Semiconductor processing using a cooled electrostatic chuck

Abstract

Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate coupled to the ESC base assembly with a vacuum region sandwiched therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly and disposed within the facility plate, a lower flange coupled to the upper flange and disposed within the facility plate, a gasket disposed between the upper and lower flanges, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, and the passage is defined by the connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to semiconductor manufacturing, and more particularly to a substrate support assembly that enables low temperature operation of an electrostatic chuck (ESC). [Background technology]

[0002] Reliable fabrication of nanometer and smaller features is one of the key technological challenges for the next generation of very large scale integration (VLSI) and ultra-large scale integration (ULSI) of semiconductor devices. However, as circuit technology limits are being approached, the shrinking dimensions of VLSI and ULSI interconnect technologies are placing additional demands on processing power. Reliable formation of gate structures on substrates is critical to the success of VLSI and ULSI, and to the continuing efforts to increase circuit density and quality of individual substrates and dies.

[0003] To reduce manufacturing costs, integrated chip (IC) manufacturers are demanding higher throughput and better device yields and performance for every silicon substrate processed. Some manufacturing techniques being explored for next generation devices under current development require processing at low temperatures, e.g., temperatures below -20 degrees Celsius. Dry reactive ion etching of a substrate maintained uniformly at a temperature below -20 degrees Celsius allows ions to be bombarded onto the upwardly facing surface of a material disposed on the substrate with reduced natural etching, thereby forming trenches with smooth vertical sidewalls. Additionally, cryogenic temperatures can improve the selectivity of etching one material over another. For example, the selectivity between silicon (Si) and silicon dioxide (SiO2) increases exponentially with decreasing temperature.

[0004] Thus, there is a need for an improved substrate support assembly suitable for use at high temperatures. Summary of the Invention

[0005] In one embodiment, a substrate support assembly is provided. The substrate support assembly includes an electrostatic chuck (ESC) base assembly having a base channel disposed therein, a facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly and disposed within the facility plate, a lower flange coupled to the upper flange and disposed within the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, and the passage is defined by a connected opening of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

[0006] In another embodiment, a substrate support assembly is provided. The substrate support assembly includes an electrostatic chuck (ESC) base assembly having a base channel disposed therein, a facility plate coupled to the ESC base assembly with a vacuum region therebetween, an insulator plate coupled to the facility plate, a ground plate coupled to the insulator plate, and an interface assembly. The interface assembly includes an interface flange coupled to an insulator tube disposed through the insulator plate, the interface flange disposed in the ground plate, an outer ring disposed around the interface flange, a coolant flange coupled to the interface flange, and an interface gasket disposed between the interface flange and the coolant flange. A passage is connected to a base channel of the ESC base assembly defined by the connected openings of the interface flange, the coolant flange, the interface gasket, and the base channel. A composite flange is coupled to the ground plate, and the coolant flange is disposed within the composite flange. A vacuum passage is connected to the vacuum region. The vacuum passage is defined by an inner surface of the facility plate, an inner surface of the insulator plate, an inner surface of the ground plate, the interface flange, the outer ring, the coolant flange, the insulator tube, and the composite flange.

[0007] In yet another embodiment, a substrate support assembly is provided. The substrate support assembly includes an electrostatic chuck (ESC) base assembly having a base channel disposed therein, a facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a coolant line coupled to a coolant flange disposed within the composite flange, the coolant line being in fluid communication with a passageway. The passageway is connected to the base channel of the ESC base assembly. The passageway is defined by connected openings of the coolant flange and the base channel. A vacuum tube is coupled to the composite flange, the coolant line is disposed within the vacuum tube, and the vacuum tube is in fluid communication with the vacuum passageway. The vacuum passageway is defined by an inner surface of the facility plate, the coolant flange, and the composite flange.

[0008] Thus, in a manner that allows the above-mentioned features of the present disclosure to be understood in detail, a more particular description of the present disclosure briefly summarized above will in some cases refer to embodiments, some of which are illustrated in the accompanying drawings, it being noted, however, that the accompanying drawings merely depict exemplary embodiments and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic cross-sectional view of a plasma processing chamber according to an embodiment. [Figure 2A] 1 is a schematic cross-sectional view of a substrate support assembly according to an embodiment. [Figure 2B] 1 is a schematic cross-sectional view of a substrate support assembly according to an embodiment. [Figure 3A] 1 is a schematic diagram of a seal assembly according to an embodiment. [Figure 3B] 1 is a schematic cross-sectional view of an upper flange according to an embodiment. [Figure 3C] 1 is a schematic cross-sectional view of a plurality of bonding layers according to an embodiment. [Figure 3D]1 is a schematic cross-sectional view of a plurality of bonding layers according to an embodiment. [Figure 3E] 1 is a schematic cross-sectional view of an interface assembly according to an embodiment. [Figure 3F] 1 is a schematic cross-sectional view of an interface assembly according to an embodiment. [Figure 3G] 1 is a schematic cross-sectional view of an interface assembly according to an embodiment. [Figure 3H] 4A-4C are schematic cross-sectional views of vacuum inlet and outlet tubes according to an embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] For ease of understanding, wherever possible, identical reference numerals have been used to indicate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0011] The embodiments described herein provide a substrate support assembly that enables operation of an electrostatic chuck (ESC) such that a substrate disposed thereon is maintained at a temperature below -20 degrees Celsius while other surfaces of the processing chamber are maintained at a different temperature during processing of the substrate.

[0012] Although the substrate support assembly is described below in an etch processing chamber, the substrate support assembly can also be utilized in other types of plasma processing chambers, such as physical vapor deposition chambers, chemical vapor deposition chambers, ion implantation chambers, among others, and in other systems where the substrate must be maintained at temperatures below −20 degrees Celsius for processing. The substrate support assemblies disclosed herein can also be utilized at temperatures greater than −20 degrees Celsius.

[0013] FIG. 1 is a schematic cross-sectional view of an exemplary plasma processing chamber 100, shown configured as an etch chamber having a substrate support assembly 101. The substrate support assembly 101 may be utilized in other types of plasma processing chambers, such as plasma treatment chambers, annealing chambers, physical vapor deposition chambers, chemical vapor deposition chambers, and ion implantation chambers, among others, and in other systems in which the ability to uniformly maintain a surface or workpiece, such as a substrate 124, at a temperature below −20 degrees Celsius is desirable. By subjecting a substrate 124 maintained at a temperature below −20 degrees Celsius to a dry reactive ion etch, an upwardly facing surface of a material disposed on the substrate 124 may be bombarded with ions with reduced spontaneous etching, thereby forming trenches with smooth vertical sidewalls. For example, diffusion of ions in the porosity of a low-k dielectric material disposed on a substrate 124 uniformly maintained at a temperature below −20 degrees Celsius may be reduced, while continuing to bombard an upwardly facing surface of the low-k dielectric material to form trenches with smooth vertical sidewalls. Additionally, temperatures below -20 degrees Celsius can improve the selectivity of etching one material over another, for example the selectivity between silicon (Si) and silicon dioxide (SiO2) increases exponentially with decreasing temperature.

[0014] The plasma processing chamber 100 includes a chamber body 102 having a sidewall 104, a bottom 106, and a lid 108 that encloses a processing region 110. An injector 112 is coupled to the sidewall 104 and / or the lid 108 of the chamber body 102. A gas panel 114 is coupled to the injector 112 to provide process gases to the processing region 110. The injector 112 may be one or more nozzles or inlet ports, or alternatively may be a showerhead. The process gases are removed from the processing region 110 along with any processing by-products through an exhaust outlet 116 formed in the sidewall 104 or bottom 106 of the chamber body 102. The exhaust outlet 116 is coupled to a pumping system 140, which includes a throttle valve and a pump that are utilized to control the vacuum level in the processing region 110.

[0015] The process gas may be energized to form a plasma in the processing region 110. The process gas may be energized by capacitively or inductively coupling RF power to the process gas. In one embodiment depicted in FIG. 1, which may be combined with other embodiments described herein, a plurality of coils 118 are disposed above the lid 108 of the plasma processing chamber 100 and coupled to an RF power source 122 via a matching network 120.

[0016] The substrate support assembly 101 is disposed below the implanter 112 in the processing region 110. The substrate support assembly 101 includes an ESC 103 and an ESC base assembly 105. The ESC base assembly 105 is coupled to the ESC 103 and a facilities plate 107. The facilities plate 107, supported by a ground plate 111, is configured to facilitate electrical, cooling, heating and gas connections to the substrate support assembly 101. The ground plate 111 is supported by the bottom 106 of the processing chamber. An insulator plate 109 insulates the facilities plate 107 from the ground plate 111.

[0017] The ESC base assembly 105 includes a base channel 115 coupled to a cryogenic cooling device 117. The cryogenic cooling device 117 is in fluid communication with the base channel 115 via a base inlet conduit 123 connected to an inlet 254 (shown in FIGS. 2A and 2B) of the base channel 115 and via a base outlet conduit 125 connected to an outlet 256 (shown in FIGS. 2A and 2B) of the base channel 115 such that the ESC base assembly 105 is maintained at a temperature below −20 degrees Celsius. The cryogenic cooling device 117 is coupled to the interface box to control the flow rate of a base fluid. The base fluid may include a material capable of maintaining a temperature below −50 degrees Celsius. The cryogenic cooling device 117 provides a base fluid that circulates through the base channel 115 of the ESC base assembly 105. The base fluid flowing through the base channel 115 can maintain the ESC base assembly 105 at a temperature below −20 degrees Celsius, which can facilitate control of the lateral temperature profile of the ESC 103, such that the substrate 124 disposed above the ESC 103 is uniformly maintained at a temperature below −20 degrees Celsius. In one embodiment that can be combined among other embodiments described herein, the cryogenic cooling device 117 is a single stage cooling device operable to maintain the base fluid at a temperature below about −50 degrees Celsius. In another embodiment that can be combined among other embodiments described herein, the cryogenic cooling device 117 is a cooling device that utilizes a refrigerant inside the cooling device such that the base fluid is maintained at a temperature below −50 degrees Celsius.

[0018] The equipment plate 107 includes equipment channels 234 coupled to a cooling device 119 (shown in FIGS. 2A and 2B). The cooling device 119 is in fluid communication with the equipment channels 234 via an equipment inlet conduit 127 connected to an inlet 240 (shown in FIGS. 2A and 2B) of the equipment channel 234 and via an equipment outlet conduit 129 connected to an outlet 242 (shown in FIGS. 2A and 2B) of the equipment channel 234 so that the equipment plate 107 is maintained at a predetermined ambient temperature. The cryogenic cooling device 117 is coupled to the interface box to control the flow rate of equipment fluid. The equipment fluid can include a material capable of maintaining an ambient temperature between about -10 degrees Celsius and about 60 degrees Celsius. The cooling device 119 provides equipment fluid circulating through the equipment channels 234 of the equipment plate 107. The equipment fluid flowing through the equipment channel 234 can maintain the equipment plate 107 at a predetermined ambient temperature, thereby facilitating the maintenance of the insulator plate 109 at the predetermined ambient temperature.

[0019] The ESC 103 has a support surface 130 and a bottom surface 132 opposite the support surface 130. In one embodiment, which may be combined with other embodiments described herein, the ESC 103 is fabricated from a ceramic material, such as alumina (Al2O3), aluminum nitride (AlN), or other suitable material. Alternatively, the ESC 103 may be fabricated from a polymer, such as polyimide, polyetheretherketone, polyaryletherketone, or the like.

[0020] The ESC 103 includes a chuck electrode 126 disposed therein. The chuck electrode 126 may be configured as a unipolar or bipolar electrode, or other suitable structure. The chuck electrode 126 is coupled through an RF filter and fixture plate 107 to a chuck power supply 134, which provides DC power to electrostatically affix the substrate 124 to a support surface 130 of the ESC 103. The RF filter prevents RF power utilized to form a plasma (not shown) in the plasma processing chamber 100 from damaging electrical equipment or creating electrical disturbances outside the chamber.

[0021] The ESC 103 includes one or more resistive heaters 128 embedded therein. The resistive heaters 128 are utilized to raise the temperature of the ESC 103 to a temperature suitable for processing a substrate 124 disposed on a support surface 130. The resistive heaters 128 are coupled to a heater power supply 136 via a fixture plate 107 and an RF filter. The RF filter prevents RF power utilized to form a plasma (not shown) within the plasma processing chamber 100 from damaging electrical equipment or causing electrical disturbances outside the chamber. The heater power supply 136 may provide 500 watts or more of power to the resistive heater 128. The heater power supply 136 includes a controller (not shown) utilized to control the operation of the heater power supply 136, the controller being set to heat the substrate 124 as needed to maintain the substrate temperature at a desired temperature, typically below −20 degrees Celsius. In other words, the heat from the resistive heater 128 and the cooling from the base fluid circulating through the ESC base assembly 105 are balanced to maintain the substrate 124 at a desired temperature below −20 degrees Celsius. For example, the resistive heater 128 and the base fluid circulating through the ESC base assembly 105 maintain the substrate 124 at a temperature suitable for processing, which is below about −20 degrees Celsius, such as between about −20 degrees Celsius and about −150 degrees Celsius.

[0022] The resistive heater 128 includes multiple laterally separated heating zones, and the controller can preferentially heat at least one of the zones of the resistive heater 128 relative to the resistive heaters 128 located in one or more of the other zones. For example, the resistive heaters 128 can be arranged concentrically into the separated heating zones. The separated heating zones of the resistive heaters 128 assist controlling the lateral edge to center temperature uniformity of the substrate 124.

[0023] The substrate support assembly 101 may include one or more probes disposed therein. The ESC 103 is coupled to a probe controller 138. A probe tip of the probe controller 138 is disposed in or on the ESC 103 to determine the temperature of the ESC 103. A probe tip of the probe controller 138 is disposed in the ESC base assembly 105 to calibrate the temperature of the substrate based on the temperature of the ESC base assembly 105. The probe controller 138 is coupled to a heater power supply 136 such that individual zones of the resistive heater 128 are independently heated based on the temperature measurements such that the lateral temperature profile of the ESC 103 is substantially uniform, thereby maintaining the substrate 124 disposed on the ESC 103 at a uniform temperature below −20 degrees Celsius.

[0024] 2A is a cross-sectional schematic diagram of the substrate support assembly 101 that enables operation of the ESC 103 such that the substrate 124 disposed thereon is maintained at a temperature below −20 degrees Celsius while other surfaces of the processing chamber are maintained at a different temperature. The ESC 103 is coupled to the ESC base assembly 105. The ESC 103 is affixed to the ESC base assembly 105 using a bonding layer 202. The bonding layer 202 can include an organic material or an inorganic material. In some embodiments, which can be combined with other embodiments described herein, the bonding layer 202 can include an epoxy material or a metallic material. The chuck electrode 126 is coupled to the chuck power supply 134 via a first insulated wire 204 that is disposed through a first bore 208 in the lower insulator 212 of the equipment plate 107 and the upper insulator 214 of the ESC base assembly 105. The one or more resistive heaters 128 are coupled to the heater power supply 136 via a second insulated wire 206 disposed through a second bore 210 in the lower insulator 212 of the equipment plate 107 and the upper insulator 214 of the ESC base assembly 105.

[0025] The equipment plate 107 includes a plate portion 229 and a wall portion 230. The plate portion 229 of the ESC base assembly 105 is coupled to the equipment plate 107 using one or more first screw assemblies 220 such that a vacuum region 222 exists between the ESC base assembly 105 and the equipment plate 107. Each of the one or more first screw assemblies 220 includes an insulating layer 227 in contact with the equipment plate 107, one or more Belleville washers 226, and a bolt 224 inserted through the equipment plate 107 and threaded into a threaded hole 228 in the ESC base assembly 105. The insulating layer 227 contacts the equipment plate 107 to provide thermal isolation from the ESC base assembly 105, which is maintained at a base temperature. The insulating layer 227 includes a polyamide-imide (PAI) or polyimide (PI) containing material. One or more Belleville washers 226 and bolts 224 are preloaded to force the equipment plate 107 against the ESC base assembly 105 .

[0026] The facilities plate 107 includes a wall portion 230 coupled to the ESC 103 by a seal 232. A bottom insulator 212 of the facilities plate 107 maintains a vacuum region 222 through the seal 232. The walls coupled to the ESC by the seal 232 protect the material of the ESC base assembly 105 from potential flaking off due to contact with process gases. The vacuum region 222 is defined by the ESC 103, the ESC base assembly 105, the facilities plate 107 and the seal 232. The vacuum region 222 prevents condensation on the backside of the cooling plate, prevents process gases from flowing into the substrate support assembly 101 by having a pressure independent of the pressure in the processing region 110, and also provides thermal isolation between the ESC base assembly 105 and the facilities plate 107. The facilities plate 107 includes an aluminum-containing material.

[0027] The equipment channel 234 of the equipment plate 107 is machined into the equipment plate and welded with a cover 238. The inlet 240 of the equipment channel 234 is in fluid communication with an inlet tube 244 disposed through the insulator plate 109 and the ground plate 111. The outlet 242 of the equipment channel 234 is in fluid communication with an outlet tube 246 disposed through the insulator plate 109 and the ground plate 111. The inlet tube 244 and the outlet tube 246 are connected to a connection 248 having a connection inlet 250 connected to the equipment inlet conduit 127 and a connection outlet 252 connected to the equipment outlet conduit 129. The connection 248, the inlet tube 244 and the outlet tube 246 may comprise an insulating material, such as a ceramic-containing material. The base channel 115 of the ESC base assembly 105 includes a base channel 115 inlet 254 in fluid communication with an inlet passage 258. The inlet passage 258 is disposed through the facilities plate 107, the insulator plate 109 and the ground plate 111. The outlet 256 of the base channel 115 is fluidly connected to the outlet passage 260. The outlet passage 260 is disposed through the facilities plate 107, the insulator plate 109 and the ground plate 111. The seal assembly 301 can couple the inlet 254 or the outlet 256 of the ESC base assembly 105 to the inlet passage 258 or the outlet passage 260. In an embodiment that can be combined with other embodiments described herein, the substrate support assembly 101 includes a seal assembly 301 coupled to the inlet 254 of the ESC base assembly 105. In another embodiment that can be combined with other embodiments described herein, the seal assembly 301 can also be coupled to the outlet 256 of the ESC base assembly 105. In yet another embodiment, which can be combined with other embodiments described herein, the substrate support assembly 101 includes one seal assembly 301 coupled to the inlet 254 of the ESC base assembly 105, and another seal assembly 301 coupled to the outlet 256 of the ESC base assembly 105.

[0028] The interface block 270 includes two vacuum tubes 276, a first vacuum tube 276a and a second vacuum tube 276b. The first vacuum tube 276a is connected to the base inlet conduit 123 such that the cryogenic cooling device 117 is in fluid communication with the inlet passage 258. The second vacuum tube 276b is connected to the base outlet conduit 125 such that the cryogenic cooling device 117 is in fluid communication with the outlet passage 260. The first vacuum tube 276a is connected to a vacuum conduit 280 that is in fluid communication with a vacuum source 284. The second vacuum tube 278b is connected to a vacuum conduit 282 that is in fluid communication with the vacuum source 284.

[0029] The interface assembly 305 couples one or more vacuum tubes 276 to the ground plate 111 and the insulator tube 328. In one embodiment that may be combined with other embodiments described herein, the substrate support assembly 101 includes an interface assembly 305 coupling a first vacuum tube 276a to the insulator tube 328 in which the inlet passage 258 is located. In another embodiment that may be combined with other embodiments described herein, the substrate support assembly 101 includes an interface assembly 305 coupling a second vacuum tube 276b to the insulator tube 328 in which the outlet passage 260 is located. In yet another embodiment that may be combined with other embodiments described herein, the substrate support assembly 101 includes one interface assembly 305 coupling a first vacuum tube 276a to the insulator tube 328 in which the inlet passage 258 is located, and another interface assembly 305 coupling a second vacuum tube 278b to the insulator tube 328 in which the outlet passage 260 is located.

[0030] The vacuum region 222 is connected to a vacuum passage 262. The vacuum passage 262 is defined by an inner surface 207 of the fixture plate 107, an inner surface 209 of the insulator plate 109, an inner surface 211 of the ground plate 111, an inlet passage 258 and an outlet passage 260. The vacuum passage 262 is coupled to a vacuum source 284 via two vacuum tubes 276. By coupling the vacuum source 284 to the vacuum region 222 and the vacuum passage 262, a pressure independent of the pressure in the process region 110 can be maintained within these two vacuum tubes 276.

[0031] The substrate support assembly 101 also includes one or more lift pin assemblies 286 for accommodating lift pins (not shown) for lifting the substrate 124 above the support surface 130 of the ESC 103 to facilitate robotic transfer into and out of the plasma processing chamber 100. Each of the one or more lift pin assemblies 286 includes a lift pin guide 288 disposed through the ESC 103, the ESC base assembly 105, the fixture plate 107, the insulator plate 109, and the ground plate 111. A portion 290 of the lift pin guide 288 disposed through the ESC base assembly 105 is surrounded by a threaded bushing 292 that holds the lift pin guide 288 in place. The lift pin guide 288 is coupled to the ESC 103 by a seal 232 to separately maintain the chamber vacuum and the insulation vacuum. The ESC 103 may include one or more gas passages for providing a backside heat transfer gas, such as helium, to an interstitial space defined between the substrate 124 and the support surface 130 of the ESC 103. Each of the one or more gas passages is disposed through the ESC 103, the ESC base assembly 105, the facility plate 107, the insulator plate 109, and the ground plate 111. Each of the one or more gas passages is coupled to the ESC 103 by a seal 232 to maintain pressure in the vacuum region 222.

[0032] The equipment plate 107 includes a recessed portion 296 and a seal 294 disposed between the insulator plate 109 and the equipment plate 107. A surface 205 of the insulator plate 109 bonded to the equipment plate 107 is conformal with the equipment plate 107. The recessed portion 296 and the insulator plate 109 provide a reduced thickness 201 of the equipment plate 107 and a greater thickness 203 of the insulator plate 109. The reduced thickness 201 of the equipment plate 107 and the greater thickness 203 of the insulator plate 109 reduce the length of the first insulated wire 204 disposed through the first bore 208 in the lower insulator 212 of the equipment plate 107 and the length of the first insulated wire 204 disposed through the insulator plate 109. By reducing the length of the first insulated wire 204 disposed through the first bore 208, a lower arcing potential is generated in the first bore 208 of the RF hot fixture plate 107 due to the voltage supplied to the first insulated wire 204 by the chuck power supply 134. The outer portion 269 of the insulator plate 109 can include a material different from the material of the inner portion 271 of the insulator plate 109. The outer portion 269 can include an aluminum oxide (AlO2)-containing material and the inner portion 271 of the insulator plate 109 can include a polystyrene-containing material.

[0033] As shown in FIG 2B, the substrate support assembly 101 includes a protective cover 285. The protective cover 285 is disposed over the interface assembly 305 (shown in FIGS. 3E-3G). The protective cover 285 includes an insulating material, such as polytetrafluoroethylene (PTFE). The protective cover is utilized during packaging, shipping, and transportation of the substrate support assembly 101.

[0034] 3A is a schematic cross-sectional view of a seal assembly 301. As described above, the seal assembly 301 can be coupled to the inlet 254 or the outlet 256 of the ESC base assembly 105. One seal assembly 301 can be coupled to the inlet 254 of the ESC base assembly 105, and another seal assembly 301 can be coupled to the outlet 256 of the ESC base assembly 105.

[0035] The seal assembly 301 includes an upper flange 302. The upper flange 302 is coupled to the ESC base assembly 105. In an embodiment that may be combined with other embodiments described herein, the upper flange 302 is coupled to the inlet 254 of the ESC base assembly 105. In another embodiment that may be combined with other embodiments described herein, the upper flange 302 is coupled to the outlet 256 of the ESC base assembly 105. The upper flange 302 is disposed in the equipment plate 107. In an embodiment that may be combined with other embodiments described herein, the upper flange 302 is welded or brazed to the ESC base assembly 105.

[0036] The seal assembly 301 includes a lower flange 304. The lower flange 304 is coupled to an upper flange 302. The lower flange 304 is disposed within an equipment plate. The lower flange 304 is coupled to the upper flange 302 using a number of fasteners 324. The number of fasteners 324 may be socket head screws. The number of fasteners 324 are in contact with a number of washers 326. The number of fasteners 324 are disposed within a number of holes 327. The number of holes 327 are disposed through the lower flange 304 and the upper flange 302. The number of holes 327 may be threaded such that the number of fasteners 324 are retained within the number of holes 327.

[0037] The lower flange 304 includes, but is not limited to, one or more of a nickel-cobalt ferrous alloy or a nickel-iron ferrous alloy. The nickel-cobalt ferrous alloy may include one or more of nickel, iron, cobalt, carbon, silicon, and manganese. The nickel-iron ferrous alloy may be FeNi36. Alternatively, the lower flange 304 is formed entirely of a nickel-cobalt ferrous alloy, entirely of a nickel-iron ferrous alloy, or a combination of a nickel-cobalt ferrous alloy and a nickel-iron ferrous alloy.

[0038] The seal assembly 301 includes a gasket 322 disposed between the upper flange 302 and the lower flange 304. The gasket 322 includes, but is not limited to, a metallic material. For example, the metallic material is a copper material.

[0039] The lower flange 304 is coupled to an insulator tube 128. The insulator tube 328 comprises a ceramic material, such as a silicon carbide material. For example, the insulator tube 328 is SC-30. The insulator tube 328 provides a through connection for the base fluid to enter and exit the ESC base assembly 105 via the inlet passage 258 and the outlet passage 260. In one embodiment, which may be combined with other embodiments described herein, the inlet passage 258 is coupled to the base channel 115 using a seal assembly 301. In another embodiment, which may be combined with other embodiments described herein, the outlet passage 260 is coupled to the base channel 115 using a seal assembly 301. In yet another embodiment, which may be combined with other embodiments described herein, the inlet passage 258 and the outlet passage 260 are coupled to the base channel 115 using two seal assemblies 301.

[0040] Insulation 330 surrounds insulator tube 328. Insulation 330 includes insulating materials such as, but not limited to, polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), or polyimide-based plastics. Insulation 330 provides insulation to the base fluid traveling through inlet passage 258 and outlet passage 260. Insulation 330 may include two halves joined together.

[0041] An inlet passage 258 is connected to the inlet 254. The inlet passage 258 is defined by the connected openings of the upper flange 302, the gasket 322, the lower flange 304 and the insulator tube 328. The base fluid flows through the connected openings of the upper flange 302, the gasket 322, the lower flange 304 and the insulator tube 328. An outlet passage 260 is connected to the outlet 256. The outlet passage 260 is defined by the connected openings of the upper flange 302, the gasket 322, the lower flange 304 and the insulator tube 328. The base fluid flows through the connected openings of the upper flange 302, the gasket 322, the lower flange 304 and the insulator tube 328.

[0042] The seal assembly 301 provides a seal such that an inlet passage 258 disposed through the facility plate 107, the insulator plate 109, and the ground plate 111 can provide a base fluid to the base channel 115. The base fluid is provided to the inlet 254 of the base channel 115 through the inlet passage 258. The seal assembly 301 also provides a seal such that an outlet passage 260 disposed through the facility plate 107, the insulator plate 109, and the ground plate 111 can remove the base fluid from the base channel 115. The base fluid is removed from the outlet 256 of the base channel 115 through the outlet passage 260.

[0043] Additionally, seal assembly 301 prevents vacuum leakage from vacuum region 222 and vacuum passage 262. Vacuum passage 262 is connected to vacuum region 222. Vacuum passage 262 is further defined by interior surface 207 of equipment plate 107, upper flange 302, gasket 322, lower flange 304, and insulator tube 328.

[0044] The seal assembly 301 provides a seal between the ESC base assembly 105 and the equipment plate 107. The base channel 115 is machined into the ESC base assembly 105. The base channel 115 may be bonded, welded, or brazed to the cover 303. The seal assembly 301 may operate to maintain a base fluid at a base fluid temperature.

[0045] 3B is a schematic cross-sectional view of the top flange 302 shown in FIG. 3A. In one embodiment, which may be combined with other embodiments described herein, the top flange 302 is welded (such as using an explosive welding process) to the ESC base assembly 105 at a number of welds 310. The top flange 302 may also be brazed to the ESC base assembly 105. The number of welds 310 is between about 0.09 inches and about 0.15 inches. The top flange 302 is recessed into the ESC base assembly 105 by a recess length 312. The recess length is between about 0.05 inches and about 0.12 inches. The top flange 302 has a top flange length 314 between about 0.28 inches and about 0.48 inches. The top flange 302 has a top flange width 316 between about 1.33 inches and about 2.12 inches.

[0046] As shown in FIG. 3B , the top flange 302 includes a top portion 318 and a bottom portion 320. The top portion 318 is coupled to the ESC base assembly 105. The bottom portion 320 of the top flange 302 is in contact with a gasket 322. The top portion 318 includes, but is not limited to, a metallic material. In one example, the top portion 318 is aluminum. In another example, the portion 318 is stainless steel or titanium. The bottom portion 320 includes, but is not limited to, a metallic material. If the top portion 318 is aluminum, the bottom portion is stainless steel, titanium, or a combination thereof. If the top portion 318 is stainless steel or titanium, the top portion 318 is coupled to the ESC base assembly 105 by an explosion welding process. In yet another example, the top portion 318 and the bottom portion 320 can both have the same material, such as a metallic material. The bottom portion 320 is coupled to the top portion 318 by a bonding region 319. Bonding region 319 bonds bottom portion 320 to top portion 318 using a welding process, such as an explosion welding process.

[0047] 3C and 3D are schematic cross-sectional views of a plurality of bonding layers 332. The bonding layers may be planar as shown in FIG. 3C or stepped as shown in FIG. 3D. The stepped surface can improve part locking and lateral movement due to temperature cycling. The stepped surface can also improve bonding surface area and hermetic sealing. The bottom flange 304 is bonded to the insulator tube 328 using a plurality of bonding layers 332. The plurality of bonding layers 332 includes a plurality of metallization layers 334. The plurality of metallization layers 334 includes, but is not limited to, Mo-Mn or combinations thereof. The plurality of metallization layers 334 includes a metallization layer thickness 336 of about 0.0001 inches to about 0.0005 inches. The plurality of metallization layers 334 are bonded together by a solder filler 338. The solder filler 338 includes, but is not limited to, tin, indium, or combinations thereof. For example, the solder filler 338 is a Sn, Ag and Ti containing alloy. The solder filler 338 has a joining temperature of about 140° C. to about 150° C. The solder filler 338 includes a solder fill thickness 340 of about 0.001 inches to about 0.003 inches. The multiple bonding layers 332 provide stress relief at the joint between the bottom flange 304 to the insulator tube 328.

[0048] 3E-3G are schematic cross-sectional views of an interface assembly 305. Although two interface assemblies 305 are shown in FIG. 3E-3G, the substrate support assembly 101 may include one interface assembly 305. The interface assembly 305 couples one of the first vacuum tube 276a, the second vacuum tube 276b, or both the first vacuum tube 276a and the second vacuum tube 276b to the ground plate 111. The interface assembly 305 couples one of the first vacuum tube 276a, the second vacuum tube 276b, or both the first vacuum tube 276a and the second vacuum tube 276b to the insulator tube 128. Each of the one or more vacuum inlet tubes 276 includes a refrigerant line 346 disposed therein. The refrigerant line 346 is in fluid communication with the cryogenic cooling device 117. In an embodiment, which may be combined with other embodiments described herein, the refrigerant line 346 provides a base fluid to the inlet passage 258. In another embodiment, which may be combined with other embodiments described herein, the refrigerant line 346 receives the base fluid from the outlet passage 260. The interface assembly 305 is contained within an interface block 270.

[0049] In one embodiment, which may be combined with other embodiments described herein, the refrigerant line 346 in fluid communication with the inlet passage 258 is coupled to the ground plate 111 using an interface assembly 305. In another embodiment, which may be combined with other embodiments described herein, the refrigerant line 346 in fluid communication with the outlet passage 260 is coupled to the ground plate 111 using an interface assembly 305. In yet another embodiment, which may be combined with other embodiments described herein, the refrigerant line 346 in fluid communication with the inlet passage 258 and another refrigerant line 346 in fluid communication with the outlet passage 260 are coupled to the ground plate 111 using two interface assemblies 305.

[0050] The interface assembly 305 includes an interface flange 350. The interface flange 350 is coupled to the insulator tube 328. The interface flange 350 is disposed within the ground plate 111. As shown in FIG. 3C, the interface flange 350 is coupled to the insulator tube 328 using multiple bonding layers 332. Multiple metallization layers 334 are bonded together by solder filler 338. The multiple bonding layers 332 provide stress relief at the joint between the interface flange 350 and the insulator tube 328.

[0051] The interface flange 350 includes, but is not limited to, one or more of a nickel-cobalt ferrous alloy or a nickel-iron ferrous alloy. The nickel-cobalt ferrous alloy may include one or more of nickel, iron, cobalt, carbon, silicon, and manganese. The nickel-iron ferrous alloy may be FeNi36. The interface flange 350 may be formed entirely of a nickel-cobalt ferrous alloy, entirely of a nickel-iron ferrous alloy, or a combination of a nickel-cobalt ferrous alloy and a nickel-iron ferrous alloy. The interface flange 350 may be rotatable. The lower flange and the interface flange 350 may be made of the same material, such as a nickel-cobalt ferrous alloy.

[0052] The interface assembly 305 includes an outer ring 354. The outer ring 354 is coupled to the interface flange 350. The outer ring 354 includes, but is not limited to, a metallic material. For example, the metallic material may be stainless steel. The outer ring 354 may include halves integrally coupled together.

[0053] The interface assembly 305 includes a refrigerant flange 356. The refrigerant flange 356 is coupled to the interface flange 350. The refrigerant flange 356 provides an interface for base fluid to flow into and / or out of the insulator tubes 328. The refrigerant flange 356 is coupled to the interface flange 350 using a number of fasteners 358. The number of fasteners 358 are disposed through the outer ring 354. The number of fasteners are in contact with a number of washers 360. The number of fasteners 358 are disposed within a number of holes 359. The number of holes 359 are disposed through the refrigerant flange 356 and the interface flange 350. The number of holes 359 may be threaded such that the number of fasteners 358 are retained within the number of holes 359.

[0054] The interface assembly 305 includes an interface gasket 362 disposed between the interface flange 350 and the coolant flange 356. The interface gasket 362 includes, but is not limited to, a metallic material. For example, the metallic material is a copper material.

[0055] In one embodiment, which may be combined with other embodiments described herein, interface assembly 305 provides an interface such that inlet passage 258 disposed through facility plate 107, insulator plate 109, and ground plate 111 can provide a base fluid to base channel 115. Inlet passage 258 is connected to inlet 254. Inlet passage 258 is further defined by connected openings of interface flange 350, refrigerant flange 356, and interface gasket 362. The base fluid flows through the connected openings of inlet interface flange 350, supply flange 356, and interface gasket 362.

[0056] In another embodiment, which may be combined with other embodiments described herein, interface assembly 305 provides an interface such that outlet passage 260 disposed through facility plate 107, insulator plate 109, and ground plate 111 may remove base fluid from base channel 115. Outlet passage 260 is connected to outlet 256. Outlet passage 260 is further defined by connected openings of interface flange 350, refrigerant flange 356, and interface gasket 362. Base fluid flows through connected openings of interface flange 350, refrigerant flange 356, and interface gasket 362.

[0057] The interface assembly 305 includes a composite flange 364. The composite flange 364 of the interface assembly 305 couples one of the first vacuum tube 276a, the second vacuum tube 276b, or both the first vacuum tube 276a and the second vacuum tube 276b to the ground plate 111. The refrigerant flange 356 is disposed within the composite flange 364. The interface assembly 305 compresses the refrigerant flange 356 so that the refrigerant line 346 is in fluid communication with the inlet passage 258 and / or compresses the refrigerant flange 356 so that the refrigerant line 346 is in fluid communication with the outlet passage 258. The interface assembly 305 can compress the refrigerant flange 356 so that the refrigerant line 346 is in fluid communication with the inlet passage 258, and another interface assembly 305 can compress the refrigerant flange 356 so that the refrigerant line 346 is in fluid communication with the outlet passage 258.

[0058] The composite flange 364 is coupled to the ground plate 111 using a number of fasteners 365. The number of fasteners 365 may be bolts. The number of fasteners 365 may be spring loaded. The number of fasteners 365 are disposed within a number of holes 367. The number of holes 367 are disposed through the composite flange 364 and the ground plate 111. The number of holes 367 may be threaded such that the number of fasteners 365 are retained within the number of holes 367. The composite flange includes a thermal interface pad 361.

[0059] The one or more vacuum tubes 276 are bonded, welded or brazed to the composite flange 364. The refrigerant line 346 extends through the one or more vacuum tubes 276. The one or more vacuum tubes 276 are connected to the vacuum passage 262. The vacuum passage 262 is further defined by the inner surface 209 of the insulator plate 109, the inner surface 211 of the ground plate 111, the interface flange 350, the outer ring 354, the refrigerant flange 356 and the composite flange 364.

[0060] 3E and 3F, the interface assembly 305 includes an insulator ring 366. The insulator ring 366 surrounds the refrigerant line 346. The insulator ring 366 includes an insulating material, such as, but not limited to, polytetrafluoroethylene (PTFE). The insulator ring 366 provides insulation to the base fluid. The vacuum passage 262 extends through the insulator ring 366 into one or more vacuum tubes 276.

[0061] As shown in FIGURE 3E, an RF gasket 378 is disposed within the composite flange 364. A bracket 380 is coupled to the outer ring 354 of the interface assembly 305 using a number of fasteners 355. The bracket 380 is coupled to the outer rings of the two interface assemblies 305. The bracket 380 includes, but is not limited to, an aluminum material. The bracket 380 contacts the RF gasket 378 to provide an RF ground.

[0062] As shown in FIG. 3F, the RF gasket 378 is disposed within the composite flange 364. A bracket 381 is coupled to the coolant flange 356 of the interface assembly 305. The bracket 381 is coupled to the coolant flange 356 using a number of fasteners 382. The bracket 381 is coupled to the coolant flanges 356 of the two interface assemblies 305. The number of fasteners 382 are disposed through the coolant flange 356 such that the bracket 381 contacts the coolant flange 356. The bracket 381 includes, but is not limited to, an aluminum material. The bracket 381 contacts the RF gasket 378 to provide an RF ground.

[0063] As shown in FIG. 3G , the contact ring 372 is in contact with the fasteners 358. The contact ring 372 includes, but is not limited to, a metallic material. For example, the metallic material may be stainless steel. The contact ring 372 is in contact with the fasteners 358 for RF grounding. The contact ring 372 maintains contact with the fasteners 358 using a number of screws 374 supporting the contact ring 372. The number of screws 374 may be shoulder screws and includes, but is not limited to, a metallic material. For example, the metallic material may be stainless steel. The number of screws 374 connect the contact ring 372 to the composite flange 364. The number of screws 374 includes a number of springs 375. The number of springs 375 are stainless steel compression springs wrapped around individual threads 274 of the number of screws 374. The number of springs 375 enable the contact ring 372 to maintain contact with the fasteners 358.

[0064] 3H is a schematic cross-sectional view of one or more vacuum tubes 276, namely, first vacuum tube 276a and second vacuum tube 276b. As shown in FIG. 3H, one or more vacuum tubes 276 are coupled to a composite flange 364. One or more refrigerant lines 346 are coupled to a refrigerant flange 356. One of the one or more refrigerant lines 346 is disposed within the first vacuum tube 276a. One of the one or more refrigerant lines 346 is disposed within the second vacuum tube 276b. One or more refrigerant lines 346 include rigid tubes 368. Each of the rigid tubes 368 is coupled to the refrigerant flange 356. One or more refrigerant lines 346 include a flexible portion 369. One or more vacuum tubes 276 include a vacuum fitting flange 370. The vacuum fitting flange 370 can be coupled to the base inlet conduit 123 or the base outlet conduit 125.

[0065] In summary, a substrate support assembly is provided that allows the ESCs to be operated such that a substrate disposed on the ESCs is maintained at a substrate temperature while other surfaces of the processing chamber are maintained at different temperatures. The substrate support assembly is disposed in a processing chamber including an ESC 103, an ESC base assembly 105 coupled to the ESC 103 and a fixture plate 107, and an insulator plate 109 coupled to a ground plate 111. A base fluid flowing through a base channel of the ESC base assembly 105 coupled to the ESC 103 allows the ESC base assembly 105 to be maintained at a base temperature. The seal assembly 301 provides a seal such that the base fluid can pass through an insulator tube 328 to the base channel 115 and out another insulator tube 328. The insulator 330 insulates the base fluid moving through the insulator tube 328. The insulator 330 can include a silicon carbide material. The interface assembly 305 couples one or more vacuum tubes 276 to the ground plate 111 using a composite flange 364. The refrigerant flange 356 is disposed within the composite flange 364. The refrigerant line 346 is disposed within each of the one or more vacuum tubes 276.

[0066] The substrate support assembly described herein delivers the base fluid to the base channel of the ESC base assembly. The base fluid may include a material capable of maintaining the base fluid temperature below -50 degrees Celsius, thus requiring a substrate support assembly that accounts for the large temperature difference between the base fluid and the various components of the substrate support assembly. Additionally, the substrate support assembly described herein prevents vacuum leaks in the vacuum regions and vacuum passages, thus providing thermal insulation for the base fluid. The sealing and interface assemblies provide a sealed and insulated environment that transfers the base fluid to the base channel as the base fluid travels to the ESC base assembly, and protects the various components around the substrate support assembly from the base fluid temperature.

[0067] While the foregoing is directed to examples of the disclosure, other and further examples of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the following claims.

Claims

1. 1. A substrate support assembly comprising: an electrostatic chuck (ESC) base assembly having a base channel disposed therein; a facility plate coupled to the ESC base assembly with a vacuum region therebetween; an insulator plate coupled to the facilities plate; a ground plate coupled to the insulator plate; 1. A seal assembly comprising: an upper flange coupled to the base channel of the ESC base assembly, the upper flange being disposed within the equipment plate; a lower flange coupled to the upper flange, the lower flange being disposed within the equipment plate; a gasket disposed between the upper flange and the lower flange; an insulator tube coupled to the lower flange; a seal assembly including: a passageway connected to the base channel, the passageway being defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube and the ESC base assembly; 1. An interface assembly comprising: an interface flange coupled to the insulator tube and disposed within the ground plate; an outer ring disposed about the interface flange; a refrigerant flange coupled to the interface flange; an interface gasket disposed between the interface flange and the refrigerant flange; a composite flange coupled to the ground plate, the refrigerant flange disposed within the composite flange; an interface assembly comprising: A substrate support assembly comprising:

2. a vacuum passageway connected to the vacuum region, the vacuum passageway being defined by an interior surface of the equipment plate, the upper flange, the gasket, the lower flange, and the insulator tube; The substrate support assembly of claim 1 , further comprising:

3. The substrate support assembly of claim 2 , wherein the passageway is further defined by connected openings in the interface flange, the coolant flange and the interface gasket.

4. The substrate support assembly of claim 3 , wherein the vacuum passage is further defined by an inner surface of the insulator plate, an inner surface of the ground plate, the interface flange, the outer ring, the coolant flange, and the composite flange.

5. a refrigerant line coupled to the refrigerant flange, the refrigerant line being in fluid communication with the passage; a vacuum tube coupled to the composite flange, the refrigerant line being disposed within the vacuum tube and the vacuum passage being in fluid communication with the vacuum tube; The substrate support assembly of claim 4 , further comprising:

6. The substrate support assembly of claim 5 , wherein the refrigerant line is in fluid communication with a cryogenic cooling system and the vacuum tube is in fluid communication with a vacuum source.

7. The substrate support assembly of claim 1 , wherein an insulator ring is disposed within the composite flange.

8. The substrate support assembly of claim 1 , wherein the interface flange is bonded to the insulator tube using multiple bonding layers.

9. The substrate support assembly of claim 1 , wherein the bottom flange and the interface flange are the same material.

10. The substrate support assembly of claim 1 , wherein the facilities plate is coupled to the ESC base assembly using one or more first screw assemblies.

11. The substrate support assembly of claim 1 , wherein the top flange is coupled to the ESC base assembly at a plurality of weld points, or the top flange is brazed to the ESC base assembly.

12. The substrate support assembly of claim 1 , wherein the upper flange comprises a top portion and a bottom portion, the top portion comprising an aluminum material and the bottom portion comprising stainless steel, titanium, or a combination thereof.

13. The substrate support assembly of claim 1 , wherein the lower flange is coupled to the upper flange using a plurality of fasteners.

14. 2. The substrate support assembly of claim 1, wherein the insulator tube is bonded to the lower flange using multiple bonding layers, the multiple bonding layers including multiple metallization layers and solder fillers disposed between the multiple bonding layers.

15. The substrate support assembly of claim 1 , wherein the insulator tube comprises silicon carbide.

16. 1. A substrate support assembly comprising: an electrostatic chuck (ESC) base assembly having a base channel disposed therein; a facility plate coupled to the ESC base assembly with a vacuum region therebetween; an insulator plate coupled to the facilities plate; a ground plate coupled to the insulator plate; 1. An interface assembly comprising: an interface flange coupled to an insulator tube disposed through the insulator plate, the interface flange being disposed within the ground plate; an outer ring disposed about the interface flange; a refrigerant flange coupled to the interface flange; an interface gasket disposed between the interface flange and the refrigerant flange, a passageway connected to the base channel of the ESC base assembly is defined by the connected openings of the interface flange, the coolant flange, the interface gasket and the base channel. An interface gasket; a composite flange coupled to the ground plate, the refrigerant flange being disposed within the composite flange; a vacuum passageway connected to the vacuum region, defined by an interior surface of the equipment plate, an interior surface of the insulator plate, an interior surface of the ground plate, the interface flange, the outer ring, the refrigerant flange, the insulator tube, and the composite flange; Vacuum passage and an interface assembly comprising: A substrate support assembly comprising:

17. The substrate support assembly of claim 16 , wherein an RF gasket and a bracket coupled to the outer ring provide an RF ground, the bracket being coupled to the outer ring using a number of fasteners.

18. 17. The substrate support assembly of claim 16, wherein an RF gasket and a bracket coupled to the coolant flange provide an RF ground, the bracket being coupled to the coolant flange using a number of fasteners.

19. 17. The substrate support assembly of claim 16, wherein a contact ring contacts a plurality of fasteners, the plurality of fasteners coupling the coolant flange to the interface flange, the contact ring being supported by a plurality of screws disposed through the composite flange, the plurality of screws including a plurality of springs disposed around the plurality of screws.

20. 1. A substrate support assembly comprising: an electrostatic chuck (ESC) base assembly having a base channel disposed therein; an equipment plate supported by a composite flange, the equipment plate being coupled to the ESC base assembly with a vacuum region therebetween; a refrigerant line coupled to a refrigerant flange disposed within the composite flange, the refrigerant line in fluid communication with the passage; the passageway is connected to the base channel of the ESC base assembly, the passageway being defined by a connected opening of the coolant flange and the base channel; A refrigerant line; a vacuum tube coupled to the composite flange, the refrigerant line being disposed within the vacuum tube, the vacuum tube being in fluid communication with a vacuum passage; the vacuum passage is defined by an interior surface of the equipment plate, the coolant flange, and the composite flange. Vacuum tubes and A substrate support assembly comprising:

Images