Plasma Processing Equipment

Abstract

To provide a plasma processing apparatus capable of suppressing deterioration of an exhaust function in a plasma processing apparatus.SOLUTION: In a plasma processing apparatus 1 comprising a baffle structure arranged so as to surround a substrate support part 11 in a plasma processing chamber 10, the baffle structure contains an upper side baffle plate 120 and a lower side baffle plate 152. The upper side baffle plate includes a plurality of first opens 130. Each of the plurality of first opens includes a first width. The lower side baffle plate includes a conductivity, is coupled to a ground potential, and includes a plurality of second opens 170. Each of the plurality of second opens includes an upper side open part and a lower side open part. The upper side open part has a second width larger than the first width, and the lower side open part has a third width smaller than the first width.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] An exemplary embodiment of the present disclosure relates to a plasma processing apparatus. [Background technology]

[0002] A technique for at least partially adjusting the pressure while confining the plasma in a plasma processing chamber during plasma processing of a substrate is described in US Pat. No. 5,399,324. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2012-513094 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for suppressing deterioration of the exhaust function in a plasma processing apparatus. [Means for solving the problem]

[0005] In one exemplary embodiment of the present disclosure, there is provided a plasma processing chamber, a substrate support disposed within the plasma processing chamber, and a baffle structure disposed within the plasma processing chamber to surround the substrate support, the baffle structure including an upper baffle plate and a lower baffle plate, the upper baffle plate having a plurality of first openings, each of the plurality of first openings having a first width, the lower baffle plate being conductive and coupled to a ground potential, the lower baffle plate having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion, the upper opening portion having a second width greater than the first width, and the lower opening portion having a second width less than the first width. A plasma processing apparatus is provided, comprising: a baffle structure having a third width; and a liner structure disposed in the plasma processing chamber to surround a plasma processing space above a substrate support, the liner structure including an inner cylindrical liner and an outer cylindrical liner, the inner cylindrical liner having a plurality of third openings, each of the plurality of third openings having a fourth width, the outer cylindrical liner being conductive and coupled to a ground potential, the outer cylindrical liner having a plurality of fourth openings, each of the plurality of fourth openings having an inner opening portion and an outer opening portion, the inner opening portion having a fifth width greater than the fourth width, and the outer opening portion having a sixth width less than the fourth width. Effect of the Invention

[0006] According to one exemplary embodiment of the present disclosure, a technique for suppressing deterioration of an exhaust function in a plasma processing apparatus can be provided. [Brief description of the drawings]

[0007] [Figure 1] 1 is a diagram showing an outline of a configuration example of a plasma processing apparatus according to a first exemplary embodiment. [Diagram 2] FIG. 2 is a perspective view of an example plasma confinement structure. [Diagram 3] 4A to 4C are longitudinal cross-sectional views showing examples of the widths of first and second openings when the upper and lower baffle plates are cut in the circumferential direction. [Figure 4] 4 is a longitudinal cross-sectional view showing an example of the lengths of a first opening and a second opening when an upper baffle plate and a lower baffle plate are cut along a radial direction. FIG. [Diagram 5] FIG. 13 is a diagram showing an outline of a configuration example of a plasma processing apparatus according to a second exemplary embodiment. [Figure 6] 11 is a cross-sectional view showing an example of the widths of the third opening and the fourth opening when the inner cylindrical liner and the outer cylindrical liner are cut in the circumferential direction. FIG. [Figure 7] 11 is a longitudinal cross-sectional view showing an example of the lengths of the third opening and the fourth opening when the inner cylindrical liner and the outer cylindrical liner are cut along the top-bottom direction. FIG. [Figure 8] FIG. 13 is a diagram showing an outline of a configuration example of a plasma processing apparatus according to a third exemplary embodiment. [Figure 9] 13A to 13C are longitudinal cross-sectional views showing examples of the widths of the first openings and the second openings when the upper baffle plate and the lower baffle plate in the exemplary embodiment 4 are cut in the circumferential direction. [Figure 10] 11 is a cross-sectional view showing an example of the widths of the third opening and the fourth opening when the inner cylindrical liner and the outer cylindrical liner in exemplary embodiment 4 are cut in the circumferential direction. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Each embodiment of the present disclosure will be described below.

[0009] In one exemplary embodiment, there is provided a plasma processing chamber, a substrate support disposed within the plasma processing chamber, and a baffle structure disposed within the plasma processing chamber to surround the substrate support, the baffle structure including an upper baffle plate and a lower baffle plate, the upper baffle plate having a plurality of first openings, each of the plurality of first openings having a first width, the lower baffle plate being electrically conductive and coupled to a ground potential, the lower baffle plate having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion, the upper opening portion having a second width greater than the first width, and the lower opening portion having a third width less than the first width. and a liner structure disposed in the plasma processing chamber surrounding a plasma processing space above a substrate support, the liner structure including an inner cylindrical liner and an outer cylindrical liner, the inner cylindrical liner having a plurality of third openings, each of the plurality of third openings having a fourth width, the outer cylindrical liner being electrically conductive and coupled to a ground potential, the outer cylindrical liner having a plurality of fourth openings, each of the plurality of fourth openings having an inner opening portion and an outer opening portion, the inner opening portion having a fifth width greater than the fourth width, and the outer opening portion having a sixth width less than the fourth width.

[0010] In one exemplary embodiment, the first opening has a first width from the entrance to the exit of the first opening.

[0011] In one exemplary embodiment, the third opening has a fourth width from the entrance to the exit of the third opening.

[0012] In one exemplary embodiment, the upper opening portion of the second opening has the second width from the inlet to the outlet of the upper opening portion.

[0013] In one exemplary embodiment, the upper opening portion of the second opening has a second width at the entrance of the upper opening portion and a third width at the exit of the upper opening portion, the width narrowing from the entrance to the exit of the upper opening portion.

[0014] In one exemplary embodiment, the inner opening portion of the fourth opening has a fifth width from the entrance to the exit of the inner opening portion.

[0015] In one exemplary embodiment, the inner opening portion of the fourth opening has a fifth width at the entrance of the inner opening portion and a sixth width at the exit of the inner opening portion, the width narrowing from the entrance to the exit of the inner opening portion.

[0016] In one exemplary embodiment, the inner cylindrical liner and the upper baffle plate comprise a conductive or insulating material.

[0017] In one exemplary embodiment, the inner cylindrical liner and the upper baffle plate include materials formed of quartz, Si, or SiC.

[0018] In one exemplary embodiment, the outer cylindrical liner and the lower baffle plate comprise an electrically conductive material.

[0019] In one exemplary embodiment, the outer cylindrical liner and the lower baffle plate comprise an electrically conductive material and a plasma resistant coating on the electrically conductive material.

[0020] In one exemplary embodiment, the conductive material of the outer cylindrical liner and lower baffle plate is formed of aluminum.

[0021] In one exemplary embodiment, the ratio of the first width to the second width is between 1:10 and 9:10, and the ratio of the third width to the first width is between 1:10 and 9:1.

[0022] In one exemplary embodiment, the ratio of the fourth width to the fifth width is between 1:10 and 9:10, and the ratio of the sixth width to the fourth width is between 1:10 and 9:10.

[0023] In one exemplary embodiment, a plasma processing apparatus is provided, comprising: a plasma processing chamber; a substrate support disposed within the plasma processing chamber; and a liner structure disposed within the plasma processing chamber to surround a plasma processing space above the substrate support, the liner structure including an inner liner and an outer liner, the inner liner having a plurality of first openings, each of the plurality of first openings having a first width, the outer liner being conductive and coupled to a ground potential, the outer liner having a plurality of second openings, each of the plurality of second openings having an inner opening portion and an outer opening portion, the inner opening portion having a second width greater than the first width, and the outer opening portion having a third width less than the first width.

[0024] In one exemplary embodiment, a plasma processing apparatus is provided that includes a plasma processing chamber, a substrate support disposed within the plasma processing chamber, and a baffle structure disposed within the plasma processing chamber to surround the substrate support, the baffle structure including an upper baffle and a lower baffle, the upper baffle having a plurality of first openings, each of the plurality of first openings having a first width, the lower baffle being conductive and coupled to a ground potential, the lower baffle having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion, the upper opening portion having a second width greater than the first width, and the lower opening portion having a third width less than the first width.

[0025] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are given the same reference numerals, and duplicated explanations will be omitted. Unless otherwise specified, the positional relationship such as up, down, left, right, etc. will be described based on the positional relationship shown in the drawing. The dimensional ratio of the drawings does not indicate the actual ratio, and the actual ratio is not limited to the illustrated ratio.

[0026] <First exemplary embodiment of plasma processing apparatus 1> An example of the configuration of a plasma processing system will be described below. Fig. 1 is a diagram for explaining an example of the configuration of a capacitively coupled plasma processing apparatus. A plasma processing apparatus 1 as a substrate processing apparatus according to an exemplary embodiment executes a plasma processing method for plasma processing a substrate.

[0027] The plasma processing system includes a capacitively coupled plasma processing device 1 and a control unit 2. The capacitively coupled plasma processing device 1 includes a plasma processing chamber (also simply referred to as a "chamber") 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. The plasma processing device 1 also includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas inlet includes a shower head 13. The substrate support 11 is disposed in the plasma processing chamber 10. The shower head 13 is disposed above the substrate support 11. In one embodiment, the shower head 13 constitutes at least a part of a ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space (substrate processing space) 10s defined by the shower head 13, a sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 10s and at least one gas exhaust port for exhausting gas from the plasma processing space. The plasma processing chamber 10 is grounded. The showerhead 13 and the substrate support 11 are electrically insulated from the plasma processing chamber 10.

[0028] The substrate support 11 includes a main body 50 and a ring assembly 51. The main body 50 has a central region 50a for supporting the substrate W and an annular region 50b for supporting the ring assembly 51. A wafer is an example of the substrate W. The annular region 50b of the main body 50 surrounds the central region 50a of the main body 50 in a plan view. The substrate W is disposed on the central region 50a of the main body 50, and the ring assembly 51 is disposed on the annular region 50b of the main body 50 so as to surround the substrate W on the central region 50a of the main body 50. Therefore, the central region 50a is also called a substrate support surface for supporting the substrate W, and the annular region 50b is also called a ring support surface for supporting the ring assembly 51.

[0029] In one embodiment, the main body 50 includes a base 60 and an electrostatic chuck 61. The base 60 includes a conductive member. The conductive member of the base 60 may function as a lower electrode. The electrostatic chuck 61 is disposed on the base 60. The electrostatic chuck 61 includes a ceramic member 61a and an electrostatic electrode 61b disposed within the ceramic member 61a. The ceramic member 61a has a central region 50a. In one embodiment, the ceramic member 61a also has an annular region 50b. Note that other members surrounding the electrostatic chuck 61, such as the annular electrostatic chuck or the annular insulating member, may have the annular region 50b. In this case, the ring assembly 51 may be disposed on the annular electrostatic chuck or the annular insulating member, or may be disposed on both the electrostatic chuck 61 and the annular insulating member. Also, an RF or DC electrode may be disposed within the ceramic member 61a, in which case the RF or DC electrode functions as a lower electrode. When a bias RF signal or DC signal, which will be described later, is connected to the RF or DC electrode, the RF or DC electrode is also called a bias electrode. It should be noted that both the conductive member of the base 60 and the RF or DC electrode may function as the two lower electrodes.

[0030] The ring assembly 51 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0031] The substrate support 11 may also include a temperature adjustment module configured to adjust at least one of the electrostatic chuck 61, the ring assembly 51, and the substrate to a target temperature. The temperature adjustment module may include a heater, a heat transfer medium, a flow passage 60a, or a combination thereof. A heat transfer fluid such as a brine or a gas flows through the flow passage 60a. In one embodiment, the flow passage 60a is formed in the base 60, and one or more heaters are disposed in the ceramic member 61a of the electrostatic chuck 61. The substrate support 11 may also include a heat transfer gas supply configured to supply a heat transfer gas between the back surface of the substrate W and the central region 50a.

[0032] The substrate support portion 11 is provided with lifters (lift pins) not shown. In one embodiment, the lifters are disposed in a plurality of through holes that vertically penetrate the substrate support portion 11, and are moved vertically in the through holes by a driving device not shown. In one embodiment, the substrate W is carried in and out of the chamber 10 by a transport arm not shown. The lifter supports and raises and lowers the substrate W on the substrate support portion 11, exchanges the substrate W with the transport arm, and can place the substrate W on the substrate support portion 11.

[0033] The shower head 13 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the multiple gas inlets 13c. The shower head 13 also includes an upper electrode. Note that the gas introduction unit may include, in addition to the shower head 13, one or more side gas injectors (SGIs) attached to one or more openings formed in the sidewall 10a.

[0034] The gas supply 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply 20 is configured to supply at least one process gas from a respective gas source 21 through a respective flow controller 22 to the showerhead 13. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply 20 may include one or more flow modulation devices to modulate or pulse a flow rate of the at least one process gas.

[0035] The power source 30 includes an RF power source 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power source 31 is configured to supply at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to at least one lower electrode and / or at least one upper electrode. This causes a plasma to be formed from at least one processing gas supplied to the plasma processing space 10s. Thus, the RF power source 31 can function as at least a part of a plasma generating unit configured to generate a plasma from one or more processing gases in the plasma processing chamber 10. In addition, a bias potential is generated on the substrate W by supplying a bias RF signal to the at least one lower electrode, so that ion components in the formed plasma can be attracted to the substrate W.

[0036] In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit, and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a may be configured to generate a plurality of source RF signals having different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0037] The second RF generating unit 31b is coupled to at least one lower electrode via at least one impedance matching circuit and configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generating unit 31b may be configured to generate a plurality of bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0038] The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generator 32a and a second DC generator 32b. In one embodiment, the first DC generator 32a is connected to at least one lower electrode and configured to generate a first DC signal. The generated first bias DC signal is applied to the at least one lower electrode. In one embodiment, the second DC generator 32b is connected to at least one upper electrode and configured to generate a second DC signal. The generated second DC signal is applied to the at least one upper electrode.

[0039] In various embodiments, at least one of the first and second DC signals may be pulsed. In this case, a sequence of DC-based voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses may have a rectangular, trapezoidal, triangular or combination of these pulse waveforms. In one embodiment, a waveform generator for generating a sequence of voltage pulses from the DC signal is connected between the first DC generator 32a and at least one lower electrode. Thus, the first DC generator 32a and the waveform generator constitute a voltage pulse generator. When the second DC generator 32b and the waveform generator constitute a voltage pulse generator, the voltage pulse generator is connected to at least one upper electrode. The voltage pulses may have a positive polarity or a negative polarity. Also, the sequence of voltage pulses may include one or more positive polarity voltage pulses and one or more negative polarity voltage pulses within one period. The first and second DC generating units 32a, 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may be provided in place of the second RF generating unit 31b.

[0040] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0041] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to execute various steps described in the present disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to execute various steps (plasma processing) described herein. In one embodiment, a part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include, for example, a computer 2a. The computer 2a may include, for example, a processing unit (CPU: Central Processing Unit) 2a1, a storage unit 2a2, and a communication interface 2a3. The processing unit 2a1 may be configured to read a program from the storage unit 2a2 and execute the read program to perform various control operations. This program may be stored in the storage unit 2a2 in advance, or may be acquired via a medium when necessary. The acquired program is stored in the storage unit 2a2, and is read from the storage unit 2a2 by the processing unit 2a1 and executed. The medium may be various storage media readable by the computer 2a, or may be a communication line connected to the communication interface 2a3. The storage unit 2a2 may include a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a local area network (LAN).

[0042] The plasma processing apparatus 1 in this exemplary embodiment includes a plasma confinement structure 100 that defines a plasma processing space 10s. The plasma confinement structure 100 includes a baffle structure and a liner structure. The baffle structure is configured to exhaust an atmosphere (gas) in the plasma processing space 10s. In one embodiment, the baffle structure is disposed in the chamber 10 so as to surround the substrate support 11. The baffle structure includes an upper baffle plate 120 that faces the plasma processing space 10s and a lower baffle plate 152 that is located below the upper baffle plate 120. The upper baffle plate 120 and the lower baffle plate 152 extend in the horizontal direction. An upper surface of the lower baffle plate 152 is in contact with a lower surface of the upper baffle plate 120.

[0043] The liner structure includes an inner cylindrical liner 153 and an outer cylindrical liner 151. In one embodiment, the inner cylindrical liner 153 has a cylindrical shape. The inner cylindrical liner 153 is arranged concentrically with the substrate support 11 and the upper baffle plate 120. The inner cylindrical liner 153 is arranged on the outer end of the upper baffle plate 120. The inner cylindrical liner 153 is located on the horizontal side of the plasma processing space 10s and is exposed to the plasma processing space 10s. In one embodiment, the inner cylindrical liner 153 includes an insulating material and has insulating properties. In one embodiment, the inner cylindrical liner 153 includes a material formed of quartz, Si, or SiC. Note that the inner cylindrical liner 153 may include a conductive material and have conductivity.

[0044] The outer cylindrical liner 151 has a cylindrical shape. The outer cylindrical liner 151 is arranged concentrically with the substrate support 11 and the lower baffle plate 152. The outer cylindrical liner 151 is arranged on the outer end of the lower baffle plate 152. The outer cylindrical liner 151 is overlapped on the outside of the inner cylindrical liner 153 in the radial direction A. The outer cylindrical liner 151 contains a conductive material such as aluminum (Al) and is conductive. In one embodiment, the outer cylindrical liner 151 has a plasma-resistant coating on its surface partially or entirely. In the example of FIG. 2, the inner cylindrical liner 153 is a separate member from the upper baffle plate 120. In this case, the inner cylindrical liner 153 may be in contact with the upper baffle plate 120 or may be separated from it. The inner cylindrical liner 153 may be integrated with the upper baffle plate 120. 2, the outer cylindrical liner 151 is integrated with the lower baffle plate 152, but may be a separate member from the lower baffle plate 152. In this case, the outer cylindrical liner 151 may be in contact with or separate from the lower baffle plate 152. FIG 2 is a perspective view showing an example of the plasma confinement structure 100 in one embodiment.

[0045] In one embodiment, the upper baffle plate 120 has an annular thin plate shape. The upper baffle plate 120 is stacked on the lower baffle plate 152 described below with the plate surface facing upward. The upper baffle plate 120 is located on the outer periphery of the substrate support 11 and below the plasma processing space 10s. The upper baffle plate 120 is exposed to the plasma processing space 10s. In one embodiment, the upper baffle plate 120 includes an insulating material and has insulating properties. In one embodiment, the upper baffle plate 120 includes a material formed of quartz, Si, or SiC. The upper baffle plate 120 may include a conductive material and have conductivity.

[0046] The upper baffle plate 120 has a plurality of first openings 130. In one embodiment, each first opening 130 is an elongated hole extending in a radial direction (direction from the center toward the outer periphery) A of the substrate support portion 11, and penetrates the upper baffle plate 120 in a vertical direction Z from the upper surface to the lower surface. The first openings 130 are provided at equal intervals around the entire circumference in a circumferential direction R of the outer periphery of the substrate support portion 11. In one embodiment, the first openings 130 may be provided at intervals of 1° to 5° in the circumferential direction R.

[0047] The lower baffle plate 152 includes a conductive material such as aluminum (Al) and is conductive. The lower baffle plate 152 has a plasma-resistant coating partially or entirely on its surface. The lower baffle plate 152 is electrically insulated from the substrate support 11. As shown in FIG. 1, in one embodiment, the lower baffle plate 152 is insulated from the substrate support 11 by one or more annular insulating members 155. The lower baffle plate 152 is connected to a ground potential. In one embodiment, the lower baffle plate 152 is connected to a ground potential through the chamber 10. In one embodiment, the lower baffle plate 152 is connected to a ground potential through the shower head 13. The lower baffle plate 152 is electrically insulated from the upper electrode.

[0048] In one embodiment, the plasma confinement structure 100 further includes an inner cylindrical portion 150. The inner cylindrical portion 150 includes a conductive material such as aluminum (Al) and is electrically conductive. The inner cylindrical portion 150 is electrically connected to a lower baffle plate 152 while being electrically insulated from the substrate support 11. In one embodiment, the inner cylindrical portion 150 is insulated from the substrate support 11 by one or more annular insulating members 155. In one embodiment, the lower baffle plate 152 is connected to ground potential through the inner cylindrical portion 150.

[0049] In one embodiment, the inner cylindrical portion 150 has a cylindrical shape and is located on the outer periphery of the substrate support 11 .

[0050] An exhaust passage 160 extending vertically is formed between the side wall of the chamber 10 and the inner circumferential cylindrical portion 150. The exhaust passage 160 communicates with a gas exhaust port 10e at the bottom of the chamber 10.

[0051] 2, in one embodiment, the lower baffle plate 152 has an annular thin plate shape. The upper baffle plate 120 is stacked on the lower baffle plate 152. The lower baffle plate 152 is located on the outer periphery of the substrate support 11 and below the plasma processing space 10s.

[0052] The lower baffle plate 152 has a plurality of second openings 170. Each second opening 170 is an elongated hole extending in the radial direction A of the substrate support 11, and penetrates the lower baffle plate 152 in the vertical direction Z from the upper surface to the lower surface. The second openings 170 are provided at equal intervals around the entire circumference of the outer periphery of the substrate support 11 in the circumferential direction R so as to have the same number and intervals as the first openings 130. In one embodiment, the second openings 170 are provided at intervals of 1° to 5° in the circumferential direction. Each second opening 170 is connected to a corresponding first opening 130.

[0053] 3 is a vertical cross-sectional view showing an example of the widths of the first openings 130 and the second openings 170 when the upper baffle plate 120 and the lower baffle plate 152 in one embodiment are cut along the circumferential direction R. In one embodiment, the first openings 130 have a first width D1 that is constant from the inlet to the outlet of the first openings 130 in the circumferential direction R of the first openings 130 (the short side direction of the first openings 130).

[0054] In one embodiment, the second opening 170 has an upper opening portion 200 located on the upstream side of the second opening 170, and a lower opening portion 201 located on the downstream side of the second opening 170. The upper opening portion 200 has a second width D2 that is constant from the inlet to the outlet of the upper opening portion 200 in the circumferential direction R of the second opening 170 (the short side direction of the second opening 170). The second width D2 is larger than the first width D1.

[0055] The lower opening portion 201 has a third width D3 that is constant from the inlet to the outlet of the lower opening portion 201 in the circumferential direction R of the second opening 170. The third width D3 is smaller than the first width D1 and the second width D2.

[0056] In one embodiment, the ratio of the first width D1 to the second width D2 is between 1:10 and 9:10.

[0057] In one embodiment, the ratio of the third width D3 to the first width D1 is between 1:10 and 9:10.

[0058] The length K2 of the lower opening 201 is equal to or smaller than the length K1 of the upper opening 200. In one embodiment, the ratio of the length K1 of the upper opening 200 to the length K2 of the lower opening 201 is between 1:1 and 10:1.

[0059] 4 is a vertical cross-sectional view showing an example of the lengths of the first openings 130 and the second openings 170 when the upper baffle plate 120 and the lower baffle plate 152 in one embodiment are cut along the radial direction A. In one embodiment, the first openings 130 have a first length L1 that is constant from the inlet to the outlet of the first openings 130 in the radial direction A of the first openings 130 (the longitudinal direction of the first openings 130).

[0060] In one embodiment, the upper opening portion 200 of the second opening 170 has a second length L2 that is constant from the inlet to the outlet of the second opening 170 in the radial direction A of the second opening 170 (the longitudinal direction of the second opening 170). In one embodiment, the second length L2 is greater than the first length L1. In one embodiment, the lower opening portion 201 of the second opening 170 has a third length L3 that is constant from the inlet to the outlet of the second opening 170 in the radial direction A of the second opening 170. In one embodiment, the third length L3 is less than the first length L1 and the second length L2.

[0061] <An example of a plasma processing method> The plasma processing method includes an etching process in which a film on a substrate W is etched using plasma.

[0062] First, the substrate W is carried into the chamber 10 by the transport arm, placed on the substrate support portion 11 by the lifter, and held by suction on the substrate support portion 11 as shown in FIG.

[0063] Next, a processing gas is supplied to the shower head 13 by the gas supply unit 20, and is supplied to the plasma processing space 10s from the shower head 13. The processing gas supplied at this time contains a gas that generates active species necessary for etching the substrate W.

[0064] One or more RF signals are supplied to the upper electrode and / or the lower electrode from the RF power supply 31. The atmosphere in the plasma processing space 10s may be exhausted from the gas exhaust port 10e, and the inside of the plasma processing space 10s may be depressurized. Thus, plasma is generated in the plasma processing space 10s, and the substrate W is etched.

[0065] The atmosphere in the plasma processing space 10s during the etching process is exhausted by the exhaust system 40. The atmosphere in the plasma processing space 10s flows into the first opening 130 on the outer periphery of the substrate support 11, passes through the second opening 170, and passes through the exhaust passage 160 to be exhausted from the gas exhaust port 10e.

[0066] According to this exemplary embodiment, the plasma processing apparatus 1 has a baffle structure arranged to surround the substrate support 11 in the chamber 10. The baffle structure has an upper baffle plate 120 and a lower baffle plate 152. The upper baffle plate 120 has a plurality of first openings 130. Each of the plurality of first openings 130 has a first width D1. The lower baffle plate 152 is conductive and connected to a ground potential. The lower baffle plate 152 also has a plurality of second openings 170 that are respectively connected to the plurality of first openings 130. Each of the plurality of second openings 170 has an upper opening portion 200 and a lower opening portion 201. The upper opening portion 200 has a second width D2 that is larger than the first width D1. The lower opening portion 201 has a third width D3 that is smaller than the first width D1. In the conventional plasma processing apparatus, the exhaust portion such as the baffle plate is scraped by the plasma during the plasma processing, and deposits are generated on the exhaust portion, which causes fluctuations in the exhaust function of the plasma processing apparatus. Fluctuations in the exhaust function of the plasma processing apparatus also affect the plasma processing of the substrate. According to this exemplary embodiment, as shown in FIG. 3, the second opening 170 has an upper opening portion 200 having a second width D2 larger than the first width D1 and a lower opening portion 201 having a third width D3 smaller than the first width D1, so that the exhaust rate of the plasma processing space 10s can be controlled while ensuring the exhaustability of the atmosphere in the plasma processing space 10s. This makes it possible to suppress fluctuations in the exhaust function of the plasma processing apparatus 1 over time. In addition, since the conductive lower baffle plate 152 is connected to the ground potential, an RF return circuit can be formed in which the RF power supplied to the substrate support portion 11 flows to the ground via the lower baffle plate 152.

[0067] In this exemplary embodiment, the first opening 130 has a first width D1 from the inlet to the outlet of the first opening 130, so that the exhaust performance of the atmosphere in the plasma processing space 10s can be appropriately ensured.

[0068] In this exemplary embodiment, the upper opening 200 of the second opening 170 has a second width D2 from the inlet to the outlet of the upper opening 200. This ensures a sufficient space in the upper opening 200, and the flow path in the lower opening 201 is narrower than the second width D2, so that the exhaust rate of the atmosphere in the plasma processing space 10s can be controlled.

[0069] In the present exemplary embodiment, the upper baffle plate 120 includes a material formed of quartz, Si, or SiC, which improves the plasma resistance of the upper baffle plate 120 and can reduce the generation of particles in the chamber 10.

[0070] In the present exemplary embodiment, the lower baffle plate 152 includes a conductive material, which can more reliably ensure the RF return circuit.

[0071] In this exemplary embodiment, the lower baffle plate 152 includes a conductive material and a plasma-resistant coating covering the surface of the conductive material, which improves the plasma resistance of the lower baffle plate 152 and can control the exhaust rate of the plasma processing space 10s while ensuring the exhaustability of the atmosphere in the plasma processing space 10s for a long period of time.

[0072] In this exemplary embodiment, the conductive material of the lower baffle plate 152 is made of aluminum (Al), so that the RF return circuit can be suitably ensured.

[0073] <Second exemplary embodiment of the plasma processing apparatus 1> In one embodiment, the plasma processing apparatus 1 includes a liner structure 240 instead of the liner structure of the exemplary embodiment 1. The liner structure 240 is configured to exhaust gas in the plasma processing space 10s from a side. FIG. 5 is a diagram showing an example of a configuration of the plasma processing apparatus 1 having the plasma confinement structure 100 including the baffle structure and the liner structure 240.

[0074] In one embodiment, the liner structure 240 is disposed in the chamber 10 so as to surround the plasma processing space 10s above the substrate support 11. The liner structure 240 includes an inner cylindrical liner 250 and an outer cylindrical liner 270. In one embodiment, the inner cylindrical liner 250 has a cylindrical shape. The inner cylindrical liner 250 is disposed concentrically with the substrate support 11 and the upper baffle plate 120. The inner cylindrical liner 250 is disposed on the outer end of the upper baffle plate 120. The inner cylindrical liner 250 is located on the horizontal side of the plasma processing space 10s and is exposed to the plasma processing space 10s. In one embodiment, the inner cylindrical liner 250 includes an insulating material and has insulating properties, similar to the upper baffle plate 120. In one embodiment, the inner cylindrical liner 250 includes a material formed of quartz, Si, or SiC. The inner cylindrical liner 250 may include a conductive material and have electrical conductivity. In the example of FIG. 5, the inner cylindrical liner 250 is a member separate from the upper baffle plate 120. In this case, the inner cylindrical liner 250 may be in contact with the upper baffle plate 120 or may be separated from it. The inner cylindrical liner 250 may be integrated with the upper baffle plate 120. In the example of FIG. 5, the outer cylindrical liner 270 is integrated with the lower baffle plate 152, but may be a member separate from the lower baffle plate 152. In this case, the outer cylindrical liner 270 may be in contact with the lower baffle plate 152 or may be separated from it.

[0075] The inner cylindrical liner 250 has a plurality of third openings 260. In one embodiment, each third opening 260 is an elongated hole extending in the up-down direction Z, and penetrates the inner cylindrical liner 250 in the radial direction A from the inner surface to the outer surface. The third openings 260 are provided at equal intervals around the entire circumference in the circumferential direction R of the substrate support 11. The third openings 260 may be provided at intervals of 1° to 5° in the circumferential direction.

[0076] In one embodiment, the outer cylindrical liner 270 has a cylindrical shape. The outer cylindrical liner 270 is arranged concentrically with the substrate support 11 and the lower baffle plate 152. The outer cylindrical liner 270 is arranged on the outer end of the lower baffle plate 152. The outer cylindrical liner 270 is arranged overlapping the outer side of the inner cylindrical liner 250 in the radial direction A. The outer cylindrical liner 270 includes a conductive material such as aluminum (Al) and is conductive. The outer cylindrical liner 270 has a plasma-resistant coating partially or entirely on its surface.

[0077] The outer cylindrical liner 270 has a plurality of fourth openings 280. In one embodiment, each of the fourth openings 280 is an elongated hole extending in the vertical direction Z, and penetrates the outer cylindrical liner 270 in the radial direction A from the inner surface to the outer surface. The fourth openings 280 are provided at equal intervals around the entire circumference of the outer periphery of the substrate support 11 in the circumferential direction R so as to be the same in number and at the same intervals as the third openings 260. The fourth openings 280 may be provided at intervals of 1° to 5° in the circumferential direction. Each of the fourth openings 280 communicates with the corresponding third opening 260. The outer space of the fourth openings 280 communicates with the exhaust passage 160.

[0078] 6 is a cross-sectional view showing an example of the widths of the third opening 260 and the fourth opening 280 when the inner cylindrical liner 250 and the outer cylindrical liner 270 in one embodiment are cut along the circumferential direction R. In one embodiment, the third opening 260 has a fourth width D4 that is constant from the inlet to the outlet of the third opening 260 in the circumferential direction R of the third opening 260 (the short direction of the third opening 260).

[0079] In one embodiment, the fourth opening 280 has an inner opening portion 290 located on the upstream side of the fourth opening 280, and an outer opening portion 291 located on the downstream side of the fourth opening 280. The inner opening portion 290 has a fifth width D5 that is constant from the inlet to the outlet of the inner opening portion 290 in the circumferential direction (short direction of the fourth opening 280) R of the fourth opening 280. The fifth width D5 is larger than the fourth width D4.

[0080] The outer opening portion 291 has a sixth width D6 that is constant from the inlet to the outlet of the outer opening portion 291 in the circumferential direction R of the fourth opening 280. The sixth width D6 is smaller than the fourth width D4 and the fifth width D5.

[0081] The ratio of the fourth width D4 to the fifth width D5 is between 1:10 and 9:10.

[0082] The ratio of the sixth width D6 to the fourth width D4 is between 1:10 and 9:10.

[0083] The length K4 of the outer opening 291 is equal to or smaller than the length K3 of the inner opening 290. In one embodiment, the ratio of the length K3 of the inner opening 290 to the length K4 of the outer opening 291 is between 1:1 and 10:1.

[0084] 7 is a vertical cross-sectional view showing an example of the lengths of the third opening 260 and the fourth opening 280 when the inner cylindrical liner 250 and the outer cylindrical liner 270 in one embodiment are cut along the vertical direction Z. The third opening 260 has a fourth length L4 that is constant from the inlet to the outlet of the third opening 260 in the vertical direction Z of the third opening 260.

[0085] The inner opening portion 290 of the fourth opening 280 has a fifth length L5 that is constant from the inlet to the outlet of the fourth opening 280 in the vertical direction Z of the fourth opening 280. In one embodiment, the fifth length L5 is greater than the fourth length L4. The outer opening portion 291 of the fourth opening 280 has a sixth length L6 that is constant from the inlet to the outlet of the fourth opening 280 in the vertical direction Z of the fourth opening 280. In one embodiment, the sixth length L6 is less than the fourth length L4 and the fifth length L5.

[0086] The first width D1 of the first opening 130 and the fourth width D4 of the third opening 260 may be the same dimension or different dimensions. The second width D2 of the second opening 170 and the fifth width D5 of the fourth opening 280, and the third width D3 of the second opening 170 and the sixth width D6 of the fourth opening 280 may be the same dimension or different dimensions. Other configurations may be similar to those of the above exemplary embodiment 1.

[0087] During the etching process, the atmosphere in the plasma processing space 10s flows into the first opening 130, passes through the second opening 170, and is exhausted from the gas exhaust port 10e through the exhaust passage 160. The atmosphere in the plasma processing space 10s also flows into the third opening 260, passes through the fourth opening 280, and is exhausted from the gas exhaust port 10e through the exhaust passage 160.

[0088] According to this exemplary embodiment, the second opening 170 on the lower side of the plasma processing space 10s has an upper opening portion 200 having a second width D2 larger than the first width D1, and a lower opening portion 201 having a third width D3 smaller than the first width D1. Also, the fourth opening 280 on the side of the plasma processing space 10s has an inner opening portion 290 having a fifth width D5 larger than the fourth width D4, and an outer opening portion 291 having a sixth width D6 smaller than the fourth width D4. This makes it possible to control the exhaust rate of the atmosphere in the plasma processing space 10s while ensuring the exhaustability of the atmosphere in the plasma processing space 10s. Therefore, it is possible to suppress the fluctuation of the exhaust function over time in the plasma processing device 1.

[0089] <Third Exemplary Embodiment of Plasma Processing Apparatus 1> In one embodiment, the plasma processing apparatus 1 may include a non-porous baffle structure instead of the baffle structure of the exemplary embodiment 2. Thus, the plasma processing apparatus 1 includes a liner structure 240 having a third opening 260 and a fourth opening 280, and a non-porous baffle structure. This allows the atmosphere in the plasma processing space 10s to be exhausted only from the sides. FIG. 8 is a diagram showing a configuration example of the plasma processing apparatus 1 in this exemplary embodiment. In this exemplary embodiment, the inner cylindrical liner 250 has a third opening 260, and the outer cylindrical liner 270 has a fourth opening 280. Meanwhile, the upper baffle plate 120 does not have the first opening 130, and the lower baffle plate 152 does not have the second opening 170. The other configurations are the same as those of the exemplary embodiment 2.

[0090] <Fourth Exemplary Embodiment of Plasma Processing Apparatus 1> FIG. 9 shows another configuration example of the second opening 170 in the lower baffle plate 152. In one embodiment, in the circumferential direction R of the second opening 170, the upper opening portion 200 of the second opening 170 may have a second width D2 at the inlet of the upper opening portion 200 and a third width D3 at the outlet of the upper opening portion 200. Thereby, the second opening 170 may have a shape in which the width narrows from the inlet to the outlet of the upper opening portion 200. Note that the second width D2 is larger than the first width D1, and the third width D3 is smaller than the first width D1. In such a case, the second opening 170 can also regulate the exhaust rate of the atmosphere in the plasma processing space 10s.

[0091] 10 shows another example of the configuration of the fourth opening 280 in the outer cylindrical liner 270. In one embodiment, in the circumferential direction R of the fourth opening 280, the inner opening portion 290 of the fourth opening 280 may have a fifth width D5 at the inlet of the inner opening portion 290 and a sixth width D6 at the outlet of the inner opening portion 290. As a result, the fourth opening 280 may have a shape in which the width narrows from the inlet to the outlet of the inner opening portion 290. Note that the fifth width D5 is larger than the fourth width D4, and the sixth width D6 is smaller than the fourth width D4. In this case, the fourth opening 280 can also regulate the exhaust rate of the atmosphere in the plasma processing space 10s.

[0092] The plasma processing apparatus may be modified in various ways without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment may be added to other embodiments within the scope of ordinary creativity of a person skilled in the art. Also, some components in one embodiment may be replaced with corresponding components in other embodiments.

[0093] The present plasma processing apparatus may be a plasma processing apparatus using any plasma source, such as an inductively coupled plasma or a microwave plasma, other than a capacitively coupled plasma processing apparatus. [Explanation of symbols]

[0094] 1: plasma processing apparatus, 10: chamber, 10s: plasma processing space, 11: substrate support, 100: plasma confinement structure, 120: upper baffle plate, 130: first opening, 152: lower baffle plate, 170: second opening, 200: upper opening portion, 201: lower opening portion, 240: liner structure, 250: inner cylindrical liner, 260: third opening, 270: outer cylindrical liner, 280: fourth opening, 290: inner opening portion, 291: outer opening portion, D1: first width, D2: second width, D3: third width, D4: fourth width, D5: fifth width, D6: sixth width, W: substrate

Claims

1. a plasma processing chamber; a substrate support disposed within the plasma processing chamber; a baffle structure disposed within the plasma processing chamber and surrounding the substrate support, the baffle structure including an upper baffle plate and a lower baffle plate, the upper baffle plate having a plurality of first openings, each of the plurality of first openings having a first width, the lower baffle plate being electrically conductive and coupled to a ground potential, the lower baffle plate having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion, the upper opening portion having a second width greater than the first width, and the lower opening portion having a third width less than the first width; a liner structure disposed within the plasma processing chamber to surround a plasma processing space above the substrate support, the liner structure including an inner cylindrical liner and an outer cylindrical liner, the inner cylindrical liner having a plurality of third openings, each of the plurality of third openings having a fourth width, the outer cylindrical liner being electrically conductive and coupled to a ground potential, the outer cylindrical liner having a plurality of fourth openings, each of the plurality of fourth openings having an inner opening portion and an outer opening portion, the inner opening portion having a fifth width greater than the fourth width, and the outer opening portion having a sixth width less than the fourth width; A plasma processing apparatus comprising:

2. The plasma processing apparatus of claim 1 , wherein the first opening has the first width from an entrance to an exit of the first opening.

3. The plasma processing apparatus of claim 2 , wherein the third opening has the fourth width from an entrance to an exit of the third opening.

4. The plasma processing apparatus of claim 3 , wherein the upper opening portion of the second opening has the second width from an inlet to an outlet of the upper opening portion.

5. the upper opening portion of the second opening has the second width at an entrance of the upper opening portion, and the third width at an exit of the upper opening portion, and has a shape in which the width narrows from the entrance to the exit of the upper opening portion. The plasma processing apparatus according to claim 3 .

6. the inner opening portion of the fourth opening has the fifth width from an inlet to an outlet of the inner opening portion. The plasma processing apparatus according to claim 1 .

7. the inner opening portion of the fourth opening has the fifth width at an entrance of the inner opening portion, and the sixth width at an exit of the inner opening portion, and has a shape in which the width narrows from the entrance to the exit of the inner opening portion. The plasma processing apparatus according to claim 1 .

8. The plasma processing apparatus of claim 1 , wherein the inner cylindrical liner and the upper baffle plate comprise a conductive or insulating material.

9. The plasma processing apparatus of claim 1 , wherein the inner cylindrical liner and the upper baffle plate comprise materials made of quartz, Si, or SiC.

10. The plasma processing apparatus of claim 9 , wherein the outer cylindrical liner and the lower baffle plate comprise an electrically conductive material.

11. The plasma processing apparatus of claim 9 , wherein the outer cylindrical liner and the lower baffle plate comprise an electrically conductive material and a plasma resistant coating on the electrically conductive material.

12. The plasma processing apparatus of claim 11 , wherein the conductive material of the outer cylindrical liner and the lower baffle plate are formed of aluminum.

13. a ratio of the first width to the second width is between 1:10 and 9:10; The plasma processing apparatus of claim 1 , wherein a ratio of the third width to the first width is between 1:10 and 9:

10.

14. a ratio of the fourth width to the fifth width is between 1:10 and 9:10; The plasma processing apparatus of claim 1 , wherein a ratio of the sixth width to the fourth width is in the range of 1:10 to 9:

10.

15. a plasma processing chamber; a substrate support disposed within the plasma processing chamber; a liner structure disposed within the plasma processing chamber to surround a plasma processing space above the substrate support, the liner structure including an inner liner and an outer liner, the inner liner having a plurality of first openings, each of the plurality of first openings having a first width, the outer liner being electrically conductive and coupled to a ground potential, the outer liner having a plurality of second openings, each of the plurality of second openings having an inner opening portion and an outer opening portion, the inner opening portion having a second width greater than the first width, and the outer opening portion having a third width less than the first width; A plasma processing apparatus comprising:

16. a plasma processing chamber; a substrate support disposed within the plasma processing chamber; a baffle structure disposed within the plasma processing chamber and surrounding the substrate support, the baffle structure including an upper baffle and a lower baffle, the upper baffle having a plurality of first openings, each of the plurality of first openings having a first width, the lower baffle being electrically conductive and coupled to a ground potential, the lower baffle having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion, the upper opening portion having a second width greater than the first width, and the lower opening portion having a third width less than the first width; A plasma processing apparatus comprising:

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