Robot for simultaneous substrate transfer

Abstract

An exemplary substrate processing system may include a transfer region housing defining a transfer region and including a substrate support and a transfer device. The transfer device may have a housing and include a central hub including a first shaft and a second shaft. The housing may be coupled to the second shaft and may define an interior housing region. The transfer device may include a plurality of arms equal to the number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled to the exterior of the housing. The transfer device may include a plurality of arm hubs disposed within the interior housing volume. Each arm hub of the plurality of arm hubs may be coupled to an arm of the plurality of arms via the housing. The arm hub may be coupled to the first shaft of the central hub.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 873,432, filed July 12, 2019, the contents of which are incorporated herein by reference in their entirety for all purposes.

[0002] This technology is related to the following applications, filed simultaneously on July 12, 2019, entitled: "ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER" (U.S. Provisional Application No. 62 / 873,400), "ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER" (U.S. Provisional Application No. 62 / 873,458), "ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER" (U.S. Provisional Application No. 62,873,480), "MULTI-LID STRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEMS" (U.S. Provisional Application No. 62 / 873,518), and "HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS" (U.S. Provisional Application No. 62 / 873,503), each of which is incorporated herein by reference in its entirety for all purposes.

[0003] Technical Field TECHNICAL FIELD The present technology relates to semiconductor processes and equipment, and more particularly, to substrate processing systems. [Background technology]

[0004] background Semiconductor processing systems often utilize cluster tools to integrate multiple process chambers. This configuration can facilitate the performance of several sequential processing operations without removing the substrate from the controlled processing environment, or can allow similar processes to be performed on multiple substrates at once in various chambers. These chambers can include, for example, degassing chambers, pre-treatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etch chambers, metrology chambers, and other chambers. The combination of chambers in the cluster tool, and the operating conditions and parameters under which these chambers are run, are selected to produce a particular structure using a particular processing recipe and process flow.

[0005] Cluster tools often process multiple substrates by passing the substrates sequentially through a series of chambers for processing operations. Process recipes and sequences are typically programmed into a microprocessor controller that directs, controls, and monitors the processing of each substrate through the cluster tool. Once an entire cassette of wafers has been successfully processed through the cluster tool, the cassette can be sent to yet another cluster tool or a stand-alone tool, such as a chemical mechanical polisher, for further processing.

[0006] Robots are typically used to transport wafers through the various processing and holding chambers. The time required for each process and processing operation directly impacts the throughput of substrates per unit time. The substrate throughput of a cluster tool can be directly related to the speed of the substrate processing robot located in the transfer chamber. As processing chamber configurations become more developed, traditional wafer transport systems can become inadequate.

[0007] Thus, there is a need for improved systems and methods that can be used to efficiently orient substrates within a cluster tool environment. These and other needs are addressed by current technology. Summary of the Invention

[0008] An exemplary substrate processing system may include a transfer region housing defining a transfer region. A sidewall of the transfer region housing may define a sealable access for providing and receiving a substrate. The system may include a plurality of substrate supports disposed within the transfer region. The system may also include a transfer apparatus. The transfer apparatus may include a central hub including a first shaft and a second shaft extending around and concentric with the first shaft. The central hub may have a housing disposed within the transfer region and coupled to the second shaft. The housing may define an interior housing region. The transfer apparatus may include a plurality of arms equal to the number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled around an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the interior housing region. Each arm hub of the plurality of arm hubs may be coupled to an arm of the plurality of arms via the housing. The arm hub may be coupled to the first shaft of the central hub.

[0009] In some embodiments, the plurality of substrate supports may include at least four substrate supports. The arm hubs may be distributed about a central axis of a central hub proximate a radial edge of the interior housing region. The arm hubs may be rotatable independently of a housing to which the plurality of arms are coupled. The first shaft may extend within the interior housing region. One or more linkages may couple each arm hub of the plurality of arm hubs with a first shaft within the interior housing region. Rotation of the first shaft may be configured to simultaneously rotate each arm hub of the plurality of arm hubs. Each arm hub may be characterized by a central axis that is radially offset from the central axis of the central hub, and rotation of each arm hub of the plurality of arm hubs may be configured to rotate a corresponding arm of the plurality of arms about the central axis of the associated arm hub. The one or more linkages may include one or more belts extending around each arm hub of the plurality of arm hubs and the first shaft. The one or more linkages may include a plurality of gears coupled between the first shaft and the plurality of arm hubs, and the one or more linkages may include a plurality of gears coupled between the first shaft and the plurality of arm hubs. Each substrate support of the plurality of substrate supports may include a set of lift pins accessible through the substrate support, and each set of lift pins may be characterized by a different vertical length than the other sets of lift pins. The central hub may be vertically translatable along a central axis of the central hub. The transfer apparatus may also include a third shaft and a plurality of aligners. Each aligner may be disposed proximate a distal end of an associated arm of the plurality of arms. Each aligner may be rotatable independently of the plurality of arms and the housing.

[0010] Some embodiments of the present technique may include a method of transferring a substrate. The method may include receiving a substrate on a first substrate support in a transfer region of a substrate processing system. The substrate processing system may include a transfer apparatus including a central hub having a first shaft and a second shaft extending around and concentric with the first shaft. The central hub has a housing. The transfer apparatus may include a plurality of arms, each arm of the plurality of arms being coupled around an exterior of the housing. The transfer apparatus may include a plurality of arm hubs, each arm hub of the plurality of arm hubs being coupled with an arm of the plurality of arms. The arm hub may be coupled with the first shaft of the central hub. The method may include engaging the substrate with an arm of the plurality of arms. The method may include rotating the first shaft in a first direction about a central axis of the central hub. The method may include rotating the second shaft in a second direction about the central axis of the central hub. The method may include co-rotating the first shaft and the second shaft in a second direction about the central axis to reposition the substrate. The method may include delivering the substrate to a second substrate support of the substrate processing system.

[0011] In some embodiments, the method may include translating the transfer apparatus by further rotating the second shaft in a second direction about the central axis and rotating the first shaft in a first direction about the central axis. The method may include rotating the first shaft in a second direction about the central axis and rotating the second shaft in a first direction about the central axis. The method may then include engaging the substrate and lifting the substrate from the first substrate support by vertically translating the transfer apparatus in the transfer region. The method may then include engaging the substrate and retracting the first substrate support from the substrate. Each arm of the multiple arms may include an aligner rotatable independently of the arm. When the substrate is engaged by an arm of the multiple arms, the substrate may be seated on the aligner. The transfer region may include at least four substrates, and engaging the substrate may include engaging the at least four substrates individually or simultaneously with the arms of the multiple arms. The method can include detaching the at least four substrates, which can result in disposing the at least four substrates on associated substrate supports, either individually or simultaneously. The method can also include delivering the substrates to an alignment hub disposed between the first substrate support and the second substrate support, prior to delivering the substrates to the second substrate support.

[0012] Some embodiments of the present technology may also include a substrate processing system that may include a transfer region housing that defines a transfer region. A sidewall of the transfer region housing may define a sealable access for providing and receiving a substrate. The system may include a plurality of substrate supports disposed within the transfer region. The system may include a transfer device. The transfer device may include a central hub including a first shaft, a second shaft extending around the first shaft and extending concentrically with the first shaft, and a third shaft extending around the second shaft and extending concentrically with the second shaft. The central hub may have a housing disposed within the transfer region and coupled to the third shaft. The housing may define an interior housing region. The transfer device may include a plurality of arms, each arm of the plurality of arms coupled around an exterior of the housing at a proximal end of the arm. The transfer device may include a plurality of arm hubs disposed within the interior housing region, each arm hub of the plurality of arm hubs coupled to an arm of the plurality of arms via the housing. The arm hub may be coupled to the first shaft of the central hub. The transfer device may include a plurality of aligners, each aligner of the plurality of aligners coupled to an arm of the plurality of arms at a distal end of the arm. The transfer device may include a plurality of aligner hubs disposed within the interior housing region, each aligner hub of the plurality of aligner hubs being concentric with an arm hub of the plurality of arm hubs. Each aligner hub of the plurality of aligner hubs may be coupled to an aligner of the plurality of aligners via the housing. The aligner hubs may be coupled to the second shaft of the central hub.

[0013] Such techniques may provide many advantages over conventional systems and techniques. For example, the handling system may provide increased transfer speeds compared to conventional designs. Additionally, the handling system may accommodate a transfer region having multiple rows of substrates. These and other embodiments, along with many of their advantages and features, are described in more detail in conjunction with the following description and accompanying figures.

[0014] A further understanding of the nature and advantages of the disclosed techniques may be realized by reference to the remaining portions of the specification and the drawings. [Brief description of the drawings]

[0015] [Figure 1A] 1 shows a schematic top view of an exemplary processing system in accordance with some embodiments of the present technique. [Figure 1B] 1 shows a schematic partial cross-sectional view of an exemplary chamber system in accordance with some embodiments of the present technique. [Diagram 2] 1 shows a schematic perspective view of a transfer region of an exemplary chamber system in accordance with some embodiments of the present technique; [Figure 3A-3B] 3A and 3B show schematic cross-sectional views of an exemplary transfer device in accordance with some embodiments of the present technology. [Figure 3C] 1 illustrates a schematic top view of exemplary transfer device components, in accordance with some embodiments of the present technology; [Figure 3D] 1 illustrates a schematic top view of exemplary transfer device components, in accordance with some embodiments of the present technology; [Figure 4] 1 illustrates example operations in a method of transferring a substrate in accordance with some embodiments of the present technique. [Figure 5A-5B] 5A and 5B show schematic top views of a substrate being transferred in accordance with some embodiments of the present technique. [Fig. 5C-5D] 5E and 5F show schematic top views of a substrate being transferred according to some embodiments of the present technique. [Fig. 5E-5F] 5E and 5F show schematic top views of a substrate being transferred according to some embodiments of the present technique. [Fig. 5G-5H] 5E and 5F show schematic top views of a substrate being transferred according to some embodiments of the present technique. [Figure 6] 1 shows a schematic cross-sectional view of an exemplary transfer device in accordance with some embodiments of the present technology. [Figure 7] 1 depicts a schematic cross-sectional elevation view of a transfer section of an exemplary substrate processing system, in accordance with certain embodiments of the present technique; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Some of the figures are included as schematic diagrams. It is understood that these figures are for illustrative purposes and should not be considered to be to scale or to ratio unless specifically stated to be to scale or to ratio. Furthermore, as schematic diagrams, the drawings are provided to aid in understanding and may not include all aspects or information compared to a realistic depiction and may include material that is emphasized for illustrative purposes.

[0017] In the accompanying figures, similar components and / or features may have the same reference label. Furthermore, various components of the same kind may be distinguished by tracing the reference numbers with a letter that distinguishes the similar components. If only a first reference number is used in this specification, the description is applicable to any one of the similar components having the same first reference number, regardless of the letter.

[0018] Substrate processing may include time-consuming operations to add, remove, or otherwise modify material on a wafer or semiconductor substrate. Efficient movement of substrates may reduce queue times and increase substrate throughput. Additional chambers may be incorporated into the mainframe to improve the number of substrates processed within the cluster tool. Lengthening the tool allows for the continual addition of transfer robots and processing chambers, but as the footprint of the cluster tool expands, space inefficiencies may result. Thus, the present technology may include a cluster tool with an increased number of processing chambers within a defined footprint. To accommodate the limited footprint on the transfer robot, the present technology may increase the number of processing chambers laterally outward from the robot. For example, some conventional cluster tools may include one or two processing chambers located around a section of the transfer robot located centrally to maximize the number of chambers radially around the robot. The present technology may extend this concept by incorporating additional chambers laterally outward as another row or group of chambers. For example, the techniques of the present invention may be applied to cluster tools that include three, four, five, six or more processing chambers each accessible at one or more robot access locations.

[0019] However, as additional process locations are added, accessing these locations from the central robot may no longer be feasible without additional transfer capabilities at each location. Some conventional techniques may include a wafer carrier on which the substrate remains seated during transfer. However, the wafer carrier may contribute to thermal non-uniformities and particle contamination on the substrate. The present technology overcomes these problems by incorporating a transfer section vertically aligned to the processing chamber area and a carousel or transfer device that can operate in concert with the central robot to access the additional wafer locations. The present technology does not use a conventional wafer carrier in some embodiments, and a particular wafer can be transferred from one substrate support to a different substrate support in the transfer area. Although the remaining disclosure routinely identifies a particular structure, such as a four-position transfer area, in which the present structure and method may be used, it will be readily understood that the system and method are equally applicable to any number of structures and devices that may benefit from the transfer capabilities described. Thus, the technology should not be considered so limited as to be usable with only a particular structure. Additionally, while an exemplary tool system is described to provide a foundation for the present technology, it should be understood that the present technology may be incorporated into any number of semiconductor processing chambers and tools that may benefit from some or all of the described operations and systems.

[0020] FIG. 1A shows a top view of one embodiment of a deposition, etch, bake, and cure chamber substrate processing tool or processing system 100 according to some embodiments of the present technology. In this figure, a set of front-opening unified pods 102 deliver substrates of various dimensions that are received in a factory interface 103 by robot arms 104a and 104b and placed in a load lock or low pressure holding area 106 before being delivered to one of the substrate processing areas 108 located in chamber systems or quad sections 109a-c, each of which may be a substrate processing system having a transfer area fluidly coupled with multiple processing areas 108. Although a quad system is shown, it should be understood that platforms incorporating stand-alone chambers, twin chambers, and other multi-chamber systems are equally encompassed by the present technology. A second robot arm 110 housed in a transfer chamber 112 may be used to transport substrate wafers from the holding area 106 to the quad section 109 and vice versa, and the second robot arm 110 may be housed in a transfer chamber to which each of the quad sections or processing systems may be connected. Each substrate processing region 108 can be equipped to perform a number of substrate processing operations, including any number of deposition processes, including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition, as well as etching, pre-cleaning, annealing, plasma treatment, degassing, alignment, and other substrate processes.

[0021] Each quad section 109 may include a transfer region capable of receiving and delivering substrates from the second robot arm 110. The transfer region of the chamber system may be aligned with the transfer chamber with the second robot arm 110. In some embodiments, the transfer region may be laterally accessible to the robot. In subsequent operations, components of the transfer section may translate the substrate vertically to the overlying processing region 108. Similarly, the transfer region may also be operable to rotate the substrate between positions within each transfer region. The substrate processing region 108 may include any number of system components for depositing, annealing, curing, and / or etching a material film on a substrate or wafer. In one configuration, two sets of processing regions, such as the processing regions in quad sections 109a and 109b, may be used to deposit material on a substrate, and a third set of processing chambers, such as the processing chambers or region in quad section 109c, may be used to cure, anneal, or otherwise process the deposited film. In another configuration, all three sets of chambers, such as all twelve chambers shown, may be configured to deposit and / or cure a film on a substrate.

[0022] As shown in the figure, the second robot arm 110 may include two arms for simultaneously delivering and / or retrieving multiple substrates. For example, each quad section 109 may include two accesses 107 along a surface of the housing of the transfer region that may be aligned laterally with the second robot arm. The accesses may be defined along a surface adjacent to the transfer chamber 112. In some embodiments as shown, the first access may be aligned with a first substrate support of the plurality of substrate supports of the quad section. Additionally, the second access may be aligned with a second substrate support of the plurality of substrate supports of the quad section. In some embodiments, the first substrate support may be adjacent to the second substrate support, and the two substrate supports may define a first row of substrate supports. As shown in the illustrated configuration, the second row of substrate supports may be positioned behind the first row of substrate supports laterally outward from the transfer chamber 112. The two arms of the second robot arm 110 can be spaced apart to allow both arms to simultaneously enter a quad section or chamber system and deliver or retrieve one or two substrates to a substrate support in the transfer region.

[0023] Any one or more of the described transfer regions may be incorporated with additional chambers separate from the fabrication system shown in different embodiments. It will be understood that additional configurations of deposition, etching, annealing, and curing chambers for material films are contemplated by the processing system 100. Additionally, any number of other processing systems may be utilized with the present technology, which may incorporate a transfer system for performing any of the specific operations, such as moving a substrate. In some embodiments, a processing system that may provide access to multiple processing chamber regions while maintaining a vacuum environment in various sections, such as the noted holding and transfer regions, may allow operations to be performed in multiple chambers while maintaining a specific vacuum environment between individual processes.

[0024] FIG. 1B shows a schematic cross-sectional elevation view of one embodiment of an exemplary processing tool, e.g., through a chamber system, according to some embodiments of the present technique. FIG. 1B may show a cross-sectional view of any two adjacent processing regions 108 in any quad section 109. The elevation view may show the configuration of the fluid coupling between one or more processing regions 108 and the transfer region 120. For example, the continuous transfer region 120 may be defined by a transfer region housing 125. The housing may define an open interior volume in which multiple substrate supports 130 may be placed. For example, as shown in FIG. 1A, the exemplary processing system may include four or more including multiple substrate supports 130 distributed within the housing around the transfer region. The substrate support may be a pedestal as shown, although many other configurations may be used. In some embodiments, the pedestal may be vertically transportable between the transfer region 120 and a processing region covering the transfer region. The substrate support may be vertically transportable along a central axis of the substrate support along a path between a first position and a second position within the chamber system. Thus, in some embodiments, each substrate support 130 may be axially aligned with an overlying processing region 108 defined by one or more chamber components.

[0025] The open transfer area can provide the ability for a transfer device 135, such as a carousel, to engage and move, such as rotate, a substrate between various substrate supports. The transfer device 135 can be rotatable about a central axis. This allows the substrate to be positioned for processing in any of the processing regions 108 in the processing system. The transfer device 135 can include one or more end effectors that can engage the substrate from above, below, or can engage the outer edge of the substrate to move around the substrate support. The transfer device can receive a substrate from a transfer chamber robot, such as the robot 110 described above. The transfer device can then rotate the substrate to an alternate substrate support to facilitate delivery of additional substrates.

[0026] Once positioned and awaiting processing, the transfer apparatus can place an end effector or arm between the substrate supports, thereby lifting the substrate support over the transfer apparatus 135 and delivering the substrate to the processing region 108, which may be vertically offset from the transfer region. For example and as shown, the substrate support 130a can deliver the substrate to the processing region 108a, while the substrate support 130b can deliver the substrate to the processing region 108b. This can occur with the other two substrate supports and processing regions, as well as additional substrate supports and processing regions in embodiments where additional processing regions are included. In this configuration, the substrate support, when operably engaged to process a substrate, such as in a second position, can at least partially define the processing region 108 from below, and the processing region can be axially aligned with the associated substrate support. The processing region can be defined from above by the face plate 140, as well as other lid stack components. In some embodiments, each processing region can have an individual lid stack component, while in some embodiments, the components can accommodate multiple processing regions 108. Based on this configuration, in some embodiments, each processing region 108 can be fluidly coupled to the transfer region while being fluidly isolated from above from other processing regions within the chamber system or quad section.

[0027] In some embodiments, the face plate 140 can operate as an electrode of the system for generating a local plasma in the processing region 108. As shown, each processing region can utilize or incorporate a separate face plate. For example, face plate 140a can be included to define from above processing region 108a, and face plate 140b can be included to define from above processing region 108b. In some embodiments, the substrate support can operate as a companion electrode for generating a capacitively coupled plasma between the substrate support and the substrate support. The pumping liner 145 can at least partially define the processing region 108 radially or laterally, depending on the region geometry. Again, separate pumping liners can be utilized for each processing region. For example, pumping liner 145a can at least partially define the processing region 108a radially, and pumping liner 145b can at least partially define the processing region 108b radially. In embodiments, blocker plate 150 may be disposed between lid 155 and faceplate 140, and separate blocker plates may be included to facilitate fluid distribution within each processing region. For example, blocker plate 150a may be included for distribution to processing region 108a, and blocker plate 150b may be included for distribution to processing region 108b.

[0028] The lid 155 may be a separate component for each processing region or may include one or more common aspects. In some embodiments as shown, the lid 155 may be a single component that defines multiple apertures 160 for fluid delivery to the individual processing regions. For example, the lid 155 may define a first aperture 160a for fluid delivery to processing region 108a, and the lid 155 may define a second aperture 160b for fluid delivery to processing region 108b. Additional apertures may be defined for additional processing regions within each section, if included. In some embodiments, each quad section 109 or multi-processing region section that may accommodate more or less than four substrates may include one or more remote plasma units 165 for delivering plasma effluent to the processing chamber. In some embodiments, individual plasma units may be incorporated into each chamber processing region, while in some embodiments, fewer remote plasma units may be used. For example, as described, a single remote plasma unit 165 may serve multiple chambers, be it two, three, four or more, or all of the chambers for a particular quad section. Plumbing may extend from the remote plasma unit 165 to each aperture 160 for delivery of plasma effluent for processing or cleaning in embodiments of the present technology.

[0029] As previously mentioned, the processing system 100, or more specifically, a quad section or chamber system incorporated with the system 100 or other processing systems, may include a transfer section disposed below the illustrated processing chamber region. FIG. 2 shows a schematic isometric view of an exemplary chamber system 200 according to some embodiments of the present technique. The illustrated system may include a transfer region housing 205 that defines an interior volume or transfer region in which some components may be included. The transfer region may further be defined at least in part from above by a processing chamber, such as the processing chamber shown in the quad section 109 of FIG. 1A. A sidewall of the transfer region housing may define one or more access locations 205 where substrates may be delivered and retrieved, such as by the second robot arm 110 as described above. The access location 205 may be a slit valve or other sealable access location, in some embodiments, including a door or other sealing mechanism to provide an airtight environment within the transfer region housing 205. Although shown with two such access locations 205, it should be understood that in some embodiments, only a single access location 205 may be included. It should also be understood that the substrate processing system 200 may be sized to accommodate any substrate size, including 200 mm, 300 mm, 450 mm, or larger or smaller substrates, including substrates characterized by any number of geometries or configurations.

[0030] Within the transfer region housing 205, there may be multiple substrate supports 210 arranged around the transfer region area. Although four substrate supports are shown, it should be understood that any number of substrate supports are similarly encompassed by embodiments of the present technology. For example, according to embodiments of the present technology, about 3, 4, 5, 6, 8, or more substrate supports 210 may be housed in the transfer region. The second robot arm 110 may deliver substrates to either or both of the substrate supports 210a or 210b via the access 205, and in some embodiments, may deliver substrates directly to a transfer device in the transfer region. Similarly, the second robot arm 110 may retrieve substrates from these locations. Lift pins may protrude from the substrate support 210 or be accessible through the substrate support, as described below, and may allow the robot to access underneath the substrate. The lift pins may be fixed on the substrate support or where the substrate support can retract underneath, or the lift pins may be further raised or lowered through the substrate support in some embodiments. The substrate support 210 may be vertically transportable and in some embodiments may extend to a processing chamber, such as processing chamber 108 disposed above the transfer region housing 205 .

[0031] The transfer region housing 205 may extend through apertures in the transfer region as shown, and may operate in conjunction with a laser, camera, or other monitoring device projecting or transmitting through adjacent apertures, to provide access to an alignment system 215, whereby the translated substrate is properly positioned. The transfer region housing 205 may also include a transfer apparatus 220, which may be operated in a number of ways to position and move the substrate between the various substrate supports. Exemplary operations are described below, but in one example, the transfer apparatus 220 may move substrates on substrate supports 210a and 210b to substrate supports 210c and 210d, so that additional substrates can be delivered to the transfer region.

[0032] The transfer device 220 may include a central hub 225 that may include one or more shafts extending into the transfer chamber. The central hub 225 may include a housing 230 centrally located or otherwise disposed within the transfer region housing 205. The housing 230 may define an interior housing region in which additional components associated with the transfer device 220 may be disposed, as described below. The housing 230 may be detachable from the base of the transfer region housing 205, thereby allowing the housing 230 to rotate within the transfer region. Coupled with the central hub may include a number of arms 235. The arms 235 may be coupled at a radially outer location around the housing 230, although in embodiments the arms may be coupled closer towards the central axis of the central hub. By locating the arms radially outward, associated hub and linkage components may be more freely integrated within the housing, as described below. The arm 235 can extend from the exterior of the housing, and the arm can be fixedly coupled to the housing, although in some embodiments the arm can be coupled to a hub or an extension of the hub that extends through the housing, allowing additional rotation of the transfer device and facilitating independent rotation of the arm 235 relative to the housing 230.

[0033] Any number of arms 235 may be included in embodiments of the present technology. In some embodiments, the number of arms 235 may be similar or equal to the number of substrate supports 210 included in the chamber. Thus, as shown, for four substrate supports, the transfer apparatus 220 may include four arms extending laterally or radially outward from the central hub housing. The arms may be characterized by any number of shapes and profiles, such as linear profiles as shown, as well as arcuate profiles, or different distal position shapes as described further below. As described further below, the arms may extend under one or more substrates 201 and may be used to individually adjust one or more substrates, as well as to transfer the substrates 201 to alternative substrate supports in the transfer region.

[0034] The arms and housing and other components of the transfer apparatus may be made of or include a number of materials, including conductive and / or insulating materials. In some embodiments, the materials may be coated or plated to withstand contact with precursors or other chemicals that may enter the transfer region from the overlying processing chamber. The materials may also be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, the substrate support may be operable to heat a substrate disposed on the support. The substrate support may be configured to raise the surface or substrate temperature to a temperature of about 100° C. or more, about 200° C. or more, about 300° C. or more, about 400° C. or more, about 500° C. or more, about 600° C. or more, about 700° C. or more, about 800° C. or more, or more.

[0035] Any of these temperatures may be maintained during operation, and therefore components of the transfer apparatus 220 may be exposed to any of these stated or encompassed temperatures, including the arm 235, which may extend between the substrate support 210 and the substrate 201. As a result, in some embodiments, any material may be selected to accommodate these temperature regimes, and may include materials such as ceramics and metals, which may be characterized by relatively low coefficients of thermal expansion or other beneficial properties. The coupling of the components may also be adapted for operation in high temperature and / or corrosive environments. For example, in some embodiments, where the arm and hub may each be ceramic, the coupling may include press fittings, snap fittings, or other fittings that may not include additional materials, such as bolts, which may expand and contract with temperature and cause cracks in the ceramic, although in some embodiments, any number of fittings may be used with the components.

[0036] Some embodiments of the transfer apparatus 220 may also include an aligner 240 coupled to the arm 235 around or near the distal end of the arm relative to the proximal connection to the housing 230. As discussed further below, the aligner 240 may provide a third aspect of rotation for the substrate to be positioned or repositioned during transfer or other operations. In some embodiments, the aligner may extend directly between the substrate support and the substrate, which may expose the aligner and associated components, including the linkage, to substrate support temperatures. Thus, these materials may be similarly selected to correspond to environmental conditions to which the materials may be exposed. Any number of other materials that may facilitate movement or resistance during operation may be utilized and are also included in the present technology.

[0037] The transfer device 220 can include several components and configurations that can facilitate movement of the arm independent of the housing, as described further below. Figures 3A-3B show schematic cross-sectional views of an exemplary transfer device 220 in accordance with some embodiments of the present technology, however, it should be understood that other configurations that provide the described independent rotational movement are encompassed by the present technology as well.

[0038] The central hub 225 may include a first shaft 310 and a second shaft 320, which may be axially aligned with the first shaft 310. For example, the first shaft 310 and the second shaft 320 may be concentric about a central axis that extends vertically through the central hub. In some embodiments, the first shaft 310 may extend through the second shaft 310, or through aspects of the second shaft 320. As shown in FIG. 3A, the first shaft 310 and the second shaft 320 may be coaxial, but the two shafts may be coupled with separate motors or drive systems. As shown, the first shaft 310a may be coupled with a first drive system 312a, which may include a motor and enable rotation about the central axis. This rotation can rotate the linkage 330 in a first direction or a second direction opposite the first, and the movement can rotate the arm hubs 335 in a first direction or a second direction opposite the first about a central axis passing through each arm hub. Similarly, the second shaft 320a can be coupled to a second drive system 314a, which can independently rotate the housing 230 in a first direction or a second direction about the central axis. In some embodiments, a vertical translation drive 325 can be included, which can translate the transfer apparatus vertically along the central axis. This can facilitate lifting of the substrate from the substrate support or lift pins in some embodiments, although in some embodiments the substrate can be raised and lowered using the lift pins and / or substrate support, and the transfer apparatus 220 may not include a vertical drive mechanism.

[0039] Shown internally within the area defined by the housing 230 may be one or more arm hubs 335 including a plurality of arm hubs. The arm hub may be at least partially disposed within the housing and may extend through the housing 230 to couple with the arm 235 or may include an extension post or linkage to couple with the arm 235. Each arm of the plurality of arms 235 may include a corresponding or associated arm hub 335 that facilitates rotation of the arm independent of rotation of the housing 230. The arm hubs 335 may be individually or collectively coupled to the first shaft 310 of the central hub, thereby enabling rotation of the arm hub 335 as the first shaft 310 rotates. The arm hubs 335 may be distributed around a central axis of the central hub and may be radially offset from the central axis. Each arm hub may be characterized by a corresponding arm hub axis extending through the arm hub and defining an axis of rotation of the associated arm coupled to or coupled with the hub.

[0040] The arm hubs 335 may be located near the radial or lateral edges of the interior region of the housing 230, which may limit interference between adjacent hubs when the number of hubs and arms is increased, for example, due to a transfer region including additional substrate supports. The arm hubs 335 may not be directly coupled to the housing 230, or may be rotatably coupled to the housing, which may facilitate independent rotation between the arm hubs and the housing, creating multiple rotational aspects for the transfer apparatus 220. The first shaft 310 may extend within the interior housing and provide some access to the coupling mechanism 330 about the first shaft. As shown, a linkage may couple each arm hub of the multiple arm hubs 335 individually or collectively with the first shaft 310 within the interior housing region. As a result, when the first shaft 310 is rotated by the first drive system 312a, the linkage coupling the shaft with the arm hubs may rotate the hubs as well, and the arm hubs may simultaneously rotate about their individual hub central axes that are radially offset from the central axis of the transfer apparatus or central hub, as described above. When the arm hub rotates with the rotation of the first shaft 310, the arm 235 can also rotate in a direction that corresponds to or is related to the rotational direction of the first shaft 310 and / or the arm hub 335.

[0041] 3B illustrates another embodiment of the transfer device 220 that may utilize a gearbox to facilitate counter-rotation of the first shaft 310b relative to the second shaft 320b. For example, the second shaft 320b may be coupled to a gearbox 331 including a gear set 332 having a first gear coupled to the first shaft 310b. As will be readily appreciated, driving the first gear in a first direction with the first drive system 312b will result in counter-rotation of the opposite gear, which may be coupled to the second shaft 320b and the housing 230. Additionally, the second drive system 314b may be coupled to a component to rotate the gearbox and the first shaft together, which may facilitate co-rotation of the housing 230 and the arm 235, however, due to differences in rotation ratios between the arm and the housing, the first shaft 310b and the second shaft 310b may be rotated in a similar direction, but additional rotation of the first shaft 310b may also occur. This figure also shows an optional vertical translation drive 325, which can move the transfer device linearly up and down, as described above. It should be understood that Figures 3A-3B are merely illustrative of any number of configurations and components that can be used to independently rotate the first and second shafts allowing separate control of the housing and arm. As a result, in some embodiments, the first and second shafts can co-rotate about a central axis, either at similar or different rotational speeds, or the two shafts can counter-rotate relative to the other, either at the same or different rotational speeds. More details about this operation are provided below.

[0042] 3B-3F show schematic top views of exemplary components of a transfer device 220, according to some embodiments of the present technology. It should be understood that only some aspects of the transfer device as described above may be illustrated, but the illustrations are not intended to be limiting and may include any of the components, materials, or characteristics of the transfer device 220 described above. Additionally, the figures may show linkages included in any of the transfer devices or embodiments of the present technology described above.

[0043] As shown, the transfer device 220 may include a housing 230. The housing 230 may include a covered lid portion as previously shown, but the lid is not shown in the figures to facilitate the exemplary coupling included in the present technology. The first shaft 310 may extend into the housing 230 and may couple with the arm hubs 335 as previously described. Although only four arm hubs 335 are shown, it should be understood that any number of hubs may be included to accommodate any number of associated arms. The linkage 330a is shown in one embodiment that may use one or more belt couplings and may extend around the individual arm hubs 335 as well as the first shaft 310 in some manner. The belts may extend into grooves or trenches defined in each of the arm hubs and the first shaft. For example, four separate trenches may be defined vertically along the first shaft 310 to accommodate each belt, such that the belts are kept offset to limit or prevent contact or interaction of the belts. Similarly, grooves or trenches may be provided around each arm hub to maintain a set position of the belts.

[0044] Although a set of belts is shown in the figures, a single belt, such as a serpentine belt or drive belt, can extend around each arm hub and the first shaft 310 to provide coupling. Additionally, twist belts can be incorporated to reverse rotation between components. While individual or multiple belts can be used in different embodiments, additional linkage systems can be used as well. For example, as shown in FIG. 3D, a gear set can be used to drive the arm hubs as shown. For example, the first shaft 310 can define several gear teeth along an area that extends into the housing 230. The gear teeth can interconnect with the teeth of the linkage gear 330b around each arm hub 335 of the transfer device. Each gear of the multiple gears can be positioned in contact with one or both of the first shafts 310 as well as the associated arm hub 335 as shown. Additional gears can also be incorporated in any number of configurations to facilitate rotation of the arm hubs from rotation of the first shaft 310. Again, only four such arm hubs and linkage gears are shown, but encompassed embodiments of the present technology may include any number of linkages and hubs. Similarly, Figures 3C and 3D show two possible linkage systems encompassed by the present technology, and are not intended to be limiting.

[0045] Couplings of any number of other system components configured to provide the described movements are similarly encompassed by the present technology. Additionally, it should be understood that the linkage connection may include a number of gears, twisted belts, and other components that may cause the arm hub 335 to rotate in a similar or different direction to the first shaft 310, and therefore any embodiment described throughout this disclosure may take this effect into account. For example, a first direction of rotation of a shaft may cause the associated arm hub to rotate in either direction, and therefore, where first and second directions are described, either direction may actually be included to correspond to the movement illustrated or described, which may account for any type of actual linkage coupling encompassed in any particular example.

[0046] FIG. 4 illustrates exemplary operations in a method 400 of transferring a substrate according to some embodiments of the present technique. The method 400 may be performed in one or more transfer systems, such as the system 200, which may be incorporated into the processing system 100, for example. The method may include several optional operations as illustrated in the figures, which may or may not be specifically related to some embodiments of the method according to the present technique. The method 400 describes the operations shown generally in FIGS. 5A-5H, which are described in conjunction with the operations of the method 400. It should be understood that FIG. 5 shows only a partial schematic view with limited details, and that in some embodiments, the system may include more or less substrate supports and other components, as well as alternative structural aspects that may still benefit from any aspect of the present technique.

[0047] FIG. 5A may show a transfer region of a substrate processing system 500 as previously described, and may include any of the features and aspects of system 200 described above, including any of the drive components previously described in FIG. 3, as well as any other drive components understood to be encompassed by the present technology as well. Additionally, system 500 may be illustrated with several substrates 501 positioned within the chamber, such as seated on substrate support 510 as shown. This figure may show a configuration for subsequent initial operations of method 400, which may include receiving substrates at first substrate support 510a in operation 405, such as through robotic access as previously described. The robot may deliver one or two or more substrates to the transfer region 505 on a substrate support proximate to an access or slit valve. The transfer device 520 may rotate two substrates to the opposite substrate support and deliver two additional substrates. It should be understood that the same process may be performed with any number of substrates, including sending one substrate at a time to a processing chamber. FIG. 5A may show after four substrates have been positioned within the transfer region. Additionally, during delivery or subsequent transfer of a substrate, the transfer apparatus 520 may be positioned in a recessed configuration, which may be, for example, coiled adjacent the housing 530 of the central hub 525 or extended between the substrate supports 510. When a transfer operation is initiated for any number of substrates, the transfer apparatus may perform one or more adjustments to extend the arm 535 at least partially below the substrate 501, as shown. These movements or adjustments may include any of the rotations as described below, as well as additional rotations or movements to accommodate components within the transfer region.

[0048] The transfer process may include rotating the transfer apparatus in several ways. The method 400 may include engaging the substrate 501 in operation 410. The engagement may occur simultaneously or separately until one or more substrates are transferred from the substrate support 510, including the lift pins of the substrate support, to the arm 535 of the transfer apparatus 520. Depending on whether it has vertical movement capability, the engagement and movement may or may not include raising or lowering one or both of the substrate or the transfer apparatus. Once the substrate is engaged by the transfer apparatus, the complete transfer of the substrate may take place between the substrate support and the transfer apparatus. For example, in some embodiments, the transfer apparatus may lift the substrate from the substrate support or may lift pins on which the substrate may sit. This may be performed, for example, by translating the transfer apparatus vertically. In some embodiments, the substrate support may retract away from the substrate to complete the transfer.

[0049] After transfer to the transfer apparatus is complete, the substrate may be rotated between the substrate supports for further processing in a different chamber or to deliver the substrate to a substrate support accessible by a transfer robot, such as the second robot arm 110 as described above. Translation of the substrate or substrates may occur by causing one or more rotations of the first shaft and the second shaft, which may cause rotation of the arms and housing, as shown in FIG. 5B. Although the figure shows a counterclockwise rotation, it should be understood that in embodiments, the substrate may be rotated in either direction about the central axis.

[0050] To initiate translation of the substrate after the substrate is placed on the arm 535 of the transfer apparatus, the method may include rotating the first shaft of the central hub in a first direction about the central axis of the central hub in operation 415. Beforehand, subsequently, or simultaneously, the method may include rotating the second shaft in a second direction about the central axis of the second hub in operation 420. The second direction may be an opposite rotation to the first direction, as previously described. As shown in FIG. 5B, this opposite rotation may facilitate retracting the substrate 501 toward the central hub 525 during translation, as the arm 535 is rotated backward toward the housing 530. While not intended to be limiting, the illustrated rotation may be indicative of an embodiment of translating the substrate 501 from the first substrate support 510a to the second substrate support 510b. To provide this rotation, the second shaft of the central hub may be rotated in a translational direction, such as counterclockwise as shown. While this is occurring, the first shaft can rotate in a first direction opposite the second shaft, which can cause the arm to retract toward the start position, as shown. As previously noted, depending on the type of linkage used, the rotational directions described may actually represent either rotational direction to correspond to the movement shown for the linkage type used.

[0051] The counter rotation can occur at any location or degree, which can narrow the envelope in which the rotation can occur. Translation of one or more substrates can then proceed in operation 425, where the arm 535 and the housing 530 can co-rotate about a second direction at a common speed or common ratio toward the second substrate support 510b. As shown, the co-rotation can occur along a second direction about a central axis. As a result, the direction of rotation of the first shaft can be reversed, and the rotation of the second shaft can continue in the same direction as used for engagement. Of course, if the translation of the substrate proceeded along the first direction, the direction of rotation of the shafts will also be reversed. As shown in Figures 5B-5D, the arm 535 rotating about an axis that is separate and radially offset from the housing 530 can further facilitate a more direct translation of the substrate between the substrate supports. For example, a substantially linear path, or any degree of arcuate or angular movement can be provided by the present technique by adjusting the rotation of the shaft of the transfer device. In some embodiments, by providing a linear path by which a substrate can be moved laterally directly from a first substrate support to a second substrate support, such as in a straight line between the center of the first substrate support and the second substrate support, reduced translation times can be provided, which when extended to hundreds or thousands of operations can result in significantly reduced queue times over conventional technologies.

[0052] As mentioned above, a substrate processing system according to an embodiment of the present technology can have a monitoring and alignment system, including an alignment hub 540 disposed between each pair of substrate supports. An additional access port 542 can allow a camera or laser to impinge on the substrate to identify misalignment, which may be based on a notch or other identifier on the substrate. In some embodiments, an optional alignment operation can be performed on each substrate in optional operation 430. As shown in FIG. 5C, the substrate can be transferred to the alignment hub 540, which can be facilitated by the profile of the arm 535. As shown, the distal portion of the arm on which the substrate is supported can be characterized by a hook, fork, or aperture through which the alignment hub 540 can extend. In different embodiments, the alignment hub 540 can be raised to transfer the substrate or the substrate can be lowered and placed on the alignment hub 540. In either case, one or more aligners can receive the substrate, depending on the number of substrates being translated. Alignment adjustments can be performed and the transfer device can re-engage the substrate.

[0053] As shown in FIG. 5D, the transfer apparatus can continue to rotate the substrate toward the substrate support to which the substrate 501 is delivered. Although movement to an adjacent substrate support in a counterclockwise direction is shown, it should be understood that delivery to other substrate supports in either rotational direction can be performed as well. In operation 435, the substrate can be delivered to a second substrate support, as shown in FIG. 5E, which can include extending the arm 535 by reversing the rotation of the first shaft. As the housing 530 continues to rotate, the arm can be withdrawn from the substrate support, and thus, in some embodiments, the arm can be extended outwardly proximate to the desired delivery location to accommodate a lateral translation path with the rotating housing track. Once delivered, the transfer apparatus can decouple the substrate from the transfer apparatus. Again, the substrate can be lowered along with the transfer apparatus and / or the substrate support, or lift pins of the substrate support can engage the substrate to receive it from the transfer apparatus. As described below, the substrate can be individually positioned on the respective substrate support, which can facilitate further alignment of the substrate.

[0054] For example, the substrate support or lift pins may correspond to the individual delivery of the substrate, so that the transfer device may perform additional alignment operations before delivering the substrate. For example, while translating the substrate, the aforementioned camera or monitoring system may identify the offset of the substrate, so that the substrate may contact the pocket of the substrate support where the substrate is delivered. The monitoring system may provide feedback via an associated control system, which may direct further operation of the transfer device. Discrete lateral movements along the xy plane parallel to the surface of the substrate support may be limited due to the rotational nature of the transfer device, but these movements may still be performed. By further rotating one or both of the housing or the arm, the intersecting arc paths may be changed to laterally adjust the position of the substrate before delivery. As will be further shown below, each lift tweezer may be vertically offset from the other lift tweezer, so this correction may be performed for one or more, including each substrate of the system.

[0055] Once each substrate is delivered to its respective substrate support, the transfer device can be transitioned out between the substrate and the substrate support. The technique can also accommodate lift pins associated with the substrate support. FIG. 5F shows only two substrates 501 for ease of illustration, and shows two other bare substrate supports showing lift pins 545, which can extend between the substrate and the substrate support, but can be avoided by the subsequent transfer device of the substrate. The translation and delivery can be performed laterally as described above, but the delivery can include raising the lift pins or lowering the transfer device, which can align the lift pins with the transfer path. Transitioning the transfer device away from the substrate support can therefore involve additional movements.

[0056] As shown in FIG. 5F, the transition of the transfer device can include rotating the first shaft more aggressively in the first direction while continuing to rotate the second shaft in the second direction, which can pull the arms 535 inward toward the central hub. As shown, this movement can cause the arms to retract from the lift pins that may be located on either side of the arms after delivery. Additionally, the rotation can be performed toward a feature of the arms as shown, but can occur in either direction. While any number of arm profiles and shapes are encompassed by the present technology, the hooks shown can shorten the leading edge of the arms in the second direction, which may further avoid contact with the lift pins as shown.

[0057] In some embodiments, the arm may be retracted between the substrate supports, but the recess can keep the arm nested close to the housing during processing. Once the arm is initially recessed as shown, the transition may also include rotating the second shaft in a first direction. During the initial rotation, the first shaft may be rotated to keep the arm 535 retracted, which may include rotating the first shaft with the second shaft in the first direction, as shown in FIG. 5G. Subsequently, the first shaft may be rotated in an opposite direction to the second shaft to extend the arm 535 outward, as shown in FIG. 5H. For example, as shown, the first shaft may be rotated in a second direction and the second shaft may be rotated in a first direction to extend the arm outward, which may place the arm in a holding position during substrate processing. Additionally, such a position, if included, may align the arm 535 on the alignment hub 540, which may provide protection for the alignment hub against particle buildup, for example.

[0058] FIG. 6 shows a schematic cross-sectional view of an exemplary transfer device 600 according to some embodiments of the present technology. The transfer device 600 can include an additional aligner component as described above that can further perform a rotational alignment operation during the transfer. As a result, an aligner integrated into the transfer device, unlike the alignment hub 540 described above, can further reduce the transfer time. For example, when the substrate is translated on the monitor device as described above, information can be sent back to the transfer device to indicate a rotational alignment adjustment, which may be performed during the translation. This can eliminate the movement of the alignment hub, thereby eliminating additional release and engagement operations, which may further control small offsets that may occur during transfer, or may improve the accuracy of the substrate alignment over conventional techniques.

[0059] The transfer device 600 may include any of the components, materials, configurations, or characteristics of other transfer devices described elsewhere, and may show a simplified schematic diagram to illustrate possible coupling of alignment components. The transfer device 600 may be incorporated into any of the transfer regions as previously described, including the transfer region housing 205 that includes any number of substrate supports or includes the substrate supports 210, and the transfer device 600 may include common components having the configurations previously described. For example, the transfer device 600 may include a central hub 630 that includes a housing 632 that may define an interior housing region, and multiple arms 635 that extend outwardly from the housing as previously described. In any of the examples of the present technology, a housing may not be included, but including a housing may protect components located in the interior region from exposure to wastewater or other process materials and facilitate cooling by creating separate regions. The central hub 630 may include a first shaft 610, a second shaft 615, and a third shaft 620. The shafts may be coaxial about a central axis that passes through the central hub 630. For example, the second shaft 615 can extend around and be concentric with the first shaft 610, and the third shaft 620 can extend around and be concentric with the second shaft 615. Each of the first shaft 610, the second shaft 615, and the third shaft 620 can be configured to allow independent rotation of different elements of the transfer apparatus.

[0060] For example, the housing 632 may be coupled to a third shaft 620 and may be rotatable about a central axis with a third drive system 622, which may include any number of motors or drivers, similar to other systems described elsewhere, and may rotate in either direction about the central axis. A number of arms 635 may be coupled about the exterior of the housing 632 and may include any of the arm features or characteristics described above. The arms may be coupled near the housing at a proximal end of the arm, and a distal end of each arm may support an aligner 640 of the multiple aligners. The coupling of the arms to the aligners may include any number of linkage schemes, as described above, and the following example is included to facilitate understanding of the independent rotational control of the components, regardless of the particular linkage mechanism used.

[0061] The first shaft 610 can be coupled to a plurality of arm hubs 645 as described above. The arm hubs 645 can be at least partially disposed within the interior housing area, while a portion of the arm hub or an extension of the arm hub can extend through the housing to couple with the arm 635. Each arm hub of the plurality of arm hubs can be coupled to an arm of the plurality of arms as described above. The arm hubs can be coupled to the first shaft 610 by a linkage 642, which can include any of the linkages or mechanisms described above. The first shaft 610 can be operably coupled to a first drive system 612, which can facilitate independent rotation of the first shaft 610 and can provide rotational capability to the arm 635.

[0062] In some embodiments, each arm 635 may define an internal arm region that may allow coupling access to the aligner 640, although in some embodiments coupling may be performed on or under and along the exterior of each arm 635. However, by providing an internal arm region, the linkage may be protected from exposure to processing materials and may at least partially reduce thermal exposure of the components. A number of aligner hubs 650 may be included in the internal housing region and coupled to the second shaft 615 with linkage 647. The aligner hubs 650 may be concentric with the arm hubs 645 as shown, and in some embodiments, the aligner hubs 650 may extend through the arm hubs 645 into the internal arm volume. Thus, in some embodiments, no portion of the aligner hubs 650 should be exposed in the transfer region environment. The aligner hubs 650 may be coupled to the second shaft 615 at a first end with the linkage 647. At a second end of the aligner hub 650 opposite the first end, a linkage 652 can further couple the aligner hub to the aligner 640. The second shaft 615 can be operably coupled to a second drive system 617, which can facilitate independent rotation of the second shaft 615 and provide rotational capability to the aligner 640.

[0063] In some embodiments, a vertical translation drive 625 may be included, which allows the transfer apparatus to translate vertically along a central axis. This may facilitate lifting of the substrate from the substrate support or lift pins in some embodiments, although in some embodiments the lift pins and / or substrate support may be used to raise and lower the substrate and the transfer apparatus 600 may not include a vertical drive mechanism. Incorporating a third shaft and drive system as shown may provide an additional rotational degree of freedom that may facilitate alignment operations of the substrate being transferred and further reduce queue times by combining the alignment function with the translation function.

[0064] FIG. 7 shows a schematic cross-sectional elevation view of an exemplary substrate processing system 700 according to some embodiments of the present technique. FIG. 7 shows a staggered lift pin configuration as described above and as may be included in any of the transfer regions or substrate processing systems described above. For example, any of the lift pins described above may include staggered height lift pins as shown. The substrate processing system 700 may include any of the components, configurations, and characteristics of any of the embodiments described above, as well as any of the systems described above may include the lift pin configuration shown. The system 700 may include a plurality of substrates 701 individually positioned on a set of lift pins 705 in a chamber, which may also include a transfer device 720, which may include any of the features of the transfer devices described above, including an arm 735 extending from the transfer device.

[0065] The lift pins 705 may be a set of pins that extend from the substrate support 710 to provide accessibility for delivery or retrieval of the substrate 701, and each set may include any number of pins to accommodate the substrate. As shown, the lift pin sets 705 are staggered at four different heights, which may allow for individual delivery and retrieval of the substrates. For example, the lift pin 705a may extend a first vertical length above the substrate support. The lift pin 705b may extend a second vertical length above the substrate support 710b shown in cross section, hiding the substrate support through which the lift pin 705a may extend even if the substrate supports are aligned. As shown, the second vertical length may be less than the first vertical length.

[0066] Additionally, the lift pin 705c can extend a third vertical length from the substrate support 710c, which may be shorter than the second vertical length. Finally, the lift pin 705d can extend a fourth vertical length from the associated substrate support, which can be hidden by the substrate support 710c and aligned with the substrate support 810c. The fourth vertical length may be shorter than the third vertical length. By shifting the height of the lift tweezers, individual adjustments can be made to each substrate prior to delivery or retrieval of the substrate. For example, when placed on the associated lift pin, the substrate 701a can be accessible above the substrate 702b, which can be accessible above the substrate 702c, which can be accessible above the substrate 702d.

[0067] The present technology includes a substrate processing system that can accommodate additional substrate supports that may not otherwise be accessible by a centrally located transfer robot as described above. By incorporating a transfer apparatus according to an embodiment of the present technology, multiple substrate supports can be utilized and accessed during substrate processing. If the transfer apparatus includes an articulated arm that can rotate independently relative to the substrate housing, two axes of rotation can be provided, which can facilitate repositioning of the substrate to limit misalignments that lead to additional edge contact between the substrate and the substrate support. The system can also increase the speed of movement by providing a more linear motion between the substrate supports, which can also facilitate a reduction in the size of the movement area.

[0068] In the foregoing description, for purposes of explanation, numerous details have been set forth in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to one skilled in the art that particular embodiments may be practiced without some of these details or with additional details.

[0069] Although several embodiments have been disclosed, those skilled in the art will appreciate that various modifications, alternative structures, and equivalents may be used without departing from the spirit of the embodiments. Moreover, some well-known processes and elements have not been described to avoid unnecessarily obscuring the present technology. Thus, the above description should not be interpreted as limiting the scope of the present technology. In addition, although a method or process may be described as sequential or stepwise, it should be understood that these steps may be performed simultaneously or in a different order than described.

[0070] Where a range of values ​​is presented, unless the context clearly dictates otherwise, it is understood that each intervening value between the upper and lower limits of that range is also specifically disclosed to the smallest unit of the unit of the lower limit. Any narrower ranges between any stated or unstated intervening value in a stated range, as well as any other stated or intervening value in that stated range, are also encompassed. The upper and lower limits of these smaller ranges may be individually included or excluded from the range, and each range in which either, neither or both limits are included in the smaller range is also encompassed within the scope of this technology, subject to any specifically excluded limits in the stated range. Where a stated range includes one or more limits, ranges excluding either or both of those included limits are also included.

[0071] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly indicates otherwise. Thus, for example, reference to a "substrate" includes a plurality of such substrates, reference to an "arm" includes a reference to one or more arms and equivalents thereof known to those skilled in the art, and so forth.

[0072] Additionally, the terms "comprise(s)", "comprising", "contain(s)", "containing", "include(s)", and "including", when used in this specification and claims, are intended to specify the presence of stated features, integers, components, or steps, but do not exclude the presence or addition of one or more other features, integers, components, steps, operations, or groups.

Claims

1. A method of manufacturing a transfer region housing, comprising: a transfer region housing defining a transfer region, a sidewall of the transfer region housing defining a sealable access for providing and receiving a substrate; a plurality of substrate supports disposed within the transfer region; A transport device; A substrate processing system comprising: The transfer device comprises: a central hub including a first shaft and a second shaft extending around and concentric with the first shaft, the central hub having a housing disposed within the transfer region and coupled to the second shaft, the housing defining an interior housing region; a plurality of arms equal to the number of substrate supports of the plurality of substrate supports, each arm of the plurality of arms being coupled around an exterior of the housing; a plurality of arm hubs disposed within the interior housing region, each arm hub of the plurality of arm hubs coupled to an arm of the plurality of arms through the housing and coupled to the first shaft of the central hub; and a third shaft and a plurality of aligners; each aligner disposed proximate a distal end of an associated arm of the plurality of arms, each aligner being rotatable independently of the plurality of arms and the housing.

2. 2. The substrate processing system of claim 1, wherein the arm hubs are distributed about a central axis of the central hub proximate a radial edge of the inner housing region, and the arm hubs are rotatable independently of the housing to which the arms are coupled.

3. 3. The substrate processing system of claim 2, wherein the first shaft extends within the inner housing region, and one or more linkages couple each arm hub of the plurality of arm hubs to the first shaft within the inner housing region.

4. 4. The substrate processing system of claim 3, wherein rotation of the first shaft is configured to simultaneously rotate each arm hub of the plurality of arm hubs, each arm hub being characterized by a central axis that is radially offset from a central axis of the central hub, and wherein rotation of each arm hub of the plurality of arm hubs is configured to rotate a corresponding arm of the plurality of arms about the central axis of the associated arm hub.

5. The substrate processing system of claim 3 , wherein the one or more linkages include one or more belts extending around each arm hub of the plurality of arm hubs and the first shaft.

6. 4. The substrate processing system of claim 3, wherein the one or more linkages include a plurality of gears coupled between the first shaft and the plurality of arm hubs, each gear of the plurality of gears being disposed between and in contact with the first shaft and an arm hub of the plurality of arm hubs.

7. 2. The substrate processing system of claim 1, wherein each substrate support of the plurality of substrate supports includes a set of lift pins accessible through the substrate support, each set of lift pins being characterized by a different vertical length than each of the other sets of lift pins.

8. 1. A method of transferring a substrate, comprising: Receiving the substrate on a first substrate support in a transfer region of a substrate processing system, the substrate processing system including a transfer apparatus, the transfer apparatus comprising: a central hub including a housing, the central hub including a first shaft and a second shaft extending around and concentric with the first shaft; a plurality of arms, each arm of the plurality of arms coupled around an exterior of the housing; a plurality of arm hubs, each arm hub of the plurality of arm hubs being coupled to an arm of the plurality of arms, the arm hub being coupled to the first shaft of the central hub; and engaging an arm of the plurality of arms with the substrate; rotating the first shaft in a first direction about a central axis of the central hub; rotating the second shaft in a second direction about a central axis of the central hub; co-rotating the first shaft and the second shaft about the central axis in a second direction to reposition the substrate; delivering the substrate to an alignment hub disposed between the first substrate support and a second substrate support; and delivering the substrate to the alignment hub and then delivering the substrate to the second substrate support of the substrate processing system; A method for transferring a substrate comprising:

9. 9. The method of transferring a substrate of claim 8, further comprising translating the transfer apparatus by further rotating the second shaft in the second direction about the central axis and rotating the first shaft in the first direction about the central axis.

10. 10. The method of claim 9, further comprising rotating the first shaft in the second direction about the central axis and rotating the second shaft in the first direction about the central axis.

11. 9. The method of transferring a substrate of claim 8, further comprising, subsequent to engaging the substrate, lifting the substrate from the first substrate support by vertically translating the transfer apparatus within the transfer region.

12. The method of claim 8 further comprising retracting the first substrate support from the substrate subsequent to engaging the substrate.

13. 9. The method of claim 8, wherein each arm of the plurality of arms further comprises an aligner rotatable independently of the arm, the substrate seated on the aligner when engaged by an arm of the plurality of arms.

14. A method for manufacturing a substrate transport system comprising: a transport region housing defining a transport region, a sidewall of the transport region housing defining a sealable access for providing and receiving a substrate; a plurality of substrate supports disposed within the transfer region; a plurality of alignment hubs disposed within the transfer region, a respective one of the plurality of alignment hubs positioned between each adjacent pair of the plurality of substrate supports, each of the plurality of alignment hubs configured to receive a substrate; A transport device; A substrate processing system comprising: The transfer device comprises: a central hub including a first shaft and a second shaft extending around and concentric with the first shaft, the central hub having a housing disposed within the transfer region and coupled to the second shaft, the housing defining an interior housing region; a plurality of arms equal to the number of substrate supports of the plurality of substrate supports, each arm of the plurality of arms being coupled around an exterior of the housing; and a plurality of arm hubs disposed within the interior housing area, each arm hub of the plurality of arm hubs coupled to an arm of the plurality of arms through the housing and coupled to the first shaft of the central hub; A substrate processing system comprising:

Images