Component mounting device, component holding member, component holding support member, and component mounting method

Abstract

To provide a component mounting device capable of mounting a large component on a board without deteriorating the productivity, a component holding member, a component holding support member, and a component mounting method.SOLUTION: The component mounting device sucks an upper surface of a component D2 with a suction nozzle 17A attached to a head unit 10, and picks up and mounts the same on a board. The component mounting device includes: a contact member 20A that is provided to a front end of the suction nozzle 17A and comes into contact with an adsorption area 23A on the upper surface of the component D2; and multiple regulation parts 22A that are placed at least at two places around the suction nozzle 17A and come into contact with the upper surface of the component D2 other than the adsorption area 23A for regulating the attitude of the component D2 sucked by the suction nozzle 17A.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a component mounting device, a component holding member, a component holding assist member, and a component mounting method for holding and mounting a component on a board. [Background technology]

[0002] In recent years, there has been an increasing demand for mounting larger components on a board using a component mounting device that holds components with a suction nozzle and mounts them on a board. However, as components become larger, a problem has become apparent in which the component held by the suction nozzle becomes tilted due to a misalignment in the position where the component is held, making it impossible to mount the component on the board in the correct posture (see, for example, Patent Document 1). Patent Document 1 discloses that the component mounting device (surface mounting device) detects that the component held by the nozzle is tilted, places the component held by the nozzle on a component posture correction means, corrects the posture of the component, and then holds it again with the nozzle. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-192904 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, with conventional technologies including Patent Document 1, although the nozzle can hold the component in the correct posture, it is necessary to limit the nozzle movement speed so that the component does not tilt between holding the component and moving it to the mounting position on the board, resulting in reduced productivity.

[0005] SUMMARY OF THE PRESENT EMBODIMENTS The present invention has an object to provide a component mounting device, a component holding member, a component holding assistance member, and a component mounting method that are capable of mounting large components on a board without reducing productivity. [Means for solving the problem]

[0006] The component mounting device of the present invention is a component mounting device that picks up and mounts a component on a substrate by suctioning the upper surface of the component with a suction nozzle attached to a head unit, and includes a contact member provided at the tip of the suction nozzle and contacting a suction area on the upper surface, and a plurality of regulating parts that are arranged in at least two places around the suction nozzle and contact areas of the upper surface other than the suction area to regulate the attitude of the component picked up by the suction nozzle; A top plate extending in a horizontal direction and provided on the suction nozzle; Equipped with The restricting portion extends downward from the top plate. . Another component mounting device of the present invention is a component mounting device that picks up and mounts the top surface of a component on a substrate by suction with a suction nozzle attached to a head unit, and comprises an abutment member provided at the tip of the suction nozzle and abutting the suction area on the top surface, and a plurality of regulating portions arranged in at least two locations around the suction nozzle and contacting locations on the top surface other than the suction area to regulate the posture of the component picked up by the suction nozzle, wherein the head unit is capable of mounting a plurality of suction nozzles, and the regulating portions are provided on the head unit in place of a suction nozzle different from the suction nozzle. Another component mounting device of the present invention is a component mounting device that picks up and mounts an upper surface of a component on a substrate by suction with a suction nozzle attached to a head unit, and comprises a contact member provided at the tip of the suction nozzle and abutting the suction area on the upper surface, a plurality of regulating portions arranged in at least two locations around the suction nozzle and contacting locations on the upper surface other than the suction area to regulate the posture of the component picked up by the suction nozzle, and a plate-shaped member extending horizontally provided on the underside of the head unit, and the regulating portions extend downward from the underside of the plate-shaped member.

[0007] Another component mounting device of the present invention is a component mounting device that picks up and mounts a component by suctioning the top surface of the component with a suction nozzle and mounts it on a substrate, and is equipped with an abutment member provided at the end of the suction nozzle and abutting the suction area on the top surface, and a top plate connecting the tip of the suction nozzle and the abutment member, wherein the tip of the nozzle, the abutment member and the top plate form a closed space between the abutment member and the top surface when the abutment member abuts the suction area, and the abutment member regulates the posture of the component picked up by the suction nozzle.

[0008] The component holder of the present invention is attached to a head unit of a component mounting device and holds components mounted on a substrate. Top of a component holder for holding a component, the component holder comprising: a suction nozzle; a contact member provided at a tip of the suction nozzle and contacting the suction area on the upper surface; and a plurality of restricting portions provided integrally with the suction nozzle at at least two locations around the suction nozzle, the restricting portions contacting locations on the upper surface other than the suction area and restricting a position of the component picked up by the suction nozzle. A top plate extending in a horizontal direction and provided on the suction nozzle; Equipped with The restricting portion extends downward from the top plate. .

[0009] Another component holding member of the present invention is a component holding member that is attached to a head unit provided in a component mounting device and holds the upper surface of a component to be mounted on a substrate, and comprises a suction nozzle, a contact member provided at the end of the suction nozzle and contacting an suction area on the upper surface, and a top plate connecting the tip of the suction nozzle and the contact member, wherein the tip of the suction nozzle, the contact member and the top plate form a closed space between the top surface and the contact member when the contact member contacts the suction area, and the contact member regulates the posture of the component picked up by the suction nozzle.

[0010] The component holding support member of the present invention is a component holding support member that is attached to a head unit of a component mounting device and is used together with a suction nozzle that holds an upper surface of a component to be mounted on a substrate, the component holding support member comprising: a plate-like member extending in a horizontal direction and provided on a lower surface of the head unit; a plurality of regulating portions that are located at at least two locations around the suction nozzle, that come into contact with a location on the upper surface other than a suction area where the suction nozzle contacts the component, and that regulate a posture of the component picked up by the suction nozzle; The restricting portion extends downward from the lower surface of the plate-like member. .

[0011] Another component holding support member of the present invention is a component holding support member that is attached to a head unit capable of mounting multiple suction nozzles equipped in a component mounting device, and is used together with suction nozzles that hold the upper surface of a component to be mounted on a board, and is attached to the head unit in place of a suction nozzle different from the suction nozzle that holds the upper surface of the component, and has at least one regulating portion that is positioned around the suction nozzle and contacts areas of the upper surface other than the suction area where the suction nozzle abuts the component, and regulates the posture of the component picked up by the suction nozzle.

[0012] The component mounting method of the present invention is a component mounting method for mounting a component on a substrate by a component mounting device that picks up and suctions the upper surface of a component with a suction nozzle attached to a head unit and mounts the component on the substrate, and includes moving the multiple regulating parts and the upper surface of the component relatively from a state in which a plurality of regulating parts located at at least two locations around the suction nozzle are in contact with a location on the upper surface other than the suction area where the suction nozzle abuts the component, moving the multiple regulating parts and the upper surface of the component relatively to move the multiple regulating parts away from the upper surface, rotating the suction nozzle, and moving the multiple regulating parts and the upper surface of the component relatively to bring the multiple regulating parts into contact with the upper surface again. Effect of the Invention

[0013] According to the present invention, large components can be mounted on a board without reducing productivity. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a plan view of a component mounting device according to an embodiment of the present invention; [Diagram 2] FIG. 2A is a front view of a head unit provided in a component mounting device according to an embodiment of the present invention; [Diagram 3] 1A is a front view, FIG. 1B is a bottom view, and FIG. 1C is a cross-sectional view showing a state in which a first component holder is attached to a head unit included in a component mounting device according to an embodiment of the present invention. [Figure 4] 1A is a front view, FIG. 1B is a bottom view, and FIG. 1C is a cross-sectional view showing a state in which a suction nozzle and a first component holding support member are attached to a head unit of a component mounting device according to an embodiment of the present invention. [Diagram 5] 1A is a front view, FIG. 1B is a bottom view, and FIG. 1C is a cross-sectional view showing a state in which a suction nozzle and a second component holding support member are attached to a head unit of a component mounting device according to an embodiment of the present invention. [Figure 6] 1A is a front view, FIG. 1B is a bottom view, and FIG. 1C is a cross-sectional view showing a state in which a second component holder is attached to a head unit included in a component mounting device according to an embodiment of the present invention. [Figure 7]FIG. 1 is a flow diagram of a component mounting method according to an embodiment of the present invention. [Figure 8] 1A and 1B are explanatory diagrams illustrating a process of correcting the posture of a component held by a head unit to which a third suction nozzle is attached according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting device, head unit, suction nozzle, component holding member, and component holding support member. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations are omitted. In FIG. 1 and some parts described later, the X-axis (left and right direction in FIG. 1) in the substrate transport direction and the Y-axis (up and down direction in FIG. 1) perpendicular to the substrate transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 2(a) and some parts described later, the Z-axis (up and down direction in FIG. 2(a)) is shown as the height direction perpendicular to the horizontal plane.

[0016] First, the configuration of the component mounting device 1 will be described with reference to Fig. 1. A board transport mechanism 2 is installed along the X-axis at the center of a base 1a. The board transport mechanism 2 transports a board 3 carried in from upstream along the X-axis, and positions and holds the board 3 at a mounting position by a head unit, which will be described below. The board transport mechanism 2 also carries out the board 3 downstream after the component mounting operation has been completed.

[0017] A component supply unit 4 is installed on each side (front-rear direction of the Y axis) of the board transport mechanism 2. A plurality of tape feeders 5 are attached in parallel along the X axis to the component supply units 4 on both sides. The tape feeders 5 feed a carrier tape, on which pockets for storing components are formed, in a direction (tape feed direction) from outside the component supply unit 4 toward the board transport mechanism 2, thereby supplying components to a component removal position where the head unit picks up the components. In addition, a tray feeder 7 is attached to one of the component supply units 4, which supplies a plurality of trays 6 containing components D, connectors, etc. to the component removal position.

[0018] In Fig. 1, a Y-axis table 8 equipped with a linear drive mechanism is disposed on both ends of the X-axis on the upper surface of a base 1a. A beam 9 similarly equipped with a linear mechanism is coupled to the Y-axis table 8 so as to be freely movable along the Y-axis. A head unit 10 is attached to the beam 9 so as to be freely movable along the X-axis. The head unit 10 is equipped with multiple (three in this example) nozzle lifting and rotating mechanisms 11 that can raise and lower a suction nozzle detachably attached to the lower end and rotate it around a vertical axis (Z-axis).

[0019] The Y-axis table 8 and the beam 9 constitute a head moving mechanism 12 that moves the head unit 10 along the X-axis and the Y-axis. The head moving mechanism 12 and the head unit 10 constitute a component mounting mechanism that performs a component mounting operation of picking up components from the component supply unit 4 and mounting them at the mounting positions on the board 3. In the component mounting operation, the head unit 10 moves above the component supply unit 4, picks up each of the predetermined components by suctioning the upper surfaces of the components with a suction nozzle, moves above the board 3, rotates the components held by the suction nozzle in a predetermined direction, and repeats a series of turns to mount the components at their respective mounting positions. In this way, the component mounting device 1 suctions the components with the suction nozzle attached to the head unit 10 and mounts them on the board 3.

[0020] 1, beam 9 is fitted with head camera 13, which is located on the underside of beam 9 and moves integrally with head unit 10. As head unit 10 moves, head camera 13 moves above substrate 3 positioned at the mounting operation position of substrate transport mechanism 2, and recognizes the position of a substrate mark (not shown) provided on substrate 3.

[0021] A component recognition camera 14 is installed between the component supply unit 4 and the board transport mechanism 2. When the head unit 10, which has taken out a component from the component supply unit 4, is positioned above the component recognition camera 14, the component recognition camera 14 captures an image of the component held by the suction nozzle from below. When the head unit 10 mounts the component on the board 3, the mounting position is corrected taking into account the recognition results of the board 3 by the head camera 13 and the recognition results of the component by the component recognition camera 14.

[0022] 1, a nozzle stocker 15 having a plurality of nozzle housing units 15a that stocks suction nozzles to be attached to the nozzle lifting and rotating mechanism 11 of the head unit 10 is disposed next to the component recognition camera 14. The component mounting device 1 is equipped with a control device C. The control device C is equipped with a storage unit that stores at least information related to components, and a control unit that controls each unit of the component mounting device 1 based on various information stored in the storage unit. The control unit not only executes a component mounting operation, but also executes a nozzle replacement operation for replacing the suction nozzle attached to the nozzle lifting and rotating mechanism 11 with the suction nozzle stocked in the nozzle stocker 15.

[0023] The nozzle replacement operation is performed by the control unit controlling the head moving mechanism 12 and the nozzle lifting and rotating mechanism 11 based on information stored in the memory unit, including the type of component to be mounted on the board and the type of suction nozzle that will pick up the component. In the nozzle replacement operation, the control unit first controls the head moving mechanism 12 to move the nozzle lifting and rotating mechanism 11, to which the suction nozzle to be replaced is attached, above an empty nozzle housing section 15a of the nozzle stocker 15. Next, the control unit controls the nozzle lifting and rotating mechanism 11 to lower the attached suction nozzle and accommodate the suction nozzle in the empty nozzle housing section 15a.

[0024] Next, the control unit controls the head moving mechanism 12 to move the nozzle lifting and rotating mechanism 11 from which the suction nozzle has been removed to above the nozzle storage section 15a in which the suction nozzle to be attached is stocked. Next, the control unit controls the nozzle lifting and rotating mechanism 11 to attach the suction nozzle that was stocked in the nozzle storage section 15a to the tip of the nozzle lifting and rotating mechanism 11.

[0025] In this way, the head moving mechanism 12 and the nozzle lifting and rotating mechanism 11 of the head unit 10 constitute a nozzle exchanging means that exchanges the detachable suction nozzle attached to the nozzle lifting and rotating mechanism 11 of the head unit 10 with the suction nozzle stocked in the nozzle accommodating section 15a of the nozzle stocker 15. The control section controls the nozzle exchanging means based on information stored in the memory section.

[0026] Next, a detailed configuration of the head unit 10 will be described with reference to FIG. 2. In the head unit 10, three nozzle lifting and rotating mechanisms 11A, 11B, and 11C are arranged along the X-axis. A nozzle holder 16 for holding a suction nozzle 17 is arranged at the lower end of each of the nozzle lifting and rotating mechanisms 11A to 11C. A plurality of types of suction nozzles 17 are prepared corresponding to the size, shape, etc. of the component D1 to be picked up, and the suction nozzle 17 corresponding to the type of component D1 to be mounted on the substrate 3 is attached to the nozzle holder 16. Note that the number of nozzle lifting and rotating mechanisms 11A to 11C provided in the head unit 10 is not limited to three, and may be changed depending on the type of suction nozzle 17 to be attached, the type of component D1 to be picked up, etc.

[0027] A held part 18 is disposed on the upper part of the suction nozzle 17. The suction nozzle 17 is attached to the nozzle holder 16 by the nozzle holder 16 gripping the held part 18. A suction hole (not shown) is formed inside the suction nozzle 17, penetrating vertically and opening to a suction opening 17a at the lower end of the suction nozzle 17. The suction hole of the suction nozzle 17 attached to the nozzle holder 16 is connected to a vacuum source (not shown) via the nozzle lifting and rotating mechanisms 11A to 11C. By operating the vacuum source, a suction force is generated at the suction opening 17a, and the component D1 is sucked to the lower end of the suction nozzle 17.

[0028] Next, the configuration of the first component holding member 19A (component holding member) that holds the large component D2 mounted on the substrate 3 will be described with reference to Fig. 3. The first component holding member 19A is attached to the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B in the center of the head unit 10. Fig. 3(a) shows the first component holding member 19A attached to the nozzle lifting and rotating mechanism 11B as viewed from the front. Fig. 3(b) shows the first component holding member 19A attached to the nozzle lifting and rotating mechanism 11B as viewed from below. Fig. 3(c) shows the state as viewed below from the cross section A shown in Fig. 3(a).

[0029] The first component holding member 19A includes a suction nozzle 17A, the held portion 18 of which is held by the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B. A contact member 20A is provided at the tip of the suction nozzle 17A, which contacts a suction area 23A on the upper surface of the component D2. In this example, the suction area 23A includes the center of the upper surface of the component D2 and is set to an area larger than the contact surface of the contact member 20A. A suction opening 20Aa communicating with a suction hole of the suction nozzle 17A is opened on the lower surface of the contact member 20A, which contacts the upper surface of the component D2. By operating a vacuum source while the contact member 20A is in contact with the upper surface of the component D2, the component D2 is sucked onto the contact member 20A.

[0030] A plate-like top plate 21A that extends horizontally is disposed on the suction nozzle 17A. The top plate 21A is made of a hard material such as metal or acrylic. Four downwardly extending restricting portions 22A are disposed on the lower surface of the top plate 21A. The four restricting portions 22A are disposed near the four corners of the component D2 that is sucked to the contact member 20A. The height positions of the lower surfaces of the four restricting portions 22A are set to a height that contacts the upper surface of the component D2 sucked to the contact member 20A at a location other than the suction area 23A and restricts the posture of the held component D2. The positions and number of the restricting portions 22A are changed according to the shape of the held component D2. For example, in the case of a component or connector that is elongated along the X-axis, two restricting portions 22A are disposed on either side of the contact member 20A.

[0031] In this manner, the first component holding member 19A, which is attached to the nozzle lifting and rotating mechanism 11B of the head unit 10 and holds the component D2 to be mounted on the substrate 3, includes the suction nozzle 17A, a contact member 20A provided at the tip of the suction nozzle 17A and in contact with the suction area 23A on the upper surface of the component D2, and a plurality of restricting portions 22A provided integrally with the suction nozzle 17A at at least two locations around the suction nozzle 17A, which contact locations on the upper surface of the component D2 other than the suction area 23A and restrict the posture of the component D2 picked up by the suction nozzle 17A. Since the restricting portions 22A restrict the posture of the picked-up component D2, the first component holding member 19A does not need to limit the moving speed of the head unit 10, and can mount a large component D2 on the substrate 3 without reducing productivity.

[0032] 4, the configurations of the suction nozzle 17B that holds the upper surface of the component D2 to be mounted on the board 3, and the first component holding support member 24B (component holding support member) that is used together with the suction nozzle 17B will be described. The suction nozzle 17B is attached to the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B in the center of the head unit 10, and the two first component holding support members 24B are respectively attached to the nozzle lifting and rotating mechanism 11A and the nozzle lifting and rotating mechanism 11C of the head unit 10 that sandwich the central nozzle lifting and rotating mechanism 11B.

[0033] Fig. 4(a) shows the suction nozzle 17B and the first component holding support member 24B mounted on the nozzle lifting and rotating mechanisms 11A to 11C as viewed from the front. Fig. 4(b) shows the suction nozzle 17B and the first component holding support member 24B mounted on the nozzle lifting and rotating mechanisms 11A to 11C as viewed from below. Fig. 4(c) shows the state as viewed below from the cross section B shown in Fig. 4(a).

[0034] The held portion 18 of the suction nozzle 17B is held by the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B. The two first component holding support members 24B have held portions 18 of the same shape as the held portion 18 of the suction nozzle 17B. The held portions 18 are held by the nozzle holders 16 of the nozzle lifting and rotating mechanism 11A and the nozzle lifting and rotating mechanism 11C, respectively, so that the two first component holding support members 24B are attached to the two nozzle lifting and rotating mechanisms 11A and 11C. The tip of the suction nozzle 17B is provided with a contact member 20B that contacts the suction area 23A on the upper surface of the component D2. The component D2 is sucked onto the contact member 20B by operating the vacuum source while the contact member 20B is in contact with the upper surface of the component D2.

[0035] A plate-shaped top plate 21B extending along the Y-axis is disposed on each of the two first component holding support members 24B. The top plate 21B is made of a hard material such as metal or acrylic. Two downwardly extending restricting portions 22B are disposed on the lower surface of each of the two top plates 21B. When the two first component holding support members 24B are attached to the nozzle lifting and rotating mechanisms 11A and 11C, a total of four restricting portions 22B are disposed near the four corners of the component D2 sucked by the contact member 20B. The height positions of the lower surfaces of the four restricting portions 22B are set to a height that contacts the upper surface of the component D2 sucked by the contact member 20B at a location other than the suction area 23A and restricts the posture of the held component D2.

[0036] When the head unit 10 equipped with the suction nozzle 17B and the two first component holding support members 24B picks up the component D2 from the tray feeder 7, the control unit controls the nozzle lifting and rotating mechanisms 11A-11C so that the lower surface of the abutting member 20B of the suction nozzle 17B and the lower surface of the regulating member 22B come into contact with the upper surface of the component D2. That is, the suction nozzle 17B and the two first component holding support members 24B are lowered. After the suction nozzle 17B picks up the component D2, the control unit controls the nozzle lifting and rotating mechanisms 11A-11C so that the suction nozzle 17B and the two first component holding support members 24B are simultaneously raised. As a result, the component D2 is held by the head unit 10 in a horizontal position.

[0037] In this way, the first component-holding support member 24B used together with the suction nozzle 17B is attached to the nozzle lifting and rotating mechanisms 11A, 11C of the head unit 10 in place of a suction nozzle different from the suction nozzle 17B that holds the upper surface of the component D2, and is provided with at least one restricting portion 22B that is positioned around the suction nozzle 17B and contacts a portion of the upper surface of the component D2 other than the suction region 23A where the suction nozzle 17B abuts against the component D2 and restricts the posture of the component D2 picked up by the suction nozzle 17B. Since the posture of the component D2 picked up by the suction nozzle 17B is restricted by the restricting portion 22B of the first component-holding support member 24B, there is no need to limit the movement speed of the head unit 10, and large components D2 can be mounted on the board 3 without reducing productivity.

[0038] Next, with reference to Fig. 5, the configurations of the suction nozzle 17C that holds the upper surface of the component D2 to be mounted on the board 3 and the second component holding support member 24C (component holding support member) that is used together with the suction nozzle 17C will be described. The suction nozzle 17C is attached to the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B in the center of the head unit 10. In the example of Fig. 5, the suction nozzle 17C is also attached to the nozzle holder 16 of the nozzle lifting and rotating mechanism 11A and the nozzle lifting and rotating mechanism 11C of the head unit 10. Note that the suction nozzle 17C of the nozzle lifting and rotating mechanism 11A and the nozzle lifting and rotating mechanism 11C are not essential for holding the component D2.

[0039] FIG. 5(a) shows the suction nozzle 17C and the second component holding support member 24C mounted on the nozzle lifting and rotating mechanisms 11A to 11C as viewed from the front. FIG. 5(b) shows the suction nozzle 17C and the second component holding support member 24C mounted on the nozzle lifting and rotating mechanisms 11A to 11C as viewed from below. FIG. 5(c) shows the state as viewed from below from the cross section C shown in FIG. 5(a). The suction nozzle 17C includes a held portion 18 held by the nozzle holder 16 and a contact member 20B that contacts the upper surface of the component. The suction nozzle 17C that contacts the suction area 23A on the upper surface of the component D2 and picks up the component D2 is mounted on the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B.

[0040] A plate-shaped member 25 extending in the horizontal direction is disposed on the lower surface of the head unit 10. The plate-shaped member 25 is made of a hard material such as metal or acrylic. Four downwardly extending restricting portions 22C are disposed on the lower surface of the plate-shaped member 25. The four restricting portions 22C are disposed near the four corners of the component D2 adsorbed to the contact member 20C. The height positions of the lower surfaces of the four restricting portions 22C are set to a height that contacts the upper surface of the component D2 adsorbed to the contact member 20C at a location other than the suction area 23A and restricts the posture of the held component D2. The plate-shaped member 25 and the plurality of restricting portions 22c constitute a second component holding support member 24C.

[0041] When the head unit 10, to which the suction nozzle 17C and the second component holding support member 24C are attached, picks up the component D2 from the tray feeder 7, the control unit controls the nozzle lifting and rotating mechanism 11B so that the lower surface of the abutting member 20C of the suction nozzle 17C and the lower surface of the regulating portion 22C abut against the upper surface of the component D2. That is, the suction nozzle 17C is lowered to abut against the abutting member 20C. After the suction nozzle 17C picks up the component D2, the control unit raises the suction nozzle 17C and controls the nozzle lifting and rotating mechanism 11B so that the suction nozzle 17C stops at a height where the upper surface of the component D2 contacts the regulating portion 22c. As a result, the component D2 is held by the head unit 10 in a horizontal position.

[0042] 5(b), the plate-like member 25 has a notch 25a formed therein so as not to interfere with the lifting and lowering operations of the nozzle lifting and rotating mechanisms 11A to 11C. This allows components to be picked up by the suction nozzles 17C attached to the nozzle lifting and rotating mechanisms 11A and 11C even when the second component holding support member 24C is attached to the lower surface of the head unit 10. For example, when mounting the component D1 shown in FIG. 2 on the substrate 3, each of the three suction nozzles 17C attached to the nozzle lifting and rotating mechanisms 11A to 11C can pick up the component D1 and mount it on the substrate 3.

[0043] In this manner, the second component-holding support member 24C used together with the suction nozzle 17C is attached to the underside of the head unit 10 (its position is fixed relative to the head unit 10), is located at at least two places around the suction nozzle 17C, and has a plurality of restricting portions 22C that contact the upper surface of the component D2 at places other than the suction area 23A where the suction nozzle 17C abuts against the component D2 and restricts the posture of the component D2 picked up by the suction nozzle 17C. Since the posture of the component D2 picked up by the suction nozzle 17C is restricted by the restricting portions 22C of the second component-holding support member 24C, there is no need to limit the movement speed of the head unit 10, and large components D2 can be mounted on the board 3 without reducing productivity.

[0044] As described above, the component mounting device 1 including the head unit 10 to which the first component holding member 19A or the suction nozzle 17B and the two first component holding support members 24B or the suction nozzle 17C and the second component holding support member 24C are attached includes abutment members 20A-20C provided at the tips of the suction nozzles 17A-17C of the head unit 10 and abutting against the suction area 23A on the upper surface of the component D2, and a plurality of regulating parts 22A-22C arranged at at least two places around the suction nozzles 17A-17C and contacting the places on the upper surface of the component D2 other than the suction area 23A to regulate the attitude of the component D2 picked up by the suction nozzles 17A-17C, and the upper surface of the component D2 is picked up by the suction nozzles 17A-17C attached to the nozzle lifting and rotating mechanism 11B and mounted on the board 3. This allows a large component D2 to be mounted on the board 3 without reducing productivity.

[0045] Next, the configuration of the second component holding member 19D (component holding member) that holds the large component D2 mounted on the substrate 3 will be described with reference to Fig. 6. The second component holding member 19D is attached to the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B in the center of the head unit 10. Fig. 6(a) shows the second component holding member 19D attached to the nozzle lifting and rotating mechanism 11B as viewed from the front. Fig. 6(b) shows the second component holding member 19D attached to the nozzle lifting and rotating mechanism 11B as viewed from below. Fig. 6(c) shows the state as viewed below from the cross section D shown in Fig. 6(a).

[0046] The second component holding member 19D includes a suction nozzle 17D, the held portion 18 of which is held by the nozzle holder 16 of the nozzle lifting and rotating mechanism 11B. A plate-shaped top plate 21D extending in the horizontal direction is disposed on the suction nozzle 17D. The top plate 21D is made of a hard material such as metal or acrylic. A contact member 20D is disposed on the lower surface of the top plate 21D, and extends downward along the outer periphery of the top plate 21D. The contact member 20D is made of a flexible material such as polyurethane rubber. The contact member 20D contacts the suction area 23B on the upper surface of the component D2.

[0047] When the contact member 20D contacts the suction area 23B on the upper surface of the component D2, a closed space S is formed between the tip of the suction nozzle 17D, the contact member 20D, and the top plate 21D and the upper surface of the component D2. When the vacuum source is operated in this state, the space S is sucked through the suction opening 17Da that opens at the lower end of the suction nozzle 17D, and the component D2 is sucked onto the lower end of the second component-holding member 19D. In other words, the posture of the component D2 held by the suction force generated by suction from the suction nozzle 17D is regulated by the contact member 20D.

[0048] In this way, the second component holding member 19D, which is attached to the nozzle lifting and rotating mechanism 11B of the head unit 10 and holds the upper surface of the component D2 to be mounted on the substrate 3, includes the suction nozzle 17D, the contact member 20D provided at the tip of the suction nozzle 17D and contacting the suction area 23B on the upper surface of the component D2, and the top plate 21D connecting the tip of the suction nozzle 17D and the contact member 20D. When the contact member 20D contacts the suction area 23B, the tip of the suction nozzle 17D, the contact member 20D, and the top plate 21D form a closed space S between the top surface of the component D2 and the contact member 20D, and the contact member 20D regulates the posture of the component D2 picked up by the suction nozzle 17D. Since the posture of the component D2 picked up by the second component holding member 19D is regulated by the contact member 20D, there is no need to limit the moving speed of the head unit 10, and a large component D2 can be mounted on the substrate 3 without reducing productivity.

[0049] 3, 4, and 6, the first component holding member 19A, the second component holding member 19D, and the first component holding support member 24B are detachable from the head unit 10. The first component holding member 19A, the second component holding member 19D, and the first component holding support member 24B can be stocked in the nozzle stocker 15. The control unit of the control device C controls the nozzle replacement means (the head moving mechanism 12, the nozzle lifting and rotating mechanisms 11A to 11C of the head unit 10) based on information stored in the storage unit, to replace the first component holding member 19A, the second component holding member 19D, and the first component holding support member 24B between the head unit 10 and the nozzle stocker 15.

[0050] In Figures 3 and 6, head unit 10 to which first component holding member 19A or second component holding member 19D is attached can correct any misalignment of held component D2 in the θ direction (around the Z axis) by operating nozzle lifting and rotation mechanism 11B to rotate suction nozzle 17A or suction nozzle 17D around the Z axis, even if first component holding member 19A or second component holding member 19D is holding component D2.

[0051] 4 and 5, on the other hand, in the head unit 10 to which the suction nozzle 17B and the two first component holding support members 24B or the suction nozzle 17C and the second component holding support member 24C are attached, the restricting portion 22B or the restricting portion 22C, which does not rotate around the Z axis together with the suction nozzle 17B or the suction nozzle 17C, is in contact with the upper surface of the component D2 while holding the component D2. Therefore, in this state, it is not possible to correct the misalignment of the held component D2 in the θ direction (around the Z axis). When a large component D2 is mounted on the board 3, if the misalignment of the held component D2 in the θ direction is large, it may interfere with surrounding components and the like and prevent the component D2 from approaching the mounting position on the board 3. In this case, it is necessary to correct the misalignment in the θ direction before the component D2 approaches the mounting position on the board 3.

[0052] Next, following the flow of Fig. 7, and with reference to Fig. 8, a component mounting method by the component mounting device 1 including the head unit 10 to which the suction nozzle 17C and the second component holding support member 24C are attached will be described. Here, an example will be described in which a component D2 supplied from a tray feeder 7 is mounted at a mounting position on the board 3. Note that the component D2 is also mounted on the board 3 by the same component mounting method in the component mounting device 1 including the head unit 10 to which the suction nozzle 17B and the two first component holding support members 24B are attached.

[0053] 7, first, the control unit of the control device C controls the head moving mechanism 12 to move the head unit 10 to above the component pick-up position of the tray feeder 7. Next, the control unit controls the nozzle lifting and rotating mechanism 11B to which the suction nozzle 17C is attached to lower the suction nozzle 17C to pick up the component D2. After that, the control unit lifts the suction nozzle 17C and stops it at a height where the upper surface of the component D2 comes into contact with the restricting portion 22c (ST1). As a result, the suction nozzle 17C and the second component holding support member 24C hold the component D2 in a state where the restricting portions 22C located at at least two places around the suction nozzle 17C are in contact with the upper surface of the component D2 other than the suction region 23A where the suction nozzle 17C comes into contact with the component D2.

[0054] Next, the control unit controls the head moving mechanism 12 to move the head unit 10 above the component recognition camera 14, and captures an image of the component D2 with the component recognition camera 14 to recognize the holding posture (ST2). If the deviation in the θ direction is outside the allowable range (No in ST3), the control unit controls the nozzle lifting and rotating mechanism 11B to lower the suction nozzle 17C (arrow a in FIG. 8(a)) and move the multiple regulating parts 22C away from the upper surface of the component D2 (ST4). That is, the multiple regulating parts 22C and the upper surface of the component D2 are moved relatively to move the multiple regulating parts 22C away from the upper surface of the component D2. Next, the control unit controls the nozzle lifting and rotating mechanism 11B to rotate the suction nozzle 17C in the θ direction (arrow b in FIG. 8(a)) to correct the deviation in the θ direction (ST5).

[0055] In FIG. 7, the control unit then controls the nozzle lifting and rotating mechanism 11B to lift the suction nozzle 17C (arrow c in FIG. 8(b)) and bring the multiple regulating parts 22C into contact with the upper surface of the component D2 (ST6). That is, the multiple regulating parts 22C and the upper surface of the component D2 are moved relatively to bring the multiple regulating parts 22C into contact with the upper surface of the component D2 again. Next, the control unit controls the head moving mechanism 12 to move the head unit 10 above the substrate 3. Next, the control unit controls the nozzle lifting and rotating mechanism 11B to lower the suction nozzle 17C and place the component D2 at the placement position on the substrate 3 (ST7). If the deviation in the θ direction is within the allowable range (Yes in ST3), the component D2 is placed at the placement position on the substrate 3 without correcting the deviation in the θ direction in (ST4) to (ST6) (ST7). [Industrial Applicability]

[0056] The component mounting device, component holding member, component holding assistance member, and component mounting method of the present invention have the effect of enabling large components to be mounted on a board without reducing productivity, and are useful in the field of mounting components on a board. [Explanation of symbols]

[0057] 1. Parts mounting equipment 3. Substrate 10 Head Unit 11, 11A to 11C Nozzle lifting and rotating mechanism (nozzle replacement means) 12 Head moving mechanism (nozzle replacement means) 15 Nozzle Stocker 17, 17A~17D Suction nozzle 19A First component holding member (component holding member) 19D Second component holding member (component holding member) 20A~20D Contact parts 21A, 21B, 21D Top plate 22A~22C Regulation Department 23A, 23B Adsorption area 24B First component holding support member (component holding support member) 24C 2nd component holding support part (component holding support part) D, D1, D2 parts S Space

Claims

1. A component mounting device that picks up a component by suction using a suction nozzle attached to a head unit and mounts the component on a substrate, a contact member provided at a tip of the suction nozzle and contacting the suction area on the upper surface; a plurality of restricting portions arranged at at least two locations around the suction nozzle, the restricting portions being in contact with a location on the upper surface other than the suction area and restricting a posture of the component picked up by the suction nozzle; A top plate extending in a horizontal direction and provided on the suction nozzle, The restricting portion extends downward from the top plate.

2. A component mounting device that picks up a component by suction using a suction nozzle attached to a head unit and mounts the component on a substrate, a contact member provided at a tip of the suction nozzle and contacting the suction area on the upper surface; a plurality of regulating portions that are arranged at at least two locations around the suction nozzle, come into contact with a location on the upper surface other than the suction area, and regulate a posture of the component picked up by the suction nozzle; The head unit can be equipped with a plurality of suction nozzles, The regulating portion is provided on the head unit in place of a suction nozzle different from the suction nozzle of the component mounting device.

3. A component mounting device that picks up a component by suction using a suction nozzle attached to a head unit and mounts the component on a substrate, a contact member provided at a tip of the suction nozzle and contacting the suction area on the upper surface; a plurality of restricting portions arranged at at least two locations around the suction nozzle, the restricting portions being in contact with a location on the upper surface other than the suction area and restricting a posture of the component picked up by the suction nozzle; a plate-shaped member extending in a horizontal direction and provided on a lower surface of the head unit; The restricting portion extends downward from a lower surface of the plate-like member.

4. The component mounting device according to claim 1 , wherein the suction nozzle is detachable from the head unit.

5. A storage unit that stores at least information regarding the part; a nozzle stocker for stocking suction nozzles; a nozzle exchange means for exchanging a suction nozzle mounted on the head unit with a suction nozzle stocked in the nozzle stocker; 5. The component mounting device according to claim 4, further comprising: a control unit that controls the nozzle exchange means based on the information stored in the memory unit.

6. A component mounting device that picks up a component by suction using a suction nozzle and mounts the component on a substrate, a contact member provided at a tip of the suction nozzle and contacting the suction area on the upper surface; a top plate that connects the tip of the suction nozzle and the contact member, the tip of the nozzle, the contact member, and the top plate form a closed space between the contact member and the upper surface when the contact member contacts the suction region, The abutment member regulates the attitude of the component picked up by the suction nozzle.

7. A component holder that is attached to a head unit of a component mounting device and holds an upper surface of a component to be mounted on a substrate, A suction nozzle; a contact member provided at a tip of the suction nozzle and contacting the suction area on the upper surface; a plurality of regulating portions provided integrally with the suction nozzle at at least two locations around the suction nozzle, the regulating portions coming into contact with locations on the upper surface other than the suction area and regulating a posture of the component picked up by the suction nozzle; A top plate extending in a horizontal direction and provided on the suction nozzle, The restricting portion is a component holding member that extends downward from the top plate.

8. A component holder that is attached to a head unit of a component mounting device and holds an upper surface of a component to be mounted on a substrate, A suction nozzle; a contact member provided at a tip of the suction nozzle and contacting the suction area on the upper surface; a top plate that connects the tip of the suction nozzle and the contact member, a tip of the suction nozzle, the contact member, and the top plate form a closed space between the contact member and the top surface when the contact member contacts the suction region; The abutment member is a component holding member that regulates the posture of the component picked up by the suction nozzle.

9. A component holding support member that is attached to a head unit of a component mounting device and is used together with a suction nozzle that holds an upper surface of a component to be mounted on a substrate, a plate-like member extending in a horizontal direction and provided on a lower surface of the head unit; a plurality of regulating portions that are located at at least two locations around the suction nozzle and come into contact with a location on the upper surface other than a suction area where the suction nozzle contacts the component, and regulate a posture of the component picked up by the suction nozzle; The restricting portion is a component holding support member that extends downward from the lower surface of the plate-like member.

10. A component holding support member that is attached to a head unit capable of mounting a plurality of suction nozzles provided in a component mounting device, and is used together with the suction nozzles that hold an upper surface of a component to be mounted on a substrate, a suction nozzle that is different from the suction nozzle that holds the upper surface of the component is attached to the head unit, a component holding support member provided with at least one regulating portion positioned around the suction nozzle and contacting a portion of the upper surface other than a suction area where the suction nozzle abuts the component, and regulating the posture of the component picked up by the suction nozzle.

11. A component mounting method for mounting a component on a substrate by a component mounting device that picks up a component by suction using a suction nozzle attached to a head unit and mounts the component on the substrate, comprising: a state in which a plurality of restricting portions located at at least two locations around the suction nozzle are in contact with a location on the upper surface other than a suction area where the suction nozzle abuts against the component, The plurality of restricting portions and the upper surface of the component are moved relatively to separate the plurality of restricting portions from the upper surface; Rotating the suction nozzle; and moving the plurality of restricting portions and the upper surface of the component relatively to bring the plurality of restricting portions into contact with the upper surface again.

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