Contactless communication media

Abstract

To provide a non-contact communication medium that can prevent damage to a storage body.SOLUTION: A non-contact communication medium 1 has an electronic component 10, a storage body 20, and a damper 28. The electronic component 10 performs non-contact communication. The storage body 20 is formed of ceramics and stores the electronic component 10. The damper 28 covers at least part of the storage body 20.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to contactless communication media. [Background technology]

[0002] Conventionally, goods are managed using RFID (Radio Frequency Identifier) ​​tags.

[0003] Patent Document 1 discloses a technology for sealing an RFID tag in a heat-insulating container in order to use the RFID tag to manage parts that are processed at high temperatures in factories, etc. The container in which the RFID tag is sealed is attached to the part and flows through the manufacturing process together with the part. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-129838 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the above-described container may be subject to damage such as chipping or cracking during the manufacturing process.

[0006] The present disclosure has been made in view of the above, and aims to provide a contactless communication medium that can suppress damage to its container. [Means for solving the problem]

[0007] A non-contact communication medium according to one aspect of the present disclosure includes an electronic component, a housing, and a damper. The electronic component performs non-contact communication. The housing is made of ceramic and houses the electronic component. The damper covers at least a portion of the housing. [Effects of the Invention]

[0008] According to the present disclosure, damage to the container can be suppressed. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a side view of a contactless communication medium according to an embodiment. [Figure 2] FIG. 2 is a plan view of the contactless communication medium according to the embodiment. [Figure 3] 3 is a cross-sectional view taken along the line III-III in FIG. 2. FIG. [Figure 4] FIG. 4 is a cross-sectional view of a contactless communication medium according to a first modified example. [Figure 5] FIG. 5 is a cross-sectional view of a non-contact communication medium according to a second modification. [Figure 6] FIG. 6 is a plan view of a non-contact communication medium according to a second modified example. [Figure 7] FIG. 7 is a side view of a non-contact communication medium according to a third modified example. [Figure 8] FIG. 8 is a plan view of a contactless communication medium according to a third modified example. [Figure 9] FIG. 9 is a side view of a non-contact communication medium according to a fourth modified example. [Figure 10] FIG. 10 is a plan view of a non-contact communication medium according to a fourth modified example. [Figure 11] FIG. 11 is a cross-sectional view taken along the line XI-XI shown in FIG. [Figure 12] FIG. 12 is a cross-sectional view of a non-contact communication medium according to a fifth modified example. [Figure 13] FIG. 13 is a cross-sectional view of a non-contact communication medium according to a sixth modified example. [Figure 14] FIG. 14 is a cross-sectional view of a non-contact communication medium according to a seventh modification. [Figure 15] FIG. 15 is a side view of a non-contact communication medium according to an eighth modification. [Figure 16] FIG. 16 is a plan view of a contactless communication medium according to an eighth modification. [Figure 17]17 is a cross-sectional view taken along the line XVII-XVII shown in FIG. [Figure 18] FIG. 18 is an enlarged cross-sectional view of a non-contact communication medium according to a ninth modification. [Figure 19] FIG. 19 is an enlarged cross-sectional view of a non-contact communication medium according to a tenth modification. [Figure 20] FIG. 20 is an enlarged cross-sectional view of a non-contact communication medium according to an eleventh modification. [Figure 21] FIG. 21 is an enlarged cross-sectional view of a non-contact communication medium according to a twelfth modification. [Figure 22] FIG. 22 is an enlarged cross-sectional view of a non-contact communication medium according to a thirteenth modification. [Figure 23] FIG. 23 is an enlarged cross-sectional view of a non-contact communication medium according to a fourteenth modification. [Figure 24] FIG. 24 is an enlarged cross-sectional view of a non-contact communication medium according to a fifteenth modification. [Figure 25] FIG. 25 is an enlarged cross-sectional view of a non-contact communication medium according to a sixteenth modification. [Figure 26] 26 is a cross-sectional view taken along the line XXVI-XXVI of FIG. 25. FIG. [Figure 27] FIG. 27 is an enlarged cross-sectional view of a non-contact communication medium according to a seventeenth modification. [Figure 28] FIG. 28 is an enlarged cross-sectional view of a non-contact communication medium according to an eighteenth modification. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a form for implementing a contactless communication medium according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the contactless communication medium according to the present disclosure is not limited to this embodiment. Furthermore, each embodiment can be appropriately combined within a range that does not cause contradiction in processing content. Furthermore, the same components in each of the following embodiments will be given the same reference numerals, and duplicated explanations will be omitted.

[0011] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0012] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis, Y-axis, and Z-axis directions are defined as being perpendicular to each other, and the positive Z-axis direction is the vertically upward direction.

[0013] <Configuration of contactless communication medium> The configuration of a non-contact communication medium according to an embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a side view of the non-contact communication medium according to an embodiment. Fig. 2 is a plan view of the non-contact communication medium according to an embodiment. Fig. 3 is a cross-sectional view taken along the line III-III in Fig. 2.

[0014] 1 to 3, a contactless communication medium 1 according to the embodiment includes an electronic component 10 and a container 20. The electronic component 10 is, for example, an RFID tag.

[0015] Electronic component 10 as RFID has an antenna for contactless communication, an IC chip that performs contactless communication via the antenna, and a memory that stores identification information, all on a substrate made of, for example, LTCC (Low Temperature Co-fired Ceramics) etc. Electronic component 10 as RFID can transmit the identification information stored in the memory to an external device (for example, an RFID reader) by contactless communication using electromagnetic induction, radio waves, etc.

[0016] The non-contact communication medium 1 according to the embodiment may be used, for example, in a high-temperature environment exceeding the heat resistance temperature of the electronic component 10. For example, the non-contact communication medium 1 according to the embodiment is attached to a component to be plated and plated together with the component. The temperature for plating is, for example, 75°C to 500°C. Furthermore, the non-contact communication medium 1 according to the embodiment may be treated with acidic or alkaline chemicals together with the component. That is, the non-contact communication medium 1 according to the embodiment may be used in an acidic or alkaline environment exceeding the chemical resistance of the electronic component 10.

[0017] Therefore, in the contactless communication medium 1 according to the embodiment, the electronic component 10 is sealed in the container 20 in order to protect the electronic component 10 from high-temperature environments and acidic and alkaline environments.

[0018] Container 20 has first and second substrates 21 and 22 made of ceramics and adhesive layer 23, and first and second substrates 21 and 22 are bonded to each other via adhesive layer 23. Container 20 accommodates electronic component 10 in internal space 26 formed by bonded first and second substrates 21 and 22.

[0019] The ceramics constituting the first substrate 21 and the second substrate 22 can be, for example, corderite. Corderite has a small thermal expansion coefficient, which makes it excellent in thermal shock resistance, and also has low thermal conductivity, which makes it difficult for heat to be transferred to the electronic component 10. In this way, by using corderite, the electronic component 10 can be appropriately protected from high-temperature environments. However, the ceramics constituting the first substrate 21 and the second substrate 22 do not necessarily have to be corderite. This point will be described later.

[0020] The adhesive layer 23 is made of an adhesive. The adhesive only needs to have heat resistance that can withstand the environment in which the non-contact communication medium 1 is used. For example, an inorganic adhesive can be used as such an adhesive. Alternatively, an inorganic adhesive to which ceramic powder has been added can be used as the adhesive.

[0021] The first substrate 21 and the second substrate 22 have a cylindrical shape. Specifically, the first substrate 21 and the second substrate 22 have flat surfaces (upper and lower end surfaces) that are circular in plan view at both ends, and have a curved surface (outer peripheral surface) that connects the upper and lower end surfaces. The adhesive layer 23 is located between the lower end surface 21a of the first substrate 21 and the upper end surface 22a of the second substrate 22, and the first substrate 21 and the second substrate 22 joined by the adhesive layer 23 have a cylindrical shape as a whole (a so-called coin shape).

[0022] A recess 22b is located on the upper end surface 22a of the second substrate 22, and the electronic component 10 is housed in the recess 22b. The size of the recess 22b is not particularly limited, as long as it is at least larger than the dimensions of the electronic component 10. The recess 22b is sealed by bonding the first substrate 21 and the second substrate 22 via the adhesive layer 23. This seals the electronic component 10.

[0023] The non-contact communication medium 1 according to the embodiment further includes a damper 28. The damper 28 covers at least a part of the outer surface of the housing 20. The damper 28 is formed of a heat-resistant resin such as PEEK (polyether ether ketone), polyimide, or silicone. Note that the damper 28 need only be made of a material that is at least tougher than the housing 20, and does not necessarily have to be made of resin.

[0024] In this way, in the non-contact communication medium 1 according to the embodiment, at least a part of the housing 20 is covered with the damper 28. This allows the damper 28 to absorb physical shocks that the housing 20 receives while being transported through a manufacturing process together with components to be monitored, for example. Therefore, according to the non-contact communication medium 1 according to the embodiment, damage to the housing 20 can be suppressed.

[0025] Furthermore, the damper 28 is easy to replace because it is separate from the container 20. Therefore, by replacing the damper 28, the non-contact communication medium 1 can be used for a long period of time.

[0026] The damper 28 according to the embodiment has a strip shape extending along the outer peripheral surface of the housing 20, and covers the entire periphery of the adhesive layer 23. By covering the adhesive layer 23 with the damper 28 in this manner, peeling between the first base material 21 and the second base material 22 can be suppressed.

[0027] <Manufacturing method> Here, an example of a method for manufacturing the non-contact communication medium 1 according to the embodiment will be described.

[0028] First, cordierite powder and sintering aid powder are prepared. Examples of sintering aids include rare earth oxides (yttrium oxide, cerium oxide, etc.), alkali metal oxides (lithium oxide, sodium oxide, etc.), and alkaline earth metals (calcium oxide). Instead of cordierite powder, a mixture of magnesium oxide, aluminum oxide, and silicon oxide in the desired cordierite composition ratio may also be used. Next, the prepared powder is placed in a vibration mill together with water as a solvent, and pulverized and mixed to obtain the raw material.

[0029] Next, organic components such as binders, plasticizers, and release agents are added to the raw materials obtained by grinding and mixing, and then these are stirred to produce a slurry.The slurry is then spray-dried using a spray dryer to produce ceramic granules.

[0030] Next, the produced ceramic granules are subjected to powder press molding to obtain the green bodies of the first substrate 21 and the second substrate 22. Note that the recesses 22b (see FIG. 3) are also formed by the mold in this step.

[0031] Next, the compact is degreased by heat treating it in an air atmosphere, a vacuum atmosphere, or a nitrogen gas atmosphere, and then fired to obtain the first substrate 21 and the second substrate 22.

[0032] Next, electronic component 10 is accommodated in recess 22b of second substrate 22, and then first substrate 21 and second substrate 22 are joined together using an adhesive to obtain housing 20 accommodating electronic component 10. Damper 28 is then attached to housing 20. For example, strip-shaped damper 28 may be prepared in advance and attached to housing 20. Alternatively, strip-shaped damper 28 attached to housing 20 may be created by attaching a mold to housing 20 and pouring resin into the mold. In this manner, contactless communication medium 1 according to the embodiment is obtained.

[0033] <Modifications regarding the corners of the container and the damper> Next, modifications of the above-described embodiment will be described. First, modifications relating to the corners of the container and the damper will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view of a non-contact communication medium according to a first modification.

[0034] 4, a contactless communication medium 1A according to the first modification has a container 20A. The container 20A has a first base material 21A, a second base material 22A, and an adhesive layer 23A.

[0035] First base material 21A and second base material 22A have a cylindrical shape with rounded corners. Specifically, first base material 21A has rounded corner 21A1 on the periphery of its upper end surface. Similarly, second base material 22A has rounded corner 22A1 on the periphery of its lower end surface.

[0036] In this way, the first substrate 21A and the second substrate 22A according to the first modification have the curved corners 21A1, 22A1. Therefore, according to the non-contact communication medium 1A according to the first modification, it is possible to make the first substrate 21A and the second substrate 22A less likely to be chipped.

[0037] The first base material 21A also has a rounded corner 21A2 at the periphery of the lower end surface 21Aa, which is the end of the interface with the adhesive layer 23A. Similarly, the second base material 22A also has a rounded corner 22A2 at the periphery of the upper end surface 22Aa, which is the end of the interface with the adhesive layer 23A.

[0038] As described above, the first substrate 21A and the second substrate 22A according to the first modification have curved corners 21A2, 22A2 at the end of the interface with the adhesive layer 23A. This increases the thickness of the adhesive layer 23A at the end of the interface, thereby preventing peeling between the first substrate 21A and the second substrate 22A. For example, peeling between the first substrate 21A and the second substrate 22A in the shear direction, i.e., peeling caused by the first substrate 21A and the second substrate 22A shifting from each other along the bonding surface, can be effectively prevented.

[0039] Furthermore, the damper 28A according to the first modified example also has corners 28A1 and 28A2 that are curved in an R shape. Specifically, the damper 28A has corners 28A1 and 28A2 that are curved in an R shape at the tip end in the direction in which the damper 28A protrudes from the housing 20A. By curving the corners 28A1 and 28A2 of the damper 28A in this way, damage to the damper 28A can be suppressed.

[0040] <Modified damper> Next, modified examples of the damper will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a cross-sectional view of a non-contact communication medium according to a second modified example. Fig. 6 is a plan view of the non-contact communication medium according to the second modified example.

[0041] 5 and 6, the non-contact communication medium 1B according to the second modification has a damper 28B that covers the entire housing 20. In this way, the entire housing 20 may be covered with the damper 28B. This makes it possible to more reliably prevent damage to the housing 20. Furthermore, not only is the adhesive layer 23 covered, but the first base material 21 and the second base material 22 are fixed together by the damper 28B, so that peeling between the first base material 21 and the second base material 22 can also be more reliably prevented.

[0042] The non-contact communication medium 1 according to the second modified example can be obtained, for example, by dipping (immersing) the manufactured container 20 in molten resin.

[0043] <Modifications regarding the overall shape of the container> Next, modifications of the overall shape of the container will be described. Fig. 7 is a side view of a non-contact communication medium according to a third modification. Fig. 8 is a plan view of the non-contact communication medium according to the third modification.

[0044] 7 and 8, a non-contact communication medium 1C according to the third modification includes an electronic component 10, a housing 20C, and a damper 28C. The housing 20C includes a first base material 21C, a second base material 22C, and an adhesive layer 23C.

[0045] The container 20C according to the third modification has a spherical shape. Specifically, the first base material 21C and the second base material 22C have hemispherical shapes, and are joined together via the adhesive layer 23C, thereby forming the spherical shape of the container 20C.

[0046] The damper 28C according to the third modification has a strip shape and covers the adhesive layer 23C. The damper 28C may cover the entire housing body 20C.

[0047] By making the container 20C spherical in this way, damage such as chipping or cracking of the container 20C can be more reliably prevented.

[0048] 9 is a side view of a non-contact communication medium according to a fourth modified example, FIG. 10 is a plan view of the non-contact communication medium according to the fourth modified example, and FIG. 11 is a cross-sectional view taken along the arrows XI-XI shown in FIG.

[0049] As shown in FIGS. 9 to 11, a non-contact communication medium 1D according to the fourth modification includes an electronic component 10 (see FIG. 11), a container 20D, and a damper 28D.

[0050] Container 20D has first substrate 21D, second substrate 22D, adhesive layer 23D, first flange 24D, and second flange 25D. First substrate 21D, second substrate 22D, and adhesive layer 23D have an overall spherical shape, similar to first substrate 21C, second substrate 22C, and adhesive layer 23C according to the third modification. Note that first substrate 21D, second substrate 22D, and adhesive layer 23D may also have an overall cylindrical shape, similar to first substrate 21, second substrate 22, and adhesive layer 23 according to the embodiment.

[0051] First flange 24D is a portion that protrudes in a flange-like shape from the outer peripheral surface of first substrate 21D, and has a ring shape that extends around the entire circumference of first substrate 21D. Similarly, second flange 25D is a portion that protrudes in a flange-like shape from the outer peripheral surface of second substrate 22D, and has a ring shape that extends around the entire circumference of second substrate 22D.

[0052] First flange 24D and second flange 25D are made of the same ceramic (for example, cordierite) as first substrate 21D and second substrate 22D. By using the same ceramic, the thermal expansion coefficients are the same, so even if a sudden temperature change occurs, cracks or the like due to differences in the thermal expansion coefficients are unlikely to occur between first substrate 21D and second substrate 22D and first flange 24D and second flange 25D. Specifically, first flange 24D is formed integrally with first substrate 21D, and second flange 25D is formed integrally with second substrate 22D.

[0053] The first flange 24D is located on the outer periphery of the end portion on the lower end surface 21Da side of the first substrate 21D so that its lower end surface is flush with the lower end surface 21a of the first substrate 21D. The second flange 25D is located on the outer periphery of the end portion on the upper end surface 22Da side of the second substrate 22D so that its upper end surface is flush with the upper end surface 22Da of the second substrate 22D.

[0054] Thus, the non-contact communication medium 1D of the fourth modified example has a first flange portion 24D on the outer periphery of the joint end portion of the first substrate 21D with the second substrate 22D, and has a second flange portion 25D on the outer periphery of the joint end portion of the second substrate 22D with the first substrate 21D.

[0055] The adhesive layer 23D is located not only between the first base material 21D and the second base material 22D, but also between the first flange 24D and the second flange 25D. This increases the bonding area compared to a case without the first flange 24D and the second flange 25D, and therefore the non-contact communication medium 1D according to the fourth modification can more reliably bond the first base material 21D and the second base material 22D. In other words, the bonded portion of the housing 20D can be made less likely to peel off.

[0056] Furthermore, a damper 28D according to the fourth modification has a band shape and covers the first flange portion 24D, the second flange portion 25D, and the adhesive layer 23D.

[0057] The first flange 24D and the second flange 25D protrude from the outer surfaces of the first substrate 21D and the second substrate 22D, and are therefore susceptible to damage such as chipping and cracking. In contrast, by covering the first flange 24D and the second flange 25D with a damper 28D, as in the non-contact communication medium 1D according to the fourth modification, it is possible to suppress damage to the first flange 24D and the second flange 25D.

[0058] In this way, the non-contact communication medium 1D according to the fourth modification can appropriately protect the container 20D having the first flange 24D and the second flange 25D.

[0059] Fig. 12 is a cross-sectional view of a non-contact communication medium according to Modification 5. As shown in Fig. 12, a non-contact communication medium 1E according to Modification 5 includes an electronic component 10, a housing 20E, and a damper 28E.

[0060] The housing 20E according to the fifth modification has a recess 29 that extends around the entire periphery of the housing 20E. Specifically, the recess 29 is located so as to straddle an outer periphery 21E5 at the joint end of the first base material 21E with the second base material 22E and an outer periphery 22E5 at the joint end of the second base material 22E with the first base material 21E.

[0061] A damper 28E according to the fifth modification has a band shape and is positioned in a recess 29 of a container 20E.

[0062] In this way, by providing the housing body 20E with the recess 29 for fitting the damper 28E, the position of the damper 28E is fixed, and therefore, it is possible to prevent the damper 28E from coming off the housing body 20E while, for example, the non-contact communication medium 1E is being used. Furthermore, the presence of the recess 29 in the housing body 20E makes it possible to facilitate the work of attaching the damper 28E to the housing body 20E.

[0063] Although an example in which damper 28E has a rectangular shape and protrudes from housing 20E has been shown here, the shape of damper 28E is not limited thereto. For example, damper 28F of a non-contact communication medium 1F according to a sixth modified example shown in Fig. 13 has an outer surface that is curved so as to be flush with the outer surface of housing 20E. By giving damper 28F such a shape, it is possible to more reliably prevent damper 28F from coming off housing 20E while non-contact communication medium 1F is in use.

[0064] Further, although an example in which the container 20E has a spherical shape has been shown here, the shape of the container 20E is not limited to a spherical shape, and may be, for example, a cylindrical shape or the like.

[0065] <Modifications regarding adhesive layer> Next, a modification of the adhesive layer will be described with reference to Fig. 14. Fig. 14 is a cross-sectional view of a non-contact communication medium according to a seventh modification.

[0066] 14, a non-contact communication medium 1G according to the seventh modification includes a housing 20G. An adhesive layer 23G of the housing 20G according to the seventh modification protrudes from between the first base material 21 and the second base material 22. Specifically, the adhesive layer 23G protrudes over the entire periphery of the housing 20G. However, the adhesive layer 23G may protrude from only a portion of the circumferential direction of the housing 20G.

[0067] In this way, the adhesive layer 23G protrudes from the first base material 21 and the second base material 22, thereby more firmly bonding the first base material 21 and the second base material 22. Therefore, the first base material 21 and the second base material 22 can be more reliably restrained.

[0068] Furthermore, damper 28G according to the seventh modification has a band shape and covers adhesive layer 23G that protrudes from first base material 21 and second base material 22. Therefore, it is possible to prevent first base material 21 and second base material 22 from peeling from each other, and also possible to more firmly fix damper 28G to housing body 20G by means of protruding adhesive layer 23G.

[0069] Although the cylindrical container 20G has been described as an example here, the present invention is not limited to this, and the adhesive layer 23G may protrude from the spherical containers 20C to 20E shown in FIG. 7 and the like.

[0070] <Modifications of the Electronic Component Holding Structure> However, the conventional technology has room for further improvement in terms of preventing damage such as chipping of electronic components such as RFID tags caused by movement within the housing space. Therefore, the non-contact communication medium may have a structure for holding down the electronic components.

[0071] <Eighth Modification> First, the configuration of a non-contact communication medium according to an eighth modified example having the above-described holding structure will be described with reference to Fig. 15 to Fig. 17. Fig. 15 is a side view of the non-contact communication medium according to the eighth modified example. Fig. 16 is a plan view of the non-contact communication medium according to the eighth modified example. Fig. 17 is a cross-sectional view taken along the arrows XVII-XVII shown in Fig. 16.

[0072] The holding structures for electronic component 10 shown in the following eighth to tenth modifications can be appropriately incorporated into the non-contact communication media according to the above-described embodiment and the first to seventh modifications.

[0073] 15 to 17, a contactless communication medium 1L according to the eighth modification includes an electronic component 10 and a container 200. The electronic component 10 is, for example, an RFID tag.

[0074] The housing 200 has a first base material 210 and a second base material 220 made of ceramics, and an adhesive layer 230, and the first base material 210 and the second base material 220 are bonded to each other via the adhesive layer 230. Specifically, the first base material 210 and the second base material 220 have flat surfaces 210a, 220a that face each other and have approximately the same diameter, and these flat surfaces 210a, 220a are bonded to each other via the adhesive layer 230. Hereinafter, the flat surface 210a of the first base material 210 will be referred to as the "first flat surface 210a," and the flat surface 220a of the second base material 220 will be referred to as the "second flat surface 220a."

[0075] The first base material 210 has an accommodating recess 250 that accommodates the electronic component 10. The accommodating recess 250 opens at the center of the first flat surface 210a. The first flat surface 210a is closed by the second flat surface 220a of the second base material 220. This seals the electronic component 10 inside the enclosure 200.

[0076] The adhesive layer 230 is made of an adhesive agent. The adhesive agent only needs to have heat resistance that can withstand the environment in which the non-contact communication medium 1L is used.

[0077] Both first substrate 210 and second substrate 220 have a cylindrical shape. Specifically, first substrate 210 and second substrate 220 have flat surfaces (upper and lower end surfaces) that are circular in plan view at both ends, and have a curved surface (outer peripheral surface) connecting the upper and lower end surfaces. Adhesive layer 230 is located between first flat surface 210a, which is the upper end surface of first substrate 210, and second flat surface 220a, which is the lower end surface of second substrate 220. First substrate 210 and second substrate 220 joined by adhesive layer 230 have an overall cylindrical shape (a so-called coin shape).

[0078] An accommodating recess 250 is located on the first flat surface 210a of the first base material 210, and the electronic component 10 is accommodated in the accommodating recess 250. The inside of the accommodating recess 250 is a space, and no filler or the like is located therein.

[0079] As shown in FIG. 17, the second base material 220 has an accommodating protrusion 260 that protrudes from the second flat surface 220a and fits into the accommodating recess 250.

[0080] In this way, by fitting the accommodating protrusion 260 into the accommodating recess 250, the internal space of the accommodating recess 250 can be narrowed. As the internal space of the accommodating recess 250 is narrowed, even if the electronic component 10 moves within the internal space of the accommodating recess 250, the amount of movement is reduced. Therefore, according to the non-contact communication medium 1L of the eighth modification, it is possible to prevent damage such as chipping of the electronic component 10 caused by movement of the electronic component 10 within the accommodating recess 250.

[0081] Furthermore, in the non-contact communication medium 1L according to the eighth modification, the electronic component 10 is sandwiched between the tip surface 260a of the accommodating protrusion 260 and the bottom surface 250a of the accommodating recess 250. This makes it possible to suppress movement of the electronic component 10 within the accommodating recess 250. Furthermore, the interior of the accommodating recess 250 is an open space, and the electronic component 10 is not in contact with any member (such as a filler) other than the tip surface 260a of the accommodating protrusion 260 and the bottom surface 250a of the accommodating recess 250. Therefore, compared to when the electronic component 10 is fixed using a filler or the like, heat from the outside is less likely to be transmitted to the electronic component 10.

[0082] In this way, by sandwiching the electronic component 10 between the tip surface 260a of the accommodating protrusion 260 and the bottom surface 250a of the accommodating recess 250, heat conduction to the electronic component 10 can be suppressed while preventing damage to the electronic component 10, such as chipping.

[0083] Furthermore, the tip surface 260a of the accommodating protrusion 260 according to the eighth modification curves toward the bottom surface 250a of the accommodating recess 250, in other words, toward the electronic component 10. This reduces the contact area between the accommodating protrusion 260 and the electronic component 10. This therefore reduces heat conduction from the second base material 220 to the electronic component 10.

[0084] <Ninth Variation> Fig. 18 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 9. As shown in Fig. 18, a container 200M included in a non-contact communication medium 1M according to Modification 9 has a second base material 220M.

[0085] The tip surface of the accommodating protrusion 260M of the second base material 220M is recessed in a curved shape, and this recessed portion accommodates at least a part of the electronic component 10. In the ninth modification, the electronic component 10 is in point contact with the recessed surface 260M1 of the accommodating protrusion 260M, and is sandwiched between the recessed surface 260M1 and the bottom surface 250a of the accommodating recess 250.

[0086] In this way, the tip surface of the accommodating protrusion 260M may be recessed. In this case, too, the contact area between the electronic component 10 and the accommodating protrusion 260M can be reduced. Therefore, the movement of the electronic component 10 can be suppressed while suppressing heat conduction from the second base material 220M to the electronic component 10.

[0087] <Tenth Modification> Fig. 19 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 10. As shown in Fig. 19, a container 200N included in a non-contact communication medium 1N according to Modification 10 has a second base material 220N.

[0088] The tip surface of the accommodating protrusion 260N of the second base material 220N is recessed, and the recessed surface 260N1 is, for example, a flat surface. The electronic component 10 is in surface contact with the recessed surface 260N1 and is sandwiched between the recessed surface 260N1 and the bottom surface 250a of the accommodating recess 250.

[0089] In this way, by bringing the electronic component 10 into surface contact with the accommodating protrusion 260N, movement of the electronic component 10 can be more reliably suppressed. Furthermore, the edge portion 260N2 located on the outer periphery of the recessed surface 260N1 protrudes further toward the bottom surface 250a of the accommodating recess 250 than the recessed surface 260N1. Therefore, even if the electronic component 10 moves, the electronic component 10 abuts against the edge portion 260N2, thereby reducing the amount of movement of the electronic component 10 and preventing damage to the electronic component 10, such as chipping.

[0090] <Eleventh Modification> Fig. 20 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 11. As shown in Fig. 20, a container 200P included in a non-contact communication medium 1P according to Modification 11 has a second base material 220P.

[0091] The tip surface of the accommodating protrusion 260P of the second base material 220P is recessed, and the recessed surface 260P1 is flat.

[0092] In the eleventh modification, edge 260P2 located on the outer periphery of recessed surface 260P1 contacts bottom surface 250a of accommodating recess 250, and electronic component 10 is completely accommodated in the recessed portion of accommodating protrusion 260P.

[0093] In this way, the edge 260P2 of the accommodating protrusion 260P may contact the bottom surface 250a of the accommodating recess 250. In this case, the accommodating protrusion 260P also functions as a spacer that defines the distance between the first flat surface 210a and the second flat surface 220a. Therefore, according to the non-contact communication medium 1P of the eleventh modification, it is possible to suppress variations in the thickness of the adhesive layer 230 among a plurality of non-contact communication media 1P. In other words, it is possible to suppress variations in quality among a plurality of non-contact communication media 1P.

[0094] <Twelfth Modification> Fig. 21 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 12. As shown in Fig. 21, a container 200Q included in a non-contact communication medium 1Q according to Modification 12 has a second base material 220Q.

[0095] The accommodating protrusion 260Q of the second base material 220Q has a plurality of protrusions 260Q1 protruding from its tip end surface. In the twelfth modification, the electronic component 10 is sandwiched between the plurality of protrusions 260Q1 and the bottom surface 250a of the accommodating recess 250.

[0096] Here, an example has been shown in which a plurality of protrusions 260Q1 are provided on the tip surface of the accommodating protrusion 260Q, but it is sufficient that the accommodating protrusion 260Q has at least one protrusion 260Q1.

[0097] In this manner, the accommodating protrusion 260Q may have at least one protrusion 260Q1 protruding from the tip end surface. In this case, too, the contact area between the electronic component 10 and the accommodating protrusion 260Q can be reduced. Therefore, the movement of the electronic component 10 can be suppressed while suppressing heat conduction from the second base material 220Q to the electronic component 10.

[0098] Furthermore, by providing multiple protrusions 260Q1, the accommodating protrusion 260Q and the electronic component 10 come into contact at multiple points, thereby making it possible to more reliably suppress movement of the electronic component 10 while reducing the contact area between the electronic component 10 and the accommodating protrusion 260Q.

[0099] <13th Modification> Fig. 22 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 13. As shown in Fig. 22, a container 200R included in a non-contact communication medium 1R according to Modification 13 has, for example, a second base material 220Q similar to that of Modification 12.

[0100] Furthermore, a housing 200R according to the thirteenth modification includes a first base material 210R. The first base material 210R includes an accommodating recess 250R. The accommodating recess 250R includes a plurality of protrusions 250R1 protruding from a bottom surface 250a. In the thirteenth modification, the electronic component 10 is sandwiched between the plurality of protrusions 260Q1 provided on the accommodating protrusion 260Q and the plurality of protrusions 250R1 provided on the accommodating recess 250R.

[0101] Here, an example has been shown in which a plurality of protrusions 250R1 are provided on the bottom surface 250a of the accommodating recess 250R, but it is sufficient that the accommodating recess 250R has at least one protrusion 250R1.

[0102] In this manner, the accommodating recess 250R may have at least one protrusion 250R1 protruding from the bottom surface 250a. In this case, too, the contact area between the electronic component 10 and the accommodating recess 250R can be reduced. Therefore, the movement of the electronic component 10 can be suppressed while suppressing the heat conduction from the first base material 210R to the electronic component 10.

[0103] Furthermore, by providing multiple protrusions 250R1, the accommodating recess 250R and the electronic component 10 come into contact at multiple points, thereby making it possible to more reliably suppress movement of the electronic component 10 while reducing the contact area between the electronic component 10 and the accommodating recess 250R.

[0104] Furthermore, by setting the distance between the protrusions 250R1 so that the electronic component 10 fits between the two protrusions 250R1, the positioning of the electronic component 10 can be facilitated.

[0105] <14th Modification> Fig. 23 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 14. As shown in Fig. 23, a container 200S included in a non-contact communication medium 1S according to Modification 14 has a cushioning material 270S1 on a tip surface 260a of a containing protrusion 260. The container 200S also has a cushioning material 270S2 on a bottom surface 250a of a containing recess 250.

[0106] The cushioning materials 270S1 and 270S2 are made of a material, such as a resin, that is more flexible than the ceramic first base material 210 and the second base material 220. Suitable examples of such resins include silicone, amide, imide, and amide-imide resins. Furthermore, the cushioning materials 270S1 and 270S2 preferably have heat resistance.

[0107] In the fourteenth modification, the electronic component 10 is sandwiched between the accommodating protrusion 260 and the accommodating recess 250 via the cushioning materials 270S1 and 270S2. Therefore, even if the housing 200S receives an impact, the cushioning materials 270S1 and 270S2 absorb the impact, thereby preventing the impact from being transmitted to the electronic component 10. Therefore, the non-contact communication medium 1S according to the fourteenth modification can more reliably prevent damage to the electronic component 10.

[0108] Here, an example has been shown in which the cushion materials 270S1 and 270S2 are provided on both the accommodating protrusion 260 and the accommodating recess 250, but the cushion materials 270S1 and 270S2 may be provided on at least one of the accommodating protrusion 260 and the accommodating recess 250.

[0109] <15th Modification> Fig. 24 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 15. As shown in Fig. 24, a container 200T included in a non-contact communication medium 1T according to Modification 15 has a second base material 220T.

[0110] The accommodating protrusion 260T of the second base material 220T according to the fifteenth modification is made of a cushioning material that is more flexible than the first base material 210 and the second base material 220T.

[0111] In this way, the entire accommodating protrusion 260T may be formed of a cushioning material, which allows the accommodating protrusion 260T to be replaced depending on the size of the electronic component 10, for example.

[0112] <16th Modification> Fig. 25 is an enlarged cross-sectional view of a non-contact communication medium according to a sixteenth modification. Fig. 26 is a cross-sectional view taken along the arrows XXVI-XXVI shown in Fig. 25. As shown in Fig. 25, a container 200U included in a non-contact communication medium 1U according to the sixteenth modification has a second base material 220U.

[0113] 25 and 26, the accommodating protrusion 260U of the second base material 220U has a protrusion 260U1 that protrudes circumferentially from the tip end surface. In the sixteenth modification, the electronic component 10 is sandwiched between the circumferential protrusion 260U1 and the bottom surface 250a of the accommodating recess 250.

[0114] In this manner, the accommodating protrusion 260U may have a protrusion 260U1 that protrudes circumferentially from the tip end surface, thereby making it possible to more reliably suppress movement of the electronic component 10 while reducing the contact area between the electronic component 10 and the accommodating protrusion 260U.

[0115] <17th Modification> Fig. 27 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 17. As shown in Fig. 27, a container 200V included in a non-contact communication medium 1V according to Modification 17 has an adhesive layer 230V.

[0116] The adhesive layer 230V according to the seventeenth modification example protrudes from between the first base material 210 and the second base material 220. The adhesive layer 230V protrudes all around the circumference of the housing body 200V. It is sufficient that the adhesive layer 230V protrudes from at least a part of the circumference of the housing body 200V.

[0117] In this way, the adhesive layer 230V protrudes from the first base material 210 and the second base material 220, so that the first base material 210 and the second base material 220 can be bonded together more firmly.

[0118] <18th Variation> Fig. 28 is an enlarged cross-sectional view of a non-contact communication medium according to an eighteenth modification. As shown in Fig. 28, a container 200W included in a non-contact communication medium 1W according to the eighteenth modification has a spherical shape. Specifically, a first base material 210W and a second base material 220W have hemispherical shapes, and are bonded together via an adhesive layer 230W to obtain a spherical container 200W.

[0119] By making the housing body 200W spherical with no corners in this way, damage to the housing body 200W such as chipping or cracking can be further suppressed.

[0120] <Other variations> The ceramics constituting the first and second substrates are not limited to cordierite. For example, the ceramics constituting the first and second substrates may be Al2O3 (alumina), Si3N4 (silicon nitride), SiC (silicon carbide), or Al2TiO5 (aluminum titanate). The ceramics constituting the first and second substrates may also be crystallized glass such as Li2O-Al2O3-SiO2.

[0121] The housing preferably has a lightness index L* (the value of the dimension L, which represents lightness in the Lab color space) of 50 or more. This makes dirt on the housing more noticeable, making it easier to determine when it's time to replace it. Furthermore, compared to a housing with a lightness index L* of less than 50 (i.e., a dark color), heat is less likely to build up, making it harder for heat to be transferred to electronic components. The lightness of the housing can be adjusted, for example, by using pigments (see, for example, Japanese Patent Nos. 5762522 and 5744045).

[0122] The first and second substrates may also be different colors. This improves top-to-bottom visibility, facilitating the work of attaching the non-contact communication medium to the component to be monitored. For example, when a worker wants to place an electronic component closer to the component to be monitored, the worker can easily identify the first substrate, of the first and second substrates, that houses the electronic component, and place the first substrate closer to the component to be monitored.

[0123] When the first and second substrates have different colors, the color of the first substrate housing the electronic components may be brighter than the color of the second substrate. This improves top and bottom visibility while reducing the transfer of heat to the electronic components. Additionally, it is preferable that the electronic components are located far away from components with a low brightness index. This reduces the transfer of heat to the electronic components.

[0124] The electronic component is not limited to an RFID tag, but may be any other electronic component that performs contactless communication. For example, the electronic component may be a sensor with contactless communication capabilities. The sensor may also be a sensor, such as a temperature sensor, that measures the processing environment of the component to be monitored.

[0125] The parts to which the contactless communication medium according to the present disclosure is attached are not limited to parts that are plated.

[0126] For example, a contactless communication medium according to the present disclosure may be attached to a part, such as a piece of casting produced in a foundry of metallic materials.

[0127] Furthermore, the non-contact communication medium according to the present disclosure may be used for managing items in the vulcanization process in the manufacturing process of rubber products.

[0128] The vulcanization process is a process in which sulfur or peroxides, etc., blended into the rubber-based raw materials are chemically reacted over time and temperature to crosslink the molecules in order to increase the elastic limit of the raw materials. Note that pressure may also be applied during the vulcanization process. The temperature during the vulcanization process is, for example, 100°C to 200°C. The pressure during the vulcanization process is, for example, 0.5 MPa to 2 MPa.

[0129] As an example, the contactless communication medium according to the present disclosure may be attached to a used tire that is to be recycled as a retread tire. A retread tire is obtained by scraping the surface of a used tire, attaching a new rubber sheet thereon, and then vulcanizing the scraped surface.

[0130] Known vulcanization processes for retread tires include the remolding method and the precure method. The remolding method involves laminating an unvulcanized rubber sheet to the surface of a used tire, and then vulcanizing the tire at high temperature and high pressure using a mold. The precure method involves laminating a vulcanized rubber sheet to the surface of a used tire, and then vulcanizing the tire at low temperature and low pressure in a vulcanizer. The non-contact communication medium disclosed herein is applicable to both the remolding method and the precure method. In particular, the precure method is intended for small-lot, high-mix production, and therefore involves a relatively large number of manual inspection processes. In contrast, managing goods using the non-contact communication medium disclosed herein can reduce labor costs and improve the production efficiency of retread tires.

[0131] The non-contact communication medium according to the present disclosure is preferably attached to a location other than the tread portion where the rubber sheet is attached. For example, the non-contact communication medium according to the present disclosure may be disposed inside a used tire.

[0132] Additionally, a contactless communication medium according to the present disclosure may be attached to a medical instrument (eg, forceps, needle holder, etc.).

[0133] In the medical field, issues include how to prevent medical instruments from remaining inside the body, how to streamline the management of medical instruments, how to prevent the mix-up of medical instruments during surgery, etc. By attaching the contactless communication medium according to the present disclosure to medical instruments, it becomes possible to manage each individual medical instrument using an RFID tag, which can contribute to solving the above issues.

[0134] The non-contact communication medium according to the present disclosure may also be used for marking to identify lesions within the body.

[0135] A conventional marking method is the biomarker staining method, which uses dye to stain lesions found in the body during an examination. However, the biomarker staining method stains a wide area and the dye diffuses over time, making it difficult to precisely identify the lesion. Another proposed marking method involves placing metal needles or clips at the lesion site. However, this method has issues, such as the need to prepare a CT scan device during surgery and the risk of excessive radiation exposure.

[0136] When the non-contact communication medium according to the present disclosure is used for marking, the non-contact communication medium according to the present disclosure is first placed at the lesion site before surgery. Then, during surgery, a sensor antenna is used to measure, for example, the distance between the RFID tag and the sensor antenna, thereby estimating the position of the RFID, i.e., the position of the lesion site.

[0137] Thus, when the contactless communication medium according to the present disclosure is used for marking, it is desirable that the contactless communication medium according to the present disclosure be as small as possible because it is placed inside the body. In this regard, the ceramic constituting the housing of the present disclosure has a higher dielectric constant than, for example, resin, and is less likely to interfere with RFID communication. Therefore, the contactless communication medium according to the present disclosure can be made smaller than, for example, a contactless communication medium having a housing made of resin.

[0138] As described above, the non-contact communication medium according to the embodiment (for example, non-contact communication mediums 1, 1A to 1G) includes an electronic component (for example, electronic component 10), a housing (for example, housings 20, 20A, 20C to 20E), and a damper (for example, dampers 28, 28A to 28G). The electronic component performs contactless communication. The housing is made of ceramic and houses the electronic component. The damper covers at least a portion of the housing. This can prevent damage to the housing.

[0139] The housing has a first base material (for example, first base material 21, 21A, 21C to 21E) and a second base material (for example, second base material 22, 22A, 22C to 22E) bonded to each other via an adhesive layer (for example, adhesive layers 23, 23A, 23C to 23E, 23G), and accommodates electronic components in an internal space (for example, internal space 26) of the bonded first base material and second base material. In this case, the damper may cover the adhesive layer. This can prevent the first base material from peeling from the second base material.

[0140] The housing may have a first flange (for example, first flange 24D) located on the outer periphery of the joint end with the second base material, and a second flange (for example, second flange 25D) located on the outer periphery of the joint end with the first base material. In this case, the damper may cover the first flange, the second flange, and the adhesive layer. The first flange and the second flange widen the joint area, thereby ensuring a more reliable joint between the first base material and the second base material. Furthermore, covering the first flange and the second flange with the damper can prevent damage to the first flange and the second flange.

[0141] The damper may have curved corners (for example, corners 28A1 and 28A2), which can prevent the damper from being damaged.

[0142] The first and second substrates may have curved corners (for example, corners 21A2 and 22A2) at the interface edges with the adhesive layer, which increases the thickness of the adhesive layer at the interface edges, thereby preventing the first and second substrates from peeling apart.

[0143] The adhesive layer may extend beyond the first and second substrates, thereby enabling the first and second substrates to be more firmly bonded together.

[0144] The housing may have a recess (for example, recess 29) extending around the entire circumference of the housing. In this case, the damper may be located in the recess. This can prevent the damper from shifting out of position. It can also make the damper easier to install.

[0145] The damper may cover the entire housing, which can more reliably prevent damage to the housing.

[0146] The container may be spherical, which can more reliably prevent damage to the container such as chipping or cracking.

[0147] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0148] 1: Contactless communication medium 10: Electronic components 20: Containment Unit 21: 1st base material 22:Second base material 23: Adhesive layer 26: Interior space 28: Damper

Claims

1. An electronic component that performs contactless communication; a container made of ceramics for housing the electronic component; a damper covering at least a portion of the container; having The container has an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, The damper covers a portion of the side surface, A non-contact communication medium, wherein at least the lower side among the side surfaces is exposed.

2. the housing has a first base material and a second base material bonded to each other via an adhesive layer, and the electronic component is housed in an internal space of the bonded first base material and the bonded second base material; the adhesive layer covers at least a portion of the wall surfaces of the first base material and the second base material exposed to the internal space, The non-contact communication medium according to claim 1 , wherein the damper covers the adhesive layer.

3. The container is a first flange portion located on an outer periphery of an end portion to be joined with the second base material; a second flange portion located on an outer periphery of the joint end portion with the first base material; having The non-contact communication medium according to claim 2 , wherein the damper covers the first flange portion, the second flange portion, and the adhesive layer.

4. The non-contact communication medium according to claim 2 or 3, wherein the damper has a curved corner.

5. 5. The non-contact communication medium according to claim 2, wherein the first substrate and the second substrate have curved corners at interface ends with the adhesive layer.

6. The non-contact communication medium according to claim 2 , wherein the adhesive layer protrudes from the first substrate and the second substrate.

7. The container is a recess extending around the entire circumference of the housing; The non-contact communication medium according to claim 1 , wherein the damper is located in the recess.

8. The non-contact communication medium according to any one of claims 1 to 7, wherein the container is spherical.

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