Component crimping device and component transfer method

Abstract

To prevent interference between a movement device which supplies a first component, and a light source for imaging a second component.SOLUTION: A component crimping device 1 includes: a common transfer unit 10 which transfers a first component 91 or a second component 92 to a crimping head 75; an imaging unit 50 which images the first component 91 or the second component 92 supplied to a transfer region RA; a lower light source 52 which radiates light to the second component 92 supplied to transfer region RA, from the lower side; and a first transfer unit 30 which can move the lower light source 52. In a first mode m1, the common transfer unit 10 holds the first component 91 from the top face side to transfer it to the crimping head 75. In a second mode m2, the common transfer unit holds the second component 92 from the bottom face side to transfer it to the crimping head 75. In the second mode m2, the first transfer unit 30 arranges the lower light source 52 at a position P2 beneath the transfer region RA, and in the first mode m1, the first transfer unit retracts the lower light source 52 to another position P1 different from the position P2.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a component pressure bonding device that pressure bonds a component to a board, and a component transfer method for transferring a component by the component pressure bonding device. [Background technology]

[0002] Conventionally, a component bonding device that bonds electronic components such as IC chips to the side edge of a liquid crystal panel is known. As an example of a mounting method using this type of component bonding device, Patent Document 1 discloses a method of mounting chip-type electronic components by a COG (Chip on Glass) method and a method of mounting film-type electronic components by a FOG (Film on Glass) method. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2005-317784 A Summary of the Invention [Problem to be solved by the invention]

[0004] For example, when mounting a chip-type electronic component and a film-type electronic component using one component bonding device, it is necessary to image each of the two electronic components using an imaging unit and a light source to recognize the position of each electronic component. However, depending on how the light source is arranged, there is a problem that the moving device that supplies one electronic component and the light source for imaging the other electronic component may interfere with each other.

[0005] An object of the present invention is to provide a component crimping device and the like that prevents interference between a moving device that supplies one electronic component and a light source that captures an image of the other electronic component. [Means for solving the problem]

[0006] A component crimping device according to one aspect of the present invention includes a placement section on which a substrate is placed, a crimping head section which crimps a first component or a second component onto the substrate placed on the placement section, a transport section which transports the first component or the second component from a predetermined transfer area to the crimping head section, an imaging section which is disposed above the transfer area and which captures an image of the first component or the second component supplied to the transfer area, a lower light source which irradiates light from below onto the second component supplied to the transfer area, and a transport device capable of moving the lower light source, wherein the transport section, in a first mode for transporting the first component, holds the first component supplied to the transfer area from an upper surface side of the first component, , turning the first part upside down, and In a second mode of transferring the second part to the crimping head section, the second part supplied to the transfer area is held from the underside of the second part and transferred to the crimping head section, and in the second mode, the moving device positions the lower light source at a position below the transfer area, and in the first mode, the moving device retracts the lower light source to another position different from the position.

[0007] A component transfer method according to one aspect of the present invention is a component transfer method for a component crimping device including a crimping head section which crimps a first component or a second component onto a substrate, a transport section which transports the first component or the second component from a predetermined transfer area to the crimping head section, an imaging section which is disposed above the transfer area and which captures an image of the first component or the second component supplied to the transfer area, a lower light source which irradiates light from below onto the second component supplied to the transfer area, and a transport device which is capable of moving the lower light source, wherein in a first mode, the transport section holds the first component supplied to the transfer area from an upper surface side of the first component and , turning the first part upside down, and In the second mode, the second part supplied to the transfer area is transferred to the crimping head section, and in the second mode, the second part is held from the underside of the second part and transferred to the crimping head section, and in the second mode, the moving device positions the lower light source at a position below the transfer area, and in the first mode, the moving device retracts the lower light source to another position different from the position. Effect of the Invention

[0008] According to the component crimping device and the like of the present invention, it is possible to prevent interference between a moving device that supplies one electronic component and a light source that captures an image of the other electronic component. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a component crimping device according to an embodiment. [Diagram 2] FIG. 2 is a view of the component crimping device according to the embodiment, as viewed from the direction of the arrow indicated by line II in FIG. [Diagram 3] FIG. 3 is a view of the component crimping device according to the embodiment, seen from the direction of the arrow indicated by the line II-II in FIG. [Figure 4] FIG. 4 is a diagram showing a first path and a light source when a first component is transferred in a first mode of the component crimping device. [Diagram 5] FIG. 5 is a diagram showing a common path when the first component is transferred in the first mode of the component crimping device. [Figure 6] FIG. 6 is a diagram showing a second path and a light source when the second component is transferred in the second mode of the component crimping device. [Figure 7] FIG. 7 is a diagram showing a common path when the second component is transferred in the second mode of the component crimping device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims showing the highest concept of the present invention will be described as optional components.

[0011] In addition, each drawing is a schematic diagram and is not necessarily a precise illustration. In addition, in each drawing, the same components are denoted by the same reference numerals.

[0012] In the following embodiments, the conveying direction of the substrate in the component compression bonding apparatus may be referred to as a first direction D1, and the depth direction of the component compression bonding apparatus perpendicular to the first direction D1 may be referred to as a second direction D2. The vertical direction may be referred to as a third direction D3, and the positive direction of the third direction D3 may be referred to as an upward direction, and the negative direction of the third direction D3 may be referred to as a downward direction. Each of the first direction D1 and the second direction is a direction included in the horizontal direction.

[0013] (Embodiment) [1. Outline of component crimping device] A schematic configuration of a component pressure bonding apparatus 1 according to an embodiment will be described with reference to Fig. 1. The component pressure bonding apparatus 1 is an apparatus that mounts electronic components on a substrate 80, and is used, for example, for producing display panels such as liquid crystal panels and organic EL (Electroluminescence) panels. Examples of the electronic components mounted on the substrate 80 include a first component 91 and a second component 92, which will be described later.

[0014] FIG. 1 is a plan view showing a component crimping device 1 according to an embodiment.

[0015] 1, the component bonding apparatus 1 includes a substrate carry-in section 110, an attachment section 120, a temporary compression bonding section 130, a main compression bonding section 140, a substrate carry-out section 150, a transport section 160, and a control section 170. The component bonding apparatus 1 also includes a component supply section 5 provided on the rear side of the temporary compression bonding section 130 and connected to the temporary compression bonding section 130. The control section 170 is connected to each of the devices such as the attachment section 120, the temporary compression bonding section 130, the main compression bonding section 140, and the component supply section 5 so as to be capable of wireless communication or to be capable of wired communication via a control line or the like, and controls each of the devices.

[0016] The substrate carry-in section 110, the attachment section 120, the temporary pressure-bonding section 130, the final pressure-bonding section 140, and the substrate carry-out section 150 are connected in this order along a first direction D1.

[0017] In the component bonding apparatus 1, first, the substrate 80 is carried into the substrate carry-in section 110. The substrate 80 carried into the substrate carry-in section 110 is carried to the attachment section 120 by the transport section 160. In the attachment section 120, an anisotropic conductive film (ACF) which is an anisotropic conductive member is attached to the region of the substrate 80 where the electrode section is formed. The substrate 80 to which the ACF is attached is carried to the temporary compression bonding section 130 by the transport section 160. In the temporary compression bonding section 130, an image of an electronic component (first component 91 or second component 92) supplied from the component supply section 5 is captured using the imaging section 50 and the light sources 51, 52 (see FIGS. 2 and 3), and then the electronic component is temporarily compressed to the substrate 80 via the ACF. The substrate 80 to which the electronic component has been temporarily compressed is carried to the full compression bonding section 140 by the transport section 160. In the final bonding section 140, the electronic components are final-bonded to the substrate 80 via the ACF. Through this final bonding, the electronic components are electrically connected to the electrode sections of the substrate 80. The substrate 80 to which the electronic components have been connected is transported by the transport section 160 to the substrate unloading section 150, and then unloaded from the substrate unloading section 150.

[0018] In the component crimping apparatus 1 of this embodiment, in order to prevent interference between the moving device that supplies the first component 91 and the light source for imaging the second component 92, the temporary crimping unit 130 and the component supply unit 5 have the configurations shown below.

[0019] [2. Configuration of temporary bonding section and parts supply section] Fig. 2 is a view of the component crimping device 1 as seen from the direction of the arrow indicated by line II in Fig. 1. Fig. 3 is a view of the component crimping device 1 as seen from the direction of the arrow indicated by line II-II in Fig. 1.

[0020] A first component 91 required for mounting by the COG method and a second component 92 required for mounting by the FOG method are supplied from the component supply unit 5 to the temporary bonding unit 130 of the component bonding apparatus 1. The first component 91 is a chip-shaped electronic component, such as an IC (Integrated Circuit) component. The second component 92 is a film-shaped electronic component, such as a TCP (Tape Carrier Package) component.

[0021] 2 and 3, the temporary compression bonding unit 130 includes a placement unit 70 on which a substrate 80 is placed, and a compression head unit 75 provided above the placement unit 70. The placement unit 70 includes a movable stage that is movable in a first direction D1 and a second direction D2, and the compression head unit 75 is movable in a third direction D3. The compression head unit 75 receives and holds the first component 91 or the second component 92 transferred from the component supply unit 5, and temporarily compresses it to the substrate 80.

[0022] The mounting unit 70 may be provided with a backup unit that is disposed below the bonding head unit 75 and supports a bonding portion provided on a side edge of the substrate 80 from below the substrate 80 when temporary bonding is performed by the bonding head unit 75. In this case, the substrate 80 is mounted on the movable stage with the side edge of the substrate 80, which is the bonding portion, protruding from the movable stage, the movable stage moves to a position where the side edge of the substrate 80 is supported by the backup unit, and the bonding head unit 75 performs temporary bonding with the bonding portion of the substrate 80 supported by the backup unit.

[0023] The component crimping apparatus 1 has a first mode m1 in which a first component 91 is supplied to the pre-crimping unit 130, and a second mode m2 in which a second component 92 is supplied to the pre-crimping unit 130. The control unit 170 selects the first mode m1 when mounting by the COG method is performed, for example, and selects the second mode m2 when mounting by the FOG method is performed.

[0024] In the first mode m1, a first part 91 is transferred via the first path r1 and the common path rc shown in Figures 1 and 2. In the second mode m2, a second part 92 is transferred via the second path r2 and the common path rc shown in Figures 1 and 3. Different parts are transferred on the common path rc depending on the mode.

[0025] The first path r1 is a path that extends along the first direction D1. The second path r2 is a path that extends along a second direction D2 that intersects with the first direction D1. Specifically, the second direction D2 is perpendicular to the first direction D1. The common path rc is a path that extends along the second direction D2, similar to the second path r2.

[0026] In this embodiment, a first component 91 is transferred in a first direction D1 on the first path r1, and a second component 92 is transferred in a second direction D2 on the second path r2. The second direction D2 is a direction extending toward the depth of the component crimping device 1, while the first direction D1 is aligned with the longitudinal direction of the rectangular component crimping device 1. Since the first direction D1 in which the first component 91 is transferred and the second direction D2 in which the second component 92 is transferred are configured to intersect in this manner, the component crimping device 1 can effectively utilize the space on the back side of the component crimping device 1.

[0027] Hereinafter, a specific configuration of the component supply unit 5 will be described with reference to FIGS.

[0028] 2 and 3, the component supply unit 5 includes a first take-out unit 61 and a first conveying unit 30 provided on the first path r1, a second take-out unit 62 and a second conveying unit 40 provided on the second path r2, and a common conveying unit 10 provided on the common path rc. The component supply unit 5 also includes an imaging unit 50 and a plurality of light sources 51 and 52 provided in a transfer area RA described below. In addition, the light source 52 is disposed at a position P1 different from the transfer area RA in the first mode m1. The light sources 51 and 52 will be described in detail later.

[0029] First, the first route r1 will be described with reference to FIG.

[0030] 4 is a diagram showing a first path r1 and light sources 51, 52 when a first component 91 is transferred in a first mode m1 of the component crimping apparatus 1. As shown in (a) to (c) of FIG. 4, a first removal unit 61 and a first transfer unit 30 are provided on the first path r1.

[0031] The first removal unit 61 is a tray supply device that removes the first parts 91 from the storage unit and supplies them to the first transfer unit 30. As shown in (a) of FIG. 4, the first removal unit 61 removes and supplies a predetermined tray 96 from a plurality of trays 96 stored in a magazine rack. A plurality of first parts 91 are arranged in a matrix on the tray 96. The first removal unit 61 supplies the tray 96 having the plurality of first parts 91 to the first transfer unit 30.

[0032] The first conveying section 30 is an example of a "moving device." The first conveying section 30 includes a first stage 31 that supports the first component 91, and a first moving mechanism 32 that moves the first stage 31. The first stage 31 holds the tray 96, for example, by suction or the like. As a result, the first component 91 is indirectly supported by the first stage 31 from below. The first moving mechanism 32 is, for example, a linear single-axis robot, and is capable of moving the first stage 31 in a first direction D1. The first moving mechanism 32 is an example of a "moving mechanism."

[0033] 4(b), the first moving mechanism 32 moves the first stage 31 to the transfer area RA along the first direction D1. In this manner, the first conveyer 30 conveys the first component 91 in the first direction D1 and supplies it to the transfer area RA.

[0034] As shown in Figures 2 and 3, the transfer area RA is an area where the first part 91 is transferred between the first path r1 and the common path rc, and is an area where the second part 92 is transferred between the second path r2 and the common path rc.

[0035] An imaging unit 50 and an upper light source 51 are provided above the transfer area RA.

[0036] The upper light source 51 is, for example, a coaxial light source, and irradiates light from above onto the first component 91 supported by the first stage 31 in the transfer area RA.

[0037] 4(c), the imaging unit 50 is, for example, a camera, and captures an image of the first part 91 supported on the first stage 31 in the transfer area RA using light emitted from an upper light source 51. This makes it possible to supply the first part 91 to the common transfer unit 10 while recognizing the position coordinates of the first part 91.

[0038] Next, the common path rc will be described with reference to FIGS.

[0039] 2 and 3, the common path rc is provided with a common transfer section 10. The common transfer section 10 is a transfer section shared for transferring the first part 91 and the second part 92, and handles either the first part 91 or the second part 92 and transfers it to the crimping head section 75. The common transfer section 10 is an example of a "transfer section".

[0040] The common transfer section 10 includes a head support section 15 and a common moving mechanism 16 .

[0041] The head support part 15 interchangeably supports the first holding head 11 for holding the first component 91 and the second holding head 12 for holding the second component 92. That is, the first holding head 11 and the second holding head 12 are detachable from the head support part 15. Specifically, the first holding head 11 is attached to the head support part 15 in the first mode m1, and the second holding head 12 is attached to the head support part 15 in the second mode m2. The attachment of the first holding head 11 and the second holding head 12 to the head support part 15 may be performed automatically by, for example, a tool changer (not shown) provided in the common transfer part 10.

[0042] The common moving mechanism 16 moves the head support part 15, which is supporting either the first holding head 11 holding the first component 91 or the second holding head 12 holding the second component 92, to the crimping head part 75. The common moving mechanism 16 is, for example, a three-axis robot, and moves the head support part 15 in the second direction D2 and the third direction D3, and rotates the head support part 15 about an axis along the first direction D1. In this way, the common moving mechanism 16 can transport the component held by the first holding head 11 or the second holding head 12, and can also turn it upside down.

[0043] FIG. 5 is a diagram showing a common path rc when the first component 91 is transferred in the first mode m1 of the component crimping apparatus 1. As shown in FIG.

[0044] 5(a), the first holding head 11 holds the first component 91, which has been supplied to the transfer area RA from the first direction D1, from the upper surface side of the first component 91 by being driven by the common moving mechanism 16. Then, the first holding head 11 turns the first component 91 upside down by being driven by the common moving mechanism 16 (see FIG. 5(b)), and transfers it to the crimping head unit 75 (see FIG. 5(c)).

[0045] The crimping head section 75 receives and holds the first component 91 transferred from the first holding head 11, and temporarily crimps it onto the substrate 80, as shown in FIG. 5(d).

[0046] Next, the second route r2 will be described with reference to FIG.

[0047] 6 is a diagram showing the second path r2 and the light sources 51, 52 when the second component 92 is transferred in the second mode m2 of the component crimping apparatus 1. The second path r2 is provided with the second removal unit 62 and the second transport unit 40. Note that the two second removal units 62 are installed side by side to efficiently perform product type and lot exchange. An example in which the second component 92 is supplied using one of the second removal units 62 will be described below.

[0048] The second removal unit 62 is a component tape supplying device that removes second components 92 from the storage unit and supplies them to the second transport unit 40. As shown in (a) of FIG. 6, the second removal unit 62 punches out and removes second components 92 from a band-shaped component tape 97 that includes a plurality of second components 92. The second removal unit 62 supplies the removed second components 92 to the second transport unit 40.

[0049] The second transfer section 40 includes a second stage 41 that supports the second part 92, a second moving mechanism 42, and a moving head 43. The second stage 41 directly holds the second part 92 from below, for example, by suction or the like. The second moving mechanism 42 is, for example, an orthogonal two-axis robot, and is capable of moving the second stage 41 in a first direction D1 (see FIG. 1). The moving head 43 directly holds the second part 92 from above, for example, by suction or the like. The moving head 43 is, for example, an orthogonal two-axis robot, and is capable of moving the held second part 92 in a second direction D2.

[0050] Specifically, the second moving mechanism 42 moves the second stage 41 along the first direction D1, and moves the second part 92 to an intermediate position between the two second removal units 62. The moving head 43 holds, from above, the second part 92 on the second stage 41 that has moved to the intermediate position, and transfers it to the delivery area RA along the second direction D2.

[0051] 6(b), the second holding head 12 is waiting in the transfer area RA, and the moving head 43 transfers the second component 92 to the second holding head 12 in the transfer area RA. In this manner, the second transport section 40 transfers the second component 92 in the second direction D2 and supplies it to the transfer area RA.

[0052] 3, an imaging unit 50 is provided above the transfer area RA. A lower light source 52 is provided below the transfer area RA.

[0053] The lower light source 52 has an optical axis along the third direction D3, and irradiates light from below onto the second component 92 held by the second holding head 12 in the transfer area RA. The second holding head 12 is formed of a translucent material that transmits light.

[0054] 6(c), the imaging unit 50 captures an image of the silhouette of the second component 92 using light emitted from the lower light source 52. As a result, even if the second component 92, which is a film-like electronic component, is warped or warped, the external shape of the second component 92 can be imaged without being affected by diffuse reflection or the like caused by the warp or warp, and the position coordinates of the second component 92 held by the second holding head 12 can be recognized with high accuracy.

[0055] In this embodiment, the lower light source 52 is provided so as to be able to retreat from the transfer area RA when the first part 91 is supplied to the transfer area RA by the first conveyor 30. For example, the lower light source 52 is disposed at a position P2 (see FIG. 3) on the opposite side of the imaging unit 50 as viewed from the second part 92 supplied to the transfer area RA in the second mode m2, and is disposed at another position P1 different from the position P2 in the first mode m1 (see FIG. 2). The position P2 is, for example, within the range of the transfer area RA, and the other position P1 is, for example, outside the movement range of the first stage 31. The position of the light source 52 refers to the position of the optical axis of the light source 52 in the first direction D1 and the second direction D2.

[0056] The lower light source 52 is provided on a side surface of the first stage 31. More specifically, the lower light source 52 is provided on a side surface located in the positive direction of the first direction D1 when viewed from the center of the first stage 31. Therefore, the lower light source 52 also moves together with the horizontal movement of the first stage 31. This allows the lower light source 52 to be configured not to interfere with the movement of the first conveyor 30.

[0057] FIG. 7 is a diagram showing a common route rc when the second component 92 is transferred in the second mode m2 of the component crimping apparatus 1. As shown in FIG.

[0058] As shown in (a) of Figure 7, the second holding head 12 holds the second component 92 supplied to the transfer area RA from the second direction D2 from the underside of the second component 92 by being driven by the common moving mechanism 16, and transfers it to the crimping head portion 75.

[0059] 7(b), the crimping head unit 75 receives and holds the second component 92 transferred from the second holding head 12, and pre-crimps it to the substrate 80. In this manner, in the component crimping device 1, the first component 91 or the second component 92 is supplied from two intersecting directions at the component supply unit 5, and the first component 91 or the second component 92 is received at the pre-crimping unit 130 and pre-crimps it to the substrate 80.

[0060] (summary) The component crimping apparatus 1 of this embodiment comprises a mounting section 70 on which a substrate 80 is placed, a crimping head section 75 which crimps a first component 91 or a second component 92 onto the substrate 80 placed on the mounting section 70, a common transport section (an example of a transport section) 10 which transports the first component 91 or the second component 92 from a predetermined transfer area RA to the crimping head section 75, an imaging section 50 which is arranged above the transfer area RA and captures an image of the first component 91 or the second component 92 supplied to the transfer area RA, a lower light source 52 which irradiates light from below onto the second component 92 supplied to the transfer area RA, and a first transport section (an example of a moving device) 30 which is capable of moving the lower light source 52. In a first mode m1 for transferring a first part 91, the common transfer unit 10 holds the first part 91 supplied to the transfer area RA from the upper surface side of the first part 91 and transfers it to the crimping head unit 75, and in a second mode m2 for transferring a second part 92, holds the second part 92 supplied to the transfer area RA from the lower surface side of the second part 92 and transfers it to the crimping head unit 75. In the second mode m2, the first transfer unit 30 places the lower light source 52 at a position P2 below the transfer area RA, and in the first mode m1, retracts the lower light source 52 to a position P1 different from position P2.

[0061] In this way, by retracting the lower light source 52 to another position P1, when the first component 91 is supplied to the transfer area RA in the first mode m1, it is possible to prevent interference between the means for transferring the first component 91 and the lower light source 52 for capturing an image of the second component 92. In other words, it is possible to prevent interference between the moving device that supplies one electronic component (the first component 91) and the light source 52 for capturing an image of the other electronic component (the second component 92).

[0062] In addition, the first transport section 30 has a stage 31 that supports the first part 91 removed from the first removal section 61, and a first moving mechanism (an example of a moving mechanism) 32 that moves the stage 31 from the first removal section 61 to the transfer area RA, and the lower light source 52 may be provided on the stage 31.

[0063] In this way, by providing the lower light source 52 on the stage 31, it is possible to reliably prevent interference between the first conveying section 30 conveying the first part 91 and the lower light source 52 for imaging the second part 92 when the first part 91 is supplied to the transfer area RA.

[0064] Furthermore, in the first mode m1, the first transporter 30 may move the stage 31 in the horizontal direction to retreat the lower light source 52 to another position P1.

[0065] In this way, in the first mode m1, by moving and retracting the stage 31 in the horizontal direction, it is possible to easily prevent interference between the first transporter 30 and the light source 52 below.

[0066] Also, the other position P1 may be outside the range of movement of the stage 31.

[0067] In this way, by having the other position P1 outside the movement range of the stage 31, it is possible to reliably prevent interference between the first conveying section 30 and the lower light source 52 when the first part 91 is supplied to the transfer area RA.

[0068] In addition, the component crimping apparatus 1 may further include an upper light source 51 that irradiates light from above onto the first component 91 supported on the stage 31 in the transfer area RA, and the imaging unit 50 may image the first component 91 supported on the stage 31 in the transfer area RA using the light emitted from the upper light source 51.

[0069] According to this, it is possible to capture images of each of the first component 91 and the second component 92 using one imaging unit 50. In addition, the imaging unit 50 can recognize the position coordinates of the first component 91 and the second component 92, and supply the first component 91 or the second component 92.

[0070] Moreover, the first component 91 may be an IC (Integrated Circuit) component, and the second component 92 may be a TCP (Tape Carrier Package) component.

[0071] This makes it possible to prevent interference between the means for transferring the first component 91 and the lower light source 52 in the component pressure bonding apparatus 1 for pressure bonding an IC component and a TCP component onto the substrate 80.

[0072] The component transfer method of this embodiment is a component transfer method for a component crimping apparatus 1 that includes a crimping head unit 75 that crimps a first component 91 or a second component 92 onto a substrate 80, a common transfer unit (an example of a transfer unit) 10 that transfers the first component 91 or the second component 92 from a predetermined transfer area RA to the crimping head unit 75, an imaging unit 50 that is arranged above the transfer area RA and images the first component 91 or the second component 92 supplied to the transfer area RA, a lower light source 52 that irradiates light from below onto the second component 92 supplied to the transfer area RA, and a first transfer unit (an example of a moving device) 30 that can move the lower light source 52. In the first mode m1, the common transfer unit 10 holds the first part 91 supplied to the transfer area RA from the upper surface side of the first part 91 and transfers it to the crimping head unit 75, and in the second mode m2, holds the second part 92 supplied to the transfer area RA from the lower surface side of the second part 92 and transfers it to the crimping head unit 75. In the second mode m2, the first transfer unit 30 places the lower light source 52 at position P2 below the transfer area RA, and in the first mode m1, retracts the lower light source 52 to another position P1 different from position P2.

[0073] In this way, by retracting the lower light source 52 to another position P1, it is possible to prevent interference between the means for transporting the first part 91 and the lower light source 52 for imaging the second part 92 when the first part 91 is supplied to the transfer area RA in the first mode m1.

[0074] (Other embodiments) Although the component crimping device and the like according to the present embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0075] In the above embodiment, an example has been shown in which the first transfer unit 30 transfers the first part 91 in the first direction D1 and the second transfer unit 40 transfers the second part 92 in the second direction D2, but the orthogonal arrangement may be reversed. For example, the first transfer unit 30 may transfer the first part 91 in the second direction D2 and supply it to the transfer area RA, and the second transfer unit 40 may transfer the second part 92 in the first direction D1 and supply it to the transfer area RA.

[0076] In the above embodiment, an example has been shown in which the lower light source 52 is provided on the side surface of the first stage 31, but the means for retracting the lower light source 52 is not limited to this. For example, the lower light source 52 may be attached to another moving mechanism and configured to move to position P2 in the second mode m2 and to move to position P1 in the first mode m1.

[0077] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present invention. [Industrial Applicability]

[0078] The present invention can be used in component pressure bonding devices and the like used to produce display panels such as liquid crystal panels and organic EL (Electroluminescence) panels. [Explanation of symbols]

[0079] 1 Component crimping device 5. Parts Supply Department 10 Common transfer section (example of transfer section) 11 First holding head 12 Second holding head 15 Head support 16 Common movement mechanism 30 First conveying section (an example of a moving device) 31 First Stage 32 First moving mechanism (an example of a moving mechanism) 40 2nd transfer section 41 Second Stage 42 Second movement mechanism 43 Moving Head 50 Imaging unit 51 Upper light source 52 Lower light source 61 1st extraction section 62 2nd extraction part 70 Placement section 75 Crimping head 80 Substrate 91 1st Part 92 2nd Part 96 Tray 97 Parts Tape 110 Substrate loading section 120 Attachment part 130 Temporary crimping part 140 Main crimping section 150 Substrate removal section 160 Conveyor 170 Control section D1 1st direction D2 2nd direction D3 Third direction m1 1st mode m2 2nd mode P1, P2 position RA Handover Area rc common route r1 1st route r2 Second route

Claims

1. a placement section on which a substrate is placed; a crimping head unit that crimps a first component or a second component onto the substrate placed on the placement unit; A transfer unit that transfers the first component or the second component from a predetermined transfer area to the crimping head unit; an imaging unit that is disposed above the transfer area and captures an image of the first component or the second component supplied to the transfer area; a lower light source that irradiates light from below the second component supplied to the transfer area; A moving device capable of moving the lower light source; Equipped with In a first mode for transferring the first component, the transfer unit holds the first component supplied to the transfer area from an upper surface side of the first component, turns the first component upside down, and transfers the first component to the crimping head unit, and in a second mode for transferring the second component, the transfer unit holds the second component supplied to the transfer area from a lower surface side of the second component and transfers the second component to the crimping head unit. the moving device disposes the lower light source at a position below the transfer area in the second mode, and retreats the lower light source to a position different from the position in the first mode. Component crimping device.

2. The moving device is a stage for supporting the first component taken out from the first take-out section; a moving mechanism that moves the stage from the first removal unit to the delivery area, The lower light source is provided on the stage. The component crimping device according to claim 1 .

3. the moving mechanism, in the first mode, moves the stage in a horizontal direction to retract the lower light source to the other position; The component crimping device according to claim 2 .

4. the other position is outside the range of movement of the stage; The component crimping device according to claim 3 .

5. moreover, an upper light source that irradiates light from above onto the first component supported by the stage in the transfer area; the imaging unit images the first component supported on the stage in the transfer area by using light emitted from the upper light source. The component crimping device according to any one of claims 2 to 4.

6. the first component is an integrated circuit (IC) component, The second component is a TCP (Tape Carrier Package) component. The component crimping device according to any one of claims 1 to 5.

7. A component transfer method for a component crimping apparatus including: a crimping head unit that crimps a first component or a second component onto a substrate; a transfer unit that transfers the first component or the second component from a predetermined transfer area to the crimping head unit; an imaging unit that is disposed above the transfer area and images the first component or the second component supplied to the transfer area; a lower light source that irradiates light from below onto the second component supplied to the transfer area; and a moving device that can move the lower light source, In a first mode, the transfer unit holds the first component supplied to the transfer area from an upper surface side of the first component, turns the first component upside down, and transfers the first component to the crimping head unit, and in a second mode, holds the second component supplied to the transfer area from a lower surface side of the second component and transfers it to the crimping head unit. the moving device disposes the lower light source at a position below the transfer area in the second mode, and retreats the lower light source to a position different from the position in the first mode. Parts transfer method.

Images