Substrate work device, substrate loading control method, and substrate work control method

Abstract

To make it possible to confirm the generation of a floating matter when a predetermined work is performed on a board having a mounting location where a component is mounted.SOLUTION: A dust sensor 5 (floating object detection unit) that detects dust floating in a housing 40 of a mounter 4 (board working device) is provided to output detection values Vc1 and Vc2 corresponding to the amount of dust in the housing 40. Therefore, on the basis of the detection values Vc1 and Vc2 of the dust sensor 5, it is possible to check the dust generation status in the mounter 4.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a technique for detecting floating objects in a board processing device that performs a predetermined operation on a board having mounting locations on which components are mounted. [Background technology]

[0002] As shown in Patent Document 1, a board on which components are mounted can be produced using a solder printer that prints solder on mounting locations on the board and a component mounter that mounts components on the mounting locations on the board on which the solder is printed. In particular, Patent Document 1 provides a camera that captures an image of the board, and when a foreign object attached to the board is detected based on the image captured by the camera, the foreign object is removed from the board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-198730 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, it is preferable to carry out work on a board in a clean environment. However, the above-mentioned method of checking for boards on which foreign matter has already adhered is difficult to deal with this. In other words, an environment in which a large amount of floating matter such as dust and dirt is floating inside a board working device such as a solder printer or a component mounter is not suitable for working on a board. However, the above-mentioned method cannot check the occurrence of such floating matter. Therefore, there has been a demand for a technology that can check the occurrence of floating matter in a board working device.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a technology that makes it possible to check the occurrence of floating objects when performing specified operations on a board having mounting locations on which components are mounted. [Means for solving the problem]

[0006] The board work device of the present invention is a board work device that performs a predetermined operation on a board having mounting locations on which components are mounted, and comprises a housing, a board transport unit that transports the board to a work position within the housing, a work execution unit that performs a predetermined operation on the board transported to the work position by the board transport unit, and a floating object detection unit that detects floating objects within the housing and outputs a detection value corresponding to the amount of floating objects.

[0007] The floating object detection method of the present invention is a floating object detection method for detecting floating objects using a board work device that performs a specified operation on a board having mounting locations on which components are mounted, and includes a step of detecting floating objects floating within the housing of the board work device using a floating object detection unit arranged within the housing, and outputting a detection value corresponding to the amount of floating objects from the floating object detection unit.

[0008] In the present invention (substrate working apparatus and floating matter detection method) configured as described above, a floating matter detection unit is provided for detecting floating matter floating in the housing of the substrate working apparatus, and this floating matter detection unit outputs a detection value corresponding to the amount of floating matter in the housing. Therefore, it is possible to confirm the occurrence of floating matter in the substrate working apparatus based on the detection value of the floating matter detection unit.

[0009] The substrate working device may be configured to further include a first control unit that acquires a detection value of the floating matter detection unit as a pre-loading detection value before the substrate is loaded into the working position and controls the loading of the substrate by the substrate transport unit based on the pre-loading detection value. In this configuration, the loading of the substrate can be appropriately controlled based on the occurrence of floating matter before the substrate is loaded.

[0010] The substrate working device may be configured such that, when the pre-loading detection value is less than the load permission threshold, the first control unit causes the substrate transport unit to load the substrate to the working position, but when the pre-loading detection value is equal to or greater than the load permission threshold, the first control unit prohibits the substrate transport unit from loading the substrate to the working position. In this configuration, when there is a large amount of floating matter in the housing, loading of the substrate to the working position in the housing is prohibited, thereby preventing the substrate from being loaded into an unclean environment.

[0011] The first control unit may configure the substrate processing device so that, when the pre-loading detection value is equal to or greater than the load permission threshold, a warning is issued to the worker. In this configuration, when there is a large amount of floating matter in the housing, the worker can then use the warning as a trigger to perform cleaning work as appropriate to remove the floating matter from the housing.

[0012] The first control unit may be configured to obtain the detection value of the floating object detection unit after issuing the warning as a post-warning detection value, and when it is confirmed that the post-warning detection value is less than the carry-in permission threshold, to cause the substrate transport unit to carry in the substrate to the work position. In this configuration, when the floating object in the housing is reduced by the cleaning work of the worker, the substrate can be carried in to the work position in the housing.

[0013] The substrate processing device may be configured such that the first control unit obtains the detection value of the floating object detection unit after a predetermined time has elapsed since it was confirmed that the pre-load detection value is equal to or greater than the load permission threshold value as a pre-warning detection value, and issues a warning to the worker when it is confirmed that the pre-warning detection value is equal to or greater than the load permission threshold value. In this configuration, when there is a large amount of floating objects in the housing, a warning is issued to the worker. Therefore, the worker can use the warning as a trigger to perform cleaning work as appropriate to remove the floating objects from inside the housing.

[0014] The substrate working device may be configured such that, when the first control unit confirms that the pre-warning detection value is less than the carry-in permission threshold, the first control unit causes the substrate transport unit to carry in the substrate to the working position. In this configuration, when the amount of floating matter in the housing decreases over a predetermined time, the substrate can be carried in to the working position in the housing.

[0015] The first control unit may be configured to change the carry-in permission threshold in response to an input operation by the worker. In this configuration, the board operation device can control whether to allow or prohibit the board from being carried in according to the cleanliness level inside the case desired by the worker.

[0016] The substrate processing apparatus may be further configured to include a second control unit that acquires the amount of floating matter detected by the floating matter detection unit as a pre-operation detection value before the operation execution unit performs the predetermined operation, and controls the operation execution unit to perform the predetermined operation based on the pre-operation detection value. In this configuration, the execution of the predetermined operation on the substrate can be appropriately controlled based on the occurrence state of floating matter before the operation execution unit performs the predetermined operation.

[0017] The second control unit may be configured to prohibit the operation unit from performing the predetermined operation when the pre-operation detection value is equal to or greater than the operation permission threshold value. In this configuration, the operation unit is prohibited from performing the predetermined operation when there is a large amount of floating matter inside the housing, so that the predetermined operation can be prevented from being performed on the substrate in an unclean environment.

[0018] The second control unit may be configured to cause the operation execution unit to execute the predetermined operation when the pre-operation detection value is less than the operation permission threshold value. In this configuration, the predetermined operation can be executed on the substrate in a clean environment.

[0019] The substrate processing device may be further configured to include a camera that captures an image of the substrate brought into the processing position, and the second control unit may control the execution of a predetermined task by the task execution unit based on the result of determining whether or not there is something attached to the substrate from the image acquired by the camera capturing the substrate. In this configuration, the execution of the predetermined task on the substrate can be appropriately controlled depending on the presence or absence of something attached to the substrate.

[0020] The substrate processing device may be configured such that, when the second control unit detects a substance adhering to the substrate, the second control unit prohibits the operation unit from performing the predetermined operation. In this configuration, the predetermined operation can be prevented from being performed on the substrate having the substance adhering thereto.

[0021] The second control unit may be configured to cause the operation execution unit to execute a predetermined operation when the pre-operation detection value is less than the operation permission threshold value and the substrate is free of any attached matter. In this configuration, the predetermined operation can be appropriately executed on a substrate free of any attached matter.

[0022] The second control unit may be configured to change the work permission threshold in response to an input operation by the worker. In this configuration, the board working device can control whether or not a predetermined work is performed in response to the cleanliness level inside the case desired by the worker.

[0023] The substrate processing apparatus may be configured to further include a storage unit that stores the detection value output by the floating matter detection unit as a log. In this configuration, by analyzing the log, it is possible to obtain information regarding the occurrence of floating matter.

[0024] The substrate working apparatus may be configured so that the floating object detector is attached to the substrate transport unit, and in this configuration, it is possible to check the occurrence of floating objects in the vicinity of the substrate.

[0025] The substrate processing device may be configured such that the task execution unit has a task unit that executes a predetermined task and a unit drive unit that drives the task unit, and the floating matter detection unit is attached to the task unit. In this configuration, the location where the floating matter occurrence status is checked can be appropriately changed by moving the floating matter detection unit along with the task unit.

[0026] The substrate processing device may be configured so that a plurality of floating object detectors are provided within the housing. In this configuration, floating objects can be detected at a plurality of locations, and the occurrence of floating objects can be confirmed over a wide area within the housing.

[0027] The work execution unit may be configured to mount components on the mounting locations of the board carried into the work position. In this configuration, it is possible to check the occurrence of floating objects in the component mounter (board work device).

[0028] The work execution unit may be configured to print solder on the mounting portion of the board brought into the work position. In this configuration, it is possible to check the occurrence of floating objects in the printing machine (board work device). Effect of the Invention

[0029] As described above, according to the present invention, it is possible to check the occurrence status of floating objects when performing a predetermined operation on a board having mounting locations on which components are mounted. [Brief description of the drawings]

[0030] [Figure 1] FIG. 2 is a plan view showing a component mounter. [Diagram 2] FIG. 2 is a diagram showing an electrical configuration of the component mounter shown in FIG. [Diagram 3] 6 is a flowchart showing a first example of board carry-in control executed by the component mounter. [Figure 4] 11 is a flowchart showing a second example of board carry-in control executed by the component mounter. [Diagram 5] 4 is a flowchart showing an example of component mounting control executed by the component mounter. [Figure 6] FIG. 13 is a plan view showing a schematic diagram of a modified example of the component mounter. [Figure 7] 6 is a flowchart showing an example of an operation for collecting detection values ​​of a dust sensor as a log. [Figure 8] FIG. 2 is a front view showing a schematic diagram of a solder printer; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Fig. 1 is a plan view showing a component mounter, and Fig. 2 is a diagram showing the electrical configuration of the component mounter of Fig. 1. In Fig. 1 and the following figures, the horizontal X direction, the horizontal Y direction perpendicular to the X direction, and the vertical Z direction are appropriately shown. This component mounter 4 mounts a component P at a mounting location provided on a board B. The board B is, for example, a printed circuit board, and the mounting location is, for example, a land provided on the printed circuit board.

[0032] 2, the mounter 4 includes a control unit 410, a storage unit 420, and a UI (User Interface) 430. The control unit 410 is a processor including a CPU (Central Processing Unit) and the like, and controls the entire mounter 4. The storage unit 420 is a storage device including a HDD (Hard Disk Drive) or SSD (Solid State Drive), and stores various data. The UI 430 is, for example, a touch panel display, and displays information to an operator and accepts input operations from the operator.

[0033] 1, the component mounter 4 includes a pair of conveyors 41 arranged in parallel in the Y direction. The component mounter 4 mounts components P on the board B carried in from the upstream side (left side in FIG. 1) in the Y direction (board transport direction) to a mounting work position Lo (position of the board B in FIG. 1) by the conveyor 41, and carries out the board B (component-mounted board B) on which mounting of the components P has been completed from the mounting work position Lo to the downstream side in the Y direction by the conveyor 41. The transport of the board B by this conveyor 41 is controlled by the control unit 410.

[0034] Further, in the component mounter 4, a pair of X-axis rails 421 parallel to the X direction, an X-axis ball screw 422 parallel to the X direction, and an X-axis motor Mx (servo motor) that rotates and drives the X-axis ball screw 422 are provided, and a Y-axis rail 424 parallel to the Y direction is supported by the pair of X-axis rails 421 so as to be movable in the X direction and is fixed to the nut of the X-axis ball screw 422. A Y-axis ball screw 425 parallel to the Y direction and a Y-axis motor My (servo motor) that rotates and drives the Y-axis ball screw 425 are attached to the Y-axis rail 424, and the head unit 43 is fixed to the nut of the Y-axis ball screw 425 while being supported by the Y-axis rail 424 so as to be movable in the Y direction. Therefore, the control unit 410 can rotate the X-axis ball screw 422 by the X-axis motor Mx to move the head unit 43 in the X direction, and rotate the Y-axis ball screw 425 by the Y-axis motor My to move the head unit 43 in the Y direction.

[0035] A board recognition camera C is attached to the head unit 43. The board recognition camera C faces downward and captures an image of a fiducial mark of the board B located at the mounting work position Lo. The image captured by the board recognition camera C is transferred to the control unit 410, and the control unit 410 can determine the position of the board B from the fiducial mark included in the image.

[0036] The head unit 43 has a so-called rotary type mounting head 431. That is, the mounting head 431 has a plurality (eight pieces) of nozzles 432 arranged at equal angular intervals in a circular shape centered on a rotation axis, and the plurality of nozzles 432 can rotate about the rotation axis by the driving force of an R-axis motor Mr. Furthermore, the nozzles 432 are raised and lowered in the Z direction by a Z-axis driving mechanism Mz constituted by an actuator or the like. Therefore, the control unit 410 can adjust the rotational position of the nozzles 432 by controlling the R-axis motor Mr, and can adjust the height of the nozzles 432 by controlling the Z-axis driving mechanism Mz.

[0037] Further, a pressure applying section 433 is in communication with the nozzle 432, and the pressure applying section 433 applies a predetermined pressure to the nozzle 432 according to the control of the control section 410. Specifically, when the nozzle 432 is to suck and hold the component P, the pressure applying section 433 applies a negative pressure to the nozzle 432. Further, when the nozzle 432 is to place the component P on a mounting location (land) of the board B, the pressure applying section 433 applies atmospheric pressure or positive pressure to the nozzle 432.

[0038] As shown in FIG. 1, two component supply units 44 are arranged in the X direction on each side of the pair of conveyors 41 in the Y direction. A plurality of tape feeders 441 are arranged in the Y direction and detachably attached to each component supply unit 44. The tape feeders 441 extend in the X direction and have component supply points 442 at their ends on the conveyor 41 side in the X direction. A component supply reel around which a tape is wound, in which small pieces of components P such as integrated circuits, transistors, and capacitors are stored at predetermined intervals, is arranged for each tape feeder 441, and the tape pulled out from the component supply reel is loaded into the tape feeder 441. The tape feeder 441 intermittently feeds the tape in the X direction toward the conveyor 41 side in response to a command from the control unit 410. As a result, the components P in the tape are fed in the X direction (feed direction) and supplied to the component supply points 442 of the tape feeder 441 in order.

[0039] Then, the mounting head 431 mounts the component P on the board B by executing the following operation based on a command from the control unit 410. That is, the mounting head 431 moves above the tape feeder 441 and brings the nozzle 432 into contact with the component P supplied to the component supply point 442 by the tape feeder 441. Then, the mounting head 431 adsorbs (picks up) the component P by the negative pressure applied to the nozzle 432. The mounting head 431 transfers the component P thus held by the nozzle 432 to a mounting point (land) of the board B at the mounting work position Lo.

[0040] Moreover, the component mounter 4 includes a housing 40, and the mounting work position Lo is provided within the housing 40. Here, the fact that the object is provided within the housing 40 indicates a state in which the object is included inside the outer edge of the housing 40 in a plan view. Note that in FIG. 1, the housing 40 is shown through. The head unit 43 and the board recognition camera C are also disposed within the housing 40, and in a plan view, the movement ranges of the head unit 43 and the board recognition camera C are contained within the housing 40. Furthermore, the tip portions of the respective tape feeders 441 are also disposed within the housing 40.

[0041] Furthermore, the component mounter 4 includes a dust sensor 5 disposed in the housing 40. The dust sensor 5 has a configuration similar to that of the particle sensor described in, for example, 2019-158721, and sucks air in the housing 40 through an intake port 51 and exhausts it through an exhaust port 52. The dust sensor 5 has a light emitting unit that irradiates light onto air passing through a flow path from the intake port 51 to the exhaust port 52, and a light receiving unit that receives light reflected by particles (dust) contained in the air, and the light receiving unit outputs a detection value (current value or voltage value) according to the amount of light received. In the example of FIG. 1, the dust sensor 5 is attached to the side surface (outer surface) in the Y direction of the conveyor 41, and the intake port 51 and the exhaust port 52 face upward. That is, the dust sensor 5 detects dust (floating matter) floating in the housing 40 and outputs a detection value according to the amount of the dust to the control unit 410. Therefore, the control unit 410 can confirm the amount of dust inside the housing 40 based on the detection value output from the dust sensor 5.

[0042] Fig. 3 is a flowchart showing a first example of board carry-in control executed by the component mounter. The flowchart in Fig. 3 is executed based on the control of the control unit 410 when the board B waiting upstream of the mounting work position Lo in the board transport direction (Y direction) is carried into the mounting work position Lo by the conveyor 41. The waiting location for the board B is provided, for example, outside the housing 40. However, the board B may be made to wait in a state where it is partially inserted inside the housing 40.

[0043] In step S101, while the board B is waiting upstream of the mounting work position Lo, the dust sensor 5 detects dust (floating matter) in the housing 40 (dust detection) and outputs a detection value Vc1 according to the amount of dust. In step S102, the control unit 410 judges whether the detection value Vc1 is less than the carry-in permission threshold Tcp. If the detection value Vc1 is less than the carry-in permission threshold Tcp ("YES" in step S102), the board B is carried into the mounting work position Lo (step S108).

[0044] On the other hand, if the detection value Vc1 is equal to or greater than the carry-in permission threshold Tcp ("NO" in step S102), the control unit 410 prohibits the board B from being carried into the mounting work position Lo (step S103). That is, the control unit 410 does not execute the carrying of the board B into the mounting work position Lo by the conveyor 41, and the board B waits upstream of the mounting work position Lo in the board transport direction (Y direction).

[0045] Furthermore, if the detection value Vc1 is equal to or greater than the carry-in permission threshold Tcp ("NO" in step S102), the control unit 410 issues a warning to the worker (step S104). For example, the control unit 410 displays a warning screen on the display of the UI 430, indicating that a large amount of dust has been generated. Alternatively, the control unit 410 sounds a warning buzzer from a speaker provided in the UI 430. By confirming such a warning, the worker can perform cleaning work to remove the dust. Specifically, cleaning work can be performed by circulating air inside the housing 40 through a filter, thereby capturing dust with the filter.

[0046] When a predetermined time has elapsed since the warning was issued ("YES" in step S105), the dust sensor 5 detects dust (floating matter) in the housing 40 (dust detection) and outputs a detection value Vc2 corresponding to the amount of dust (step S106). In step S107, the control unit 410 judges whether the detection value Vc2 is less than the carry-in permission threshold Tcp. If the detection value Vc2 is less than the carry-in permission threshold Tcp ("YES" in step S107), the board B is carried into the mounting operation position Lo (step S108). On the other hand, if the detection value Vc2 is equal to or greater than the carry-in permission threshold Tcp ("NO" in step S107), the process returns to step S103.

[0047] In this way, in the first example of board transport control, a dust sensor 5 (floating object detection unit) is provided that detects dust floating inside the housing 40 of the component mounter 4 (board work device), and this dust sensor 5 outputs detection values ​​Vc1, Vc2 according to the amount of dust inside the housing 40. Therefore, it is possible to check the dust generation status in the component mounter 4 based on the detection values ​​Vc1, Vc2 of the dust sensor 5.

[0048] Furthermore, the control unit 410 (first control unit) acquires the detection value Vc1 (pre-entry detection value) of the dust sensor 5 before carrying the board B to the mounting work position Lo (work position) (step 101). Then, the control unit 410 controls the carrying of the board B to the mounting work position Lo by the conveyor 41 (board transport unit) based on the detection value Vc1 (steps S102, S103, S108). With this configuration, the carrying of the board B can be appropriately controlled based on the dust generation state before carrying the board B to the mounting work position Lo.

[0049] Furthermore, when the detection value Vc1 is less than the carry-in permission threshold Tcp, the control unit 410 causes the conveyor 41 to carry in the board B to the mounting work position Lo (step S108), whereas when the detection value Vc1 is equal to or greater than the carry-in permission threshold Tcp, the control unit 410 prohibits the conveyor 41 from carrying in the board B to the mounting work position Lo (step S103). In this configuration, when there is a lot of dust inside the housing 40, carrying in the board B to the mounting work position Lo inside the housing 40 is prohibited, so that carrying in the board B into an unclean environment can be prevented.

[0050] Furthermore, when the detection value Vc1 is equal to or greater than the carry-in permission threshold value Tcp, the control unit 410 issues a warning to the worker (step S104). In this configuration, when there is a large amount of dust inside the housing 40, a warning is issued to the worker. Therefore, the worker can use the warning as a trigger to perform cleaning work as appropriate and remove floating objects from inside the housing 40.

[0051] Furthermore, after issuing the warning, the control unit 410 acquires the detection value Vc2 (detection value after warning) of the dust sensor 5 (step S106). Then, when the control unit 410 confirms that the detection value Vc2 is less than the carry-in permission threshold value Tcp ("YES" in step S107), it causes the conveyor 41 to carry in the board B to the mounting work position Lo (step S108). In this configuration, when the dust in the housing 40p has decreased due to the cleaning work of the worker, the board B can be carried in to the mounting work position Lo in the housing 40p.

[0052] Moreover, the dust sensor 5 is attached to the conveyor 41 (substrate transport section). With this configuration, the generation state of dust in the vicinity of the substrate B can be confirmed.

[0053] Fig. 4 is a flowchart showing a second example of board carry-in control executed by the component mounter. The flowchart in Fig. 4 is executed based on the control of the control unit 410 when the board B waiting upstream of the mounting work position Lo in the board transport direction (Y direction) is carried into the mounting work position Lo by the conveyor 41, similar to the first example in Fig. 3.

[0054] In step S201, while the substrate B is waiting, the dust sensor 5 detects dust (floating matter) (dust detection) and outputs a detection value Vc3 according to the amount of dust. If the detection value Vc3 is less than the carry-in permission threshold Tcp (YES in step S202), the substrate B is carried into the mounting work position Lo (step S208). On the other hand, if the detection value Vc3 is equal to or greater than the carry-in permission threshold Tcp (NO in step S202), the substrate B is prohibited from being carried into the mounting work position Lo (step S203).

[0055] Furthermore, if the detection value Vc3 is equal to or greater than the carry-in permission threshold Tcp ("NO" in step S202), steps S204 to S207 are executed. That is, when a predetermined time has elapsed since the control unit 410 confirmed that the detection value Vc3 is equal to or greater than the carry-in permission threshold Tcp ("YES" in step S204), the control unit 410 causes the dust sensor 5 to detect dust floating in the housing 40, and acquires the detection value Vc4 of the dust sensor 5 corresponding to the amount of dust (step S205).

[0056] In step S206, the control unit 410 judges whether the detection value Vc4 is less than the carry-in permission threshold Tcp. If the detection value Vc4 is less than the carry-in permission threshold Tcp (YES in step S206), the board B is carried into the mounting work position Lo (step S208). On the other hand, if the detection value Vc4 is equal to or greater than the carry-in permission threshold Tcp (NO in step S206), the control unit 410 issues a warning to the operator (step S207) and returns to step S204.

[0057] In this way, in the second example of board transport control, a dust sensor 5 (floating object detection unit) is provided that detects dust floating inside the housing 40 of the component mounter 4 (board work device), and this dust sensor 5 outputs detection values ​​Vc3, Vc4 according to the amount of dust inside the housing 40. Therefore, it is possible to check the dust generation status in the component mounter 4 based on the detection values ​​Vc3, Vc4 of the dust sensor 5.

[0058] Furthermore, the control unit 410 (first control unit) acquires the detection value Vc4 (pre-warning detection value) of the dust sensor 5 after a predetermined time has elapsed since it was confirmed that the detection value Vc3 (pre-entry detection value) is equal to or greater than the entry permission threshold value Tcp (steps S204, S205). Then, when the control unit 410 confirms that the detection value Vc4 is equal to or greater than the entry permission threshold value Tcp ("NO" in step S206), it issues a warning to the worker (step S207). In this configuration, if there is a large amount of dust inside the housing 40, a warning is issued to the worker. Therefore, the worker can use the warning as a trigger to perform cleaning work as appropriate to remove dust from inside the housing 40.

[0059] Furthermore, when the control unit 410 confirms that the detection value Vc4 is less than the carry-in permission threshold value Tcp ("YES" in step S206), it causes the conveyor 41 (substrate transport unit) to carry in the board B to the mounting work position Lo. In this configuration, when the amount of dust in the housing 40 decreases over a predetermined time, the board B can be carried in to the mounting work position Lo in the housing 40.

[0060] Fig. 5 is a flowchart showing an example of component mounting control executed by the component mounter. The flowchart in Fig. 5 is executed under the control of the control unit 410 when the head unit 43 mounts the component P on the board B carried in to the mounting work position Lo.

[0061] In step S301, before starting mounting of components P on the board B at the mounting work position Lo, the dust sensor 5 detects dust (floating matter) in the housing 40 (dust detection) and outputs a detection value Vm1 according to the amount of dust. In step S302, the control unit 410 judges whether the detection value Vm1 is less than the mounting permission threshold Tmp. Then, if the detection value Vm1 is less than the mounting permission threshold Tmp (if "YES" in step S302), the head unit 43 starts mounting the components P on the board B (step S308). As a result, the head unit 43 repeats the operation of transferring the components P supplied to the component supply location 442 by the tape feeder 441 to the board B in a predetermined procedure.

[0062] On the other hand, if the detection value Vm1 is equal to or greater than the mounting permission threshold Tmp ("NO" in step S302), the control unit 410 prohibits the head unit 43 from mounting the component P on the board B. In other words, the control unit 410 does not execute mounting of the component P on the board B by the head unit 43, and the head unit 43 waits at a predetermined home position.

[0063] Furthermore, if the detection value Vm1 is equal to or greater than the mounting permission threshold Tmp (if "NO" in step S302), the control unit 410 issues a warning to the worker (step S304). Specifically, the warning can be issued in the same manner as in step S104. By acknowledging the warning, the worker can perform cleaning work to remove dust.

[0064] When a predetermined time has elapsed since the warning was issued ("YES" in step S305), the dust sensor 5 detects dust (floating matter) in the housing 40 (dust detection) and outputs a detection value Vm2 corresponding to the amount of dust (step S306). In step S307, the control unit 410 determines whether the detection value Vm2 is less than the mounting permission threshold Tmp. If the detection value Vm2 is less than the mounting permission threshold Tmp ("YES" in step S307), mounting of the component P on the board B is started (step S308). On the other hand, if the detection value Vm2 is equal to or greater than the mounting permission threshold Tmp ("NO" in step S307), the process returns to step S303.

[0065] In this example of component mounting control, a dust sensor 5 (floating object detection unit) is provided to detect dust floating inside a housing 40 of a component mounter 4 (board working device), and this dust sensor 5 outputs detection values ​​Vm1, Vm2 according to the amount of dust inside the housing 40. Therefore, it is possible to check the dust generation status in the component mounter 4 based on the detection values ​​Vm1, Vm2 of the dust sensor 5.

[0066] Furthermore, the control unit 410 (second control unit) acquires a detection value Vm1 (pre-operation detection value) indicating the amount of dust detected by the dust sensor 5 before component mounting (predetermined operation) is performed by the head unit 43 (operation execution unit) (step S301), and controls the execution of component mounting by the head unit 43 based on the detection value Vm1 (steps S302, S303, S308). With this configuration, it is possible to appropriately control the execution of component mounting on the board B based on the dust generation state before component mounting is performed.

[0067] Furthermore, when the detection value Vm1 is equal to or greater than the mounting permission threshold Tmp (work permission threshold), the control unit 410 prohibits the head unit 43 from mounting components (step S303). In this configuration, when there is a large amount of dust inside the housing 40, the component mounting is prohibited, so that it is possible to prevent component mounting on the board B from being performed in an unclean environment.

[0068] Furthermore, when the detection value Vm1 is less than the mounting permission threshold Tmp, the control unit 410 causes the head unit 43 to mount components. In this configuration, component mounting on the board B can be performed in a clean environment.

[0069] Incidentally, as shown in the following modified example, the result of foreign object detection using the board recognition camera C can be used in combination with the component mounting control of Fig. 5. In this modified example, foreign object detection is performed in addition to dust detection in step S301. In this foreign object detection, the board recognition camera C faces the board B stopped at the mounting work position Lo from above and captures an image of the board B. This image is transferred from the board recognition camera C to the control unit 410, and the control unit 410 judges whether or not there is a foreign object attached to the board B.

[0070] Then, in step S302, the next mounting start condition · Mounting start condition 1…Detection value Vm1<Mounting permission threshold Tmp Mounting start condition 2: No foreign matter is present on board B If both of these conditions are met, the answer is determined to be "YES" and component mounting is started (step S308). On the other hand, if either mounting start condition 1 or 2 is not met, component mounting is prohibited (step S303). Furthermore, steps S306 and S307 are also executed in the same manner as steps S301 and S302.

[0071] In such a modified example, a board recognition camera C (camera) is provided to image the board B brought into the mounting work position Lo, and the control unit 410 (second control unit) controls the execution of component mounting by the head unit 43 based on the result of determining whether or not there is foreign matter (adherence) adhering to the board B from the image acquired by imaging the board B with the board recognition camera C (steps S301, S302, S308).In such a configuration, the execution of component mounting on the board B can be appropriately controlled depending on the presence or absence of foreign matter adhering to the board B.

[0072] Furthermore, when the control unit 410 detects foreign matter adhering to the substrate B ("YES" in step S302), it prohibits the head unit 43 from mounting components (step S303). With this configuration, it is possible to prevent component mounting from being performed on the substrate B having foreign matter adhering thereto.

[0073] Furthermore, when the control unit 410 confirms that the detection value Vm1 (pre-operation detection value) is less than the mounting permission threshold Tmp (operation permission threshold) and that no foreign matter is attached to the board B, it causes the head unit 43 to mount components. In this configuration, component mounting can be appropriately performed on the board B that does not have any foreign matter attached.

[0074] Fig. 6 is a plan view showing a schematic diagram of a modified example of a component mounter. The difference between the component mounters 4 in Fig. 6 and Fig. 1 is the arrangement of the dust sensor 5, but the other configurations are the same between the two. That is, in the component mounter 4 in Fig. 6, the dust sensor 5 is attached to the head unit 43, and the dust sensor 5 can move within the housing 40 together with the head unit 43 by being driven by the X-axis motor Mx and the Y-axis motor My. The intake port 51 and exhaust port 52 of the dust sensor 5 each face to the side (X direction).

[0075] That is, there are provided a head unit 43 (work unit) that performs component mounting, and an X-axis motor Mx and a Y-axis motor My (unit drive section) that drive the head unit 43, and the dust sensor 5 is attached to the head unit 43. Therefore, by moving the dust sensor 5 along with the head unit 43, the location where the dust generation status is checked can be changed as appropriate.

[0076] Fig. 7 is a flowchart showing an example of an operation for collecting detection values ​​of the dust sensors as a log. The flowchart in this figure is executed under the control of the control unit 410. In addition, in the component mounter 4, the dust sensors 5 are attached to both the side surface of the conveyor 41 (configuration in Fig. 1) and the head unit 43 (configuration in Fig. 6). In other words, two dust sensors 5 are provided.

[0077] In this flowchart, dust is detected by the dust sensor 5 each time an event (the events shown in steps S401 to S406) occurs in the mounter 4 (step S407), and the detected value is recorded as a log in the storage unit 420 (step S408). Note that the detected value of the dust sensor 5 is recorded in association with the content of the event that triggered the acquisition of the detected value and the time when the detected value was acquired.

[0078] Specifically, when the transport of the board B to the mounting work position Lo is confirmed ("YES" in step S401), the dust sensor 5 attached to the conveyor 41 detects dust (step S407), and the dust detection value obtained in step S407 is recorded as a log (step S408). This makes it possible to record the dust generation situation in the vicinity of the board B immediately after the board B is transported.

[0079] When the mounting head 431 of the head unit 43 moves above the component supply point 442 ("YES" in step S402), the dust sensor 5 attached to the head unit 43 detects dust (step S407), and the dust detection value obtained in step S407 is recorded as a log (step S408). This makes it possible to record the dust generation situation in the vicinity of the component supply point 442 immediately after the mounting head 431 moves to the component supply point 442.

[0080] When the mounting head 431 of the head unit 43 picks up the component P from the component supply point 442 ("YES" in step S403), the dust sensor 5 attached to the head unit 43 detects dust (step S407), and the dust detection value obtained in step S407 is recorded as a log (step S408). This makes it possible to record the dust generation situation in the vicinity of the component supply point 442 immediately after the mounting head 431 picks up the component P from the component supply point 442.

[0081] When the mounting head 431 of the head unit 43 moves above the mounting location on the substrate B ("YES" in step S404), the dust sensor 5 attached to the head unit 43 detects dust (step S407), and the dust detection value obtained in step S407 is recorded as a log (step S408). This makes it possible to record the dust generation situation in the vicinity of the substrate B immediately after the mounting head 431 moves to the mounting location.

[0082] When the mounting head 431 of the head unit 43 mounts the component P on the mounting location ("YES" in step S405), the dust sensor 5 attached to the head unit 43 detects dust (step S407), and the dust detection value obtained in step S407 is recorded as a log (step S408). This makes it possible to record the dust generation situation in the vicinity of the board B immediately after the mounting head 431 mounts the component P.

[0083] When the removal of the board B from the mounting work position Lo is confirmed ("YES" in step S406), the dust sensor 5 attached to the conveyor 41 detects dust (step S407), and the dust detection value obtained in step S407 is recorded as a log (step S408). This makes it possible to record the dust generation situation in the vicinity of the board B immediately after the board B is removed.

[0084] In this way, the detection value output by the dust sensor 5 is stored as a log in the storage unit 420. In this configuration, by analyzing the log, it is possible to obtain information about the dust generation situation.

[0085] Moreover, a plurality of dust sensors 5 are provided inside the housing 40. In this configuration, dust can be detected at a plurality of locations, and the dust generation state can be confirmed over a wide range inside the housing 40.

[0086] As described above, in this embodiment, the component mounter 4 corresponds to an example of the “board working device” of the present invention, the housing 40 corresponds to an example of the “housing” of the present invention, the conveyor 41 corresponds to an example of the “board transport section” of the present invention, the head unit 43 corresponds to an example of the “working unit” of the present invention, the head unit 43, the X-axis motor Mx and the Y-axis motor My cooperate to function as an example of the “work execution section” of the present invention, the X-axis motor Mx and the Y-axis motor My correspond to an example of the “unit drive section” of the present invention, the dust sensor 5 corresponds to an example of the “floating matter detection section” of the present invention, the control section 410 corresponds to an example of the “first control section” and the “second control section” of the present invention, and the memory section 420 corresponds to an example of the “memory section” of the present invention. In the present invention, the detection values ​​Vc1 and Vc3 correspond to an example of a "pre-loading detection value" of the present invention, the detection value Vc2 corresponds to an example of a "post-warning detection value" of the present invention, the detection value Vc4 corresponds to an example of a "pre-warning detection value" of the present invention, the detection value Vm1 corresponds to an example of a "pre-work detection value" of the present invention, the load permission threshold Tcp corresponds to an example of a "loading permission threshold" of the present invention, and the mounting permission threshold Tmp corresponds to an example of a "work permission threshold" of the present invention.

[0087] The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention. For example, the number and arrangement of the dust sensors 5 are not limited to the above example. Therefore, three or more dust sensors 5 can be arranged in the housing 40, and the dust sensors 5 can be attached to a location other than the conveyor 41 and the head unit 43.

[0088] The orientation of the dust sensor 5 may be changed as appropriate. In this case, the intake port 51 and the exhaust port 52 may face upward, sideways, or downward. Also, the intake port 51 and the exhaust port 52 do not necessarily need to face the same direction.

[0089] Also, the manner in which the detection value by the dust sensor 5 is recorded as a log can be modified in various ways. For example, instead of being triggered by an event as in Fig. 5, the detection value by the dust sensor 5 may be recorded as a log every time a predetermined time (e.g., 30 seconds or 1 minute) has elapsed.

[0090] The setting of the carry-in permission threshold Tcp can be performed in various ways. For example, the control unit 410 may change the carry-in permission threshold Tcp in response to an input operation by an operator to the UI 430. In this configuration, it is possible to control whether or not to carry in the substrate B in response to the cleanliness level inside the housing 40 desired by the operator.

[0091] The mounting permission threshold Tmp can be set in various ways. For example, the control unit 410 may change the mounting permission threshold Tmp in response to an input operation by an operator via the UI 430. In this configuration, it is possible to control whether or not to perform component mounting in response to the cleanliness level inside the housing 40 desired by the operator.

[0092] Furthermore, the specific configuration of the component mounter 4 may be changed as appropriate. Therefore, for example, as described in JP 2019-110154 A, the component mounter 4 may be configured to mount bare chips of a diced wafer W as components P on a substrate B (flip-chip mounting).

[0093] Alternatively, the dust sensor 5 may be provided in a solder printer that prints solder on the mounting locations (lands) of the board B, and the same control as in each of the above flowcharts may be executed. FIG. 8 is a front view showing a schematic diagram of a solder printer. The solder printer 2 prints solder on the lands of the board B using a mask M through which pattern holes corresponding to the lands of the board B penetrate. The solder printer 2 includes a mask holding unit 21 that holds the mask M, a board holding unit 23 disposed below the mask M, and a squeegee unit 29 disposed above the mask M. The mask holding unit 21, the board holding unit 23, and the squeegee unit 29 are disposed in a housing 20 of the solder printer 2. The solder printer 2 prints the solder supplied to the upper surface of the mask M on the upper surface of the board B through the pattern holes of the mask M (printing work) by sliding the squeegee 291 of the squeegee unit 29 on the upper surface of the mask M in the X direction while the board B faces the mask M from below using the board holding unit 23.

[0094] The substrate holding unit 23 is disposed below the mask M held by the mask holding unit 21, and aligns the position of the substrate B with respect to the mask M. The substrate holding unit 23 has a pair of conveyors 24 that transport the substrate B, a substrate holding part 25 that holds the substrate B received from the conveyors 24, and a flat movable table 26 that supports the conveyors 24 and the substrate holding part 25.

[0095] The pair of conveyors 24 are arranged parallel to each other in the Y direction with a gap therebetween in the X direction, and support both ends in the X direction of the board B from below with their upper surfaces. Each conveyor 24 transports the board B in the Y direction and carries the board B into or out of the solder printer 2. In particular, the position facing the mask M from below corresponds to the printing position where solder is printed on the board B, and the conveyor 24 carries the board B into the printing position inside the housing 20 and carries the board B out from the printing position.

[0096] The substrate holding unit 25 has a flat lift table 251 and a slide support 252 that can slide in the Z direction relative to the movable table 26, and the lift table 251 is supported on the upper end of the slide support 252. In addition, a plurality of backup pins 253 erected in the Z direction are arranged on the upper surface of the lift table 251 at intervals in the X and Y directions. Then, as the slide support 252 rises and falls, the backup pins 253 rise and fall together with the lift table 251. For example, when the conveyor 24 carries in the substrate B, the upper end of each backup pin 253 is positioned below the upper surface of the conveyor 24. Then, when the conveyor 24 carries in the substrate B to the printing work position directly above the backup pin 253, the backup pin 253 rises and the upper end of the backup pin 253 protrudes upward from the upper surface of the conveyor 24. As a result, the substrate B is transferred from the upper surface of the conveyor 24 to the upper ends of each backup pin 253.

[0097] Furthermore, the substrate holding unit 25 has a pair of clamp plates 254 arranged at a distance in the X direction above the pair of conveyors 24. The upper surface of each clamp plate 254 is a plane parallel to the X and Y directions and is located at the same height. At least one of these clamp plates 254 is movable in the X direction.

[0098] Then, the substrate B on the backup pins 253 rises up to between a pair of clamp plates 254, and the movable clamp plates 254 move in the X direction, narrowing the gap between the clamp plates 254 and clamping the substrate B from the X direction (horizontal direction) by the clamp plates 254.

[0099] Furthermore, the substrate holding unit 23 has a table driving mechanism 27 that drives the movable table 26. This table driving mechanism 27 has an X-axis table 271, a Y-axis table 272 attached to the upper surface of the X-axis table 271, an R-axis table 273 attached to the upper surface of the Y-axis table 272, and a ball screw 274 that raises and lowers the movable table 26 relative to the R-axis table 273. This table driving mechanism 27 drives the X-axis table 271 in the X direction, drives the Y-axis table 272 in the Y direction, drives the R-axis table 273 in the R direction (a rotation direction about an axis parallel to the Z direction), and drives the movable table 26 in the Z direction by rotating the ball screw 274. In other words, the table driving mechanism 27 can drive the conveyor 24 and the substrate holding part 25 arranged on the movable table 26 in the X, Y, Z, and R directions. For example, when positioning the loaded substrate B with respect to the mask M, the table drive mechanism 27 raises the substrate B clamped by the clamp plate 254 in the Z direction while adjusting the position of the substrate B in the X, Y, and R directions. This brings the upper surfaces of the clamp plate 254 and the substrate B into contact with the lower surface of the mask M.

[0100] The squeegee unit 29 adjusts the rotation angle of the squeegee 291 to bring the squeegee 291 into contact with the upper surface of the mask M at a predetermined angle (attack angle) and presses the squeegee 291 against the mask M with a predetermined pressure (printing pressure). From this state, the squeegee unit 29 moves the squeegee 291 in the X direction at a predetermined speed (squeegee speed), thereby printing solder onto the lands of the substrate B through the pattern holes in the mask M.

[0101] Furthermore, the solder printer 2 includes a dust sensor 5 disposed within the housing 20. This dust sensor 5 is attached to the side (outer surface) in the X direction of the conveyor 24, and the intake port 51 and the exhaust port 52 face upward. This dust sensor 5 detects dust (floating matter) floating within the housing 20, and outputs a detection value according to the amount of the dust to the control unit 200. Therefore, the control unit 200 can confirm the amount of dust within the housing 20 based on the detection value output from the dust sensor 5. Note that the control unit 200 is a processor configured with a CPU and the like.

[0102] The solder printer 2 (board working device) configured in this manner is provided with a dust sensor 5 that detects dust floating within the housing 20, and this dust sensor 5 outputs a detection value corresponding to the amount of dust within the housing 20. Therefore, it is possible to check the dust generation status in the solder printer 2 based on the detection value of the dust sensor 5.

[0103] Furthermore, when the conveyor 24 carries the substrate B to the printing position (a position overlapping the mask M in a plan view), the substrate carry-in control of Fig. 3 or Fig. 4 can be executed, thereby achieving the same effects as those described above.

[0104] The arrangement of the dust sensor 5 in the solder printer 2 is not limited to the example in FIG. 8, and the dust sensor 5 may be attached to the squeegee unit 29, for example. This allows the dust sensor 5 to move within the housing 20 together with the squeegee unit 29. Furthermore, the same operation as described above for recording the detection value of the dust sensor 5 as a log can also be executed for the solder printer 2. [Explanation of symbols]

[0105] 2...Solder printer (circuit board work device) 4...Component mounting machine (board work device) 40…Housing 41...Conveyor (substrate transport section) 43...Head unit (work execution unit, work unit) 5...Dust sensor (floating object detection unit) 410...Control unit (first control unit, second control unit) 420...Storage section Mx...X-axis motor Mx (operation execution part, unit drive part) My…Y-axis motor My (operation execution part, unit drive part) B: Substrate P…Parts Lo…Mounting work position (work position) C…Board recognition camera (camera) Vc1: Detection value (detection value before delivery) Vc2: Detection value (detection value after warning) Vc3: Detection value (detection value before delivery) Vc4: Detection value (pre-warning detection value) Vm1: Detection value (detection value before operation) Tcp… Import permission threshold Tmp: Implementation permission threshold (work permission threshold)

Claims

1. A board working device that performs a predetermined operation on a board having a mounting portion on which a component is mounted, A housing and a substrate transport unit that transports the substrate to a work position within the housing; a work execution unit that executes the predetermined work on the board that has been carried into the work position by the board transport unit; a floating matter detection unit that detects floating matter in the housing and outputs a detection value corresponding to the amount of the floating matter; a first control unit that acquires the detection value of the floating object detection unit as a pre-carry-in detection value before the substrate is carried into the work position, and when the pre-carry-in detection value is less than a carry-in permission threshold, causes the substrate transport unit to carry the substrate into the work position, while when the pre-carry-in detection value is equal to or greater than the carry-in permission threshold, prohibits the substrate transport unit from carrying the substrate into the work position; Equipped with The first control unit acquires the detection value of the floating object detection unit a pre-warning detection value a predetermined time after confirming that the pre-loading detection value is equal to or greater than the load-permission threshold, and when it confirms that the pre-warning detection value is equal to or greater than the load-permission threshold, the substrate working device notifies an operator of a warning.

2. The substrate working apparatus according to claim 1 , wherein the first control unit, when confirming that the pre-warning detection value is less than the loading permission threshold, causes the substrate transport unit to load the substrate into the working position.

3. The board working apparatus according to claim 1 , wherein the first control unit changes the carry-in permission threshold in response to an input operation by an operator.

4. A substrate working apparatus as described in any one of claims 1 to 3, further comprising a second control unit that acquires the amount of floating matter detected by the floating matter detection unit as a pre-work detection value before the specified work is performed by the work performing unit, and controls the execution of the specified work by the work performing unit based on the pre-work detection value.

5. The board working apparatus according to claim 4 , wherein the second control unit prohibits the work executing unit from performing the predetermined work when the pre-work detection value is equal to or greater than a work permission threshold value.

6. The board working apparatus according to claim 5 , wherein the second control unit causes the work execution unit to execute the predetermined work when the pre-work detection value is less than the work permission threshold value.

7. A board working device that performs a predetermined operation on a board having a mounting portion on which a component is mounted, A housing and a substrate transport unit that transports the substrate to a work position within the housing; a work execution unit that executes the predetermined work on the board that has been carried into the work position by the board transport unit; a floating matter detection unit that detects floating matter in the housing and outputs a detection value corresponding to the amount of the floating matter; a second control unit that acquires an amount of floating matter detected by the floating matter detection unit as a pre-work detection value before the predetermined work is performed by the work performing unit, and prohibits the work performing unit from performing the predetermined work if the pre-work detection value is equal to or greater than a work permission threshold; a camera for capturing an image of the substrate carried into the work position; Equipped with The second control unit controls the execution of the specified task by the task execution unit based on the result of determining whether or not there is any adhesion to the substrate based on an image acquired by the camera capturing an image of the substrate.

8. The substrate working apparatus according to claim 7 , wherein the second control unit prohibits the work execution unit from performing the predetermined work when the second control unit confirms the attachment adhering to the substrate.

9. 9. The substrate working apparatus of claim 8, wherein the second control unit causes the work execution unit to execute the specified work when it confirms that the pre-work detection value is less than the work permission threshold value and that no adhesion is attached to the substrate.

10. The substrate working apparatus according to claim 5 , wherein the second control unit changes the work permission threshold in response to an input operation by an operator.

11. The substrate processing apparatus according to claim 1 , further comprising a storage unit configured to store the detection value output by the floating object detection unit as a log.

12. 12. The substrate processing apparatus according to claim 1, wherein the floating object detector is attached to the substrate transport unit.

13. the task execution section includes a task unit that executes the predetermined task, and a unit drive section that drives the task unit; The substrate working apparatus according to claim 1 , wherein the floating object detector is attached to the working unit.

14. The substrate processing apparatus according to claim 1 , wherein a plurality of the floating object detectors are provided in the housing.

15. The board working device according to claim 1 , wherein the work execution unit mounts a component in the mounting location of the board brought into the work position.

16. The board working device according to claim 1 , wherein the work execution unit prints solder on the mounting location of the board brought into the working position.

17. A method for controlling board loading, which detects floating objects using a board work device that performs a predetermined operation on a board having a mounting portion on which a component is to be mounted, comprising: a step of detecting floating matter floating in a housing of the substrate processing device by a floating matter detection unit disposed in the housing, and outputting a detection value corresponding to an amount of the floating matter from the floating matter detection unit; a first control unit acquires the detection value of the floating object detection unit as a pre-carrying detection value before the substrate is carried into a work position in the housing by the substrate transport unit, and when the pre-carrying detection value is less than a carry-in permission threshold, causes the substrate transport unit to carry into the work position, while when the pre-carrying detection value is equal to or greater than the carry-in permission threshold, prohibits the substrate transport unit from carrying into the work position; Equipped with The first control unit acquires the detection value of the floating object detection unit a pre-warning detection value a predetermined time after confirming that the pre-loading detection value is equal to or greater than the load-carrying permission threshold, and when it confirms that the pre-warning detection value is equal to or greater than the load-carrying permission threshold, it alerts an operator with a warning.

18. A board operation control method for detecting floating objects using a board operation device that performs a predetermined operation on a board having a mounting portion on which a component is to be mounted, comprising: a step of detecting floating matter floating in a housing of the substrate processing device by a floating matter detection unit disposed in the housing, and outputting a detection value corresponding to an amount of the floating matter from the floating matter detection unit; a step of, before the predetermined work is performed by the work performing unit on the substrate carried into a work position in the housing by the substrate transport unit, a second control unit acquires an amount of floating matter detected by the floating matter detection unit as a pre-work detection value, and when the pre-work detection value is equal to or greater than a work permission threshold value, prohibiting the work performing unit from performing the predetermined work; Equipped with A substrate work control method in which the second control unit controls the execution of the specified work by the work execution unit based on the result of determining whether or not there is any adhesion to the substrate based on an image obtained by a camera imaging the substrate brought into the work position.

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