SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a technique enabling reduction of the number of substrates to be discarded even when an abnormality occurs in a processing unit.SOLUTION: A substrate processing system according to an embodiment of the present disclosure, comprises: a plurality of processing units capable of performing the same type processing on a substrate; a conveying device that conveys the substrate to the plurality of processing units; and a control section that controls the plurality of processing units and the conveying device. The control section includes: a relief processing section; a conveying processing section; and a re-relief processing section. The relief processing section performs a relief processing in an abnormality processing unit with respect to a residence substrate in the processing by the abnormality processing unit in which an abnormality occurs. The conveying processing section conveys a residence substrate to another processing unit from the abnormality processing unit on the basis of a preset conveying pattern when the relief processing cannot be performed for the residence substrate in the abnormality processing unit. The re-relief processing section performs the relief processing again on the residence substrate conveyed to another processing unit.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The disclosed embodiments relate to a substrate processing system and a substrate processing method. [Background technology]

[0002] 2. Description of the Related Art Conventionally, in a substrate processing apparatus that processes substrates such as semiconductor wafers (hereinafter also referred to as wafers), a technique for improving the yield of processed substrates is known (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-148734 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can reduce the number of discarded substrates even when an abnormality occurs in a processing unit. [Means for solving the problem]

[0005] A substrate processing system according to one aspect of the present disclosure includes a plurality of processing units capable of performing the same type of processing on substrates, a transport device that transports the substrates to the plurality of processing units, and a controller that controls the plurality of processing units and the transport device. The controller also includes a relief processing unit, a transport processing unit, and a re-relief processing unit. The relief processing unit performs relief processing in the abnormal processing unit for a stuck substrate being processed in an abnormal processing unit in which an abnormality has occurred. When the abnormal processing unit is unable to perform relief processing on the stuck substrate, the transport processing unit transports the stuck substrate from the abnormal processing unit to another of the processing units based on a preset transport pattern. The re-relief processing unit performs relief processing again on the stuck substrate transported to the other of the processing units. Effect of the Invention

[0006] According to the present disclosure, even if an abnormality occurs in a processing unit, the number of substrates to be discarded can be reduced. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing a schematic configuration of a substrate processing system according to an embodiment. [Diagram 2] FIG. 2 is a schematic diagram showing a specific configuration example of the processing unit according to the embodiment. [Diagram 3] FIG. 3 is a schematic diagram showing a specific configuration example of the inspection device according to the embodiment. [Figure 4] FIG. 4 is a schematic diagram showing a specific configuration example of the cleaning device according to the embodiment. [Diagram 5] FIG. 5 is a schematic diagram showing a specific configuration example of the cleaning device according to the embodiment. [Figure 6] FIG. 6 is a block diagram showing a specific configuration example of the control device according to the embodiment. [Figure 7] FIG. 7 is a diagram illustrating an example of a transport pattern storage unit according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining a first conveying pattern according to the embodiment. [Figure 9] FIG. 9 is a diagram for explaining a second conveying pattern according to the embodiment. [Figure 10] FIG. 10 is a diagram for explaining the third conveying pattern according to the embodiment. [Figure 11] FIG. 11 is a diagram illustrating an example of the examination information storage unit according to the embodiment. [Figure 12] FIG. 12 is a diagram illustrating an example of a recipe information storage unit according to the embodiment. [Figure 13] FIG. 13 is a diagram illustrating an example of a transport information storage unit according to the embodiment. [Figure 14]FIG. 14 is a flowchart showing a procedure of substrate processing executed in the substrate processing system according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, with reference to the attached drawings, an embodiment of the substrate processing system and the substrate processing method disclosed in the present application will be described in detail. Note that the present disclosure is not limited to the embodiments shown below. It should be noted that the drawings are schematic, and the dimensional relationship of each element, the ratio of each element, and the like may differ from reality. Furthermore, there may be parts in which the dimensional relationship and ratio differ between the drawings.

[0009] 2. Description of the Related Art Conventionally, in a substrate processing apparatus that processes substrates such as semiconductor wafers (hereinafter also referred to as wafers), a technique for improving the yield of processed substrates has been known.

[0010] However, in conventional technology, when an abnormality occurs in a processing unit, it is difficult to rescue a substrate that was being processed in the processing unit in which the abnormality occurred (hereinafter also referred to as the "abnormal processing unit").

[0011] In particular, if a different abnormality occurs while a substrate that had been processed in an abnormal processing unit is being salvaged in the same unit, it has been difficult to salvage the substrate, and the substrate has had to be discarded.

[0012] Therefore, there is a need for a technology that can overcome the above-mentioned problems and reduce the number of substrates that are discarded even when an abnormality occurs in a processing unit.

[0013] <Outline of the substrate processing system> First, a schematic configuration of a substrate processing system 1 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing a schematic configuration of a substrate processing system 1 according to an embodiment. In the following, to clarify the positional relationship, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are defined, and the positive direction of the Z-axis is defined as the vertical upward direction.

[0014] 1, the substrate processing system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are disposed adjacent to each other.

[0015] The carry-in / out station 2 includes a carrier placement section 11 and a transport section 12. An inspection device 15 is disposed in the transport section 12. A plurality of carriers C are placed on the carrier placement section 11, each of which accommodates a plurality of substrates, in this embodiment, semiconductor wafers W (hereinafter referred to as wafers W), in a horizontal state.

[0016] The transfer section 12 is disposed adjacent to the carrier placement section 11, and includes therein a substrate transfer device 13 and a transfer section 14. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 13 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the carrier C, the transfer section 14, and the inspection device 15 using the wafer holding mechanism.

[0017] The inspection device 15 inspects the processing state of the processed wafer W. In the present disclosure, the inspection device 15 is provided as an in-line inspection device that can inspect the wafer W processed in the multiple processing units 17 before being carried out to the carrier C. The inspection device 15 will be described in detail later.

[0018] The processing station 3 is disposed adjacent to the transport section 12. The processing station 3 includes a transport section 16, a plurality of (ten in the figure) processing units 17, and a cleaning device 19. The plurality of processing units 17 and the cleaning device 19 are disposed side by side on both sides of the transport section 16.

[0019] The transfer section 16 includes a substrate transfer device 18 therein. The substrate transfer device 18 is an example of a transfer device. The substrate transfer device 18 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 18 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the delivery section 14 and the processing unit 17 using the wafer holding mechanism.

[0020] The processing units 17 perform a predetermined substrate processing on the wafers W transferred by the substrate transfer device 18. The multiple processing units 17 arranged in the processing station 3 are all capable of performing the same type of substrate processing. The processing units 17 will be described in detail later.

[0021] The cleaning device 19 cleans the substrate transfer device 18. Details of the cleaning device 19 will be described later.

[0022] The substrate processing system 1 also includes a control device 4. The control device 4 is, for example, a computer, and includes a control unit 5 and a storage unit 6. The storage unit 6 stores programs for controlling various processes executed in the substrate processing system 1. The control unit 5 controls the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 6. The control device 4 will be described in detail later.

[0023] Such a program may be recorded in a computer-readable storage medium and installed from that storage medium into the storage unit 6 of the control device 4. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

[0024] Furthermore, the memory unit 6 is not limited to being provided in the control device 4 of the substrate processing system 1, but may be provided in a storage device located in a location separate from the substrate processing system 1, and the storage device and the control device 4 of the substrate processing system 1 may be connected via a network.

[0025] In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 in the loading / unloading station 2 takes out the wafer W from the carrier C placed on the carrier placement part 11, and places the taken-out wafer W on the transfer part 14. The wafer W placed on the transfer part 14 is taken out of the transfer part 14 by the substrate transfer device 18 in the processing station 3, and is carried into the processing unit 17.

[0026] The wafer W carried into the processing unit 17 is processed by the processing unit 17, and then carried out of the processing unit 17 by the substrate transfer device 18 and placed on the transfer section 14. Then, the processed wafer W placed on the transfer section 14 is carried into the inspection device 15 by the substrate transfer device 13.

[0027] The processed wafer W carried into the inspection device 15 is inspected by the inspection device 15, and then carried out of the inspection device 15 by the substrate transfer device 13 and returned to the carrier C on the carrier mounting section 11.

[0028] <Processing unit configuration> Next, the configuration of the processing unit 17 according to the embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic diagram showing a specific configuration example of the processing unit 17 according to the embodiment. As shown in Fig. 2, the processing unit 17 includes a chamber 20, a substrate processing section 30, a liquid supply section 40, and a collection cup 50.

[0029] The chamber 20 accommodates a substrate processing unit 30, a liquid supply unit 40, and a collection cup 50. An FFU (Fan Filter Unit) 21 is disposed on the ceiling of the chamber 20. The FFU 21 forms a downflow within the chamber 20.

[0030] Substrate processing unit 30 includes a holder 31, a support 32, and a drive unit 33, and performs liquid processing on a placed wafer W. Holder 31 holds wafer W horizontally. Support 32 is a member extending in the vertical direction, with a base end rotatably supported by drive unit 33 and a tip end supporting holder 31 horizontally. Drive unit 33 rotates support 32 about a vertical axis.

[0031] In the substrate processing unit 30, the supporting column 32 is rotated using the driving unit 33, thereby rotating the holding unit 31 supported by the supporting column 32, and thereby rotating the wafer W held by the holding unit 31.

[0032] A holding member 31a for holding the wafer W from the side is disposed on the upper surface of a holding unit 31 included in the substrate processing unit 30. The wafer W is held horizontally by the holding member 31a while being slightly spaced from the upper surface of the holding unit 31. The wafer W is held by the holding unit 31 with the surface on which the substrate processing is performed facing upward.

[0033] The liquid supply unit 40 supplies a processing fluid to the wafer W. The liquid supply unit 40 includes nozzles 41a to 41d, an arm 42 that horizontally supports the nozzles 41a to 41d, and a rotating and lifting mechanism 43 that rotates and raises and lowers the arm 42.

[0034] The nozzle 41a is connected to an etching liquid supply source 46a via a valve 44a and a flow rate regulator 45a. The etching liquid is used, for example, in an etching process. The nozzle 41b is connected to a DIW supply source 46b via a valve 44b and a flow rate regulator 45b. The DIW (DeIonized Water) is used, for example, in a rinsing process.

[0035] The nozzle 41c is connected to a cleaning liquid supply source 46c via a valve 44c and a flow rate regulator 45c. The cleaning liquid is, for example, SC1 (a mixture of ammonia and hydrogen peroxide solution) and is used for the cleaning process. The nozzle 41d is connected to an IPA supply source 46d via a valve 44d and a flow rate regulator 45d. IPA (Isopropyl Alcohol) is, for example, used for the drying process.

[0036] The nozzle 41a discharges an etching liquid supplied from an etching liquid supply source 46a. The nozzle 41b discharges DIW supplied from a DIW supply source 46b. The nozzle 41c discharges a cleaning liquid supplied from a cleaning liquid supply source 46c. The nozzle 41d discharges IPA supplied from an IPA supply source 46d.

[0037] In the processing unit 17 of the embodiment, the nozzles 41a to 41d are disposed above the wafer W (on the front side), but the nozzles 41a to 41d may be disposed below the wafer W (on the back side).

[0038] Collection cup 50 is disposed so as to surround holding part 31, and collects the processing liquid scattered from wafer W due to the rotation of holding part 31. A drainage port 51 is disposed at the bottom of collection cup 50, and the processing liquid collected by collection cup 50 is discharged from drainage port 51 to the outside of processing unit 17. In addition, an exhaust port 52 is disposed at the bottom of collection cup 50, which discharges gas supplied from FFU 21 to the outside of processing unit 17.

[0039] <Inspection equipment configuration> Next, the configuration of the inspection device 15 according to the embodiment will be described with reference to Fig. 3. Fig. 3 is a schematic diagram showing a specific configuration example of the inspection device 15 according to the embodiment. As shown in Fig. 3, the inspection device 15 includes a housing 61, a rotating mounting table 62, an illumination unit 63, a camera 64, and a data processing unit 65.

[0040] The housing 61 has an opening 61a through which the wafer W is loaded and unloaded, and accommodates therein a rotating stage 62, an illumination unit 63, and a camera 64. The rotating stage 62 horizontally supports the wafer W and adjusts the orientation of the supported wafer W. The illumination unit 63 illuminates the surface of the wafer W supported by the rotating stage 62.

[0041] The camera 64 captures an image of the surface of the wafer W supported on the rotary mounting table 62. The camera 64 has, for example, a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor.

[0042] The data processing unit 65 processes the image of the wafer W obtained by the camera 64, and performs various inspections of the wafer W based on the processed image of the wafer W.

[0043] The inspection apparatus 15 according to the embodiment can perform, for example, particle number detection for detecting the number of particles adhering to the wafer W, pattern collapse detection for detecting collapse of a pattern formed on the wafer W, and the like.

[0044] In addition, the inspection apparatus 15 according to the embodiment can also perform splashback detection, which detects splashback, which occurs when the solvent of the resist liquid that has splashed out from the surface of the wafer W re-adheres to the wafer W, and coating unevenness detection, which detects unevenness in the coating of the resist liquid.

[0045] It should be noted that the inspections that can be performed by the inspection apparatus 15 according to the embodiment are not limited to the above examples, and various inspections for checking the processing state of the wafer W processed in the processing unit 17 can be performed.

[0046] In addition, the example of Figure 3 shows a case where the camera 64 captures an image of the front surface of the wafer W for inspection, but the camera 64 is not limited to the case where the camera 64 captures an image of the front surface of the wafer W for inspection, and may capture an image of the back surface or edge portion of the wafer W for inspection.

[0047] <Cleaning Equipment Configuration> Next, the configuration of the cleaning device 19 according to the embodiment will be described with reference to Fig. 4 and Fig. 5. Fig. 4 and Fig. 5 are schematic diagrams showing specific configuration examples of the cleaning device 19 according to the embodiment.

[0048] 4 is a cross-sectional view of the cleaning apparatus 19 as viewed from the side, and Fig. 5 is a cross-sectional view of the cleaning apparatus 19 as viewed from above. Figs. 4 and 5 also show the substrate transport apparatus 18 to be cleaned.

[0049] 4 and 5, the substrate transfer device 18 has a transfer arm 110 that holds the outer periphery of the wafer W (see FIG. 1) and transfers it. As shown in FIG. 5, the transfer arm 110 has a frame portion 111 and an arm portion 112.

[0050] The frame portion 111 is configured, for example, in a 3 / 4 ring shape in order to support the outer periphery of the wafer W. The arm portion 112 is configured integrally with the frame portion 111 and supports the frame portion 111.

[0051] The frame portion 111 has a plurality of holding portions 113 arranged at, for example, three locations, which directly support the outer periphery of the wafer W. The plurality of holding portions 113 are arranged at equal intervals on the inner circumference of the frame portion 111 and protrude inward from the frame portion 111.

[0052] 4, a base 114 that supports the transfer arm 110 is disposed on the underside of the transfer arm 110. A drive mechanism 115 is provided on the base 114. The substrate transfer device 18 can move the transfer arm 110 in the horizontal direction (the X-axis direction in FIG. 4) by operating the drive mechanism 115.

[0053] A shaft 116 supporting the base 114 is disposed on the underside of the driving mechanism 115. A driving mechanism 117 is further provided on the underside of the shaft 116. By operating the driving mechanism 117, the substrate transport device 18 can raise and lower the transport arm 110 in the vertical direction (the Z-axis direction in FIG. 4) and rotate the transport arm 110.

[0054] The cleaning device 19 has a processing container 120 with an opening on the side facing the substrate transfer device 18. The cleaning device 19 can clean the holder 113 of the transfer arm 110 in the processing container 120 by inserting the transfer arm 110 through an opening 121 on the side of the processing container 120.

[0055] Gas injectors 130 for injecting gas are disposed above and below opening 121 of processing vessel 120. Gas injectors 130 are fixed to the inner walls on the upper and lower sides of processing vessel 120, respectively.

[0056] The gas injection unit 130 has a gas injection nozzle 132 in which a plurality of gas injection ports 131 are arranged. The injection ports 131 of the gas injection unit 130 located at the upper part of the opening 121 are arranged at the lower end of the gas injection nozzle 132. As a result, the gas injection unit 130 located at the upper part of the opening 121 injects gas vertically downward (in the negative direction of the Z axis in FIG. 4) from the injection ports 131.

[0057] On the other hand, the outlet 131 of the gas injection unit 130 located at the bottom of the opening 121 is disposed at the upper end of the gas injection nozzle 132. As a result, the gas injection unit 130 located at the bottom of the opening 121 injects gas vertically upward (the positive direction of the Z axis in FIG. 4) from the outlet 131.

[0058] As shown in FIG. 5, gas injection nozzle 132 extends in the short direction of processing vessel 120 (X-axis direction in FIG. 5), and both ends thereof are supported by fixing members 133 fixed to the upper or lower part of processing vessel 120.

[0059] Further, a gas supply source 135 is connected to the gas injection nozzle 132 via a supply pipe 134. A heating mechanism 136 such as a heater is disposed in the supply pipe 134. The heating mechanism 136 heats the gas supplied from the gas supply source 135.

[0060] When gas is supplied from the gas supply source 135 to the gas injection nozzle 132 and the gas is injected from the gas injection nozzle 132, the opening 121 is blocked by the airflow of the injected gas, forming a so-called air curtain at the opening 121. The gas injected from the gas injection nozzle 132 may be, for example, air.

[0061] Also, an exhaust port (not shown) may be disposed in the processing vessel 120 so that the air current of the air curtain does not flow outside the processing vessel 120. In this case, the control unit 5 (see FIG. 1) can prevent the air current of the air curtain from flowing outside the processing vessel 120 by exhausting air from the exhaust port when the air curtain is formed.

[0062] 4, a cleaning nozzle 140 that discharges a cleaning gas and a cleaning liquid is disposed in the upper portion of the processing vessel 120. The cleaning nozzle 140 has a size (e.g., approximately the same size as the holding part 113) that allows the cleaning gas and the cleaning liquid to be uniformly discharged from above onto the holding part 113 of the transfer arm 110.

[0063] A cleaning gas supply source 142 is connected to the cleaning nozzle 140 via a cleaning gas supply pipe 141. A heating mechanism 143 such as a heater is provided to the supply pipe 141. The heating mechanism 143 heats the cleaning gas supplied from the cleaning gas supply source 142.

[0064] Further, a cleaning liquid supply source 145 is connected to the cleaning nozzle 140 via a cleaning liquid supply pipe 144. A heating mechanism 146 such as a heater is provided to the supply pipe 144. The heating mechanism 146 heats the cleaning liquid supplied from the cleaning liquid supply source 145. The cleaning liquid is heated, for example, until it becomes mist-like.

[0065] The cleaning liquid supplied from the cleaning liquid supply source 145 is discharged from the cleaning nozzle 140 at a high discharge pressure by the cleaning gas supplied from the cleaning gas supply source 142 .

[0066] The cleaning gas may be, for example, nitrogen gas, compressed air, helium gas, etc. The cleaning liquid may be, for example, pure water (preferably at high temperature), thinner, amine-based organic solvent, HFE (hydrofluoroether), acetone, IPA, etc.

[0067] 5, the cleaning nozzle 140 is connected to a moving mechanism 148 via an arm 147. The arm 147 can be moved by the moving mechanism 148 along a guide rail 149 extending in the longitudinal direction of the processing vessel 120 (the Y-axis direction in FIG. 5).

[0068] Moreover, the arm 147 can be moved by a moving mechanism 148 in the widthwise direction of the processing vessel 120 (the X-axis direction in FIG. 5) and also in the vertical direction (the Z-axis direction in FIG. 5).

[0069] 4, a drain port 150 is disposed on the bottom surface of the processing vessel 120 to collect the cleaning liquid discharged from the cleaning nozzle 140 and dropped onto the bottom surface of the processing vessel 120. A drain pipe 151 is connected to the drain port 150. The drain port 150 can also be used as an exhaust port.

[0070] Next, a cleaning process of the transfer arm 110 performed in the cleaning device 19 described above will be described. First, the control unit 5 causes the transfer arm 110 to enter the processing vessel 120 from the opening 121. At this time, gas injection from the gas injection nozzle 132 is stopped.

[0071] Then, when the control unit 5 causes the transfer arm 110 to advance to a predetermined position, it moves the cleaning nozzle 140 to directly above one of the holders 113 on the transfer arm 110.

[0072] Next, the control unit 5 discharges the cleaning gas and the cleaning liquid from the cleaning nozzle 140 toward one of the holding units 113. At this time, the cleaning liquid is heated to, for example, 70° C. by the heating mechanism 146 and is in the form of mist. Similarly, the cleaning gas is heated to, for example, 70° C. by the heating mechanism 143.

[0073] The cleaning liquid discharged from cleaning nozzle 140 is discharged with strong pressure by the cleaning gas, so that particles of the mist-like cleaning liquid collide with holding portion 113, and foreign matter adhering to holding portion 113 is removed.

[0074] The cleaning liquid that has dropped to the bottom surface of the processing vessel 120 is discharged from the drain port 150. Note that, while the cleaning gas and cleaning liquid are being discharged from the cleaning nozzle 140, the control unit 5 causes the gas jet nozzle 132 to jet gas.

[0075] Then, an air curtain is formed at the opening 121, and the cleaning liquid discharged from the cleaning nozzle 140 does not scatter outside the processing vessel 120. When discharging the cleaning gas and the cleaning liquid, the control unit 5 may discharge the mixture from the cleaning nozzle 140 after mixing the cleaning gas and the cleaning liquid.

[0076] The control unit 5 ejects the cleaning gas and cleaning liquid for a predetermined time, and when one holding unit 113 is cleaned, it then ejects only the cleaning gas from the cleaning nozzle 140. In this way, the control unit 5 dries the holding unit 113 wetted with the cleaning liquid. It is preferable that the control unit 5 ejects gas from the gas ejection nozzle 132 to form an air curtain at the opening 121 even while drying the holding unit 113.

[0077] When the cleaning and drying processes of one holder 113 are thus completed, the control unit 5 then moves the cleaning nozzle 140 to directly above another holder 113 and performs the cleaning and drying processes of that other holder 113. In this manner, the control unit 5 cleans all three holders 113 of the transfer arm 110.

[0078] Then, when cleaning of all of the holders 113 is completed, the control unit 5 causes the transfer arm 110 to retreat from the processing vessel 120. At this time, the control unit 5 causes gas to be jetted from the gas jet nozzle 132, and the gas is heated by the heating mechanism 136 to, for example, 70° C.

[0079] This allows the control unit 5 to completely dry the transfer arm 110 with the heated gas when the holder 113 of the transfer arm 110 passes through the opening 121 .

[0080] <Control device configuration> Next, a detailed configuration of the control device 4 according to the embodiment will be described with reference to Fig. 6 to Fig. 13. Fig. 6 is a block diagram showing a specific configuration example of the control device 4 according to the embodiment. As described above, the control device 4 includes the control unit 5 and the storage unit 6.

[0081] The substrate processing system 1 may also have an input unit (such as a keyboard or mouse) that accepts various operations from a user who uses the substrate processing system 1, and a display unit (such as a liquid crystal display) that displays various information.

[0082] The control unit 5 is realized, for example, by a CPU (Central Processing Unit) or an MPU (Micro Processing Unit) executing various programs stored in the storage unit 6 using a RAM (Random Access Memory) as a working area. The control unit 5 is also realized, for example, by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).

[0083] 6, the control unit 5 has a substrate processing unit 5a, a relief processing unit 5b, a selection unit 5c, a transfer processing unit 5d, a re-relief processing unit 5e, and an inspection unit 5f, and realizes or executes the functions and actions of substrate processing described below. Note that the internal configuration of the control unit 5 is not limited to the configuration shown in FIG. 6, and may be other configurations as long as they perform the substrate processing described below.

[0084] The storage unit 6 is realized by, for example, a semiconductor memory element such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk. As shown in Fig. 6, the storage unit 6 has a transport pattern storage unit 6a, an inspection information storage unit 6b, a recipe information storage unit 6c, and a transport information storage unit 6d.

[0085] The substrate processing section 5a reads out a process recipe and a transfer recipe for the wafer W from the storage section 6 or the like, controls each section based on these recipes, and processes the wafer W in each of the multiple processing units 17. The processing conditions for the wafer W are set in advance in the process recipe, and the transfer conditions for the wafer W are set in advance in the transfer recipe.

[0086] For example, the process recipe includes an etching process using an etching liquid, a rinsing process using a rinsing liquid, a cleaning process using a cleaning liquid, a rinsing process using a rinsing liquid, and a drying process using a drying liquid, in this order. Note that the processes included in the process recipe are not limited to the above example, and various processes that can be performed by the processing unit 17 may be included.

[0087] When an abnormality occurs in one of the processing units 17, the relief processing unit 5b performs relief processing in the abnormal processing unit 17A (see FIG. 8) for a wafer W (hereinafter also referred to as a retained wafer) that was being processed when the abnormality occurred in the same abnormal processing unit 17A. The retained wafer is an example of a retained substrate.

[0088] Such a rescue process is, for example, a process of washing away the chemical liquid adhering to the retained wafers with a rinse liquid. Since the chemical reaction caused by the chemical liquid adhering to the retained wafers is stopped by such a rescue process (washing process), it becomes possible to avoid discarding the retained wafers by separately carrying out subsequent substrate processing.

[0089] That is, in the embodiment, even if an abnormality occurs in the processing unit 17, the number of wafers W to be discarded can be reduced by this rescue processing.

[0090] When the abnormality processing unit 17A cannot perform rescue processing for the retained wafer, the selection unit 5c selects one transport pattern to be performed by the transport processing unit 5d from the multiple transport patterns stored in the transport pattern storage unit 6a. The details of the transport pattern selection process performed by the selection unit 5c will be described later.

[0091] When the abnormal processing unit 17A cannot perform rescue processing for the accumulated wafer, the transfer processing unit 5d transfers the accumulated wafer from the abnormal processing unit 17A to another normal processing unit 17 based on a preset transfer pattern.

[0092] For example, when the abnormality processing unit 17A cannot perform rescue processing for the accumulated wafer, the transfer processing unit 5d transfers the accumulated wafer from the abnormality processing unit 17A to another processing unit 17 based on one transfer pattern selected by the selection unit 5c.

[0093] Fig. 7 is a diagram showing an example of a transport pattern storage unit 6a according to the embodiment. As shown in Fig. 7, the transport pattern storage unit 6a stores a plurality of transport patterns (for example, pattern 1 to pattern 3).

[0094] The transport patterns stored in the transport pattern storage unit 6a include a transport sequence of the multiple wafers W that is different from the transport sequence of the multiple processing units 17 that is performed when all of the multiple processing units 17 are normal. A specific example of such a transport pattern will be described below.

[0095] Fig. 8 is a diagram for explaining pattern 1 of the transfer pattern according to the embodiment. In Figs. 8 to 10, for ease of understanding, the transfer sequence of the wafers W under normal conditions is shown on the left side, and the transfer sequence of the wafers W under abnormal conditions is shown on the right side. In Figs. 8 to 10, the order in which the wafers W are carried out from the ten processing units 17 is indicated by numbers in circles.

[0096] As shown in FIG. 8, pattern 1, which is one of multiple transport patterns, is a transport pattern in which priority is given to removing wafers W that have been processed normally, and the transport of retained wafers that have been processed in the abnormal processing unit 17A is performed last.

[0097] For example, in pattern 1, the transfer order of the retained wafers that were being processed in the abnormal processing unit 17A is changed from the seventh place under normal circumstances to the last, tenth place. Note that between multiple wafers W that have been normally processed in multiple processing units 17, the wafers W are transferred in the order that follows the scheduled transfer order.

[0098] Then, the transport processing unit 5d controls the substrate transport device 18, etc. to transport out the normally processed wafers W in a sequence based on the selected pattern 1, and transports the retained wafers from the abnormal processing unit 17A to another available processing unit 17 in a sequence based on pattern 1.

[0099] 9 is a diagram for explaining the transport pattern 2 according to the embodiment. As shown in FIG 9, the pattern 2, which is one of the multiple transport patterns, is a transport pattern in which the transport of the wafers stuck in the abnormality processing unit 17A is prioritized, and the transport of the stuck wafers that have been processed in the abnormality processing unit 17A is performed first.

[0100] For example, in pattern 2, the transfer order of the retained wafers that were being processed in the abnormal processing unit 17A is changed from seventh in the normal case to second. The reason why it is second and not first (first) is that in order to transfer the retained wafer to another processing unit 17, the wafer W needs to be unloaded from the other processing unit 17 as the transfer destination first.

[0101] In addition, between the plurality of wafers W that have been normally processed in the plurality of processing units 17, the wafers W are transferred in the scheduled transfer order.

[0102] Then, the transport processing unit 5d controls the substrate transport device 18, etc. to transport the normally processed wafers W out in a sequence based on the selected pattern 2, and transports the retained wafers from the abnormal processing unit 17A to another available processing unit 17 in a sequence based on pattern 2.

[0103] 10 is a diagram for explaining a transfer pattern 3 according to the embodiment. As shown in FIG 10, the transfer pattern 3, which is one of the multiple transfer patterns, is a transfer pattern that prioritizes the transfer of wafers W with short Q-Time from among wafers W processed in all processing units 17 including the abnormal processing unit 17A.

[0104] Here, Q-time refers to a time limit set for the time that the substrate is left standing after dry etching in order to prevent, for example, oxidation of metal wiring exposed by dry etching.

[0105] Then, the transport processing unit 5d controls the substrate transport device 18, etc. to transport the normally processed wafers W in an order based on the selected pattern 3, and transports the retained wafers from the abnormal processing unit 17A to another available processing unit 17 in an order based on pattern 3.

[0106] Returning to the description of Fig. 6, the re-rescue processing unit 5e performs a re-rescue process (hereinafter also referred to as a re-rescue process) on the retained wafer transferred to another processing unit 17. The re-rescue process is a process similar to the above-mentioned rescue process, and is, for example, a process of washing the chemical liquid adhering to the retained wafer with a rinsing liquid.

[0107] Such a re-rescue process stops the chemical reaction caused by the chemical solution adhering to the remaining wafers, and therefore, by separately carrying out subsequent substrate processing thereafter, it becomes possible to avoid discarding the remaining wafers.

[0108] That is, in the embodiment, even if the rescue processing cannot be performed in the abnormality processing unit 17A, the number of wafers W to be discarded can be reduced by performing this re-rescue processing.

[0109] In addition, in an embodiment, it is preferable for the cleaning device 19 to clean the substrate transport device 18 immediately after the transport processing unit 5d transports the retained wafer from the abnormal processing unit 17A to another available processing unit 17 (i.e., before unloading the next wafer W).

[0110] As a result, even if substrate transfer device 18 is contaminated by the chemical liquid adhering to the retained wafers, the normally processed wafers W can be prevented from being contaminated by substrate transfer device 18.

[0111] The inspection unit 5f inspects the processing state of the retained wafer that has been subjected to the salvage process or the re-salvage process by the inspection device 15. Furthermore, the inspection unit 5f stores various parameters of the retained wafer inspected by the inspection device 15 in the inspection information storage unit 6b, the recipe information storage unit 6c, and the transport information storage unit 6d of the storage unit 6.

[0112] The inspection information storage unit 6b stores inspection information related to the inspection results of the retained wafers. Fig. 11 is a diagram showing an example of the inspection information storage unit 6b according to the embodiment. In the inspection information storage unit 6b shown in Fig. 11, a wafer ID, a process alarm, a rescue alarm, a process restart time, a transport pattern, and an inspection result are stored in association with each other.

[0113] Here, the wafer ID is an identifier for identifying the retained wafer. The process alarm is information indicating the type of alarm that occurred during the process (i.e., before the rescue process) in the abnormality processing unit 17A in which the retained wafer indicated by the associated wafer ID was being processed.

[0114] The rescue processing alarm is information indicating the type of alarm that occurred during rescue processing (i.e., before re-rescue processing) in the abnormality processing unit 17A in which the retained wafer indicated by the associated wafer ID was being processed. The process processing alarm and the rescue processing alarm are examples of abnormality information.

[0115] The process restart time is information indicating the time that has elapsed since normal processing was interrupted until the subsequent processing was restarted for the retained wafer indicated by the associated wafer ID.

[0116] The transport pattern is information indicating the transport pattern selected by the selection unit 5c when the retained wafer indicated by the associated wafer ID is transported from the abnormal processing unit 17A to the normal processing unit 17, and is an example of transport pattern information. The inspection result is information indicating the inspection result by the inspection device 15 of the retained wafer indicated by the associated wafer ID, and is an example of inspection information.

[0117] The recipe information storage unit 6c stores recipe information related to the transfer processing and process processing of the retained wafer. Fig. 12 is a diagram showing an example of the recipe information storage unit 6c according to the embodiment. The recipe information storage unit 6c shown in Fig. 12 stores the above-mentioned wafer ID, transfer recipe, and process recipe in association with each other.

[0118] The transfer recipe is information indicating a transfer recipe that has been set in advance for a retained wafer indicated by a corresponding wafer ID. The process recipe is information indicating a process recipe that has been set in advance for a retained wafer indicated by a corresponding wafer ID. The transfer recipe and the process recipe are examples of recipe information.

[0119] The transport information storage unit 6d stores transport information related to the transport process of the retained wafer. Fig. 13 is a diagram showing an example of the transport information storage unit 6d according to the embodiment. The transport information storage unit 6d shown in Fig. 13 stores the above-mentioned wafer ID, Q-Time setting time, carrier carry-in / out time, and transport passing module in association with each other.

[0120] The Q-Time setting time is information indicating the Q-Time preset for the retained wafer indicated by the associated wafer ID. The carrier carry-in / out time is information indicating the time from when the retained wafer indicated by the associated wafer ID is carried out from carrier C (see FIG. 1) to when it is carried into carrier C.

[0121] The transport passing module is information indicating various modules through which the retained wafer indicated by the associated wafer ID passes when being transported in the substrate processing system 1. The transport passing module stores, for example, the number of the stage on which the carrier C was placed (S1, etc.), the number of the processing unit 17 in which the retained wafer was processed (P1, etc.), and the number of the inspection device 15 in which the retained wafer was inspected (T1, etc.).

[0122] Furthermore, the transfer information storage unit 6d may store details of the time that the retained wafers were located in each of the modules in the substrate processing system 1.

[0123] In the embodiment, the selection unit 5c may select one transport pattern from the multiple transport patterns using various information stored in the inspection information storage unit 6b, the recipe information storage unit 6c, and the transport information storage unit 6d of the storage unit 6. The details of the transport pattern selection process by the selection unit 5c will be described below.

[0124] First, the selection unit 5c extracts data in which the "processing alarm" and "relief alarm" stored in the inspection information storage unit 6b match the "transfer recipe" and "process recipe" stored in the recipe information storage unit 6c.

[0125] Then, when the extracted data is equal to or greater than the given number, the selection unit 5c further extracts data for each "transport pattern" from the extracted data.

[0126] Then, if the amount of data for each extracted "transport pattern" is equal to or greater than a given number, the selection unit 5c calculates the abnormality rate in the inspection results for each "transport pattern" and selects the transport pattern with the lowest calculated abnormality rate.

[0127] In this manner, the selection unit 5c may select one of the multiple transport patterns based on the type of abnormality that occurred in the abnormality processing unit 17A. This allows the transport processing unit 5d to transport the retained wafer from the abnormality processing unit 17A to another processing unit 17 using the transport pattern with the lowest abnormality rate.

[0128] Therefore, according to the embodiment, the number of remaining wafers salvaged by the re-salvage process can be further increased, and the number of discarded wafers W can be further reduced.

[0129] In addition, when the number of data extracted in the above selection process is less than a given number, the selection unit 5c may select a transport pattern set in advance. For example, the selection unit 5c may select the pattern 2 in which priority is given to rescue processing of a retained wafer in a normal state, and may select the pattern 1 in which priority is given to processing of a normal wafer W when the number of jobs waiting to be processed of a wafer W in the substrate processing system 1 increases.

[0130] Furthermore, when product defects due to Q-Time exceedance are found in product inspection downstream of the substrate processing system 1, the selection unit 5c may select pattern 3 in which priority is given to processing of wafers W with short Q-Time.

[0131] Furthermore, if the amount of data extracted in the above selection process is less than a given amount, the selection unit 5c may simply select the transportation pattern with the lowest abnormality rate.

[0132] In addition, when the re-rescue process is performed in a certain processing unit 17, if the abnormality rate is significantly higher than when the re-rescue process is performed in another processing unit 17, the transport processing unit 5d may not transport the retained wafer to the processing unit 17 with the high abnormality rate.

[0133] This makes it possible to further increase the number of remaining wafers salvaged by the re-salvage process, thereby further reducing the number of discarded wafers W.

[0134] The substrate processing system 1 according to the embodiment includes a plurality of processing units 17, a transport device (substrate transport device 18), and a controller 5. The plurality of processing units 17 can perform the same type of processing on a substrate (wafer W). The transport device (substrate transport device 18) transports the substrate (wafer W) to the plurality of processing units 17. The controller 5 controls the plurality of processing units 17 and the transport device (substrate transport device 18). The controller 5 also includes a relief processor 5b, a transport processor 5d, and a re-relief processor 5e. The relief processor 5b performs relief processing in the abnormality processing unit 17A for a retained substrate (retained wafer) being processed in the abnormality processing unit 17A where an abnormality has occurred. When the abnormality processing unit 17A cannot perform relief processing on the retained substrate (retained wafer), the transport processor 5d transports the retained substrate (retained wafer) from the abnormality processing unit 17A to another processing unit 17 based on a preset transport pattern. The re-relief processing unit 5e performs the relief processing again on the retained substrate (retained wafer) transported to another processing unit 17. This makes it possible to reduce the number of wafers W to be discarded even if an abnormality occurs in the processing unit 17.

[0135] Furthermore, in the substrate processing system 1 according to the embodiment, the transfer pattern includes a transfer order of the substrates (wafers W) that is different from the transfer order of the substrates (wafers W) that is performed when all of the processing units 17 are normal. This makes it possible to reduce the number of wafers W to be discarded even when an abnormality occurs in a processing unit 17.

[0136] In the substrate processing system 1 according to the embodiment, the control unit 5 further includes a selection unit 5c that selects one transfer pattern to be performed by the transfer processing unit 5d from a plurality of transfer patterns each having a different transfer order. This makes it possible to reduce the number of discarded wafers W even if an abnormality occurs in the processing unit 17.

[0137] In the substrate processing system 1 according to the embodiment, the selector 5c selects one of the multiple transport patterns based on the type of abnormality that occurs in the abnormality processing unit 17A, thereby further reducing the number of discarded wafers W.

[0138] Moreover, the substrate processing system 1 according to the embodiment includes an inspection device 15 and a storage unit 6. The inspection device 15 inspects the processing state of the processed substrate (wafer W). The storage unit 6 stores the inspection information, the transport pattern information, the anomaly information, and the recipe information in association with each other. The inspection information is information on the processing state of the retained substrate (retained wafer) inspected by the inspection device 15. The transport pattern information is information on the transport pattern when the retained substrate (retained wafer) is transported to another processing unit 17. The anomaly information is information on the type of anomaly that has occurred in the anomaly processing unit 17A. The recipe information is information on the recipe related to the processing of the retained substrate (retained wafer). This makes it possible to reduce the number of wafers W to be discarded even if an anomaly occurs in the processing unit 17.

[0139] Furthermore, in the substrate processing system 1 according to the embodiment, the selector 5c selects one of the multiple transport patterns based on the inspection information, the transport pattern information, the abnormality information, and the recipe information stored in the storage unit 6. This can further reduce the number of discarded wafers W.

[0140] Moreover, the substrate processing system 1 according to the embodiment further includes a cleaning device 19 that cleans the transfer device (substrate transfer device 18). Moreover, the transfer processing unit 5d cleans the transfer device (substrate transfer device 18) with the cleaning device 19 immediately after the transfer device (substrate transfer device 18) transfers the staying substrate (stayed wafer) from the abnormal processing unit 17A to another processing unit 17. This makes it possible to prevent a normally processed wafer W from being contaminated by the substrate transfer device 18, even if the substrate transfer device 18 is contaminated by a chemical solution adhering to the staying wafer.

[0141] <Substrate processing procedure> Next, a procedure for substrate processing according to the embodiment will be described with reference to Fig. 14. Fig. 14 is a flow chart showing a procedure for substrate processing executed in the substrate processing system 1 according to the embodiment.

[0142] First, the control unit 5 controls the substrate transfer devices 13, 18, etc. based on a preset transfer recipe to load a wafer W into each processing unit 17 (step S101). Then, the substrate processing unit 5a controls each processing unit 17 based on a preset process recipe to process a plurality of wafers W (step S102).

[0143] Next, the control unit 5 determines whether or not the processing has been normally completed in all the processing units 17 (Step S103). If the processing has been normally completed in all the processing units 17 (Yes in Step S103), the control unit 5 unloads the wafer W from each processing unit 17 (Step S104), and completes the series of processing.

[0144] On the other hand, if the processing is not normally completed in any of the processing units 17 (step S103, No), the relief processing unit 5b performs relief processing in the abnormality processing unit 17A for the wafers remaining in the abnormality processing unit 17A (step S105).Then, the control unit 5 determines whether the relief processing in the abnormality processing unit 17A has been normally completed (step S106).

[0145] Here, if the rescue process is normally completed in the abnormality processing unit 17A (step S106, Yes), the control unit 5 proceeds to the process of step S104.

[0146] On the other hand, if the rescue process has not ended normally in the abnormality processing unit 17A (step S106, No), the selection unit 5c selects one transport pattern from the multiple transport patterns (step S107).

[0147] Next, the transfer processing unit 5d transfers the remaining wafer from the abnormal processing unit 17A to another processing unit 17 based on the selected transfer pattern (step S108). Then, the re-rescue processing unit 5e performs re-rescue processing on the remaining wafer in the other processing unit 17 (step S109), and the process proceeds to step S104.

[0148] The substrate processing method according to the embodiment includes a rescue step (step S105), a transport step (step S108), and a re-rescue step (step S109). In the rescue step (step S105), among the multiple processing units 17 capable of performing the same type of processing on a substrate (wafer W), the abnormal processing unit 17A performs rescue processing on a retained substrate (retained wafer) being processed in the abnormal processing unit 17A in which an abnormality has occurred. In the transport step (step S108), when the abnormal processing unit 17A cannot perform rescue processing on the retained substrate (retained wafer), the retained substrate (retained wafer) is transported from the abnormal processing unit 17A to another processing unit 17 based on a transport pattern set in advance. In the re-rescue step (step S109), rescue processing is performed again on the retained substrate (retained wafer) transported to the other processing unit 17. This makes it possible to reduce the number of wafers W to be discarded even when an abnormality has occurred in the processing unit 17.

[0149] Although the embodiment of the present disclosure has been described above, the present disclosure is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present disclosure. For example, in the above embodiment, an example in which a plurality of processing units 17 for processing the wafer W by a wet process is provided is shown, but a plurality of processing units for processing the wafer W by various dry processes may be provided.

[0150] The disclosed embodiments should be considered to be illustrative and not restrictive in all respects. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0151] Moreover, the above-mentioned "section, module, unit" can be read as "means" or "circuit", etc. For example, a selection section can be read as a selection means or a selection circuit. [Explanation of symbols]

[0152] W wafer (example of substrate) 1. Substrate Processing System 4. Control device 5. Control section 5b Relief Processing Section 5c Selection section 5d. Transport processing section 5e Re-relief processing section 5F Inspection Department 6 Memory section 6a Transport pattern storage unit 6b Examination information storage unit 6c Recipe information storage section 6d Transport information storage unit 15 Inspection equipment 17 Processing Unit 17A Abnormality Processing Unit 18 Substrate transport device (an example of a transport device) 19 Cleaning Equipment

Claims

1. a plurality of processing units capable of performing the same type of processing on the substrate; a transport device configured to transport the substrate to the processing units; A control unit that controls the processing units and the transport device; Equipped with The control unit is a relief processing unit that performs relief processing in the abnormal processing unit for retained substrates being processed in the abnormal processing unit in which an abnormality has occurred; a transport processing unit that transports the stuck substrate from the abnormal processing unit to another processing unit based on a preset transport pattern when the stuck substrate cannot be rescued by the abnormal processing unit; a re-relief processing unit that performs re-relief processing on the retained substrate transported to another of the processing units; a selection unit that selects one of the transport patterns to be implemented by the transport processing unit from a plurality of the transport patterns each having a different transport order; having the selection unit selects one of the plurality of transport patterns based on a type of the abnormality that has occurred in the abnormality processing unit, an inspection device that inspects a processing state of the substrate after processing; a storage unit that stores, in association with each other, inspection information regarding a processing state of the retained substrate inspected by the inspection device, transport pattern information regarding the transport pattern when the retained substrate is transported to another of the processing units, abnormality information regarding a type of abnormality occurring in the abnormal processing unit, and recipe information regarding a recipe related to the processing of the retained substrate; Further equipped Substrate processing system.

2. The transport pattern includes a transport order that is different from a transport order of the plurality of substrates that is performed when all of the plurality of processing units are normal. The substrate processing system of claim 1 .

3. The selection unit selects one of the plurality of transport patterns based on the inspection information, the transport pattern information, the abnormality information, and the recipe information stored in the storage unit. The substrate processing system according to claim 1 .

4. A plurality of processing units capable of performing the same type of processing on a substrate; a transport device configured to transport the substrate to the processing units; A control unit that controls the processing units and the transport device; Equipped with The control unit is a relief processing unit that performs relief processing in the abnormal processing unit for retained substrates being processed in the abnormal processing unit in which an abnormality has occurred; a transport processing unit that transports the stuck substrate from the abnormal processing unit to another processing unit based on a preset transport pattern when the stuck substrate cannot be rescued by the abnormal processing unit; a re-relief processing unit that performs re-relief processing on the retained substrate transported to another of the processing units; a selection unit that selects one of the transport patterns to be implemented by the transport processing unit from a plurality of the transport patterns each having a different transport order; having the selection unit selects one of the plurality of transport patterns based on a type of the abnormality that has occurred in the abnormality processing unit, The apparatus further includes a storage unit that stores, in association with each other, transport pattern information regarding the transport pattern when transporting the retained substrate to another of the processing units, abnormality information regarding the type of abnormality that has occurred in the abnormal processing unit, and recipe information regarding a recipe related to the processing of the retained substrate. Substrate processing system.

5. The transport pattern includes a transport order that is different from a transport order of the plurality of substrates that is performed when all of the plurality of processing units are normal. The substrate processing system of claim 4 .

6. The conveying device further includes a cleaning device for cleaning the conveying device. The transport processing unit cleans the transport device with the cleaning device immediately after the transport device transports the retained substrate from the abnormal processing unit to another processing unit. The substrate processing system according to any one of claims 1 to 5.

7. a rescue step of performing rescue processing on retained substrates being processed in an abnormal processing unit in which an abnormality has occurred among a plurality of processing units capable of performing the same type of processing on substrates, in the abnormal processing unit; a transport step of transporting the stuck substrate from the abnormal processing unit to another processing unit based on a preset transport pattern when the stuck substrate cannot be rescued by the abnormal processing unit; a re-rescue process for performing re-rescue processing on the retained substrate transported to another processing unit; a selection step of selecting one of the transport patterns to be performed by the transport step from a plurality of the transport patterns each having a different transport order; an inspection step of inspecting a processing state of the substrate after the processing; a storage step of storing, in association with each other, inspection information regarding the processing state of the retained substrate inspected in the inspection step, transport pattern information regarding the transport pattern when the retained substrate is transported to another of the processing units, abnormality information regarding the type of abnormality occurring in the abnormal processing unit, and recipe information regarding a recipe related to the processing of the retained substrate; Including, The selecting step selects one of the plurality of transport patterns based on a type of the abnormality that has occurred in the abnormality processing unit. A method for processing a substrate.

8. A rescue process in which a rescue process is performed in an abnormal processing unit among a plurality of processing units capable of performing the same type of processing on substrates, for a retained substrate being processed in the abnormal processing unit in which an abnormality has occurred; a transport step of transporting the stuck substrate from the abnormal processing unit to another processing unit based on a preset transport pattern when the stuck substrate cannot be rescued by the abnormal processing unit; a re-rescue process for performing re-rescue processing on the retained substrate transported to another processing unit; a selection step of selecting one of the transport patterns to be performed by the transport step from a plurality of the transport patterns each having a different transport order; a storage step of storing transport pattern information on a transport pattern when transporting the retained substrate to another processing unit, abnormality information on a type of abnormality occurring in the abnormal processing unit, and recipe information on a recipe related to processing of the retained substrate in association with each other; Including, The selecting step selects one of the plurality of transport patterns based on a type of the abnormality that has occurred in the abnormality processing unit. A method for processing a substrate.

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