Large-area, high-density plasma processing chamber for flat panel displays

Abstract

To provide a lid plate for independent control of plasma density and a gas distribution with an interior space of a plasma-enhanced chemical vapor deposition (PECVD) chamber.SOLUTION: In a PECVD chamber, a lid assembly includes a gas distribution assembly comprising a plurality of inner diffuser plates 505, each inner diffuser plate being combined to a lid plate body 705 by a fastener 520. A portion of the inner diffuser plates is separated by a dielectric plate 510, and each of the plurality of inner diffuser plates includes a groove 700 formed in a first surface and one or more orifice holes 525 formed between a surface of the groove and a second surface opposing the first surface.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present disclosure relate generally to process chambers, such as plasma enhanced chemical vapor deposition (PECVD) chambers. In particular, embodiments of the present disclosure relate to a lid assembly for a process chamber. [Background technology]

[0002] In the manufacture of solar panels and flat panel displays, numerous processes are employed to deposit thin films onto substrates, such as semiconductor substrates, solar panel substrates, and liquid crystal display (LCD) and / or organic light emitting diode (OLED) substrates, to form electronic devices thereon. Deposition is generally accomplished by introducing precursor gases into a chamber having a substrate disposed on a temperature-controlled substrate support. The precursor gases are typically directed through a gas distribution plate disposed near the top of the chamber. The precursor gases in the chamber may be energized (e.g., excited) into a plasma by applying RF power from one or more radio frequency (RF) sources coupled to the chamber to a conductive showerhead disposed within the chamber. The excited gases react to form a layer of material on a surface of the substrate disposed on a temperature-controlled substrate support.

[0003]

[0003] The size of the substrate for forming electronic devices today is usually more than one square meter in surface area. Achieving film thickness uniformity across these substrates is difficult. Film thickness uniformity becomes even more difficult as the size of the substrate increases. Traditionally, plasma is generated in conventional chambers to ionize gas atoms and generate radicals of deposition gas. They are useful for depositing film layers on substrates of this size using a capacitively coupled electrode configuration. Recently, interest in inductively coupled plasma configurations, which have been historically utilized in deposition on round substrates or wafers, has been explored for use in deposition processes for these large substrates. However, inductive coupling utilizes dielectric materials as structural support components. These dielectric materials do not have the structural strength to withstand the structural loads caused by the presence of atmospheric pressure on one side of the large area structure of the chamber, the atmospheric side, and reduced pressure conditions on the other side, as used in conventional chambers for these larger substrates. Therefore, inductively coupled plasma systems are being developed for plasma processing of large area substrates. However, the process uniformity, for example, the uniformity of deposition thickness across large substrates, is not as desired.

[0004]

[0004] Therefore, what is needed in the art is a chamber lid assembly for use with large area substrates that is configured to improve film thickness uniformity across the deposition surface of the substrate. Summary of the Invention

[0005]

[0005] Embodiments described herein provide a chamber lid plate for independently controlling plasma density and gas distribution within an interior volume of the chamber. In one embodiment, the lid assembly includes a gas distribution assembly including a plurality of diffuser plates, portions of which are separated by a dielectric plate, each of the plurality of diffuser plates including a groove formed in a first surface and one or more orifice holes formed between a surface of the groove and a second surface opposite the first surface.

[0006]

[0006] In another embodiment, the lid plate includes a gas distribution assembly having a plurality of diffuser plates, portions of the plurality of diffuser plates separated by a plurality of dielectric plates and a plurality of separation plates, and each of the plurality of diffuser plates includes a groove formed in a first surface and one or more orifice holes formed between the surface of the groove and a second surface opposite the first surface.

[0007]

[0007] In yet another embodiment, the lid plate includes a gas distribution assembly having a plurality of diffuser plates, the plurality of diffuser plates including a plurality of inner diffuser plates and an outer diffuser plate on either side of the plurality of inner diffuser plates, the plurality of inner diffuser plates being separated by one or more dielectric plates and a plurality of separation plates, each of the plurality of diffuser plates including a groove formed in a first surface and one or more orifice holes formed between the surface of the groove and a second surface opposite the first surface.

[0008]

[0008] In order that the features of the present disclosure described above may be understood in detail, a more particular description of the present disclosure briefly summarized above may be obtained by referring to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the attached drawings only show exemplary embodiments, and therefore should not be considered as limiting the scope of the present disclosure, and other equally effective embodiments may be acceptable. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic cross-sectional view of a chamber according to one embodiment. [Diagram 2]

[0010] 1 is a schematic cross-sectional view of a plate according to one embodiment; [Figure 3A]

[0011] FIG. 2 is a schematic perspective view of a plate according to one embodiment. [Figure 3B]

[0012] FIG. 2 is a negative perspective view of a plate according to one embodiment. [Figure 4]

[0013] FIG. 2 is a schematic bottom view of a plate according to one embodiment. [Diagram 5]

[0014] FIG. 2 is a schematic bottom view of one embodiment of a lid plate. [Figure 6A]

[0015] FIG. 6 is a cross-sectional view of the lid plate of FIG. 5. [Figure 6B] FIG. 6 is a cross-sectional view of the lid plate of FIG. 5. [Figure 7]

[0016] FIG. 6B is an enlarged cross-sectional view of the lid plate from FIG. 6A. [Figure 8]

[0017] FIG. 4 is a plan view of the rear side of the diffuser plate. [Figure 9A]

[0018] 9A-9C are cross-sectional views from FIG. 8 showing various configurations of the diffuser plate. [Figure 9B] 9A-9C are cross-sectional views from FIG. 8 showing various configurations of the diffuser plate. [Figure 9C] 9A-9C are cross-sectional views from FIG. 8 showing various configurations of the diffuser plate. [Figure 10]

[0019] FIG. 13 is a schematic bottom view of another embodiment of the lid plate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010]

[0020] For ease of understanding, wherever possible, like reference numerals have been used to designate like elements common to the figures, and it is believed that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0011]

[0021]

[0005] The embodiments described herein provide a chamber lid assembly for independently controlling plasma density and gas distribution within an interior volume of the chamber. The lid assembly includes a plasma generation system and a gas distribution assembly. The plasma generation system includes a plurality of dielectric plates having a lower surface oriented relative to a reduced pressure and an upper surface operable to be oriented relative to atmospheric pressure. One or more coils are disposed on or above the plurality of dielectric plates. The gas distribution assembly includes a first diffuser and a second diffuser. The first diffuser includes a plurality of first channels that intersect with a plurality of second channels of the second diffuser.

[0012]

[0022] 1 is a schematic cross-sectional view of a chamber 100, such as a PECVD chamber, that may benefit from embodiments described herein. Suitable chambers may be obtained from Applied Materials, Inc., Santa Clara, Calif. It should be understood that the system described below is an exemplary chamber, and that other chambers, including chambers from other manufacturers, may be used or modified to implement aspects of the present disclosure. The chamber 100 includes a chamber body 104, a lid assembly 106, and a substrate support assembly 108. The lid assembly 106 is disposed on an upper end of the chamber body 104.

[0013]

[0023] The substrate support assembly 108 is disposed at least partially within the interior space of the chamber body 104. The substrate support assembly 108 includes a substrate support 110 and a shaft 112. The substrate support 110 has a support surface 118 for supporting the substrate 102. In one embodiment, which may be combined with other embodiments described herein, the substrate 102 is a large area substrate, such as a substrate having a surface area of ​​about one square meter or more. However, the substrate 102 is not limited to any particular size or shape. In one aspect, the term "substrate" refers to any polygonal, square, rectangular, curved, or other non-circular workpiece, such as, for example, glass or polymer substrates used in the manufacture of flat panel displays.

[0014]

[0024] The substrate support 110 typically includes a heating element (not shown). The substrate support 110 is movably disposed within the interior space of the chamber body 104 by a shaft 112 extending through the chamber body 104. The shaft 112 is then connected to a substrate support drive system 114 that moves the substrate support 110 between a raised processing position (as shown) and a lowered position that facilitates transfer of the substrate into and out of the interior space of the chamber body 104 through an opening 116 formed through the chamber body 104. In one embodiment, which may be combined with other embodiments described herein, the substrate support drive system 114 rotates the shaft 112 and the substrate support 110.

[0015]

[0025] The lid assembly 106 includes a lid plate 122 disposed on an upper end of the chamber body 104. The lid plate 122 includes a gas distribution assembly 124 and a plasma generation system 126. The gas distribution assembly 124 includes one or more first diffuser inlets 130 of a first diffuser 128 disposed within the lid plate 122. In an embodiment that may be combined with other embodiments described herein, the lid plate 122 includes an aluminum-containing material. In an embodiment that may be combined with other embodiments described herein, the gas distribution assembly 124 includes one or more second diffuser inlets (shown in FIGS. 3A and 3B ) coupled to a second diffuser 136 disposed within the lid plate 122. The one or more first diffuser inlets 130 may be coupled to a first gas source 134. Each of the one or more first diffuser inlets 130 is in fluid communication with a first channel (shown in FIG. 3B) of the first diffuser 128. The one or more second diffuser inlets (shown in FIGS. 3A and 3B) can be coupled to a second gas source 138. Each of the one or more second diffuser inlets (shown in FIGS. 3A and 3B) is in fluid communication with a second channel (shown in FIG. 3B) of the second diffuser 136. In some embodiments, the gas provided by the first gas source 134 is the same as the gas provided by the second gas source 138.

[0016]

[0026] The first diffuser 128 supplies one or more first gases from a first gas source 134 to the processing region 120 between the underside 160 of the lid plate 122 and the substrate support 110. The one or more first gases are provided to the processing region 120 through a plurality of first holes (shown in FIG. 4) in each first channel (shown in FIG. 3B) of the first diffuser 128. A flow controller 141, such as a mass flow control (MFC) device, is disposed between each of the one or more first diffuser inlets 130 and the first gas source 134 to control the flow rate of the first gas from the first gas source 134 to each first channel (shown in FIG. 3B), thus providing independent control of the first gas flow within the processing region 120. The one or more second gases are provided to the processing region 120 through a plurality of second holes (shown in FIG. 4) in each second channel (shown in FIG. 3B) of the second diffuser 136. A flow controller 141 is disposed between each of the one or more second diffuser inlets (shown in FIGS. 3A and 3B) and the second gas source 138 to control the flow rate of the second gas from the second gas source 138 to each second channel (shown in FIG. 3B), thus providing independent control of the second gas flow in the processing region 120. A pump 155 is in fluid communication with the processing region 120. The pump 155 is operable to control the pressure in the processing region 120 and to exhaust gases and by-products from the processing region 120. In one embodiment, each of the first gas and the second gas is the same gas.

[0017]

[0027] The plasma generating system 126 includes one or more cavities 140 arranged in parallel in the lid plate 122. Each of the one or more cavities 140 includes recesses for a plurality of dielectric plates 150 (shown in FIGS. 2 to 4). Each of the one or more cavities 140 includes one or more coils 142 arranged on or above the plurality of dielectric plates 150. The plurality of dielectric plates 150 provide a physical barrier having a structural strength to withstand a structural load generated by the presence of atmospheric pressure in the one or more cavities 140 and the presence of reduced pressure in the interior space of the chamber body 104. Each of the plurality of dielectric plates 150 includes a lower surface 151 and an upper surface 153 oriented opposite the lower surface 151. The lower surface 151 is oriented relative to (i.e., toward) the processing region 120. The lower surface 151 of each of the dielectric plates 150 is thereby exposed to a first pressure in the processing region 120, such as a reduced pressure. The top surface 153 is oriented away from (i.e., away from) the processing region 120. The top surface 153 of each of the dielectric plates 150 is thereby exposed to a second pressure outside of the processing region 120, such as atmospheric pressure. In one embodiment, which may be combined with other embodiments described herein, the first pressure and the second pressure are different.

[0018]

[0028] In one embodiment, which may be combined with other embodiments described herein, the dielectric plate includes at least one of aluminum oxide (Al2O3), aluminum nitride (AlN), quartz, zirconium dioxide (ZrO2), zirconium nitride (ZrN), and glass materials. Each coil 142 has an electrical input terminal 144 connected to a power source 152 and an electrical output terminal 146 connected to a ground 154. In one embodiment, which may be combined with other embodiments described herein, each coil 142 is connected to the power source 152 via a matching box 148 having a matching circuit for adjusting electrical characteristics, such as impedance, of the coil 142. Each coil 142 is configured to generate an electromagnetic field that energizes at least one of the one or more first gases and the second gas into an inductively coupled plasma. Independently connecting each coil 142 of each of the one or more cavities 140 to a respective power source 152 allows for independent control of the power level and frequency provided to each coil 142. Independent control of the power level and frequency provided to each coil 142 allows the density of the inductively coupled plasma to be independently controlled within process zones 156a, 156b, 156c, 156d (collectively referred to as process zones 156) corresponding to each coil 142. A controller 158 is coupled to the chamber 100 and configured to control aspects of the chamber 100 during processing.

[0019]

[0029] 2 is a schematic cross-sectional view of the lid plate 122. FIG. 2 shows one or more cavities 140, coils 142, electrical input terminals 144, electrical output terminals 146, and recesses 201 for one or more first diffuser inlets 130 of the first diffuser 128 of the gas distribution assembly 124, as well as a plurality of dielectric plates 150 of the plasma generating system 126. In an embodiment that may be combined with other embodiments described herein, the lid assembly 106 includes a heat exchange system including a plurality of fluid channels (shown in FIG. 3B) that can be coupled to a heat exchanger (not shown). The heat exchanger, such as a cooler, is in fluid communication with each of the fluid channels via the fluid inlets 202 and fluid outlets 204 of the plurality of fluid channels (shown in FIG. 3B). The lid plate 122 is thereby maintained at a predetermined temperature. Each coil 142 has one or more turns.

[0020]

[0030] 3A is a schematic perspective view of the lid plate 122 without the plurality of dielectric plates 150 and the respective coils 142. FIG. 3B is a negative perspective view of the lid plate 122 without the plurality of dielectric plates 150 and the respective coils 142. The lid plate 122 includes a plurality of first channels 302. Each of the first channels 302 is disposed or formed in the lid plate 122. Each of the first channels 302 of the plurality of first channels 302 is disposed adjacent to one of the recesses 201. Each of the recesses 201 is between two adjacent first channels 302 disposed in the lid plate 122. Each of the first channels 302 is in fluid communication with at least one first diffuser inlet of the one or more first diffuser inlets 130.

[0021]

[0031] In one embodiment that may be combined with other embodiments described herein, the lid plate 122 includes a plurality of second channels 304 disposed or formed therein. Each second channel of the plurality of second channels 304 is disposed between two adjacent cavities 140 of the one or more cavities 140. Each of the second channels 304 is in fluid communication with at least one second diffuser of the one or more second diffuser inlets 306 formed in the lid plate 122. In another embodiment that may be combined with other embodiments described herein, the lid plate 122 includes a plurality of fluid channels 308 of a heat exchange system that may be coupled to a heat exchanger (not shown). The heat exchanger, such as a cooler, is in fluid communication with the plurality of fluid channels 308 via the fluid inlet 202 and the fluid outlet 204. The plurality of fluid channels 308 are disposed adjacent to the one or more cavities 140 and the recess outside the recess 201.

[0022]

[0032] 4 is a schematic bottom view of the lid plate 122. As shown in FIG. 4, each of the first channels 302 and each of the second channels 304 intersect. In an embodiment that may be combined with other embodiments described herein, each of the first channels 302 is orthogonal to each of the second channels 304. Each of the dielectric plates 150 is disposed adjacent to the first channel 302 and adjacent to at least one of the second channels 304. Each of the first channels of the plurality of first channels 302 includes a plurality of first holes 402 extending through the lid plate 122. The flow rate controller 141 controls the flow rate of the first gas from the first gas source 134 through the plurality of first holes 402. Controlling the flow rate of the first gas provides independent control of the first gas flow within first zones 406a, 406b, 406c, 406d, 406e, 406f, 406g, 406h, 406i (collectively referred to as first zones 406) of the processing region 120 corresponding to each first channel of the plurality of first channels 302. In one embodiment having a second diffuser 136, which may be combined with other embodiments described herein, each second channel of the plurality of second channels 304 includes a plurality of second holes 404 extending through the lid plate 122. The flow controller 141 controls the flow rate of the second gas from the second gas source 138 through the plurality of second holes 404. By controlling the flow rate of the second gas, the second gas flow within second zones 408a, 408b, 408c (collectively referred to as second zones 408) of the processing region 120 corresponding to each second channel of the multiple second channels 304 can be independently controlled.

[0023]

[0033] Figure 5 is a schematic bottom view of one embodiment of the lid plate 122. The lid plate 122 of Figure 5 illustrates generally the structure of the bottom surface 160 of the lid plate 122. The first zone 406 and the second zone 408 are not shown, although the lid plate 122 may include one or more zones as described above.

[0024]

[0034] The lid plate 122 includes multiple diffuser plates, shown as outer diffuser plates 500 and inner diffuser plates 505. Each of the inner diffuser plates 505 is separated by and / or disposed between a dielectric plate 150 and / or a separator plate 510. Each of the outer diffuser plates 500 has a dielectric plate 150 and one or more separator plates 510 on one side thereof.

[0025]

[0035] Each of the outer diffuser plate 500, the inner diffuser plate 505, and the separation plate 510 may be made of a conductive material, such as aluminum.

[0026]

[0036] In this embodiment, the separation plate 510 and each of the outer diffuser plate 500 and inner diffuser plate 505 include a plurality of fasteners 515 and 520, respectively. Each of the fasteners 515 and 520 may be made of a ceramic or metallic material. Each of the outer diffuser plate 500 and inner diffuser plate 505 may be integral (i.e., one-piece structure), or each of the outer diffuser plate 500 and inner diffuser plate 505 may include multiple parts. Similarly, the dielectric plate 150 may include a single piece of material, or may include multiple plates. In an embodiment in which the dielectric plate 150 is multiple plates, each of the dielectric plates 150 may be coupled to the lid plate 122 and / or to the separation plate 510 and / or the outer diffuser plate 500 and inner diffuser plate 505 using fasteners (not shown).

[0027]

[0037] Each of the outer diffuser plate 500 and the inner diffuser plate 505 includes one or more orifice holes 525 (e.g., first holes 402). Each of the one or more orifice holes 525 is in fluid communication with a corresponding one of the first channels 302 (also shown in FIG. 3B). In some embodiments, each of the separation plates 510 includes one or more orifice holes 530 (e.g., second holes 404). Each of the one or more orifice holes 530 of the separation plate 510 is in fluid communication with a corresponding one of the second channels 304 (also shown in FIG. 3B).

[0028]

[0038] Figures 6A and 6B are cross-sectional views of the lid plate 122 from Figure 5. In Figure 6A, a portion of the outer diffuser plate 505 and the inner diffuser plate 500 are shown with a portion of the separation plate 510 between them. In Figure 6B, one of the inner plates 505 is shown along its length.

[0029]

[0039] 7 is an enlarged cross-sectional view of the lid plate 122 from FIG. 6A. One of the inner diffuser plates 505 is shown, as well as a portion of the two separation plates 510. The inner diffuser plate 505 includes a groove 700 that is in fluid communication with one of the first channels 302 and one or more orifice holes 525. Although not shown, the other of the inner diffuser plates 505 may be similarly configured. In addition, the outer diffuser plate 500 includes a groove 700, as well as one or more orifice holes 525.

[0030]

[0040] The inner diffuser plate 505 is connected to the body 705 of the lid plate 122 by fasteners 520. Each fastener 520 is disposed in a respective countersunk hole 710 on either side of the groove 700 and the one or more orifice holes 525. Similarly, the separation plate 510 is connected to the body 705 by fasteners 715 (only one is shown). The fasteners 715 are disposed in the countersunk holes 720. The fasteners 715 and 520 extend in their respective countersunk holes to a (lower) surface 725A of the separation plate 510 and a (lower) surface 725B of the inner diffuser plate 505. The surfaces 725A and 725B are planar or flat. Thereby, the surfaces are flush with one another. Additionally, the extensions of the fasteners 715 and 520 in their respective countersunk holes present a flat or planar lower surface (i.e., without protrusions or depressions). This promotes more uniform plasma formation. Although not shown, each of the dielectric plates 150 (ie, lower surfaces 151) is also coplanar with surface 725B.

[0031]

[0041] The groove 700 and the first channel 302 are fluidly sealed by an elastomeric seal 730 disposed in a groove 735 formed in the body 705. The elastomeric seal 730 is sized to surround the groove 700 and the first channel 302. The elastomeric seal 730 may be an elongated O-ring. The elastomeric seal 730 is compressed against a sealing surface 740 of the inner diffuser plate 505. The sealing surface 740 is smoother than the remainder of the face 725B and backside 745, as well as other exterior surfaces of the inner diffuser plate 505. In some embodiments, the sealing surface 740 includes a surface finish of about 16 (root mean square (RMS)) or 16 microinches (average surface roughness (Ra)).

[0032]

[0042] 8 is a plan view of the back side 745 of a diffuser plate 800. The diffuser plate 800 may be one of the outer diffuser plates 500 or one of the inner diffuser plates 505.

[0033]

[0043] The diffuser plate 800 includes a length 805 that is longer than the length or width of the substrate (not shown). In one embodiment, the length 805 is about 5 feet to about 6 feet or more. The sealing surface 740 is shown surrounding the groove 700. In addition, a plurality of holes 810 are disposed along the length 805 of the diffuser plate 800. Each hole 810 is adapted to receive a fastener 520 (shown in FIG. 7). The holes 810 are formed between an edge 815 of the diffuser plate 800 and the sealing surface 740. Each fastener 520 is a screw or bolt having a tool interface, such as a hex head or a recessed interface, that may be used with a screwdriver, a hex key, a screwdriver that may be used with bits commercially available under TORX®, or the like.

[0034]

[0044] Orifice holes 525, not shown in this view, are formed in groove 700 at each of a plurality of orifice locations 825. Length 820 indicates where along groove 700 orifice holes 525 begin and end. Length 820 is shorter than length 805. Orifice locations 825 are positioned within length 820. Orifice locations 825 may be at equal or unequal pitch along length 820. The pitch between orifice locations 825 may be from about 0.25 inch to about 1 inch.

[0035]

[0045] 9A-9C are cross-sectional views from FIG. 8 showing various configurations of diffuser plate 800. In particular, FIGS. 9A-9C show variations in the profile of grooves 700 and / or orifice holes 525.

[0036]

[0046] In Figure 9A, a diffuser plate 900A is shown including a groove 700 having a semicircular profile. Additionally, three orifice holes 525 are shown formed between a first surface 905 and a surface 910 of the groove 700. The surface 910 of the groove 700 is a radius or curved surface. Although three orifice holes 525 are shown, the number of orifice holes may be one to five or more at each of the orifice locations 825 shown in Figure 8.

[0037]

[0047] 9A includes a central orifice hole 915 and two outer orifice holes 920. The diameter of the central orifice hole 915 and the diameter of the outer orifice holes 920 may be the same or different. The diameter of the central orifice hole 915 and some or all of the outer orifice holes 920 may be from about 0.008 inches to about 0.04 inches. The lengths of the outer orifice holes 920 may be the same or substantially equal. However, the length of the central orifice hole 915 is shorter than that of the outer orifice holes 920.

[0038]

[0048] The central orifice hole 915 is disposed along an axis 925 that is at an angle of about 90 degrees from the first surface 905. The outer orifice hole 920 is formed at an acute angle 930 from the axis 925. The acute angle 930 can be about 20 degrees to about 50 degrees from the axis 925, such as about 35 degrees to about 45 degrees, e.g., about 40 degrees.

[0039]

[0049] Although not shown, other orifice holes 525 (FIG. 8) at other orifice locations 825 along the length 820 may be the same as or different from the central orifice hole 915 and the outer orifice holes 920 shown in FIG. 9A. In addition, the surface 910 may be constant along the length 805 (FIG. 8). However, the surface 910 may vary along the length 805. For example, the grooves 700 may be deeper in a central portion of the diffuser plate 800 and shallower at the edge portions of the diffuser plate 800 along the length 805.

[0040]

[0050] Figure 9B shows a diffuser plate 900B that is substantially similar to the diffuser plate 900A shown in Figure 9A with the following exceptions: The groove 700 has a square-shaped profile and the outer orifice hole 920 includes a flared portion 935. The flared portion 935 connects the outer orifice hole 920 to the face 910 of the groove 700. The groove 700 includes two side surfaces 940 that extend at a perpendicular angle from the face 910.

[0041]

[0051] Figure 9C illustrates a diffuser plate 900C that is substantially similar to the diffuser plate 900A illustrated in Figure 9A with the following exceptions: Diffuser plate 900C includes a single orifice hole 945 at orifice location 825. The configuration of diffuser plate 900C may be beneficially utilized as the outer diffuser plate 500 illustrated in Figure 5. The single orifice hole 945 may be angled at an acute angle 930 and may direct gas toward the center of the substrate 102 (shown in Figure 1).

[0042]

[0052] Figure 10 is a schematic bottom view of another embodiment of the lid plate 122. While the outer diffuser plate 500 and the inner diffuser plate 505 are shown as a single integral piece in other figures, the lid plate 122 shown in Figure 10 includes a plurality of segmented diffuser plates, which are shown as a first plurality of outer diffuser plates 1000 and a second plurality of inner diffuser plates 1005. The first plurality of outer diffuser plates 1000 and the second plurality of inner diffuser plates 1005 are arranged in a plurality of rows 1010. Each row 1010 is substantially parallel to the other rows 1010.

[0043]

[0053] The first plurality of outer diffuser plates 1000 includes two or more diffuser segments 1015, and the second plurality of inner diffuser plates 1005 includes two or more diffuser segments 1020. Each of the diffuser segments 1015 and 1020 may be constructed similarly to the diffuser plate 800 shown in FIG. 8 and the diffuser plates 900A-C shown in FIGS. 9A-C, except that they are shorter in length. The shorter lengths of the outer diffuser plate 1000 and inner diffuser plate 1005 may minimize the effects of their thermal expansion and contraction. Additionally, the flow of gas through each of the diffuser segments 1015 and 1020 may be independently controlled.

[0044]

[0054] In summary, a chamber lid assembly is provided for independently controlling plasma density and gas distribution within the interior space of the chamber. Independent control of the power level and frequency provided to each coil allows the density of the inductively coupled plasma to be independently controlled within the process zone corresponding to each coil. Controlling the flow rate of the first gas provides independent control of the first gas flow within a first zone of the processing region corresponding to each first channel of the plurality of first channels. Controlling the flow rate of the second gas provides independent control of the second gas flow within a second zone of the processing region corresponding to each second channel of the plurality of second channels. In some embodiments, a uniform gas flow across the processing region may be desired. However, in other embodiments, the gas flow across the processing region may not be uniform. A non-uniform gas flow may be desired due to some physical structure(s) and / or geometry of the chamber.

[0045]

[0055] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of the disclosure being defined by the following claims.

Claims

1. A lid plate, One or more cavities; one or more first diffuser inlets formed outside the one or more cavities; one or more first channels in fluid communication with the one or more first diffuser inlets and in fluid communication with the plurality of first holes; one or more second diffuser inlets; one or more second channels in fluid communication with the one or more second diffuser inlets and in fluid communication with the plurality of second holes; wherein the one or more first channels and the one or more second channels are oriented in a cross-position relative to one another; A lid equipped with:

2. a dielectric plate positioned within at least one of the one or more cavities; a plurality of fluid channels in the lid plate configured to couple to a heat exchanger; The lid of claim 1 further comprising:

3. 3. The lid of claim 2, further comprising one or more coils positioned within at least one of the one or more cavities, the one or more coils being positioned on or above the dielectric plate, at least one of the one or more coils having an electrical input terminal configured to connect to a power source and an electrical output terminal configured to connect to ground, the one or more coils being configured to generate an electromagnetic field when powered on.

4. The lid of claim 3 , wherein the one or more coils include a plurality of coils, each independently connected to a respective power source through a respective match box.

5. The lid of claim 1 , wherein the first plurality of holes extend through a portion of the lid plate.

6. the plurality of first holes extend through one or more diffuser plates coupled to the lid plate; At least one of the one or more diffuser plates has: A first surface; a second surface opposite the first surface; and a groove formed in the first surface; At least some of the plurality of first holes are formed between a surface of the groove and the second face, and the groove is in fluid communication with one of the one or more first channels. The lid of claim 1 .

7. 7. The lid of claim 6, wherein the at least some of the first plurality of holes are formed at a pitch from one another along a length of the groove, the pitch being within a range of 0.25 inches to 1 inch.

8. 8. The lid of claim 7, wherein at least some of the first plurality of holes are formed at the pitch in sets of holes, each set having a central hole and outer holes formed at an acute angle from an axis of the central hole, the acute angle being within a range of 20 degrees to 50 degrees, and the outer holes including a flared portion that joins a surface of the groove.

9. A lid as described in claim 1, wherein at least one of the one or more second channels is positioned between two adjacent cavities of the one or more cavities.

10. The lid of claim 1 or claim 9, wherein the one or more first channels and the one or more second channels are independently connected to a plurality of flow controllers.

11. A lid as described in claim 1 or claim 9, wherein the plurality of first holes are formed in one or more diffuser plates and the plurality of second holes are formed in one or more separation plates disposed between adjacent diffuser plates.

12. The lid of claim 11 , wherein an outer surface of the one or more diffuser plates is flush with an outer surface of the one or more separator plates, and the one or more diffuser plates and the one or more separator plates are secured to the lid plate through countersinks.

13. The lid of claim 12 , wherein the one or more diffuser plates include a plurality of diffuser plates oriented in a plurality of parallel rows, and the one or more separator plates include a plurality of separator plates oriented in a plurality of columns.

14. A lid plate, Several cavities, one or more first diffuser inlets formed outside the plurality of cavities; one or more first channels in fluid communication with the one or more first diffuser inlets; one or more second diffuser inlets; one or more second channels in fluid communication with the one or more second diffuser inlets; wherein the one or more first channels and the one or more second channels are oriented in a cross-position relative to one another; a plurality of diffuser plates including a plurality of holes in fluid communication with a plurality of channels, including the one or more first channels and the one or more second channels; A lid equipped with:

15. The lid of claim 14 , wherein the plurality of diffuser plates includes a plurality of inner diffuser plates and an outer diffuser plate opposite the inner diffuser plates.

16. each of the plurality of inner diffuser plates comprises a plurality of first hole locations along a first length, each of the plurality of first hole locations having a set of one or more holes of the plurality of holes; the outer diffuser plate includes a plurality of second hole locations along a second length, each of the plurality of second hole locations having a single hole of the plurality of holes. The lid of claim 15.

17. 17. The lid of claim 16, wherein the set of one or more holes includes a central hole and two outer holes opposite the central hole, the two outer holes being angled relative to the central hole.

18. 15. The lid of claim 14, wherein the plurality of holes extend within a surface of a groove formed in each diffuser plate of the plurality of diffuser plates, the groove including a rectangular or square shaped profile, and the groove including a depth that varies along its length.

19. A lid plate comprising: Several cavities, one or more first diffuser inlets formed outside the plurality of cavities; one or more channels in fluid communication with the one or more diffuser inlets; a plurality of diffuser plates comprising a plurality of holes in fluid communication with the one or more channels, the plurality of holes including a central hole and two outer holes opposite the central hole, the two outer holes being angled with respect to the central hole; A lid plate comprising: A lid equipped with:

20. A lid as described in claim 19, wherein the plurality of diffuser plates includes a plurality of inner diffuser plates and an outer diffuser plate opposite the inner diffuser plates.

21. each of the plurality of inner diffuser plates comprises a plurality of first hole locations along a first length, each of the plurality of first hole locations having a set of one or more holes from the plurality of holes; the outer diffuser plate includes a plurality of second hole locations along a second length, each of the plurality of second hole locations having a single hole of the plurality of holes.

21. The lid of claim 20.

22. Each of the one or more sets of holes includes the central hole and the two outer holes.

22. The lid of claim 21.

23. A lid as described in claim 19, wherein the plurality of holes extend within a surface of a groove formed in each of the plurality of diffuser plates, the groove including a rectangular or square-shaped profile, and the groove including a depth that varies along its length.

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