Semiconductor Device

Abstract

To provide a technology that can suppress detachment of a sealing resin from a semiconductor element.SOLUTION: A semiconductor device comprises: a main wiring wire that is electrically connected to a semiconductor element; a reinforcement wire that is connected to the semiconductor element and is positioned at a semiconductor element side relative to the main wiring wire or at an opposite side of the semiconductor element in a cross-sectional view; and a sealing resin that covers the semiconductor element, the main wiring wire and the reinforcement wire. The reinforcement wire is connected to a plurality of parts of the semiconductor element, or both end parts of the reinforcement wire are positioned within an outline of the semiconductor element in a plan view.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device. [Background technology]

[0002] Patent Document 1 proposes a semiconductor device in which a reinforcing wire, such as a wire for preventing disconnection, is connected to the periphery of a semiconductor element. With such a semiconductor device, the reinforcing wire can suppress peeling of the sealing resin caused by repeated concentration of thermal stress. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-120679 A Summary of the Invention [Problem to be solved by the invention]

[0004] The reinforcing wire in Patent Document 1 is connected to the periphery of the semiconductor element, and therefore can suppress peeling of the sealing resin in the periphery. However, the reinforcing wire in Patent Document 1 does not act on the semiconductor element, and does not directly suppress peeling of the sealing resin from the semiconductor element. For this reason, there is a possibility that the sealing resin will peel off from the semiconductor element under actual usage conditions.

[0005] Therefore, the present disclosure has been made in consideration of the above-mentioned problems, and has an object to provide a technique capable of suppressing peeling of the sealing resin from the semiconductor element. [Means for solving the problem]

[0006] The semiconductor device according to the present disclosure includes one or more semiconductor elements, a main wiring wire electrically connected to the semiconductor elements, and a semiconductor device connected to the semiconductor elements and configured to have a cross-sectional view of the main wiring wire. and a connection portion between the semiconductor element For BeforeThe semiconductor device includes a reinforcing wire located on the opposite side to the semiconductor element, and a sealing resin that covers the semiconductor element, the main wiring wire, and the reinforcing wire, and the reinforcing wire is connected to a plurality of portions of the semiconductor element, or both ends of the reinforcing wire are located inside the outline of the semiconductor element in a plan view. The height of the reinforcing wire relative to the semiconductor element is lower than the height of the main wiring wire relative to the semiconductor element. . Furthermore, the semiconductor device according to the present disclosure comprises one or more semiconductor elements, a main wiring wire electrically connected to the semiconductor element, a reinforcing wire connected to the semiconductor element and positioned on the semiconductor element side or the opposite side to the semiconductor element with respect to the main wiring wire in a cross-sectional view, and a sealing resin covering the semiconductor element, the main wiring wire, and the reinforcing wire, wherein the reinforcing wire is connected to multiple portions of the semiconductor element, the one or more semiconductor elements are multiple semiconductor elements, and the reinforcing wire is connected to the multiple portions of the one or more semiconductor elements and is connected between the multiple semiconductor elements. In addition, the semiconductor device according to the present disclosure includes one or more semiconductor elements, a main wiring wire electrically connected to the semiconductor element, a reinforcing wire connected to the semiconductor element and positioned on the semiconductor element side or the opposite side to the semiconductor element with respect to the main wiring wire in a cross-sectional view, and a sealing resin covering the semiconductor element, the main wiring wire, and the reinforcing wire, wherein the reinforcing wire is connected to multiple portions of the semiconductor element, the semiconductor element includes multiple pattern regions, and the multiple portions are provided in two or more pattern regions of the multiple pattern regions. In addition, the semiconductor device according to the present disclosure includes one or more semiconductor elements, a main wiring wire electrically connected to the semiconductor element and electrically connected to a metal circuit pattern, a reinforcing wire connected to the semiconductor element and located on the semiconductor element side or the opposite side to the semiconductor element with respect to the main wiring wire in a cross-sectional view, and a sealing resin covering the semiconductor element, the main wiring wire, and the reinforcing wire, wherein the semiconductor element transmits and receives electrical signals to and from an external device via the main wiring wire and the metal circuit pattern, and the reinforcing wire is connected to multiple portions of the semiconductor element, or further includes a connecting reinforcing wire whose both ends are located inside the outline of the semiconductor element in a planar view and electrically connects the reinforcing wire to the metal circuit pattern. Effect of the Invention

[0007] According to the present disclosure, the reinforcing wire is connected to multiple parts of the semiconductor element, or both ends of the reinforcing wire are located inside the outer contour of the semiconductor element when viewed in a planar view, thereby preventing the sealing resin from peeling off from the semiconductor element. [Brief description of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing a configuration of a semiconductor device according to a first embodiment. [Diagram 2] FIG. 11 is a plan view showing a configuration of a semiconductor device according to a second embodiment. [Diagram 3] FIG. 11 is a three-dimensional view showing the configuration of a semiconductor device according to a second embodiment. [Figure 4] FIG. 11 is a cross-sectional view showing a configuration of a semiconductor device according to a third embodiment. [Diagram 5] FIG. 11 is a plan view showing a configuration of a semiconductor device according to a third embodiment. [Figure 6] FIG. 11 is a three-dimensional view showing the configuration of a semiconductor device according to a third embodiment. [Figure 7] FIG. 11 is a cross-sectional view showing a configuration of a semiconductor device according to a fourth embodiment. [Figure 8] FIG. 11 is a plan view showing a configuration of a semiconductor device according to a fourth embodiment. [Figure 9] FIG. 13 is a plan view showing a configuration of a semiconductor device according to a modification of the fourth embodiment. [Figure 10]FIG. 13 is a cross-sectional view showing a configuration of a semiconductor device according to a fifth embodiment. [Figure 11] FIG. 13 is a plan view showing a configuration of a semiconductor device according to a fifth embodiment. [Figure 12] FIG. 13 is a plan view showing a configuration of a semiconductor device according to a modification of the fifth embodiment. [Figure 13] FIG. 13 is a cross-sectional view showing a configuration of a semiconductor device according to a sixth embodiment. [Figure 14] FIG. 13 is a three-dimensional view showing the configuration of a semiconductor device according to a sixth embodiment. [Figure 15] FIG. 13 is a three-dimensional view showing the configuration of a semiconductor device according to a sixth embodiment. [Figure 16] FIG. 13 is a plan view showing a configuration of a semiconductor device according to a seventh embodiment. [Figure 17] FIG. 23 is a plan view showing a configuration of a semiconductor device according to a modification of the seventh embodiment. [Figure 18] FIG. 13 is a plan view showing a configuration of a semiconductor device according to an eighth embodiment. [Figure 19] FIG. 23 is a plan view showing a configuration of a semiconductor device according to a modification of the eighth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described with reference to the accompanying drawings. The features described in each of the following embodiments are merely examples, and not all features are necessarily required. In addition, in the following description, similar components in multiple embodiments are given the same or similar reference numerals, and different components are mainly described. In addition, in the following description, specific positions and directions such as "upper", "lower", "left", "right", "front" or "back" do not necessarily correspond to positions and directions in actual implementation.

[0010] <Embodiment 1> Fig. 1 is a cross-sectional view showing the configuration of a semiconductor device according to the first embodiment. The semiconductor device in Fig. 1 is, for example, a power semiconductor device. The semiconductor device in Fig. 1 includes an element mounting portion 1, a bonding member 2, a semiconductor element 3, a main wiring wire 4, a reinforcing wire 5, a sealing resin 6, and a case and an external connection terminal (not shown). In the following description, when there is no need to distinguish between the main wiring wire 4 and the reinforcing wire 5, they may be referred to simply as wires.

[0011] The element mounting portion 1 includes an insulating layer 1b, a back metal plate 1a provided on the lower surface of the insulating layer 1b, and a metal circuit pattern 1c provided on the upper surface of the insulating layer 1b. The element mounting portion 1 may be, for example, an IMB (Insulated Metal Baseplate) using a DBC (Direct Bonded Cupper) substrate or a resin substrate as the insulating layer 1b. The semiconductor device according to the first embodiment may have a transfer mold structure using a lead frame for the metal circuit pattern 1c, or may have a full transfer mold structure in which the insulating layer 1b and the back metal plate 1a are omitted.

[0012] The bonding member 2 electrically and mechanically connects the semiconductor element 3 to the metal circuit pattern 1c by bonding the semiconductor element 3 to the metal circuit pattern 1c of the element mounting portion 1. The material of the bonding member 2 is, for example, solder, a sintered material, or a conductive adhesive.

[0013] The semiconductor element 3 includes a surface electrode 3a provided on an upper surface. The semiconductor element 3 is, for example, an IGBT (Insulated Gate Bipolar Transistor), an RC-IGBT (Reverse Conducting - IGBT), a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), a PND (PN junction diode), an SBD (Schottky Barrier Diode), or an FWD (Free Wheeling Diode), and transmits and receives electrical signals to and from an external device via the main wiring wire 4, the metal circuit pattern 1c, and an external connection terminal (not shown), etc.

[0014] The material of the semiconductor element 3 may be ordinary silicon (Si) or a wide band gap semiconductor such as silicon carbide (SiC), gallium nitride (GaN), diamond, etc. When the material of the semiconductor element 3 is a wide band gap semiconductor, stable operation under high temperature and high voltage and high switching speed are possible. The number of semiconductor elements 3 may be one or more.

[0015] One or more main wiring wires 4 are electrically connected to the surface electrodes 3a of the semiconductor element 3, and are also electrically connected to external connection terminals or metal circuit patterns 1c.

[0016] The reinforcing wire 5 is connected to the semiconductor element 3. The reinforcing wire 5 may be electrically and mechanically connected to the semiconductor element 3, or may be mechanically connected to the semiconductor element 3 without being electrically connected to the semiconductor element 3.

[0017] In the first embodiment, the reinforcing wire 5 is located on the semiconductor element 3 side with respect to the main wiring wire 4 in a cross-sectional view, i.e., below the loop of the main wiring wire 4. As will be described in another embodiment, the reinforcing wire 5 may be located on the opposite side of the main wiring wire 4 to the semiconductor element 3 in a cross-sectional view, i.e., above the loop of the main wiring wire 4.

[0018] In the first embodiment, the reinforcing wire 5 is connected to multiple portions of the semiconductor element 3, and both ends of the reinforcing wire 5 are located inside the outline of the semiconductor element 3 in a planar view. Note that the reinforcing wire 5 may be connected to multiple portions of the semiconductor element 3, and both ends of the reinforcing wire 5 may not be located inside the outline of the semiconductor element 3 in a planar view. Alternatively, the reinforcing wire 5 may not be connected to multiple portions of the semiconductor element 3, and both ends of the reinforcing wire 5 may be located inside the outline of the semiconductor element 3 in a planar view. These configurations will be described in other embodiments.

[0019] In this embodiment 1, the reinforcing wire 5 is provided over substantially the entire surface of the semiconductor element 3, but as described in another embodiment, it may be provided only around the connection between the semiconductor element 3 and the main wiring wire 4.

[0020] The case (not shown) is connected to the element mounting portion 1 and encloses the bonding member 2, the semiconductor element 3, the main wiring wire 4, and the reinforcing wire 5 as well as the space surrounding them. One end of the external connection terminal is provided in the space of the case, and the other end of the external connection terminal is provided outside the case.

[0021] The sealing resin 6 is filled into the space of the case, and covers the joining members 2, the semiconductor element 3, the main wiring wires 4, and the reinforcing wires 5, thereby covering and protecting them.

[0022] <Summary of the first embodiment> In the first embodiment, not only the main wiring wires 4 but also the reinforcing wires 5 are connected onto the semiconductor element 3, so that the number of wire connections per unit area on the upper surface of the semiconductor element 3 increases. This enhances the anchoring effect of the wires on the sealing resin 6, so that the effect of suppressing peeling of the sealing resin 6 from the semiconductor element 3, that is, the peeling suppression effect, can be enhanced.

[0023] In addition, the ratio of resin in the sealing resin 6 per unit volume of the portion above the semiconductor element 3 decreases and the ratio of metal in the wire increases, so that the linear expansion coefficient of the portion can be made closer to that of the surface electrode 3a of the semiconductor element 3. As a result, peeling caused by thermal stress due to a mismatch between the linear expansion coefficient of the resin and the linear expansion coefficient of the surface electrode 3a can be suppressed. If the material of the reinforcing wire 5 and the material of the surface electrode 3a are the same, this effect can be expected to be improved. In addition, since the heat capacity of the portion above the semiconductor element 3 can be increased by the reinforcing wire 5, the junction temperature Tj during current flow can be lowered, and uniform temperature distribution can be expected.

[0024] In the first embodiment, the reinforcing wire 5 is located on the semiconductor element 3 side in cross-sectional view with respect to the main wiring wire 4. With such a configuration, it is possible to suppress a change in the position of the connection part of the main wiring wire 4 due to the provision of the reinforcing wire 5, and therefore it is possible to easily change the design of an existing product.

[0025] <Embodiment 2> Fig. 2 is a plan view showing the configuration of a semiconductor device according to the second embodiment, and Fig. 3 is a three-dimensional view showing the configuration. In the second embodiment, the semiconductor element 3 includes an ineffective area 10 and an effective area 11 provided on the upper surface. The ineffective area 10 surrounds the effective area 11. The effective area 11 corresponds to the area in which the surface electrode 3a in Fig. 1 is provided, and multiple parts of the effective area 11 are connected to the main wiring wire 4 and the reinforcing wire 5. In the second embodiment, the reinforcing wire 5 is parallel to the main wiring wire 4 in a plan view as shown in Fig. 2.

[0026] In Fig. 2, the reinforcing wire 5 is offset from the main wiring wire 4 in plan view, but the reinforcing wire 5 may overlap the main wiring wire 4 in plan view. In plan views such as Fig. 2, the connection parts at which the semiconductor element 3 is bonded to the main wiring wire 4 and the reinforcing wire 5 are shown as being circular, but the shape of the connection parts is not limited to being circular. In plan views such as Fig. 2, the main wiring wire 4 and the reinforcing wire 5 are separated by the connection parts with the semiconductor element 3 for convenience, but they do not have to be separated.

[0027] <Summary of the second embodiment> In the second embodiment, since the reinforcing wires 5 are parallel to the main wiring wires 4 in a plan view, when the sealing resin 6 is injected in the manufacturing process of the semiconductor device, the sealing resin 6 is likely to flow along the arrangement of the wires, as shown in Fig. 3. This suppresses air voids that are generated when the sealing resin 6 entrains air while flowing, and improves the filling property of the sealing resin 6, thereby improving the insulation properties of the semiconductor device.

[0028] <Embodiment 3> Fig. 4 is a cross-sectional view showing the configuration of a semiconductor device according to the third embodiment, and Figs. 5 and 6 are plan and three-dimensional views showing the configuration, respectively. For convenience, in plan views such as Fig. 5, a white line is drawn around the outline of the wire located at the front side at the point where the wires cross. The configuration of the third embodiment differs from that of the second embodiment in that the reinforcing wire 5 crosses the main wiring wire 4 in plan view. Note that in Fig. 5, the main wiring wire 4 and the reinforcing wire 5 are perpendicular to each other, but they do not necessarily have to be perpendicular to each other.

[0029] <Summary of the Third Embodiment> The anchor effect of the sealing resin 6 by the wires occurs in the upward direction and in the extending direction of the wires. Therefore, when the wires are crossed, the anchor effect occurs in the upward direction of the main wiring wires 4 and the reinforcing wires 5 and in two different extending directions of the main wiring wires 4 and the reinforcing wires 5. According to the third embodiment, the anchor effect occurs in more directions than in the second embodiment, so that a further improvement in the peel-suppressing effect can be expected.

[0030] <Fourth embodiment> Fig. 7 is a cross-sectional view showing the configuration of a semiconductor device according to the fourth embodiment, and Fig. 8 is a plan view showing the configuration. In the first to third embodiments, the reinforcing wire 5 is located on the semiconductor element 3 side with respect to the main wiring wire 4 in a cross-sectional view. In contrast, in the fourth embodiment, the reinforcing wire 5 is located on the opposite side of the main wiring wire 4 from the semiconductor element 3, that is, above the loop of the main wiring wire 4 in a cross-sectional view. In Figs. 7 and 8, the reinforcing wire 5 is located above the main wiring wire 4 on the semiconductor element 3 and intersects with the main wiring wire 4. Although Figs. 7 and 8 show the fourth embodiment applied to the third embodiment, it may also be applied to the second embodiment.

[0031] 8 shows a structure in which the main wiring wire 4 is connected to the metal circuit pattern 1c of the element mounting portion 1. The semiconductor element 3 transmits and receives electrical signals to and from an external device via the main wiring wire 4, the metal circuit pattern 1c, an external output terminal, etc.

[0032] <Summary of the fourth embodiment> In the fourth embodiment, the reinforcing wire 5 is located on the opposite side to the semiconductor element 3 with respect to the main wiring wire 4 in a cross-sectional view. With this configuration, the connection area of ​​the reinforcing wire 5 can be expanded, and therefore the number of reinforcing wires 5 that can be connected to the semiconductor element 3 can be increased. For example, when connecting a reinforcing wire 5 having a length of 200 μm to a semiconductor element 3 of 5 mm×5 mm, the number of reinforcing wires 5 that can be connected is about four in the third embodiment, but in the fourth embodiment, the number of reinforcing wires 5 that can be connected can be increased to about eight. As a result, the anchor effect of the wire on the sealing resin 6 is improved, and a further improvement in the peel-suppression effect can be expected.

[0033] <Modification> 9 is a plan view showing the configuration of a semiconductor device according to this modification of the fourth embodiment. The semiconductor device according to this modification further includes a connecting reinforcing wire 7 that electrically connects the reinforcing wire 5 and the metal circuit pattern 1c. With this configuration, the reinforcing wire 5 can transmit and receive electrical signals, so that the current density deficiency caused when the number of main wiring wires 4 is reduced can be compensated for.

[0034] <Embodiment 5> Fig. 10 is a cross-sectional view showing the configuration of a semiconductor device according to the fifth embodiment, and Fig. 11 is a plan view showing the configuration. In the fifth embodiment, in a cross-sectional view, the reinforcing wire 5 is located on the opposite side to the semiconductor element 3 with respect to a connection portion 4a between the main wiring wire 4 and the semiconductor element 3. In other words, the reinforcing wire 5 is located on the connection portion 4a of the main wiring wire 4.

[0035] The height of the reinforcing wire 5 relative to the semiconductor element 3 is lower than the height of the main wiring wire 4 relative to the semiconductor element 3. In the example of Fig. 10, the height of the top of the loop of the reinforcing wire 5 is lower than the height of the top of the loop of the main wiring wire 4.

[0036] <Summary of the fifth embodiment> According to the configuration of the fifth embodiment, the reinforcing wires 5 are located close to the connection portions 4a of the main wiring wires 4, so that the anchor effect can be enhanced around the connection portions 4a of the main wiring wires 4, and peeling of the sealing resin 6 from the connection portions 4a can be suppressed in a concentrated manner. As a result, the number of reinforcing wires 5 can be reduced, so that the cycle time of the semiconductor device can be shortened and the productivity can be increased.

[0037] <Modification> 12 is a plan view showing a configuration of a semiconductor device according to this modification of embodiment 5. In this modification, reinforcing wire 5 is connected to multiple portions of semiconductor element 3. The multiple portions include first portion 3b, second portion 3c, and third portion 3d.

[0038] The first portion 3b is an end portion of the semiconductor element 3. The second portion 3c is an end portion of the semiconductor element 3 on the opposite side to the first portion 3b. The first portion 3b and the second portion 3c may be connected to the metal circuit pattern 1c by a reinforcing connecting wire 7. The third portion 3d is a portion between the first portion 3b and the second portion 3c.

[0039] According to this configuration, the reinforcing wire 5 is connected not only to the first portion 3b and the second portion 3c which are the ends of the semiconductor element 3, but also to the third portion 3d which is the center, thereby increasing the rigidity of the reinforcing wire 5. This makes it possible to suppress deformation of the reinforcing wire 5 due to repeated thermal stress, thereby obtaining a stronger anchor effect and further enhancing the peeling suppression effect.

[0040] In the fifth embodiment and its modified examples, the reinforcing wire 5 is electrically connected to the semiconductor element 3, but it does not have to be electrically connected.

[0041] <Sixth embodiment> Fig. 13 is a cross-sectional view showing the configuration of a semiconductor device according to the present embodiment 6. Fig. 14 is a three-dimensional view showing the configuration of the semiconductor element 3 on the left side of Fig. 13, and Fig. 15 is a three-dimensional view showing the configuration of the semiconductor element 3 on the right side of Fig. 13.

[0042] 13, the reinforcing wire 5 is located below the loop of the main wiring wire 4, and both ends of the reinforcing wire 5 are located inside the outline of the semiconductor element 3 in a plan view. Each reinforcing wire 5 is provided for each connection with the semiconductor element 3. In other words, the material wire is cut off each time it is connected to the semiconductor element 3, thereby forming the reinforcing wire 5. Such a reinforcing wire 5 has substantially the same function as a bump.

[0043] The angle between the main wiring wire 4 and the reinforcing wire 5 in plan view is approximately 0 degrees in Fig. 14 and approximately 90 degrees in Fig. 15, but is not limited to these. When a thin wire with a diameter of 50 µm or less is used for the reinforcing wire 5, the bump formed from the reinforcing wire 5 is preferably in a ball bond shape.

[0044] <Summary of the sixth embodiment> In the sixth embodiment, the reinforcing wire 5 is provided at each connection portion with the semiconductor element 3 to form a bump. With this configuration, the number of connection points of the reinforcing wire 5 that can be connected to the semiconductor element 3 can be increased. For example, when a reinforcing wire 5 with a diameter of 200 μm is connected to a semiconductor element 3 of 10 mm×10 mm at a pitch of 3 mm without being cut off, the number of connection points of the reinforcing wire 5 that can be connected is four. In contrast, in the sixth embodiment, a bump made of the reinforcing wire 5 can be connected to a semiconductor element 3 of the same size at a pitch of 2 mm or less, so that the number of connection points of the reinforcing wire 5 that can be connected can be increased to five or more. As a result, the anchor effect of the sealing resin 6 by the wire is improved, and further improvement in the peeling suppression effect can be expected.

[0045] Generally, the longer the wire loop, the more it is affected by the expansion and contraction of the sealing resin 6 due to repeated thermal stress. However, in the sixth embodiment, the reinforcing wire 5 is a bump without a loop, and this effect can be reduced, so that the stress generated at the connection between the reinforcing wire 5 and the semiconductor element 3 can be alleviated. Therefore, the connection strength of the reinforcing wire 5 itself can be expected to be improved. Note that, although the reinforcing wire 5 is located below the main wiring wire 4 in the example of FIG. 13, a configuration in which a part of the reinforcing wire 5 is located above the main wiring wire 4 is also possible.

[0046] <Embodiment 7> FIG. 16 is a plan view showing the configuration of a semiconductor device according to the seventh embodiment. As shown in FIG. 16, in the seventh embodiment, the reinforcing wire 5 is not a linear wire but a plate-shaped ribbon wire. The reinforcing wire 5, which is a ribbon wire, is located below the loop of the main wiring wire 4. In FIG. 16, all of the reinforcing wires 5 are ribbon wires, but some of the reinforcing wires 5 may be linear wires and the remaining reinforcing wires 5 may be ribbon wires. In FIG. 16, the connection between the semiconductor element 3 and the reinforcing wire 5 is shown as a rectangle, but the shape of the connection is not limited to a circle. In FIG. 16, the reinforcing wire 5 is located below the loop of the main wiring wire 4, but it may be located above the loop of the main wiring wire 4.

[0047] <Summary of the seventh embodiment> In the seventh embodiment, since the reinforcing wire 5 is a ribbon wire, the area covering the top surface of the semiconductor element 3 can be increased compared to a linear wire, and the gaps between the reinforcing wires 5 can be narrowed. This not only provides a stronger anchor effect and further enhances the peeling suppression effect, but also improves the temperature uniformity in the portion above the semiconductor element 3.

[0048] <Modification> Fig. 17 is a plan view showing the configuration of a semiconductor device according to this modified example of the seventh embodiment. As shown in Fig. 17, not only the reinforcing wire 5 but also the main wiring wire 4 may be a ribbon wire. By using a ribbon wire for both the main wiring wire 4 and the reinforcing wire 5, the main wiring wire 4 and the reinforcing wire 5 can be formed by the same wire bonding apparatus, so that the cost of the introduction apparatus can be reduced or the productivity can be improved.

[0049] <Embodiment 8> Fig. 18 is a plan view showing a configuration of a semiconductor device according to the eighth embodiment. The semiconductor device according to the eighth embodiment includes semiconductor elements 31 and 32 as a plurality of semiconductor elements 3 performing the same switching operation. Note that in Fig. 18, the number of the plurality of semiconductor elements performing the same switching operation is two, but it may be three or more. In Fig. 18, each of the semiconductor elements 31 and 32 includes five effective areas 11a-11e which are a plurality of pattern areas provided on the upper surface. Note that the number of effective areas 11a-11e may be more than one and is not limited to five.

[0050] A connecting wire 5a, which is a part of the reinforcing wire 5, is connected between the semiconductor elements 31, 32. The remaining portion of the reinforcing wire 5 is connected to multiple portions of one or more of the semiconductor elements 31, 32, similar to the first embodiment etc. In Fig. 18, the remaining portion of each reinforcing wire 5 is electrically connected to either the semiconductor element 31, 32, and is electrically connected to each of the five effective areas 11a to 11e.

[0051] <Summary of the eighth embodiment> In the prior art, because a portion of the main wiring wire 4 is used as a connecting wire connecting multiple semiconductor elements, the design freedom of the main wiring wire 4 is low, and the number of connecting wires is about one or two. However, in the eighth embodiment, because a portion of the reinforcing wire 5 is the connecting wire 5a, the number of connecting wires can be increased. This makes it possible to improve electrical signal delay between the semiconductor elements 31, 32, to equalize the potential distribution, and to enhance the effect of suppressing signal oscillation.

[0052] Furthermore, in embodiments 1 to 7, the anchor effect of the sealing resin 6 by the wire is obtained only on the semiconductor element 3, but in this embodiment 8, it can also be obtained between multiple semiconductor elements 3, thereby further enhancing the peel-off suppression effect.

[0053] Generally, providing a reinforcing wire 5 on the metal circuit pattern 1c provides an anchor effect, but providing the metal circuit pattern 1c between multiple semiconductor elements 3 results in a relatively large distance between the multiple semiconductor elements 3, which increases the size of the semiconductor device. In contrast, in the eighth embodiment, the reinforcing wire 5 is not provided on the metal circuit pattern 1c but is provided between the multiple semiconductor elements, which makes it possible to reduce the distance between the multiple semiconductor elements 3 and reduce the size of the semiconductor device.

[0054] Furthermore, in the eighth embodiment, the multiple portions of the semiconductor element 3 to which the reinforcing wires 5 are connected are provided in each of the effective areas 11a to 11e. With this configuration, it is possible to improve the electrical signal delay between the effective areas 11a to 11e, to equalize the potential distribution, and to enhance the effect of suppressing signal oscillation.

[0055] <Modification> Fig. 19 is a plan view showing a configuration of a semiconductor device according to this modified example of the eighth embodiment. As shown in Fig. 19, the multiple portions of the semiconductor element 3 to which the reinforcing wires 5 are connected need not be provided in each of the effective regions 11a to 11e, but may be provided in two or more of the effective regions 11a to 11e. In Fig. 19, one reinforcing wire 5 is electrically connected to the effective regions 11a, 11c, and 11e, and another reinforcing wire 5 is electrically connected to the effective regions 11b and 11d. With this configuration, the pitch of the connection between the reinforcing wires 5 and the effective regions 11a to 11e can be increased, so that even if the size of the semiconductor element 3 is reduced, the connection between the reinforcing wires 5 and the effective regions 11a to 11e can be facilitated.

[0056] It should be noted that the embodiments and modifications may be freely combined, and the embodiments and modifications may be modified or omitted as appropriate. [Explanation of symbols]

[0057] 3, 31, 32 semiconductor element, 3b first portion, 3c second portion, 3d third portion, 4 main wiring wire, 4a connection portion, 5 reinforcing wire, 6 sealing resin, 11a to 11d effective area.

Claims

1. one or more semiconductor devices; a main wiring wire electrically connected to the semiconductor element; a reinforcing wire connected to the semiconductor element and located on the opposite side to the semiconductor element with respect to a connection portion between the main wiring wire and the semiconductor element in a cross-sectional view; a sealing resin that covers the semiconductor element, the main wiring wire, and the reinforcing wire; Equipped with The reinforcing wire is connected to a plurality of portions of the semiconductor element, or both ends of the reinforcing wire are located inside the outline of the semiconductor element in a plan view, A semiconductor device, wherein a height of the reinforcing wire relative to the semiconductor element is lower than a height of the main wiring wire relative to the semiconductor element.

2. One or more semiconductor elements; a main wiring wire electrically connected to the semiconductor element; a reinforcing wire connected to the semiconductor element and positioned on the semiconductor element side or on the opposite side to the semiconductor element with respect to the main wiring wire in a cross-sectional view; a sealing resin that covers the semiconductor element, the main wiring wire, and the reinforcing wire; Equipped with the stiffening wire is connected to portions of the semiconductor device; the one or more semiconductor devices are a plurality of semiconductor devices; A semiconductor device, wherein the reinforcing wire is connected to the portions of one or more of the semiconductor elements and is connected between the semiconductor elements.

3. One or more semiconductor elements; a main wiring wire electrically connected to the semiconductor element; a reinforcing wire connected to the semiconductor element and positioned on the semiconductor element side or on the opposite side to the semiconductor element with respect to the main wiring wire in a cross-sectional view; a sealing resin that covers the semiconductor element, the main wiring wire, and the reinforcing wire; Equipped with the stiffening wire is connected to portions of the semiconductor device; the semiconductor device includes a plurality of pattern regions; The semiconductor device, wherein the plurality of portions are provided in two or more pattern regions among the plurality of pattern regions.

4. One or more semiconductor elements; a main wiring wire electrically connected to the semiconductor element and electrically connected to a metal circuit pattern; a reinforcing wire connected to the semiconductor element and positioned on the semiconductor element side or on the opposite side to the semiconductor element with respect to the main wiring wire in a cross-sectional view; a sealing resin that covers the semiconductor element, the main wiring wire, and the reinforcing wire; Equipped with the semiconductor element transmits and receives electrical signals to and from an external device via the main wiring wire and the metal circuit pattern; The reinforcing wire is connected to a plurality of portions of the semiconductor element, or both ends of the reinforcing wire are located inside the outline of the semiconductor element in a plan view, The semiconductor device further comprises a connecting reinforcement wire that electrically connects the reinforcement wire and the metal circuit pattern.

5. 5. The semiconductor device according to claim 1, The semiconductor device, wherein the reinforcing wire is parallel to the main wiring wire in a plan view.

6. 5. The semiconductor device according to claim 1, The semiconductor device, wherein the reinforcing wire intersects with the main wiring wire in a plan view.

7. 7. The semiconductor device according to claim 2, A semiconductor device, wherein the reinforcing wire is located on the semiconductor element side relative to the main wiring wire in a cross-sectional view.

8. 7. The semiconductor device according to claim 2, A semiconductor device, wherein the reinforcing wire is located on an opposite side to the semiconductor element with respect to the main wiring wire in a cross-sectional view.

9. 9. The semiconductor device according to claim 1, the stiffening wire is connected to the portions of the semiconductor device; The multiple portions include a first portion which is an end of the semiconductor element, a second portion which is an end opposite to the first portion, and a third portion which is a portion between the first portion and the second portion.

10. 5. The semiconductor device according to claim 1, the two ends of the reinforcing wire are located inside the outline of the semiconductor element in a plan view, The reinforcing wire is provided for each connection portion with the semiconductor element.

11. The semiconductor device according to any one of claims 1 to 10, The semiconductor device, wherein the reinforcing wire comprises a ribbon wire.

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