Substrate transport hand, substrate transport system, computer program, and article manufacturing method

Abstract

To provide a substrate conveying hand that can efficiently convey a substrate while preventing dust according to the form of the substrate.SOLUTION: A substrate conveying hand is to convey a substrate, and comprises: at least one first holding unit that is provided on an upper surface of the substrate conveying hand and can adsorb and hold the substrate; at least one second holding unit that is provided on a lower surface of the substrate conveying hand and can adsorb and hold the substrate; and driving means for individually turning on and off the adsorption performed by the first holding unit and the second holding unit.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate transport device and the like. [Background technology]

[0002] As the demand for miniaturization of articles such as semiconductor devices and MEMS increases, attention is being paid to a microfabrication technology in which a pattern of an imprint material is formed on a substrate by contacting a mold with the imprint material on the substrate and curing the imprint material. This technology is also called imprint technology. With imprint technology, it is possible to form a fine structure on the order of several nanometers on a substrate.

[0003] In an imprinting apparatus that forms a pattern by imprinting technology, a mold serving as an original is brought into contact with an imprinting material on a substrate when forming a pattern, and the imprinting material is cured, thereby transferring the pattern of the mold serving as an original onto the substrate, thereby forming a pattern on the substrate. Also, there is a method of producing the mold serving as the original as a replica of the master mold.

[0004] An imprinting apparatus is also used to manufacture such a master mold. To manufacture a replica master mold, an imprinting material is placed on a blank mold, and the imprinting material is cured while the master mold is in contact with the imprinting material. This transfers the pattern of the master mold to the blank mold, thereby manufacturing the master mold.

[0005] In both imprinting apparatuses for manufacturing articles and for manufacturing original molds, if particles (dust) get caught between the object to which the pattern is to be transferred and the pattern to be transferred, manufacturing defects occur and the original mold is damaged. Therefore, it is important not only to suppress the generation of particles, but also to manufacture and transport devices in a processing space or transport space where no particles are floating.

[0006] Although the discussion here is focused on imprint systems, the adhesion of particles to the substrate or original is also undesirable in projection exposure apparatuses. Moreover, in semiconductor devices, as patterns become finer due to the high integration of integrated circuits, more strict control of dust and chemical contamination is required.

[0007] In Patent Document 1, the substrate is transported by a transport hand in a plate state. A substrate support block is fixed to the upper surface of the transport hand, and the substrate can be mechanically held on the upper surface side of the transport hand body by engaging the outer surface of the substrate. In addition, three suction holes are provided in the center of the lower surface side of the transport hand body, and a groove portion communicating with the suction holes is formed.

[0008] The groove is connected to a vacuum suction mechanism such as a vacuum pump, and by operating the vacuum suction mechanism, negative pressure is applied to the groove, making it possible to suction and hold the substrate on the underside of the transport hand. However, since the holding mechanism on the upper side of the transport hand body contacts the outer periphery of the substrate to determine the position of the substrate, there is a possibility that dust will be generated due to contact and sliding. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2005-123642 A Summary of the Invention [Problem to be solved by the invention]

[0010] An object of the present invention is to provide a substrate transport hand that can efficiently transport a substrate while preventing dust from entering the substrate in accordance with the substrate's shape. [Means for solving the problem]

[0011] the above In order to achieve the object, there is provided a substrate transport hand for transporting a substrate, the substrate transport hand comprising: A substrate transport hand for transporting a substrate, At least one first support member is provided on the upper surface side of the substrate transport hand and capable of suction-holding the substrate. 1 keep With At least one second substrate is provided on a lower surface side of the substrate transport hand and capable of suction-holding the substrate. 2 protection With The above 1 keep Holding part and the above 2 protection Motif In adsorption situation Each independently Switch and a drive means for 、 The first holding unit is connected to a vacuum source via a first flow path, and the second holding unit is connected to the vacuum source via a second flow path; the first holding portion and the second holding portion are disposed at positions offset from each other when the substrate transport hand is viewed from the top surface side, The first flow path and the second flow path are disposed at positions offset from each other when the substrate transport hand is viewed from the top surface side. It is characterized by: Effect of the Invention

[0012] According to the present invention, it is possible to realize a substrate transport hand that can efficiently transport a substrate while preventing dust from entering the substrate in accordance with the shape of the substrate. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic diagram showing an overall configuration of a substrate transfer system 100 according to an embodiment of the present invention. [Diagram 2] 1 is a schematic diagram showing a configuration of a substrate transport hand according to an embodiment of the present invention. [Diagram 3] 1A is a diagram showing a configuration around a substrate accommodating apparatus 300 in the first embodiment, and FIG. 1B is a flowchart showing an operation example in the first embodiment. [Figure 4] 10A is a diagram showing an example of the configuration of a substrate accommodating apparatus 300 in the second embodiment, and FIG. 10B is a flowchart showing an example of the operation in the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each drawing, the same members or elements are designated by the same reference numerals, and duplicated descriptions will be omitted or simplified. <Example 1>

[0015] First, a substrate transfer system 100 according to a first embodiment of the present invention will be described. The substrate transfer system 100 according to the present embodiment includes a cluster type substrate processing apparatus 200 and a substrate accommodating apparatus 300. Fig. 1 is a schematic diagram showing an overall configuration of the substrate transfer system 100 according to the embodiment of the present invention. Cluster type substrate processing apparatus 200 includes a plurality of (six in this embodiment as an example) substrate processing sections 210 (210A-210F) and a substrate transport area 220. Substrate processing sections 210 (210A-210F) include, for example, lithography apparatus. Furthermore, substrate transport section 10A indicates substrate transport section 10 in a state where it has moved to substrate transport area 220, and substrate transport section 10B indicates substrate transport section 10 in a state where it is inserted into substrate housing boxes FP1-FP4.

[0016] In this embodiment, the lithography apparatus includes a semiconductor exposure apparatus. It also includes an imprinting apparatus that applies an imprinting material to the surface of a substrate and imprints (presses) a mold having projections and recesses to form an uneven pattern on the substrate. It also includes an imprinting apparatus (planarization apparatus) that forms a flat surface by imprinting a mold having a flat surface into the imprinting material on the substrate.

[0017] Fig. 2 is a schematic diagram showing the configuration of a substrate transport hand according to an embodiment of the present invention, in which Fig. 2(A) is a plan view of the transport hand according to the embodiment, Fig. 2(B) is a side view of the transport hand according to the embodiment in a state where a substrate is held on the upper side thereof, and Fig. 2(C) is a side view of the transport hand according to the embodiment in a state where a substrate is held on the lower side thereof.

[0018] As shown in FIGS. 2(A) to (C), the substrate 1 is placed substantially horizontally with the surface to be processed facing the Z-axis direction (upward in FIGS. 2(B) and (C)) or downward. On the upper surface side of the substrate transport hand 18, at least one holder 13a serving as a first holder capable of suction-holding a substrate is provided. Further, on the lower surface side of the substrate transport hand 18, at least one holding portion 13b is provided as a second holding portion capable of suction-holding a substrate.

[0019] In the example of Fig. 2(A), two holders 13a are provided, protruding from the upper surface of the substrate transport hand 18, and only the holders 13a come into contact with the substrate 1a. In the example of Fig. 2(A), two holders 13b are also provided, protruding from the lower surface of the substrate transport hand 18, and only the holders 13b come into contact with the substrate 1b.

[0020] The holding unit 13a communicates with a vacuum source via a vacuum flow path 14a and an on-off valve 21a. The holding unit 13b communicates with a vacuum source via a vacuum flow path 14b and an on-off valve 21b. Therefore, the holding units 13a and 13b are configured to be able to independently and selectively adsorb the substrate by the on-off valves 21a and 21b. That is, the on-off valves 21a and 21b function as drive means for independently turning on and off the suction by the first holding unit and the second holding unit.

[0021] In this embodiment, the holders 13a and 13b are vacuum suction devices that suction and hold the substrate by vacuum suction, but an electrostatic suction device that suctions the substrate by electrostatic force may be used. In the embodiment, the holders 13a and 13b are provided in two units, but the number of the holders 13a and 13b is not limited to two units, and at least one unit may be used.

[0022] Also, as shown in FIG. 2(A), holding portion 13a and holding portion 13b are arranged at each of the two split tips of substrate transport hand 18 so that they can adsorb and hold the substrate at positions approximately equidistant from the center of the substrate on line 15 passing through the diameter of the substrate. 2A, the holders 13a and 13b are arranged at positions offset from each other when viewed from the Z-axis direction (the upper surface side of the substrate transport hand). The vacuum channels 14a and 14b are also arranged at the tip of the substrate transport hand 18 so as not to overlap when viewed from the Z-axis direction.

[0023] With this configuration, even if the holding parts 13a and 13b are provided on the front and back of the substrate transport hand 18, the tip of the substrate transport hand 18 can be made sufficiently thin, and the configuration of the substrate accommodating device 300 can be made compact. Moreover, when the substrate is adsorbed and held by the holding part 13a or the holding part 13b, the substrate can be held efficiently and in a well-balanced manner. In addition, since there is no mechanism for mechanically holding the substrate or a rotation mechanism, the configuration is less likely to generate particles.

[0024] FIG. 3A is a diagram showing an example of the configuration of a substrate accommodating apparatus 300 in the first embodiment, and FIG. 3B is a flowchart showing an example of the operation in the first embodiment. In FIG. 3(A), substrate accommodating device 300 has substrate accommodating boxes FP1-4 placed thereon, and is provided with reversing means 30 for reversing the front and back of substrate 1 selected and held by the substrate transport hand.

[0025] Furthermore, as shown in FIG. 3(B), substrate transport section 10B holds substrate 1 accommodated in any of substrate accommodation boxes FP1 to FP4 and transports it to substrate transport area 220 in response to a command from the control section. (About Flow 1)

[0026] The substrate transport operation of flow 1 in the flow chart of FIG. 3(B) will be described. One substrate 1 is selected from among the plurality of substrates 1 stored in substrate storage boxes FP1 to FP4, and the back surface of the substrate 1 is suction-held by holding portion 13a formed on the upper surface of substrate transport hand 18 in substrate transport section 10B.

[0027] Next, the substrate 1 is handed over to reversing means 30, and the substrate is reversed. Next, a holder 13b formed on the lower surface of substrate transport hand 18 in substrate transport section 10B adsorbs and holds the upper surface of the substrate after being reversed, and transports substrate 1 to substrate transport region 220. Substrate 1 transported to substrate transport region 220 is transported by substrate transport section 10A to one of substrate processing sections 210A to 210F, where a substrate processing step such as imprint processing is performed. (About Flow 2)

[0028] The substrate transport operation of flow 2 in the flow chart of FIG. 3(B) will be described. Substrate 1 is picked up from one of substrate housing boxes FP1 to FP4 and held by suction on the back surface of substrate 1 by holder 13a configured on the upper surface of substrate transport hand 18 in substrate transport section 10B, and substrate 1 is transported to substrate transport area 220. Thereafter, substrate 1 transported to substrate transport area 220 is transported by substrate transport section 10A to one of substrate processing sections 210A to 210F for processing. (About Flow 3)

[0029] The substrate transport operation of flow 3 in the flow chart of FIG. 3(B) will be described. Substrate 1 is picked up from one of substrate storage boxes FP1 to FP4 by holding the surface of substrate 1 by holding portion 13b formed on the underside of substrate transport hand 18 in substrate transport section 10B, and substrate 1 is transported to substrate transport area 220. Then, substrate 1 transported to substrate transport area 220 is transported by substrate transport section 10A to one of substrate processing sections 210A to 210F for processing. <Example 2>

[0030] Second Embodiment Next, a substrate transfer system 100 according to a second embodiment of the present invention will be described with reference to FIG. FIG. 4A is a diagram showing an example of the configuration of a substrate accommodating apparatus 300 in the second embodiment, and FIG. 4B is a flowchart showing an example of the operation in the second embodiment. In FIG. 4, substrate accommodating device 300 has substrate accommodating boxes FP1-4, reversing means 30 for substrate 1, and is equipped with position measuring means 40 for measuring and correcting positional deviation of the substrate.

[0031] As shown in the flow chart of FIG. 4(B), substrate transport section 10B holds substrate 1 accommodated in any of substrate accommodation boxes FP1 to FP4 and transports it to substrate transport area 220 in response to a command from the control section. (About Flow 4)

[0032] The substrate transport operation of flow 4 in the flow chart of FIG. 4(B) will be described. The back surface of substrate 1 is sucked and held by holding portion 13a formed on the upper surface of substrate transport hand 18 in substrate transport section 10B from one of substrate storage boxes FP1 to FP4. Substrate 1 is then handed over to inversion means 30, which inverts the substrate. Next, the top surface of the substrate after inversion is sucked and held by holding portion 13b provided on the lower surface of substrate transport hand 18 in substrate transport section 10B.

[0033] Furthermore, position measurement means 40 measures an error caused by the inversion means 30 and a position deviation that occurs when the substrate 1 is transferred from the holder 13a to the holder 13b, and corrects the deviation of the substrate holding position by the holder 13b. Then, the holder 13b transports the substrate 1 to the substrate transfer region 220. The substrate 1 transported to the substrate transfer region 220 is transported by the substrate transport section 10A to one of the substrate processing sections 210A to 210F for processing. (About Flow 5)

[0034] The substrate transport operation of flow 5 in the flow chart of FIG. 4(B) will be described. One substrate 1 from among the plurality of substrates accommodated in substrate housing boxes FP1 to FP4 is adsorbed and held by its rear surface by holding section 13a configured on the upper surface of substrate transport hand 18 in substrate transport section 10B. Then, after positional deviation of the substrate is corrected by position measurement means 40, substrate 1 is transported to substrate transport region 220. Thereafter, substrate 1 transported to substrate transport region 220 is transported by substrate transport section 10A to one of substrate processing sections 210A to 210F for processing. (About Flow 6)

[0035] The substrate transport operation of flow 6 in the flow chart of FIG. 4(B) will be described. The surface of substrate 1 is suction-held by holding portion 13b formed on the underside of substrate transport hand 18 in substrate transport section 10B from one of substrate housing boxes FP1 to FP4. Then, after positional deviation of the substrate is corrected by position measurement means 40, substrate 1 is transported to substrate transport region 220. Substrate 1 transported to substrate transport region 220 is transported by substrate transport section 10A to one of substrate processing sections 210A to 210F for processing.

[0036] In this manner, in the substrate transport system 100 of the embodiment, high-precision, high-throughput processing is possible while preventing the adhesion of dust, regardless of whether the substrate has a surface facing upward or a surface facing downward. In the above-mentioned first and second embodiments, a cluster-type substrate processing apparatus having a plurality of processing sections has been described. However, the effects of the above-mentioned embodiments can be sufficiently obtained even in a stand-alone substrate processing apparatus having only one processing section.

[0037] As described above, the substrate transport hand of the embodiment can provide a substrate transport system that achieves both high productivity and high precision. In this embodiment, the vacuum flow path 14 and the substrate transport hand 18 are preferably made of conductive ceramic material. They are also preferably connected to the same earth as the earth of the cluster type substrate processing apparatus 200 or the substrate accommodation apparatus 300. This is because, if dust is generated, it is possible to remove static electricity that attracts the dust to the substrate.

[0038] It is also preferable to provide suction ports for sucking up dust around the suction holders 13a and 13b or around the tip of the substrate transport hand, so that the dust suction operation can be performed independently of the suction holders 13a and 13b. It is also preferable to control the dust suction operation so that suction is performed continuously during the substrate transport hand's transport operation, while the substrate is being held, and while the substrate is being handed over.

[0039] By using the substrate transport hand, substrate transport system, lithography apparatus, and the like according to the present embodiment, the productivity and quality can be improved when manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures. A method for manufacturing devices (semiconductor devices, magnetic storage media, liquid crystal display elements, etc.) as products will be described.

[0040] Such manufacturing methods involve the use of a lithography apparatus to deposit a substrate (such as a wafer, a glass plate, a filter, etc.) The method may include a pattern forming step of forming a mold pattern on the surface of a substrate (such as a mold-shaped substrate). Here, the step of transferring the mold pattern may include a pattern forming step of forming a flat pattern. The substrate is not limited to a single base material, and may include a multi-layer structure. Alternatively, the method may include a pattern forming step of exposing a pattern to a photosensitive body on the substrate using a lithography device.

[0041] The manufacturing method further includes a step of treating the substrate before or after the pattern forming step. For example, the treatment step may include a step of removing a residual film of the pattern and a development step. It may also include well-known manufacturing processes such as a step of etching the substrate using the pattern as a mask, a step of cutting chips out of the substrate (dicing), a step of placing the chips on a frame and electrically connecting them (bonding), and a step of sealing with resin (molding). The method for manufacturing an article using the substrate transport hand, substrate transport system, lithography apparatus, etc. in this embodiment has fewer defects caused by dust than conventional methods, and is therefore advantageous in at least one of the performance, quality, productivity, and production costs of the article.

[0042] The present invention has been described in detail above based on its preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications are possible based on the gist of the present invention, and these modifications are not excluded from the scope of the present invention. A computer program for implementing all or part of the control in this embodiment may be provided to the substrate transport device, substrate holding device, or lithography device via a network or various storage media. A computer (or a CPU, MPU, or the like) in the substrate transport device, substrate holding device, or lithography device may read and execute the program. In this case, the program and the storage medium storing the program constitute the present invention. [Explanation of symbols]

[0043] 1: Substrate 10A, 10B: Substrate transport section 13a, 13b: Holding part 14a, 14b: Vacuum channel 18: Circuit board transport hand 21a, 21b: Opening and closing valve 100: Substrate transport system 210: Substrate processing section 220: Substrate transport area 300: Substrate receiving device

Claims

1. A substrate transport hand for transporting a substrate, At least one first holding part provided on an upper surface side of the substrate transport hand and capable of suction-holding the substrate; At least one second holding portion provided on a lower surface side of the substrate transport hand and capable of suction-holding the substrate; a driving means for independently switching the suction states of the first holding portion and the second holding portion, The first holding portion is connected to a vacuum source via a first flow path, and the second holding portion is connected to the vacuum source via a second flow path; the first holding portion and the second holding portion are disposed at positions offset from each other when the substrate transport hand is viewed from the top surface side, the first flow path and the second flow path are disposed at positions offset from each other when the substrate transport hand is viewed from the top surface side. A substrate transport hand characterized by the above.

2. 2. The substrate transport hand according to claim 1, wherein the substrate transport hand has a tip portion divided into two, and the first holding portion and the second holding portion are each disposed at the tip portion.

3. 2. The substrate transport hand according to claim 1, wherein the substrate transport hand is made of a conductive ceramic.

4. 4. The substrate transport hand according to claim 3, wherein the substrate transport hand is grounded.

5. 4. The substrate transport hand according to claim 3, further comprising a suction port at a tip of the substrate transport hand for sucking in dust, and the first holding portion and the second holding portion perform suction operations independently of each other.

6. 2. The substrate transport hand according to claim 1, wherein the driving means includes a vacuum suction device.

7. 2. The substrate transport hand according to claim 1, wherein the driving means includes an electrostatic adsorption device.

8. A substrate transport system characterized by having a control unit that uses the substrate transport hand described in any one of claims 1 to 7 to select and hold a single substrate from a substrate accommodation device that accommodates a plurality of substrates, and transports the substrate to a substrate processing device.

9. 9. The substrate transport system according to claim 8, wherein the substrate accommodation device has a reversing means for reversing the front and back of the substrate selected and held by the substrate transport hand.

10. 9. The substrate transport system according to claim 8, wherein the substrate accommodation device has a position measuring means for measuring and correcting a positional deviation of the substrate selectively held by the substrate transport hand.

11. The substrate transport system of claim 8 , wherein the substrate processing apparatus includes at least one lithography apparatus.

12. The substrate transport system of claim 11 , wherein the lithography apparatus comprises an imprint apparatus.

13. A computer program for controlling the substrate transport system according to any one of claims 8 to 12, which uses the substrate transport hand to select and hold a substrate from the substrate accommodation device that accommodates a plurality of substrates, and to transport the substrate to the substrate processing device.

14. a substrate processing step of processing a substrate in the substrate processing apparatus by using the substrate transfer system according to any one of claims 8 to 12; and manufacturing an article by processing the substrate processed by the substrate processing step.

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