Mark recognition and processing device

Abstract

To provide a mark recognition device and a processing device, which can reduce a total substrate lot-by-lot processing time in the processing time of recognition processing which recognizes a plurality of marks on the substrate.SOLUTION: A mark recognition unit 522 of a mark recognition device 5 performs the image recognition processing of a mark image GM corresponding to a mark M on a substrate PP, according to the control of a recognition control unit 524, so as to output mark recognition data DM which indicates the recognition result. Before a number of the substrates PP carried in to a work area WA reaches a reference number, the recognition control unit 524 executes normal control, so as to set a recognition stability condition based on the mark recognition data DM output from the mark recognition unit 522. When a substrate PP is carried in to the work area WA after the execution of the normal control, and if the recognition stability condition is satisfied, the recognition control unit 524 executes skip control which controls the mark recognition unit 522 to skip the image recognition processing targeted for a specific mark on the substrate PP.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a mark recognition device that recognizes a mark formed on a substrate, and a processing device including the same. [Background technology]

[0002] The component mounting device as a processing device is equipped with a head unit that performs a component mounting process to mount electronic components (hereinafter simply referred to as "components") on a substrate such as a printed wiring board carried into a predetermined work area. In the component mounting process of the head unit, it is necessary to mount the components at the predetermined component mounting positions on the substrate carried into the work area without causing positional deviation.

[0003] For this reason, in the component mounting device, the mark on the board brought into the work area is captured by an imaging camera mounted on the head unit to generate a mark image, and image recognition processing of the mark is performed based on the mark image to obtain correction data for the component mounting position (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2002-9494 A Summary of the Invention [Problem to be solved by the invention]

[0005] In a component mounting device, boards are sequentially carried into a work area in lots. In addition, in order to accurately correct the component mounting positions, multiple marks may be formed on the board. In this case, each time a board of the same lot is carried into the work area, image recognition processing of mark images corresponding to each of the multiple marks is performed. In this case, a problem may occur in that the processing time of the recognition processing for recognizing the multiple marks on the board increases the total processing time per board lot.

[0006] An object of the present invention is to provide a mark recognition device that can shorten the total processing time for a recognition process that recognizes multiple marks on a substrate on a substrate lot basis, and a processing apparatus equipped with the same. [Means for solving the problem]

[0007] A mark recognition device according to one aspect of the present invention is a device for recognizing a plurality of marks formed on a substrate carried into a predetermined work area in units of lots. The mark recognition device includes a mark recognition unit that recognizes a feature amount of the mark in a mark image by performing an image recognition process on the mark image showing an image of the mark on the substrate, and outputs mark recognition data showing the recognition result, and a recognition control unit that controls the mark recognition unit each time the substrate of the same lot is carried into the work area. The recognition control unit executes normal control to control the mark recognition unit so that the image recognition process is performed on all of the plurality of marks on the substrate until the number of substrates carried into the work area reaches a predetermined reference number. When the number of substrates carried into the work area reaches the reference number, the recognition control unit executes skip control to control the mark recognition unit to skip the image recognition process on a specific mark among the plurality of marks on the substrate if a recognition stability condition indicating stability of the mark recognition data corresponding to the marks on the substrate of the same lot is satisfied, the recognition control unit being set based on the mark recognition data output from the mark recognition unit during execution of the normal control.

[0008] According to this mark recognition device, the mark recognition unit performs image recognition processing of mark images showing images of marks on substrates carried into the work area in lots based on the control of the recognition control unit, and outputs mark recognition data showing the recognition result. Until the number of substrates carried into the work area reaches a reference number, the recognition control unit executes normal control. In this normal control, the recognition control unit controls the mark recognition unit so that image recognition processing is performed on all of the multiple marks on the substrate. Therefore, when the normal control is executed by the recognition control unit, mark recognition data corresponding to each of the multiple marks on the substrate is output from the mark recognition unit every time a substrate of the same lot is carried into the work area. The recognition control unit sets a recognition stability condition based on the mark recognition data output from the mark recognition unit when the normal control is executed. This recognition stability condition is an index of stability of the mark recognition data corresponding to each of the multiple marks on the substrate of the same lot.

[0009] When a new substrate is carried into the work area after the number of substrates carried into the work area reaches a reference number, the recognition control unit judges whether or not the recognition stability condition is satisfied. When the recognition stability condition is satisfied, the mark recognition data corresponding to marks on substrates of the same lot is stable within an allowable range. Therefore, when the recognition stability condition is satisfied, the recognition control unit executes skip control. In this skip control, the recognition control unit controls the mark recognition unit to skip image recognition processing targeted at a specific mark among the multiple marks on the substrate carried into the work area. This makes it possible to reduce the accuracy of image recognition of marks on the substrate from decreasing, and to shorten the total processing time for image recognition processing targeted at marks on the substrate per substrate lot.

[0010] In the mark recognition device, the marks include fiducial marks for recognizing a position of the substrate, and in this case, the recognition control unit executes the skip control when the fiducial marks are formed in three or more places on the substrate and the recognition stability condition is satisfied.

[0011] The total processing time for image recognition processing targeting fiducial marks on a substrate per substrate lot becomes longer as the number of fiducial marks formed on the substrate increases. Therefore, when three or more fiducial marks are formed on the substrate and the recognition stability condition is satisfied, the recognition control unit executes skip control. Such skip control more effectively contributes to shortening the total processing time per substrate lot.

[0012] In the above-mentioned mark recognition device, the recognition control unit does not allow the execution of the skip control when a board on which a circuit has been formed on the side opposite to the side on which the fiducial mark to be recognized is formed and on which components have already been mounted is brought into the work area.

[0013] A board on which a circuit is formed on the surface opposite to the surface on which the fiducial mark to be recognized is formed and on which components are already mounted, i.e., a bottom-mounted board on which a circuit is formed on the bottom surface facing downward when brought into the work area and on which components are already mounted, may be warped due to the weight of the components already mounted on the bottom surface. If the board is warped, there is a risk that the mark recognition data corresponding to the fiducial mark on the board of the same lot may not be stable. Therefore, when a bottom-mounted board on which warping is a concern is brought into the work area, the recognition control unit does not permit the execution of skip control.

[0014] In the above-mentioned mark recognition device, the fiducial marks include a reference fiducial mark formed at a reference position on the substrate and a residual fiducial mark formed at a position other than the reference position on the substrate. In this case, the recognition control unit controls the mark recognition unit in the normal control so that the image recognition process is performed on the reference fiducial mark and the residual fiducial mark. In addition, in the skip control, the recognition control unit determines that the recognition stability condition is satisfied when a difference between the mark recognition data output from the mark recognition unit by controlling the mark recognition unit so that the image recognition process is performed on the reference fiducial mark and the mark recognition data output from the mark recognition unit corresponding to the reference fiducial mark during execution of the normal control falls within a predetermined allowable range, and controls the mark recognition unit to skip the image recognition process on the residual fiducial mark as the specific mark.

[0015] In this aspect, when a substrate is carried into the work area after the execution of normal control, the recognition control unit controls the mark recognition unit so that image recognition processing is performed on the reference fiducial mark. The recognition control unit then determines that the recognition stability condition is satisfied when a difference between the mark recognition data output from the mark recognition unit corresponding to the reference fiducial mark on the substrate carried into the work area after the execution of normal control and the mark recognition data output from the mark recognition unit corresponding to the reference fiducial mark during the execution of normal control falls within a predetermined allowable range. When it is determined that the recognition stability condition is satisfied, the recognition control unit executes skip control to control the mark recognition unit to skip image recognition processing on the residual fiducial marks on the substrate carried into the work area. This makes it possible to shorten the processing time required for the total image recognition processing on a substrate lot basis according to the skipping of the image recognition processing on the residual fiducial marks on the substrate.

[0016] In the above-mentioned mark recognition device, the substrate is a multiple substrate including a plurality of individual substrates on which the reference fiducial mark and the residual fiducial mark are formed. In this case, the recognition control unit controls the mark recognition unit in the skip control to skip the image recognition process for the residual fiducial mark when it is determined that the recognition stability condition is satisfied for each of the plurality of individual substrates.

[0017] In this aspect, when a multiple substrate including a plurality of individual substrates is carried into the work area, the recognition control unit determines whether or not the recognition stability condition is satisfied for each of the plurality of individual substrates based on the mark recognition data output from the mark recognition unit corresponding to the reference fiducial mark. If it is determined that the recognition stability condition is satisfied, the recognition control unit executes skip control to control the mark recognition unit to skip image recognition processing for the remaining fiducial marks for each of the plurality of individual substrates. This makes it possible to shorten the processing time required for the total image recognition processing for each lot of multiple substrates in accordance with the skipping of image recognition processing for the remaining fiducial marks on each individual substrate.

[0018] In the above-mentioned mark recognition device, when a bat mark indicating that the individual substrate has a defect is formed as the mark on the individual substrate, the recognition control unit determines that the recognition stability condition is satisfied when the mark recognition data corresponding to the bat mark is continuously output from the mark recognition unit during execution of the normal control, and controls the mark recognition unit to skip the image recognition process targeting the bat mark as the specific mark in the skip control.

[0019] In a multiple substrate, a bat mark may be applied to a defective individual substrate. When mark recognition data corresponding to a bat mark is continuously output from the mark recognition unit during execution of normal control, it is expected that an individual substrate arranged at the same position in a multiple substrate of the same lot is defective. Therefore, when mark recognition data corresponding to a bat mark is continuously output from the mark recognition unit during execution of normal control, the recognition control unit executes skip control to control the mark recognition unit to skip image recognition processing targeted at the bat mark on the individual substrate. This makes it possible to shorten the processing time required for the total image recognition processing on a multiple substrate lot basis in accordance with the skipping of image recognition processing targeted at the bat mark on the individual substrate.

[0020] A processing apparatus according to another aspect of the present invention includes a substrate transport section which transports a substrate having a plurality of marks formed thereon to a predetermined work area in lot units, the above-mentioned mark recognition device which recognizes the plurality of marks on the substrate brought into the work area, and a head unit which applies processing to a predetermined area on the substrate based on the recognition results of the marks by the mark recognition device.

[0021] This processing apparatus includes a mark recognition device that can reduce the total processing time for image recognition processing of marks on a substrate per substrate lot while suppressing a decrease in the accuracy of image recognition of marks on the substrate. This allows the head unit to efficiently process a predetermined area on the substrate without causing misalignment, based on the mark recognition result by the mark recognition device. Effect of the Invention

[0022] As described above, according to the present invention, it is possible to provide a mark recognition device that can shorten the total processing time for a recognition process that recognizes multiple marks on a substrate on a substrate lot basis, and a processing device equipped with the same. [Brief description of the drawings]

[0023] [Figure 1] 1 is a diagram showing a configuration of a component mounting system to which a mark recognition device according to an embodiment of the present invention is applied. [Diagram 2] 1 is a plan view showing a configuration of a mounter body in a component mounting apparatus as a processing apparatus to which a mark recognition device is applied. [Diagram 3] FIG. 2 is an enlarged view of a head unit portion of the mounting machine main body. [Figure 4] FIG. 2 is a block diagram of a mark recognition device. [Diagram 5] FIG. 2 is a diagram showing an example of a board carried into a work area of ​​a mounting machine main body. [Figure 6] 11 is a flowchart showing a first specific example of a mark recognition process performed by the mark recognition device. [Figure 7] 1 is a diagram showing a multiple board as an example of a board carried into a work area of ​​a mounting machine main body; [Figure 8] 13 is a flowchart showing a second specific example of the mark recognition process by the mark recognition device. [Figure 9] 13A and 13B are diagrams showing a state in which a butt mark is formed on an individual substrate in a multiple substrate. [Figure 10] 11 is a flowchart showing a bat mark recognition process performed by the mark recognition device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A mark recognition device and a processing device including the same according to an embodiment of the present invention will be described below with reference to the drawings.

[0025] [Overall configuration of component mounting system] 1, a mark recognition device 5 according to one embodiment of the present invention is applied to a component mounting system 100. The component mounting system 100 is configured with a component mounting line 10 in which a pattern forming device 11, a pattern inspection device 12, a component mounting device 13, and a mounting inspection device 14 are connected so as to be aligned in a straight line in this order. The pattern forming device 11 and the component mounting device 13 are equipped with a mark recognition device 5.

[0026] The pattern forming device 11 is a processing device that performs a pattern forming process to form a solder paste pattern on a board carried in a lot unit to a predetermined work area. In the mark recognition device 5 provided in the pattern forming device 11, a mark on the board carried in the work area is captured by an imaging camera to generate a mark image, and an image recognition process of the mark is performed based on the mark image. The image recognition process of the mark recognition device 5 recognizes feature quantities such as the shape, outer size, and center position coordinates of the mark in the mark image. The mark recognition result by the mark recognition device 5 is referred to when the pattern forming process is performed in the pattern forming device 11. That is, in the pattern forming device 11, a solder paste pattern is formed in a predetermined area on the board carried in the work area without causing a positional deviation based on the mark recognition result by the mark recognition device 5.

[0027] The pattern inspection device 12 is disposed downstream of the pattern forming device 11, and inspects the processing state of the pattern formation processing in the pattern forming device 11. The board after inspection by the pattern inspection device 12 is carried into the component mounting device 13.

[0028] The component mounting device 13 is a processing device that performs a component mounting process in which electronic components (hereinafter referred to as "components") are mounted on a board on which a solder paste pattern is formed. Details of the mark recognition device 5 provided in the component mounting device 13 will be described later. The component-mounted board obtained by the component mounting process in the component mounting device 13 is carried into a mounting inspection device 14.

[0029] The mounting inspection device 14 is disposed downstream of the component mounting device 13 and inspects the processing state of the component mounting process in the component mounting device 13. The component mounting board after inspection by the mounting inspection device 14 is carried into a reflow device as necessary. The reflow device performs a reflow process in which the solder on the component mounting board is melted and then hardened, thereby obtaining a reflow board. This reflow board is carried into a reflow inspection device as necessary. The reflow inspection device is disposed downstream of the reflow device and inspects the processing state of the reflow process in the reflow device.

[0030] [Component mounting equipment configuration] Next, the component mounting apparatus 13 will be described with reference to Figures 2 and 3 in addition to Figure 1. In Figure 2, directional relationships are shown using XY Cartesian coordinates that are orthogonal to each other on a horizontal plane.

[0031] The component mounting device 13 includes a mounting machine main body 2 that constitutes a structural portion for performing a component mounting process for mounting components on a board PP. The mounting machine main body 2 includes a main body frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a board support unit 28.

[0032] The main body frame 21 is a structure in which the various components constituting the mounting machine main body 2 are arranged, and is formed in a substantially rectangular shape in plan view as seen from a direction (vertical direction) perpendicular to both the X-axis direction and the Y-axis direction. The conveyor 23 extends in the X-axis direction and is arranged on the main body frame 21. The conveyor 23 is a board transport section that transports the board PP on which a plurality of marks M are formed to a predetermined work area WA in lots. The board PP brought into the work area WA is positioned by the board support unit 28. The board support unit 28 positions the board PP in the work area WA on the conveyor 23 by supporting the board PP from below with the surface on which the marks M are formed facing upward.

[0033] The component supply units 24 are disposed in the respective regions at both ends of the main frame 21 in the Y-axis direction, sandwiching the conveyor 23. The component supply unit 24 is an area in the main frame 21 where a plurality of feeders 24F are mounted in a juxtaposed state, and a set position of each feeder 24F is defined for each component to be held by a mounting head 251 provided in a head unit 25 described later. The feeder 24F is detachably mounted on the component supply unit 24. The feeder 24F is a device that performs a component supply process to supply components. The feeder 24F is not particularly limited as long as it can hold a plurality of components and supply the held components to a predetermined component supply position set in the feeder, and is, for example, a tape feeder. The tape feeder is a feeder that includes a reel around which a component storage tape that stores components at predetermined intervals is wound, and is configured to supply components by feeding the component storage tape from the reel.

[0034] The head unit 25 is held by a moving frame 27. On the main body frame 21, a fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotated by a Y-axis servo motor 263 are arranged. The moving frame 27 is arranged on the fixed rail 261, and a nut portion 271 provided on the moving frame 27 is screwed onto the ball screw shaft 262. In addition, a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274 are arranged on the moving frame 27. The head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is screwed onto the ball screw shaft 273. The moving frame 27 moves in the Y-axis direction by the operation of the Y-axis servo motor 263, and the head unit 25 moves in the X-axis direction relative to the moving frame 27 by the operation of the X-axis servo motor 274. That is, head unit 25 is capable of moving in the Y-axis direction in conjunction with the movement of movable frame 27, and is also capable of moving in the X-axis direction along movable frame 27. Head unit 25 is capable of moving between component supply unit 24 and substrate PP supported by substrate support unit 28. Head unit 25 moves between component supply unit 24 and substrate PP to perform a component mounting process for mounting components onto substrate PP.

[0035] As shown in FIG. 3, the head unit 25 includes a plurality of mounting heads 251. Each mounting head 251 has a suction nozzle 2511 attached to its tip (lower end). The suction nozzle 2511 is a nozzle capable of suctioning and holding a component supplied by the feeder 24F. The suction nozzle 2511 performs a component suction process for suctioning a component. The suction nozzle 2511 can be connected to any of a negative pressure generator, a positive pressure generator, and the atmosphere via an electric switching valve. That is, the suction nozzle 2511 can suction and hold a component by supplying negative pressure to the suction nozzle 2511, and then the suction and holding of the component is released by supplying positive pressure. Each mounting head 251 performs a component mounting process for mounting a component suctioned and held by the suction nozzle 2511 onto the board PP, corresponding to each of a plurality of target mounting positions set on the board PP. Each mounting head 251 performs a component mounting process on the board PP to obtain a component-mounted board.

[0036] Each mounting head 251 can be raised and lowered in the Z-axis direction (vertical direction) relative to the frame of the head unit 25, and can rotate around a head axis extending in the Z-axis direction. Each mounting head 251 can be raised and lowered along the Z-axis direction between a suction-enabled position where the suction nozzle 2511 can suction and hold a component, and a retreated position above the suction-enabled position. That is, when a component is suctioned and held by the suction nozzle 2511, each mounting head 251 descends from the retreated position to the suction-enabled position, and suctions and holds the component at the suction-enabled position. On the other hand, after suctioning and holding the component, each mounting head 251 rises from the suction-enabled position to the retreated position. Furthermore, each mounting head 251 can be raised and lowered along the Z-axis direction between a mountable position where the component suctioned and held by the suction nozzle 2511 can be mounted at a predetermined target mounting position on the board PP, and the retreated position.

[0037] As shown in FIG. 2, the mounting machine main body 2 further includes a component recognition camera 31, a component supply camera 32, and a mark recognition camera 51.

[0038] The component recognition camera 31 is an imaging camera that is installed between the component supply unit 24 and the conveyor 23 on the main body frame 21 and has an imaging element such as a complementary metal-oxide-semiconductor (CMOS) or a charged-coupled device (CCD). The component recognition camera 31 captures an image of a component sucked and held by the suction nozzle 2511 of each mounting head 251 from below while the head unit 25 moves from the component supply unit 24 toward the board PP supported by the board support unit 28. The component recognition camera 31 captures an image of the component sucked and held by the suction nozzle 2511 before the component is mounted on the board PP. The component recognition camera 31 recognizes the state of the component being held by the suction nozzle 2511 before the head unit 25 executes the component mounting process. When an abnormality occurs in the holding of the component by the suction nozzle 2511, the component recognition camera 31 recognizes the abnormality. Specifically, when the suction nozzle 2511 is not holding a component, the component recognition camera 31 recognizes this non-holding as a holding abnormality. Also, when the posture of the component suction-held by the suction nozzle 2511 is abnormal, the component recognition camera 31 recognizes this abnormal posture as a holding abnormality.

[0039] The component supply camera 32 is disposed in the head unit 25, and is an imaging camera equipped with an imaging element such as a CMOS or a CCD. The component supply camera 32 captures an image of a component supplied to the component supply position by the feeder 24F from diagonally above before the suction nozzle 2511 sucks and holds the component. The component supply camera 32 detects whether a component is being supplied to the component supply position by the feeder 24F, or the attitude of the component supplied to the component supply position.

[0040] The mark recognition camera 51 is an imaging camera arranged in the head unit 25. The mark recognition camera 51 constitutes a part of the mark recognition device 5. That is, the component mounting apparatus 13 according to the present embodiment is equipped with the mark recognition device 5.

[0041] [Mark recognition device configuration] Next, the mark recognition device 5 provided in the component mounting device 13 will be described with reference to the block diagram of Fig. 4 in addition to Fig. 1 and Fig. 2. The mark recognition device 5 is a device that performs a mark recognition process for image-recognizing a plurality of marks M formed on a board PP that is carried into the work area WA in lots by the conveyor 23. The mark recognition device 5 includes a mark recognition camera 51 and a management device 52.

[0042] In order to recognize the multiple marks M formed on the upper surface of the substrate PP carried into the work area WA, the mark recognition camera 51 performs an imaging process of imaging each of the multiple marks M from above. As a result, the mark recognition camera 51 generates a mark image GM corresponding to each of the multiple marks M on the substrate PP. The mark recognition camera 51 has an illumination unit 511 and an imaging unit 512. The illumination unit 511 is composed of, for example, an LED (Light Emintting Diode). The illumination unit 511 illuminates a predetermined mark arrangement area on the substrate PP including the mark M. The illumination unit 511 is capable of changing the illumination output. The illumination unit 511 can adjust the illuminance of the mark arrangement area to be illuminated on the substrate PP by changing the illumination output. The imaging unit 512 includes an imaging element such as a CMOS or a CCD. The imaging unit 512 images the mark arrangement area illuminated by the illumination unit 511, and generates a mark image GM based on the reflected light from the mark arrangement area. When the mark M on the substrate PP is imaged by the mark recognition camera 51, the head unit 25 is moved in the X-axis direction and the Y-axis direction so that the mark recognition camera 1 can image the mark M.

[0043] The management device 52 is configured by, for example, a microcomputer. The management device 52 is a device that generally manages the mark recognition processing of the mark recognition device 5. The management device 52 includes an acquisition unit 521, a mark recognition unit 522, a storage unit 523, a recognition control unit 524, a data output unit 525, and an operation unit 526.

[0044] The acquisition unit 521 acquires the mark image GM generated by the mark recognition camera 51, and also acquires substrate information DP. The substrate information DP is information relating to substrates PP carried into the work area WA in lots. The substrate information DP includes registered lot number information for identifying the lot of the substrate PP, substrate number information indicating the number of substrates PP in the same lot, substrate type information indicating the type of substrate PP, mark number information indicating the number of multiple marks M formed on the substrate PP, and mark position information indicating the position of the mark M on the substrate PP.

[0045] The operation unit 526 is composed of a keyboard, a mouse, a touch panel, etc. The operation unit 526 accepts an input operation of setting data DS by an operator. The setting data DS includes data related to settings for distinguishing a plurality of marks M formed on the substrate PP, data related to setting values ​​used when a recognition control unit 524 described later controls the mark recognition unit 522, and the like.

[0046] The mark recognition unit 522 performs image recognition processing on the mark image GM acquired by the acquisition unit 521. That is, the mark recognition unit 522 performs image recognition processing on the mark image GM generated by the mark recognition camera 51 and corresponding to each of the multiple marks M on the substrate PP. By performing image recognition processing on the mark image GM, the mark recognition unit 522 recognizes feature amounts such as the shape, outer size, and center position coordinates of the mark M in the mark image GM, and outputs mark recognition data DM indicating the recognition result. The mark recognition unit 522 outputs the mark recognition data DM corresponding to each of the multiple marks M on the substrate PP.

[0047] The storage unit 523 stores the mark recognition data DM output from the mark recognition unit 522 , and also stores the setting data DS input via the operation unit 526 .

[0048] The data output unit 525 reads out the mark recognition data DM from the storage unit 523, and outputs a recognition data set SD indicating a data group of the mark recognition data DM for each of the multiple marks M on the substrate PP. The recognition data set SD is referenced when the head unit 25 performs a component mounting process for mounting components on the substrate PP. That is, based on the mark recognition data DM corresponding to each mark M included in the recognition data set SD, the head unit 25 mounts components at target mounting positions on the substrate PP brought into the work area WA without causing positional deviation.

[0049] The recognition control unit 524 controls the mark recognition processing in the mark recognition device 5. Specifically, every time a substrate PP of the same lot is carried into the work area WA, the recognition control unit 524 controls the imaging processing of the mark recognition camera 51 and the image recognition processing of the mark recognition unit 522. When controlling the imaging processing of the mark recognition camera 51, the recognition control unit 524 also controls the movement of the head unit 25 in which the mark recognition camera 51 is arranged.

[0050] Based on the substrate information DP acquired by the acquisition unit 521, the recognition control unit 524 grasps the lot number of the substrate PP carried into the work area WA, the number of substrates of the same lot, the substrate type, the number and position of the marks M on the substrate PP, and the like. Then, the recognition control unit 524 executes normal control until the number of substrates PP carried into the work area WA reaches a reference number. In this normal control, the recognition control unit 524 controls the mark recognition camera 51 so that imaging processing is performed for each of the multiple marks M on the substrate PP, and controls the mark recognition unit 522 so that image recognition processing is performed. Therefore, when the recognition control unit 524 executes normal control, each time a substrate PP of the same lot is carried into the work area WA, a mark image GM is generated by the mark recognition camera 51 corresponding to each of the multiple marks M on the substrate PP, and mark recognition data DM is output from the mark recognition unit 522.

[0051] When normal control is being executed by the recognition control unit 524, the data output unit 525 uses the mark recognition data DM output from the mark recognition unit 522 as is, and outputs a recognition data set SD indicating a data group of the mark recognition data DM for each of the multiple marks M on the substrate PP.

[0052] The mark recognition data DM includes the mark recognition coordinates Rn of the following formula (1) that indicate the XY coordinates of the center position of the mark M as the feature amount of the mark M in the mark image GM.

[0053]

number

[0054] Based on the mark recognition data DM output from the mark recognition unit 522 during execution of normal control, the recognition control unit 524 calculates, for each of the multiple marks M on the substrate PP, a mark recognition position average μf of the following formula (2) indicating the average of the mark recognition coordinates Rn for the reference number a of the substrate PP, and a mark recognition position deviation σf of the following formula (3) indicating the deviation of the mark recognition coordinates Rn.

[0055]

number

[0056]

number

[0057] Then, the recognition control unit 524 sets a recognition stability condition based on the mark recognition position average μf and the mark recognition position deviation σf. This recognition stability condition serves as an index of stability of the mark recognition data DM corresponding to each of the multiple marks M on the substrates PP of the same lot.

[0058] When a new substrate PP is carried into the work area WA after the number of substrates PP carried into the work area WA reaches the reference number a, the recognition control unit 524 judges whether the recognition stability condition is satisfied. When the recognition stability condition is satisfied, the mark recognition data DM corresponding to the marks M on the substrate PP of the same lot is stable within the allowable range. Therefore, when the recognition stability condition is satisfied, the recognition control unit 524 executes skip control. In this skip control, the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522, respectively, to skip the imaging process and the image recognition process for a specific mark other than the reference mark formed at the reference position among the multiple marks M on the substrate PP carried into the work area WA. Note that the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522, respectively, to perform the imaging process and the image recognition process for the reference mark that is not the target of the skip control.

[0059] By the recognition control unit 524 executing skip control when the recognition stability condition is satisfied, it is possible to suppress a decrease in the accuracy of image recognition of the mark M on the substrate PP, while shortening the total processing time for the imaging process and image recognition process targeting the mark M on the substrate PP on a lot basis of the substrate PP.

[0060] When skip control is executed by the recognition control unit 524, the data output unit 525 creates a recognition data set SD for a reference mark that is not the target of skip control by directly using the mark recognition data DM output from the mark recognition unit 522. On the other hand, for a specific mark that is the target of skip control, the data output unit 525 creates a recognition data set SD by using the mark recognition data DM (e.g., the mark recognition position average μf) output from the mark recognition unit 522 corresponding to the specific mark when normal control is executed. Then, the data output unit 525 outputs the created recognition data set SD.

[0061] If the recognition stability condition is not satisfied, the recognition control unit 524 executes normal control in the same manner as the control until the number of substrates PP carried into the work area WA reaches the reference number a. In this case, the recognition control unit 524 controls the mark recognition camera 51 so that imaging processing is performed for each of the multiple marks M on the substrate PP, and controls the mark recognition unit 522 so that image recognition processing is performed.

[0062] [Specific example of the operation of the mark recognition device] Next, the operation of the mark recognition device 5 will be described in more detail.

[0063] <First concrete example of mark recognition processing by a mark recognition device> A first specific example of the mark recognition process by the mark recognition device 5 will be described with reference to Fig. 5 and Fig. 6. Fig. 5 shows an example of a substrate PPA on which fiducial marks FM1 and FM2 for recognizing the position of the substrate are formed as marks M. The fiducial marks FM1 and FM2 are marks for detecting the amount of positional deviation from the origin coordinates of the substrate PPA. On the substrate PPA, a pair of reference fiducial marks FM1 are formed at a reference position on the substrate PPA, and a residual fiducial mark FM2 is formed at a position other than the reference position on the substrate PPA. The pair of reference fiducial marks FM1 are formed near the vertices on a diagonal line passing through the origin coordinates of the rectangular substrate PPA.

[0064] Based on the board information DP acquired by the acquisition unit 521, the recognition control unit 524 grasps the lot number of the board PPA carried into the work area WA, the number of boards in the same lot, the board type, the number and positions of the fiducial marks FM1, FM2 on the board PPA, etc. Then, the recognition control unit 524 judges whether the board PPA carried into the work area WA is a bottom-side mounting board (step a1). A bottom-side mounting board is a board on which a circuit is formed on the surface (bottom surface facing downward) opposite to the surface on which the fiducial marks FM1, FM2 to be recognized are formed, and on which components are already mounted.

[0065] If the substrate PPA brought into the work area WA is not a bottom-side mounted substrate (NO in step a1), the recognition control unit 524 determines whether or not fiducial marks FM1, FM2 are formed in three or more locations on the substrate PPA (step a2).

[0066] If the board PPA carried into the work area WA is a bottom-mounted board (YES in step a1), or if three or more fiducial marks FM1, FM2 are not formed on the board PPA (NO in step a2), the recognition control unit 524 sets the skip control flag to OFF and does not permit execution of the skip control (step a21). The bottom-mounted board may be warped due to the weight of components already mounted on the bottom surface. If the board PPA is warped, there is a risk that the mark recognition data DM corresponding to the fiducial marks FM1, FM2 on the board PPA of the same lot may not be stable. Therefore, if a bottom-mounted board that is likely to be warped is carried into the work area WA, the recognition control unit 524 does not permit execution of the skip control.

[0067] When the skip control flag is set to OFF, the recognition control unit 524 executes normal control each time the substrate PPA is carried into the working area WA (step a22). In this normal control, the recognition control unit 524 controls the mark recognition camera 51 so that imaging processing is performed for each of the fiducial marks FM1, FM2 on the substrate PPA, and controls the mark recognition unit 522 so that image recognition processing is performed. Therefore, when the recognition control unit 524 executes normal control, each time the substrate PPA of the same lot is carried into the working area WA, the mark recognition camera 51 generates mark images GM corresponding to the fiducial marks FM1, FM2 on the substrate PPA, and the mark recognition unit 522 outputs mark recognition data DM.

[0068] When normal control is being executed by the recognition control unit 524, the data output unit 525 uses the mark recognition data DM output from the mark recognition unit 522 as is to output a recognition data set SD indicating a data group of the mark recognition data DM for each fiducial mark FM1, FM2 on the substrate PPA (step a23).

[0069] On the other hand, if the board PPA carried into the work area WA is not a bottom-mount board (NO in step a1) and the fiducial marks FM1, FM2 are formed in three or more places on the board PPA (YES in step a2), the recognition control unit 524 sets the skip control flag to ON and permits execution of the skip control (step a3). The total processing time for the imaging process and image recognition process for the fiducial marks FM1, FM2 on the board PPA per lot of the board PPA becomes longer as the number of fiducial marks FM1, FM2 formed on the board PPA increases. Therefore, if the fiducial marks FM1, FM2 are formed in three or more places on the board PPA, the recognition control unit 524 permits execution of the skip control. Such skip control more effectively contributes to shortening the total processing time for the board PPA per lot.

[0070] In a state in which the skip control flag is set to ON, the recognition control unit 524 judges whether or not the number of boards PPA carried into the working area WA has reached the reference number a (step a4).

[0071] If the number of substrates PPA carried into the work area WA has not reached the reference number a (NO in step a4), the recognition control unit 524 executes normal control until the reference number a is reached (step a41). In this normal control, the recognition control unit 524 controls the mark recognition camera 51 so that imaging processing is performed for each of the fiducial marks FM1 and FM2 on the substrate PPA, and controls the mark recognition unit 522 so that image recognition processing is performed. Therefore, when the recognition control unit 524 executes normal control, each time a substrate PPA of the same lot is carried into the work area WA, a mark image GM is generated by the mark recognition camera 51 corresponding to each of the fiducial marks FM1 and FM2 on the substrate PPA, and mark recognition data DM is output from the mark recognition unit 522.

[0072] The mark recognition data DM corresponding to the pair of reference fiducial marks FM1 includes the mark recognition coordinates Rn of the above formula (1) that indicate the XY coordinates of the center position of the reference fiducial mark FM1. Similarly, the mark recognition data DM corresponding to the residual fiducial mark FM2 includes the mark recognition coordinates Rn that indicate the XY coordinates of the center position of the residual fiducial mark FM2.

[0073] The recognition control unit 524 calculates the mark recognition position average μf of the above formula (2) and the mark recognition position deviation σf of the above formula (3) corresponding to each of a pair of reference fiducial marks FM1 on the substrate PPA based on the mark recognition data DM output from the mark recognition unit 522 during execution of normal control. Similarly, the recognition control unit 524 calculates the mark recognition position average μf and the mark recognition position deviation σf corresponding to the residual fiducial mark FM2 on the substrate PPA.

[0074] When normal control is being executed by the recognition control unit 524, the data output unit 525 uses the mark recognition data DM output from the mark recognition unit 522 as is to output a recognition data set SD indicating a data group of the mark recognition data DM for each fiducial mark FM1, FM2 on the substrate PPA (step a42).

[0075] When the number of substrates PPA carried into the working area WA reaches the reference number a (YES in step a4), the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522 so that imaging processing and image recognition processing are performed on the pair of reference fiducial marks FM1 on the substrate PPA (step a5). As a result, in the preparation stage for skip control after the execution of normal control, the mark recognition camera 51 generates mark images GM corresponding to the pair of reference fiducial marks FM1 on the substrate PPA, and the mark recognition unit 522 outputs mark recognition data DM. The mark recognition data DM corresponding to the pair of reference fiducial marks FM1 includes the mark recognition coordinates Rn of the above formula (1).

[0076] The recognition control unit 524 judges whether the recognition stability condition is satisfied or not by whether the difference between the mark recognition coordinates Rn included in the mark recognition data DM corresponding to the pair of reference fiducial marks FM1 in the preparation stage for skip control after the execution of normal control and the mark recognition position average μf based on the mark recognition data DM corresponding to the pair of reference fiducial marks FM1 during the execution of normal control falls within a predetermined allowable range (step a6). Note that the allowable range may be set according to the mark recognition position deviation σf based on the mark recognition data DM corresponding to the pair of reference fiducial marks FM1 during the execution of normal control (for example, 2σ, 3σ, etc.), or may be set according to the setting data DS input via the operation unit 526.

[0077] When the difference between the mark recognition coordinates Rn corresponding to the pair of reference fiducial marks FM1 in the preparation stage for skip control after the execution of normal control and the mark recognition position average μf corresponding to the pair of reference fiducial marks FM1 during the execution of normal control falls within the allowable range (YES in step a6), the recognition control unit 524 determines that the recognition stability condition is satisfied. In this case, the recognition control unit 524 executes skip control to control the mark recognition camera 51 and the mark recognition unit 522, respectively, to skip the imaging process and image recognition process for the residual fiducial marks FM2 on the substrate PPA carried into the work area WA (step a7). This makes it possible to shorten the processing time required for the total imaging process and image recognition process for each lot of the substrate PPA according to the skipping of the imaging process and image recognition process for the residual fiducial marks FM2 on the substrate PPA.

[0078] In addition, skip control may be performed on all remaining fiducial marks FM2 on the substrate PPA, or skip control may be performed on only those remaining fiducial marks FM2 on the substrate PPA whose mark recognition position deviation σf during normal control is less than a predetermined value.

[0079] When the recognition control unit 524 executes skip control, the data output unit 525 creates a recognition data set SD for a pair of reference fiducial marks FM1 that are not subject to skip control by directly using the mark recognition data DM output from the mark recognition unit 522. On the other hand, for the remaining fiducial mark FM2 that is subject to skip control, the data output unit 525 creates a recognition data set SD by using the mark recognition data DM (e.g., the mark recognition position average μf) output from the mark recognition unit 522 corresponding to the remaining fiducial mark FM2 when normal control is executed. Then, the data output unit 525 outputs the created recognition data set SD (step a8).

[0080] If the recognition stability condition is not satisfied (NO in step a6), the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522, respectively, so that imaging processing and image recognition processing are performed on the residual fiducial mark FM2 on the substrate PPA (step a61).

[0081] <Second concrete example of mark recognition processing by a mark recognition device> A second specific example of the mark recognition process by the mark recognition device 5 will be described with reference to FIGS. 7 and 8. FIG. 7 shows an example of a multi-piece substrate PPB as the substrate PP. The multi-piece substrate PPB is a substrate in which a plurality of piece substrates PPB2 are arranged between a pair of end-piece substrates PPB1. In the multi-piece substrate PPB, no circuit is formed in the pair of end-piece substrates PPB1, and circuits independent of each other are formed in each of the plurality of piece substrates PPB2. In the pair of end-piece substrates PPB1, reference fiducial marks FM1 are formed in the vicinity of positions corresponding to vertices on a diagonal line passing through the origin coordinates of the rectangular multi-piece substrate PPB as a whole, at reference positions of the entire multi-piece substrate PPB. In each of the plurality of piece substrates PPB2, a reference fiducial mark FM1 and a residual fiducial mark FM2 are formed in the vicinity of vertices on one diagonal line of the rectangular piece substrate PPB2. The reference fiducial mark FM1 on the piece substrate PPB2 is formed at a reference position on the piece substrate PPB2.

[0082] The recognition control unit 524 judges whether the number of the multiple boards PPB carried into the work area WA has reached a reference number a (step b1).

[0083] If the number of the multiple substrates PPB carried into the working area WA has not reached the reference number a (NO in step b1), the recognition control unit 524 executes normal control until the reference number a is reached (step b2). In this normal control, the recognition control unit 524 executes each of the controls in steps b21 to b23.

[0084] In step b21, the recognition control unit 524 controls the mark recognition camera 51 to perform imaging processing for each of the reference fiducial marks FM1 on the pair of end-piece substrates PPB1 in the multiple substrate PPB, and controls the mark recognition unit 522 to perform image recognition processing. As a result, mark images GM are generated by the mark recognition camera 51 corresponding to each of the reference fiducial marks FM1 on the pair of end-piece substrates PPB1, and mark recognition data DM is output from the mark recognition unit 522. The mark recognition data DM corresponding to the reference fiducial marks FM1 on the pair of end-piece substrates PPB1 includes the mark recognition coordinates Rn of the above formula (1) that indicate the XY coordinates of the center position of the reference fiducial mark FM1.

[0085] Next, the recognition control unit 524 controls steps b22 and b23 for each of the plurality of individual substrates PPB2 in the multiple substrate PPB. That is, the recognition control unit 524 controls the recognition of the reference fiducial mark FM1 and the recognition of the residual fiducial mark FM2 for each of the plurality of individual substrates PPB2.

[0086] In step b22, the recognition control unit 524 controls the mark recognition camera 51 to perform imaging processing on the reference fiducial mark FM1 on the individual substrate PPB2, and controls the mark recognition unit 522 to perform image recognition processing. As a result, a mark image GM is generated by the mark recognition camera 51 corresponding to the reference fiducial mark FM1 on the individual substrate PPB2, and mark recognition data DM is output from the mark recognition unit 522. The mark recognition data DM corresponding to the reference fiducial mark FM1 on the individual substrate PPB2 includes the mark recognition coordinates Rn of the above formula (1) indicating the XY coordinates of the center position of the reference fiducial mark FM1.

[0087] In step b23, the recognition control unit 524 controls the mark recognition camera 51 to perform imaging processing on the residual fiducial mark FM2 on the individual substrate PPB2, and controls the mark recognition unit 522 to perform image recognition processing. As a result, a mark image GM is generated by the mark recognition camera 51 corresponding to the residual fiducial mark FM2 on the individual substrate PPB2, and mark recognition data DM is output from the mark recognition unit 522. The mark recognition data DM corresponding to the residual fiducial mark FM2 on the individual substrate PPB2 includes the mark recognition coordinates Rn of the above formula (1) indicating the XY coordinates of the center position of the residual fiducial mark FM2.

[0088] The recognition control unit 524 calculates the mark recognition position average μf of the above formula (2) and the mark recognition position deviation σf of the above formula (3) corresponding to the reference fiducial marks FM1 on the pair of piece substrates PPB1 based on the mark recognition data DM output from the mark recognition unit 522 during execution of normal control. In addition, the recognition control unit 524 calculates the mark recognition position average μf of the above formula (2) and the mark recognition position deviation σf of the above formula (3) corresponding to each of the reference fiducial marks FM1 and the residual fiducial marks FM2 on the piece substrate PPB2 for each of the plurality of individual substrates PPB2.

[0089] When normal control is being performed by the recognition control unit 524, the data output unit 525 outputs the recognition data set SD using the mark recognition data DM output from the mark recognition unit 522 as is (step b3). Specifically, the data output unit 525 outputs the recognition data set SD indicating a data group of the mark recognition data DM of the reference fiducial marks FM1 on the pair of end piece substrates PPB1, and also outputs the recognition data set SD indicating a data group of the mark recognition data DM of the reference fiducial marks FM1 and the residual fiducial marks FM2 for each of the multiple individual substrates PPB2.

[0090] When the number of the multi-piece substrates PPB carried into the working area WA reaches the reference number a (YES in step b1), the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522 so that imaging processing and image recognition processing are performed on each of the reference fiducial marks FM1 on the pair of end-piece substrates PPB1 in the multi-piece substrate PPB (step b4). As a result, the mark recognition camera 51 generates mark images GM corresponding to each of the reference fiducial marks FM1 on the pair of end-piece substrates PPB1, and the mark recognition unit 522 outputs mark recognition data DM. The mark recognition data DM corresponding to the reference fiducial marks FM1 on the pair of end-piece substrates PPB1 includes the mark recognition coordinates Rn of the above formula (1).

[0091] Next, the recognition control unit 524 performs a preparatory control for the skip control after the execution of the normal control for each of the plurality of individual boards PPB2.

[0092] Specifically, the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522 so that imaging processing and image recognition processing are performed on the reference fiducial mark FM1 on the individual substrate PPB2 (step b5). As a result, in the preparation stage for skip control after execution of normal control, a mark image GM is generated by the mark recognition camera 51 corresponding to the reference fiducial mark FM1 on the individual substrate PPB2, and mark recognition data DM is output from the mark recognition unit 522. The mark recognition data DM corresponding to the reference fiducial mark FM1 on the individual substrate PPB2 includes the mark recognition coordinates Rn of the above formula (1).

[0093] The recognition control unit 524 judges whether the recognition stability condition is satisfied based on whether the difference between the mark recognition coordinate Rn included in the mark recognition data DM corresponding to the reference fiducial mark FM1 on the individual substrate PPB2 in the preparation stage for skip control after the execution of normal control and the mark recognition position average μf based on the mark recognition data DM corresponding to the reference fiducial mark FM1 on the individual substrate PPB2 during the execution of normal control falls within a predetermined allowable range (step b6). Note that the allowable range may be set according to the mark recognition position deviation σf based on the mark recognition data DM corresponding to the reference fiducial mark FM1 on the individual substrate PPB2 during the execution of normal control (for example, 2σ, 3σ, etc.), or may be set according to the setting data DS input via the operation unit 526.

[0094] When the difference between the mark recognition coordinate Rn corresponding to the reference fiducial mark FM1 on the individual substrate PPB2 in the preparation stage for skip control after the execution of normal control and the mark recognition position average μf corresponding to the reference fiducial mark FM1 on the individual substrate PPB2 during the execution of normal control falls within the allowable range (YES in step b6), the recognition control unit 524 determines that the recognition stability condition is satisfied. In this case, the recognition control unit 524 executes skip control to control the mark recognition camera 51 and the mark recognition unit 522, respectively, to skip the imaging process and image recognition process for the remaining fiducial mark FM2 on the individual substrate PPB2 (step ab7). This makes it possible to shorten the processing time required for the total imaging process and image recognition process for the multiple substrate PPB in units of lots, according to the skipping of the imaging process and image recognition process for the remaining fiducial mark FM2 on each individual substrate PPB2.

[0095] In addition, skip control targeting the residual fiducial mark FM2 on the individual substrate PPB2 may be performed when the mark recognition position deviation σf during execution of normal control corresponding to the residual fiducial mark FM2 is less than a predetermined value.

[0096] When skip control is executed by the recognition control unit 524, the data output unit 525 creates a recognition data set SD for the reference fiducial mark FM1 that is not subject to skip control on the individual substrate PPB2 by directly using the mark recognition data DM output from the mark recognition unit 522. On the other hand, for the remaining fiducial mark FM2 that is subject to skip control on the individual substrate PPB2, the data output unit 525 creates a recognition data set SD by using the mark recognition data DM (e.g., the mark recognition position average μf) output from the mark recognition unit 522 in correspondence with the remaining fiducial mark FM2 when normal control is executed. Then, the data output unit 525 outputs the created recognition data set SD (step b8).

[0097] If the recognition stability condition is not satisfied (NO in step b6), the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522, respectively, so that imaging processing and image recognition processing are performed on the remaining fiducial mark FM2 on the individual substrate PPB2 (step b61).

[0098] <Specific example of bat mark recognition processing by the mark recognition device> A specific example of the bat mark recognition process by the mark recognition device 5 will be described with reference to Figures 9 and 10. Figure 9 shows an example of a multiple-panel substrate PPB in which a bat mark BM is affixed to one of a plurality of individual substrates PPB2 on which circuits EC are formed. The bat mark BM is a mark indicating that the individual substrate PPB2 has a defect. The individual substrate PPB2 determined to have a bat mark BM affixed in the bat mark recognition process by the mark recognition device 5 is excluded from the component mounting process by the head unit 25.

[0099] The recognition control unit 524 judges whether the number of the multiple boards PPB carried into the work area WA has reached a reference number a (step c1).

[0100] If the number of multi-panel substrates PPB carried into the working area WA has not reached the reference number a (NO in step c1), the recognition control unit 524 executes normal control targeting the bat marks BM until the reference number a is reached (step c2). In this normal control, the recognition control unit 524 controls the mark recognition camera 51 to perform imaging processing on the bat marks BM on the individual substrate PPB2, and controls the mark recognition unit 522 to perform image recognition processing. As a result, a mark image GM is generated by the mark recognition camera 51 in correspondence with the bat marks BM on the individual substrate PPB2, and mark recognition data DM is output from the mark recognition unit 522 (step c3).

[0101] When the number of multi-panel substrates PPB carried into the working area WA reaches the reference number a (YES in step c1), the recognition control unit 524 judges whether the mark recognition data DM relating to the bat marks BM output from the mark recognition unit 522 each time a multi-panel substrate PPB is carried into the working area WA during execution of normal control is associated with an individual substrate PPB2 arranged at the same position on the multi-panel substrate PPB. As a result, the recognition control unit 524 judges whether the mark recognition data DM relating to the bat marks BM has been continuously output from the mark recognition unit 522 in correspondence with the individual substrates PPB2 arranged at the same position on the multi-panel substrate PPB sequentially carried into the working area WA during execution of normal control (step c4).

[0102] When the mark recognition unit 522 continuously outputs the mark recognition data DM corresponding to the bat mark BM during execution of the normal control, it is expected that the individual substrate PPB2 arranged at the same position on the multiple substrate PPB of the same lot has a defect. For this reason, when the mark recognition unit 522 continuously outputs the mark recognition data DM corresponding to the bat mark BM during execution of the normal control (YES in step c4), the recognition control unit 524 executes skip control to control the mark recognition camera 51 and the mark recognition unit 522, respectively, to skip the imaging process and image recognition process targeted at the bat mark BM on the individual substrate PPB2 (step c5). This makes it possible to shorten the processing time required for the total imaging process and image recognition process for the multiple substrate PPB in units of lots, in accordance with the skipping of the imaging process and image recognition process targeted at the bat mark BM on the individual substrate PPB2.

[0103] When the skip control for the bat mark BM is executed by the recognition control unit 524, the data output unit 525 outputs recognition skip information for notifying that the mark recognition process for the bat mark BM has been skipped (step c6). This recognition skip information is input, for example, to the mounting inspection device 14 downstream of the component mounting device 13 in which the mark recognition device 5 is disposed in the component mounting line 10. In the mounting inspection device 14, the input of the recognition skip information causes it to recognize that there is a defect in the individual substrate PPB2 of the multiple substrate PPB carried out from the component mounting device 13 and carried into the mounting inspection device 14. In a state in which the defect in the individual substrate PPB2 is recognized, the mounting inspection device 14 may perform a process of collecting data for analyzing the cause of the defect.

[0104] When recognition skip information is output from the mark recognition device 5 disposed in the pattern forming device 11, the recognition skip information is input to the pattern inspection device 12 downstream of the pattern forming device 11. In this case, similar to the above-mentioned mounting inspection device 14, the pattern inspection device 12 may perform a process of collecting data for analyzing the cause of defects in the individual substrate PPB2.

[0105] When the mark recognition unit 522 is not continuously outputting the mark recognition data DM corresponding to the bat mark BM during execution of the normal control (NO in step c4), the recognition control unit 524 controls the mark recognition camera 51 and the mark recognition unit 522 so that imaging processing and image recognition processing are performed on the bat mark BM on the individual substrate PPB2 in the multiple substrate PPB carried into the work area WA after execution of the normal control (step c41). As a result, the mark recognition camera 51 generates a mark image GM corresponding to the bat mark BM on the individual substrate PPB2, and the mark recognition unit 522 outputs the mark recognition data DM (step c42).

[0106] The individual substrate PPB2 corresponding to the mark recognition data DM relating to the bat mark BM can be excluded from the component mounting process by the head unit 25. [Explanation of symbols]

[0107] 5. Mark Recognition Device 51 Mark Recognition Camera 52 Management device 522 Mark Recognition Unit 524 Recognition control unit 11 Pattern forming device (processing device) 13 Component mounting equipment (processing equipment) BM Bat Mark DM mark recognition data FM1 Standard Fiducial Mark FM2 Residual Fiducial Mark GM mark image PP, PPA substrate PPB Multi-panel board PPB2 piece board WA Work Area

Claims

1. A mark recognition device that recognizes a plurality of marks formed on a substrate carried into a predetermined work area in lots, a mark recognition unit that recognizes a feature amount of the mark in a mark image by performing an image recognition process on the mark image showing an image of the mark on the substrate, and outputs mark recognition data showing the recognition result; a recognition control unit that controls the mark recognition unit every time the substrate of the same lot is carried into the work area, The recognition control unit is executing normal control for controlling the mark recognition unit so that the image recognition process is performed on all of the multiple marks on the substrate until the number of the substrates carried into the work area reaches a predetermined reference number; when the substrate is newly carried into the work area after the number of carried-in substrates has reached the reference number, if a recognition stability condition indicating stability of the mark recognition data corresponding to the marks on the substrates of the same lot, which is set based on the mark recognition data output from the mark recognition unit during execution of the normal control, is satisfied, the skip control is executed to control the mark recognition unit to skip the image recognition process targeted at a specific mark among the multiple marks on the substrate; The substrate is a multiple substrate including a plurality of individual substrates, The recognition control unit is When a butt mark indicating that the individual substrate has a defect is formed on the individual substrate as the mark, In the normal control, the mark recognition unit is controlled so that the image recognition process is performed on the bat mark for each of the plurality of individual substrates. In the skip control, when the mark recognition data corresponding to the bat mark is continuously output from the mark recognition unit during execution of the normal control, the mark recognition device determines that the recognition stability condition is satisfied for each of the plurality of individual substrates, and controls the mark recognition unit to skip the image recognition process targeting the bat mark as the specific mark.

2. the mark includes a fiducial mark for identifying a position of the substrate; The mark recognition device according to claim 1, wherein the recognition control unit executes the skip control of the image recognition processing targeting the specific mark among the fiducial marks when the fiducial marks are formed in three or more locations on the substrate and the recognition stability condition is satisfied.

3. The mark recognition device of claim 2, wherein the recognition control unit does not allow execution of the skip control when a board having a circuit formed on a side opposite to a side on which the fiducial mark to be recognized is formed and components mounted thereon is brought into the work area.

4. the fiducial marks include a reference fiducial mark formed at a reference position on the substrate, and a residual fiducial mark formed at a position on the substrate other than the reference position, The recognition control unit is In the normal control, the mark recognition unit is controlled so that the image recognition process is performed on the reference fiducial mark and the residual fiducial mark; The mark recognition device of claim 2 or 3, wherein in the skip control, the mark recognition unit is controlled so that the image recognition processing is performed on the reference fiducial mark, and when a difference between the mark recognition data output from the mark recognition unit and the mark recognition data output from the mark recognition unit corresponding to the reference fiducial mark when the normal control is executed falls within a predetermined tolerance range, it is determined that the recognition stability condition is satisfied, and the mark recognition unit is controlled so as to skip the image recognition processing targeting the remaining fiducial mark as the specific mark.

5. the reference fiducial mark and the residual fiducial mark are formed on the plurality of individual substrates in the substrate, The mark recognition device according to claim 4, wherein the recognition control unit controls the mark recognition unit to skip the image recognition process for the remaining fiducial marks when it determines that the recognition stability condition is satisfied for each of the plurality of individual substrates in the skip control.

6. A mark recognition device that recognizes a plurality of marks formed on a substrate that is brought into a predetermined work area in lots, a mark recognition unit that recognizes a feature amount of the mark in a mark image by performing an image recognition process on the mark image showing an image of the mark on the substrate, and outputs mark recognition data showing the recognition result; a recognition control unit that controls the mark recognition unit every time the substrate of the same lot is carried into the work area, The recognition control unit is executing normal control for controlling the mark recognition unit so that the image recognition process is performed on all of the multiple marks on the substrate until the number of the substrates carried into the work area reaches a predetermined reference number; when the substrate is newly carried into the work area after the number of carried-in substrates has reached the reference number, if a recognition stability condition indicating stability of the mark recognition data corresponding to the marks on the substrates of the same lot, which is set based on the mark recognition data output from the mark recognition unit during execution of the normal control, is satisfied, the skip control is executed to control the mark recognition unit to skip the image recognition process targeted at a specific mark among the multiple marks on the substrate; the mark includes a fiducial mark for identifying a position of the substrate; the fiducial marks include a reference fiducial mark formed at a reference position on the substrate, and a residual fiducial mark formed at a position on the substrate other than the reference position, the substrate is a multiple substrate including a plurality of individual substrates on which the reference fiducial marks and the residual fiducial marks are formed, The recognition control unit is When a butt mark indicating that the individual substrate has a defect is formed on the individual substrate as the mark, In the normal control, the mark recognition unit is controlled so that the image recognition process is performed on the reference fiducial mark and the residual fiducial mark for each of the plurality of individual substrates, and the image recognition process is performed on the butt mark; In the skip control, the mark recognition device controls the mark recognition unit so that the image recognition process is performed on the reference fiducial mark for each of the multiple individual substrates, and when a difference between the mark recognition data output from the mark recognition unit and the mark recognition data output from the mark recognition unit corresponding to the reference fiducial mark during execution of the normal control falls within a predetermined tolerance range, it determines that the recognition stability condition is satisfied, and skips the image recognition process targeting the residual fiducial mark as the specific mark, and determines that the recognition stability condition is satisfied when the mark recognition data corresponding to the bat mark is continuously output from the mark recognition unit during execution of the normal control, and controls the mark recognition unit to skip the image recognition process targeting the bat mark as the specific mark.

7. a substrate transport unit that transports the substrate on which the marks are formed to a predetermined work area in units of lots; a mark recognition device according to any one of claims 1 to 6, which recognizes a plurality of marks on the substrate carried into the work area; a head unit that applies processing to a predetermined area on the substrate based on a recognition result of the mark by the mark recognition device.

Images