Microphone Chip and Microphone

Abstract

The present application relates to a microphone chip and a microphone. [Solution] The microphone chip includes a diaphragm and a back plate, the diaphragm is provided with a plurality of pleats, a protrusion is provided on the side of the back plate adjacent to the diaphragm, and along the direction perpendicular to the back plate, the outer contour of the projection of the protrusion on the diaphragm does not intersect with the outer contour of the pleats. An electrode sheet is provided on the side of the back plate adjacent to the diaphragm, and an electrode is also provided on the side of the diaphragm adjacent to the back plate, so that the electrode sheet and the diaphragm form a capacitor system, a sound hole is provided on the back plate, and when sound waves pass through the sound hole to drive the diaphragm to vibrate, the distance between the electrode sheet and the diaphragm changes, and the capacitance value of the capacitor system changes, thereby converting the sound wave signal into an electrical signal. Along the direction perpendicular to the back plate, the outer contour of the projection of the protrusion on the diaphragm does not intersect with the outer contour of the pleats. This prevents the protrusion from contacting and locking with the side wall of the pleats in the process of external vibration or excessive air blowing, etc., causing the diaphragm and the back plate to stick together, which affects the normal operation of the microphone chip.

Description

[Technical field]

[0001] The present invention relates to the field of microphone technology, in particular to microphone chips and microphones. [Background technology]

[0002] A conventional microphone chip generally includes a back plate, a diaphragm, and a base, both of which are fixed to the base. The diaphragm has pleats to reduce the rigidity of the diaphragm, and the back plate has protrusions to prevent the diaphragm from adhering to the back plate. Some of the protrusions correspond to the edges of the pleats, so that when the diaphragm is subjected to external vibration or excessive air blowing, the protrusions will be caught by the pleats, which will affect the operation of the microphone chip. Summary of the Invention [Problem to be solved by the invention]

[0003] The objective of the present application is to provide a microphone tip and a microphone, which solves the problem that the protrusions are easy to engage with the pleats of the diaphragm. [Means for solving the problem]

[0004] An embodiment of the present application provides a microphone chip, the microphone chip including a diaphragm and a backplate, the diaphragm having a plurality of pleats and a protrusion on a side of the backplate adjacent to the diaphragm, and along a direction perpendicular to the backplate, an outer contour of the projection of the protrusion on the diaphragm does not intersect with an outer contour of the pleats.

[0005] In a possible design, along a direction perpendicular to the backplate, the projections of the protrusions on the diaphragm lie between adjacent pleats.

[0006] In a possible design, along a direction perpendicular to the backplate, the pleats cover the projection of the protrusions on the diaphragm.

[0007] In a possible design, the width of the protrusion is D1, which satisfies condition (1). 0.1μm≦D1≦5μm (1)

[0008] In a possible design, the width of the pleat is D2, which satisfies condition (2). 1μm≦D2≦20μm (2)

[0009] In a possible design, the pleats are arranged along the circumference of the membrane, with the centres of the pleats overlapping with the centre of the membrane.

[0010] In a possible design, the pleats are circular or polygonal.

[0011] In a possible design, the protrusions are provided in a plurality of positions, the distance between adjacent protrusions is L, and conditional expression (3) is satisfied. 10μm≦L≦100μm (3)

[0012] In a possible design, the height of the protrusion is H, which satisfies condition (4). 0.1μm≦H≦5μm (4)

[0013] An embodiment of the present application provides a microphone, which includes a body and the microphone chip, the microphone chip being mounted on the body. Effect of the Invention

[0014] The beneficial effect of the present invention is that along the direction perpendicular to the back plate, the outer contour of the projection of the protrusion on the diaphragm does not intersect with the outer contour of the pleat. This prevents the protrusion from contacting and locking with the side wall of the pleat in the process of external vibration or excessive air blowing, etc., causing the diaphragm and the back plate to stick together, which affects the normal operation of the microphone chip. Specifically, an electrode sheet is installed on the side of the back plate close to the diaphragm, and an electrode is also installed on the side of the diaphragm close to the back plate, so that the electrode sheet and the diaphragm form a capacitor system, and when a sound hole is installed on the back plate and sound waves drive the diaphragm to vibrate through the sound hole, the distance between the electrode sheet and the diaphragm changes, and the capacitance value of the capacitor system changes, thereby converting the sound wave signal into an electrical signal. In addition, the pleats of the diaphragm can reduce the rigidity of the diaphragm and improve the flexibility of the diaphragm, making the diaphragm more sensitive to the sound waves, thereby improving the probability that the microphone chip converts the sound wave signal into an electrical signal. [Brief description of the drawings]

[0015] It is to be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. [Figure 1] 1 is a structural schematic diagram of a specific embodiment of a microphone chip provided by the present application; [Diagram 2] FIG. 2 is a cross-sectional view of FIG. [Diagram 3] FIG. 3 is a partial enlarged view of region A in FIG. [Figure 4] FIG. 2 is a top view of the microphone chip in FIG. 1 excluding the back plate and electrode sheet.

[0016] The drawings herein are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application, and together with the description serve to explain the principles of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] In order to better understand the technical solution of the present application, the following describes in detail the embodiments of the present application with reference to the accompanying drawings.

[0018] It is clear that the described embodiments are only some of the embodiments of the present application, and are not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0019] The terms used in the examples of this application are intended to describe particular examples only and are not intended to limit the present application. As used in the examples of this application and the appended claims, the singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly dictates otherwise.

[0020] It should be understood that the term "and / or" used in this specification only describes the related relationship of related objects, and there may be three kinds of relationships, for example, A and / or B can represent the following relationship, and there are three kinds of situations: A exists alone, A and B exist simultaneously, and B exists alone. Note that the sign " / " here generally means that the preceding and following related objects are in an "or" relationship.

[0021] In addition, terms indicating directions such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described from the angle shown in the drawings, and should not be construed as limiting the embodiments of the present application. Furthermore, in this context, when an element is described as being connected "upper" or "lower" to another element, it should be understood that it may not only be directly connected "upper" or "lower" to the other element, but may also be indirectly connected "upper" or "lower" to the other element through an intermediate element.

[0022] The present application provides a microphone chip, which solves the problem that protrusions are easily engaged with pleats in a diaphragm. As shown in Fig. 1 to Fig. 4, the microphone chip includes a diaphragm 4 and a back plate 1, a plurality of pleats 41 are provided on the diaphragm 4, and a protrusion 3 is provided on the side of the back plate 1 close to the diaphragm 4, and the outer contour of the projection of the protrusion 3 on the diaphragm 4 does not intersect with the outer contour of the pleats 41 along a direction perpendicular to the back plate 1.

[0023] In this embodiment, as shown in Figures 3 and 4, the outer contour of the projection 3 projected onto the vibration membrane 4 does not intersect with the outer contour of the pleats 41 along the direction perpendicular to the back plate 1. This prevents the projection 3 from intersecting with the pleats 41 in the process of external vibration or excessive air blowing. 41 1, the diaphragm 4 and the back plate 1 are in contact with each other and locked, so as to prevent the diaphragm 4 and the back plate 1 from being stuck together and affecting the normal operation of the microphone chip.

[0024] Specifically, the electrode sheet 2 is installed on the side of the back plate 1 close to the diaphragm 4, and an electrode is also installed on the side of the diaphragm 4 close to the back plate 1, so that the electrode sheet 2 and the diaphragm 4 form a capacitor system. When a sound hole 11 is installed on the back plate 1 and a sound wave passes through the sound hole 11 to drive the diaphragm 4 to vibrate, the distance between the electrode sheet 2 and the diaphragm 4 changes, and the capacitance value of the capacitor system changes, thereby converting the sound wave signal into an electrical signal. In addition, the pleats 41 of the diaphragm 4 can reduce the rigidity of the diaphragm 4 and improve the flexibility of the diaphragm 4, making the diaphragm 4 more sensitive to the sound waves, thereby improving the probability that the microphone chip converts the sound wave signal into an electrical signal.

[0025] In addition, the protrusion 3 may be integrally formed with the backplate 1, or may be connected to the backplate 1 by a method such as adhesion. The microphone chip further includes a base 5, to which the backplate 1 and the diaphragm 4 are both fixedly connected.

[0026] In a specific embodiment, as shown in FIG. 4, along a direction perpendicular to the backplate 1, the projections of the protrusions 3 on the diaphragm 4 are located between adjacent pleats 41.

[0027] In this embodiment, as shown in FIG. 4, when the projection of the protrusion 3 on the diaphragm 4 is located between adjacent pleats 41, the protrusion 3 is unlikely to come into contact with and become locked on the side wall of the pleat 41; on the other hand, the protrusion 3 can prevent the diaphragm 4 from coming into contact with the backplate 1, thereby ensuring the normal operation of the microphone chip.

[0028] In a specific embodiment, along a direction perpendicular to the backplate 1 , the pleats 41 cover the projection of the protrusions 3 on the diaphragm 4 .

[0029] In this embodiment, the pleats 41 cover the projection of the protrusion 3 on the diaphragm 4, i.e., the projection of the protrusion 3 on the diaphragm 4 completely overlaps with the bottom wall of the pleats 41, so that the protrusion 3 will not come into contact with the side wall of the pleats 41 in the process of external vibration or excessive air blowing, etc. This prevents the protrusion 3 from being locked with the pleats 41, and further ensures the reliability of the operation of the microphone chip.

[0030] In a specific embodiment, the width D1 of the protrusion 3 satisfies 0.1 μm≦D1≦5 μm, as shown in Fig. 4. For example, D1 may be specifically 0.1 μm, 1 μm, 2 μm, 3 μm, 5 μm, etc.

[0031] In this embodiment, as shown in Fig. 4, the width D1 of the protrusion 3 should not be too large or too small. If the width D1 of the protrusion 3 is too large (e.g., larger than 5 µm), the protrusion 3 reduces the spatial range in which the diaphragm 4 can move, affecting the operation of the microphone chip. If the width D1 of the protrusion 3 is too small (e.g., smaller than 0.1 µm), the area in which the protrusion 3 can contact the diaphragm 4 is too small, and the diaphragm 4and the electrode sheet 2 on the back plate 1 cannot be effectively prevented from contacting each other, which will cause a short circuit and further affect the operation of the microphone chip. Therefore, only when the width D1 of the protrusion 3 satisfies 0.1 μm≦D1≦5 μm, it is possible to ensure a large movement range for the diaphragm 4 and at the same time effectively prevent the diaphragm 4 from contacting the electrode sheet 2 on the back plate 1.

[0032] In a specific embodiment, the width D2 of the pleat 41 satisfies 1 μm≦D2≦20 μm, as shown in Fig. 4. For example, D2 may be specifically 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, etc.

[0033] In this embodiment, as shown in FIG. 4, the width D2 of the pleats 41 should not be too large or too small. If the width D2 of the pleats 41 is too large (e.g., larger than 20 μm), the rigidity of the pleats 41 with respect to the diaphragm 4 is excessively reduced, the diaphragm 4 is too soft, and the amplitude of the movement of the diaphragm 4 is too large under the action of sound waves, and the number of times of contact with the protrusions 3 is too large, which affects the probability of the microphone chip converting the sound wave signal into an electric signal. If the width D2 of the pleats 41 is too small (e.g., smaller than 1 μm), the rigidity of the diaphragm 4 is large, and the amplitude of the movement of the diaphragm 4 is too small under the action of sound waves, which affects the probability of the microphone chip converting the sound wave signal into an electric signal. Therefore, only when the width D2 of the pleats 41 satisfies 1 μm≦D2≦20 μm, it can be guaranteed that the range of movement of the diaphragm 4 is just right to convert the sound wave signal into an electric signal under the action of sound waves.

[0034] In a specific embodiment, as shown in FIG. 4, the pleats 41 are arranged along the circumferential direction of the diaphragm 4, and the centers of the pleats 41 overlap with the center of the diaphragm 4.

[0035] In this embodiment, as shown in FIG. 4, multiple pleats 41 are arranged along the circumferential direction of the vibrating membrane 4, and the centers of the multiple pleats 41 overlap with the center of the vibrating membrane 4, thereby approximating the rigidity at different positions on the vibrating membrane 4 and approximating the displacement of the vibrating membrane 4 moving at different positions due to the action of sound waves, so that the microphone chip can effectively convert the sound wave signal into an electrical signal.

[0036] In a specific embodiment, as shown in FIG. 4, the pleats 41 are circular or polygonal.

[0037] In this embodiment, as shown in Fig. 4, the pleats 41 can be formed in a circular shape, a polygonal shape, etc. Specifically, when the shape of the diaphragm 4 is circular, the pleats 41 can be formed in a circular shape, so that more pleats 41 can be formed on the diaphragm 4, and at the same time, the movement of the diaphragm 4 under the action of sound waves is more symmetrical. Similarly, when the diaphragm 4 is a regular hexagon, the pleats 41 can be formed in a regular hexagon or a circle.

[0038] 4, a plurality of protrusions 3 are provided, and the distance L between adjacent protrusions 3 satisfies 10 μm≦L≦100 μm. For example, L may be specifically 10 μm, 30 μm, 60 μm, 80 μm, 100 μm, etc.

[0039] In this embodiment, as shown in FIG. 4, the distance L between adjacent protrusions 3 should not be too large or too small. If the distance L between adjacent protrusions 3 is too large (e.g., larger than 100 μm), the protrusions 3 cannot effectively prevent the contact between the diaphragm 4 and the electrode sheet 2 on the back plate 1, thereby causing a short circuit and affecting the operation of the microphone chip. If the distance L between adjacent protrusions 3 is too small (e.g., smaller than 10 μm), the protrusions 3 will reduce the spatial range in which the diaphragm 4 can move, affecting the operation of the microphone chip. Therefore, the distance L between adjacent protrusions 3 only needs to satisfy 10 μm≦L≦100 μm to ensure that the diaphragm 4 has a large movement space, and at the same time, it can effectively prevent the diaphragm 4 from contacting the electrode sheet 2 on the back plate 1.

[0040] In a specific embodiment, the height H of the protrusion 3 satisfies 0.1 μm≦H≦5 μm, as shown in Fig. 3. For example, H may be specifically 0.1 μm, 1 μm, 2 μm, 3 μm, 5 μm, etc.

[0041] In this embodiment, as shown in FIG. 3, the height H of the protrusion 3 should not be too large or too small. If the height H of the protrusion 3 is too large (e.g., larger than 5 μm), the protrusion 3 will reduce the spatial range in which the diaphragm 4 can move, affecting the operation of the microphone chip. If the height H of the protrusion 3 is too small (e.g., smaller than 0.1 μm), the protrusion 3 cannot effectively prevent the contact between the diaphragm 4 and the electrode sheet 2 on the back plate 1, which is likely to cause a short circuit, and further affecting the operation of the microphone chip. Therefore, only when the height H of the protrusion 3 satisfies 0.1 μm≦H≦5 μm, it can ensure that the diaphragm 4 has a large movement space and at the same time effectively prevent the diaphragm 4 from contacting the electrode sheet 2 on the back plate 1.

[0042] The embodiment of the present application provides a microphone, which includes a body and a microphone chip, and the microphone chip is installed in the body. In this embodiment, the microphone provided by the present application is installed in a microphone chip, which is more reliable in operation, less likely to be damaged, and provides a better user experience.

[0043] The above is merely an embodiment of the present invention, and those skilled in the art may make modifications without departing from the spirit of the present invention, all of which are within the scope of protection of the present invention.

[0044] 1-Backplate 11-Sound hole 2-Electrode sheet 3-protrusion 4-Vibrating membrane 41-Pleats 5-Base

Claims

1. 1. A microphone chip comprising: The device includes a vibration membrane (4) and a back plate (1), The diaphragm (4) is provided with a plurality of pleats (41), A plurality of protrusions (3) are provided on the side of the back plate (1) adjacent to the diaphragm (4), and along a direction perpendicular to the back plate (1), the outer contour of the projections (3) projected onto the diaphragm (4) does not intersect with the outer contour of the pleats (41); The plurality of protrusions (3) are arranged along the circumferential direction of the vibration membrane (4), A microphone chip characterized in that the pleats (41) are arranged along the circumferential direction of the diaphragm (4), and the centers of the pleats (41) overlap with the center of the diaphragm (4).

2. 2. The microphone chip of claim 1, characterized in that along a direction perpendicular to the backplate (1), the projections of the protrusions (3) on the diaphragm (4) are located between adjacent pleats (41).

3. 2. The microphone chip of claim 1, characterized in that along a direction perpendicular to the backplate (1), the pleats (41) cover the projection of the protrusions (3) on the diaphragm (4).

4. The microphone chip according to claim 1, characterized in that the protrusion (3) has a width D1 and satisfies the following conditional expression (1): 0.1 μm≦D1≦5 μm (1)

5. 2. The microphone chip of claim 1, wherein the width of the pleat (41) is D2 and satisfies the following conditional expression (2): 1 μm≦D2≦20 μm (2)

6. 2. A microphone tip as claimed in claim 1, characterized in that the pleats (41) are circular or polygonal.

7. The microphone chip according to any one of claims 1 to 6, characterized in that a plurality of the protrusions (3) are provided, the distance between adjacent protrusions (3) is L, and the following conditional formula (3) is satisfied: 10 μm≦L≦100 μm (3)

8. The microphone chip according to any one of claims 1 to 6, characterized in that the protrusion (3) has a height H and satisfies the following conditional expression (4). 0.1 μm≦H≦5 μm (4)

9. A microphone, A microphone comprising: a body; and the microphone chip according to claim 1 , the microphone chip being mounted on the body.

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