Mark detection apparatus, exposure apparatus, and article manufacturing method

Abstract

To provide a technique useful for improving the reproducibility of position of a scope when fixing the scope.SOLUTION: A mark detection device has: a support member; a scope for detecting a mark; a driving mechanism for changing the position of the scope relative to the support member; a plurality of fixing mechanisms that perform fixing operation to fix the scope to the support member; and a controller. When the plurality of fixing mechanisms are used to fix the scope to the support member, the controller causes the plurality of fixing mechanisms to perform the fixing operation in a preset order.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a mark detection apparatus, an exposure apparatus, and an article manufacturing method. [Background technology]

[0002] In recent years, the line width of patterns formed on a substrate has become very small due to the high integration and miniaturization of semiconductor integrated circuits. Accordingly, further miniaturization is desired in the lithography process that forms resist patterns on a substrate. In step-and-repeat projection exposure apparatus and step-and-scan exposure apparatus, the exposure light is imaged at a desired position on a substrate via a projection optical system, and the stage on which the substrate is placed is moved relatively to form a desired pattern on the substrate. Therefore, in order to meet the demand for finer patterns, it is important to align the relative positions of the substrate and the exposure light with high accuracy. Conventionally, a method (global alignment) has been implemented in which the positions of alignment marks formed near the shot areas on the substrate are measured prior to pattern formation, and the arrangement of the shot areas is obtained to perform alignment.

[0003] Patent Document 1 describes a method for moving a detection system while maintaining a clearance by generating forces in opposite directions in the vertical direction between the detection system and the force generating device provided in a support device that movably supports multiple mark detection systems. According to Patent Document 1, the detection system can be moved without being affected by frictional forces, so that the detection system can be positioned with high accuracy. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5534262 Summary of the Invention [Problem to be solved by the invention]

[0005] Even if the scope that detects the mark can be positioned at the target position with high accuracy, when the scope is fixed in order to keep it stationary at the target position, the position of the scope may change due to the operation for fixing the scope.

[0006] An object of the present invention is to provide an advantageous technique for improving the reproducibility of the position of a scope when the scope is fixed. [Means for solving the problem]

[0007] One aspect of the present invention relates to a mark detection device, Supports mark detection system A support member and a support member 、 The above Included in the mark detection system Scope position a drive mechanism for changing the position of the support member; do Scope Location Fixing action to fix each Multiple locking mechanisms and a pre-set sequence The plurality of fixing mechanisms and a control unit that causes the fixing operation to be performed. Effect of the Invention

[0008] According to the present invention, an advantageous technique is provided for improving the repeatability of the position of the scope when fixing the scope. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus according to an embodiment. [Diagram 2] FIG. 1 is a schematic diagram showing an example of the configuration of a mark detection device according to a first embodiment. [Diagram 3] FIG. 4 is a schematic diagram showing the configuration of a mark detection system of a comparative example. [Figure 4] FIG. 2 is a schematic diagram showing a mark detection system in the first embodiment. [Diagram 5] 1 is a schematic diagram showing an example of the configuration of a vacuum pad or a movable member. [Figure 6] 4 is a flowchart illustrating the operation of the exposure apparatus of one embodiment. [Figure 7] FIG. 11 is a schematic diagram showing a mark detection system according to a second embodiment. [Figure 8] FIG. 13 is a schematic diagram showing a mark detection system according to a third embodiment. [Figure 9] FIG. 13 is a schematic diagram showing a mark detection system according to a fourth embodiment. [Figure 10] FIG. 1 is a schematic diagram illustrating a mark detection device equipped with three mark detection systems. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] [First embodiment] 1 is a block diagram showing the configuration of an exposure apparatus EXP incorporating a mark detection apparatus 100. The exposure apparatus EXP may include an illumination apparatus IL, an original stage RS that holds and positions an original 31, a projection optical system 2, a substrate stage WS that holds and positions a substrate 3, a mark detection apparatus 100, and a controller 1100. A reference plate 39 may be disposed on the substrate stage WS. The controller 1100 has a processor and a memory, and may control the illumination apparatus IL, the original stage RS, the substrate stage WS, and the mark detection apparatus 100. The controller 1100 may process a signal output from the mark detection apparatus 100 to execute a process of detecting the position of a mark on the substrate 3.

[0012] The illumination device IL illuminates the original 31 having a pattern to be transferred to the substrate 3. The illumination device IL may include a light source unit 800 and an illumination optical system 801. The illumination optical system 801 may have a function of uniformly illuminating the original 31. In addition, the illumination optical system 801 may have a polarized illumination function.

[0013] The light source unit 800 may include, for example, a laser. The laser may include, for example, an ArF excimer laser with a wavelength of about 193 nm or a KrF excimer laser with a wavelength of about 248 nm, but the type of light source is not limited to an excimer laser. Specifically, an F2 laser with a wavelength of about 157 nm or an EUV (Extreme ultraviolet) light source with a wavelength of 20 nm or less may be used.

[0014] The illumination optical system 801 is an optical system that illuminates the illumination surface, i.e., the original 31, using the light beam emitted from the light source unit 800. The illumination optical system 801 can, for example, shape the light beam into a slit shape and illuminate the original 31 with the slit-shaped light beam. The illumination optical system 801 can include lenses, mirrors, an optical integrator, a diaphragm, etc. These can be arranged in the following order, for example: a condenser lens, a fly's-eye lens, an aperture diaphragm, a condenser lens, a slit, and an imaging optical system.

[0015] The original 31 may be made of, for example, quartz, and may have a pattern thereon to be transferred to the substrate 3. The original 31 may be held by an original stage RS, and may be driven by an actuator (not shown). Diffracted light emitted from the original 31 is projected onto the substrate 3 by the projection optical system 2. The original 31 and the substrate 3 may be arranged in an optically conjugate relationship. The pattern of the original 31 may be transferred to the substrate 3 by scanning the original 31 and the substrate 3 at a speed ratio according to the reduction magnification ratio of the projection optical system 2. The exposure apparatus EXP may further include an original detection unit of an oblique light incidence system. The position of the original 31 may be detected by the original detection unit, and the original 31 may be arranged at a predetermined position.

[0016] The original stage RS holds the original 31 by an original chuck (not shown) and can be driven by a driving mechanism (not shown). The driving mechanism is composed of a linear motor or the like, and can drive the original 31 by driving the original stage RS in the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotation direction of each axis. The projection optical system 2 has a function of forming an image of a light beam from an object surface of the projection optical system 2 on an image surface of the projection optical system 2. In other words, the projection optical system 2 forms an image of diffracted light from the pattern of the original 31 on the substrate 3. The projection optical system 2 can be, for example, an optical system made of a plurality of lens elements, an optical system having a plurality of lens elements and at least one concave mirror (catadioptric optical system), or an optical system having a plurality of lens elements and at least one diffractive optical element such as a kinoform.

[0017] The substrate 3 is a processing object, and the photoresist is applied onto the substrate 3. The substrate 3 may also be understood as a detection object having a mark whose position is detected using the mark detection apparatus 100. The substrate 3 may be, for example, a semiconductor substrate or a glass substrate.

[0018] The substrate stage WS holds the substrate 3 by a substrate chuck (not shown). The substrate stage WS is driven by a drive mechanism (not shown) configured by a linear motor or the like, and can thereby move the substrate 3 in the X-axis direction, Y-axis direction, Z-axis direction, and the rotation direction of each of these axes. In addition, the positions of the original stage RS and the substrate stage WS are monitored by, for example, a six-axis laser interferometer 81, and can be driven at a constant speed ratio by the control unit 1100.

[0019] Next, a configuration example of the mark detection device 100 will be described with reference to FIG. 2(A). The mark detection device 100 may include a plurality of mark detection systems 21a-21c having detection areas arranged at different positions along the X-axis direction. The mark detection device 100 may also include a plurality of driving mechanisms 22a-22c that can drive a detection system frame 23 that holds the plurality of mark detection systems 21a-21c, respectively. In this way, the mark detection device 100 can individually adjust the positions of the detection areas of the plurality of mark detection systems 21a-21c in the X-axis direction using the plurality of driving mechanisms 22a-22c. The mark detection device 100 may be configured so that the relative positions of the detection areas of the plurality of mark detection systems 21a-21c can be adjusted at least in the X-axis direction by the plurality of driving mechanisms 22a-22c. The driving direction of the plurality of mark detection systems 21a-21c is not limited to the X-axis direction, and may be configured so that the plurality of mark detection systems 21a-21c can be driven in the Y-axis direction and / or the Z-axis direction in addition to the X-axis direction, for example. At least one of the multiple mark detection systems 21a-21c, for example, mark detection system 21a, may not be driven by a drive mechanism and the position of the detection area may be fixed. The mark detection system whose detection area is fixed may be mark detection system 21b and / or mark detection system 21c. In the following description, when the multiple mark detection systems 21a, 21b, and 21c are described without distinguishing one from another, they will be referred to as mark detection system 21.

[0020] FIG. 2B is a diagram showing a configuration example of the mark detection system 21. The mark detection system 21 includes a scope SCP. The scope SCP may include an illumination system that illuminates the substrate 3 with light emitted from a light source 61, and an imaging system that forms an image of a mark 72 provided on the substrate 3. The illumination system may include illumination optical systems 62, 63, and 66, an illumination aperture stop 64, a mirror M2, a relay lens 67, a polarizing beam splitter 68, a λ / 4 plate 70, and an objective optical system 71. The imaging system may include the objective optical system 71, the λ / 4 plate 70, a detection aperture stop 69, a polarizing beam splitter 68, and an imaging optical system 74. The imaging system may be configured to form an image of the reflected light from the mark 72 on a sensor 75. The control unit 1100 determines the coordinate position of the mark based on the position information of the substrate stage WS measured using a laser interferometer 81 and the signal waveform of the mark on the substrate 3 detected using the mark detection system 21.

[0021] In the mark detection system 21, the light emitted from the light source 61 passes through the illumination optical systems 62 and 63 and reaches the illumination aperture stop 64 arranged at a position conjugate with the substrate 3. At this time, the light beam diameter at the illumination aperture stop 64 becomes sufficiently smaller than the light beam diameter at the light source 61. The light that passed through the illumination aperture stop 64 passes through the illumination optical system 66, the mirror M2, and the relay lens 67 and is guided to the polarizing beam splitter 68. Here, the polarizing beam splitter 68 transmits the P-polarized light parallel to the Y direction and reflects the S-polarized light parallel to the X direction. Therefore, the P-polarized light that passed through the polarizing beam splitter 68 passes through the detection aperture stop 69 and the λ / 4 plate 70 to be converted into circularly polarized light, and passes through the objective optical system 71 to Koehler illuminate the mark 72 on the substrate 3.

[0022] The light reflected, diffracted, and scattered by the mark 72 passes through the objective optical system 71 again, and then passes through the λ / 4 plate 70 to be converted from circularly polarized light to S-polarized light, and reaches the detection aperture stop 69. Here, the polarization state of the light reflected by the mark 72 is circularly polarized in the opposite direction to the circularly polarized light irradiated onto the mark 72. That is, if the polarization state of the light irradiated onto the mark 72 is right-handed circularly polarized, the polarization state of the light reflected by the mark 72 is left-handed circularly polarized. In addition, the detection aperture stop 69 can change the numerical aperture of the reflected light from the mark 72 by changing the aperture amount according to an instruction from the control unit 1100. The light that passes through the detection aperture stop 69 is reflected by the polarizing beam splitter 68, and then is guided to the sensor 75 via the imaging optical system 74. Therefore, the optical path of the illumination light to the substrate 3 and the optical path of the reflected light from the substrate 3 are separated by the polarizing beam splitter 68, and an image of the mark 72 provided on the substrate 3 is formed on the sensor 75.

[0023] Next, a method for detecting (the position of) a mark on the substrate 3 using the mark detection device 100 will be described with reference to FIGS. 2(C) to (F). FIG. 2(C) is a view of the mark detection device 100 shown in FIG. 2(A) as seen from the Z-axis direction, and FIGS. 2(D) and (E) show the positional relationship between the mark detection device 100 and the mark 32 on the substrate 3 at different times during the detection operation of the mark 32 on the substrate 3. In consideration of productivity, the mark detection device 100 can be controlled so as to measure only the marks 32 in some shot areas among all the shot areas, as shown in FIGS. 2(D) and (E). In one example, by controlling the position of the substrate stage WS, the coordinate positions of the marks 32 on the substrate 3 can be detected by aligning the marks 32 with respect to the respective detection areas of the mark detection systems 21 of the mark detection device 100. At this time, the position of the substrate stage WS can be controlled by the control unit 1100 so as to detect the marks 32 to be detected in the shortest possible time.

[0024] For example, the marks 32 on the substrate 3 may be aligned within the detection regions and focal depths of at least two of the multiple mark detection systems 21 of the mark detection device 100, and the positions of the two marks 32 may be detected simultaneously. For example, as shown in FIG. 2(D), two marks 32F and 32G on the substrate 3 may be aligned with the mark detection systems 21a and 21b, and the detection operation of the mark positions may be performed simultaneously. Also, as shown in FIG. 2(E), the mark detection system 21 used to detect the position of the mark 32 may be changed according to the layout of the mark 32 on the substrate 3. For example, the marks 32L and 32M on the substrate 3 may be aligned with the mark detection systems 21b and 21c, and the detection operation of the mark positions may be performed. Furthermore, as shown in FIG. 2(F), the three marks 32R, 32S, and 32T on the substrate 3 may be aligned with the detection regions and focal depths of the three mark detection systems 21a to 21c, and the detection operation of the marks 32R, 32S, and 32T may be performed simultaneously. This makes it possible to shorten the drive time of the substrate stage WS and the measurement time of the mark detection device 100 compared to the case where multiple marks 32 on the substrate 3 are sequentially aligned and detected in the detection area of ​​one mark detection system.

[0025] The control unit 1100 can calculate the shift (movement), magnification, and rotation for the arrangement of the multiple shot areas 34 on the substrate 3 by global alignment based on the detection results of the marks 32 relative to the detection areas of the multiple mark detection systems 21. This makes it possible to determine the regularity of the lattice arrangement of the arrangement of the multiple shot areas 34 on the substrate 3. The control unit 1100 can then determine a correction coefficient from the reference baseline and the determined regularity of the lattice arrangement, and align the original 31 and the substrate 3 based on the result.

[0026] Before describing the fixing operation of the mark detection system in the mark detection device of the embodiment, the fixing operation of the mark detection system in a mark detection device of a comparative example and problems associated with it will be described.

[0027] FIG. 3(A) shows an example of a fixing method of a mark detection system of a comparative example. Note that FIG. 3(A) shows only one of a plurality of drivable mark detection systems. The other drivable mark detection systems may have the same configuration. A mark detection system housing 12 is supported by one guide 10 to be movable in the X-axis direction with respect to a detection system frame 23. A gap is provided between the fixing mechanism 11 and the mark detection system housing 12. The fixing mechanism 11 has a flow path (not shown) for vacuum suction inside, and an electromagnetic valve 15 is provided in the middle of the flow path, and the electromagnetic valve 15 can supply and cut off vacuum pressure. In addition, the mark detection system housing 12 is driven by a driving mechanism (not shown), and the mark detection system housing 12 is positioned at a predetermined position by control by the control unit 1100 based on information measured by an encoder (not shown). Thereafter, the electromagnetic valve 15 supplies vacuum pressure to the fixing mechanism 11, so that the fixing mechanism 11 and the mark detection system housing 12 can be brought into contact with each other, and the position of the mark detection system housing 12 is fixed by frictional force.

[0028] Here, in the relationship between the fixing mechanism 11 and the mark detection-system housing 12, there are often individual differences in the gap amount and inclination before vacuum suction (before fixing) due to manufacturing errors and assembly errors of parts. For example, as shown in Fig. 3(B), when the right fixing mechanism 11 is inclined and close to the mark detection-system housing 12, a part of the right fixing mechanism 11 may first come into contact with the mark detection-system housing 12. Then, when the other part of the right fixing mechanism 11 and the left fixing mechanism 11 come into contact with the mark detection-system housing 12 with the part of the right fixing mechanism 11 as a fulcrum, a horizontal force may act on the mark detection-system housing 12.

[0029] 3C, when there is a difference in the gap between the two fixing mechanisms 11, a difference in suction force occurs between the two fixing mechanisms 11, and a rotational force about the X-axis may act on the mark detection system housing 12. When such a force acts on the mark detection system housing 12, the position of the mark detection system housing 12 may shift.

[0030] Furthermore, if the distance of the flow path from the solenoid valve 15 to the two fixing mechanisms 11 has a manufacturing error, the timing of the vacuum suction will deviate from the target timing. As a result, if the order in which the vacuum pressure is supplied to the two fixing mechanisms 11 is reversed from the intended order, the behavior during vacuum suction will change and the positional deviation may become inconsistent. If these deviation factors exist, the mark 32 to be detected may deviate from the center of the detection area of ​​the mark detection system 21, and a detection error may occur due to the aberration of the optical system of the mark detection system housing 12. Furthermore, if the position of the mark detection system housing 12 deviates from the target position by several μm, the mark 32 may deviate from the detection area, resulting in a measurement error.

[0031] The configuration of the mark detection system 21 in the mark detection device 100 of the embodiment will be described below. Figures 4(A) and 4(B) show one of the multiple drivable mark detection systems 21 in the embodiment. Figure 4(A) is a plan view, and Figure 4(B) is a cross-sectional view. In Figure 4(A), the detection system frame 23 is omitted. Since the mark detection system housing 12 is a housing that houses the above-mentioned scope SCP, the mark detection system housing 12 in the following description can be read as the scope SCP. The mark detection system 21 can include the detection system frame 23 as a support member, the mark detection system housing 12 (scope SCP), a drive mechanism DM, and horizontal fixing mechanisms 13a and 13b as multiple fixing mechanisms. The mark detection device 100 may have one or more guides that guide the mark detection system housing 12, and in the example of Figure 4, the mark detection device 100 has two guides 10. The two guides 10 can be arranged parallel to each other. The guide 10 can be, for example, a linear guide using rolling elements or a hydrostatic bearing type linear guide.

[0032] The two horizontal fixing mechanisms 13a and 13b may be supported by the detection system frame 23. The two horizontal fixing mechanisms 13a and 13b may be disposed between the two guides 10 in an orthogonal projection onto a horizontal plane. The two horizontal fixing mechanisms 13a and 13b may be disposed such that the center of gravity of the mark detection system housing 12 is located between the two horizontal fixing mechanisms 13a and 13b in an orthogonal projection onto a horizontal plane. The two horizontal fixing mechanisms 13a and 13b may have a horizontal surface pressed against the mark detection system housing 12. The mark detection device 100 may include two vertical fixing mechanisms 14a and 14b as additional fixing mechanisms. The two vertical fixing mechanisms 14a and 14b may have a vertical surface pressed against the mark detection system housing 12. Hereinafter, the horizontal fixing mechanisms 13a and 13b and the vertical fixing mechanisms 14a and 14b are also referred to as fixing mechanisms 13a, 13b, 14a, and 14b. The fixing mechanisms 13a, 13b, 14a, and 14b apply forces to different positions of the mark detection system housing 12 or the scope SCP to fix the scope SCP.

[0033] The two vertical fixing mechanisms 14a and 14b can generate a holding force for fixing the mark detection system housing 12 in the ωY-axis direction (rotation direction around the Y-axis). In the example of FIG. 4, the X-direction span of each guide 10 is not sufficient, and the rigidity in the ωY-axis direction (around the Y-axis) is not sufficient, so the two vertical fixing mechanisms 14a and 14b can be provided. However, if the rigidity in the ωY-axis direction (around the Y-axis) meets the required specifications, the two vertical fixing mechanisms 14a and 14b are not necessary. The horizontal fixing mechanisms 13a and 13b can generate a holding force for fixing the mark detection system housing 12 in the horizontal direction (direction parallel to the XY plane). The horizontal fixing mechanisms 13a and 13b can also generate a holding force for fixing the mark detection system housing 12 in the ωZ-axis direction (rotation direction around the Z-axis).

[0034] The vertical fixing mechanisms 14a and 14b can be supported by the detection system frame 23. The vertical fixing mechanisms 14a and 14b can generate a holding force for fixing the mark detection system housing 12 in the vertical direction (Z-axis direction). The vertical fixing mechanisms 14a and 14b can generate a holding force for fixing the mark detection system housing 12 in the ωY-axis direction.

[0035] The horizontal fixing mechanisms 13a and 13b may be connected to pressure lines for individually supplying vacuum pressure thereto, and the vertical fixing mechanisms 14a and 14b may be connected to a common pressure line for supplying vacuum pressure thereto.

[0036] The pressure lines for individually supplying vacuum pressure to the horizontal fixing mechanisms 13a, 13b may be connected to a vacuum line via normally open air operated valves 30a, 30b, respectively. The pressure lines for individually supplying vacuum pressure to the horizontal fixing mechanisms 13a, 13b may further be connected to the atmosphere via normally closed air operated valves 40a, 40b. The common pressure line for supplying vacuum pressure to the vertical fixing mechanisms 14a, 14b may be connected to a vacuum line via a normally open air operated valve 30c. The common pressure line for supplying vacuum pressure to the vertical fixing mechanisms 14a, 14b may further be connected to the atmosphere via a normally closed air operated valve 40c.

[0037] Compressed air can be supplied to the air operated valves 30a, 30b, 30c via the solenoid valves 15a, 15b, 15c controlled by the control unit 1100. When the control unit 1100 opens the solenoid valves 15a, 15b, 15c, the normally open type air operated valves 30a, 30b, 30c are closed, and the normally closed type air operated valves 40a, 40b, 40c are opened. When the control unit 1100 closes the solenoid valves 15a, 15b, 15c, the normally open type air operated valves 30a, 30b, 30c are opened, and the normally closed type air operated valves 40a, 40b, 40c are closed.

[0038] When the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b are caused to perform a fixing operation so as to fix the mark detection system housing 12, the control unit 1100 closes the solenoid valves 15a, 15b, 15c. This causes the normally open type air operated valves 30a, 30b, 30c to be in an open state, and the normally closed type air operated valves 40a, 40b, 40c to be in a closed state. Thus, vacuum pressure is supplied to the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b, and the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b, and the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b perform a fixing operation.

[0039] When the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b are caused to perform a release operation so as to release the fixing of the mark detection system housing 12, the control unit 1100 opens the solenoid valves 15a, 15b, 15c. This causes the normally open type air operated valves 30a, 30b, 30c to be in a closed state, and the normally closed type air operated valves 40a, 40b, 40c to be in an open state. Thus, atmospheric pressure is supplied to the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b, and the vertical fixing mechanisms 14a, 14b perform a release operation.

[0040] Fig. 5(A) shows an example of the configuration of the vacuum chucks constituting the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b, respectively. The vacuum chuck shown in Fig. 5(A) may include a vacuum pad 16 that contacts the mark detection system housing 12 when vacuum-suctioning the mark detection system housing 12, and a spring 17 that supports the vacuum pad 16. The vacuum pad 16 may be understood as an example of a movable member. The spring 17 has flexibility and may allow the vacuum pad 16 to move in the suction direction.

[0041] The vacuum pad 16 may be provided with a recess communicating with the above-mentioned vacuum line. The recess of the vacuum pad 16 may have a rectangular shape as exemplified in FIG. 5(B). Alternatively, the vacuum pad 16 may have an island-like portion in the center connected to the edge portion as exemplified in FIG. 5(C) in order to reduce the amount of elastic deformation of the vacuum pad 16 during vacuum suction. The island-like portion may have a circular shape as exemplified in FIG. 5(D), a rectangular shape as exemplified in FIG. 5(E), or a shape as exemplified in FIG. 5(F).

[0042] Since the vacuum suction force is determined by the area of ​​the recess of the vacuum pad 16, the number and area of ​​the island-like parts can be freely designed within a range where the necessary vacuum suction force can be obtained. Although it depends on the shape of the island-like parts, the larger the area of ​​the island-like parts, the less deformation caused by vacuum suction. Also, the spring 17 can have a structure that is flexible in the suction direction in which the vacuum pad 16 suctions the mark detection system housing 12 (the direction in which the vacuum pad 16 is pressed against the mark detection system housing 12) and has high rigidity in a direction perpendicular to the suction direction. In order to fix the mark detection system housing 12 with high rigidity by vacuum suction, it is desirable to make the rigidity of the spring 17 in the direction perpendicular to the suction direction, for example, 500 times or more as much as the rigidity of the spring 17 in the suction direction within a range where vacuum suction is possible. In other words, it is desirable that the rigidity of the spring 17 in the suction direction is lower than the rigidity of the spring 17 in the direction perpendicular to the suction direction.

[0043] The above-mentioned fixing mechanisms 13a, 13b, 14a, 14b, and the drive motor, ball screw, etc., described below, can be covered by a cover 28 attached to the detection system frame 23 and the mark detection system housing 12. A narrow gap of about 1 mm is provided in the portion covering the moving parts, and the moving parts are not in contact with each other. By discharging the air inside the cover 28 from an exhaust port 29, it is possible to prevent particles from the drive mechanism, etc., from being discharged into the space outside the cover 28, and to release part of the heat generated by the mark detection system 21.

[0044] The driving and fixing operations of the mark detection system 21 in the mark detection device 100 of the embodiment will be described below. First, the control unit 1100 can feedback control the driving mechanism DM so that the mark detection system housing 12 is positioned at a target position based on the output of the encoder 19 that measures the position of the mark detection system housing 12 (scope SCP). The driving mechanism DM can include, for example, an AC servo motor 26 and a ball screw 27 that is rotationally driven by the AC servo motor 26. The driving mechanism DM may include a pulse motor as an actuator. The driving mechanism DM may be configured as a linear motion mechanism such as a linear motor, instead of a combination of a motor and a motion conversion mechanism.

[0045] When the mark detection system housing 12 reaches the target position, the control unit 1100 performs a settling judgment, and if the control deviation is equal to or less than the threshold value, the positioning control is completed. At this time, the control unit 1100 may control the positioning operation so that the mark detection system housing 12 is always driven in a fixed direction (a predetermined direction) in the final drive of the positioning operation to complete the positioning operation. This improves the repeatability of the positioning of the mark detection system housing 12 (scope SCP). At this point, the feedback control (servo control) is still ON.

[0046] Next, the control unit 1100 executes a fixing sequence for fixing the mark detection system housing 12 (scope SCP). In this fixing sequence, the timings at which the horizontal fixing mechanisms 13a and 13b are operated are different from each other, and the individual timings at which the horizontal fixing mechanisms 13a and 13b are operated are different from the timings at which the vertical fixing mechanisms 14a and 14b are operated.

[0047] First, the control unit 1100 may operate the solenoid valve 15a to supply vacuum pressure to the horizontal fixing mechanism 13a. The control unit 1100 may then operate the solenoid valve 15b to supply vacuum pressure to the horizontal fixing mechanism 13b. The control unit 1100 may stop the feedback control according to the timing of operating the solenoid valve 15b. When the feedback control is stopped, the driving of the AC servo motor 26 is stopped, and the holding force by the AC servo motor 26 is lost. Since it takes about several hundred msec for the horizontal fixing mechanism 13b to start vacuum suction, the feedback control is substantially stopped first, and the driving force by the AC servo motor 26 and the holding force by the frictional force of the horizontal fixing mechanisms 13a and 13b do not interfere with each other. Alternatively, the gain of the feedback control may be gradually reduced so that the feedback control is turned off by the time the vacuum suction is completed.

[0048] Next, the control unit 1100 operates the solenoid valve 15c to supply vacuum pressure to the vertical fixing mechanisms 14a and 14b, thereby completing the operation of fixing the position of the mark detection system casing 12 (scope SCP).

[0049] In the above example, the control unit 1100 may perform positioning control, operate the horizontal fixing mechanism 13a, and then operate the horizontal fixing mechanism 13b. Alternatively, the control unit 1100 may perform positioning control, operate the horizontal fixing mechanism 13a, operate the horizontal fixing mechanism 13b, and then operate the vertical fixing mechanisms 14a and 14b. Instead of such an operation, the control unit 1100 may perform positioning control, operate the horizontal fixing mechanism 13b, and then operate the horizontal fixing mechanism 13a. Alternatively, the control unit 1100 may perform positioning control, operate the horizontal fixing mechanism 13b, and then operate the horizontal fixing mechanism 13a, and then operate the vertical fixing mechanisms 14a and 14b. Here, the order in which the horizontal fixing mechanisms 13a and 13b are operated may be a preset order. Alternatively, the order in which the horizontal fixing mechanisms 13a and 13b and the vertical fixing mechanisms 14a and 14b are operated may be a preset order. This order is preferably determined so that the fluctuation of the position of the scope SCP due to the fixed sequence falls within an allowable range, preferably so that the fluctuation is minimized, as described later. However, if this order is a preset order, the reproducibility of the fluctuation between multiple fixed sequences can be obtained, so that the amount of the fluctuation can be managed as an offset value, and the target position for positioning the scope SCP can be corrected based on the offset value.

[0050] Setting the order of operation of the horizontal fixing mechanisms 13a, 13b to a preset order is advantageous in suppressing with high reproducibility the fluctuation in the position of the scope SCP caused by the operation of fixing the scope SCP. Alternatively, setting the order of operation of the horizontal fixing mechanisms 13a, 13b and the vertical fixing mechanisms 14a, 14b to a preset order is advantageous in suppressing with high reproducibility the fluctuation in the position of the scope SCP caused by the operation of fixing the scope SCP.

[0051] In summary, when the scope SCP is fixed to the support member by the multiple fixing mechanisms, the control unit 1100 causes the multiple fixing mechanisms to perform the fixing operation in a preset order. Furthermore, preferably, when the scope SCP is fixed to the support member by the multiple fixing mechanisms, the control unit 1100 causes the multiple fixing mechanisms to start the fixing operation at a preset time difference. Alternatively, when the scope SCP is fixed to the support member by the multiple fixing mechanisms, the control unit 1100 causes the multiple fixing mechanisms to perform fixed operations at different timings and in a preset order. Alternatively, when the scope SCP is fixed to the support member by the multiple fixing mechanisms, the control unit 1100 causes one of the multiple fixing mechanisms, which is preset, to start the fixing operation, and then causes the other of the multiple fixing mechanisms to start the fixing operation. Typically, the positional deviation of the scope SCP caused by the fixation of the scope SCP when the multiple fixing mechanisms are made to perform the fixing operation in a preset order is smaller than the positional deviation of the scope SCP caused by the fixation of the scope SCP when the multiple fixing mechanisms are made to perform the fixing operation simultaneously.

[0052] The configuration in which the center of gravity G of the mark detection system housing 12 (scope SCP) is disposed between the horizontal fixing mechanisms 13a and 13b is advantageous for suppressing the occurrence of positional deviation of the mark detection system housing 12 when the vacuum suction by the horizontal fixing mechanisms 13a and 13b is started. The configuration in which the mark detection system housing 12 is disposed between the two guides 10 is advantageous for suppressing the rotation of the mark detection system housing 12 in the ωX-axis direction even when there is a difference in the vacuum suction force by the horizontal fixing mechanisms 13a and 13b. The vertical fixing mechanisms 14a and 14b can generate forces in the Y-axis direction and the ωZ-axis direction. However, if the rigidity in the Y direction by the guides 10 and the horizontal fixing mechanisms 13a and 13b is sufficient, positional deviation due to the forces generated by the vertical fixing mechanisms 14a and 14b is acceptable. According to this embodiment, it is advantageous to keep the fluctuation in the position of the mark detection system housing 12 (scope SCP) due to the fixing operation of the mark detection system housing 12 by the horizontal fixing mechanisms 13a, 13b within an acceptable range, which is advantageous for detecting the position of the mark on the substrate with high accuracy.

[0053] When the fixing mechanism is not vacuum-suctioning the mark detection system housing 12, the mark detection device 100 may be assembled and adjusted so that a narrow gap of, for example, about 0 to 20 μm is formed between the fixing mechanism and the mark detection system housing 12. However, the amount and inclination of the gap may vary depending on the tolerance of the parts and the assembly error. When the plurality of solenoid valves 15a to 15c are operated sequentially, in order to position the plurality of mark detection systems 21 in a short time, the time difference between the operations may not be so large, and may be within several hundred msec. In that case, the vacuum suction may not be performed in the intended order due to the difference in the amount of the gap and the inclination, the difference in the length of the vacuum line, the difference in the reaction speed of the air operated valve, and the like. Even if the order is as intended, the positional deviation after fixing by vacuum suction may exceed the allowable range. In such a case, an order may be selected in which the difference between the measurement value by the encoder 19 before the execution of the fixed sequence and the measurement value by the encoder 19 after the execution of the fixed sequence falls within the allowable range or is minimized. Such a selection may be performed by the control unit 1100. That is, the control unit 1100 can determine the order so that the positional deviation of the scope SCP caused by the fixing of the scope SCP when the fixing mechanisms are caused to perform the fixing operation in the predetermined order falls within the allowable range.

[0054] The information for determining the above order may include, for example, the movement amount, movement speed, movement acceleration, movement direction (whether to move in the + or - direction along the X-axis), target position, etc. of the mark detection system.

[0055] Regarding the amount of movement, if the temperature distribution of the peripheral parts of the scope SCP is different before and after the movement due to the large amount of movement, the amount and inclination of the above gap may change due to the change in the amount of thermal expansion. Regarding the speed of movement, if the speed is high, the path and curvature of the mounted objects such as tubes connected to the mark detection system may change, which may cause resistance when driven. Alternatively, the amount and inclination of the above gap may change due to the tension of the mounted objects after driving pulling the mark detection system. Furthermore, regarding acceleration, if the acceleration is high, the peripheral parts vibrate due to the reaction force against the peripheral parts of the scope SCP, so the amount and inclination of the above gap will continue to change depending on the amount and amplitude of the vibration.

[0056] Regarding the direction of movement, even with the same drive command value, the movement position differs slightly depending on whether the movement is in the + or - direction of the X-axis due to backlash of the ball screw, etc., and the center of gravity position changes, so the amount of the gap and the difference in inclination may change. Regarding the target position, the center of gravity of the mark detection system moves depending on the target position, which changes the degree of deformation of the common base frame, so the amount of the gap and the difference in inclination change, and the optimal pickup order changes.

[0057] Furthermore, when multiple mark detection systems are provided, the center of gravity of the mark detection device changes depending on which mark detection system is moved, and the degree of deformation of the common base frame, etc. changes, which in turn changes the differences in the amount of gap and inclination of each mark detection system, and may change the optimal adsorption order.

[0058] Furthermore, when multiple mark detection systems are provided, each mark detection system has its own component tolerance and assembly error, so that fixing all the mark detection systems in the same order by their fixing mechanisms may not be the order that minimizes positional deviation after fixing. Therefore, it is also effective to specify an optimal fixing order for each mark detection system.

[0059] 10 is a schematic diagram of a case where three mark detection systems 21 are provided. According to this, the common base plate 41 supporting the three mark detection systems 21 is bent at a portion where the weight of the mark detection systems 21 is applied relative to the fastening points 42 of the base plate 41. The amount of this bending varies depending on the thickness of the base plate 41 and the locations of the fastening points 42. Therefore, from the viewpoint of minimizing the positional deviation after fixing, the order of the fixing operations for the multiple mark detection systems 21 may be different from each other. The optimal order of the fixing operations for each of the multiple mark detection systems 21 may be the order in which the difference between the measurement value of the encoder 19 of the mark detection system 21 before the fixing sequence and the measurement value of the encoder 19 after the fixing sequence falls within an allowable range or is the order in which it is minimized. Such an order may be determined by the control unit 1100.

[0060] When the optimal order of the fixing operation varies depending on factors such as the movement amount, movement direction, and target position of the scope SCP, the control unit 1100 may determine the order by executing a predetermined setting sequence. In addition, in the above description, when the scope is not fixed by the fixing mechanism, there is a gap between the mark detection system housing 12 and the fixing mechanism. However, assembly and adjustment may be performed in a state of contact with the mark detection system housing 12 or with a preload applied, and a gap may be created by supplying compressed air when moving the mark detection system 21.

[0061] The operation of the exposure apparatus EXP will be described below by way of example. FIG. 6(A) is a flow chart showing an exposure processing sequence by the exposure apparatus EXP. The exposure sequence shown in FIG. 6(A) is controlled by the control unit 1100. First, in S101, a substrate 3 (e.g., a wafer) is loaded into the exposure apparatus EXP. In S102, the control unit 1100 judges whether or not to drive at least one of the multiple mark detection systems 21 of the mark detection apparatus 100 with respect to the substrate 3. The control unit 1100 can execute this judgment based on information such as layout information of marks to be detected that are registered in advance by the user, the number of marks to be detected, the exposure recipe that was executed immediately before, and a setting indicating whether productivity or accuracy is to be prioritized.

[0062] If it is determined in S102 that the mark detection system 21 needs to be driven, the process proceeds to S103. In S102, the control unit 1100 controls the mark detection device 100 to drive, position, and fix the mark detection system 21 to be driven among the multiple mark detection systems 21 of the mark detection device 100. Specifically, the control unit 1100 causes the driving mechanism DR to drive and position the mark detection system 21, and causes the fixing mechanisms 13a, 13b, 14a, and 14b to fix the mark detection system 21. If it is determined in S102 that the driving of any of the mark detection systems 21 is not required, the process proceeds to S104. In S104, the control unit 1100 causes a surface position detection device (not shown) to detect surface positions at multiple points on the substrate 3, and measures the shape of the surface of the substrate 3. The process of driving and fixing the mark detection device 100 in S103 may be performed in parallel with the process of S104.

[0063] In S105, the control unit 1100 moves the substrate stage WS so that the reference mark SM is located on the optical axis of the multiple mark detection systems 21 of the mark detection device 100 based on the design coordinate position of the reference mark SM formed on the reference member in the stage coordinate system. Then, the control unit 1100 measures the positional deviation of the reference mark SM with respect to the optical axis of the multiple mark detection systems 21, and resets the stage coordinate system based on the positional deviation so that the origin of the stage coordinate system coincides with the optical axis. After that, the control unit 1100 moves the substrate stage WS so that the reference mark SM is located on the optical axis of the exposure light based on the design positional relationship between the optical axis of the projection optical system 2 and the optical axis of the mark detection device 100. Then, the control unit 1100 measures the positional deviation of the reference mark with respect to the optical axis of the exposure light via the projection optical system 2 by a TTL detection system (not shown).

[0064] In S106, the control unit 1100 determines a reference baseline between the optical axis of each of the multiple mark detection systems 21 of the mark detection device 100 and the optical axis of the projection optical system 2 based on the measurement result in S105. In S107, the control unit 1100 detects the position of the mark on the substrate 3 using the mark detection device 100, and performs alignment of the XY plane of the substrate 3 with respect to the exposure device EXP. In S108, the control unit 1100 calculates the shift (movement), magnification (magnification), and rotation (rotation) for the arrangement of multiple shot areas on the substrate 3 by a global alignment method based on the measurement result in S107. Then, the control unit 1100 performs correction of each item and keystone correction based on the calculation result, and determines the regularity of the lattice arrangement. Thereafter, the control unit 1100 obtains a correction coefficient from the regularity of the lattice arrangement determined as the reference baseline, and performs alignment of the exposure light and the substrate 3 based on the result.

[0065] In S109, the control unit 1100 performs exposure and scanning of the substrate stage WS in the Y direction. During exposure, the control unit 1100 also performs an operation to match the shape of the surface of the substrate 3 in the height direction on an exposure slit basis by driving the stage in the Z direction and tilt direction based on the surface shape data of the exposure shot detected by the surface position detection device. In S110, the control unit 1100 judges whether there are any shot areas to be exposed (i.e., unexposed shot areas), and repeats the above operation until there are no more unexposed shot areas. When exposure of all shot areas is completed, the substrate 3 is unloaded in S111, and the exposure process is completed.

[0066] Next, a description will be given with reference to FIG. 6(B). The process of S105 described above is a calibration method for the positional deviation on the XY plane of the multiple mark detection systems 21. In reality, the focal positions (Z direction) of the multiple mark detection systems 21 may differ from each other. Generally, when mark detection is performed at a position deviated from the focal position, an error from the correct position occurs. Therefore, it is advantageous to improve detection accuracy by performing calibration while also taking into account focal position information. This method will be described with reference to FIG. 6(B). Note that here, an example will be described in which the mark detection system 21 does not have a focus drive mechanism. In this example, focus adjustment is performed by controlling the position and attitude of the substrate 3.

[0067] In S151, the control unit 1100 causes each mark detection system 21 to measure the reference mark SM, and acquires information on the focal position and the detected position in the XY directions of each mark detection system 21. In S152, the control unit 1100 calculates the tilt attitude of the substrate surface that has the least deviation from the focal position of each mark detection system 21 from the information acquired using each mark detection system 21, using the least squares method or the like.

[0068] In S153, the control unit 1100 controls the attitude of the substrate stage WS so that the tilt is the one calculated in S151. In S154, the control unit 1100 observes the marks with multiple mark detection systems 21, thereby making it possible to perform measurement at a position as close as possible to the focal position. This improves the accuracy of mark detection. In S155, the control unit 1100 determines whether there is an abnormality in the measurement result due to dirt or damage to the mark, and if the measurement is performed normally, proceeds to S156, and if there is an abnormality, returns to S153 and performs measurement again using an alternative mark. In S156, the control unit 1100 calculates the amount of deviation of the mark position in the substrate surface from the design value from the measurement value as a correction value.

[0069] [Second embodiment] The second embodiment will be described with reference to FIG. 7. Matters not mentioned as the second embodiment may follow the first embodiment. In the second embodiment, a horizontal fixing mechanism 13c is adopted instead of the vertical fixing mechanisms 14a and 14b in the first embodiment. The horizontal fixing mechanism 13c sucks the mark detection system housing 12 in the Z-axis direction. In the second embodiment, solenoid valves 15a, 15b, and 15c may be arranged in vacuum lines connected to the horizontal fixing mechanisms 13a, 13b, and 13c, respectively. The solenoid valves 15a, 15b, and 15c may be controlled by the control unit 1100. Note that, as in the first embodiment, a method of operating an air-operated valve using a solenoid valve may be adopted.

[0070] The horizontal fixing mechanism 13c can be supported by the detection system frame 23. The horizontal fixing mechanism 13c can generate a holding force for fixing the mark detection system housing 12 in the horizontal direction. In addition, the horizontal fixing mechanism 13c, together with the horizontal fixing mechanisms 13a and 13b, can generate a holding force for fixing the mark detection system housing 12 in the ωZ axis direction (rotation direction around the Z axis). In addition, the horizontal fixing mechanism 13c, together with the horizontal fixing mechanisms 13a and 13b, can generate a holding force for fixing the mark detection system housing 12 in the ωY axis direction (rotation direction around the Y axis). In the example of FIG. 7, the X-direction span of each guide 10 is not sufficient, and the rigidity in the ωY axis direction (around the Y axis) is not sufficient. The horizontal fixing mechanism 13c is useful for improving the rigidity in the ωY axis direction (around the Y axis). In order to improve the rigidity in the ωY axis direction (around the Y axis), the horizontal fixing mechanism 13c sucks the mark detection system housing 12 at a height different from that of the horizontal fixing mechanisms 13a and 13b.

[0071] Next, a procedure for fixing the position of the mark detection system 21 in the second embodiment will be described. First, the control unit 1100 may operate the solenoid valve 15a to supply vacuum pressure to the horizontal fixing mechanism 13a. Next, the control unit 1100 may operate the solenoid valve 15c to supply vacuum pressure to the horizontal fixing mechanism 13c. The control unit 1100 may stop the feedback control according to the timing of operating the solenoid valve 15c. When the feedback control is stopped, the driving of the AC servo motor 26 is stopped, and the holding force by the AC servo motor 26 is lost. Since it takes about several hundred msec for the horizontal fixing mechanism 13c to start vacuum suction, the stopping of the feedback control is completed first, and the driving force by the AC servo motor 26 and the holding force by the frictional force of the horizontal fixing mechanisms 13a and 13c do not interfere with each other. Alternatively, the gain of the feedback control may be gradually reduced so that the feedback control is turned off by the time the vacuum suction is completed.

[0072] Next, the control unit 1100 operates the solenoid valve 15b to supply vacuum pressure to the horizontal fixing mechanism 13b, thereby completing the fixing operation of the position of the mark detection system casing 12 (scope SCP).

[0073] In the second embodiment, the horizontal fixing mechanisms 13a and 13c can be arranged such that the center of gravity G of the mark detection system housing 12 is located between the horizontal fixing mechanisms 13a and 13c in the orthogonal projection onto the XY plane. In terms of the height direction, it is preferable that the height of the suction surface of the horizontal fixing mechanism 13c is near the height of the center of gravity G. Such a configuration is advantageous for suppressing the positional deviation of the mark detection system housing 12 when the mark detection system housing 12 is sucked by the horizontal fixing mechanisms 13a and 13c. In addition, such a configuration is advantageous for suppressing rotation in the ωX axis direction even if there is a difference in the suction force of the horizontal fixing mechanisms 13a and 13c. The horizontal fixing mechanism 13c generates a force to fix the mark detection system housing 12 in the horizontal direction, and since the heights of the horizontal fixing mechanisms 13a and 13b are different from each other, the horizontal fixing mechanism 13c has a different suction height from the horizontal fixing mechanism 13a, and can fix the mark detection system housing 12 in the ωY axis direction as well. Finally, the horizontal fixing mechanism 13b sucks the mark detection system housing 12, thereby obtaining a holding force sufficient for fixing the mark detection system housing 12. Guide 10 and horizontal fixing mechanisms 13a and 13c can provide sufficient rigidity for six degrees of freedom for fixing mark detection system housing 12. Therefore, positional deviation caused by suction of mark detection system housing 12 by horizontal fixing mechanism 13b can be kept sufficiently small.

[0074] [Third embodiment] The third embodiment will be described with reference to FIG. 8. Matters not mentioned in the third embodiment may follow the second embodiment, or the first embodiment through the second embodiment. The third embodiment employs a configuration in which a holding force is generated by actuators 20a, 20b, and 20c, instead of the configuration in the second embodiment in which a holding force is generated by applying vacuum pressure to horizontal fixing mechanisms 13a, 13b, and 13c. The actuators 20a, 20b, and 20c are controlled by a control unit 1100.

[0075] The horizontal fixing mechanisms 13a and 13b can be supported by the detection system frame 23 via the actuators 20a and 20b. The horizontal fixing mechanisms 13a and 13b are driven in the Z direction by the actuators 20a and 20b controlled by the control unit 1100, and pressed against the mark detection system housing 12. The fixing mechanisms 13a and 13b driven by the actuators 20a and 20b, respectively, generate a holding force that fixes the mark detection system housing 12 in the horizontal direction and the ωZ axis direction. The horizontal fixing mechanism 13c can be supported by the detection system frame 23 via the actuator 20c. The horizontal fixing mechanism 13c is driven in the Z direction by the actuator 20c controlled by the control unit 1100, and pressed against the mark detection system housing 12. The fixing mechanism 13c driven by the actuator 20c generates a holding force that fixes the mark detection system housing 12 in the horizontal direction and the ωZ axis direction. The horizontal fixing mechanism 13c is useful for improving the rigidity in the ωY axis direction (around the Y axis). In order to improve the rigidity in the ωY-axis direction (around the Y-axis), the horizontal fixing mechanism 13c can be pressed against the mark detection system housing 12 at a height different from that of the horizontal fixing mechanisms 13a and 13b.

[0076] The actuators 20a, 20b, and 20c can be individually controlled by the control unit 1100. The actuators 20a, 20b, and 20c can be configured by, for example, a piezoelectric element, an air cylinder, or an electromagnetic actuator. In the third embodiment, a vacuum line and a recess for vacuum suction are not required, which can contribute to simplifying the structure.

[0077] Next, a procedure for fixing the position of the mark detection system 21 in the third embodiment will be described. First, the control unit 1100 may operate the actuator 20a to press the horizontal fixing mechanism 13a against the mark detection system housing 12. Next, the control unit 1100 may operate the actuator 20c to press the horizontal fixing mechanism 13c against the mark detection system housing 12. The control unit 1100 may stop the feedback control according to the timing of operating the actuator 20c. When the feedback control is stopped, the driving of the AC servo motor 26 is stopped, and the holding force by the AC servo motor 26 is lost. It may take about several hundred msec to operate the actuator 20c to press the horizontal fixing mechanism 13c against the mark detection system housing 12. Therefore, in practice, the stopping of the feedback control is completed first, and the driving force by the AC servo motor 26 and the holding by the frictional force of the horizontal fixing mechanisms 13a and 13c do not interfere with each other. Alternatively, the gain of the feedback control may be gradually reduced so that the feedback control is turned OFF by the time the vacuum suction is completed. Next, the control unit 1100 operates the actuator 20a to press the horizontal fixing mechanism 13b against the mark detection system housing 12, thereby completing the fixing operation of the position of the mark detection system housing 12 (scope SCP). When the horizontal fixing mechanisms 13a, 13b, and 13c are not pressed against the mark detection system housing 12, the mark detection device 100 can be assembled and adjusted so that there is a gap between the horizontal fixing mechanisms 13a, 13b, and 13c and the mark detection system housing 12. However, conversely, the assembly and adjustment may be performed so that the horizontal fixing mechanisms 13a, 13b, and 13c are not pressed against the mark detection system housing 12. In this case, when the mark detection system 21 is moved, a gap may be formed between the horizontal fixing mechanisms 13a, 13b, and 13c and the mark detection system housing 12 by an actuator.

[0078] [Fourth embodiment] The fourth embodiment will be described with reference to FIG. 9. The fourth embodiment is provided as a supplement to the first embodiment. Matters not mentioned in the fourth embodiment may follow the first embodiment. In the fourth embodiment, the mark detection device 100 may include a main mark detection system housing 12a fixed to the detection system frame 23 described in the first embodiment. The mark detection device 100 may also include two sub mark detection system housings 12b and 12c supported by two guides 10a and 10b fixed to the detection system frame 23 and independently movable in the X direction. The guides 10a and 10b may be shared by the mark detection system housings 12a and 12b. The guides 10a and 10b may include, for example, rails.

[0079] Two horizontal fixing mechanisms 13a and 13b may be provided for the sub mark detection system housing 12b. The two horizontal fixing mechanisms 13a and 13b may be disposed between the guides 10a and 10b. The two horizontal fixing mechanisms 13a and 13b may be disposed such that the center of gravity of the mark detection system housing 12b is located between the two horizontal fixing mechanisms 13a and 13b. Two horizontal fixing mechanisms 13c and 13d may be provided for the sub mark detection system housing 12c. The two horizontal fixing mechanisms 13c and 13d may be disposed between the guides 10a and 10b. The two horizontal fixing mechanisms 13c and 13d may be disposed such that the center of gravity of the mark detection system housing 12c is located between the two horizontal fixing mechanisms 13a and 13b.

[0080] For the sub mark detection system housing 12b, two vertical fixing mechanisms 14a, 14b may be provided to suck the mark detection system housing 12b from the Y-axis direction. Also, for the sub mark detection system housing 12b, two vertical fixing mechanisms 14c, 14d may be provided to suck the mark detection system housing 12c from the Y-axis direction. In the example of FIG. 9, the X-direction span of each guide 10 is not sufficient, and the rigidity in the ωY-axis direction (around the Y-axis) is not sufficient. The vertical fixing mechanisms 14a, 14b, 14c, 14d are useful for improving the rigidity in the ωY-axis direction (around the Y-axis).

[0081] Horizontal fixing mechanisms 13a and 13b generate a holding force for fixing mark detection system housing 12b in the horizontal direction, and can generate a holding force for fixing mark detection system housing 12b in the ωZ axis direction by combining the two. Horizontal fixing mechanisms 13c and 13d generate a holding force for fixing mark detection system housing 12c in the horizontal direction, and can generate a holding force for fixing mark detection system housing 12c in the ωZ axis direction by combining the two. Vertical fixing mechanisms 14c and 14d may be supported by detection system frame 23 via the same member, and can generate a holding force for fixing mark detection system housing 12c in the vertical direction, and can generate a holding force for fixing mark detection system housing 12c in the ωY axis direction by combining the two.

[0082] The horizontal fixing mechanisms 13a, 13b, 13c, and 13d may be supplied with vacuum pressure via independent vacuum lines, while the vertical fixing mechanisms 14a, 14b, 14c, and 14d may be supplied with vacuum pressure via a common vacuum line.

[0083] The exposure apparatus EXP can be used in an article manufacturing method for manufacturing an article. The article manufacturing method can include an exposure step of exposing a substrate using the exposure apparatus EXP, a development step of developing the substrate that has undergone the exposure step, and a processing step of processing the substrate that has undergone the development step to obtain an article. The processing step can include, for example, a step of etching the substrate that has undergone the development step.

[0084] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0085] 23: detection system frame (support member), SCP: scope, DM: drive mechanism, 12a, 12b, 13a, 13b: fixing mechanism, 1100: control unit

Claims

1. A support member for supporting a mark detection system; a drive mechanism for changing a position of a scope included in the mark detection system relative to the support member; a plurality of fixing mechanisms each performing a fixing operation to fix the position of the scope relative to the support member; a control unit that causes the plurality of fixing mechanisms to perform the fixing operations in a preset sequence; A mark detection device comprising:

2. the control unit, when fixing the scope to the support member by the plurality of fixing mechanisms, causes the plurality of fixing mechanisms to start the fixing operations at preset time intervals.

2. The mark detection device according to claim 1.

3. the plurality of fixing mechanisms apply forces to different positions of the scope to fix the scope; 3. The mark detection device according to claim 1, wherein the mark detection device detects a position of the mark.

4. each of the plurality of fixing mechanisms includes a movable member, and applies a force to the scope for fixing the scope by pressing the movable member against the scope; 4. The mark detection device according to claim 3.

5. each of the plurality of fixing mechanisms sucks the scope by vacuum pressure; 5. The mark detection device according to claim 4.

6. The movable member includes a vacuum pad, and each of the plurality of fixing mechanisms includes a spring that supports the movable member.

6. The mark detection device according to claim 5.

7. the stiffness of the spring in a direction in which the movable member is pressed against the scope is lower than the stiffness of the spring in a direction perpendicular to the direction; 7. The mark detection device according to claim 6.

8. each of the plurality of fixing mechanisms includes an actuator that presses the movable member against the scope; 5. The mark detection device according to claim 4.

9. a positional deviation of the scope caused by the fixation of the scope when the plurality of fixing mechanisms are caused to perform the fixing operations in the sequence is smaller than a positional deviation of the scope caused by the fixation of the scope when the plurality of fixing mechanisms are caused to perform the fixing operations simultaneously; 9. The mark detection device according to claim 1, wherein the mark detection device detects a position of the mark.

10. the control unit determines the order such that a positional deviation of the scope caused by fixation of the scope falls within an allowable range when the fixing mechanisms are caused to perform the fixing operations in the order.

9. The mark detection device according to claim 1, wherein the mark detection device detects a position of the mark.

11. the order is determined as an order according to at least one of a movement amount, a movement direction, a target position, a movement speed, and a movement acceleration of the scope for positioning the scope; 9. The mark detection device according to claim 1, wherein the mark detection device detects a position of the mark.

12. a final driving direction of the scope in the operation of the driving mechanism for positioning the scope is a predetermined direction; 12. The mark detection device according to claim 1, wherein the mark detection device detects a position of the mark.

13. Equipped with multiple mark detection systems, each of the plurality of mark detection systems includes the scope, the drive mechanism, and the plurality of fixing mechanisms; the order is determined for each of the plurality of mark detection systems; 13. The mark detection device according to claim 1, wherein the mark detection device detects a position of the mark.

14. Further comprising two guides arranged in parallel to guide the scope, the plurality of fixing mechanisms includes two fixing mechanisms disposed between the two guides; 14. The mark detection device according to claim 1,

15. In an orthogonal projection onto a horizontal plane, the center of gravity of the scope is located between the two fixing mechanisms.

15. The mark detection device according to claim 14.

16. The two fixing mechanisms have horizontal surfaces that are pressed against the scope.

16. The mark detection device according to claim 14 or 15.

17. the plurality of fixing mechanisms includes a fixing mechanism disposed at a height different from the two fixing mechanisms; 17. The mark detection device according to claim 14, wherein the mark detection device detects a position of the mark.

18. A support member for supporting a mark detection system; a drive mechanism for changing a position of a scope included in the mark detection system relative to the support member; a plurality of fixing mechanisms each performing a fixing operation to fix the position of the scope relative to the support member; a control unit that causes the plurality of fixing mechanisms to perform the fixing operations at different timings and in a preset sequence; A mark detection device comprising:

19. A support member for supporting a mark detection system; a drive mechanism for changing a position of a scope included in the mark detection system relative to the support member; a plurality of fixing mechanisms each performing a fixing operation to fix the position of the scope relative to the support member; a control unit that causes one predetermined fixing mechanism among the plurality of fixing mechanisms to start the fixing operation, and then causes other fixing mechanisms among the plurality of fixing mechanisms to start the fixing operation; A mark detection device comprising:

20. An exposure apparatus for exposing a substrate, comprising:

20. An exposure apparatus comprising: a mark detection device according to claim 1 configured to detect a mark on the substrate.

21. an exposure step of exposing a substrate using the exposure apparatus according to claim 20; a developing step of developing the substrate that has been subjected to the exposure step; a processing step of processing the substrate that has undergone the developing step to obtain an article; A method for manufacturing an article, comprising:

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