DEVICE MOUNTING APPARATUS AND METHOD FOR ADJUSTING DEVICE

Abstract

To provide an element mounting device, a mounting method for the element mounting device, and an element mounting method with which it is possible to easily and more reliably pick up elements in multiple rows and multiple columns.SOLUTION: An element mounting device 1 comprises a carrier base 3, a mounting table 4, a transfer unit 5, and tilt mechanisms 33, 58a, 58b. The carrier base 3 is a supply base on which a carrier C carrying elements in a row is placed. The mounting table is where a substrate S is placed, on which elements are arranged. The transfer unit moves between the carrier base and the mounting table, collectively picking up elements in multiple rows and multiple columns from the carrier C and collectively transferring the picked elements in multiple rows and multiple columns to the substrate. The tilt mechanisms 33, 58a, 58b are capable of tilting at least one of the placement face of the carrier base, the holding face of the transfer unit, and the placement face of the mounting table, as the object to tilt, and adjusting the placement face of the carrier base, the holding face of the transfer unit, and the placement face of the mounting table in parallel.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an element mounting device. and Method for adjusting element mounting device To Regarding. [Background technology]

[0002] Element mounting devices that mount elements such as semiconductor elements, resistors, and capacitors on a board on which a circuit pattern is formed are becoming widespread. Element mounting devices have an element transport unit that moves back and forth between an element supplier on which elements are stocked and a board on which the elements are to be mounted. The transport unit picks up elements one by one from the element supplier, holds and transports the elements to the board, and releases the elements onto the board. A conductive bonding material such as ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), NCP (Non Conductive Paste) or homogeneous eutectic solder is formed on the board, and the elements are mounted on the board by placing the elements on the board and then applying heat and pressure.

[0003] In recent years, miniaturization of elements has progressed at a very fast pace. Elements with a side size of 200 μm or less, such as 50 μm or 10 μm, have been proposed. These elements are, for example, mini LEDs or micro LEDs with a side size of 50 μm or 10 μm, and are arranged in multiple rows and columns as RGB pixels on a display substrate for a display, and are also arranged on a lighting substrate as light emitters for a backlight. When mounting LEDs as pixels on a display substrate, if the display substrate is compatible with 4K, at least 8 million LEDs for one of the RGB colors must be mounted on the display substrate, and mounting the elements one by one poses problems in production efficiency.

[0004] In view of this, a proposal has been made to improve production efficiency by picking up multiple elements at once and mounting them on a board at once. That is, a device mounting device has been proposed that has a transport section with a holding surface that holds elements in multiple rows and columns, and that picks up elements in multiple rows and columns at once using this holding surface.

[0005] For example, as a method for holding elements by the transfer unit, adsorption such as vacuum adsorption and electrostatic adsorption is often used. When vacuum adsorption is adopted, a number of suction holes are formed on the holding surface of the transfer unit. Each suction hole is connected to a pneumatic circuit having a compressor or an ejector, and a negative pressure is generated in each suction hole. The transfer unit picks up the elements from the element supplier in a lump by sucking the elements into the suction holes by the negative pressure, transports them to the substrate, and releases the elements from the substrate by releasing the negative pressure by breaking the vacuum or opening to the atmosphere. When electrostatic adsorption is adopted, a number of mesa structures are formed on the base substrate, and electrodes and dielectric layers are provided on the mesa structures. The electrostatic force generating unit having the mesa structures becomes a local adsorption point for the elements, and the elements are sucked in a lump to each electrostatic force generating unit by the electrostatic force caused by the application of a voltage. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Special Publication No. 2015-505736 Summary of the Invention [Problem to be solved by the invention]

[0007] When handling multiple rows and columns of elements at once, it is necessary to keep the holding surface of the transport unit parallel to the element supply body, and the holding surface of the transport unit parallel to the substrate with high precision, in order to eliminate the risk of elements being left unattached from the element supply body, the risk of excessive load being applied to some elements during pick-up, the risk of poor bonding of elements to the substrate, and the risk of excessive load being applied to some elements during mounting.

[0008] The present invention has been proposed to solve the problems described above, and aims to provide an element mounting device, an adjustment method for the element mounting device, and an element mounting method that can easily and reliably pick up multiple rows and columns of elements at once and mount them on a substrate at once. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention provides an element mounting apparatus having a supply table on which an element supply body having elements arranged in an array is placed, a mounting table on which a substrate on which the elements are arranged in an array is placed, and a holding surface for holding elements in multiple rows and columns, the supply table being moved between the supply table and the mounting table, and which picks up the elements in multiple rows and columns from the element supply body all at once on the holding surface and transfers the picked up elements in multiple rows and columns from the holding surface to the substrate all at once; and The mounting surface of the mounting stand of a tilt mechanism that tilts the supply table as a tilting object and adjusts the placement surface of the supply table and the holding surface of the transfer section, and the holding surface of the transfer section and the placement surface of the mounting table, so as to be parallel to each other; Multi-row, multi-column elements a tilt sensor for detecting an inclination of a mounting surface of the mounting table at a position where the substrates are transferred to the substrate all at once, the tilt sensor for detecting an inclination of a holding surface of the transfer unit at a position where the substrates are picked up ... transferred to the substrate all at once, the tilt sensor for detecting an inclination of a holding surface of the transfer unit at a position where the substrates are picked up, the tilt sensor for detecting an inclination of a Multi-row, multi-column elements and a displacement sensor for detecting an inclination of the holding surface of the transfer section at a position where the substrates are transferred to the substrate all at once.

[0010] The tilt mechanism may be a manual tilt mechanism that tilts a tilt object by manually operating a knob, or an electric tilt mechanism that tilts a tilt object using a motor as a power source, or both of these.

[0012] The supply table and The mounting stand To Each of the tilt mechanisms provided may be the power tilt mechanism.

[0015] The manual tilt mechanism may be configured to tilt the tilt target by 0.0003° or more and 0.15° or less when the knob rotates once.

[0016] The electric tilt mechanism may include a cam follower that supports a tilting object, and a tilting portion that causes the cam follower to move in the ascending and descending direction of a tilted surface, and the tilting portion may have a slope that rises in height by 1 mm or less when moved horizontally by 10 mm.

[0017] In order to achieve the above object, a method for adjusting an element mounting apparatus according to the present invention includes a supply table on which an element supply body having elements arranged in an array is placed, a mounting table on which a substrate on which the elements are arranged in an array is placed, and a holding surface for holding elements in multiple rows and columns, the transport unit moving between the supply table and the mounting table and picking up the elements in multiple rows and columns from the element supply body all at once on the holding surface and transferring the picked-up elements in multiple rows and columns from the holding surface to the substrate all at once, a tilt mechanism provided on the transport unit for tilting the placement surface of the supply table and the placement surface of the mounting table as tilt targets, and Multi-row, multi-column elements a tilt sensor for detecting an inclination of a mounting surface of the mounting table at a position where the substrates are transferred to the substrate all at once, the tilt sensor for detecting an inclination of a holding surface of the transfer unit at a position where the substrates are picked up ... transferred to the substrate all at once, the tilt sensor for detecting an inclination of a holding surface of the transfer unit at a position where the substrates are picked up, the tilt sensor for detecting an inclination of a Multi-row, multi-column elements a displacement sensor for detecting an inclination of the holding surface of the transfer unit at a position where the elements are transferred to the substrate all at once, the displacement sensor detecting an inclination of the placement surface of the supply table at a position where the pickup is performed, an inclination of the holding surface of the transfer unit, Multi-row, multi-column elements the tilt mechanism detects the inclination of the loading surface of the mounting table and the inclination of the holding surface of the transfer section at a position where the supply tables are all transferred to the substrate at once, and based on the detection results, adjusts the loading surface of the supply table and the holding surface of the transfer section, and the holding surface of the transfer section and the loading surface of the mounting table so that they are previously parallel. Effect of the Invention

[0020] According to the present invention, it is possible to pick up elements from an element supplier all at once without dropping any of the elements and without applying an excessive load to some of the elements. In addition, the held elements can be bonded to a substrate with high accuracy and can be detached all at once without applying an excessive load to some of the elements. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a perspective view showing a schematic configuration of an element mounting apparatus. [Diagram 2] FIG. 4 is a perspective view showing a schematic diagram of an adhesive sheet attached to a transfer section. [Diagram 3] 1A and 1B are cross-sectional views of an adhesive sheet made of a thermal release sheet, in which (a) shows the sheet before heating and (b) shows the sheet after locally heating. [Figure 4] FIG. 2 is a front view showing a detailed configuration of the element mounting device. [Diagram 5] FIG. 2 is a side view showing a detailed configuration of the element mounting device. [Figure 6] 1A and 1B are diagrams showing the configuration of the carrier base and the tilt mechanism, where (a) is a top view and (b) is a side view. [Figure 7] FIG. 4 is a diagram showing a detailed configuration of a transfer unit. [Figure 8] 13 is a diagram showing a detailed configuration of a tilt mechanism of the transport section as viewed from a direction orthogonal to the XZ plane. FIG. [Figure 9] 13 is a diagram showing a detailed configuration of a tilt mechanism of the transport section as viewed from a direction orthogonal to the YZ plane. FIG. [Figure 10] 4 is a flowchart showing the operation of the device mounting apparatus according to the embodiment. [Figure 11] FIG. 11 is a configuration diagram of a component mounting apparatus according to a second embodiment. [Figure 12] 10 is a flowchart showing an operation of detecting and adjusting the inclination of a holding surface. [Figure 13] 11 is a schematic diagram showing the state of the device when detecting the inclination of the holding surface. FIG. [Figure 14] FIG. 4 is a schematic diagram showing irradiation of a holding surface with laser light. [Figure 15]10 is a flowchart showing an operation of detecting and adjusting the inclination of the placement surface of the mounting table. [Figure 16] 11 is a schematic diagram showing a state of the device when detecting the inclination of the mounting surface of the mounting stand; FIG. [Figure 17] 11 is a schematic diagram showing irradiation of a laser beam onto a mounting surface of a mounting stand; FIG. [Figure 18] FIG. 11 is a configuration diagram showing another example of the installation of the laser measuring instrument. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a device mounting apparatus and a mounting method according to the present invention will be described in detail with reference to the drawings.

[0023] (First embodiment) (Schematic configuration) A device mounting apparatus according to a first embodiment will be described. FIG. 1 is a schematic diagram showing a schematic configuration of the device mounting apparatus. As shown in FIG. 1, a carrier C and a substrate S are carried into the device mounting apparatus 1. The carrier C is an element supplying body that stocks the elements E in an array. The array refers to a state in which the elements E are arranged in a plurality of rows and a plurality of columns according to a determined pattern, and the spacing between the rows and columns is the same or different, for example, a checkerboard arrangement, a staggered arrangement like a honeycomb pattern, and the like. The elements E are components used in electronic circuits, and include chips such as MEMS, semiconductor elements, resistors, and capacitors, and the semiconductor elements include discrete semiconductors such as transistors, diodes, LEDs, and thyristors, as well as integrated circuits such as ICs and LSIs. The LEDs include so-called mini LEDs and micro LEDs. In particular, the elements E include so-called micro components with a side of 200 μm or less. The substrate S is formed with a circuit pattern, and is, for example, an illumination substrate for a backlight on which mini LEDs are aligned, or a display substrate on which RGB micro LEDs are arranged as pixels.

[0024] This device mounting apparatus 1 picks up multiple rows and columns of devices E all at once from a carrier C, and transfers the picked up multiple rows and columns of devices E all at once to a substrate S. This device mounting apparatus 1 then transfers the multiple rows and columns of devices E to the substrate S multiple times, thereby manufacturing a device mounting substrate on which the devices E are arranged in an array. This device mounting apparatus 1 also electrically and mechanically bonds the transferred devices E to the substrate S. Such a device mounting apparatus 1 is also called a die bonding apparatus or a chip bonding apparatus.

[0025] The element mounting apparatus 1 includes a carrier table 3, a mounting table 4, and a transfer unit 5. The carrier table 3 is a supply table for carriers C having a mounting surface on which the carriers C are placed, and stops at a pick-up position 21. That is, the carrier table 3 stops a group of elements E in multiple rows and columns to be picked up among the elements E stocked in an array-like arrangement on the carrier C, so that the center position of the group is located at the pick-up position 21. The mounting table 4 is a supply table for substrates S having a mounting surface on which the substrates S are placed, and stops at a mounting position 22. That is, the mounting table 4 stops a circuit pattern on the substrate S, on which a group of elements E in multiple rows and columns is mounted by the transfer unit 5, so that the center position of the circuit pattern is located at the mounting position 22.

[0026] The transfer unit 5 transfers the elements E from the carrier C to the substrate S. The transfer unit 5 moves between a pickup position 21 and a mounting position 22. The transfer unit 5 faces the carrier C placed on the carrier table 3 at the pickup position 21, and picks up the elements E in multiple rows and columns from the carrier C all at once. The transfer unit 5 also faces the substrate S placed on the mounting table 4 at the mounting position 22, and transfers the elements E in multiple rows and columns that it is holding to the substrate S all at once.

[0027] The method of picking up the elements E by the transport unit 5 is, for example, adhesion. The transport unit 5 is provided with a flat holding surface 51a, and an adhesive sheet A is attached to this holding surface 51a. As shown in FIG. 2, the adhesive sheet A has an adhesive area A1 on one side that is the same as or slightly wider than the area in which the elements E are arranged in multiple rows and columns. The adhesive area A1 has adhesive force all over. In other words, there is no need to pinpoint align all of the elements E in multiple rows and columns, and the adhesive sheet A exerts adhesive force and adheres each element E when each element E comes into contact with any area of ​​the adhesive sheet A. The slightly wider adhesive area A1 is a range that extends to the space between the element E group to be picked up and the adjacent element E one outside the element E group, but does not reach the adjacent element E.

[0028] The transfer unit 5 mounts the adhesive sheet A on the holding surface 51a so that the adhesive area A1 faces the element E at the pickup position 21 and the adhesive area A1 faces the substrate S at the mounting position 22. The transfer unit 5 presses the adhesive sheet A against the element E on the carrier C to transfer all the elements E in the adhesive area A1 from the carrier C to the adhesive sheet A at once. The transfer unit 5 also brings all the held elements E into contact with the substrate S at once, and then loses or reduces the adhesive force of the adhesive sheet A, and detaches all the elements E from the adhesive sheet A to the substrate S at once. A conductive bonding material is formed on the substrate S in advance. The conductive bonding material electrically and mechanically connects the substrate S and the elements E by alloy bonding, conductive particle compression bonding, bump compression bonding, or the like, and hardens by heating. For example, ACF, ACP, NCF, NCP, or homogeneous eutectic solder is formed on the substrate S as the conductive bonding material.

[0029] The carrier table 3 on which the carrier C is placed has a tilt-adjustable mounting surface, which is previously aligned parallel to the holding surface 51a of the transfer unit 5. The transfer unit 5 which holds the elements E has a tilt-adjustable mounting surface, which is previously aligned parallel to the holding surface 51a of the mounting table 4 on which the substrate S is placed. Therefore, all the elements E that fit within the adhesive area A1 can be picked up from the carrier C at once without missing any of them and without applying an excessive load to some of the elements E. Furthermore, all the held elements E can be bonded to the substrate S with high precision, and can be detached at once without applying an excessive load to some of the elements E.

[0030] An example of the adhesive sheet A is shown below. The adhesive sheet A is, for example, a thermal release sheet whose adhesive strength is lost or reduced by heat at a specified temperature. As shown in FIG. 3, the adhesive sheet A has a two-layer structure of a substrate A2 and an adhesive layer A3. The adhesive layer A3 includes an adhesive and a foaming filler A4. The foaming filler A4 is formed by filling an elastic shell with a substance that gasifies and expands by heat. In this adhesive sheet A, the volume of the foaming filler A4 expands due to heat, and the adhesive area with the element E decreases, so that the adhesive strength with respect to the element E is lost or reduced. That is, the transfer unit 5 brings the element E into contact with the substrate S and then heats the adhesive sheet A, thereby peeling the element E from the adhesive sheet A and transferring it to the substrate S. An example of a thermal release sheet may be one in which a phase transition from solid to liquid occurs in the adhesive layer, and it is sufficient if the adhesive strength can be controlled by heat.

[0031] (Detailed configuration) A more detailed description will be given of the above-mentioned element mounting apparatus 1. Fig. 4 is a front view showing the detailed configuration of the element mounting apparatus 1, and Fig. 5 is a side view showing the detailed configuration of the element mounting apparatus 1.

[0032] As shown in Figures 4 and 5, the device mounting apparatus 1 has a stand 6. The stand 6 is a table with a flat top surface, on which the carrier table 3, the mounting table 4, the transport unit 5, and the lift unit 9 are mounted. Inside the stand 6, a control means 11 such as a computer or a microcomputer having a CPU, ROM, RAM, and a signal transmission circuit that controls each part of the device mounting apparatus 1 is accommodated. In addition, the transport unit 5 holds the adhesive sheet A by suction, and the stand 6 accommodates an air pressure circuit 12 that supplies negative pressure to the transport unit 5 as a suction force, and the control means 11 is provided with a signal transmission circuit that controls a solenoid valve in the air pressure circuit 12 to switch between generating and releasing negative pressure.

[0033] Hereinafter, one axis direction parallel to the top surface of the pedestal 6 will be referred to as the X-axis direction. The Y-axis direction is parallel to the top surface of the pedestal 6 and perpendicular to the X-axis, the Z-axis direction is a height direction perpendicular to the X-axis and Y-axis directions, and θ rotation refers to rotation around the Z-axis. In addition, the direction moving away from the top surface of the pedestal 6 along the Z-axis direction to the outside of the pedestal 6 will be referred to as the upward direction, and the direction moving from the top surface of the pedestal 6 toward the inside of the pedestal 6 along the Z-axis direction will be referred to as the downward direction.

[0034] The carrier table 3 has a mounting surface that spreads two-dimensionally in the X-axis and Y-axis directions. The carrier table 3 is equipped with an X-axis driving mechanism 31, a Y-axis driving mechanism 32, and a tilt mechanism 33, and is movable in the X-axis and Y-axis directions, and the tilt of the mounting surface can be changed. The movable range in the X-axis direction includes the pickup position 21 and a loading / unloading position for loading and unloading the carrier C with respect to the carrier table 3. The X-axis driving mechanism 31 is used for aligning the carrier C with the transport unit 5 in the X-axis direction. The Y-axis driving mechanism 32 is used for aligning the carrier C with the transport unit 5 in the Y-axis direction. The tilt mechanism 33 is used for adjusting the parallelism with the transport unit 5, and tilts the mounting surface of the carrier table 3.

[0035] For example, a ball screw mechanism can be used as the X-axis driving mechanism 31 and the Y-axis driving mechanism 32. The rail and the ball screw extend along the respective moving directions. The ball screw is composed of a rotary motor, a screw shaft, and a slider, and the slider is screwed onto the screw shaft, and the screw shaft is rotated about its axis by the rotary motor. The X-axis driving mechanism 31 is fixed to the slider of the Y-axis driving mechanism 32, and placed on the rail of the Y-axis driving mechanism 32. The carrier table 3 is fixed to the slider of the X-axis driving mechanism 31, and placed on the rail of the X-axis driving mechanism 31.

[0036] The tilt mechanism 33 is an electric tilt mechanism that combines a ball screw mechanism and a cam follower mechanism and tilts a tilt target using a motor as a power source. Figure 6 shows the detailed configuration of this tilt mechanism 33. Figure 6(a) is a diagram of the carrier table 3 as seen from above, and the parts of the tilt mechanism 33 that are hidden by the carrier table 3 are shown by dashed lines. Figure 6(b) is a diagram of the carrier table 6 as seen from the side.

[0037] As shown in FIG. 6, the tilt mechanism 33 includes a rotary motor 331, a screw shaft 332, a cam 333, and a cam follower 334. The screw shaft 332 is rotated by the rotary motor 331 such as a stepping motor. The axial movement of the screw shaft 332 is restricted by a bearing 337. The cam 333 is a long cylindrical body along the screw shaft 332, and a screw groove is drilled on the inner peripheral surface of the cylinder and is screwed onto the screw shaft 332. The cam 333 includes an inclined portion 335. The inclined portion 335 rises from the outer peripheral surface of the cam 333, has a roughly right-angled triangular shape, and has an inclined surface 336 that is continuously higher along the axial direction. The cam follower 334 is movable in the Z-axis direction. The cam follower 334 is pressed against the inclined surface 336 of the cam 333 by, for example, a tension spring, and follows the inclined surface 336 of the cam 333.

[0038] In this tilt mechanism 33, when the rotary motor 331 is driven, the screw shaft 332 rotates about its axis. When the screw shaft 332 rotates about its axis, the cam 333 moves in the direction in which the screw shaft 332 extends. When the cam 333 moves, the cam follower 334 is pushed up in a direction perpendicular to the screw shaft 332 by climbing the inclined surface 336, or is lowered in a direction perpendicular to the screw shaft 332 by descending the inclined surface 336. In order to achieve both improved accuracy in parallelism adjustment and high rigidity, it is preferable that the inclined surface 336 of this inclined portion 335 has an inclination that increases in height by 1 mm or less for a horizontal movement of 10 mm.

[0039] The carrier table 3 includes three sets of the tilt mechanism 33 and is supported by three cam followers 334. That is, the tilt mechanism 33 is disposed between the arrangement of the X-axis drive mechanism 31 and the Y-axis drive mechanism 32 and the carrier table 3. The three cam followers 334 are disposed at the corner positions of an equilateral triangle and support the carrier table 3 as a tilt target. With this configuration, the tilt mechanism 33 can adjust the placement surface of the carrier table 3 to be parallel to the holding surface 51a of the transfer unit 5. The arrangement of the three cam followers 334 is not limited to an equilateral triangle arrangement, and may be an isosceles triangle arrangement. For example, the position of the cam follower 334 at the center of the front side in FIG. 6(a) may be the apex angle of an isosceles triangle, and the remaining two cam followers 334 may be disposed at both base angles of the isosceles triangle. In the case of an isosceles triangle arrangement, it is desirable that the base of the isosceles triangle be located closer to the edge opposite to the edge of the carrier base 3 on which the cam follower 334 at the apex angle is arranged than to that edge.

[0040] 4 and 5, the mounting table 4 has a mounting surface that expands two-dimensionally in the X-axis and Y-axis directions. This mounting table 4 is also movable in the X-axis and Y-axis directions, and is equipped with an X-axis drive mechanism 41 and a Y-axis drive mechanism 42 that are formed by ball screw mechanisms. The Y-axis drive mechanism 42 is mainly used for loading and unloading the substrate S placed on the mounting table 4, and is also used for aligning the substrate S with the transport unit 5 in the Y-axis direction. The X-axis drive mechanism 41 is also used for aligning the transport unit 5 with the substrate S in the X-axis direction.

[0041] The transfer section 5 is mounted on a raised platform 61 and moves autonomously along a straight line connecting the pickup position 21 and the mounting position 22 spaced apart in the X-axis direction, and is capable of descending in the Z-axis direction toward the carrier table 3 and the mounting table 4 located at the pickup position 21 and the mounting position 22.

[0042] Here, the lifting platform 61 is one step higher than the upper surface of the base 6, and extends along the arrangement of the pickup position 21 and the mounting position 22. A rail 63 is laid on the lifting platform 61 along the X-axis direction. The rail 63 is a guide for the transport unit 5 that moves between the pickup position 21 and the mounting position 22. The rail 63 has a length that reaches the carrier table 3 positioned at the pickup position 21 and the mounting table 4 positioned at the mounting position 22. The rail 63 is held by a support unit 64. The support unit 64 is a block body that supports the transport unit 5, and is further driven by a ball screw 65 that is composed of a rotation motor and a screw shaft that is axially rotated by the rotation motor.

[0043] The support part 64 extends in the Y-axis direction toward a straight line connecting the pickup position 21 and the mounting position 22. The transport part 5 is attached to an extended tip surface 67 of the support part 64. A rail 66 extending in the Z-axis direction is laid on the extended tip surface 67. The transport part 5 is attached to the support part 64 by gripping the rail 66 with a slider 591, and is slidable in the Z-axis direction.

[0044] The lifting unit 9 pushes down the transport unit 5, which is slidable in the Z-axis direction, to lower the transport unit 5 located at the pickup position 21 toward the carrier table 3, and also lowers the transport unit 5 located at the mounting position 22 toward the mounting table 4. First, a support column 62 is erected on the base 6, located behind the raising table 61 and extending higher than the transport unit 5. The upper end of this support column 62 is bent in the Y-axis direction, and protrudes up to just above the movement trajectory of the transport unit 5. The lifting unit 9 is installed on the extending tip surface 69 of this support column 62.

[0045] That is, a rail 91 extending in the Z-axis direction is laid on the extending end surface 69 of the support 62. A screw shaft 93 rotated by a rotary motor 92 is installed parallel to the rail 91 on the extending end surface 69 of the support 62. Furthermore, a contact block 94 is attached by gripping the rail 91 and screwing into the screw shaft 93. The contact block 94 descends toward the transport section 5 by being driven by the rotary motor 92, contacts the upper end of the transport section 5, and further presses down the transport section 5. The transport section 5 is biased upward by a biasing means such as a spring (not shown), and the contact block 94 presses down the transport section 5 against the biasing means. When the contact block 94 leaves the transport section 5 and the pressing force by the contact block 94 is released, the transport section 5 is returned to the raised position shown in FIG. 4 and FIG. 5 by the biasing means.

[0046] The transport unit 5 is capable of moving along the rails 63 to a position directly above the pickup position 21 and the mounting position 22. Therefore, the contact block 94 is long in the X-axis direction so as to include at least both the pickup position 21 and the mounting position 22 within its range, and is capable of abutting against and pushing down the transport unit 5 no matter where the transport unit 5 is located. The transport unit 5 may also be connected to the contact block 94 in a state in which it is movable in the X-axis direction.

[0047] 7 is a schematic diagram showing a detailed configuration of the transport section 5. The transport section 5 is configured by mounting each section on a bracket 59. The bracket 59 has a slider 591 that grips the rail 66, and the abutment block receiver 54 is mounted on the bracket 59. The abutment block receiver 54 is a member that comes into contact with the abutment block 94. The abutment block receiver 54 is pressed by the abutment block 94, causing the transport section 5 to rise and fall along the rail 66.

[0048] A head 51 is provided at the tip of the transfer unit 5 in the downward direction, and a cylinder 52 is connected to the head 51. The head 51 is a holding unit that holds the adhesive sheet A on a holding surface 51a, and heats the adhesive sheet A and the conductive bonding material formed on the substrate S by generating heat. The holding surface 51a is a flat rectangle extending parallel to the carrier table 3 and the mounting table 4. A negative pressure is applied to the head 51, and the head 51 adsorbs and holds the adhesive sheet A on the holding surface 51a by the negative pressure. The cylinder 52 is a pressure source such as an air cylinder, and applies a load to the head 51 to press the adhesive sheet A against the element E via the head 51, and also presses the element E against the substrate S via the head 51 at the mounting position 22.

[0049] Here, the head 51 has a porous structure, or has suction holes 51b, or has both a porous structure and suction holes 51b. For example, the head 51 is a ceramic mainly made of aluminum nitride or silicon nitride having a porous structure. Alternatively, the head 51 may be made of, for example, stainless steel. The inside of the porous structure or the suction holes 51b of the head 51 is connected to the air pressure circuit 12, and negative pressure is generated on the holding surface 51a through the porous structure of the head 51 and through the through holes 51b provided in the head 51, so that the adhesive sheet A is adsorbed and held.

[0050] Furthermore, a heater 56 and a blower 57 are installed inside the head 51. The heater 56 is a heating source such as a pulse heater, and heats the head 51, and the blower 57 cools the head 51 by blowing air. The heater 56 is controlled by the control means 11. Under the control of the control means 11, the heater 56 heats the head 51 while the element E is in contact with the substrate S. The heater 56 also stops or reduces heating when the element E is not in contact with the substrate S, and the blower 57 cools the head 51 when the element E is not in contact with the substrate S.

[0051] The transfer unit 5 includes a camera 55 and a θ rotation unit 53 that detect positional deviation of the head 51 and rotate the head 51 to correct the deviation, and also includes tilt mechanisms 58a and 58b that change the orientation of the holding surface 51a of the adhesive sheet A of the head 51. The camera 55 is installed beside the row of heads 51 and cylinders 52, and detects relative positional deviations between the transfer unit 5 and the carrier C, and between the transfer unit 5 and the substrate S. The θ rotation unit 53 rotates the head 51 around the Z axis to align the element E on the carrier C with the circuit pattern on the substrate S.

[0052] The tilt mechanisms 58a and 58b are manual tilt mechanisms that are connected between the cylinder 52 and the θ rotation unit 53 and tilt the tilt target by manual operation, thereby changing the orientation of the head 51. The tilt mechanisms 58a and 58b will be described in more detail with reference to Figs. 8 and 9. Fig. 8 is a diagram showing a detailed configuration of the tilt mechanism of the transfer unit viewed from a direction perpendicular to the XZ plane, and Fig. 9 is a diagram showing a detailed configuration of the tilt mechanism of the transfer unit viewed from a direction perpendicular to the YZ plane. Note that Fig. 8 shows only the detailed configuration of the tilt mechanism 58a, and Fig. 9 shows only the detailed configuration of the tilt mechanism 58b. Note that the tilt target of the tilt mechanisms 58a and 58b is the holding surface 51a of the head 51.

[0053] 8 and 9, each of the tilt mechanisms 58a and 58b includes a base 581 having a concave curved surface 582, and a sliding part 583 having a convex curved surface 584. The sliding part 583 of the tilt mechanism 58a for tilting in the XZ plane is fixed to the cylinder 52, the base 581 of the tilt mechanism 58a for tilting in the XZ plane and the sliding part 583 of the tilt mechanism 58b for tilting in the YZ plane are fixed, and the base 581 of the tilt mechanism 58b for tilting in the YZ plane is fixed to the rotation axis of the θ rotation unit 53.

[0054] The base 581 and the sliding part 583 of each of the tilt mechanisms 58a and 58b have a concave curved surface 582 and a convex curved surface 584 of the same curvature, and the concave curved surface 582 and the convex curved surface 584 are in friction with each other. The centers of the circles of the concave curved surface 582 and the convex curved surface 584 are located at the center of the holding surface 51a. While the convex curved surface 584 slides against the concave curved surface 582, the sliding part 583 rotates about the holding surface 51a of the head 51, thereby changing the orientation of the head 51.

[0055] In tilt mechanism 58a for tilting in the XZ plane, base 581 and sliding portion 583 are positioned so that concave curved surface 582 and convex curved surface 584 extend in the X-axis direction drawing an arc. The shapes of concave curved surface 582 and convex curved surface 584 in a cross section along the XZ plane are mountain-shaped, and the shapes of concave curved surface 582 and convex curved surface 584 in a cross section along the YZ plane are flat. Therefore, tilt mechanism 58a causes head 51 to swing along the XZ plane.

[0056] In addition, in the tilt mechanism 58b for tilting in the YZ plane, the base 581 and the sliding part 583 are positioned so that the concave curved surface 582 and the convex curved surface 584 extend in the Y-axis direction while drawing an arc. The shapes of the concave curved surface 582 and the convex curved surface 584 in a cross section along the YZ plane are mountain-shaped, and the shapes of the concave curved surface 582 and the convex curved surface 584 in a cross section along the XZ plane are flat. Therefore, the tilt mechanism 58b causes the head 51 to swing along the YZ plane. In this way, the tilt mechanisms 58a and 58b move the head 51 along the XZ plane and the YZ plane, thereby making it possible to adjust the holding surface 51a to be parallel to the mounting surface of the mounting table 4.

[0057] These tilt mechanisms 58a and 58b further include an adjustment unit 585. The adjustment unit 585 has the same structure as, for example, a micrometer, and includes a knob 586, a frame 587, and a spindle 588. The knob 586 corresponds to the thimble of a micrometer, and has a scale on its periphery. When the knob 586 is manually turned in units of one scale, the spindle 588 advances or retreats from the frame 587 in units of one scale, and the amount of protrusion changes with the frame 587 as the base end. For example, when the knob 586 is turned clockwise, the spindle 588 extends. When the knob 586 is turned counterclockwise, the spindle 588 contracts. The frame 587 is urged toward the base 581 by a tension spring 589, and the tip of the spindle 588 is always pressed against the side of the base 581.

[0058] Therefore, when the spindle 588 extends, the frame 587 is pushed in a direction away from the base 581. When the spindle 588 retracts, the frame 587 approaches the base 581. The frame 587 is directly or indirectly fixed to the sliding part 583. Therefore, when the spindle 588 expands and contracts and the frame 587 approaches or moves away from the base 581, the sliding part 583 is dragged by the frame 587 according to the displacement and displacement direction of the position of the frame 587, and the convex curved surface 584 moves while rubbing against the concave curved surface 582, changing its direction. In this way, the tilt mechanisms 58a and 58b tilt the tilting target, that is, the holding surface 51a, by manually operating the knob 586.

[0059] In the tilt mechanisms 58a and 58b, it is desirable that the orientation of the sliding portion 583, in other words the orientation of the holding surface 51a, is displaced by 0.0003° to 0.15° when the knob 586 is rotated once. That is, if the length of one side of the holding surface 51a is, for example, 20 mm, it is desirable that the height difference between the opposing sides of the holding surface 51a is displaced by 0.1 μm to 50 μm when the knob 586 is rotated once. If it is below this range, the efficiency of adjusting the tilt of the holding surface 51a is impaired, and if it is above this range, the holding surface 51a changes significantly in response to the operation of the knob 586, making it difficult to adjust the holding surface 51a to the desired tilt.

[0060] The range of 0.0003° to 0.15° is for the following reasons. First, as a result of intensive research, it was found that by suppressing the difference between the minimum and maximum distances of the holding surface 51a, each of which has a side length of 20 mm, to the mounting surface of the carrier table 3 to 2 μm or less, 98% or more of the elements E that fit within the adhesive area A1 can be picked up. Specifically, 251 of the 256 elements E (16 rows x 16 columns) that fit within the adhesive area A1 were picked up. Therefore, if the difference between the minimum and maximum distances of the holding surface 51a to the mounting surface of the carrier table 3 is 1 μm, all of the elements E will be picked up more reliably.

[0061] Therefore, when the holding surface 51a has a side with a width of 20 mm, it is most efficient that the difference between the minimum distance and the maximum distance can be changed in units of 1 μm or less. In other words, it is most efficient that the angle formed between one side of the holding surface 51a and the mounting surface of the carrier table 3 can be changed in units of 0.003°. Since there are 50 graduations around the knob 586, in order to be able to change the angle by 0.003° per graduation, when converted into one rotation of the knob 586, it is sufficient that the angle can be changed by a maximum of 0.15° per rotation.

[0062] Furthermore, if the number of rotations of knob 586 required to change by 1 μm is approximately 10 or less, this is practically tolerable from the viewpoint of adjustment efficiency. In other words, if one rotation of knob 586 results in a change of 0.1 μm, this is practically tolerable. In other words, one rotation of knob 586 should result in a change of at least 0.0003°.

[0063] Incidentally, even in the electric tilt mechanism 33 driven by the rotary motor 331, from the viewpoint of tilt adjustment efficiency, it is sufficient that the mounting surface of the carrier table 3 can be displaced by 0.0003° or more and 0.15° or less per one rotation of the rotary shaft of the rotary motor 331.

[0064] (operation) (Adjustment operation) A description will be given of the operation of such an element mounting apparatus 1. First, prior to the mounting process of the element E, the parallelism between the holding surface 51a of the transport unit 5 and the mounting surface of the mounting table 4 and the parallelism between the holding surface 51a of the transport unit 5 and the mounting surface of the carrier table 3 are adjusted.

[0065] For example, pressure-sensitive paper is placed on the mounting surface of the mounting table 4 so that the pressure distribution can be detected. After the pressure-sensitive paper is placed on the mounting surface of the mounting table 4, the transfer unit 5 is lowered toward the mounting table 4 and the holding surface 51a of the transfer unit 5 is pressed against the pressure-sensitive paper. After the transfer unit 5 is raised, the pressure-sensitive paper is removed and the pressure distribution is observed. If the outline mark of the holding surface 51a remains evenly on the pressure-sensitive paper, the holding surface 51a of the transfer unit 5 and the mounting surface of the mounting table 4 are kept parallel to each other.

[0066] On the other hand, if a part of the external mark of the holding surface 51a is missing, the missing area is an area where the holding surface 51a and the mounting surface of the mounting table 4 are not in contact, and the holding surface 51a of the transport unit 5 is greatly inclined with respect to the mounting surface of the mounting table 4 so that the missing area is away from the mounting surface of the mounting table 4. The area where the mark is light is an area where the holding surface 51a and the mounting surface of the mounting table 4 are in contact but the load is too light, and the holding surface 51a of the transport unit 5 is still inclined with respect to the mounting surface of the mounting table 4 so that the area where the mark is light is away from the mounting surface of the mounting table 4. The area where the mark is dark is an area where the holding surface 51a and the mounting surface of the mounting table 4 are in excessive contact and an excessive load is applied, and the holding surface 51a of the transport unit 5 is inclined with respect to the mounting surface of the mounting table 4 so that the area where the mark is dark is closer to the mounting surface of the mounting table 4.

[0067] While referring to the impression on the pressure-sensitive paper, the operator turns the knob 586 of the adjustment unit 585 to tilt the head 51 along the XZ plane or along the YZ plane. This impression display and tilt adjustment is repeated until the outline mark of the holding surface 51a is uniformly left on the pressure-sensitive paper. This keeps the holding surface 51a of the transfer unit 5 and the mounting surface of the mounting table 4 parallel with high precision. Here, parallel includes not only perfect parallelism, but also a deviation within a range that allows multiple rows and columns of elements E to be mounted at once. Note that, as long as the pressure distribution can be detected, it is not limited to pressure-sensitive paper, and a pressure distribution meter with an array of strain sensors or a touch panel capable of simultaneous detection of multiple points may be placed on the device.

[0068] Next, after completing the adjustment of the parallelism between the holding surface 51a of the transfer unit 5 and the mounting surface of the mounting table 4, pressure-sensitive paper is placed on the mounting surface of the carrier table 3 so that the pressure distribution can be detected. After the pressure-sensitive paper is placed on the mounting surface of the carrier table 3, the transfer unit 5 is lowered toward the carrier table 3, and the holding surface 51a of the transfer unit 5 is pressed against the pressure-sensitive paper. After the transfer unit 5 is raised, the pressure-sensitive paper is removed and the pressure distribution is observed. The operator tilts the carrier table 3 while referring to the impression on the pressure-sensitive paper.

[0069] For example, the tilt mechanism 33 of the carrier table 3 raises or lowers the cam follower according to an operation signal input from outside. For example, an operation means such as a teaching pendant is connected to the control means 11, and a user inputs a tilt instruction to the tilt mechanism 33 by pressing buttons for tilting in the XZ plane and tilting in the YZ plane, and by the number of times the buttons are pressed and the time the buttons are pressed. For example, the tilt direction is determined according to the pressed button, and the amount of tilt is determined by the number of times the buttons are pressed and the time the buttons are pressed. The control means 11 calculates the amount of operation of the three tilt mechanisms 33 according to the pressed button, the number of times the buttons are pressed and the time the buttons are pressed, and outputs a control signal to instruct each tilt mechanism 33 to drive.

[0070] This keeps the holding surface 51a of the transfer section 5 and the placement surface of the carrier table 3 parallel with high accuracy. Here, "parallel" includes not only perfect parallelism, but also a deviation within a range that allows multiple rows and columns of elements E to be picked up all at once. Although an example in which the tilt mechanism 33 is tilted in response to an operation by an operator has been described, the tilt mechanism 33 may be configured to tilt automatically without being operated by an operator. For example, the impression on the pressure-sensitive paper may be detected by a camera 55 provided on the transfer section 5, or a displacement sensor may be installed on the transfer section 5 to enable multi-point measurement, to detect the distances between each point on the holding surface 51a of the transfer section 5 and each point on the placement surface of the carrier table 3.

[0071] In the detection of indentations by the camera 55, the control means 11 refers to the image output from the camera 55 and judges the presence or absence of a mark and the shade of the mark based on the brightness value of each pixel. The brightness value indicates the presence or absence of contact and the contact load, and the control means 11 generates a control signal to move a portion with a relatively small brightness value closer to the transfer section 5 according to the value and a portion with a relatively large brightness value farther away from the transfer section 5 according to the value, and outputs the control signal to the tilt mechanism 33. When a displacement sensor is used, the control means 11 generates a control signal to move a portion with a relatively long distance closer to the transfer section 5 according to the distance value and a portion with a relatively short distance farther away from the transfer section 5 according to the distance value, and outputs the control signal to the tilt mechanism 33. In the tilt mechanism 33, the three rotary motors rotate in a direction according to the control signal by a rotation angle according to the control signal, and each cam follower 334 moves up and down.

[0072] The camera 55 or laser measuring device may also be used when operating the tilt mechanisms 58a and 58b of the transport section 5. A monitor such as an organic EL display or a liquid crystal display capable of displaying at least character strings is connected to the control means 11. The control means 11 converts the results from the camera 55 or the displacement sensor into the direction and amount of rotation of the knob 586, and displays it on the monitor. The operator can operate each of the knobs 586 of the tilt mechanisms 58a and 58b by referring to the information on the direction and amount of rotation of the knob 586.

[0073] (Implementation Operation) Next, the mounting operation of the element mounting apparatus 1 will be described. Fig. 10 is a flowchart showing the operation of the element mounting apparatus 1. First, an adhesive sheet A is attached to the head 51 of the transfer section 5 (step S01). The transfer section 5 holding the adhesive sheet A moves to the pick-up position 21 (step S02). At the pick-up position 21, the carrier table 3 waits with a carrier C placed on it. That is, the central position of a group of elements E in multiple rows and columns (hereinafter referred to as "group of elements E to be picked up") to be picked up by the transfer section 5 this time among the elements E stored in an array on the carrier C is positioned at the pick-up position 21 and waits.

[0074] When the transfer unit 5 reaches the pick-up position 21, the transfer unit 5 is aligned with the carrier C, i.e., the group of elements E to be picked up (step S03). In step S03, the camera 55 photographs the group of elements E to be picked up. The image from the camera 55 is analyzed by the control means 11, and when positional misalignment in the X-axis and Y-axis directions and orientation misalignment around the Z-axis between the transfer unit 5 and the group of elements E to be picked up is detected, the transfer unit 5 and the carrier table 3 move relative to each other to eliminate these misalignments. In the case of misalignment in the X-axis direction, since both the transfer unit 5 and the carrier table 3 can move in the X-axis direction, one or both are operated.

[0075] The detection of the misalignment is performed by detecting the positions of two elements E located on a diagonal of one of the group of elements E shown in the image through image processing. In the image processing, binarization or contour emphasis may be performed to clarify the diagonal of the group of elements E. Then, the midpoint of the diagonal is calculated, and the difference between the calculation result and the reference point in the image is taken. This difference is the positional misalignment in the X-axis and Y-axis directions between the transfer unit 5 and the group of elements E to be picked up. In addition, the misalignment of the direction around the Z-axis is eliminated by operating the θ rotation unit 53 so that one diagonal of the group of elements E shown in the image coincides with the reference line.

[0076] Once the alignment between the transfer unit 5 and the group of elements E to be picked up is complete, the transfer unit 5 picks up the group of elements E to be picked up from the carrier C (step S04). In this step S04, the lift unit 9 lowers the transfer unit 5 toward the carrier C of the carrier table 3, and presses the attached adhesive sheet A against the group of elements E to be picked up. The adhesive sheet A has adhesive force all over the adhesive area A1. Therefore, all of the elements E that fit within the projection area of ​​the adhesive sheet A, that is, all of the group of elements E to be picked up, are attached to the adhesive sheet A.

[0077] Here, the tilt mechanism 33 that tilts the carrier table 3 keeps the holding surface 51a of the transfer unit 5 and the mounting surface of the carrier table 3 parallel with high precision as described above. Therefore, all of the elements E of the group of elements E to be picked up can be reliably pressed against the adhesive sheet A. As a result, all of the elements E that fit into the adhesive area A1 from the carrier C are not missed, and some of the elements E are not damaged by an excessive load, and all of the elements E are picked up collectively with high precision.

[0078] When the group of elements E is transferred to the adhesive sheet A, the transfer unit 5 moves from the pickup position 21 to the mounting position 22 (step S05). At this time, the mounting table 4 waits at the mounting position 22 with the substrate S placed thereon. That is, the center position of the area (hereinafter referred to as the "planned mounting area") in which the group of elements E is to be mounted by the transfer unit 5 in multiple rows and columns this time among the circuit patterns formed on the substrate S is positioned at the mounting position 22 and waits. When the transfer unit 5 reaches the mounting position 22, the transfer unit 5 is aligned with the planned mounting area on the substrate S (step S06). The camera 55 photographs the circuit pattern of the planned mounting area. Then, the control means 11 detects the positional deviations in the X-axis direction and the Y-axis direction and the orientation deviation around the Z-axis between the transfer unit 5 and the planned mounting area, and moves the transfer unit 5 and the mounting table 4 relatively to eliminate the deviations. In detecting the deviations, for example, the positional deviations and orientation deviations may be calculated based on the electrode pads on the circuit pattern present at the diagonal corners of the planned mounting area.

[0079] When the alignment between the transfer unit 5 and the substrate S is completed, the transfer unit 5 mounts the group of elements E on the substrate S (step S07).

[0080] In step S07, the lifting unit 9 lowers the transfer unit 5, and the transfer unit 5 presses the group of elements E collectively against the substrate S. That is, the rotary motor 92 is operated, and the abutment block 94 is lowered toward the transfer unit 5. The abutment block 94 abuts against the abutment block receiver 54 of the transfer unit 5, and presses the entire transfer unit 5 toward the substrate S, causing the group of elements E to abut against the substrate S. At this time, the pressure required for pressing is supplied to the cylinder 52, so that the group of elements E is pressed against the substrate S with a predetermined pressure.

[0081] In step S07, when the element E group contacts the substrate S, the heater 56 heats the head 51 to a process temperature T2, which is higher than the peeling temperature T1 of the adhesive sheet A, for bonding the element E group to the substrate S with a conductive bonding material. Heating may be started before the element E group contacts the substrate S, so that the temperature of the head 51 passes the peeling temperature T1 immediately after the element E group contacts the substrate S. The heat of the head 51 is transferred to the adhesive sheet A, and is further transferred from the adhesive sheet A to the conductive bonding material via the element E group. Therefore, the adhesive force of the adhesive sheet A is lost or reduced, the element E group is peeled off from the adhesive sheet A, and the element E group is placed on the substrate S side. That is, the element E group attached to the adhesive sheet A is transferred from the adhesive sheet A to the substrate S without remaining on the adhesive sheet A. Furthermore, when the head 51 reaches the process temperature T2, the element E group is bonded to the substrate S with a conductive bonding material.

[0082] Moreover, the holding surface 51a of the transfer unit 5 and the mounting surface of the mounting table 4 are kept parallel with high precision by the tilt mechanisms 58a and 58b that tilt the head 51 of the transfer unit 5, as described above. Therefore, all of the elements E held by the adhesive sheet A can be reliably pressed against the substrate S. As a result, all of the held elements E are bonded to the substrate S with high precision, and no part of the elements E is damaged by an excessive load, and all of the elements E are released to the substrate S together with high precision.

[0083] The adhesive sheet A held by the transfer unit 5 has a size and shape that includes elements E in m rows and n columns. The carrier C is assumed to have elements E stocked in a×m rows and b×n columns. Also, the substrate S is assumed to have room for mounting elements E in c×m rows and d×n columns. a, b, c, and d are positive real numbers, preferably natural numbers. In this case, the transfer unit 5 moves back and forth between the pickup position 21 and the mounting position 22, and repeats mounting of elements E until all elements E are picked up from the carrier C or until all elements E are placed in the mounting space of the substrate S. The adhesive sheet A is replaced each time a series of processes of picking up and mounting elements E is completed. In addition, considering that the transfer unit 5 removes all elements E from the carrier C without any surplus and mounts all elements E on the circuit pattern of the substrate S without any surplus, it is preferable that a, b, c, and d are natural numbers.

[0084] (effect) As described above, the element mounting apparatus 1 includes the carrier table 3, the mounting table 4, the transport unit 5, and the tilt mechanisms 33, 58a, and 58b. The carrier table 3 is a supply table on which the carrier C on which the elements E are arranged in an array is placed. The mounting table 4 is a substrate S on which the elements E are arranged in an array is placed. The transport unit 5 moves between the carrier table 3 and the mounting table 4, and picks up multiple rows and columns of elements E from the carrier C all at once, and transfers the picked up multiple rows and columns of elements E to the substrate S all at once. The tilt mechanisms 33, 58a, and 58b make it possible to adjust the placement surface of the carrier table 3, the holding surface 51a of the transport unit 5, and the placement surface of the mounting table 4 so as to be parallel to each other.

[0085] This allows all of the elements E to be picked up at once from the carrier C without missing any of them and without applying an excessive load to some of the elements E. In addition, all of the held elements E can be bonded to the substrate S with high precision and can be removed at once without applying an excessive load to some of the elements E.

[0086] The transfer section 5 is also provided with tilt mechanisms 58a and 58b, which are manual tilt mechanisms. The tilt mechanisms 58a and 58b do not have a power source such as a rotary motor, and therefore the transfer section 5 can be made smaller and lighter. This allows the transfer section 5 to move at high speed, improving the speed at which elements E are mounted. Furthermore, the force of inertia when the transfer section 5 is stopped at the carrier table 3 and the mounting table 4 can be reduced, and the transfer section 5 can be stopped at the pickup position 21 and the mounting position 22 with high accuracy. This reduces pick-up and mounting errors of elements E, improving yield.

[0087] Furthermore, the tilt mechanisms 58a and 58b are configured to tilt the holding surface 51a by 0.0003° or more and 0.15° or less when the knob is rotated once. This makes it possible to highly effectively achieve both a reduction in the time required for adjusting the parallelism and an improvement in the moving speed of the transfer section 5, thereby improving production efficiency. In addition, it is possible to highly effectively achieve both an improvement in the accuracy of adjusting the parallelism and a reduction in pick-up errors and mounting errors of the elements E, further improving the yield.

[0088] In addition, the carrier table 3 is provided with a tilt mechanism 33, which is an electric tilt mechanism. This allows the holding surface 51a of the transfer unit 5 and the mounting surface of the carrier table 3 to be adjusted to be parallel with high precision, reducing mistakes in picking up the elements E. In addition, since the parallelism adjustment is completed in a short time, the process can be quickly moved to the mounting process, improving production efficiency.

[0089] Furthermore, this tilt mechanism 33 tilts the mounting surface of the carrier table 3 in the range of 0.0003° to 0.15° when the rotary motor 331 rotates once. This makes it possible to highly effectively achieve both a reduction in the time required for parallelism adjustment and an improvement in accuracy, and highly effectively reduces pick-up errors and mounting errors of the elements E, improving yield. Also, the inclined surface 336 of the inclined portion 335 has an inclination that rises in height by 1 mm or less for a horizontal movement of 10 mm. This makes it possible to achieve both an improvement in the accuracy of parallelism adjustment and high rigidity.

[0090] In addition, as long as the mounting surface of the carrier table 3, the holding surface 51a of the transfer unit 5, and the mounting surface of the mounting table 4 can be adjusted to be parallel, either the tilt mechanisms 58a and 58b which are manual tilt mechanisms or the tilt mechanism 33 which is an electric tilt mechanism may be mounted on the transfer unit 5 and the carrier table 3. In addition, either the tilt mechanisms 58a and 58b which are manual tilt mechanisms or the tilt mechanism 33 which is an electric tilt mechanism may be mounted on the mounting table 4.

[0091] For example, the tilt mechanism 33 mounted on the carrier table 3 may be provided on the mounting table 4. In this case, the tilt mechanisms 58a and 58b of the transfer unit 5 adjust the parallelism between the mounting surface of the carrier table 3 and the holding surface 51a of the transfer unit 5. In addition, the tilt mechanism 33 of the mounting table 4 adjusts the parallelism between the holding surface 51a of the transfer unit 5 and the mounting surface of the mounting table 4.

[0092] Further, the transfer unit 5 may be equipped with a tilt mechanism 33, which is an electric tilt mechanism, instead of the tilt mechanisms 58a and 58b, which are manual tilt mechanisms. That is, the control means 11 stores tilt information of the holding surface 51a when the transfer unit 5 is located at the pick-up position 21. Then, when the transfer unit 5 is located at the pick-up position 21, the control means 11 operates the tilt mechanism 33 according to the tilt information of the holding unit 51a, so that the holding surface 51a of the transfer unit 5 and the mounting surface of the carrier table 3 are parallel to each other. Further, the control means 11 stores tilt information of the holding surface 51a when the transfer unit 5 is located at the mounting position 22. Then, when the transfer unit 5 is located at the mounting position 22, the control means 11 operates the tilt mechanism 33 according to the tilt information of the holding unit 51a, so that the holding surface 51a of the transfer unit 5 and the mounting surface of the mounting table 4 are parallel to each other.

[0093] In this case, the mechanism for tilting the carrier table 3 and the mounting table 4 can be eliminated, and the cost of the element mounting device can be reduced. In addition, it is also possible that the carrier C with warping or undulation and the substrate S with warping or undulation are carried into the element mounting device. Even in this case, if the transfer unit 5 is equipped with the tilt mechanism 33, which is an electric tilt mechanism, the holding surface 51a can be tilted according to the degree of warping or undulation of the carrier C occurring in the area where the element E is to be picked up by acquiring and storing information on the warping or undulation of the substrate S in advance. In addition, if the transfer unit 5 is equipped with the tilt mechanism 33, which is an electric tilt mechanism, the holding surface 51a can be tilted according to the degree of warping or undulation of the substrate S occurring in the area where the element E is to be mounted by acquiring and storing information on the warping or undulation of the substrate S in advance.

[0094] The degree of warping or swell of the carrier C and the degree of warping or swell of the substrate S may be detected by an image captured by the camera 55 or a displacement sensor that measures position using a multipoint measurement laser light installed in the transfer section 5. A method for detecting the degree of warping based on an image may involve, for example, installing lighting, shining light on the carrier C and the substrate S, and detecting the direction and length of the shadow that is generated. Note that similar measures can be taken when warping or swell occurs on the mounting surface of the carrier table 3 or the mounting surface of the mounting table 4, in addition to the carrier C and the substrate S.

[0095] Furthermore, it is also possible to provide a tilt mechanism similar to the tilt mechanism 33 mounted on the carrier table 3 on the mounting table 4, and eliminate the tilt mechanisms 58a and 58b of the transfer unit 5. In this case, the tilt mechanisms 33 are adjusted so that the mounting surface of the carrier table 3 and the mounting surface of the mounting table 4 are parallel to the holding surface 51a of the transfer unit 5. With this configuration, the weight of the transfer unit 5 that moves between the carrier table 3 and the mounting table 4 can be reduced by the weight of the tilt mechanisms 58a and 58b, thereby stabilizing and improving the accuracy of the transfer operation.

[0096] When the mounting table 4 is provided with the tilt mechanism 33, it is particularly useful in terms of mounting accuracy of the element E that the inclined surface 336 of the inclined portion 335 has an inclination that rises in height by 1 mm or less for a horizontal movement of 10 mm. First, when the element E is mounted on the mounting table 4, a load of several hundred newtons is applied by the transfer unit 5. This load generates a force that moves the inclined portion 335 and the cam follower 334 relatively in the horizontal direction. However, since the inclined portion 335 is configured to move by the rotation of the screw shaft 332, it is difficult to move horizontally even when an external force is applied. Therefore, the force that moves horizontally acts on the cam follower 334 and the mounting surface of the mounting table 4 to which the cam follower 334 is attached. When mounting the element E, if the mounting surface is displaced horizontally due to this horizontal moving force, it causes a decrease in mounting accuracy. And, the force that moves horizontally becomes larger as the inclination of the inclined surface 336 becomes larger. However, as a result of intensive research, the inventors have experimentally found that inclined surface 336 of inclined portion 335 should be inclined so that the height rises by 1 mm or less for a horizontal movement of 10 mm. This makes it possible to suppress the positional deviation of the mounting surface caused by the load applied when mounting element E to a level that does not affect the mounting accuracy of element E.

[0097] In addition, tilt mechanism 33 has been described as an electric tilt mechanism, but tilt mechanisms 58a and 58b equipped with a rotary motor connected to knob 586 electrically rotate knob 586 and are included in the electric tilt mechanism.

[0098] In addition, although an example in which the adhesive sheet A is used as the holding mode of the holding surface 51a has been described, this is not limiting, and methods such as vacuum adsorption and electrostatic adsorption may be used. When vacuum adsorption is used, suction holes are formed in multiple rows and columns on the holding surface 51a of the transfer unit 5. The suction holes are connected to an air pressure circuit 12 having a compressor and an ejector, and negative pressure is generated in the suction holes. The transfer unit 5 picks up the element E by sucking the element to the suction hole by the negative pressure, and releases the element E from the substrate S by releasing the negative pressure by breaking the vacuum or opening to the atmosphere. When electrostatic adsorption is used, mesa structures are formed in multiple rows and columns on the holding surface 51a. An electrode and a dielectric layer are provided on the mesa structure. The electrostatic force generating unit having this mesa structure becomes a local adsorption point for the element E.

[0099] Second Embodiment Fig. 11 is a schematic diagram of a device mounting device 1 according to the second embodiment. In Fig. 11, the same configurations and functions as those in the first embodiment are denoted by the same reference numerals, and the dimensions, shapes, etc. of characteristic parts in the second embodiment are exaggerated compared to their actual size.

[0100] The device mounting apparatus 1 is also provided with a tilt mechanism 33 mounted on the carrier table 3 on the mounting table 4. The tilt mechanisms 58a and 58b of the transport unit 5 are electric tilt mechanisms. That is, the tilt mechanisms 58a and 58b are provided with a rotary motor connected to the knob 558, and electrically rotate the knob 586. The device mounting apparatus 1 is further provided with a laser measuring device 7 as an example of a displacement sensor. The laser measuring device 7 is provided on the carrier table 3, the mounting table 4, and the transport unit 5. The laser measuring device 7 emits a laser beam toward the object to be measured and receives the reflected light from the object to be measured. The laser measuring device 7 calculates the distance of the object to be measured from the time required to receive the light, for example, or calculates the distance of the object to be measured from the phase difference between the incident and outgoing light. The displacement sensor is not limited to this, and may be, for example, a sensor that measures the position by ultrasonic waves, as long as the object to be measured that is separated from the sensor can be measured.

[0101] These laser measuring devices 7 are used to measure the inclination of the holding surface 51a of the transfer section 5 at the pickup position 21 and the mounting position 22, the inclination of the mounting surface of the carrier table 3, and the inclination of the mounting surface of the mounting table 4. Then, in the element mounting apparatus 1, based on the measurement results, the parallelism between the holding surface 51a and the mounting surface of the carrier table 3 is adjusted, and the parallelism between the holding surface 51a and the mounting surface of the mounting table 4 is also adjusted.

[0102] First, the laser measuring device 7 of the transfer unit 5 measures the position of each point on the mounting surface of the carrier table 3 at the pickup position 21, and measures the position of each point on the mounting surface of the mounting table 4 at the mounting position 22. The positioning results are input to the control means 11 and become parameters for calculating the inclination of the mounting surface of the carrier table 3 and the mounting surface of the mounting table 4. That is, the laser measuring device 7 of the transfer unit 5 is installed on a line segment connecting the pickup position 21 and the mounting position 22, and can reach the pickup position 21 and the mounting position 22 by the movement of the transfer unit 5 in the X-axis direction. The laser measuring device 7 is fixed to a bracket 59 (see FIG. 7) so as to emit a laser beam downward along the Z-axis. The laser measuring device 7 fixed to the bracket 59 is not affected by the rotation and tilt change by the θ rotation unit 53 and the tilt mechanisms 58a and 58b. The laser measuring device 7 is located to the side of the head 51 so as not to interfere with the pick-up and mounting of the element E, and the lowest end portion is located at a position higher than the holding surface 51a.

[0103] The laser measuring instruments 7 of the carrier table 3 and the mounting table 4 are mounted on horizontal plates 34 provided on the carrier table 3 and the mounting table 4, respectively. The horizontal plate 34 of the carrier table 3 extends horizontally along the XY plane, and is translated along the XY plane together with the carrier table 3 by the X-axis driving mechanism 31 and the Y-axis driving mechanism 32. The horizontal plate 34 of the mounting table 4 also extends horizontally along the XY plane, and is translated along the XY plane together with the mounting table 4 by the X-axis driving mechanism 41 and the Y-axis driving mechanism 42.

[0104] The laser measuring device 7 of the carrier table 3 measures the position of each point in the holding surface 51a at the pickup position 21, and the laser measuring device 7 of the mounting table 4 measures the position of each point in the holding surface 51a at the mounting position 22. The positioning results are input to the control means 11 and become parameters for calculating the inclination of the holding surface 51a at the pickup position 21 and the mounting position 22. That is, the laser measuring device 7 of the carrier table 3 is fixed to a position that can reach the pickup position 21 by driving the X-axis driving mechanism 31 and the Y-axis driving mechanism 32, and the laser measuring device 7 of the mounting table 4 is fixed to a position that can reach the mounting position 22 by driving the X-axis driving mechanism 41 and the Y-axis driving mechanism 42. Moreover, these laser measuring devices 7 are fixed to the horizontal plate 34 so as to emit laser light upward along the Z-axis direction.

[0105] The control means 11 calculates each tilt from the positioning result of the laser measurement instrument 7. Then, the control means 11 controls the tilt mechanisms 58a and 58b based on the tilt angle of the holding surface 51a to adjust the tilt of the holding surface 51a, and also controls each tilt mechanism 33 based on the tilt angle of the mounting surfaces of the carrier table 3 and the mounting table 4 to adjust the tilt of each mounting surface. The control means 11 can be equipped with a display unit 11a. The display unit 11a is a liquid crystal display, an organic EL display, or the like, and visually displays information.

[0106] 12 is a flowchart showing the operation of the control means 11 to detect and adjust the inclination of the holding surface 51a at the mounting position 22. Note that the operation of detecting and adjusting the inclination of the holding surface 51a at the pick-up position 21 is the same except that the position is the pick-up position 21 and that the laser measuring device 7 of the carrier table 3 is used, and therefore a description thereof will be omitted.

[0107] First, as shown in Fig. 13, the control means 11 controls the ball screw 65 to position the holding surface 51a of the transfer unit 5 at the mounting position 22 (step S11). The control means 11 also controls the X-axis drive mechanism 41 and the Y-axis drive mechanism 42 to make the laser measuring device 7 of the mounting table 4 face the holding surface 51a located at the mounting position 22 (step S12). Next, while moving the mounting table 4 in the X-axis direction (step S13), the control means 11 uses the laser measuring device 7 of the mounting table 4 to irradiate laser light toward multiple points within the holding surface 51a (step S14). Then, the control means 11 measures the distances to the multiple points (step S15).

[0108] In steps S13 and S14, three laser light irradiation points Lp are set in each of both edge regions of the holding surface 51a extending in the X-axis direction, as shown in Fig. 14(a), for example. The three laser light irradiation points Lp are preferably as far apart as possible, and may be set at the corners at both ends of the edge and at the center of the edge.

[0109] That is, in step S12, first, the mounting table 4 is moved so that one of the corners of the holding surface 51a faces the laser measuring instrument 7. The control means 11 prestores the X-axis direction movement distance and the Y-axis direction movement distance required for the laser measuring instrument 7 to face one of the corners of the holding surface 51a. The control means 11 converts the X-axis direction movement distance and the Y-axis direction movement distance into an analog or pulse current or voltage signal and outputs it to the X-axis driving mechanism 41 and the Y-axis driving mechanism 42. For example, the X-axis direction movement distance and the Y-axis direction movement distance starting from the origin position of the mounting table 4 are stored. In this case, the mounting table 4 is first returned to the origin position, and then controlled according to the X-axis direction movement distance and the Y-axis direction movement distance. Alternatively, if the current position of the mounting table 4 is stored, the difference between the X-axis direction movement distance and the Y-axis direction movement distance and the current position is calculated, and control is performed according to the difference.

[0110] The control means 11 also stores in advance the distance between the three laser light irradiation points Lp arranged in the X-axis direction. After the laser measuring device 7 is placed directly opposite one of the corners of the holding surface 51a and the first laser light is emitted, the control means 11 moves the laser measuring device 7 of the mounting table 4 by the pre-stored distance in the X-axis direction toward the next laser light irradiation point Lp. Then, the control means 11 causes the laser measuring device 7 of the mounting table 4 to emit the laser light toward the next laser light irradiation point Lp. Furthermore, after irradiating the laser light to the laser light irradiation point Lp at the center of the side, the control means 11 moves the laser measuring device 7 of the mounting table 4 by the pre-stored distance in the X-axis direction toward the next laser light irradiation point Lp at the opposite corner. Then, the control means 11 causes the laser measuring device 7 of the mounting table 4 to emit the laser light.

[0111] After changing the laser light irradiation point Lp along one side, three more laser light irradiation points Lp are set along the opposing side. The control means 11 stores in advance the Y-axis direction separation distance of the opposing sides. The control means 11 moves the laser measurement device 7 of the mounting table 4 by this Y-axis direction separation distance to control the laser light emission, and irradiates the laser light to the three laser light irradiation points Lp on the opposing side.

[0112] When the multiple points irradiated with the laser light are positioned (step S15), the control means 11 calculates the inclination of the holding surface 51a with respect to the X-axis from the positioning results (step S16). In the inclination calculation, the distance moved in the X-axis direction to irradiate the three laser light irradiation points Lp with the laser light and the difference in the positioning results of the three laser light irradiation points LP may be based on. Since the arrangement of the laser light irradiation points Lp is obtained for two lines, for example, each line may be used to obtain the inclination angle of each and average them. Furthermore, in order to obtain a lot of angle information and increase the accuracy, steps S13 to S15 may be repeated a predetermined number of times to take the average of multiple angles. Depending on the inclination with respect to the Y-axis, there may be cases where the measurement results for one line cannot be obtained, so the advantage of redundancy can be enjoyed by positioning the laser light irradiation points Lp for two lines.

[0113] After the calculation of the inclination of the holding surface 51a in the X-axis direction is completed, the control means 11 moves the mounting table 4 along the Y-axis direction (step S17) while irradiating a laser beam onto a plurality of points on the holding surface 51a using the laser measuring device 7 of the mounting table 4 (step S18). Then, the control means 11 measures the distances to each of the plurality of points (step S19). After measuring the distances to each of the plurality of points, the control means 11 calculates the inclination of the holding surface 51a with respect to the Y-axis from the positioning results (step S20).

[0114] In steps S17 and S18, as shown in FIG. 14B, for example, three laser light irradiation points Lp are set in each of both edge regions of the holding surface 51a extending in the Y-axis direction. The three laser light irradiation points Lp are preferably as far apart as possible, and may be set at the corners at both ends of the edge and at the center of the side. The control means 11 may move the laser measuring device 7 of the mounting table 4 according to the separation distance of the three laser light irradiation points Lp arranged in the Y-axis direction, starting from the final irradiation point of the total of six laser light irradiation points Lp in both edge regions extending in the X-axis direction, and may also move the laser measuring device 7 of the mounting table 4 to the second line according to the separation distance in the Y-axis direction of the opposing sides.

[0115] After calculating the tilt angles of the holding surface 51a with respect to the X-axis and the Y-axis, the control means 11 displays the tilt angles with respect to the X-axis and the Y-axis on the display unit 11a (step S21). If the tilt of the holding surface 51a with respect to the horizontal plate 34 is large, that is, if it exceeds the allowable tilt (step S22, Yes), the control means 11 controls the tilt mechanisms 58a and 58b according to the calculation result, changes the tilt angle of the holding surface 51a (step S23), and starts over from step S12. If the tilt of the holding surface 51a is small, that is, if it is within the allowable range of tilt (step S22, No), the tilt angle of the holding surface 51a is stored (step S24), and the detection and adjustment of the tilt of the holding surface 51a is completed.

[0116] It is not necessary to strictly correct the inclination angle of the holding surface 51a. What needs to be adjusted in parallelism is the relationship between the holding surface 51a and the mounting surface of the mounting table 4, and also the relationship between the holding surface 51a and the mounting surface of the carrier table 3. It is sufficient that the inclination angle is within the inclination change limit of the mounting surface of the mounting table 4 and the mounting surface of the carrier table 3.

[0117] Once the holding surface 51a has been adjusted to be parallel to the horizontal plate 34, the parallelism between the mounting surface of the mounting table 4 and the holding surface 51a is then adjusted. Fig. 15 is a flow chart showing the operation of the control means 11 to detect and adjust the inclination of the mounting surface of the mounting table 4 at the mounting position 22. Note that the operation of detecting and adjusting the inclination of the mounting surface of the carrier table 3 at the pick-up position 21 is the same except that the position is the pick-up position 21, so a description thereof will be omitted.

[0118] 16, the control means 11 controls the ball screw 65 to align the laser measuring device 7 of the transport section 5 with the mounting position 22 (step S31). The control means 11 also controls the X-axis drive mechanism 41 and the Y-axis drive mechanism 42 to make the placement surface of the mounting table 4 directly face the laser measuring device 7 of the transport section 5 (step S32). Next, while moving the mounting table 4 in the X-axis direction (step S33), the control means 11 uses the laser measuring device 7 of the transport section 5 to direct laser light at multiple points on the placement surface of the mounting table 4 (step S34). Then, the control means 11 measures the distances to the multiple points (step S35).

[0119] In steps S33 and S34, as shown in FIG. 17(a), for example, three laser light irradiation points Lp are set in each of both edge regions extending in the X-axis direction among the edge regions of the mounting surface of the mounting table 4. The three laser light irradiation points Lp are preferably as far apart as possible, and may be set at the corners at both ends of the edge and the center of the side. First, the mounting table 4 is moved so that one of the corners of the mounting surface of the mounting table 4 faces the laser measuring instrument 7. The control means 11 stores in advance the X-axis direction movement distance and Y-axis direction movement distance required for one of the corners of the mounting surface of the mounting table 4 to face the laser measuring instrument 7. The control means 11 also stores in advance the separation distance of the three laser light irradiation points Lp aligned in the X-axis direction.

[0120] After measuring the positions of the multiple points irradiated with the laser light (step S35), the control means 11 calculates the inclination of the mounting surface of the mounting table 4 with respect to the X-axis from the positioning results (step S36). The inclination calculation may be based on the difference between the distance moved in the X-axis direction to irradiate the three laser light irradiation points Lp with the laser light and the positioning results of the three laser light irradiation points Lp.

[0121] After the calculation of the inclination with respect to the X-axis is completed, the control means 11 moves the mounting table 4 along the Y-axis direction (step S37) while directing laser light at multiple points on the mounting surface of the mounting table 4 using the laser measurement device 7 of the transfer unit 5 (step S38). Then, the control means 11 measures the distances to each of the multiple points (step S39). Then, after measuring the distances to each of the multiple points, the control means 11 calculates the inclination of the mounting surface of the mounting table 4 in the Y-axis direction from the positioning results (step S40).

[0122] In steps S37 and S38, as shown in Fig. 17(b), for example, three laser light irradiation points Lp are set in each of both edge regions extending in the Y-axis direction among the edge regions of the mounting surface of the mounting base 4. It is desirable that the three laser light irradiation points Lp are as far apart as possible, and they are preferably set at the corners at both ends of the edge and at the center of the side. Note that steps S32 to S40 may be repeated multiple times to ensure detection accuracy of the tilt angle, and the final tilt angle may be calculated by a statistical method such as averaging.

[0123] After calculating the tilt angles of the mounting surface of the mounting table 4 relative to the X-axis and Y-axis, the tilt angles of the holding surface 51a relative to the X-axis and Y-axis are read out (step S41), and the tilt angle of the holding surface 51a is subtracted from the tilt angle of the mounting surface of the mounting table 4 (step S42). Then, the control means 11 drives the tilt mechanism 33 provided on the mounting table 4 to tilt the mounting table 4 and eliminate the difference (step S43). That is, the control means 11 calculates the movement direction and movement amount of each tilt mechanism 33 from the difference in the X-axis direction and the difference in the Y-axis direction, converts the calculation results into analog or pulse current or voltage signals, and outputs them to each tilt mechanism 33.

[0124] As described above, the tilt angles of the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 are detected with respect to the horizontal, and the tilt mechanism 33 adjusts the tilt to eliminate the difference between the two tilt angles, so that the tilt of the mounting surface of the mounting table 4 follows the tilt of the holding surface 51a and the two become parallel. Similarly, the tilt of the holding surface 51a is detected at the pickup position 21 using the laser measuring device 7 of the carrier table 3, and the tilt of the mounting surface of the carrier table 3 is measured using the laser measuring device 7 of the transfer section 5 to eliminate the difference between the two, so that the mounting surface of the carrier table 3 follows the tilt of the holding surface 51a at the pickup position 21.

[0125] Here, if the difference in the inclination angle of the holding surface 51a at the pickup position 21 and the mounting position 22 is negligible, after detecting the inclination of the holding surface 51a at either the pickup position 21 or the mounting position 22, the inclination angle may be reused when performing a difference calculation at the other position. "Negligible" refers to a case where even if the accuracy of the parallelism at one position decreases due to the reuse of the inclination angle, there is no problem in picking up or mounting the element E. In this case, the man-hours required for detecting the inclination angle are reduced, and the operating efficiency of the element mounting apparatus 1 is improved.

[0126] In addition, if the inclination angle of the holding surface 51a in one position can be estimated from the inclination angle of the holding surface 51a in the other position, that is, if a calculation formula exists for calculating the inclination angle of the holding surface 51a in one position from the inclination angle of the holding surface 51a in the other position, the inclination angle of the holding surface 51a in one position may be reused in a similar manner.

[0127] The laser measuring device 7 of the transfer unit 5 may be fixed to the head 51. When the laser measuring device 7 is fixed to the head 51, the holding surface 51a and the laser light always maintain an orthogonal relationship without being affected by the driving of the θ rotation unit 53 and the tilt mechanisms 58a and 58b. Therefore, the tilt angle of both placement surfaces detected by the laser measuring device 7 of the transfer unit 5 is based on the holding surface 51a. In this case, it is sufficient to drive the tilt mechanism 33 by the amount of the tilt angle of both placement surfaces without comparing with the tilt of the holding surface 51a. Moreover, if the tilt of the holding surface 51a is within the allowable range of the angle change by the tilt mechanism 33, it is not necessary to detect the tilt of the holding surface 51a, and the laser measuring device 7 of the carrier table 3 and the mounting table 4 can be eliminated.

[0128] However, it is desirable to provide the laser measuring device 7 on the bracket 59 of the transfer section 5, since it is possible to reduce the weight of the object that performs the θ rotation, the angle change in the X-axis direction, and the angle change in the Y-axis direction, thereby further improving the accuracy of these θ rotations and angle changes.

[0129] In this embodiment, the laser measuring instruments 7 of the transfer unit 5, the carrier table 3, and the mounting table 5 are installed so as to emit laser light along the Z axis in order to use the horizontal as a reference for the inclination. However, it is sufficient that the laser light emitted by the laser measuring instrument 7 of the transfer unit 5 and the laser light emitted by the laser measuring instruments 7 of the carrier table 3 and the mounting table 5 are parallel, and it is not necessary to use the horizontal as a reference. In addition, if the inclination of the holding surface 51a of the transfer unit 5 is uniform on a line segment including the pickup position 21 and the mounting position 22, or the variation is negligible, the laser measuring instruments 7 mounted on the carrier table 3 and the mounting table 5 can be made common and placed, for example, on the upper surface of the stand 6, between the carrier table 3 and the mounting table 5.

[0130] In order to improve the accuracy of the positioning results of the laser measurement instrument 7, it is desirable that the transport unit 5 is lowered by the lift unit 9 during positioning to reduce the distance between the laser measurement instrument 7 of the transport unit 5 and each placement surface, and the distance between the laser measurement instrument 7 of the carrier table 3 and the holding surface 51a. If the laser measurement instrument 7 of the transport unit 5 cannot be brought closer to the placement surface until the positioning accuracy is improved, a laser measurement instrument 7 may be installed, for example, on the pickup position 21 in addition to the laser measurement instrument 7 of the transport unit 5, as shown in FIG.

[0131] That is, the laser measuring instrument 7 is installed on the stand 6 and supported by an inverted L-shaped pillar 81. The inverted L-shaped pillar 81 rises from the upper surface of the stand 6 and extends, bending midway, toward the pickup position 22. An elevation unit 82 is provided on the extending tip surface of the inverted L-shaped pillar 81. The elevation unit 82 is, for example, a rail and a ball screw extending in the Z-axis direction. The laser measuring instrument 7 is supported by the inverted L-shaped pillar 81 via the elevation unit 82. The laser measuring instrument 7 irradiates laser light downward along the Z-axis that passes through the pickup position 21.

[0132] When the laser light is irradiated onto the placement surface of the carrier table 3, the laser measuring device 7 permanently installed above the pick-up position 21 is lowered instead of the transport unit 5. The transport unit 5 is retracted from the pick-up position 21. On the other hand, when detecting the inclination of the holding surface 51a at the pick-up position 21, the laser measuring device 7 on the inverted L-shaped support 81 is retracted upward. If the transport unit 5 cannot be brought close enough to the mounting position 22, the inverted L-shaped support 81, the lift unit 82, and the laser measuring device 7 are permanently installed on the mounting position 22 side.

[0133] In the above-described element mounting device 1, the mounting surface of the carrier table 3 and the mounting surface of the mounting table 4 are adjusted to be parallel to the holding surface 51a. However, without being limited to this, for example, the parallelism between each area of ​​the carrier C placed on the carrier table 3 and the substrate S placed on the mounting table 4 and the holding surface 51a may be adjusted.

[0134] In this case, the distances between multiple points for each region of the carrier C and the substrate S are measured by the laser measuring device 7, and the tilt angle for each region is calculated. Then, each time an element E is picked up in a region, the parallelism is adjusted by the tilt mechanism 33 based on the tilt angle of that region, and each time an element E is mounted in a region, the parallelism may be adjusted by the tilt mechanism 33 based on the tilt angle of that region. This allows elements to be picked up and mounted better, taking into account warpage and thickness variations of the carrier C and the substrate S, etc.

[0135] (Other embodiments) Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims.

[0136] For example, a ball screw mechanism has been used as a specific example of the driving mechanism equipped in the element mounting device 1, such as the X-axis driving mechanisms 31 and 41, the Y-axis driving mechanisms 32 and 42, and the tilt mechanism 33, but this is not limited to this, and other known driving mechanisms such as a linear motor mechanism or a belt driving mechanism can be used. [Explanation of symbols]

[0137] 1. Element mounting equipment 11 Control Means 11a Display section 12 Pneumatic Circuit 21 Pickup Position 22 Mounting position 3 Carrier stand 31 X-axis drive mechanism 32 Y-axis drive mechanism 33 Tilt mechanism 331 Rotary Motor 332 Screw shaft 333 Cam 334 Cam Follower 335 Slope 336 Slope 337 Bearings 34 horizontal plate 4 Mounting stand 41 X-axis drive mechanism 42 Y-axis drive mechanism 5 Transfer section 51 Head 51a Holding surface 52 cylinders 53 θ rotation section 54 Contact block receiver 55 Camera 56 Heater 57 Blower 58a Tilt mechanism 58b Tilt mechanism 581 Base 582 Concave curved surface 583 Sliding Part 584 Convex curved surface 585 Adjustment section 586 Knob 587 Frames 588 Spindle 589 Tension Spring 59 Bracket 591 Slider 6 Mounting stand 61 Raising platform 62 Pillar 7 Laser measuring equipment 81 Inverted L-shaped support 82 Lifting section 9 Lifting section C Career E element S-substrate A Adhesive sheet

Claims

1. a supply table on which an element supply body having elements arranged in an array is placed; a mounting base on which a substrate on which the elements are arranged in an array is placed; a transfer unit having a holding surface for holding elements in multiple rows and columns, the transfer unit moving between the supply table and the mounting table, picking up the elements in multiple rows and columns from the element supply body all at once on the holding surface, and transferring the picked-up elements in multiple rows and columns from the holding surface to the substrate all at once; a tilt mechanism that tilts the placement surface of the supply table and the placement surface of the mounting table as tilting objects, and adjusts the placement surface of the supply table and the holding surface of the transfer unit, and the holding surface of the transfer unit and the placement surface of the mounting table, so as to be parallel to each other; a displacement sensor provided on the transfer section for detecting an inclination of a mounting surface of the supply table at a position where the pick-up is performed and an inclination of a mounting surface of the mounting table at a position where the multi-row, multi-column elements are transferred collectively to the substrate, provided on the supply table for detecting an inclination of the holding surface of the transfer section at the position where the pick-up is performed, and provided on the mounting table for detecting an inclination of the holding surface of the transfer section at the position where the multi-row, multi-column elements are transferred collectively to the substrate; To have An element mounting device comprising:

2. The tilt mechanism includes: A manual tilt mechanism that tilts a tiltable object by manually operating a knob, an electric tilt mechanism that tilts a tiltable object using a motor as a power source, or both of these.

2. The device mounting apparatus according to claim 1,

3. the tilt mechanism provided on each of the supply table and the mounting table is an electric tilt mechanism; 3. The device mounting apparatus according to claim 2, wherein

4. the manual tilt mechanism tilts the tilt target by 0.0003° or more and 0.15° or less when the knob rotates once; 3. The device mounting apparatus according to claim 2, wherein

5. The electric tilt mechanism includes: A cam follower that supports a tiltable object; an inclined portion that causes the cam follower to move in an ascending and descending direction of an inclined surface; Equipped with The inclined portion has an inclination such that the height increases by 1 mm or less when the inclined portion is moved horizontally by 10 mm; 3. The device mounting apparatus according to claim 2, wherein

6. a supply table on which an element supply body having elements arranged in an array is placed; a mounting base on which a substrate on which the elements are arranged in an array is placed; a transfer unit having a holding surface for holding elements in multiple rows and columns, the transfer unit moving between the supply table and the mounting table, picking up the elements in multiple rows and columns from the element supply body all at once on the holding surface, and transferring the picked-up elements in multiple rows and columns from the holding surface to the substrate all at once; a tilt mechanism that tilts the placement surface of the supply table and the placement surface of the mounting table as tilt targets; a displacement sensor provided on the transfer section for detecting an inclination of a mounting surface of the supply table at a position where the pick-up is performed and an inclination of a mounting surface of the mounting table at a position where the multi-row, multi-column elements are transferred collectively to the substrate, provided on the supply table for detecting an inclination of the holding surface of the transfer section at the position where the pick-up is performed, and provided on the mounting table for detecting an inclination of the holding surface of the transfer section at the position where the multi-row, multi-column elements are transferred collectively to the substrate; A method for adjusting a device mounting apparatus comprising: the displacement sensor detects an inclination of the mounting surface of the supply table and an inclination of the holding surface of the transfer section at a position where the pick-up is performed, and an inclination of the mounting surface of the mounting table and an inclination of the holding surface of the transfer section at a position where the multiple rows and multiple columns of elements are transferred to the substrate all at once, and based on the detection results, the tilt mechanism adjusts the mounting surface of the supply table and the holding surface of the transfer section, and the holding surface of the transfer section and the mounting surface of the mounting table so that they are parallel in advance; A method for adjusting an element mounting apparatus comprising the steps of:

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