Substrate transfer method and substrate transfer device

Abstract

To shorten a time required for transferring a substrate between a holding portion for holding the substrate of a substrate delivery device and an elevating member configured to be elevating.SOLUTION: A board delivery method includes the steps of moving a holding portion for holding a substrate of a substrate delivery device above an area in which an elevating member configured to be elevating and lowering is arranged, lowering the holding portion that holds the substrate while raising the elevating member, delivering the substrate from the holding portion to the elevating member, or lowering the elevating member that supports the substrate while raising the holding portion, and delivering the substrate from the elevating member to the holding portion.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to a substrate transfer method and a substrate transfer device. [Background technology]

[0002] Patent Document 1 discloses a method for transferring a wafer between a wafer transport mechanism, tweezers, and the mounting table when the wafer is placed on the mounting table for processing. In this method, three lift pins protrude from the top surface of the mounting table, and the tweezers reach directly above the mounting table, ready to transfer the wafer. The tweezers then descend to place the wafer on the lift pins, after which the tweezers retreat from the mounting table. The lift pins then retreat into the mounting table, and the wafer is placed on the mounting table. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-64132 A Summary of the Invention [Problem to be solved by the invention]

[0004] The technique according to the present disclosure reduces the time required for transferring a substrate between a holder that holds a substrate in a substrate transport device and a lifting member that is configured to be freely raised and lowered. [Means for solving the problem]

[0005] One aspect of the present disclosure is a method for transferring a substrate, comprising the steps of: A transfer arm of the substrate transfer device is extended, the transfer arm having a holder at its tip for holding the substrate. Above the area where the lifting member that can be raised and lowered is arranged The above Holder Horizontally A step of moving the Lowering of the extended transport arm The holding unit holding the substrate is lowered and the lifting member is raised at the same time, and the substrate is transferred from the holding unit to the lifting member, or the lifting member supporting the substrate is lowered and Lifting of the extended transfer armand simultaneously raising the holding part and transferring the substrate from the lifting member to the holding part. Effect of the Invention

[0006] According to the present disclosure, it is possible to reduce the time required for transferring a substrate between a holder that holds a substrate in a substrate transport device and a lifting member that is configured to be freely raised and lowered. [Brief description of the drawings]

[0007] [Figure 1] 1 is a plan view showing an outline of a configuration of a wafer processing system as a substrate transfer system according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view showing an outline of the configuration of a transfer arm. [Diagram 3] FIG. 2 is a diagram illustrating only a part of the configuration inside a vacuum processing chamber. [Figure 4] FIG. 2 is a diagram showing a schematic view of the interior of a vacuum processing chamber during wafer processing. [Diagram 5] FIG. 2 is a diagram showing a schematic view of the interior of a vacuum processing chamber during wafer processing. [Figure 6] FIG. 2 is a diagram showing a schematic view of the interior of a vacuum processing chamber during wafer processing. [Figure 7] FIG. 2 is a diagram showing a schematic view of the interior of a vacuum processing chamber during wafer processing. [Figure 8] FIG. 13 is a diagram for explaining a conventional wafer delivery method. [Figure 9] 11 is a diagram for explaining another example of a wafer processing system to which the transfer method according to the present embodiment is applied. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] For example, in a manufacturing process of a semiconductor device, a process such as a film formation process, an etching process, etc. is performed on a substrate such as a semiconductor wafer (hereinafter, referred to as a "wafer") in a reduced pressure atmosphere. The above-mentioned process is performed in a processing apparatus having a mounting table on which the substrate is placed.

[0009] The substrate is loaded into and unloaded from the processing apparatus using a substrate transport device equipped with a pick, which is a holding part for holding the substrate. The substrate is placed on the mounting table of the processing apparatus from the pick of the substrate transport device via lift pins that are configured to be freely raised and lowered and support the substrate. Conventionally, the substrate is placed via the lift pins, for example, as follows. That is, with the lift pins protruding from the upper surface of the mounting table, the pick of the substrate transport device holding the substrate is moved above the lift pins, and then the pick is lowered to transfer the substrate to the lift pins. The pick is then retracted and the lift pins are lowered to place the substrate on the mounting table.

[0010] However, the above-mentioned method has room for improvement in terms of the time required for transferring the substrate.

[0011] Therefore, the technique disclosed herein transfers the substrate between the pick of the substrate transport device and the lifting member at high speed.

[0012] Hereinafter, a substrate transfer method and a substrate transfer system according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0013] <Wafer processing system> Fig. 1 is a plan view showing an outline of the configuration of a wafer processing system as a substrate transfer system according to the present embodiment. Fig. 2 is a perspective view showing an outline of the configuration of a transfer arm. Fig. 3 is a view showing an outline of only a part of the configuration inside a vacuum processing chamber described later.

[0014] A wafer processing system 1 in FIG. 1 performs predetermined processes, such as film formation, diffusion, and etching, on a wafer W as a substrate under reduced pressure. This wafer processing system 1 has a configuration in which a carrier station 10, into which a carrier C capable of accommodating a plurality of wafers is transferred in and out, and a processing station 11 equipped with a plurality of various processing devices that perform predetermined processing on the wafers W under reduced pressure are integrally connected. The carrier station 10 and the processing station 11 are connected via two load lock devices 12 and 13.

[0015] The load lock devices 12 and 13 have load lock chambers 12a and 13a that are configured so that the interior of the chambers can be switched between an atmospheric pressure state and a vacuum state. A support member (not shown) for supporting the wafer W is provided in each of the load lock chambers 12a and 13a. The load lock devices 12 and 13 are provided to connect an atmospheric pressure transfer device 21 and a vacuum transfer device 30, which will be described later.

[0016] The carrier station 10 has a carrier mounting table 20 and an atmospheric pressure transfer device 21 provided adjacent to the carrier mounting table 20 .

[0017] The carrier placement table 20 is configured so that a plurality of carriers C, for example, three carriers C, can be placed side by side. The atmospheric pressure transfer device 21 has an atmospheric transfer chamber 22 whose interior is kept under atmospheric pressure. The atmospheric transfer chamber 22 is connected to the load lock chambers 12a, 13a of the load lock devices 12, 13 via gate valves G1, G2. A wafer transfer mechanism 23 is provided in the atmospheric transfer chamber 22. The wafer transfer mechanism 23 is configured to transfer a wafer W between the carrier C on the carrier mounting table 20 and the load lock chambers 12a, 13a under atmospheric pressure.

[0018] The carrier station 10 further includes an aligner 24 disposed adjacent to the atmospheric pressure transfer device 21. The aligner 24 recognizes a notch or the like of the wafer W and adjusts the orientation of the wafer W.

[0019] The processing station 11 includes a vacuum transfer device 30 as a substrate transfer device, and processing devices 40-43.

[0020] The vacuum transfer device 30 has a vacuum transfer chamber 31 whose interior is kept in a reduced pressure state (vacuum state). The vacuum transfer chamber 31 is made of a sealable housing, and is formed, for example, in a substantially polygonal shape (hexagonal shape in the illustrated example) in a plan view. The vacuum transfer chamber 31 is connected to the load lock chambers 12a and 13a of the load lock devices 12 and 13 via gate valves G3 and G4. The vacuum transfer chamber 31 is also connected to vacuum processing chambers 44 to 47, which will be described later, via gate valves G5 to G8, respectively. A wafer transfer mechanism 32 is provided in the vacuum transfer chamber 31 as a substrate transfer mechanism for transferring a wafer W between the vacuum processing chambers 44 to 47, which will be described later, of the processing devices 40 to 43.

[0021] The wafer transfer mechanism 32 has one transfer arm 32a. Note that the wafer transfer mechanism 32 may have a plurality of transfer arms 32a. The transfer arm 32a is, for example, an articulated arm.

[0022] 2, the transfer arm 32a is provided with a pick 32b as a holder at its tip. The pick 32b is configured to be freely raised and lowered, specifically, the pick 32b is configured to be raised and lowered in accordance with the raising and lowering of the entire transfer arm 32a. The pick 32b is also configured to be freely advanced and retreated with respect to the processing devices 40 to 43, specifically, the pick 32b is configured to be advanced and retreated with respect to the support pins 110 of each of the processing devices 40 to 43 by the transfer arm 32a extending and retracting. The pick 32b is also configured to be freely advanced and retreated with respect to each of the load lock chambers 12a and 13a, specifically, the pick 32b is configured to be advanced and retreated with respect to the support members (not shown) of each of the load lock chambers 12a and 13a by the transfer arm 32a extending and retracting. The wafer transfer mechanism 32 is configured to transfer the wafer W while holding it with a pick 32b of a transfer arm 32a.

[0023] The wafer transfer mechanism 32 also has a base 32c. The base 32c axially supports the base of the transfer arm 32a. The base 32c is provided with a drive unit 32d that drives the advancement and retreat of the pick 32b relative to the support pins 110 of each of the processing devices 40 to 43 and the advancement and retreat of the pick 32b relative to the support members (not shown) of each of the load lock chambers 12a and 13a. The drive unit 32d also drives the rotation of the transfer arm 32a about the base 32c. The drive unit 32d also drives the lifting and lowering of the transfer arm 32a, i.e., the lifting and lowering of the pick 32b. The drive unit 32d has an actuator (not shown) such as a motor that generates driving force for the above-mentioned advancement and retreat, rotation, and lifting and lowering.

[0024] The processing apparatuses 40 to 43 perform predetermined processes, such as a film formation process, a diffusion process, an etching process, etc., under reduced pressure on the wafer W. As shown in Fig. 1, the processing apparatuses 40 to 43 each have vacuum processing chambers 44 to 47 in which the predetermined processes are performed on the wafer W under reduced pressure. It should be noted that the processing devices 40 to 43 can be arbitrarily selected from devices that perform processing according to the purpose of the wafer processing.

[0025] As shown in FIG. 3, a mounting table 100 is provided in the vacuum processing chamber 44 of the processing apparatus 40. A plurality of (e.g., three) support pins 110 are provided below the mounting table 100 in the vacuum processing chamber 44 as lifting members extending in the vertical direction. The support pins 110 are connected to a lifting mechanism 120 that lifts and lowers the support pins 110. The lifting mechanism 120 has, for example, a support member 121 that supports the plurality of support pins 110, and a drive unit 122 that drives the lifting and lowering of the support member 121, i.e., the lifting and lowering of the support pins 110. The drive unit 122 has an actuator (not shown) such as a motor that generates a driving force for the lifting and lowering. By lifting and lowering, the support pins 110 protrude and retract from an upper surface (i.e., mounting surface) 100a of the mounting table 100 through a through hole 100b that penetrates the mounting table 100 in the thickness direction, i.e., in the vertical direction, in order to transfer the wafer W between the mounting table 100 and the pick 32b.

[0026] Similarly to the vacuum processing chamber 44, the vacuum processing chambers 45 to 47 are also provided with a mounting table 100, support pins 110, and the like.

[0027] 1, the wafer processing system 1 is further provided with a control unit 50. The control unit 50 is, for example, a computer equipped with a CPU, a memory, and the like, and has a program storage unit (not shown). The program storage unit stores programs for implementing various processes in the wafer processing system 1. For example, the program storage unit stores a program for controlling the drive unit 32d for the pick 32b and the drive unit 122 for the support pins 110 to implement the wafer processing described below.

[0028] <Wafer processing> Next, an example of wafer processing performed using the wafer processing system 1 configured as above will be described with reference to Figures 4 to 7. Figures 4 to 7 are diagrams that show the state inside the vacuum processing chamber 44 during wafer processing, and show only a part of the configuration inside the vacuum processing chamber 44. The following processing is performed under the control of the control unit 50.

[0029] (S1: Loading into vacuum transport device 30) First, the wafer W is loaded into the vacuum transfer device 30. Specifically, first, for example, the transfer arm 23a of the wafer transfer mechanism 23 takes out the wafer W from the carrier C and loads it into the aligner 24. Then, the orientation of the wafer W is adjusted in the aligner 24. Next, the transfer arm 23a takes out the wafer W from the aligner 24, and the gate valve G1 is opened. Thereafter, the transfer arm 23a loads the wafer W into the load lock chamber 12a of the load lock device 12, and the wafer W is transferred to a support member (not shown) in the load lock chamber 12a.

[0030] Next, the transfer arm 23a is removed from the load lock chamber 12a, and the gate valve G1 is closed to hermetically seal the inside of the load lock chamber 12a and reduce the pressure therein.

[0031] When the pressure in the load lock chamber 12a becomes equal to or lower than a predetermined pressure, the gate valve G3 is opened, and the wafer W is received by the pick 32b of the transfer arm 32a from the support member (not shown) in the load lock chamber 12a and removed from the load lock chamber 12a. Thereafter, the gate valve G3 is closed.

[0032] (S2: Carrying into the processing device 40) Next, the wafer W is carried into, for example, the processing device 40.

[0033] (S2-1: Movement of pick 32b) Specifically, first, the pick 32b holding the wafer W is moved to an area in the processing device 40 where the support pins 110 are arranged, i.e., above the mounting table 100. More specifically, first, as shown in Fig. 4, the support pins 110 are raised until the upper ends of the support pins 110 reach a first pin height H11. The first pin height H11 is the height of the support pins 110 when the pick 32b loads or unloads the wafer W. Specifically, the first pin height H11 is the height at which the support pins 110 protrude from the upper surface 100a of the mounting table 100, and is lower than a second pin height H12 and a first pick height H21, which will be described later. After the upper end of the support pin 110 reaches the first pin height H11, the gate valve G5 is opened, and then the pick 32b holding the wafer W is inserted into the vacuum processing chamber 44 by horizontal movement at the first pick height H21 as shown in FIG. 5, and is moved to a position above the support pin 110 (specifically, to a position where the wafer W held by the pick 32b and the support pins 110 all overlap in a plan view). The first pick height H21 is the height of the pick 32b when the wafer W is carried in and out by the pick 32b. Specifically, the first pick height H21 is higher than the first pin height H11 and a second pin height H12 described later. In addition, the distance L1 between the first pick height H21 and the first pin height H11 is set so that the pick 32b and the wafer W do not come into contact with the support pins 110 when the pick 32b holding the wafer W moves horizontally.

[0034] (S2-2: Delivery from pick 32b to support pin 110) After the pick 32b holding the wafer W is moved horizontally, the pick 32b is lowered and the support pins 110 are raised simultaneously as shown in Fig. 6, and the wafer W is transferred from the pick 32b to the support pins 110 as shown in Fig. 7. Specifically, the pick 32b is lowered from the first pick height H21 to the second pick height H22, and the support pins 110 are raised so that the upper ends of the support pins 110 are positioned at the second pin height H12 from the first pin height H11. As a result, the wafer W is transferred from the pick 32b to the support pins 110 at a height between the first pick height H21 and the second pick height H22 and between the first pin height H11 and the second pin height position H12, and is supported by the support pins 110 whose upper ends are positioned at the second pin height H12. For example, the second pick height H22 is lower than the first pin height H11, and the second pin height H12 is also lower than the first pick height H21. The distance L2 between the second pin height H12 and the second pick height H22 and the distance L3 between the second pick height H22 and the upper surface 100a of the mounting table 100 are set as follows: That is, the distance L3 is set so that the wafer W supported by the support pins 110 and the upper surface 100a of the mounting table 100 do not come into contact with the pick 32b when the pick 32b moves horizontally at the second pick height H22 for insertion or removal of the pick 32b.

[0035] (S2-3: Placement on the placement table 100) After the wafer W is transferred from the pick 32b to the support pins 110, the wafer W is placed on the mounting table 100 by the support pins 110. Specifically, the pick 32b is moved horizontally at the second pick height H22 to retract from the mounting table 100, that is, retracted from the support pins 110 and also retracted from the vacuum processing chamber 44. Next, the support pins 110 are lowered so that their upper ends are submerged in the mounting table 100. As a result, the wafer W is transferred from the support pins 110 to the upper surface 100a of the mounting table 100 and placed thereon. Thereafter, the gate valve G5 is closed, and the vacuum processing chamber 44 is sealed.

[0036] (S3: Processing) Next, in the processing device 40, the wafer W is subjected to processing such as etching.

[0037] (S4: Unloading from the processing device 40) Thereafter, the wafer W is unloaded from the processing apparatus 40.

[0038] (S4-1: Removal from the mounting table 100) Specifically, first, in the processing apparatus 40, the wafer W is removed from the mounting table 100 by the support pins 110. More specifically, the support pins 110 are raised until the upper ends of the support pins 110 are at the second pin height H12. As a result, the wafer W is removed from the upper surface 100a of the mounting table 100 and transferred to the support pins 110, and is in a state where the wafer W is supported by the support pins 110 whose upper ends are positioned at the second pin height H12.

[0039] (S4-2: Movement of pick 32b (entry)) After the support pins 110 are raised, the pick 32b is moved and enters the area where the support pins 110 are arranged, i.e., above the mounting table 100. More specifically, first, the gate valve G5 is opened, and then the pick 32b is inserted into the vacuum processing chamber 44 by horizontal movement at the second pick height H22, and enters between the wafer W supported by the support pins 110 and the upper surface 100a of the mounting table 100.

[0040] (S4-3: Delivery from support pin 110 to pick 32b) After the pick 32b moves horizontally, the pick 32b rises and the support pins 110 fall simultaneously, and the wafer W is transferred from the support pins 110 to the pick 32b. Specifically, the pick 32b rises from the second pick height H22 to the first pick height H21, and the support pins 110 fall such that the upper ends of the support pins 110 are at the first pin height H11 from the second pin height H12. As a result, the wafer W is transferred from the support pins 110 to the pick 32b, and is held by the pick 32b located at the first pick height H21.

[0041] (S4-4: Retraction of pick 32b and lowering of support pin 110) After the wafer W is held by the pick 32b, the pick 32b is withdrawn from the vacuum processing chamber 44, and the support pins 110 are lowered. More specifically, first, the pick 32b is horizontally moved at the first pick height H21 to withdraw from above the mounting table 100 and the support pins 110, and also from within the vacuum processing chamber 44. Next, the support pins 110 are lowered so that their upper ends are submerged in the mounting table 100. Thereafter, the gate valve G5 is closed.

[0042] (S5: Unloading the wafer W from the vacuum transfer device 30) Next, in a procedure reversing that of step S1, the wafer W is unloaded from the vacuum transfer device 30 and returned to the carrier C. However, in the process of returning the wafer W to the carrier C, loading and unloading of the wafer W into and from the aligner 24 and adjustment of the orientation of the wafer W in the aligner 24 are omitted. This completes the series of wafer processing steps.

[0043] As described above, the method for transferring the wafer W according to the present embodiment includes a step of moving the pick 32b above the region where the support pins 110 are arranged. The method also includes a step of simultaneously lowering the pick 32b holding the wafer W and raising the support pins 110 to transfer the wafer W from the pick 32b to the support pins 110, and a step of simultaneously lowering the support pins 110 supporting the wafer W and raising the pick 32b to transfer the wafer W from the support pins 110 to the pick 32b. That is, in the method for transferring the wafer W between the pick 32b and the support pins 110, the one of the pick 32b and the support pins 110 that holds the wafer W is lowered and the one that does not hold the wafer W is raised simultaneously. For example, the pick 32b holding the wafer W is lowered from the first pick height H21 to the second pick height H22, and the support pins 110 are raised so that the upper ends of the support pins 110 are raised from the first pin height H11 to the second pin height H12, simultaneously. In addition, in this delivery method, the distance L1 between the first pick height H21 and the first pin height H11 is set so that when the pick 32b holding the wafer W moves horizontally, the pick 32b and the wafer W do not come into contact with the support pins 110, as described above. In other words, in this delivery method, the first pick height H21 is set based on the first pin height H11 within a range in which no contact occurs between the pick and the pins when the wafer is carried in and out.

[0044] On the other hand, in the conventional method for transferring a wafer W, when transferring a wafer W between the pick 32b and the support pins 110, only one of the pick 32b and the support pins 110 is raised and lowered, and the other is fixed. For example, in the conventional method for transferring a wafer W, as shown in Fig. 8, the pick 32b holding the wafer W is lowered from the first pick height H41 to the second pick height H42 in a state where the support pins 110 are fixed at a transfer height H31 where the upper ends of the support pins 110 protrude from the upper surface 100a of the mounting table 100, and the wafer W is transferred from the pick 32b. In the conventional method, the distance L4 between the first pick height H1 and the transfer height H31 of the support pins 110 is set so that the pick 32b and the wafer W do not come into contact with the support pins 110 when the pick 32b holding the wafer W moves horizontally, similar to the distance L1 in the present transfer method. In other words, in the conventional method, the first pick height H41 is set within a range in which no contact occurs between the pick and the pins when the wafer is carried in and out, based on the above-mentioned delivery height H31.

[0045] Here, consider a case where the transfer height H31 in the conventional method and the second pin height H12 in the present transfer method are the same. In this case, the first pin height H11 in the present transfer method, which is lower than the second pin height H12, is lower than the transfer height H31 in the conventional method. As described above, in the present transfer method, the first pick height H21 is set based on the first pin height H11, and in the conventional method, the first pick height H41 is set based on the transfer height H31, each within a range where no contact occurs between the pick and pin when the wafer is carried in and out. Therefore, in the present transfer method, the first pick height H21 can be made lower than the first pick height H41 in the conventional method within a range where no contact occurs between the pick and pin when the wafer is carried in and out (for example, so that the distance L1 in the one-way transfer method is equal to the distance L4 in the conventional method).

[0046] Furthermore, as described above, when the transfer height H31 in the conventional method and the second pin height H12 in this transfer method are the same, this transfer method can make the first pick height H21 lower than the first pick height H41 in the conventional method, and therefore has the following effect: That is, when the second pick height H42 in the conventional method and the second pick height H22 in this transfer method are the same, in this transfer method, when transferring the wafer W between the pick 32b and the support pins 110, the vertical movement distance of the pick 32b, i.e., the lifting distance, can be made shorter than in the conventional method. Therefore, according to this delivery method, the wafer W can be delivered between the pick 32b and the support pins 110 in a short time, that is, at high speed.

[0047] The time required to transfer the wafer W between the pick 32b and the support pins 110 can be shortened, for example, by moving the pick 32b, i.e., the transfer arm 32a, up and down at high speed. However, if the transfer arm 32a is moved up and down at high speed, the vibration of the transfer arm 32a increases, and this vibration may cause the wafer W to shift on the pick 32b or may make it impossible to transfer the wafer properly between the pick 32b and the support pins 110. In contrast, according to the present delivery method, the lifting distance of the pick 32b can be shortened when the wafer W is delivered between the pick 32b and the support pins 110, so that the wafer W can be delivered in a short time without the need to lift and lower the pick 32b at high speed. In other words, according to the present delivery method, the wafer W can be delivered in a short time between the pick 32b and the support pins 110 without increasing the vibration of the transport arm 32a.

[0048] Furthermore, according to this delivery method, the lifting distance of the pick 32b can be shortened as described above, so that the power consumption during lifting of the pick 32b can be reduced, and the opening (specifically, the opening height) of the processing device 40-43 in which the gate valves G5-G8 are provided can be reduced. The smaller the opening, the better the processing results can be obtained in the processing device 40-43. Furthermore, since the opening can be reduced, the gate valves G5-G8 can also be made smaller. By making the gate valves G5-G8 smaller, the amount of air consumed for opening and closing the gate valves G5-G8 and the amount of movement of the gate valves G5-G8 when opening and closing the gate valves G5-G8 can also be reduced. Furthermore, by reducing the amount of movement of the gate valves G5-G8 as described above, the time required for the delivery of the wafer W between the pick 32b and the support pins 110, including the opening and closing of the gate valves G5-G8, can be further reduced. Furthermore, since the gate valves G5 to G8 and the openings in which the gate valves G5 to G8 are provided can be made small, the wafer processing system 1 as a whole can be made compact.

[0049] <Other examples of wafer processing systems to which this delivery method can be applied> FIG. 9 is a diagram for explaining another example of a wafer processing system to which the present delivery method is applied, and is a plan view showing an outline of the configuration of a wafer transfer mechanism provided in a vacuum transfer device of the wafer processing system.

[0050] Wafer transfer mechanism 200 in Fig. 9 differs from wafer transfer mechanism 32 in Fig. 3 in the configuration of the transfer arm, specifically, in the configuration of a holder provided at the tip of the transfer arm for holding wafer W. While the holder, i.e., pick 32b, of transfer arm 32a of wafer transfer mechanism 32 in Fig. 3 can hold one wafer W, holder 202 of transfer arm 201 of wafer transfer mechanism 200 is configured to be able to hold multiple wafers W (e.g., four wafers W) at once.

[0051] Specifically, the holding portion 202 of the transfer arm 201 has a pair of long plate portions 203. In the following description, one of the long plate portions is referred to as a first long plate portion 203a, and the other is referred to as a second long plate portion 203b. The first long plate portion 203a and the second long plate portion 203b are each formed in a long and narrow plate shape so as to extend in the horizontal direction. The first long plate portion 203a and the second long plate portion 203b are provided so as to be parallel to each other. The length of the first long plate portion 203a is a length capable of collectively holding a plurality of wafers W (two in this example) arranged along the longitudinal direction of the first long plate portion 203a. The width of the first long plate portion 203a (length perpendicular to the longitudinal direction in a horizontal plane) is formed to be narrower than, for example, the diameter of the wafer W. The length and width of the second long plate portion 203b are the same as those of the first long plate portion 203a.

[0052] The wafer transfer mechanism 200 configured as described above simultaneously loads a plurality of wafers W into the processing apparatus. This processing apparatus is provided with a number of mounting tables similar to the mounting table 100 in Fig. 3 corresponding to the number of wafers W held by the wafer transfer mechanism 200, and each mounting table is provided with a support pin similar to the support pin 110 in Fig. 3. This processing apparatus then simultaneously performs processing such as etching on the plurality of wafers W.

[0053] In a wafer processing system having a processing apparatus as described above and a vacuum transfer apparatus provided with a wafer transfer mechanism 200, a plurality of wafers W are simultaneously transferred from the holder 202 of the wafer transfer mechanism 200 to support pins provided in the processing apparatus, or from the support pins to the holder 202. The present transfer method can also be applied to such simultaneous transfer of a plurality of wafers W.

[0054] Furthermore, in the case of the wafer transfer mechanism 200, in which the holder 202 is configured to be able to hold the wafers W collectively, the transfer arm 201 becomes large, and the rigidity of the transfer arm 201 (specifically, the rigidity of the first and second long plate portions 203a, 203b) decreases, and the transfer arm 201 is likely to vibrate when raised and lowered at high speed. Even in a wafer processing system equipped with the wafer transfer mechanism 200 having the transfer arm 201 that is prone to vibrating, by applying this transfer method, multiple wafers W can be transferred simultaneously between the holder 202 and the support pins in the processing device in a short time without increasing the vibration of the transfer arm 201.

[0055] <Modification> In the above, the present transfer method has been described by way of example in which a wafer is transferred between a liftable support pin provided in a processing device and a holder of a transfer arm. However, when a support member in a load lock chamber is configured to be liftable, the present transfer method can also be applied to a case in which a wafer is transferred between a support member in a load lock chamber and a holder of a transfer arm.

[0056] In the above, the load lock chambers are not configured in multiple stages in the vertical direction, but they may be configured in multiple stages. When the load lock chambers are configured in multiple stages, a lifting mechanism for the transfer arm is essential for the wafer transfer mechanism provided in the vacuum transfer device. According to this transfer method, when the load lock chambers are configured in multiple stages in the vertical direction, the lifting mechanism for the transfer arm, which is essential in this case, can be effectively utilized.

[0057] The embodiments disclosed herein should be considered as illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0058] 1. Wafer Processing System 30 Vacuum transport device 32b Pick 32d Drive unit 50 Control section 110 Support pin 122 Drive unit 202 Holding part W wafer

Claims

1. A process of extending a transport arm of a substrate transport device, the transport arm having a holding part at its tip for holding a substrate, and horizontally moving the holding part above an area in which a lifting member configured to be freely raised and lowered is disposed; a step of simultaneously lowering the holding part holding the substrate by lowering an extended transport arm and raising the lifting member, and transferring the substrate from the holding part to the lifting member; or simultaneously lowering the lifting member supporting the substrate and raising the holding part by raising the extended transport arm, and transferring the substrate from the lifting member to the holding part.

2. The holding unit is configured to be able to hold a plurality of substrates, 2. The substrate transfer method according to claim 1, wherein the transferring step transfers a plurality of substrates simultaneously from the holder to the lifting member or from the lifting member to the holder.

3. A lifting member configured to be freely raised and lowered; A drive unit that drives the lifting member to move up and down; a substrate transport device having a transport arm that is configured to be freely raised and lowered and to be movable toward and away from the lifting member by extension and contraction, and a holding part that holds a substrate is provided at a tip of the transport arm; another drive unit that drives the transport arm to move up and down and extend and retract relative to the lifting member; A control unit, The control unit is extending the transport arm to horizontally move the holding unit above an area in which the lifting member is disposed; a substrate transfer system which controls the drive unit and the other drive unit so as to perform a process of simultaneously lowering the holding unit holding the substrate and raising the lifting member by lowering an extended transport arm, and transferring the substrate from the holding unit to the lifting member, or simultaneously lowering the lifting member supporting the substrate and raising the holding unit by raising an extended transport arm, and transferring the substrate from the lifting member to the holding unit.

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