Temporary placement stage and parts mounting device

Abstract

To provide a temporary placement stage and a component mounting device capable of clearly recognizing the outer shape of a component while preventing the positional deviation of the placed component.SOLUTION: A temporary placement stage 7 on which a component D to be mounted on a substrate 3 is temporarily placed includes an upper member 26 having air permeability and having a component D mounted thereon, a plate member 27 disposed below the upper member 26 and having a plurality of suction holes 27H penetrating in the thickness direction, a suction unit (holding body 30, light transmitting member 29) that sucks the component D placed on the upper member 26 to the upper surface of the upper member 26 by sucking air from below the plate member 27 through the suction holes 27H and the upper member 26, and a light source unit 22 that irradiates the upper member 26 with light 22a from below.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a temporary placement stage provided in a component mounting device and the like, and to the component mounting device. [Background technology]

[0002] Conventionally, component mounting devices that mount components on a substrate are known and are used in the manufacture of various types of mounting substrates. Among such component mounting devices, in particular those that require high accuracy in mounting components on a substrate, components taken out from a component supply unit are temporarily placed on a temporary placement stage and recognized by a recognition camera, and then the components are picked up again and mounted on the substrate (for example, see Patent Document 1 below).

[0003] When a part temporarily placed on the temporary placement stage is recognized by a recognition camera, the part is usually illuminated from above and its outline is recognized under the illumination light. At this time, the part is vacuum-adsorbed onto the temporary placement stage to prevent the part from shifting position during recognition by the recognition camera and when the mounting head picks up the part. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-119134 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, as described above, when a component is illuminated from above, the illumination light may be diffused on the surface of the component, making it difficult to recognize the outer shape of the component. This can result in component recognition errors or a pickup error due to the inability to pick up the center of the component.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a temporary placement stage and a component mounting device that can prevent misalignment of a placed component while allowing the external shape of the component to be clearly recognized. [Means for solving the problem]

[0007] The temporary placement stage of the present invention is a temporary placement stage on which components to be mounted on a substrate are temporarily placed, and includes an upper member having air permeability and on whose upper surface components are placed, a plate-like member disposed below the upper member and having a plurality of suction holes penetrating in a thickness direction, a suction unit that sucks air from below the plate-like member through the suction holes and the upper member, thereby adsorbing the components placed on the upper member to the upper surface of the upper member, and a light source unit that irradiates light onto the upper member from below. a partition member disposed below the plate-like member, the partition member having a region-forming hole penetrating in a thickness direction, the partition member partitioning the upper member by the region-forming hole; Equipped with.

[0008] The component mounting device of the present invention is as follows: 14 and a mounting head that mounts the component temporarily placed on the temporary placement stage onto a substrate. Effect of the Invention

[0009] According to the present invention, it is possible to prevent the placed component from shifting from its original position while clearly recognizing the outer shape of the component. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view of a component mounting device according to an embodiment of the present invention; [Diagram 2] FIG. 1 is a perspective view showing a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention together with a mounting head; [Diagram 3] FIG. 1 is a front cross-sectional view of a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention. [Figure 4] FIG. 1 is an exploded perspective view of a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention. [Diagram 5] FIG. 13 is a front cross-sectional view of another embodiment of the chamber provided in the temporary placement stage of the component mounting apparatus according to the embodiment of the present invention. [Figure 6]FIG. 1 shows a relationship between a suction hole of a plate-shaped member provided on a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention and (a) an area forming hole of a partition member, (b) a relationship with an 8-nozzle mounting head, and (c) a relationship with a 16-nozzle mounting head. [Figure 7] FIG. 1 is a block diagram showing a configuration of a component mounting device according to an embodiment of the present invention. [Figure 8] FIG. 1 is a flow diagram of a component mounting method according to an embodiment of the present invention. [Figure 9] FIG. 2 is a flow chart of a component re-suction method according to an embodiment of the present invention. [Figure 10] (a)(b)(c) are explanatory diagrams of a component mounting process using a component mounting device according to an embodiment of the present invention. [Figure 11] (a)(b)(c) are explanatory diagrams of a component mounting process using a component mounting device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation and can be changed as appropriate depending on the specifications of the component mounting device, the temporary placement stage, and the mounting head. In the following, the same reference numerals are used for corresponding elements in all the drawings, and duplicated explanations will be omitted. In FIG. 1 and in some parts described later, the X-axis (left-right direction in FIG. 1) in the substrate transport direction and the Y-axis (up-down direction in FIG. 1) perpendicular to the substrate transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 2 and in some parts described later, the Z-axis (up-down direction in FIG. 2) is shown as the height direction perpendicular to the horizontal plane.

[0012] First, the configuration of component mounting device 1 will be described with reference to Fig. 1. In component mounting device 1, board transport section 2 is installed along the X-axis at the center of base 1a. Board transport section 2 transports board 3 carried in from upstream along the X-axis, and positions and holds it at a mounting operation position by a mounting head, which will be described below. In addition, board transport section 2 carries out board 3 downstream after component mounting operation has been completed. Component supply sections 4 are installed on both sides (front and rear directions of the Y-axis) of board transport section 2.

[0013] A tape feeder 5 is attached to each component supply unit 4 along the X-axis. The tape feeder 5 feeds a carrier tape, on which pockets for storing components are formed, by pitch-feeding in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport unit 2 to supply components to a component removal position where the mounting head picks up the components. In addition, a temporary placement unit 6 is attached to the front component supply unit 4. The temporary placement unit 6 includes a temporary placement stage 7 on which components to be mounted on the board 3 are temporarily placed, and a vacuum source 8. The vacuum source 8 includes a vacuum pump, a vacuum ejector, etc., and supplies negative pressure to the temporary placement stage 7 (sucks in air). The temporary placement stage 7 will be described in detail later.

[0014] When the tape feeder 5 and the temporary placement unit 6 are attached to the component supplying section 4, they are each electrically connected to a control device 40 (see FIG. 7) provided in the component mounting device 1. In addition, the tape feeder 5 and the temporary placement unit 6 are each supplied with electricity and compressed air via the component supplying section 4.

[0015] In Fig. 1, a Y-axis table 9 equipped with a linear drive mechanism is disposed at both ends of the X-axis on the top surface of a base 1a. A beam 10 similarly equipped with a linear mechanism is coupled to the Y-axis table 9 so as to be freely movable along the Y-axis. A mounting head 11 is attached to the beam 10 so as to be freely movable along the X-axis. The mounting head 11 is equipped with a plurality of (eight in this example) nozzle drive units 11a that can hold a component and move up and down and rotate around a vertical axis (Z-axis). A suction nozzle 11b (see Fig. 2) that suctions and holds the component is attached to the lower end of each of the nozzle drive units 11a.

[0016] Note that multiple types of mounting heads 11 are prepared in advance, each differing in the number of nozzle drive units 11a and the type of suction nozzles 11b that can be attached, and the mounting head 11 attached to the beam 10 is changed depending on the size of the component to be mounted on the substrate 3. Hereinafter, a mounting head 11 that has eight nozzle drive units 11a and can be equipped with eight suction nozzles 11b will be referred to as an "8-nozzle mounting head", etc.

[0017] 1, Y-axis table 9 and beam 10 constitute an XY unit 12 that moves mounting head 11 along the X-axis and Y-axis. XY unit 12 and mounting head 11 constitute a component mounting mechanism that performs a component mounting operation of picking up components from component supply unit 4 and mounting them at component mounting positions on board 3. In the component mounting operation, mounting head 11 moves above component supply unit 4, picks up predetermined components with each suction nozzle 11b, moves above board 3, rotates the components held by each suction nozzle 11b in a predetermined direction, and repeats a series of turns to mount the components at their respective component mounting positions.

[0018] 1, beam 10 is equipped with a head camera 13 that is positioned on the underside of beam 10 and moves integrally with mounting head 11. As mounting head 11 moves, head camera 13 moves above board 3 positioned at the mounting operation position of board transport section 2, and captures an image of a board mark (not shown) provided on board 3 to recognize the position of board 3. In addition, in the case of components that require high component mounting accuracy, each suction nozzle 11b of mounting head 11 temporarily places the picked-up component on temporary placement stage 7, and head camera 13 moves above temporary placement stage 7 to capture an image of the temporarily placed component to recognize the outer shape and top surface shape of the component.

[0019] A component recognition camera 14 is installed between the component supply unit 4 and the board transport unit 2. When the mounting head 11, which has taken out a component from the component supply unit 4, is positioned above the component recognition camera 14, the component recognition camera 14 captures an image of the component held by the suction nozzle 11b from below. When the mounting head 11 mounts the component on the board 3, the component mounting position is corrected taking into account the recognition result of the board 3 by the head camera 13, the outer shape and top surface shape of the component recognized by temporarily placing it on the temporary placement stage 7, and the recognition result of the component by the component recognition camera 14 (positional deviation between the nozzle and the component).

[0020] Next, the configuration of the temporary placement stage 7 included in the temporary placement unit 6 will be described in detail with reference to Figs. 2 to 4. In Figs. 2 and 3, the temporary placement stage 7 is configured such that a box-shaped chamber 21 and a light source section 22 located below the chamber 21 are supported by a plurality of legs 23 extending in the vertical direction (direction along the Z axis). The light source section 22 is provided with a light emitting section 24 that irradiates light 22a toward the chamber 21 above. The light emitting section 24 is configured with a light source such as an LED, and may be composed of one light source or may be composed of a plurality of light sources. A diffusion member 25 is disposed between the light source section 22 and the chamber 21 above the light source section 22, which transmits the light 22a irradiated from the light source section 22 and diffuses it toward the chamber 21.

[0021] 3 and 4, the chamber 21 includes an upper member 26, a plate-like member 27, a partition member 28, a light-transmitting member 29, and a holder 30. The upper surface of the upper member 26 is a component mounting surface on which the component D is mounted. The upper member 26 is made of a thin (for example, about 1 to 2 mm) sheet-like member, and is made of a material that is light-transmitting and light-diffusing and also has air permeability, for example, a porous material made of a resin material having light-diffusing properties. Here, the reason why the upper member 26 is formed in a thin sheet shape is to improve the light transmittance in the thickness direction of the upper member 26 and to ensure air permeability and thereby to ensure the holding force of the component D.

[0022] Plate-like member 27 is made of a plate-like member made of a resin material such as acrylic having optical transparency. Plate-like member 27 is provided in contact with the lower surface side of upper member 26, and supports upper member 26 from below. Plate-like member 27 has a plurality of suction holes 27H penetrating in the thickness direction in correspondence with the positions of parts D to be placed (temporarily placed) on upper member 26.

[0023] 3 and 4, partitioning member 28 is made of a plate-like member. Partitioning member 28 is provided in contact with the lower surface side of plate-like member 27, and supports upper member 26 and plate-like member 27 from below to maintain a flat plate shape. For this reason, partitioning member 28 is thicker than upper member 26 (for example, about 3 mm) and has rigidity that makes it difficult to bend and deform. Partitioning member 28 has a plurality of region forming holes 28H that penetrate in the thickness direction. Partitioning member 28 divides upper member 26 and plate-like member 27 into a plurality of regions while in contact with plate-like member 27.

[0024] 3 and 4, holder 30 has upper opening 31 that opens upward and lower opening 32 that opens downward, and is provided with light-transmitting member 29 on its underside. Light-transmitting member 29 is a plate-like member made of glass, transparent resin material, or the like, and is provided so as to close lower opening 32. A protruding edge 30F that protrudes inward from upper opening 31 is provided in a portion of holder 30 located slightly below upper opening 31.

[0025] The peripheral portion of the partition member 28 is placed on this overhanging edge 30F, and the plate-like member 27 and the upper member 26 are placed on top of it, so that the upper member 26, the plate-like member 27 and the partition member 28 can be attached to the upper opening 31. The upper member 26, the plate-like member 27 and the partition member 28 may be attached to the overhanging edge 30F in a state where they are previously stacked and fixed to each other. In this way, the upper member 26, the plate-like member 27 and the partition member 28 are stacked and held on the upper part of the holder 30. If the plate-like member 27 is thicker and harder than the upper member 26 and can hold the upper member 26 in a flat plate shape, the partition member 28 can be omitted.

[0026] In FIG. 3, when the upper member 26, the plate-like member 27, the partition member 28, and the light-transmitting member 29 are attached to the holder 30, a hollow internal space 30P is formed inside the chamber 21. The internal space 30P of the chamber 21 is in communication with the upper surface side of the upper member 26 via the upper member 26, the plate-like member 27, and the partition member 28. A suction flow path 30S is formed in the side wall of the holder 30, leading from the outside to the internal space 30P. A suction pipe line 33 leading to the vacuum source 8 is connected to the position where the suction flow path 30S opens on the outer surface of the holder 30. In this way, the internal space 30P of the chamber 21 is in communication with the vacuum source 8 via the suction flow path 30S and the suction pipe line 33.

[0027] When the vacuum source 8 is operated to suck air, the vacuum source 8 sucks air in the chamber 21 (inside the internal space 30P) through the suction pipe 33. As a result, the pressure inside the chamber 21 becomes negative, and the air on the upper side of the upper member 26 is sucked into the chamber 21 through the breathable upper member 26 (through the pores of the porous material constituting the upper member 26). This generates an adsorption force on the upper surface of the upper member 26, and when a component D is placed on the upper surface side of the upper member 26, the component D is adsorbed and held on the upper surface of the upper member 26. Furthermore, by limiting the area where air is sucked through the upper member 26 by the suction holes 27H of the plate-like member 27, the component D can be efficiently adsorbed and held on the upper surface of the upper member 26.

[0028] In this way, holder 30 and light transmitting member 29 constitute a suction section that sucks air from below plate-like member 27 through suction holes 27H and upper member 26, thereby adsorbing component D placed on upper member 26 to the upper surface of upper member 26. That is, the suction section includes holder 30 that holds upper member 26 and plate-like member 27 to form a closed space (internal space 30P), and generates an adsorption force on the upper surface of upper member 26 by sucking in air within the space.

[0029] 3, when light 22a is irradiated upward from light emitting section 24 of light source section 22 in a state in which component D is suction-held on the upper surface of upper member 26, irradiated light 22a passes through diffusion member 25 and is diffused to reach light transmitting member 29 of chamber 21. Light 22a that has reached light transmitting member 29 passes through light transmitting member 29, area forming hole 28H of partition member 28, and plate-like member 27 to reach upper member 26. Light 22a that has reached upper member 26 passes through upper member 26 or is diffused within upper member 26 to reach the upper surface of upper member 26. Light 22a that has reached the upper surface of upper member 26 is irradiated to the sky in areas where component D is not present, and is blocked by temporarily placed component D in areas where component D is present.

[0030] In this state, by capturing an image of upper member 26 from above with head camera 13, the external shape of temporarily placed part D can be recognized with high accuracy (see FIG. 11(a)). The contrast (difference in brightness) between part D and upper member 26 in the image captured by head camera 13 is adjusted by the transmittance of upper member 26, the transmittance of diffusion member 25, the arrangement of light emitting section 24, the luminance of light 22a, the irradiation angle, the position of diffusion member 25, etc. In other words, the illuminance of light 22a is adjusted to be approximately the same (uniform) at each position of part D temporarily placed on temporary placement stage 7.

[0031] Thus, the holder 30 has an upper opening 31 to which the upper member 26 is attached, a lower opening 32 formed below the upper opening 31, and a light transmitting member 29 that transmits the light 22a irradiated from the light source unit 22 to reach the upper member 26 at a position that closes the lower opening 32. In addition, the temporary placement stage 7 has a diffusing member 25 disposed between the light source unit 22 and the upper member 26, which diffuses the light 22a irradiated from the light source unit 22 toward the upper member 26. In addition, the upper member 26 also diffuses the light 22a irradiated from the light source unit 22 toward its upper surface.

[0032] Next, referring to FIG. 5, another embodiment of the chamber constituting the temporary placement stage 7 will be described. In the chamber 34 of the other embodiment, the method of installing the upper member 26, the plate-like member 27, the partition member 28, and the light-transmitting member 29 on the holder 35 is different from that of the chamber 21 shown in FIG. 3. That is, the upper member 26, the plate-like member 27, and the partition member 28 are installed overlapping on the upper surface of the upper opening 36 that opens upward of the holder 35. Also, the light-transmitting member 29 is installed in contact with the lower surface of the lower opening 37 that opens downward of the holder 35. As a result, a hollow internal space 35P is formed inside the chamber 34. The internal space 35P is sucked by the vacuum source 8 through the suction flow path 35S and the suction pipe 33 formed on the side wall of the holder 35.

[0033] Next, the relationship between the upper member 26, the suction holes 27H of the plate-like member 27, and the area forming holes 28H of the partition member 28 will be described with reference to Figures 6(a) to 6(c). Figure 6(b) shows the positional relationship between the suction nozzles 11b (nozzle drive units 11a) and the suction holes 27Ha of an 8-nozzle mounting head (mounting head 11 having eight nozzle drive units 11a). Figure 6(c) shows the positional relationship between the suction nozzles 11b (nozzle drive units 11a) and the suction holes 27Hb of a 16-nozzle mounting head (mounting head 11 having 16 nozzle drive units 11a).

[0034] In Fig. 6(a), eight suction holes 27Ha corresponding to the eight suction nozzles 11b of the eight-nozzle head and sixteen suction holes 27Hb corresponding to the sixteen suction nozzles 11b of the sixteen-nozzle head are formed in the plate-like member 27. In addition, a plurality of (eight in this example) area forming holes 28H of the partition member 28 are formed so that the suction holes 27Ha and the suction holes 27Hb are located therein. In this example, one suction hole 27Ha and two suction holes 27Hb are located in one area forming hole 28H. That is, the plurality of suction holes 27H (27Ha, 27Hb) are formed in the plate-like member 27 so as to be located inside the area forming hole 28H.

[0035] In Fig. 6(b), an 8-nozzle mounting head, in which eight suction nozzles 11b each hold a component D, is positioned above the temporary placement stage 7, and the eight suction nozzles 11b are simultaneously lowered, so that eight components D can be placed (temporarily placed) on the upper member 26 at the positions of the suction holes 27Ha at one time (see Fig. 10). In Fig. 6(c), a 16-nozzle mounting head, in which 16 suction nozzles 11b each hold a component D, is positioned above the temporary placement stage 7, and the 16 suction nozzles 11b are simultaneously lowered, so that 16 components D can be placed (temporarily placed) on the upper member 26 at the positions of the suction holes 27Hb at one time. In this way, the components D placed on the upper member 26 are placed in an area partitioned by the partition member 28.

[0036] Also, when a component D temporarily placed on the temporary placement stage 7 is imaged by the head camera 13 and then re-sucked by the suction nozzles 11b, the mounting head 11 (8-nozzle mounting head, 16-nozzle mounting head) is positioned above the temporary placement stage 7 and all of the suction nozzles 11b are raised and lowered simultaneously, so that all of the components D can be re-sucked at once (simultaneous re-sucking) (see Figure 11).

[0037] If the imaging results of the temporarily placed components D by the head camera 13 show that the position of the components D relative to the suction nozzle 11b is inappropriate when simultaneously re-picking up the components D (the positional deviation of the temporarily placed components D relative to the suction nozzle 11b to be re-picked up is large), then individual re-picking up is performed in which the positions of the mounting head 11 are individually corrected and then the components are re-picked up by the suction nozzle 11b. In the individual re-picking up, in addition to re-picking up the components D in order for each suction nozzle 11b, it is also possible to simultaneously re-pick up a group of components that have similar tendencies of misalignment of the temporarily placed components D.

[0038] Furthermore, if the component D held by each of the multiple suction nozzles 11b is imaged by the component recognition camera 14 before being placed (temporarily placed) on the upper member 26 and there is any component D whose position with respect to the suction nozzle 11b is inappropriate (the positional deviation of the component D with respect to the suction nozzle 11b is large), the component may be placed (temporarily placed) individually at a position where simultaneous re-suction is possible on the upper member 26. Furthermore, if the component D held by each of the multiple suction nozzles 11b is imaged by the component recognition camera 14 before being placed (temporarily placed) on the upper member 26 and there is any component D whose suction state with respect to the suction nozzle 11b is not good (the component is standing, etc.), the component may be placed (temporarily placed) individually so as to enable simultaneous re-suction on the upper member 26.

[0039] In this way, the plurality of suction holes 27H (27Ha, 27Hb) are formed in the plate-like member 27 in correspondence with the shape (configuration) of the mounting head 11, which is a device that places the component D on the upper member 26. Also, the plurality of suction holes 27H are formed in the plate-like member 27 in correspondence with different devices. In this example, a single plate-like member 27 is formed with a plurality of suction holes 27Ha and a plurality of suction holes 27Hb corresponding to different devices (8-nozzle mounting head, 16-nozzle mounting head). Also, the partition member 28 can change the number of area forming holes 28H to a different one. Note that the size of the area forming holes 28H is desirably larger than the outer shape of the component D to be temporarily placed on the temporary placement stage 7 so as not to block the light 22a that illuminates the component D from below.

[0040] As described above, the temporary placement stage 7 on which the component D to be mounted on the board 3 is temporarily placed includes an upper member 26 that has air permeability and on which the component D is placed, a plate-like member 27 that is disposed below the upper member 26 and has a plurality of suction holes 27H penetrating in the thickness direction, a suction section (holding body 30, light-transmitting member 29) that sucks air from below the plate-like member 27 through the suction holes 27H and the upper member 26 to adsorb the component D placed on the upper member 26 to the upper surface of the upper member 26, and a light source section 22 that irradiates the upper member 26 with light 22a from below. This makes it possible to clearly recognize the external shape of the component D while preventing the placed component D from shifting out of position.

[0041] Furthermore, by providing partition member 28, which is disposed below plate-like member 27 and has region forming holes 28H penetrating in the thickness direction, and which partitions upper member 26 by region forming holes 28H, it is possible to prevent bending or deformation of upper member 26 due to suction by the suction section or impact when suction nozzle 11b places component D. In this manner, component mounting device 1 to which temporary placement unit 6 is attached includes temporary placement stage 7 and mounting head 11 that mounts component D temporarily placed on temporary placement stage 7 onto substrate 3. Note that component mounting device 1 may be configured to include temporary placement stage 7 on base 1a.

[0042] Next, the configuration of the control system of the component mounting device 1 will be described with reference to Fig. 7. The component mounting device 1 includes a control device 40, a board transport unit 2, a tape feeder 5, a temporary placement unit 6, a mounting head 11, an XY unit 12, a head camera 13, and a component recognition camera 14. The control device 40 includes a memory unit 41, a mounting operation processing unit 42, and a positional deviation measurement processing unit 43. The memory unit 41 is a storage device, and stores mounting data 44, positional deviation data 45, and the like. The mounting data 44 stores various information such as the type and size of the component D to be mounted on the board 3, and the coordinates of the component mounting position on the board 3, for each board type of the mounting boards to be produced.

[0043] The mounting operation processing unit 42 controls the board transport unit 2, the tape feeder 5, the mounting head 11, the XY unit 12, the head camera 13, and the component recognition camera 14 based on the mounting data 44 to execute a component mounting operation of mounting the component D at a component mounting position on the board 3. In the component mounting operation, the mounting operation processing unit 42 corrects the amount of misalignment of the component D held by the suction nozzle 11b based on the positional deviation data 45 and mounts the component D on the board 3. The positional deviation measurement processing unit 43 controls the temporary placement unit 6, the mounting head 11, the XY unit 12, and the head camera 13 to temporarily place the component D held by the suction nozzle 11b on the temporary placement stage 7, recognize the amount of misalignment of the component D, and store the amount of misalignment in the storage unit 41 as positional deviation data 45.

[0044] Next, a component mounting method by the component mounting device 1 will be described with reference to Figs. 10 and 11 along the flow of Figs. 8 and 9. First, the mounting operation processing unit 42 causes the board transport unit 2 to carry in the board 3 and hold it at the mounting operation position (ST1: board carrying step). Next, the mounting operation processing unit 42 causes each suction nozzle 11b of the mounting head 11 to pick up and hold a component D from the tape feeder 5 (ST2: component suction step). Below, the mounting head 11 will be described using an example of an eight-nozzle mounting head. That is, each of the eight suction nozzles 11b of the mounting head 11 holds a component D. Next, the positional deviation measurement processing unit 43 activates the vacuum source 8 (ST3: vacuum source on step) (arrow a in Fig. 10(a)).

[0045] Next, the misalignment measurement processing unit 43 moves the mounting head 11 above the temporary placement stage 7 (FIG. 10(a)). Next, the misalignment measurement processing unit 43 simultaneously lowers the eight suction nozzles 11b to bring the bottom surfaces of the held components D into contact with the top surface of the upper member 26 (arrow b in FIG. 10(b)). Next, the misalignment measurement processing unit 43 stops the vacuum suction of all the suction nozzles 11b and simultaneously raises the eight suction nozzles 11b (arrow c in FIG. 10(c)). As a result, the eight components D are placed (temporarily placed) on the top surface of the upper member 26 (ST4: temporary component placement process).

[0046] 8, the misalignment measurement processing unit 43 then causes the light emitting unit 24 of the light source unit 22 to emit light 22a (ST5: light source on step) (FIG. 11(a)). Next, the misalignment measurement processing unit 43 moves the head camera 13 (arrow d in FIG. 11(a)) to capture an image of the component D temporarily placed on the upper member 26 (ST6: imaging step). The misalignment measurement processing unit 43 recognizes and processes the captured image, calculates the amount of misalignment in the XY directions and the amount of rotational misalignment of each of the eight components D, and stores the calculated amount of misalignment in the memory unit 41 as misalignment data 45. Next, the misalignment measurement processing unit 43 stops the emission of light 22a from the light emitting unit 24 (ST7: light source off step).

[0047] Next, the positional deviation measurement processing unit 43 moves the mounting head 11 to the same position as when the component D was temporarily placed on the upper member 26. Next, the positional deviation measurement processing unit 43 re-adsorbs the temporarily placed component D to the eight suction nozzles 11b (ST8: component re-adsorption process).

[0048] 9, in the component re-pickup step (ST8), first, the positional deviation measurement processing unit 43 judges whether simultaneous re-pickup is possible or not based on the image of the temporarily placed components D captured in the imaging step (ST6) (ST21: simultaneous re-pickup possibility judgment step). If the positional deviation of the temporarily placed components D relative to the suction nozzles 11b that will re-pickup them is small, the positional deviation measurement processing unit 43 judges that simultaneous pick-up is possible (Yes in ST21), and the temporarily placed components D are simultaneously re-pickup by the eight suction nozzles 11b (ST22: simultaneous re-pickup step).

[0049] That is, the misalignment measurement processing unit 43 simultaneously lowers the eight suction nozzles 11b (arrows e in FIG. 11(b)). When the lower ends of the suction nozzles 11b come into contact with the upper surface of the component D, the misalignment measurement processing unit 43 then starts vacuum suction of all the suction nozzles 11b. Next, the misalignment measurement processing unit 43 simultaneously raises the eight suction nozzles 11b (arrows f in FIG. 11(c)).

[0050] 9, if there is a temporarily placed component D with a large positional deviation relative to the suction nozzle 11b that will pick up the temporarily placed component D again, the positional deviation measurement processing unit 43 determines that simultaneous pickup is not possible (No in ST21), and the temporarily placed component D is re-picked up by the suction nozzle 11b individually or for each group of components with similar tendency for positional deviation (ST23: individual re-picking up process). As a result, the component D is re-picked up by the eight suction nozzles 11b (ST22, ST23).

[0051] 8, next, the positional deviation measurement processing unit 43 stops the vacuum source 8 (ST9: vacuum source off step). In this way, the steps from the component temporary placement step (ST4) to the component re-suction step (ST8) are performed with the vacuum source 8 operating. Therefore, the suction force of the component D on the upper member 26 of the temporary placement stage 7 is adjusted so that the positional deviation of the component D mounted on the upper member 26 can be prevented and is weaker than the suction force with which the suction nozzle 11b holds the component D.

[0052] If air is sucked from the upper component 26 when the component D is not placed on the upper component 26, dirt and dust may adhere to the upper surface of the upper component 26. Therefore, it is desirable to shorten the time from the vacuum source ON step (ST3) to the component temporary placement step (ST4) and the time from the component re-adsorption step (ST8) to the vacuum source OFF step (ST9).

[0053] In the above example, the vacuum source is turned on (ST3) and the light source is turned on (ST5) in separate steps, but they do not necessarily have to be turned on in separate steps. For example, the vacuum source and the light source may be turned on at the same time before the component temporary placement step (ST4). Similarly, the light source is turned off (ST7) and the vacuum source is turned off (ST9) and they do not necessarily have to be turned off in separate steps, and the light source and the vacuum source may be turned off at the same time after the component re-sucking step (ST8).

[0054] Next, the mounting operation processing unit 42 mounts the components D re-adsorbed by the mounting head 11 at the component mounting positions on the board 3 (ST10: component mounting process). In the component mounting process (ST10), the mounting operation processing unit 42 corrects the amount of positional deviation of each component D based on the positional deviation data 45 and mounts the components D on the board 3. The component pickup process (ST2) to the component mounting process (ST10) are repeatedly executed until all the components D are mounted on the board 3 (No in ST11). When all the components D have been mounted on the board 3 (Yes in ST11), the mounting operation processing unit 42 causes the board transport unit 2 to unload the board 3 (ST12: board unloading process).

[0055] In this way, the component mounting device 1 equipped with the temporary placement stage 7 can prevent misalignment of the mounted component D, clearly recognize the outer shape of the component D to measure the amount of misalignment, and correct the position and rotation angle of the suction nozzle 11b based on the measured amount of misalignment to mount the component D on the substrate 3, thereby achieving high mounting accuracy. [Industrial Applicability]

[0056] INDUSTRIAL APPLICABILITY The temporary placement stage and component mounting device of the present invention have the effect of preventing displacement of a placed component while allowing the external shape of the component to be clearly recognized, and are useful in the field of mounting components on a substrate. [Explanation of symbols]

[0057] 1. Parts mounting equipment 3. Substrate 7 Temporary Stage 11 Mounting head 22 Light source section 22a light 25 Diffusion material 26 Upper member 27 Plate-shaped members 27H, 27Ha, 27Hb suction hole 28 Partitioning material 28H area forming hole 29 Light-transmitting member (suction part) 30, 35 Holder (suction part) 30P, 35P Internal space (closed space) 31, 36 Upper opening 32, 37 Lower opening D parts

Claims

1. A temporary placement stage on which components to be mounted on a substrate are temporarily placed, an upper member having air permeability and on whose upper surface a component is placed; a plate-like member disposed below the upper member and having a plurality of suction holes penetrating therethrough in a thickness direction; a suction unit that sucks air from below the plate-like member through the suction hole and the upper member to adsorb a component placed on the upper member onto an upper surface of the upper member; A light source unit that irradiates light onto the upper member from below; a partition member disposed below the plate-like member, the partition member having an area forming hole penetrating in a thickness direction, the partition member partitioning the upper member by the area forming hole,

2. The temporary placement stage according to claim 1 , wherein the plurality of suction holes are formed in the plate-like member so as to be positioned inside the region forming hole.

3. The temporary placement stage according to claim 1 , wherein the component to be placed on the upper member is placed in an area defined by the partition member.

4. The temporary placement stage according to claim 1 , wherein the partition member has a changeable number of the area forming holes.

5. 5. The temporary placement stage according to claim 1, wherein the suction section includes a holder that holds the upper member and the plate-like member to form a closed space, and an adhesive force is generated on an upper surface of the upper member by sucking in air from within the space.

6. 6. The temporary placement stage according to claim 5, wherein the holder has an upper opening to which the upper member is attached, a lower opening formed below the upper opening, and a light-transmitting member that transmits light irradiated from the light source unit to a position that closes the lower opening and allows the light to reach the upper member.

7. The temporary placement stage according to claim 5 , wherein the upper member, the plate-like member and the partition member are stacked and held on the upper part of the holder.

8. The temporary placement stage according to claim 1 , wherein the plurality of suction holes are formed in the plate-like member in accordance with a shape of a device for placing components on the upper member.

9. The temporary placement stage according to claim 8 , wherein the plurality of suction holes are formed in the plate-like member corresponding to different pieces of equipment.

10. The temporary placement stage according to claim 1 , further comprising a diffusion member disposed between the light source unit and the upper member, the diffusion member diffusing the light emitted from the light source unit toward the upper member.

11. The temporary placement stage according to claim 1 , wherein the upper member is made of a porous material and has air permeability.

12. The temporary placement stage according to claim 1 , wherein the upper member diffuses the light emitted from the light source unit toward an upper surface thereof.

13. The temporary placement stage according to claim 1 , wherein the plate-like member is thicker than the upper member.

14. The temporary placement stage according to claim 1 , wherein the plate-like member is harder than the upper member.

15. 15. A component mounting device comprising: the temporary placement stage according to claim 1; and a mounting head that mounts the component temporarily placed on the temporary placement stage onto a substrate.

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