Mounting system and mounting method

Abstract

The present disclosure addresses the problem of improving the quality of mounting with respect to a first target object. This mounting system (10) comprises a mounting head (1), an imaging device (2), and a control device (3). The mounting head (1) includes a capturing part (11) that captures the first target object. The mounting head (1) holds the capturing part (11) so that the same can be moved towards a second target object. The imaging device (2) is provided to the mounting head (1). The imaging device (2) has an imaging visual field that includes an identification region including a target object to be identified. The control device (3) controls the movement of the capturing part (11) so that the capturing part (11) moves towards the second target object.

Description

[Technical field]

[0001] The present disclosure generally relates to a mounting system and a mounting method. More specifically, the present disclosure relates to a mounting system and a mounting method including a capture unit that captures a first object. [Background technology]

[0002] Patent Document 1 describes a component mounting device that mounts components at predetermined positions on a board.

[0003] In the component mounting device described in Patent Document 1, a warp detector detects the amount of warp in a board, and mounts components at a mounting height that is set according to the amount of warp. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2004-71641 A Summary of the Invention

[0005] In the component mounting device described in Patent Document 1, the warpage of the entire board is estimated from detection data of the warpage amount at several points on the board, so it is difficult to detect the actual mounting height for each mounting position. Therefore, for example, if the board is warped in the thickness direction, there is a possibility that mounting defects of the component (first object) will occur.

[0006] An object of the present disclosure is to provide a mounting system and a mounting method that can improve the mounting quality of a first object.

[0007] A mounting system according to one embodiment of the present disclosure includes a mounting head, an imaging device, and a control device. The mounting head has a capture unit that captures a component as a first object. The mounting head holds the capture unit so that it can move toward a board as a second object. The imaging device is provided on the mounting head. The imaging device includes a specific area including a specific object in an imaging field of view. The control device controls the movement of the capture unit so that the capture unit moves toward the board. The control device captures a component as a third object based on an output of the imaging device. The above The control device includes a detection unit that detects when a part has landed on a joining member as a fourth object. The detection unit detects when the third object has landed on the fourth object when the amount of movement of the capture unit as the specific object decreases. The control device executes a first process that is a process of moving the capture unit until the third object has landed on the fourth object. A mounting system according to another aspect of the present disclosure includes a mounting head, an imaging device, and a control device. The mounting head has a capture unit that captures a component as a first object. The mounting head holds the capture unit so that it can move toward a container as a second object. The imaging device is provided on the mounting head. The imaging device includes a specific area including a specific object in an imaging field of view. The control device controls the movement of the capture unit so that the capture unit moves toward the container. The control device has a detection unit that detects, based on an output of the imaging device, that the capture unit as the specific object has landed on a surface of the component contained in the container. The detection unit detects that the capture unit has landed on the surface of the component by the amount of movement of the capture unit becoming smaller. The control device executes a first process that is a process of moving the capture unit until the capture unit has landed on the surface of the component.

[0008] A mounting method according to one aspect of the present disclosure is a mounting method used in a mounting system including a mounting head and an imaging device. The mounting head has a capture unit that captures a component as a first object. The mounting head holds the capture unit movably toward a board as a second object. The imaging device is provided on the mounting head. The imaging device includes a specific area including a specific object in an imaging field of view. The mounting method further includes capturing a third object as a third object based on an output of the imaging device. The above The mounting method further includes a detection step of detecting that the component has grounded to a joining member serving as a fourth object. In the detection step, it is detected that the third object has grounded to the fourth object when the amount of movement of the capture part serving as the specific object decreases. The mounting method further includes a control step of executing a first process which is a process of moving the capture part until the third object has grounded to the fourth object. A mounting method according to another aspect of the present disclosure is a mounting method used in a mounting system including a mounting head and an imaging device. The mounting head has a capture unit that captures a component as a first object. The mounting head holds the capture unit movably toward a container as a second object. The imaging device is provided on the mounting head. The imaging device includes a specific area including a specific object in an imaging field of view. The mounting method includes a detection step of detecting that the capture unit as the specific object has landed on a surface of the component contained in the container based on an output of the imaging device. In the detection step, it is detected that the capture unit has landed on the surface of the component by detecting that the amount of movement of the capture unit becomes small. The mounting method further includes a control step of executing a first process that is a process of moving the capture unit until the capture unit has landed on the surface of the component. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic perspective view of a mounting system according to the first embodiment. [Diagram 2] FIG. 2 is a block diagram of the above mounting system. [Diagram 3]3A to 3D are explanatory diagrams for explaining the operation of the mounting system. [Figure 4] FIG. 4 is a flowchart for explaining the operation of the mounting system. [Diagram 5] FIG. 5 is a block diagram of a mounting system according to the second embodiment. [Figure 6] 6A to 6D are explanatory diagrams for explaining the operation of the mounting system. [Figure 7] FIG. 7 is a flowchart for explaining the operation of the mounting system. [Figure 8] 8A to 8C are explanatory diagrams for explaining the operation of the mounting system according to the first modification of the second embodiment. [Figure 9] FIG. 9 is a flowchart for explaining the operation of the mounting system. [Figure 10] FIG. 10 is a schematic side view of a main part of a mounting system according to Modification 2 of the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] (Embodiment 1) Hereinafter, a mounting system 10 and a mounting method according to this embodiment will be described with reference to FIGS.

[0011] (1) Overview 1, a mounting system 10 according to this embodiment is a mounting device (mounter) for mounting a first object T1 captured by a capture unit 11 onto a second object T2. The mounting system 10 is used in operations for manufacturing various products such as electronic devices, automobiles, clothing, food, medicines, and crafts in facilities such as factories, laboratories, offices, and educational facilities.

[0012] In this embodiment, a case where the mounting system 10 is used for manufacturing electronic devices in a factory will be described. A typical electronic device has various circuit blocks such as a power supply circuit and a control circuit. In manufacturing these circuit blocks, as an example, a solder coating process, a mounting process, and a soldering process are performed in this order. In the solder coating process, cream solder is applied (or printed) on a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the board. In the soldering process, for example, the board on which the components are mounted is heated in a reflow furnace to melt the cream solder and perform soldering. In the mounting process, the mounting system 10 performs an operation of mounting the component 100, which is the first object T1, on the board 200, which is the second object T2. That is, in the mounting system 10 according to this embodiment, the first object T1 is the component 100, and the second object T2 is the board 200 on which the component 100 is mounted.

[0013] In this manner, a mounting system 10 used to mount a first object T1 (component 100) on a second object T2 (substrate 200) includes a mounting head 1 having a capture unit 11 for capturing the first object T1, as shown in Fig. 1. The capture unit 11 is, for example, a suction nozzle, and captures (holds) the first object T1, which is the component 100, in a state in which it can be released (i.e., released from capture). With the first object T1 captured by the capture unit 11, the mounting system 10 lowers the capture unit 11 so as to approach the second object T2, and mounts the first object T1 on the mounting surface T21 of the second object T2.

[0014] In such a mounting system 10, when mounting the first target T1 on the mounting surface T21 of the second target T2, it is required to image the specific region R1 (see FIGS. 3A to 3D) for the purpose of recognizing the specific region R1 (mounting position) on the mounting surface T21. Therefore, the mounting system 10 according to this embodiment includes an imaging device 2 as shown in FIG. 3A in addition to the mounting head 1. As a result, the mounting system 10 images the specific region R1 of the mounting surface T21 with the imaging device 2, and for example, during mounting of the first target T1 by the mounting head 1, it becomes possible to confirm the state of the specific target TA (see FIG. 3A) included in the specific region R1 by the image. Therefore, in this embodiment, the imaging device 2 is configured to be able to image at least the region directly below the capture unit 11 of the mounting surface T21. In this embodiment, the specific target TA is a contact member 9 that contacts both the component 100 and the board 200. In this embodiment, the contact member 9 is a joining member 91 that joins the component 100 and the board 200, and is, for example, solder.

[0015] That is, the mounting system 10 according to this embodiment includes a mounting head 1, an imaging device 2 (see FIG. 3A), and a control device 3 (see FIG. 2). The mounting head 1 has a capture unit 11 that captures a first target T1. The mounting head 1 holds the capture unit 11 so that it can move toward a second target T2. The imaging device 2 is provided on the mounting head 1. The imaging device 2 includes a specific region R1 (see FIG. 3A) including a specific target TA (see FIG. 3A) in an imaging field of view R10 (see FIG. 3A). The control device 3 controls the movement of the capture unit 11 so that the capture unit 11 moves toward the second target T2, based on information about the specific target TA included in the output of the imaging device 2.

[0016] In the mounting system 10 according to this embodiment, the imaging device 2 includes a specific region R1 including a specific object TA in an imaging field of view R10. In addition, in the mounting system 10, the control device 3 controls the movement of the capture unit 11 based on information about the specific object TA included in the output of the imaging device 2. Therefore, the control device 3 can determine the mounting state of the first object T1 relative to the second object T2, for example, based on the state of the specific object TA. Therefore, according to the mounting system 10 according to this embodiment, the mounting quality of the first object T1 can be improved.

[0017] (2)Details The mounting system 10 and the mounting method according to this embodiment will be described in detail below.

[0018] (2.1) Premise In this embodiment, as an example, a case will be described in which the mounting system 10 is used to mount a component (first object T1) by surface mount technology (SMT). That is, the component 100 as the first object T1 is a surface mount component (SMD: Surface Mount Device), and is mounted by being placed on a surface (mounting surface T21) of a board 200 as a second object T2. However, this is not the only example, and the mounting system 10 may be used to mount a component (first object T1) by insertion mount technology (IMT). In this case, the component 100 as the first object T1 is a component for insertion mounting having lead terminals, and is mounted on the surface (mounting surface T21) of the board (second object T2) by inserting the lead terminals into holes in the board 200 as the second object T2.

[0019] Furthermore, the "imaging optical axis" in this disclosure is the optical axis of an image captured by the imaging device 2, and is an optical axis determined by both the imaging element 21 (see FIG. 2) and the optical system 22 (see FIG. 2) of the imaging device 2, which will be described later. In other words, the optical path along which light passes from the center of the image captured by the imaging device 2 is the imaging optical axis Ax1 (see FIG. 3A) of the imaging device 2. Specifically, the straight line connecting the center of the light receiving surface of the imaging element 21 and a portion of the subject that is imaged at the center of the light receiving surface of the imaging element 21 through the optical system 22 is the imaging optical axis Ax1 of the imaging device 2.

[0020] Furthermore, the term "image" in this disclosure refers to an image captured by the imaging device 2, and includes still images (still images) and videos (moving images). Furthermore, "video" includes an image composed of multiple still images obtained by stop-motion photography or the like. The image does not have to be the data itself output from the imaging device 2. For example, the image may be appropriately compressed as necessary, converted into another data format, or processed by cutting out a portion of the image captured by the imaging device 2, adjusting the focus, adjusting the brightness, adjusting the contrast, or the like. In this embodiment, as an example, the image is a full-color video.

[0021] In the following, as an example, three mutually orthogonal axes, X-axis, Y-axis, and Z-axis, are set, and the axes parallel to the surface (mounting surface T21) of the substrate 200, which is the second object T2, are defined as the "X-axis" and "Y-axis", and the axis parallel to the thickness direction of the substrate 200 is defined as the "Z" axis. Furthermore, the side of the capture unit 11 seen from the substrate 200, which is the second object T2, is defined as the positive direction of the Z axis (also referred to as "above"). In addition, the state seen from the positive direction of the Z axis (above) is also referred to as "planar view" below. The X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely indicated for the purpose of explanation, and none of them have any substance. In addition, these directions are not intended to limit the directions when the mounting system 10 is used.

[0022] In addition, pipes for circulating cooling water, cables for supplying power, pipes for supplying air pressure (including positive pressure and vacuum), etc. are connected to the mounting system 10, but in this embodiment, illustration of these is omitted as appropriate.

[0023] (2.2) Overall structure Next, the overall configuration of the mounting system 10 according to this embodiment will be described with reference to FIGS.

[0024] As shown in Figs. 1 and 2, the mounting system 10 according to this embodiment includes a mounting head 1, an imaging device 2, and a control device 3. As shown in Fig. 2, in addition to the mounting head 1, the imaging device 2, and the control device 3, the mounting system 10 according to this embodiment further includes a driving device 4, a component supplying device 5, a conveying device 6, a backup device 7, and a lighting device 8. However, the driving device 4, the component supplying device 5, the conveying device 6, the backup device 7, and the lighting device 8 are not essential components of the mounting system 10. In other words, at least one of the driving device 4, the component supplying device 5, the conveying device 6, the backup device 7, and the lighting device 8 may not be included in the components of the mounting system 10. Also, in Fig. 1, only the mounting head 1 and the driving device 4 are illustrated, and the illustration of the other components of the mounting system 10 is omitted as appropriate.

[0025] The mounting head 1 has at least one capturing unit 11. In this embodiment, the mounting head 1 has one capturing unit 11. With the capturing unit 11 capturing the first object T1 (component 100), the mounting head 1 moves the capturing unit 11 to approach the second object T2 (substrate 200) and mounts the first object T1 on the mounting surface T21 of the second object T2. In other words, the mounting head 1 holds the capturing unit 11 movably between a first position where the capturing unit 11 is closer to the second object T2 and a second position farther away from the second object T2 than the first position. That is, the mounting head 1 holds the capturing unit 11 movably toward the second object T2.

[0026] The imaging device 2 is fixed to the mounting head 1. In this embodiment, the mounting system 10 has one imaging device 2. The imaging device 2 has an imaging element 21 and an optical system 22. The imaging device 2 is, for example, a video camera that captures moving images. In this embodiment, as shown in FIG. 3A, the imaging device 2 includes a specific region R1 including a specific object TA on the mounting surface T21 of the second object T2 (substrate 200) in an imaging field of view R10.

[0027] The control device 3 controls each part of the mounting system 10. The control device 3 mainly comprises a microcontroller having one or more processors and one or more memories. That is, the functions of the control device 3 are realized by the processor of the microcontroller executing a program recorded in the memory of the microcontroller. The program may be pre-recorded in the memory, may be provided via a telecommunication line such as the Internet, or may be provided by recording it on a non-transitory recording medium such as a memory card.

[0028] The control device 3 is electrically connected to, for example, each of the mounting head 1, the imaging device 2, the drive device 4, the component supply device 5, the transport device 6, the backup device 7, and the lighting device 8. The control device 3 outputs a control signal to the mounting head 1 and the drive device 4, and controls the mounting head 1 and the drive device 4 so as to mount at least the first object T1 captured by the capture unit 11 on the mounting surface T21 of the second object T2. The control device 3 also outputs a control signal to the imaging device 2 and the lighting device 8, controls the imaging device 2 and the lighting device 8, and acquires an image captured by the imaging device 2 from the imaging device 2.

[0029] The driving device 4 is a device that moves the mounting head 1. In this embodiment, the driving device 4 moves the mounting head 1 within the XY plane. The "XY plane" here is a plane that includes the X-axis and the Y-axis and is perpendicular to the Z-axis. In other words, the driving device 4 moves the mounting head 1 in the X-axis and Y-axis directions. In this embodiment, since the imaging device 2 is fixed to the mounting head 1, the driving device 4 also moves the imaging device 2 together with the mounting head 1. In other words, the driving device 4 moves the mounting head 1 and the imaging device 2 within the XY plane.

[0030] Specifically, as shown in Fig. 1, the drive device 4 has an X-axis drive unit 41 and a Y-axis drive unit 42. The X-axis drive unit 41 moves the mounting head 1 linearly in the X-axis direction. The Y-axis drive unit 42 moves the mounting head 1 linearly in the Y-axis direction. The Y-axis drive unit 42 moves the mounting head 1 linearly in the Y-axis direction by moving the mounting head 1 together with the X-axis drive unit 41 along the Y-axis. In the present embodiment, as an example, each of the X-axis drive unit 41 and the Y-axis drive unit 42 includes a linear motor, and moves the mounting head 1 by a driving force generated by the linear motor upon receiving a power supply.

[0031] The component supplying device 5 supplies components 100 as first objects T1 to be captured by the capturing unit 11 of the mounting head 1. As an example, the component supplying device 5 has a tape feeder that supplies the components 100 housed in a carrier tape. Alternatively, the component supplying device 5 may have a tray on which a plurality of components 100 are placed. The mounting head 1 captures the first objects T1 (components 100) from such a component supplying device 5 with the capturing unit 11.

[0032] The transport device 6 is a device that transports the board 200 as the second object T2. The transport device 6 is realized by, for example, a belt conveyor. The transport device 6 transports the second object T2 (board 200), for example, along the X-axis. The transport device 6 transports the second object T2 at least below the mounting head 1, that is, to a mounting space that faces the capture unit 11 in the Z-axis direction. Then, the transport device 6 stops the second object T2 in the mounting space until the mounting head 1 completes mounting the first object T1 (component 100) on the second object T2 (board 200).

[0033] The backup device 7 backs up the board 200 as the second object T2 transported to the mounting space by the transport device 6. In other words, the second object T2 (board 200) transported to the mounting space by the transport device 6 is held in the mounting space by the backup device 7. The backup device 7 backs up the second object T2 in the mounting space at least until mounting of the first object T1 (component 100) on the second object T2 (board 200) by the mounting head 1 is completed.

[0034] The illumination device 8 illuminates the imaging field R10 of the imaging device 2. The illumination device 8 only needs to illuminate the imaging field R10 at least at the timing when the imaging device 2 captures an image, and for example, emits light in accordance with the imaging timing of the imaging device 2. In this embodiment, since the image captured by the imaging device 2 is a full-color video, the illumination device 8 outputs light in the wavelength range of the visible light region, such as white light. In this embodiment, as an example, the illumination device 8 has a plurality of light sources such as LEDs (Light Emitting Diodes). The illumination device 8 illuminates the imaging field R10 of the imaging device 2 by emitting light from the plurality of light sources. The illumination device 8 is realized by an appropriate illumination method, such as ring illumination or coaxial epi-illumination. The illumination device 8 is fixed to the mounting head 1 together with the imaging device 2, for example.

[0035] In addition to the above configuration, the mounting system 10 also includes, for example, a communication unit. The communication unit is configured to communicate with a higher-level system directly or indirectly via a network or a repeater. This allows the mounting system 10 to exchange data with the higher-level system.

[0036] (2.3) Mounting head Next, a more detailed configuration of the mounting head 1 will be described with reference to FIGS. 1 to 3D.

[0037] In this embodiment, in addition to the capturing unit 11, the mounting head 1 further has an actuator 12 (see FIG. 2) for moving the capturing unit 11, and a head body 13 for holding the capturing unit 11 and the actuator 12. In the mounting system 10 according to this embodiment, one head body 13 holds one capturing unit 11 and one actuator 12. This enables the mounting head 1 to capture one first object T1 (component 100).

[0038] The capture unit 11 is, for example, a suction nozzle. The capture unit 11 is controlled by the control device 3 and can switch between a capture state in which the first object T1 is captured (held) and a release state in which the first object T1 is released (released from capture). However, the capture unit 11 is not limited to a suction nozzle, and may be configured to capture (hold) the first object T1 by pinching (picking) it like a robot hand, for example.

[0039] Regarding the capture of the first target T1 by the capture unit 11, the mounting head 1 operates by receiving air pressure (vacuum) as power. That is, the mounting head 1 switches the capture unit 11 between a captured state and a released state by opening and closing a valve on a supply path of air pressure (vacuum) connected to the capture unit 11.

[0040] The actuator 12 moves the capturing portion 11 linearly in the Z-axis direction. Furthermore, the actuator 12 rotates the capturing portion 11 in a rotational direction (hereinafter referred to as the "θ direction") around an axis along the Z-axis direction. In this embodiment, as an example, the actuator 12 drives the capturing portion 11 by a driving force generated by a linear motor for the movement of the capturing portion 11 in the Z-axis direction. The actuator 12 drives the capturing portion 11 by a driving force generated by a rotary motor for the movement of the capturing portion 11 in the θ direction. Meanwhile, as described above, the mounting head 1 moves linearly in the X-axis direction and the Y-axis direction by the driving device 4. As a result, the capturing portion 11 included in the mounting head 1 can move in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the driving device 4 and the actuator 12.

[0041] The head body 13 is made of metal and formed into a rectangular parallelepiped shape, for example. The capturing part 11 and the actuator 12 are assembled to the head body 13, whereby the head body 13 holds the capturing part 11 and the actuator 12. In this embodiment, the capturing part 11 is indirectly held by the head body 13 via the actuator 12 in a state in which the capturing part 11 is movable in the Z-axis direction and the θ direction. The mounting head 1 moves within the XY plane as the head body 13 is moved within the XY plane by the driving device 4.

[0042] According to the above-mentioned configuration, the mounting head 1, in a state where the first object T1 (component 100) is captured by the capturing unit 11, moves the capturing unit 11 so as to approach the second object T2 (substrate 200), and can mount the first object T1 on the mounting surface T21 of the second object T2. That is, the mounting head 1 moves the capturing unit 11 at least between a first position where the capturing unit 11 is closer to the second object T2, and a second position which is farther away from the second object T2 than the first position. In short, the mounting head 1 mounts the first object T1 on the mounting surface T21 of the second object T2 by moving the capturing unit 11 in a state where the first object T1 is captured from the second position to the first position.

[0043] In this embodiment, the position of the capturing portion 11 shown in Fig. 3C is the first position, and the position of the capturing portion 11 shown in Fig. 3A is the second position. In other words, the first position is the bottom dead center of the capturing portion 11, and the second position is the top dead center of the capturing portion 11. However, the "bottom dead center" in this disclosure does not refer to the lowest position in the movable range of the capturing portion 11, but to the lowest position of the capturing portion 11 when the first object T1 is mounted on the mounting surface T21 of the second object T2.

[0044] (2.4) Imaging device Next, a more detailed configuration of the imaging device 2 will be described with reference to FIGS. 2 to 3D.

[0045] 2, in this embodiment, the imaging device 2 has an imaging element 21 and an optical system 22. The optical system 22 forms an image of an imaging field of view R10 including a specific region R1 on the imaging element 21.

[0046] The imaging element 21 is, for example, an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The imaging element 21 converts an image formed on a light receiving surface into an electrical signal and outputs the electrical signal.

[0047] The optical system 22 includes one or more lenses and mirrors. In this embodiment, as an example, the optical system 22 is realized by a combination of a plurality of lenses (lens group). The optical system 22 forms an image of light from an imaging field of view R10 as shown in FIG. 3A on the light receiving surface of the imaging element 21. In this embodiment, the optical system 22 of the imaging device 2 is a telecentric optical system. That is, the chief ray of the entire optical system is parallel to the optical axis (imaging optical axis Ax1). Note that the optical system 22 is not limited to the above configuration.

[0048] Incidentally, as shown in FIG. 3A, the imaging device 2 includes in the imaging field of view R10 a specific region R1 that faces the capture unit 11 in a direction (Z-axis direction) perpendicular to the mounting surface T21 of the mounting surface T21 of the second object T2 (substrate 200). In other words, when the capture unit 11 is located on the mounting surface T21 of the second object T2, the imaging device 2 includes in the imaging field of view R10 a region directly below the capture unit 11 on the mounting surface T21 as the specific region R1. In further other words, the specific region R1 is a region that includes a specific object TA located directly below the capture unit 11 when the capture unit 11 is located on the mounting surface T21 of the second object T2. Therefore, the imaging device 2 can capture an image of the region directly below the capture unit 11.

[0049] Specifically, the imaging device 2 is held by the head body 13 of the mounting head 1, and thereby fixed to the mounting head 1. Although not shown in the figure, the imaging device 2 is held by the head body 13 by being fixed to a side surface of the head body 13. Since the capturing unit 11 is disposed on the lower surface of the head body 13, the imaging device 2 is disposed to the side of the capturing unit 11 in a plan view.

[0050] Here, as shown in Fig. 3A, the imaging device 2 has an imaging optical axis Ax1 that is inclined with respect to the perpendicular line to the mounting surface T21 of the second object T2. That is, the imaging device 2 is fixed to the mounting head 1 in a posture in which the imaging optical axis Ax1 is inclined with respect to the perpendicular line to the mounting surface T21. In other words, the imaging optical axis Ax1 of the imaging device 2 is inclined with respect to the Z axis. In this way, the imaging device 2 is disposed to the side of the capture unit 11, and the imaging optical axis Ax1 is inclined with respect to the Z axis, so that the imaging device 2 can capture an image of the specific region R1 directly below the capture unit 11.

[0051] (2.5) Control Device Next, a more detailed configuration of the control device 3 will be described with reference to FIGS. 2 to 3D.

[0052] As described above, the control device 3 controls the mounting head 1 by outputting a control signal to the mounting head 1. Specifically, the control device 3 controls the mounting head 1 to move the capture unit 11 in a straight line in the Z-axis direction until the capture unit 11 located at the second position reaches the first position. In other words, the control device 3 moves the capture unit 11 until the state of the specific object TA included in the imaging field of view R10 of the imaging device 2 reaches a predetermined state. In addition, the control device 3 controls the mounting head 1 to move the capture unit 11 to the first position, and then releases the capture of the first object T1 by the capture unit 11, or captures the first object T1 with the capture unit 11. In other words, the control device 3 moves the capture unit 11 until the state of the specific object TA included in the imaging field of view R10 of the imaging device 2 reaches a predetermined state, and then releases the capture of the first object T1 by the capture unit 11, or captures the first object T1 with the capture unit 11. In this embodiment, an example of a mounting process is shown in which a first object T1 captured by the capture unit 11 is mounted on a mounting surface T21 of a second object T2, and the control device 3 releases the capture of the first object T1 by the capture unit 11 by controlling the mounting head 1.

[0053] In addition, in this embodiment, the control device 3 judges whether the first object T1 is mounted (attached) to the second object T2 based on a change in the shape of the specific object TA. Here, in this embodiment, the specific object TA is a contact member 9 that brings the first object T1 and the second object T2 into contact. In other words, the contact member 9 that contacts both the first object T1 and the second object T2 is included in the specific region R1. Furthermore, in this embodiment, the contact member 9 is a joining member 91 that joins the first object T1 and the second object T2, and is, for example, solder. The control device 3 judges whether the first object T1 is mounted (attached) to the second object T2 based on a change in the shape of the contact member 9 as the specific object TA in a plan view. In other words, the control device 3 controls the movement of the capture unit 11 toward the second object T2 based on a change in the shape of the contact member 9. Specifically, the control device 3 determines that the first object T1 is mounted (attached) to the second object T2 if the length dimension L1 of the specific object TA in the X-axis direction has changed, for example, from L11 (see FIG. 3B) to L12 (see FIG. 3C) that is larger than L11. Here, in this embodiment, the length dimension L1 of the specific object TA in the X-axis direction is the length from the end face of the first object T1 in the X-axis direction to the end of the specific object TA on the opposite side to the end face, as shown in FIG. 3B and FIG. 3C.

[0054] In this embodiment, the "information about the specific object TA" is the change in the length dimension L1 of the specific object TA in the X-axis direction. In addition, in this embodiment, "the state of the specific object TA reaches a predetermined state" means that the change in the length dimension L1 of the specific object TA reaches (L12-L11).

[0055] Incidentally, in the mounting system 10 according to this embodiment, the control device 3 can detect a short circuit (bridge) of multiple (two in the illustrated example) joining members 91 joining the first object T1 and the second object T2 from the magnitude of the length dimension L1 in the X-axis direction of the specific object TA. For example, if the length dimension L1 in the X-axis direction of each joining member 91 is longer than L12, the control device 3 determines that the multiple joining members 91 are short-circuited.

[0056] (3) Mounting Method Next, a mounting method according to this embodiment will be described with reference to FIGS. 3A to 3D and 4. FIG.

[0057] The mounting method according to this embodiment is a mounting method used in a mounting system 10 including a mounting head 1 and an imaging device 2. The mounting head 1 has a capture unit 11 that captures a first target T1. The mounting head 1 holds the capture unit 11 so that it can move toward a second target T2. The imaging device 2 is provided on the mounting head 1. The imaging device 2 includes a specific region R1 including a specific target TA in an imaging field of view R10. The mounting method includes a step of moving the capture unit 11 by a control device 3. The control device 3 moves the capture unit 11 so that the capture unit 11 moves toward the second target T2 based on information about the specific target TA included in the output of the imaging device 2.

[0058] That is, the mounting method according to this embodiment is a method of moving the capture unit 11 using the mounting system 10 according to this embodiment. In this mounting method, the capture unit 11 is moved toward the second object T2 based on information about the specific object TA included in the output of the imaging device 2. Therefore, for example, even if the substrate 200 serving as the second object T2 is warped in the Z-axis direction, the first object T1 can be reliably mounted (attached) to the second object T2 based on the state of the specific object TA.

[0059] 3A to 3D are schematic diagrams showing the overall operation of the mounting system 10, including the mounting method according to this embodiment, and Fig. 4 is a flowchart showing the overall operation of the mounting system 10, including the mounting method according to this embodiment.

[0060] The control device 3 controls the drive device 4 to move the mounting head 1 in the X-axis direction and the Y-axis direction (step S11). Specifically, the control device 3 causes the X-axis drive unit 41 to move the mounting head 1 linearly in the X-axis direction, and causes the Y-axis drive unit 42 to move the mounting head 1 linearly in the Y-axis direction. At this time, the control device 3 moves the mounting head 1 in the X-axis direction and the Y-axis direction so that the XY coordinates of the capture unit 11 that has captured the first target T1 coincide with the XY coordinates of the mounting position (attachment position) of the first target T1 on the mounting surface T21 of the second target T2. As shown in FIG. 3A, when the mounting head 1 reaches a position where the XY coordinates of the capture unit 11 coincide with the XY coordinates of the mounting position of the first target T1, the control device 3 activates the imaging device 2 to start imaging the specific region R1. In this embodiment, as shown in FIG. 3A, a joining member 91 serving as a specific object TA joining a first object T1 and a second object T2 is included in the specific region R1.

[0061] 3A, from a state in which the XY coordinates of the capture unit 11 and the XY coordinates of the mounting position of the first object T1 match, the control device 3 controls the actuator 12 to move the capture unit 11 linearly (downward) in the Z-axis direction (step S12). As a result, the first object T1 captured by the capture unit 11 moves closer to the second object T2 and comes into contact with the specific object TA arranged on the mounting surface T21 of the second object T2.

[0062] Here, the control device 3 adjusts the movement amount of the capture unit 11 based on the change in shape of the specific object TA caused by the first object T1 coming into contact with the specific object TA. In other words, the control device 3 adjusts the movement amount of the capture unit 11 so that the pushing amount after the first object T1 comes into contact with the specific object TA becomes a specified amount (step S13). Specifically, the control device 3 moves the capture unit 11 linearly in the Z-axis direction until the change amount of the length dimension L1 of the specific object TA in the X-axis direction becomes (L12-L11).

[0063] That is, if the change in the length dimension L1 of the specific object TA in the X-axis direction is smaller than (L12-L11) (step S13: No), the control device 3 continues to move the capture unit 11 linearly in the Z-axis direction. Then, when the change in the length dimension L1 of the specific object TA in the X-axis direction reaches (L12-L11) (step S13: Yes), the control device 3 stops the movement of the capture unit 11 and releases the capture of the first object T1 by the capture unit 11 (step S14).

[0064] Then, as shown in Fig. 3D, the control device 3 controls the actuator 12 to move the capturing unit 11 linearly (upward) in the Z-axis direction (step S15). When the capturing unit 11 reaches the second position, the control device 3 stops the imaging device 2 and ends the imaging of the specific region R1. Note that the control device 3 may stop the imaging device 2 at the timing when the capturing unit 11 releases the capture of the first object T1.

[0065] The mounting method as described above is executed by the control device 3 of the mounting system 10, so that the first object T1 can be reliably mounted (attached) to the second object T2. That is, according to the mounting method according to this embodiment, the mounting quality of the first object T1 can be improved.

[0066] In the mounting method described above, after the mounting head 1 is moved in the X-axis direction and the Y-axis direction, the actuator 12 is moved in the Z-axis direction. However, the movement of the mounting head 1 in the X-axis direction and the Y-axis direction (step S11) and the movement of the actuator 12 in the Z-axis direction (step S12) may be performed simultaneously.

[0067] (4) Variations The first embodiment is merely one of various embodiments of the present disclosure. Various modifications of the first embodiment are possible depending on the design and the like, as long as the object of the present disclosure can be achieved. In addition, all of the drawings referred to in this disclosure are schematic diagrams, and the ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios. In addition, the same function as the mounting method according to the first embodiment may be embodied in a mounting system 10, a (computer) program, or a non-transitory recording medium on which a program is recorded. The program according to one aspect is a program for causing one or more processors to execute the mounting method according to the first embodiment.

[0068] Below, we will list some modified examples of the embodiment 1. The modified examples explained below can be applied in appropriate combinations.

[0069] The mounting system 10 in the present disclosure includes a computer system in, for example, the control device 3. The computer system is mainly composed of a processor and a memory as hardware. The processor executes a program recorded in the memory of the computer system, thereby realizing the function of the mounting system 10 in the present disclosure. The program may be pre-recorded in the memory of the computer system, provided through an electric communication line, or provided by recording it in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits such as IC or LSI referred to here are called by different names depending on the degree of integration, and include integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Furthermore, a field-programmable gate array (FPGA) that is programmed after the manufacture of the LSI, or a logic device that can reconfigure the connection relationship inside the LSI or reconfigure the circuit partition inside the LSI, can also be adopted as a processor. The electronic circuits may be integrated in one chip or distributed among multiple chips. The chips may be integrated in one device or distributed among multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Thus, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0070] Furthermore, it is not essential for the mounting system 10 that multiple functions are concentrated in one housing. The components of the mounting system 10 may be distributed across multiple housings. Furthermore, at least some of the functions of the mounting system 10, for example, the functions of the control device 3, may be realized by the cloud (cloud computing) or the like.

[0071] Conversely, at least some of the functions of the mounting system 10 that are distributed among multiple devices in the first embodiment may be consolidated in one housing. For example, some of the functions that are distributed among the mounting head 1 and the control device 3 may all be consolidated in the mounting head 1.

[0072] Furthermore, the use of the mounting system 10 is not limited to the manufacture of electronic devices in a factory. For example, when the mounting system 10 is used to mount a mechanical component on a glass plate, the mounting system 10 performs an operation of mounting the mechanical component, which is a first object T1, on the glass plate, which is a second object T2.

[0073] Furthermore, the number of capturing units 11 and the number of imaging devices 2 provided in the mounting head 1 are not limited to the numbers described in embodiment 1. For example, there may be two or more capturing units 11 and two or more imaging devices 2. Furthermore, the numbers of capturing units 11 and imaging devices 2 may be the same or different. As an example, when the number of imaging devices 2 is less than the number of capturing units 11, it is sufficient that one imaging device 2 is configured to be able to capture images of multiple capturing units 11.

[0074] Furthermore, the imaging device 2 is not limited to a video camera capable of capturing full-color moving images, but may be, for example, a camera capable of capturing monochrome images, a still camera capable of capturing still images, a line sensor, or the like.

[0075] The control device 3 may also determine whether the first object T1 is mounted (attached) to the second object T2 based on the shape of the specific object TA. In other words, the control device 3 may control the movement of the capture unit 11 toward the second object T2 based on the shape of the specific object TA (contact member 9). For example, as shown in FIG. 3C, if the length dimension L1 in the X-axis direction of the specific object TA reaches L12, the control device 3 determines that the first object T1 is mounted (attached) to the second object T2. That is, the position shown in FIG. 3C becomes the first position. On the other hand, if the length dimension L1 in the X-axis direction of the specific object TA does not reach L12, the control device 3 moves the capture unit 11 toward the first position (second object T2) until the length dimension L1 in the X-axis direction of the specific object TA reaches L12. Furthermore, the control device 3 may determine whether the first object T1 is mounted (attached) to the second object T2 by combining the change in the shape of the specific object TA with the shape of the specific object TA. For example, in the example shown in Figures 3A to 3D, the control device 3 determines that the first object T1 is mounted (attached) to the second object T2 if the change in the length dimension L1 of the specific object TA in the X-axis direction is (L12-L11) and the length dimension L1 of the specific object TA in the X-axis direction has reached L12.

[0076] In addition, the change in the shape of the specific object TA is not limited to the length dimension L1 in the X-axis direction, but may be, for example, the height dimension in the Z-axis direction of the specific object TA. In other words, the change in the shape of the specific object TA may be a change in the amount of creeping up of the specific object TA rising along the side of the first object T1. For example, as shown in FIG. 3B, when the first object T1 is not in contact with the specific object TA, the amount of creeping up of the specific object TA is zero. In contrast, as shown in FIG. 3C, when the capture unit 11 reaches the first position, the amount of creeping up of the specific object TA reaches a predetermined value. Therefore, the control device 3 determines that the first object T1 has been mounted (attached) to the second object T2 because the amount of change in the amount of creeping up of the specific object TA has reached the predetermined value. Even in this case, the first object T1 can be reliably mounted (attached) to the second object T2 by pushing the capture unit 11 to the first position where the amount of change in the amount of creeping up of the specific object TA reaches the predetermined value, and the mounting quality of the first object T1 can be improved. Even in this case, the control device 3 may determine whether the first object T1 is mounted on the second object T2 based on the amount of creeping up (shape) of the specific object TA, rather than the change in the amount of creeping up (change in shape) of the specific object TA.

[0077] The bonding member 91 is not limited to solder, and may be, for example, a conductive paste or an adhesive. The contact member 9 is also not limited to the bonding member 91 such as solder, and may be, for example, a heat dissipation grease such as silicone grease.

[0078] In the above embodiment, the control device 3 determines whether the first object T1 is mounted (attached) to the second object T2 based on the amount of change in the length dimension L1 of the specific object TA. In contrast, the control device 3 may determine whether the first object T1 is mounted (attached) to the second object T2 based on the amount of change in the end of the specific object TA, for example.

[0079] (Embodiment 2) 5, the mounting system 10A according to this embodiment differs from the mounting system 10 according to the first embodiment in that the control device 3A has a detection unit 31 and a determination unit 32. Hereinafter, the same components as those in the first embodiment will be denoted by the same reference numerals and the description thereof will be omitted as appropriate.

[0080] (1) Overall structure The mounting system 10A according to this embodiment includes a mounting head 1, an imaging device 2, and a control device 3A. The mounting head 1 has a capture unit 11 that captures a first target T1. The mounting head 1 holds the capture unit 11 so that it can move toward a second target T2. The imaging device 2 includes a specific region R1 including a specific target TA in an imaging field of view R10. The control device 3A controls the movement of the capture unit 11 so that the capture unit 11 moves toward the second target T2, based on information about the specific target TA included in the output of the imaging device 2.

[0081] As shown in FIG. 5, a mounting system 10A according to this embodiment further includes a driving device 4, a component supplying device 5, a transporting device 6, a backup device 7, and a lighting device 8 in addition to the mounting head 1, the imaging device 2, and the control device 3A.

[0082] As shown in Figs. 6A to 6D, the imaging device 2 includes a specific region R1 including the contact member 9 in an imaging field of view R10. In this embodiment, as shown in Figs. 6A to 6D, the capturing unit 11 and the first object T1 captured by the capturing unit 11 are included in the imaging field of view R10. In this embodiment, the capturing unit 11 and the first object T1 (substrate 200) are the specific object TA. In this embodiment, the first object T1 is the component 100, and the second object T2 is the substrate 200 on which the component 100 is mounted.

[0083] The control device 3A includes a detection unit 31 and a determination unit 32, as shown in FIG.

[0084] The detection unit 31 detects that the third object T3 has landed on the fourth object T4 based on the output of the imaging device 2. In this disclosure, "landing" means that the third object T3 is in contact with the fourth object T4. In addition, in this disclosure, "contact" may be point contact, line contact, or surface contact. In this embodiment, the contact between the third object T3 and the fourth object T4 is surface contact.

[0085] In this embodiment, the third object T3 is the first object T1 (component 100) to be mounted (attached) to the mounting surface T21 of the second object T2 (substrate 200). The fourth object T4 is a contact member 9 that is placed on the mounting surface T21 of the second object T2 and brings the first object T1 and the second object T2 into contact. In this embodiment, the contact member 9 is a joining member 91 that joins the first object T1 and the second object T2. The joining member 91 is, for example, solder.

[0086] As an example, the detection unit 31 detects that the third object T3 has landed on the fourth object T4 based on a change in the amount of movement of the capture unit 11. In other words, the detection unit 31 detects that the third object T3 has landed on the fourth object T4 when the state of the specific object TA (capture unit 11) reaches a predetermined state. When the third object T3 comes into contact with the fourth object T4, the amount of movement of the capture unit 11 decreases due to a reaction force from the fourth object T4. Therefore, the detection unit 31 detects that the third object T3 has landed on the fourth object T4 when the amount of movement of the capture unit 11 changes (becomes smaller). In this embodiment, "the state of the specific object TA reaches a predetermined state" means that the amount of movement of the capture unit 11 changes (becomes smaller).

[0087] The determination unit 32 determines whether or not to perform the second process after performing the first process. In other words, the determination unit 32 determines whether or not to move the capture unit 11 further toward the second object T2 after the third object T3 has landed on the fourth object T4. The first process is a process of moving the capture unit 11 toward the first position (second object T2) until the third object T3 has landed on the fourth object T4. In this embodiment, the control device 3A moves the capture unit 11 toward the second object T2 based on the movement amount of the capture unit 11 in the first process. The second process is a process (hereinafter also referred to as a "push process") of moving the capture unit 11 further toward the second object T2 after the third object T3 has landed on the fourth object T4. In this embodiment, the control device 3A moves the capture unit 11 further toward the second object T2 after the third object T3 has landed on the fourth object T4 in the second process. For example, the determination unit 32 determines whether or not to execute the second process based on the length dimension in the X-axis direction of the contact member 9 included in the image captured by the imaging device 2. Specifically, the determination unit 32 determines that the second process is unnecessary if the length dimension in the X-axis direction of the contact member 9 reaches a predetermined length at the timing when the detection unit 31 detects the grounding of the third object T3. On the other hand, the determination unit 32 determines that the second process is necessary if the length dimension in the X-axis direction of the contact member 9 does not reach a predetermined length at the timing when the detection unit 31 detects the grounding of the third object T3. That is, the control device 3A is configured to determine whether or not to move the capture unit 11 toward the second object T2 at the timing when the third object T3 touches the ground.

[0088] In short, the control device 3A determines whether or not the pushing process is necessary at the timing when the third object T3 touches the fourth object T4. In other words, the control device 3A determines whether or not to cause the mounting head 1 to perform the second process at the timing when the third object T3 touches the fourth object T4 by causing the mounting head 1 to perform the first process.

[0089] When the determination unit 32 determines that the second process is to be executed, the control device 3A executes the first process and then executes the second process. When the determination unit 32 determines that the second process is not to be executed, the control device 3A executes only the first process.

[0090] Incidentally, the control device 3A is configured to control the movement of the capture unit 11 based on the output of the imaging device 2 as described above. Specifically, the control device 3A controls the movement of the capture unit 11 in the first process based on the image captured by the imaging device 2 so that the capture unit 11 moves toward the second object T2 until the third object T3 touches the ground on the fourth object T4. On the other hand, the control device 3A controls the movement of the capture unit 11 in the second process so that the capture unit 11 moves toward the second object T2 by a preset movement amount. In other words, the control device 3 moves the capture unit 11 further toward the second object T2 by a preset movement amount after the third object T3 touches the ground on the fourth object T4. That is, in the mounting system 10A according to this embodiment, at the timing when the third object T3 touches the ground, the feedback control that moves the capture unit 11 based on the image captured by the imaging device 2 is switched to the sequence control that moves the capture unit 11 by a preset movement amount.

[0091] (2) Mounting Method Next, a mounting method according to this embodiment will be described with reference to FIGS. 6A to 6D and 7. FIG.

[0092] The mounting method according to this embodiment is a mounting method used in a mounting system 10A that includes a mounting head 1 and an imaging device 2. The mounting head 1 has a capture unit 11 that captures a first target T1. The mounting head 1 holds the capture unit 11 so that it can move toward a second target T2. The imaging device 2 is provided on the mounting head 1. The imaging device 2 includes a specific region R1 including a specific target TA in an imaging field of view R10. The mounting method includes a step of moving the capture unit 11 by a control device 3A. The control device 3A moves the capture unit 11 toward the second target T2 based on information about the specific target TA included in the output of the imaging device 2.

[0093] That is, the mounting method according to this embodiment is a method of moving the capture unit 11 using the mounting system 10A according to this embodiment. In this mounting method, the capture unit 11 is moved toward the second object T2 based on information about the specific object TA included in the output of the imaging device 2. Therefore, for example, even if the substrate 200 as the second object T2 is warped in the Z-axis direction, the first object T1 can be reliably mounted (attached) to the second object T2 based on the state of the specific object TA. In this embodiment, the "information about the specific object TA" is the amount of movement of the capture unit 11 as the specific object TA.

[0094] 6A to 6D are schematic diagrams showing the overall operation of the mounting system 10A, including the mounting method according to this embodiment, and Fig. 7 is a flowchart showing the overall operation of the mounting system 10A, including the mounting method according to this embodiment.

[0095] The control device 3A controls the drive device 4 to move the mounting head 1 in the X-axis direction and the Y-axis direction (step S21). Specifically, the control device 3A moves the mounting head 1 in a straight line in the X-axis direction by the X-axis drive unit 41, and moves the mounting head 1 in a straight line in the Y-axis direction by the Y-axis drive unit 42. At this time, the control device 3A moves the mounting head 1 in the X-axis direction and the Y-axis direction so that the XY coordinates of the capture unit 11 that has captured the first target T1 coincide with the XY coordinates of the mounting position (attachment position) of the first target T1 on the mounting surface T21 of the second target T2. As shown in FIG. 6A, when the mounting head 1 reaches a position where the XY coordinates of the capture unit 11 coincide with the XY coordinates of the mounting position of the first target T1, the control device 3A starts the imaging device 2 and starts imaging the specific region R1. In this embodiment, as shown in FIG. 6A, the contact member 9 arranged on the mounting surface T21 of the second target T2 is included in the specific region R1. In this embodiment, the capturing unit 11 and the first object T1 captured by the capturing unit 11 are included in the imaging field of view R10 of the imaging device 2.

[0096] As shown in Fig. 6A, from a state in which the XY coordinates of the capture unit 11 and the XY coordinates of the mounting position of the first object T1 match, the control device 3A controls the actuator 12 to move the capture unit 11 linearly (downward) in the Z-axis direction (step S22). As a result, the first object T1 captured by the capture unit 11 moves closer to the second object T2 and contacts the contact member 9 arranged on the mounting surface T21 of the second object T2. The detection unit 31 of the control device 3A detects that the first object T1 as the third object T3 has landed on the contact member 9 as the fourth object T4 based on the change (reduced) in the amount of movement of the capture unit 11 (step S23).

[0097] When the detection unit 31 detects the grounding of the third object T3, the determination unit 32 of the control device 3A determines whether or not the second process as the pushing process is necessary (step S24). When the determination unit 32 determines that the second process is to be executed (step S24: Yes), the control device 3A controls the actuator 12 to move (lower) the capture unit 11 in the Z-axis direction by a preset movement amount (step S25). Then, the control device 3A stops the movement of the capture unit 11 in the Z-axis direction, and then releases the capture of the first object T1 by the capture unit 11 (step S26). On the other hand, when the determination unit 32 determines that the second process is not to be executed (step S24: No), the control device 3A stops the movement of the capture unit 11 in the Z-axis direction, and then releases the capture of the first object T1 by the capture unit 11 (step S26).

[0098] Then, as shown in Fig. 6D, the control device 3A controls the actuator 12 to move the capturing unit 11 linearly (upward) in the Z-axis direction (step S27). When the capturing unit 11 reaches the second position, the control device 3A stops the imaging device 2 and ends imaging of the specific region R1. Note that the control device 3A may stop the imaging device 2 at the timing when the capturing unit 11 releases the capture of the first object T1.

[0099] The mounting method as described above is executed by the control device 3A of the mounting system 10A, so that the first object T1 can be reliably mounted (attached) to the second object T2. That is, according to the mounting method according to this embodiment, the mounting quality of the first object T1 can be improved.

[0100] In the mounting method described above, the mounting head 1 is moved in the X-axis direction and the Y-axis direction, and then the actuator 12 is moved in the Z-axis direction. However, the movement of the mounting head 1 in the X-axis direction and the Y-axis direction (step S21) and the movement of the actuator 12 in the Z-axis direction (step S22) may be performed simultaneously.

[0101] (3) Modifications Below, we will list some modified examples of the second embodiment. The modified examples explained below can be applied in appropriate combinations.

[0102] (3.1) Variation 1 As shown in FIG. 8A to FIG. 8C, the second object T2 may be a container 300 in which the components 100 as the first object T1 are accommodated. That is, the mounting system 10A according to the first modification can also be used for a suction process for suctioning the components 100 as the first object T1 accommodated in the container 300 as the second object T2. The container 300 as the second object T2 is a carrier tape, a tray, or the like. In this embodiment, the container 300 is a carrier tape. In short, the first object T1 is the components 100, and the second object T2 is the container 300 in which the components 100 are accommodated. In addition, in the first modification, the specific object TA is the capture unit 11. The second object T2 as the container 300 has a container section T22 in which the components 100 as the first object T1 are accommodated, as shown in FIG. 8A to FIG. 8C.

[0103] Next, a mounting method according to Modification 1 will be described with reference to FIGS. 8A to 8C and 9. FIG.

[0104] The control device 3A controls the drive device 4 to move the mounting head 1 in the X-axis direction and the Y-axis direction (step S31). Specifically, the control device 3A causes the X-axis drive unit 41 to move the mounting head 1 linearly in the X-axis direction, and causes the Y-axis drive unit 42 to move the mounting head 1 linearly in the Y-axis direction. At this time, the control device 3A moves the mounting head 1 in the X-axis direction and the Y-axis direction so that the XY coordinates of the capture unit 11 and the XY coordinates of the first target T1 in the storage unit T22 of the second target T2 match. As shown in FIG. 8A, when the mounting head 1 reaches a position where the XY coordinates of the capture unit 11 and the XY coordinates of the first target T1 match, the control device 3A starts the imaging device 2 and starts imaging the specific region R1. In the first modification, as shown in FIG. 8A, the first target T1 captured by the capture unit 11 is included in the specific region R1.

[0105] As shown in FIG. 8A, the control device 3A controls the actuator 12 to move the capture unit 11 linearly (downward) in the Z-axis direction from a state in which the XY coordinates of the capture unit 11 and the XY coordinates of the first object T1 match (step S32). As a result, the capture unit 11 moves closer to the first object T1 contained in the container T22 for the second object T2, and contacts the surface (top surface) of the first object T1. The detection unit 31 of the control device 3A detects that the capture unit 11 as the third object T3 has landed on the first object T1 (component 100) as the fourth object T4, based on the fact that the amount of movement of the capture unit 11 has changed (become smaller) as a result of the capture unit 11 coming into contact with the first object T1 (step S33). In addition, when the dimensions of the part 100 are smaller than the dimensions of the capture portion 11 in the X-axis direction, the detection unit 31 detects that the capture portion 11 as the third object T3 has grounded to the second object T2 (container 300) as the fourth object T4, based on the change (decreased) in the amount of movement of the capture portion 11 due to contact of the capture portion 11 with the second object T2.

[0106] When the detection unit 31 detects the grounding of the third object T3 (the capture unit 11), the determination unit 32 of the control device 3A determines whether or not the second process as the pushing process is necessary (step S34). As an example, the determination unit 32 of the control device 3A determines to execute the second process if the amount of bending in the Z-axis direction of the second object T2 in which the first object T1 as the fourth object T4 is housed does not reach a predetermined value.

[0107] When the determination unit 32 determines that the second process is to be executed (step S34: Yes), the control device 3A controls the actuator 12 to move (lower) the capture unit 11 in the Z-axis direction by a preset movement amount (step S35). Then, the control device 3A stops the movement of the capture unit 11 in the Z-axis direction, and then captures the first object T1 with the capture unit 11 (step S36). On the other hand, when the control device 3A determines that the determination unit 32 does not determine that the second process is to be executed (step S34: No), the control device 3A stops the movement of the capture unit 11 in the Z-axis direction, and then captures the first object T1 with the capture unit 11 (step S36).

[0108] Then, as shown in Fig. 8C, the control device 3A controls the actuator 12 to move (raise) the capturing unit 11 that has captured the first object T1 in a straight line in the Z-axis direction (step S37). When the capturing unit 11 reaches the second position, the control device 3A stops the imaging device 2 and ends imaging of the specific region R1. Note that the control device 3A may stop the imaging device 2 at the timing when the capturing unit 11 releases the capture of the first object T1.

[0109] The control device 3A of the mounting system 10A executes the mounting method (suction method) as described above, so that the first object T1 can be reliably sucked by the capture unit 11. That is, the mounting method according to the first modification includes not only a mounting process of mounting the first object T1 (component 100) captured by the capture unit 11 on the mounting surface T21 of the second object T2 (board 200), but also a suction process of sucking the first object T1 (component 100) by the capture unit 11.

[0110] In the mounting method described above, after moving the mounting head 1 in the X-axis direction and the Y-axis direction, the actuator 12 is moved in the Z-axis direction. However, the movement of the mounting head 1 in the X-axis direction and the Y-axis direction (step S31) and the movement of the actuator 12 in the Z-axis direction (step S32) may be performed simultaneously.

[0111] (3.2) Variation 2 The specific object TA may include an actuator 12, as shown in Fig. 10. The actuator 12 has a nozzle holder 121 that holds a suction nozzle as the capture unit 11, and a shaft 122 that is connected to the upper end of the nozzle holder 121.

[0112] Nozzle holder 121 includes a spring body 14. Spring body 14 is arranged so that its expansion and contraction direction is the Z-axis direction, and applies a downward spring force to capture part 11. Capture part 11 is held by nozzle holder 121 in a state in which it can move in the Z-axis direction relative to nozzle holder 121 against the spring force from spring body 14.

[0113] The shaft 122 is configured to be movable in the Z-axis direction by a driving force generated by a linear motor. Therefore, by moving the shaft 122 in the Z-axis direction, the capture part 11 can be moved between the first position and the second position. In other words, the actuator 12, which is composed of the nozzle holder 121 and the shaft 122, functions as a holding member that holds the capture part 11 movably between the first position and the second position. In the second modification, the specific object TA includes a holding member (actuator 12) that holds the capture part 11 movably between the first position and the second position. In addition, a measurement point (specific point) P1 is provided on the outer circumferential surface of the shaft 122.

[0114] 10, the imaging device 2 includes a specific region R1 including the actuator 12 as the specific object TA in an imaging field of view R10. The imaging device 2 is aligned with the actuator 12 as the specific object TA in the X-axis direction. In other words, the imaging device 2 is disposed to the side of the specific object TA. This allows the imaging device 2 to capture an image of a measurement point P1 provided on the shaft 122 of the actuator 12 as the specific object TA when the capture unit 11 moves from the second position to the first position.

[0115] In the mounting system 10A according to the second modification, the control device 3A controls the movement of the capture unit 11 toward the second object T2 based on the movement amount of the measurement point P1 included in the imaging field of view R10 of the imaging device 2 in the first process until the third object T3 touches the fourth object T4. Also, in the mounting system 10A, the control device 3A controls the movement of the capture unit 11 toward the second object T2 based on the movement amount of the measurement point P1 included in the imaging field of view R10 of the imaging device 2 in the second process. Here, in the second process, since the capture unit 11 is in contact with the first object T1, the movement of the capture unit 11 toward the second object T2 is restricted, but the spring body 14 provided in the nozzle holder 121 is compressed, so that the shaft 122 can move toward the second object T2. Therefore, in the second process, the control device 3A can control the movement of the capture unit 11 toward the second object T2 based on the movement amount of the measurement point P1 provided on the shaft 122.

[0116] (3.3) Other Modifications The detection unit 31 may detect that the third object T3 has landed on the fourth object T4 based on a change in the shape of the contact member 9. The contact member 9 as the fourth object T4 is deformed at least in the X-axis direction by contact with the first object T1 as the third object T3. Therefore, the detection unit 31 detects that the third object T3 has landed on the fourth object T4 based on a change in the length dimension in the X-axis direction of the contact member 9 included in the image captured by the imaging device 2.

[0117] The specific object TA may include at least one of the first object T1 (component 100), the capture unit 11, and the actuator 12 as a holding member. Therefore, the specific object TA may include any one of the first object T1, the capture unit 11, and the actuator 12, or may include two or more of them.

[0118] Furthermore, when the second object T2 is the container 300, the determination unit 32 of the control device 3A may determine whether the capture unit 11 has reached the first position based on the amount of movement of the capture unit 11 (suction nozzle) relative to the nozzle holder 121. For example, assume that the spring force from the spring body 14 (see FIG. 10) on the capture unit 11 is smaller than the reaction force from the container 300 in a state in which the capture unit 11 is in contact with the first object T1. In this case, after the capture unit 11 comes into contact with the first object T1, the capture unit 11 moves the shaft 122 downward to move upward relative to the nozzle holder 121. Therefore, the determination unit 32 of the control device 3A can determine whether the capture unit 11 has reached the first position based on the amount of movement of the capture unit 11 relative to the nozzle holder 121 included in the image captured by the imaging device 2.

[0119] Furthermore, in this case, as a result of the movement of the capture portion 11 relative to the nozzle holder 121, the length dimension (dimension in the Z-axis direction) of the nozzle holder 121 imaged by the imaging device 2 becomes smaller. Therefore, the determination portion 32 can also determine whether or not the capture portion 11 has reached the first position by comparing the length dimension of the nozzle holder 121 with a predetermined threshold value.

[0120] Also, the specific object TA may be the contact member 9, as in the first embodiment. In this case, the control device 3A may move the capture unit 11 further toward the second object T2 until the state of the specific object TA reaches a predetermined state after the third object T3 has landed on the fourth object T4. The control device 3A moves the capture unit 11 further toward the second object T2 until, for example, the length dimension in the X-axis direction of the contact member 9 reaches a predetermined length after the third object T3 has landed on the fourth object T4. In other words, "the state of the specific object TA reaches a predetermined state" means that the length dimension in the X-axis direction of the contact member 9 as the specific object TA reaches a predetermined length.

[0121] The configuration described in the above-mentioned second embodiment (including the modified example) can be applied in appropriate combination with the configuration described in the first embodiment (including the modified example).

[0122] (summary) As described above, the mounting system (10; 10A) according to the first aspect includes a mounting head (1), an imaging device (2), and a control device (3; 3A). The mounting head (1) has a capture unit (11) that captures a first target (T1). The mounting head (1) holds the capture unit (11) so that the capture unit (11) can move toward a second target (T2). The imaging device (2) is provided on the mounting head (1). The imaging device (2) includes a specific region (R1) including a specific target (TA) in an imaging field of view (R10). The control device (3; 3A) controls the movement of the capture unit (11) so that the capture unit (11) moves toward the second target (T2) based on information about the specific target (TA) included in the output of the imaging device (2).

[0123] According to this embodiment, the mounting quality of the first object (T1) can be improved.

[0124] In the mounting system (10; 10A) according to the second embodiment, in the first embodiment, the control device (3; 3A) moves the capture unit (11) until the state of the specific object (TA) reaches a predetermined state.

[0125] According to this embodiment, the mounting quality of the first object (T1) can be improved.

[0126] The mounting system (10; 10A) according to the third aspect is the second aspect, and further includes a detection unit (31). The detection unit (31) detects that the third object (T3) has landed on the fourth object (T4) based on the output of the imaging device (2). The detection unit (31) detects that the third object (T3) has landed on the fourth object (T4) when the state of the specific object (TA) reaches a predetermined state.

[0127] According to this embodiment, the mounting quality of the first object (T1) can be improved.

[0128] In the mounting system (10; 10A) according to the fourth aspect, in the third aspect, the control device (3; 3A) moves the capture portion (11) further toward the second object (T2) after the third object (T3) has made contact with the fourth object (T4).

[0129] According to this embodiment, the mounting quality of the first object (T1) can be improved.

[0130] The mounting system (10; 10A) according to the fifth aspect is the third or fourth aspect, and further includes a determination unit (32). The determination unit (32) determines whether or not to move the capture unit (11) further toward the second object (T2) after the third object (T3) touches the fourth object (T4).

[0131] According to this embodiment, the mounting quality of the first object (T1) can be improved.

[0132] In a mounting system (10; 10A) according to a sixth aspect, in any one of the first to fifth aspects, the specific target (TA) includes at least one of a first target (T1), a capture unit (11), and a holding member (12). The holding member (12) movably holds the capture unit (11).

[0133] According to this embodiment, the amount of movement of the capture part (11) can be determined from the specific object (TA) included in the specific region (R1).

[0134] In the mounting system (10; 10A) according to the seventh aspect, in the sixth aspect, the imaging device (2) is arranged to the side of the specific object (TA) so as to be able to image a specific point (P1) on the specific object (TA) when the capture section (11) moves.

[0135] According to this embodiment, the amount of movement of the capture portion (11) can be determined from the specific point (P1) imaged by the imaging device (2).

[0136] In the mounting system (10; 10A) according to the eighth aspect, in the sixth or seventh aspect, the control device (3; 3A) moves the capture portion (11) toward the second object (T2) based on the amount of movement of the specific object (TA).

[0137] According to this embodiment, the movement of the capture portion (11) toward the second object (T2) can be controlled based on the amount of movement of the capture portion (11) or the part (100).

[0138] In a mounting system (10; 10A) according to a ninth aspect, in any one of the first to fifth aspects, the specific object (TA) is a contact member (9) that contacts both the first object (T1) and the second object (T2).

[0139] According to this embodiment, the first object (T1) and the second object (T2) can be brought into contact with each other via the contact member (9).

[0140] In a mounting system (10; 10A) according to a tenth aspect, in the ninth aspect, the contact member (9) is a joining member (91) that joins a first object (T1) and a second object (T2).

[0141] According to this embodiment, the first object (T1) and the second object (T2) can be joined together via the joining member (91).

[0142] In the mounting system (10; 10A) according to the eleventh aspect, in the ninth or tenth aspect, the control device (3; 3A) moves the capture portion (11) toward the second object (T2) based on the shape of the contact member (9).

[0143] According to this embodiment, the movement of the capture part (11) toward the second object (T2) can be controlled based on the shape of the contact member (9).

[0144] In the mounting system (10; 10A) according to the 12th aspect, in the 9th or 10th aspect, the control device (3; 3A) moves the capture portion (11) toward the second object (T2) based on a change in the shape of the contact member (9).

[0145] According to this embodiment, the movement of the capture part (11) toward the second object (T2) can be controlled based on the change in shape of the contact member (9).

[0146] In a mounting system (10; 10A) according to a thirteenth aspect, in any one of the first to twelfth aspects, the first object (T1) is a component (100). The second object (T2) is a board (200) on which the component (100) is mounted.

[0147] According to this embodiment, the mounting quality of the component (100) on the board (200) can be improved.

[0148] In a mounting system (10; 10A) according to a fourteenth aspect, in any one of the first to twelfth aspects, the first object (T1) is a component (100). The second object (T2) is a container (300) that contains the component (100).

[0149] According to this embodiment, the component (100) can be reliably attracted to the capture portion (11).

[0150] In the mounting system (10; 10A) according to the fifteenth aspect, in the second aspect, the control device (3; 3A) moves the capture section (11) until the state of the specific object (TA) reaches a predetermined state, and then releases the capture of the first object (T1) by the capture section (11), or captures the first object (T1) with the capture section (11).

[0151] According to this embodiment, the mounting quality of the first object (T1) can be improved.

[0152] A mounting method according to a sixteenth aspect is a mounting method used in a mounting system (10; 10A) including a mounting head (1) and an imaging device (2). The mounting head (1) has a capture unit (11) that captures a first target (T1). The mounting head (1) holds the capture unit (11) so that the capture unit (11) can move toward a second target (T2). The imaging device (2) is provided on the mounting head (1). The imaging device (2) includes a specific region (R1) including a specific target (TA) in an imaging field of view (R10). The mounting method includes a step of moving the capture unit (11) by a control device (3; 3A). The control device (3; 3A) moves the capture unit (11) so that the capture unit (11) moves toward the second target (T2) based on information related to the specific target (TA) included in the output of the imaging device (2).

[0153] According to this embodiment, the mounting quality of the first object (T1) can be improved.

[0154] The configurations according to the second to fifteenth aspects are not essential for the mounting system (10; 10A) and can be omitted as appropriate. [Explanation of symbols]

[0155] 1 Mounting head 2. Imaging device 3,3A Control Device 9 Contact members 10,10A mounting system 11 Capture unit 12 Actuator (holding member) 31 Detection unit 32 Judgment section 91 Joint materials 100 parts 200 boards 300 container R1 Specific area TA Specific Object T1 First Object T2 Second Object T3 Third Object T4 Fourth Object

Claims

1. a mounting head having a capture unit that captures a component as a first object and that holds the capture unit movably toward a board as a second object; an imaging device provided in the mounting head and including a specific area including a specific object in an imaging field of view; a control device that controls the movement of the capture unit so that the capture unit moves toward the substrate; the control device has a detection unit that detects, based on an output of the imaging device, that the part as a third object has been grounded to a joining member as a fourth object; The detection unit detects that the third object has come into contact with the fourth object when a movement amount of the capture unit as the specific object becomes smaller, and The control device executes a first process which is a process of moving the capture unit until the third object touches the fourth object. Implementation system.

2. the control device executes a second process which is a process of moving the capture unit toward the second object by a preset movement amount after the third object has landed on the fourth object. The mounting system according to claim 1 .

3. The control device further includes a determination unit that determines whether or not to execute the second process based on a shape of the joining member included in an image captured by the imaging device after the first process is executed. The mounting system according to claim 2 .

4. The specific object includes a holding member that movably holds the capture unit. The mounting system according to any one of claims 1 to 3.

5. the imaging device is disposed to the side of the specific object so as to be able to image a specific point on the specific object when the capture unit moves; The mounting system according to claim 4 .

6. The control device moves the capture unit toward the second object based on a movement amount of the holding member as the specific object. The mounting system according to claim 4 or 5.

7. a mounting head having a capture portion that captures a component as a first object and that holds the capture portion movably toward a container as a second object; an imaging device provided in the mounting head and including a specific area including a specific object in an imaging field of view; A control device that controls the movement of the capture unit so that the capture unit moves toward the container, the control device has a detection unit that detects, based on an output of the imaging device, that the capture unit as the specific object has landed on a surface of the part contained in the container; the detection unit detects that the capture unit has come into contact with the surface of the component when the amount of movement of the capture unit becomes smaller; The control device executes a first process which is a process of moving the capture unit until the capture unit touches the surface of the component. Implementation system.

8. a mounting head having a capture unit that captures a component as a first object and that holds the capture unit movably toward a board as a second object; an imaging device provided in the mounting head and including a specific area including a specific object in an imaging field of view, a detection step of detecting that the part as a third object has been grounded to a joining member as a fourth object based on an output of the imaging device; In the detection step, it is detected that the third object has come into contact with the fourth object when a movement amount of the capture unit as the specific object becomes small, The method further includes a control step of executing a first process which is a process of moving the capture unit until the third object touches the fourth object. How to implement it.

9. a mounting head having a capture portion that captures a component as a first object and that holds the capture portion movably toward a container as a second object; an imaging device provided in the mounting head and including a specific area including a specific object in an imaging field of view, a detection step of detecting, based on an output of the imaging device, that the capture unit as the specific object has come into contact with a surface of the part contained in the container; In the detection step, it is detected that the capture part has come into contact with the surface of the component when a movement amount of the capture part becomes small, The method further includes a control step of executing a first process which is a process of moving the capture unit until the capture unit touches the surface of the component. How to implement it.

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