Semiconductor device and method for manufacturing the same

Abstract

To provide a semiconductor device manufactured by a manufacturing process including a step of grinding the back surface of a semiconductor wafer with a whetstone and a manufacturing method of the semiconductor device, in which the deterioration of the dressing of the whetstone and the occurrence of surface burn on the surface of the semiconductor wafer are suppressed without adding a manufacturing process.SOLUTION: A semiconductor device includes a circuit region formed on one surface of a semiconductor substrate, a connecting portion arranged on one surface, covering the circuit region, electrically connected to the circuit region, and used for connection with the outside, a ring-shaped wiring formed on one surface and surrounding a circuit region, a first protective film covering the annular wiring and formed between the peripheral portion of the semiconductor substrate and the connecting portion, and a second protective film formed on a predetermined partial region on the connecting portion.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a semiconductor device and a method for manufacturing the semiconductor device. [Background technology]

[0002] 2. Description of the Related Art One field of semiconductor devices is vertical elements, examples of which include FRDs (Fast Recovery Diodes) and IGBTs (Insulated Gate Bipolar Transistors).

[0003] As an example of an FRD, for example, Patent Document 1 discloses a high-speed diode including an n-type semiconductor layer and a p-type semiconductor layer stacked on the n-type semiconductor layer, a pn junction is formed at the boundary between the n-type semiconductor layer and the p-type semiconductor layer, and crystal defects are formed so that their frequency of occurrence gradually decreases from the top surface of the p-type semiconductor layer toward the bottom surface of the n-type semiconductor layer. Patent Document 1 describes that in manufacturing a high-speed diode, the back surface of the semiconductor wafer is ground by back grinding, wet etching, or the like while the support substrate is bonded, and the thickness of the entire semiconductor wafer including the front-side element structure portion is adjusted to a desired thickness.

[0004] Regarding semiconductor wafers or chips (semiconductor devices) in the manufacturing process of FRD, for example, Patent Document 2 is known. The semiconductor device according to Patent Document 2 includes a semiconductor layer, a first electrode provided on the surface of the semiconductor layer, a plurality of second electrodes provided on the first electrode and having a rectangular cross-sectional shape with sides of 50 micrometers or less parallel to the surface of the semiconductor layer, and a resin layer provided between the plurality of second electrodes and having higher ductility than the second electrodes. In FRD, in order to accommodate high current density and the implementation of a double-sided cooling structure, a thick-film nickel electrode is formed by nickel plating on the chip surface. In Patent Document 2, this nickel electrode is divided into a plurality of second electrodes and provided on the first electrode, thereby suppressing warpage of the semiconductor wafer or chip. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2017-208490 A [Patent Document 2] JP 2015-177116 A Summary of the Invention [Problem to be solved by the invention]

[0006] In vertical elements such as FRDs and IGBTs, current flows through the semiconductor substrate from the circuit elements formed on the front side of the substrate to the back electrode formed on the back side, but if the thickness of the semiconductor substrate is large, the resistance component becomes large, which can cause problems such as heat generation. Therefore, as shown in Patent Document 1, it is common to use semiconductor wafers in which the back side of the semiconductor wafer is ground to reduce the thickness after the circuit elements are formed, for vertical elements such as FRDs and IGBTs.

[0007] When grinding the back surface of such a semiconductor wafer, there is a problem of surface burning. The problem of surface burning will be described with reference to FIGS.

[0008] Back grinding is performed on the semiconductor wafer, but Fig. 6 focuses on one semiconductor device mounted on the semiconductor wafer and shows the state of the semiconductor device. Fig. 6(a) shows the state of the semiconductor device before the back surface of the semiconductor wafer 23 is ground, and Fig. 6(b) shows the state of the semiconductor device after the back surface of the semiconductor wafer 23 is ground. Fig. 7 shows the state of the grindstone used in grinding. Fig. 7(a) shows the state of the grindstone before grinding corresponding to Fig. 6(a), and Fig. 7(b) shows the state of the grindstone after grinding corresponding to Fig. 6(b).

[0009] 6(a) and (b), circuit elements (not shown) are formed on the front surface of a semiconductor wafer 23, and a protective film 15 is formed on the circuit elements. When performing back grinding, as shown in Fig. 6(a), first, a laminate is prepared in which a support member 22 such as glass is bonded to the front surface side of the semiconductor wafer 23 with an adhesive 21. Then, a grindstone 30 is pressed against the back surface of the semiconductor wafer 23 for grinding.

[0010] At this time, since the adhesive 21 is generally soft, depending on the distance between the protective film 15 and the adjacent protective film 15, the adhesive 21 may bend toward the support member 22 as shown in FIG. 6(b). The semiconductor wafer 23 also bends toward the support member 22 as the support member 22 bends. When the semiconductor wafer 23 bends toward the support member 22, the pressure on the grindstone 30 decreases, and the grindstone 30, which was sufficiently sharpened before grinding as shown in FIG. 7(a), becomes less uneven as shown in FIG. 7(b). This is because, in general, as the grindstone grinds an object, abrasive grains on the surface break off and new abrasive grains emerge on the surface, thereby sharpening the grindstone. However, as the pressure applied to the grindstone 30 decreases, this sharpening is no longer performed efficiently.

[0011] When the sharpening of the grindstone 30 deteriorates (the unevenness decreases), the contact pressure between the grindstone 30 and the semiconductor wafer 23 decreases, so to speak, resulting in a state of freewheeling. This freewheeling causes the ground surface of the semiconductor wafer 23 to burn, resulting in surface burning. This surface burning occurs mainly in one semiconductor device mounted on the semiconductor wafer 23 due to the distribution of the protective film 15 in that semiconductor device. Surface burning can change the characteristics of the circuit region formed on the surface of the semiconductor wafer 23, so it is necessary to avoid the occurrence of surface burning as much as possible. That is, in the past, as a method for suppressing the problem of surface burning caused by the distribution of the protective film 15 formed on one semiconductor device of the semiconductor wafer 23, it was required to suppress the problem of surface burning for one semiconductor device. In addition, it is preferable that this method does not involve any change, such as the addition of a process, in the manufacturing process of the semiconductor device. In this regard, Patent Document 1 and Patent Document 2 are not documents that deal with the problem of surface burning.

[0012] In consideration of the above circumstances, the present invention aims to provide a semiconductor device and a method for manufacturing a semiconductor device that are manufactured by a manufacturing process that includes a step of grinding the back surface of a semiconductor wafer with a grinding wheel, which is capable of preventing deterioration of the grinding wheel's sharpness and the occurrence of surface burns on the front surface of the semiconductor wafer, and further capable of preventing this without adding any manufacturing steps. [Means for solving the problem]

[0013] In order to solve the above problems, the semiconductor device of the present invention includes a circuit area formed on one surface of a semiconductor substrate, a connection portion disposed on the one surface, covering the circuit area, electrically connected to the circuit area, and used for connection to an external device, an annular wiring formed on the one surface surrounding the circuit area, a first protective film covering the annular wiring and formed between a peripheral portion of the semiconductor substrate and the connection portion, and a second protective film formed in a predetermined partial area on the connection portion.

[0014] In order to solve the above problems, a manufacturing method for a semiconductor device according to the present invention includes the steps of forming a circuit region on one side of a semiconductor substrate, forming a connection portion that is disposed on the one side, covers the circuit region, is electrically connected to the circuit region, and is used for connecting to an external device, forming annular wiring on the one side surrounding the circuit region, simultaneously forming, from the same material, a first protective film that covers the annular wiring and is disposed between a peripheral portion of the semiconductor substrate and the connection portion, and a second protective film that is disposed in a predetermined portion of the connection portion, attaching a support member to the surface of the semiconductor substrate facing the circuit region using an adhesive member, and grinding the surface of the semiconductor substrate opposite to the one side with a grindstone. Effect of the Invention

[0015] According to the present invention, in a semiconductor device and a method for manufacturing a semiconductor device manufactured by a manufacturing process that includes a step of grinding the back surface of a semiconductor wafer with a grinding wheel, it is possible to provide a semiconductor device and a method for manufacturing a semiconductor device that are capable of suppressing deterioration of the grinding wheel's sharpness and occurrence of surface burns on the front surface of the semiconductor wafer, and further capable of suppressing such occurrence without adding any manufacturing steps. [Brief description of the drawings]

[0016] [Figure 1] 1A and 1B are a plan view and a cross-sectional view showing an example of a configuration of a semiconductor device according to an embodiment. [Diagram 2] 1A and 1B are a plan view and a cross-sectional view, respectively, showing a semiconductor device according to a comparative example. [Diagram 3] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a semiconductor device according to an embodiment. [Figure 4] 1A and 1B are partial cross-sectional views showing an example of a method for manufacturing a semiconductor device according to an embodiment. [Diagram 5] 6(a) to 6(c) are diagrams showing other configurations of the arrangement of the second protective film in the semiconductor device according to the embodiment. [Figure 6] 1A and 1B are partial diagrams illustrating surface burns that occur during back grinding of a semiconductor wafer. [Figure 7] 1A and 1B are partial diagrams illustrating surface burns that occur during back grinding of a semiconductor wafer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the following preferred embodiments, a semiconductor device according to the present invention is applied to an FRD.

[0018] The configuration of a semiconductor device 10 according to the present embodiment will be described with reference to Fig. 1. Fig. 1(a) is a plan view of the semiconductor device 10 seen from above, and Fig. 1(b) is a cross-sectional view taken along line A-A' shown in Fig. 1(a).

[0019] As shown in FIG. 1(b), the semiconductor device 10 includes a semiconductor substrate 11, an impurity region 12, a pad 13, a ring wiring (annular wiring) 14, a first protective film 15, a second protective film 16, a back electrode 17, and a ring impurity region (annular impurity region) 18.

[0020] A semiconductor device 10 according to the present embodiment will be described with reference to FIG. 1(a). The semiconductor substrate 11 has a quadrangular shape in plan view, and N-type Si (silicon) is used as an example of the material. The pad 13 is arranged in a quadrangular shape contained in the semiconductor substrate 11 in plan view, and is made of a metal such as Al (aluminum). The ring wiring 14 is arranged in a ring shape on the inside of the semiconductor substrate 11 and outside the pad 13 in plan view so as to surround the pad 13, and is made of a metal such as Al (aluminum). The first protective film 15 is formed so as to cover the ring wiring 14, and is made of, for example, polyimide. The second protective film 16 is formed in a quadrangular shape on the inside of the first protective film 15, and is made of the same material as the first protective film 15, but the details of the second protective film 16 will be described later.

[0021] As shown in FIG. 1(b), the impurity region 12 is a region where an impurity is introduced into the surface of the semiconductor substrate 11, for example, a P-type impurity is introduced. In the semiconductor device 10, a PN junction is formed at the interface between the N-type semiconductor substrate 11 and the P-type impurity region 12, and the semiconductor device 10 functions as a diode. When the positive electrode of a power supply is connected to the pad 13 and the negative electrode of the power supply is connected to the back electrode 17, a diode current flows from the pad 13 to the back electrode 17. That is, a through current flows from the front surface to the back surface of the semiconductor substrate 11. In this embodiment, in the cross-sectional view shown in FIG. 1(b), a region including a PN junction formed at the interface between the N-type semiconductor substrate 11 and the P-type impurity region 12 is called a "circuit region" ("active region").

[0022] 1(b), the pad 13 is disposed on the upper part of the impurity region 12. The pad 13 is a connection part for connecting to the outside via, for example, a bonding wire, etc. In this embodiment, it is an anode terminal.

[0023] As shown in FIG. 1(b), the ring wiring 14 is disposed above the semiconductor substrate 11 and outside the pad 13. A ring impurity region 18, which is a region where P-type impurities are introduced, is formed directly below the ring wiring 14. Although not shown in FIG. 1(a), it is formed in a ring shape like the ring wiring 14. The ring impurity region 18 has a function of a guard ring and suppresses the occurrence of leakage current. In addition, the ring wiring 14 and the ring impurity region 18 have a function of alleviating an electric field. That is, the depletion layer formed at the interface between the semiconductor substrate 11 and the impurity region 12 is extended to the periphery, which is the outside of the semiconductor device 10, by using the ring wiring 14 and the ring impurity region 18, thereby alleviating an electric field. Furthermore, the ring wiring 14 has a function of reducing the impurity concentration on the surface of the semiconductor substrate 11, that is, a function of a channel stopper. In this embodiment, a form using a single ring wiring 14 as shown in FIG. 1(a) is exemplified and described, but the present invention is not limited to this, and a form using multiple ring wirings such as double or triple ring wirings may be used depending on the withstand voltage required for the semiconductor device 10.

[0024] 1(b), the back electrode 17 is an electrode formed on the back surface of the semiconductor substrate 11 and is made of a metal such as Al, and serves as a cathode terminal in the semiconductor device 10.

[0025] Next, the function of the second protective film 16 according to the present embodiment will be described, but before that, a semiconductor device 50 according to a comparative example will be described with reference to FIG. 2. FIG. 2(a) is a plan view of the semiconductor device 50 seen from above, and FIG. 2(b) is a cross-sectional view taken along line B-B' shown in FIG. 2(a). The semiconductor device 50 is an FRD obtained by removing the second protective film 16 from the semiconductor device 10 shown in FIG. 1. Therefore, the same components are denoted by the same reference numerals and detailed description will be omitted.

[0026] As shown in FIG. 2, the semiconductor device 50 lacks the second protective film 16 compared to the semiconductor device 10, so that the entire pad 13 is exposed to the outside. That is, since there is no protective film between the left and right first protective films 15 in FIG. 2(b), the distance L3 between the protective films 15 of the semiconductor device 50 is longer than the distances L1 and L2 between the protective films 15 and 16 of the semiconductor device 10. That is, since the distance between the protective films of the semiconductor device 50 is wider than that of the semiconductor device 10, when the back grinding is performed as described in FIG. 6 and FIG. 7, the adhesive 21 (adhesive member) is more likely to deform in the portion of the pad 13, and as a result, the semiconductor wafer 23 is more likely to bend. That is, the semiconductor device 50 according to the comparative example is more likely to cause surface burning of the semiconductor wafer 23. Note that the distances L1, L2, and L3 are merely examples.

[0027] Therefore, in the semiconductor device 10 according to the present embodiment, a second protective film 16 is provided. As shown in Fig. 1(b), by disposing the second protective film 16 between the two first protective films 15, the area supporting the adhesive 21 increases and the pressure applied to the adhesive 21 increases, so that the deflection of the adhesive 21 decreases. As a result, the deflection of the semiconductor wafer 23 also decreases, making it possible to suppress surface burning of the semiconductor wafer 23.

[0028] Next, a method for manufacturing the semiconductor device 10 according to the present embodiment will be described with reference to Fig. 3. The semiconductor device 10 is manufactured in the form of a semiconductor wafer on which a plurality of semiconductor devices 10 are mounted, but the following description will focus on one of the semiconductor devices 10.

[0029] First, a semiconductor substrate 11 having circuit elements formed on its surface is prepared (FIG. 3(a)).

[0030] Next, a protective film 19 (polyimide, for example) is formed on the entire surface. Then, a resist 20 is applied onto the protective film 19, and a mask for forming the first protective film 15 and the second protective film 16 is produced by photolithography and etching (exposure, development, FIG. 3(b)).

[0031] Next, the protective film 19 is etched to form the first protective film 15 and the second protective film 16 (FIG. 3(c)). Thereafter, the first protective film 15 and the second protective film 16 are cured (hardened by heating). That is, the first protective film 15 and the second protective film 16 are formed simultaneously from the same material. Therefore, the manufacturing method of the semiconductor device 10 is the same as the manufacturing method of the semiconductor device 50 according to the comparative example, and there is no change such as the addition of a process.

[0032] Next, a support member 22 (eg, glass) is attached to the front surface (circuit surface) of the semiconductor substrate 11 with an adhesive 21 (FIG. 4(a)).

[0033] Next, the semiconductor substrate 11 is turned over, and the rear surface of the semiconductor substrate 11 is ground with a grindstone 30 to reduce the semiconductor substrate 11 to a predetermined thickness (FIG. 4(b)).

[0034] Thereafter, the adhesive 21 and the support member 22 are removed, and a back electrode 17 (not shown) is formed on the back surface of the semiconductor substrate 11. Thereafter, the semiconductor wafer is diced into individual chips, thereby manufacturing the semiconductor device 10 according to the present embodiment.

[0035] Next, referring to FIG. 5, another embodiment of the method for forming the second protective film 16 will be described. FIG. 5 is a diagram showing a representative example of the formation of the second protective film 16. FIG. 5 shows the pad 13, the first protective film 15, and the second protective film 16 extracted from the configuration shown in FIG. 1(a). The arrangement area of ​​the second protective film 16 may basically be any area of ​​the pad 13, as long as it avoids areas where the protective film 16 cannot be provided, such as areas where a test probe (probe) contacts at the semiconductor wafer stage and areas where a connection member (e.g., bonding wire) is connected after singulation. The areas where the protective film 16 cannot be provided differ for each semiconductor device depending on the test contents at the semiconductor wafer stage, the connection method of the pad 13 after singulation, etc.

[0036] FIG. 5 shows an example of the arrangement of the second protective film 16, provided that when the area used for external connection is the center of the pad 13 and the area with which the test probe comes into contact is at least a portion along the rectangular periphery of the pad 13, no protective film is provided in that area.

[0037] FIG. 5(a) is an example in which two rectangular second protective films 16 are arranged along two opposing sides of a rectangular pad 13. In this way, the number of second protective films 16 may be multiple. FIG. 5(b) is an example in which four circular second protective films 16 are arranged, one at each of the four corners of the rectangular pad 13. In this way, the shape of the second protective film 16 is not limited to a rectangle, and may be any shape that can be arranged on the pad 13, such as an ellipse, a triangle, a diamond, etc., other than a circle. In addition, the second protective film 16 may be arranged at the apex of the rectangular pad 13, rather than along the sides of the rectangular pad 13. FIG. 5(c) is a form in which the second protective film 16 is arranged in a rectangular shape with a rectangular opening with a gap between it and the first protective film 15 in the rectangular pad 13. By adopting such a form, the area of ​​the second protective film 16 can be increased while taking into consideration the region where the protective film is not provided, so that surface burning can be more effectively prevented.

[0038] 5, the first protective film 15 and the second protective film 16 are not in contact with each other, but a small gap is provided, but the second protective film 16 may be formed in the gap between the first protective film 15 and the second protective film 16 so as to be in contact with each other. By forming the second protective film 16 in this manner, the area of ​​the second protective film 16 can be increased, and surface burning can be prevented more effectively. In other words, the second protective film 16 only needs to be provided inside the first protective film 15, and the specific arrangement and shape can be changed according to the conditions.

[0039] In the above embodiment, the second protective film 16 remains even after the semiconductor device 10 is manufactured, but the present invention is not limited to this, and the second protective film 16 may be removed at any stage after the back surface of the semiconductor substrate 11 is ground and before the connection of the connection member to the pad 13. This avoids restrictions on the connection of the bonding wire to the pad 13, etc.

[0040] In the above embodiment, a vertical element has been described as an example of the semiconductor device according to the present embodiment, but the present invention is not limited to this and may be applied to semiconductor devices of other types, such as a horizontal element. [Explanation of symbols]

[0041] 10 Semiconductor device 11 Semiconductor substrate 12 Impurity region 13 Pad 14 Ring wiring 15 First protective film 16 Second protective film 17 Back electrode 18 Ring impurity region 19 Protective film 20 Resist 21 Adhesive 22 Support member 23 Semiconductor Wafers 30 Grindstone 50 Semiconductor device

Claims

1. a circuit region disposed in a recess formed on one surface of a semiconductor substrate; a connection portion that is disposed in the recess so as to be contained within the semiconductor substrate, covers the circuit region, is electrically connected to the circuit region, and is used for connection to an external device; a ring-shaped wiring formed on the one surface so as to surround the circuit region; a first protective film that covers the annular wiring and is formed between a peripheral portion of the semiconductor substrate and the connection portion and surrounds the recess; a second protective film disposed in the recess and formed on a predetermined partial region on the connection portion; Semiconductor device.

2. The second protective film is formed at a distance from the first protective film. The semiconductor device according to claim 1 .

3. The second protective film is disposed on the periphery of the connection portion.

3. The semiconductor device according to claim 1 or 2.

4. The connecting portion has a rectangular shape in a plan view, A plurality of the second protective films are included, Each of the plurality of second protective films is disposed along a side of the connection portion or at a corner of the connection portion. The semiconductor device according to claim 1 .

5. The second protective film covers the peripheral portion of the connection portion and has an opening in a region including a center portion of the connection portion.

3. The semiconductor device according to claim 1 or 2.

6. The semiconductor device is a vertical element that passes a current in a direction perpendicular to the semiconductor substrate. The semiconductor device according to claim 1 .

7. The semiconductor device is an FRD. The semiconductor device according to claim 1 .

8. forming a circuit region on one side of a semiconductor substrate; forming a connection portion disposed on the one surface, covering the circuit region, electrically connected to the circuit region, and used for connection to an external device; forming a ring-shaped wiring on the one surface surrounding the circuit region; a step of simultaneously forming, from the same material, a first protective film that covers the annular wiring and is disposed between the peripheral edge of the semiconductor substrate and the connection portion, and a second protective film that is disposed in a predetermined partial region on the connection portion; a step of attaching a support member to a surface of the semiconductor substrate on the circuit region side by using an adhesive member; grinding the surface of the semiconductor substrate opposite to the one surface with a grindstone. A method for manufacturing a semiconductor device.

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