Burn-in board and burn-in device

Abstract

To provide a burn-in board with which it is possible to suppress a decrease in the quality of burn-in test, even when the number of sockets increases.SOLUTION: The burn-in board comprises: a substrate 40; a socket 70 mounted to the substrate 40; a connector 80 mounted to the substrate 40; wiring systems 50a1 thru 50h10 and 60a thru 60p provided to the substrate 40, for connecting the plurality of sockets 70 and the connector 80; and a compensation circuit 90 connected to the wiring systems 50a1 thru 50h10 and 60a thru 60p, for compensating for the frequency characteristics of signals transmitted along the wiring systems 50a1 thru 50h10 and 60a thru 60p.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a burn-in board used in burn-in testing of electronic devices under test (DUTs: Devices Under Test) such as semiconductor integrated circuit elements, and to a burn-in apparatus equipped with the burn-in board. [Background technology]

[0002] A burn-in device is known that includes a burn-in board with multiple sockets to which a DUT can be attached, a burn-in chamber that houses the burn-in board and applies thermal stress to the DUT, and a burn-in controller that inputs and outputs signals to the DUT via the burn-in board (see, for example, Patent Document 1). The burn-in board includes sockets to which a DUT can be attached and a wiring board on which the sockets are mounted, and multiple sockets are arranged on the upper surface of the wiring board. In the burn-in device, the burn-in board and the burn-in controller are electrically connected by fitting a connector of the burn-in board to a connector of the burn-in chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-025829 A Summary of the Invention [Problem to be solved by the invention]

[0004] The sockets are connected to the drivers in the burn-in controller via connectors, and the signals of the drivers are input / output to the DUT via the wiring system of the wiring board. Since the number of drivers is limited and multiple sockets are connected to the same driver via the wiring system, the number of sockets is greater than the number of drivers. Since the connectors of the burn-in board are provided at one end of the wiring board, the wiring length of the wiring system connecting the sockets and the connectors varies depending on the position of the sockets on the wiring board. Depending on the type of signal input / output from the burn-in controller to the DUT, differences in the length of the wiring between the sockets can affect the quality of the burn-in test.

[0005] Therefore, when the number of sockets on the burn-in board is increased, the wiring length of the wiring system becomes longer, which may delay the rise time and / or fall time of the signal, resulting in a decrease in the quality of the burn-in test.

[0006] The problem to be solved by the present invention is to provide a burn-in board and a burn-in device that are capable of suppressing a deterioration in the quality of a burn-in test even when the number of sockets is increased. [Means for solving the problem]

[0007] [1] A burn-in board according to the present invention comprises a substrate, a socket mounted on the substrate, a connector mounted on the substrate, a wiring system provided on the substrate and connecting a plurality of the sockets and the connectors, and a wiring system connected to the wiring system. Can A compensation circuit is provided. The compensation circuit is configured to connect an RC filter, in which a resistor and a capacitor are connected in parallel, in series with the wiring system connecting the socket and the connector, and to make the gain on the low frequency side of the test signal transmitted through the wiring system smaller than the gain on the high frequency side. This is a burn-in board. [2] In the above invention, the compensation circuit is test The amplitude of the low frequency side of the signal is smaller than the amplitude of the high frequency side. Even if good. [3] In the above invention, the wiring system may have a plurality of wirings having different lengths, and the compensation circuit may be connected to one of the plurality of wirings having a longer wiring length. [ 4In the above invention, an external capacitor including a first capacitor and a second capacitor is connected to the wiring system, the wiring system connects between the sockets and the connector, and has a plurality of wires having different wiring lengths; One end of the first capacitor and the second capacitor is connected to the wiring, and the other end is grounded, The capacitance of the first capacitor is larger than the capacitance of the second capacitor, the first capacitor is connected to one of the plurality of wirings having a shorter wiring length, and the second capacitor is connected to one of the plurality of wirings having a longer wiring length. The first capacitor and the second capacitor are connected to the upstream side or the downstream side of the compensation circuit. This is also fine.

[0008] [ 5 In the above invention, test The signal is a test signal to a DUT that is electrically connected to the socket. but good. [ 6 A burn-in apparatus according to the present invention is a burn-in apparatus including the above-mentioned burn-in board. Effect of the Invention

[0009] According to the present invention, a burn-in board includes a board, a socket mounted on the board, a connector mounted on the board, a wiring system provided on the board and connecting the sockets and the connector, and a compensation circuit connected to the wiring system and compensating for the frequency characteristics of a signal transmitted through the wiring system. As a result, even if the number of sockets on the burn-in board increases, the present invention can suppress a decrease in the test quality of the burn-in test. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a front view showing a burn-in apparatus in a first embodiment of the present invention. [Diagram 2] FIG. 2 is a block diagram showing a system configuration of the burn-in device in the first embodiment of the present invention. [Diagram 3] FIG. 3 is a schematic plan view showing a wiring system of a burn-in board in the first embodiment of the present invention. [Figure 4] FIG. 4 is a diagram for explaining a wiring circuit of a burn-in board in the first embodiment of the present invention. [Diagram 5] FIG. 5 is a graph for explaining signal characteristics in the wiring circuit of FIG. [Figure 6] FIG. 6 is a graph for explaining the rise time of a signal flowing through the wiring circuit of FIG. [Figure 7] FIG. 7 is a diagram for explaining a wiring circuit of a burn-in board in the second embodiment of the present invention. [Figure 8] FIG. 8 is a graph for explaining the rise time of a signal flowing through the wiring circuit of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] First Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0012] First, the overall configuration of a burn-in apparatus 1 in this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a front view of the burn-in apparatus in this embodiment, and Figure 2 is a block diagram showing the system configuration of the burn-in apparatus in this embodiment.

[0013] The burn-in device 1 in this embodiment is a device for performing a burn-in test, which is a type of screening test for the purpose of extracting initial defects in DUTs such as IC chips and removing initial defective products. As shown in Figures 1 and 2, this burn-in device 1 includes a burn-in chamber 11 capable of accommodating a burn-in board 20, a test power supply 12 that applies a power supply voltage to a DUT 100 (see Figure 2) mounted on the burn-in board 20, and a burn-in controller 13 that inputs and outputs signals to the DUT 100.

[0014] This burn-in apparatus 1 applies a power supply voltage to the DUT 100 and inputs and outputs signals while applying thermal stress (e.g., about −55° C. to +125° C.) to the DUT 100 mounted on a burn-in board 20 housed in a burn-in chamber 11, thereby screening the DUT 100. The DUT 100 in this embodiment is a memory-based device. Note that the DUT 100 to be tested is not particularly limited, and may be, for example, a logic-based device or a SoC (System on a chip).

[0015] 1, the burn-in chamber 11 has a temperature-controlled room 111 partitioned by a heat-insulating wall or the like, and a door 112 that can open and close the temperature-controlled room 111. A plurality of slots 113 for holding the burn-in boards 20 are provided inside the temperature-controlled room 111. Each slot 113 has a pair of rails 114 that support both the left and right ends of the burn-in board 20. The burn-in board 20 is carried into the temperature-controlled room 111 through the door 112 while sliding on the rails 114. Two rows of 24-level slots 111 are provided inside the temperature-controlled room 111, making it possible to accommodate a total of 48 burn-in boards 20.

[0016] In the figure, one door (the door on the right side in the figure) is not shown, and the temperature-controlled chamber 111 is shown in an open state. In contrast, the other door 112 (the door on the left side in the figure) is shown in a closed state, and therefore the 24 rows of slots 113 on the left side in the figure are not shown. In addition, the number and arrangement of the slots 113 (i.e., the number and positional relationship of the burn-in boards 20 accommodated in the temperature-controlled chamber 111) are not limited to the example shown in FIG. 1, and can be set arbitrarily in consideration of test efficiency, etc.

[0017] A connector 115 (see FIG. 2) is provided at the back of each slot 113. The connector 115 can receive the connector 80 of the burn-in board 20 inserted into the slot 113.

[0018] 2, this connector 115 is electrically connected to the DUT power supply 12 and the burn-in controller 13. Although only one burn-in board 20 is shown in FIG. 2, in reality, the other burn-in boards 20 are also connected to the DUT power supply 12 and the burn-in controller 13 in a similar manner.

[0019] 1, the burn-in chamber 11 further includes an evaporator 116, a heater 117, and a fan 118. The air in the temperature-constant chamber 111 is circulated by the fan 118, and is cooled by the evaporator 116 and heated by the heater 117, thereby adjusting the temperature in the temperature-constant chamber 111. The operations of the evaporator 116, the heater 117, and the fan 118 are controlled by the burn-in controller 13.

[0020] The DUT power supply 12 is connected to each DUT 100 on the burn-in board 20 via the connectors 115 and 60 so as to apply a power supply voltage to each DUT 100 on the burn-in board 20 , and is controlled by the burn-in controller 13 .

[0021] In addition to controlling the application of voltage to DUT 100, the input and output of signals to DUT 100, and the temperature adjustment within the temperature-controlled chamber 111, the burn-in controller 13 is capable of determining that a DUT that exhibits an abnormal reaction during the burn-in test is defective, storing the serial number of the DUT (for example, corresponding to the number of slot 113 and the position on the burn-in board 20), and feeding back the test results.

[0022] Next, the burn-in board 20 in this embodiment will be described with reference to Fig. 3. Fig. 3 is a schematic plan view showing the wiring system of the burn-in board in this embodiment.

[0023] As shown in FIG. 3, the burn-in board 20 in this embodiment includes a wiring board 30, a plurality of (320 in this example) sockets 70 mounted on the wiring board 30, and a connector 80 mounted on the wiring board 30.

[0024] Socket 70 (A1~P 20 ) can be fitted with a DUT 100. 20 ) are collectively referred to as socket 70, and individual sockets 70 are also referred to as socket 70A1 and socket 70A2. Connector 80 is mounted on one end (upper edge in FIG. 3) 41 of substrate 40 of wiring board 30, and can be fitted into connector 115 provided in burn-in chamber 11 as described above. When connector 80 is fitted into burn-in chamber 11, socket 70 is electrically connected to a driver of the burn-in controller via connector 80. Burn-in board 20 may include a reinforcing frame that reinforces wiring board 30 and a bottom cover that protects the back surface of the wiring board.

[0025] Each socket 70 has a plurality of contact pins (16 in this example) that come into contact with the terminals of the DUT 100. When the DUT 100 is attached to the socket 70 during a burn-in test, the contact pins come into contact with the terminals of the DUT 100, electrically connecting the DUT 100 and the socket 70. Sockets 70A1 to 70P 20 All of them have the same structure.

[0026] As shown in FIG. 3, a plurality of sockets 70A1 to 70P 20 are arranged in a matrix on substrate 40 of wiring board 30.

[0027] More specifically, in this embodiment, twenty sockets 70A1 to 70A are arranged along one direction (the Y-axis direction in FIG. 3) on the substrate 40. 20 are arranged as an example, and these sockets 70A1 to 70A 20A single socket row is formed by

[0028] Similarly, 20 sockets 70B1 to 70B arranged in one direction 20 are lined up in a row, and these sockets 70B1 to 70B 20 A single socket row is formed by the remaining sockets 70C1 to 70P. 20 Similarly, 20 sockets 70 are arranged in a row in the same direction for each of the first and second terminals.

[0029] The number of sockets 70 mounted on the substrate 40 is not particularly limited to the above. Furthermore, the arrangement of the sockets 70 on the substrate 40 is not particularly limited to the above.

[0030] In the present embodiment, wiring board 30 includes the above-mentioned plurality of sockets 70A1 to 70P. 20 3, wiring board 30 includes an electrically insulating substrate 40 and a wiring system 50. In this embodiment, wiring board 30 is a multi-layer wiring board, and each wiring system is formed by a wiring pattern formed on substrate 40 and a conductive path such as a via hole.

[0031] In this embodiment, the first wiring system 50a1 to 50h 10 The type of connection form of the first wiring system 50a1-50h is different from the type of connection form of the second wiring system 60a-60p. Here, the connection form (Connection form / Connection topology) refers to the form of electrical connection between the connector 80 and the multiple sockets 70 in the wiring board 30, and is expressed by a connection path (positional relationship between the wiring and the branch points) that is configured by combining the wiring that connects the connector 80 and the multiple sockets 70 and the branch points. The types of this connection form can be classified according to the presence or absence of a branch point and the position of the branch point. In this embodiment, the first wiring system 50a1-50h 10has a connection form having a branch point, whereas second wiring systems 60a-60p have a connection form without a branch point. Note that the number of types of connection forms of the wiring systems in wiring board 30 is not particularly limited, and the wiring board may have wiring systems with three or more types of connection forms.

[0032] First wiring system 50a1 to 50h 10 Since the first wiring system 50a1 has a basically identical configuration, the configuration of the first wiring system 50a1 will be described below as a representative, and the configuration of the other first wiring systems 50a2 to 50h will be described below as a representative. 10 Similarly, since the second wiring systems 60a to 60p basically have the same configuration, the configuration of the second wiring system 60a will be representatively described below, and descriptions of the configurations of the other second wiring systems 60b to 60p will be omitted.

[0033] The first wiring system 50a1 has a connection form in which the wiring branches between the connector 80 and the socket 70A1 and has a portion connected to the socket 70B1. That is, in the first wiring system 50a1, the wiring branches into two between the connector 80 and the sockets 70A1 and 70B1. In the first wiring system 50a1, the socket 70A1 and the socket 70A2 that is adjacent to the socket 70A1 along the Y-axis direction are connected in a daisy chain by wiring. Similarly, in the first wiring system 50a1, the socket 70B1 and the socket 70B2 that is adjacent to the socket 70B1 along the Y-axis direction are connected in a daisy chain by wiring.

[0034] In this embodiment, the length of the wiring between the branch point of the first wiring system 50a1 and the socket 70A1 is substantially the same as the length of the wiring 53 between the branch point and the socket 70B1, so that the transmission time of the signal in the socket 70A1 is substantially the same as the transmission time of the signal in the socket 70B1.

[0035] In addition, the length of the wiring between the socket 70A1 and the socket 70A2 is substantially the same as the length of the wiring between the socket 70B1 and the socket 70B2. Therefore, the total length of the wiring between the branch point of the first wiring system 50a1 and the socket 70A2 and the wiring connecting the socket 70A1 and the socket 70A2 in a daisy chain is substantially the same as the total length of the wiring between the branch point of the first wiring system 50a1 and the socket 70B2 and the wiring connecting the socket 70B1 and the socket 70B2 in a daisy chain. Therefore, the transmission time of the signal of the socket 70A2 is substantially the same as the transmission time of the signal of the socket 70B2.

[0036] The first wiring system 50a2 also has a wiring system similar to the above-mentioned first wiring system 50a1, and as shown in FIG. 3, connects the connector 80 to four sockets 70A3, 70A4, 70B3, and 70B4.

[0037] Although not specifically shown, the first wiring systems 50a3 to 50a9 also have wiring systems similar to the above-mentioned first wiring system 50a1. The first wiring system 50a3 connects the connector 80 and the four sockets 70A5, 70A6, 70B5, and 70B6. The first wiring system 50a4 connects the connector 80 and the four sockets 70A7, 70A8, 70B7, and 70B8. The first wiring system 50a5 connects the connector 80 and the four sockets 70A9, 70A10, 70B11, and 70B12. 10 ,70B9,70B 10 The first wiring system 50a6 connects the connector 80 and the four sockets 70A 11 ,70A 12 ,70B 11 ,70B 12 The first wiring system 50a7 connects the connector 80 and the four sockets 70A 13 ,70A 14 ,70B 13 ,70B 14 The first wiring system 50a8 connects the connector 80 and the four sockets 70A 15 ,70A 16 ,70B 15 ,70B 16The first wiring system 50a9 connects the connector 80 and the four sockets 70A 17 ,70A 18 ,70B 17 ,70B 18 and is connected.

[0038] First wiring system 50a 10 The second wiring system 50a1 has a wiring system similar to the first wiring system 50a1 described above, and includes a connector 80 and four sockets 70A, as shown in FIG. 19 ,70A 20 ,70B 19 ,70B 20 and is connected.

[0039] That is, the first connection configurations 50a1 to 50a2 in which four sockets 70 are connected to the connector 80 for each of the two socket rows 75A and 75B are 10 Similarly, in the other socket rows 75C to 75P, ten first connection configurations 50b1 to 50h are provided for every two socket rows. 10 As a result, the burn-in board 20 of this embodiment has 320 sockets 70A1 to 70P. 20 For the 80 first connection configurations 50a1 to 50h 10 It is equipped with:

[0040] In contrast, the second wiring system 60a includes a connector 80 and sockets 70A1 to 70A 20 In the second wiring system 60a, twenty sockets 70A1 to 70A2 are arranged in a line along the first direction to form a socket row 75A. 20 However, the connection lines 62a1 to 62a 19 are connected in a daisy chain by

[0041] The second wiring system 60b also has a wiring system similar to the above-mentioned second wiring system 60a, and the socket row 75B includes 20 sockets 70B1 to 70B 20 are connected in a daisy chain.

[0042] Similarly, the second wiring systems 60c to 60p have a wiring system similar to the second wiring system 60a described above, and each of the second wiring systems 60c to 60p connects the 20 sockets 70 that make up each of the socket rows 75C to 75P in a daisy chain configuration.

[0043] In substrate 40 of wiring board 30, connector 80 is mounted on one end 41 of substrate 40, and sockets 70 are arranged side by side along the Y direction. Therefore, in one socket row, socket 70A1 is arranged at the position closest to connector 70, and socket 70A 20 is disposed at the position furthest from the connector 70. Therefore, the first wiring system 50a 10 Wiring 51a from the branch point to the connector 80 10 The wiring length of the first wiring system 50a1 is longer than the wiring length of the wiring 51a1 from the branch point of the first wiring system 50a1 to the connector 80.

[0044] Here, we will explain the relationship between the wiring length and the rise time and fall time of the test signal input / output from the burn-in controller 13 to the DUT 100. Note that since the rise and fall of the test signal are symmetrical, the following explanation will be about the rise of the test signal, but the relationship between the wiring length and the rise of the test signal is the same as the relationship between the wiring length and the fall of the test signal, so the explanation will be omitted.

[0045] Various test signals are used for testing the DUT 100 depending on the type of test. For example, when performing a clock test on the DUT 100, the test signal for the DUT 100 includes an input signal input to the DUT 100. On the other hand, for example, when performing a memory test on the DUT 100, the test signal for the DUT 100 includes both an input signal input to the DUT 100 and an output signal output from the DUT 100. A specific example of such a test signal is a signal including a signal for writing data to the DUT 100 and a signal for reading data from the DUT 100.

[0046] Since the test signal for the clock test contains only an input signal, the test speed requirement is low and the rise time of the test signal can be long. On the other hand, since the test signal for the memory test contains an input signal for reading and an output signal for writing, the test speed requirement is high and a short rise time is required. Therefore, when testing the DUT100 using the test signal for the memory test, input and output signals with short rise and fall times are required.

[0047] The rise time of the test signal of the DUT 100 is affected by the length of the wiring connecting the connector 80 and the socket 70. Since the length of the wiring 51a1 included in the first wiring system 50a1 connecting the connector 80 and the sockets 70A1, A2, B1, and B2 is short, the attenuation of the signal flowing through the first wiring system 50a1 is small. 19 , A 20 , B 19 , B 20 A first wiring system 50a that connects 10 Wiring included in 51a 10 Since the wiring length of the first wiring system 50a1 is long, the attenuation of the signal flowing through the first wiring system 50a1 is large. 10 The rise time of the test signal flowing through the first wiring system 50a1 is longer than the rise time of the test signal flowing through the first wiring system 50a1. That is, when the sockets 70 are arranged on the wiring board 30 as shown in Fig. 3, a test signal that satisfies the rise time requirement can be input / output to the DUT 100 connected to the socket 70 closer to the connector 80. On the other hand, there is a possibility that a test signal that satisfies the rise time requirement cannot be input / output to the DUT 100 connected to the socket 70 farther from the connector 80.

[0048] In this embodiment, a compensation circuit 90 is provided in order to shorten the rise time of a test signal in a wiring system having long wiring. 20 4, the compensation circuit 90 is a wiring circuit between the connector 80 and the socket A. 20 A wiring system 50A connecting10 The compensation circuit 90 is connected to the first wiring system 50a. 10 The compensation circuit 90 is a circuit that compensates for the frequency characteristics of a test signal transmitted through the first wiring system 50a1 to 50a2. The compensation circuit 90 has a parallel circuit of a capacitor 91 and a resistor 92. The parallel circuit of the capacitor 91 and the resistor 92 is an RC filter. The compensation circuit 90 is 10 Wiring 51a1 to 51a 10 Among them, the wirings 51a1 to 51a 10 At least wire a is connected to 10 It is connected to the wiring 51a. 10 The compensation circuit 90 may be connected to the first wiring system 50a1 to 50a2, but may be connected to a termination resistor for impedance matching between the input side and the output side of the DUT 100. 10 Not limited to the first connection form 50b1 to 50h 10 1, or may be connected to the second connection configuration 60a to 60p.

[0049] 5 is a graph showing the frequency characteristics of the compensation circuit 90, where the horizontal axis indicates frequency and the vertical axis indicates gain. As shown in FIG. 5, the compensation circuit 90 functions as a high-pass filter. The compensation circuit 90 operates when the frequency of the test signal is higher than the high-side threshold frequency (f b ), the signal is multiplied with the maximum gain Kb and transmitted. а If the frequency of the test signal is lower than the high-side threshold frequency (f b ) below the low threshold frequency (f а ), the compensation circuit 90 applies a gain between Ka and Kb such that the higher the frequency, the higher the gain, and outputs the signal. In other words, the compensation circuit 90 makes the amplitude of the low-frequency side of the test signal smaller than the amplitude of the high-frequency side. а , f b) and the gains Kа and Kb are set according to the rise time required for the test signal. For example, to make the rise time shorter, the threshold frequency (f а , f b ) can be set to a lower value. In other words, the frequency characteristic of the test signal compensated for by the compensation circuit 90 is set according to the rise time or fall time required for the test signal.

[0050] 6 shows the voltage characteristics of a signal compensated by compensation circuit 90 and the voltage characteristics of a signal not compensated by compensation circuit 90. The vertical axis represents voltage and the horizontal axis represents time. In Fig. 6, graph A shows the characteristics of signal A not compensated by compensation circuit 90, and graph B shows the characteristics of signal B compensated by compensation circuit 90.

[0051] The rise time of a test signal is the time it takes for the voltage to change from 20% to 80% at the rise time, assuming that the maximum voltage at the rise time of the signal is 100%. In Figure 6, A (100%) indicates the maximum voltage at the rise time of signal A, A (80%) indicates a voltage that is 80% of the maximum voltage at the rise time of signal A, and A (20%) indicates a voltage that is 20% of the maximum voltage at the rise time of signal A. In addition, B (100%) indicates the maximum voltage at the rise time of signal B, B (80%) indicates a voltage that is 80% of the maximum voltage at the rise time of signal B, and B (20%) indicates a voltage that is 20% of the maximum voltage at the rise time of signal B.

[0052] The rise time of the signal not compensated by the compensation circuit 90 is Ta, and the rise time of the signal not compensated by the compensation circuit 90 is Tb (<Ta). In the signal waveform at the rise of the test signal, the waveform in the first half of the rise is greatly affected by the high-frequency components of the signal, and the waveform in the second half of the rise is greatly affected by the low-frequency components of the signal. The compensation circuit 90 reduces the gain on the low-frequency side and increases the gain on the high-frequency side. Therefore, as shown in FIG. 6, for signal B, the voltage from the start of the rise of signal B until a certain time has elapsed changes with the same characteristics as signal A, but the maximum voltage of the rise of signal B is lower than the maximum voltage of signal A. That is, the compensation circuit 90 shortens the apparent rise time by suppressing the maximum voltage at the rise without changing the slope of the voltage at the rise of the test signal. Thereby, the compensation circuit 90 can shorten the rise time of the test signal in a wiring system having a long wiring length connected to a wiring with a long wiring length.

[0053] As described above, the burn-in board 20 and the burn-in device 1 according to the present embodiment include the socket 70, the connector 80, and the first wiring systems 50a1 to 50h that connect the plurality of sockets 70 and connectors 80 10 and / or the second wiring systems 60а to 60p, and the first wiring systems 50a1 to 50h 10The burn-in controller 13 includes a compensation circuit 90 connected to the first and second wiring systems 60a to 60p, which compensates for the frequency characteristics of the signal (test signal) transmitted through the wiring system. This can shorten the rise time and / or fall time of the signal. The burn-in controller 13 adjusts the output timing of the signal so that the same timing test signal reaches all DUTs 100 as much as possible, but if the operation rate is increased, the calibration on the tester side may not work, and the signal reading timing may be shifted. In particular, the longer the wiring length of the wiring that transmits the signal, the longer the delay time of the rise time and / or fall of the signal, which affects the test performance. In this embodiment, the compensation circuit 90 is connected to the connection system having a long wiring length, so that the rise time and / or fall time can be shortened. As a result, even if the number of sockets on the burn-in board is increased, it is possible to suppress the deterioration of the test quality of the burn-in test.

[0054] In this embodiment, the compensation circuit 90 has a filter that makes the amplitude of the low frequency side of the signal smaller than the amplitude of the high frequency side, thereby shortening the apparent rise time and / or fall time of the signal.

[0055] In this embodiment, the first wiring system 50a1 to 50h 10 And / or the second wiring system 60a-60p has a plurality of wirings with different wiring lengths, and the compensation circuit 90 is connected to the wiring with the longer wiring length among the plurality of wirings. This makes it possible to reduce the rise and / or rise delay caused by the wiring with a long wiring length.

[0056] In this embodiment, the frequency characteristic compensated for by the compensation circuit is set according to the rise time or fall time required for the test signal, thereby shortening the rise time and / or fall time of the signal.

[0057] Second Embodiment FIG. 7 is a diagram for explaining a wiring circuit of a burn-in board in this embodiment.

[0058] The burn-in board 20 in this embodiment includes a first wiring system 50a1 to 50h 10 and / or an external capacitor connected to the second wiring system 60a-60p. The second embodiment differs from the first embodiment in that it has an external capacitor, but the other configurations are the same. Below, the burn-in board 20 in the second embodiment will be described only in terms of differences from the first embodiment, and the same reference numerals will be used to denote parts having the same configuration as the first embodiment, and description thereof will be omitted.

[0059] FIG. 7(a) shows a wiring circuit of a first wiring system 50a1 connecting between a connector 80 and a socket 70A1, and FIG. 7(b) shows a wiring circuit of a first wiring system 50a1 connecting between the connector 80 and the socket 70A1. 20 A first wiring system 50a connecting 10 The first wiring system 50a1 has a wiring 51a1 that connects between a branch point of the first wiring system 50a1 and the connector 80. A first capacitor 111 is connected to the wiring 51a1. 10 The first wiring system 50a 10 and a connector 80. 10 Also, the wiring 51a 10 A second capacitor 112 is connected to the first capacitor 111. The capacitance of the first capacitor 111 is larger than the capacitance of the second capacitor 112. The connection position of the second capacitor is not limited to the downstream side of the compensation circuit 90 as shown in FIG. 7(b), but may be the upstream side of the compensation circuit 90.

[0060] The socket 70A1 has a plurality of contact pins, which are arranged to correspond to the terminals of the DUT 100. The contact pins are arranged densely to accommodate multiple channels. 20 also has contact pins.

[0061] Socket 70A1~70P 20Since the contact pins are arranged at a high density, the distance between adjacent pins is short. 10 Depending on the position on the wiring board 30, the adjacent distance between the first and second wiring systems 60a to 60p may be short in some places. When the adjacent distance between the pins or between the wirings becomes short, crosstalk may occur. In particular, crosstalk occurs in high-frequency signals. On the other hand, the shorter the rise time and / or fall time required for the test signal, the more high-frequency components the test signal contains. In order to suppress crosstalk, it is sufficient to reduce the high-frequency components of the test signal, but the rise time and / or fall time will be longer. In other words, there is a trade-off between crosstalk and the rise / fall time of the test signal. Furthermore, as in the first embodiment, the rise / fall time of the test signal is also affected by the length of the wiring.

[0062] In this embodiment, the first capacitor 111 is connected to the wiring 51a1 so that the rise time and / or fall time of the test signal falls within a required time while suppressing crosstalk according to the wiring length. 10 A second capacitor 112 is connected to the

[0063] FIG. 8(a) shows the voltage characteristics of a signal transmitted through the wiring 51a1, and FIG. 10 8(a) and 8(b) show the voltage characteristics of the signal when the first capacitor 111 and the second capacitor 112 are not connected. The solid line graph shows the voltage characteristics of the signal when the first capacitor 111 and the second capacitor 112 are connected.

[0064] In the case where crosstalk occurs due to a short rise time of the test signal and a large amount of high frequency components, an external capacitor (corresponding to the first capacitor 111 and the second capacitor 112) is connected to the wiring 51a1 and the wiring 51a 10The wiring 51a1 has a short length and small signal attenuation, and therefore a short rise time (see the dotted line graph in FIG. 8(a)). For this reason, a first capacitor 111 with a large capacitance is connected to the wiring a1. As shown in the solid line graph in FIG. 8(a), the rise time (T1) is lengthened by the first capacitor 111. Since the rise time (T1) is lengthened and the high frequency components of the test signal are suppressed, crosstalk can be suppressed.

[0065] Wiring 51a 10 Since the wiring length is long, the signal attenuation is large, and the rise time is long (see the dotted line graph in FIG. 8(b)). 10 8(b), the rise time (T1) becomes longer due to the second capacitor 112. However, since the capacitance is smaller, the adjustment range of the rise time by connecting the second capacitor 112 is shorter than that of the first capacitor 111. The rise time (T2) becomes longer and the high frequency components of the test signal are suppressed, so crosstalk can be suppressed.

[0066] As described above, the burn-in board 20 and the burn-in device 1 according to the present embodiment include the first wiring system 50a1, 10 The first wiring system 50a1, 50a2 includes external capacitors including a first capacitor 111 and a second capacitor 112. 10 Can hold multiple sockets 70 A1 , 70 A20 and the connector 80, the first capacitor 111 is connected to the wiring 51a1 having a shorter wiring length, and the second capacitor 111 is connected to the wiring 51a2 having a longer wiring length. 10 A second capacitor 112 is connected to the line 111. This makes it possible to adjust the rise time and / or fall time of the test signal to an optimal length while suppressing crosstalk in wirings of different lengths.

[0067] The external capacitor is connected to the first wiring system 50a1, 50a 10 Not limited to the above, other first wiring systems 50a2 to 50a9, 50b1 to 50h10 In this case, the capacitance of the capacitor may be increased as the length of the wiring is shorter.

[0068] The above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0069] For example, the configuration of the burn-in apparatus 1 described above is merely an example and is not particularly limited to the above. For example, the burn-in apparatus 1 described above uses a temperature-controlled room 111 to adjust the temperature of the DUT 100, but is not particularly limited to this. For example, the burn-in apparatus 1 may adjust the temperature of the DUT by contacting a pusher for temperature adjustment with the DUT 100. [Explanation of symbols]

[0070] 1...Burn-in equipment 11…Burn-in chamber 12…DUT power supply 12...Test power supply 13…Burn-in controller 20…Burn-in board 20…Burnin' Board 30...Wiring board 40…Substrate 41...End 50a1~50h 10 …First wiring system 50a1~50a 10 …wiring 60a~60p...Second wiring system 70,70A1~70P 20 …socket 75A~75P...Socket row 80…Connector 100…DUT

Claims

1. Substrate and a socket mounted on the substrate; A connector mounted on the substrate; a wiring system provided on the board and connecting the sockets and the connector; a compensation circuit connected to the wiring system; The compensation circuit comprises: an RC filter having a resistor and a capacitor connected in parallel is connected in series to the wiring system connecting the socket and the connector; A burn-in board that makes the gain on the low frequency side of the test signal transmitted through the wiring system smaller than the gain on the high frequency side.

2. 2. The burn-in board of claim 1, The compensation circuit is a burn-in board that makes the amplitude of the low frequency side of the test signal smaller than the amplitude of the high frequency side.

3. 3. The burn-in board according to claim 1, The wiring system has a plurality of wirings having different wiring lengths, The compensation circuit is a burn-in board connected to one of the plurality of wirings having a longer wiring length.

4. The burn-in board according to any one of claims 1 to 3, an external capacitor connected to the wiring system, the external capacitor including a first capacitor and a second capacitor; the wiring system includes a plurality of wires having different lengths, the wires connecting the plurality of sockets and the connector; one end of the first capacitor and one end of the second capacitor are connected to the wiring, and the other end is grounded; the capacitance of the first capacitor is greater than the capacitance of the second capacitor; the first capacitor is connected to one of the plurality of wirings having a shorter wiring length; the second capacitor is connected to one of the plurality of wirings that has a longer wiring length; The first capacitor and the second capacitor are connected to a burn-in board on the upstream side or downstream side of the compensation circuit.

5. The burn-in board according to any one of claims 1 to 4, The test signal is a burn-in board that is a test signal to a DUT that is electrically connected to the socket.

6. A burn-in device comprising the burn-in board according to any one of claims 1 to 5.

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