Apparatus and method for estimating cause of error

Abstract

To provide an error cause estimation device capable of guiding a specific object that causes a work error, and an error cause estimation method.SOLUTION: An error cause estimation device comprises a storage unit, an extraction unit, and a guide unit. Regarding a plurality of work errors occurring in a substrate work of a substrate work machine which performs a predetermined substrate work on a substrate, the storage unit stores an evaluation object, which is at least one of a use apparatus used for the substrate work and use data used for the substrate work, and an error code indicating the type of the work error in an associated manner. On the basis of the plurality of work errors stored by the storage unit, the extraction unit extracts a specific object which is the evaluation object causing the work error. The guide unit guides the specific object extracted by the extraction unit together with the error code associated with the specific object and the type of the substrate work in which the work error occurs.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] This specification discloses techniques relating to an error cause estimating device and an error cause estimating method. [Background technology]

[0002] The arithmetic device described in Patent Document 1 includes a storage unit and a control unit. The storage unit stores device operation information and abnormality history information. The device operation information specifies the number of operations of a first component and a second component used when mounting components on a board for each combination of the first component and the second component. The abnormality history information specifies the number of abnormalities that have occurred in the first component and the second component when mounting components on a board for each combination of the first component and the second component. The control unit compares the variance value of the first component with a high abnormality occurrence rate with the variance value of the second component with a high abnormality occurrence rate, and determines that the type to which the component with the smaller value belongs is highly likely to be the cause of the abnormality. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-238689 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the arithmetic device described in Patent Document 1 cannot provide appropriate guidance on the specific object that caused the work error.

[0005] In consideration of the above circumstances, this specification discloses an error cause estimation device and an error cause estimation method that can guide a specific object that caused a work error. [Means for solving the problem]

[0006] This specification discloses an error cause estimation device including a storage unit, an extraction unit, and a guidance unit. The storage unit stores, for a plurality of work errors occurring in a substrate-related work performed by a substrate-related work machine performing a predetermined substrate-related work on a substrate, an evaluation target, which is at least one of a device used in the substrate-related work and usage data used in the substrate-related work, in association with an error code indicating the type of the work error. The extraction unit extracts a specific target, which is the evaluation target that caused the work error, based on the plurality of work errors stored by the storage unit. The guidance unit provides guidance for the specific target extracted by the extraction unit together with an error code associated with the specific target and the type of the substrate-related work in which the work error occurred.

[0007] This specification also discloses an error cause estimation method including a storage step, an extraction step, and a guidance step. The storage step stores an evaluation object, which is at least one of the equipment used in the substrate-related operation and the usage data used in the substrate-related operation, associated with an error code indicating the type of the operation error for a plurality of operation errors that occurred in the substrate-related operation of a substrate-related operation machine that performs a predetermined substrate-related operation on a substrate, in association with the error code indicating the type of the operation error. The extraction step extracts a specific object, which is the evaluation object that caused the operation error, based on the plurality of operation errors stored by the storage step. The guidance step provides guidance for the specific object extracted by the extraction step together with the error code associated with the specific object and the type of the substrate-related operation in which the operation error occurred. Effect of the Invention

[0008] According to the above error cause estimating device, it is possible to inform a specific object that caused an operation error together with an error code associated with the specific object and the type of substrate-related operation that caused the operation error. The above description of the error cause estimating device also applies to the error cause estimating method. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram showing a configuration example of a substrate-related work line; [Diagram 2] FIG. 2 is a plan view showing a configuration example of a component mounting machine. [Diagram 3] FIG. 2 is a schematic diagram showing an example of a device used and usage data. [Figure 4] FIG. 2 is a block diagram showing an example of a control block of the error cause estimating device. [Diagram 5] 4 is a flowchart showing an example of a control procedure performed by the error cause estimation device. [Figure 6] 11 is a schematic diagram showing an example of a state in which an error code, a device used, and usage data are associated with each other and stored in a storage device. FIG. [Figure 7] 10 is a schematic diagram showing an example of evaluation values ​​of an error occurrence state for a feeder which is a first type evaluation object and a holding member (suction nozzle) which is a second type evaluation object. FIG. [Figure 8] 11A and 11B are schematic diagrams showing an example of guidance by a guidance unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] 1. Embodiment 1-1. Example of circuit board work line WL0 configuration In the substrate-related work line WL0, a predetermined substrate-related work is performed on the substrate 90. The type and number of substrate-related work machines WM0 constituting the substrate-related work line WL0 are not limited. As shown in Fig. 1, the substrate-related work line WL0 in this embodiment is equipped with a plurality (five) of substrate-related work machines WM0, including a printer WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0011] The printer WM1 prints solder at mounting positions of the multiple components 91 on the board 90. The print inspection machine WM2 inspects the printing condition of the solder printed by the printer WM1. As shown in FIG. 2, the component mounting machine WM3 mounts the multiple components 91 on the board 90 on which the solder has been printed by the printer WM1. There may be one component mounting machine WM3 or multiple component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the task of mounting the multiple components 91.

[0012] The reflow furnace WM4 heats the board 90 on which a plurality of components 91 have been mounted by the component mounting machine WM3, melts the solder, and performs soldering. The appearance inspection machine WM5 inspects the mounting state of the plurality of components 91 mounted by the component mounting machine WM3. In this manner, the board-related work line WL0 uses a plurality (five) of board-related work machines WM0 to transport the boards 90 in sequence and perform production processing including inspection processing to produce board products 900. The board-related work line WL0 can also include board-related work machines WM0 such as a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive application device, and an ultraviolet ray irradiation device, as necessary.

[0013] The plurality of (five) substrate-related performing machines WM0 and the line management device LC0 that make up the substrate-related performing line WL0 are communicatively connected by a communication unit. The line management device LC0 and the management device HC0 are communicatively connected by a communication unit. The communication unit can communicatively connect them by wire or wirelessly, and various communication methods can be used.

[0014] In this embodiment, a local area network (LAN) is configured by the multiple (five) substrate-related performing machines WM0, the line management device LC0, and the management device HC0. Therefore, the multiple (five) substrate-related performing machines WM0 can communicate with each other via the communication unit. Also, the multiple (five) substrate-related performing machines WM0 can communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

[0015] The line management device LC0 controls the multiple (five) substrate-related performing machines WM0 that make up the substrate-related performing line WL0, and monitors the operating status of the substrate-related performing line WL0. The line management device LC0 stores various control data for controlling the multiple (five) substrate-related performing machines WM0. The line management device LC0 transmits control data to each of the multiple (five) substrate-related performing machines WM0. In addition, each of the multiple (five) substrate-related performing machines WM0 transmits its operating status and production status to the line management device LC0.

[0016] The management device HC0 manages at least one line management device LC0. For example, the operating status and production status of the substrate-related performing operation machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary. The management device HC0 is provided with a storage device DS0. The storage device DS0 can store various acquired data acquired by the substrate-related performing operation machine WM0. For example, various image data captured by the substrate-related performing operation machine WM0 is included in the acquired data. Records (log data) of the operating status acquired by the substrate-related performing operation machine WM0 are included in the acquired data. The storage device DS0 can also store various production information related to the production of the board products 900.

[0017] 1-2. Example of component placement machine WM3 configuration The component mounting machine WM3 mounts a plurality of components 91 on a board 90. As shown in FIG 2, the component mounting machine WM3 includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15 and a control device 16.

[0018] The board transport device 11 is, for example, configured with a belt conveyor or the like, and transports the board 90 in a transport direction (X-axis direction). The board 90 is a circuit board on which electronic circuits, electric circuits, magnetic circuits, etc. are formed. The board transport device 11 transports the board 90 into the component mounting machine WM3, and positions the board 90 at a predetermined position within the machine. After the component mounting machine WM3 has completed the mounting process of the multiple components 91, the board transport device 11 transports the board 90 out of the component mounting machine WM3.

[0019] The component supplying device 12 supplies a plurality of components 91 to be mounted on the board 90. The component supplying device 12 includes a plurality of feeders 121 arranged along the transport direction (X-axis direction) of the board 90. As shown in FIG. 3, each of the plurality of feeders 121 is equipped with a reel RL0. A carrier tape CT0 storing a plurality of components 91 is wound around the reel RL0. The feeder 121 feeds the carrier tape CT0 by a pitch to supply the components 91 so that they can be picked up at a supply position PU0 located at the tip side of the feeder 121. The component supplying device 12 can also supply electronic components (e.g., lead components) that are relatively large compared to chip components and the like, in a state where they are arranged on a tray.

[0020] The component transfer device 13 includes a head driving device 131 and a moving table 132. The head driving device 131 is configured to be able to move the moving table 132 in the X-axis direction and the Y-axis direction by a linear motion mechanism. The mounting head 20 is detachably (replaceably) attached to the moving table 132 by a clamp member. The mounting head 20 uses at least one holding member 30 to pick up and hold a component 91 supplied by the component supply device 12, and mounts the component 91 on the board 90 positioned by the board transport device 11. The holding member 30 can be, for example, a suction nozzle, a chuck, or the like.

[0021] The component camera 14 and the board camera 15 may be made of a known imaging device. The component camera 14 is fixed to a base of the component mounting machine WM3 so that the optical axis faces upward in the vertical direction (Z-axis direction). The component camera 14 can image the component 91 held by the holding member 30 from below. The board camera 15 is provided on a moving stage 132 of the component transfer device 13 so that the optical axis faces downward in the vertical direction (Z-axis direction). The board camera 15 can image the board 90 from above. The component camera 14 and the board camera 15 capture images based on a control signal sent from the control device 16. Image data of the captured images captured by the component camera 14 and the board camera 15 are transmitted to the control device 16.

[0022] The control device 16 includes a known arithmetic unit and a storage device, and constitutes a control circuit. Information output from various sensors provided in the component mounting machine WM3, image data, etc. are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions that are set in advance.

[0023] For example, the control device 16 causes the board camera 15 to capture an image of the board 90 positioned by the board transport device 11. The control device 16 processes the image captured by the board camera 15 to recognize the positioning state of the board 90. The control device 16 also causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 91 held by the holding member 30. As shown in Fig. 3, the control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the component 91.

[0024] The control device 16 moves the holding member 30 toward above the intended mounting position that is set in advance by a control program or the like. The control device 16 also corrects the intended mounting position based on the positioning state of the board 90, the holding attitude of the component 91, and the like, and sets the mounting position where the component 91 is actually mounted. The intended mounting position and the mounting position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

[0025] The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the holding member 30 according to the mounting position. The control device 16 lowers the holding member 30 at the corrected rotation angle in the corrected target position to mount the component 91 on the board 90. The control device 16 repeats the above pick-and-place cycle to execute the mounting process of mounting a plurality of components 91 on the board 90.

[0026] 1-3. Example of configuration of error cause estimation device 70 As shown in Fig. 3, for example, various devices and data are used from when components 91 are supplied from feeder 121 of component supply device 12, when holding member 30 picks up components 91 supplied from feeder 121, until when components 91 are mounted on board 90. If an error occurs in these operations due to a malfunction of a specific device, the more devices involved, the more difficult it becomes to identify the device that caused the operation error. The same can be said about data, and also about other operations involving boards.

[0027] Therefore, the substrate-related work line WL0 of this embodiment is provided with an error cause estimation device 70. The error cause estimation device 70 extracts a specific object ST0 that caused a work error from the evaluation object ET0. The error cause estimation device 70 can be provided in various computing devices. For example, the error cause estimation device 70 can be provided in an analysis device, a line management device LC0, a management device HC0, a control device 16 of a component mounting machine WM3, etc. The error cause estimation device 70 can also be formed on a cloud. As shown in FIG. 4, the error cause estimation device 70 of this embodiment is provided in the management device HC0.

[0028] When considered as a control block, the error cause estimation device 70 includes a memory unit 71, a counting unit 72, and an extraction unit 73. The error cause estimation device 70 can also include a first determination unit 74 and a second determination unit 75. The error cause estimation device 70 can also include a guidance unit 76. As shown in FIG. 4, the error cause estimation device 70 of this embodiment includes a memory unit 71, a counting unit 72, an extraction unit 73, a first determination unit 74, a second determination unit 75, and a guidance unit 76.

[0029] Moreover, the error cause estimation device 70 of this embodiment executes control according to the flowchart shown in Fig. 5. The storage unit 71 performs the process shown in step S11. The aggregation unit 72 performs the process shown in step S12. The extraction unit 73, the first judgment unit 74, and the second judgment unit 75 perform the process shown in step S13. The guidance unit 76 performs the process shown in step S14.

[0030] 1-3-1. Storage section 71 The memory unit 71 associates the evaluation object ET0 and the error code EC0 and stores them in the storage device DS0 (step S11 shown in FIG. 5). The evaluation object ET0 refers to at least one of the equipment used UM0 and the usage data UD0. The equipment used UM0 refers to the equipment used in the substrate-related operation of the substrate-related operation machine WM0. The usage data UD0 refers to the data used in the substrate-related operation of the substrate-related operation machine WM0. The error code EC0 refers to an operation error in the substrate-related operation using the evaluation object ET0.

[0031] For example, the substrate-related operation machine WM0 includes a component mounting machine WM3 that mounts components 91 on a substrate 90. In this case, as described above, the substrate-related operation includes at least one of a supply operation of supplying components 91 from the component supply device 12, a picking operation of picking up the components 91 supplied from the component supply device 12, and a mounting operation of mounting the components 91 on the substrate 90. Also, as shown in FIG. 3, for example, the equipment used UM0 includes a reel RL0, a feeder 121, a mounting head 20, a holding member 30, a component camera 14, and the like. The reel RL0 and the feeder 121 are involved in the supply operation of the components 91. The mounting head 20, the holding member 30, and the component camera 14 are involved in the picking operation and the mounting operation of the components 91.

[0032] The usage data UD0 includes part data including shape data, arrangement data, coordinate data, etc. The part data specifies the properties and handling conditions of the part 91. Specifically, the part data specifies properties such as the electrical characteristic values ​​of the part 91, their errors, and the conditions of the usage environment, as well as the packaging form and storage conditions. The part data also specifies handling conditions such as the specifications of the reel RL0, the feeder 121 used, the type of holding member 30, the moving speed of the mounting head 20, and the lifting and lowering speed of the holding member 30. Furthermore, the part data includes shape data.

[0033] The shape data specifies the external shape of the component 91. Specifically, the shape data specifies, for example, the size (length, width, and height) of the component 91, the size tolerance, the position of the leads, and the external color. The shape data may also specify the imaging conditions and lighting conditions when the component camera 14 images the component 91 held by the holding member 30. The component mounting machine WM3 processes the image data of the component 91 captured by the component camera 14 and compares it with the external shape specified in the shape data to determine whether the component 91 is held by the holding member 30, whether the type is incorrect, and the like. Similarly, the component mounting machine WM3 obtains the holding attitude, such as the position and rotation angle, of the component 91 relative to the holding member 30.

[0034] The arrangement data specifies the slot positions of the pallet member in which the multiple feeders 121 are arranged. The coordinate data specifies the positions of the board 90 on which the components 91 are to be mounted. These usage data UD0 are stored in the storage device DS0 shown in Figures 1 and 4. The control device 16 of the component mounting machine WM3 can acquire and use these data together with, for example, a control program. The component data and arrangement data are involved in the supplying operation of the components 91. The component data and coordinate data are involved in the picking and mounting operations of the components 91.

[0035] As described above, the operation errors in the supplying and picking operations of the components 91 are judged based on the image of the components 91 captured by the component camera 14. Similarly, the operation errors in the mounting operation of the components 91 are judged based on the image of the board 90 captured by the board camera 15. In either case, the component mounting machine WM3 can judge the acceptability of the board-to-board operation based on whether or not the measurement value of the object extracted from the image is within the allowable range. The acceptability of the board-to-board operation can also be judged by another board-to-board operation machine WM0. For example, the appearance inspection machine WM5 can judge the acceptability of the board-to-board operation by the component mounting machine WM3.

[0036] An error code EC0 is assigned for each type of work error. The error code EC0 may take various forms as long as it can identify work errors in substrate-related work. As shown in FIG. 6, the error code EC0 in this embodiment is expressed, for example, as a character string (alphanumeric characters). The memory unit 71 associates the evaluation object ET0 and the error code EC0 and stores them in the memory device DS0. Specifically, the memory unit 71 associates an identification code that identifies the evaluation object ET0 with the error code EC0 and stores them in the memory device DS0.

[0037] The memory unit 71 sequentially stores the evaluation object ET0 and the error code EC0 in the memory device DS0 when a work error occurs. The memory unit 71 can also store a predetermined number of evaluation objects ET0 and error codes EC0 in the memory device DS0 when a predetermined number of work errors occur. If the substrate-related work machine WM0 performs a substrate-related work but no work error occurs, the memory unit 71 stores only the evaluation object ET0 in the memory device DS0.

[0038] 6 shows an example of a state in which an error code EC0, a device used UM0, and usage data UD0 are associated and stored in a storage device DS0. For example, an operation error in a substrate-related operation using a device used UM1, a device used UM2, and usage data UD1 is indicated by an error code EC0001. The same can be said for error codes EC0170, EC0174, and EC0728.

[0039] 1-3-2. Tabulation section 72 The tallying unit 72 tallies up the evaluation values ​​EV0 of the error occurrence status for the multiple types of evaluation objects ET0 stored in the storage device DS0 for each error code EC0 (step S12 shown in FIG. 5). The evaluation value EV0 is not limited as long as it can evaluate the error occurrence status.

[0040] For example, the evaluation value EV0 of the error occurrence situation can be expressed by a combination of the number of times the evaluation object ET0 was used in a substrate-related operation and the number of times an operation error occurred. For example, for the error code EC0001 shown in Fig. 6, the counting unit 72 counts the number of times the evaluation object ET0 was used in a substrate-related operation and the number of times an operation error occurred for each of the used equipment UM1, the used equipment UM2, and the usage data UD1. When the same error code EC0001 is stored in the storage device DS0, the counting unit 72 counts the evaluation value EV0 in the same manner.

[0041] It should be noted that the greater the number of error codes EC0 stored in the storage device DS0, the more frequently work errors occur. Therefore, the aggregation unit 72 can also generate a ranking of the error codes EC0 stored in the storage device DS0. This allows the extraction unit 73 to extract the specific target ST0 from the error codes EC0 with the highest rankings.

[0042] Also, for example, error code EC0170 and error code EC0174 shown in Fig. 6 differ only in the lowest digit. Error code EC0 is often assigned sequentially to related work errors, and grouping similar error codes EC0 (for example, when only the lowest digit is different) makes it easier to count evaluation values ​​EV0. Therefore, the counting unit 72 may group similar error codes EC0 and count the evaluation values ​​EV0 of the error occurrence situations.

[0043] For example, when the error code EC0170 and the error code EC0174 shown in Fig. 6 are grouped, a new error code EC017X is assigned. The counting unit 72 counts the evaluation object ET0 associated with the error code EC0170 and the evaluation object ET0 associated with the error code EC0174 together to calculate the evaluation value EV0 of the error occurrence situation.

[0044] In addition, grouping error codes EC0 that require the same or similar countermeasures to improve work errors makes it easier to implement the countermeasures. Therefore, the counting unit 72 can group error codes EC0 that require the same or similar countermeasures to improve work errors, and count the evaluation values ​​EV0 of the error occurrence situations.

[0045] Furthermore, there are many cases where the countermeasures to improve related work errors that are assigned similar error codes EC0 are the same or similar. Therefore, the counting unit 72 can group error codes EC0 that have similar error codes EC0 and that have the same or similar countermeasures to improve the work errors, and count the evaluation values ​​EV0 of the error occurrence situations.

[0046] 1-3-3. Extraction unit 73, first judgment unit 74, and second judgment unit 75 The extraction unit 73 extracts a specific object ST0, which is the evaluation object ET0 that caused the work error, based on the significant difference in the evaluation value EV0 of the error occurrence situation between multiple types of evaluation objects ET0 aggregated for each error code EC0 (step S13 shown in Figure 5).

[0047] Here, one type of evaluation target ET0 selected from the multiple types of evaluation targets ET0 stored in association with one error code EC0 is defined as a first type evaluation target ET1, and one type of evaluation target ET0 different from the first type evaluation target ET1 is defined as a second type evaluation target ET2. At this time, the first determination unit 74 determines whether or not there is a significant difference in the evaluation value EV0 of the error occurrence situation for the multiple evaluation targets ET0 included in the second type evaluation target ET2 based on one evaluation target ET0 included in the first type evaluation target ET1, for each of the multiple evaluation targets ET0 included in the first type evaluation target ET1.

[0048] The second determination unit 75 determines whether or not there is a significant difference in the evaluation value EV0 of the error occurrence situation for each of the multiple evaluation targets ET0 included in the first type evaluation target ET1 using one evaluation target ET0 included in the second type evaluation target ET2 as a reference, for each of the multiple evaluation targets ET0 included in the second type evaluation target ET2. In this embodiment, the extraction unit 73 can extract the specific target ST0 based on the first determination result which is the determination result determined by the first determination unit 74 and the second determination result which is the determination result determined by the second determination unit 75.

[0049] FIG. 7 shows an example of an evaluation value EV0 of an error occurrence state for a feeder 121, which is a first-class evaluation object ET1, and a holding member 30 (suction nozzle), which is a second-class evaluation object ET2. The figure shows a schematic diagram of an evaluation value EV0 of an error occurrence state for one error code EC0001, and other types of error codes EC0 are omitted. For convenience of explanation, the feeder 121 is assumed to be three, feeder FD1, feeder FD2, and feeder FD3. Similarly, for convenience of explanation, the holding member 30 (suction nozzle) is assumed to be three, suction nozzle NZ1, suction nozzle NZ2, and suction nozzle NZ3.

[0050] Furthermore, the fractional notation in the figure shows an example of an evaluation value EV0 of an error occurrence situation. The denominator shows the number of times it was used for substrate-related operations (e.g., picking operations). The numerator shows the number of times an operation error (e.g., picking error) occurred. For example, the combination of feeder FD1 and suction nozzle NZ1 shows that the number of times an operation error occurred was 4 out of 100 times of use.

[0051] The first determination unit 74 first uses the feeder FD1 as a reference for one evaluation object ET0 included in the first type evaluation object ET1. The first determination unit 74 determines whether or not there is a significant difference in the evaluation value EV0 of the error occurrence situation for three evaluation objects ET0, the suction nozzle NZ1, the suction nozzle NZ2, and the suction nozzle NZ3, included in the second type evaluation object ET2, using the feeder FD1 as a reference.

[0052] The evaluation value EV0 of the error occurrence situation for the suction nozzle NZ1 based on the feeder FD1 is expressed as a situation where the number of times a work error occurred was four out of 100 times of use. The evaluation value EV0 of the error occurrence situation for the suction nozzle NZ2 based on the feeder FD1 is expressed as a situation where the number of times a work error occurred was one out of 100 times of use. The evaluation value EV0 of the error occurrence situation for the suction nozzle NZ3 based on the feeder FD1 is expressed as a situation where the number of times a work error occurred was zero out of 100 times of use.

[0053] The first judging unit 74 can use a statistical testing method, specifically a method called "test of difference in population ratio," to judge whether there is a significant difference in the evaluation value EV0 of the error occurrence situation, for example. This testing method performs statistical processing using the number of uses in substrate-related operations and the number of occurrences of operation errors, and tests whether there is a significant difference between multiple events (evaluation values ​​EV0 of the error occurrence situation). An occurrence probability of 5% is exemplified as a criterion for judging a significant difference.

[0054] For example, consider two events in which two dice are rolled six times, with the first die showing one "1" and the second die showing two. A "1" corresponds to a task error. Here, the hypothesis is made that the two dice have the same performance, with a 1 / 6 probability of showing a "1." In contrast, in the actual event, the two dice are rolled six times, with one "1" showing and the other showing two "1s." The difference in the number of times a "1" appears is within the range that can occur by chance, and the probability of occurrence is greater than the criterion of 5%. Therefore, the hypothesis is not rejected, and it is verified that there is no significant difference in the performance of the two dice.

[0055] In contrast, suppose two events occur in which two dice are rolled 60 times, with the first die showing 10 numbers of "1" and the second die showing 20 numbers. In this event, the probability of "1" coming up is the same as when the dice are rolled 6 times. However, under the same hypothesis, the probability of the second die showing 20 numbers of "1" is less than the criterion of 5%. Therefore, the hypothesis is rejected, and it is tested that there is a significant difference (bias) in the performance of the two dice. In other words, it becomes clear that the probability of "1" coming up on the second die is greater than (1 / 6). For example, it is estimated that two of the six faces of the second die show "1".

[0056] As in the above example, in the "test of the difference in population ratios," the test accuracy is improved as the number of uses increases. From this perspective, the first judging unit 74 may select the evaluation object ET0 that has been used for substrate-related operations a predetermined number of times or more as the first-type evaluation object ET1. Similarly, the second judging unit 75 may select the evaluation object ET0 that has been used for substrate-related operations a predetermined number of times or more as the second-type evaluation object ET2.

[0057] For example, the error occurrence rate is calculated by dividing the number of occurrences of work errors by the number of times the evaluation target ET0 was used for substrate-related operations. When the error occurrence rate is used as an index for extracting the specific target ST0, the first judgment unit 74 may set a minimum number of uses and select the evaluation target ET0 with the minimum number of uses or more as the first-type evaluation target ET1. Similarly, when the error occurrence rate is used as an index for extracting the specific target ST0, the second judgment unit 75 may set a minimum number of uses and select the evaluation target ET0 with the minimum number of uses or more as the second-type evaluation target ET2.

[0058] Here, assume that a significant difference is found in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the second type evaluation target ET2, which is based on one evaluation target ET0 included in the first type evaluation target ET1. In this case, the first judgment unit 74 judges that the evaluation target ET0 used as the reference is not the specific target ST0, and that the evaluation target ET0 included in the second type evaluation target ET2, which has a bad evaluation value EV0 of the error occurrence situation, may be the specific target ST0. For convenience of explanation, this judgment is referred to as judgment A.

[0059] Also, assume that there is no significant difference in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the second type evaluation target ET2 based on one evaluation target ET0 included in the first type evaluation target ET1, and the evaluation value EV0 of the error occurrence situation is good. In this case, the first judgment unit 74 judges that the evaluation target ET0 used as the reference is not the specific target ST0, and that the second type evaluation target ET2 does not include the specific target ST0. For convenience of explanation, this judgment is referred to as judgment B.

[0060] Furthermore, a case is assumed in which no significant difference is recognized in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the second type evaluation target ET2 based on one evaluation target ET0 included in the first type evaluation target ET1 as a reference, and the evaluation value EV0 of the error occurrence situation is poor. In this case, the first judgment unit 74 judges that the evaluation target ET0 used as the reference may be the specific target ST0. For convenience of explanation, this judgment is referred to as judgment C.

[0061] The second judgment unit 75 performs judgment in which the first type evaluation target ET1 and the second type evaluation target ET2 are interchanged, as compared with the first judgment unit 74. In other words, it is assumed that a significant difference is recognized in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the first type evaluation target ET1 based on one evaluation target ET0 included in the second type evaluation target ET2. In this case, the second judgment unit 75 judges that the evaluation target ET0 used as the reference is not the specific target ST0, and that the evaluation target ET0 with a bad evaluation value EV0 of the error occurrence situation included in the first type evaluation target ET1 may be the specific target ST0. For convenience of explanation, this judgment is referred to as judgment D.

[0062] Also, assume that there is no significant difference in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the first type evaluation target ET1 based on one evaluation target ET0 included in the second type evaluation target ET2, and the evaluation value EV0 of the error occurrence situation is good. In this case, the second judgment unit 75 judges that the evaluation target ET0 used as the reference is not the specific target ST0, and that the first type evaluation target ET1 does not include the specific target ST0. For convenience of explanation, this judgment is referred to as judgment E.

[0063] Furthermore, a case is assumed in which no significant difference is recognized in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the first type evaluation target ET1 using one evaluation target ET0 included in the second type evaluation target ET2 as a reference, and the evaluation value EV0 of the error occurrence situation is poor. In this case, the second judgment unit 75 judges that the evaluation target ET0 used as the reference may be the specific target ST0. For convenience of explanation, this judgment is referred to as judgment F.

[0064] From the above, when a significant difference is recognized in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the second type evaluation target ET2 based on one evaluation target ET0 included in the first type evaluation target ET1, and when a significant difference is not recognized in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the first type evaluation target ET1 based on one evaluation target ET0 included in the second type evaluation target ET2, and the evaluation value EV0 of the error occurrence situation is poor, the extraction unit 73 may be able to extract a specific target ST0.

[0065] Furthermore, when a significant difference is recognized in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the first type evaluation target ET1 based on one evaluation target ET0 included in the second type evaluation target ET2, and when a significant difference is not recognized in the evaluation value EV0 of the error occurrence situation for multiple evaluation targets ET0 included in the second type evaluation target ET2 based on one evaluation target ET0 included in the first type evaluation target ET1 and the evaluation value EV0 of the error occurrence situation is poor, the extraction unit 73 may be able to extract a specific target ST0.

[0066] In the example shown in FIG. 7, no significant difference is found between the evaluation values ​​EV0 of the error occurrence situation for the suction nozzle NZ2 and suction nozzle NZ3 when the feeder FD1 is used as a reference. However, the evaluation value EV0 of the error occurrence situation for the suction nozzle NZ1 when the feeder FD1 is used as a reference is poor compared to the suction nozzle NZ2 and suction nozzle NZ3, and a significant difference is found in the evaluation value EV0 of the error occurrence situation. Furthermore, since a significant difference is found in the evaluation value EV0 of the error occurrence situation for the suction nozzle NZ1, suction nozzle NZ2, and suction nozzle NZ3 when the feeder FD1 is used as a reference, the first judgment unit 74 judges that the feeder FD1 used as a reference is not the specific target ST0 (judgment A). Furthermore, the first judgment unit 74 judges that the suction nozzle NZ1 with a poor evaluation value EV0 of the error occurrence situation may be the specific target ST0 (judgment A), and sets this as the first first judgment result.

[0067] Similarly, for the suction nozzle NZ1, suction nozzle NZ2, and suction nozzle NZ3 using the feeder FD2 as a reference, a significant difference is recognized in the evaluation value EV0 of the error occurrence situation, so the first judgment unit 74 judges that the reference feeder FD2 is not the specific target ST0 (judgment A). The first judgment unit 74 also judges that the suction nozzle NZ1 with a defective evaluation value EV0 of the error occurrence situation may be the specific target ST0 (judgment A), and sets this as the second first judgment result.

[0068] Furthermore, since a significant difference is recognized in the evaluation value EV0 of the error occurrence situation for the suction nozzle NZ1, suction nozzle NZ2, and suction nozzle NZ3 using the feeder FD3 as a reference, the first judgment unit 74 judges that the reference feeder FD3 is not the specific target ST0 (judgment A). The first judgment unit 74 also judges that the suction nozzle NZ1 with a defective evaluation value EV0 of the error occurrence situation may be the specific target ST0 (judgment A), and sets this as the third first judgment result.

[0069] Conversely, no significant difference is found in the evaluation values ​​EV0 of the error occurrence status for feeders FD1, FD2, and FD3 using suction nozzle NZ1 as a reference. Also, the evaluation values ​​EV0 of the error occurrence status for feeders FD1, FD2, and FD3 using suction nozzle NZ1 as a reference are poorer than those for suction nozzle NZ2 and suction nozzle NZ3. Therefore, the second judgment unit 75 judges that the suction nozzle NZ1 used as a reference may be the specific target ST0 (judgment F), and sets this as the first second judgment result.

[0070] Similarly, there is no significant difference in the evaluation value EV0 of the error occurrence situation for feeders FD1, FD2, and FD3 based on the suction nozzle NZ2. Also, the evaluation value EV0 of the error occurrence situation for feeders FD1, FD2, and FD3 based on the suction nozzle NZ2 is better than that of the suction nozzle NZ1. Therefore, the second judgment unit 75 judges (judgment E) that the suction nozzle NZ2 used as the reference is not the specific target ST0 and that the first-type evaluation target ET1 (feeder FD1, feeder FD2, and feeder FD3) does not include the specific target ST0, and sets this as the second second judgment result.

[0071] Moreover, no significant difference is recognized in the evaluation value EV0 of the error occurrence situation for feeders FD1, FD2, and FD3 based on the suction nozzle NZ3. Furthermore, the evaluation value EV0 of the error occurrence situation for feeders FD1, FD2, and FD3 based on the suction nozzle NZ3 is better than that of the suction nozzle NZ1. Therefore, the second judgment unit 75 judges (judgment E) that the suction nozzle NZ3 used as the reference is not the specific target ST0 and that the first-type evaluation target ET1 (feeder FD1, feeder FD2, and feeder FD3) does not include the specific target ST0, and sets this as the third second judgment result.

[0072] The extraction unit 73 extracts the specific target ST0 based on a first judgment result which is a judgment result judged by the first judgment unit 74 and a second judgment result which is a judgment result judged by the second judgment unit 75. In the example shown in FIG. 7, the extraction unit 73 extracts the specific target ST0 based on the first first judgment result to the third first judgment result judged by the first judgment unit 74 and the first second judgment result to the third second judgment result judged by the second judgment unit 75.

[0073] Furthermore, when the first judgment result and the second judgment result are not contradictory, the extraction unit 73 extracts the evaluation target ET0 that satisfies the first judgment result and the second judgment result as the specific target ST0. The above six judgment results are not contradictory, and the extraction unit 73 can extract the evaluation target ET0 that satisfies the first judgment result and the second judgment result as the specific target ST0. Specifically, the extraction unit 73 extracts the suction nozzle NZ1 as the specific target ST0. Furthermore, the extraction unit 73 estimates that the feeder FD1, the feeder FD2, and the feeder FD3 are not the specific target ST0. Furthermore, the extraction unit 73 estimates that the suction nozzle NZ2 and the suction nozzle NZ3 are not the specific target ST0.

[0074] 1-3-4. Information section 76 The guidance unit 76 guides the specific target ST0 extracted by the extraction unit 73 (step S14 shown in FIG. 5). For example, the guidance unit 76 can guide the specific target ST0 by displaying the specific target ST0 on the display device 80. A known display device can be used as the display device 80. The display device 80 can be provided in the analysis device, the management device HC0, the line management device LC0, the component mounting machine WM3, etc. As shown in FIGS. 1 and 4, the display device 80 of this embodiment is provided in the management device HC0.

[0075] FIG. 8 shows an example of guidance by the guidance unit 76. In the example shown in the figure, the guidance unit 76 guides the worker that the specific target ST0 that caused the work error is the suction nozzle NZ1. This allows the worker to know the specific target ST0. However, if only the specific target ST0 is guided, the worker needs to check the work error separately. Therefore, it is preferable for the guidance unit 76 to guide the worker not only to the specific target ST0 but also to the error code EC0 associated with the specific target ST0.

[0076] In the example shown in the figure, the guidance unit 76 provides guidance on the error code EC0 (in this example, the error code EC0001) associated with the suction nozzle NZ1 that is the specific target ST0. The guidance unit 76 can also provide guidance that the error code EC0001 indicates, for example, a component standing abnormality (an abnormal state in which the suction nozzle NZ1 has picked up a corner or the like of the component 91 and caused the component 91 to stand up). Furthermore, the guidance unit 76 can also provide guidance that the type of operation for substrates is a picking operation.

[0077] By the guidance unit 76 guiding the specific target ST0 together with the error code EC0, an experienced worker can easily implement measures to improve the work error in the substrate-related work using the specific target ST0 based on accumulated knowledge. However, an inexperienced worker may have difficulty implementing the measures. Therefore, the guidance unit 76 may provide the specific target ST0 together with the countermeasure information EI0 for improving the work error in the substrate-related work using the specific target ST0. This allows even an inexperienced worker to implement measures to improve the work error in the substrate-related work using the specific target ST0.

[0078] In the example shown in the figure, the guidance unit 76 provides guidance to skip the suction nozzle NZ1, which is the specific target ST0, as countermeasure information EI0 for improving the work error. Skipping the suction nozzle NZ1 indicates that when the mounting head 20 is equipped with multiple suction nozzles, the suction nozzle NZ1 is not used, but rather another suction nozzle is used. Furthermore, the guidance unit 76 provides guidance to replace the suction nozzle NZ1, which is the specific target ST0, as countermeasure information EI0 for improving the work error.

[0079] It is advisable to store in advance in the storage device DS0 a comparison table listing possible countermeasure candidates (countermeasure information EI0) for the combination of the error code EC0 and the evaluation target ET0. In this case, the guidance unit 76 can refer to the comparison table stored in the storage device DS0, acquire countermeasure candidates (countermeasure information EI0) for the combination of the error code EC0 and the specific target ST0, and provide the countermeasure information EI0.

[0080] The guidance unit 76 can provide various countermeasure information EI0 according to the types of the identified object ST0 and the error code EC0. For example, if the identified object ST0 is the mounting head 20 and the error code EC0 indicates an abnormality related to the internal structure of the mounting head 20, the guidance unit 76 can provide guidance on maintenance of the mounting head 20 as the countermeasure information EI0. In addition, if the identified object ST0 is the holding member 30 (suction nozzle) and the error code EC0 indicates an abnormality in the front / back determination of the component 91, an abnormality in the mounting load, an abnormality in the suction load, or the like, the guidance unit 76 can provide guidance on correcting the shape data as the countermeasure information EI0.

[0081] The substrate-related work is not limited to the supply work, picking work, and mounting work of the component 91. For example, the substrate-related work may be a transport work in which the substrate 90 is carried into the machine, positioned at a predetermined position, and the substrate 90 is carried out from the machine after the predetermined substrate-related work. For example, it is assumed that the specific target ST0 is the substrate transport device 11, and the error code EC0 indicates a reading error of a positioning reference part provided on the substrate 90, a detection error of a plurality of positioning reference parts, or the like. In this case, the guidance unit 76 can provide guidance, as the countermeasure information EI0, ​​on correcting data related to the positioning reference parts defined in the production program, or the like.

[0082] It is also assumed that the specific target ST0 is the board transport device 11, and the error code EC0 indicates an error related to loading / unloading of the board 90 in the specific substrate-related operation machine WM0. In this case, the guidance unit 76 can provide guidance on cleaning, calibration, etc. of the board transport device 11 as the countermeasure information EI0. Furthermore, the substrate-related operation machine WM0 is not limited to the component mounting machine WM3, and may be, for example, a printing machine WM1, a printing inspection machine WM2, or an appearance inspection machine WM5.

[0083] 2. Method for estimating the cause of the error What has already been described about the error cause estimation device 70 also applies to the error cause estimation method. Specifically, the error cause estimation method includes a storage step, an extraction step, and a guidance step. The storage step corresponds to the control performed by the storage unit 71. The extraction step corresponds to the control performed by the extraction unit 73. The guidance step corresponds to the control performed by the guidance unit 76.

[0084] 3. Examples of Effects of the Embodiments According to the error cause estimating device, it is possible to inform the specific object that caused the work error together with the error code associated with the specific object and the type of substrate-related work that caused the work error. The above description of the error cause estimating device also applies to the error cause estimating device. [Explanation of symbols]

[0085] 70: Error cause estimation device, 71: Storage unit, 73: Extraction unit, 76: guide portion, 90: circuit board, 91: component, UM0: Equipment used, UD0: Data used, ET0: Evaluation target, EC0: Error code, ST0: Specific target, WM0: Circuit board work machine.

Claims

1. a storage unit that stores an evaluation target, which is at least one of a device used in the substrate-related operation and usage data used in the substrate-related operation, and an error code indicating a type of the operation error, in association with each other, for a plurality of operation errors occurring in a substrate-related operation performed by a substrate-related operation machine that performs a substrate-related operation on a substrate; An extraction unit that extracts a specific target that is the evaluation target that caused the work error based on the multiple work errors stored in the storage unit; a guide unit that guides the specific object extracted by the extraction unit together with an error code associated with the specific object and a type of the substrate-related operation that caused the operation error; An error cause estimation device comprising:

2. a storage step of storing an evaluation object, which is at least one of a device used in the substrate-related operation and usage data used in the substrate-related operation, and an error code indicating a type of the operation error, in association with each other, for a plurality of operation errors occurring in a substrate-related operation performed by a substrate-related operation machine that performs a substrate-related operation on a substrate; an extraction step of extracting a specific target that is the evaluation target and that caused the work error based on the plurality of work errors stored by the storage step; a guidance step of providing information about the specific object extracted by the extraction step together with an error code associated with the specific object and a type of the substrate-related operation in which the operation error occurred; The error cause estimation method includes:

Images