Contactless communication media

Abstract

To prevent peeling of a connection part of a storage body.SOLUTION: A non-contact communication medium according to the present disclosure has an electronic component and a storage body. The electronic component performs non-contact communication. The storage body has a first substrate and a second substrate that are formed of ceramics and connected with each other with an adhesive layer therebetween and stores the electronic component in an internal space of the first substrate and the second substrate connected with each other. The storage body has a first flange part that is located on an outer periphery of a connection end of the first substrate with the second substrate, and a second flange part that is located on an outer periphery of a connection end of the second substrate with the first substrate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a contactless communication medium. [Background technology]

[0002] Conventionally, items are managed using RFID (Radio Frequency IDentifier) ​​tags.

[0003] Patent Document 1 discloses a technique for sealing an RFID tag in a container having thermal insulation so that the RFID tag can be used to manage parts that are processed at high temperatures in a factory, etc. The container described in Patent Document 1 has a container for containing the RFID tag and a lid joined to the container. The container with the RFID tag sealed in it is attached to the part and flows through the manufacturing process together with the part. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2008-129838 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the above-mentioned container, there is a risk that the joint between the container and the lid may come apart, for example, during the manufacturing process.

[0006] The present disclosure has been made in consideration of the above, and aims to provide a non-contact communication medium that can suppress peeling of the joints of the container. [Means for solving the problem]

[0007] A non-contact communication medium according to an embodiment of the present disclosure includes an electronic component and a housing. The electronic component performs non-contact communication. The housing includes a first base material and a second base material made of ceramics and bonded to each other via an adhesive layer, and accommodates the electronic component in an internal space of the bonded first base material and second base material. The housing also includes a first flange portion located on the outer periphery of a joint end portion of the first base material with the second base material, and a second flange portion located on the outer periphery of a joint end portion of the second base material with the first base material. Effect of the Invention

[0008] According to the present disclosure, peeling of the joints of the container can be suppressed. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a side view of a non-contact communication medium according to an embodiment. [Diagram 2] FIG. 2 is a plan view of the non-contact communication medium according to the embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III of FIG. [Figure 4] FIG. 4 is a cross-sectional view of a non-contact communication medium according to a first modified example. [Diagram 5] FIG. 5 is a side view of a non-contact communication medium according to a second modified example. [Figure 6] FIG. 6 is a plan view of a non-contact communication medium according to a second modified example. [Figure 7] FIG. 7 is a side view of a non-contact communication medium according to a third modified example. [Figure 8] FIG. 8 is a cross-sectional view of a non-contact communication medium according to a fourth modified example. [Figure 9] FIG. 9 is a side view of a non-contact communication medium according to a fifth modified example. [Figure 10] FIG. 10 is a plan view of a non-contact communication medium according to a fifth modified example. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI of FIG. [Figure 12]FIG. 12 is an enlarged cross-sectional view of a non-contact communication medium according to a sixth modified example. [Figure 13] FIG. 13 is an enlarged cross-sectional view of a non-contact communication medium according to a seventh modified example. [Figure 14] FIG. 14 is an enlarged cross-sectional view of a non-contact communication medium according to an eighth modified example. [Figure 15] FIG. 15 is an enlarged cross-sectional view of a non-contact communication medium according to a ninth modified example. [Figure 16] FIG. 16 is an enlarged cross-sectional view of a non-contact communication medium according to a tenth modification. [Figure 17] FIG. 17 is an enlarged cross-sectional view of a non-contact communication medium according to an eleventh modification. [Figure 18] FIG. 18 is an enlarged cross-sectional view of a non-contact communication medium according to a twelfth modified example. [Figure 19] FIG. 19 is an enlarged cross-sectional view of a non-contact communication medium according to a thirteenth modified example. [Figure 20] FIG. 20 is a cross-sectional view taken along the line XX-XX shown in FIG. [Figure 21] FIG. 21 is an enlarged cross-sectional view of a non-contact communication medium according to a fourteenth modification. [Figure 22] FIG. 22 is an enlarged cross-sectional view of a non-contact communication medium according to a fifteenth modification. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a form for implementing a non-contact communication medium according to the present disclosure (hereinafter, referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the non-contact communication medium according to the present disclosure is not limited to this embodiment. In addition, each embodiment can be appropriately combined within a range that does not cause a contradiction in the processing contents. In addition, the same parts in each of the following embodiments are given the same reference numerals, and duplicated explanations will be omitted.

[0011] In addition, in the embodiments described below, expressions such as "constant", "orthogonal", "vertical" and "parallel" may be used, but these expressions do not necessarily mean "constant", "orthogonal", "vertical" and "parallel" strictly. In other words, each of the above expressions allows for deviations due to, for example, manufacturing accuracy and installation accuracy.

[0012] In addition, in order to make the explanation easier to understand, each of the drawings referred to below may show an orthogonal coordinate system that defines an X-axis direction, a Y-axis direction, and a Z-axis direction that are perpendicular to each other, and has the positive Z-axis direction as the vertically upward direction.

[0013] <Construction of non-contact communication medium> The configuration of a non-contact communication medium according to an embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a side view of the non-contact communication medium according to an embodiment. Fig. 2 is a plan view of the non-contact communication medium according to an embodiment. Fig. 3 is a cross-sectional view taken along the line III-III in Fig. 2.

[0014] 1 to 3, a non-contact communication medium 1 according to the embodiment includes an electronic component 10 and a container 20. The electronic component 10 is, for example, an RFID tag.

[0015] Electronic component 10 as RFID has an antenna for non-contact communication, an IC chip that performs non-contact communication via the antenna, and a memory that stores identification information, all on a substrate made of, for example, LTCC (Low Temperature Co-fired Ceramics) etc. Electronic component 10 as RFID can transmit the identification information stored in the memory to an external device (for example, an RFID reader) by non-contact communication using electromagnetic induction, radio waves, etc.

[0016] The non-contact communication medium 1 according to the embodiment may be used, for example, in a high-temperature environment exceeding the heat resistance temperature of the electronic component 10. For example, the non-contact communication medium 1 according to the embodiment is attached to a component to be plated and plated together with the component. The plating temperature is, for example, 75°C to 500°C. The non-contact communication medium 1 according to the embodiment may be treated with acidic or alkaline chemicals together with the component. That is, the non-contact communication medium 1 according to the embodiment may be used in an acidic or alkaline environment exceeding the chemical resistance of the electronic component 10.

[0017] Therefore, in the non-contact communication medium 1 according to the embodiment, the electronic component 10 is sealed in the container 20 in order to protect the electronic component 10 from high-temperature environments and acidic and alkaline environments.

[0018] The housing 20 has a first base material 21 and a second base material 22 made of ceramics, and an adhesive layer 23, and the first base material 21 and the second base material 22 are bonded to each other via the adhesive layer 23. The housing 20 accommodates the electronic component 10 in an internal space 26 formed by the bonded first base material 21 and second base material 22.

[0019] The ceramics constituting the first substrate 21 and the second substrate 22 may be, for example, corderite. Corderite has a small thermal expansion coefficient and therefore excellent thermal shock resistance, and also has a low thermal conductivity and therefore does not easily transfer heat to the electronic component 10. In this way, by using corderite, the electronic component 10 can be appropriately protected from a high-temperature environment. Note that the ceramics constituting the first substrate 21 and the second substrate 22 do not necessarily have to be corderite. This point will be described later.

[0020] The adhesive layer 23 is made of an adhesive. The adhesive may have heat resistance sufficient to withstand the environment in which the non-contact communication medium 1 is used. For example, an inorganic adhesive may be used as such an adhesive. Alternatively, an inorganic adhesive to which ceramic powder has been added may be used as the adhesive.

[0021] The first substrate 21 and the second substrate 22 have a cylindrical shape. Specifically, the first substrate 21 and the second substrate 22 have flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, and have a curved surface (outer peripheral surface) that connects the upper end surface and the lower end surface. The adhesive layer 23 is located between the lower end surface 21a of the first substrate 21 and the upper end surface 22a of the second substrate 22, and the first substrate 21 and the second substrate 22 bonded by the adhesive layer 23 have a cylindrical shape (so-called coin type) as a whole.

[0022] A recess 22b is located on the upper end surface 22a of the second substrate 22, and the electronic component 10 is housed in the recess 22b. The size of the recess 22b is not particularly limited as long as it is at least larger than the dimensions of the electronic component 10. The recess 22b is sealed by bonding the first substrate 21 and the second substrate 22 via the adhesive layer 23. This seals the electronic component 10.

[0023] The container 20 according to the embodiment further has a first flange 24 and a second flange 25. The first flange 24 is a portion that protrudes in a flange-like shape from the outer peripheral surface of the first base material 21, and has a ring shape that extends around the entire circumference of the first base material 21. Similarly, the second flange 25 is a portion that protrudes in a flange-like shape from the outer peripheral surface of the second base material 22, and has a ring shape that extends around the entire circumference of the second base material 22.

[0024] The first flange 24 and the second flange 25 are made of the same ceramic (e.g., cordierite) as the first base material 21 and the second base material 22. By forming them from the same ceramic, the thermal expansion coefficients are the same, so that even if a sudden temperature change occurs, cracks and the like due to differences in the thermal expansion coefficients are unlikely to occur between the first base material 21 and the second base material 22 and the first flange 24 and the second flange 25. Specifically, the first flange 24 is formed integrally with the first base material 21, and the second flange 25 is formed integrally with the second base material 22.

[0025] The first flange 24 is located on the outer periphery of the end portion on the lower end surface 21a side of the first substrate 21 so that its lower end surface is flush with the lower end surface 21a of the first substrate 21. The second flange 25 is located on the outer periphery of the end portion on the upper end surface 22a side of the second substrate 22 so that its upper end surface is flush with the upper end surface 22a of the second substrate 22.

[0026] Thus, the non-contact communication medium 1 of the embodiment has a first flange portion 24 on the outer periphery of the joint end portion of the first substrate 21 with the second substrate 22, and has a second flange portion 25 on the outer periphery of the joint end portion of the second substrate 22 with the first substrate 21.

[0027] The adhesive layer 23 is located not only between the first base material 21 and the second base material 22, but also between the first flange portion 24 and the second flange portion 25. This increases the bonding area compared to a case without the first flange portion 24 and the second flange portion 25, and therefore the non-contact communication medium 1 according to the embodiment can ensure the bonding between the first base material 21 and the second base material 22. In other words, the bonding portion of the housing 20 can be made less likely to peel off.

[0028] <Manufacturing method> Here, an example of a method for manufacturing the non-contact communication medium 1 according to the embodiment will be described.

[0029] First, cordierite powder and sintering aid powder are prepared. The sintering aid is, for example, a rare earth oxide (yttrium oxide, cerium oxide, etc.), an alkali metal oxide (lithium oxide, sodium oxide, etc.), or an alkaline earth metal (calcium oxide). Note that instead of cordierite powder, a mixture of magnesium oxide, aluminum oxide, and silicon oxide in the desired cordierite composition ratio may be used. Next, the prepared powder is put into a vibration mill together with water as a solvent, and pulverized and mixed to obtain a raw material.

[0030] Next, organic components such as binders, plasticizers, and release agents are added to the raw materials obtained by grinding and mixing, and then the mixture is stirred to produce a slurry. The slurry is then spray-dried using a spray dryer to produce ceramic granules.

[0031] Next, the produced ceramic granules are subjected to powder press molding. Specifically, a molded body of the first substrate 21 and the first flange 24 is obtained by using a die machined so that the first substrate 21 and the first flange 24 are integrally molded. Also, a molded body of the second substrate 22 and the second flange 25 is obtained by using a die machined so that the second substrate 22 and the second flange 25 are integrally molded. In this process, the recess 22b (see FIG. 3) is also formed.

[0032] Next, the molded body is degreased by heat treating it in an air atmosphere, a vacuum atmosphere or a nitrogen gas atmosphere, and then sintered to obtain a first substrate 21 integrated with a first flange portion 24 and a second substrate 22 integrated with a second flange portion 25.

[0033] Next, after the electronic component 10 is accommodated in the recess 22b of the second substrate 22, the first substrate 21 integrated with the first flange 24 and the second substrate 22 integrated with the second flange 25 are joined together using an adhesive, thereby obtaining the non-contact communication medium 1 according to the embodiment.

[0034] <Modifications regarding the corners of the container> Next, modified examples of the above-mentioned embodiment will be described. First, modified examples relating to the corners of the container will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view of a non-contact communication medium according to a first modified example.

[0035] 4, a non-contact communication medium 1A according to a first modified example has a container 20A. The container 20A has a first base material 21A, a second base material 22A, an adhesive layer 23A, a first flange portion 24A, and a second flange portion 25A.

[0036] The first base material 21A and the second base material 22A have a cylindrical shape, and the corners are curved in an R shape. Specifically, the first base material 21A has a corner 21A1 curved in an R shape on the periphery of its upper end surface. Similarly, the second base material 22A has a corner 22A1 curved in an R shape on the periphery of its lower end surface.

[0037] In this manner, the first substrate 21A and the second substrate 22A according to the first modified example have the curved corners 21A1, 22A1. Therefore, according to the non-contact communication medium 1A according to the first modified example, it is possible to make the first substrate 21A and the second substrate 22A less likely to be chipped.

[0038] The first flange 24A and the second flange 25A according to the first modification also have curved corners. Specifically, the first flange 24A has a corner 24A1 curved in an R shape on the outer periphery of the upper end surface. Similarly, the second flange 25A has a corner 25A1 curved in an R shape on the outer periphery of the lower end surface. In this way, the first flange 24A and the second flange 25A according to the first modification have curved corners. Therefore, according to the non-contact communication medium 1A according to the first modification, it is possible to make it difficult for the first flange 24A and the second flange 25A to be chipped.

[0039] The first flange 24A has a curved corner 24A2 at the inner periphery of the upper end surface, in other words, at the base end in the direction of projection from the first base material 21A (the horizontal direction including the X-axis direction and the Y-axis direction). Similarly, the second flange 25A has a curved corner 25A2 at the inner periphery of the lower end surface. This makes it possible to prevent cracks from occurring in the first flange 24A and the second flange 25A.

[0040] First flange 24A has R-shaped corner 24A3 at the end of its interface with adhesive layer 23A, in other words, at the periphery of its lower end face. Similarly, second flange 25A has R-shaped corner 25A3 at the end of its interface with adhesive layer 23A, in other words, at the periphery of its upper end face.

[0041] In this way, the first flange 24A and the second flange 25A according to the first modification have curved corners 24A3, 25A3 at the interface end with the adhesive layer 23A. This increases the thickness of the adhesive layer 23A at the interface end, so that peeling between the first substrate 21A and the second substrate 22A can be suppressed. For example, peeling between the first substrate 21A and the second substrate 22A in the shear direction, that is, peeling caused by the first substrate 21A and the second substrate 22A shifting from each other along the bonding surface, can be suitably suppressed.

[0042] <Modifications regarding the overall shape of the container> Next, modified examples of the overall shape of the container will be described. Fig. 5 is a side view of a non-contact communication medium according to a second modified example, Fig. 6 is a plan view of the non-contact communication medium according to the second modified example, and Fig. 7 is a side view of a non-contact communication medium according to a third modified example.

[0043] 5 and 6, a non-contact communication medium 1B according to the second modification includes a container 20B. The container 20B includes a first base material 21B, a second base material 22B, an adhesive layer 23B, a first flange portion 24B, and a second flange portion 25B.

[0044] The container 20B according to the second modification has a shape in which a spherical surface of a sphere formed of a first base material 21B and a second base material 22B is surrounded by a first flange portion 24B, a second flange portion 25B, and an adhesive layer 23B in a band shape. The band shape is located at the maximum circumference portion of the sphere. The maximum circumference portion is the portion of the sphere that has the maximum circumference. Specifically, the maximum circumference portion is the circumference portion of the cut edge that is created when the sphere is cut along a plane that passes through the center of the sphere.

[0045] Specifically, first substrate 21B and second substrate 22B have a hemispherical shape, and first flange 24B and second flange 25B are located at the maximum circumferential portions of first substrate 21B and second substrate 22B, respectively.

[0046] By forming the container 20B in a spherical shape in this manner, damage to the container 20B, such as chipping or cracking, can be more reliably prevented.

[0047] 7, a non-contact communication medium 1C according to a third modification has a container 20C having a prolate spheroid shape. The container 20C has a first base material 21C, a second base material 22C, an adhesive layer 23C, a first flange 24C, and a second flange 25C.

[0048] In a container 20C according to the third modification, a first flange 24C and a second flange 25C extend along the maximum circumference of an oval-shaped container 20. The maximum circumference of the oval-shaped container 20 refers to the circumference of a cut surface that is created when the oval-shaped container 20 is cut along the long axis of the oval-shaped container 20 by a plane that is parallel to the long axis of the oval-shaped container 20.

[0049] With this configuration, it is possible to enlarge the bonding area between the first base material 21C and the second base material 22C while preventing the container 20C from becoming large. Therefore, according to the non-contact communication medium 1C according to the third modification, it is possible to prevent the first base material 21C and the second base material 22C from peeling off from each other.

[0050] Note that the first flange portion 24B and the second flange portion 25B according to the second modified example and the first flange portion 24C and the second flange portion 25C according to the third modified example may have corners curved in an R shape.

[0051] <Modifications regarding adhesive layer> Next, a modification regarding the adhesive layer will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view of a non-contact communication medium according to a fourth modification.

[0052] 8, a non-contact communication medium 1D according to the fourth modification has a container 20D. An adhesive layer 23D of the container 20D according to the fourth modification protrudes from between the first flange 24 and the second flange 25. Specifically, the adhesive layer 23D protrudes over the entire circumference of the container 20D. However, the adhesive layer 23D may be configured to protrude from a portion of the circumference of the first flange 24 and the second flange 25.

[0053] In this manner, the adhesive layer 23D protrudes from the first flange portion 24 and the second flange portion 25, thereby making it possible to more firmly bond the first base material 21 and the second base material 22. Therefore, peeling between the first base material 21 and the second base material 22 can be more reliably suppressed.

[0054] Although the cylindrical container 20D has been described as an example here, the present invention is not limited to this. The adhesive layer 23B may protrude from the spherical container 20B shown in FIG. 5, and the adhesive layer 23C may protrude from the oblong container 20C shown in FIG. 7.

[0055] <Modifications of the Electronic Component Holding Structure> However, the conventional technology has room for further improvement in terms of preventing damage such as chipping of electronic components such as RFID tags caused by movement of the electronic components within the accommodation space. Therefore, the non-contact communication medium may have a structure for holding down the electronic components.

[0056] <Fifth Modification> First, the configuration of a non-contact communication medium according to a fifth modified example having the above-mentioned holding structure will be described with reference to Fig. 9 to Fig. 11. Fig. 9 is a side view of the non-contact communication medium according to the fifth modified example. Fig. 10 is a plan view of the non-contact communication medium according to the fifth modified example. Fig. 11 is a cross-sectional view taken along line XI-XI in Fig. 10.

[0057] The holding structures for electronic component 10 shown in the following fifth to fifteenth modifications can be appropriately incorporated into the non-contact communication media according to the above-described embodiment and the first to fourth modifications.

[0058] 9 to 11, a non-contact communication medium 1L according to the fifth modified example includes an electronic component 10 and a container 200. The electronic component 10 is, for example, an RFID tag.

[0059] The container 200 has a first base material 210 and a second base material 220 made of ceramics, and an adhesive layer 230, and the first base material 210 and the second base material 220 are bonded to each other via the adhesive layer 230. Specifically, the first base material 210 and the second base material 220 have flat surfaces 210a, 220a of substantially the same diameter facing each other, and these flat surfaces 210a, 220a are bonded to each other via the adhesive layer 230. Hereinafter, the flat surface 210a of the first base material 210 will be referred to as the "first flat surface 210a," and the flat surface 220a of the second base material 220 will be referred to as the "second flat surface 220a."

[0060] The first base material 210 has an accommodating recess 250 that accommodates the electronic component 10. The accommodating recess 250 opens at the center of the first flat surface 210a. The first flat surface 210a is closed by the second flat surface 220a of the second base material 220. As a result, the electronic component 10 is sealed inside the enclosure 200.

[0061] The adhesive layer 230 is made of an adhesive. The adhesive may have heat resistance sufficient to withstand the environment in which the non-contact communication medium 1L is used.

[0062] The first substrate 210 and the second substrate 220 both have a cylindrical shape. Specifically, the first substrate 210 and the second substrate 220 have flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, and have a curved surface (outer peripheral surface) that connects the upper end surface and the lower end surface. The adhesive layer 230 is located between the first flat surface 210a, which is the upper end surface of the first substrate 210, and the second flat surface 220a, which is the lower end surface of the second substrate 220, and the first substrate 210 and the second substrate 220 bonded by the adhesive layer 230 have a cylindrical shape (so-called coin type) as a whole.

[0063] An accommodating recess 250 is located on the first flat surface 210a of the first base material 210, and the electronic component 10 is accommodated in the accommodating recess 250. The inside of the accommodating recess 250 is a space, and no filler or the like is located therein.

[0064] As shown in FIG. 11, the second base material 220 has an accommodating protrusion 260 that protrudes from the second flat surface 220a and fits into the accommodating recess 250.

[0065] In this manner, the internal space of the accommodating recess 250 can be narrowed by inserting the accommodating protrusion 260 into the accommodating recess 250. As the internal space of the accommodating recess 250 is narrowed, even if the electronic component 10 moves in the internal space of the accommodating recess 250, the amount of movement is reduced. Therefore, according to the non-contact communication medium 1L of the fifth modification, it is possible to prevent damage such as chipping of the electronic component 10 caused by the movement of the electronic component 10 in the accommodating recess 250.

[0066] Moreover, in the non-contact communication medium 1L according to the fifth modification, the electronic component 10 is sandwiched between the tip surface 260a of the accommodating protrusion 260 and the bottom surface 250a of the accommodating recess 250. This makes it possible to suppress movement of the electronic component 10 in the accommodating recess 250. Furthermore, the inside of the accommodating recess 250 is a space, and the electronic component 10 is not in contact with any member (e.g., a filler) other than the tip surface 260a of the accommodating protrusion 260 and the bottom surface 250a of the accommodating recess 250. Therefore, compared to a case in which the electronic component 10 is fixed by a filler or the like, for example, heat from the outside is less likely to be transmitted to the electronic component 10.

[0067] In this manner, by sandwiching the electronic component 10 between the tip surface 260a of the accommodating protrusion 260 and the bottom surface 250a of the accommodating recess 250, it is possible to suppress the conduction of heat to the electronic component 10 while preventing damage to the electronic component 10, such as chipping.

[0068] Moreover, the tip surface 260a of the accommodating protrusion 260 according to the fifth modified example is curved toward the bottom surface 250a of the accommodating recess 250, in other words, toward the electronic component 10. This makes it possible to reduce the contact area between the accommodating protrusion 260 and the electronic component 10. As a result, it is possible to suppress heat conduction from the second base material 220 to the electronic component 10.

[0069] <Sixth Modification> Fig. 12 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 6. As shown in Fig. 12, a container 200M included in a non-contact communication medium 1M according to Modification 6 has a second base material 220M.

[0070] The tip surface of the accommodating protrusion 260M of the second base material 220M is recessed in a curved shape, and this recessed portion accommodates at least a part of the electronic component 10. In the sixth modified example, the electronic component 10 is in point contact with the recessed surface 260M1 of the accommodating protrusion 260M, and is sandwiched between the recessed surface 260M1 and the bottom surface 250a of the accommodating recess 250.

[0071] In this manner, the tip surface of the accommodating protrusion 260M may be recessed. In this case as well, the contact area between the electronic component 10 and the accommodating protrusion 260M can be reduced. Therefore, the movement of the electronic component 10 can be suppressed while suppressing the heat conduction from the second base material 220M to the electronic component 10.

[0072] <Seventh Modification> Fig. 13 is an enlarged cross-sectional view of a non-contact communication medium according to Modification Example 7. As shown in Fig. 13, a container 200N included in a non-contact communication medium 1N according to Modification Example 7 has a second base material 220N.

[0073] The tip surface of the accommodating protrusion 260N of the second base material 220N is recessed, and the recessed surface 260N1 is, for example, a flat surface. The electronic component 10 is in surface contact with the recessed surface 260N1 and is sandwiched between the recessed surface 260N1 and the bottom surface 250a of the accommodating recess 250.

[0074] In this way, by bringing the electronic component 10 into surface contact with the accommodating protrusion 260N, the movement of the electronic component 10 can be more reliably suppressed. In addition, the edge portion 260N2 located on the outer periphery of the recessed surface 260N1 protrudes toward the bottom surface 250a of the accommodating recess 250 further than the recessed surface 260N1. Therefore, even if the electronic component 10 moves, the electronic component 10 abuts against the edge portion 260N2, thereby reducing the amount of movement of the electronic component 10 and suppressing damage to the electronic component 10, such as chipping.

[0075] <Eighth Modification> Fig. 14 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 8. As shown in Fig. 14, a container 200P included in a non-contact communication medium 1P according to Modification 8 has a second base material 220P.

[0076] The tip surface of the accommodating protrusion 260P of the second base material 220P is recessed, and the recessed surface 260P1 is a flat surface.

[0077] In the eighth modified example, edge 260P2 located on the outer periphery of recessed surface 260P1 contacts bottom surface 250a of accommodating recess 250, and electronic component 10 is completely accommodated in the recessed portion of accommodating protrusion 260P.

[0078] In this manner, the edge 260P2 of the accommodating protrusion 260P may contact the bottom surface 250a of the accommodating recess 250. In this case, the accommodating protrusion 260P also functions as a spacer that defines the distance between the first flat surface 210a and the second flat surface 220a. Therefore, according to the non-contact communication medium 1P according to the eighth modification, it is possible to suppress the variation in thickness of the adhesive layer 230 among the plurality of non-contact communication media 1P. In other words, it is possible to suppress the variation in quality among the plurality of non-contact communication media 1P.

[0079] <Ninth Variation> Fig. 15 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 9. As shown in Fig. 15, a container 200Q included in a non-contact communication medium 1Q according to Modification 9 has a second base material 220Q.

[0080] The accommodating protrusion 260Q of the second base member 220Q has a plurality of protrusions 260Q1 protruding from a tip end surface thereof. In the ninth modification, the electronic component 10 is sandwiched between the plurality of protrusions 260Q1 and the bottom surface 250a of the accommodating recess 250.

[0081] Here, an example has been shown in which a plurality of protrusions 260Q1 are provided on the tip surface of the accommodating protrusion 260Q, but it is sufficient that the accommodating protrusion 260Q has at least one protrusion 260Q1.

[0082] In this manner, the accommodating protrusion 260Q may have at least one protrusion 260Q1 protruding from the tip end surface. In this case as well, the contact area between the electronic component 10 and the accommodating protrusion 260Q can be reduced. Therefore, the movement of the electronic component 10 can be suppressed while suppressing the heat conduction from the second base material 220Q to the electronic component 10.

[0083] Furthermore, by providing multiple protrusions 260Q1, the accommodating convex portion 260Q and the electronic component 10 come into contact at multiple points, thereby making it possible to more reliably suppress the movement of the electronic component 10 while reducing the contact area between the electronic component 10 and the accommodating convex portion 260Q.

[0084] <Tenth Modification> Fig. 16 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 10. As shown in Fig. 16, a container 200R of a non-contact communication medium 1R according to Modification 10 has a second base material 220Q similar to that of Modification 9, for example.

[0085] Moreover, housing 200R according to the tenth modification has first substrate 210R. First substrate 210R has accommodating recess 250R. Accommodating recess 250R has multiple protrusions 250R1 protruding from bottom surface 250a. In the tenth modification, electronic component 10 is sandwiched between multiple protrusions 260Q1 provided on accommodating protrusion 260Q and multiple protrusions 250R1 provided on accommodating recess 250R.

[0086] Here, an example has been shown in which a plurality of protrusions 250R1 are provided on the bottom surface 250a of the accommodating recess 250R, but it is sufficient that the accommodating recess 250R has at least one protrusion 250R1.

[0087] In this manner, the accommodating recess 250R may have at least one protrusion 250R1 protruding from the bottom surface 250a. In this case as well, the contact area between the electronic component 10 and the accommodating recess 250R can be reduced. Therefore, the movement of the electronic component 10 can be suppressed while suppressing the heat conduction from the first substrate 210R to the electronic component 10.

[0088] Furthermore, by providing multiple protrusions 250R1, the accommodating recess 250R and the electronic component 10 come into contact at multiple points, thereby making it possible to more reliably suppress movement of the electronic component 10 while reducing the contact area between the electronic component 10 and the accommodating recess 250R.

[0089] Moreover, by setting the distance between the two protrusions 250R1 so that the electronic component 10 fits between the two protrusions 250R1, the positioning of the electronic component 10 can be facilitated.

[0090] <Eleventh Modification> Fig. 17 is an enlarged cross-sectional view of a non-contact communication medium according to the 11th modification. As shown in Fig. 17, a container 200S of a non-contact communication medium 1S according to the 11th modification has a cushioning material 270S1 on a tip surface 260a of a container protrusion 260. The container 200S also has a cushioning material 270S2 on a bottom surface 250a of a container recess 250.

[0091] The cushioning materials 270S1 and 270S2 are made of a material, such as a resin, that is more flexible than the first base material 210 and the second base material 220, which are made of ceramics. Examples of such resins that can be used preferably include silicone, amide, imide, and amide-imide resins. In addition, the cushioning materials 270S1 and 270S2 preferably have heat resistance.

[0092] In the eleventh modification, the electronic component 10 is sandwiched between the accommodating protrusion 260 and the accommodating recess 250 via the cushioning materials 270S1 and 270S2. Therefore, even if the accommodating body 200S receives an impact, the cushioning materials 270S1 and 270S2 absorb the impact, thereby preventing the impact from being transmitted to the electronic component 10. Therefore, according to the non-contact communication medium 1S according to the eleventh modification, damage to the electronic component 10 can be more reliably prevented.

[0093] Here, an example is shown in which the cushion materials 270S1, 270S2 are provided on both the accommodating protrusion 260 and the accommodating recess 250, but the cushion materials 270S1, 270S2 may be provided on at least one of the accommodating protrusion 260 and the accommodating recess 250.

[0094] <Twelfth Modification> Fig. 18 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 12. As shown in Fig. 18, a container 200T included in a non-contact communication medium 1T according to Modification 12 has a second base material 220T.

[0095] The accommodating protrusion 260T of the second base material 220T according to the twelfth modification is made of a cushioning material that is more flexible than the first base material 210 and the second base material 220T.

[0096] In this manner, the entire accommodating protrusion 260T may be formed of a cushioning material. This allows the accommodating protrusion 260T to be replaced according to the size of the electronic component 10, for example.

[0097] <13th Modification> Fig. 19 is an enlarged cross-sectional view of a non-contact communication medium according to a 13th modified example. Fig. 20 is a cross-sectional view taken along the arrows XX-XX shown in Fig. 19. As shown in Fig. 19, a container 200U included in a non-contact communication medium 1U according to a 13th modified example has a second base material 220U.

[0098] 19 and 20, the accommodating protrusion 260U of the second base material 220U has a protrusion 260U1 that protrudes circumferentially from the tip end surface. In the thirteenth modification, the electronic component 10 is sandwiched between the circumferential protrusion 260U1 and the bottom surface 250a of the accommodating recess 250.

[0099] In this manner, the accommodating protrusion 260U may have a protrusion 260U1 that protrudes circumferentially from the tip end surface, which makes it possible to more reliably suppress the movement of the electronic component 10 while reducing the contact area between the electronic component 10 and the accommodating protrusion 260U.

[0100] <14th Variation> Fig. 21 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 14. As shown in Fig. 21, a container 200V included in a non-contact communication medium 1V according to Modification 14 has an adhesive layer 230V.

[0101] The adhesive layer 230V according to the fourteenth modification protrudes from between the first base material 210 and the second base material 220. The adhesive layer 230V protrudes over the entire circumference of the housing body 200V. It is sufficient that the adhesive layer 230V protrudes from at least a portion of the circumference of the housing body 200V.

[0102] In this manner, the adhesive layer 230V protrudes from the first base material 210 and the second base material 220, so that the first base material 210 and the second base material 220 can be bonded more firmly.

[0103] <15th Variation> Fig. 22 is an enlarged cross-sectional view of a non-contact communication medium according to the fifteenth modification. As shown in Fig. 22, a container 200W of a non-contact communication medium 1W according to the fifteenth modification has a spherical shape. Specifically, a first base material 210W and a second base material 220W have a hemispherical shape, and are bonded together via an adhesive layer 230W to obtain a spherical container 200W.

[0104] By forming the container 200W in a spherical shape without any corners in this manner, damage to the container 200W such as chipping or cracking can be further suppressed.

[0105] <Other Modifications> The ceramics constituting the first and second substrates are not limited to cordierite. For example, the ceramics constituting the first and second substrates may be Al2O3 (alumina), Si3N4 (silicon nitride), SiC (silicon carbide), or Al2TiO5 (aluminum titanate). The ceramics constituting the first and second substrates may be crystallized glass such as Li2O-Al2O3-SiO2.

[0106] The container preferably has a lightness index L* (a value of the dimension L that represents lightness in the Lab color space) of 50 or more. This makes dirt on the container more noticeable, making it easier to determine when to replace it. Also, compared to a container with a lightness index L* of less than 50 (i.e., a dark color), heat is less likely to build up, making it harder for heat to be transferred to electronic components. The lightness of the container can be adjusted, for example, by pigments (see, for example, Japanese Patent No. 5762522 and Japanese Patent No. 5744045).

[0107] The first and second substrates may be different in color. This improves visibility from above and below, facilitating the work of attaching the non-contact communication medium to the components to be monitored. For example, when an operator wishes to place an electronic component closer to the components to be monitored, the operator can easily identify the first substrate, which contains the electronic component, of the first and second substrates, and place the first substrate closer to the components to be monitored.

[0108] When the first and second substrates are different in color, the color of the first substrate on which the electronic components are housed may be brighter than that of the second substrate. This improves top and bottom visibility while making it difficult for heat to be transferred to the electronic components. In addition, it is preferable that the electronic components are far away from members with low brightness indexes. This makes it difficult for heat to be transferred by the electronic components.

[0109] The electronic component is not limited to an RFID tag, but may be any other electronic component that performs non-contact communication. For example, the electronic component may be a sensor having a non-contact communication function. The sensor may be a sensor that measures the processing environment of the component to be monitored, such as a temperature sensor.

[0110] The parts to which the non-contact communication medium according to the present disclosure is attached are not limited to parts that are plated.

[0111] For example, a contactless communication medium according to the present disclosure may be attached to a part, such as a piece of casting produced in a foundry of metallic material.

[0112] Furthermore, the non-contact communication medium according to the present disclosure may be used for item management in the vulcanization process in the manufacturing process of rubber products.

[0113] The vulcanization process is a process in which sulfur or peroxides, etc., blended into the rubber-based raw materials are chemically reacted at a certain temperature and over a certain period of time to crosslink the molecules in order to increase the elastic limit of the rubber-based raw materials. Note that pressure may also be applied during the vulcanization process. The temperature during the vulcanization process is, for example, 100°C to 200°C. The pressure during the vulcanization process is, for example, 0.5 MPa to 2 MPa.

[0114] As an example, the non-contact communication medium according to the present disclosure may be attached to a used tire that is to be recycled as a retread tire. A retread tire is obtained by scraping the surface of a used tire, attaching a new rubber sheet thereon, and then vulcanizing the tire.

[0115] Known vulcanization processes for retread tires include the remolding method and the precure method. The remolding method is a method in which an unvulcanized rubber sheet is attached to the surface of a used tire, and then the tire is vulcanized at high temperature and high pressure using a mold. The precure method is a method in which a vulcanized rubber sheet is attached to the surface of a used tire, and then the tire is vulcanized at low temperature and low pressure in a vulcanizer. The non-contact communication medium according to the present disclosure is applicable to both the remolding method and the precure method. In particular, the precure method is intended for small-lot, high-mix production, and therefore involves relatively many manual inspection processes. In contrast, by managing goods using the non-contact communication medium according to the present disclosure, it is possible to reduce personnel costs and improve the production efficiency of retread tires.

[0116] The non-contact communication medium according to the present disclosure is preferably attached to a location other than the tread portion to which the rubber sheet is attached. For example, the non-contact communication medium according to the present disclosure may be disposed inside a used tire.

[0117] A non-contact communication medium according to the present disclosure may also be attached to a medical instrument (eg, forceps, needle holder, etc.).

[0118] In the medical field, issues include how to prevent medical instruments from remaining inside the body, how to streamline the management of medical instruments, how to prevent the mix-up of medical instruments during surgery, etc. By attaching the non-contact communication medium according to the present disclosure to medical instruments, it becomes possible to manage each individual medical instrument by RFID tag, which can contribute to solving the above issues.

[0119] The non-contact communication medium according to the present disclosure may also be used for marking to identify diseased areas within the body.

[0120] A conventional marking method is the dye staining method. In the dye staining method, the lesions found in the body during the examination are stained with dye. However, the dye staining method has a wide coloring range and the dye diffuses over time, making it difficult to precisely identify the lesion. Another marking method proposed is to place a metal needle or clip at the lesion. However, this method has problems such as the need to prepare a CT scan device during surgery and the risk of excessive radiation exposure.

[0121] When the non-contact communication medium according to the present disclosure is used for marking, the non-contact communication medium according to the present disclosure is placed at the lesion site before surgery. Then, during surgery, the position of the RFID, i.e., the position of the lesion site, is estimated by measuring, for example, the distance between the RFID tag and the sensor antenna using a sensor antenna.

[0122] In this way, when the non-contact communication medium according to the present disclosure is used for marking, it is desirable that the non-contact communication medium according to the present disclosure be as small as possible since it is placed inside the body. In this respect, the ceramic constituting the container of the present disclosure has a higher dielectric constant than, for example, resin, and is less likely to impede communication by RFID. For this reason, the non-contact communication medium of the present disclosure can be made smaller than, for example, a non-contact communication medium having a container made of resin.

[0123] As described above, the non-contact communication medium according to the embodiment (for example, non-contact communication medium 1, 1A to 1D) has an electronic component (for example, electronic component 10) and a container (for example, containers 20, 20A to 20D). The electronic component performs non-contact communication. The container has a first base material (for example, first base material 21, 21A to 21C) and a second base material (for example, second base material 22, 22A to 22C) made of ceramics and bonded to each other via an adhesive layer (for example, adhesive layer 23, 23A to 23D), and accommodates the electronic component in an internal space (for example, internal space 26) of the bonded first base material and second base material. The container has a first flange (for example, first flange 24, 24A to 24C) located on the outer periphery of the joint end of the first base material with the second base material, and a second flange (for example, second flange 25, 25A to 25C) located on the outer periphery of the joint end of the second base material with the first base material. Therefore, according to the non-contact communication medium according to the embodiment, it is possible to suppress peeling of the joint portion of the container.

[0124] The first and second substrates may have rounded corners (for example, corners 21A1 and 22A1), which can make the first and second substrates less susceptible to chipping.

[0125] The container may be spherical in shape, which can more reliably prevent damage to the container such as chipping or cracking.

[0126] The container may have an oblong shape. In this case, the first flange and the second flange may extend along the maximum circumference of the container. This makes it possible to prevent the container from becoming large in size and to prevent the first base material from peeling off from the second base material.

[0127] The first and second flanges may have curved corners (for example, corners 24A1 to 24A3, 25A1 to 25A3). Specifically, the first and second flanges may have curved corners (for example, corners 24A2, 25A2) at the base ends in the direction of projection from the first and second substrates. This can prevent cracks from occurring in the first and second flanges. The first and second flanges may also have curved corners (for example, corners 24A3, 25A3) at the end of the interface with the adhesive layer. This can increase the thickness of the adhesive layer at the end of the interface, thereby preventing the first and second substrates from peeling off.

[0128] The first and second flanges may be made of the same ceramic as the first and second base materials. By using the same ceramic, the thermal expansion coefficients are the same, so that even if a sudden temperature change occurs, cracks or the like caused by differences in thermal expansion coefficients are unlikely to occur between the first and second base materials and the first and second flanges.

[0129] The adhesive layer may extend beyond the first flange and the second flange, thereby enabling the first base material and the second base material to be more firmly bonded to each other.

[0130] Further advantages and modifications may readily occur to those skilled in the art. Thus, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof. [Explanation of symbols]

[0131] 1: Contactless communication medium 10: Electronic components 20: Containment unit 21: 1st base material 22:Second base material 23: Adhesive layer 24: First flange 25: Second flange 26: Interior space

Claims

1. An electronic component that performs contactless communication; a container having a first base material and a second base material which are made of ceramics and are bonded to each other via an adhesive layer, the container housing the electronic component in an internal space of the bonded first base material and the bonded second base material; having the second base member has an upper end surface, a lower end surface, and a side surface connecting the upper end surface and the lower end surface, The upper end surface is provided with a recess for accommodating the electronic component, The aspect is A first side surface which is a flange portion located on the upper end surface side; a second side surface located inside the first side surface and located on the lower end surface side when viewed from a direction perpendicular to the upper end surface; having A non-contact communication medium, wherein at least a portion of the first side surface and the second side surface are exposed outer surfaces.

2. A non-contact communication medium as described in claim 1, wherein the first substrate has a first flange portion located on the outer periphery of the joint end portion with the second substrate.

3. The non-contact communication medium according to claim 1 , wherein the first substrate and the second substrate have curved corners.

4. The non-contact communication medium according to claim 2 , wherein the flange portion and the first flange portion of the second base material have curved corners.

5. The non-contact communication medium according to claim 4 , wherein the flange portion and the first flange portion of the second substrate have the curved corner portion at a base end in a protruding direction from the first substrate and the second substrate.

6. The non-contact communication medium according to claim 4 , wherein the flange portion and the first flange portion of the second base material have the curved corner portion at an end portion of an interface with the adhesive layer.

7. 7. The non-contact communication medium according to claim 4, wherein the flange portion and the first flange portion of the second base material are made of the same ceramic as the first base material and the second base material.

8. The non-contact communication medium according to claim 4 , wherein the adhesive layer protrudes from the flange portion and the first flange portion of the second base material.

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