Localized purge module for substrate handling - Patents.com

Abstract

A substrate handling robot includes an end effector for supporting a substrate and an arm coupled to the end effector for translating the end effector between an extended position and a retracted position. The substrate handling robot also includes an enclosure for at least partially enclosing the substrate when the end effector is in the retracted position and the substrate is on the end effector. The enclosure includes a shower for supplying a flow of purge gas to the substrate.

Description

[Technical field]

[0001] TECHNICAL FIELD This disclosure relates to substrate handling (eg, semiconductor wafer handling), and more particularly to gas purging in substrate handling systems. [Background technology]

[0002] [Related Applications] This application claims priority to U.S. Provisional Patent Application No. 63 / 037008, filed June 10, 2020, the entire contents of which are incorporated by reference for any purpose.

[0003] Tools for preparing or inspecting substrates (e.g., semiconductor wafers) may include an equipment front-end module. The equipment front-end module may include a robot that may be used to move substrates between various stations within the tool. The equipment front-end module may be purged with a purge gas (e.g., nitrogen) to provide a suitable environment for substrates handled by the robot. For example, purging may be performed to remove oxygen from the equipment front-end module.

[0004] Traditionally, the entire tool front-end module has been purged. However, such purging is expensive because it uses large purge gas flows. Purging the entire tool front-end module does not provide precise environmental control near the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2003-092335 A [Patent Document 2] JP 2009-023021 A Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, there is a need for improved systems and methods for performing gas purging on substrates handled by robots. [Means for solving the problem]

[0007] In certain embodiments, a substrate handling robot includes an end effector that supports a substrate and an arm coupled to the end effector that translates the end effector between an extended position and a retracted position. The substrate handling robot also includes an enclosure that at least partially encloses the substrate when the end effector is in the retracted position and the substrate is on the end effector. The enclosure includes a shower that provides a flow of purge gas to the substrate.

[0008] In certain embodiments, the method includes loading a substrate onto an end effector coupled to the arm when the arm is in an extended position, retracting the arm to a retracted position when the substrate is loaded onto the end effector, at least partially enclosing the substrate in an enclosure with a shower while the arm is retracted, and providing a flow of purge gas to the substrate via the shower while the substrate is at least partially enclosed in the enclosure.

[0009] For a better understanding of the various implementations described, reference should be made to the detailed description below in conjunction with the following drawings. [Brief description of the drawings]

[0010] [Figure 1A] FIG. 1 illustrates a perspective view of a substrate handling robot according to certain embodiments, with a substrate on its end effector in a retracted position. [Figure 1B] FIG. 1B illustrates a perspective view of the substrate handling robot of FIG. 1A with a substrate on the end effector in an extended position according to certain embodiments. [Figure 1C]1C is a longitudinal cross-sectional view of the substrate handling robot of FIGS. 1A and 1B with a substrate on the end effector in a retracted position according to certain embodiments. [Diagram 2] FIG. 1 illustrates a perspective view of an enclosure according to certain embodiments. [Diagram 3] 1 is a flow chart illustrating a method of substrate handling according to certain embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Like reference characters indicate corresponding parts throughout the drawings and specification.

[0012] Reference will now be made in detail to various embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a consistent understanding of the various embodiments described. However, it will be apparent to those skilled in the art that the various embodiments described may be practiced without such specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

[0013] 1A-1C show a substrate handling robot 100 according to certain embodiments. FIGS. 1A and 1B are perspective views of the substrate handling robot 100, and FIG. 1C is a longitudinal cross-sectional view of the substrate handling robot 100. The substrate handling robot 100 has a rotatable platform 102 (e.g., a rotatable box, also called a robot box, or R-box for short) that can be rotated around an axis 128 (e.g., a central axis) (in FIG. 1C) along a circle 104. For example, the rotatable platform 102 can be rotated a full 360°. The rotatable platform 102 can also be capable of other movements. For example, the rotatable platform 102 can be raised, lowered, and / or laterally translated along a particular direction. The rotatable platform 102 can be provided with an axle 126 by which the rotation can be performed.

[0014] Mounted on the pivotable platform 102 is an arm 106 and an end effector 112. The end effector 112 is coupled (e.g., rigidly connected) to and extends beyond the end of the arm 106 and is capable of supporting a substrate 116. The end effector 112 is coupled to the pivotable platform 102 by the arm 106, which has a rear portion 108 and a front portion 110, i.e., the end effector extends beyond the end of the front portion 110 of the arm 106. In some embodiments, the substrate 116 is a semiconductor wafer. In some embodiments, the end effector 112 is a fork (e.g., having two prongs) that supports the substrate 116 (e.g., a semiconductor wafer).

[0015] The arm 106 is translatably coupled to the pivotable platform 102 such that it can be moved back and forth along the pivotable platform 102 to translate the end effector 112 and substrate 116 back and forth between extended and retracted positions. The end effector 112 and substrate 116 are shown in a retracted position in FIGS. 1A and 1C and in an extended (i.e., extended) position in FIG. 1B. In some embodiments, the arm 106 is translatable radially relative to the pivotable platform 102 (e.g., about an axis 128 in FIG. 1C) to translate the end effector 112 and substrate 116 between the extended and retracted positions. For example, the arm 106 is translatable along a direction substantially parallel (e.g., within manufacturing tolerances) to the side of the pivotable platform 102. 1B, the end effector 112 and substrate 116 may be translated to an extended position by extending the arm 106 past the end 118 of the pivotable platform 102. The end effector 112 and substrate 116 may be positioned past the end 118 of the pivotable platform 102 in the extended position and above the pivotable platform 102 (e.g., above the end 118) in the retracted position. The arm 106 may be extended past the end 118 of the pivotable platform 102 when the end effector 112 and substrate 116 are in the extended position, but not when the end effector 112 and substrate 116 are in the retracted position. The arm 106 may be positioned above the pivotable platform 102 when the end effector 112 and substrate 116 are in the retracted position. A motor may be provided on the pivotable platform 102 (eg, within a box of the pivotable platform 102 ) to move the arm 106 and thereby translate the end effector 112 and substrate 116 .

[0016] The enclosure 114 at least partially encloses the substrate 116 when in the retracted position (i.e., when the end effector 112 is in the retracted position and has the substrate 116 loaded thereon). In some embodiments, the enclosure 114 is coupled (e.g., rigidly connected) to the pivotable platform 102 (e.g., at or near the end 118). In other embodiments, the enclosure 114 does not enclose the pivotable platform 102. As the pivotable platform 102 rotates, the enclosure 114 rotates with the arm 106 and the end effector 112. The location of the enclosure 114 can be at a fixed location on the pivotable platform 102 (e.g., at or near the end 118). In some embodiments, the top of the enclosure 114 covers the substrate 116 and / or the side walls of the enclosure 114 surround each side of the substrate 116 when the substrate 116 is in the retracted position. (The top of the enclosure 114 is shown without fill in FIGS. 1A and 1B to reveal the underlying structure.) The enclosure 114 does not cover or surround the entire arm 106 when the substrate is in the retracted position, but may or may not surround a portion of the arm 106 (e.g., the end of the front portion 110) depending on the embodiment. The enclosure 114 may have a side opening (e.g., parallel to the end 118 of the pivotable platform 102) through which the substrate 116, the end effector 112, and a portion of the arm 106 pass during translation from the retracted position to the extended position.

[0017] The enclosure 114 includes a shower for providing a flow of purge gas 124 to the substrate. In some embodiments, the purge gas 124 is nitrogen (N2). In some embodiments, the shower includes one or more porous surfaces through which the purge gas 124 flows. For example, an upper inner surface 122 (FIG. 1C) of the enclosure 114, or a portion thereof, is made porous. The inner surface 122 is positioned against the surface of the substrate 116 when the substrate 116 is loaded onto the end effector 112 and the end effector 112 and the substrate 116 are in a retracted position. The purge gas 124 flows through the inner surface 122 (i.e., through holes in the inner surface 122) and onto the surface of the substrate 116.

[0018] Additionally, the shower may have a chamber 120 that is in the top of the enclosure 114. The chamber 120 is bounded by surfaces including an inner surface 122, an outer surface of the top of the enclosure 114, and a side surface of the top of the enclosure 114. A purge gas 124 is provided to the chamber 120 and flows from there through the inner surface 122. In some embodiments, the purge gas 124 is provided to the chamber 120 by one or more tubes 130 (FIG. 1C). The one or more tubes 130 may extend through a box in the rotatable platform 102. (The cross section in FIG. 1C does not show a rotatable platform 102-enclosure 114 connection for the one or more tubes 130. One example of such a connection is an elbow 218, which is discussed below in connection with FIG. 2.)

[0019] Depending on the embodiment, the enclosure 114 is not hermetically sealed. For example, the enclosure 114 may have a side opening through which the substrate 116, the end effector 112, and a portion of the arm 106 pass and through which the purge gas 124 may flow. The flow of purge gas 124 provided by the shower may be continuous. For example, the flow of purge gas 124 may be continuous while the end effector 112 and substrate 116 are in the retracted position, or may continue when the end effector 112 and substrate 116 are not in the retracted position.

[0020] FIG. 2 is a perspective view of an enclosure 200 according to certain embodiments. The enclosure 200 is an example of the enclosure 114 (FIGS. 1A-1C). A top portion 202 of the enclosure 200 includes a chamber 204, which is an example of the chamber 120 (FIG. 1C). An inner surface 206 of the top portion 202 is an example of the inner surface 122 (FIG. 1C) and includes a porous surface 208. The porous surface 208 is positioned against a surface of the substrate 116 when the substrate 116 is loaded onto the end effector 112 and the end effector 112 and substrate 116 are in a retracted position. A purge gas 124 is passed from the chamber 204 through the porous surface 208 and onto the surface of the substrate 116 (FIGS. 1A-1C).

[0021] The enclosure 200 further includes side walls 210 that are connected to (e.g., form part of) the top 202 of the enclosure 200. In some embodiments, respective portions of the side walls 210 are side surfaces of the chamber 204. The side walls 210 are connected to brackets 214 that connect the enclosure 200 to the pivotable platform 102 (FIGS. 1A-1C). For example, the brackets 214 may be connected to respective sides of the box of the pivotable platform 102 by inserting connectors (e.g., screws, bolts, etc.) through holes 216 in the brackets 214. The brackets 214 may be connected to the side walls 210 by surfaces 212 that may slope downwardly and inwardly from the side walls 210 to the brackets 214. The substrate 116 on the end effector 112 may be inserted into the enclosure 200 (e.g., retracted into the enclosure 200 by the arm 106 of FIGS. 1A-1C) into the space between one side with the inner surface 206 (e.g., where the porous surface 208 is) and another side with the surface 212 and the top of the pivotable platform 102. The end effector 112, with the substrate 116 loaded thereon, may also be received within this space when in the retracted position.

[0022] In some embodiments, one or both of the sidewalls 210 may have an interior surface that may be fully or partially porous. Such a porous surface may be used to deliver a flow of purge gas 124 to the substrate 116, either in place of or in addition to the porous surface 208. The porous surface 208 may be absent. The purge gas 124 may be delivered to the porous surface of the sidewalls 210 via the chamber 204.

[0023] In some embodiments, an elbow 218 is connected to the enclosure 200 (e.g., the top 202 thereof) and is connectable to the pivotable platform 102 (e.g., the box of the pivotable platform 102). The elbow 218 provides a passageway for one or more tubes 130 (FIG. 1C) that supply the purge gas 124 to the chamber 204. The one or more tubes 130 may extend through the elbow 218. For example, the one or more tubes 130 may extend through the box of the pivotable platform 102, through the elbow 218, and into the chamber 204.

[0024] Figure 3 is a flow chart illustrating a substrate handling method 300 according to certain embodiments. In the method 300, a substrate (e.g., substrate 116 in Figures 1A-1C) is loaded (302) onto an end effector (e.g., end effector 112 in Figures 1A-1C) coupled to an arm (e.g., arm 106 in Figures 1A-1C) when the arm is in an extended position (e.g., the position shown in Figure 1B). In some embodiments, the substrate is a semiconductor wafer and the end effector includes a fork, and the semiconductor wafer is picked up (304) by the fork.

[0025] Once the substrate is loaded onto the end effector, the arm is retracted (306) to a retracted position. In the retracted position, the substrate is at least partially enclosed within an enclosure (e.g., enclosure 114 in FIGS. 1A-1C; enclosure 200 in FIG. 2) having a shower. In some embodiments, the shower is provided with a porous surface (308). For example, the porous surface is provided on an inner surface (e.g., porous surface 208 in FIG. 2) of a top (e.g., top 202 in FIG. 2) of the enclosure. A surface of the substrate is positioned against the inner surface (310). For example, the porous surface is provided on an inner surface of a side wall (e.g., side wall 210 in FIG. 2) of the enclosure. The substrate is positioned adjacent to the inner surface (312).

[0026] Once the substrate is at least partially enclosed within the enclosure, a flow of purge gas (e.g., purge gas 124 in FIG. 1C) is provided to the substrate via a shower (314). For example, the purge gas flow is provided continuously. In some embodiments, the purge gas flow is provided by causing the purge gas to flow through a porous surface (316). For example, the purge gas is provided via one or more tubes (e.g., one or more tubes 130 in FIGS. 1C and 2) to a chamber (e.g., chamber 120 in FIG. 1C; chamber 204 in FIG. 2) that is surrounded by surfaces that include a porous surface (e.g., surfaces that include an inner surface that is entirely or partially a part of the inner surface). The purge gas flows from the chamber through the porous surface and onto the substrate.

[0027] In some embodiments, the arm and enclosure are mounted on a pivotable platform (e.g., pivotable platform 102 in FIGS. 1A-1C). In the method 300, a purge gas flow may be provided to the substrate via a shower while the pivotable platform is pivoting. For example, a substrate is loaded onto an end effector when the pivotable platform is in a first position (302). The pivotable platform is pivoted from the first position to a second position (320). The purge gas flow is provided to the substrate via a shower while the pivotable platform is pivoting. Once the pivotable platform is in the second position, the substrate is moved to a station (322). When the substrate is moved to the station, the arm is extended from a retracted position to an extended position to remove the substrate from the enclosure. The station may be a second station corresponding to the second position. The method 300 may move the substrate from a first station corresponding to the first pose to a second station corresponding to the first pose. For example, the substrate may be picked up from the first station in operations 302 and 306.

[0028] In some embodiments, the rotatable platform includes a box through which one or more tubes that supply purge gas to the shower extend (e.g., as shown in FIG. 1C). For example, the tube or tubes may extend through the box and through an elbow (e.g., elbow 218 in FIG. 2) that connects the rotatable platform to the enclosure.

[0029] The method 300 may include fewer or more operations than those illustrated in Figure 3. The performance of multiple operations may overlap, or multiple operations may be combined into a single operation.

[0030] The enclosure 114 (of FIGS. 1A-1C) (e.g., enclosure 200 in FIG. 2) acts as a localized purge module. The enclosure 114 and method 300 allow the purge to be localized and therefore precise with respect to the substrate. This localized purge also uses a relatively small purge gas flow, e.g., compared to the gas flow used to purge the entire equipment front-end module, including the wafer handler robot. Additionally, in some embodiments, a costly and complex full robot enclosure is avoided.

[0031] The above description is for illustrative purposes and has been described with reference to specific embodiments. However, the illustrative discussion above is not intended to be exhaustive or to restrict the scope of the claims to the precise forms disclosed. Many modifications and variations are possible in light of the teachings above. The embodiments have been selected in order to best explain the principles underlying the claims and their practical application, and thus to enable others skilled in the art to best utilize various modifications of the embodiments as appropriate for the specific use envisioned.

Claims

1. 1. A substrate handling robot, comprising: an end effector for supporting the substrate; an arm coupled to the end effector for translating the end effector between an extended position and a retracted position; a pivotable platform on which the arm is mounted; an enclosure mounted on the rotatable platform for at least partially enclosing the substrate when the end effector is in the retracted position and the substrate is on the end effector, the enclosure including a shower for providing a flow of purge gas to the substrate; Equipped with the shower comprises a porous surface through which the purge gas flows; a first side wall of the enclosure having an inner surface with the porous surface thereon; the porous surface is a first porous surface, the shower further comprising a second porous surface through which the purge gas flows; a second side wall of the enclosure having an inner surface; and The second side wall has an inner surface including the second porous surface. robot.

2. The robot according to claim 1 , the arm is radially translatable relative to the pivotable platform to translate the end effector between the extended position and the retracted position; and The robot, wherein the enclosure has a fixed location on the pivoting platform.

3. The robot according to claim 2, the enclosure is rigidly connected to the pivotable platform; and A robot in which the arm is extendable beyond the end of the pivotable platform and the end effector can be translated to the extended position.

4. The robot according to claim 1 , The robot, wherein the inner surface is positioned to face a surface of the substrate when the end effector is in the retracted position and the substrate is on the end effector.

5. 5. The robot of claim 4, wherein the shower further comprises a chamber in the upper portion of the enclosure, the chamber being bounded by surfaces including the interior surface.

6. 6. The robot of claim 5, further comprising one or more tubes for supplying the purge gas to the chamber.

7. The robot according to claim 6, further comprising: the pivotable platform comprising a box on which the arm and the enclosure are mounted; The robot further comprises: An elbow connecting the box and the enclosure; wherein the one or more tubes extend through the box and through the elbow.

8. 5. The robot of claim 4, wherein the enclosure further comprises: a sidewall connected to the top of the enclosure; a bracket coupled to the side wall and connecting the enclosure to the pivotable platform; A robot equipped with

9. The robot according to claim 1 , the substrate is a semiconductor wafer; and The robot, wherein the end effector comprises a fork that holds the semiconductor wafer.

10. 1. A method comprising: loading a substrate onto an end effector coupled to the arm when the arm is in an extended position, the arm being mounted on a pivotable platform; retracting the arm to a retracted position when the substrate is loaded onto the end effector, and at least partially enclosing the substrate within an enclosure having a shower when the arm is retracted, the enclosure being mounted on the pivotable platform; and rotating the pivotable platform while the substrate is at least partially enclosed within the enclosure and providing a flow of purge gas to the substrate through the shower; the loading is performed when the rotatable platform is in a first position; The pivoting includes pivoting the pivotable platform from the first position to a second position; providing the flow of purge gas to the substrate via the shower includes providing a flow of purge gas while the rotatable platform is rotating; and moving the substrate to a station while the pivotable platform is in the second orientation, thereby extending the arm from the retracted position to the extended position, and removing the substrate from the enclosure while the arm is further extended. method.

11. 11. The method of claim 10, the shower comprises a porous surface; and The method includes causing the purge gas to flow through the porous surface when the purge gas flow is provided through the shower.

12. 12. The method of claim 11, the enclosure has a top inner surface with the porous surface; and The method further comprises enclosing the substrate within the enclosure and positioning a surface of the substrate against the interior surface.

13. 13. The method of claim 12, the shower further comprises a chamber in the upper portion of the enclosure, the chamber being bounded by surfaces including the inner surface; and The method includes providing the flow of purge gas through one or more tubes to the chamber.

14. 14. The method of claim 13, The pivotable platform includes: A box, One or more tubes extending within the box; wherein the rotating comprises rotating the rotatable platform while supplying the flow of purge gas through the shower to the substrate.

15. 12. The method of claim 11, a first side wall of the enclosure having an inner surface with the porous surface thereon; and The method further comprises: positioning the substrate adjacent to the interior surface while enclosing the substrate within the enclosure.

16. 11. The method of claim 10, the substrate is a semiconductor wafer; the end effector comprises a fork; and The method includes picking up the semiconductor wafer with the forks while loading the substrate onto the end effector.

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