Tape peeling device

Abstract

To provide a tape peeling device capable of peeling off a transfer source adhesive tape without using a peeling tape. [Solution] The tape peeling device 1 is a tape peeling device that peels off the first adhesive tape from the workpiece and the first ring frame after the second adhesive tape has been affixed to the workpiece during a transfer process in which a flat workpiece mounted on a first ring frame via a first adhesive tape is mounted on a second ring frame via a second adhesive tape, and is equipped with an insertion device 30 that inserts an insertion member 31 between the first ring frame and the first adhesive tape to peel off a portion of the first adhesive tape from the first ring frame, a clamping device 40 that is movable along the surface of the workpiece while clamping the peeled portion of the first adhesive tape, and a pressing device 50 that is movable along the surface of the workpiece while pressing the first adhesive tape.

Description

[Technical field]

[0001] The present invention relates to a tape peeling device. [Background technology]

[0002] 2. Description of the Related Art In the manufacturing process of semiconductor devices, a semiconductor wafer mounted on a ring frame via an adhesive tape is sometimes mounted on another ring frame via another adhesive tape, a process known as transfer.

[0003] For example, this includes cases where the front and back of the chip are inverted after dicing the semiconductor wafer, cases where the pattern-formed surface is attached to a dicing tape and mounted, and the front and back of the chip are inverted during die bonding, etc. Therefore, in the transfer process, the semiconductor wafer is mounted on the destination ring frame, and then the original adhesive tape is peeled off from the semiconductor wafer.

[0004] In another embodiment, the transfer is performed via a ring frame. In this case, the semiconductor wafer is mounted on the ring frame via the original adhesive tape, and the destination adhesive tape is attached to the surface of the semiconductor wafer where the original adhesive tape is not attached, and then the original adhesive tape is peeled off from the semiconductor wafer.

[0005] When peeling off the original adhesive tape, a peeling tape is mainly used to peel off the original tape from the semiconductor wafer and the original ring frame (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2013-219087 A Summary of the Invention [Problem to be solved by the invention]

[0007] After use, the peeling tape is discarded together with the original adhesive tape, which is one of the factors that increases the manufacturing cost of semiconductor devices and also leads to an increase in waste.

[0008] The present invention has been made in consideration of the above-mentioned problems, and an object of the present invention is to provide a tape peeling device capable of peeling off a transfer source adhesive tape without using a peeling tape. [Means for solving the problem]

[0009] A tape separation device according to a first aspect of the present invention comprises: A tape peeling device for peeling off the first adhesive tape from a workpiece and the first ring frame after the second adhesive tape is attached to the workpiece during a transfer step of mounting a flat workpiece mounted on a first ring frame via a first adhesive tape to a second ring frame via a second adhesive tape, the tape peeling device comprising: a mounting stage on which the work is mounted, the work having the first adhesive tape and the second adhesive tape attached to both sides thereof and fixed to the first ring frame and the second ring frame; an inserting device that inserts an inserting member between the first ring frame and the first adhesive tape to peel off a portion of the first adhesive tape from the first ring frame; a clamping device that is movable along a surface of the workpiece while clamping the peeled portion of the first adhesive tape; a pressing device that is movable along a surface of the workpiece while pressing the first adhesive tape; With the mounting stage fixed, The first adhesive tape is folded back at an acute angle by the pressing device as the clamp device moves, and is peeled off from the workpiece and the first ring frame. R, The pressing device is driven by a force applied to the first adhesive tape as the clamp device moves. It is characterized by:

[0010] A tape peeling device according to a second aspect of the present invention comprises: A tape peeling device for peeling off the first adhesive tape from a workpiece and the ring frame after the second adhesive tape is attached to the workpiece and the ring frame during a transfer step of mounting a flat workpiece mounted on a ring frame via a first adhesive tape to the ring frame via a second adhesive tape, the tape peeling device comprising: a mounting stage on which the workpiece is mounted, the workpiece being fixed to the ring frame with the first adhesive tape and the second adhesive tape attached to both sides thereof; an inserting device for inserting an insert member between the ring frame and the first adhesive tape to peel off a portion of the first adhesive tape from the ring frame; a clamping device that is movable along a surface of the workpiece while clamping the peeled portion of the first adhesive tape; a pressing device that is movable along a surface of the workpiece while pressing the first adhesive tape; With the mounting stage fixed, The first adhesive tape is folded back at an acute angle by the pressing device as the clamp device moves, and is peeled off from the workpiece and the ring frame. R, The pressing device is driven by a force applied to the first adhesive tape as the clamp device moves. It is characterized by: Effect of the Invention

[0012] According to the present invention, it is possible to provide a tape peeling device capable of peeling off a transfer source adhesive tape without using a peeling tape. [Brief description of the drawings]

[0013] [Figure 1] 1A and 1B are perspective views illustrating an object to be processed that is an object of the tape peeling device. [Diagram 2] FIG. 2 is a plan view showing a schematic configuration of a tape peeling device. [Diagram 3] FIG. 1 is a front view showing a schematic configuration of a tape peeling device. [Figure 4] FIG. 2 is a side view showing a schematic configuration of the tape separation device. [Diagram 5] 3 is a cross-sectional view taken along the line AA' of FIG. [Figure 6]1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 7] 1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 8] 1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 9] 1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 10] 1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 11] 1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 12] 1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 13] 1A to 1C are diagrams illustrating the operation of the tape peeling device. [Figure 14] 14A and 14B are perspective views for explaining another object to be processed by the tape peeling device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The tape peeling device according to the present embodiment will be described with reference to the drawings. The tape peeling device is used in a transfer process in which a flat work such as a semiconductor wafer or chip mounted on a transfer source ring frame via a transfer source adhesive tape is mounted on a transfer destination ring frame via a transfer destination adhesive tape. Specifically, the tape peeling device is used to peel the transfer source adhesive tape TA1 from the work W and the transfer source ring frame RF1 as shown in FIG. 1(B) from a state in which the transfer destination adhesive tape TA2 is attached to the work W as shown in FIG. 1(A).

[0015] In this specification, the state shown in Figure 1 (A), i.e., the state in which the source adhesive tape TA1 and the destination adhesive tape TA2 are adhered to both sides of the workpiece W and fixed to the source ring frame RF1 and the destination ring frame RF2, respectively, is referred to as the object to be processed Op.

[0016] As shown in FIGS. 2 to 5, the tape peeling device 1 includes a base 10, a mounting stage 20, an insertion device 30, a clamping device 40, a pressing device 50, and a control device (not shown).

[0017] The base 10 is a foundation on which the mounting stage 20, the insertion device 30, the clamp device 40, the pressing device 50, etc. are disposed.

[0018] The mounting stage 20 is a platform on which the object Op is placed. A frame 21 corresponding to the shape of the object Op, specifically, the shapes of the source ring frame RF1 and the destination ring frame RF2, is erected on the mounting stage 20. The mounting stage 20 is also formed with an intake hole 22, which is connected to a decompression device (not shown) such as a pump. The reduced pressure via the intake hole 22 and the frame 21 can suppress misalignment of the object Op placed on the mounting stage 20 during the peeling operation of the source adhesive tape TA1. Note that in addition to the frame 21 and the intake hole 22, any configuration may be used as long as it can suppress misalignment of the object Op.

[0019] The insertion device 30 includes an insertion member 31. The insertion device 30 can be moved in the X-direction and the Z-direction by a driving source such as a motor (not shown). The insertion member 31 is a thin, flat member extending in the X-direction. The tip of the insertion member 31 is curved in a convex shape. The insertion member 31 is also installed so that the tip extends slightly downward. The insertion device 30 moves to insert the insertion member 31 between the transfer source ring frame RF1 and the transfer source adhesive tape TA1, and peels off a part of the transfer source adhesive tape TA1 adhered to the transfer source ring frame RF1. The insertion member 31 is made of a material having a strength such as a metal such as aluminum or a hard resin that does not distort when the transfer source adhesive tape TA1 is partially peeled off.

[0020] The clamp device 40 clamps the peeled portion of the transfer source adhesive tape TA1 peeled off by the insertion device 30. The clamp device 40 includes a slider 41, a lifting device 42, a clamp fixing portion 43, and a clamp rotating portion 44.

[0021] The sliders 41 are disposed on both sides of the base 10 and include a movement mechanism for moving the clamp device 40 in the X direction. The clamp device 40 straddles the mounting stage 20, is supported by being hung between both sliders 40, and is configured to be movable in the X direction by the sliders 41. The slider 41 may have any configuration as long as it can move the clamp device 40 in the X direction, and examples of the configuration include a configuration including a drive source such as an air cylinder, a hydraulic cylinder, or a motor, and a transmission member such as a gear.

[0022] The lifting device 42 is installed in the center of the U-shaped clamp device 40 so as to extend toward the mounting stage. The clamp fixing part 43 is connected to the clamp device 40 via the lifting device 42. The lifting device 42 may have any configuration as long as it can raise and lower the clamp fixing part 43, and examples of the configuration include an air cylinder, a hydraulic cylinder, or a configuration including a drive source such as a motor and a transmission member such as a gear.

[0023] The clamp rotation part 44 is rotatably disposed on the clamp fixing part 43. The clamp rotation part 44 rotates around an axis in the Y direction. By rotating the clamp rotation part 44, the source adhesive tape TA1 can be clamped and released between the clamp fixing part 43 and the clamp rotation part 44. The centers of the clamp fixing part 43 and the clamp rotation part 44 are cut out to prevent interference with the insertion member 31.

[0024] The pressing device 50 moves while pressing the object Op from above during the peeling operation of the original adhesive tape TA1, realizing smooth and clean peeling of the original adhesive tape TA1. The pressing device 50 is supported so as to be hung across sliders 52 installed on both sides of the base 10. The sliders 52 are provided with a mechanism that allows them to move in the X-axis direction, and the pressing device 50 can be moved in the X-direction by the sliders 52.

[0025] A pressing member 51 is rotatably installed in the pressing device 50. The pressing member 51 rotates about an axis in the Y direction. By rotating the pressing member 51, it is possible to abut against the object to be treated Op and press or release the object to be treated Op from above.

[0026] The movement mechanism of the slider 52 is configured so that when the original adhesive tape TA1 is being peeled off, the clamp device 40 moves in response to the force pulling the original adhesive tape TA1. An example of such a movement mechanism is an air cylinder. When the original adhesive tape TA1 is being peeled off, the air inside the air cylinder is released, so that the pressing device 50 moves in response to the external force. However, the mechanism is not limited to an air cylinder as long as it achieves the same purpose.

[0027] The control device controls the operations of the insertion device 30, the clamping device 40, and the pressing device 50.

[0028] Next, the operation of the tape peeling device 1 will be described with reference to Figs. 6 to 13. In Figs. 6 to 13, the configuration is shown in a simplified manner for ease of explanation. First, as shown in Fig. 6, the object to be processed Op is placed on the mounting stage 20. After the object to be processed Op is placed on the mounting stage 20, air is sucked in through the air intake hole 22, and the object to be processed Op adheres closely to the mounting stage 20, suppressing any subsequent positional deviation.

[0029] 7, the pressing device 50 moves toward the insertion device 30. Then, the pressing member 51 rotates counterclockwise on the paper surface to press the object Op to be processed.

[0030] Thereafter, the insertion device 30 moves. The tip of the insertion member 31 comes into contact with the surface of the transfer source ring frame RF1, and the insertion device 30 moves toward the transfer source adhesive tape TA1 so as to slide on the surface of the transfer source ring frame RF1.

[0031] 8, the insertion device 30 continues to move leftward on the paper, so that the insertion member 31 enters between the transfer source ring frame RF1 and the transfer source adhesive tape TA1, and the edge of the transfer source adhesive tape TA1 is peeled off. After peeling off a predetermined amount of the transfer source adhesive tape TA1, the insertion device 30 stops moving.

[0032] 9, the clamp rotation portion 44 rotates, and the clamp fixing portion 43 and the clamp rotation portion 44 clamp the peeled portion of the transfer source adhesive tape TA1.

[0033] Then, as shown in FIG. 10, the clamp fixing portion 43 and the clamp rotating portion 44 move in the Z direction and the X direction while holding the source adhesive tape TA1 so as to take up the slack in the source adhesive tape TA1.

[0034] As shown in FIG. 11, the clamp fixing portion 43 and the clamp rotating portion 44 further move in the X direction, and the source adhesive tape TA1 is folded back at an acute angle at the tip of the pressing member 51.

[0035] 12, as the clamp fixing portion 43 and the clamp rotating portion 44 move, the original adhesive tape TA1 is peeled off while being folded back at an acute angle by the pressing member 51. As described above, while the clamp fixing portion 43 and the clamp rotating portion 44 move in the X direction, the pressing device 50 also moves in the X direction while being driven by the force pulling the original adhesive tape TA1, so that the original adhesive tape TA1 is sequentially peeled off from the workpiece W and the original ring frame RF1.

[0036] 13, the original adhesive tape TA1 is peeled off, and then the clamp fixing portion 43 and the clamp rotating portion 44 are released to collect the peeled original adhesive tape TA1 in a collection box or the like (not shown). After that, the insertion device 30, the clamp device 40, and the pressing device 50 return to their original positions, and the original ring frame RF1 is removed from the mounting stage 10, and the destination ring frame RF2 on which the workpiece W is mounted is removed from the mounting stage 20. Then, a new object Op is placed on the mounting stage 20, and the above operations are repeated.

[0037] In this way, the tape peeling device 1 peels off the transfer source adhesive tape TA1 without using a peeling tape, which reduces the manufacturing cost required when using a peeling tape, and also reduces waste generation.

[0038] The present invention allows various embodiments and modifications without departing from the broad spirit and scope of the present invention. The above-described embodiment is for the purpose of explaining the present invention, and does not limit the scope of the present invention. For example, although the above describes a configuration in which the insertion device 30 and the clamp device 40 are separate devices, the insertion device 30 may be incorporated into the clamp device 40.

[0039] In the above, the form in which the workpiece W is transferred from the transfer source ring frame RF1 to the transfer destination ring frame RF2 has been described, but the tape peeling device 1 can also be applied to a processing object Op using only one ring frame. Specifically, as shown in Fig. 14(A), even for a processing object Op in which the transfer source adhesive tape TA1 and the transfer destination adhesive tape TA2 are attached to both sides of the ring frame RF and the workpiece W, the tape peeling device 1 can peel off the transfer source adhesive tape TA1 by the same operation as above, and can bring it into the state shown in Fig. 14(B). [Explanation of symbols]

[0040] 1 Sheet peeling device 10 Base 20 Mounting stage 21 slots 22 Air Intake Hole 30 Insertion device 31 Insertion material 40 Clamping device 41 Slider 42 Lifting device 43 Clamp fixing part 44 Clamp rotating part 50 Pressing device 51 Holding member 52 Slider Op Processing object RF Ring Frame RF1 Original ring frame RF2 Transfer ring frame TA1 Transfer adhesive tape TA2 Transfer Destination Adhesive Tape Double work

Claims

1. A tape peeling device for peeling off the first adhesive tape from a workpiece and the first ring frame after the second adhesive tape is attached to the workpiece during a transfer step of mounting a flat workpiece mounted on a first ring frame via a first adhesive tape to a second ring frame via a second adhesive tape, the tape peeling device comprising: a mounting stage on which the work is mounted, the work being fixed to the first ring frame and the second ring frame by having the first adhesive tape and the second adhesive tape attached to both sides thereof, respectively; an inserting device for inserting an insert member between the first ring frame and the first adhesive tape to peel off a portion of the first adhesive tape from the first ring frame; a clamping device that is movable along a surface of the workpiece while holding the peeled portion of the first adhesive tape; a pressing device that is movable along a surface of the workpiece while pressing the first adhesive tape; With the mounting stage fixed, the first adhesive tape is folded back at an acute angle by the pressing device as the clamp device moves, and is peeled off from the workpiece and the first ring frame; the pressing device is driven by a force applied to the first adhesive tape by the movement of the clamp device; A tape peeling device comprising:

2. A tape peeling device for peeling off the first adhesive tape from a workpiece and the ring frame after the second adhesive tape is attached to the workpiece and the ring frame during a transfer step of mounting a flat workpiece mounted on a ring frame via a first adhesive tape to the ring frame via a second adhesive tape, the tape peeling device comprising: a mounting stage on which the workpiece is mounted, the workpiece being fixed to the ring frame with the first adhesive tape and the second adhesive tape attached to both sides thereof; an inserting device for inserting an insert member between the ring frame and the first adhesive tape to peel off a portion of the first adhesive tape from the ring frame; a clamping device that is movable along a surface of the workpiece while holding the peeled portion of the first adhesive tape; a pressing device that is movable along a surface of the workpiece while pressing the first adhesive tape; With the mounting stage fixed, the first adhesive tape is folded back at an acute angle by the pressing device as the clamp device moves, and peeled off from the workpiece and the ring frame; the pressing device is driven by a force applied to the first adhesive tape by the movement of the clamp device; A tape peeling device comprising:

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