Electronic Components

Abstract

To provide an electronic component that has excellent heat dissipation, is compact, and is easy to handle.SOLUTION: An electronic component 10 has at least one chip component 20. The electronic component 10 has a first surface 22a and a second surface 21c intersecting the first surface 22a. A junction 104 of a shape memory plate 100 is joined to the first surface 22a. A shape changing part 102 that is continuous with the junction 104 of the shape memory plate 100 covers at least a portion of the second surface 21c. The shape memory plate 100 stores a shape in which the shape changing part 102 changes in a direction away from the second surface 21c at a predetermined temperature or above.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present invention relates to an electronic component that has excellent heat dissipation properties and is easy to handle. [Background technology]

[0002] In order to improve the heat dissipation of electronic components, electronic components with heat sinks have been developed, for example, as shown in Patent Document 1 below.

[0003] However, in conventional electronic components with heat sinks, the attachment of a heat sink with excellent heat dissipation properties results in the electronic components becoming larger, and the heat sink becomes an obstacle, making it difficult to transport the electronic components using a pickup device or the like, and making handling difficult. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-109333 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component that has excellent heat dissipation properties, is small in size, and is easy to handle. [Means for solving the problem]

[0006] In order to achieve the above object, the electronic component according to the present invention comprises: An electronic component having at least one chip component, the electronic component has a first surface and a second surface intersecting the first surface; A joint portion of a shape memory plate is joined to the first surface, A shape-changing portion of the shape memory plate that is continuous with the joint portion covers at least a portion of the second surface, The shape of the shape-changing portion, which changes in a direction away from the second surface at a predetermined temperature or higher, is memorized in the shape memory plate.

[0007] In the electronic component according to the present invention, before mounting on a circuit board or the like, the joints and shape-changing parts of the shape-memory plates are folded along the outer surfaces (first and second surfaces) of the chip components, so that the electronic component can be made smaller. Furthermore, these shape-memory plates do not get in the way when the electronic component is transported by a pickup device or the like. The electronic component may be transported while being detachably held by the suction part of the pickup device to the outer surface of the shape-changing part or the outer surface of the joints.

[0008] That is, the electronic component of the present invention has excellent handleability. In addition, when mounting the electronic component on a circuit board or the like, heat is transferred to the shape memory plate due to a heat treatment during reflow for mounting, and the shape memory plate deforms to recover to the memorized shape, and the shape-changing portion of the shape memory plate deforms in a direction away from the second surface of the electronic component.

[0009] Therefore, the shape-changing part of the shape memory plate has a large heat dissipation area exposed to the surrounding atmosphere, and becomes a part with excellent heat dissipation properties, similar to a heat sink. Therefore, heat generated in the electronic component itself and heat transmitted to the electronic component from a circuit board are transmitted from the joint to the shape-changing part, where they are dissipated. Therefore, after mounting the electronic component, the heat dissipation properties are improved. Forced cooling air may be applied to the shape-changing part after mounting.

[0010] The predetermined temperature is a temperature higher than the maximum temperature that occurs when handling the electronic component, and is a temperature at which the shape memory plate does not recover its memorized shape at the temperature that occurs when handling the electronic component. This predetermined temperature is determined to be higher than the maximum temperature that occurs when handling the electronic component, and lower than the temperature at which the bonded portion peels off from the second surface.

[0011] Preferably, the joining portion of the shape memory plate is joined to the first surface by an adhesive or a conductive adhesive, or is joined to the first surface by a joining means that does not peel off at or below the predetermined temperature.

[0012] When the joint of the shape memory plate is joined to an insulating part of an electronic component, it is not necessary for the joint to be electrically conductive to the first surface. However, when the joint of the shape memory plate is connected to a terminal electrode of an electronic component, it is preferable for them to be electrically conductive. This is because, when mounting an electronic component, a solder fillet may be formed on the outer surface of the joint of the shape memory plate, and it is preferable for the solder fillet to be electrically conductive to the terminal electrode as well.

[0013] Preferably, a treatment layer (e.g., a plating layer containing tin) that improves wettability with a joining material (e.g., solder) when mounting the electronic component is formed on the outer surface of the joining portion of the shape memory plate. This is because solder fillets are easily formed on the outer surface of the joining portion of the shape memory plate.

[0014] Preferably, the shape memory plate is an alloy plate containing a metal having excellent electrical conductivity.

[0015] Preferably, the shape of the shape memory plate is such that the shape change portion is substantially perpendicular to the mounting surface on which the electronic component is mounted when the temperature is equal to or higher than the predetermined temperature. By configuring in this manner, heat dissipation is particularly improved.

[0016] The electronic component may further have a third surface intersecting the first surface or the second surface. Also, a separate joint of a separate shape memory plate may be joined to the third surface. Furthermore, a separate shape change portion continuous with the separate joint of the separate shape memory plate may cover at least a part of the second surface, and preferably, the separate shape change portion has a shape stored in the separate shape memory plate in a direction away from the second surface at or above the predetermined temperature.

[0017] This configuration makes it possible to increase the number of shape-changing parts that change shape after mounting, thereby particularly improving heat dissipation. Also, by providing a plurality of shape-changing parts that change shape after mounting, it becomes possible to limit the height and width of the shape-changing parts after they change, thereby limiting the amount of space that the electronic component occupies after mounting.

[0018] The separate shape-changing portion and the shape-changing portion may be combined to cover the second surface without overlapping, or may cover the second surface by overlapping. By overlapping, the shape change of the shape-changing portion after mounting can be increased. Furthermore, when covering the second surface without overlapping, the shape change of the shape-changing portion after mounting can be reduced while ensuring the miniaturization of the electronic component before mounting, and the area from which heat is dissipated can be increased.

[0019] The chip component may have an element body and a terminal electrode formed on an end surface of the element body, and the first surface may be a main surface of the terminal electrode of the chip component, and the second surface may be a side surface of the element body.

[0020] Alternatively, the electronic component may further have a case having a recess for accommodating the chip component, in which case the first surface may be at least one of a plurality of surfaces of the case, and the second surface may be at least one of the others.

[0021] The chip component may include a plurality of chip components. The electronic component of the present invention may further include an open-type case that holds the chip components such that outer surfaces of the terminal electrodes of the plurality of chip components are exposed and continuously arranged in a first direction.

[0022] The first surface may be a collective surface in which the outer surfaces of the terminal electrodes of the plurality of chip components are exposed along a first direction and continuously connected. The second surface may be at least one surface of the open-type case. With this configuration, heat from the plurality of chip components can be efficiently dissipated to the outside through the shape-changing portion of the shape memory plate. [Brief description of the drawings]

[0023] [Figure 1A] FIG. 1A is a schematic perspective view of an electronic component according to one embodiment of the present invention. [Figure 1B] FIG. 1B is a schematic perspective view showing a state after the shape of the electronic component shown in FIG. 1A has been changed. [Figure 1C] FIG. 1C is a cross-sectional view taken along line IC-IC of the electronic component shown in FIG. 1B. [Figure 2A] FIG. 2A is a schematic perspective view of an electronic component according to another embodiment of the present invention. [Figure 2B] FIG. 2B is a schematic perspective view showing a state after the shape of the electronic component shown in FIG. 2A has been changed. [Figure 3A] FIG. 3A is a schematic perspective view of an electronic component according to still another embodiment of the present invention. [Figure 3B] FIG. 3B is a schematic perspective view showing a state after the shape of the electronic component shown in FIG. 3A has been changed. [Figure 4A] FIG. 4A is a schematic perspective view of an electronic component according to still another embodiment of the present invention. [Figure 4B] FIG. 4B is a schematic perspective view showing a state after the shape of the electronic component shown in FIG. 4A has been changed. [Figure 4C] FIG. 4C is a schematic perspective view of the electronic component shown in FIG. 4A as viewed from a different angle (the case is omitted). [Figure 4D] FIG. 4D is an exploded perspective view of the electronic component shown in FIG. 4C. [Figure 5A] FIG. 5A is a schematic perspective view of an electronic component according to still another embodiment of the present invention. [Figure 5B] FIG. 5B is a schematic perspective view showing a state after the shape of the electronic component shown in FIG. 5A has been changed. [Figure 5C] 5C is a schematic perspective view of a case included in the electronic component shown in FIG. 5A, as viewed obliquely from below. [Figure 5D] FIG. 5D is a conceptual diagram showing an assembly process of the electronic component shown in FIG. 5A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0025] First embodiment As shown in FIG. 1A, an electronic component 10 according to an embodiment of the present invention has a capacitor chip 20 and a shape memory plate 100.

[0026] As shown in Fig. 1A, the capacitor chip 20 has a substantially rectangular parallelepiped shape. As shown in Fig. 1C, the capacitor chip 20 has an element body 21 and first and second terminal electrodes 22, 24. Note that Fig. 1C (Fig. 1B), unlike Fig. 1A, shows a state in which the shape memory plate 100 is mounted on a circuit board 70 or the like and is deformed into a memorized shape.

[0027] As shown in FIG. 1C, the first and second terminal electrodes 22, 24 are formed on the first end face 21a and the second end face 21b of the element body 21, and the first end face 21a and the second end face 21b are located on opposite sides to each other along the X-axis direction.

[0028] The element body 21 has internal electrode layers 26 and dielectric layers 28 stacked along the Z-axis direction. The first and second terminal electrodes 22, 24 are each connected to one of the internal electrode layers 26 adjacent to each other in the stacking direction.

[0029] The material of the dielectric layers 28 in the capacitor chip 20 is not particularly limited, and may be, for example, a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. The thickness of each dielectric layer 28 is not particularly limited, but is generally from 1 μm to several hundred μm.

[0030] The conductive material contained in the internal electrode layer 26 is not particularly limited, but if the constituent material of the dielectric layer 28 is resistant to reduction, a relatively inexpensive base metal can be used. As the base metal, Ni or a Ni alloy is preferable. As the Ni alloy, an alloy of Ni and one or more elements selected from Mn, Cr, Co, and Al is preferable, and the Ni content in the alloy is preferably 95% by weight or more. The internal electrode layer 26 may be formed using a commercially available electrode paste. The thickness of the internal electrode layer 26 may be appropriately determined depending on the application, etc.

[0031] The material of the first and second terminal electrodes 22, 24 is not particularly limited, and copper, copper alloy, nickel, nickel alloy, etc. are usually used, but silver and alloys of silver and palladium can also be used. The thickness of the terminal electrodes 22, 24 is also not particularly limited. At least one metal coating selected from Ni, Cu, Sn, etc. may be formed on the surface of the first and second terminal electrodes 22, 24. For example, the terminal electrodes may be made of a Cu baked layer, a Ni plating layer, and a Sn plating layer.

[0032] The shape and size of the capacitor chip 20 may be appropriately determined depending on the purpose and application. In the drawings, the X-axis, Y-axis, and Z-axis are perpendicular to each other.

[0033] 1A, the shape memory plate 100 has a joint 104 and a shape-changing portion 102 that is continuous with the joint 104. The lower side of the joint 104 in the Z-axis direction extends to the vicinity of the second side surface 21d of the chip component 20, and has a shape parallel to the Y-axis. The joint 104 covers most of the main surface 22a (first surface) in the X-axis direction of the first terminal electrode 22.

[0034] Joint portion 104 of shape memory plate 100 is joined to main surface 22a (first surface) of first terminal electrode 22 so as to be electrically conductive.

[0035] The bonding portion 104 and the main surface 22a can be bonded to each other using, for example, an adhesive or a conductive adhesive, but is not limited thereto. The bonding means between the bonding portion 104 and the main surface 22a is preferably such that the bonding portion 104 and the main surface 22a do not peel off at a predetermined temperature when the electronic component 10 is reflowed. For example, by using high-temperature solder, the bonding portion 104 and the main surface 22a can be bonded to each other so as not to peel off at a temperature equal to or lower than the predetermined temperature when the electronic component 10 is reflowed.

[0036] The shape-changing portion 102 has a trapezoidal flat plate portion, and covers a portion (approximately half) of the first side surface 21c (second surface) of the element main body 21 before the shape is changed.

[0037] The shape memory plate 100 has a property of changing to a memorized shape at a predetermined temperature or higher. The shape memorized in the shape memory plate 100 is a direction in which the shape-changing portion 102 moves away from the first side surface 21c and becomes perpendicular to the circuit board 70, as shown in Fig. 1C. The predetermined temperature at which the shape-changing portion 102 deforms is a temperature (e.g., 60°C) or higher that is higher than the maximum temperature (maximum environmental temperature) that occurs when handling the electronic component 10.

[0038] Therefore, in this embodiment, the specified temperature at which the shape-changing portion 102 deforms is set to a temperature higher than the maximum temperature that occurs when handling the electronic component 10 and lower than the temperature at which the bonded portion peels off from the second surface.

[0039] The shape memory plate 100 of this embodiment is an alloy plate containing a metal with excellent electrical conductivity. As an alloy plate containing a metal with excellent electrical conductivity, for example, a shape memory alloy of a copper alloy containing 60% by weight or more of copper is preferable. As a shape memory alloy of a copper alloy, for example, Cu-Zn, Cu-Al-Ni, Cu-Al-Ni-Mn-Ti, etc. are exemplified. In addition, as a shape memory alloy other than a copper alloy, Ni-Ti, etc. are exemplified.

[0040] As shown in Fig. 1A, the electronic component 10 further includes another shape memory plate 100a. The other shape memory plate 100a has the same configuration as the shape memory plate 100, but may have a different configuration. The material, size, and shape of the other shape memory plate 100a are preferably the same as the material, size, and shape of the shape memory plate 100, but may be different. For example, the shape of the shape memory plate 100 and the other shape memory plate 100a may be restored at different temperatures.

[0041] The joint 104a of the separate shape memory plate 100a is joined so as to be electrically conductive to the main surface 24a (third surface) of the second terminal electrode 24. The separate joint 104a and the main surface 24a can be joined in the same manner as the joint 104 and the main surface 22a.

[0042] The other shape-changing portion 102a has a trapezoidal flat plate portion, and covers a part (approximately half) of the first side surface 21c (second surface) of the element main body 21 before the shape is changed.

[0043] The end 106 of the shape memory plate 100 and the end 106a of the other shape memory plate 100a are arranged facing each other without overlapping. The shape changing portion 102 and the other shape changing portion 102a have outer surfaces parallel to the surface along the first side surface 21c, except for the gap between the ends 106 and 106a.

[0044] In this embodiment, the gap between the end 106 of the shape-changing portion 102 and the end 106a of the other shape-changing portion 102a is set to be a constant width and to be in a straight line on the XY plane, but is not limited to this. For example, the gap between the end 106 of the shape-changing portion 102 and the end 106a of the other shape-changing portion 102a may be of a variable width rather than a constant width, or the shapes of the ends 106, 106a may be changed to be comb-like so that the peaks and valleys of each interlock.

[0045] 1C, electronic component 10 can be used by being mounted on, for example, a circuit board 70. Circuit patterns 72, 72 are formed on circuit board 70. In this embodiment, joint portion 104 (separate joint portion 104a) is joined to main surface 22a (main surface 24a) so as to be electrically conductive. Even if a solder fillet is formed via joint portion 104 when electronic component 10 is mounted, circuit patterns 72, 72 can be electrically conductively connected to first terminal electrode 22 (second terminal electrode 24).

[0046] In this embodiment, as shown in FIG. 1A, in the electronic component 10, before being mounted on a circuit board or the like, the shape-changing portion 102 (another shape-changing portion 102a) of the shape memory plate 100 (another shape memory plate 100a) is bent along the first side surface 21c of the chip component 20, thereby enabling the electronic component 10 to be miniaturized.

[0047] Furthermore, the shape memory plate 100 (another shape memory plate 100a) does not get in the way when the electronic component 10 is transported by a pickup device or the like. The shape memory plate 100 (another shape memory plate 100a) may be transported while being detachably held by an adsorption part of a pickup device on the outer surface of the shape memory plate 100 (another shape memory plate 100a) or the outer surface of the joint 104 (another joint 104a).

[0048] That is, the electronic component 10 of this embodiment has excellent handleability. When mounting the electronic component 10 on a circuit board or the like, heat is transferred to the shape memory plate 100 (another shape memory plate 100a) due to heat treatment during reflow for mounting. As a result, as shown in FIG. 1C, the shape memory plate 100 (another shape memory plate 100a) deforms so as to recover to the memorized shape, and the shape changing portion 102 (another shape changing portion 102a) deforms in a direction away from the second surface of the electronic component 10.

[0049] 1B and 1C, the shape-changing portion 102 (another shape-changing portion 102a) has a large heat dissipation area exposed to the surrounding atmosphere, and becomes a portion with excellent heat dissipation properties, similar to a heat sink. Therefore, heat generated in the electronic component 10 itself and heat transferred to the electronic component 10 from a circuit board or the like is transferred from the joint 104 (another joint 104a) to the shape-changing portion 102 (another shape-changing portion 102a) and dissipated there. Therefore, after the electronic component 10 is mounted, the heat dissipation properties are improved. Forced cooling air or the like may be applied to the shape-changing portion 102 (another shape-changing portion 102a) after mounting.

[0050] In this embodiment, the shape of the shape memory plate 100 (another shape memory plate 100a) is memorized in a direction (upper side in the Z-axis direction in FIG. 1C) in which the shape changing portion 102 (another shape changing portion 102a) is substantially perpendicular to the mounting surface on which the electronic component 10 is mounted. With this configuration, when the shape memory plate 100 (another shape memory plate 100a) becomes a predetermined temperature or higher due to heat during solder reflow or the like, the shape memory plate 100 deforms and extends in the Z-axis upward direction as shown in FIG. 1B and FIG. 1C, thereby increasing the heat dissipation area and particularly improving the heat dissipation performance.

[0051] In this embodiment, a treatment layer (e.g., a plating layer containing tin) that improves wettability with a joining material (e.g., solder) when mounting the electronic component 10 is formed on the outer surface of the joint portion 104 (separate joint portion 104a). This is because solder fillets and the like are more likely to be formed on the outer surface of the joint portion 104 (separate joint portion 104a). The treatment layer may be made of the same material as the metal coating of the first and second terminal electrodes 22, 24.

[0052] As shown in FIG. 1A, in the electronic component 10 of this embodiment, in addition to the shape memory plate 100, another shape memory plate 100a is formed. By configuring in this way, it is possible to increase the number of shape-changing parts whose shape changes after mounting, and heat dissipation is particularly improved. In addition, by providing a plurality of shape-changing parts whose shape changes after mounting, it is possible to limit the height and width of the shape-changing parts after the change, and the size of the space occupied by the electronic component after mounting can be limited.

[0053] In this embodiment, as shown in Fig. 1A, the shape-changing portion 102 and the separate shape-changing portion 102a cover the first side surface 21c without overlapping, and while ensuring the miniaturization of the electronic component 10 before mounting, the shape change of the shape-changing portion after mounting can be reduced and the area from which heat is dissipated can be increased. Note that in this embodiment, the separate joint portion 104a of the separate shape memory plate 100a may be formed on another surface, such as the third side surface 21e, instead of the main surface 24a of the second terminal electrode 24.

[0054] In this embodiment, the shape memory plate 100 and the other shape memory plate 100a whose shape has been memorized can be formed by bending them toward the first side surface 21c after attaching them to the first and second terminal electrodes 22 and 24. Also, the shape memory plate 100 and the other shape memory plate 100a whose shape has been memorized can be attached to the first and second terminal electrodes 22 and 24 in a folded state.

[0055] Second embodiment As shown in Figures 2A and 2B, electronic component 10a of this embodiment has the same configuration as electronic component 10 of the first embodiment, except for the structures of shape-changing portion 112 and other shape-changing portion 112a, and has the same effects. In the following explanation, explanation of overlapping parts will be omitted as much as possible, and different parts will be mainly explained. In addition, common parts in the drawings are given the same reference numerals.

[0056] As shown in Fig. 2B, in this embodiment, the shape-changing portion 112 has a rectangular flat plate portion. Similarly, the other shape-changing portion 112a also has a rectangular flat plate portion. Note that Fig. 2B shows a state in which the shape memory plate 110 is deformed into a memorized shape when mounted on a circuit board, unlike Fig. 2A.

[0057] As shown in Fig. 2A, before the shape-changing portion 112 is deformed, it covers most of the first side surface 21c (second surface) of the element main body 21. Furthermore, the other shape-changing portion 112a is combined with the shape-changing portion 112 and overlaps with it to cover the first side surface 21c. By overlapping in this manner, it is possible to increase the shape change of the shape-changing portion 112 and the other shape-changing portion 112a, as shown in Fig. 2B after mounting.

[0058] Third embodiment As shown in Figures 3A and 3B, electronic component 10b of this embodiment has the same configuration and similar effects as the electronic components of the first and second embodiments, except for the structure of shape-changing portion 132. In the following description, explanations of overlapping parts will be omitted as much as possible, and differences will be focused on. Also, common parts in the drawings are given the same reference numerals.

[0059] In this embodiment, as shown in Fig. 3B, the end 126 of the shape-changing portion 122 is formed in a comb-like shape. Similarly, the end 126a of the other shape-changing portion 122a is also formed in a comb-like shape. Note that Fig. 3B shows a state in which the shape memory plate 120 is deformed into a memorized shape after being mounted on a circuit board, unlike Fig. 3A.

[0060] As shown in FIG. 3B after mounting, end portions 126, 126a of shape-changing portion 122 and another shape-changing portion 122a are comb-shaped, so that the surface area is increased and heat dissipation is further improved.

[0061] The shape-changing portion 122 and the separate shape-changing portion 122a may be configured so as not to overlap each other, but so that the comb teeth of the ends 126, 126a mesh with each other.

[0062] Fourth embodiment As shown in Fig. 4A, the electronic component 10c of this embodiment has the same configuration as the electronic components of the first to third embodiments, except that it has two capacitor chips 20a and 20b, a pair of individual metal terminals 30 and 40, a common metal terminal 50, an enclosed insulating case 60, and a shape memory plate 130, and has the same effects. In the following description, explanations of overlapping parts will be omitted as much as possible, and differences will be described in detail. In addition, common parts in the drawings are given the same reference numerals.

[0063] As shown in Fig. 4A, the capacitor chips 20a and 20b are each substantially rectangular parallelepiped in shape and have substantially the same shape and size. The thicknesses of the capacitor chips 20a and 20b (dimension along the Y axis shown in Fig. 4A) are thinner than that of the capacitor chip 20. Note that Fig. 4B, unlike Fig. 4A, shows a state in which the shape memory plate 130 is deformed into a memorized shape after being mounted on a circuit board or the like.

[0064] The element body of the capacitor chips 20a and 20b has first and second terminal electrodes 22, 24 formed on first and second end faces opposing each other in the X-axis direction (longitudinal direction), respectively, and connected to any of the internal electrode layers adjacent to each other in the stacking direction.

[0065] 4C, in this embodiment, the enclosed insulating case 60 is formed of a rectangular parallelepiped housing, and has an outer wall 61 and a bottom wall 63 that surround a plurality of accommodating recesses 62a, 62b that open upward in the Z-axis direction. The accommodating recesses 62a, 62b adjacent to each other in the Y-axis direction are mostly separated by a partition wall 64, but communicate with each other by communication grooves 65, 65 provided in the partition wall 64.

[0066] As shown in Fig. 4D, the communication grooves 65 are formed along the inner wall surfaces on both sides in the X-axis direction of each of the accommodating recesses 62a, 62b. As shown in Fig. 4C, the inner electrode portion 52 of the common metal terminal 50 is attached to the inside of the accommodating recesses 62a, 62b through one of the communication grooves 65 along the inner wall surfaces so as to straddle the accommodating recesses 62a, 62b.

[0067] 4D, in this embodiment, the width of the communication groove 65 in the X-axis direction is such that the inner electrode portion 52 of the common metal terminal 50 can be inserted and fixed therein. Also, the depth of the communication groove 65 in the Z-axis direction is formed to be shallower than the depth of each of the accommodating recesses 62a, 62b in the Z-axis direction.

[0068] As shown in Fig. 4D, the common metal terminal 50 has a pair of inner electrode portions 52. These are separated by a slit 53 extending in the Z-axis direction and connected by a connecting piece 525 and an opening edge electrode portion 54. A side electrode portion 56 is formed continuously with the opening edge electrode portion 54 so as to follow the second outer side surface 61b of the surrounding type insulating case 60. Each inner electrode portion 52 is inserted into the inner wall surface of the accommodation grooves 62a, 62b, and the connecting piece 525 engages with the connecting groove 65. The inner electrode portion 52 is in contact with and electrically connected to the second terminal electrodes 24, 24 of both capacitor chips 20a, 20b.

[0069] 4D, in this embodiment, the opening surface of each of the accommodating recesses 62a, 62b of the enclosed insulating case 60 is only the upper surface in the Z-axis direction, and no holes, notches, grooves, or openings communicating with the outside of the case 60 are formed in the outer wall 61 and bottom wall 63 of each of the accommodating recesses 62a, 62b. Along the opening surfaces of each of the accommodating recesses 62a, 62b of the enclosed insulating case 60, the case 60 is provided with an opening edge surface 66 on the upper surface in the Z-axis direction of the outer wall 61. In this embodiment, the opening edge surface 66 is flush with the upper surface in the Z-axis direction of the partition wall 64, but may be different.

[0070] 4D, the first individual metal terminal 30 has an inner electrode portion 32 that is inserted along the other inner wall in the X-axis direction of one of the accommodating recesses 62a of the surrounding insulating case 60. The inner electrode portion 32 contacts and is electrically connected to the first terminal electrode 22 of one of the capacitor chips 20a in the Y-axis direction. An opening edge electrode portion 34 is formed along an opening edge surface 66 continuous with the inner electrode portion 32.

[0071] In addition, the side electrode portion 36 is formed integrally with the opening edge electrode portion 34, continuing from the opening edge electrode portion 34 along the first outer surface 61a of the outer wall 61 of the surrounding insulating case 60. In this embodiment, the side electrode portion 36 is formed so as to extend in the Z-axis direction along the first outer surface 61a of the outer wall 61. As shown in FIG. 4A, the side electrode portion 36 does not need to be in contact with the first outer wall surface 61a of the outer wall 61, and may be disposed parallel to the first outer wall surface 61a of the outer wall 61 with a predetermined gap therebetween. In addition, it is preferable that the opening edge electrode portion 34 be in contact with the opening edge surface 66 of the outer wall, but there may be a small gap therebetween.

[0072] 4D, the second individual metal terminal 40 has an inner electrode portion 42 that is inserted along the other inner wall in the X-axis direction of the other accommodating recess 62b of the surrounding insulating case 60. The inner electrode portion 42 contacts and is electrically connected to the first terminal electrode 22 of the other capacitor chip 20b in the Y-axis direction. An opening edge electrode portion 44 is formed along an opening edge surface 66 continuous with the inner electrode portion 42.

[0073] Furthermore, a side electrode portion 46 is formed integrally with the opening edge electrode portion 44, continuing from the opening edge electrode portion 44, along the first outer surface 61a of the outer wall 61 of the surrounding type insulating case 60. In this embodiment, the side electrode portion 46 is formed so as to extend in the Z-axis direction along the first outer surface 61a of the outer wall 61.

[0074] 4A, like the side electrode portion 36, the side electrode portion 46 does not need to be in contact with the first outer wall surface 61a of the outer wall 61, and may be disposed parallel to the first outer wall surface 61a of the outer wall 61 with a predetermined gap therebetween. Also, the opening edge electrode portion 44 is preferably in contact with the opening edge surface 66 of the outer wall, but may have a small gap therebetween. The first individual metal terminal 30 and the second individual metal terminal 40 are attached to the surrounding insulating case 60 at a predetermined interval (corresponding to the thickness of the partition wall 64 in the Y-axis direction) and are insulated from each other.

[0075] As shown in FIG. 4D, in this embodiment, the length in the X-axis direction of each accommodating recess 62a, 62b is determined so that when the terminals 30, 40, 50 are attached to the enclosed insulating case 60, the terminal electrodes 22, 24 of each capacitor chip 20a, 20b are pressed against the inner electrode portions 32, 42, 52.

[0076] In this embodiment, the inner electrode portions 32, 42 are provided with curved portions 320 (420) that are pressed by spring force toward the capacitor chips 20a, 20b. With this configuration, the inner electrode portion 32 (42) and the first terminal electrode 22 are connected in a pressure-welded state, and the inner electrode portion 52 of the common metal terminal 50 and the second terminal electrode 24 are connected in a pressure-welded state. This eliminates the need to connect them with a connecting member such as solder or conductive adhesive.

[0077] The width of each of the accommodating recesses 62a, 62b in the Y-axis direction is determined so that the capacitor chips 20a, 20b can fit inside each of the accommodating recesses 62a, 62b. The depth of each of the accommodating recesses 62a, 62b in the Z-axis direction is determined so that when the capacitor chips 20a, 20b are accommodated inside each of the accommodating recesses 62a, 62b, the upper ends of the chips 20a, 20b in the Z-axis direction do not protrude from the opening edge surface 66 to the upper part in the Z-axis direction. However, the upper ends of the chips 20a, 20b in the Z-axis direction may protrude slightly from the opening edge surface 66 to the upper part in the Z-axis direction. The enclosed insulating case 60 is made of an insulator such as ceramic, glass, or synthetic resin, and the insulator may be made of a flame-retardant material.

[0078] In this embodiment, the capacitor chips 20a and 20b can be easily accommodated in the accommodating recesses 62a and 62b. By accommodating the capacitor chips 20a and 20b in the accommodating recesses 62a and 62b in this manner, the capacitor chips 20a and 20b can be effectively protected from impacts and the like.

[0079] In this embodiment, the accommodating recesses 62a, 62b can also be used as spaces for filling the resin. In this embodiment, even if the enclosed insulating case 60 does not have through holes or the like and the insides of the accommodating recesses 62a, 62b of the case 60 accommodating the capacitor chips 20a, 20b are filled with molten resin, the resin can be effectively prevented from spilling out of the through holes or the like.

[0080] In this embodiment, the common metal terminal 50 connects the second terminal electrodes 24, 24 of the different capacitor chips 20a, 20b to each other at a position facing the metal terminals 30, 40. The first individual metal terminal 30 and the second individual metal terminal 40 are connected to the first individual metal terminals 22, 22 of the different capacitor chips 20a, 20b, respectively. As a result, the capacitor chips 20a, 20b are connected in series between the first individual metal terminal 30 and the second individual metal terminal 40.

[0081] The first individual metal terminal 30 and the second individual metal terminal 40 have the same configuration, and are each formed by bending a single conductive plate piece (for example, a metal plate) into a substantially C-shape. The thickness of the metal plate is not particularly limited. The thickness of the metal plate constituting the common metal terminal 50 is also approximately the same as that of the first individual metal terminal 30 and the second individual metal terminal 40.

[0082] 4A, a shape memory plate 130 is attached to the enclosed insulating case 60. The shape memory plate 130 has a joint 134 that covers the bottom wall 63 (first surface) of the enclosed insulating case 60, and four shape change portions 132 that are continuous with the joint 134.

[0083] The bonding portion 134 and the bottom wall 63 can be bonded to each other using an adhesive or the like, but the bonding method is not limited thereto. It is preferable that the bonding means for bonding the bonding portion 134 and the bottom wall 63 is such that the bonding portion 134 and the bottom wall 63 do not peel off at or below a predetermined temperature when the electronic component 10 is reflowed.

[0084] 4A, the four shape-changing portions 132 each extend in a direction along and partially cover the outer sides 61a-61d (second surface) of the outer wall 61 of the enclosed insulating case 60. In this embodiment, there is a predetermined gap between the shape-changing portion 132 and the outer wall, but the shape-changing portion 132 may be in contact with the outer wall.

[0085] In this embodiment, the shape that the shape memory plate 130 memorizes is a direction in which the shape-changing portion 132 is substantially parallel to the mounting surface on which the electronic component 10c is mounted (a direction along the XY plane in FIG. 4A).

[0086] As shown in Fig. 4A, in this embodiment, in the electronic component 10c, before mounting on a circuit board or the like, the shape-changing portion 132 of the shape-memory plate 130 is bent along the outer surfaces 61a to 61d of the outer wall of the surrounding insulating case 60, so that the electronic component 10c can be made compact. In addition, these shape-memory plates 130 do not get in the way when the electronic component 10c is transported by a pickup device or the like. The outer surface of the joint portion 130 is flat, and the electronic component 10c may be transported by being detachably held to the outer surface of the joint portion 134 by an adsorption portion of a pickup device.

[0087] That is, the electronic component 10c of this embodiment has excellent handleability. When the electronic component 10c is mounted on a circuit board or the like, heat is transferred to the shape memory plate 130 due to a heat treatment during reflow for mounting, and the shape memory plate 130 deforms to recover to the memorized shape, and the shape changing portion 132 deforms in a direction away from the second surface of the electronic component 10c.

[0088] 4B, after the shape is changed, the heat dissipation area of ​​shape-changing portion 132 exposed to the surrounding atmosphere becomes large, and the shape-changing portion 132 becomes a portion with excellent heat dissipation properties, similar to a heat sink. Therefore, heat generated in electronic component 10c itself and heat transferred to electronic component 10c from a circuit board or the like is transferred from joint 134 to shape-changing portion 132, where it is dissipated. Therefore, after electronic component 10c is mounted, heat dissipation properties are improved. Forced cooling air or the like may be applied to shape-changing portion 132 after mounting.

[0089] Fifth embodiment As shown in FIG. 5A, the electronic component 10d of this embodiment has five capacitor chips (chip components) 20c, 20d, 20e, 20f, and 20g, an open insulating case 90 to which the capacitor chips 20c, 20d, 20e, 20f, and 20g are fixed, and a shape memory plate 140. Other than that, it has the same configuration as the electronic components of the first to fourth embodiments and has the same effects. In the following description, the description of overlapping parts will be omitted as much as possible, and the description will focus on the different parts. Also, common members in the drawings are given the same reference numerals.

[0090] In the description of electronic component 10d, as shown in FIG. 5A, the arrangement direction (first direction) of multiple capacitor chips 20c-20g is the Y-axis direction, the direction from open insulating case 90 arranged on the upper part of electronic component 10d toward the downward mounting surface is the Z-axis direction, and the direction perpendicular to the Y-axis direction and the Z-axis direction is the X-axis direction. Note that the X-axis, Y-axis, and Z-axis are perpendicular to each other, and in the description of electronic component 10d, these X-axis direction and Y-axis direction may be referred to as the horizontal direction. Note that FIG. 5B, unlike FIG. 5A, shows a state in which electronic component 10d is mounted on a circuit board or the like and shape memory plate 140 is deformed into a memorized shape.

[0091] 5A, the plurality of capacitor chips in electronic component 10d is composed of five capacitor chips 20c to 20g, which are arranged along the Y-axis direction.

[0092] Here, the number of the capacitor chips 20c-20g is not limited to five as shown in FIG. 5A, and the electronic component 10d may include any number of capacitor chips 20c-20g, which may be two or more. The capacitor chips 20c-20g have substantially the same shape, size, and structure. However, the capacitor chips 20c-20g are not limited to being the same as those shown in FIG. 5A, and may include those having different shapes and sizes. In this embodiment, the capacitor chips 20c-20g have the same configuration as the capacitor chip 20 of the first embodiment, but may have a different configuration.

[0093] 5D, capacitor chip 20c has a substantially rectangular parallelepiped outer shape, with second side surface 21b of element body 21 facing the direction opening along the Z-axis direction of open-type insulating case 90, and a first side surface opposite to second side surface 21b facing plate-like portion underside 94 of open-type insulating case 90. Capacitor chip 20c included in electronic component 10d is a chip capacitor, but capacitor chips 20c to 20g are not limited to chip capacitors and may be capacitor chips other than chip capacitors, such as chip inductors or chip varistors.

[0094] 5C, the open-type insulating case 90 has a plate-shaped portion 92, a first protruding portion 97, and a second protruding portion 98. The plate-shaped portion 92 has a generally rectangular flat plate-like outer shape, and is disposed so as to face first side surfaces of the multiple capacitor chips.

[0095] 5C, the plate-shaped portion 92 has a generally rectangular outer shape when viewed from the Z-axis direction. First side surfaces of the multiple capacitor chips are fixed to a lower surface 94 of the plate-shaped portion 92 via a hardened adhesive.

[0096] As shown in Fig. 5C, the first protrusion 97 is formed along a plate-shaped portion first side 94a of the plate-shaped portion 92 that is parallel to the Y-axis direction. The first protrusion 97 protrudes from the plate-shaped portion 92 in the Z-axis direction perpendicular to the Y-axis direction. The first protrusion 97 has a rectangular prism-like outer shape extending in the Y-axis direction, but the shape of the first protrusion 97 is not limited thereto. Also, unlike the first protrusion 97 that is continuous in the Y-axis direction as shown in Fig. 5C, the first protrusion 97 may be configured with protrusions that are intermittently formed along the Y-axis direction.

[0097] 5C, the second protrusion 98 is formed in the X-axis direction relative to the first protrusion 97, and protrudes in the Z-axis direction from the plate-shaped portion 92. The second protrusion 98 is formed along a plate-shaped portion second side 94b of the plate-shaped portion 92 that is perpendicular to the plate-shaped portion first side 94a.

[0098] The second protrusion 98 has a rectangular prism-like outer shape extending in the X-axis direction, but the shape of the second protrusion 98 is not limited to this. Also, unlike the second protrusion 98 that is continuous in the X-axis direction as shown in Fig. 5C, the second protrusion 98 may be an isolated protrusion that is formed away from the first protrusion 97 in the X-axis direction.

[0099] As shown in FIG. 5C, the first protrusion 97 and the second protrusion 98 are connected approximately perpendicularly at the corner where the plate-shaped portion first side 94a and the plate-shaped portion second side 94b of the plate-shaped portion 92 are connected, forming an L-shaped protrusion.

[0100] As shown in FIG. 5C, a first protrusion 97 is formed on a first plate-shaped side 94a of the plate-shaped portion underside 94, and a second protrusion 98 is formed on a second plate-shaped side 94b of the plate-shaped portion underside 94, whereas the other two sides of the plate-shaped portion underside 94 have no protrusions or projections.

[0101] 5C, non-projection edge portions 94ca, 94da on which no projections are formed are formed on a plate-shaped portion third side 94c parallel to a plate-shaped portion first side 94a and a plate-shaped portion fourth side 94d parallel to a plate-shaped portion second side of the plate-shaped portion 92. Therefore, the plate-shaped portion third side 94c and the plate-shaped portion fourth side 94d form the outer edges of the open-type insulating case 90.

[0102] As shown in Fig. 5D, in the capacitor chip 20c, the main surface 22a of the first terminal electrode 22 facing the X-axis direction is in contact with the first protrusion 97, and the third side surface 21e facing the Y-axis direction is in contact with the second protrusion 98. Similarly to the capacitor chip 20c, the capacitor chips 20d, 20e, 20f, and 20g shown in Fig. 5A have the main surface 22a of the first terminal electrode 22 facing the X-axis direction in contact with the first protrusion 97 as shown in Fig. 5D. Unlike the capacitor chip 20c, the capacitor chips 20d, 20e, 20f, and 20g shown in Fig. 5A have the third side surface facing the Y-axis direction not in contact with the second protrusion 98 but in contact with the other capacitor chips 20c, 20d, 20e, and 20f adjacent in the Y-axis direction.

[0103] That is, all of the capacitor chips 20c to 20g are in contact with the first protrusion 97 shown in Fig. 5D, whereas only one capacitor chip 20c located at one end in the Y-axis direction among the capacitor chips 20c to 20g shown in Fig. 5A is in contact with the second protrusion 98. The capacitor chips 20c to 20g of the electronic component 10d are aligned with the open-type insulating case 90 by the first protrusion 97, the plate-shaped portion underside 94, the second protrusion 98, and the other adjacent capacitor chips 20c, 20d, 20e, and 20f.

[0104] As shown in FIG. 5C, the downward protrusion length h1 of the first protrusion 97 from the plate-shaped portion 92 and the protrusion length h2 of the second protrusion 98 from the plate-shaped portion 92 in the Z-axis direction are shorter than the protrusion length h3 in the Z-axis direction from the plate-shaped portion 92 of the capacitor chips 20c, 20d, 20e, 20f, and 20g shown in FIG. 5A.

[0105] As a result, the capacitor chips 20c to 20g are not hindered by the first protruding portion 97 and the second protruding portion 98, and are surface-mounted on a circuit board or the like with the second side surface 21d of the capacitor chips 20c to 20g serving as a mounting surface.

[0106] 5C can be produced by, for example, resin molding or machining of a plate material. The material of the open-type insulating case 90 is not particularly limited as long as it is an insulating material, but from the viewpoint of stress relaxation, the open-type insulating case 90 is preferably made of resin.

[0107] 5A, second side surface 21d is disposed along an imaginary plane parallel to plate-shaped portion 92. Therefore, the imaginary plane on which second side surface 21d is disposed becomes the mounting surface of electronic component 10d, and electronic component 10d is mounted on a circuit board or the like on which a circuit pattern is formed.

[0108] The protruding length h2 of the second protruding portion 98 in the open insulating case 90 shown in FIG. 5A from the plate-shaped portion 92 in the Z-axis direction is not particularly limited as long as it is shorter than the protruding length h3 of the plurality of capacitor chips from the plate-shaped portion 92 in the Z-axis direction, but is preferably 1 / 2 or less of the protruding length h3 of the plurality of capacitor chips. By setting the protruding length h2 of the second protruding portion 98 to 1 / 2 or less of the protruding length h3 of the plurality of capacitor chips, a sufficient gap is formed between the second protruding portion 98 and the circuit board, and the problem of the open insulating case 90 hindering the formation of solder fillets on the terminal electrodes can be suitably prevented. In addition, the protruding length h1 of the first protruding portion 97 is also preferably set to 1 / 2 or less of the protruding length h3 of the plurality of capacitor chips, similar to the second protruding portion 98.

[0109] As shown in FIG. 5A, at least two capacitor chips 20c-20g (any two adjacent capacitor chips in the embodiment) are in contact with each other at their terminal electrodes 22, 24. As a result, the multiple capacitor chips included in electronic component 10d are connected in parallel with each other. In such electronic component 10d, even if only some of capacitor chips 20c-20g are directly connected to the circuit board, all of capacitor chips 20c-20g included in electronic component 10d are electrically connected to the circuit board and function properly as capacitors. In addition, in such electronic component 10d, all of capacitor chips 20c-20g do not need to be directly connected to the board by solder or the like, and problems such as mounting defects can be prevented.

[0110] As shown in Fig. 5A, the main surface 24a of each of the second terminal electrodes 24 of the multiple capacitor chips 20c to 20g partially protrudes from the plate-shaped portion 92 via a plate-shaped portion third side 94c of the plate-shaped portion 92. That is, the length from the plate-shaped portion first side 94a to the plate-shaped portion third side 94c shown in Fig. 5D is shorter than the length from the main surface of the first terminal electrode 22 to the main surface 24a of the second terminal electrode 24. In this way, by making the length of the plate-shaped portion 92 in the X-axis direction shorter than the length of the capacitor chips 20c to 20g in the X-axis direction, the plate-shaped portion 92 can be made smaller, thereby enabling miniaturization and a narrower mounting area.

[0111] 5A has a shape-changing portion 142 and a joint portion 144. The shape memory plate 140 is an alloy plate containing a metal of the same material as the shape memory plate 100 of the first embodiment.

[0112] In this embodiment, as shown in Fig. 5A, the bonding portion 144 is bonded so as to cover most of a first plane (first surface) formed by the main surfaces 24a of the second terminal electrodes 24 of each of the capacitor chips 20c to 20g. The lower side of the bonding portion 104 in the Z-axis direction extends to the vicinity of the second side surface 21b of each of the capacitor chips 20c to 20g, and has a shape that is approximately parallel to the X-axis direction. The bonding portion 144 can be bonded to the main surfaces 24a of the second terminal electrodes 24 of each of the capacitor chips 20c to 20g in the same direction as in the first embodiment.

[0113] 5A, end 146 of shape-changing portion 142 has a rectangular parallelepiped flat plate portion. Shape-changing portion 142 covers most of plate-like portion upper surface 96 (second surface) of open-type insulating case 90 before deformation.

[0114] In this embodiment, the shape that shape memory plate 140 memorizes is a direction in which shape-changing portion 142 is substantially perpendicular to the mounting surface on which electronic component 10d is mounted (upper side in the Z-axis direction in FIG. 5A).

[0115] In this embodiment, as shown in Fig. 5A, in the electronic component 10d, before being mounted on a circuit board or the like, the shape-changing portion 142 is bent along the plate-shaped portion upper surface 96 of the open-type insulating case 90, so that the electronic component 10d can be made compact. In addition, these shape-memory plates 140 do not get in the way when the electronic component 10d is transported by a pickup device or the like. The outer surface of the shape-changing portion 142 is flat, and the electronic component 10d may be transported by being detachably held to the outer surface of the shape-changing portion 142 by an adsorption portion of a pickup device.

[0116] That is, the electronic component 10d of this embodiment has excellent handleability. When the electronic component 10d is mounted on a circuit board or the like, heat is transferred to the shape memory plate 140 due to a heat treatment during reflow for mounting, and the shape memory plate 140 deforms so as to recover to the memorized shape, and the shape changing portion 142 deforms in a direction away from the second surface of the electronic component 10d.

[0117] 5B, the heat dissipation area of ​​shape-changing portion 142 exposed to the surrounding atmosphere is increased, and shape-changing portion 142 becomes a portion with excellent heat dissipation properties, similar to a heat sink. Therefore, heat generated in electronic component 10d itself and heat transferred to electronic component 10d from a circuit board or the like is transferred from joint 144 to shape-changing portion 142, where it is dissipated. Therefore, after electronic component 10d is mounted, heat dissipation properties are improved. Forced cooling air or the like may be applied to shape-changing portion 142 after mounting.

[0118] 5A, in this embodiment, the plurality of capacitor chips 20c to 20g are arranged in contact with the plate-shaped portion 92 and the first protruding portion 97, so that the plurality of capacitor chips 20c to 20g can be easily aligned with respect to the open-type insulating case 90 in the up-down direction and the X-axis direction. Furthermore, alignment in the Y-axis direction can be achieved by contacting the second protruding portion 98 or by contacting adjacent capacitor chips 20d, 20e, 20f, and 20g. Therefore, such electronic component 10d can be easily and efficiently aligned with the plurality of capacitor chips 20c to 20g in the open-type insulating case 90 and assembled.

[0119] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0120] For example, in each of the above embodiments, a capacitor chip is given as an example of a capacitor chip, but a capacitor chip other than a capacitor chip may be used.

[0121] Also, three or more shape memory plates can be attached to any side surface of the capacitor chip or the insulating case.

[0122] The shape memory plate may be deformed by heating it separately from the heat used during reflow. [Explanation of symbols]

[0123] 10, 10a to 10d: Electronic components 20, 20a~20g... Capacitor chip 21...Main body 21a...first end surface 21b…Second end surface 21c…1st side 21d…Second side 21e…Third side 21f…4th side 22,24…terminal electrode 22a, 24a…main surface 26...Internal electrode layer 28...Dielectric layer 30…First individual metal terminal (individual conductive terminal) 32...Inner electrode part 320…Bend 34...Opening edge electrode part 36…Side electrode part 40…Second individual metal terminal (individual conductive terminal) 42...Inner electrode part 420…Bend 44...Opening edge electrode part 46…Side electrode part 50…Common metal terminal (common conductive terminal) 52...Inner electrode part 525…Contact piece 53...Slit 54...Opening edge electrode part 56…Side electrode part 60...Enclosed insulating case 61…Exterior wall 61a...first outer surface 61b…Second outer surface 61c…Third outer surface 61d...4th outer surface 62a, 62b...accommodating recess 63…Bottom wall 64…Partition wall 65...Connecting ditch 66…Opening edge surface 67…Engagement convex portion 70...Circuit board 72...Circuit pattern 80...Joint material (solder) 90...Open insulation case 92…Plate-shaped part 94…Plate-like lower surface 94a...first side of plate-shaped portion 94b...Second side of plate-shaped portion 94c…Third side of plate-shaped portion 94ca, 94da...Non-protruding edges 94d…Fourth side of plate-shaped portion 96…Top surface of plate-shaped part 100,110,120,130,140…shape memory board 102, 112, 122, 132, 142…Shape transformation section 104,114,124,134,144...Joint part 106, 116, 126, 136, 146...End 100a, 110a, 120a, ... other shape memory plates 102a, 112a, 122a...different shape deformation parts 104a, 114a, 124a…separate joints 106a, 116a, 126a...end

Claims

1. An electronic component having at least one chip component, the electronic component has a first surface and a second surface intersecting the first surface; A joint portion of a shape memory plate is joined to the first surface, A shape-changing portion of the shape memory plate that is continuous with the joint portion covers at least a portion of the second surface, The electronic component has a shape that the shape-changing portion changes into in a direction away from the second surface when the shape-changing portion reaches a predetermined temperature or higher, the shape-memory plate storing the shape.

2. 2. The electronic component according to claim 1, wherein the joining portion of the shape memory plate is joined to the first surface by an adhesive or a conductive adhesive, or by a joining means that does not peel off at temperatures below the specified temperature.

3. 3. The electronic component according to claim 1, wherein a treatment layer is formed on an outer surface of the joint of the shape memory plate, the treatment layer improving wettability with a joint material when the electronic component is mounted.

4. 4. The electronic component according to claim 1, wherein the shape memory plate is an alloy plate containing a metal having excellent electrical conductivity.

5. 5. The electronic component according to claim 1, wherein the shape memorized by the shape memory plate is a shape in which the shape-changing portion is oriented substantially perpendicular to a mounting surface on which the electronic component is mounted at a temperature equal to or higher than the predetermined temperature.

6. the electronic component further has a third surface intersecting the first surface or the second surface; A separate joining portion of a separate shape memory plate is joined to the third surface, A different shape change portion that is continuous with the different joint portion of the different shape memory plate covers at least a part of the second surface, 6. The electronic component according to claim 1, wherein the different shape changing portion has a shape stored in the different shape memory plate in a direction away from the second surface at the predetermined temperature or higher.

7. 7. The electronic component according to claim 6, wherein the separate shape-changing portion and the shape-changing portion are combined to cover the second surface without overlapping or overlapping each other.

8. The chip component has an element body and a terminal electrode formed on an end surface of the element body, the first surface is a main surface of a terminal electrode of the chip component, 8. The electronic component according to claim 1, wherein the second surface is a side surface of the element body.

9. An electronic component further comprising a case having an accommodating recess for accommodating the chip component, 9. The electronic component according to claim 1, wherein the first surface is at least one of a plurality of surfaces of the case, and the second surface is at least one of the remaining surfaces.

10. The chip component includes a plurality of chip components, the electronic component further includes an open-type case that holds the chip components such that outer surfaces of the terminal electrodes of the plurality of chip components are exposed and continuously arranged in a first direction, the first surface is a collective surface in which outer surfaces of the terminal electrodes of the plurality of chip components are exposed along a first direction and are continuously connected, 9. The electronic component according to claim 1, wherein the second surface is at least one surface of the open-type case.

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