Laser Processing Equipment

Abstract

To provide a laser processing device which achieves tact increase and can reduce defective observation by means of an internal observation part.SOLUTION: A laser processing device 1 includes a stage 2, a laser processing head 3, cameras 5, 6 for alignment provided on the laser processing head 3, an internal observation unit 4 having a transmission beam condensing lens 43 which condenses a transmission beam I1 onto an object 20 and observing the inside of the object 20 by the transmission beam I1, a first vertical movement mechanism 7A which moves a laser processing head 3 along a Z-direction together with the cameras 5, 6 for alignment, a second vertical movement mechanism 7B which moves the internal observation unit 4 along the Z-direction, a first horizontal movement mechanism 8A and a second horizontal movement mechanism 8B which move the stage 2 along a horizontal direction, and a control part which controls the operations of the first vertical movement mechanism 7A, the second vertical movement mechanism 7B, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a laser processing apparatus. [Background technology]

[0002] There is known a laser processing device that forms a modified region in an object by irradiating the object with a laser beam. For example, Patent Document 1 describes this type of technology as a laser processing device that includes a laser processing head (irradiation unit) that irradiates laser beam, an imaging unit (information acquisition unit) that captures an image used for aligning the focusing position of the laser beam, and an imaging unit (interior observation unit) that captures an image of the inside of the object by using transmitted light that is transparent to the object. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-055030 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the laser processing device as described above, the information acquisition unit and the internal observation unit move together in the vertical direction by the same moving mechanism (vertical axis). Therefore, if the internal observation unit is moved vertically during observation using the internal observation unit, the vibrations become large due to its large weight, which may result in poor observation. In addition, when either the information acquisition unit or the internal observation unit is in operation, the other cannot move vertically, which reduces the tact (work efficiency).

[0005] Therefore, an object of the present invention is to provide a laser processing device that can realize faster processing time and reduce observation failures caused by the internal observation section. [Means for solving the problem]

[0006] The laser processing apparatus of the present invention is a laser processing apparatus that forms a modified region in an object by irradiating the object with laser light, and includes a support section that supports the object, an irradiation section that irradiates laser light onto the object supported on the support section, an information acquisition section that is provided in the irradiation section and acquires information used to align the focusing position of the laser light on the object, an internal observation section that has a transmitted light focusing lens that focuses transmitted light that is transparent to the object on the object and observes the inside of the object using the transmitted light, a first vertical movement mechanism that moves the irradiation section together with the information acquisition section along the vertical direction, a second vertical movement mechanism that moves at least one of the internal observation section and the transmitted light focusing lens along the vertical direction, a horizontal movement mechanism that moves the support section along the horizontal direction, and a control section that controls the operation of at least the first vertical movement mechanism, the second vertical movement mechanism, and the horizontal movement mechanism.

[0007] In this laser processing device, the information acquisition unit and at least one of the internal observation unit and the transmitted light focusing lens can each be moved vertically by a separate moving mechanism. This reduces the weight moved vertically during observation with the internal observation unit, thereby suppressing vibration. Also, while either the information acquisition unit or the internal observation unit is operating, the other can be moved vertically. Therefore, according to the present invention, it is possible to improve tact time and reduce poor observation by the internal observation unit.

[0008] In the laser processing device according to the present invention, the horizontal movement mechanism may have a first horizontal movement mechanism that moves the support part along a first horizontal direction, and a second horizontal movement mechanism that moves the support part along a second horizontal direction perpendicular to the first horizontal direction. In this case, by moving the support part in the first horizontal direction and the second horizontal direction, it is possible to move the laser light irradiation position of the object by the irradiation unit, the information acquisition position of the object by the information acquisition unit, and the observation position of the object by the internal observation unit in the first horizontal direction and the second horizontal direction.

[0009] In the laser processing device according to the present invention, the first vertical movement mechanism may have a first vertical axis provided on the first base and move the irradiation unit in the vertical direction along the first vertical axis, and the second vertical movement mechanism may have a second vertical axis provided on the second base separated from the first base in the first horizontal direction and move the internal observation unit in the vertical direction along the second vertical axis. In this case, a compact device configuration in the second horizontal direction can be realized.

[0010] In the laser processing device according to the present invention, the first vertical movement mechanism may have a first vertical axis provided on one side of the first base in the first horizontal direction and move the irradiation unit in the vertical direction along the first vertical axis, and the second vertical movement mechanism may have a second vertical axis provided on the other side of the first base in the first horizontal direction and move the internal observation unit in the vertical direction along the second vertical axis. In this case, it is possible to realize a device configuration in which the base on which the first vertical axis and the second vertical axis are provided is shared.

[0011] In the laser processing device according to the present invention, the first vertical movement mechanism may have a first vertical axis provided on the first base and move the irradiation unit in the vertical direction along the first vertical axis, and the second vertical movement mechanism may have a second vertical axis provided on the second base separated in the second horizontal direction from the first base and move the internal observation unit in the vertical direction along the second vertical axis. In this case, a compact device configuration in the first horizontal direction can be realized.

[0012] In the laser processing device according to the present invention, the irradiation unit and the internal observation unit may be configured to be immovable in the horizontal direction. In this case, since the information acquisition unit and the internal observation unit do not move in the horizontal direction, it is possible to avoid the generation of vibrations associated with the movement.

[0013] In the laser processing device according to the present invention, the support unit may be configured to be rotatable about a rotation axis along the vertical direction. In this case, by rotating the support unit, it is possible to move the laser light irradiation position of the object by the irradiation unit, the information acquisition position of the object by the information acquisition unit, and the observation position of the object by the internal observation in a rotation direction around the rotation axis along the vertical direction.

[0014] In the laser processing device according to the present invention, the information acquisition unit may acquire information used for aligning the focusing position of the laser light by irradiating the target object with light and receiving the light returning from the target object. In this case, acquisition of information used for aligning the focusing position of the laser light can be specifically realized.

[0015] In the laser processing device according to the present invention, the control unit may execute the following processes: moving the support unit along the horizontal direction using the horizontal movement mechanism based on the information acquired by the information acquisition unit, aligning the focusing position of the laser light to a predetermined position in the object, and acquiring alignment information related to the positional information of the support unit at the time of the alignment, and when observing the inside of the object with the internal observation unit, moving the support unit along the horizontal direction using the horizontal movement mechanism based on the alignment information and position correction information related to the positional relationship of the internal observation unit with respect to the irradiation unit, and aligning the focusing position of the transmitted light to a predetermined position in the object. This allows the focusing position of the laser light to be aligned to the predetermined position, and the alignment information at that time to be shared for observation by the internal observation unit.

[0016] In the laser processing device according to the present invention, the irradiation unit may have a laser beam focusing lens that focuses the laser beam on the object, and the control unit may execute the following steps: moving the support unit along the horizontal direction using the horizontal movement mechanism so that the reference position of the test object supported by the support unit is located on the optical axis of the laser beam focusing lens, and acquiring first information that is position information of the support unit after the movement; moving the support unit along the horizontal direction using the horizontal movement mechanism so that the reference position of the test object supported by the support unit is located on the optical axis of the transmitted light focusing lens, and acquiring second information that is position information of the support unit after the movement; and acquiring position correction information based on the first information and the second information. In this case, it is possible to specifically acquire the position correction information. Effect of the Invention

[0017] According to the present invention, it is possible to provide a laser processing device that can realize faster processing time and reduce observation failures caused by the internal observation section. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 is a configuration diagram showing a laser processing device according to a first embodiment. [Diagram 2] FIG. 2 is a plan view showing the object of FIG. [Diagram 3] FIG. 3 is a cross-sectional view of a portion of the object of FIG. [Figure 4] FIG. 4 is a configuration diagram showing the laser processing head of FIG. [Diagram 5] FIG. 5 is a configuration diagram showing the internal observation unit of FIG. [Figure 6] FIG. 6 is a flowchart showing an example of the operation of the laser processing apparatus of FIG. [Figure 7] FIG. 7 is a flowchart showing the process of acquiring XYθ correction information by the laser processing apparatus of FIG. [Figure 8] FIG. 8 is a plan view of a test object. [Figure 9]FIG. 9 is a flowchart showing a correction coefficient acquisition process performed by the laser processing apparatus of FIG. [Figure 10] FIG. 10 is a side view showing an object for correction coefficients. [Figure 11] FIG. 11 is a configuration diagram showing a laser processing device according to the second embodiment. [Figure 12] FIG. 12 is a configuration diagram showing a laser processing device according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the description of each drawing, the same or corresponding parts are given the same reference numerals, and duplicated descriptions may be omitted. In addition, each drawing may show an orthogonal coordinate system defined by an X-axis, a Y-axis, and a Z-axis. As an example, the X-direction and the Y-direction are a first horizontal direction and a second horizontal direction that intersect (are perpendicular to) each other, and the Z-direction is a vertical direction that intersects (are perpendicular to) the X-direction and the Y-direction.

[0020] [First embodiment] 1, the laser processing apparatus 1 according to the first embodiment includes a stage (support section) 2, a laser processing head 3 (irradiation section), alignment cameras (information acquisition sections) 5 and 6, an interior observation unit (interior observation section) 4, a first vertical movement mechanism 7A, a second vertical movement mechanism 7B, a first horizontal movement mechanism (horizontal movement mechanism) 8A, a second horizontal movement mechanism (horizontal movement mechanism) 8B, a control section 9, and a GUI (Graphical User Interface) 10. The laser processing apparatus 1 is an apparatus that forms a modified region 12 (see FIG. 4) in an object 20 by irradiating the object 20 with laser light L.

[0021] As shown in FIG. 2 and FIG. 3, the object 20 is, for example, a wafer. The object 20 includes a semiconductor substrate 21 and a functional element layer 22. The semiconductor substrate 21 has a front surface 21a and a back surface 21b. The semiconductor substrate 21 is, for example, a silicon substrate. The functional element layer 22 is formed on the front surface 21a of the semiconductor substrate 21. The functional element layer 22 includes a plurality of functional elements 22a arranged two-dimensionally along the front surface 21a. The functional elements 22a are, for example, light receiving elements such as photodiodes, light emitting elements such as laser diodes, and circuit elements such as memories. The functional elements 22a may be three-dimensionally configured by stacking a plurality of layers. The object 20 may or may not have a functional element layer 22, and may be a bare wafer. The semiconductor substrate 21 is provided with a notch 21c indicating a crystal orientation, but an orientation flat may be provided instead of the notch 21c.

[0022] The object 20 is cut into functional elements 22a along each of the lines 15. The lines 15 pass between the functional elements 22a when viewed from the thickness direction of the object 20. More specifically, the lines 15 pass through the center (the center in the width direction) of the street region 23 when viewed from the thickness direction of the object 20. The street region 23 extends in the functional element layer 22 so as to pass between adjacent functional elements 22a. In this embodiment, the functional elements 22a are arranged in a matrix along the surface 21a, and the lines 15 are set in a lattice pattern. Note that the lines 15 are virtual lines, but may be lines that are actually drawn.

[0023] As shown in FIG. 1, an object 20 is placed on a stage 2. The stage 2 supports the object 20, for example, by adsorbing the object 20. The stage 2 can be moved along the X direction by a first horizontal movement mechanism 8A. The stage 2 can be moved along the Y direction by a second horizontal movement mechanism 8B. The stage 2 is configured to be rotatable about a rotation axis along the Z direction. The stage 2 has a known rotation drive device (not shown) such as a motor, and is driven to rotate about the rotation axis by the driving force of the motor. The rotation of the stage 2 (the operation of the rotation drive device) is controlled by a control unit 9.

[0024] 1 and 4, the laser processing head 3 irradiates the object 20 supported on the stage 2 with a laser light L having transparency. The laser processing head 3 focuses the laser light L inside the object 20. When the laser light L is focused inside the object 20 supported on the stage 2, the laser light L is particularly absorbed in a portion corresponding to the focusing position of the laser light L (at least a part of the focusing region), and a modified region 12 is formed inside the object 20.

[0025] The modified region 12 is a region that differs from the surrounding non-modified region in terms of density, refractive index, mechanical strength, and other physical properties. Examples of the modified region 12 include a melting treatment region, a crack region, a dielectric breakdown region, and a refractive index change region. The modified region 12 has a property that cracks tend to extend from the modified region 12 to the incident side of the laser light L and to the opposite side. Such a property of the modified region 12 is utilized for cutting the target object 20.

[0026] The laser processing head 3 has a laser beam focusing lens 33 and an observation camera 35 in a housing H3. A laser beam L is incident from an external light source 31 into the housing H3 of the laser processing head 3. The light source 31 outputs the laser beam L, for example, by a pulse oscillation method. The laser beam focusing lens 33 focuses the laser beam L on the object 20 supported on the stage 2. In the laser processing head 3, the laser beam L incident from the light source 31 is incident on the laser beam focusing lens 33 through a dichroic mirror 32 in the housing H3, and is focused on the object 20 by the laser beam focusing lens 33. The laser beam focusing lens 33 may be a lens unit including a plurality of objective lenses. The housing H3 includes an attachment portion 39 provided on its side, and is connected to and supported by a first vertical movement mechanism 7A described later via the attachment portion 39.

[0027] The observation camera 35 captures an image of the object 20 supported on the stage 2 with visible light V. The observation camera 35 captures an image of the object 20 with visible light V emitted from a visible light source 36. Specifically, the visible light V emitted from the visible light source 36 is reflected by a dichroic mirror 37, passes through a dichroic mirror 32, and is then irradiated onto the object 20 via a laser beam condenser lens 33. The visible light V is reflected by a laser beam incident surface of the object 20, passes through the laser beam condenser lens 33 and the dichroic mirrors 32 and 37, and is received by the observation camera 35 via a lens 38. A reticle (not shown) that gives a scale line to the visible light V may be provided on the optical path of the visible light V. The observation camera 35 is connected to a control unit 9. The observation camera 35 outputs the captured visible image to the control unit 9. The observation camera 35 is not particularly limited, and various known cameras can be used as long as they satisfy the required performance.

[0028] The alignment cameras 5 and 6 acquire information used for aligning the focusing position of the laser light L on the object 20 (hereinafter also simply referred to as "alignment"). The alignment cameras 5 and 6 irradiate the object 20 with light and detect the light returning from the object 20 to acquire an image as information used for alignment. The alignment cameras 5 and 6 capture an image of the object 20 supported on the stage 2 by.

[0029] For example, the alignment camera 5 irradiates the object 20 with light from the back surface 21b, which is the laser light incident surface, and detects the light returning from the front surface 21a (functional element layer 22), thereby capturing an image of the functional element layer 22. Similarly, for example, the alignment camera 5 irradiates the object 20 with light from the back surface 21b, and detects the light returning from the position where the modified region 12 is formed in the semiconductor substrate 21, thereby capturing an image of the region including the modified region 12. These images are used for alignment. The alignment camera 6 has a similar configuration to the alignment camera 5, except that its lens has a lower magnification. The alignment camera 6 is used for alignment in the same way as the alignment camera 5.

[0030] The alignment cameras 5, 6 are provided on the laser processing head 3 and move integrally with the laser processing head 3. In the illustrated example, the alignment cameras 5, 6 are fixed to a mounting portion 39 of the laser processing head 3. The alignment cameras 5, 6 are connected to a control unit 9. The alignment cameras 5, 6 output captured images to the control unit 9. The alignment cameras 5, 6 are not particularly limited, and various known cameras can be used as long as they satisfy the required performance.

[0031] 1 and 5, the interior observation unit 4 observes the inside of the object 20 by using transmitted light. The interior observation unit 4 observes the inside of the object 20 by irradiating the object 20 with transmitted light and detecting the transmitted light returning from the object 20. For example, the interior observation unit 4 captures an image of the modified region 12 formed in the object 20 and the tip of the crack 14 extending from the modified region 12.

[0032] As shown in FIG. 5, the internal observation unit 4 includes a light source 41, a mirror 42, a transmitted light condensing lens 43, and a light detection unit 44 in a housing H4. The light source 41 outputs transmitted light I1 that is transparent to the semiconductor substrate 21. The light source 41 is composed of, for example, a halogen lamp and a filter, and outputs transmitted light I1 in the near-infrared region. The transmitted light I1 output from the light source 41 is reflected by the mirror 42 and passes through the transmitted light condensing lens 43, and is irradiated onto the object 20 from the back surface 21b side of the semiconductor substrate 21. The transmitted light condensing lens 43 is a lens that condenses the transmitted light I1 on the semiconductor substrate 21. The transmitted light condensing lens 43 allows the transmitted light I1 reflected by the front surface 21a of the semiconductor substrate 21 to pass through.

[0033] The light detection unit 44 detects the transmitted light I1 transmitted through the transmitted light focusing lens 43 and the mirror 42. The light detection unit 44 is, for example, configured with an InGaAs camera, and detects the transmitted light I1 in the near infrared region. The housing H4 includes an attachment portion 49 provided on its side, and is connected to and supported by a second vertical movement mechanism 7B described below via this attachment portion 49. The internal observation unit 4 is connected to the control unit 9. The internal observation unit 4 outputs a captured image (internal image) to the control unit 9. The internal observation unit 4 is not particularly limited, and various known cameras can be used as long as they satisfy the required performance.

[0034] As shown in FIG. 1, the first vertical movement mechanism 7A is a mechanism for moving the laser processing head 3 together with the alignment cameras 5 and 6 along the Z direction. The first vertical movement mechanism 7A has a first vertical shaft 71 provided on a columnar first base portion 75. The first base portion 75 is fixed to, for example, an installation surface or the like. The first vertical shaft 71 extends along the Z direction. The mounting portion 39 of the laser processing head 3 is attached to the first vertical shaft 71 so as to be movable along the Z direction. Such a first vertical movement mechanism 7A moves the laser processing head 3 in the Z direction along the first vertical shaft 71 by the driving force of a driving source (not shown). The first vertical movement mechanism 7A is not particularly limited, and various mechanisms can be used as long as they can move the laser processing head 3 in the Z direction.

[0035] The second vertical movement mechanism 7B is a mechanism that moves the internal observation unit 4 along the Z direction. The second vertical movement mechanism 7B has a second vertical shaft 72 provided on a columnar second base portion 76 fixed to, for example, an installation surface. The second base portion 76 is spaced apart in the X direction from the first base portion 75. For example, the distance between the second base portion 76 and the first base portion 75 is equal to or greater than the width of the laser processing head 3 in the X direction.

[0036] The second vertical shaft 72 extends along the Z direction. The mounting portion 49 of the internal observation unit 4 is attached to the second vertical shaft 72 so as to be movable along the Z direction. Such a second vertical movement mechanism 7B moves the internal observation unit 4 in the Z direction along the second vertical shaft 72 by the driving force of a driving source (not shown). The second vertical movement mechanism 7B is not particularly limited, and various mechanisms can be used as long as they can move the internal observation unit 4 in the Z direction.

[0037] The first horizontal movement mechanism 8A is a mechanism that moves the stage 2 along the X direction. The first horizontal movement mechanism 8A has a first horizontal shaft 81 fixed to, for example, an installation surface or the like. The first horizontal shaft 81 extends along the X direction. The stage 2 is attached to the first horizontal shaft 81 via the second horizontal movement mechanism 8B so as to be movable along the X direction. Such a first horizontal movement mechanism 8A moves the stage 2 and the second horizontal movement mechanism 8B in the X direction along the first horizontal shaft 81 by the driving force of a driving source (not shown). The first horizontal movement mechanism 8A is not particularly limited, and various mechanisms can be used as long as they can move the stage 2 in the X direction.

[0038] The second horizontal movement mechanism 8B is a mechanism for moving the stage 2 along the Y direction. The second horizontal movement mechanism 8B has, for example, a second horizontal shaft 82 provided on the first horizontal movement mechanism 8A. The second horizontal shaft 82 extends along the Y direction. The stage 2 is attached to the second horizontal shaft 82 so as to be movable along the Y direction. The second horizontal shaft 82 is movable along the first horizontal shaft 81 together with the stage 2. Such a second horizontal movement mechanism 8B moves the stage 2 in the Y direction along the second horizontal shaft 82 by the driving force of a driving source (not shown). The second horizontal movement mechanism 8B is not particularly limited, and various mechanisms can be used as long as they can move the stage 2 in the Y direction.

[0039] The control unit 9 is configured as a computer device including a processor, a memory, a storage, a communication device, etc. In the control unit 9, the processor executes software (programs) loaded into the memory, etc., and controls reading and writing of data in the memory and storage, as well as communication by the communication device. The control unit 9 controls various operations of the laser processing apparatus 1. The control unit 9 controls operations of the rotation drive device of the stage 2, the laser processing head 3, the alignment cameras 5 and 6, the internal observation unit 4, the first vertical movement mechanism 7A, the second vertical movement mechanism 7B, the first horizontal movement mechanism 8A, the second horizontal movement mechanism 8B, and the GUI 10.

[0040] The control unit 9 executes alignment based on the information acquired by the alignment cameras 5 and 6, and also executes a process to acquire alignment information regarding the position information of the stage 2 during alignment. The position information of the stage 2 is information regarding the position of the stage 2 in, for example, the X direction, Y direction, and θ direction (rotation direction around the rotation axis of the stage 2).

[0041] When observing the inside of the object 20 with the interior observation unit 4, the control unit 9 moves the stage 2 based on the alignment information and XYθ correction information (position correction information) and executes a process of aligning the focusing position of the transmitted light I1 with the alignment position (the focusing position of the laser light L during alignment) in the object 20. The XYθ correction information is information on the positional relationship of the interior observation unit 4 with respect to the laser processing head 3. For example, the XYθ correction information corresponds to a difference between the positions of the stage 2 in the X direction, the Y direction, and the θ direction when the optical axis of the laser light focusing lens 33 of the laser processing head 3 is located at the center of the object 20 and the positions of the stage 2 in the X direction, the Y direction, and the θ direction when the optical axis of the transmitted light focusing lens 43 of the interior observation unit 4 is located at the center of the object 20.

[0042] The control unit 9 executes a process of moving the stage 2 in the X direction, the Y direction, and the θ direction by the rotation drive device of the stage 2, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B so that the reference position of the test object supported by the stage 2 is located on the optical axis of the laser beam focusing lens 33, and acquiring XYθ information (first information) which is the position information of the stage 2 after the movement. The control unit 9 executes a process of moving the stage 2 in the X direction, the Y direction, and the θ direction by the rotation drive device of the stage 2, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B so that the reference position of the test object supported by the stage 2 is located on the optical axis of the transmitted beam focusing lens 43, and acquiring second XYθ information (second information) which is the position information of the stage 2 after the movement. The control unit 9 executes a process of acquiring XYθ correction information based on the first XYθ information and the second XYθ information. Details of the process of the control unit 9 will be described later.

[0043] The GUI 10 displays various information. The GUI 10 displays the imaging results of the internal observation unit 4 and the alignment cameras 5 and 6. The GUI 10 includes, for example, a touch panel display. Various settings related to processing conditions and the like are input to the GUI 10 by a user's operation such as touching.

[0044] In the laser processing apparatus 1, as an example, the laser light L is irradiated onto the object 20 from the back surface 21b side of the semiconductor substrate 21, and the stage 2 is moved along the line 15 to relatively move the focal position (focus point) of the laser light L along the line 15 with respect to the object 20, thereby forming a plurality of modified spots aligned along the line 15. One modified spot is formed by irradiating one pulse of the laser light L. A row of modified regions 12 is a collection of a plurality of modified spots aligned in a row. Adjacent modified spots may be connected to each other or may be separated from each other depending on the relative moving speed of the focal position with respect to the object 20 and the repetition frequency of the laser light L. In this embodiment, as shown in FIG. 4, two rows of modified regions 12a, 12b are formed inside the semiconductor substrate 21 along the line 15. The two rows of modified regions 12a, 12b are adjacent to each other in the thickness direction (Z direction) of the object 20. The two rows of modified regions 12a, 12b are formed by moving the two light collection positions C along a line 15 relative to the semiconductor substrate 21.

[0045] In the laser processing device 1, as described above, the housing H3 of the laser processing head 3 is supported by the first vertical movement mechanism 7A so as to be movable in the Z direction, whereby the laser processing head 3 and the alignment cameras 5, 6 provided on the laser processing head 3 are configured to be movable in the Z direction but immovable in the X and Y directions. In the laser processing device 1, as described above, the housing H4 of the internal observation unit 4 is supported by the second vertical movement mechanism 7B so as to be movable in the Z direction, whereby the internal observation unit 4 is configured to be movable in the Z direction but immovable in the X and Y directions.

[0046] Next, an example of the operation of the laser processing device 1 will be described with reference to the flowchart of FIG.

[0047] First, after activation, each device is warmed up and calibrated, and then the target object 20 is placed on the stage 2 by a robot arm (not shown), and the target object 20 is adsorbed onto the stage 2 (step S1).

[0048] Subsequently, alignment is performed (step S2). In step S2, the control unit 9 controls the operation of the first horizontal movement mechanism 8A and the second horizontal movement mechanism 8B based on an image (e.g., an image of the functional element layer 22 of the target 20) acquired by the alignment camera 5 or the alignment camera 6, and moves the stage 2 along the X direction and the Y direction so that the focusing position of the laser light L matches the alignment position. For example, the alignment position is the processing start position (predetermined position) on the line 15 as viewed from the Z direction. Also, in step S2, position information of the stage 2 during alignment is acquired as alignment information.

[0049] Next, the height is set (step S3). In step S3, the control unit 9 controls the operation of the first vertical movement mechanism 7A based on a visible image (for example, an image of the laser light incident surface of the object 20) acquired by the observation camera 35, and moves the laser processing head 3 (i.e., the laser light focusing lens 33) along the Z direction so that the focusing position of the laser light L is located on the laser light incident surface. Next, the control unit 9 controls the operation of the first vertical movement mechanism 7A, and moves the laser processing head 3 along the Z direction so that the focusing position of the laser light L is located at a predetermined depth from the laser light incident surface based on the position at the time of height setting.

[0050] Next, the control unit 9 appropriately controls ON / OFF of the laser light L from the laser processing head 3, and the operations of the first horizontal movement mechanism 8A, the second horizontal movement mechanism 8B, and the rotation drive device of the stage 2, to move the stage 2 so that the focusing position of the laser light L moves relatively along the multiple lines 15. In this way, modified regions 12 are formed inside the target object 20 along the multiple lines 15 (step S4).

[0051] Next, the inside of the object 20 is observed. In the internal observation of the object 20, the control unit 9 controls the operations of the rotation drive device of the stage 2, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B, and moves the stage 2 so that the object 20 is located at a start position for internal observation by the internal observation unit 4 (step S5). In step S5, based on the alignment information acquired in the above step S2 and the preset XYθ correction information, the position of the object 20 in the X direction, Y direction, and θ direction is controlled so that the optical axis of the transmitted light condenser lens 43 is aligned with the alignment position of the object 20 (here, the processing start position on the line 15).

[0052] Next, the interior of the object 20 is observed by the interior observation unit 4, and multiple internal images are obtained (step S6). In step S6, for example, at least one location on each line 15, the next interior observation process is performed by the interior observation unit 4 under the control of the control unit 9. That is, the second vertical movement mechanism 7B moves the interior observation unit 4 along the Z direction, and the condensing position of the transmitted light I1 is aligned with multiple positions inside the object 20 to capture an image of the object 20 and obtain multiple internal images. Information regarding the amount of movement of the interior observation unit 4 is associated with each of the multiple internal images, and this is obtained as imaging data. This acquisition of imaging data is repeated by aligning the optical axis of the transmitted light condensing lens 43 with another location on the same line 15 or another line 15.

[0053] Next, the control unit 9 judges the processing state based on the acquired imaging data (step S7). In step S7, as an example, it automatically judges which of the internal images in the multiple imaging data has a relatively clear image of the crack 14 by image recognition (performs AI judgment). The control unit 9 calculates the crack position based on the movement amount when the judged internal image was captured. The crack position can be calculated, for example, by multiplying the movement amount by a predetermined correction coefficient set in advance. The correction coefficient will be described later. In addition, the control unit 9 estimates the position of the modified region 12, etc. based on the acquired crack position, etc. Next, the control unit 9 stores the judgment result judged in the above step S7 in an arbitrary storage device. The control unit 9 causes the judgment result judged in the above step S7 to be displayed on the GUI 10 (step S8). With the above, the process is terminated.

[0054] Next, an example of how to obtain XYθ correction information will be described with reference to the flowchart of FIG.

[0055] Prior to the above-mentioned processing of steps S1 to S8, the following XYθ correction information acquisition processing is executed. First, a test object is placed on the stage 2 by a robot arm (not shown), and the test object is adsorbed onto the stage 2 (step S11). As shown in Fig. 8, the test object 20T includes, for example, a disk-shaped semiconductor substrate 121, and on the main surface of the semiconductor substrate 121, indicator lines 122 such as notches that pass through a center 125 and divide the semiconductor substrate 121 into eight equal parts in the circumferential direction are formed.

[0056] The control unit 9 controls the operations of the rotation drive device of the stage 2, the first vertical movement mechanism 7A, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B based on the visible image acquired by the observation camera 35 of the laser processing head 3, and moves the stage 2 along the θ direction, the X direction, the Y direction, and the Z direction so that the reference position (e.g., the center 125) of the test object 20T is positioned on the optical axis of the laser beam focusing lens 33 (step S12). Position information of the stage 2 at this time is acquired as first XYθ information (step S13).

[0057] The control unit 9 controls the operation of the rotation drive device of the stage 2, the second vertical movement mechanism 7B, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B based on the image acquired by the internal observation unit 4, and moves the stage 2 along the θ direction, the X direction, the Y direction, and the Z direction so that the reference position of the test object 20T is located on the optical axis of the transmitted light condenser lens 43 (step S14). The position information of the stage 2 at this time is acquired as second XYθ information (step S15). Then, XYθ correction information is acquired from the difference between the first XYθ information and the second XYθ information (step S16).

[0058] As another example, there may be a case where the coordinates of the alignment cameras 5, 6 and the observation camera 35 of the laser processing head 3 are linked, and the coordinates of the alignment cameras 5, 6 and the internal observation unit 4 are also linked, while the coordinates of the observation camera 35 of the laser processing head 3 and the internal observation unit 4 are not directly linked. In this case, the coordinates of the observation camera 35 of the laser processing head 3 and the internal observation unit 4 are indirectly linked with each other using the alignment cameras 5, 6 as a reference.

[0059] Next, an example of how to obtain the correction coefficients used in internal observation by the internal observation unit 4 will be described with reference to the flowchart of FIG.

[0060] Prior to the above-mentioned processing of steps S1 to S8, the following correction coefficient acquisition processing is executed. First, a correction coefficient object is placed on the stage 2 by a robot arm (not shown), and the correction coefficient object is adsorbed onto the stage 2 (step S21). The control unit 9 controls the operations of the rotation drive device of the stage 2, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B, and moves the control unit correction coefficient object to below the transmitted light condenser lens 43 of the interior observation unit 4.

[0061] FIG. 10 is a side view showing the object 60 for correction coefficients. As shown in FIG. 10, the object 60 for correction coefficients includes a back surface 60b and a front surface 60a opposite to the back surface 60b. In the object 60 for correction coefficients, modified regions 12 arranged in the X direction along the back surface 60b and the front surface 60a and cracks extending from the modified regions 12 are formed by laser processing. In particular, in the object 60 for correction coefficients, cracks 14 extending from the modified regions 12 along a direction intersecting the Z direction and the X direction are formed. In the object 60 for correction coefficients, a plurality of rows of modified regions 12 are formed so as to be aligned in the Z direction.

[0062] The correction coefficient object 60 has a cut surface formed so as to expose the modified regions 12, and the positions of the modified regions 12 in the Z direction are known by actually measuring the cut surface, for example, as the positions of the cracks 14. This known measured value may be held by the control unit 9, or may be held in any storage device accessible to the control unit 9.

[0063] Next, the correction coefficient object 60 is imaged by the transmitted light I1 (step S22). In step S22, the crack 14 extending from the modified region 12 along a direction intersecting the Z direction and the X direction is imaged by the transmitted light I1 by controlling the interior observation unit 4. In step S2, the control unit 9 controls the interior observation unit 4 and the second vertical movement mechanism 7B to make the transmitted light I1 incident on the back surface 60b of the correction coefficient object 60, and moves the interior observation unit 4 along the Z direction to move the focusing position of the transmitted light I1 along the Z direction, and images the correction coefficient object 60 multiple times by aligning the focusing position of the transmitted light I1 with multiple positions inside the correction coefficient object 60. In this way, multiple internal images are obtained. In step S22, the correction coefficient object 60 may be imaged while adjusting the brightness value of the internal image and shading the internal image according to the observation area.

[0064] Next, imaging data relating to the internal images is stored (step S23). In step S23, information regarding the amount of movement is associated with each internal image and stored as imaging data. Next, the control unit 9 inputs the imaging data (step S24). Then, the control unit 9 determines the formation state of the crack 14 (step S25). Here, as an example, the control unit 9 automatically determines, by image recognition, an internal image in which the image of the crack is relatively clear among the multiple internal images (performs AI determination).

[0065] Next, the control unit 9 derives a correction coefficient (step S26). In step S26, the control unit 9 derives a correction coefficient for each of the multiple modified regions 12 arranged in the Z direction so that the measured value of the position of the modified region 12, which is a value obtained by multiplying the movement amount by the correction coefficient, becomes the corresponding actual measurement value. In other words, the control unit 9 derives the correction coefficient as correction coefficient = actual measurement value / movement amount. Thereafter, the control unit 9 saves data indicating the derived correction coefficient (step S27) and ends the process.

[0066] As described above, in the laser processing apparatus 1, the alignment cameras 5, 6 and the internal observation unit 4 can each be moved in the Z direction by a different moving mechanism. This reduces the weight moved in the Z direction during observation by the internal observation unit 4, thereby suppressing vibration. The time required for the vibration to settle can be reduced. Also, while either the alignment cameras 5, 6 or the internal observation unit 4 is operating, the other can be moved in the Z direction. Therefore, the laser processing apparatus 1 can achieve faster processing times and reduce poor observation by the internal observation unit 4.

[0067] The laser processing device 1 has a first horizontal movement mechanism 8A that moves the stage 2 along the X direction, and a second horizontal movement mechanism 8B that moves the stage 2 along the Y direction. In this case, by moving the stage 2 in the X direction and the Y direction, it is possible to move the laser light irradiation position (focusing position of the laser light L) of the object 20 by the laser processing head 3, the imaging position (information acquisition position) of the object 20 by the alignment cameras 5 and 6, and the observation position of the object 20 by the interior observation unit 4 in the X direction and the Y direction.

[0068] In the laser processing device 1, the first vertical movement mechanism 7A has a first vertical shaft 71 provided on a first base part 75, and moves the laser processing head 3 in the Z direction along the first vertical shaft 71. The second vertical movement mechanism 7B has a second vertical shaft 72 provided on a second base part 76 spaced apart from the first base part in the X horizontal direction, and moves the internal observation unit 4 in the Z direction along the second vertical shaft 72. In this case, a compact device configuration can be realized in the Y direction. By arranging the laser processing device 1 so that the X direction is along the direction of the production line, a device configuration suitable for the production line can be realized.

[0069] In the laser processing device 1, the laser processing head 3 and the internal observation unit 4 are configured to be immovable in the X and Y directions. In this case, since the alignment cameras 5, 6 and the internal observation unit 4 do not move in the X and Y directions, it is possible to avoid the occurrence of vibrations that accompany the movement of the alignment cameras 5, 6 and the internal observation unit 4 in the X and Y directions.

[0070] In the laser processing device 1, the stage 2 is configured to be rotatable about a rotation axis along the Z direction. In this case, by rotating the stage 2, it is possible to move the laser light irradiation position of the object 20 by the laser processing head 3, the imaging position of the object 20 by the alignment cameras 5 and 6, and the observation position of the object 20 by the interior observation unit 4 in the rotation direction.

[0071] In the laser processing device 1, alignment cameras 5 and 6 are used as information acquisition units, and an image used for alignment is acquired by irradiating light onto the object 20 and receiving the light returning from the object 20. In this case, acquisition of information used for alignment and internal observation of the object 20 can be specifically realized.

[0072] In the laser processing device 1, the control unit 9 moves the stage 2 in the X, Y, and θ directions based on the imaging results of the alignment cameras 5 and 6, aligns the focusing position of the laser light L to a predetermined position in the object 20, and acquires alignment information. When observing the inside of the object 20 with the interior observation unit 4, the control unit 9 moves the stage 2 in the X, Y, and θ directions based on the alignment information and the XYθ correction information, and aligns the optical axis of the transmitted light focusing lens 43 to the predetermined position. In this way, alignment is performed, and the alignment information at that time can be shared for observation by the interior observation unit 4.

[0073] In the laser processing device 1, the control unit 9 moves the stage 2 in the X direction, the Y direction, and the θ direction so that the center 125 of the test object 20T supported by the stage 2 is positioned on the optical axis of the laser beam focusing lens 33, and acquires first XYθ information, which is position information of the stage 2 after the movement. The control unit 9 moves the stage 2 in the X direction, the Y direction, and the θ direction so that the center 125 of the test object 20T supported by the stage 2 is positioned on the optical axis of the transmitted beam focusing lens 43, and acquires second XYθ information, which is position information of the stage 2 after the movement. The control unit 9 acquires XYθ correction information based on the first XYθ information and the second XYθ information. In this case, it is possible to specifically acquire the XYθ correction information.

[0074] The laser processing device 1 includes only one stage 2. In other words, the laser processing device 1 uses one stage 2 for a plurality of units (the laser processing head 3 and the internal observation unit 4). In this way, each process is performed on one stage 2, so that it is possible to improve tact time.

[0075] [Second embodiment] Next, a second embodiment will be described. In the description of this embodiment, the points similar to those of the first embodiment will be omitted, and differences will be described.

[0076] As shown in FIG. 11, the laser processing apparatus 101 according to the second embodiment differs from the laser processing apparatus 1 according to the first embodiment (see FIG. 1) in that it has a first vertical movement mechanism 107A instead of the first vertical movement mechanism 7A (see FIG. 1), and has a second vertical movement mechanism 107B instead of the second vertical movement mechanism 7B (see FIG. 1).

[0077] The first vertical movement mechanism 107A is a mechanism for moving the laser processing head 3 together with the alignment cameras 5 and 6 along the Z direction. The first vertical movement mechanism 107A has a first vertical shaft 171 provided on one side in the X direction of a columnar first base part 175. The first base part 175 is fixed to, for example, an installation surface or the like. The first vertical shaft 171 extends along the Z direction. The mounting part 39 of the laser processing head 3 is attached to the first vertical shaft 171 so as to be movable along the Z direction. Such a first vertical movement mechanism 107A moves the laser processing head 3 in the Z direction along the first vertical shaft 171 by the driving force of a driving source (not shown). The first vertical movement mechanism 107A is not particularly limited, and various mechanisms can be used as long as they can move the laser processing head 3 in the Z direction.

[0078] The second vertical movement mechanism 107B is a mechanism for moving the internal observation unit 4 along the Z direction. The second vertical movement mechanism 107B has a second vertical shaft 172 provided on the other side of the first base part 175 in the X direction. That is, the first vertical shaft 171 and the second vertical shaft 172 are both provided on the first base part 175, and are arranged to face each other via the first base part 175. The second vertical shaft 172 extends along the Z direction. The mounting part 49 of the internal observation unit 4 is attached to the second vertical shaft 172 so as to be movable along the Z direction. Such a second vertical movement mechanism 107B moves the internal observation unit 4 in the Z direction along the second vertical shaft 172 by the driving force of a driving source (not shown). The second vertical movement mechanism 107B is not particularly limited, and various mechanisms can be used as long as they can move the internal observation unit 4 in the Z direction.

[0079] As described above, the laser processing apparatus 101 also has the effect of realizing faster tact times and reducing poor observation by the internal observation unit 4. Moreover, the laser processing apparatus 101 can realize an apparatus configuration in which the base portion on which the first vertical axis 171 and the second vertical axis 172 are provided is shared as the first base portion 175.

[0080] [Third embodiment] Next, a third embodiment will be described. In the description of this embodiment, the points similar to those of the first embodiment will be omitted, and only the points different from the first embodiment will be described.

[0081] As shown in FIG. 12, the laser processing apparatus 201 of the third embodiment differs from the laser processing apparatus 1 of the first embodiment (see FIG. 1) in that it has a first vertical movement mechanism 207A instead of the first vertical movement mechanism 7A (see FIG. 1), a second vertical movement mechanism 207B instead of the second vertical movement mechanism 7B (see FIG. 1), and further has a laser processing head 203 similar to the laser processing head 3.

[0082] The first vertical movement mechanism 207A is a mechanism for moving the laser processing head 3 together with the alignment cameras 5 and 6 along the Z direction. The first vertical movement mechanism 207A has a first vertical shaft 271 provided on a columnar first base portion 275. The first base portion 275 is fixed to, for example, an installation surface or the like. The first base portion 275 is disposed away from the first horizontal shaft 81 of the first horizontal movement mechanism 8A on one side in the Y direction. The first vertical shaft 271 extends along the Z direction. The mounting portion 39 of the laser processing head 3 is attached to the first vertical shaft 271 so as to be movable along the Z direction. Such a first vertical movement mechanism 207A moves the laser processing head 3 along the first vertical shaft 271 in the Z direction by the driving force of a driving source (not shown). The first vertical movement mechanism 207A is not particularly limited, and various mechanisms can be used as long as they can move the laser processing head 3 in the Z direction.

[0083] The second vertical movement mechanism 207B is a mechanism for moving the internal observation unit 4 together with the laser processing head 203 along the Z direction. The second vertical movement mechanism 207B has a second vertical shaft 272 provided on a columnar second base portion 276. The second base portion 276 is fixed to, for example, an installation surface or the like. The second base portion 276 is spaced apart from the first base portion 275 on the other side in the Y direction. The second base portion 276 is spaced apart from the first horizontal shaft 81 of the first horizontal movement mechanism 8A on the other side in the Y direction. The second vertical shaft 272 extends along the Z direction. The mounting portion 49 of the internal observation unit 4 is attached to the second vertical shaft 272 so as to be movable along the Z direction. Such a second vertical movement mechanism 207B moves the internal observation unit 4 along the second vertical shaft 272 in the Z direction by the driving force of a driving source (not shown). The second vertical movement mechanism 207B is not particularly limited, and various mechanisms can be used as long as they can move the internal observation unit 4 in the Z direction.

[0084] The laser processing head 203 is configured in the same manner as the above-described laser processing head 3. The laser processing head 203 is provided on the mounting portion 49. The laser processing head 203 is disposed on the mounting portion 49 so as to face the laser processing head 3 in the Y direction.

[0085] As described above, the laser processing apparatus 201 also has the effect of realizing faster tact times and reducing observation failures by the interior observation unit 4. Moreover, the laser processing apparatus 201 can achieve a compact device configuration in the X direction.

[0086] The above embodiment is a description of one aspect of the present invention, therefore the present invention is not limited to the above embodiment and may be modified as desired.

[0087] In the above embodiment, the alignment cameras 5 and 6 are used as the information acquisition unit, but this is not limited thereto, and a sensor or the like may be used as long as it can acquire information to be used for alignment. In the above embodiment, the second vertical movement mechanism 7B, 107B, 207B that moves the entire internal observation unit 4 in the Z direction is used, but instead of this, an actuator or the like that moves the transmitted light condensing lens 43 in the Z direction may be used as the second vertical movement mechanism. In this case, the alignment cameras 5 and 6 and the transmitted light condensing lens 43 can each be moved in the Z direction by a different movement mechanism.

[0088] In the above embodiment, the alignment information is information regarding the position in the X direction, the Y direction, and the θ direction, but the alignment information may be information regarding the position in only the X direction and the Y direction. In the above embodiment, the position correction information is XYθ correction information regarding the position in the X direction, the Y direction, and the θ direction, but the alignment information may be information regarding the position in only the X direction and the Y direction. The configurations in the above embodiment and modified examples are not limited to the materials and shapes described above, and various materials and shapes can be applied. In addition, the configurations in the above embodiment and modified examples can be arbitrarily applied to the configurations in other embodiments or modified examples. [Explanation of symbols]

[0089] 1,101,201...laser processing apparatus, 2...stage (support part), 3...laser processing head (irradiation part), 4...internal observation unit (internal observation part), 5,6...alignment camera (information acquisition part), 7A,107A,207A...first vertical movement mechanism, 7B,107B,207B...second vertical movement mechanism, 8A...first horizontal movement mechanism (horizontal movement mechanism), 8B...second horizontal movement mechanism (horizontal movement mechanism), 9...control part, 12...modification area, 20...object, 20T...test object, 33...laser light focusing lens, 43...transmitted light focusing lens, 71,171,271...first vertical axis, 72,172,272...second vertical axis, 75,175,275...first base part, 76,276...second base part, I1...transmitted light, L...laser light.

Claims

1. A laser processing apparatus for forming a modified region in an object by irradiating the object with laser light, comprising: A support portion that supports the object; an irradiation unit that irradiates the object supported by the support unit with the laser light; an information acquisition unit provided in the irradiation unit and acquiring information used for aligning a focusing position of the laser light on the object; an interior observation unit having a transmitted light condensing lens that condenses transmitted light that is transparent to the object on the object, and that observes the inside of the object using the transmitted light; a first vertical movement mechanism that moves the irradiation unit together with the information acquisition unit along a vertical direction; a second vertical movement mechanism that moves at least one of the internal observation unit and the transmitted light condensing lens along a vertical direction; a horizontal movement mechanism that moves the support part along a horizontal direction; a control unit that controls operations of at least the first vertical movement mechanism, the second vertical movement mechanism, and the horizontal movement mechanism, The control unit is a process of moving the support part along the horizontal direction by the horizontal movement mechanism based on the information acquired by the information acquisition part, aligning a focusing position of the laser light to a predetermined position on the target object, and acquiring alignment information related to position information of the support part at the time of the alignment; When observing the inside of the object using the internal observation unit, the laser processing apparatus performs a process of moving the support unit horizontally using the horizontal movement mechanism based on the alignment information and position correction information regarding the positional relationship of the internal observation unit relative to the irradiation unit, and aligning the optical axis of the transmitted light focusing lens to the specified position in the object.

2. The horizontal movement mechanism includes: a first horizontal movement mechanism that moves the support portion along a first horizontal direction; The laser processing apparatus according to claim 1 , further comprising: a second horizontal movement mechanism that moves the support portion along a second horizontal direction perpendicular to the first horizontal direction.

3. The first vertical movement mechanism has a first vertical axis provided on a first base portion, and moves the irradiation unit in a vertical direction along the first vertical axis; The laser processing apparatus of claim 2, wherein the second vertical movement mechanism has a second vertical axis provided on a second base portion spaced apart in the first horizontal direction from the first base portion, and moves the internal observation portion vertically along the second vertical axis.

4. The first vertical movement mechanism has a first vertical axis provided on one side of the first base portion in the first horizontal direction, and moves the irradiation unit in a vertical direction along the first vertical axis, The laser processing apparatus of claim 2, wherein the second vertical movement mechanism has a second vertical axis provided on the other side of the first horizontal direction on the first base portion, and moves the internal observation portion in a vertical direction along the second vertical axis.

5. The first vertical movement mechanism has a first vertical axis provided on a first base portion, and moves the irradiation unit in a vertical direction along the first vertical axis; The laser processing apparatus of claim 2, wherein the second vertical movement mechanism has a second vertical axis provided on a second base portion spaced apart in the second horizontal direction from the first base portion, and moves the internal observation portion vertically along the second vertical axis.

6. 6. The laser processing device according to claim 1, wherein the irradiation unit and the internal observation unit are configured so as to be immovable in a horizontal direction.

7. The laser processing device according to any one of claims 1 to 5, wherein the support portion is configured to be rotatable about a rotation axis along a vertical direction.

8. The laser processing apparatus according to any one of claims 1 to 7, wherein the information acquisition unit acquires information used for aligning the focusing position of the laser light by irradiating light onto the object and receiving the light returning from the object.

9. The irradiation unit has a laser beam focusing lens that focuses the laser beam on the object, The control unit is a process of moving the support part along the horizontal direction by the horizontal movement mechanism so that a reference position of a test object supported by the support part is positioned on an optical axis of the laser beam focusing lens, and acquiring first information which is position information of the support part after the movement; a process of moving the support part along the horizontal direction by the horizontal movement mechanism so that a reference position of the test object supported by the support part is positioned on the optical axis of the transmitted light focusing lens, and acquiring second information which is position information of the support part after the movement; The laser processing apparatus according to claim 1 , further comprising: a process of acquiring the position correction information based on the first information and the second information.

10. A laser processing apparatus for forming a modified region in an object by irradiating the object with laser light, comprising: A support portion that supports the object; an irradiation unit that irradiates the object supported by the support unit with the laser light; an information acquisition unit provided in the irradiation unit and acquiring information used for aligning a focusing position of the laser light on the object; an interior observation unit having a transmitted light condensing lens that condenses transmitted light that is transparent to the object on the object, and that observes the inside of the object using the transmitted light; a first vertical movement mechanism that moves the irradiation unit together with the information acquisition unit along a vertical direction; a second vertical movement mechanism that moves at least one of the internal observation unit and the transmitted light condensing lens along a vertical direction; a horizontal movement mechanism that moves the support part along a horizontal direction; a control unit that controls operations of at least the first vertical movement mechanism, the second vertical movement mechanism, and the horizontal movement mechanism, The horizontal movement mechanism includes: a first horizontal movement mechanism that moves the support portion along a first horizontal direction; a second horizontal movement mechanism that moves the support portion along a second horizontal direction perpendicular to the first horizontal direction, The first vertical movement mechanism has a first vertical axis provided on one side of the first base portion in the first horizontal direction, and moves the irradiation unit in a vertical direction along the first vertical axis, The second vertical movement mechanism has a second vertical axis provided on the other side of the first horizontal direction on the first base portion, and moves the internal observation portion in a vertical direction along the second vertical axis, a laser processing apparatus.

Images