a carbon content B to a carbon content A in the carbon-containing alumina powder, calculated using the following measurement method, is 0.20 or more and 0.90 or less. (Measurement method) The ratio B / A is calculated using the carbon content A in the carbon-containing alumina powder and the carbon content B in the alumina powder after 3 g of the carbon-containing alumina powder is washed twice with 50 mL of acetone at room temperature for 5 minutes each and then kept at 100° C. for 240 minutes. Each of the carbon contents is a value measured by a carbon / sulfur simultaneous analyzer.
[0010] [2] The carbon-containing alumina powder according to [1], which contains silicon atoms and carbon atoms, and has a ratio MSi / MC of a mass MSi of the silicon atoms to a mass MC of the carbon atoms, of 0.1 or more and 1.2 or less. [3] A resin composition comprising a resin and the carbon-containing alumina powder according to [1] or [2]. [4] A heat dissipation part comprising the carbon-containing alumina powder according to [1] or [2], or the resin composition according to [3]. [5] A method for producing a carbon-containing alumina powder according to [1] or [2], comprising the steps of mixing an alkoxysilane compound with an alumina powder, and heating the mixture at room temperature at a relative humidity of 20% to 60%, at a temperature of 100°C to 150°C, and for a heating time of 0.5 hours to 1.5 hours. Effect of the Invention
[0011] According to the present invention, it is possible to provide a carbon-containing alumina powder that can suppress an increase in viscosity when filled into a resin and can achieve high thermal conductivity of a resin composition containing the resin, as well as a resin composition and a heat dissipation part that contain the carbon-containing alumina powder. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] Hereinafter, an embodiment for carrying out the present invention (hereinafter, simply referred to as "the present embodiment") will be described in detail. Note that the following present embodiment is an example for explaining the present invention, and the present invention is not limited to only this embodiment.
[0013] The alumina powder of the present embodiment contains specific carbon-containing alumina particles.
[0014] [Carbon-containing alumina powder] (Carbon-containing alumina particles) The carbon-containing alumina particles according to the present embodiment are not particularly limited as long as they are alumina particles containing carbon and have a diameter equivalent to a circle projected area by a microscope, an average sphericity, and a specific surface area within the ranges described below. The carbon-containing alumina particles can be obtained, for example, by treating the surface of alumina particles with an alkoxysilane compound under specific conditions.
[0015] The alkoxysilane compound generally includes four types of alkoxysilane compounds having 1 to 4 alkoxy groups, and oligomers obtained by condensing these. The four types of alkoxysilane compounds include tetraalkoxysilane compounds, trialkoxysilane compounds, dialkoxysilane compounds, and monoalkoxysilane compounds, and it is preferable that hydrogen atoms are not directly bonded to silicon atoms. These alkoxysilane compounds can be used alone or in appropriate mixtures of two or more.
[0016] Examples of the tetraalkoxysilane compound include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, and tetrabutoxysilane.
[0017] Examples of trialkoxysilane compounds include methyltrimethoxysilane, methyltriethoxysilane, methyltripoxysilane, methyltributoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, butyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, octyltrimethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, decyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, and vinyltrimethoxysilane. , vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-decyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3,4-epoxycyclohexylethyltrimethoxysilane, 3,4-epoxycyclohexylethyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3-mercaptopropyltriethoxysilane.
[0018] Examples of dialkoxysilane compounds include dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldipropoxysilane, dibutyldimethoxysilane, dipropyldimethoxysilane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, cyclohexylmethyldimethoxysilane, and vinylmethyldimethoxysilane.
[0019] Examples of the monoalkoxysilane compound include trimethylmethoxysilane, triethylmethoxysilane, triphenylmethoxysilane, diethylvinylmethoxysilane, dimethylpropylmethoxysilane, dimethylphenylmethoxysilane, diphenylmethylmethoxysilane, trimethylethoxysilane, triethylethoxysilane, triphenylethoxysilane, dimethylvinylethoxysilane, dimethylpropylethoxysilane, and dimethylphenylethoxysilane.
[0020] The carbon-containing alumina particles according to the present embodiment are spherical, and therefore the resin is less likely to thicken when the alumina powder is filled with the resin, and therefore the resin can be highly filled with the carbon-containing alumina particles. Therefore, the diameter of the projected area circle equivalent by a microscope is 1 μm or more and 100 μm or less, and the average sphericity is 0.85 or more. The average sphericity is preferably 0.85 or more and 0.99 or less. By having the average sphericity in the above range, the flowability of the carbon-containing alumina particles in the resin can be further improved, and the viscosity increase when the carbon-containing alumina powder is filled into the resin can be suppressed. In addition, the contact between the alumina particles becomes more sufficient, and the contact area becomes larger, which tends to result in a resin composition and a heat dissipation part with higher thermal conductivity, and the alumina particles tend not to fall off from the resin. The average sphericity is measured by the following microscopic method. That is, the particle image taken by a scanning electron microscope, a transmission electron microscope, or the like is input into an image analyzer, and the projected area (SA) and perimeter (PM) of the particles are measured from the photograph. If the area of a perfect circle with the same perimeter as the perimeter (PM) is (SB), the sphericity of the particle is SA / SB. Therefore, assuming a perfect circle with the same perimeter as the perimeter (PM) of the sample, PM=2πr, SB=πr 2 Therefore, SB = π × (PM / 2π) 2 The sphericity of each particle is given by: Sphericity = SA / SB = SA × 4π / (PM) 2 The sphericity of any 200 particles having a projected area circle equivalent diameter of 1 μm or more and 100 μm or less is determined as above, and the arithmetic mean value is taken as the average sphericity. The specific measurement method is as described in the Examples. The projected area circle equivalent diameter refers to the diameter of a perfect circle having the same projected area as the projected area (SA) of the particle.
[0021] The carbon-containing alumina particles according to the present embodiment have a specific surface area of 0.05 m or less, because the contact resistance at the interface with the resin is low and a resin composition and a heat dissipation material are obtained that are less susceptible to viscosity increase. 2 / g or more 1.0m 2 / g or less, and 0.1m 2 / g or more 0.6m 2 / g or less. In this embodiment, the specific surface area is measured by a BET flow method, and the specific measurement method is as described in the Examples.
[0022] (Carbon-containing alumina powder) The carbon-containing alumina powder according to this embodiment has a ratio B / A of 0.20 or more and 0.90 or less, calculated using the following measurement method. When the ratio B / A is 0.20 or more, the carbon-containing alumina powder has the effect of suppressing the bleeding of carbon-containing substances such as surface treatment agents remaining in the carbon-containing alumina powder from the resin composition or heat dissipation parts. On the other hand, when the ratio B / A is 0.90 or less, the resin is less likely to thicken when filled with the powder, and the powder is easily molded. (Measurement method) The ratio B / A is calculated using the carbon content A in the carbon-containing alumina powder according to this embodiment and the carbon content B in the alumina powder after 3 g of the carbon-containing alumina powder is washed twice with 50 mL of acetone at room temperature for 5 minutes each and then kept at 100° C. for 240 minutes. The carbon contents A and B are values measured by a carbon / sulfur simultaneous analyzer. The specific measurement method is as described in the Examples.
[0023] The carbon-containing alumina powder according to the present embodiment satisfies the above-mentioned range of the ratio B / A, so that it is possible to suppress an increase in viscosity when filling a resin with the carbon-containing alumina powder, and to obtain a resin composition and a heat dissipation part that have good adhesion to an adherend. The inventors are not sure of the reason for this, but they presume it to be as follows. The ratio B / A being 0.20 or more means that a substance containing carbon at a predetermined ratio or more (e.g., an alkoxysilane compound) is strongly attached to the surface of the carbon-containing alumina particles in the carbon-containing alumina powder, for example, by chemical bonds. In this case, it is considered that the strongly attached carbon-containing substance contributes to adhesion to the adherend, and thus a resin composition and a heat dissipation part having good adhesion can be obtained. On the other hand, the ratio B / A being 0.90 or less means that a substance containing carbon at a predetermined ratio or less (e.g., an alkoxysilane compound) is present in the carbon-containing alumina powder in a state that can be easily removed. It is presumed that such a carbon-containing substance improves the fluidity between the resin and the carbon-containing alumina particles, and can suppress the increase in viscosity when filling the resin.
[0024] For example, when the carbon-containing substance is an alkoxysilane compound, when the surface of the alumina particles is treated with the alkoxysilane compound, not all of the alkoxysilane compound reacts with the alumina particles, and unreacted alkoxysilane compound remains. In this case, it is estimated that if the amount of unreacted alkoxysilane compound remaining is small enough that the ratio B / A is 0.20 or more, the bleeding of the unreacted alkoxysilane compound from the resin composition is suppressed, and the adhesion (shape conformity) to the adherend is improved. On the other hand, the remaining alkoxysilane compound contributes to the fluidity between the resin and the carbon-containing alumina powder, and has the effect of improving the adhesion between the resin and the alumina particles. Therefore, the inventors consider it important that the alkoxysilane compound remains to a certain extent. In other words, it is estimated that if the amount of unreacted alkoxysilane compound remaining is large enough that the ratio B / A is 0.90 or less, when the carbon-containing alumina powder is highly filled in the resin, the fluidity of the resin composition before molding is improved, molding processability is maintained, and adhesion is improved.
[0025] The ratio B / A calculated using the above measurement method is preferably 0.20 or more and 0.90 or less, and more preferably 0.30 or more and 0.70 or less, from the viewpoints of having better adhesion, better fluidity between the resin and the carbon-containing alumina powder, and suppressing thickening.
[0026] The carbon-containing alumina powder according to the present embodiment contains silicon atoms and carbon atoms, and the ratio of the mass MSi of the silicon atoms to the mass MC of the carbon atoms (hereinafter also simply referred to as "mass ratio") MSi / MC is preferably 0.1 or more and 1.2 or less from the viewpoint of the fixation rate of the treatment agent on the alumina surface. The silicon atoms and carbon atoms may be derived from, for example, an alkoxysilane compound used in the surface treatment of the alumina powder, may be derived from an alkoxysilane compound reacted with the surface of the alumina powder, or may be derived from an alkoxysilane compound remaining on the surface of the alumina powder. If the mass ratio MSi / MC is in the above range, it is preferable from the viewpoint of the fixation rate of the treatment agent on the alumina surface. From the viewpoint of the fixation rate of the treatment agent on the alumina surface, the mass ratio MSi / MC is preferably 0.1 or more and 1.2 or less, more preferably 0.2 or more and 0.4 or less. The mass ratio MSi / MC is measured, for example, by an energy dispersive X-ray analyzer (EDX) and can be determined from the ratio of the X-ray count numbers of the Si element and the C element.
[0027] (Content of carbon-containing alumina particles in carbon-containing alumina powder) In this embodiment, the content of the carbon-containing alumina particles in the carbon-containing alumina powder is preferably 10% by mass or more, more preferably 50% by mass or more, from the viewpoint of modifying the alumina particle surface. It may be more preferably 70% by mass or more, or 90% by mass or more. The upper limit may be 100% by mass or less, 10% by mass or less, 30% by mass or less, or 50% by mass or less.
[0028] [Method of manufacturing carbon-containing alumina powder] The method for producing a carbon-containing alumina powder of this embodiment includes a step of mixing an alkoxysilane compound with an alumina powder (hereinafter also referred to as the "mixing step"), and a step of heating at room temperature with a relative humidity of 20% to 60%, at a temperature of 100°C to 150°C, and for a heating time of 0.5 hours to 1.5 hours (hereinafter also referred to as the "heating step").
[0029] (raw materials) As raw materials for obtaining the carbon-containing alumina powder according to this embodiment, an alkoxysilane compound, an alumina powder, and, as necessary, methanol, ethanol, and water are used.
[0030] The alkoxysilane compound of the raw material may be the above-mentioned four kinds of alkoxysilane compounds having 1 to 4 alkoxy groups, and oligomers obtained by condensing these. Among these, trialkoxysilane compounds and dialkoxysilane compounds are preferred because they react well with alumina powder. These alkoxysilane compounds may be used alone or in combination of two or more.
[0031] As the raw material alumina powder, a known alumina powder containing alumina particles having an average sphericity of 0.85 or more can be used.
[0032] The raw alumina powder preferably contains alumina particles having an average particle size of 1 μm or more and 100 μm or less. In this embodiment, the average particle size refers to the median size (d50) based on the volume. The average particle size of the alumina particles can be measured, for example, by a laser light diffraction scattering type particle size distribution measuring instrument (Model LS-230 (trade name) manufactured by Beckman Coulter, Inc.). In this case, the measurement solution is obtained by adding alumina particles to ethanol, dispersing the mixture for about 1 minute with a known stirrer such as a homogenizer, and adjusting the display of the concentration adjustment window of the instrument to 45% or more and 55% or less. The particle size distribution is analyzed by dividing the particle size range of 0.04 μm to 2000 μm inclusive into 116 parts (width of log(μm)=0.04). For details of the measurement method, refer to "Laser Diffraction / Scattering Particle Size Distribution Measurement Device LS Series" (manufactured by Beckman Coulter, Inc.) or "Measuring Particle Size Distribution" by Mayumi Toyoda (Beckman Coulter, Inc., Academic Team, Particle Physics Division).
[0033] The raw alumina powder preferably contains alumina particles having a projected area circle equivalent diameter of 1 μm to 100 μm measured by a microscope, and an average sphericity of 0.85 or more. The average sphericity is preferably 0.90 to 0.98 in order to suppress thickening when filled into a resin. The average sphericity is measured by the above-mentioned microscope method, and the specific measurement method is as described in the Examples. If alumina particles with low sphericity are included, the sphericity of the carbon-containing alumina powder also becomes low, and the resin tends to thicken when filled with the alumina powder, so that the ratio of alumina particles having a sphericity of 0.85 or less among the alumina particles having a projected area equivalent circle diameter of less than 10 μm as measured by the above microscope is preferably 1.0% or less by number, more preferably 0.5% or less by number. The lower limit is, for example, 0.1% by number.
[0034] The alumina particles contained in the raw material alumina powder have a specific surface area of 0.05 m, which allows for a large contact area at the interface with the alkoxysilane compound. 2 / g or more 1.0m 2 / g or less, and 0.1m 2 / g or more 0.5m 2 It is more preferable that the molecular weight is not more than 1 / g.
[0035] (Manufacturing method) In the method for producing carbon-containing alumina powder of this embodiment, first, in the mixing step, an alkoxysilane compound, an alumina powder, and, if necessary, methanol, ethanol, and water are mixed to obtain a mixed liquid. In this embodiment, in order to facilitate the reaction between the alkoxysilane compound and the alumina powder and to suppress the amount of unreacted alkoxysilane compound from becoming excessive, it is preferable to add 0.1 parts by mass to 3.0 parts by mass, preferably 0.2 parts by mass to 1.0 parts by mass, of a hydrolysis solution in which an alkoxysilane compound and, if necessary, methanol, ethanol, and water are dissolved in a solvent to 100 parts by mass of alumina powder, and mix them. As the solvent, water is preferable in terms of dispersibility, safety, and economy, but as long as the raw material can be dispersed, a flammable liquid such as alcohol and a mixed liquid of water-alcohol, etc. may also be used. For example, the mixing method may be to add a predetermined amount of raw material and solvent and mix them with a stirrer or the like until they are sufficiently dispersed.
[0036] Next, in the heating step, the mixture obtained as described above is heated at a relative humidity of 20% to 60% at room temperature (25°C), at a temperature of 100°C to 150°C, and for a heating time of 0.5 hours to 1.5 hours. Through this step, the alkoxysilane compound reacts with the alumina particles to obtain the carbon-containing alumina powder according to this embodiment. When the relative humidity is 20% or more, the alkoxysilane compound is hydrolyzed by the surface adsorbed water of the alumina particles, and the alkoxysilane compound easily reacts with the OH group on the alumina surface. In addition, when the temperature is 100°C or more, the reaction easily proceeds. Furthermore, when the temperature is 150°C or less, the boiling point of the alkoxysilane is not reached before the reaction, and the reaction amount can be suppressed from decreasing.
[0037] The obtained carbon-containing alumina particles may be used as the carbon-containing alumina powder according to the present embodiment as it is, or the carbon-containing alumina powder according to the present embodiment may be obtained by subjecting the obtained carbon-containing alumina particles to classification, sieving, or the like.
[0038] [Resin composition and method for producing same] The resin composition according to the present embodiment includes at least a resin and the carbon-containing alumina powder according to the present embodiment. By including the carbon-containing alumina powder, the resin composition according to the present embodiment can suppress thickening and has high thermal conductivity, and can improve the adhesion of a molded product such as a heat dissipation part obtained from the resin composition to an adherend.
[0039] (resin) As the resin, various polymer compounds such as thermoplastic resins and their oligomers, elastomers, etc. can be used, for example, epoxy resin, phenol resin, melamine resin, urea resin, unsaturated polyester, urethane resin, acrylic resin, and fluororesin; polyamide such as polyimide, polyamideimide, and polyetherimide; polyester such as polybutylene terephthalate and polyethylene terephthalate; polyphenylene sulfide, aromatic polyester, polysulfone, liquid crystal polymer, polyethersulfone, polycarbonate, maleimide-modified resin, ABS (acrylonitrile-butadiene-styrene) resin, AAS (acrylonitrile-acrylic rubber-styrene) resin, AES (acrylonitrile-ethylene-propylene-diene rubber-styrene) resin, EVA (ethylene-vinyl acetate copolymer) resin, and silicone resin can be used. These resins can be used alone or in a suitable mixture of two or more.
[0040] Among these resins, from the viewpoints of heat resistance temperature, strength, and hardness after curing, epoxy resins, phenol resins, urethane resins, acrylic resins, fluororesins, polyimides, polyphenylene sulfide, polycarbonates, ABS resins, and silicone resins are preferred, silicone resins, epoxy resins, urethane resins, and acrylic resins are more preferred, and silicone resins are even more preferred.
[0041] As the silicone resin, it is preferable to use a rubber or gel obtained from a one-liquid or two-liquid addition reaction type liquid silicone having an organic group such as a methyl group and a phenyl group. Examples of such a rubber or gel include "YE5822A Liquid / YE5822B Liquid" manufactured by Momentive Performance Materials Japan LLC, and "SE1885A Liquid / SE1885B Liquid" manufactured by Dow Corning Toray Co., Ltd.
[0042] (Amount of carbon-containing alumina powder) In the resin composition of the present embodiment, from the viewpoint of the expression of the characteristics of the filler to be filled, the content of the carbon-containing alumina powder according to the present embodiment is preferably 30% by mass or more and 97% by mass or less, and more preferably 50% by mass or more and 95% by mass or less, relative to the total amount of the resin composition. Since the carbon-containing alumina powder according to the present embodiment is unlikely to thicken even when filled into a resin, even if it is contained in the resin composition within the above range, it is possible to suppress thickening of the resin composition. In addition, when the content of the carbon-containing alumina powder is 50% by mass or more, it tends to be easy to obtain a resin composition and a heat dissipation part that can realize good high thermal conductivity and adhesion to the adherend, and when it is 95% by mass or less, the resin content that binds the carbon-containing alumina powder can be secured, and it can be used more suitably for heat dissipation parts.
[0043] In the resin composition of the present embodiment, from the viewpoint of expressing the characteristics of the filler to be filled, the content of the resin according to the present embodiment relative to the total amount of the resin composition is preferably 3 mass% or more and 70 mass% or less, and more preferably 5 mass% or more and 50 mass% or less.
[0044] (Other Ingredients) In addition to the carbon-containing alumina powder and resin according to the present embodiment, the resin composition according to the present embodiment may contain inorganic fillers such as fused silica, crystalline silica, zircon, calcium silicate, calcium carbonate, silicon carbide, aluminum nitride, boron nitride, beryllia, and zirconia, as necessary, nitrogen-containing compounds such as melamine and benzoguanamine, oxazine ring-containing compounds, and phosphorus-based phosphate compounds, aromatic condensed phosphate esters, and halogen-containing condensed phosphate esters, and other flame-retardant compounds, as well as additives, within the scope of not impairing the properties of the present embodiment. Examples of additives include reaction retarders such as dimethyl maleate, curing agents, curing accelerators, flame retardant assistants, flame retardants, colorants, tackifiers, ultraviolet absorbers, antioxidants, fluorescent brighteners, photosensitizers, thickeners, lubricants, defoamers, surface conditioners, gloss agents, and polymerization inhibitors. These components may be used alone or in appropriate mixtures of two or more. In the resin composition of this embodiment, the content of each of the other components is usually 0.1% by mass or more and 5.0% by mass or less.
[0045] (Method of producing resin composition) The resin composition of the present embodiment can be produced, for example, by thoroughly stirring a resin, a carbon-containing alumina powder, and other components as necessary. The resin composition of the present embodiment can be produced, for example, by blending predetermined amounts of each component using a blender and a Henschel mixer, kneading the mixture using a heating roll, a kneader, and a single-screw or twin-screw extruder, cooling, and then pulverizing the mixture.
[0046] [Heat dissipation parts] The heat dissipation part according to the present embodiment includes the carbon-containing alumina powder or the resin composition according to the present embodiment. The heat dissipation part according to the present embodiment can achieve high thermal conductivity, that is, can have high heat dissipation, by using the carbon-containing alumina powder or the resin composition. Furthermore, the heat dissipation part according to the present embodiment can improve adhesion to the adherend by using the carbon-containing alumina powder or the resin composition. The content of the carbon-containing alumina powder in the heat dissipation part according to the present embodiment is preferably 30% by volume or more and 85% by volume or less, and more preferably 40% by volume or more and 83% by volume or less, in order to achieve higher thermal conductivity and adhesion to the adherend. Examples of the heat dissipation part include a heat dissipation sheet, a heat dissipation grease, a heat dissipation spacer, a semiconductor encapsulant, a heat dissipation paint (heat dissipation coating agent), a heat dissipation potting agent, and a heat dissipation gap filler. EXAMPLES
[0047] The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to these examples in any way.
[0048] [Evaluation method] (1) Average sphericity of carbon-containing alumina powder As in the above microscopy method, particle images taken with a scanning electron microscope (SEM) (JSM-6301F manufactured by JEOL Ltd.) were imported into an image analyzer ("MacView" (product name) manufactured by Mountec Co., Ltd.) and the projected area (A) and perimeter (PM) of 200 randomly selected particles (projected area equivalent circle diameter measured by microscopy is 1 μm or more and 100 μm or less) of the carbon-containing alumina particles obtained in the examples and comparative examples were measured from the photographs. Using these values, the sphericity and its ratio of each particle were calculated, and the arithmetic mean value of the sphericities of each particle was taken as the average sphericity.
[0049] (2) Specific surface area The specific surface area was measured based on the BET method using a specific surface area measuring instrument "Macsorb HM model-1208 (product name)" manufactured by Mountech Co., Ltd. The specific surface area (m2) was measured by the BET single point method using 1.0 g of each of the carbon-containing alumina particles obtained in the examples and comparative examples. 2 / g) was measured. Prior to the measurement, as a pretreatment, each of the carbon-containing alumina particles obtained in the examples and comparative examples was heated in a nitrogen gas atmosphere at 300°C for 5 minutes. In the BET measurement, a mixed gas of 30% nitrogen and 70% helium was used as the adsorption gas, and the flow rate was adjusted so that the indication of the main body flow meter was 25 ml / min.
[0050] (3) Ratio of carbon content A to carbon content B in the carbon-containing alumina powder, B / A First, the amount of carbon in the carbon-containing alumina powder was measured using a carbon / sulfur simultaneous analyzer (CS-444LS (trade name) manufactured by LECO Corporation), and the carbon content A was quantified by a calibration curve method. Specifically, a calibration curve was obtained using carbon steel with a known carbon content as a standard substance, and then each of the carbon-containing alumina powders obtained in the examples and comparative examples was subjected to oxidative combustion together with iron powder and tungsten powder as a combustion improver in an oxygen atmosphere until the alkoxysilane compound was completely decomposed and all carbon was converted to CO2, and the amount of CO2 generated was measured with an infrared detector to obtain the carbon content A. Next, 3 g of each of the carbon-containing alumina powders obtained in the examples and comparative examples was washed twice with 50 mL of acetone at room temperature (25° C.) for 5 minutes each, and then held at 100° C. for 240 minutes to obtain an alumina powder. The carbon amount in this alumina powder was measured using a carbon / sulfur simultaneous analyzer (CS-444LS (trade name) manufactured by LECO Corporation), and the carbon content B was quantified by the calibration curve method. The calibration curve method was performed in the same manner as above. The obtained carbon content A and carbon content B were used to calculate the ratio B / A.
[0051] (4) Mass ratio MSi / MC The mass ratio MSi / MC of silicon atoms to carbon atoms was determined by calculating the respective mass ratios from the count ratios of C and Si on the particle surface when 0.1 g of each of the carbon-containing alumina particles obtained in the examples and comparative examples was measured using an energy dispersive X-ray analyzer (EDX) (a tabletop microscope, MiniscopeTM3030Plus, manufactured by Hitachi High-Technologies Corporation) under conditions of an acceleration voltage of 15 kV, an energy range of 10 to 40 keV, a channel number of 1024 to 4096, and spectrum collection time of 20 sec.
[0052] (5) Viscosity The carbon-containing alumina powder obtained in each of the examples and comparative examples was added to silicone rubber A liquid (vinyl-containing polymethylsiloxane, YE5822A liquid (trade name) manufactured by Momentive Performance Materials Japan, LLC) and the carbon-containing alumina powder (alumina powder filling rate: 87.9 mass%) after being left for 1 day was mixed using a stirrer (NZ-1100 (trade name) manufactured by Tokyo Rikakikai Co., Ltd.) and vacuum degassed to obtain a composition. The viscosity (Pa·s) of the obtained composition was measured using a B-type viscometer (TVB-10 (trade name) manufactured by Toki Sangyo Co., Ltd.). The viscosity was measured using a No. 7 spindle at a rotation speed of 20 rpm at a room temperature of 20°C.
[0053] (6) Thermal conductivity The carbon-containing alumina powder obtained in each of the examples and comparative examples, a reaction retarder (dimethyl maleate, Kanto Chemical), and a silicone rubber B liquid (YE5822B liquid (product name) manufactured by Momentive Performance Materials Japan, LLC, including a crosslinking agent) were added in order to the silicone rubber A liquid (vinyl-group-containing polymethylsiloxane, YE5822A liquid (product name) manufactured by Momentive Performance Materials Japan, LLC), and the mixture was stirred and defoamed to obtain a slurry sample. The compounding ratios were calculated by adding the maximum amount of the alumina powder obtained in the examples and comparative examples that can be molded by heating to a liquid obtained by adding 0.01 parts by mass of a reaction retarder to 100 parts by mass of a silicone rubber mixture obtained by mixing 10 parts by volume of silicone rubber A liquid and 1 part by volume of silicone rubber B liquid, and the ratios were as shown in Table 1.
[0054] [Table 1]
[0055] The obtained slurry sample was then poured into a mold with a depression of 28 mm in diameter and 3 mm in thickness, degassed, and then heated and molded at 150°C for 20 minutes. The obtained molded product was sandwiched between a 15 mm x 15 mm copper heater case and a copper plate, and set with a tightening torque of 5 kgf / cm. Then, a power of 15 W was applied to the copper heater case and held for 4 minutes, and the temperature difference between the copper heater case and the copper plate was measured, and the thermal resistance was calculated using the following formula. Thermal resistance (℃ / W) = Temperature difference between the copper heater case and the copper plate (℃) / Heater power (W) Next, the thermal resistance (℃ / W), heat transfer area [area of the copper heater case] (m 2 ), and the molded body thickness (m) at a tightening torque of 5 kgf / cm were used to calculate the thermal conductivity from the following formula. That is, the thermal conductivity is the value when the carbon-containing alumina powder obtained in each of the examples and comparative examples was filled at the maximum possible filling amount for heat molding. The thermal conductivity measuring device used was ARC-TC-1 (product name) manufactured by Agne. Thermal conductivity (W / m K) = thickness of molded body (m) / {thermal resistance (℃ / W) × heat transfer area (m 2 )}
[0056] Example 1 0.5 parts by mass of hexyltrimethoxysilane (KBM-3063 manufactured by Shin-Etsu Chemical Co., Ltd.) as an alkoxysilane compound, 0.5 parts by mass of methanol, and 0.1 parts by mass of water were mixed in this order and stirred at room temperature for 2 days to prepare a hydrolyzed liquid. Next, alumina powder with an average particle size of 45 μm (DAW-45 (trade name) manufactured by Denka Co., Ltd., alumina particles with a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by microscopy: average sphericity: 0.90, specific surface area: 0.2 m 2 After adding 1.0 part by mass of the hydrolyzed liquid to 100 parts by mass of the mixture (w / g), the mixture was mixed and stirred for about 5 minutes using a mixer (EL-1 (product name) manufactured by Nippon Eirich Co., Ltd.) and allowed to stand at room temperature for 1 day. Thereafter, heat treatment was performed for 1.0 hour at room temperature (25°C) with a relative humidity of 50% and a temperature of 140°C to obtain a carbon-containing alumina powder containing carbon-containing alumina particles. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 2.
[0057] Example 2 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that the relative humidity and the heating temperature were changed as shown in Table 2. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 2.
[0058] Example 3 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that N-decyltrimethoxysilane (KBM-3103C (product name) manufactured by Shin-Etsu Chemical Co., Ltd.) was used as the alkoxysilane compound instead of hexyltrimethoxysilane, and the relative humidity and heating temperature were changed to those shown in Table 2. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 2.
[0059] Example 4 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that dimethyldimethoxysilane (KBM-22 (product name) manufactured by Shin-Etsu Chemical Co., Ltd.) was used as the alkoxysilane compound instead of hexyltrimethoxysilane, and the relative humidity and heating temperature were changed to those shown in Table 2. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 2.
[0060] Example 5 As the alumina powder, instead of DAW-45 (trade name) manufactured by Denka Co., Ltd., alumina powder with an average particle diameter of 3 μm (DAW-03 (trade name) manufactured by Denka Co., Ltd., alumina particles with a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by microscopy: average sphericity: 0.90, specific surface area: 0.7 m 2 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that a carbon-containing alumina powder containing 100% water and 15% by weight of 100% water was used and the relative humidity and heating temperature were changed as shown in Table 2. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 2.
[0061] Example 6 As the alumina powder, instead of DAW-45 (trade name) manufactured by Denka Co., Ltd., alumina powder with an average particle diameter of 90 μm (DAW-90 (trade name) manufactured by Denka Co., Ltd., alumina particles with a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by microscopy: average sphericity: 0.90, specific surface area: 0.06 m 2 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that a carbon-containing alumina powder containing 100% water and 15% by weight of 10 ...
[0062] Example 7 First, alumina LS-21 (product name) manufactured by Nippon Light Metals Co., Ltd. was melted in an arc furnace, cooled, and pulverized to prepare fused pulverized alumina. The pulverization was carried out in a ball mill, and alumina balls were used as the pulverization media. The pulverized alumina obtained was classified to obtain alumina powder (average particle size: 0.2 μm, alumina particles with a projected area equivalent circle diameter of 1 μm to 100 μm by microscopy: average sphericity of 0.75, specific surface area: 0.2 m). 2 / g) was prepared. Next, the obtained alumina powder and alumina powder with an average particle size of 45 μm (DAW-45 (trade name) manufactured by Denka Co., Ltd., alumina particles having a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by microscopy: average sphericity: 0.90, specific surface area: 0.2 m) were mixed. 2 1 / g) was appropriately mixed to obtain an alumina powder. Using this alumina powder, and except for changing the relative humidity and heating temperature shown in Table 2, a carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 2.
[0063] Comparative Example 1 As the alumina powder, instead of DAW-45 (trade name) manufactured by Denka Co., Ltd., alumina powder with an average particle diameter of 120 μm (DAW-120 (trade name) manufactured by Denka Co., Ltd., alumina particles with a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by microscopy: average sphericity: 0.90, specific surface area: 0.03 m 2 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that a carbon-containing alumina powder containing 100% water and 100% water was used (1 / g) and the relative humidity and heating temperature were changed to those shown in Table 3. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0064] Comparative Example 2 As the alumina powder, instead of DAW-45 (trade name) manufactured by Denka Co., Ltd., alumina powder with an average particle diameter of 1 μm (DAW-01 (trade name) manufactured by Denka Co., Ltd., alumina particles with a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by microscopy: average sphericity: 0.90, specific surface area: 1.2 m 2A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that a carbon-containing alumina powder containing 100% water and 100% water was used (1 / g) and the relative humidity and heating temperature were changed to those shown in Table 3. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0065] Comparative Example 3 First, alumina LS-21 (product name) manufactured by Nippon Light Metals Co., Ltd. was melted in an arc furnace, cooled, and pulverized to prepare fused pulverized alumina. The pulverization was carried out in a ball mill, and alumina balls were used as the pulverization media. The pulverized alumina obtained was classified to obtain alumina powder (average particle size: 0.2 μm, alumina particles with a projected area equivalent circle diameter of 1 μm to 100 μm by microscopy: average sphericity of 0.75, specific surface area: 0.2 m). 2 / g) was prepared. Next, the obtained alumina powder and alumina powder with an average particle size of 45 μm (DAW-45 (trade name) manufactured by Denka Co., Ltd., alumina particles having a projected area equivalent circle diameter of 1 μm or more and 100 μm or less by microscopy: average sphericity: 0.90, specific surface area: 0.2 m) were mixed. 2 1 / g) was appropriately mixed to obtain an alumina powder. Using this alumina powder, and except for changing the relative humidity and heating temperature shown in Table 3, a carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0066] Comparative Example 4 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that the relative humidity was changed from 50% to 15%. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0067] Comparative Example 5 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that the relative humidity was changed from 50% to 70%. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0068] Comparative Example 6 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that the heating temperature was changed from 140° C. to 80° C. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0069] Comparative Example 7 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that the heating temperature was changed from 140° C. to 170° C. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0070] Comparative Example 8 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that the heating time was changed from 1.0 hour to 0.3 hour. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0071] Comparative Example 9 A carbon-containing alumina powder containing carbon-containing alumina particles was obtained in the same manner as in Example 1, except that the heating time was changed from 1.0 hour to 2.0 hours. The physical properties of the obtained carbon-containing alumina particles and carbon-containing alumina powder were evaluated. The results are shown in Table 3.
[0072] [Table 2]
[0073] [Table 3]
[0074] This application is based on a Japanese patent application (Patent Application No. 2020-064175) filed on March 31, 2020, the contents of which are incorporated herein by reference. [Industrial Applicability]
[0075] The carbon-containing alumina powder according to the present embodiment and the resin composition using this alumina powder can be used for various purposes, but are suitable for heat dissipation parts such as heat dissipation sheets, heat dissipation greases, heat dissipation spacers, semiconductor encapsulants, heat dissipation paints (heat dissipation coating agents), heat dissipation potting agents, heat dissipation gap fillers, etc. In addition, these heat dissipation parts can be used suitably for personal computers, automobiles, portable electronic devices, household electrical appliances, etc.
Claims
1. The carbon-containing alumina particles have a projected area equivalent circle diameter measured by a microscope of 1 μm or more and 100 μm or less, and the carbon-containing alumina particles have an average sphericity of 0.85 or more and a specific surface area of 0.05 m 2 / g or more 1.0m 2 / g or less, and a ratio B / A of a carbon content B to a carbon content A in the carbon-containing alumina powder, calculated using the following measurement method, is 0.20 or more and 0.90 or less, mixing an alkoxysilane compound with an alumina powder; and heating the mixture at room temperature at a relative humidity of 20% to 60%, at a temperature of 100° C. to 150° C., and for a heating time of 0.5 hours to 1.5 hours. (Measurement method) The ratio B / A is calculated using the carbon content A in the carbon-containing alumina powder and the carbon content B in the alumina powder after 3 g of the carbon-containing alumina powder is washed twice with 50 mL of acetone at room temperature for 5 minutes each time and then held at 100° C. for 240 minutes. Each of the carbon contents is a value measured by a carbon / sulfur simultaneous analyzer.
2. 2. The method for producing a carbon-containing alumina powder according to claim 1, comprising: a silicon atom and a carbon atom; and a ratio MSi / MC of a mass MSi of the silicon atom to a mass MC of the carbon atom being 0.1 or more and 1.2 or less.
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