Wire placement device and wire placement method

Abstract

To provide a wire arrangement device and wire arrangement method that can prevent deviation of a magnetic wire from a given position in a substrate.SOLUTION: A wire arrangement device 1 linearly arranging a magnetic wire 7 on a substrate 8 has: a substrate fixation stage 3; a wire supply part 2; a wire pulling part 4; a wire guide 5; and a wire cutter 6. The wire cutter 6 is configured to cut off the magnetic wire in a state where the wire pulling part 4 pulls the magnetic wire 7 toward a substrate 8 side with respect to the wire guide 5. The wire guide 5 has a guide part 50 that performs a positioning guide of one part of the magnetic wire 7 in a width direction Y. The wire pulling part 4 is adapted to: pull the magnetic wire 7 so that the magnetic wire 7 crawls over the substrate 8 after a state where the magnetic wire 7 is suspended on the substrate 8 and to the wire guide 5; and enable a release of holding the magnetic wire 7 in a state where the magnetic wire 7 is pulled to a given position on the substrate 8.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wire placement device and a wire placement method. [Background technology]

[0002] For example, when manufacturing a magneto-impedance sensor element (hereinafter also referred to as an "MI sensor element"), a magnetic wire may be arranged on a substrate as a magnetic sensitive body. In order to arrange the magnetic wire on the substrate in this manner, a wire arrangement device has been developed in the past, and for example, Patent Document 1 discloses a magnetic wire alignment device and a magnetic wire alignment method. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-35743 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the device and method described in Patent Document 1 have a problem in that it is difficult to prevent the magnetic wire from shifting from its predetermined position on the substrate. That is, in the magnetic wire alignment method described in Patent Document 1, the magnetic wire is cut after being drawn to a predetermined position on the substrate. When cutting, an external force from a cutter may act on the magnetic wire, or the tension of the magnetic wire may suddenly change. This may cause the cut magnetic wire to move wildly to some extent. Therefore, even if the magnetic wire is drawn to a predetermined position on the substrate with high accuracy, the magnetic wire may be displaced from the predetermined position on the substrate when the wire is subsequently cut.

[0005] The present invention has been made in view of the above-mentioned problems, and aims to provide a wire placement device and a wire placement method that can prevent deviation of a magnetic wire from a predetermined position on a substrate. [Means for solving the problem]

[0006] One aspect of the present invention is a wire placement device for linearly placing a magnetic wire on a substrate, the device comprising: a substrate fixing table on which the substrate is placed and fixed; a wire supply unit for supplying the magnetic wire; a wire pull-out unit that holds a front end of the magnetic wire supplied from the wire supply unit, pulls out the magnetic wire, and places it at a predetermined position on the substrate; a wire guide that is disposed on the wire supply unit side of the substrate and below an upper surface of the substrate and that passes through and holds the magnetic wire; a wire cutter that cuts the magnetic wire on the wire supply unit side of the wire guide, The wire feeder, the wire cutter, the wire guide, and the substrate are arranged in this order in a drawing direction of the magnetic wire, The wire cutter is configured to cut the magnetic wire by cutting the magnetic wire while the wire pull-out portion pulls the magnetic wire from the wire supply portion toward the substrate side beyond the wire guide. at a position between the wire supply and the wire guide in the wire placement device, It is configured to be cuttable, The wire guide has a guide portion that positions and guides a portion of the magnetic wire cut by the wire cutter in a width direction perpendicular to both the pull-out direction and the vertical direction, The wire pull-out unit is configured to pull the cut magnetic wire forward so that the cut magnetic wire crawls over the substrate after being suspended between the substrate and the wire guide, and to release the holding of the magnetic wire when the cut magnetic wire is laid in a predetermined position on the substrate. is located.

[0007] Another aspect of the present invention is a method for linearly arranging the magnetic wire on the substrate using the wire arrangement device, comprising the steps of: The front end of the magnetic wire supplied from the wire supply unit is held by the wire pull-out unit to pull out a predetermined amount of the magnetic wire. The wire guide is disposed so that the guide portion is disposed below the magnetic wire on the wire supply portion side of the wire pull-out portion, The magnetic wire is cut by the wire cutter. at a position between the wire supply and the wire guide in the wire placement device, Disconnect, A part of the cut magnetic wire is positioned and guided in the width direction by the wire guide; The cut magnetic wire is pulled forward by the wire pull-out portion so that the magnetic wire crawls on the substrate via a state in which the magnetic wire is suspended on the substrate and the wire guide; This is a wire placement method in which the cut magnetic wire is laid at a predetermined position on the substrate, and then the wire pull-out portion releases the magnetic wire from its hold, thereby placing the magnetic wire at the predetermined position on the substrate. Effect of the Invention

[0008] The wire placement device is configured to be able to pull out the cut magnetic wire to a predetermined position on the substrate by the wire pull-out unit. Therefore, even if an external force acts on the magnetic wire during cutting or the tension of the magnetic wire changes suddenly, it does not affect the positional deviation of the magnetic wire. As a result, it is possible to prevent the magnetic wire from being displaced from the predetermined position on the substrate.

[0009] In the wire arrangement method, the cut magnetic wire is pulled out to a predetermined position on the substrate by the wire pull-out section. Therefore, even if an external force acts on the magnetic wire when it is cut or the tension of the magnetic wire fluctuates, it does not affect the positional deviation of the magnetic wire relative to the substrate. As a result, it is possible to prevent the magnetic wire from being displaced from the predetermined position on the substrate.

[0010] As described above, according to the present invention, it is possible to provide a wire placement device and a wire placement method that can prevent deviation of a magnetic wire from a predetermined position on a substrate. [Brief description of the drawings]

[0011] [Figure 1] FIG. 4 is a plan view of the wire placement device immediately before cutting the magnetic wire in the first embodiment. [Diagram 2] FIG. 2 is a plan view of the wire placement device in the first embodiment with the magnetic wire pulled out. [Diagram 3] View from view point III in Figure 2. [Figure 4] FIG. 2 is a perspective view of the wire guide in the first embodiment. [Diagram 5] FIG. 2 is a front view of the wire guide in the first embodiment. [Figure 6] FIG. 2 is a side view of the wire guide in the first embodiment. [Figure 7] FIG. 7 is an enlarged front view of the guide portion as viewed from the arrow VII in FIG. 6 . [Figure 8] FIG. 4 is a side view of the guide portion according to the first embodiment, with the side blocks removed. [Figure 9] FIG. 2 is a plan view of the MI sensor element according to the first embodiment. [Figure 10] FIG. 3 is a partially enlarged plan view showing a state in which a magnetic wire is disposed on a substrate in the first embodiment. [Figure 11] FIG. 4 is a plan view of a guide post that guides a magnetic wire in the first embodiment. [Figure 12] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. [Figure 13] FIG. 4 is an explanatory diagram of the wire arrangement method in the first embodiment, illustrating a state before the wire pull-out portion chucks the magnetic wire. [Figure 14] FIG. 4 is an explanatory diagram showing a state in which the wire pull-out portion chucks the magnetic wire in the first embodiment. [Figure 15] FIG. 4 is an explanatory diagram showing a state in which the wire pull-out portion pulls out the magnetic wire and a wire guide is disposed in the first embodiment. [Figure 16] FIG. 4 is an explanatory diagram showing a state immediately before the wire cutter cuts the magnetic wire in the first embodiment. [Figure 17] FIG. 4 is an explanatory diagram showing a state in which the magnetic wire is cut in the first embodiment. [Figure 18] FIG. 4 is an explanatory diagram showing a state in which an upper block is assembled in the first embodiment. [Figure 19] FIG. 4 is an explanatory diagram showing a state in which the magnetic wire starts to be laid on the substrate in the first embodiment. [Figure 20] FIG. 3 is an explanatory diagram showing a state in which a magnetic wire is laid on a substrate in the first embodiment. [Figure 21] FIG. 4 is an explanatory diagram showing a state immediately before the rear end of the magnetic wire passes through the front end of the wire guide in the first embodiment. [Figure 22] FIG. 4 is an explanatory diagram showing a state in which the magnetic wire has been drawn out to a predetermined position on the substrate in the first embodiment. [Figure 23] 4 is an enlarged explanatory view showing a state immediately before the rear end of the magnetic wire passes through the front end of the wire guide in the first embodiment. FIG. [Figure 24] FIG. 11 is a plan view of a substrate in a second embodiment. [Diagram 25] FIG. 25 is a front view of the substrate as viewed from the arrow XXV in FIG. 24 in the second embodiment. [Figure 26] FIG. 11 is a plan view of a substrate in a third embodiment. [Figure 27] FIG. 11 is a perspective view of a substrate in a third embodiment. [Figure 28] FIG. 11 is another perspective view of the substrate in the third embodiment. [Figure 29] FIG. 11 is a front view of the board as viewed from the rear in the third embodiment. [Diagram 30] FIG. 11 is a side view of a substrate in a third embodiment. [Diagram 31] FIG. 11 is a front view of a substrate according to a third embodiment, as viewed from the front. [Diagram 32] FIG. 13 is a plan view illustrating a wire arrangement method in the fourth embodiment. [Diagram 33] A cross-sectional view taken along line XXXIII-XXXIII in Figure 32. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The wire arrangement device can be, for example, an apparatus used in the manufacturing process of a magneto-impedance sensor element. That is, the magnetic wire can be a magnetic sensitive body of the magneto-impedance sensor element. The magnetic wire constituting the magnetic sensitive body in the MI sensor element is, for example, a thin wire having a diameter of about 1 to 150 μm. The diameter of the magnetic wire can be preferably about 3 to 80 μm, more preferably about 5 to 30 μm. In addition, the MI sensor element is an extremely fine element, and a highly accurate arrangement device is required to arrange the magnetic wire at a predetermined position therein. In this respect, the wire arrangement device of the present disclosure is particularly useful.

[0013] The guide portion of the wire guide may have a guide reference surface that is erected in a vertical direction as viewed from the pull-out direction, an inclined lower surface that is arranged at an acute angle to the guide reference surface as viewed from the pull-out direction and guides the magnetic wire from diagonally below, and an inclined upper surface that is arranged at an acute angle to the guide reference surface as viewed from the pull-out direction and guides the magnetic wire from diagonally above. In this case, the positioning accuracy of the magnetic wire by the wire guide can be easily improved.

[0014] The inclined upper surface may be configured so that its vertical position relative to the inclined lower surface can be adjusted. In this case, the guide portion can be formed in a small area along the guide reference surface. As a result, the positioning accuracy of the magnetic wire by the wire guide can be further improved.

[0015] The guide portion may have an inclined end surface at the edge on the substrate side that faces diagonally downward and that, as viewed from the width direction, is inclined upward toward the substrate side, and the upper end of the inclined end surface may be at a height equal to or higher than the upper surface of the substrate. In this case, when the rear end of the cut magnetic wire is removed from the guide portion, the rear end of the magnetic wire is prevented from bouncing up due to the elastic force of the magnetic wire. As a result, the placement accuracy of the magnetic wire on the substrate can be reliably improved.

[0016] In addition, in the wire arrangement method, a plurality of the magnetic wires may be aligned in parallel on the substrate. In this case, care must be taken to prevent the wire lead-out portion from interfering with adjacently arranged magnetic wires. In the wire arrangement method of the present disclosure, as described above, the magnetic wire that has been cut in advance is led out onto the substrate so as to crawl over the substrate. Therefore, it is easy to prevent the wire lead-out portion from interfering with adjacent magnetic wires.

[0017] (Embodiment 1) An embodiment of a wire placement device and a wire placement method using the same will be described with reference to FIGS. 1 to 23. FIG. The wire placement device 1 is a device that places a magnetic wire 7 on a substrate 8 in a straight line. The wire placement device 1 has a substrate fixing table 3, a wire supplying section 2, a wire drawing section 4, a wire guide 5, and a wire cutter 6, as shown in FIGS.

[0018] The substrate fixing stand 3 places and fixes the substrate 8. The wire supply unit 2 supplies the magnetic wire 7. The wire pull-out unit 4 holds the front end of the magnetic wire 7 supplied from the wire supply unit 2, pulls out the magnetic wire 7, and places it at a predetermined position on the substrate 8. The wire guide 5 passes through and holds the magnetic wire 7 on the wire supply unit 2 side of the substrate 8 and below the upper surface 8a of the substrate 8. The wire cutter 6 cuts the magnetic wire 7 on the wire supply unit 2 side of the wire guide 5.

[0019] The wire cutter 6 is configured to be able to cut the magnetic wire 7 in a state in which the wire pull-out portion 4 pulls out the magnetic wire 7 toward the substrate 8 side beyond the wire guide 5 (the state shown in Figs. 1 and 16). The wire guide 5 has a guide portion 50 that positions and guides a part of the magnetic wire 7 cut by the wire cutter 6 in a width direction perpendicular to both the drawing direction and the vertical direction.

[0020] The wire pull-out section 4 pulls out the magnetic wire 7 so that the cut magnetic wire 7 crawls over the substrate 8 after being suspended between the substrate 8 and the wire guide 5 (the state shown in Figs. 17 to 20). Then, when the cut magnetic wire 7 has been pulled out to a predetermined position on the substrate 8 (the state shown in Fig. 22), the wire pull-out section 4 is configured to be able to release the holding of the magnetic wire 7.

[0021] 1 to 3, in this embodiment, the wire supply unit 2 has a bobbin 21 around which the magnetic wire 7 is wound, and a first guide roller 221 and a second guide roller 222 that guide the magnetic wire 7 pulled out from the bobbin 21. The bobbin 21, the first guide roller 221, and the second guide roller 222 are attached to a support wall 24 so as to be rotatable around rotation axes parallel to each other.

[0022] 3, the first guide roller 221 is disposed on a side closer to the substrate fixing table 3 than the bobbin 21 and below the bobbin 21. The second guide roller 222 is disposed on a side closer to the substrate fixing table 3 than the first guide roller 221 and below the first guide roller 221. In this embodiment, the wire supply unit 2 and the substrate fixing table 3 are fixed onto the common base 11. In other words, the support wall 24 is fixed onto the common base 11.

[0023] The magnetic wire 7 is pulled out from the bobbin 21 toward the substrate 8 while being suspended below the first guide roller 221 and above the second guide roller 222 .

[0024] The wire supply unit 2 has a brake 23 disposed facing the second guide roller 222 from the outer circumferential side. The brake 23 is configured to be able to hold down the portion of the magnetic wire 7 along the second guide roller 222. In other words, the magnetic wire 7 is clamped between the brake 23 and the second guide roller 222, and movement of the magnetic wire 7 can be prevented. The brake 23 is provided so as to be able to advance and retreat with respect to the second guide roller 222, and locks and unlocks the magnetic wire 7 at the required timing. The portion of the brake 23 that comes into contact with the magnetic wire 7 is made of, for example, rubber or the like.

[0025] The substrate fixing base 3 is equipped with a magnetic force generating unit 31. The magnetic force generating unit 31 attracts the magnetic wire 7 onto the substrate 8. The magnetic force generating unit 31 is formed, for example, by embedding a permanent magnet in the substrate fixing base 3. This allows the magnetic wire 7 drawn out onto the substrate 8 placed on the substrate fixing base 3 to be attracted toward the substrate 8. Note that instead of the magnetic force generating unit 31, the magnetic wire 7 can be attracted toward the substrate 8 by other means, such as air pressure or static electricity.

[0026] Moreover, the substrate fixing table 3 is fixed on a base table 12 which is fixed on a common base 11 .

[0027] The wire pull-out section 4 has a chuck section 41 that grips the magnetic wire 7, and a slide holding section 42 that is held slidably relative to the linear guide 40. The linear guide 40 is fixed to the base 12, and indirectly fixed to the substrate fixing base 3. The linear guide 40 is disposed in a substantially horizontal direction. Furthermore, the longitudinal direction of the linear guide 40 substantially coincides with the pull-out direction of the magnetic wire 7.

[0028] The drawing direction of the magnetic wire 7 is appropriately referred to as the X direction. In addition, in the X direction, the side from the wire supply unit 2 toward the substrate 8 is appropriately referred to as the front, and the opposite side is appropriately referred to as the rear. In addition, the vertical direction is appropriately referred to as the Z direction. In addition, the direction perpendicular to both the X direction and the Z direction is appropriately referred to as the Y direction.

[0029] The wire pull-out portion 4 is slidable in the X direction along the linear guide 40 thus arranged. The wire pull-out portion 4 is also configured to slide so as to pass above the substrate fixing stand 3.

[0030] The wire guide 5 is detachably attached to the base 12. That is, the wire guide 5 shown in Figs. 4 to 6 is fixed to the base 12 or a member fixed thereto. There are no particular limitations on where the wire guide 5 is fixed, so long as it can be fixed so that the relative positional relationship with the substrate fixing base 3 does not change.

[0031] 7, the guide portion 50 of the wire guide 5 has a guide reference surface 503, an inclined lower surface 501, and an inclined upper surface 502. The guide reference surface 503 is a surface that stands vertically when viewed from the X direction. The inclined lower surface 501 is disposed at an acute angle with respect to the guide reference surface 503 when viewed from the X direction, and guides the magnetic wire 7 from diagonally below. The inclined upper surface 502 is When viewed from the X direction, it is disposed at an acute angle with respect to the guide reference surface 503 and guides the magnetic wire 7 from diagonally above.

[0032] As shown in Fig. 4 to Fig. 6, the wire guide 5 is formed by combining a lower block 51, an upper block 52, and a side block 53. The lower block 51 is fixed to the base 12. The upper block 52 is assembled to the upper side of the lower block 51. In addition, the side block 53 is assembled to the side surfaces of the lower block 51 and the upper block 52 facing in the Y direction.

[0033] In the wire guide 5, a guide portion 50 is formed between a lower block 51, an upper block 52, and a side block 53. As shown in Fig. 7, an inclined lower surface 501 in the guide portion 50 is formed by the lower block 51, an inclined upper surface 502 in the guide portion 50 is formed by the upper block 52, and a guide reference surface 503 in the guide portion 50 is formed by the side block 53.

[0034] 6 and 8, a plurality of lower recesses 511 and a plurality of lower protrusions 512 are arranged alternately in the X direction at the corners of the lower block 51 adjacent to the side block 53 and the upper block 52. A tapered surface 512a is formed at the corners of the protruding ends of the lower protrusions 512 on the side block 53 side, the tapered surface 512a getting farther away from the side block 53 as it goes upward. This tapered surface 512a constitutes the inclined lower surface 501.

[0035] A plurality of upper recesses 521 and a plurality of upper protrusions 522 are arranged alternately in the X direction at the corners of the upper block 52 adjacent to the side block 53 and the lower block 51. A tapered surface 522a that gets farther away from the side block 53 as it goes downward is formed at the corners of the protruding ends of the upper protrusions 522 on the side block 53 side. This tapered surface 522a constitutes the inclined upper surface 502.

[0036] That is, the lower block 51 and the upper block 52 are combined so that the upper convex portion 522 of the upper block 52 is disposed in the lower concave portion 511 of the lower block 51, and the lower convex portion 512 of the lower block 51 is disposed in the upper concave portion 521 of the upper block 52. At this time, the upper end of the tapered surface 522a of the upper convex portion 522 is positioned higher than the lower end of the tapered surface 512a of the lower convex portion 512. As a result, as shown in Fig. 7, a guide portion 50 that appears triangular when viewed from the X direction is formed.

[0037] The inclined upper surface 502 is configured so that its position in the vertical direction (Z direction) relative to the inclined lower surface 501 can be adjusted.

[0038] 4 to 6, the side block 53 is fixed to the lower block 51 by a fixing screw 541. The upper block 52 is fixed to the side block 53 in an easily detachable manner. Here, the upper block 52 is fixed to the side block 53 by a clamping mechanism (not shown) or the like in a state where the engagement portion 542 is engaged with the side block 53. Also, as shown in FIG. 5, the upper block 52 is provided with an adjustment screw 543 for adjusting the position relative to the lower block 51. The adjustment screw 543 is disposed in the vertical direction and is screwed into the flange portion 523 of the upper block 52.

[0039] When the upper block 52 is assembled to the side block 53 integrated with the lower block 51, the upper block 52 is fixed to the side block 53 with the lower end of the adjustment screw 543 abutting against a part of the lower block 51. This determines the position of the upper block 52 relative to the lower block 51 in the vertical direction. Therefore, by adjusting the length of projection of the adjustment screw 543 downward from the flange 523, the position of the upper block 52 relative to the lower block 51 can be adjusted. As a result, the vertical (Z-direction) position of the inclined upper surface 502 relative to the inclined lower surface 501 can be adjusted.

[0040] 8, guide portion 50 has an inclined end surface 55 on the edge on the substrate 8 side. That is, inclined end surface 55 is provided at the front end portion of guide portion 50 in the X direction. Inclined end surface 55 is a surface that faces diagonally downward and is a surface that faces upward as it approaches substrate 8 when viewed from the width direction (Y direction). That is, when viewed from the Y direction, inclined end surface 55 is inclined so that it faces upward in the Z direction as it approaches the front in the X direction.

[0041] The upper end 551 of the inclined end face 55 is at a height equal to or higher than the upper surface 8a of the substrate 8. In this embodiment, the upper end 551 of the inclined end face 55 is disposed above the upper surface 8a of the substrate 8. However, the upper end 551 of the inclined end face 55 can also be disposed at the same position as the upper surface 8a of the substrate 8.

[0042] 1 to 3, the wire cutter 6 is disposed between the second guide roller 222 and the wire guide 5 at a position where it can cut the magnetic wire 7. The wire cutter 6 is disposed so as to be movable forward and backward in the Y direction. That is, the wire cutter 6 is held by a cutter holding part 61 fixed to the common base 11 so as to be slidable in the Y direction.

[0043] In this embodiment, the magnetic wire 7 constitutes a magnetic sensitive body of the MI sensor element 80 as shown in FIG. 9. The magnetic wire 7 is a thin wire having a diameter of, for example, about 1 to 150 μm. The diameter of the magnetic wire 7 is preferably about 3 to 80 μm, more preferably about 5 to 30 μm. The magnetic wire 7 is also an amorphous wire. For example, the magnetic wire 7 may be made of a CoFeSiB-based alloy. As shown in FIGS. 1 to 3, the magnetic wire 7 is wound around a bobbin 21 in the wire supply unit 2.

[0044] The substrate 8 constitutes the substrate 81 of the MI sensor element 80, and is made of a semiconductor such as silicon. The substrate 8 constitutes the substrate 81 of the multiple MI sensor elements 80.

[0045] 9, the MI sensor element 80 has a substrate 81, a magnetic wire 7, a detection coil 82, and electrode wirings 83a and 83b. The magnetic wire 7 is disposed on the substrate 81. The detection coil 82 is formed so as to spirally surround the magnetic wire 7. The electrode wiring 83a is electrically connected to both ends of the magnetic wire 7. The electrode wiring 83b is electrically connected to both ends of the detection coil 82.

[0046] 10, electrode wirings 83a and 83b and lower coil wiring 821, which is a part of the detection coil 82, are formed in advance on the substrate 8, for a plurality of MI sensor elements 80. On the substrate 8, a plurality of MI sensor elements 80 are formed lined up in both the X direction and the Y direction.

[0047] Then, the wire placement device 1 places a plurality of magnetic wires 7 in parallel on the substrate 8 on which the electrode wirings 83a, 83b and the lower coil wirings 821 are formed for a plurality of MI sensor elements 80.

[0048] As shown in Figs. 10 to 12, guide posts 84 for guiding the magnetic wire 7 are formed on the upper surface 8a of the substrate 8. The magnetic wire 7 can be positioned relative to the substrate 8 by arranging the magnetic wire 7 to pass between a pair of guide posts 84. The substrate 8 is formed with a plurality of pairs of guide posts 84. The guide posts 84 protrude from the upper surface 8a of the substrate 8, for example, by approximately the same amount as the diameter of the magnetic wire 7. The gap between the pair of guide posts 84 is formed to be approximately the same as the diameter of the magnetic wire 7 or slightly larger than the diameter of the magnetic wire 7.

[0049] Instead of the pairs of guide posts 84, a groove (not shown) may be formed in the upper surface 8a of the substrate 8 along the axis along which the magnetic wire 7 is to be disposed. By disposing the magnetic wire 7 in this groove, the magnetic wire 7 can be positioned relative to the substrate 8.

[0050] A method for linearly arranging the magnetic wire 7 on the substrate 8 using the wire arrangement device 1 will be described with reference to FIGS.

[0051] 13, 14, and 15, the front end of the magnetic wire 7 supplied from the wire supply unit 2 is held by the wire pull-out unit 4 to pull out a predetermined amount of the magnetic wire 7. Here, "supplied from the wire supply unit 2" means that the wire supply unit 2 itself does not feed out the magnetic wire 7, but the wire pull-out unit 4 pulls out the magnetic wire 7, resulting in the supply of the magnetic wire 7. As shown in FIG. 15, the wire guide 5 is disposed so that the guide unit 50 is disposed below the magnetic wire 7 on the wire supply unit 2 side rather than the wire pull-out unit 4.

[0052] 16 and 17, the magnetic wire 7 is cut by the wire cutter 6 on the wire supply unit 2 side of the wire guide 5. As shown in Fig. 18, a part of the cut magnetic wire 7 is positioned and guided in the width direction Y by the wire guide 5.

[0053] As shown in FIGS. 18 to 22, the cut magnetic wire 7 is suspended on a substrate 8 and a wire guide 5, and then drawn out by a wire drawing section 4 so as to crawl over the substrate 8. When the cut magnetic wire 7 is pulled out to a predetermined position on the substrate 8 (see FIG. 22 and FIG. 2), the wire pull-out portion 4 releases the magnetic wire 7 from its hold. This places the magnetic wire 7 at a predetermined position on the substrate 8.

[0054] The wire arrangement method of this embodiment will be described in detail below. 13, first, the magnetic wire 7 is suspended from the bobbin 21 of the wire supply unit 2 between the first guide roller 221 and the second guide roller 222, and the front end of the magnetic wire 7 is caused to protrude from the second guide roller 222. In this state, a part of the magnetic wire 7 is pressed against the second guide roller 222 by the brake 23 to be fixed.

[0055] 14, the wire pull-out unit 4 retreats toward the wire supply unit 2 along the linear guide 40, and chucks the front end of the magnetic wire 7 with the chuck unit 41. Thereafter, the brake 23 is released from the magnetic wire 7. 15, the wire pull-out unit 4 which has chucked the magnetic wire 7 advances in the X direction along the linear guide 40. As a result, the magnetic wire 7 is pulled out from the wire supply unit 2 forward.

[0056] Then, the wire guide 5 is attached so that the guide portion 50 is located below the drawn-out magnetic wire 7. The wire guide 5 is fixed to the base 12 as described above. At this time, the wire guide 5 is in a state in which the lower block 51 and the side block 53 are assembled to each other, but the upper block 52 is not assembled. For convenience, in Figs. 15 to 22, the outlines of the lower block 51 and the upper block 52 are drawn with the side block 53 of the wire guide 5 shown in perspective.

[0057] 16, the wire cutter 6 is placed in a position adjacent to the front side of the second guide roller 222 to cut the magnetic wire 7. At this time, the magnetic wire 7 is fixed by the brake 23.

[0058] As shown in Fig. 17, the part of the cut magnetic wire 7 in front of the cut part falls onto the lower block 51 of the wire guide 5 and lies on the guide part 50. Then, the magnetic wire 7 moves downward along the inclined lower surface 501 of the lower block 51 due to gravity, and moves toward the guide reference surface 503 of the side block 53 (see Fig. 7). As a result, the magnetic wire 7 in the guide part 50 is positioned at the corner between the guide reference surface 503 and the inclined lower surface 501. Also, the part of the magnetic wire 7 protruding behind the wire guide 5 hangs downward due to gravity. On the other hand, the front end of the part of the magnetic wire 7 behind the cut portion is in a state where it slightly projects from the second guide roller 222, that is, in a state where it is disposed in the same initial position as in FIG.

[0059] Next, as shown in Fig. 18, the upper block 52 of the wire guide 5 is attached to the lower block 51 and the side block 53 (see Figs. 4 to 6). At this time, the position of the upper block 52 in the Z direction relative to the lower block 51 is finely adjusted by the adjustment screw 543 (see Fig. 5). This adjusts the size of the guide section 50 formed between the lower block 51, the upper block 52, and the side block 53 shown in Fig. 7. In addition, the magnetic wire 7 is arranged over the entire guide section 50 in the X direction.

[0060] From this state, as shown in Figures 19, 20 and 21, the wire pull-out portion 4 is moved forward in the X direction along the linear guide 40. As a result, the magnetic wire 7 moves to the upper surface 8a of the substrate 8 while passing through the guide portion 50. During this time, the magnetic wire 7 is suspended between the upper surface 8a of the substrate 8 and the guide portion 50 (the state shown in Figures 19, 20 and 21). The portion of the magnetic wire 7 arranged on the guide portion 50 is positioned in a state in which it contacts the guide reference surface 503 shown in Figure 7.

[0061] Furthermore, since the substrate fixing base 3 has a magnetic force generating unit 31, the magnetic wire 7 drawn onto the substrate 8 is attracted downward. Therefore, the magnetic wire 7 is laid at a predetermined position on the substrate 8, crawling over the substrate 8 while being in close contact with the upper surface 8a of the substrate 8, as shown in Figs. 20 to 22. At this time, the magnetic wire 7 is arranged while moving in the X direction so as to pass between guide posts 84 (see Figs. 11 and 12) provided in advance on the substrate 8.

[0062] 23, the rear end of the magnetic wire 7 comes into contact with the inclined end surface 55 immediately before passing through the front end of the wire guide 5. At this time, the rear end of the magnetic wire 7 is pressed against the inclined end surface 55 by its elastic force. However, since the upper end 551 of the inclined end surface 55 is located slightly above the upper surface 8a of the substrate 8, the rear end of the magnetic wire 7 passes through the inclined end surface 55 without particularly bouncing up.

[0063] 22, when the front end of the magnetic wire 7 is pulled out to a predetermined position, the wire pull-out unit 4 releases the chuck of the magnetic wire 7. As a result, the front end of the magnetic wire 7 also falls, and the entire magnetic wire 7 is disposed at a predetermined position on the upper surface 8a of the substrate 8.

[0064] This series of operations is repeated multiple times while gradually shifting the position of the substrate 8 in the Y direction. That is, the substrate fixing base 3 is provided with a moving mechanism that moves the substrate 8 in the Y direction. Then, every time one magnetic wire 7 is placed on the substrate 8, the position of the substrate 8 is moved a predetermined amount in the Y direction, and the above-mentioned operation of placing the magnetic wire 7 is repeated.

[0065] In this manner, a plurality of magnetic wires 7 are aligned in parallel on the substrate 8 (see FIG. 10).

[0066] After forming upper wiring of the detection coil 82 and the like on the substrate 8 on which the multiple magnetic wires 7 are aligned, the substrate 8 is cut into individual MI sensor elements 80. At this time, each magnetic wire 7 is also cut in the X direction to become a magnetic sensitive body of an individual MI sensor element 80. In this manner, multiple MI sensor elements 80 are manufactured as shown in FIG.

[0067] Next, the effects of this embodiment will be described. The wire placement device 1 is configured so that the cut magnetic wire 7 can be pulled out to a predetermined position on the substrate 8 by the wire pull-out part 4. Therefore, even if an external force acts on the magnetic wire 7 during cutting or the tension of the magnetic wire 7 changes suddenly, this does not affect the positional deviation of the magnetic wire 7. As a result, it is possible to prevent the magnetic wire 7 from being displaced from the predetermined position on the substrate 8.

[0068] Moreover, the guide portion 50 of the wire guide 5 has a guide reference surface 503, an inclined lower surface 501, and an inclined upper surface 502. This makes it possible to easily improve the positioning accuracy of the magnetic wire 7 by the wire guide 5.

[0069] Moreover, the inclined upper surface 502 is configured so that its vertical position relative to the inclined lower surface 501 can be adjusted. Therefore, the guide portion 50 can be formed in a small area along the guide reference surface 503. As a result, the positioning accuracy of the magnetic wire 7 by the wire guide 5 can be further improved.

[0070] Furthermore, the guide portion 50 has an inclined end surface 55 on the edge on the substrate 8 side, and an upper end 551 of the inclined end surface 55 is at a height equal to or higher than the upper surface 8a of the substrate 8. This makes it possible to prevent the rear end of the cut magnetic wire 7 from bouncing up due to the elastic force of the magnetic wire 7 when the rear end of the cut magnetic wire 7 is removed from the guide portion 50. As a result, it is possible to reliably improve the placement accuracy of the magnetic wire 7 on the substrate 8.

[0071] The magnetic wire 7 constitutes the magnetic sensitive body of the MI sensor element 80. As described above, the magnetic wire constituting the magnetic sensitive body in the MI sensor element 80 is extremely thin. In addition, the MI sensor element 80 is an extremely fine element, and a highly accurate placement device is required to place the magnetic wire 7 at a predetermined position therein. From this perspective, the wire placement device 1 of the present disclosure is particularly useful.

[0072] Moreover, in the wire arrangement method of this embodiment, a plurality of magnetic wires 7 are aligned in parallel on a substrate 8. In this case, care must be taken to prevent the wire pull-out portion 4 from interfering with adjacently arranged magnetic wires 7. In the wire arrangement method of this embodiment, as described above, the magnetic wire 7 that has been cut in advance is pulled out onto the substrate 8 so as to crawl over the substrate 8. This makes it easy to prevent the wire pull-out portion 4 from interfering with adjacent magnetic wires 7.

[0073] As described above, according to the present embodiment, it is possible to provide a wire placement device and a wire placement method that can prevent the magnetic wire from being displaced from a predetermined position on the substrate.

[0074] (Embodiment 2) In this embodiment, as shown in FIGS. 24 and 25, a plurality of edge guide grooves 85 are provided at the rear end of the substrate 8. As shown in FIG. The edge guide grooves 85 are formed in the same number as the magnetic wires 7 arranged in the Y direction. Each edge guide groove 85 is formed in a groove shape. The edge guide grooves 85 have a triangular shape both when viewed from above in the Z direction shown in FIG. 24 and when viewed from behind in the X direction shown in FIG. 25. The bottom of the edge guide groove 85 is formed in a straight line perpendicular to the Y direction. The straight bottom of the edge guide groove 85 coincides with the position in the Y direction where the magnetic wire 7 should be arranged. That is, the position in the Y direction of the area between a pair of adjacent guide posts 84 (see FIGS. 11 and 12) formed on the substrate 8 coincides with the bottom of the edge guide groove 85.

[0075] By forming the edge guide groove portion 85 in this manner, when the magnetic wire 7 is pulled out onto the substrate 8 by the wire pull-out portion 4, the magnetic wire 7 is positioned and guided to a precise position in the Y direction by the edge guide groove portion 85. That is, when the wire pull-out portion 4 grips the front end of the magnetic wire 7 and pulls it out onto the substrate 8 (see FIGS. 19 to 21), a part of the magnetic wire 7 is guided by the edge guide groove portion 85 and follows its bottom.

[0076] As described above, the bottom of the edge guide groove portion 85 coincides with the position in the Y direction where the magnetic wire 7 is to be disposed. Therefore, as shown in FIG. 24, the magnetic wire 7 is accurately positioned at a predetermined position in the Y direction.

[0077] Further, the edge guide groove portion 85 is formed outside the region of the substrate 8 that is to become the substrate 81 of the MI sensor element 80 (outside the dashed line 86 in FIG. 24). That is, in the substrate 8, the multiple MI sensor elements 80 are formed on the inside of the portion where the edge guide groove portion 85 is formed. Note that in FIG. 24, the dashed line corresponds to the outline of the substrate 81 of each MI sensor element 80. The rest is the same as in the first embodiment.

[0078] According to this embodiment, it is possible to more easily prevent the magnetic wire 7 from being displaced from the predetermined position on the substrate 8. In addition, the same effects as those of the first embodiment are achieved.

[0079] (Embodiment 3) In this embodiment, as shown in Figs. 26 to 31, a plurality of edge guide protrusions 850 are provided on each of the rear end and the front end of the substrate 8. As shown in Figs. The edge guide protrusions 850 are formed along the X direction. As shown in Figures 29 and 31, each edge guide protrusion 850 has a substantially triangular shape when viewed from the X direction.

[0080] 26 to 28, a plurality of edge guide protrusions 850 are formed side by side in the Y direction at each of the rear end and the front end of the substrate 8. These edge guide protrusions 850 are formed so as to rise upward from the upper surface 8a of the substrate 8. The valleys formed between the edge guide protrusions 850 adjacent to each other in the Y direction exert the same function as the edge guide grooves 85 in the second embodiment. In other words, the positions in the Y direction of the valleys between the adjacent edge guide protrusions 850 are provided at the same positions as in the second embodiment.

[0081] In this embodiment, as shown in Figures 26 to 28 and 30, edge guide protrusions 850 are provided not only on the rear end of the substrate 8 but also on the front end. The edge guide protrusions 850 formed on the rear end of the substrate 8 and the edge guide protrusions 850 formed on the front end are formed at the same positions and with the same arrangement pitch in the Y direction. This makes it possible to more easily and reliably position the magnetic wire 7 at both the front end and rear end of the substrate 8.

[0082] In addition, the portion between the edge guide protrusions 850 formed at the rear end is cut out in a substantially V-shape when viewed from the Z direction, as shown in Fig. 26. This allows the magnetic wire 7 drawn onto the substrate 8 to be guided between the edge guide protrusions 850 more reliably. The rest is the same as in the second embodiment, and has the same functions and effects as in the second embodiment.

[0083] (Embodiment 4) In this embodiment, as shown in Figures 32 and 33, the wire guide 5 is disposed so that its guide reference surface 503 is located slightly closer to the upper block 52 in the Y direction than the chuck portion 41 of the wire pull-out portion 4.

[0084] 32, the wire guide 5 is disposed so that the guide reference surface 503 is located slightly, for example, about several tens of μm, toward the upper block 52 in the Y direction from the position where the front end of the magnetic wire 7 is chucked by the chuck portion 41. The dashed dotted line in FIG. 32 is an auxiliary line that passes through the position where the front end of the magnetic wire 7 is chucked by the chuck portion 41 and extends in the X direction.

[0085] In this way, the magnetic wire 7 is slightly inclined with respect to the X direction when viewed from the Z direction as shown in Fig. 32. This allows the magnetic wire 7 held by the chuck portion 41 to be reliably brought into contact with the guide reference surface 503 as shown in Fig. 33. Therefore, the positioning of the magnetic wire 7 in the Y direction can be easily and reliably performed.

[0086] In this embodiment, as described above, the magnetic wire 7 is slightly inclined with respect to the X direction, and therefore the substrate 8 is aligned so that it is also slightly inclined with respect to the X direction. That is, the substrate fixing base 3 is rotatable about an axis in the Z direction, and is configured to be able to perform fine adjustment in the rotation direction.

[0087] The rest is the same as in the first embodiment, and has the same functions and effects as in the first embodiment. [Explanation of symbols]

[0088] 1 Wire placement device 2 Wire supply unit 3 Board fixing stand 4 Wire outlet 5 Wire Guide 50 Guide part 6 Wire cutters 7 Magnetic Wire 8 Substrate

Claims

1. A wire placement device for placing a magnetic wire in a straight line on a substrate, comprising: a substrate fixing table on which the substrate is placed and fixed; a wire supply unit for supplying the magnetic wire; a wire pull-out unit that holds a front end of the magnetic wire supplied from the wire supply unit, pulls out the magnetic wire, and places it at a predetermined position on the substrate; a wire guide that is disposed on the wire supply unit side of the substrate and below an upper surface of the substrate and that passes through and holds the magnetic wire; a wire cutter that cuts the magnetic wire on the wire supply unit side of the wire guide, The wire feeder, the wire cutter, the wire guide, and the substrate are arranged in this order in a drawing direction of the magnetic wire, the wire cutter is configured to cut the magnetic wire at a position between the wire supply unit and the wire guide in the wire placement device when the wire pull-out unit pulls out the magnetic wire from the wire supply unit toward the substrate side beyond the wire guide, The wire guide has a guide portion that positions and guides a portion of the magnetic wire cut by the wire cutter in a width direction perpendicular to both the pull-out direction and the vertical direction, The wire pull-out section is configured to pull the cut magnetic wire forward so that the cut magnetic wire is suspended between the substrate and the wire guide and then crawls over the substrate, and to release the hold of the magnetic wire when the cut magnetic wire is laid in a predetermined position on the substrate.

2. 2. The wire arrangement device of claim 1, wherein the guide portion of the wire guide has a guide reference surface that is erected vertically when viewed from the pull-out direction, an inclined lower surface that is arranged at an acute angle with respect to the guide reference surface when viewed from the pull-out direction and guides the magnetic wire from diagonally below, and an inclined upper surface that is arranged at an acute angle with respect to the guide reference surface when viewed from the pull-out direction and guides the magnetic wire from diagonally above.

3. 3. The wire placement device of claim 2, wherein the upper inclined surface is vertically adjustable relative to the lower inclined surface.

4. The wire placement device of claim 2 or 3, wherein the guide portion has an inclined end face at the edge facing the substrate side, the surface facing diagonally downward and inclined upward as it approaches the substrate side when viewed from the width direction, and the upper end of the inclined end face is at a height higher than the top surface of the substrate.

5. 5. The wire placement device according to claim 1, wherein the magnetic wire constitutes a magnetic sensitive body of a magneto-impedance sensor element.

6. A method for linearly arranging the magnetic wire on the substrate using the wire arrangement device according to any one of claims 1 to 5, comprising the steps of: The front end of the magnetic wire supplied from the wire supply unit is held by the wire pull-out unit to pull out a predetermined amount of the magnetic wire. The wire guide is disposed so that the guide portion is disposed below the magnetic wire on the wire supply portion side of the wire pull-out portion, cutting the magnetic wire by the wire cutter at a position between the wire supply unit and the wire guide of the wire placement device; A part of the cut magnetic wire is positioned and guided in the width direction by the wire guide; The cut magnetic wire is pulled forward by the wire pull-out portion so that the magnetic wire crawls on the substrate via a state in which the magnetic wire is suspended on the substrate and the wire guide; A wire arrangement method in which the cut magnetic wire is laid at a predetermined position on the substrate, and then the wire pull-out portion releases the magnetic wire from its hold, thereby arranging the magnetic wire at the predetermined position on the substrate.

7. 7. The wire placement method according to claim 6, further comprising aligning a plurality of said magnetic wires in parallel on said substrate.

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