Multilayer board, multilayer board module and electronic device

Abstract

In the present invention, a plurality of conductor layers include a first conductor layer that has a mounting electrode that is positioned at a positive main surface of an insulator layer that is positioned farthest in the positive direction of the Z-axis among a plurality of insulator layers. One or more interlayer connection conductors connect two conductor layers that are positioned at the positive main surface and the negative main surface of a first insulator layer. The first interlayer connection conductor includes a first region, and a second region that has a lower heat transfer coefficient than that of the first region, the second region being positioned farther in the negative direction of the Z-axis than the first region. As seen in the Z-axis direction, the area of a large-area first interlayer connection conductor that is at least one of the one or more first interlayer connection conductors is greater than the area of a second interlayer connection conductor.

Description

[Technical field]

[0001] The present invention relates to a multilayer board having an interlayer connection conductor, a multilayer board module, and an electronic device. [Background technology]

[0002] As an example of an invention related to a conventional multilayer board, a power amplifier module described in Patent Document 1 is known. This power amplifier module includes a laminated board and electronic components. The laminated board has a structure in which a core board and a board constituent base material are stacked in the vertical direction. The laminated board has a plate shape with an upper main surface and a lower main surface. The laminated board includes a plurality of heat dissipation vias that penetrate the core board and the board constituent base material in the vertical direction. The electronic components are mounted on the upper main surface of the laminated board. As a result, heat generated by the electronic components is transferred to the lower main surface of the laminated board through the plurality of heat dissipation vias. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2005-191435 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the field of the power amplifier module described in Patent Document 1, there are cases where it is undesirable to transfer heat to the lower surface of the laminated substrate.

[0005] Therefore, an object of the present invention is to provide a multilayer board, a multilayer board module, and an electronic device that can suppress the transfer of heat to the underside of the laminate while suppressing a decrease in heat dissipation performance. [Means for solving the problem]

[0006] A multilayer substrate according to one embodiment of the present invention comprises: a laminate having a structure in which a plurality of insulator layers, each having a positive principal surface located in the positive direction of the Z axis and a negative principal surface located in the negative direction of the Z axis, are laminated in the Z axis direction; a plurality of conductor layers provided in the laminate, the plurality of conductor layers including a first conductor layer having a mounting electrode located on a front main surface of an insulator layer located most positive in the Z-axis direction among the plurality of insulator layers; one or more first interlayer connection conductors that penetrate a first insulator layer, which is one of the plurality of insulator layers, in the Z-axis direction and connect two of the conductor layers located on the positive principal surface and the negative principal surface of the first insulator layer; a second interlayer connection conductor penetrating one of the plurality of insulator layers in the Z-axis direction; Equipped with Each of the one or more first interlayer connection conductors is A first region; a second region having a lower thermal conductivity than the first region, the second region being located in a negative direction of the Z axis from the first region; Contains When viewed in the Z-axis direction, an area of ​​a large-area first interlayer connection conductor, which is at least one of the one or more first interlayer connection conductors, is larger than an area of ​​the second interlayer connection conductor. Effect of the Invention

[0007] According to the multilayer board of the present invention, it is possible to suppress the transfer of heat to the lower surface of the laminate while suppressing the deterioration of heat dissipation performance. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view of an electronic device 1. [Diagram 2] FIG. 2 is a top view of the multilayer substrate 11 and the electronic component 100. As shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view of the multilayer substrate module 10a. [Figure 4] FIG. 4 is a cross-sectional view of the multilayer substrate module 10b. [Diagram 5]FIG. 5 is a cross-sectional view of the multilayer substrate module 10c. [Figure 6] FIG. 6 is a cross-sectional view of the multilayer substrate module 10d. [Figure 7] FIG. 7 is a cross-sectional view of the multilayer substrate module 10e. [Figure 8] FIG. 8 is a cross-sectional view of the multilayer substrate module 10f. [Figure 9] FIG. 9 is a cross-sectional view of the multilayer substrate module 10g. [Figure 10] FIG. 10 is a cross-sectional view of the multilayer substrate module 10h. [Figure 11] FIG. 11 is a cross-sectional view of the multilayer substrate module 10i. [Figure 12] FIG. 12 is a cross-sectional view of the multilayer substrate module 10j. [Figure 13] FIG. 13 is a cross-sectional view of the multilayer substrate module 10k. [Figure 14] FIG. 14 is a cross-sectional view of the multilayer substrate module 10l. [Figure 15] FIG. 15 is a top view of the multilayer substrate 11l. [Figure 16] FIG. 16 is a top view of the multilayer substrate 11m. [Figure 17] FIG. 17 is a cross-sectional view of the electronic device 1n. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (Embodiment) [Electronic device structure] The structure of an electronic device 1 according to an embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a cross-sectional view of the electronic device 1. Fig. 2 is a top view of the multilayer substrate 11 and the electronic component 100. In Fig. 2, the protective layer 16 is omitted.

[0010] In this specification, directions are defined as follows. The stacking direction of the laminate 12 of the multilayer substrate 11 is defined as the up-down direction. The up-down direction also coincides with the Z-axis direction. The up direction is the positive direction of the Z-axis. The down direction is the negative direction of the Z-axis. Directions perpendicular to the up-down direction are defined as the left-right direction and the front-rear direction. The left-right direction is perpendicular to the front-rear direction. Note that the up and down directions in the up-down direction may be interchanged, the left and right directions in the left-right direction may be interchanged, and the front and rear directions in the front-rear direction may be interchanged.

[0011] The electronic device 1 is, for example, a wireless communication terminal such as a smartphone. The electronic device 1 includes a multilayer substrate module 10 and a housing 120. The multilayer substrate module 10 includes a multilayer substrate 11 and an electronic component 100. The housing 120 houses the multilayer substrate module 10.

[0012] The multilayer substrate 11 transmits high-frequency signals. As shown in Fig. 1 and Fig. 2, the multilayer substrate 11 includes a laminate 12, a protective layer 16, conductor layers 18a-18h, 19a-19f, first interlayer connection conductors V1, v1a, v1b, and second interlayer connection conductors v2a-v2f.

[0013] As shown in FIG. 1, the laminate 12 has a plate shape having an upper main surface and a lower main surface. The laminate 12 has a rectangular shape when viewed in the vertical direction. The laminate 12 has a structure in which the insulating layers 14a to 14c having an upper main surface (a positive main surface located in the positive direction of the Z axis) and a lower main surface (a negative main surface located in the negative direction of the Z axis) are stacked in the vertical direction (Z axis direction). The insulating layers 14a to 14c are arranged in this order from top to bottom. The insulating layers 14a to 14c have a rectangular shape when viewed in the vertical direction. The insulating layers 14a to 14c are made of a resin. The insulating layers 14a to 14c are made of, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. This makes the laminate 12 flexible. A plane located at the center of the laminate 12 in the vertical direction (Z axis direction) and perpendicular to the vertical direction (Z axis direction) is defined as an intermediate plane S.

[0014] As shown in FIG. 1 and FIG. 2, the conductor layers 18a-18h, 19a-19f are provided on the laminate 12. The conductor layers 18a-18h are located on the upper main surface of the insulator layer 14a. As shown in FIG. 2, the conductor layers 18a-18h have mounting electrodes E1-E9. The mounting electrodes E1-E9 are located on the upper main surface (positive main surface) of the insulator layer 14a that is located at the top (most positive in the Z-axis direction) of the insulator layers 14a-14c. The mounting electrodes E1-E9 are exposed portions of the conductor layers 18a-18h from the protective layer 16 described later. The mounting electrodes E1-E9 are arranged in a 3×3 matrix when viewed in the vertical direction. The mounting electrodes E1-E9 have a rectangular shape when viewed in the vertical direction.

[0015] As shown in FIG. 2, the conductor layers 18a to 18c are arranged in this order from left to right. The conductor layer 18a extends in the left-right direction. The mounting electrodes E1 and E4 are arranged in this order from front to rear at the right end of the conductor layer 18a. The conductor layer 18b has a square shape. The mounting electrode E5 is located in the center of the conductor layer 18b. The conductor layer 18c extends in the left-right direction. The mounting electrode E6 is located at the left end of the conductor layer 18c.

[0016] 1, the conductor layers 19a to 19c are located on the upper main surface of the insulating layer 14b. The conductor layers 19a to 19c are arranged in this order from left to right. The conductor layers 19a to 19c extend in the left-right direction.

[0017] As shown in Fig. 1, the conductor layers 19d to 19f are located on the lower main surface of the insulating layer 14c. The conductor layers 19d to 19f are arranged in this order from left to right. The conductor layers 19d to 19f have a rectangular shape when viewed in the up-down direction. The conductor layers 19d to 19f are, for example, external electrodes.

[0018] The conductor layers 18a to 18c and 19a to 19f are formed by patterning metal foil attached to the upper main surfaces of the insulating layers 14a and 14b and the lower main surface of the insulating layer 14c. The metal foil is, for example, copper foil.

[0019] 1, the protective layer 16 covers substantially the entire upper main surface of the insulating layer 14a. As a result, the protective layer 16 protects the conductor layers 18a-18h. However, the mounting electrodes E1-E9 are not covered by the protective layer 16. In addition, the protective layer 16 is not a part of the laminate 12. No conductor layer is provided on the upper main surface of the protective layer 16. The above-described protective layer 16 is, for example, a resist layer.

[0020] The first interlayer connection conductors V1, v1a, and v1b penetrate the insulator layer 14a (first insulator layer), which is one of the insulator layers 14a to 14c, in the vertical direction (Z-axis direction). The first interlayer connection conductor V1 (large-area first interlayer connection conductor) and the first interlayer connection conductors v1a and v1b are located above the midplane S (positive direction of the Z-axis). The first interlayer connection conductors V1, v1a, and v1b have a shape in which the area of ​​a cross section perpendicular to the vertical direction decreases from bottom to top. Specifically, the first interlayer connection conductor V1 has a quadrangular pyramid shape. The first interlayer connection conductors v1a and v1b have a circular truncated cone shape. The area of ​​the upper end of the first interlayer connection conductors V1, v1a, and v1b is smaller than the area of ​​the lower end of the first interlayer connection conductors V1, v1a, and v1b.

[0021] The first interlayer connection conductor V1 connects the conductor layer 18a and the conductor layer 19a (two conductor layers) located on the upper main surface (positive main surface) and the lower main surface (negative main surface) of the insulator layer 14a (first insulator layer). The first interlayer connection conductor v1a connects the conductor layer 18b and the conductor layer 19b (two conductor layers) located on the upper main surface (positive main surface) and the lower main surface (negative main surface) of the insulator layer 14a (first insulator layer). The first interlayer connection conductor v1b connects the conductor layer 18c and the conductor layer 19c (two conductor layers) located on the upper main surface (positive main surface) and the lower main surface (negative main surface) of the insulator layer 14a (first insulator layer).

[0022] Each of the first interlayer connection conductors V1, v1a, and v1b includes a first region A1 and a second region A2. The first region A1 and the second region A2 are arranged in this order from top to bottom. The second region A2 is located below the first region A1 (in the negative direction of the Z axis). The second region A2 has a lower thermal conductivity than the first region A1. The material of the first region A1 is the same as the material of the conductor layers 18a to 18c. Therefore, the material of the first region A1 is, for example, copper. The material of the second region A2 is, for example, an alloy of tin and copper or an alloy of tin and silver. The second region A2 is formed by sintering a conductive paste that is a mixture of metal powder and resin.

[0023] The second interlayer connection conductors v2a-v2c penetrate the insulator layer 14b (one of the multiple insulator layers) in the vertical direction (Z-axis direction). The second interlayer connection conductors v2a-v2c have a shape in which the area of ​​a cross section perpendicular to the vertical direction decreases from bottom to top. Specifically, the second interlayer connection conductors v2a-v2c have a truncated cone shape. The area of ​​the upper ends of the second interlayer connection conductors v2a-v2c is smaller than the area of ​​the lower ends of the second interlayer connection conductors v2a-v2c.

[0024] The upper end of the second interlayer connection conductor v2a is connected to the left end of the conductor layer 19a. The upper end of the second interlayer connection conductor v2b is connected to the right end of the conductor layer 19b. The upper end of the second interlayer connection conductor v2c is connected to the right end of the conductor layer 19c.

[0025] Each of the second interlayer connection conductors v2a to v2c includes a first region A1 and a second region A2. The first region A1 and the second region A2 are arranged in this order from top to bottom.

[0026] The second interlayer connection conductors v2d-v2f penetrate the insulating layer 14c (one of the multiple insulating layers) in the up-down direction (Z-axis direction). The second interlayer connection conductors v2d-v2f are located below the midplane S (negative direction of the Z-axis). The second interlayer connection conductors v2d-v2f have a shape in which the area of ​​a cross section perpendicular to the up-down direction decreases from top to bottom. Specifically, the second interlayer connection conductors v2d-v2f have a truncated cone shape. The area of ​​the upper ends of the second interlayer connection conductors v2d-v2f is smaller than the area of ​​the lower ends of the second interlayer connection conductors v2d-v2f. big .

[0027] The second interlayer connection conductor v2d connects the second interlayer connection conductor v2a to the conductor layer 19d. The second interlayer connection conductor v2e connects the second interlayer connection conductor v2b to the conductor layer 19e. The second interlayer connection conductor v2f connects the second interlayer connection conductor v2c to the conductor layer 19f.

[0028] Each of the second interlayer connection conductors v2d to v2f includes a first region A1 and a second region A2. The first region A1 and the second region A2 are arranged in this order from bottom to top.

[0029] The first region A1 as described above is formed by plating the through holes that vertically penetrate the insulating layers 14a-14c with a metal. The metal is, for example, copper. The second region A2 is formed by filling the metal-plated through holes with a conductive paste and firing the conductive paste.

[0030] The electronic component 100 is mounted on the mounting electrodes E1 to E9 of the multilayer substrate 11. The electronic component 100 is an element that generates heat during operation. The electronic component 100 is, for example, an IC (Integrated Circuit). The electronic component 100 is, for example, an RFIC (Radio Frequency Integrated Circuit), a CPU (Central Processing Unit), or a power supply IC. The electronic component 100 includes a component body 102 and external electrodes B1 to B9. The component body 102 has a rectangular parallelepiped shape. The external electrodes B1 to B9 are located on the lower surface of the component body 102. The external electrodes B1 to B9 are arranged in a 3×3 matrix. The external electrodes B1 to B9 are connected to the mounting electrodes E1 to E9, respectively. The external electrodes B1 to B9 are electrodes to which a power supply voltage or a ground potential is connected, or electrodes through which a high-frequency signal is input or output. In this embodiment, the external electrode B4 is an electrode to which a power supply voltage or a ground potential is connected.

[0031] Here, the first interlayer connection conductor V1 is a large-area first interlayer connection conductor. When viewed in the up-down direction (Z-axis direction), the area of ​​the first interlayer connection conductor V1 (large-area first interlayer connection conductor) is larger than the areas of the first interlayer connection conductors v1a, v1b and the second interlayer connection conductors v2a to v2f. The first interlayer connection conductor V1 (large-area first interlayer connection conductor) is directly connected to the conductor layer 18a (first conductor layer). Therefore, the upper end of the first interlayer connection conductor V1 is in contact with the conductor layer 18a. When viewed in the up-down direction (Z-axis direction), the first interlayer connection conductor V1 (large-area first interlayer connection conductor) has an overlapping portion P1 that overlaps with the electronic component 100 and a non-overlapping portion P2 that does not overlap with the electronic component 100.

[0032] Moreover, the first interlayer connection conductor V1 is electrically connected to the external electrode B4 via the conductor layer 18a. The external electrode B4 is an electrode to which a power supply voltage or a ground potential is connected. Therefore, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) is connected to the power supply voltage or the ground potential.

[0033] [effect] (a) According to the multilayer substrate 11, it is possible to suppress the transfer of heat to the lower surface of the laminate 12 while suppressing the deterioration of the heat dissipation performance. More specifically, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) is directly connected to the conductor layer 18a (first conductor layer). As a result, the heat generated by the electronic component 100 is transferred to the first interlayer connection conductor V1 via the conductor layer 18a. Here, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) includes a first region A1 and a second region A2 that has a lower heat transfer coefficient than the first region A1 and is located below the first region A1. As a result, the heat transferred to the first interlayer connection conductor V1 is suppressed from being transferred from the first region A1 to the second region A2. Therefore, the heat generated by the electronic component 100 is suppressed from being transferred to the lower surface of the laminate 12.

[0034] Furthermore, when viewed in the top-bottom direction, the area of ​​the first interlayer connection conductor V1 (large-area first interlayer connection conductor) is larger than the area of ​​the second interlayer connection conductors v2a-v2c. As a result, when heat generated by electronic component 100 is transferred to first interlayer connection conductor V1, the heat is transferred in the front-back and left-right directions in first region A1. This prevents the heat dissipation performance of multilayer substrate 11 from decreasing.

[0035] (b) In the multilayer substrate 11, the area of ​​the second interlayer connection conductors v2a-v2f is smaller than the area of ​​the first interlayer connection conductor V1 (large-area first interlayer connection conductor). By using such small second interlayer connection conductors v2a-v2f, the wiring density in the multilayer substrate 11 can be increased.

[0036] (c) Multilayer substrate 11 is flexible. This allows multilayer substrate 11 to be bent and arranged along components within electronic device 1. This allows heat generated by electronic component 100 to be transferred from multilayer substrate 11 to components within electronic device 1. As a result, the heat dissipation properties of multilayer substrate 11 are improved.

[0037] (d) According to the multilayer substrate 11, the heat dissipation properties of the multilayer substrate 11 are also improved for the following reasons. More specifically, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) has an overlapping portion P1 that overlaps with the electronic component 100 and a non-overlapping portion P2 that does not overlap with the electronic component 100 when viewed in the top-bottom direction. As a result, heat transferred to the first interlayer connection conductor V1 is transferred to a portion of the laminate 12 that does not overlap with the electronic component 100 when viewed in the top-bottom direction. Therefore, the electronic component 100 is less likely to prevent heat from being emitted from the laminate 12 into the atmosphere.

[0038] (e) In the multilayer substrate 11, the first interlayer connection conductor V1 is connected to, for example, a power supply voltage or a ground potential. Since the resistance value of the first interlayer connection conductor V1 is low, heat generation in the first interlayer connection conductor V1 can be suppressed. Furthermore, in a conductor to which the power supply voltage or the ground potential is connected, it is not necessary to match the characteristic impedance to a desired characteristic impedance (for example, 50 Ω). Therefore, it is easy to apply the first interlayer connection conductor V1 having a large area to a conductor to which the power supply voltage or the ground potential is connected.

[0039] (First Modification) A multilayer substrate 11a according to a first modified example will be described below with reference to the drawings. Fig. 3 is a cross-sectional view of the multilayer substrate module 10a.

[0040] Multilayer substrate 11a differs from multilayer substrate 11 in the following points. The second interlayer connection conductors v2a to v2c have a lower thermal conductivity than the first region A1. The multilayer board 11a has second interlayer connection conductors v2d to v2 f Instead of the first region A1, third interlayer connection conductors v3a to v3c are provided. The third interlayer connection conductors v3a to v3c have a lower heat conductivity than the heat conductivity of the first region A1.

[0041] The material of the second interlayer connection conductors v2a-v2c and the material of the third interlayer connection conductors v3a-v3c are, for example, an alloy of tin and copper or an alloy of tin and silver. The second interlayer connection conductors v2a-v2c and the third interlayer connection conductors v3a-v3c are formed by filling through holes with conductive paste and firing the conductive paste. The other structure of the multilayer substrate 11a is the same as that of the multilayer substrate 11, so a description thereof will be omitted. The multilayer substrate 11a can achieve the effects (a) to (e).

[0042] (f) The multilayer substrate 11a can prevent heat from being transferred to the lower surface of the laminate 12. More specifically, the third interlayer connection conductors v3a-v3c are located below the midplane S (in the negative direction of the Z-axis). The third interlayer connection conductors v3a-v3c have a lower heat conductivity than the first region A1. This makes it difficult for heat to be transferred to the lower surface of the laminate 12 via the third interlayer connection conductors v3a-v3c.

[0043] (Second Modification) A multilayer substrate 11b according to a second modified example will be described below with reference to the drawings. Fig. 4 is a cross-sectional view of a multilayer substrate module 10b.

[0044] The multilayer substrate 11b differs from the multilayer substrate 11a in that the multilayer substrate 11b includes second interlayer connection conductors v2g, v2h instead of the first interlayer connection conductors v1a, v1b. The thermal conductivity of the second interlayer connection conductors v2g, v2h is different from that of the first interlayer connection conductors v1a, v1b. Specifically, the second interlayer connection conductors v2g, v2h have a lower thermal conductivity than that of the first region A1. The material of the second interlayer connection conductors v2g, v2h is, for example, an alloy of tin and copper or an alloy of tin and silver. The second interlayer connection conductors v2g, v2h are formed by filling the through holes with a conductive paste and firing the conductive paste. Other structures of the multilayer substrate 11b are the same as those of the multilayer substrate 11a, and therefore will not be described. The multilayer substrate 11 b can achieve the effects of (a) to (f).

[0045] (Third Modification) A multilayer substrate 11c according to a third modified example will be described below with reference to the drawings. Fig. 5 is a cross-sectional view of a multilayer substrate module 10c.

[0046] Multilayer substrate 11c differs from multilayer substrate 11 in the following points. The multilayer substrate 11c includes fourth interlayer connection conductors v4a to v4f instead of the second interlayer connection conductors v2a to v2f. The laminate 12 further includes an insulator layer 14d located below the insulator layer 14c. The multilayer substrate 11c further includes fifth interlayer connection conductors v5a to v5c.

[0047] Here, the regions obtained by dividing the laminate 12 into three equal parts in the vertical direction (Z-axis direction) are defined as a positive region A11, a middle region A12, and a negative region A13. The positive region A11, the middle region A12, and the negative region A13 are arranged in this order downward (negative direction of the Z-axis). The first interlayer connection conductor V1 (large-area first interlayer connection conductor) is located in the positive region A11. More precisely, the entire first interlayer connection conductor V1 (large-area first interlayer connection conductor) is located in the positive region A11.

[0048] The fourth interlayer connection conductors v4a-v4c penetrate the insulator layer 14b (one of the multiple insulator layers) in the up-down direction (Z-axis direction). The fourth interlayer connection conductors v4d-v4f penetrate the insulator layer 14c (one of the multiple insulator layers) in the up-down direction (Z-axis direction). The fourth interlayer connection conductors v4a-v4f are located in the intermediate region A12. More precisely, parts of the fourth interlayer connection conductors v4a-v4f are located in the intermediate region A12. The fourth interlayer connection conductors v4a-v4f have a lower thermal conductivity than that of the first region A1.

[0049] The fifth interlayer connection conductors v5a-v5c penetrate the insulating layer 14d (one of the multiple insulating layers) in the up-down direction (Z-axis direction). The fifth interlayer connection conductors v5a-v5c are located in the negative region A13. More precisely, the entire fifth interlayer connection conductors v5a-v5c are located in the negative region A13. The fifth interlayer connection conductors v5a-v5c have a higher thermal conductivity than the second region A2. Each of the fifth interlayer connection conductors v5a-v5c includes the first region A1 and the second region A2. The other structure of the multilayer substrate 11c is the same as that of the multilayer substrate 11, and therefore description thereof will be omitted. The multilayer substrate 11c can achieve the effects (a)-(f).

[0050] (g) According to multilayer substrate 11c, when a heat source is in contact with the lower main surface of multilayer substrate 11c, the heat is diffused into multilayer substrate 11c by fifth interlayer connection conductors v5a-v5c, thereby improving the heat dissipation property of multilayer substrate 11c.

[0051] (h) In the multilayer substrate 11c, the fifth interlayer connection conductors v5a-v5c have a structure that is vertically symmetrical to the first interlayer connection conductors v1a, v1b. This makes the overall structure of the multilayer substrate 11c closer to a vertically symmetrical structure. As a result, the occurrence of warping in the multilayer substrate 11c is suppressed.

[0052] (Fourth Modification) A multilayer substrate 11d according to a fourth modified example will be described below with reference to the drawings. Fig. 6 is a cross-sectional view of a multilayer substrate module 10d.

[0053] The multilayer substrate 11d includes a laminate 12 and a protective layer 16. 、 First interlayer connecting conductor V1, v1a, v1b and the second interlayer connection conductor The laminate 12 has a structure in which insulating layers 14a and 14b are stacked in the vertical direction. The first interlayer connection conductors V1, v1a and v1b penetrate the insulating layer 14a in the vertical direction.

[0054] The second interlayer connection conductors V2, v2a, and v2b penetrate the insulating layer 14b in the vertical direction. The second interlayer connection conductors V2, v2a, and v2b have a structure that is vertically symmetrical to the first interlayer connection conductors V1, v1a, and v1b. The second interlayer connection conductors V2, v2a, and v2b are electrically connected to the first interlayer connection conductors V1, v1a, and v1b, respectively.

[0055] Multilayer substrate 11d as described above can achieve the advantages (a) to (e). Furthermore, multilayer substrate 11d can achieve the advantages (g) and (h) by using a smaller number of layers than multilayer substrate 11c.

[0056] (Fifth Modification) A multilayer substrate 11e according to a fifth modified example will be described below with reference to the drawings. Fig. 7 is a cross-sectional view of a multilayer substrate module 10e.

[0057] Multilayer substrate 11e differs from multilayer substrate 11a in the following respects. The multilayer board 11e includes a second interlayer connection conductor V2 instead of the second interlayer connection conductor v2a. The thermal conductivity of the second interlayer connection conductors v2b, v2c is higher than the thermal conductivity of the second region A2. The second interlayer connection conductor V2 has the same structure as the first interlayer connection conductor V1. Therefore, the second interlayer connection conductor V2 includes a first region A1 and a second region A2. The upper end of the second interlayer connection conductor V2 is connected to the conductor layer 19a. The second interlayer connection conductor V2 has a portion that overlaps with the first interlayer connection conductor V1 when viewed in the up-down direction, and a portion that does not overlap with the first interlayer connection conductor V1 when viewed in the up-down direction.

[0058] Each of the second interlayer connection conductors v2b, v2c includes a first region A1 and a second region A2. The other structure of the multilayer substrate 11e is the same as that of the multilayer substrate 11a, and therefore a description thereof will be omitted. The multilayer substrate 11e can achieve the effects (a) to (f).

[0059] Moreover, since the multilayer substrate 11e includes the second interlayer connection conductor V2 having a large area when viewed in the vertical direction, the heat dissipation of the multilayer substrate 11e is improved. Moreover, in the multilayer substrate 11e, the second interlayer connection conductor V2 includes a portion that overlaps with the first interlayer connection conductor V1 when viewed in the vertical direction, and a portion that does not overlap with the first interlayer connection conductor V1 when viewed in the vertical direction. As a result, heat is transferred from the first interlayer connection conductor V1 to the portion of the second interlayer connection conductor V2 that overlaps with the first interlayer connection conductor V1 when viewed in the vertical direction. Furthermore, heat is transferred from the portion of the second interlayer connection conductor V2 that overlaps with the first interlayer connection conductor V1 when viewed in the vertical direction to the portion of the second interlayer connection conductor V2 that does not overlap with the first interlayer connection conductor V1 when viewed in the vertical direction. That is, heat is transferred in the left-right direction and the front-back direction in the laminate 12. As a result, the heat dissipation of the multilayer substrate 11e is improved.

[0060] (Sixth Modification) A multilayer substrate 11f according to a sixth modified example will be described below with reference to the drawings. Fig. 8 is a cross-sectional view of a multilayer substrate module 10f.

[0061] Multilayer board 11f differs from multilayer board 11e in that the second interlayer connection conductor V2 entirely overlaps with the first interlayer connection conductor V1 as viewed in the up-down direction. Other structures of multilayer board 11f are the same as those of multilayer board 11, and therefore will not be described. Multilayer board 11f can achieve the effects (a) to (f). Furthermore, since multilayer board 11f includes second interlayer connection conductor V2 having a large area as viewed in the up-down direction, the heat dissipation properties of multilayer board 11f are improved.

[0062] (Seventh Modification) A multilayer substrate 11g according to a seventh modified example will be described below with reference to the drawings. Fig. 9 is a cross-sectional view of a multilayer substrate module 10g.

[0063] Like multilayer substrate 11g, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) may entirely overlap with electronic component 100 when viewed in the top-bottom direction. Such multilayer substrate 11g can achieve the effects (a) to (f).

[0064] (Eighth Modification) A multilayer substrate 11h according to an eighth modified example will be described below with reference to the drawings. Fig. 10 is a cross-sectional view of a multilayer substrate module 10h.

[0065] As in the multilayer board 11h, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) does not have to be directly connected to the conductor layer 18b (first conductor layer). Therefore, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) may be connected to the conductor layer 18b (first conductor layer) via a conductor. The conductor may be a conductor layer 19. b The interlayer connection conductors v0a and v0b pass through the insulating layer 14a in the vertical direction and are connected to the conductor layer 18b and the conductor layer 19. b Such a multilayer substrate 11h can achieve the effects (a) to (f).

[0066] (Ninth Modification) The following is the 9 Multilayer board 11 according to a modified example i This will be described with reference to the drawings. Fig. 11 is a cross-sectional view of the multilayer substrate module 10i.

[0067] Like multilayer substrate 11i, first interlayer connection conductor V1 (large-area first interlayer connection conductor) does not have to overlap electronic component 100 when viewed in the top-bottom direction. This allows heat to be diffused to a position away from electronic component 100 by first interlayer connection conductor V1. As a result, the heat dissipation performance of multilayer substrate 11i is improved. Furthermore, multilayer substrate 11i can achieve the effects (a) to (f).

[0068] (Tenth Modification) A multilayer substrate 11j according to a tenth modified example will be described below with reference to the drawings. Fig. 12 is a cross-sectional view of a multilayer substrate module 10j.

[0069] Like the multilayer board 11j, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) does not have to be directly connected to the conductor layer 18a (first conductor layer). Therefore, the first interlayer connection conductor V1 (large-area first interlayer connection conductor) may be connected to the conductor layer 18a (first conductor layer) via a conductor. The conductor is the conductor layer 19a and the interlayer connection conductor v0a. The interlayer connection conductor v0a penetrates the insulating layer 14a in the vertical direction and connects the first interlayer connection conductor V1 (large-area first interlayer connection conductor) and the conductor layer 19a. Such a multilayer board 11h can achieve the effects (a) to (f).

[0070] (Eleventh Modification) A multilayer substrate 11k according to an eleventh modified example will be described below with reference to the drawings. Fig. 13 is a cross-sectional view of a multilayer substrate module 10k.

[0071] Multilayer substrate 11k differs from multilayer substrate 11j in that the thermal conductivity of interlayer connection conductors v0a-v0c is higher than that of second region A2. The material of interlayer connection conductors v0a-v0c is, for example, copper. This allows heat generated by electronic component 100 to be efficiently transferred to first interlayer connection conductor V1 (large-area first interlayer connection conductor) via interlayer connection conductors v0a-v0c. Such multilayer substrate 11k can achieve the effects (a)-(f).

[0072] (Twelfth Modification) A multilayer substrate 11l according to a twelfth modified example will be described below with reference to the drawings. Fig. 14 is a cross-sectional view of a multilayer substrate module 10l. Fig. 15 is a top view of the multilayer substrate 11l.

[0073] Like the multilayer substrate 11l, the conductor layer 18a may have an antenna ANT. The first interlayer connection conductor V1 (large-area first interlayer connection conductor) is connected to the conductor layer 18a. The first interlayer connection conductor V1 is located in the current path between the electronic component 100 and the antenna ANT. This reduces the resistance of the current path between the electronic component 100 and the antenna ANT. As a result, heat generation in the current path between the electronic component 100 and the antenna ANT is suppressed. Such a multilayer substrate 11l can achieve the effects (a) to (f).

[0074] In addition, since the area of ​​the antenna ANT is large, heat is radiated efficiently from the antenna ANT.

[0075] (13th Modification) A multilayer substrate 11m according to a thirteenth modified example will be described below with reference to the drawings. Fig. 16 is a top view of a multilayer substrate module 10m.

[0076] The multilayer board 11m differs from the multilayer board 11l in the shape of the first interlayer connection conductor V1. More specifically, in the multilayer board 11l, the first interlayer connection conductor V1 has a rectangular shape with long sides extending in the left-right direction when viewed in the up-down direction. On the other hand, in the multilayer board 11m, the first interlayer connection conductor V1 has a shape of a plurality of circles lined up in a row in the left-right direction when viewed in the up-down direction. Such a first interlayer connection conductor V1 is formed by forming a plurality of circular holes by drilling or irradiating with a laser beam. The multilayer board 11m can achieve the same effects as the multilayer board 11l.

[0077] (14th Modification) A multilayer substrate 11n according to a fourteenth modification will be described below with reference to the drawings. Fig. 17 is a cross-sectional view of the electronic device 1n.

[0078] The multilayer substrate 11n differs from the multilayer substrate 11 in that the multiple conductor layers include antenna conductor layers 50a, 50b. The distance from the lower main surface (negative main surface) of the laminate 12 to the antenna conductor layers 50a, 50b is shorter than the distance from the upper main surface (positive main surface) of the laminate 12 to the antenna conductor layers 50a, 50b. The distance from the lower main surface of the laminate 12 to the housing 120 is longer than the distance from the upper main surface of the laminate 12 to the housing 120. short .

[0079] Furthermore, the distance from the housing 120 to the lower main surface (negative main surface) of the laminate 12 is shorter than the distance from the housing 120 to the upper main surface (positive main surface) of the laminate 12. This prevents heat generated by the electronic component 100 from being transferred to the housing 120.

[0080] (Other embodiments) The multilayer board according to the present invention is not limited to multilayer boards 11, 11a to 11n and may be modified within the scope of the invention. Furthermore, the structures of multilayer boards 11, 11a to 11n may be combined in any manner.

[0081] The multilayer board includes one large-area first interlayer connection conductor. However, the multilayer board may include a plurality of large-area first interlayer connection conductors. In this case, the plurality of large-area first interlayer connection conductors may be located in the positive region A11. All of the plurality of large-area first interlayer connection conductors may be connected to the first conductor layer, or one or more of the plurality of large-area first interlayer connection conductors may be connected to the first conductor layer.

[0082] Although the multilayer board includes three third inter-layer connection conductors, the multilayer board may include one or more third inter-layer connection conductors.

[0083] The multilayer board includes six fourth interlayer connection conductors, but may include one or more fourth interlayer connection conductors.

[0084] Although the multilayer board includes three fifth interlayer connection conductors, the multilayer board may include one or more fifth interlayer connection conductors.

[0085] In addition, a plurality of conductor layers may have antennas.

[0086] 2, the first interlayer connection conductor V1 has a rectangular shape when viewed in the vertical direction. However, the first interlayer connection conductor V1 may have a shape other than a rectangular shape when viewed in the vertical direction. The first interlayer connection conductor V1 may have, for example, a polygonal shape or a circular shape when viewed in the vertical direction, or may have a shape with irregularities on the outer edge.

[0087] The antenna ANT may be a patch antenna, a dipole antenna, a monopole antenna, or a slot antenna.

[0088] The second interlayer connection conductor may be provided on the first insulating layer on which the first interlayer connection conductor is provided.

[0089] The multilayer board may further include a protective layer that covers the lower main surface of the laminate 12 .

[0090] (1) a laminate having a structure in which a plurality of insulator layers, each having a positive principal surface located in the positive direction of the Z axis and a negative principal surface located in the negative direction of the Z axis, are laminated in the Z axis direction; a plurality of conductor layers provided in the laminate, the plurality of conductor layers including a first conductor layer having a mounting electrode located on a front main surface of an insulator layer located most positive in the Z-axis direction among the plurality of insulator layers; one or more first interlayer connection conductors that penetrate a first insulator layer, which is one of the plurality of insulator layers, in the Z-axis direction and connect two of the conductor layers located on the positive principal surface and the negative principal surface of the first insulator layer; a second interlayer connection conductor penetrating one of the plurality of insulator layers in the Z-axis direction; Equipped with Each of the one or more first interlayer connection conductors is A first region; a second region having a lower thermal conductivity than the first region, the second region being located in a negative direction of the Z axis from the first region; Contains When viewed in the Z-axis direction, an area of ​​at least one large-area first interlayer connection conductor among the one or more first interlayer connection conductors is larger than an area of ​​the second interlayer connection conductor. Multilayer board.

[0091] (2) One or more of the large-area first interlayer connection conductors are connected to the first conductor layer via a conductor or directly to the first conductor layer. The multilayer board according to (1).

[0092] (3) A surface located at the center of the stack in the Z-axis direction and perpendicular to the Z-axis direction is defined as an intermediate surface, The one or more large-area first interlayer connection conductors are located in the positive direction of the Z-axis from the midplane. A multilayer substrate according to (1) or (2).

[0093] (4) A surface located at the center of the stack in the Z-axis direction and perpendicular to the Z-axis direction is defined as an intermediate surface, The multilayer substrate comprises: One or more third interlayer connection conductors penetrating one of the plurality of insulator layers in the Z-axis direction, the one or more third interlayer connection conductors being located in a negative direction of the Z-axis from the intermediate surface, In addition, the one or more third interlayer connection conductors have a lower thermal conductivity than the thermal conductivity of the first region; A multilayer substrate according to any one of (1) to (3).

[0094] (5) The laminate is divided into three equal parts in the Z-axis direction, and the resulting regions are defined as a positive region, an intermediate region, and a negative region. the positive region, the intermediate region, and the negative region are arranged in this order in the negative direction of the Z axis, The one or more large-area first interlayer connection conductors are located in the positive region. The multilayer board according to (1).

[0095] (6) The multilayer substrate comprises: One or more fourth interlayer connection conductors penetrating one of the plurality of insulator layers in the Z-axis direction and located in the intermediate region, In addition, the one or more fourth interlayer connection conductors have a thermal conductivity lower than a thermal conductivity of the first region; The multilayer board according to (5).

[0096] (7) The multilayer substrate comprises: One or more fifth interlayer connection conductors penetrating one of the plurality of insulator layers in the Z-axis direction, the one or more fifth interlayer connection conductors being located in the negative region, In addition, the one or more fifth interlayer connection conductors have a thermal conductivity higher than a thermal conductivity of the second region; The multilayer board according to (6).

[0097] (8) At least one of the conductor layers connected to the one or more large-area first interlayer connection conductors has an antenna. A multilayer substrate according to any one of (1) to (7).

[0098] (9) The laminate has flexibility. A multilayer substrate according to any one of (1) to (8).

[0099] (10) the plurality of conductor layers includes an antenna conductor layer, a distance from the negative principal surface to the antenna conductor layer is shorter than a distance from the positive principal surface to the antenna conductor layer; A multilayer substrate according to any one of (1) to (7) and (9).

[0100] (11) At least one of the one or more large-area first interlayer connection conductors is directly connected to the first conductor layer; A multilayer substrate according to any one of (1) to (10).

[0101] (12) A power supply voltage or a ground potential is connected to the one or more large-area first interlayer connection conductors. A multilayer substrate according to any one of (1) to (11).

[0102] (13) The multilayer substrate according to any one of (1) to (12), an electronic component mounted on the mounting electrode; Equipped with Multi-layer board module.

[0103] (14) At least one of the one or more large-area first interlayer connection conductors has an overlapping portion that overlaps with the electronic component and a non-overlapping portion that does not overlap with the electronic component when viewed in the Z-axis direction. The multilayer substrate module according to (13).

[0104] (15) The electronic component is an RFIC. A multilayer substrate module according to (13) or (14).

[0105] (16) The multilayer substrate module according to any one of (13) to (15), Equipped with electronic equipment.

[0106] (17) The electronic device includes: A housing that houses the multilayer board module, In addition, The distance from the housing to the negative principal surface is shorter than the distance from the housing to the positive principal surface. (16) An electronic device as described in (16). [Explanation of symbols]

[0107] 1,1n:Electronic equipment 10, 10a to 10n: Multilayer board module 11,11a~11n: Multilayer board 12: Laminate 14a to 14d: Insulator layers 16:Protective layer 18a to 18h, 19a to 19f: Conductive layers 50a, 50b: Antenna conductor layer 100: Electronic parts 102: Part body 120: Cabinet A1:First area A11: Positive area A12: Intermediate area A13: Negative area A2:Second area ANT: Antenna B1~B9: External electrode E1 to E9: Mounting electrodes P1: Overlapping part P2: Non-overlapping part S: Intermediate surface V1, v1a, v1b: first interlayer connection conductor V2, v2a to v2f: second interlayer connecting conductors v3a: 3rd layer connecting conductor v4a, v4d: Fourth interlayer connecting conductor v5a: 5th interlayer connecting conductor

Claims

1. a laminate having a structure in which a plurality of insulator layers, each having a positive principal surface located in the positive direction of the Z axis and a negative principal surface located in the negative direction of the Z axis, are laminated in the Z axis direction; a plurality of conductor layers provided in the laminate, the plurality of conductor layers including a first conductor layer having a mounting electrode located on a front main surface of an insulator layer located most positive in the Z-axis direction among the plurality of insulator layers; one or more first interlayer connection conductors that penetrate a first insulator layer, which is one of the plurality of insulator layers, in the Z-axis direction and connect two of the conductor layers located on the positive principal surface and the negative principal surface of the first insulator layer; a second interlayer connection conductor penetrating one of the plurality of insulator layers in the Z-axis direction; Equipped with Each of the one or more first interlayer connection conductors is A first region; and a second region having a lower thermal conductivity than the first region, the second region being located in a negative direction of the Z axis from the first region; Contains an area of ​​a large-area first interlayer connection conductor, which is at least one of the one or more first interlayer connection conductors, is larger than an area of ​​the second interlayer connection conductor, as viewed in the Z-axis direction; Multilayer board.

2. One or more of the large-area first interlayer connection conductors are connected to the first conductor layer via a conductor or directly to the first conductor layer. The multilayer substrate according to claim 1 .

3. A surface located at the center of the stack in the Z-axis direction and perpendicular to the Z-axis direction is defined as an intermediate surface, the one or more large-area first interlayer connection conductors are located in the positive direction of the Z-axis from the midplane; The multilayer substrate according to claim 1 or 2.

4. A surface located at the center of the stack in the Z-axis direction and perpendicular to the Z-axis direction is defined as an intermediate surface, The multilayer substrate comprises: One or more third interlayer connection conductors penetrating one of the plurality of insulator layers in the Z-axis direction, the one or more third interlayer connection conductors being located in a negative direction of the Z-axis from the intermediate surface, In addition, the one or more third interlayer connection conductors have a lower thermal conductivity than a thermal conductivity of the first region; The multilayer substrate according to claim 1 or 2.

5. The laminate is divided into three equal parts in the Z-axis direction, and the resulting regions are defined as a positive region, a middle region, and a negative region. the positive region, the intermediate region, and the negative region are arranged in this order in the negative direction of the Z axis, The one or more large-area first interlayer connection conductors are located in the positive region. The multilayer substrate according to claim 1 .

6. The multilayer substrate comprises: One or more fourth interlayer connection conductors penetrating one of the plurality of insulator layers in the Z-axis direction, the one or more fourth interlayer connection conductors being located in the intermediate region; In addition, the one or more fourth interlayer connection conductors have a thermal conductivity lower than a thermal conductivity of the first region; The multilayer substrate according to claim 5 .

7. The multilayer substrate comprises: One or more fifth interlayer connection conductors penetrating one of the plurality of insulator layers in the Z-axis direction, the one or more fifth interlayer connection conductors being located in the negative region; In addition, the one or more fifth interlayer connection conductors have a thermal conductivity higher than a thermal conductivity of the second region; The multilayer substrate according to claim 6.

8. At least one of the conductor layers connected to the one or more large-area first interlayer connection conductors has an antenna. The multilayer substrate according to claim 1 or 2.

9. The laminate has flexibility. The multilayer substrate according to claim 1 or 2.

10. the plurality of conductor layers includes an antenna conductor layer, a distance from the negative principal surface to the antenna conductor layer is shorter than a distance from the positive principal surface to the antenna conductor layer; The multilayer substrate according to claim 1 or 2.

11. At least one of the one or more large area first interlayer connection conductors is directly connected to the first conductor layer. The multilayer substrate according to claim 1 or 2.

12. A power supply voltage or a ground potential is connected to the one or more large-area first interlayer connection conductors. The multilayer substrate according to claim 1 or 2.

13. The multilayer substrate according to claim 1 or 2, an electronic component mounted on the mounting electrode; Equipped with Multi-layer board module.

14. At least one of the one or more large-area first interlayer connection conductors has an overlapping portion that overlaps with the electronic component and a non-overlapping portion that does not overlap with the electronic component when viewed in the Z-axis direction. The multilayer substrate module according to claim 13.

15. The electronic component is an RFIC. The multilayer substrate module according to claim 13.

16. The multilayer substrate module according to claim 13, Equipped with electronic equipment.

17. The electronic device includes: A housing that houses the multilayer board module, In addition, The distance from the housing to the negative principal surface is shorter than the distance from the housing to the positive principal surface.

17. The electronic device according to claim 16.

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