Tape peeling device

Abstract

To provide a tape peeling device in which burden on workers in roll tape replenishment work can be reduced and device downtime can be eliminated.SOLUTION: A tape peeling device 1 includes; a first detection part 115 (second detection part 116) for detecting the remaining amount of a first roll tape 85 (a second roll tape 86); a connecting part 7 for joining, to one second peeling tape 84 located between a holding part 60 and one second roll supporting part 114 that supports one second roll tape 86, the other first peeling tape 83 drawn from the other first roll tape 85; and a second cutter 18 cutting the one second peeling tape 84. In the tape peeling device, after it is detected that the remaining amount of the second roll tape 86 is low, the first peeling tape 83 is joined to the second peeling tape 84 at the connecting part 7, the second peeling tape 84 closer to the one second roll supporting part 114 side than a joined portion is cut with the second cutter 18, and the one second peeling tape 84 is joined to the other peeling tape 83 so that the first peeling tape 83 can be supplied to the holding part 60.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a tape peeling device that peels a protective tape from a wafer. [Background technology]

[0002] The tape peeling device disclosed in Patent Document 1 below peels off the protective tape from the wafer by attaching the peeling tape to the outer periphery of the surface of a protective tape (BG tape) that is applied to protect the entire surface of one side of the wafer, and gripping the end of the peeling tape and pulling it in a direction away from the wafer.

[0003] Such a release tape is, for example, a heat seal that can be attached to a protective tape by developing adhesive strength by heat. The heat seal is strip-shaped, drawn out from the outer periphery of a rolled tape, pressed against the protective tape and heated to attach it, and then cut to a shorter length on the roll tape side than the attached portion for use. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-220506 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the tape peeling device as described above, when the roll tape runs out, the worker must refill the roll tape, which increases the burden on the worker and lengthens the time the tape peeling device is stopped. Therefore, in a tape separation device, there is a problem of reducing the burden on an operator in the task of refilling roll tape and eliminating downtime of the tape separation device due to refilling roll tape. [Means for solving the problem]

[0006] The present invention, which solves the above-mentioned problems, is a tape peeling device comprising: a holding table having a holding surface for holding the underside of a wafer having a protective tape attached to its upper surface; a roll support section for rotatably supporting a roll tape having a strip-shaped peeling tape wound in a roll; a gripping section for gripping the peeling tape pulled out from the outer periphery of the roll tape; and an attachment section for attaching the peeling tape gripped by the gripping section to an outer periphery of the protective tape, and which moves the gripping section gripping the peeling tape attached to the outer periphery of the protective tape in a direction away from the wafer to peel off the protective tape. the roll support section includes at least two roll support sections, and at least two detection sections each detecting when the remaining amount of each of the roll tapes supported by each of the roll support sections is low; a connection section for overlapping and adhering a tip end side of one of the release tapes pulled out from the other roll tape to one of the release tapes between the one of the roll support sections supporting one of the roll tapes and the gripping section to join them together; a cutter for cutting one of the release tapes on the one of the roll support sections side from the part joined by the connection section; and a control section for controlling the device, the connection portion includes a first holding portion that holds one of the peeling tapes pulled out from the outer periphery of one of the roll tapes supported by one of the roll support portions, a second holding portion that holds the other of the peeling tapes pulled out from the outer periphery of the other of the roll tapes supported by the other of the roll support portions, a heating means that heats at least one of the first holding portion or the second holding portion, and a moving mechanism that moves at least one of the first holding portion or the second holding portion in a direction toward and away from the other, When the control unit detects that the remaining amount of one of the roll tapes is low by one of the detection units, the control unit controls the following: overlapping one of the release tapes on the other of the release tapes, adhering and joining them by the joining unit; and cutting one of the release tapes on the side of one of the roll support units from the joined portion by the cutter. This makes it possible to switch the release tape held by the gripping unit from one of the release tapes to the other release tape. After joining the one release tape and the other release tape, the portion of the joined release tape from the tip held by the holding portion to the joined portion is discarded so that the joined portion is not stuck to the outer periphery of the protective tape by the sticking portion. This is a tape peeling device. Effect of the Invention

[0009] The tape peeling device according to the present invention comprises a holding table having a holding surface for holding the underside of a wafer having a protective tape attached to its upper surface, a roll support part for rotatably supporting a roll tape having a strip-shaped peeling tape wound in a roll, a gripping part for gripping the peeling tape pulled out from the outer periphery of the roll tape, and an attaching part for attaching the peeling tape gripped by the gripping part to the outer periphery of the protective tape, and comprises at least two roll support parts, at least two detection parts for respectively detecting that the remaining amount of each roll tape supported by each roll support part is low, and a detection part for detecting that the end of one peeling tape pulled out from the other roll tape is adhered to one peeling tape between one roll support part supporting one roll tape and the gripping part. By further comprising a connection section for overlapping and adhering the ends to join them, a cutter for cutting one of the release tapes on one of the roll support sections side from the part joined by the connection section, and a control section for controlling the device, when the control section detects that the remaining amount of one of the roll tapes is low by one of the detection sections, the control section controls the joining of one of the release tapes to the other of the release tapes by the connection section and the cutting of one of the release tapes on the one of the roll support sections side from the joined part by the cutter, and the release tape held by the gripping section is switched from one of the release tapes to the other release tape to be newly used, so that the other release tape can be adhered to the protective tape by the adhering section and the gripping section. In other words, the tape peeling device according to the present invention can continuously perform the operation of peeling the protective tape from the wafer using the release tape without waiting for the operator to replenish the release tape.

[0010] The tape peeling device of the present invention has a connection section which includes a first holding section which holds one peeling tape pulled out from the outer periphery of one roll tape supported by one roll support section, a second holding section which holds the other peeling tape pulled out from the outer periphery of the other roll tape supported by the other roll support section, a heating means which heats at least one of the first holding section or the second holding section, and a moving mechanism which moves at least one of the first holding section or the second holding section in a direction toward and away from the other, thereby making it possible to properly connect one peeling tape to the other peeling tape so that they do not peel off.

[0011] The tape peeling device of the present invention splices one peeling tape and the other peeling tape together, and then discards the portion from the tip held by the gripping portion of the spliced ​​peeling tape to the spliced ​​portion, thereby preventing the spliced ​​portion from being attached to the outer periphery of the protective tape by the adhesive portion, thereby making it possible to prevent a situation in which the spliced ​​portion is attached to the protective tape, increasing its thickness, and resulting in failure to peel off the protective tape. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing an example of a tape peeling device. [Diagram 2] FIG. 2 is a side view showing an example of a tape peeling device. [Diagram 3] 11 is a side view illustrating a state in which the first detection section detects that the remaining amount of the first roll tape is low. FIG. [Figure 4] 13 is a side view illustrating a state in which the first release tape is overlapped and attached to the tip side of the second release tape by a connecting portion, thereby joining the two together. FIG. [Diagram 5] 13 is a side view illustrating a state in which the first holding portion that suction-holds the portion joined by the connecting portion is raised so that air for cooling can be blown onto the joined portion. FIG. [Figure 6]13 is a side view illustrating a state in which one of the first peeling tapes on the one first roll support part side of the portion joined by the joint part is being cut by a first cutter. FIG. [Figure 7] This is a side view illustrating the state in which the first release tape on one side and the second release tape on the other side are joined together, making it possible to attach the switched second release tape to the protective tape using the gripping portion and the adhesive portion. [Figure 8] 13 is a side view illustrating a state in which the second detection section detects that the remaining amount of the second roll tape is low. FIG. [Figure 9] 13 is a side view illustrating a state in which a second release tape is overlapped and attached to the tip side of a first release tape by a connecting portion, thereby joining the first release tape and the second release tape together. FIG. [Figure 10] 13 is a side view illustrating a state in which the first holding portion that suction-holds the portion joined by the connecting portion is raised so that air for cooling can be blown onto the joined portion. FIG. [Figure 11] 13 is a side view illustrating a state in which one of the second peeling tapes on the side of one of the second roll support parts from the part joined by the joint part is being cut by a second cutter. FIG. [Figure 12] This is a side view illustrating the state in which the second release tape on one side and the first release tape on the other side are joined together, making it possible to attach the switched first release tape to the protective tape using the gripping portion and the adhering portion. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The wafer 90 shown in FIG. 1 is, for example, a semiconductor wafer having a circular outer shape made of silicon as a base material, and its upper surface 900 is divided into a lattice shape by a plurality of intended division lines that intersect at right angles, and devices such as ICs are formed in each of the lattice-shaped areas. In this embodiment, the protective tape 91, which is attached so as to cover the entire upper surface 900 of the wafer 90, comprises, for example, a base layer made of resin (e.g., polyolefin-based resin, etc.) and an adhesive layer (glue layer) under the base layer. The wafer 90 may be made of gallium arsenide, sapphire, ceramics, resin, gallium nitride, silicon carbide, or the like other than silicon, and the protective tape 91 is not limited to the above example.

[0014] 1 and 2, for example, a wafer 90 may have a support tape 93 having a larger diameter than the wafer 90 attached to a lower surface 901, which is the opposite surface to an upper surface 900. The outer periphery of the adhesive layer of the support tape 93 may also be attached to a ring frame 94, so that the wafer 90 is supported by the ring frame 94 via the support tape 93, and may become a work set that can be handled by the ring frame 94.

[0015] The tape peeling device 1 according to the present invention shown in FIGS. 1 and 2 is an example of a tape peeling device that peels off a protective tape 91 attached to an upper surface 900 of a wafer 90 in FIG. 1 by using a strip-shaped first peeling tape 83 or a strip-shaped second peeling tape 84. The tape peeling device 1 includes a holding table 30 having a holding surface 302 that holds a lower surface 901 side of the wafer 90 having the protective tape 91 attached to the upper surface 900, and a first roll tape 85 on which the strip-shaped first peeling tape 83 is wound in a roll. the first roll support portion 113 supporting the first roll tape 85 (second roll tape 86) from the outer periphery thereof, the second roll support portion 114 rotatably supporting the second roll tape 86 having the strip-shaped second peeling tape 84 wound in a roll, a gripping portion 60 gripping the first peeling tape 83 (second peeling tape 84) pulled out from the outer periphery of the first roll tape 85 (second roll tape 86), and an attachment portion 66 attaching the first peeling tape 83 or the second peeling tape 84 gripped by the gripping portion 60 to the outer periphery of the protective tape 91.

[0016] The first peeling tape 83 is, for example, a two-layer heat seal consisting of an adhesive layer that is adhered to the outer periphery of the protective tape 91 while applying heat, and a substrate. The substrate is made of a resin such as polyethylene terephthalate. The adhesive layer, which is called hot melt and exhibits adhesive strength when heated, is made of a thermosetting resin such as epoxy resin. The adhesive strength of the first peeling tape 83 to the protective tape 91 is set to be stronger than the adhesive strength of the protective tape 91 to the wafer 90. The first peeling tape 83 is wound around a cylinder 855 with the adhesive layer located on the inside (the lower surface side when pulled out) to form the first roll tape 85.

[0017] The first peeling tape 83 is not limited to a heat seal. The first peeling tape 83 may be, for example, a single layer of polyolefin resin tape, and may not have a separate adhesive layer for adhering the wafer 90. In this case, the first peeling tape 83 cannot be attached to the protective tape 91 at room temperature, but since the polyolefin resin tape has thermoplasticity, when it is heated to a temperature near the melting point while being joined to the wafer 90 while being pressed with a predetermined pressure, it partially melts and can be adhered to the wafer 90. The first peeling tape 83 and the second peeling tape 84 described above are the same thing, and the second peeling tape 84 is wound around a cylinder 866 to form a second roll tape 86.

[0018] The tape peeling device 1 according to the present invention includes at least two roll support parts. That is, for example, the tape peeling device 1 includes a first roll support part 113 that rotatably supports a first roll tape 85 obtained by winding a strip-shaped first peeling tape 83 in a roll, and a second roll support part 114 that rotatably supports a second roll tape 86 obtained by winding a roll of a second peeling tape 84, which is the same as the strip-shaped first peeling tape 83, and the second roll support part 114 is disposed below the first roll support part 113.

[0019] The first roll support part 113 and the second roll support part 114 are arranged, for example, on the front surface of a column (not shown) erected on the base 10 shown in FIG. 1, in a state in which they can be rotated by a motor or the like about a rotation axis in the Y-axis direction by a rotation means (not shown), and each function as a shaft inserted into cylinder 855 of the first roll tape 85 and a shaft inserted into cylinder 866 of the second roll tape 86.

[0020] 2, a first detection unit 115 (second detection unit 116) that detects the remaining amount of the first roll tape 85 (second roll tape 86) supported by the first roll support unit 113 (second roll support unit 114) is disposed at a position slightly below the outer tangent line of the cylinder 855 (cylinder 866) of the first roll tape 85 (second roll tape 86) supported by the first roll support unit 113 (second roll support unit 114). The first detection unit 115 (second detection unit 116) is, for example, a transmission type optical sensor composed of a light receiving unit and a light projecting unit, and is disposed so that the light receiving unit and the light projecting unit sandwich the first roll tape 85 (second roll tape 86) in the X-axis direction. For example, as the first roll tape 85 decreases, the diameter of the first roll tape 85 becomes smaller, and the amount of detection light emitted by the light-emitting unit and received by the light-receiving unit increases without being blocked by the first roll tape 85, so that the first detection unit 115 detects that the remaining amount of the first roll tape 85 has decreased to or below a predetermined amount.

[0021] A pair of guide rollers 144 (a pair of guide rollers 147) are disposed at positions near the -X direction side, which is the tape feed direction, as seen from the first roll support part 113 (second roll support part 114), and can guide and feed the first peeling tape 83 (second peeling tape 84) pulled out from the first roll tape 85 (second roll tape 86) while applying tension to the tape toward the connection part 7 shown in Figures 1 and 2 while sandwiching the tape. Note that the pair of guide rollers 144 (pair of guide rollers 147) are omitted in Figure 1.

[0022] The tape peeling device 1 is provided with a connection section 7 that overlaps and adheres to the tip end of the other second peeling tape 84 pulled out from the other second roll tape 86, one of the first peeling tapes 83 between the first roll support section 113 that supports one of the first roll tapes 85 and the gripping section 60, thereby joining them together.

[0023] As shown in FIG. 2, the connection portion 7 in this embodiment includes a first holding portion 71 that holds one first peeling tape 83 pulled out from the outer periphery of one first roll tape 85 supported by one first roll support portion 113, a second holding portion 72 that holds the other second peeling tape 84 pulled out from the outer periphery of the other second roll tape 86 supported by the other second roll support portion 114, a heating means 77 that heats at least one of the first holding portion 71 or the second holding portion 72, and a moving mechanism 78 that moves at least one of the first holding portion 71 or the second holding portion 72 in the Z-axis direction toward and away from the other.

[0024] The second holding portion 72 is disposed below the first holding portion 71 so as to face the first holding portion 71 in the Z-axis direction. 2, the first holding section 71 (second holding section 72) includes, for example, an adsorption section 710 (adsorption section 720) made of a porous member or the like and adsorbing the first peeling tape 83 (second peeling tape 84), and a frame 711 (frame 721) supporting the adsorption section 710 (adsorption section 720). The adsorption section 710 (adsorption section 720) is connected to a suction source 79 such as an ejector mechanism or a vacuum generator, and the suction force generated by the suction source 79 is transmitted to a holding surface 712 (holding surface 722), which is a flat exposed surface of the adsorption section 710 (adsorption section 720), so that the first holding section 71 can suction and hold the first peeling tape 83 (second peeling tape 84) on the holding surface 712 (holding surface 722). The first holding portion 71 (second holding portion 72) can suction-hold the first peeling tape 83 (second peeling tape 84) over the entire width (length in the Y-axis direction) of the first peeling tape 83 (second peeling tape 84).

[0025] In this embodiment, only the first holding portion 71 can be heated to a predetermined temperature by the heating means 77, but only the second holding portion 72, or both the first holding portion 71 and the second holding portion 72 may be heatable. 2 is, for example, an infrared heater that is built into the frame 711 of the first holding part 71 and emits infrared rays and generates heat when a predetermined voltage is applied from a power source (not shown) and a current flows through the heating element, and may be a ceramic heater or a halogen heater, etc., and can uniformly heat the contact area between the holding surface 712 of the first holding part 71 and the first peeling tape 83 in a short time. For example, the temperature of the first holding part 71 can be measured by a temperature sensor (not shown).

[0026] In this embodiment, only the first holding portion 71 is movable in the Z-axis direction relative to the second holding portion 72 by the moving mechanism 78, but only the second holding portion 72, or both the first holding portion 71 and the second holding portion 72, may be movable in the Z-axis direction. The moving mechanism 78 is, for example, an electric slider or the like, and supports the frame 711 of the first holding portion 71 so as to be movable in the Z-axis direction.

[0027] For example, on the side surface of the frame 711 (frame 721) of the first holding section 71 (second holding section 72) on the side of the first roll support section 113 (second roll support section 114), a first cutter 17 (second cutter 18) for cutting the first peeling tape 83 (second peeling tape 84) is disposed so as to be movable up and down by a first cutter vertical movement means 177 (second cutter vertical movement means 188) such as an electric slider. The blade tip of the first cutter 17 faces the -Z direction, and the blade tip of the second cutter 18 faces the +Z direction. The first cutter 17 (second cutter 18) may cut while moving in the width direction (Y-axis direction) of the first peeling tape 83 (second peeling tape 84).

[0028] In this embodiment, for example, as shown in Fig. 1 and Fig. 2, an air nozzle 136 communicating with an air source 130 such as a compressor is disposed near the second holding part 72. The nozzle of the air nozzle 136 is directed between the first holding part 71 and the second holding part 72, and the part joined by thermal adhesion of the first peeling tape 83 and the second peeling tape 84 positioned therebetween can be cooled to a predetermined temperature by air jetted from the nozzle. Note that the cooling of the joined part is not limited to air cooling, and for example, the heating means 77 built into the first holding part 71 may be a Peltier element or the like, and the heating means 77 may cool the first holding part 71 via cooling.

[0029] 1 and 2, a guide roller unit 64 is disposed between the connection part 7 and the gripping part 60, for example, for lowering the first peeling tape 83 to a desired height position and then feeding it towards the gripping part 60. Furthermore, in this embodiment, for example, a pair of feed rollers 687 (only shown in FIG. 2) facing each other in the Z-axis direction for horizontally feeding the tip of the first peeling tape 83 towards the gripping part 60 on the -X direction side are disposed near the +X direction side of the cutting cutter 684.

[0030] For example, the leading end of the first peeling tape 83 fed from the guide roller unit 64 and the pair of feed rollers 687 is gripped by the gripping portion 60 at a predetermined tape gripping position in the X-axis direction, for example.

[0031] As shown in FIG. 1, the tape peeling device 1 has a rectangular parallelepiped base 10 extending in the X-axis direction, and a holding table 30 and a table moving means 13 are disposed on the base 10.

[0032] The holding table 30, which is disposed below the movement path of the gripping part 60 shown in Figures 1 and 2 and has a holding surface 302 for holding the underside 901 of the wafer 90 having a protective tape 91 attached to its upper surface 900, is formed in a circular shape when viewed in a plan view, and has a flat upper surface made of, for example, a porous material or the like as the holding surface 302, and the holding surface 302 is connected to a suction source (not shown) such as an ejector mechanism or a vacuum generator, and the suction force generated by the suction source is transmitted to the holding surface 302.

[0033] For example, when the wafer 90 is supported by a ring frame 94 so as to be able to be handled, the tape separation device 1 may include a ring frame holding portion 31 shown in FIG. 2 that, for example, clamps and fixes the ring frame 94. 2 has a circular ring shape in a plan view, and can clamp and fix the ring frame 94 placed on its flat upper surface together with rotatable clamps 318. For example, four clamps 318 are disposed at 90 degree intervals around the circumference of the ring frame holding portion 31. For example, the ring frame holding portion 31 and the clamp 318 can be moved up and down by the actuator 33. Note that the ring frame holding portion 31 and the like are not shown in FIG.

[0034] The table moving means 13, which enables the holding table 30 to move back and forth in the X-axis direction, includes a ball screw 137 having an axis in the X-axis direction, a pair of guide rails 131 arranged parallel to the ball screw 137, a motor 132 connected to one end of the ball screw 137 and rotating the ball screw 137, and a movable plate 133 having an internal nut that screws into the ball screw 137 and a bottom that slides against the guide rail 131. As the motor 132 rotates the ball screw 137, the movable plate 133 is guided by the guide rail 131 and moves linearly in the X-axis direction, thereby enabling the holding table 30, which is arranged on the movable plate 133 via the table base 35, to move back and forth in the X-axis direction.

[0035] For example, at a position below the −X direction end side of the movement path of the gripper 60, a wastebasket (not shown) for discarding the protective tape 91 peeled off from the wafer 90 together with the first peeling tape 83 is disposed.

[0036] The gripping portion 60, which is disposed above the movement path of the holding table 30 shown in FIG. 1, can be moved back and forth in the X-axis direction together with the adhering portion 66 by X-axis moving means 15, which is disposed, for example, in the upper area of ​​the front surface of a column (not shown) erected on the base 10.

[0037] X-axis moving means 15 comprises a ball screw 150 having an axis in the X-axis direction, a pair of guide rails 151 arranged parallel to ball screw 150, a motor 152 connected to ball screw 150 and rotating ball screw 150, and a movable block 153 having an internal nut that screws into ball screw 150 and a side portion that slides against guide rail 151. When motor 152 rotates ball screw 150, movable block 153 is guided by guide rail 151 and moves back and forth in the X-axis direction, and gripping portion 60 and adhesion portion 66 attached to movable block 153 also move back and forth in the X-axis direction.

[0038] At the tape gripping position, for example, when the first peeling tape 83 is gripped and the first peeling tape 83 is pulled out, near the gripping portion 60, there are located, in order from the +X direction side, a peeling tape cutting means 68, an adhering portion 66, and the gripping portion 60, as shown in Figures 1 and 2.

[0039] As shown in FIG. 1, the peeling tape cutting means 68 includes a mounting surface on which the adhesive layer side (lower surface side) of the first peeling tape 83 or the second peeling tape 84 is placed and a mounting table 682 having an escape groove 681 that crosses the mounting surface, for example, in the width direction (Y-axis direction) of the first peeling tape 83, a cutting cutter 684 that moves within the escape groove 681 along the extension direction of the escape groove 681, and a cutting cutter moving means 686 such as an actuator that moves the cutting cutter 684 in the extension direction of the escape groove 681 (Y-axis direction).

[0040] The adhesion part 66 is made of, for example, a predetermined metal or the like, has an outer shape formed into a substantially rectangular parallelepiped, extends linearly in the Y-axis direction with a length equal to or greater than the width of the first peeling tape 83 and the second peeling tape 84, and can be raised and lowered in the Z-axis direction by an actuator or the like. By lowering the adhesion part 66, it is possible to apply a predetermined pressing force to, for example, the first peeling tape 83 from its underside while adhering it to the protective tape 91. 2, an infrared heater 669 or the like is disposed inside the adhering portion 66 or on both sides of the adhering portion 66 for heating to exert adhesive strength of the adhesive layer of the first peeling tape 83. The temperature of the adhering portion 66 heated by the infrared heater 669 or the like can be measured by a temperature sensor (not shown).

[0041] The gripping unit 60 includes, for example, a fixed base 602 having a substantially U-shape in side view, and a lifting claw 603 that is disposed in the U-shaped internal space of the fixed base 602 and can approach or move away from the inner lower surface of the fixed base 602. As shown in Fig. 1, an actuator 605 having a rod that can advance and retreat in the Z-axis direction is disposed on the lower surface of the movable block 153, and by moving the lifting claw 603 attached to the lower end of the rod toward the fixed base 602 by the actuator 605, the leading end of the strip-shaped first peeling tape 83 can be gripped therebetween.

[0042] 1, the tape peeling device 1 includes a control unit 5 that controls the entire device. The control unit 5, which is composed of a CPU and a storage medium such as a memory, is electrically connected to the components of the tape peeling device 1, that is, the first cutter vertical movement means 177 and the second cutter vertical movement means 188 of the connection unit 7, the movement mechanism 78 that moves the first holding unit 71 up and down, the table movement means 13 that moves the holding table 30, and the X-axis movement means 15 that moves the gripping unit 60. Under the control of the control unit 5, for example, the vertical movement operations of the first cutter 17 and the first holding unit 71, and the movement operations in the X-axis direction of the holding table 30 and the gripping unit 60 are performed, and a detection signal is sent to the control unit 5 from the first detection unit 115 (second detection unit 116).

[0043] An example of the operation of the tape separating device 1 shown in FIG. 1 will be described below. 2 is placed on the holding table 30 with their centers substantially aligned, and a suction source (not shown) is activated to suction-hold the wafer 90 with the protective tape 91 facing up on the holding surface 302 of the holding table 30. In addition, a ring frame 94 supporting the wafer 90 is fixed by the ring frame holding portion 31.

[0044] (1) When switching from the first release tape to the second release tape and using the second release tape to peel off the protective tape attached to the wafer First, as shown in FIG. 3, a case will be described in which the first roll tape 85 supported by the first roll support part 113 is almost empty, and therefore the peeling tape to be used is switched from the first peeling tape 83 to the second peeling tape 84 of the second roll tape 86 supported by the second roll support part 114, to peel off the protective tape 91 attached to the wafer 90.

[0045] Note that while the first roll tape 85 supported by the first roll support portion 113 is rotated in the normal direction (for example, the clockwise direction when viewed from the front of the page) by a rotation means not shown, the strip-shaped first peeling tape 83 is passed between a pair of guide rollers 144 or a guide roller unit 64 and sent out in the -X direction toward the gripping portion 60, and the tip of the first peeling tape 83 is gripped by the gripping portion 60 shown in FIG. 1. In addition, the second peeling tape 84 of the second roll tape 86 supported by the second roll support portion 114 is passed between a pair of guide rollers 147, and its tip is held by suction by the second holding portion 72.

[0046] As the amount of detection light irradiated by the light projector increases at the light receiver without being blocked by the first roll tape 85, the first detector 115 detects that the remaining amount of the first roll tape 85 has decreased to a predetermined amount or less, which means that the tape is nearly empty. Then, the first detector 115 transmits a detection signal to the controller 5. The controller 5 recognizes that since the remaining amount of the first peeling tape 83 is low, the controller 5 must switch from the first peeling tape 83 to a new second peeling tape 84 and use the second peeling tape 84 to peel off the protective tape 91 attached to the wafer 90.

[0047] 4, under the control of the movement mechanism 78 of the connection unit 7 by the control unit 5, the movement mechanism 78 lowers the first holding unit 71. Then, the first holding unit 71 presses the first peeling tape 83 downward with the holding surface 712, and the first peeling tape 83 comes into contact with the second peeling tape 84 that is suction-held by the second holding unit 72, and the first peeling tape 83 and the second peeling tape 84 are sandwiched from above and below by the first holding unit 71 and the second holding unit 72.

[0048] In this state, a predetermined voltage is applied to the heating means 77, which is a heater in the first holding part 71, causing a current to flow and the heating means 77 to generate heat, which heats the first holding part 71 and applies heat to the joined part 845 where the first peeling tape 83 and the second peeling tape 84 are overlapped, while applying an appropriate pressing force. Note that while the heating means 77 is heating the joined part 845 via the first holding part 71, the temperature of the first holding part 71 is measured by a temperature sensor (not shown), and reaches a preset suitable thermal bonding temperature for bonding the first peeling tape 83 and the second peeling tape 84. The heater may be disposed inside first holding portion 71, or may be disposed to the side of first holding portion 71 with a gap therebetween, and heat first holding portion 71 from the outside.

[0049] The joined portion 845 is heated for a predetermined period of time to optimally develop the adhesiveness of the adhesive layer of the first peeling tape 83, and the adhesive layer at the tip side of one of the first peeling tapes 83 is adhered to the base layer of the other of the second peeling tape 84.

[0050] 5, for example, the suction hold of the second peeling tape 84 by the second holding part 72 is released, and the first holding part 71 holding the joined part 845 by suction is raised by the moving mechanism 78. Thereafter, air is sprayed from the nozzle of the air nozzle 136 toward the joined part 845 exposed between the first holding part 71 and the second holding part 72, to cool the joined part 845 to a predetermined temperature and prevent the adhesion from peeling off.

[0051] Next, as shown in FIG. 6, under the control of the first cutter up-down movement means 177 of the connection part 7 by the control part 5, the first cutter up-down movement means 177 lowers the first cutter 17, and the first peeling tape 83 on the side of the one of the first roll support parts 113 relative to the portion 845 joined by the connection part 7 is cut by the first cutter 17.

[0052] 7, the first roll tape 85 supported by the first roll support part 113 is rotated in the reverse direction (for example, counterclockwise as viewed from the front of the page) by a rotating means (not shown), while the free end of the cut first peeling tape 83 is wound up onto the first roll tape 85. Thereafter, the used first roll tape 85 that is no longer needed is removed from the first roll support part 113 by, for example, an operator, and a new first roll tape 85 is attached to the first roll support part 113. During this time, it is not necessary to stop the tape peeling device 1.

[0053] Meanwhile, the suction hold of the joined portion 845 by the first holding portion 71 is released, and the changeover of the peeling tape held by the gripping portion 60 from the first peeling tape 83 to the second peeling tape 84 is completed.

[0054] The tape peeling device 1 of this embodiment splices together a first peeling tape 83 on one side and a second peeling tape 84 on the other side, and then discards the portion from the tip of the spliced ​​first peeling tape 83 held by the holding portion 60 to the spliced ​​portion 845 with the second peeling tape 84, so as to prevent the spliced ​​portion 845 from being adhered to the outer periphery of the upper surface of the protective tape 91 by the adhesive portion 66.

[0055] Specifically, while the second roll support section 114 shown in Fig. 7 rotates the second roll tape 86 at a predetermined rotation speed, the pair of rotatable guide rollers 147 and the guide roller unit 64 apply tension to the second peeling tape 84 between the gripping section 60 and the second roll tape 86 and feed it out in the -X direction, and further, the X-axis moving means 15 shown in Fig. 1 moves the gripping section 60 in the -X direction, and pulls out the second peeling tape 84 in the -X direction from the second roll tape 86. Then, for example, after the jointed portion 845 shown in Fig. 7 passes through the second holding section 72, the guide roller unit 64, and the pair of feed rollers 687 shown in Fig. 2, the cutting cutter 684 cuts the second peeling tape 84 at a position behind the jointed portion 845 (a position on the +X direction side). As a result, for example, the leading end of the second peeling tape 84 is clamped by a pair of feed rollers 687, and the gripping portion 60 grips the joined first peeling tape 83 having the joined portion 845 and the cut second peeling tape 84 at its rear end.

[0056] The gripping portion 60, holding the first peeling tape 83 having the spliced ​​portion 845, moves to above a trash can (not shown) located below the -X direction end side of the movement path of the gripping portion 60, releases its grip on the first peeling tape 83, and drops the unnecessary first peeling tape 83 having the spliced ​​portion 845 into the trash can (not shown) for disposal. In addition, instead of discarding the peeling tape including the joined portion 845 as described above, the joined portion (the portion where the first peeling tape 83 and the second peeling tape 84 overlap) may be reused by not adhering it to the protective tape 91.

[0057] Thereafter, the X-axis moving means 15 moves the gripping part 60 in the +X direction, and the gripping part 60 and the second peeling tape 84 are aligned in the X-axis direction so that the leading end of the second peeling tape 84, which is clamped by the pair of feed rollers 687 so as to be capable of being fed, rests on the inner lower surface of the fixed base 602 by a predetermined length. Then, the lifting claws 603 of the gripping part 60 are lowered, so that the leading end of the second peeling tape 84 is gripped between the lifting claws 603 and the fixed base 602.

[0058] While the second roll support part 114 rotates the second roll tape 86 at a predetermined rotation speed, the pair of rotatable guide rollers 147, the guide roller unit 64, and the pair of feed rollers 687 feed the second peeling tape 84 between the gripper 60 and the second roll tape 86 in the -X direction while applying tension to the second peeling tape 84. The gripper 60 that pulls out the second peeling tape 84 moves to the tape attachment position P2 shown in FIG. 2, and then stops moving in the X-axis direction once. The holding table 30 that holds the wafer 90 shown in FIG. 1 and FIG. 2 moves in the +X direction, and the cutting cutter 684, the attachment part 66, the infrared heater 669, and the gripper 60 that grips the tip of the second peeling tape 84 are positioned, for example, above the outer periphery of the protective tape 91 attached to the wafer 90 on the +X direction side in this order from the +X direction side.

[0059] A predetermined voltage is applied to the infrared heater 669, causing a current to flow and the infrared heater 669 to generate heat, and the adhering portion 66 is heated by the infrared heater 669 with or without contact. While the adhering portion 66 is being heated by the infrared heater 669, a temperature sensor (not shown) built into the adhering portion 66 measures the temperature of the adhering portion 66. The temperature of the adhering portion 66 reaches a preset suitable thermal adhesion temperature of the second peeling tape 84 to the protective tape 91. Also, under the control of the control portion 5, the adhering portion 66 is lowered by the actuator.

[0060] 1 and 2 is lowered, and the second peeling tape 84, which has become drawable by the gripping unit 60 as shown in FIG. 7 where the adhesive unit 66 extends above the outer periphery on the +X direction side of the protective tape 91, is pushed downward, and the adhesive layer of the second peeling tape 84 is brought into contact with and pressed against the outer periphery of the upper surface of the protective tape 91. The adhesive unit 66, which has been heated to a suitable thermal bonding temperature in advance, allows the adhesive layer of the second peeling tape 84 to exhibit its adhesiveness in an optimal state, and the adhesive layer on the tip side of the second peeling tape 84 is adhered to the outer periphery of the upper surface of the protective tape 91 of the wafer 90 held on the holding table 30.

[0061] 1 and 2 descends, and the cutting edge of the cutting cutter 684 cuts into the second peeling tape 84 placed on the placement table 682, cutting the second peeling tape 84 into a strip shape. After cutting the second peeling tape 84, the cutting cutter 684 and the adhering part 66 rise in the +Z direction and retreat from the second peeling tape 84.

[0062] Next, the table moving means 13 shown in Figs. 1 and 2 moves the holding table 30 in the +X direction, and the X-axis moving means 15 moves the gripping part 60 gripping the tip of the second peeling tape 84 attached to the outer periphery of the +X direction side of the upper surface of the protective tape 91 in the -X direction. Then, the tension applied to the second peeling tape 84 and the protective tape 91 and the adhesive force of the adhesive layer of the heated second peeling tape 84 to the protective tape 91 are greater than the adhesive force of the protective tape 91 attached to the upper surface 900 of the wafer 90, so that the protective tape 91 is peeled off from the outer periphery of the +X direction side of the wafer 90 toward the center from the upper surface 900 of the wafer 90. Note that the protective tape 91 may be peeled off from the wafer 90 by fixing either the holding table 30 or the gripping part 60 and moving the holding table 30 or the gripping part 60 in the X-axis direction.

[0063] After the protective tape 91 has been peeled off from the entire top surface of the wafer 90, the gripping portion 60 holding the peeled off protective tape 91 and the second peeling tape 84 moves above a trash can (not shown), releases its grip on the second peeling tape 84, and drops the peeled off protective tape 91 into the trash can (not shown).

[0064] A transport means (not shown) transports the wafer 90 from which the protective tape 91 has been peeled off from the holding table 30, and a new wafer 90 with the protective tape 91 attached to its upper surface 900 is placed on the holding table 30. The process using the second peeling tape 84 as described above is repeated to peel the protective tape 91 from the upper surface 900 of the wafer 90, thereby smoothly carrying out the tape peeling operation and allowing the protective tapes 91 to be peeled off one after another from multiple wafers 90.

[0065] After each protective tape 91 of the multiple wafers 90 has been peeled off in succession, the second roll tape 86 supported by the second roll support unit 114 becomes almost empty, and therefore it is necessary to switch the peeling tape to be used from the second peeling tape 84 to the first peeling tape 83 of a new first roll tape 85 shown in Figure 8 supported by the first roll support unit 113, in order to peel off the protective tape 91 affixed to the wafers 90.

[0066] (2) When switching from the second release tape to the first release tape and using the first release tape to release the protective tape attached to the wafer, 8 is not blocked by the second roll tape 86 and the amount of light received by the light receiving section increases, so that the second detection section 116 detects that the remaining amount of the second roll tape 86 has decreased to a predetermined amount or less, which means that the tape is almost empty. Then, the second detection section 116 transmits a detection signal to the control section 5. The control section 5 recognizes that since the remaining amount of the second peeling tape 84 is low, the second peeling tape 84 should be replaced by a new first peeling tape 83, and the first peeling tape 83 should be used to peel off the protective tape 91 attached to the wafer 90.

[0067] 9, under the control of the moving mechanism 78 of the connection unit 7 by the control unit 5, the moving mechanism 78 lowers the first holding unit 71 that is suction-holding the tip of the first peeling tape 83. Then, the first holding unit 71 presses the first peeling tape 83 downward with the holding surface 712, and the first peeling tape 83 comes into contact with the second peeling tape 84, the tip of which is held by the holding unit 60, and the first peeling tape 83 and the second peeling tape 84 are sandwiched from above and below by the first holding unit 71 and the second holding unit 72.

[0068] The heating means 77 generates heat and heats the first holding portion 71, so that the joined portion 837 where the first peeling tape 83 and the second peeling tape 84 are overlapped is heated to a suitable bonding temperature and an appropriate pressing force is applied. The joined portion 837 is heated for a predetermined period of time to optimally develop the adhesiveness of the adhesive layer of the first peeling tape 83, and the base layer at the tip side of one of the second peeling tapes 84 is adhered to the adhesive layer of the other first peeling tape 83.

[0069] 10, the first holding part 71, which holds the joined part 837 by suction, is raised by controlling the movement mechanism 78 of the control part 5. Thereafter, air is sprayed from the nozzle of the air nozzle 136 toward the joined part 837 exposed between the first holding part 71 and the second holding part 72, to cool the joined part 837 to a predetermined temperature and prevent the adhesion from peeling off.

[0070] Next, as shown in FIG. 11 , under the control of the second cutter up-down movement means 188 of the connection portion 7 by the control unit 5, the second cutter up-down movement means 188 raises the second cutter 18, and cuts one of the second peeling tapes 84 on the side of the one of the second roll support parts 114 relative to the portion 837 joined by the connection portion 7 by the second cutter 18.

[0071] 12 in the reverse direction (for example, counterclockwise as viewed from the front of the page), the free end of the cut second peeling tape 84 is wound up onto the second roll tape 86. Thereafter, the used second roll tape 86 that is no longer needed is removed from the second roll support part 114 by an operator, and a new second roll tape 86 is attached to the second roll support part 114. During this time, it is not necessary to stop the tape peeling device 1.

[0072] Meanwhile, the suction hold of the joined portion 837 by the first holding portion 71 is released, and the changeover of the peeling tape held by the gripping portion 60 from the second peeling tape 84 to the first peeling tape 83 is completed.

[0073] The tape peeling device 1 of this embodiment splices together the second peeling tape 84 on one side and the first peeling tape 83 on the other side, and then discards the portion from the tip of the spliced ​​second peeling tape 84 held by the holding portion 60 to the spliced ​​portion 837 with the first peeling tape 83, so that the spliced ​​portion 837 is not adhered to the outer periphery of the upper surface of the protective tape 91 by the adhesion portion 66 shown in Figure 2.

[0074] Specifically, while the first roll support section 113 shown in Fig. 12 rotates the first roll tape 85 at a predetermined rotation speed, the pair of rotatable guide rollers 144 and the guide roller unit 64 apply tension to the first peeling tape 83 between the gripping section 60 and the first roll tape 85 and feed it out in the -X direction, and further, the X-axis moving means 15 shown in Fig. 1 moves the gripping section 60 in the -X direction, and pulls out the first peeling tape 83 in the -X direction from the first roll tape 85. Then, for example, after the jointed portion 837 shown in Fig. 12 passes through the second holding section 72, the guide roller unit 64, and the pair of feed rollers 687 shown in Fig. 2, the cutting cutter 684 cuts the first peeling tape 83 at a position behind the jointed portion 837. As a result, for example, the leading end of the first peeling tape 83 is clamped by a pair of feed rollers 687, and the gripping portion 60 grips the joined unnecessary second peeling tape 84 having the joined portion 837 and the cut first peeling tape 83 as its trailing end.

[0075] The gripping portion 60, holding the second peeling tape 84 having the spliced ​​portion 837, moves to above a trash can (not shown) located below the -X direction end side of the movement path of the gripping portion 60, releases its grip on the second peeling tape 84, and drops the unnecessary second peeling tape 84 having the spliced ​​portion 837 into the trash can (not shown) for disposal.

[0076] Thereafter, the new first peeling tape 83 is gripped by the gripping portion 60 and the first peeling tape 83 is attached to the protective tape 91 attached to the wafer 90 in a manner substantially similar to that of the second peeling tape 84 described above, and the protective tape 91 is peeled off by the gripping portion 60 via the first peeling tape 83 in a manner substantially similar to the peeling off of the protective tape 91 by the gripping portion 60 via the second peeling tape 84 described above.

[0077] As described above, the tape peeling device 1 according to the present invention includes a holding table 30 having a holding surface 302 for holding a lower surface 901 of a wafer 90 having a protective tape 91 attached to an upper surface 900 thereof, a first roll support section 113 (second roll support section 114) for rotatably supporting a first roll tape 85 (second roll tape 86) in which a strip-shaped first peeling tape 83 (second peeling tape 84) is wound in a roll, and a tape support section 115 for supporting the first peeling tape 83 (second peeling tape 84) pulled out from the outer periphery of the first roll tape 85 (second roll tape 86). The protective tape 91 is supported by a first roll support section 113 (a second roll support section 114) and a first detection section 115 (a second detection section 116) that detects that the remaining amount of the first roll tape 85 (the second roll tape 86) supported by the first roll support section 113 (the second roll support section 114) is low, and a second detection section 116 that detects that the remaining amount of the first roll tape 85 (the second roll tape 86) supported by the first roll support section 113 (the second roll support section 114) is low, and a second detection section 116 that detects that the remaining amount of the second roll tape 84 is low between the gripping section 60 and the first roll support section 114 that supports the second roll tape 86. The device further includes a connection section 7 that overlaps and adheres to the tip end of the other first peeling tape 83 pulled out from one roll tape 85 to join them, a second cutter 18 that cuts one second peeling tape 84 on the side of one second roll support section 114 from the part 837 joined by the connection section 7, and a control section 5 that controls the device. When the control section 5 detects by the one second detection section 116 that the remaining amount of one second roll tape 86 is low, the control section 5 can apply the other first peeling tape 83 to one second peeling tape 84. The joining by the connection part 7 and the cutting by the second cutter 18 of one of the second peeling tapes 84 on the side of the one second roll support part 114 from the joined part 837 are controlled, and the one second peeling tape 84 and the other first peeling tape 83 are joined together, and the peeling tape to be held by the gripping part 60 is switched from one second peeling tape 84 to the new other first peeling tape 83, so that the other first peeling tape 83 can be stuck to the protective tape 91 by the sticking part 66 and the gripping part 60. That is, the tape peeling device 1 according to the present invention can continuously perform the operation of peeling the protective tape 91 from the wafer 90 using the second peeling tape 84 without waiting for an operator to perform an operation of refilling the first peeling tape 83, for example.

[0078] In the tape peeling device 1 of the present invention, the connection portion 7 includes a second holding portion 72 that holds one second peeling tape 84 pulled out from the outer periphery of one second roll tape 86 supported by one second roll support portion 114, a first holding portion 71 that holds the other first peeling tape 83 pulled out from the outer periphery of the other first roll tape 85 supported by the other first roll support portion 113, a heating means 77 that heats at least one of the first holding portion 71 or the second holding portion 72 (in this embodiment, the first holding portion 71), and a moving mechanism 78 that moves at least one of the first holding portion 71 or the second holding portion 72 (in this embodiment, the first holding portion 71) in a direction toward and away from the other, thereby making it possible to properly connect one second peeling tape 84 and the other first peeling tape 83 so that they do not peel off.

[0079] The tape peeling device 1 of the present invention splices together the second peeling tape 84 on one side and the first peeling tape 83 on the other side, and then discards the portion of the joined peeling tape from the tip held by the holding portion 60 up to the joined portion 837, thereby preventing the joined portion 837 from being attached to the outer periphery of the upper surface of the protective tape 91 by the adhesion portion 66, thereby making it possible to prevent the occurrence of a situation in which the joined portion 837 is attached to the protective tape 91, increasing its thickness and resulting in failure to peel off the protective tape 91.

[0080] The tape peeling device 1 according to the present invention is not limited to the above embodiment, and the shapes of each component of the tape peeling device 1 illustrated in the attached drawings are not limited to these and can be modified as appropriate within the scope in which the effects of the present invention can be achieved. [Explanation of symbols]

[0081] 90: Wafer 900: Top surface of wafer 901: Bottom surface of wafer 91: Protective tape 1: Tape peeling device 113: First roll support part 85: First roll tape 83: First peeling tape 855: Cylinder 144: Pair of guide rollers 115: First detector 17: First cutter 177: First cutter vertical movement means 7: Connection part 71: First holding part 710: Adsorption part 712: Holding surface 711: Frame 79: Suction source 78: Movement mechanism 72: Second holding part 722: Holding surface 114: Second roll support part 86: Second roll tape 84: Second peeling tape 866: Cylinder 147: Pair of guide rollers 116: Second detector 18: Second cutter 188: Second cutter vertical movement means 15: X-axis moving means 150: ball screw 152: motor 60: gripping part 602: fixed base 603: lifting claw 605: actuator 66: Adhesive part 669: Infrared heater 68: peeling tape cutting means 681: escape groove 682: placement table 684: Cutting cutter; 686: Cutting cutter moving means; 687: Pair of feed rollers 30: Holding table 302: Holding surface 35: Table base 31: Ring frame holder 318: Clamp 33: Actuator 13: Table movement means 5: Control unit

Claims

[Claim 1] a holding table having a holding surface for holding the underside of a wafer having a protective tape attached to its upper surface; a roll support section for rotatably supporting a roll tape having a strip-shaped peeling tape wound in a roll; a gripping section for gripping the peeling tape pulled out from the outer periphery of the roll tape; and an attachment section for attaching the peeling tape held by the gripping section to an outer periphery of the protective tape, the tape peeling device moving the gripping section gripping the peeling tape attached to the outer periphery of the protective tape in a direction away from a wafer to peel off the protective tape, At least two of the roll supports are provided, at least two detection units each detecting when the remaining amount of each of the roll tapes supported by each of the roll support units is low; a connection section for overlapping and adhering a leading end of one of the release tapes pulled out from the other of the roll tapes to one of the release tapes between the one of the roll support sections supporting one of the roll tapes and the grip section to join them together, a cutter for cutting one of the release tapes on the side of the one of the roll support sections from the part joined by the connection section, and a control section for controlling the device, the connection portion includes a first holding portion that holds one of the peeling tapes pulled out from the outer periphery of one of the roll tapes supported by one of the roll support portions, a second holding portion that holds the other of the peeling tapes pulled out from the outer periphery of the other of the roll tapes supported by the other of the roll support portions, a heating means that heats at least one of the first holding portion or the second holding portion, and a moving mechanism that moves at least one of the first holding portion or the second holding portion in a direction toward and away from the other, The control unit when one of the detection units detects that the remaining amount of one of the roll tapes is low, the following are controlled: one of the release tapes is overlapped on the other of the release tapes and attached and joined by the joint unit; and one of the release tapes on the side of one of the roll support units from the joint unit is cut by the cutter, thereby making it possible to switch the release tape held by the gripping unit from one of the release tapes to the other of the release tapes; The tape peeling device splices one peeling tape and the other peeling tape together, and then discards the portion from the tip of the joined peeling tape held by the holding part to the joined part, so that the joined part is not stuck to the outer circumferential part of the protective tape by the sticking part.

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