Workpiece machining device and method for manufacturing the same

The work processing device adjusts the whetstone's position and trajectory based on real-time measurements to accurately chamfer arc-shaped edges, addressing inaccuracies caused by whetstone diameter variations.

JP7626963B1Active Publication Date: 2025-02-05DAITRON CO LTD

Patent Information

Application Number
JP2024060935
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-04-04
Publication Date
2025-02-05
Estimated Expiration
2044-04-04

AI Technical Summary

Technical Problem

Existing work processing devices face challenges in accurately controlling the contact position between the whetstone and the work during chamfering processes due to variations in the whetstone's outer diameter, leading to inaccuracies in processing arc-shaped edges.

Method used

The device incorporates a supporting unit, rotary drive portion, measurement unit, and control unit to determine and adjust the relative movement of the whetstone based on the work's dimensions and the whetstone's outer diameter, using calculation processes to ensure precise processing of the work's peripheral edge.

Benefits of technology

This approach allows for accurate processing of the work's peripheral edge into a target shape by continuously updating the whetstone's position and trajectory, ensuring consistent and precise chamfering results.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007626963000001_ABST
    Figure 0007626963000001_ABST
Patent Text Reader

Abstract

A workpiece machining device capable of machining the peripheral portion of a workpiece into a target shape with high precision, and a method for manufacturing the workpiece machining device are provided. [Solution] The present invention determines a target trajectory of the rotary drive unit 4 relative to the support part 2 when machining the workpiece W based on the target machining dimensions of the workpiece W and the outer diameters of the grinding wheels 3a, 3b stored in a memory device, causes the rotary drive unit 4 to rotate the grinding wheels 3a, 3b while the moving device 5 moves the support part 2 and the rotary drive unit 4 relatively along the target trajectory, machines the peripheral part of the workpiece W with the outer periphery of the grinding wheels 3a, 3b, calculates the measured value of the outer diameter of the grinding wheels 3a, 3b based on the dimensions of the machined workpiece W measured by a measuring unit 6 and the target machining dimensions, and updates the outer diameter of the grinding wheels 3a, 3b stored in the memory device to the calculated measured value of the outer diameter of the grinding wheels 3a, 3b.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to a workpiece machining device and a method for manufacturing a workpiece machining device. [Background technology]

[0002] Plate-shaped workpieces such as semiconductor device wafers may have their peripheral portions ground with a grindstone and chamfered into a predetermined shape. In this type of chamfering, in order to accurately machine the peripheral portion of the workpiece into a target shape, a technique has been proposed in which the outer diameter of a test-machined workpiece and the shape of the peripheral portion of the workpiece are measured, the relative position of the grindstone to the workpiece is corrected based on the measurement results, and then the workpiece is ground into the target outer diameter and the target peripheral shape (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-117782 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, even if the outer diameter of the grinding wheel stored by the workpiece processing device differs from the actual outer diameter, if the relative position of the grinding wheel to the workpiece is corrected based on the measurement results of a trial-machined workpiece, it becomes difficult to accurately control the contact position between the grinding wheel and the workpiece, for example, when machining the peripheral edge of the workpiece into an arc shape.

[0005] The applicant found that when a workpiece is continuously ground with a grinding wheel, not only does the outer diameter of the grinding wheel decrease due to wear, but the grinding wheel absorbs grinding fluid, causing the outer diameter to increase. In other words, the applicant found that it is important to obtain the accurate outer diameter of the grinding wheel and to determine the relative movement trajectory of the grinding wheel with respect to the workpiece based on the obtained outer diameter of the grinding wheel not only when the integrated value of the time that the grinding wheel has been grinding the workpiece is large, but also when the integrated value is small. [Means for solving the problem]

[0006] The present invention includes the embodiments set forth below.

[0007] [1] A method for grinding a peripheral portion of a workpiece, comprising: a support unit for supporting a plate-shaped workpiece; a disk-shaped grinding wheel for grinding a peripheral portion of the workpiece; a rotary drive unit for rotating the grinding wheel while supporting the grinding wheel; a moving device for relatively moving the support unit and the rotary drive unit; a measuring unit for measuring the dimensions of the machined workpiece; a storage device for storing a target machining dimension of the workpiece and an outer diameter of the grinding wheel; and a control unit for controlling the rotary drive unit and the moving device, wherein the control unit determines a position of the workpiece relative to the support unit during machining based on the target machining dimension of the workpiece and the outer diameter of the grinding wheel stored in the storage device. a processing process in which the rotational drive unit rotates the grinding wheel while moving the support unit and the rotational drive unit relatively along the target trajectory using the moving device, and the peripheral portion of the grinding wheel is used to process the peripheral portion of the workpiece; an outer diameter calculation process in which the outer diameter of the grinding wheel is calculated based on the dimensions of the machined workpiece measured by the measuring unit and the target processing dimensions; and an update process in which the outer diameter of the grinding wheel stored in the storage device is updated to the outer diameter of the grinding wheel calculated by the outer diameter calculation process.

[0008] [2] The workpiece processing apparatus described in [1] above, wherein the outer diameter calculation process calculates the outer diameter of the grinding wheel based on the outer diameter of the machined workpiece measured by the measuring unit and the target processing dimension of the outer diameter of the workpiece.

[0009] [3] The workpiece processing apparatus described in [1] above, wherein the processing step processes the peripheral portion of the workpiece using the outer periphery of the grinding wheel to form an arcuate surface on the peripheral portion of the workpiece that curves in an arc shape and becomes thinner as it approaches the peripheral portion of the workpiece, and the outer diameter calculation step calculates the outer diameter of the grinding wheel based on the radius of curvature of the arcuate surface of the machined workpiece measured by the measuring unit and the target processing dimension of the radius of curvature of the arcuate surface.

[0010] [4] The grinding wheel includes a first grinding wheel that grinds a peripheral portion of one side of the workpiece to form a first arc-shaped curved surface that becomes thinner as it approaches the peripheral portion of the workpiece, and a second grinding wheel that grinds a peripheral portion of the other side of the workpiece to form a second arc-shaped curved surface that becomes thinner as it approaches the peripheral portion of the workpiece, and the outer diameter calculation process includes a step of calculating a radius of curvature of the first arc-shaped surface based on the target machining dimension of the radius of curvature of the first arc-shaped surface of the machined workpiece measured by the measuring unit. The workpiece machining device described in [3] above, wherein an outer diameter of the first grinding wheel is calculated, and an outer diameter of the second grinding wheel is calculated based on the target machining dimension of the radius of curvature of the second arcuate surface and the radius of curvature of the second arcuate surface of the machined workpiece measured by the measuring unit, and the update process updates the outer diameter of the first grinding wheel stored in the memory device to the outer diameter of the first grinding wheel calculated by the outer diameter calculation process, and updates the outer diameter of the second grinding wheel stored in the memory device to the outer diameter of the second grinding wheel calculated by the outer diameter calculation process.

[0011] [5] A workpiece machining apparatus according to any one of [1] to [4] above, wherein, when the outer diameter of the grinding wheel calculated by the outer diameter calculation process is larger than the outer diameter of the grinding wheel stored in the memory device, the update process updates the outer diameter of the grinding wheel stored in the memory device to the outer diameter of the grinding wheel calculated by the outer diameter calculation process.

[0012] [6] A support unit for supporting a plate-shaped workpiece, a disk-shaped grinding wheel for grinding the peripheral portion of the workpiece, a rotary drive unit for rotating the grinding wheel while supporting it, a moving device for relatively moving the support unit and the rotary drive unit, a storage device for storing a target machining dimension of the workpiece and an outer diameter of the grinding wheel, and a control unit for controlling the rotary drive unit and the moving device, wherein the control unit performs a position determination process for determining a target trajectory of the rotary drive unit relative to the support unit when machining the workpiece based on the target machining dimension of the workpiece and the outer diameter of the grinding wheel stored in the storage device, and a processing process for rotating the grinding wheel by the rotary drive unit while moving the support unit and the rotary drive unit relatively along the target trajectory using the moving device, and processing the peripheral portion of the workpiece with the outer periphery of the grinding wheel; a temporary machining step of determining a target trajectory for temporary machining based on a temporary machining dimension, which is a target machining dimension for temporary machining, and an initial setting value of an outer diameter of the grindstone, and rotating the grindstone with the rotary drive unit while moving the support unit and the rotary drive unit relatively along the determined target trajectory for temporary machining by the moving device, thereby forming an arcuate surface curved in an arc shape on the periphery of the workpiece; a measuring step of measuring a radius of curvature of the arcuate surface formed in the temporary machining step; and calculating the outer diameter of the grindstone based on a measured value of the radius of curvature of the arcuate surface measured in the measuring step and the temporary machining dimension of the radius of curvature of the arcuate surface. The outer diameter of the grindstone stored in the storage device is updated to the calculated outer diameter of the grindstone. and an adjustment process for adjusting the position of at least one of the support part and the rotation drive part based on the outer diameter of the grinding wheel calculated in the outer diameter calculation process. Effect of the Invention

[0013] According to the present invention, the peripheral portion of the workpiece can be machined into a target shape with high precision. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of a workpiece machining device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a side view showing a schematic configuration of a support unit, a rotation drive unit, and a moving device in the workpiece machining device; [Diagram 3] Block diagram showing the configuration of the workpiece machining device [Figure 4] Cross-section of the edge of the workpiece after chamfering [Diagram 5] A side view showing a workpiece and a grinding wheel supported by a support during chamfering. [Figure 6] A plan view of the support and rotation drive units showing the workpiece in contact with the grinding wheel. [Figure 7] FIG. 2 is a flow chart showing the operation of the workpiece machining device of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0016] (1) Configuration of workpiece machining device 1 The configuration of a workpiece machining apparatus 1 of this embodiment will be described with reference to Figures 1 to 3. The workpiece machining apparatus 1 is an apparatus that chamfers the peripheral edge of a plate-shaped workpiece W, such as a wafer for semiconductor devices, into a predetermined shape using grindstones 3a and 3b.

[0017] In this embodiment, the workpiece processing device 1 grinds the peripheral portion of the workpiece W using grinding wheels 3a, 3b, thereby forming, on the peripheral portion of the workpiece W, as illustrated in Figure 4, an upper inclined surface Wa1 inclined at an angle θ1 with respect to the upper plane W1 of the workpiece W, a peripheral end surface Wb that forms the end face of the peripheral portion of the workpiece W and is perpendicular to the upper plane W1 and the lower plane W2, an upper arcuate surface Wc1 that smoothly connects between the upper inclined surface Wa1 and the peripheral end surface Wb, a lower inclined surface Wa2 inclined at an angle θ2 with respect to the lower plane W2, and an arcuate surface Wc2 that smoothly connects between the lower inclined surface Wa2 and the peripheral end surface Wb.

[0018] The workpiece processing device 1 includes a support part 2 that supports the workpiece W, grinding wheels 3a, 3b that grind the peripheral portion of the workpiece W, a rotational drive part 4 that rotates the grinding wheels 3a, 3b while supporting them, a moving device 5 that moves the support part 2 and the rotational drive part 4 relatively, a measuring part 6 that measures the dimensions of the workpiece W, and a control device 7 that controls the operation of the workpiece processing device 1, and performs chamfering on an unmachined workpiece W loaded into the support part 2 by a loading device 15, and loads the processed workpiece W from the support part 2 by an unloading device 16.

[0019] Specifically, the support unit 2 includes a stage 21 on which an unmachined workpiece W is placed, a suction device 22 (see FIG. 3) that vacuum-adsorbs the workpiece W placed on the stage 21, and a rotation device 23 that rotates the workpiece W together with the stage 21. In the support unit 2, the unmachined workpiece W before its peripheral portion is ground is transported to the stage 21 by a carry-in device 15.

[0020] 1, the loading device 15 is provided with a holder 15a that suction-holds an unmachined workpiece W, and an alignment sensor 15b. The alignment sensor 15b detects the outer diameter of the unmachined workpiece W held by the holder 15a, the center position of the workpiece W, and the positions of the orientation flat and notch.

[0021] Based on the detection results of the alignment sensor 15b, the loading device 15 rotates the unmachined workpiece W so that the orientation flat and notch of the workpiece W are located at predetermined positions in the circumferential direction of the workpiece W, and aligns the center of the workpiece W so that it coincides with the center of rotation of the stage 21, and places the workpiece W on the upper surface of the stage 21.

[0022] In this embodiment, the alignment sensor 15b is provided in the carry-in device 15. However, the alignment sensor may be provided separately from the carry-in device 15, for example, on an alignment table provided separately from the support portion 2.

[0023] When providing an alignment table as described above, the unmachined workpiece W is loaded onto the alignment table before being loaded into the support unit 2, and the workpiece W is rotated together with the alignment table while being held by suction on the alignment table. Then, the alignment sensor measures the distance from the rotation center of the alignment table to the edge of the workpiece W as it rotates, thereby acquiring information such as the amount and direction of eccentricity of the workpiece W, as well as the orientation of the orientation flat and notch. Based on this information, the loading device 15 transfers the workpiece W from the alignment table to the support unit 2 so that the center of the workpiece W coincides with the rotation center of the stage 21.

[0024] The stage 21 is formed with a smaller diameter than the workpiece W, and when the workpiece W is centered and placed on the stage 21, the peripheral portion of the workpiece W protrudes outward beyond the stage 21. The workpiece W placed on the stage 21 is vacuum-adsorbed by the suction device 22 and fixed onto the stage 21.

[0025] The rotating device 23 rotates the workpiece W vacuum-adsorbed on the stage 21 together with the stage 21 about an axis extending in the vertical direction during chamfering of the workpiece W. This allows the entire peripheral portion of the workpiece W placed on the stage 21 to be chamfered by the grindstones 3a and 3b.

[0026] In the workpiece processing device 1 of this embodiment, a thickness sensor 15c may be provided in the carry-in device 15 to detect the thickness of the unmachined workpiece W held by the holding part 15a, or a thickness sensor may be provided in the support part 2 to detect the thickness of the unmachined workpiece W held by the support part 2. In addition, when an alignment table as described above is provided, the thickness sensor provided in the alignment table may detect the thickness of the workpiece W held on the alignment table.

[0027] The grindstones 3a and 3b are made of disc-shaped resin-bonded grindstones or vitrified-bonded grindstones. As shown in Figs. 1 and 2, in this embodiment, the pair of grindstones 3a and 3b are arranged so that their plate surfaces are close to each other and face each other. The pair of grindstones 3a and 3b are connected to the rotation shafts 42a and 42a of a pair of spindle motors 41a and 41b, respectively. In this embodiment, the pair of grindstones 3a and 3b are arranged so that their plate surfaces are close to each other and face each other while being shifted by a predetermined angle φ1, φ2 (for example, 0° to 0.6°) in the circumferential direction of the workpiece W with respect to the direction in which the stage 21 moves (see Fig. 6).

[0028] One of the grindstones (first grindstone) 3a performs chamfering by grinding the upper side of the thickness center C of the peripheral portion of the workpiece W, that is, the upper inclined surface Wa1, the upper arcuate surface Wc1, and the portion above the thickness center C of the peripheral end surface Wb of the workpiece W. The other grindstone (second grindstone) 3b performs chamfering by grinding the lower side of the thickness center C of the peripheral portion of the workpiece W, that is, the lower inclined surface Wa2, the arcuate surface Wc2, and the portion below the thickness center C of the peripheral end surface Wb of the workpiece W.

[0029] 2 denotes a supply nozzle that supplies the grinding fluid to the grinding wheels 3a and 3b. At least while the grinding wheels 3a and 3b are grinding the peripheral portion of the workpiece W, the grinding fluid is supplied from the supply nozzle 31 to the grinding wheels 3a and 3b.

[0030] The pair of spindle motors 41a, 41b constitute the rotary drive unit 4, and the rotary shafts 42a, 42b are arranged in the horizontal direction. The pair of spindle motors 41a, 41b rotate the pair of grindstones 3a, 3b in opposite directions around the rotary shafts 42a, 42b extending in the horizontal direction. The pair of grindstones 3a, 3b rotating around the rotary shafts 42a, 42b are pressed against the peripheral portion of the workpiece W rotating together with the stage 21, and perform chamfering on the entire peripheral portion of the workpiece W placed on the stage 21.

[0031] The moving device 5 includes a stage moving device 51 that moves the stage 21 of the support unit 2 toward and away from the rotation drive unit 4, and a grindstone moving device 52 that moves the rotation drive unit 4 up and down.

[0032] The stage moving device 51 is composed of a rail or a ball screw, etc., and moves the workpiece W placed on the stage 21 in a predetermined direction X together with the stage 21, moving it closer to or away from the grinding wheels 3a, 3b provided on the rotation drive unit 4.

[0033] The grindstone moving device 52 moves the entire rotation drive unit 4 in the vertical direction Z. Specifically, it includes a first grindstone moving device 53 that synchronously moves the pair of spindle motors 41a, 41b in the vertical direction Z, and a pair of second grindstone moving devices 54a, 54b that separately move the pair of spindle motors 41a, 41b constituting the rotation drive unit 4 in the vertical direction Z. Note that the grindstone moving device 52 may be formed from the pair of second grindstone moving devices 54a, 54b without providing the first grindstone moving device 53.

[0034] The moving device 5 moves the support 2 and the rotation shafts 42a, 42b of the spindle motors 41a, 41b (i.e., the rotation shafts of the grindstones 3a, 3b) relatively along a first target trajectory and a second target trajectory, which will be described later. As shown in Fig. 5, the moving device 5 arranges a pair of grindstones 3a, 3b at different heights so as to sandwich the peripheral portion of the workpiece W from above and below, with the first grindstone 3a chamfering the peripheral portion on the upper flat surface W1 side and the second grindstone 3b chamfering the peripheral portion on the lower flat surface W2 side.

[0035] The measuring unit 6 measures various dimensions of the machined workpiece W, the peripheral portion of which has been ground by the grinding wheels 3a, 3b. Specifically, the measuring unit 6 includes an outer diameter measuring unit 61 that measures the outer diameter of the machined workpiece W, and a cross-section measuring unit 62 that measures the cross-sectional shape of the peripheral portion of the workpiece W at an arbitrary position.

[0036] The outer diameter measuring unit 61 is composed of, for example, a projection image measuring device having a light emitting unit arranged above or below the workpiece W and a light receiving unit arranged on the other side. The outer diameter measuring unit 61 measures the outer diameter of the workpiece W at any position on the periphery of the workpiece W, that is, the length of a straight line connecting two points on the peripheral end face Wb passing through the center of the workpiece W, by detecting with the light receiving unit whether or not the laser light irradiated from the light emitting unit is blocked by the workpiece W. The outer diameter measuring unit 61 may be, in addition to the above-mentioned projection image measuring device, a linear cage that detects the outer diameter of the workpiece W by contacting the workpiece W so as to sandwich it and detecting the presence or absence of the workpiece W, or may obtain the outer diameter of the workpiece by various sensors.

[0037] The cross-section measuring unit 62 is composed of an edge / notch shape measuring device including an illumination unit 62a that irradiates the peripheral portion of the workpiece W with parallel light parallel to the upper plane W1 and the lower plane W2 of the workpiece W, and an imaging unit 62b that images the light irradiated from the illumination unit 62a ahead of the workpiece W in the light traveling direction. The cross-section measuring unit 62 measures the cross-sectional shape at an arbitrary position on the peripheral portion of the workpiece W by using the imaging unit 62b to image the light that has passed through the workpiece W without being blocked by the workpiece W out of the parallel light irradiated from the illumination unit 62a to the peripheral portion of the workpiece W. The cross-section measuring unit 62 may measure the cross-sectional shape at an arbitrary position on the peripheral portion of the workpiece W using various sensors other than the edge / notch shape measuring device described above.

[0038] The measuring unit 6 outputs the measurement results from the outer diameter measuring unit 61 and the cross section measuring unit 62 to the control device 7. The measuring unit 6 and the control device 7 may be connected wirelessly or by wire.

[0039] In this embodiment, the carrying-out device 16 that carries the chamfered workpiece W out of the stage 21 is provided with the measuring unit 6, the cleaning device 10, and the drying device 11 as described above.

[0040] After the workpiece W has been chamfered, the cleaning device 10 sprays cleaning liquid onto the workpiece W and the stage 21 with the carrying-out device 16 positioned above the support section 2 to clean the workpiece W and the stage 21. The drying device 11 dries the cleaned workpiece W and the stage 21 by blowing air onto the cleaning liquid. The carrying-out device 16 carries the machined workpiece W out of the support section 2 after the cleaning device 10 and the drying device 11 have cleaned and dried the workpiece W and the stage 21.

[0041] The measurement unit 6, the cleaning device 10, and the drying device 11 may be provided separately from the discharge device 16.

[0042] 3, the control device 7 has a processing device 71 such as a computer, and a storage device 72 such as a memory. The control device 7 controls the operations of the support unit 2, the rotation drive unit 4, the moving device 5, the measuring unit 6, the carry-in device 15, and the carry-out device 16 by the processing device 71 reading and executing a control program stored in the storage device 72, and also functions as a position determination processing unit 73, an outer diameter calculation processing unit 74, and an update processing unit 75.

[0043] The measurement unit 6 may be configured as a computer independent of the control device 7. When the measurement unit 6 is configured as a computer separate from the control device 7, the measurement results of the measurement unit 6 may be transmitted to the control device 7 via communication, or the user may manually input the measurement results of the measurement unit 6 to the control device 7.

[0044] The memory device 72 stores, together with a control program, target processing dimensions, which are various dimensions of a target shape to be formed on the peripheral portion of the workpiece W by chamfering, outer diameters DTa and DTb of the grinding wheels 3a and 3b, and an axial distance L in the X direction from the rotation center of the stage 21 to the rotation shafts 42a and 42b of the spindle motors 41a and 41b (see FIG. 2).

[0045] Referring to Figures 4 and 5, examples of dimensions stored in the memory device 72 as target machining dimensions include the outer diameter DW of the workpiece W, the width (radial length) A1 of the chamfering processing on the peripheral portion of the upper flat surface W1 of the workpiece W, the width (radial length) A2 of the chamfering processing on the peripheral portion of the lower flat surface W2 of the workpiece W, the inclination angle θ1 of the acute angle side of the upper slope Wa1 relative to the upper flat surface W1, the inclination angle θ2 of the acute angle side of the lower slope Wa2 relative to the lower flat surface W2, the radius of curvature R1 of the upper arcuate surface Wc1, the radius of curvature R2 of the arcuate surface Wc2, the length B of the peripheral end surface Wb in the vertical direction Z, and the thickness T of the workpiece W.

[0046] The position determination processing unit 73 determines a target trajectory of the rotation drive unit 4 relative to the support unit 2 when machining the workpiece W based on the target machining dimensions stored in the memory device 72, the outer diameter dimensions DTa, DTb of the grinding wheels 3a, 3b, and the center distance L.

[0047] Specifically, the position determination processing unit 73 determines the target shape of the peripheral portion of the workpiece W based on the target machining dimensions stored in the memory device 72, sets a target trajectory for the first grinding wheel 3a (hereinafter, this target trajectory may also be referred to as the first target trajectory) at a position a distance of half the outer diameter of the first grinding wheel 3a from above the thickness center C of the target shape, and sets a target trajectory for the second grinding wheel 3b (hereinafter, this target trajectory may also be referred to as the second target trajectory) at a position a distance of half the outer diameter of the second grinding wheel 3b from below the thickness center C of the target shape.

[0048] The outer diameter calculation processing unit 74 obtains the measured value DTam of the outer diameter of the first grinding wheel 3a based on the measured value R1m of the radius of curvature R1 of the upper arcuate surface Wc1 of the machined workpiece W measured by the measuring unit 6, the target processing dimension R1s of the radius of curvature R1 of the upper arcuate surface Wc1 stored in the memory device 72, and the outer diameter dimension DTa of the first grinding wheel 3a stored in the memory device 72.

[0049] In addition, the outer diameter calculation processing unit 74 obtains the measured value R2m of the radius of curvature R2 of the lower circular arc surface Wc2 of the machined workpiece W measured by the measuring unit 6, the target machining dimension R2s of the radius of curvature R2 of the lower circular arc surface Wc2 stored in the memory device 72, and the outer diameter dimension DTbm of the second grinding wheel 3b stored in the memory device 72.

[0050] When the outer diameter calculation processing unit 74 acquires the measured outer diameter values ​​DTam, DTbm of the grinding wheels 3a, 3b, the update processing unit 75 updates the outer diameter dimensions DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72 to the measured values ​​DTam, DTbm calculated by the outer diameter calculation processing unit 74, and stores the measured outer diameter values ​​DTam, DTbm of the grinding wheels 3a, 3b in the memory device 72 as the new outer diameter dimensions DTa, DTb of the grinding wheels 3a, 3b.

[0051] When the outer diameter dimensions DTa, DTb of the grinding wheels 3a, 3b are updated to the measured outer diameter values ​​DTam, DTbm of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74, the position determination processing unit 73 determines a first modified target trajectory obtained by modifying the first target trajectory and a second modified target trajectory obtained by modifying the second target trajectory based on the updated outer diameter dimensions DTam, DTbm of the grinding wheels 3a, 3b and the target machining dimensions of the workpiece W stored in the memory device 72.

[0052] Then, the update processing unit 75 updates the first target trajectory and the second target trajectory stored in the memory device 72 to the first modified target trajectory and the second modified target trajectory determined by the position determination processing unit 73, and stores the first modified target trajectory and the second modified target trajectory in the memory device 72 as new first target trajectory and second target trajectory.

[0053] (2) Operation of workpiece processing device 1 Next, a method for chamfering the workpiece W using the workpiece machining apparatus 1 will be described mainly with reference to the flow chart of Fig. 7. The following operations of the workpiece machining apparatus 1 are controlled by the control device 7.

[0054] First, in step S1, the carrying-in device 15 has the holding section 15a holding the unmachined workpiece W, and detects the outer diameter of the unmachined workpiece W, the center position of the workpiece W, and the positions of the orientation flat and notch by the alignment sensor 15b. Then, based on the detection result of the alignment sensor 15b, the carrying-in device 15 rotates the workpiece W so that the orientation flat and notch of the unmachined workpiece W are located at desired positions, and centers the workpiece W before placing it on the upper surface of the stage 21.

[0055] Next, in step S2, the workpiece machining device 1 chamfers the peripheral edge of the unmachined workpiece W placed on the stage 21 of the support unit 2 with the grindstones 3a and 3b.

[0056] Specifically, the grindstones 3a and 3b are rotated by the spindle motors 41a and 41b constituting the rotation drive unit 4. In addition, after the suction device 22 vacuum-adsorbs the unmachined workpiece W placed on the upper surface of the stage 21, the rotation device 23 rotates the workpiece W together with the stage 21.

[0057] Then, the stage moving device 51 and grindstone moving device 52 constituting the moving device 5 relatively move the support part 2 and the rotating shaft 42a of the spindle motor 41a along the first target trajectory, and the peripheral part of the upper flat surface side of the workpiece W is ground with the outer periphery of the rotating first grindstone 3a to perform chamfering. Also, the support part 2 and the rotating shaft 42b of the spindle motor 41b are relatively moved along the second target trajectory, and the peripheral part of the lower flat surface side of the workpiece W is ground with the outer periphery of the rotating second grindstone 3b to perform chamfering.

[0058] When the chamfering is completed, the unloading device 16 holds the workpiece W after the chamfering, and the cleaning device 10 and drying device 11 clean and dry the workpiece W and stage 21. Then, in step S3, the outer diameter measuring unit 61 and cross-section measuring unit 62 of the measuring unit 6 measure the outer diameter DW of the workpiece W after the chamfering, the radius of curvature R1 of the upper arcuate surface Wc1, the radius of curvature R2 of the lower arcuate surface Wc2, the chamfered widths A1, A2, the inclination angles θ1, θ2, and the vertical length B of the peripheral end surface Wb.

[0059] In addition, it is preferable to measure the dimensions of the machined workpiece W at multiple locations spaced apart in the circumferential direction of the workpiece W.

[0060] Next, in step S4, the outer diameter calculation processing unit 74 calculates the measurement values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b based on the dimensions of the machined workpiece W measured by the measuring unit 6 and the target machining dimensions using the following equations (1) and (2).

[0061] DTam = DTa + 2 × (R1s - R1m) Equation (1) DTbm=DTb+2×(R2s-R2m) Equation (2) In the above equations (1) and (2), DTa is the outer diameter of the first grinding wheel 3a stored in the memory device 72, DTb is the outer diameter of the second grinding wheel 3b stored in the memory device 72, R1m is the measured value of the radius of curvature R1 of the upper arcuate surface Wc1 provided on the machined workpiece W, R2m is the measured value of the radius of curvature R2 of the lower arcuate surface Wc2 provided on the machined workpiece W, R1s is the target machining dimension of the radius of curvature R1 of the upper arcuate surface Wc1 of the workpiece W stored in the memory device 72, and R2s is the target machining dimension of the radius of curvature R2 of the lower arcuate surface Wc2 of the workpiece W stored in the memory device 72.

[0062] In addition, in step S3, if the radius of curvature R1 of the upper arcuate surface Wc1 and the radius of curvature R2 of the lower arcuate surface Wc2 are measured at multiple locations on the workpiece W, the average value of the multiple measurement results may be used as the measured value R1m of the radius of curvature R1 of the upper arcuate surface Wc1 and the measured value R2m of the radius of curvature R2 of the lower arcuate surface Wc2.

[0063] Next, in step S5, the update processing unit 75 updates the outer diameter DTa of the first grinding wheel 3a stored in the memory device 72 to the measured value DTam of the outer diameter of the first grinding wheel 3a calculated by the outer diameter calculation processing unit 74, updates the outer diameter DTb of the second grinding wheel 3b stored in the memory device 72 to the measured value DTbm of the outer diameter of the second grinding wheel 3b calculated by the outer diameter calculation processing unit 74, and stores the measured values ​​DTam, DTbm in the memory device 72 as the new outer diameters of the grinding wheels 3a, 3b.

[0064] In other words, if the measured outer diameters DTam, DTbm of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74 are larger than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, the grinding wheels 3a, 3b have expanded due to the inclusion of grinding fluid, so in step S5, the update processing unit 75 updates the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72 to the measured outer diameters DTam, DTbm of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74.

[0065] In addition, if the measured outer diameters DTam, DTbm of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74 are smaller than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, this means that the grinding wheels 3a, 3b have become smaller due to wear, so in step S5, the update processing unit 75 updates the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72 to the measured outer diameters DTam, DTbm of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74, and stores the measured values ​​DTam, DTbm in the memory device 72 as the new outer diameters DTa, DTb of the grinding wheels 3a, 3b.

[0066] Next, in step S6, the position determination processing unit 73 determines a first modified target trajectory obtained by modifying the first target trajectory and a second modified target trajectory obtained by modifying the second target trajectory based on the outer diameters DTa, DTb of the grinding wheels 3a, 3b updated to the measurement values ​​DTam, DTbm, and the target machining dimensions of the outer diameter of the workpiece W stored in the memory device 72.

[0067] Next, in step S7, the update processing unit 75 updates the first target trajectory and the second target trajectory stored in the memory device 72 to the first modified target trajectory and the second modified target trajectory determined by the position determination processing unit 73, stores the first modified target trajectory and the second modified target trajectory in the memory device 72 as new first target trajectory and second target trajectory, and then terminates the current processing.

[0068] As a result, when the workpiece W is next chamfered, the workpiece W is ground by moving the support unit 2 and the rotational drive unit 4 relatively along the first modified target trajectory and the second modified target trajectory stored in the memory device 72 as new first target trajectory and second target trajectory.

[0069] The above-described series of steps S1 to S7 may be performed every time after the chamfering of the workpiece W is performed, or may be performed every time a predetermined number of workpieces W are chamfered.

[0070] (3) Manufacturing method of the workpiece machining device 1 Next, a manufacturing method for the above-mentioned workpiece machining device 1 will be described.

[0071] To manufacture the workpiece processing apparatus 1, first, as shown in Figure 1, the support unit 2, grinding wheels 3a, 3b, rotation drive unit 4, moving device 5, measuring unit 6, loading device 15 and unloading device 16 are provided, and the support unit 2, rotation drive unit 4, moving device 5, measuring unit 6, loading device 15 and unloading device 16 are controllably connected to a control device 7 to assemble the workpiece processing apparatus 1. After that, a provisional processing process, a measurement process, an outer diameter calculation process and an adjustment process are carried out in sequence to complete the workpiece processing apparatus 1.

[0072] In the preliminary machining process, the peripheral portion of the unmachined workpiece W, which has been centered and placed on the upper surface of the stage 21 of the support portion 2, is chamfered using grinding wheels 3a, 3b to form an arc-shaped curved surface on the peripheral portion of the workpiece W.

[0073] Specifically, the position determination processing unit 73 determines a target trajectory for provisional machining based on the target machining dimensions (provisional machining dimensions) for provisional machining, the initial setting values ​​DTa0, DTb0 of the outer diameters of the grinding wheels 3a, 3b, and the initial value L0 of the inter-axis distance L in the X direction from the rotation center of the stage 21 to the rotation axes 42a, 42b of the spindle motors 41a, 41b.

[0074] Then, the support part 2 and the rotary drive part 4 are moved relatively along the determined target trajectory for temporary machining by the moving device 5 while the rotary drive part 4 rotates the grinding wheels 3a, 3b, so that an upper arc-shaped surface Wc1 is formed on the peripheral edge of the upper flat surface W1 of the workpiece W by the first grinding wheel 3a, and a lower arc-shaped surface Wc2 is formed on the peripheral edge of the lower flat surface W2 of the workpiece W by the second grinding wheel 3b.

[0075] The shape formed on the peripheral edge of the workpiece W in the provisional machining step can be any shape having a circular arc surface that curves in an arc shape, and may be the same shape as the shape formed on the peripheral edge of the workpiece W by the workpiece machining device 1 after completion of the device 1. In this embodiment, the shape includes an upper inclined surface Wa1, an upper circular arc surface Wc1, a lower inclined surface Wa2, a lower circular arc surface Wc2, and a peripheral end surface Wb as exemplified in FIG.

[0076] In the measurement step, the outer diameter DW of the workpiece W formed in the provisional machining step, the radius of curvature R1 of the upper arcuate surface Wc1, and the radius of curvature R2 of the lower arcuate surface Wc2 are measured. The radii of curvature R1 and R2 may be measured by a measuring unit 6 provided in the workpiece machining device 1, or may be measured by a measuring unit provided separately from the workpiece machining device 1.

[0077] In the outer diameter calculation process, the measured outer diameters DTam, DTbm of the grinding wheels 3a, 3b are calculated based on the measured values ​​of the radii of curvature R1, R2 of the arcuate surfaces Wc1, Wc2 measured in the measurement process and the provisional machining dimensions of the radii of curvature R1, R2 of the arcuate surfaces Wc1, Wc2 using the following equations (3) and (4).

[0078] DTam=DTa0+2×(R1p-R1m) Equation (3) DTbm=DTb0+2×(R2p-R2m) Equation (4) In the above equations (3) and (4), DTa0 is the initial setting value of the outer diameter of the first grinding wheel 3a, DTb0 is the initial setting value of the outer diameter of the second grinding wheel 3b, R1m is the measured value of the radius of curvature R1 of the upper arcuate surface Wc1 obtained in the measurement process, R2m is the measured value of the radius of curvature R2 of the lower arcuate surface Wc2 obtained in the measurement process, R1p is the provisional machining dimension of the radius of curvature R2 of the upper arcuate surface Wc1, and R2p is the provisional machining dimension of the radius of curvature R2 of the lower arcuate surface Wc2.

[0079] In the outer diameter calculation process, after calculating the measurement values ​​DTam and DTbm of the outer diameter of the grinding wheels 3a and 3b, the initial value DTa0 of the outer diameter of the first grinding wheel 3a stored in the memory device 72 is updated to the measurement value DTa, the initial value DTb0 of the outer diameter of the second grinding wheel 3b is updated to the measurement value DTb, and the measurement values ​​DTa and DTb are stored in the memory device 72.

[0080] In the adjustment step, the position of at least one of the support part 2 and the rotation driver 4 is adjusted based on the measurement values ​​DTa, DTb of the outer diameters of the grinding wheels 3a, 3b updated in the outer diameter calculation step.

[0081] For example, in the adjustment process, a correction value ΔL of the inter-axis distance L in the X direction from the rotation center of the stage 21 to the rotation shafts 42a, 42b of the spindle motors 41a, 41b is calculated based on the following formula (5). TIFF0007626963000002.tif14127

[0082] In the above formula (5), L0 is the initial value of the inter-axis distance in the X direction from the rotation center of the stage 21 to the rotation shafts 42a, 42b of the spindle motors 41a, 41b, DWm is the outer diameter of the provisionally machined workpiece W measured in the measurement process, DTam is the outer diameter of the first grinding wheel 3a calculated in the outer diameter calculation process, and φ1 is the circumferential angle of the workpiece W at the position where the first grinding wheel 3a contacts the workpiece W relative to the X direction in which the stage moving device 51 moves the stage 21.

[0083] When the correction value ΔL of the initial value L0 of the centerline distance L is calculated, the initial value L0 of the centerline distance L is adjusted based on this correction value ΔL. Then, the adjusted centerline distance L is stored in the storage device 72, and the manufacture of the workpiece processing device 1 is completed.

[0084] After performing the adjustment process as described above, a provisional machining process, a measurement process, an outer diameter calculation process, and an adjustment process may be performed based on the adjusted centerline distance L, and the provisional machining process through the adjustment process may be repeatedly performed until the adjusted centerline distance L satisfies a predetermined condition.

[0085] (4) Effects In this embodiment, the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72 are updated to the measured outer diameter values ​​DTam, DTbm of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74, and the first target trajectory and the second target trajectory are corrected based on the measured outer diameter values ​​DTam, DTbm of the grinding wheels 3a, 3b, so that the peripheral portion of the workpiece can be precisely machined into the desired shape.

[0086] In this embodiment, if the measured outer diameters DTam, DTbm of the grinding wheels 3a, 3b are larger than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, the update processing unit 75 updates the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72 to the measured outer diameters DTam, DTbm of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74, so that the peripheral portion of the workpiece can be precisely machined into the desired shape even if the grinding wheels 3a, 3b expand.

[0087] In this embodiment, the measured values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b are obtained based on the measured values ​​R1m, R2m of the radii of curvature of the arcuate surfaces Wc1, Wc2 provided on the machined workpiece W, so that the measured values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b can be obtained accurately.

[0088] That is, the radii of curvature of the arcuate surfaces Wc1, Wc2 formed by the grindstones 3a, 3b change due to the change in the outer diameter of the grindstones 3a, 3b, but are not affected by an error in the relative position of the support unit 2 and the rotation drive unit 4 (that is, an error in the inter-axis distance from the rotation center of the stage 21 of the support unit 2 to the rotation axis of the grindstones 3a, 3b). Therefore, by obtaining the outer diameter of the grindstones 3a, 3b based on the measured values ​​of the radii of curvature of the arcuate surfaces Wc1, Wc2 formed by the grindstones 3a, 3b, the outer diameter of the grindstones 3a, 3b can be obtained with high accuracy, and as a result, the peripheral portion of the workpiece can be machined into a target shape with high accuracy.

[0089] In this embodiment, the outer diameter of the first grinding wheel 3a which grinds the peripheral portion of the upper plane W1 of the workpiece W and the outer diameter of the second grinding wheel 3b which grinds the peripheral portion of the lower plane W2 are obtained separately, and the target trajectories of the first grinding wheel 3a and the second grinding wheel 3b are corrected based on the obtained outer diameters, so that the upper plane W1 and the lower plane W2 can be precisely machined into the desired shape.

[0090] In addition, in this embodiment, when manufacturing the workpiece machining device 1, after assembling the workpiece machining device 1, the above-mentioned provisional machining process, measurement process, outer diameter calculation process, and adjustment process are sequentially performed, so that the axis distance L stored in the memory device 72 can be made close to the true value from the rotation center of the stage 21 to the rotation shafts 42a, 42b of the spindle motors 41a, 41b. Since the change over time of the device setting value such as the axis distance L is extremely small compared to the outer diameter of the grindstones 3a, 3b, by making the axis distance L close to the true value in advance, it is guaranteed that the error caused by the subsequent machining is due to the change in the diameter of the grindstone. Therefore, the workpiece machining device 1 manufactured by the manufacturing method of this embodiment can accurately adjust the positions of the support part 2 and the rotation drive part 4 based on the outer diameter of the grindstones 3a, 3b.

[0091] (5) Example of changes Although the embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope of the invention and its equivalents as well as in the scope and gist of the invention. Modifications are described below. Note that any one of the multiple modification examples described below may be applied to the above embodiment, or any two or more of the modification examples described below may be applied in combination. Note that various modifications other than the following modification examples are possible.

[0092] (5-1) Change example 1 In the above embodiment, the measurement values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b were obtained based on the measurement values ​​R1m, R2m of the radii of curvature of the arcuate surfaces Wc1, Wc2 provided on the machined workpiece W, but the measurement values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b may also be obtained based on the outer diameter of the machined workpiece W.

[0093] For example, the outer diameter calculation processing unit 74 calculates the actual measured values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b from the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, the actual measured value DWm of the outer diameter of the machined workpiece W measured by the measuring unit 6, and the target machining dimension DWs of the outer diameter of the workpiece W stored in the memory device 72, for example, using the following equations (6) and (7).

[0094] DTam=DTa+(DWs-DWm) Equation (1) DTbm = DTb + (DWs - DWm) Equation (2) In this modified example 1, the measurement values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b can be obtained based on the outer diameter of the machined workpiece W, which is easy to measure, so that the workpiece machining apparatus 1 can be manufactured with a simple configuration.

[0095] (5-2) Change example 2 When the dimensions of the machined workpiece W are measured at multiple locations spaced apart around the circumference of the workpiece W, if the deviation between the multiple measurement results is less than a predetermined value, the outer diameter of the grinding wheels 3a, 3b may be calculated using the dimensions of the machined workpiece W, and if the deviation between the multiple measurement results is greater than the predetermined value, the outer diameter of the grinding wheels 3a, 3b may not be calculated and an abnormality may be reported.

[0096] In this modified example, abnormalities other than changes in the outer diameter of the grinding wheels 3a, 3b can be detected, such as when the deviation between multiple measurement results is greater than a predetermined value or when the center of the workpiece W and the center of rotation of the stage 21 are misaligned.

[0097] (5-3) Change example 3 During the period from the start of chamfering processing of the workpiece W to the time when a predetermined number of workpieces W have been processed, or during the period from the start of chamfering processing of the workpiece W to the time when a predetermined time (e.g., 24 hours) has elapsed since the start of chamfering processing of the workpiece W, if the measurement values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74 are larger than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, the update processing unit 75 may update the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72 to the measurement values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74.

[0098] Furthermore, during the period from the start of chamfering processing of the workpiece W to the processing of a predetermined number of workpieces W, or during the period from the start of chamfering processing of the workpiece W to the elapse of a predetermined time (e.g., 24 hours) after the start of chamfering processing of the workpiece W, if the measurement values ​​DTam, DTbm are smaller than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, it is not necessary to update the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72.

[0099] For a while after the start of chamfering of the workpiece W, the grinding wheels 3a and 3b are more likely to expand due to the incorporation of grinding fluid than due to the influence of wear. In this modified example, if the measured values ​​DTam and DTbm of the outer diameters of the grinding wheels 3a and 3b are larger than the outer diameters DTa and DTb of the grinding wheels 3a and 3b stored in the storage device 72 for a while after the start of chamfering of the workpiece W, the outer diameters of the grinding wheels 3a and 3b may be updated. Also, if the measured values ​​DTam and DTbm of the outer diameters of the grinding wheels 3a and 3b are smaller than the outer diameters DTa and DTb of the grinding wheels 3a and 3b, it is possible that the cause is other than the change in the outer diameter of the grinding wheels 3a and 3b, such as the relative positions of the support unit 2 and the rotation drive unit 4, and therefore the outer diameters DTa and DTb of the grinding wheels 3a and 3b do not need to be updated.

[0100] (5-4) Change Example 4 After a predetermined number of workpieces W have been processed since the start of chamfering processing of the workpiece W, or after a predetermined time has elapsed since the start of chamfering processing of the workpiece W, if the measurement values ​​DTam, DTbm of the outer diameter of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74 are smaller than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, the update processing unit 75 updates the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72 to the measurement values ​​DTam, DTbm of the outer diameter of the grinding wheels 3a, 3b calculated by the outer diameter calculation processing unit 74.

[0101] Furthermore, after a predetermined number of workpieces W have been processed since the start of chamfering processing of the workpiece W, or after a predetermined time has elapsed since the start of chamfering processing of the workpiece W, if the measurement values ​​DTam, DTbm are larger than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72, it is not necessary to update the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the memory device 72.

[0102] When the time required for chamfering the workpiece W becomes longer, the influence of wear becomes greater than the expansion of the grinding wheels 3a, 3b. In this modified example, when a predetermined number of workpieces W are chamfered or a predetermined time has elapsed since the start of chamfering, if the measured values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b are smaller than the outer diameters DTa, DTb of the grinding wheels 3a, 3b stored in the storage device 72, the outer diameters of the grinding wheels 3a, 3b are updated. Also, if the measured values ​​DTam, DTbm of the outer diameters of the grinding wheels 3a, 3b are larger than the outer diameters DTa, DTb of the grinding wheels 3a, 3b, it is possible to consider that there is a cause other than the change in the outer diameter of the grinding wheels 3a, 3b, such as the relative positions of the support unit 2 and the rotation drive unit 4, and therefore it is not necessary to update the outer diameters DTa, DTb of the grinding wheels 3a, 3b.

[0103] (5-5) Change example 5 In the above embodiment, the manufacturing method of the workpiece machining device 1 equipped with the measuring unit 6 has been described, but the above manufacturing method may be applied to a workpiece machining device not equipped with the measuring unit 6. [Explanation of symbols]

[0104] 1...workpiece machining device, 2...support unit, 3...grinding wheel, 4...rotation drive unit, 5...moving device, 6...measuring unit, 7...control device, 15...loading device, 15a...holding unit, 15b...alignment sensor, 16...unloading device, 21...stage, 22...suction device, 23...rotating device, 41a...spindle motor, 41b...spindle motor, 42a...rotating shaft, 42b...rotating shaft, 51...stage moving device, 52...grinding wheel moving device, 53...first grinding wheel moving device, 54a...second grinding wheel moving device, 54b...second grinding wheel moving device, 61...diameter measuring unit, 62...cross-section measuring unit, 71...processing device, 72...storage device, 73...position determination processing unit, 74...outer diameter calculation processing unit, 75...update processing unit

Claims

1. A support portion that supports a plate-shaped workpiece; A disk-shaped grinding wheel for grinding the peripheral portion of the workpiece; A rotation drive unit that rotates the grindstone while supporting it; a moving device that moves the support unit and the rotation drive unit relatively; A measuring unit that measures the dimensions of the machined workpiece; A storage device that stores a target machining dimension of the workpiece and an outer diameter of the grinding wheel; a control unit that controls the rotation drive unit and the moving device, The control unit is a position determination process for determining a target trajectory of the rotation drive unit relative to the support unit during machining of the workpiece, based on the target machining dimensions of the workpiece and the outer diameter of the grindstone stored in the storage device; a processing process in which the support unit and the rotary drive unit are moved relatively along the target trajectory by the moving device while the rotary drive unit is rotated by the grindstone, and a peripheral portion of the workpiece is processed by the outer periphery of the grindstone; an outer diameter calculation process for calculating an outer diameter of the grinding wheel based on the dimensions of the machined workpiece measured by the measuring unit and the target machining dimensions; An update process for updating the outer diameter of the grindstone stored in the storage device to the outer diameter of the grindstone calculated by the outer diameter calculation process.

2. 2 . The workpiece machining device according to claim 1 , wherein the outer diameter calculation process calculates the outer diameter of the grinding wheel based on the outer diameter of the machined workpiece measured by the measuring unit and the target machining dimension of the outer diameter of the workpiece.

3. The processing step includes processing the peripheral portion of the workpiece with the outer periphery of the grindstone to form an arcuate surface on the peripheral portion of the workpiece that is curved in an arc shape and has a thickness that becomes thinner as it approaches the peripheral portion of the workpiece, 2. The workpiece machining device according to claim 1, wherein the outer diameter calculation process calculates the outer diameter of the grinding wheel based on the radius of curvature of the arcuate surface of the machined workpiece measured by the measuring unit and the target machining dimension of the radius of curvature of the arcuate surface.

4. The grinding wheel includes a first grinding wheel that grinds a peripheral portion of one surface of the workpiece to form a first arcuate surface that is curved in an arc shape and whose thickness becomes thinner as it approaches the peripheral portion of the workpiece, and a second grinding wheel that grinds a peripheral portion of the other surface of the workpiece to form a second arcuate surface that is curved in an arc shape and whose thickness becomes thinner as it approaches the peripheral portion of the workpiece, The outer diameter calculation process includes: Calculating an outer diameter of the first grinding wheel based on the target machining dimension of the radius of curvature of the first arcuate surface and the radius of curvature of the first arcuate surface of the machined workpiece measured by the measuring unit; Calculating an outer diameter of the second grinding wheel based on the target machining dimension of the radius of curvature of the second arcuate surface and the radius of curvature of the second arcuate surface of the machined workpiece measured by the measuring unit; The update process includes: updating the outer diameter of the first grinding wheel stored in the storage device to the outer diameter of the first grinding wheel calculated by the outer diameter calculation process; updating the outer diameter of the second grinding wheel stored in the storage device to the outer diameter of the second grinding wheel calculated by the outer diameter calculation process; The workpiece machining device according to claim 3.

5. A workpiece machining device described in any one of claims 1 to 4, wherein when the outer diameter of the grinding wheel calculated by the outer diameter calculation process is larger than the outer diameter of the grinding wheel stored in the memory device, the update process updates the outer diameter of the grinding wheel stored in the memory device to the outer diameter of the grinding wheel calculated by the outer diameter calculation process.

6. A support portion that supports a plate-shaped workpiece; A disk-shaped grinding wheel for grinding the peripheral portion of the workpiece; A rotation drive unit that rotates the grindstone while supporting it; a moving device that moves the support unit and the rotation drive unit relatively; A storage device that stores a target machining dimension of the workpiece and an outer diameter of the grinding wheel; a control unit that controls the rotation drive unit and the moving device, The control unit is a position determination process for determining a target trajectory of the rotation drive unit relative to the support unit during machining of the workpiece, based on the target machining dimensions of the workpiece and the outer diameter of the grindstone stored in the storage device; a processing process in which the support unit and the rotary drive unit are moved relatively along the target trajectory by the moving device while the rotary drive unit is rotated by the grindstone, and a peripheral portion of the workpiece is processed by the outer periphery of the grindstone; A method for manufacturing a workpiece machining device that performs the steps of: a provisional machining process for determining a target trajectory for provisional machining based on provisional machining dimensions, which are target machining dimensions for provisional machining, and an initial set value of an outer diameter of the grindstone, and rotating the grindstone with the rotary drive unit while relatively moving the support unit and the rotary drive unit by the moving device along the determined target trajectory for provisional machining, thereby forming an arcuate surface curved in an arc shape on the peripheral portion of the workpiece; a measuring step of measuring a radius of curvature of the arcuate surface formed in the provisional machining step; an outer diameter calculation step of calculating an outer diameter of the grindstone based on a measured value of the radius of curvature of the arcuate surface measured in the measurement step and the provisional machining dimension of the radius of curvature of the arcuate surface, and updating the outer diameter of the grindstone stored in the storage device to the calculated outer diameter of the grindstone; an adjustment step of adjusting a position of at least one of the support unit and the rotation drive unit based on the outer diameter of the grindstone calculated in the outer diameter calculation step; A method for manufacturing a workpiece machining device comprising:

Citation Information

Patent Citations

  • Grinding wheel diameter measuring device in grinding machine

    JP2001038619A

  • Wafer chamfering processing method and wafer chamfering apparatus

    JP2014117782A

  • Dressing method and grinding method for workpiece

    JP2018024051A

  • Grinder device

    JP2018069341A

  • Grinding device

    JP2019034390A

Cited By

  • Processing equipment

    JP7769281B1