Light heating device

Abstract

To provide an optical heating device having a flashlamp and LED elements.SOLUTION: An optical heating device for heating a substrate comprises: a chamber which houses the substrate; a support member which supports the substrate inside the chamber; a flashlamp which is disposed so as to face a first principal surface of the substrate supported by the support member; a plurality of LED elements which emit light toward the first principal surface of the substrate or a second principal surface that is on the opposite side to the first principal surface, from the outside of a flash irradiation space sandwiched between the substrate supported by the support member and the flashlamp; and a light-shielding member which is provided in the middle in a separation direction between the flashlamp and the plurality of LED elements, and also outside the flash irradiation space, and which shields light emitted from the flashlamp and proceeds to the plurality of LED elements.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present invention relates to a light heating device. [Background technology]

[0002] Conventionally, optical heating devices using halogen lamps have been mainly used for the heat treatment of semiconductor substrates. In recent years, in the semiconductor manufacturing process, there has been a demand for thinner impurity diffusion layers along with miniaturization and high integration, and there is a demand for heating devices that can perform heat treatment evenly in a short time.

[0003] In the semiconductor manufacturing process, a method called ion implantation is commonly used to introduce impurities into silicon crystals by ion implantation. In this method, the semiconductor substrate is heated to 1000°C or higher to repair crystal defects that occur during ion implantation.

[0004] In the case of a microprocess, the annealing of a semiconductor substrate is preferably performed by suppressing thermal diffusion on the semiconductor substrate as much as possible in order to form a thin impurity diffusion layer, and it is required to complete the heating process in a short time. Therefore, for example, a light heating device using a flash lamp as described in Patent Document 1 below is used in the annealing of a semiconductor substrate in a microprocess. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2006-324389 Summary of the Invention [Problem to be solved by the invention]

[0006] When the temperature of a semiconductor substrate is instantaneously raised and lowered between room temperature and 1000°C or higher, the substrate may expand or shrink rapidly due to heat, resulting in warping or cracking. In order to minimize the temperature difference between the temperature rise and fall of the heating by the flash lamp and to suppress warping or cracking of the semiconductor substrate, the optical heating device described in the above Patent Document 1 preheats the semiconductor substrate using a halogen lamp to a temperature at which the thermal diffusion of impurities is not an issue throughout the entire semiconductor substrate. Here, in this specification, the term "preheating" refers to the use of a separate light source to heat the semiconductor substrate to a predetermined temperature before annealing with the flash lamp.

[0007] Therefore, the present inventors have conducted extensive research into further improving and enhancing conventional light heating devices, as described below.

[0008] 11 is a diagram showing a schematic configuration of a conventional light heating device 100 equipped with a flash lamp 102 and a halogen lamp 103. As shown in FIG. 11, the conventional light heating device 100 includes a chamber 101, a flash lamp 102, and a halogen lamp 103.

[0009] The chamber 101 also includes a light-transmitting window 104 for introducing light emitted from the flash lamps 102 and the halogen lamps 103 into the chamber 101, and a support member 105 for supporting a semiconductor substrate W1 to be heated in the chamber 101. When the chamber 101 is evacuated, the light-transmitting window 104 is hermetically sealed with an O-ring or the like, but such a structure is not shown in FIG.

[0010] The halogen lamps 103 are turned on before heating is performed by the flash lamps 102, and perform preheating of the semiconductor substrate W1 accommodated in the chamber 101 until the temperature is stabilized at a predetermined temperature.

[0011] Here, the inventors considered replacing the halogen lamp 103 as the light source for preheating with an LED element in order to speed up preheating, extend the life of the light heating device 100, and reduce power consumption, and found that the following problems existed.

[0012] The flash lamps 102 emit light toward the semiconductor substrate W1 with such high energy that the temperature of the main surface of the semiconductor substrate W1 is instantaneously raised to 1000° C. or higher. However, not all of the light emitted from the flash lamps 102 is directed toward the semiconductor substrate W1, and some of the light is irradiated onto areas other than the semiconductor substrate W1.

[0013] When the LED element is irradiated with light emitted from the flash lamp 102, it is heated in the same manner as the semiconductor substrate W1, and in some cases, it may be destroyed. For this reason, in the conventional light heating device 100, it was not possible to simply replace the preheating light source from the halogen lamp 103 with the LED element.

[0014] In view of the above problems, an object of the present invention is to provide a light heating device including a flash lamp and an LED element. [Means for solving the problem]

[0015] The light heating device of the present invention is An optical heating device for heating a substrate, comprising: a chamber for housing the substrate; a support member for supporting the substrate within the chamber; a flash lamp disposed to face a first main surface of the substrate supported by the support member; a plurality of LED elements that emit light from an outside of a flashlight irradiation space sandwiched between the substrate supported by the support member and the flash lamp toward the first main surface of the substrate or a second main surface opposite to the first main surface; The present invention is characterized in that it is provided with a light-shielding member between the flash lamp and the multiple LED elements in the spacing direction and outside the flash irradiation space, which blocks light emitted from the flash lamp and traveling toward the multiple LED elements.

[0016] The LED element is arranged so as to irradiate light toward the first or second main surface of the substrate from outside the flash irradiation space between the substrate supported by the support member and the flash lamp. A light blocking member is arranged between the flash lamp and the LED element in the separation direction to block light emitted from the flash lamp toward the LED element.

[0017] Here, the "flash irradiation space" in this specification refers to the space between the substrate supported by the support member and the flash lamp. A detailed explanation of the flash irradiation space will be given later in the section "Form for carrying out the invention" with reference to Figures 1 and 2.

[0018] In addition, the term "light blocking" in this specification is a concept that includes not only blocking light in the entire spectral range, but also blocking light in a certain wavelength range among the light emitted from the flash lamp.

[0019] With the above configuration, the light emitted from the flash lamp is not directly irradiated onto the LED element. Therefore, the LED element is prevented from being destroyed by the light emitted from the flash lamp. In addition, since the light shielding member is disposed outside the flash irradiation area, the light emitted from the flash lamp and traveling directly toward the substrate is not shielded.

[0020] In addition to preheating, the LED elements provided in the light heating device of the above configuration can also be used, for example, to irradiate light onto the substrate after heating treatment using a flash lamp to prevent a sudden drop in temperature, or to provide concentrated heating to the peripheral areas of the substrate where the temperature is likely to drop.

[0021] In the above-mentioned light heating device, The light blocking member may be a glass material having a dielectric multilayer film formed on the surface.

[0022] Furthermore, in the above-mentioned light heating device, the plurality of LED elements are arranged to emit light toward the second main surface of the substrate; The light blocking member may be disposed between the substrate supported by the support member and the LED element.

[0023] The width of the wavelength band where the relative intensity of the spectrum of light emitted from an LED element is 50% or more with respect to the peak value of the light intensity is very narrow compared to the spectrum of light emitted from a flash lamp, as shown in Fig. 9 referred to in "Description of Embodiments". Therefore, by configuring a light-shielding member that transmits only light in a part of the wavelength range corresponding to the spectrum of light emitted from an LED element, it is possible to configure the light emitted from the LED element to transmit only the wavelength range with a sufficiently high light intensity and to block light in the other ranges.

[0024] By forming dielectric multilayer films with a predetermined thickness on the surface of the glass material, an optical member that transmits only light in a predetermined wavelength range is constructed. In other words, by configuring the light shielding member as described above, it is possible to configure it so that only light in a predetermined wavelength range transmits according to the spectrum of light emitted from the LED element.

[0025] Therefore, with the above configuration, the light emitted from the LED element is sufficiently irradiated onto the substrate, and light in a predetermined wavelength range emitted from the flash lamp and traveling toward the LED element is blocked. Therefore, all the light emitted from the flash lamp is not directly irradiated onto the LED element, and damage to the LED element is suppressed.

[0026] In the above-mentioned light heating device, the plurality of LED elements are arranged to emit light toward the second main surface of the substrate; The light blocking member may be disposed so as to connect a side surface of the substrate supported by the support member to an inner wall surface of the chamber.

[0027] The light blocking member in the above configuration is configured like a wall that divides the inside of the chamber into a space in which the flash lamps are arranged and a space in which the LED elements are arranged, and has a hole in which the substrate is fitted. The substrate fits into the hole, dividing the space in which the flash lamps are arranged and the space in which the LED elements are arranged.

[0028] As long as the light is strong enough not to destroy the LED elements, there is no problem if the light travels from the space in which the flash lamps are placed to the space in which the LED elements are placed, so there may be slight gaps between the substrate and the light shielding member, and between the light shielding member and the inner wall surface of the chamber. Specifically, there may be gaps of up to about 5.0 mm between the side surface of the substrate and the light shielding member, and between the light shielding member and the inner wall surface of the chamber.

[0029] However, it is preferable that the side surface of the substrate and the light-shielding member are in contact with each other all around and configured without gaps so as not to allow light to pass from the space in which the flash lamps are arranged to the space in which the LED elements are arranged. Also, for example, it is preferable that the light-shielding member and the chamber are configured as one unit so that no gaps are formed between the light-shielding member and the inner wall surface of the chamber.

[0030] With the above configuration, the light emitted from the flash lamp and traveling toward the LED element, either directly or after being reflected by the inner wall surface of the chamber, is blocked by the substrate and the light-shielding member. Therefore, the LED element is not irradiated at all or only partially by the light emitted from the flash lamp, and damage caused by the light emitted from the flash lamp is suppressed.

[0031] In the above-mentioned light heating device, the plurality of LED elements are arranged to emit light toward the second main surface of the substrate; the light-shielding member is a member that is disposed between the substrate supported by the support member and the LED elements and that is capable of opening and closing, and is configured to switch between a light-transmitting state and a light-blocking state by opening and closing; An opening / closing control unit may be provided that controls the light blocking member to close before the flash lamp is turned on.

[0032] With the above configuration, the light-shielding member can be configured to block the light emitted from the LED element and irradiated onto the second main surface of the substrate only when the flash lamp is turned on. As a result, during preheating, the light emitted from the LED element is irradiated onto the second main surface of the substrate, and when the flash lamp is turned on, the light emitted from the flash lamp is blocked so as not to reach the LED element.

[0033] In the above-mentioned light heating device, the plurality of LED elements are disposed on an opposite side of the flash lamp to the substrate supported by the support member, The light blocking member may be a reflector that reflects light emitted from the flash lamp and traveling toward the LED element toward the substrate.

[0034] With the above configuration, the light emitted from the flash lamp toward the LED element arranged on the opposite side of the substrate is reflected by the reflector toward the substrate. In other words, the light emitted from the flash lamp and traveling toward the LED element is blocked by the reflector. Therefore, the light emitted from the flash lamp is not directly irradiated onto the LED element.

[0035] Furthermore, it is no longer necessary to provide separate spaces for arranging the flash lamps and the LED elements, and they can be arranged close to each other, making it possible to reduce the size of the entire device. Effect of the Invention

[0036] According to the present invention, a light heating device including a flash lamp and an LED element is realized. [Brief description of the drawings]

[0037] [Figure 1A] 1 is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device. [Figure 1B] 1 is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device. [Diagram 2] 1B is a diagram of the light heating device of FIG. 1A viewed in the −Z direction with the reflector removed. [Figure 3A] 3 is a diagram showing a state in which the flash lamp, the light blocking member, and the semiconductor substrate are removed from FIG. 2. [Figure 3B] 1B when viewed in the −Z direction with the reflector, flash lamp, light blocking member, and semiconductor substrate removed. FIG. [Figure 4] 1 is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device. [Figure 5A] 1 is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device. [Figure 5B] 5B is a diagram showing a state in which the light blocking member provided in the light heating device of FIG. 5A is in the middle of an opening / closing process, as viewed from the +Z side. [Figure 5C] 5B is a diagram showing a state in which the light blocking member included in the light heating device of FIG. 5A is closed, as viewed from the +Z side. [Figure 6A] FIG. 2 is a side cross-sectional view showing a state in which a light blocking member is open in the configuration of one embodiment of a light heating device. [Figure 6B] FIG. 6B is a side cross-sectional view showing the light heating device in FIG. 6A in a state where the light blocking member is closed. [Figure 7] 1 is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device. [Figure 8A] 1 is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device. [Figure 8B] 8B is a diagram of the light blocking member of the light heating device of FIG. 8A as viewed from the +Z side. [Figure 9] 1 is a graph showing the spectra of light emitted by a flash lamp and an LED element. [Figure 10A] 1 is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device. [Figure 10B] 10B is a diagram of the light blocking member of the light heating device of FIG. 10A as viewed from the +Z side. [Figure 11] 1 is a diagram showing a schematic configuration of a conventional light heating device equipped with a flash lamp and a halogen lamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0038] The light heating device of the present invention will be described below with reference to the drawings. Note that the drawings are all schematic illustrations, and the dimensional ratios and numbers in the drawings do not necessarily match the actual dimensional ratios and numbers.

[0039] [First embodiment] Fig. 1A is a side cross-sectional view showing a schematic configuration of one embodiment of a light heating device 1, and Fig. 2 is a drawing showing the light heating device 1 of Fig. 1A viewed in the -Z direction with a reflector 15 described later removed. As shown in Fig. 1A, the light heating device 1 of the first embodiment includes a chamber 10 for accommodating a semiconductor substrate W1, a plurality of flash lamps 11, a plurality of LED elements 12, a support member 13, a light blocking member 14, and a reflector 15.

[0040] 1A and 2, the direction in which the multiple flash lamps 11 are arranged is defined as the X direction, the direction in which the flash lamps 11 extend is defined as the Y direction, and the direction perpendicular to the X and Y directions is defined as the Z direction. When expressing a direction, if a distinction is made between positive and negative directions, the direction is described with a positive or negative sign added, such as "+Z direction" and "-Z direction", and when expressing a direction without distinguishing between positive and negative directions, the direction is simply described as "Z direction".

[0041] As shown in FIG. 1A, the chamber 10 includes a support member 13 that supports the semiconductor substrate W1 inside. The support member 13 supports the semiconductor substrate W1 so that the main surfaces (W1a, W1b) of the semiconductor substrate W1 are arranged on the XY plane. Also, as shown in FIG. 1A, the chamber 20 of the first embodiment is formed with a light-transmitting window 10c so that the heating light emitted from each light source arranged outside the chamber 10 is taken in inside. The material of the light-transmitting window 10c is, for example, glass. Note that in the drawing viewed from the Z direction as in FIG. 2, which is referred to in the following description, the light-transmitting window 10c is not shown in order to understand the positional relationship of each member.

[0042] Fig. 1B is a side cross-sectional view showing a schematic configuration of another embodiment of the light heating device 1. As shown in Fig. 1B, the support member 13 supports the semiconductor substrate W1 in any manner as long as its main surface (W1a, W1b) is arranged on the XY plane. For example, the support member 13 may have a plurality of pin-shaped protrusions 13a and the protrusions 13a may support the semiconductor substrate W1 at points.

[0043] Here, the first principal surface W1a is a surface on which circuit elements, wiring, etc. are formed and which is irradiated with light emitted from the flash lamp 11, and the second principal surface W1b is a surface which is irradiated with light emitted from the LED element 12.

[0044] 1A and 2, the chamber 10 of the first embodiment has a rectangular parallelepiped shape that is a rectangle when viewed from the Z direction, but may have other shapes. For example, the chamber 10 may have a polygonal column shape that is a polygon other than a rectangle, such as a hexagon or an octagon, when viewed from the Z direction, or a cylindrical or elliptical shape that is a circle or an ellipse when viewed from the Z direction. In addition, the chamber 10 may not have the light-transmitting window 10c when it is not necessary to configure the light-transmitting window 10c, such as when a flash lamp 11 or an LED element 12 can be placed inside the chamber 10.

[0045] As shown in FIG. 1A, light emitted from the flash lamps 11 is irradiated onto a first main surface W1a of the semiconductor substrate W1, and light emitted from the LED elements 12 is irradiated onto a second main surface W1b of the semiconductor substrate W1.

[0046] When the power required for lighting is supplied between electrodes (not shown) and a trigger for starting discharge occurs, a discharge occurs in the light emitting tube of the flash lamp 11, and a flash of light is emitted toward the first main surface W1a of the semiconductor substrate W1. The semiconductor substrate W1 is instantaneously (for example, in about 0.1 ms to 100 ms) heated to 1000° C. or higher by the flash of light emitted from the flash lamp 11 being irradiated onto the first main surface W1a.

[0047] Fig. 3A is a diagram of a state in which the flash lamps 11, the light blocking member 14, and the semiconductor substrate W1 have been removed from Fig. 2, and Fig. 3B is a diagram of the light heating device 1 of Fig. 1B when viewed in the -Z direction with the reflector 15, the flash lamps 11, the light blocking member 14, and the semiconductor substrate W1 removed. As shown in Fig. 3A and Fig. 3B, the multiple LED elements 12 are arranged on the XY plane on one LED substrate 12a, and are arranged so that the light emitted from the LED elements 12 is directed toward the second main surface W1b of the semiconductor substrate W1 as shown in Fig. 1A.

[0048] In the light heating device 1 of the first embodiment, as shown in Fig. 1A and Fig. 3A, a plurality of LED elements 12 are arranged on the same plane on one LED substrate 12a, but the LED substrate 12a may have a curved surface and the LED elements 12 may be arranged on the curved surface. Also, the LED substrate 12a may be divided into a plurality of substrates.

[0049] 1A, the light shielding member 14 is disposed so as to connect the side surface of the semiconductor substrate W1 with the inner wall surface 10a of the chamber 10. When viewed from the Z direction, the light shielding member 14 has an annular shape provided with a hole in which the semiconductor substrate W1 fits, as shown in FIG.

[0050] This separates space A1 into which light emitted from flash lamps 11 is irradiated and space A2 into which light emitted from LED elements 12 is irradiated. Light that is emitted from flash lamps 11 and does not irradiate semiconductor substrate W1 but attempts to travel toward the outside of semiconductor substrate W1 is blocked by light-shielding member 14 and does not travel toward LED elements 12. In other words, light-shielding member 14 functions to block light that is emitted from flash lamps 11 and travels toward LED elements 12 without traveling toward semiconductor substrate W1.

[0051] 2, a small gap d1 is formed between the semiconductor substrate W1 and the light blocking member 14. It is preferable that no gap d1 is formed at all. However, due to variations in size of the semiconductor substrate W1, it is difficult to configure the light heating device 1 so that no gap d1 is formed for all semiconductor substrates W1.

[0052] Therefore, it is preferable that the light heating device 1 is formed so that the gap d1 is 5.0 mm or less, taking into consideration that the amount of light emitted from the flash lamp 11 and reaching the LED element 12 is reduced to a level that does not destroy the LED element 12.

[0053] 1A is a space between the semiconductor substrate W1 supported by the support member 13 and the flash lamp 11, and is a space through which the light emitted from the flash lamp 11 travels directly toward the semiconductor substrate W1. This space A3 is hereinafter referred to as the "flash irradiation space A3."

[0054] The range of the flash irradiation space A3 in the XY plane is a region where the flash lamp 11 and the semiconductor substrate W1 overlap when viewed from the Z direction, as shown in FIG.

[0055] As shown in FIGS. 1A and 2, when there is a gap d2 between the flash lamps 11, the flash irradiation space A3 also includes the space between the gap d2 and the semiconductor substrate W1.

[0056] If a member that blocks the light emitted from the flash lamps 11 is placed between the flash lamps 11 and the first main surface W1a of the semiconductor substrate W1, the light emitted from the flash lamps 11 will not reach the first main surface W1a of the semiconductor substrate W1. As a result, there will be some parts of the first main surface W1a of the semiconductor substrate W1 that the light emitted from the flash lamps 11 reaches and some parts that it does not reach.

[0057] For this reason, LED elements 12 and light blocking member 14 are disposed outside flash irradiation space A3 so that light emitted from flash lamps 11 is evenly irradiated onto first main surface W1a of semiconductor substrate W1. Light blocking member 14 is disposed between flash lamps 11 and LEDs in the direction in which they are separated from each other (Z direction in the first embodiment).

[0058] The reflector 15 reflects the light emitted from the flash lamp 11 and traveling toward the opposite side (+Z side) from the semiconductor substrate W1, so that the light travels toward the semiconductor substrate W1 side (-Z side).

[0059] With the above configuration, the light emitted from the flash lamp 11 is blocked by the semiconductor substrate W1 or the light blocking member 14, and only a small amount of light passes through the gap d1, so that the LED element 12 is hardly irradiated with the light. Therefore, the LED element 12 is prevented from being destroyed by the light emitted from the flash lamp 11.

[0060] In the first embodiment, a plurality of flash lamps 11 are provided, but as long as the intensity of the emitted light is sufficiently high, only one flash lamp may be provided, and the reflector 15 may not be provided.

[0061] Fig. 4 is a side cross-sectional view showing a schematic configuration of another embodiment of the light heating device 1. As shown in Fig. 1A, the light blocking member 14 in the first embodiment is configured to be parallel to the XY plane, but as shown in Fig. 4, the light blocking member 14 may be configured to be inclined with respect to the XY plane.

[0062] [Second embodiment] The configuration of the second embodiment of the light heating device 1 of the present invention will be described, focusing on the differences from the first embodiment.

[0063] 5A is a side cross-sectional view showing a schematic configuration of one embodiment of the light heating device 1. In the light heating device 1 of the second embodiment, a light blocking member 14 is disposed between the semiconductor substrate W1 and the LED element 12 in the Z direction. Note that the light blocking member 14 of the second embodiment is configured to be openable and closable.

[0064] Fig. 5B is a diagram showing a state in which the light blocking member 14 provided in the light heating device 1 in Fig. 5A is in the middle of an opening / closing process as viewed from the +Z side, and Fig. 5C is a diagram showing a state in which the light blocking member 14 provided in the light heating device 1 in Fig. 5A is closed as viewed from the +Z side. The light blocking member 14 of the second embodiment is configured to be openable and closable like a camera shutter, as shown in Figs. 5B and 5C.

[0065] As shown in FIG. 5A, the light heating device 1 of the second embodiment includes a control unit 40. The control unit 40 includes an illumination control unit 40a that controls the illumination of the flash lamp 11, and an opening / closing control unit 40b that controls the opening and closing of the light blocking member 14.

[0066] When the semiconductor substrate W1 is accommodated in the chamber 10, preheating is started by the LED elements 12. Then, when a predetermined time required for preheating has elapsed, the opening / closing control unit 40b controls the light blocking member 14 to close before the lighting control unit 40a executes lighting control of the flash lamps 11.

[0067] After the light blocking member 14 is closed, the lighting control unit 40a executes lighting control of the flash lamp 11, and light is emitted from the flash lamp 11 toward the semiconductor substrate W1. At this time, the LED element 12 may be either lit or unlit.

[0068] With the above configuration, when the flash lamp 11 is turned on, the space A1 irradiated with the light emitted from the flash lamp 11 and the space A2 irradiated with the light emitted from the LED element 12 are separated by the light-shielding member 14. That is, of the light emitted from the flash lamp 11, the light that is not irradiated onto the semiconductor substrate W1 and passes around the semiconductor substrate W1 is blocked by the light-shielding member 14 and does not reach the space A2. Therefore, the light emitted from the flash lamp 11 is not irradiated onto the LED element 12, and damage to the LED element 12 is suppressed.

[0069] In the above description, as shown in Fig. 5B and Fig. 5C, the light shielding member 14 is configured like a camera shutter and is opened and closed by the opening / closing control unit 40b, but the light shielding member 14 may have other configurations. For example, the light shielding member 14 may be opened and closed by moving a plate-like member. In the second embodiment, the housing portion 14a in which the light shielding member 14 is housed is formed in the chamber 10 while the LED element 12 is irradiating the second main surface W1b of the semiconductor substrate W1 with light, but the housing portion 14a may not be formed in the chamber 10, and a gap may be provided in the wall of the chamber 10 to allow the light shielding member 14 to be inserted and removed.

[0070] 6A and 6B are side cross-sectional views showing an open state and a closed state of the light blocking member 14 in another configuration of one embodiment of the light heating device 1. The light blocking member 14 in this configuration may be configured to open and close like a louver, as shown in Figs. 6A and 6B.

[0071] In this configuration, the control unit 40 is also configured so that the opening / closing control unit 40b controls the light-shielding member 14 to close before the lighting control unit 40a turns on the flash lamp 11; however, the control unit 40 is not shown in Figures 6A and 6B.

[0072] [Third embodiment] The configuration of the third embodiment of the light heating device 1 of the present invention will be described, focusing on the differences from the first and second embodiments.

[0073] Fig. 7 is a side cross-sectional view showing a schematic configuration of one embodiment of the light heating device 1. As shown in Fig. 7, in the light heating device 1 of the third embodiment, the LED element 12 is disposed on the +Z side of the flash lamp 11.

[0074] Each flash lamp 11 is provided with an individual reflector 15. The reflector 15 reflects light emitted from the flash lamp 11 so that it travels toward the semiconductor substrate W1 side, and also blocks the light emitted from the flash lamp 11 so that it does not travel directly toward the LED element 12. That is, the reflector 15 in the third embodiment constitutes the light-shielding member 14.

[0075] The LED elements 12 irradiate light onto the first main surface W1a of the semiconductor substrate W1 through a gap d3 sandwiched between the reflectors 15 arranged in the X direction.

[0076] With the above configuration, the light emitted from flash lamp 11 is not directly irradiated onto LED element 12, so that damage to LED element 12 by the light emitted from flash lamp 11 can be prevented.

[0077] Furthermore, since the flash lamps 11 and the LED elements 12 can be arranged close to each other in the same space, the entire light heating device 1 can be made compact.

[0078] [Fourth embodiment] The configuration of the fourth embodiment of the light heating device 1 of the present invention will be described, focusing on the differences from the first, second and third embodiments.

[0079] Fig. 8A is a side cross-sectional view showing a schematic configuration of one embodiment of the light heating device 1, and Fig. 8B is a drawing showing the light blocking member 14 of the light heating device 1 of Fig. 8A as viewed from the +Z side. As shown in Fig. 8A, the light blocking member 14 of the fourth embodiment is configured to separate the space A1 and the space A2, and is configured to transmit light having a wavelength near the main emission wavelength of the light emitted from the LED element 12.

[0080] More specifically, the light-shielding member 14 is a member in which a dielectric multilayer film is formed on the surface of a plate-shaped glass material so as to transmit light in a predetermined wavelength range and reflect light in the other wavelength ranges. The dielectric multilayer film is, for example, a film in which ZrO2 and SiO2 layers are laminated in multiple layers, and is configured to block light outside the wavelength range of ±50 nm from the main emission wavelength of the LED element 12.

[0081] The term "main emission wavelength" as used herein refers to the wavelength at which the intensity of emitted light is the highest within the emission spectrum.

[0082] Here, we will explain the spectra of flash lamp 11 and LED element 12. Fig. 9 is a graph showing the spectrum of light emitted by flash lamp 11 and LED element 12, and is a graph showing relative intensity with the light intensity at the peak wavelength set to 1.

[0083] 9, the light emitted from the LED element 12 has a main emission wavelength of 398 nm and exhibits a narrow emission spectrum with a wavelength band width of about 50 nm where the relative intensity to the peak value of the light intensity is 50% or more (solid line).The light emitted from the flash lamp 11 exhibits a broad emission spectrum with an emission wavelength band of 1000 nm or more (dashed line).

[0084] Therefore, with the above configuration, the light emitted from the flash lamp 11 that reaches the LED element 12 is only a small portion of the wavelength range of the entire spectrum. Therefore, the light emitted from the flash lamp 11 does not reach the LED element 12 while maintaining high energy that would destroy the LED element 12. In other words, it is possible to prevent the LED element 12 from being excessively heated and destroyed by the light emitted from the flash lamp 11.

[0085] 8A and 8B, the light blocking member 14 of the fourth embodiment is configured without gaps so as to completely separate the space A1 and the space A2 when viewed from the Z direction, but it does not necessarily have to be configured without gaps. For example, in the vicinity of the center where the light emitted from the flash lamp 11 is sufficiently blocked by the semiconductor substrate W1, a hole may be provided so that the light emitted from the LED element 12 is not attenuated even slightly.

[0086] Furthermore, the light blocking member 14 in the first to third embodiments described with reference to FIGS. 1 to 7 may be made of a glass material on which a dielectric multilayer film is formed.

[0087] Fig. 10A is a side cross-sectional view showing a schematic configuration of another embodiment of the light heating device 1, and Fig. 10B is a drawing of the light blocking member 14 of Fig. 10A when viewed from the +Z side. As shown in Fig. 10A and Fig. 10B, the light blocking member 14 of the fourth embodiment may be formed with protrusions 13a that support the semiconductor substrate W1, and may be configured to have the function of the support member 13.

[0088] [Another embodiment] Another embodiment will be described below.

[0089] <1> The light heating device 1 may be provided with an optical system such as a lens, a prism, a diffusion plate, or an integrator optical system. By providing these optical systems, the light heating device 1 can be configured so that the light emitted from the LED elements 12 is evenly irradiated onto the entire main surface (W1a, W1b) of the semiconductor substrate W1. It can also be configured so that the light is irradiated onto the main surface (W1a, W1b) of the semiconductor substrate W1 while avoiding the flash lamps 11 and the light shielding member 14.

[0090] <2> The configuration of the light heating device 1 described above is merely an example, and the present invention is not limited to the configurations shown in the drawings. [Explanation of symbols]

[0091] 1 : Optical heating device 10: Chamber 10a: Inner wall surface 10c: Translucent window 11: Flash lamp 12: LED element 12a: LED board 13: Support member 13a : Protrusion 14: Light blocking material 14a: Storage section 15: Reflector 40: Control section 40a: Lighting control section 40b: Opening and closing control section 100: Optical heating device 101: Chamber 102: Flash lamp 103: Halogen lamp 104: Translucent window 105: Support member W1: Semiconductor substrate W1a: First principal surface W1b: Second principal surface

Claims

1. An optical heating device for heating a substrate, comprising: a chamber for housing the substrate; a support member for supporting the substrate within the chamber; a flash lamp disposed so as to face only a first main surface of the substrate supported by the support member; a plurality of LED elements that emit light from an outside of a flashlight irradiation space sandwiched between the substrate supported by the support member and the flash lamp toward the first main surface of the substrate or a second main surface opposite to the first main surface; a light-shielding member that is between the flash lamp and the plurality of LED elements in a separation direction and outside the flash irradiation space and that blocks light that is emitted from the flash lamp and proceeds toward the plurality of LED elements; The light heating device is characterized in that the light-shielding member is a glass material having a dielectric multilayer film formed on its surface, which blocks light emitted from the flash lamp that is outside the wavelength range of ±50 nm of the main emission wavelength of the light emitted by the LED element.

2. the plurality of LED elements are arranged to emit light toward the second main surface of the substrate; 2. The optical heating device according to claim 1, wherein the light blocking member is disposed between the substrate supported by the support member and the LED element.

3. the plurality of LED elements are arranged to emit light toward the second main surface of the substrate; 2. The optical heating device according to claim 1, wherein the light blocking member is disposed so as to connect a side surface of the substrate supported by the support member with an inner wall surface of the chamber.

4. the plurality of LED elements are arranged to emit light toward the second main surface of the substrate; the light blocking member is a member that is disposed between the substrate supported by the support member and the plurality of LED elements and that is capable of being opened and closed, and is configured to switch between a light transmitting state and a light blocking state by opening and closing; 3. The light heating device according to claim 1, further comprising an opening / closing control unit that controls the light blocking member to close before the flash lamp is turned on.

5. the plurality of LED elements are disposed on an opposite side of the flash lamp to the substrate supported by the support member, 2. The optical heating device according to claim 1, wherein the light blocking member is a reflector that reflects light emitted from the flash lamp and traveling toward the LED element toward the substrate.

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