Electronic device, insole-type electronic device and monitoring system

Abstract

To provide an inner sole type electronic apparatus including an electronic board that hardly receives impact or load caused by walking or running.SOLUTION: An electronic apparatus includes: a horseshoe-type base that is made to lean along an inner heel part of a shoe to enclose a back of a foot's heel; and an electronic board mounted on the base. The electronic apparatus is disposed in a state of leaning along the inner heel part of the shoe, which inhibits the electronic board included by the electronic apparatus from receiving a load and impact from a sole. As a result, the electronic board can be protected from the load and impact.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electronic device and a monitoring system. [Background technology]

[0002] In recent years, it has become common to wear electronic devices on the body to obtain biometric and location information. One method of wearing electronic devices is to incorporate them into shoes. This method requires that the electronic devices do not interfere with the user's movements or cause discomfort when worn.

[0003] A technology that meets this demand is disclosed, for example, in Patent Document 1. In this technology, a housing (cavity) is provided within the surface of the midsole of the shoe or on the surface of the midsole side of the insole, and an electronic module is stored in the housing. This configuration prevents discomfort caused by wearing the shoes. Furthermore, a method is disclosed in which the gap between the electronic module and the housing is filled with a shock absorbing material to further reduce the discomfort.

[0004] Patent Document 2 also discloses a method of configuring a portable device for location search by providing a chamber in the heel of a shoe (heel portion of the outsole) and housing a GPS (Global Positioning System) receiver and communication device in this chamber. Housing electronic devices in the heel of a shoe makes it possible to obtain the user's location information without interfering with the user's movements. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2015-033643 A [Patent Document 2] JP 2000-028698 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the technology of Patent Document 1 has a problem that the electronic module is located between the sole of the foot and the sole of the shoe, so the electronic module is damaged by the impact and load generated by walking or running, raising concerns about reliability. Patent Document 1 also shows a method of cushioning the impact by filling the housing with an impact absorbing material, but this is not sufficient because it cannot completely absorb the impact. Also, even if the impact can be reduced, there is a problem that a load is applied.

[0007] The same problem also exists in Patent Document 2. In particular, the heel of the shoe is the part of the sole that bears the greatest load, and therefore electronic devices are more likely to be damaged at the heel.

[0008] The present invention has been made in consideration of the above problems, and has an object to provide an insole-type electronic device in which the electronic module is less susceptible to shocks and loads caused by walking or running. [Means for solving the problem]

[0009] In order to solve the above problems, the electronic device of the present invention has a horseshoe-shaped base that stands along the inner heel of the shoe and wraps around the back of the heel, and an electronic board mounted on the base. Since the electronic device is placed in a standing state along the inner heel of the shoe, the electronic board of the electronic device is not subjected to load or impact from the sole of the foot. As a result, the electronic board can be protected from these loads and impacts. Effect of the Invention

[0010] The effect of the present invention is to provide an electronic device in which an electronic board is less susceptible to shocks and loads caused by walking or running. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view showing an electronic device according to a first embodiment. [Diagram 2] 1 is a perspective view showing a state in which an electronic device according to a first embodiment is installed in a shoe. [Diagram 3] FIG. 11 is a partial perspective view showing an electronic device according to a second embodiment. [Figure 4] FIG. 11 is an exploded perspective view of an electronic device according to a second embodiment. [Diagram 5] FIG. 11 is a perspective view illustrating a cross section of an electronic device according to a second embodiment. [Figure 6] FIG. 7 is a partial cross-sectional view of FIG. [Figure 7] 11 is a cross-sectional view showing a person wearing shoes in which an electronic device according to a second embodiment is installed. FIG. [Figure 8] 11 is a cross-sectional view showing a person running or walking while wearing shoes on which an electronic device of a second embodiment is installed. FIG. [Figure 9] FIG. 11 is a perspective view showing an electronic device according to a third embodiment. [Figure 10] FIG. 11 is a cross-sectional view showing a specific example of the third embodiment. [Figure 11] FIG. 11 is a cross-sectional view showing another specific example of the third embodiment. [Figure 12] FIG. 13 is a perspective view showing an insole-type electronic device according to a fourth embodiment. [Figure 13] FIG. 13 is a perspective view showing an insole-type electronic device according to a fifth embodiment. [Figure 14] FIG. 13 is an exploded perspective view showing an insole-type electronic device according to a fifth embodiment. [Figure 15] FIG. 13 is a plan view showing an insole-type electronic device according to a fifth embodiment. [Figure 16] FIG. 13 is a cross-sectional view showing an insole-type electronic device according to a fifth embodiment. [Figure 17] FIG. 13 is a cross-sectional view showing a modified example of the insole-type electronic device of the fifth embodiment. [Figure 18] FIG. 13 is an exploded perspective view showing an insole-type electronic device according to a sixth embodiment. [Figure 19] FIG. 13 is a perspective view showing an insole-type electronic device according to a sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. However, the embodiments described below are limited in a technically preferable manner for carrying out the present invention, but the scope of the invention is not limited to the following. Note that the same components in each drawing are given the same numbers, and the description may be omitted.

[0013] (First embodiment) 1 is a perspective view showing an electronic device 10 according to a first embodiment. The electronic device 10 has a horseshoe-shaped base body 1 that stands along the inner heel part of a shoe and wraps around the rear of the heel of the foot, and an electronic board 2 mounted on the base body 1.

[0014] 2 is a perspective view showing the state in which the electronic device 10 is installed in a shoe. The electronic device 10 is placed in a state in which it is leaned up along the inner heel part of the shoe 20. Therefore, the electronic board 2 provided in the electronic device 10 is not subjected to load or impact from the sole of the foot. As a result, the electronic board 2 can be protected from these loads and impacts.

[0015] As described above, according to this embodiment, it is possible to provide an electronic device in which the electronic board is less susceptible to shocks and loads caused by walking or running.

[0016] Second embodiment FIG. 3 is a partial perspective view showing an electronic device 1000 of the second embodiment. The electronic device 1000 has a heel cup type housing 100 and an electronic board 200 stored in the housing 100. The electronic board 200 is built into the housing 100 and is isolated from the outside world. Here, the heel cup refers to a structure that is placed behind the heel of the foot when wearing a shoe, is placed along the inner heel part of the shoe, and wraps around the rear side of the heel of the foot. For example, as shown in FIG. 3, it can be shaped like a horseshoe when viewed from above. In this embodiment, the heel cup covers the side of the heel and does not include the part of the heel that touches the sole of the foot.

[0017] 4 is an exploded perspective view of the heel-cup type housing 100 of the electronic device 1000 of this embodiment and the electronic board 200 stored in the housing 100. The heel-cup type electronic device 1000 is placed behind the heel of the foot when the shoe is worn, and is placed upright along the inner heel part of the shoe. The housing 100 is a horseshoe type that encases the rear of the heel of the foot, that is, a heel cup type. The electronic board 200 has a flexible portion and can be bent into a curved shape to fit the horseshoe shape of the housing 100.

[0018] The housing 100 is made of a flexible material, and can be deformed to fit the shape of the heel of the foot or the heel of the shoe. For example, silicone rubber can be used.

[0019] The electronic board 200 has, for example, a flexible FPC (flexible printed circuit board) 210, a module board that is not flexible, and a battery 230. Also, for example, a pattern antenna 240 for transmission and reception can be formed on the FPC 210 by a wiring pattern. In the example of FIG. 4, module boards 220, 221, and 222 are mounted on the FPC 210. The module boards 220, 221, and 222 can be, for example, a communication module, a position detection module, a power supply module, a microcomputer, etc. These module boards may be mounted on the FPC 160 by combining the necessary functions. When mounting the module board, it is desirable to connect the connection points of the mounting part by concentrating them in a small area as much as possible. In this way, the flexibility range of the FPC 160 can be maximized, and it is easier to follow a curved shape with less stress. That is, it is possible to deform along with the housing to follow the shape of the heel of the foot or the heel part of the shoe.

[0020] FIG. 5 is a perspective view illustrating a cross section of the electronic device 1000 of this embodiment. FIG. 6 is an enlarged view of partial cross section A in FIG. 5. The housing 100 has a board storage area 110 for storing the electronic board 200, and is bag-shaped with an opening on one side. The opening provided in the housing 100 is a board insertion opening 120 for inserting the electronic board 200 into the housing 100. The board insertion opening 120 is slit-shaped and narrower than the width of the board storage area 110. The electronic board 200 is inserted by pushing the board insertion opening 120 open, and is stored in the housing in a curved state along the horseshoe shape.

[0021] In the above description, the electronic board 200 is built into the housing 100, but it is also possible to use a configuration in which the electronic board 200 is attached to the side of the housing 100, or in addition to that configuration, a protective sheet that covers the electronic board 200. Furthermore, when an electronic circuit can be formed directly in the housing 100 or electronic components can be mounted, the electronic board 200 may be integrated with the housing 100.

[0022] (Specific examples) FIG. 7 is a cross-sectional view showing a state where a person is wearing a shoe 20 in which a heel cup type electronic device 1000 of this embodiment is installed and standing or walking on a floor 40. In an upright state, the weight of a person wearing the shoe 20 is applied to the sole of the heel of the shoe, which is sandwiched between the foot 30 and the floor 40. That is, this load is applied vertically from the sole of the foot, as shown by the arrow in FIG. 7. In contrast, almost no load is applied to the heel cup type electronic device 1000 disposed on the side of the heel. In a test in which several people with different weights tried on shoes with a load sensor placed in the heel cup, the measured value was around 1 kgf for all subjects.

[0023] Fig. 8 is a cross-sectional view showing a state where a person is running or walking while wearing the shoe 20 in which the heel cup type electronic device 1000 of this embodiment is installed. Even when walking or running, the body weight is applied in the stepping direction shown by the arrow in Fig. 8, so the load on the heel cup type electronic device 1000 is also almost independent of the body weight. Similarly, in the measurement test, it was confirmed that the load hardly changes.

[0024] From the above specific examples, it can be said that the heel cup is a suitable place to place the device. In addition, a low load means that the reaction force on the wearer is small, and therefore the discomfort felt by the wearer is small. In addition, since there are no foreign objects such as electronic devices under the feet, which bear most of the weight, the impact of impairing the comfort of the shoes can be reduced. In addition, since the device can be easily removed and installed in other shoes, the wearer can choose shoes that suit their preferences.

[0025] (Third embodiment) FIG. 9 is a perspective view showing a heel cup type electronic device 2000 of this embodiment. The electronic device 2000 has a housing 2100 and an electronic board (not shown) stored in the housing 2100. The housing 2100 has a heel cup shape that covers the sides of the heel and does not include the part of the heel that touches the sole of the foot. The housing 2100 has a board insertion opening 2110 for inserting the electronic board in the upper surface part of the heel cup. The upper surface means the surface that becomes the upper side when the electronic device 2000 is placed in the heel part of a shoe.

[0026] In manufacturing the electronic device 2000, first, the electronic board is inserted into the housing 2100 through the board insertion opening 2110 of the housing 2100. At this time, the electronic board is bent to match the curved shape of the housing 2100. When the electronic board is inserted into a predetermined position in the housing 2100, the board insertion opening 2110 is closed with a sealant to seal the electronic board. The sealant can be supplied, for example, as shown in FIG. 9, by inserting a dispense nozzle 3000 into the board insertion opening 2110 and moving the dispense nozzle 3000 along the board insertion opening 2110 as shown by the arrow. Next, the filled sealant is hardened to seal. By sealing the electronic board to the housing 2100 with the sealant, the electronic device 2000 can be provided with waterproof / dustproof functions.

[0027] Next, a specific example of the sealing structure of the electronic device 2000 will be described. FIG. 10 is a cross-sectional view showing one example. In this example, a protective member 2300 is interposed between the housing 2100 and the electronic board 2200. The protective member 2300 is, for example, a high-strength film having insulating properties and abrasion resistance. Specifically, for example, a highly stretched PET (polyethylene terephthalate) film. With this configuration, when the heel-cup type electronic device 2000 is deformed by an external force, the housing 2100 and the electronic board 2200 do not rub against each other directly, and a low-stress structure is obtained in which both can be smoothly and freely displaced. And because it is a low-stress structure, it is easy to bend, and because it is easy to bend, the stress generated in the electronic board 2200 is small. Therefore, by adopting the above configuration, the electronic board 2200 can be protected from destruction due to stress. Also, by interposing a plurality of such films in layers, the components can be further smoothly and freely displaced, resulting in a lower-stress structure. After the electronic board 2200 and the protective member 2300 are inserted, the board insertion opening 2110 is sealed with a sealing agent 3100 .

[0028] FIG. 11 shows an example in which the substrate storage area 2120 is filled with a filler 3200. As in the example of FIG. 10, the housing 2100 and the electronic substrate 2200 do not rub against each other directly, and a low-stress structure is realized in which the two can be smoothly and freely displaced. For example, an inert liquid or a low-hardness gel material may be used for the filler 3200. Specifically, for example, silicone oil or silicone gel may be used. By filling the substrate storage area 2120 with the filler 3200, moisture that has permeated the housing 2100 does not condense inside the housing 2100, and the operational reliability can be improved even in the harsh environment of the inside of a shoe.

[0029] As described above, according to this embodiment, a heel cup type electronic device with excellent reliability can be configured.

[0030] (Fourth embodiment) An insole type electronic device can be configured by combining the heel cup type electronic device of the first to third embodiments with an insole (shoe insole). FIG. 12 is a perspective view showing an insole type electronic device 5000 in which the heel cup type electronic device 2000 is joined to the insole 4000. The insole type electronic device 5000 is arranged so that the heel cup type electronic device 2000 fits on the inner side of the heel part of the shoe. For this purpose, the heel cup type electronic device 2000 is fitted and joined to the insole 4000, which is a shape obtained by removing the heel cup part from a normal shape insole. In this way, the heel cup type electronic device 2000 can be stabilized in the shoe. In addition, it is possible to impart the functions of the electronic device, such as comfort, fatigue reduction, deodorization, and moisture absorption, without affecting the functions of the insole itself.

[0031] It is also possible to install additional functional parts by hollowing out a part of the insole 4000. For example, the area below the arch is the part of the sole that receives the least amount of weight, and a battery, a charging antenna, etc. can be installed therein.

[0032] It is also possible to perform location monitoring using the heel cup type electronic device 2000 or the insole type electronic device 5000 obtained in this way. For example, the heel cup type electronic device 2000 is equipped with a function for acquiring location information and a function for transmitting the acquired location information. Then, by providing a location monitoring device that receives the location information in a monitoring center or the like, it is possible to monitor the location information of, for example, dementia wandering patients and wide-area workers. In the case of the insole type electronic device 5000 of this embodiment, since there is no foreign object such as an electronic device under the feet that bears most of the body weight, the discomfort felt when wearing the electronic device is reduced. Therefore, it is possible to provide a monitoring system in which subjects who require location management, such as dementia wandering patients and wide-area workers, are not conscious of carrying an electronic device.

[0033] Fifth embodiment In this embodiment, based on the configuration of the fourth embodiment, an example of a configuration in which a recess is formed in a part of the insole and a part is installed in this recess will be described. Suitable places for installing parts in the insole include, for example, the arch part and the heel part. The part under the arch of the foot is the part of the sole that receives the least load. In addition, since the part under the heel of the foot is the part that does not bend when walking, it can be said that the heel part of the insole is a part where the user is unlikely to feel uncomfortable even if a structure is stored therein. For this reason, it is convenient to implement a relatively large-volume large-capacity battery or a wireless power receiving function for charging in the above-mentioned places.

[0034] FIG. 13 is a perspective view showing an example of an insole-type electronic device 5100 having the same basic configuration as the insole-type electronic device 5000 of FIG. 12, in which a storage space is provided by hollowing out the insole 4100 to store electronic components. Here, a configuration in which a battery unit 6100, a wireless power receiving module 6200, and a connection cable 6300 are stored as electronic components is illustrated. Also, like the insole-type electronic device 5000 of FIG. 12, a heel cup-type electronic device 2500 is arranged. Furthermore, a base plate 4200 is arranged below the heel part of the insole 4100. As described above, by providing a storage space in the insole 4100 and arranging electronic components therein, the electronic components can be arranged without creating a part protruding from the surface of the insole 4100. Since there is no protruding part, the user can use the insole-type electronic device 4100 comfortably.

[0035] 14 is an exploded perspective view of the insole type electronic device 5100, disassembled into each functional part. The insole 4100 can be, for example, a foot-shaped plate-like body made of elastomer such as polyurethane having flexibility and cushioning properties, rubber, or a sponge material formed by foaming these. The insole 4100 has a storage space 4110 for storing the battery unit 6100 in the arch part, and a storage space 4120 for storing the wireless power receiving module 6200 in the heel part. In addition, a connecting groove 4130 for storing the connection cable 6300 is provided between the two.

[0036] The base plate 4200 that reinforces the heel portion is, for example, a plate-like body formed from a tough resin material, and its thickness can be, for example, about 0.5 mm to 1 mm. The base plate 4200 can bend flexibly. A wall portion 4220 that rises upward is provided on the outer edge of the base plate 4200 from the arch of the foot to the heel. The material of the base plate can be selected from various materials such as PP (polypropylene), PC (polycarbonate), urethane elastomer, and PVC (polyvinyl chloride). FIG. 15 is a plan view of the insole type electronic device 5100, drawn from the surface on which the foot is placed. FIG. 16 is a cross-sectional view taken along the line AA' in FIG. 15. The battery unit 6100 is a battery 6110 and an electronic circuit 6120 equipped with a power supply circuit and an interface connector, etc., all housed in a single housing 6130. The battery unit 6100 includes, for example, a button-type secondary battery, its protection circuit, a charging circuit, an IMU for data measurement, and a control circuit for stepping down or stepping up the voltage as a power source for the electronic device 2000. Here, IMU is an abbreviation for Inertial Measurement Unit. However, the functions to be implemented are not limited to those described above.

[0037] The wireless power receiving module 6200 has a function of supplying power for charging the battery. The wireless power receiving module 6200 is composed of an antenna coil 6210, a control circuit 6220, a ferrite plate 6230, and a housing 6230 that houses them. The antenna coil 6210 receives power from an external wireless power transmitting module. The control circuit 6220 rectifies and stabilizes the received power, and lowers or raises the voltage. When charging, the power receiving antenna coil 6210 is made to face the power transmitting antenna coil of the external wireless power transmitting module (not shown). Then, an alternating current is passed through the power transmitting antenna coil to generate and change a magnetic flux, thereby generating an electromotive force in the power receiving antenna coil 6210. Note that the function of the control circuit 6220 may be integrated into an electronic circuit 6120 in the battery unit 6100.

[0038] The base plate 4200 holds the heel part of the insole 4100 and the heel cup type electronic device 2500 and is joined to them. Here, the bottom part of the electronic device 2500 is positioned along the wall part 4220 of the base plate 4200. In addition, the end part of the heel part of the insole 4100 is positioned to match the inside of the electronic device 2500 and the outer shape of the base plate 4200.

[0039] The reason for adopting the above configuration is that it is difficult to attach the heel cup type electronic device 2500 to the side of the insole 4100, which is thin and has no stiffness. As described above, the various functions can be easily assembled by placing and fixing them together on the base plate 4200. For example, adhesive or double-sided adhesive tape can be used for the fixing method. In the example of Figs. 14 and 16, the battery unit 6100 is fitted into the through hole 4210 provided in the base plate 4200, but the through hole 4210 may be eliminated and the battery unit 6100 may be held on the base plate 4200.

[0040] Fig. 17 is a cross-sectional view showing a modification of the insole-type electronic device 5100 of Fig. 16. In this modification, a base plate 4200 is provided with a convex portion 4201 that covers the upper surface of the battery unit 6100 and a convex portion 4202 that covers the upper surface of the wireless power receiving module 6200. The convex portion 4201 and the housing 6131 surround the battery unit 6100, and the convex portion 4202 and the housing 6231 surround the wireless power receiving module 6200. With the above configuration, positioning of the base plate 4200 when loading / fixing it to the insole 4100 becomes easy.

[0041] In the above description, the electronic components stored in the storage spaces 4110 and 4120 are the battery unit 6100 and the wireless power receiving module 6200, but the electronic components are not limited to these and any electronic components can be used.

[0042] Sixth embodiment In this embodiment, an insole-type electronic device 5101 in which a second insole 4101 is placed on the upper side of the insole-type electronic device 5100 of the fifth embodiment will be described. Fig. 18 is an exploded perspective view showing the insole-type electronic device 5101. Fig. 19 is a perspective view showing a state in which the insole 4100 and the second insole 4101 are placed on top of each other to assemble the insole-type electronic device 5101.

[0043] In the above configuration, the second insole 4101 can be selected regardless of the function of the electronic device to be added to the insole type electronic device 5101. Therefore, the second insole can ensure the functions required for an insole, such as comfort, fatigue reduction, deodorization, and moisture absorption, and the insole type electronic device 5101 can be configured according to individual preferences. Therefore, the insole 4100 of the insole type electronic device 5100 does not need to be comfortable, and a wide range of material options can be available. For example, the flexibility may be such that the hardness is about Duro A 30 to 70°. In addition, the shape may be a flat plate shape, and there is no need to design a complex three-dimensional shape such as a raised arch. Therefore, the insole 4100 can be easily produced by punching out a flat plate of sponge material or rubber material with a die (such as a Vic die or a Thomson die). In addition, if a rubber-like material is used for molding with a 3D printer, no die is required at all, and small-scale production can be easily performed. Therefore, there is no need to create expensive molds, and there are no restrictions on the materials used or the manufacturing method.

[0044] As described above, according to this embodiment, an insole that is easy to manufacture and a second insole that is highly comfortable are combined, so that a comfortable insole-type electronic device can be manufactured easily.

[0045] The present invention has been described above by taking the above-mentioned embodiment as an exemplary example. However, the present invention is not limited to the above-mentioned embodiment. That is, the present invention can be applied in various aspects that can be understood by a person skilled in the art within the scope of the present invention.

[0046] A part or all of the above-described embodiments can be described as, but is not limited to, the following supplementary notes. (Appendix 1) A base body having a shape that envelops the rear of the heel of the foot along the side of the inner heel portion of the shoe; An electronic board integrally mounted on the base; 1. An electronic device comprising: (Appendix 2) The electronic substrate is a flexible housing. 2. The electronic device according to claim 1 . (Appendix 3) The electronic substrate is A module substrate is mounted on a flexible wiring board. 3. The electronic device according to claim 1 or 2. (Appendix 4) The substrate is It is bag-shaped with an opening, The electronic board is built into the base, The opening is sealed with a sealing agent. 4. The electronic device according to claim 1, (Appendix 5) Between the base and the electronic board, A protective material is included 5. The electronic device according to claim 4. (Appendix 6) The protective member is at least one high-strength film having insulating properties and abrasion resistance. 6. The electronic device according to claim 5, (Appendix 7) The protective member is Filler made of insulating lubricant or gel material 6. The electronic device according to claim 5, (Appendix 8) The electronic substrate is Has location information acquisition function and communication function 8. An electronic device according to any one of claims 1 to 7. (Appendix 9) The electronic substrate has a pattern antenna made of a conductive foil. 9. The electronic device according to claim 8, (Appendix 10) The electronic device according to any one of claims 1 to 9; an insole coupled to the electronic device; 1. An insole-type electronic device comprising: (Appendix 11) The insole has an electronic component separate from the electronic device inside. 11. The insole-type electronic device according to claim 10. (Appendix 12) The electronic component is electrically connected to the electronic device. 12. The insole-type electronic device according to claim 11. (Appendix 13) An electronic device according to any one of Supplementary Notes 1 to 9 or an insole-type electronic device according to any one of Supplementary Notes 10 to 12; a position monitoring device that monitors position information of the electronic device or the insole type electronic device, The electronic device or the insole type electronic device has a function of acquiring location information and a function of transmitting the location information, The location information monitoring device receives the location information. A monitoring system characterized by the above. (Appendix 14) A horseshoe-shaped base that wraps around the back of the heel of the foot along the inside of the inner heel of the shoe, Mounting the electronic board 2. A method for manufacturing an electronic device comprising the steps of: (Appendix 15) The electronic substrate is a flexible housing. 15. A method for manufacturing an electronic device according to claim 14, (Appendix 16) The electronic substrate is A module substrate is mounted on a flexible wiring board. 16. A method for manufacturing an electronic device according to claim 14 or 15. (Appendix 17) The housing, It is bag-shaped with an opening, The electronic board is built into the housing, The opening is sealed with a sealant. 16. A method for manufacturing an electronic device according to any one of claims 14 to 15. (Appendix 18) Between the housing and the electronic board, Use a protective member 18. A method for manufacturing an electronic device according to claim 17, (Appendix 19) The protective member is a high-strength film having insulating properties and abrasion resistance, and is layered in at least one layer. 19. A method for manufacturing an electronic device according to claim 18, (Appendix 20) The protective member is Filler made of insulating lubricant or gel material 19. A method for manufacturing an electronic device according to claim 18, (Appendix 21) The insole is A recess for accommodating the electronic component 13. The insole-type electronic device according to claim 11 or 12. (Appendix 22) The recessed portion is Located on at least one of the arch and heel portions of the insole. 22. The insole-type electronic device according to claim 21 . (Appendix 23) A plate-shaped base plate is provided to support the heel portion of the insole from below. 23. The insole-type electronic device according to claim 21 or 22. (Appendix 24) At least a portion of the electronic component is The base plate is integrally disposed 24. The insole-type electronic device according to claim 23. (Appendix 25) A second insole is disposed above the insole. 25. An insole-type electronic device according to any one of appendices 21 to 24. [Explanation of symbols]

[0047] 1 Base 2, 200, 2200 Electronic board 10, 1000, 2000, 2500 electronic equipment 20 Shoes 30 feet 40 beds 100, 2100 case 110, 2120 Substrate storage area 120, 2110 Board insertion port 210 FPC 220 Module Board 230 battery 2300 Protective materials 3000 Dispense Nozzle 3100 Sealant 3200 Filler 4000, 4100 Insoles 4110, 4120 Storage space 4200 Base Plate 5000, 5100, 5101 Insole-type electronic devices

Claims

1. A horseshoe-shaped base body that envelops the rear of the heel of the foot along the side of the inner heel part of the shoe; An electronic board integrally mounted on the base; having The base body is a flexible heel-cup shaped housing, the housing has a slit-shaped board insertion opening on an upper surface of the housing along the side of the inner heel portion of the shoe, and is bag-shaped so that the electronic board can be inserted into the housing through the board insertion opening; the board insertion opening is sealed with a sealing agent when the electronic board is inserted into the housing; 1. An electronic device comprising:

2. The electronic substrate is A module substrate is mounted on a flexible wiring board.

2. The electronic device according to claim 1 .

3. Between the housing and the electronic board, A protective material is included 3. The electronic device according to claim 1, wherein the first and second electrodes are electrically connected to the first and second electrodes.

4. The protective member is at least one high-strength film having insulating properties and abrasion resistance.

4. The electronic device according to claim 3.

5. The protective member is Filler made of insulating lubricant or gel material 4. The electronic device according to claim 3.

6. The electronic substrate is Has location information acquisition function and communication function 6. The electronic device according to claim 1, wherein the first and second electrodes are electrically connected to the first and second electrodes.

7. The electronic device according to claim 1 , an insole coupled to the electronic device; 1. An insole-type electronic device comprising:

8. The insole is Has a recess for accommodating electronic components 8. The insole type electronic device according to claim 7.

9. The recessed portion is Located on at least one of the arch and heel portions of the insole.

9. The insole type electronic device according to claim 8.

10. A plate-shaped base plate is provided to support the heel portion of the insole from below.

10. The insole type electronic device according to claim 8 or 9.

11. At least a portion of the electronic component is The base plate is integrally disposed The insole type electronic device according to claim 10 .

12. A second insole is disposed above the insole.

12. The insole type electronic device according to claim 7, wherein the insole type electronic device is a device that is adapted to receive a wearer's body.

13. The electronic device according to any one of claims 1 to 6 or the insole-type electronic device according to any one of claims 7 to 12, a position monitoring device that monitors position information of the electronic device or the insole type electronic device, The electronic device or the insole type electronic device has a function of acquiring location information and a function of transmitting the location information, The location monitoring device receives the location information. A monitoring system characterized by the above.

Images