Component Handlers

Abstract

The present disclosure relates to a system 100 for handling components 102. The system 100 includes a support assembly 300 configured to support a source substrate 302 having singulated components 102 thereon, and a component transfer assembly 400 configured to support a component transfer medium 402 for receiving the singulated components 102 from an end effector 206. The turret assembly 200, support assembly 300, and component transfer assembly 400 are aligned vertically relative to one another. During rotation of the turret 202, the end effector 206 continuously picks singulated components 102 from the source substrate 302 and places the picked singulated components 102 on the component transfer medium 402.

Description

[Technical field]

[0001] The present disclosure relates generally to component handlers and, more particularly, to systems and methods according to various embodiments for handling components, such as semiconductor dies, using a rotatable turret. [Background technology]

[0002] Semiconductor products such as semiconductor integrated circuits are typically manufactured in wafer form or in package form and are singulated into a plurality of components such as semiconductor dies. The singulated components are primarily subjected to further processing steps until the components are packaged and distributed. Each processing step may occur at a different and separate processing station and / or by a different processing module. Conventionally, each component is first picked up at a first location and transferred between the various processing stations before being released at a second location on the transport medium. The components are processed at the processing stations while in motion or while temporarily stationary at the processing stations, depending on the processing requirements. Between the various processes, the singulated components are transferred from one station to another, primarily in batches. It is important that the components are primarily transferred in an automated, compact and high-speed environment, thereby minimizing the risk of damage to the components and achieving a high throughput and precision while transferring the components.

[0003] Some existing devices known in the semiconductor industry for handling and transporting components include the tape and reel assembly and component handler described in U.S. Patent No. 5,393,963. The component handler is a rotary component handler having a flipper mechanism driven by a motor. The flipper uses a cam follower mechanism to flip the flipper head from a retrieve position to a release position. One problem with this component handler is that the high rotational speed of the flipper mechanism subjects the cam follower mechanism to high frictional forces, thereby prematurely shortening the life of the cam follower mechanism. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2009 / 128790 Summary of the Invention [Problem to be solved by the invention]

[0005] Therefore, there is a need to provide an improved component handler to overcome or mitigate at least one of the above problems and / or shortcomings. [Means for solving the problem]

[0006] According to a first aspect of the present disclosure, there is a system for handling components. The system includes a turret assembly including: a turret rotatable about a horizontal axis; and a plurality of end effectors attached to and arranged around the turret, the end effectors being radially aligned from the horizontal axis. The system further includes: a support assembly configured to support a source substrate including singulated components, the support assembly being aligned vertically relative to the turret assembly; and a component transport assembly configured to support a component transport medium for receiving the singulated components from the end effectors, the component transport assembly being aligned vertically relative to the turret assembly. The turret assembly is disposed between the support assembly and the component transport assembly, and during rotation of the turret, the end effectors continuously pick singulated components from the source substrate and place the picked singulated components on the component transport medium.

[0007] According to a second aspect of the disclosure, there is a method for handling components, the method comprising: supporting a source substrate on a support assembly vertically aligned with a turret assembly, the source substrate carrying singulated components; supporting a component transfer medium on a component transfer assembly vertically aligned with the turret assembly, the component transfer medium receiving singulated components from a plurality of end effectors of the turret assembly; rotating a turret of the turret assembly about a horizontal axis, the end effectors being attached to and arranged around the turret and radially aligned from the horizontal axis; and actuating the end effectors during the rotation of the turret to continuously pick singulated components from the source substrate and place the picked singulated components on the component transfer medium, the turret assembly being disposed between the support assembly and the component transfer assembly.

[0008] According to a third aspect of the present disclosure, there is a turret assembly for handling components, the turret assembly comprising: a turret rotatable about a horizontal axis; and a plurality of end effectors attached to and arranged around the turret, the end effectors being radially aligned from the horizontal axis; during rotation of the turret, the end effectors continuously pick singulated components from a source substrate and place the picked singulated components on a component transport medium, the source substrate, the turret assembly and the component transport medium being vertically aligned with respect to one another, and the turret assembly being disposed between the source substrate and the component transport medium.

[0009] Thus, a component handler according to the present disclosure is disclosed herein. Various features, aspects and advantages of the present disclosure will become more apparent from the following detailed description of embodiments thereof, by way of non-limiting example only, when taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram illustrating a system for handling components according to some embodiments of the present disclosure. [Diagram 2] 1 is a flowchart illustrating a method for handling components according to some embodiments of the present disclosure. [Diagram 3] FIG. 1 is a schematic diagram illustrating an end effector for handling components according to some embodiments of the present disclosure. [Figure 4] FIG. 2 is another schematic diagram illustrating a system for handling components according to some embodiments of the present disclosure. [Diagram 5] FIG. 2 is another schematic diagram illustrating a system for handling components according to some embodiments of the present disclosure. [Figure 6] FIG. 2 is another schematic diagram illustrating a system for handling components according to some embodiments of the present disclosure. [Figure 7A]FIG. 1 is a schematic diagram illustrating stages of a system for handling components according to some embodiments of the present disclosure. [Figure 7B] FIG. 2 is a schematic diagram illustrating steps of a system for handling components according to some embodiments of the present disclosure. [Figure 7C] FIG. 2 is a schematic diagram illustrating steps of a system for handling components according to some embodiments of the present disclosure. [Figure 7D] FIG. 2 is a schematic diagram illustrating steps of a system for handling components according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] For the sake of brevity and clarity, the description of the embodiments of the present disclosure will be directed to the component handler according to the drawings. While aspects of the present disclosure will be described in conjunction with the embodiments provided herein, it will be understood that these aspects are not intended to limit the present disclosure to these embodiments. On the contrary, the present disclosure is intended to cover alternatives, modifications, and equivalents to the embodiments described herein, which alternatives, modifications, and equivalents are included within the scope of the present disclosure as defined by the appended claims. Furthermore, in the following detailed description, specific details are provided to provide a thorough understanding of the present disclosure. However, individuals of ordinary skill in the art, i.e., those skilled in the art, will recognize that the present disclosure may be practiced without the specific details and / or with multiple details emanating from the combination of aspects of a specific embodiment. In some instances, well-known systems, methods, procedures, and components have not been described in detail so as not to unnecessarily obscure aspects of the embodiments of the present disclosure.

[0012] In embodiments of the present disclosure, the depiction or use of a particular element or reference to a particular reference number in a particular drawing or descriptive material corresponding to that drawing may include the same, equivalent or similar elements or reference numbers identified in another drawing or descriptive material corresponding to that drawing.

[0013] References to "one embodiment / example," "another embodiment / example," "some embodiments / examples," "some other embodiments / examples," etc. indicate that the embodiment / example so described has a particular feature, structure, characteristic, property, element, or limitation, but do not indicate that all embodiments / examples have that particular feature, structure, characteristic, property, element, or limitation. Moreover, repeated use of the phrase "in one embodiment / example" or "in another embodiment / example" does not necessarily refer to the same embodiment / example.

[0014] The terms "comprising", "including", "having" and the like do not exclude the presence of other features / elements / steps than those listed in an embodiment. The recitation of certain features / elements / steps in mutually different embodiments does not indicate that a combination of these features / elements / steps cannot be used in a given embodiment.

[0015] As used herein, the terms "a" and "an" are defined as one or more. The use of " / " in the drawings or related text is understood to mean "and / or" unless otherwise indicated. The term "set" is defined as a non-empty and finite group of elements, which mathematically exhibits a cardinality of at least one in accordance with known mathematical definitions (e.g., a set as defined herein may correspond to a unit, singlet or single-element set, or a multi-element set). Recitation of a specific numerical value or value range herein is understood to include or be an approximate numerical value or value range. As used herein, the terms "first", "second", "third", "fourth", etc. are used merely as labels or identifiers and are not intended to impose numerical requirements on the terms associated therewith. As used herein, the term "with respect to each other" indicates a relationship between two or more elements.

[0016] In a representative or exemplary embodiment of the present disclosure, as shown in FIG. 1, there is a system 100 for handling components 102. The system 100 includes a turret assembly 200, a support assembly 300 vertically arranged on the turret assembly 200, and a component transport assembly 400 vertically arranged on the turret assembly 200. Specifically, the turret assembly 200 is disposed between the support assembly 300 and the component transport assembly 400. In many embodiments, the support assembly 300 is disposed below the turret assembly 200, and the component transport assembly 400 is disposed above the turret assembly 200.

[0017] The turret assembly 200 is configured to pick up or retrieve singulated or separate components 102 from the support assembly 300, transport the picked singulated components 102 towards the component transport assembly 400, and place or release the picked singulated components 102 onto the component transport assembly 400. The singulated components 102 may be semiconductor or integrated circuit dies, chips or packages.

[0018] The turret assembly 200 includes a turret 202 rotatable about a horizontal axis 204. As shown in FIG. 1, the horizontal axis 204 is referred to as the Y-axis, and the turret 202 is rotatable in the XZ plane. The turret assembly 200 further includes a plurality of end effectors 206 mounted and arranged around the turret 202. The end effectors 206 are configured to pick up and place the singulated components 102. Further, the end effectors 206 are radially aligned from the horizontal axis 204, such that picking up and placing the singulated components 102 is along the radial direction of the turret 202. The end effectors 206 are also referred to as pick and place devices having a pick-up head for retrieving and releasing the singulated components 102.

[0019] The support assembly 300 is configured to support a source substrate 302 having singulated components 102. In many embodiments, the source substrate 302 is a semiconductor wafer having singulated semiconductors as components 102. The support assembly 300 has a support portion 304 for supporting the source substrate 302, such as a wafer support or retaining structure for supporting the singulated wafer. The wafer support structure can be a wafer table, such as a wafer table having a highly flat or ultra-flat support surface. The wafer and / or components 102 can be supported on the wafer table by a wafer support medium, such as a film frame, an adhesive film, an adhesive tape, or a base plate, as can be readily understood by one of ordinary skill in the art.

[0020] In some embodiments, the support portion 304 has a number of suction ports to facilitate conforming the source substrate 302 to the support portion 304. The suction ports can be activated to hold the support portion 304 to retrieve the component 102, and can be deactivated to release the source substrate 302 for discard or disposal. It is envisioned that there can be other means for engaging or holding the source substrate 302 to the support portion 304. For example, instead of the suction ports, there can be porous portions formed within the support portion 304. The porous portions can be exposed to negative or positive pressure and serve the same function as the suction ports, as can be readily understood by one of ordinary skill in the art.

[0021] In some embodiments, there is a support actuation mechanism 306 for actuating the support assembly 300 to move the source substrate 302 for the end effector 206 to pick up the singulated component 102. Specifically, the support actuation mechanism 306 moves the source substrate 302 to position the next singulated component 102 for pick-up by the next end effector 206. The support actuation mechanism 306 may be part of the support assembly 300 or may be separately connected to the support assembly 300. For example, the support actuation mechanism 306 is coupled to or integral with the support portion 304 and actuates the support portion 304 to thereby move the source substrate 302. In some embodiments, the support assembly 300 has an ejection mechanism (which may cooperate with the support portion 304) to assist the end effector 206 in picking up the component 102. For example, the ejection mechanism may have an ejection pin for pushing the component 102 vertically from the source substrate 302 towards the end effector 206. Such ejection mechanisms may be constructed in a manner readily understood by one of ordinary skill in the art.

[0022] The component transport assembly 400 is configured to support a component transport medium 402 for receiving the singulated components 102 from the end effector 206. To this end effector transports the singulated components 102 from the source substrate 302 to the component transport medium 402. In many embodiments, the component transport medium 402 is a film or thin film, such as a die attach film mounted on a film frame, to which the released components 102 can be readily attached, as will be readily understood by one of ordinary skill in the art.

[0023] The component transfer assembly 400 may have a retaining portion 404 for holding the component transfer medium 402 securely. In some embodiments, the retaining portion 404 has a porous portion formed therein that may be subjected to negative or positive pressure to facilitate conforming the component transfer medium 402 to a surface of the retaining portion 404. The negative pressure at the retaining portion 404 may be activated to hold the component transfer medium 402 for placement of the component 102 and deactivated to release the component transfer medium 402 for transfer to a subsequent processing stage. The porous portion is in fluid communication with a vacuum source. The negative pressure allows the component transfer medium 402 to be held in close contact and generally flat against the retaining portion 404, thereby preventing or at least reducing sagging of the component transfer medium 402 due to the collective weight of the components 102 placed on the bottom retaining surface of the component transfer medium 402. This arrangement advantageously ensures that the vertical position and height of the component transport assembly 400 relative to the turret assembly 200 is not affected or is minimally affected by sagging of the component transport medium 402. Although the porous portion has been described with respect to the retaining portion 404, it is envisioned that there may be other means for engaging or retaining the component transport medium 402 to prevent or reduce sagging of the component transport medium.

[0024] In some embodiments, the component transport actuation mechanism 406 is for actuating the component transport assembly 400 to move the component transport medium 402 relative to the end effector 206 to position the singulated component 102. Specifically, the component transport actuation mechanism 406 moves the component transport medium 402 and positions it for positioning the next singulated component 102 by the next end effector 206. The component transport actuation mechanism 406 may be part of the component transport assembly 400 or may be separately connected to the component transport assembly 400. For example, the component transport actuation mechanism 406 is coupled to or integral with the holding portion 404 to actuate the holding portion 404, thereby moving the component transport medium 402.

[0025] In a representative or exemplary embodiment of the present disclosure, a method 500 is performed by the system 100 for handling components 102, with reference to FIG. 2. In step 502, a source substrate 302 is supported on a support assembly 300 vertically aligned with a turret assembly 200, the source substrate 302 having a singulated component 102. In step 504, a component transport medium 402 is supported on a component transport assembly 400 vertically aligned with the turret assembly 200, the component transport medium 402 receiving the singulated component 102 from the multiple end effectors 206 of the turret assembly 200.

[0026] In step 506, the turret 202 of the turret assembly 200 is rotated about the horizontal axis 204 and the end effector 206 is mounted and arranged around and radially aligned with the turret 202. In step 508, while the turret 202 is rotating, the end effector 206 is actuated to continuously pick singulated components 102 from the source substrate 302 and place the picked singulated components 102 on the component transport medium 402.

[0027] The turret assembly 200 is disposed between the support assembly 300 and the component transfer assembly 400 such that it uses the end effector 206 to retrieve components 102 directly from the source substrate 302 and release them onto the component transfer medium 402. In many embodiments, the turret assembly 200 retrieves components 102 from the support assembly 300 disposed below the turret assembly and transfers the components to the component transfer assembly 400 disposed above the turret assembly. The retrieval and release of components 102 is performed during continuous rotation of the turret 202, pausing at intervals during picking and placing of components 102 so that the components are continuously transferred while the turret 202 rotates.

[0028] The turret 202 may be configurable to rotate in a clockwise or counterclockwise manner, although various portions of the system 100 may be reconfigured according to the direction of rotation. The turret 202 may be configurable to adjust the rotational speed of the turret as well. During the rotation of the turret 202, the turret 202 pauses at a loading position to pick up the component 102 and at an unloading position to place the component 102. While the turret 202 continuously rotates from the loading position to the unloading position to transfer the component 102 from the support assembly 300 to the component transfer assembly 400, the turret 202 may pause at various stages and steps during the transfer, such as to perform other processing on the component 102 during the transfer. In some embodiments, the rotation pauses at a predetermined position between the loading position and the unloading position, such as an image capture position for alignment, as described in more detail below.

[0029] In some embodiments, the turret 202 is generally circular, such that the end effector 206 is equidistant radially from the horizontal axis 204. The horizontal axis 204 lies in the XZ plane relative to the ground, i.e., parallel to the ground. Arranging the turret 202 to be rotatable advantageously reduces the footprint on the ground, making the system 100 more compact. Another advantage of rotating the turret 202 relative to the horizontal axis 204 is that the turret assembly 200 is less susceptible to vibrations that tend to occur in a vertical axis turret and are caused by vertical forces in the end effector during the retrieve / pickup and release / place steps. The turret assembly 200 has an actuation mechanism, such as a rotary actuator or other type of actuation mechanism, optionally in cooperation with a transmission mechanism to rotate the turret 202. In many embodiments, the turret assembly 200 has a motor to rotate the turret 202. The motor can be battery-powered or powered, and can be a step motor or a servo motor. A motor or actuation mechanism is configured to rotate the turret 202 in a controlled manner such that the turret 202 rotates and pauses at intervals to pick and place the component 102. It is envisioned that there may be other types of motors or actuation mechanisms for effecting the rotation or angular displacement of the turret.

[0030] The turret assembly 200 may be configured to hold a desired number of end effectors 206 on the turret 202. The number of end effectors 206 may be preset to match a desired throughput of the system 100, such as two, three, or four end effectors 206 mounted in an array around the turret 202. A greater number of end effectors 206 increases the throughput as the turret 202 rotates, but reduces the angular displacement between successive end effectors 206, thereby increasing the speed at which the end effectors 206 retrieve and release the singulated components 102. It is contemplated that the number of end effectors 206 may be calculated by one of ordinary skill in the art based on the desired throughput.

[0031] Additionally, the turret assembly 200 may be configured with respect to a radius relative to the turret 202 such that the end effector 206 may be configured to rotate about the horizontal axis 204 at a shorter or longer radius. The turret 202 may be designed with certain features or elements to reduce the weight and / or inertial mass of the end effector to improve the efficiency of the turret assembly 200. Such design features or elements are readily understood by those skilled in the art.

[0032] 3, each of the end effectors 206 has a pick-up head 208 for picking up and placing the singulated components 102. In some embodiments, the pick-up heads 208 have a suction tip or nozzle or any suitable type of component gripper for retrieving, holding, and releasing the components 102. For example, each of the pick-up heads 208 is a suction nozzle fluidly connected to a fluid source (e.g., a pneumatic or hydraulic source or a combination thereof) so that negative or positive fluid pressure, e.g., vacuum pressure, can be actuated to retrieve and release the components 102.

[0033] The pick-up head 208 may apply a predetermined force to the component 102 at the point of contact with the component 102 during the retrieval step, which allows the component 102 to be stably held or gripped by the pick-up head 208, preventing or mitigating the risk of damage to the component 102. Without this force, such damage may occur due to misalignment of the component 102 on the source substrate 302, which may result in poor contact between the pick-up head 208 and the component 102, and the component 102 not being held accurately by the pick-up head 208. The misalignment may include one or more misalignments of the source substrate 302 along the X-axis, the Y-axis and / or the tilt angle in the XY plane relative to the support assembly 300.

[0034] The sensor may be located on the pick-up head 208 and configured to measure the force that the pick-up head 208 exerts on the component 102 during the retrieval step. Based on the sensor measurement, the force may be adjusted, for example, by increasing the force to stabilize the pick-up head 208's hold on the component 102, or by decreasing the force to avoid exerting excessive force on the component 102, which may result in damage to the component 102.

[0035] The singulated components 102 are individually picked or retrieved from the source substrate 302 by the end effectors 206 from the top-bottom direction. As shown in FIG. 3, when the end effectors 206 are in a loading position relative to the components 102 of the source substrate 302, the pick-up heads 208 can be moved vertically from a waiting position to a pick-up position over a predetermined distance to allow for the retrieval of the components 102. Because the end effectors 206 are oriented radially away from the center of the turret 202, the force that each of the pick-up heads 208 exerts on the components 102 is fully transferred through the center of the turret 202 and the horizontal axis 204. This significantly reduces the unbalanced forces that tend to occur in a vertical axis turret with vertically oriented end effectors, thereby reducing disturbances such as shock and vibration to other parts of the system 100. As a result of the reduced disturbances, unwanted movements of the end effectors 206 during the retrieval and release steps are minimized. Thus, the singulated components 102 may be retrieved by the end effector 206 without risking damage from the pick-up head 208 during the retrieval step.

[0036] In the loading position of the source substrate 302 during the retrieval step, the pick-up head 208 is in a downward orientation relative to the top supporting surface of the singulated component 102, which is in a generally flat position corresponding to the horizontal XY plane. In the unloading position of the component transport medium 402 during the release step, the pick-up head 208 is in an upward orientation relative to the bottom supporting surface of the component transport medium 402, which is in a generally flat position corresponding to the horizontal XY plane. In this arrangement, the supporting surface of the component transport medium 402 is in a downward orientation, facing directly towards the upwardly oriented top supporting surface of the source substrate 302.

[0037] In many embodiments, the end effectors 206 are positioned at equal angular intervals around the turret 202. By spacing the end effectors 206 at equal angular intervals from one another relative to the horizontal axis 204, the weight of the turret assembly 200 is substantially balanced. For example, in one example of rotation, one end effector 206 is in a load position while another end effector 206 is in an unload position and the overall weight of the turret assembly 200 is approximately balanced relative to the horizontal axis 204.

[0038] 4, the first end effector 206a and the second end effector 206b are directly opposite one another, i.e., the end effectors 206a, 206b are positioned 180° apart relative to one another. Both end effectors 206a, 206b are structurally configured in a similar manner, and their spatial configurations relative to the turret 202 are also similar. For example, when the first end effector 206a is in an unloading position at the top of the turret 202 and places a first singulated component 102a on the component transport medium 402, the second end effector 206b is in a loading position at the bottom of the turret 202 and picks up a second singulated component 102b from a source substrate 302. The rotation of the turret 202 is paused to allow the first singulated component 102a to be placed on the component transport medium 402 and the second singulated component 102b to be removed from the source substrate 302. The turret 202 then resumes rotation to move the second end effector 206b and the held second singulated component 102b to an unloaded position on the component transport medium 402 and simultaneously move the first end effector 206a to a loaded position on the source substrate 302. The second singulated component 102b is now ready to be placed on the component transport medium 402 and the first end effector 206a is ready to pick up another singulated component 102.

[0039] Thus, the first end effector 206a and the second end effector 206b are rotated together with the turret 202, such that, in one example of turret rotation, the first end effector 206a is in position to place the first singulated component 102a vertically, e.g., in a bottom-up direction, on the component transport medium 402, and the second end effector 206b is in position to pick up the second singulated component 102b vertically, e.g., in a top-down direction, from the source substrate 302.

[0040] 1, in some embodiments, the turret assembly 200 has four end effectors 206a-206d positioned equiangularly spaced about the turret 202, i.e., 90° apart from one another. In some embodiments, the turret assembly 200 has three end effectors 206a-206c positioned equiangularly spaced about the turret 202, i.e., 120° apart from one another. However, it is envisioned that the end effectors 206 may be spaced at various angular distances. For example, in a turret assembly 200 having three end effectors 206a-206c, the first and second end effectors 206a, 206b may be angularly spaced apart by 180°, the second and third end effectors 206b, 206c may be angularly spaced apart by 90°, and the first and third end effectors 206a, 206c may be angularly spaced apart by 90°.

[0041] 5 and 6, in some embodiments, the system 100 further includes an image capture device 600 configured to capture images of the singulated components 102 held by the end effector 206 during rotation of the turret 202. During image capture of each singulated component 102, the component 102 may be moving (the turret 202 is continuously rotating) or momentarily stationary (the turret 202 is stopped rotating). The image capture device 600 may be aligned radially from the horizontal axis 204. In particular, the image capture device 600 may be positioned in a suitable or ergonomic location radially pointing toward the center of the turret 202. For example, the image capture device 600 is aligned with the X-axis and points directly toward the end effector 206 in an image capture position for image capture of the singulated components 102 held by the end effector 206. This arrangement allows the image capture device 600 to capture a good image of the bottom surface of the singulated component 102, as the bottom surface of the singulated component is aligned with the center of the field of view of the image capture device 600. It is contemplated that the image capture device 600 may be positioned or re-arranged differently depending on the direction of rotation of the turret 202.

[0042] The system 100 may include an illumination device that facilitates capturing clearer and more accurate images of the singulated components. The illumination device may include one or more of a ring light, a xenon lamp, a light emitting diode (LED) lamp, and a white light. The illumination intensity from the illumination device may be varied as needed.

[0043] The system 100 may further include a computer system 700 communicatively coupled to the image capture device 600. The computer system 700 includes an image processing module for processing captured images of the singulation component 102. In some embodiments, the image capture module is configured to detect alignment of the singulation component 102 with the center of the field of view of the image capture device 600, and to capture one or more images of a bottom surface of the singulation component 102 in response to positive detection of said alignment. The computer system 700 may include a data storage module (e.g., a hard disk drive, solid state drive, or memory device, etc.) for storing the captured images. Additionally, as described in more detail below, the image processing module is configured to calculate a misalignment of the retained singulation component 102 based on the captured images.

[0044] The computer system 700 may include one or more computers, laptops, minicomputers, mainframe computers, any non-transient tangible machine capable of executing machine-readable code, cloud-based servers, distributed server networks, and computer system networks. The computer system 700 may be implemented in hardware or software. Additionally, the computer system 700 may include a processor, memory, and various other modules or components.

[0045] The modules and components of the modules are configured to perform various operations or steps and are configured as parts of the processor. Such operations or steps are performed in response to non-transient instructions operable or executable by the processor. The memory is used to store instructions and possibly data that is read during execution of the program. The memory may be referred to as a computer-readable storage medium and / or a non-transient computer-readable medium in some circumstances. A non-transient computer-readable medium is any computer-readable medium, with the only exception being a transitory propagating signal itself.

[0046] In some embodiments, the computer system 700 stores a digital map or data set of the source substrate 302 in a data storage module. The digital map identifies the locations of the singulated components 102 relative to the source substrate 302. Additionally, the digital map may identify the locations of defective singulated components 102. In particular, the digital map provides a record of which of the components 102 of the source substrate 302 are good and which are defective. This may depend on the results of electrical tests and visual inspections that may be performed during front-end and back-end processing prior to transferring the components 102 from the source substrate 302. The digital map of the source substrate 302 is continuously updated during front-end and back-end processing, particularly after each set of electrical tests and visual inspections that the source substrate 302 undergoes. Within the digital map, data fields corresponding to the location of each singulated component 102 are updated with specific and distinct data elements that at least describe whether the singulated components 102 are electrically good or bad and whether the singulated components are visually good or defective. Good or non-defective components 102 are transferred from the source substrate 302 to the component transport medium 402, while defective components 102 are discarded.

[0047] A plurality of source substrates 302 are stored in a storage medium, such as a wafer stack, prior to being transferred to the support assembly 300. Each of the source substrates 302 has an associated identification, such as an optical code, and each digital map of the source substrates 302 is digitally linked to an identifier. Some non-limiting examples of optical codes include Quick Response Code (QR) Code, barcode, EZ Code, high capacity color barcode, Schott Code, Maxi Code, GTIN12 Code, GTIN13 Code, and Aztec Code. The identifier can be physical, such as a substrate identification number or a barcode, imprinted or tagged on a surface of the source substrate 302, such as the periphery of the source substrate 302, providing an identification of the source substrate.

[0048] Prior to transferring the source substrate 302 to the support assembly 300, a digital map of the source substrate 302 may be provided to determine the locations of the singulation components 102 to be retrieved. Each location is determined in terms of XYθ coordinates, i.e., a linear position along the X and Y axes, and an angular orientation position θ in the horizontal XY plane. The XYθ coordinates of each singulation component 102 refer to pre-determined data.

[0049] When the singulation component 102 of the source substrate 302 is picked up by the end effector 206 and moved to an image capture position, such as the third end effector 206c holding the third singulation component 102c as shown in Figure 5, the image capture device 600 captures one or more images of the bottom surface of the singulation component 102. Further, in the example shown in Figure 5, the first end effector 206a, the second end effector 206b and the third end effector 206c are rotated along with the turret 202. In one example of turret rotation, the first end effector 206a is positioned to place the first singulated component 102a vertically in a bottom-up direction onto the component transport medium 402, the second end effector 206b is positioned to pick the second singulated component 102b vertically in a top-down direction from the source substrate 302, and the third end effector 206c holds the third singulated component 102c and is positioned to capture one or more images of the third singulated component 102c.

[0050] The captured images are communicated to a computer system 700, and a calculation module of the computer system calculates the actual position of the singulation component 102 based on the captured images. The actual position is in XYθ coordinates with reference to pre-determined data in a digital map of the source substrate 302. Although the image capture device 600 has been described to capture images to calculate the actual position, there may be other means of measuring or determining the actual position and coordinates of the singulation component 102, as will be readily understood by those skilled in the art.

[0051] The calculation module then compares the actual position of the singulated component 102 with a reference position of the same singulated component 102 from the digital map. Based on this comparison, the calculation module calculates the misalignment of the singulated component 102 with respect to the digital map of the source substrate 302 and calculates the correct position for placing the singulated component 102 on the component transport medium 402.

[0052] Misalignment between the actual position of the singulated component 102 and the reference position of the singulated component from the digital map may be corrected by actuating the component transport assembly 400 to thereby move the component transport medium 402 before placing the singulated component 102 on the component transport medium 402. In some embodiments, a component transport actuation mechanism 406 actuates the component transport assembly 400 to move the component transport medium 402 to correct the misalignment.

[0053] The computer system 700 has an actuation control module for controlling the component transport actuation mechanism 406 to correct the misalignment having XYθ deviations (deviations along the X-axis, Y-axis and / or tilt angle in the XY plane). The component transport actuation mechanism 406 actuates the component transport assembly 400 to move the component transport medium 402 along the X-axis, Y-axis and / or tilt angle in the XY plane. Thus, the component transport actuation mechanism 406 can align the component transport medium 402 with the singulation component 102 by correcting or compensating for the XYθ deviations of the calculated misalignment. Each singulation component 102 can then be accurately placed on the component transport medium 402 at the correct position.

[0054] In some embodiments, the component transport actuation mechanism 406 is further configured to actuate the component transport assembly 400 to move the component transport medium 402 vertically along the Z-axis. This may be done by adjusting the vertical distance between the component transport medium 402 and the end effector 206 before the end effector 206 places the singulated component 102 on the component transport medium 402. Furthermore, depending on, for example, the thickness of the component transport medium 402, the vertical distance between the end effector 206 and the component transport medium 402 may vary. The component transport actuation mechanism 406 may actuate the component transport assembly 400 to thereby move the component transport medium 402 downward or upward and adjust the vertical distance of the end effector 206 so that the end effector 206 can accurately place the singulated component 102 on the component transport medium 402.

[0055] In some embodiments, the support actuation mechanism 306 actuates the support assembly 300 to align the singulation component 102 of the source substrate 302 to the end effector 206. The support assembly 300 can be actuated to compensate for misalignment determined from a digital map of the source substrate 302.

[0056] The actuation control module is configured to control the support actuation mechanism 306 to actuate the source substrate 302 along the X-axis, the Y-axis and / or a tilt angle in the XY plane. Thus, the support actuation mechanism 306 can align the singulation component 102 with the end effector 206 by actuating the support assembly 300 to move the source substrate 302 and thereby center the singulation component 102 of the source substrate 302 with the pick-up head 208 of the end effector 206. Each singulation component 102 can then be accurately picked up at the correct location on the source substrate 302. Thus, such a support assembly 300 can carry, securely hold and accurately position the source substrate 302 in a manner that will be readily understood by those skilled in the art.

[0057] In some embodiments, the support actuation mechanism 306 is further configured to actuate the support assembly 300 to move the source substrate 302 vertically along the Z-axis. This may be done to adjust the vertical distance between the source substrate 302 and the end effector 206 before the end effector 206 picks up the singulated component 102 from the source substrate 302. Furthermore, the vertical distance between the end effector 206 and the source substrate 302 may vary, for example, depending on the thickness of the source substrate 302. The support actuation mechanism 306 actuates the support assembly 300 to move the source substrate 302 down or up to adjust the vertical distance relative to the end effector 206, so that the end effector 206 can accurately pick up the singulated component 102 from the source substrate 302.

[0058] In many embodiments, the source substrate 302 undergoes inspection prior to the transfer of the components 102 from the source substrate 302 to the component transport medium 402. The inspections may be performed on the source substrate 302 prior to transfer of the source substrate 302 to the support assembly 300 or when the source substrate 302 is already positioned on the support assembly 300 but prior to positioning it relative to the end effector 206 to pick up the components 102. During these inspections, a digital map of the source substrate 302 is constantly updated to accurately correct for misalignments during the transfer of the components 102 from the source substrate 302 to the component transport medium 402.

[0059] In some embodiments, the system 100 does not have an image capture device 600. Thus, the computer system 700 performs the misalignment correction based on the digital map of the source substrate 302 without processing the captured images of the singulation components 102. This is possible because the digital map is constantly updated during inspection and the actual coordinates of the singulation components 102 can be accurately derived from the digital map. In these embodiments, the image capture device 600 does not need to capture images of the singulation components 102 to correct the misalignment. Using the digital map, the actuation control module controls the support actuation mechanism 306 to actuate the support assembly 300 to move the source substrate 302 to position the singulation components 102 accurately below the end effector 206, i.e., the center of each of the singulation components 102 is directly below the respective end effector 206. Thus, the singulation components 102 can be directly transferred to the component transport medium 402 with minimal intervening steps since the misalignment of the singulation components 102 is minimal.

[0060] In some embodiments, the source substrate 302, such as a film frame holding the singulated components 102, undergoes a stretching process, which stretches the singulated components 102 away from the source substrate 302. This stretching process may be performed to increase the separation or gap between the components, making them easier to pick up by the end effector 206. As a result of the stretching process, the actual coordinates of each of the singulated components 102 are misaligned from the coordinates stored in the digital map. In these embodiments, the system 100 includes an image capture device 600 that cooperates with a computer system 700 to correct for misalignment based on the digital map. As described above, while the singulated components 102 are being transported, the image capture device 600 captures one or more images of each of the singulated components 102 and processes the captured images to correct for misalignment of the singulated components 102.

[0061] The computer system 700 may be connected using a communications network or interface to one or more other components of a broader semiconductor manufacturing system, such as having other component handlers, die sorters, system controllers, etc. The computer system 700 may be able to receive, retrieve, or access a digital map of the source substrate 302 in the form to which the singulated components 102 are transferred, as well as other data relating to the processing of the components 102.

[0062] The system 100 is preferably operated automatically by a computer system 700, such as in cooperation with a semiconductor manufacturing system. Each of the end effectors 206 positioned about the rotating turret 202 can transfer a singulated component 102 from a pick-up or load position where it picks up the singulated component 102 from the source substrate 302 to a release or unload position where it places the singulated component 102 on the component transport medium 402. Rotation of the turret 202 about the horizontal axis 204 moves the singulated component 102 progressively from the load position to the unload position where the end effectors 206 can successively pick singulated components 102 from the source substrate 302 and place the singulated components 102 on the component transport medium 402.

[0063] The loading and unloading positions are located along a vertical line perpendicular to the source substrate 302 and / or the component transport medium 402, such that the source substrate 302 is arranged in a facing orientation relative to the component transport medium 402. In this arrangement, when the singulated component 102 is picked up by the end effector 206 in the loading position, the singulated component is in a top-down orientation, meaning that a top surface of the singulated component 102 faces upward. When the singulated component 102 is placed by the end effector 206 in the unloading position, the singulated component is in a bottom-up orientation, meaning that a bottom surface of the singulated component 102 faces upward, such that the bottom surface is attached to the component transport medium 402. This arrangement advantageously allows the singulated components 102 to be transferred directly from the source substrate 302 to the component transport medium 402 with minimal intervening steps to reorient the singulated components 102, such as flipping the components 102.

[0064] An exemplary operation of the system 100 for handling components is described below with reference to Figures 7A-7D, which illustrate various stages of the operation. In this operation, the components 102 are semiconductor dies 102 singulated from a source substrate 302, which is a semiconductor wafer 302. The turret assembly 200 has four end effectors 206a-d positioned at equal angular intervals around the turret 202. The wafer 302 is supported on a support portion 304, which may be a wafer table 304, and the support assembly 300 is referred to as a wafer table assembly 300. The wafer table assembly 300 further has a support actuation mechanism 306. The component transport medium 402 is a die attach film 402 for attaching the dies 102.

[0065] The wafer 302 is first retrieved from a storage medium, such as a wafer stack, by a robotic device, a wafer handler, or other means known to those skilled in the art. The wafer 302 is retrieved and transferred to a support assembly 300, where the wafer is placed on a wafer table 304. A wafer handler or similar means for handling the wafer 302 may be integrated into or as the support assembly 300, or may cooperate separately with the support assembly 300. After the wafer 302 is placed on the wafer table 304, a support actuation mechanism 306 is actuated to actuate the wafer table 304 and move the wafer 302 to align the first die 102a with the first end effector 206a. The movement of the wafer 302 is determined from a digital map of the wafer to compensate for misalignment between the first end effector 206a and the first die 102a.

[0066] As shown in Fig. 7A, the first end effector 206a is in the loading position and picks up the first die 102a. As shown in Fig. 7B, the turret 202 rotates 90 degrees clockwise and moves the picked up first die 102a to the image capture position. At the same time, the second end effector 206b moves to the loading position to pick up the second die 102b from the wafer 302.

[0067] At the image capture position, the image capture device 600 captures one or more images of the bottom surface of the first die 102a. The calculation module then calculates an actual position of the first die 102a based on the captured images, and further calculates a misalignment between the actual position of the first die 102a and the reference position of the first die 102a from the digital map. The actuation control module then controls the component transfer actuation mechanism 406, thereby correcting the misalignment. The component transfer actuation mechanism 406 is actuated to actuate the component transfer assembly 400 and move the die attach film 402 to correct the misalignment. At the loading position, the second end effector 206b picks up the second die 102b.

[0068] 7C, the turret 202 rotates 90° clockwise and moves the first die 102a to an unloading position, while simultaneously moving the second die 102b to an image capture position and moving the third end effector 206c to a loading position to remove the third die 102c from the wafer 302.

[0069] In the unloading position, the component transport assembly 400 is actuated to move the die attach film 402 to compensate for the misalignment, so that the first die 102a can be accurately placed in the correct position on the die attach film 402. In the image capture position, the image capture device 600 captures one or more images of the bottom surface of the second die 102b. In the loading position, the third end effector 206c picks up the third die 102c.

[0070] As shown in FIG. 7D, the turret 202 rotates 90° clockwise and moves the second die 102b to an unloading position. At the same time, the third die 102c is moved to an image capture position and the fourth end effector 206d is moved to a loading position to pick the fourth die 102d from the wafer 302. It is assumed that the above description regarding unloading, aligning and placing the first die 102a applies similarly and in the same way to the second die 102b, the third die 102c and the fourth die 102d and will not be repeated for brevity. It is also assumed that the dies 102 of the wafer 302 are continuously picked and placed by the end effector 206 in a similar manner throughout the rotation of the turret 202.

[0071] As described in various embodiments herein, the system 100 is configured to handle the components 102 by transferring them from the support assembly 300 to the component transfer assembly 400, both of which are vertically aligned on the turret assembly 200. This vertical alignment allows the components 102 to be transferred directly from the source substrate 302 to the component transfer medium 402 with minimal intervening steps to reorient the components 102. This reduces the risk of the components 102 becoming dislodged from the end effectors 206, as there are fewer intervening steps during transfer. The transfer of the components 102 can be done at high throughput, for example by increasing the number of end effectors 206 on the turret assembly 200, and with high precision, as misalignment can be corrected by actuating the component transfer assembly 400 to move the component transfer medium 402 before placing the components 102 on the component transfer medium. High throughput and high precision can increase the efficiency of manufacturing and distributing semiconductor products from semiconductor fabs, resulting in higher profits.

[0072] Various embodiments of the present disclosure have been described with respect to a vertical arrangement, in which the support assembly 300 is disposed below the turret assembly 200 and the component transfer assembly 400 is disposed above the turret assembly 200. However, other embodiments are possible in which the support assembly 300 is disposed above the turret assembly 200 and the component transfer assembly 400 is disposed below the turret assembly 200. In these embodiments, the turret 202 transfers the components 102 from a source substrate 302 disposed above the turret 202 to a component transfer medium 402 disposed below the turret 202. The end effector 206 vertically picks up the components 102 from the source substrate 302 in a bottom-up direction and vertically places the components 102 on the component transfer medium 402 in an up-down direction. Various components of the system 100 may be rearranged according to the vertical arrangement.

[0073] In the above detailed description, embodiments of the present disclosure relating to a component handler are described with reference to the drawings provided. The description of various embodiments herein is not intended to be directed to or limited to only specific or particular representative examples of the present disclosure, but is intended to illustrate non-limiting examples of the present disclosure. The present disclosure serves to address at least one of the above-mentioned problems and issues associated with the prior art. Although only some embodiments of the present disclosure are disclosed herein, it is anticipated by those skilled in the art in view of the present disclosure that various changes and / or modifications may be made to the disclosed embodiments without departing from the scope of the present disclosure. Thus, the scope of the present disclosure and the following claims are not limited to the embodiments described herein. [Explanation of symbols]

[0074] 100 system, 102 singulation component, semiconductor die, 102a first singulation component, first die, 102b second singulation component, second die, 102c third singulation component, third die, 102d fourth die, 200 turret assembly, 202 rotating turret, 204 horizontal axis, 206 end effector, 206a first end effector, 206b second end effector, 206c third end effector, 206d fourth end effector, 208 pick-up head, 300 support assembly, wafer table assembly, 302 source substrate, semiconductor wafer, 304 support portion, wafer table, 306 support actuation mechanism, 400 component transfer assembly, 402 component transfer medium, die attach film, 404 holding portion, 406 component transfer actuation mechanism

Claims

1. 1. A system for handling components, comprising: - a turret assembly, - a turret rotatable about a horizontal axis; a plurality of end effectors mounted on and arranged around the turret, the end effectors being radially aligned from the horizontal axis; and a turret assembly comprising: a support assembly configured to move a source substrate to a retrieval position, the support assembly being disposed below the turret assembly such that an end effector of a plurality of end effectors is positioned in an orientation facing vertically downwards and above the component at an XYθ coordinate position of the source substrate, the end effector being configured to retrieve a component from the source substrate when the end effector is rotated to the retrieval position, the XYθ coordinate position of the component on the source substrate being identified in a digital map of the source substrate; an image capture device radially aligned from the horizontal axis and configured to capture images of the components retrieved by the end effector during rotation of the turret when the end effector is in an image capture position; A calculation module; Equipped with The calculation module: determining from the image an actual location of the component on the source substrate relative to an XYθ coordinate location in the digital map; Calculating a misalignment of the actual location of the component relative to the digital map of the source substrate; calculating a corrective position for placing the component on a component transport medium of a component transport assembly; It is structured as follows: The component transport assembly includes: a turret assembly disposed above the turret assembly such that the end effector having the component retrieved from the source substrate is oriented in a vertically upward direction to release the component from the end effector; configured to move the component transport medium to a release position such that the end effector can release the component at the correction position on the component transport medium when the end effector is in the release position. A system characterized by:

2. the source substrate includes a plurality of the components; 2. The system of claim 1, wherein the digital map includes XYθ coordinates for each of the components on the source substrate.

3. 3. The system of claim 2, wherein the digital map of the source substrate includes locations of defective dies.

4. In operation, the turret is rotated in a first direction; when the one of the end effectors is in the retrieve position, the one of the end effectors is configured to retrieve the one of the components based on an XYθ coordinate position of the one of the components from the digital map; an image capture module captures an image of the one component when the one end effector is in the image capture position; The calculation module: determining an actual location of the one component on the source substrate; Calculating a misalignment of the actual location of the one component relative to the digital map of the source substrate; calculating the corrected position for placing the one component on the component transport medium; 2. The system of claim 1, wherein when the one end effector is in the release position, the one end effector is configured to release the one component to the component transport medium at the correction position of the one component.

5. a component transport actuation mechanism for actuating the component transport assembly to correct misalignment; a support actuation mechanism for actuating the support assembly to align the component of the source substrate with respect to the end effector; Further equipped with 10. The system of claim 1, wherein the support assembly comprises a highly flat or ultra-flat wafer table for supporting the source substrate.

6. The plurality of end effectors may include a first end effector and a second end effector, whereby, in one example of rotation of the turret, the first end effector is positioned to vertically position a first of the components on the component transport medium; the second end effector is positioned to pick up a second of the components vertically from the source substrate; The system of claim 5 , wherein each of the end effectors comprises a suction nozzle.

7. 7. The system of claim 6, wherein the plurality of end effectors further comprises a third end effector, whereby during one rotation of the turret, the third end effector is holding a third component and is in a position to capture an image of the third component.

8. 1. A method for handling a component, comprising: - moving a source substrate supported on a support assembly to a retrieval position, the support assembly being positioned below a turret assembly, whereby one of a plurality of end effectors is positioned above the component on the source substrate in an orientation pointing vertically downward at an XYθ coordinate position of the source substrate to retrieve the component from the source substrate at the retrieval position, a digital map including the XYθ coordinate positions of the component on the source substrate; - rotating a turret of the turret assembly about a horizontal axis, wherein a plurality of the end effectors are mounted on and arranged around the turret and radially aligned from the horizontal axis, and rotating the turret rotates the end effectors having the components retrieved from the source substrate to an image capture position; - capturing an image of the component held by the end effector when the end effector is positioned at the image capture position by an image capture device; - analyzing said image by a calculation module, - determining the actual location of the component on the source substrate; - calculating a misalignment of the actual position of the component relative to the digital map of the source substrate; - calculating a corrected position for placing the component on a component transport medium of a component transport assembly; Steps and - moving the component transport medium of the component transport assembly to a component release position, the component release position corresponding to the correction position for placing the component on the component transport medium; - rotating the turret so that the end effector is in a position at the component release position, the end effector being positioned in a vertically upwards orientation for releasing the component from the end effector to the component transport medium at the corrected position of the component transport medium; 23. A method comprising:

9. the source substrate includes a plurality of components; 9. The method of claim 8, wherein the XYθ coordinates of each of the components included in the digital map reference predetermined datum of the source substrate.

10. 9. The method of claim 8, wherein the digital map of the source substrate includes the locations of defective dies.

11. During operation, rotating the turret in a first direction so that the end effector having the component is positioned at the image capture location, a next (x+1) one of the end effectors is positioned at the retrieval location to pick up the next (x+1) component on the source substrate, the source substrate being moved to the retrieval location corresponding to an XYθ coordinate location of the next component from the digital map; rotating the turret in the first direction to position the end effector having the component at the component release position, the next end effector is positioned at the image capture position and a next next (x+2) one of the plurality of end effectors is positioned at the retrieval position to retrieve the next next (x+2) one of the components on the source substrate; rotating the turret in the first direction to position the next end effector having the component at the component release position, and positioning the next next end effector at the image capture position; Equipped with The method of claim 10 , wherein a plurality of the end effectors sequentially retrieve, image, and release a component when in the retrieval position, the image capture position, and the component release position.

12. The method of claim 8 , wherein moving the component transport medium to the component release position comprises actuating the component transport assembly to move the component transport medium to the component release position.

13. 9. The method of claim 8, wherein moving the source substrate to the retrieval position comprises actuating the support assembly to align the component of the source substrate with the end effector.

14. rotating a first end effector and a second end effector of the plurality of end effectors together with the turret, whereby, in one example of the rotation, the first end effector is in the component release position for vertically placing a first of the components on the component transport medium; the second end effector is in the retrieve position for vertically removing a second of the components from the source substrate; The method of claim 13 , wherein the first and second end effectors each comprise a suction nozzle.

15. 15. The method of claim 14, further comprising rotating a third of the plurality of end effectors with the turret, whereby, during one instance of the rotation, the third end effector is holding a third of the component and is in a position to capture an image of the third component.

16. the source substrate comprises a semiconductor wafer having a plurality of components; the component is a semiconductor die; and / or The method of claim 8 , wherein the component transport medium comprises a die attach film.

Images