Temperature controlled radio frequency resonator and corresponding radio frequency oscillator

Abstract

The present invention relates to a temperature-controlled RF resonator 200 comprising a thermally insulated enclosure 110, inside which are implemented at least one resonating element 120 configured to deliver an RF output signal 120s when supplied with an RF input signal 120e, at least one heating element 130 configured to deliver thermal energy into the thermal enclosure when powered by an LF power supply signal 130ali, and at least one temperature probe 140 configured to deliver an LF electrical measurement signal 140mes according to the temperature inside the thermal enclosure. Such an RF resonator comprises at least one input / output port 200es1, 200es2 passing through the thermally insulated enclosure and for propagating at least one of the RF signals 120e, 120s and the other of the LF electrical signals 130ali, 140mes.

Description

[Technical field]

[0001] The field of the invention is that of precision frequency sources.

[0002] More particularly, the present invention relates to temperature controlled radio frequency (ie, RF) resonators and corresponding RF oscillators.

[0003] Thus, the present invention has many applications in analog applications, e.g., fields requiring precision RF signal generation, and digital applications, e.g., fields requiring precision clock generation, including, but not limited to, RF communications (e.g., cellular, military, space, etc.), banking where high clock accuracy is required, etc. [Background technology]

[0004] Frequency sources are needed to generate any kind of periodic signal, both for analog applications (e.g. for generating RF carriers) and for digital applications (e.g. for generating clocks intended to clock digital flip-flop circuits).

[0005] Many RF frequency sources are based on the use of one (or more) resonant elements to filter a periodic signal maintained inside an oscillator about its resonant frequency. The use of such a resonant element makes it possible in particular to improve the phase noise performance of the periodic signal maintained by the oscillator due to the filtering provided by the resonant element.

[0006] However, due to the physical properties of the resonant elements used in practice (e.g. MEMS (MicroElectroMechanical Systems), piezoelectric, SAW (Surface Acoustic Wave), BAW (Bulk Acoustic Wave), etc.), the resonant frequency of such resonant elements depends on their temperature. For this reason, known precision frequency sources use temperature control of the resonant elements they implement.

[0007] For example, Figure 1 shows such a temperature-controlled RF resonator 100 according to a known embodiment. More specifically, the RF resonator 100 comprises a thermally insulated housing 110, inside which the following are implemented: a resonating element 120 configured to deliver an RF output signal 120s when supplied with an RF input signal 120e. More specifically, the RF output signal 120s corresponds to the RF input signal 120e filtered around the resonant frequency RF of the resonating element 120. - a heating element 130 configured to provide thermal energy in the thermal enclosure 110 when powered by a low frequency or LF power signal 130ali. For example, the heating element 130 is a resistor that generates heat by Joule effect when a current passes through it (in this case a current corresponding to the electrical signal 130ali). In certain common implementations, the electrical signal 130ali is preferably continuous or DC (for "direct current"). However, depending on the stability of the power supply used to generate the electrical signal 130ali, the signal is still more generally LF, considering that the term LF includes the ideal DC case according to the present application. Furthermore, in some common implementations, such electrical signal 130ali is to be slaved by a servo loop. This is the case, for example, of the configuration of the oscillator 300 described below in relation to FIG. 3. With this type of control, the electrical signal 130ali changes over time, whether at the moment when the servo loop is closed or during the change of the control set point (for example to monitor the temperature change measured by the temperature sensor 140). In this embodiment, the spectrum of the variations in electrical signal 130ali is frequency limited by the bandwidth of the servo loop, so that the variations are actually at the LF as opposed to RF resonant frequency of resonator 100. a temperature sensor 140 configured to deliver an LF electrical measurement signal 140mes as a function of the temperature present in the thermal enclosure 110. For example, the temperature sensor 140 is a temperature-dependent variable resistor. The LF electrical measurement signal 140mes is in this case a current whose intensity is a function of temperature when a given potential difference is applied to the temperature sensor 140.

[0008] Additionally, the RF resonator 100 comprises six input / output ports 100es1-100es6 (a given input / output port being understood herein as comprising a single electrical connection (e.g., a single conductor carrying the various input / output signals). The six input / output ports 100es1-100es6 pass through the thermal enclosure 110 to electrically connect the various above elements within the thermal enclosure 110 to an external electrical circuit, such as an oscillator that generates and maintains the RF input signal 120e. More specifically, the input / output port 100es1 is used to propagate an RF input signal 120e from outside the housing 110 to the resonator element 120; the input / output port 100es2 is used to propagate the RF output signal 120s from the resonant element 120 to the outside of the housing 110; the input / output ports 100es3 and 100es4 are used to propagate the LF power signals 130ali from a power source external to the housing 110 to the heating element 130 and from the heating element 130 to a power source external to the housing 110, respectively; The input / output port 100es5 and the input / output port 100es6 are used to propagate the LF electrical measurement signal 140mes from the temperature sensor 140 to the outside of the housing 110 and from the outside of the housing 110 to the temperature sensor 140, respectively. Summary of the Invention [Problem to be solved by the invention]

[0009] Such RF resonators 100 are typically incorporated into RF oscillators to generate precision RF signals. However, such precision frequency sources are increasingly being used in applications where power consumption criteria are important, for example when incorporated into devices that are energy autonomous or have limited access to such energy resources (e.g., wireless communication terminals, satellites, laptop computers, etc.).

[0010] Therefore, there is a need for a temperature controlled RF resonator that consumes less power than known resonators. [Means for solving the problem]

[0011] In one embodiment of the present invention, a temperature controlled RF resonator is proposed that includes a thermally insulated housing, the thermally insulated housing includes: - at least one resonant element configured to provide an RF output signal when provided with an RF input signal, where the RF output signal corresponds to the RF input signal filtered around a resonant frequency of the at least one resonant element; - at least one heating element configured to provide thermal energy within a thermal enclosure when powered by a low frequency or LF power signal; - at least one temperature sensor configured to emit an LF electrical measurement signal as a function of the temperature in the thermally insulated enclosure; will be implemented.

[0012] Such an RF resonator comprises at least one input / output port traversing a thermal enclosure, the at least one input / output port comprising: one of the RF signals; and - other LF electrical signals At least propagate the following.

[0013] Thus, the present invention provides a novel and inventive solution for reducing the power consumption of temperature controlled RF resonators.

[0014] In particular, by reusing an input / output port (where a given input / output port is understood to comprise a single electrical connection (e.g., a single conductor carrying different input / output signals) traversing the thermally insulated enclosure) for carrying both RF and LF signals, the number of openings present in the enclosure can be minimized, thus reducing heat losses and thereby reducing energy consumption associated with heating the enclosure.

[0015] According to one embodiment of the invention, the RF resonator further comprises an RF path inside the thermally insulated housing, through which an RF signal propagates and in which the at least one resonant element is implemented, the RF path comprising decoupling means for blocking LF electrical components.

[0016] The LF signal is therefore routed to a corresponding LF path. Such decoupling means may for example comprise one (or more) capacitors.

[0017] According to one embodiment, the decoupling means comprise at least one resonant element.

[0018] Thus, LF / RF decoupling is achieved in a simple and efficient way, for example using MEMS, piezoelectric, SAW or BAW type resonator elements, since such resonator elements naturally exhibit a capacitive effect at LF.

[0019] According to one embodiment of the present invention, the RF resonator is provided inside a thermally insulated housing with: - a first LF path along which an LF power signal propagates and in which said at least one heating element is implemented, said first LF path comprising at least one first trap circuit for blocking RF electrical components; or a second LF path along which the LF electrical measurement signal propagates and in which said at least one temperature sensor is implemented, said second LF path comprising at least one second trap circuit for blocking RF electrical components; Or, it further includes both of these LF paths.

[0020] Thus, the RF signal is routed to the corresponding LF path of the resonator. For example, the trap circuit(s) may comprise an inductor implemented as a separate element or in a distributed manner (e.g., with a section of a printed circuit board acting as an inductor at RF frequencies). The trap circuit(s) may also be implemented as a higher order filter circuit that provides better rejection at a given RF frequency than a single inductor.

[0021] According to one embodiment of the invention, a first end of the RF path and a first end of the first LF path are electrically connected to a first input / output port through the insulated housing, or a second end of the RF path and a first end of the second LF path are electrically connected to a second input / output port that traverses the insulated housing, or both of these connections.

[0022] According to an embodiment of the invention, the RF resonator comprises a first LF path and said second LF path, wherein a second end of the first LF path and a second end of the second LF path are electrically connected to a third input / output port across the thermally insulated enclosure.

[0023] Therefore, the number of openings present in the housing 110 is further reduced and heat loss is also reduced.

[0024] In one embodiment of the present invention, there is provided an RF oscillator comprising an RF resonator according to any of the above embodiments.

[0025] According to some embodiments, the RF resonator of the RF oscillator comprises a first LF path and / or a second LF path (as in any of the above embodiments in which the RF resonator comprises said first LF path and / or second LF path). In these embodiments: the first input / output port comprises at least a first end of an oscillator RF path carrying a respective RF input signal and a respective RF output signal and comprising first decoupling means for blocking LF electrical components; a first oscillator LF path including at least one first trap circuit of the oscillator for propagating the LF power signal and blocking the RF electrical component; or - the second input / output port comprises at least a second end of the oscillator RF path comprising second decoupling means for respectively propagating the RF output signal and the RF input signal and blocking the LF electrical components; a second oscillator LF path including at least one second oscillator trap circuit for propagating the LF electrical measurement signal and blocking the RF electrical component; and electrically connected to both of Or it has both of these connections.

[0026] According to some embodiments, the second end of the first LF path of the RF resonator and the second end of the second LF path of the RF resonator are electrically connected to a third input / output port across the thermally insulated enclosure, hi related embodiments, the third input / output port is electrically connected to an electrical ground of the RF oscillator.

[0027] Other objects, features and advantages of the present invention will appear more clearly on reading the following description, given by way of illustrative and non-limiting example and in conjunction with the drawings in which: [Brief description of the drawings]

[0028] [Figure 1] FIG. 1, already mentioned above in connection with the "Background Art" section, shows a temperature controlled RF resonator according to a known embodiment. [Diagram 2] FIG. 1 illustrates a temperature controlled RF resonator according to one embodiment of the present invention. [Diagram 3] 3 illustrates an RF oscillator comprising the temperature controlled RF resonator of FIG. 2 according to one embodiment of the present invention. [Figure 4a] 4 shows the phase noise performance obtained for the oscillator of FIG. 3 versus an oscillator with the known RF resonator of FIG. 1; [Figure 4b] 4 shows the phase noise performance obtained for the oscillator of FIG. 3 versus an oscillator with the known RF resonator of FIG. 1; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] The general principle of the invention is based on reusing one (or more) input / output ports of a temperature-controlled RF resonator to propagate both RF signals (e.g. RF input signal 120e or RF output signal 120s) and LF signals (e.g. LF power signal 130ali or LF electrical measurement signal 140mes) used by some of the elements present inside the thermally insulated enclosure of the RF resonator, thus reducing heat losses and thereby energy consumption associated with heating the enclosure.

[0030] With reference now to FIG. 2, a temperature controlled RF resonator 200 according to one embodiment of the present invention will now be described.

[0031] The RF resonator 200 uses some of the components of the RF resonator 100 described above in relation to Fig. 1. More specifically, the RF resonator 200 also comprises an insulated housing 110 within which is mounted a resonating element 120 configured to deliver an RF output signal 120s when provided with an RF input signal 120e. As described above in relation to Fig. 1, the RF output signal 120s corresponds to the RF input signal 120e filtered around the resonant frequency RF of the resonating element 120. In other embodiments, several resonating elements are used to improve filtering of the RF signal and thus improve noise performance, although this impacts the solution size.

[0032] Returning to Fig. 2, also implemented within the housing 110 is a heating element 130 configured to provide thermal energy within the thermal housing 110 when energized by the LF power signal 130ali. As described above in relation to Fig. 1, the heating element 130 is, for example, a resistor that generates heat by the Joule effect when a current corresponding to the electrical signal 130ali passes through it. In other embodiments, several heating elements are used, for example in a distributed manner within the housing 110, to provide a uniform temperature.

[0033] Returning to Fig. 2, also implemented within the housing 110 is a temperature sensor 140 configured to deliver an LF electrical measurement signal 140mes proportional to the temperature within the thermal housing 110. As described above in relation to Fig. 1, the temperature sensor 140 is for example a temperature dependent variable resistor. The LF electrical measurement signal 140mes is in this case a current whose intensity is a function of temperature when a given potential difference is applied to the temperature sensor 140. In other embodiments, several temperature sensors are used in a distributed manner, for example within the housing 110, to provide a better temperature estimate.

[0034] Returning to Fig. 2, the RF resonator 200 includes two input / output ports 200es1 and 200es2 that cross the thermally insulated housing 110, each of which carries an RF signal 120e or 120s and an LF signal 130ali or 140mes. Thus, by reusing the input / output ports 200es1 and 200es2 to carry both the RF signal 120e or 120s and the LF signal 130ali or 140mes, the number of apertures present in the housing 110 can be minimized. This reduces the heat loss and therefore the energy consumption related to the heating of the housing 110. In fact, the energy consumption is essentially related to the power supplied to compensate for the heat loss due to the various accesses between the inside and the outside of the housing 110.

[0035] Such losses have several causes: thermal conduction, radiation, and convection. In comparison, the power consumption of an oscillator circuit can be on the order of tens to hundreds of microwatts, whereas the power consumption of the elements present within the housing 110 is on the order of 100 mW.

[0036] Typically, in known industrial implementations, the resonant element 120 is placed in a vacuum, thus limiting convection. Radiation is controlled by the lining of the housing surrounding the zone that is maintained at a set temperature. Heat conduction is through various physical elements connecting the heated zone and the exterior of the enclosure 110. These elements are electrical wires and mechanical supports. For example, a 25 μm diameter gold wire bond wire has a 26 MK.W-1 .m -1 Divide this resistivity by the number of wires required to implement the resonator. For example, if we consider a mechanical glass support of 100 μm thickness on a surface of 400 μm × 100 μm, we have a resistance of 2.5 kK.W -1 The thermal resistance of three 1mm long wires (for example the configuration in Figure 2) is 1.9kK.W. -1 .m -1 , and 1.7kK.W for five wires also 1mm long (e.g., the configuration of Figure 1). -1 .m -1 1. Thus, for a temperature change of 145K in the enclosure 110, the power consumption with five wires can be estimated at 85.5mW and the power consumption with three wires at 75mW, a 12% reduction in power consumption going from five I / O ports to three I / O ports. Doing the same calculation for 100μm long wires, the power consumption goes down by 33% going from five I / O ports to three I / O ports.

[0037] Also, the start-up time (i.e., the time required to bring the elements of the RF resonator 200 to the desired temperature and thus to accurately stabilize its resonant frequency at the desired frequency) is related to the thermal mass, and especially the thermal leakage, of the RF resonator 200. Thus, the start-up time of the RF resonator 200 is also reduced compared to the start-up time of the known RF resonator 100.

[0038] In another embodiment, a single input / output port is reused to propagate both RF and LF signals through the housing 110. In this case, there is still a gain in terms of heat loss, albeit less, compared to the case of FIG. 2, where several input / output ports are reused.

[0039] Returning to Fig. 2, the input / output port 200es1 propagates both the RF input signal 120e and the LF power signal 130ali. For this purpose, a first end of the RF path 200crf (the RF path 200crf is a path on which the resonator element 120 is implemented and on which the RF signal propagates within the housing 110 as shown by the dotted arrow 200crf in the figure) and a first end of the first LF path 200cbf1 (the first LF path 200cbf1 is a path on which the heating element 130 is implemented and on which the LF power signal 130ali propagates within the housing 110 as shown by the dotted arrow 200cbf1 in the figure) are electrically connected to the input / output port 200es1.

[0040] Similarly, the input / output port 200es2 propagates both the RF output signal 120s and the LF electrical measurement signal 140mes. To this end, a second end of the RF path 200crf and a first end of a second LF path 200cbf2 (the second LF path 200cbf2 is a path on which the temperature sensor 140 is implemented and through which the LF electrical measurement signal 140mes propagates within the housing 110 as indicated by the dotted arrow 200cbf2 in the figure) are electrically connected to the input / output port 200es1.

[0041] In another embodiment, the roles of the RF ports of the RF resonator 200 are reversed symmetrically when looking at the RF resonator 200 from the point of view of its RF path 200crf, where one input / output port carries both the RF output signal and the LF power signal, and the other input / output port carries both the RF input signal 120e and the LF electrical measurement signal 140mes.

[0042] Returning to Fig. 2, the RF path 200crf includes decoupling means for blocking the LF electrical component. Thus, the LF power signal 130ali is sent to a first LF path 200cbf1. Similarly, the LF electrical measurement signal 140mes is sent to a second LF path 200cbf2.

[0043] In the embodiment under consideration, the decoupling means comprises the resonant element 120 itself. Indeed, some resonant elements, such as MEMS, piezoelectric, SAW or BAW, have a natural capacitive effect that blocks LF electrical components. In another embodiment, the decoupling means comprises one (or more) capacitors, for example implemented in the form of a separate element. In another embodiment, the decoupling means comprises a higher order high-pass circuit, improving the rejection of certain LF frequencies.

[0044] 2, the first LF path 200cbf1 includes a first trap circuit 200cb1 that blocks the LF electrical component. Similarly, the second LF path 200cbf2 includes a second trap circuit 200cb2 that also blocks the RF electrical component. Thus, the RF signals 120e and 120s are routed to the LF path 200crf.

[0045] In this embodiment, the first trap circuit 200cb1 and the second trap circuit 200cb2 comprise inductors implemented as separate elements or in a distributed manner (e.g., with a section of a printed circuit board acting as an inductor at RF frequencies). In other embodiments, the first trap circuit 200cb1 and / or the second trap circuit 200cb2 comprise multiple elements (separate or distributed) to provide a higher order filter circuit with better rejection at a given RF frequency than a single inductor.

[0046] 2, the second end of the first LF path 200cbf1 and the second end of the second LF path 200cbf2 are electrically connected to the third input / output port 200es3. Thus, the number of openings present in the housing 110 is further reduced, and heat loss is also reduced.

[0047] In another embodiment, multiple input / output ports are used to implement return paths outside the enclosure 110 for the various LF signals implemented in the RF resonator 200 .

[0048] Referring now to FIG. 3, an RF oscillator 300 comprising the RF resonator 200 will be described.

[0049] More particularly, the RF resonator 200 allows filtering of the oscillating signal maintained by the active part 310 of the oscillator to achieve better performance, for example in terms of phase noise.

[0050] The active part 310 also measures the LF electrical measurement signal 140mes delivered by the temperature sensor 140 and generates the LF power signal 130ali for the heating element 130 according to the measurement of the electrical signal 140mes. In another embodiment, the function of measuring the LF electrical signal 140mes and generating the LF electrical signal 130ali is offset from the active part 310, which is dedicated in this case to generating and maintaining the RF oscillations.

[0051] Returning to Figure 3, the input / output port 200es1 is a first end of the RF path of the oscillator 300, comprising first decoupling means 300md1 for propagating the RF input signal 120e and blocking the LF electrical components; a first LF path of the oscillator 300, which carries the LF power signal 130ali and includes a first trap circuit 300cb1 of the oscillator 300, which blocks the RF electrical components; The input terminals are electrically connected to both of the input terminals.

[0052] Furthermore, the input / output port 200es2 is a second end of the RF path of the oscillator 300, comprising second decoupling means 300md2 for propagating the RF output signal 120s and blocking the LF electrical components; a second LF path of the oscillator 300, which comprises a second trap circuit 300cb2 of the oscillator 300, which propagates the LF electrical measurement signal 140mes and blocks the RF electrical component; The input terminals are electrically connected to both of the input terminals.

[0053] In the embodiment under consideration, the first trap circuit 300cb1 and the second trap circuit 300cb2 of the oscillator 300 comprise inductors implemented as separate elements or in a distributed manner (e.g., with a section of a printed circuit board acting as an inductor at RF frequencies). In other embodiments, the first trap circuit 300cb1 of the oscillator 300 and / or the second trap circuit 300cb2 of the oscillator 300 comprise multiple elements (separate or distributed) to provide a higher order filter circuit that exhibits better rejection at a given RF frequency than a simple inductor.

[0054] Returning to figure 3, the first decoupling means 300md1 and the second decoupling means 300md2 comprise one (or more) capacitors, for example implemented as separate elements. In other embodiments, the first decoupling means 300md1 and / or the second decoupling means 300md2 are implemented as higher order high-pass circuits, allowing improved rejection of certain LF frequencies.

[0055] In the above-described embodiment of RF resonator 200 in which a single input / output port is reused to propagate both RF and LF signals through housing 110, only that input / output port is connected to both the RF path and one of the LF paths of oscillator 300 via corresponding means as described above, while the other input / output port is connected in known manner to the corresponding RF or LF path.

[0056] Returning to FIG. 3, the input / output port 200es3 is electrically connected to the electrical ground of the oscillator 300.

[0057] In the above embodiment in which several input / output ports are used to implement return paths to the outside of the housing 110 for all or part of the different LF signals implemented in the RF resonator 200, the input / output ports are each electrically connected to the electrical ground of the oscillator 300.

[0058] 4a and 4b, a particular phase noise performance (NΦ) obtained for oscillator 300 configured to resonate at 418 MHz will now be described.

[0059] More specifically, - curve 400a2 (Fig. 4a) shows the phase noise measured for oscillator 300 as a function of the frequency offset from the resonant frequency of resonator 200 for a given temperature in housing 110 (here 62°C); - Curve 400a1 (Figure 4a) shows the phase noise measured for a reference oscillator having identical components to oscillator 300, except for a known RF resonator 100 used instead of RF resonator 200. Here, the phase noise is also measured for the same given temperature in housing 110 (here 62°C) as a function of frequency offset from the resonant frequency of resonator 100.

[0060] By comparing the curves 400a1 and 400a2, it is noted that the degradation of the phase noise performance of the oscillator 300 is slight (i.e., in fact less than 20%) compared to the reference oscillator. This result is valid in the presence of different additional elements (trap circuits 200cb1, 200cb2, 300cb1, 300cb2 and decoupling means 300md1, 300md2) implemented in the resonator 200 and in the oscillator 300.

[0061] The same conclusion can be drawn by looking at the phase noise performance obtained as a function of temperature within the enclosure 110. More specifically, - curves 400b1 and 400b2 (FIG. 4b) show the phase noise measured, respectively, for oscillator 300 and the reference oscillator, at a frequency offset of 100 Hz from the resonant frequency of the resonator implemented in said oscillator, as a function of temperature (each of curves 400b1 and 400b2 is normalized to the value of curve 400b2 at 28.5° C.); - curves 400b3 and 400b4 (FIG. 4b) show the phase noise measured as a function of temperature, respectively for oscillator 300 and for the reference oscillator, at 1 kHz offset from the resonant frequency of the resonator implemented in said oscillator (each of curves 400b3 and 400b4 is normalized with respect to the value of curve 400b4 at 28.5° C.); - Curves 400b5 and 400b6 (Figure 4b) show the phase noise measured as a function of temperature for oscillator 300 and the reference oscillator, respectively, at a frequency offset of 10 kHz from the resonant frequency of the resonator implemented in the oscillator (each of curves 400b5 and 400b6 is normalized to the value of curve 400b6 at 28.5°C).

[0062] By comparing curves 400b1 and 400b2 with each other, then with curves 400b3 and 400b4, and finally with curves 400b5 and 400b6, it can be noted that the degradation in phase noise performance of oscillator 300 here is slight (i.e., actually less than 20%) relative to the reference oscillator, regardless of the temperature considered within enclosure 110. In order to maintain the disclosure matters at the time of filing of the present application, the contents of claims 1 to 9 at the time of filing of the present application are added as follows. (Claim 1) A temperature controlled radio frequency or RF resonator (200) comprising a thermally insulated housing (110), the interior of the thermally insulated housing (110) including: at least one resonant element (120) configured to deliver an RF output signal (120s) when provided with an RF input signal (120e), wherein the RF output signal corresponds to the RF input signal filtered about a resonant frequency of the at least one resonant element; at least one heating element (130) configured to provide thermal energy within said insulating enclosure when powered by a low frequency or LF power signal (130ali); at least one temperature sensor (140) configured to deliver an LF electrical measurement signal (140mes) as a function of temperature within said thermally insulated enclosure; was implemented, The RF resonator includes at least one input / output port (200es1, 200es2) that traverses the thermally insulated housing; The at least one input / output port includes: One of the RF signals (120e, 120s); and Other signals among the LF electrical signals (130 ali, 140 mes) An RF resonator characterized by propagating at least (Claim 2) Inside the thermally insulated housing, an RF path (200crf) along which the RF signal propagates and in which the at least one resonant element is implemented, the RF path comprising decoupling means for blocking LF electrical components; The RF resonator of claim 1 further comprising: (Claim 3) 3. The RF resonator of claim 2, wherein the decoupling means comprises the at least one resonant element. (Claim 4) Inside the thermally insulated housing, a first LF path (200cbf1) along which the LF power signal propagates and on which the at least one heating element is implemented, the first LF path comprising at least one first trap circuit (200cb1) for blocking RF electrical components; or a second LF path (200cbf2) along which the LF electrical measurement signal propagates and on which the at least one temperature sensor is implemented, the second LF path comprising at least one second trap circuit (200cb2) for blocking RF electrical components; 4. The RF resonator of claim 2, further comprising: a first insulating layer; a second insulating layer; or both. (Claim 5) a first end of the RF path and a first end of the first LF path are electrically connected to a first input / output port that traverses the insulating enclosure; or a second end of the RF path and a first end of the second LF path are electrically connected to a second input / output port that traverses the thermally insulated housing. or having both of these connections; 5. The RF resonator of claim 4. (Claim 6) the RF resonator comprises the first LF path and the second LF path; a second end of the first LF path and a second end of the second LF path are electrically connected to a third input / output port (200es3) that traverses the insulating enclosure; 6. An RF resonator according to claim 4 or 5. (Claim 7) 7. An RF oscillator comprising the RF resonator (200) according to any one of claims 1 to 6. (Claim 8) The RF resonator is as claimed in claim 5 or 6, The first input / output port (200es1) includes at least a first end of the oscillator RF path comprising first decoupling means (300md1) for propagating the RF input signal and the RF output signal, respectively, and blocking LF electrical components; a first LF path of the oscillator, the first LF path including at least one first trap circuit (300cb1) of the oscillator for propagating the LF power signal and blocking RF electrical components; or The second input / output port (200es2) includes at least a second end of the RF path of the oscillator comprising second decoupling means (300md2) for propagating the RF output signal and the RF input signal, respectively, and blocking a second LF electrical component; a second LF path of the oscillator, which includes at least one second trap circuit (300cb2) of the oscillator for propagating the LF electrical measurement signal and blocking RF electrical components; and electrically connected to both of or both of these connections; 8. The RF oscillator according to claim 7. (Claim 9) The RF resonator is as claimed in claim 6, and the third input / output port is 9. The RF oscillator of claim 7 or 8, electrically connected to an electrical ground of the RF oscillator.

Claims

1. A temperature controlled high frequency or RF resonator (200) comprising a thermally insulated housing (110), the interior of which comprises: at least one resonant element (120) configured to deliver an RF output signal (120s) when provided with an RF input signal (120e), wherein the RF output signal corresponds to the RF input signal filtered about a resonant frequency of the at least one resonant element; at least one heating element (130) configured to provide thermal energy within said thermally insulated enclosure when powered by a low frequency or LF power signal (130ali); at least one temperature sensor (140) configured to emit an LF electrical measurement signal (140mes) dependent on the temperature inside said thermally insulated enclosure; was implemented, the RF resonator comprises at least one input / output port (200es1, 200es2) traversing the thermally insulated enclosure; The at least one input / output port includes: one of the RF input signal and the RF output signal (120e, 120s); the other of the LF power signal and the LF electrical measurement signal (130 ali, 140 mes); and a single electrical connection configured to propagate both The RF resonator is disposed inside the thermally insulated housing. an RF path (200crf) along which the RF input signal and the RF output signal propagate and on which the at least one resonant element is implemented, the RF path comprising decoupling means for blocking LF electrical components; a first LF path (200cbf1) along which the LF power signal propagates, on which the at least one heating element is implemented, and which includes at least one first trap circuit (200cb1) that blocks RF electrical components; and a second LF path (200cbf2) along which the LF electrical measurement signal propagates, on which the at least one temperature sensor is implemented, and which includes at least one second trap circuit (200cb2) that blocks RF electrical components, or both.

4. An RF resonator comprising:

2. 2. The RF resonator of claim 1, wherein said decoupling means comprises said at least one resonating element.

3. a first end of the RF path and a first end of the first LF path are electrically connected to a first input / output port that traverses the insulating enclosure; or a second end of the RF path and a first end of the second LF path are electrically connected to a second input / output port that traverses the thermally insulated enclosure; or having both of these connections; The RF resonator of claim 1 .

4. the RF resonator comprises the first LF path and the second LF path; A second end of the first LF path and a second end of the second LF path are electrically connected to a third input / output port (200es3) that traverses the thermally insulated housing. The RF resonator of claim 1 .

5. An RF oscillator comprising an RF resonator (200) according to any one of claims 1 to 4.

6. The RF resonator according to claim 3, The first input / output port (200es1) includes at least a first end of an RF path of the RF oscillator, the first end comprising a first decoupling means (300md1) for carrying the RF input signal and the RF output signal, respectively, and blocking LF electrical components; a first LF path of the RF oscillator, the first LF path including at least one first trap circuit (300cb1) of the RF oscillator for propagating the LF power signal and blocking an RF electrical component; or The second input / output port (200es2) includes at least a second end of the RF path of the RF oscillator comprising second decoupling means (300md2) for carrying the RF output signal and the RF input signal, respectively, and blocking a second LF electrical component; a second LF path of the RF oscillator, the second LF path including at least one second trap circuit (300cb2) of the RF oscillator for propagating the LF electrical measurement signal and blocking an RF electrical component; and electrically connected to both of or both of these connections; An RF oscillator according to claim 5 which recites claim 3.

7. 7. The RF oscillator of claim 5 or 6, wherein the RF resonator is as defined in claim 4, and the third input / output port is electrically connected to an electrical ground of the RF oscillator.

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