Mounting method and mounting device

Abstract

To efficiently perform mounting processing of a plurality of components requiring upper surface recognition.SOLUTION: A mounting method in a mounting device which includes a plurality of component supply devices, a head that has a plurality of collection members, a movement device that moves the head, and an imaging device that moves together with the head to image a component from above, and which arranges the components in an object after sequentially collecting the components with the collection members comprises the steps of: (a) setting the components being the collection objects in one or more groups on the basis of the collection order when the upper surface recognition component requiring upper surface recognition is included in the components being the collection objects on the basis of the image captured by the imaging device in a state of being supplied to the supply position by the component supply devices; and (b) performing processing of collecting the components in a group unit after performing the upper surface recognition of all the upper surface recognition components in the group.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] This specification discloses a mounting method and a mounting apparatus. [Background technology]

[0002] Conventionally, there is known a mounting method in which a component is recognized based on an image of the supplied component captured by a camera, and the component is mounted on a board. For example, Patent Document 1 describes a method in which a component having a characteristic part such as a light-emitting part on its upper surface is imaged from above by a camera attached to a head, and the upper surface is recognized based on the image. This allows the component to be held and positioned on the board with high precision, even if the position of the characteristic part deviates from the design value. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2016 / 020975 Summary of the Invention [Problem to be solved by the invention]

[0004] When performing the above-mentioned recognition process, it is necessary to move the head to an imaging position where the camera can capture an image of the component, capture the image, and then move the head to a pick-up position where the component is picked up. Therefore, when there are multiple components that require recognition process, the head must move multiple times between the imaging position and the pick-up position, which takes time, and may reduce the efficiency of the mounting process.

[0005] A primary object of the present disclosure is to more efficiently perform mounting processing for multiple components that require top-side recognition. [Means for solving the problem]

[0006] In order to achieve the above-mentioned main object, the present disclosure has adopted the following means.

[0007] A mounting method according to the present disclosure is a mounting method for a mounting apparatus including a plurality of component supply devices, a head having a plurality of picking members, a moving device for moving the head, and an imaging device for moving together with the head to image components from above, the method comprising the steps of: picking up components in order with the picking members and then placing the components on an object; (a) when a top-surface recognition component that requires top-surface recognition based on an image captured by the imaging device while being supplied to a supply position by the component supply device is included in the components to be picked, the components to be picked are set in one or more groups based on a picking order; (b) performing a process of picking components on a group-by-group basis after performing the top-side recognition on all top-side-recognized components in the group; The gist of the invention is that it includes the following:

[0008] In the mounting method of the present disclosure, when an upper surface recognition component is included in a component to be picked, the components to be picked are set to one or more groups based on the picking order, and the process of picking the components is performed in order by group after the upper surface recognition of all the upper surface recognition components in the group is performed. This makes it possible to suppress repeated movement of the head between the position where the imaging device is above the supply position and the position where the picking member is above the supply position when picking up multiple upper surface recognition components. This makes it possible to reduce the movement time of the head when picking up upper surface recognition components, and to perform the mounting process of the components more efficiently. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is an explanatory diagram showing an example of a mounting system 10. [Diagram 2] FIG. 2 is a diagram showing an outline of the configuration of a mounting apparatus 11. [Diagram 3] FIG. 2 is a block diagram showing the electrical connection relationship of the mounting apparatus 11. [Figure 4] 11 is a flowchart showing an example of a top surface recognition component mounting process. [Diagram 5] FIG. 13 is an explanatory diagram showing an example of a picking order, a component type, and a slot number of a tape feeder 15. [Figure 6]FIG. 13 is an explanatory diagram showing an example of a case where upper surface recognition and collection of parts are performed on a group basis. [Figure 7] 5A to 5C are explanatory diagrams showing an example of the movement of the mounting head 22 in the embodiment. [Figure 8] FIG. 11 is an explanatory diagram showing an example of movement of the mounting head 22 in the comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Next, an embodiment of the present disclosure will be described with reference to the drawings. FIG. 1 is an explanatory diagram showing an example of a mounting system 10. FIG. 2 is a configuration diagram showing an outline of the configuration of a mounting device 11. FIG. 3 is a block diagram showing the electrical connection relationship of the mounting device 11. The mounting system 10 includes, for example, a mounting device 11 that performs a pick-and-place process of picking up (sucking) a component and arranging (mounting) it on a substrate S, and a management computer 50 that manages the mounting system 10. In the mounting system 10, a plurality of mounting devices 11 are arranged from upstream to downstream, but FIG. 1 shows only one mounting device 11. In this embodiment, the left-right direction (X-axis direction), front-back direction (Y-axis direction), and up-down direction (Z-axis direction) are as shown in FIG. 1.

[0011] 1 to 3, mounting device 11 includes board transport unit 12, mounting unit 13, component supply unit 14, part camera 17, nozzle stocker 18, and control device 40 (see FIG. 3). Board transport unit 12 transports board S and fixes it at the mounting position. Board transport unit 12 has a pair of conveyor belts that are spaced apart from each other and span the left-right direction in FIG. 1, and drives the conveyor belts to transport board S.

[0012] The mounting unit 13 picks up components from the component supply unit 14 and places them on the board S fixed to the board transport unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 24. The head moving unit 20 includes a slider that moves in the XY directions guided by a guide rail, and a motor that drives the slider. The mounting head 22 is removably attached to the slider and moves in the XY directions by the head moving unit 20. One or more suction nozzles 24 are removably attached to the underside of the mounting head 22. The suction nozzle 24 is a picking member that picks up components by using pressure. The picking member may be a mechanical chuck that grips the components. The mounting head 22 raises and lowers the suction nozzle 24 along the Z axis by driving a drive motor (not shown), and adjusts the angle of the component picked up by the suction nozzle 24 by rotating (rotating) the suction nozzle 24. In addition, the mounting head 22 is structured so that a cylindrical holder that holds multiple (e.g., 12) suction nozzles 24 rotates, and the suction nozzles 24 can rise and fall to a predetermined position (here, the very front of the device) to pick up and place components.

[0013] A mark camera 25 is disposed on the underside of this mounting head 22 (or slider). The mark camera 25 moves in the X and Y directions in association with the movement of the mounting head 22. The mark camera 25 is disposed on the mounting head 22 on a side farther from the component supply unit 14 than the suction nozzle 24 (rear side in the Y direction). This mark camera 25 captures an image of a reference mark affixed to the board S, and captures an image of an upper surface recognition component that requires recognition of the component upper surface from above, and outputs the image to the control device 40.

[0014] The top-surface-recognized component is a component that has a feature on the top surface side, and is a component that requires recognition of the position and shape of the feature from above, recognition of usability, etc. For example, a top-surface-recognized component is a light-emitting component that has an LED light-emitting surface or the like as a feature on the top surface. In the mounting device 11, before the top-surface-recognized component supplied from the component supply unit 14 is adsorbed by the suction nozzle 24 of the mounting head 22, the control device 40 recognizes the top surface of the top-surface-recognized component using an image captured from above by the mark camera 25. The control device 40 corrects the suction position according to the position and shape of the recognized feature, and determines whether it is usable or not. For example, if there is a light-emitting surface on the top surface, the control device 40 can correct the suction position so that the component is adsorbed while avoiding the light-emitting surface. The control device 40 can also correct the mounting position when mounting the component based on the result of the top-surface recognition. In this way, the function (operation) of the control device 40 to recognize the top surface of the component is called TVR (Top View Recognition).

[0015] The component supply unit 14 supplies components from the front side of the mounting device 11, and is provided with a plurality of tape feeders 15 arranged in a plurality of slots aligned in the left-right direction (X-axis direction) and capable of supplying components by tape. The tape feeder 15 has a reel around which a tape is wound, on which components are stored at predetermined intervals, and supplies the components to the supply position by feeding out the tape by a predetermined amount at a time.

[0016] 2, distances D1 and D2 are determined. Distance D1 is the distance between the above-mentioned liftable position (predetermined position) of mounting head 22 and the imaging center of mark camera 25. Distance D2 is the distance (interval) in the X-axis direction between adjacent tape feeders 15. Distance D1 is several times to about ten times longer than distance D2, and in this embodiment, distance D1 is about ten times longer than distance D2.

[0017] The part camera 17 captures an image of the component picked up by the suction nozzle 24 from below, and outputs the image to the control device 40. The control device 40 recognizes the bottom surface of the component using the image captured from below by the part camera 17. In addition, the nozzle stocker 18 stocks multiple types of suction nozzles 24 that can be attached to the mounting head 22.

[0018] As shown in Fig. 3, the control device 40 is configured as a microprocessor centered on a CPU 41. The control device 40 includes a ROM 42 for storing processing programs, an HDD 43 for storing various data, a RAM 44 used as a working area, an input / output interface 45 for exchanging electrical signals with external devices, and the like, which are connected via a bus 46. The control device 40 outputs control signals to the board transport unit 12, the head moving section 20 and suction nozzle 24 of the mounting unit 13, the mark camera 25, the component supply unit 14, the part camera 17, and the like. The control device 40 also inputs signals from the mark camera 25, the component supply unit 14, the part camera 17, and the like.

[0019] The management computer (PC) 50 is a computer that manages information on each device of the mounting system 10. The management PC 50 includes a control device configured as a microprocessor centered on a CPU. The control device includes a ROM that stores a processing program, a HDD that stores various data, a RAM used as a working area, and an input / output interface for exchanging electrical signals with external devices. The management PC 50 also includes an input device 52 such as a keyboard and a mouse through which an operator inputs various commands, and a display 54 that displays various information. The management PC 50 is configured to be able to communicate with the mounting device 11, and transmits a job (mounting instruction) that instructs the mounting device 11 to start mounting processing. This job includes information on what type of components are to be mounted on the board S in what order, information on how many boards S are to be produced, information on the tape feeder 15 that supplies the components, and information on whether the supplied components are top-recognized components.

[0020] The mounting process of the mounting device 11 thus configured will be described below. In the mounting process, the control device 40 first causes the substrate conveying unit 12 to carry the substrate S to a predetermined position and hold it there. Next, the control device 40 causes the tape feeder 15 to feed the tape to supply components to a supply position, and causes the head moving unit 20 to move the mounting head 22 to the supply position and causes the suction nozzle 24 to pick up the components. As described above, the mounting head 22 has a plurality of (e.g., 12) suction nozzles 24. For this reason, the control device 40 sequentially moves the mounting head 22 to the supply position of each tape feeder 15 that supplies the necessary components based on the mounting order (collection order) included in the job, and sequentially moves each suction nozzle 24 to a position where it can be raised and lowered to pick up the components. Depending on the mounting order, the plurality of (e.g., 12) components picked up by each suction nozzle 24 may include components supplied from the same tape feeder 15. Next, the control device 40 causes the head moving unit 20 to move the mounting head 22 above the parts camera 17, and causes the parts camera 17 to capture an image of the underside of the component adsorbed by the suction nozzle 24. The control device 40 performs underside recognition by processing the captured underside image of the component, corrects the target mounting position of the component so that any misalignment of the component is eliminated, and then moves the mounting head 22 above the board S to mount the component at the target mounting position. The control device 40 repeats this pick and place of components that need to be mounted on the board S, and when mounting of the necessary components is completed, causes the board transport unit 12 to release its hold on the board S and carry it out of the machine.

[0021] Furthermore, when a top-surface-recognition component is included as a component to be mounted, the mounting process is performed as follows. FIG. 4 is a flowchart showing an example of the top-surface-recognition component mounting process. This process is executed by the CPU 41 of the control device 40 when a top-surface-recognition component is included in a job. Furthermore, FIG. 5 is an explanatory diagram showing an example of the picking order, component types, and slot numbers of the tape feeder 15. Here, an example is shown in which component types A to J in mounting orders 1 to 12 are all top-surface-recognition components for 12 components that can be picked up (picked and placed) at once by the 12 suction nozzles 24 of the mounting head 22, but components that do not require top-surface recognition may be included. Furthermore, FIG. 6 is an explanatory diagram showing an example of the case where top-surface recognition and picking of components are performed in groups.

[0022] In the top surface recognition component mounting process, the CPU 41 first acquires the component type to be picked this time, the picking order, and the slot number of the tape feeder 15 (S100). In the example of Fig. 5, the picking orders (mounting orders) of the 12 components to be picked are the first, seventh, and tenth, and it is determined that the same component type A is picked from the same tape feeder 15 set in slot 10. Note that in the other picking orders, different types of components are picked from tape feeders 15 in different slots.

[0023] Next, the CPU 41 judges whether or not a group has been set for the parts to be collected this time (S110). When the CPU 41 judges that a group has not been set, it judges whether or not there are top-surface-recognized parts (hereinafter, same-source parts) that are supplied from the same tape feeder 15 (S120). When the CPU 41 judges that there are same-source parts, it sets groups so that the same-source parts are not grouped together but are separated into different groups (S130). Specifically, among the same-source parts, groups are set as one group including the parts that precede the same-source parts in the collection order, excluding the first same-source part in the collection order. For example, in the example of FIG. 5, the first, seventh, and tenth parts in the collection order are the same-source parts, so that the parts are separated into a group up to the sixth part before the seventh part in the collection order, and a group up to the ninth part before the tenth part in the collection order, excluding the first part in the collection order. That is, the CPU 41 sets three groups, namely, group 1 for the first to sixth mounting orders, group 2 for the seventh to ninth mounting orders, and group 3 for the tenth to twelfth mounting orders. As another example, if the third and ninth mounting orders are identical-source parts, the parts are divided into a group up to the eighth mounting order before the ninth mounting order, excluding the third mounting order, which is the earliest mounting order, and two groups after that. On the other hand, if the CPU 41 determines in S120 that there are no identical-source parts, it sets one group including all the parts to be picked based on the picking order (S140). That is, group 1 for the first to twelfth mounting orders is set. The groups set in S130 and S140 are ordered based on the picking order of the parts.

[0024] Next, CPU 41 initializes target value N, which indicates the group number to be processed, to a value of 1 (S150), and performs top surface recognition of the components in group N (S160). For example, in the case of group 1 in FIG. 5, six components, the first to sixth components in the collection order, are imaged in order by mark camera 25, and top surface recognition (TVR) is performed (FIG. 6(1)). Next, CPU 41 causes suction nozzle 24 to pick up (pick up) the components in group N (S170, FIG. 6(2)). For example, in the case of group 1 in FIG. 5, six components, the first to sixth components in the collection order, are picked up in order by suction nozzle 24 (FIG. 6(2)).

[0025] Here, FIG. 7 is an explanatory diagram showing an example of the movement of the mounting head 22 in the embodiment. Also, FIG. 8 is an explanatory diagram showing an example of the movement of the mounting head 22 in the comparative example. Both of FIG. 7 and FIG. 8 show a case where six components of group 1 in FIG. 5 are processed. In the present embodiment in FIG. 7, the mark camera 25 is positioned in order above the component supply position of each tape feeder 15 to perform top surface recognition, the suction nozzle 24 (at a position where it can be raised and lowered) is positioned above the supply position of the tape feeder 15 at one end (the leftmost side in FIG. 7), and then the mounting head 22 is moved so that each suction nozzle 24 is positioned in order above the supply position to pick up the component. On the other hand, in the comparative example in FIG. 8, the mark camera 25 is positioned above the component supply position of the tape feeder 15 at one end to perform top surface recognition, the suction nozzle 24 is positioned above the supply position to pick up the component, and then the mounting head 22 is moved to the adjacent tape feeder 15 to sequentially repeat the process of top surface recognition of the component and picking up the component. In this way, in the comparative example, the distance D1 or the number of movements in the Y-axis direction corresponding to the distance D1 is greater than in the embodiment. As described above, the distance D1 is approximately 10 times longer than the distance D2, so the movement amount of the mounting head 22 increases in the comparative example. Therefore, in the present embodiment, it is possible to reduce the movement amount of the mounting head 22 and shorten the movement time compared to the comparative example.

[0026] After performing the top surface recognition and pickup of each component in group N in this way, the CPU 41 judges whether there is a next group (S180), and if it judges that there is a next group, it increments the target value N by a value of 1 (S190) and performs the processes of S160 to S180. That is, the CPU 41 sequentially performs the top surface recognition (FIG. 6(3)) and pickup (FIG. 6(4)) of three components in group 2. Next, the CPU 41 increments the target value N again, and then sequentially performs the top surface recognition (FIG. 6(5)) and pickup (FIG. 6(6)) of three components in group 3. In this way, in this embodiment, the process of performing the top surface recognition of all top surface recognized components in the same group and then pickup of the components is performed sequentially on a group-by-group basis. Here, if the same supply source component is included in the same group, the top surface recognition of the subsequent supply source same component cannot be performed unless the supply source same component supplied from the supply source tape feeder 15 is picked up. For this reason, not only does it become necessary to move the mounting head 22 in order to pick up the previous identical-source component with the suction nozzle 24, but it is also necessary to wait for the previous identical-source component to be picked up before recognizing the top surface of the subsequent identical-source component, resulting in a time loss due to the movement of the mounting head 22 and the waiting for suction. In this embodiment, groups are set so that identical-source components are not included in the same group, making it possible to prevent such a time loss from occurring.

[0027] Then, when the CPU 41 determines in S180 that there is no next group, it controls the mounting head 22 to move above the part camera 17 (S200), and performs bottom surface recognition processing for each component from the bottom surface image captured by the part camera 17 (S210). Then, it moves to the mounting position of each component, places each component in order (S220), and ends this processing. Note that in the case of top surface recognition components, the processing of S210 may be omitted when bottom surface recognition is not required, such as when the mounting position is corrected based on the top surface recognition result.

[0028] Here, the correspondence between the components of this embodiment and the components of this disclosure will be clarified. S130 and S140 of the top surface recognition component mounting process of this embodiment correspond to step (a), and S160 and S170 correspond to step (b). In addition, the tape feeder 15 corresponds to the component supply device, the mounting head 22 corresponds to the head, the head moving unit 20 corresponds to the moving device, the mark camera 25 corresponds to the imaging device, and the mounting device 11 corresponds to the mounting device.

[0029] When top surface recognition components are included in the collection targets, the mounting device 11 of the embodiment described above sets the collection target components to one or more groups, and performs top surface recognition and collection of all top surface recognition components in a group on a group basis. This prevents the mounting head 22 from repeatedly moving between the position where the mark camera 25 is above the supply position and the position where the suction nozzle 24 is above the supply position, and reduces the movement time of the mounting head 22.

[0030] In addition, when top surface recognition is required and components from the same supplier are included in the targets to be collected, groups are set so that the components from the same supplier are placed in separate groups, thereby preventing time loss due to the movement of the mounting head 22 or waiting for suction, and enabling efficient processing.

[0031] It goes without saying that the present disclosure is in no way limited to the above-described embodiment, and can be embodied in various forms as long as it falls within the technical scope of the present disclosure.

[0032] For example, in the above embodiment, when parts with the same supplier are included in the collection target, groups are set with the parts with the collection order preceding the parts with the same supplier as one group, but this is not limited to this. Any method of grouping may be used as long as the parts with the same supplier are grouped in separate groups and not in the same group. For example, in the example of Fig. 5, the parts with the same number of parts may be grouped into multiple groups with the first to fourth parts in the collection order as group 1, the fifth to eighth parts as group 2, and the ninth to twelfth parts as group 3.

[0033] In the above embodiment, when there are no parts with the same source, one group including all parts to be picked is set, but this is not limited to this. For example, one group may be set for each tape feeder 15, that is, each part may be set in a separate group. In this case, the top surface recognition and picking of parts are performed in groups one by one. Alternatively, groups may be set for a predetermined number of parts, such as two or three.

[0034] In the above-described embodiment, the distance D1 between the liftable position (predetermined position) of the mounting head 22 and the imaging center of the mark camera 25 is several to ten times longer than the distance D2 between adjacent tape feeders 15, but the present disclosure is not limited to this and may be any distance D1 longer than the distance D2. Alternatively, the present disclosure may be applied to a case where the distance D1 is equal to the distance D2 and is not limited to a distance D1 longer than the distance D2.

[0035] The mounting method and mounting device disclosed hereinabove may be configured as follows. For example, after the step (b), a step (c) of placing components on an object based on the result of the top surface recognition may be included. In addition, in the step (b), the top surface recognition may be performed for all top surface recognized components in the group, and then a process of picking components based on the result of the top surface recognition may be performed on a group-by-group basis.

[0036] In the mounting method disclosed herein, in step (a), when the picking targets include a plurality of identical-source components (predetermined components) that require top surface recognition and are supplied from the same component supply device, the groups may be set so that the plurality of identical-source components are each placed in a different group. In this way, top surface recognition of subsequent identical-source components is performed after the identical-source component that is earlier in the picking order is picked up, thereby preventing waiting for the earlier identical-source component to be picked up and enabling more efficient mounting processing.

[0037] In the mounting method of the present disclosure, in the step (a), among the plurality of identical-source parts, the parts whose collection order is earlier than the identical-source part, excluding the identical-source part whose collection order is the earliest, may be divided into one group, and the group may be set. In this way, appropriate grouping can be performed by simple processing.

[0038] The mounting device disclosed herein is a mounting device that sequentially picks up parts using multiple picking members and then places them on a target object, and includes multiple component supply devices, a head having the multiple picking members, a moving device for moving the head, an imaging device that moves with the head and images the parts from above, and a control device that controls the component supply devices, the head, the moving device, and the imaging device so that, if the parts to be picked include top-surface-recognized parts that require top-surface recognition based on an image captured by the imaging device while supplied to a supply position by the component supply device, the parts to be picked are set to one or more groups based on the picking order, and the process of picking parts after performing the top-surface recognition of all top-surface-recognized parts in the group is performed on a group-by-group basis.

[0039] In the mounting device of the present disclosure, as in the mounting method described above, when picking up multiple components that require top surface recognition, it is possible to suppress repeated movement of the head between a position where the imaging device is above the supply position and a position where the picking member is above the supply position. Therefore, it is possible to reduce the movement time of the head when picking up multiple components that require top surface recognition, and to more efficiently perform the mounting process of the components.

[0040] In any of the mounting devices disclosed herein, the head may be configured to move the plurality of picking members to predetermined positions in order to have the picking members pick up components at the predetermined positions, the imaging device may be provided at a position spaced a first distance from the predetermined positions, and the plurality of component supply devices may be disposed such that the supply positions are spaced a second distance apart that is shorter than the first distance. In this way, the movement time of the head when picking up a plurality of components that require top surface recognition can be reliably reduced, thereby making it possible to perform the component mounting process more efficiently. [Industrial Applicability]

[0041] The present disclosure can be used in a mounting apparatus that mounts components on a board. [Explanation of symbols]

[0042] 10 mounting system, 11 mounting device, 12 board transport unit, 13 mounting unit, 14 component supply unit, 15 tape feeder, 17 parts camera, 18 nozzle stocker, 20 head moving section, 22 mounting head, 24 suction nozzle, 25 mark camera, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 input / output interface, 46 bus, 50 management computer, 52 input device, 54 display, S board.

Claims

1. A mounting method for a mounting apparatus including a plurality of component supply devices, a head having a plurality of picking members, a moving device for moving the head, and an imaging device for moving together with the head to image components from above, the method comprising the steps of: picking up components in order with the picking members and then placing the components on an object, the method comprising the steps of: (a) when the parts to be picked include upper surface recognition parts that require upper surface recognition based on an image captured by the imaging device while being supplied to a supply position by the part supply device, setting the parts to be picked that can be picked up at one time by the multiple picking members of the head into multiple groups based on a picking order such that the number of parts in one group is less than the number of the multiple picking members of the head and the sum of the number of parts in each group is the number of the multiple picking members of the head; (b) performing a process of picking components on a group-by-group basis after performing the top surface recognition on all top surface recognized components in the group; Implementation methods including:

2. The mounting method according to claim 1, In the step (a), when the top surface recognition is required and a plurality of identical parts supplied from the same component supply device are included in the collection target, the groups are set so that the plurality of identical parts are each placed in a separate group. How to implement it.

3. The mounting method according to claim 2, In the step (a), among the plurality of identical supplier parts, the identical supplier part having the earliest picking order is excluded, and the parts having the picking order before the identical supplier part are divided into one group, and the group is set. How to implement it.

4. A mounting apparatus that sequentially picks up components using a plurality of picking members and then places the components on an object, A plurality of component supply devices; a head having the plurality of sampling members; a moving device for moving the head; an imaging device that moves together with the head to image the component from above; a control device that controls the component supply device, the head, the moving device, and the imaging device so that, when the components to be picked up include upper surface recognition components that require upper surface recognition based on an image captured by the imaging device while the components have been supplied to a supply position by the component supply device, the components to be picked up that can be picked up at one time by the multiple picking members of the head are set into multiple groups based on a picking order such that the number of components in one group is less than the number of the multiple picking members of the head and the sum of the number of components in each group is the number of the multiple picking members of the head, and a process of picking components is performed on a group basis after the upper surface recognition of all upper surface recognition components in the group has been performed; A mounting device comprising:

5. The mounting device according to any one of claims 1 to 4, The head is configured to sequentially move the plurality of collection members to predetermined positions and cause the collection members to collect parts at the predetermined positions; the imaging device is provided at a position spaced a first distance from the predetermined position, The component supply devices are disposed such that the supply positions are spaced apart from one another by a second distance that is shorter than the first distance. Mounting equipment.

Images