Board working device and method for managing excess backup pins

Abstract

A push-up plate 70 on which backup pins 70 are installed upright is divided into a plurality of surplus pin upright installation areas R1-R5 and an order of priority is set for the plurality of surplus pin upright installation areas in a surface mounting device 14, and a control unit 29 therein executes the following: change processing in which the arrangement of backup pins 73 is changed by a changing unit when the type of a substrate P or the front / back thereof are switched; and movement processing in which surplus backup pins 73 not used in backing up of the substrate P after switching among backup pins 73 installed upright in positions overlapping with the work position of the substrate P after switching while in the state prior to changing the arrangement are moved to a surplus pin upright installation area high in the order or priority among the surplus pin upright installation areas not overlapping with the work position of the substrate P after switching.

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a board working device and a method for managing surplus backup pins. [Background technology]

[0002] A mounting line that mounts components on a board is equipped with a plurality of board working devices that perform work on the board. The board working devices include a screen printer that prints a circuit pattern on the board, a dispenser that applies adhesive to the board, and a surface mounter that mounts components on the board. These board working devices are equipped with a backup unit that backs up the board from below to prevent the board from bending while work is being performed on the board. The backup unit is equipped with a plurality of backup pins that back up the board, a plate on which the backup pins are erected, and a lifting mechanism that raises and lowers the plate.

[0003] The backup pins are erected at positions that avoid the circuit pattern printed on the board. In the case of mounting components on both sides of a board, when components are mounted on one side and then mounted on the other side, the backup pins are erected at positions that avoid the circuit pattern printed on one side and the components mounted on one side. Since the positions at which the circuit patterns and components are mounted differ depending on the type and front and back of the board, the positions at which the backup pins are erected are set for each type and front and back of the board. When the type or front and back of the board to be produced is changed, a so-called changeover is performed to change the arrangement of the backup pins according to the type or front and back after the change.

[0004] Conventional board working devices have a storage section for storing surplus backup pins that are not used to back up boards, separate from the plate on which the backup pins are erected. However, providing a storage section requires space for the storage section within the board working device, and there is a problem in that the number of parts increases. For this reason, conventionally, part of the plate has been used as an area for erecting surplus backup pins (for example, see Patent Document 1). Specifically, when mounting components on multiple types of boards, the electronic component mounting device described in Patent Document 1 provides a stock area in a certain area on the backup base outside the areas of the multiple types of boards, and erects surplus backup pins in the stock area (second embodiment of Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2011-14627 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the electronic component mounting device described in Patent Document 1, the problem that arises when a stock area is provided on the backup base has not been fully considered. This specification discloses a technique that can reduce the total setup time over a relatively long period of time when extra backup pins are provided on a plate on which backup pins are provided. [Means for solving the problem]

[0007] A board working device for working on a board, the device comprising: a transport unit that transports the board to a working position corresponding to the type of the board or the front and back sides of the board; a backup unit having a plurality of backup pins and a plate on which the backup pins are erected, the backup unit backing up the board transported to the working position by the transport unit with the backup pins; a working unit that performs the work on the board backed up by the backup unit; a change unit that changes the arrangement of the backup pins erected on the plate; and a control unit, and priorities are set for the multiple surplus pin erection regions, and the control unit executes a change process in which the change unit changes the arrangement of the backup pins when the type or front / back of the board is switched, and a movement process in which the surplus backup pins that are erected in positions that overlap with the working position of the board after switching in a state before the arrangement is changed and that are not used to back up the board after switching, are moved to the surplus pin erection region that has a higher priority among the surplus pin erection regions that do not overlap with the working position of the board after switching. Effect of the Invention

[0008] According to the above configuration, when extra backup pins are provided on a plate on which backup pins are provided, the total setup time can be reduced over a relatively long period of time. [Brief description of the drawings]

[0009] [Figure 1] Schematic diagram of a mounting line according to the first embodiment [Diagram 2] Schematic diagram of a surface mounter seen from above [Diagram 3] Side view of the head unit and backup unit [Figure 4] Schematic diagram of the transport conveyor and push-up plate [Diagram 5] Perspective view of the backup unit [Figure 6]Block diagram showing the electrical configuration of a surface mounter [Figure 7] Flowchart of backup pin layout change process [Figure 8] A schematic diagram showing the work position when mounting components on a product A board. [Figure 9] Schematic diagram showing the work position when mounting components on the product B board [Figure 10] Schematic diagram showing the work position when mounting components on a product C board [Figure 11] Schematic diagram showing the work position when mounting components on the board of type D [Figure 12] Schematic diagram showing the work position when mounting components on the product E board [Figure 13] Schematic diagram showing the work position when mounting components on the product F board DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] (Outline of this embodiment) (1) A board working device according to the present disclosure is a board working device for working on a board, the board working device comprising: a transport unit that transports the board to a working position corresponding to the type of the board or the front and back sides of the board, a backup unit having a plurality of backup pins and a plate on which the backup pins are erected, the backup unit backing up the board transported to the working position by the transport unit with the backup pins, a working unit that performs the work on the board backed up by the backup unit, a change unit that changes the arrangement of the backup pins erected on the plate, and a control unit, The control unit executes a change process in which the change unit changes the arrangement of the backup pins when the type or front / back of the board is switched, and a movement process in which surplus backup pins that are not used to back up the board after switching and that are arranged in positions that overlap with the working position of the board after switching in a state before the arrangement is changed are moved to the surplus pin standing area having a higher priority among the surplus pin standing areas that do not overlap with the working position of the board after switching.

[0011] When surplus backup pins are provided on a plate on which backup pins are provided, it may not be possible to set an excess pin provision area on the plate that does not overlap with the work position of any board. In that case, any area on the plate is set as the excess pin provision area, and if the work position of the board overlaps with that excess pin provision area, the excess backup pins provided in that excess pin provision area are moved to an area that does not overlap with the work position of the board. In this case, if an area that is likely to overlap with the work position of the board is set as the excess pin provision area, the number of times that the work position overlaps with the excess pin provision area and the backup pins must be moved increases. For this reason, the total setup time becomes longer when viewed over a relatively long period of time.

[0012] According to the above board working device, among the backup pins that are erected in positions that overlap with the work position of the board after switching in the state before the layout is changed, the surplus backup pins that are not used to back up the board after switching are moved to surplus pin erection areas with a higher priority among the surplus pin erection areas that do not overlap with the work position of the board after switching. Therefore, if a higher priority is set for surplus pin erection areas that are less likely to overlap with the work position, the number of times that the backup pins must be moved because the work position of the board overlaps with the surplus pin erection area can be reduced. Therefore, the total setup time when viewed over a relatively long period of time can be reduced. Therefore, according to the above-described board working apparatus, when extra backup pins are provided on a plate on which backup pins are provided, the total setup time can be reduced over a relatively long period of time.

[0013] (2) In the change process, if there are not enough backup pins to use for backing up the substrate after the change in position with the working position of the substrate after the change in position in the state before the change in position, the control unit may use the backup pins that are erected in the surplus pin erection area, which have a lower priority among the backup pins that are erected in positions that do not overlap with the working position of the substrate after the change, as the backup pins to make up for the shortage.

[0014] For example, if backup pins erected in surplus pin erection regions with a higher priority are used to make up for the shortage, the number of backup pins erected in the surplus pin erection regions with a higher priority will be reduced. In other words, the number of backup pins erected in surplus pin erection regions that are likely to overlap with the work position of the board will be increased. This increases the number of times that surplus backup pins must be moved. In contrast, if backup pins in surplus pin erection regions with a lower priority are used, it is not necessary to reduce the number of backup pins erected in regions that are unlikely to overlap with the board, and therefore the number of times that surplus backup pins must be moved can be reduced.

[0015] (3) The transport section may have a pair of conveyor belts that transport the substrate, each of the conveyor belts being configured to move in a direction perpendicular to a transport direction of the substrate, each of the four corners of the plate may be defined as a first surplus pin mounting region, and an area other than the four first surplus pin mounting regions may be defined as a second surplus pin mounting region, and a higher priority may be set for the first surplus pin mounting region than for the second surplus pin mounting region.

[0016] When each conveyor belt is configured to be movable in a direction perpendicular to the conveying direction of the board, work on the board can be performed at both work positions on one side and the other side of the perpendicular direction. When work on the board can be performed at both work positions, boards are less likely to overlap at the four corners of the plate when viewed from above compared to other areas. According to the above-described board working device, the four first surplus pin standing regions (i.e., the regions at the four corners of the plate) have a higher priority than the second surplus pin standing regions (i.e., the regions other than the four corners), so that the setup time can be reduced compared to a case in which the first surplus pin standing regions have a lower priority than the second surplus pin standing regions.

[0017] (4) The four first surplus pin installation areas may be an area between one of the conveyor belts and the other of the conveyor belts when one of the conveyor belts is closest to the other of the conveyor belts when the other of the conveyor belts is at the farthest end on the opposite side from the one of the conveyor belts, and an area between one of the conveyor belts and the other of the conveyor belts when one of the conveyor belts is closest to the other of the conveyor belts when the other of the conveyor belts is at the farthest end on the opposite side from the one of the conveyor belts.

[0018] As described above, the first surplus pin standing region is less likely to overlap with the substrate than the second surplus pin standing region. However, if the width of the first surplus pin standing region in the orthogonal direction is wide, the first surplus pin standing region is more likely to overlap with the working position of the substrate. According to the above-mentioned board working device, the four first surplus pin erection areas are areas within the area between one conveyor belt and the other conveyor belt when one conveyor belt is closest to the other conveyor belt when the other conveyor belt is at the very end on the opposite side from the one conveyor belt, and areas within the area between one conveyor belt and the other conveyor belt when one conveyor belt is closest to the other conveyor belt when the other conveyor belt is at the very end on the opposite side from the one conveyor belt, so that the board working position is less likely to overlap the first surplus pin erection area compared to when part of the first surplus pin erection area is outside these areas.

[0019] (5) Different priorities may be set for the four first surplus pin standing regions.

[0020] According to the above-described board working device, the surplus backup pins are moved to the first surplus pin standing region, which has the highest priority among the four first surplus pin standing regions, so that the setup time can be more likely to be reduced.

[0021] [Details of the embodiment of the present disclosure] The present disclosure will be described below with reference to the embodiments. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. The embodiments of the present disclosure can be realized in various forms, such as an apparatus, a system, a method, a computer program for implementing the functions of these apparatus, systems, or methods, and a recording medium on which the computer program is recorded.

[0022] <Embodiment 1> A first embodiment will be described with reference to Figures 1 to 13. In the following description, the left-right direction in Figure 1 is referred to as the X direction, the up-down direction is referred to as the Z direction, and the front-rear direction in Figure 2 is referred to as the Y direction. In the following description, the right side is referred to as the upstream side, and the left side is referred to as the downstream side. In the following description, the reference numerals in the drawings may be omitted for the same components, with some exceptions.

[0023] (1) Mounting line With reference to Fig. 1, a mounting line 1 for mounting components on a board will be described. The mounting line 1 is equipped with a loader 10, a screen printer 11, a print inspection machine 12, a dispenser 13, three surface mounters 14, a post-mounting appearance inspection machine 15, a reflow machine 16, a post-curing appearance inspection machine 17, and an unloader 18, which are arranged in a row via multiple conveyors 19. The screen printer 11, the dispenser 13, and the surface mounters 14 are examples of board working devices. In the following description, the surface mounter 14 will be used as an example of the board working device.

[0024] (2) Overall configuration of surface mounter The overall configuration of the surface mounter 14 will be described with reference to Fig. 2. The surface mounter 14 includes a base 20, a transport conveyor 21 (an example of a transport section), two board stoppers 22, four component supply devices 23, a backup section 24 (see Fig. 3), a head unit 25, a head moving section 26, two component imaging cameras 27, a board imaging camera 28, a control section 29 (see Fig. 6), and an operation section 30 (see Fig. 6). The head unit 25 and the head moving section 26 are examples of a working section and a changing section.

[0025] The base 20 has a rectangular shape in a plan view and has a flat upper surface. In Fig. 2, an area 100 indicated by a two-dot dashed line is a work position where the substrate P is fixed when mounting components E on the substrate P. As will be described in detail later, there are a front work position and a rear work position. Which work position the substrate P is fixed to depends on the type of substrate P and the front and back sides.

[0026] The transport conveyor 21 is equipped with a pair of conveyor belts 31 (front conveyor belt 31A and rear conveyor belt 31B) that circulate in the X-axis direction, a conveyor drive motor 89 (see FIG. 6) that drives the conveyor belts 31, and the like. As will be described in detail later, the transport conveyor 21 is a so-called dual stage (DS) conveyor that can selectively transport the substrate P to a front work position and a rear work position, and each conveyor belt 31 is configured to be able to move independently in the front-rear direction (an example of a direction perpendicular to the substrate transport direction). The transport conveyor 21 also is equipped with a belt movement motor 90 (see FIG. 6) that moves each conveyor belt 31 independently in the front-rear direction.

[0027] The board stopper 22 is a mechanism that abuts against the board P transported by the transport conveyor 21 from the downstream side to position the board P. The two board stoppers 22 are provided spaced apart on the left and right sides at the rear of the conveyor frame of the front conveyor belt 31A. The board stoppers 22 are equipped with a contact portion that abuts against the board P, a movement mechanism that moves the contact portion in the left-right direction, and a lifting mechanism that raises and lowers the contact portion.

[0028] The four component supply devices 23 are arranged in a row in the X-axis direction, two at each end of the front and rear of the transport conveyor 21, for a total of four locations. A plurality of tape feeders 32 are attached to the component supply devices 23 and aligned horizontally in the X-axis direction. Each tape feeder 32 includes a reel (not shown) on which a component tape (not shown) containing a plurality of components E is wound, and an electric feeding device (not shown) that pulls out the component tape from the reel, and supplies components E one by one from a component supply position provided at the end on the transport conveyor 21 side.

[0029] The backup unit 24 (see FIG. 3) is a device that backs up the board P when mounting components E on the board P. The backup unit 24 will be described later. The head unit 25 is equipped with a plurality of mounting heads 40 that pick up and release components E. The head unit 25 will be described later.

[0030] Head moving section 26 moves head unit 25 in the X-axis and Y-axis directions within a predetermined movable range. Head moving section 26 includes a beam 35 that supports head unit 25 so that it can move back and forth in the X-axis direction, a pair of Y-axis guide rails 36 that support beam 35 so that it can move back and forth in the Y-axis direction, an X-axis servo motor 37 that moves head unit 25 back and forth in the X-axis direction, and a Y-axis servo motor 38 that moves beam 35 back and forth in the Y-axis direction.

[0031] The two component imaging cameras 27 are provided between the two component supply devices 23 aligned in the X-axis direction. The component imaging cameras 27 are cameras for capturing images of the components E adsorbed to the mounting head 40 from below to recognize the shape, angle, and the like of the components E. The component imaging cameras 27 are disposed with their imaging surfaces facing upward. The board imaging camera 28 is provided in the head unit 25. The board imaging camera 28 is a camera for capturing an image of a fiducial mark affixed to the board P from above and detecting the position and angle of the board P. The board imaging camera 28 is disposed in an orientation in which the imaging surface faces downward.

[0032] (2-1) Head unit The head unit 25 will be described with reference to Fig. 3. The head unit 25 is a so-called in-line type, and multiple mounting heads 40 are arranged side by side in the X-axis direction. The head unit 25 is provided with a Z-axis servo motor 87 (see Fig. 3) that raises and lowers these mounting heads 40 individually, and an R-axis servo motor 88 (see Fig. 3) that rotates these mounting heads 40 all at once around their axis.

[0033] Each mounting head 40 is for suctioning and releasing a component E, and has a nozzle shaft 40A and a suction nozzle 40B that is detachably attached to the lower end of the nozzle shaft 40A. Negative pressure and positive pressure are supplied to the suction nozzle 40B from an air supply device (not shown) via the nozzle shaft 40A. The suction nozzle 40B picks up the component E when negative pressure is supplied to it, and releases the component E when positive pressure is supplied to it. Although an in-line type head unit 25 has been described as an example here, the head unit 25 may be, for example, a so-called rotary head in which a plurality of mounting heads 40 are arranged on a circumference.

[0034] The head unit 25 is used not only for mounting the components E but also for changing the arrangement of the backup pins 73 provided in the backup section 24 described below. Specifically, a nozzle station (not shown) in which a spare suction nozzle 40B is stored is disposed inside the surface mounter 14. The nozzle station also stores a suction nozzle (hereinafter referred to as a pin suction nozzle) for suctioning the backup pins 73. When changing the arrangement of the backup pins, the suction nozzle 40B attached to the nozzle shaft 40A is stored in the nozzle station, and the pin suction nozzle is attached to the nozzle shaft 40A. The surface mounter 14 uses the pin suction nozzle to pick up and move the backup pin to be moved.

[0035] (2-2) Transport Conveyor The transport conveyor 21 will be described with reference to Fig. 4. As described above, the transport conveyor 21 is a DS conveyor. In Fig. 4, position 60 is the position where the rear conveyor belt 31B has moved to the rearmost position, and position 62 is the position where the rear conveyor belt 31B has moved to the frontmost position. Position 61 is the position where the front conveyor belt 31A has moved to the rearmost position, and position 63 is the position where the front conveyor belt 31A has moved to the frontmost position. The distance between positions 60 and 61, and the distance between positions 62 and 63 are the minimum widths of the pair of conveyor belts 31, respectively.

[0036] At the front work position described above, front conveyor belt 31A is at the frontmost position 63, and rear conveyor belt 31 is at a position spaced rearward from front conveyor belt 31 by the width of substrate P. At the rear work position described above, rear conveyor belt 31B is at the rearmost position 60, and front conveyor belt 31A is at a position spaced forward from rear conveyor belt 31 by the width of substrate P.

[0037] In the case of a product type in which more components E supplied by the component supply device 23 arranged at the front side are mounted than components E supplied by the component supply device 23 arranged at the rear side, the total travel distance in the front-to-rear direction of the head unit 25 is shorter when the components E are mounted at the front work position. In other words, the takt time is shorter. Conversely, in the case of a product type in which more components E supplied by the component supply device 23 arranged at the rear side are mounted, the total travel distance in the front-to-rear direction of the head unit 25 is shorter when the components E are mounted at the rear work position.

[0038] For this reason, in the surface mounter 14, a work position for mounting components E on the board P is set for each type of board P. Specifically, a front work position is set for a type in which more components E are supplied by the front component supply device 23, and a rear work position is set for a type in which more components E are supplied by the rear component supply device 23. The same is true for the front and back sides, and a work position for mounting components E on the front side and a work position for mounting components E on the back side are set for each type. For convenience, in the following explanation, type and front and back sides will be collectively referred to simply as type.

[0039] The work position can also be changed in the left-right direction (transport direction). As described above, since multiple tape feeders 32 are attached side-by-side to component supply device 23, when the number of components E supplied by left tape feeder 32 is greater than the number of components E supplied by right tape feeder 32, the work position is set to the left. Conversely, when the number of components E supplied by right tape feeder 32 is greater than the number of components E supplied by left tape feeder 32, the work position is set to the right.

[0040] (2-3) Backup Section As shown in FIG. 3, the backup section 24 includes a push-up plate 70 (an example of a plate), a base plate 71 arranged below the push-up plate 70, four support posts 72, a plurality of backup pins 73, and a lifting mechanism 74 that raises and lowers the base plate 71.

[0041] As shown in Fig. 5, the push-up plate 70 is a metal member formed in a flat plate shape. A plurality of pin insertion holes 70A are formed in a matrix pattern in the push-up plate 70, penetrating in the plate thickness direction. The base plate 71 is a plate-shaped member, and is connected to the push-up plate 70 via supports 72 standing up from the four corners. The backup pin 73 has a cylindrical portion 73A and a flange portion 73B that protrudes annularly from the cylindrical portion 73A. The outer diameter of the cylindrical portion 73A is the same as or slightly smaller than the inner diameter of the pin insertion hole 70A. The outer diameter of the flange portion 73B is larger than the inner diameter of the pin insertion hole 70A.

[0042] 3, the lifting mechanism 74 includes a plurality of ball screws 74A extending downward from the base plate 71, ball nuts 74B screwed into each ball screw 74A, a lifting motor 74C, and a belt 74D wound around the ball nuts 74B and the lifting motor 74C. When the lifting motor 74C rotates, the ball nuts 74B rotate via the belt 74D, and the ball screws 74A move up and down. This causes the backup unit 24 to move up and down.

[0043] Before substrate P is carried into the work position, backup pins 73 are lowered to a position where their upper ends are below conveyor belt 31. When substrate P is carried into the work position, push-up plate 70 rises, and substrate P is lifted by multiple backup pins 73. As a result, substrate P is backed up by backup section 24.

[0044] (3) Electrical configuration of surface mounter 6, the surface mounter 14 includes a control unit 29 and an operation unit 30. The control unit 29 includes an arithmetic processing unit 81, a motor control unit 82, a storage unit 83, an image processing unit 84, an external input / output unit 85, a feeder communication unit 86, and the like.

[0045] The arithmetic processing unit 81 includes a CPU, a RAM, and the like, and controls each part of the surface mounter 14 by executing a control program stored in the storage unit 83 . Under the control of the arithmetic processing unit 81, the motor control unit 82 controls the rotation of each motor such as the X-axis servo motor 37 and the Y-axis servo motor 38. The memory unit 83 stores various programs and data executed by the arithmetic processing unit 81. The various data include information related to the production of the substrate P, the working position for each type of substrate P, the erected position of the backup pin 73 for each type of substrate P (hereinafter referred to as the backup position), and the like.

[0046] The image processing unit 84 is configured to receive image signals output from the component imaging camera 27 and the board imaging camera 28 . The external input / output unit 85 is a so-called interface, and is configured to receive detection signals output from various sensors 91 provided in the main body of the surface mounter 14. The external input / output unit 85 is also configured to control the operation of various actuators 92 (such as the backup unit 24, the board stopper 22, and the air supply device) based on control signals output from the arithmetic processing unit 81.

[0047] The feeder communication unit 86 is connected to the tape feeder 32 and controls the tape feeder 32 in an integrated manner. The operation unit 30 includes a display device such as a liquid crystal display, and input devices such as a touch panel, a keyboard, a mouse, etc. An operator can operate the operation unit 30 to perform various settings.

[0048] (4) Excess pin installation area 4, a description will be given of the surplus pin standing regions set on the push-up plate 70. The push-up plate 70 is divided into a plurality of surplus pin standing regions R1 to R5, and a higher priority is set for the surplus pin standing region that is less likely to overlap with the working position of the substrate P.

[0049] Specifically, the four corner regions of the push-up plate 70 are usually less likely to be overlapped by the substrate P than the other regions. For this reason, the four corner regions of the push-up plate 70 are each defined as one first surplus pin standing region R1-R4, and the region other than the four first surplus pin standing regions R1-R4 is defined as a second surplus pin standing region R5. A higher priority is set for the four first surplus pin standing regions R1-R4 than for the second surplus pin standing region R5.

[0050] The four first surplus pin erection regions R1 to R4 will be described in more detail. Within the region between the two conveyor belts 31 when the rear conveyor belt 31B is at position 60 and the front conveyor belt 31A is at position 61 (an example of the region between one conveyor belt and the other conveyor belt when one conveyor belt is at the farthest end on the opposite side from the other conveyor belt and the other conveyor belt is closest to one conveyor belt), the left end and the right end are defined as first surplus pin erection regions R2, R3.

[0051] Similarly, within the area between the two conveyor belts 31 when the rear conveyor belt 31B is at position 62 and the front conveyor belt 31A is at position 63 (an example of the area between one conveyor belt and the other conveyor belt when one conveyor belt is closest to the other conveyor belt when the other conveyor belt is at the very end opposite to the first conveyor belt), the left and right ends are defined as first surplus pin installation areas R1, R4.

[0052] There is also a difference in how difficult it is for the substrate P to overlap among the four first surplus pin standing regions R1 to R4. For this reason, different priorities are set for the four first surplus pin standing regions R1 to R4. Specifically, in the first embodiment, the first surplus pin standing region R1 is the least likely to overlap with the work position of the substrate P, followed in order by the first surplus pin standing region R2, the first surplus pin standing region R3, and the first surplus pin standing region R4. For this reason, the highest priority is set for the first surplus pin standing region R1, and the priorities are lower in the order of the first surplus pin standing region R2, the first surplus pin standing region R3, and the first surplus pin standing region R4.

[0053] The priorities among the four first surplus pin areas R1 to R4 can be set in various ways. For example, a factory operator may investigate the first surplus pin areas that overlap with the work positions of the board P for each type of board P in a factory where the surface mounter 14 is used, and set a higher priority to the first surplus pin areas with fewer types of boards that overlap with the work positions. Alternatively, the priorities among the four first surplus pin areas may be set in the surface mounter 14 in advance by the manufacturer of the surface mounter 14.

[0054] Alternatively, the surface mounter 14 may set the priority order. For example, the surface mounter 14 may record the work positions of the board P of one type as work position data each time the surface mounter 14 produces the board P of that type, and after a certain amount of work position data has been accumulated, count the number of types of boards whose work positions overlap for each first surplus pin standing region based on the accumulated work position data, and set a higher priority order for a first surplus pin standing region whose work positions overlap fewer types of boards whose work positions overlap. Alternatively, the operator may arbitrarily set priorities for the four first surplus pin regions R1 to R4.

[0055] For convenience, in the following description, the first surplus pin region R1 will be referred to as the first priority R1, the first surplus pin region R2 as the second priority R2, the first surplus pin region R3 as the third priority R3, the first surplus pin region R4 as the fourth priority R4, and the second surplus pin region R5 as the fifth priority R5.

[0056] In the following explanation, a surplus pin standing area overlapping with the work position of the substrate P refers to a surplus pin standing area whose entirety overlaps with the work position. Therefore, if only a part of the surplus pin standing area overlaps with the work position, the surplus pin standing area is considered not to overlap with the work position. Even if a part of the surplus pin standing area overlaps with the work position, the head unit 25 is capable of setting up backup pins 73 in the area of ​​the surplus pin standing area that does not overlap with the work position and of moving the backup pins 73 set up in that area.

[0057] With reference to FIG. 12, the margins secured on the outside of the conveyor belt 31 and on the left and right sides of the substrate P will be described. There is some kind of protrusion on the outside of the conveyor belt 31 (the front side in the case of the front conveyor belt 31A, and the rear side in the case of the rear conveyor belt 31B). Therefore, in order to prevent the surplus backup pins 73 from interfering with the protrusion, a margin 101 is secured on the outside of the conveyor belt 31. In addition, a moving mechanism and a lifting mechanism for moving the abutment part in the left and right direction are disposed around the abutment part of the upstream substrate stopper 22. Therefore, in order to prevent the surplus backup pins 73 from interfering with these, a margin 102 is secured on the downstream side of the substrate P. In this embodiment, it is assumed that there is also some kind of member on the upstream side of the substrate P. Therefore, a margin 103 is secured on the upstream side of the substrate P. In the surplus pin erection region, the backup pins 73 cannot be erected in the region overlapping with these margins 101, 102, and 103.

[0058] (5) Change in backup pin arrangement Here, first, the flow of the process of changing the arrangement of the backup pins will be described, and then a specific example will be described.

[0059] (5-1) Flow of changing backup pin layout The flow of processing for changing the arrangement of backup pins will be described with reference to Fig. 7. This processing is executed after production of one type of board P has ended and before production of the next type of board P starts. Here, when the control unit 29 changes the arrangement of the backup pins 73, the control unit 29 preferentially uses the backup pins 73 that are erected at a position that overlaps with the working position of the substrate P of the type to be switched before the arrangement is changed, for backing up the substrate P of the type to be switched.

[0060] In S101, the control unit 29 reads out from the memory unit 83 the working position of the substrate P of the next variety to be produced (hereinafter referred to as the post-switching variety) and the backup position of the substrate P of the post-switching variety (in other words, the position of the pin insertion hole 70A in which the backup pin 73 is to be erected). In S102, control unit 29 determines the number of backup pins 73 erected in positions that overlap with the working positions of board P of the new type in the state before the arrangement is changed.

[0061] In S103, if the number determined in S102 is equal to or greater than the number of backup pins 73 used to back up the type of board P after the switch, control unit 29 proceeds to S104, and if less, proceeds to S106. In S104, the control unit 29 moves the backup pin 73, which is erected at a position overlapping with the working position of the substrate P of the type after the change in the arrangement before the change in the arrangement, to the backup position of the substrate P of the type after the change (an example of a change process).

[0062] In S105, the control unit 29 moves surplus backup pins 73 that are not used to back up the post-switching type substrate P, among the backup pins 73 that are erected in positions that overlap with the working position of the post-switching type substrate P in the state before the arrangement is changed, to a surplus pin erection area with a high priority among the surplus pin erection areas that do not overlap with the working position of the post-switching type substrate P (an example of a moving process).

[0063] In S106, the control unit 29 moves the backup pin 73, which is erected at a position overlapping with the working position of the substrate P of the type after the change in the arrangement before the change in the arrangement, to the backup position of the substrate P of the type after the change (an example of a change process). In S107, the control unit 29 preferentially uses backup pins 73 erected in a surplus pin erection area with a low priority among the backup pins 73 erected at positions that do not overlap with the working position of the substrate P of the type after the switch, as backup pins 73 to make up for the shortage (an example of change processing).

[0064] (5-2) Specific examples of changes to backup pin placement 8 to 13, specific examples of changes in the arrangement of the backup pin 73 will be described. In these figures, a white circle 111 inside the pin insertion hole 70A indicates the position of the backup pin 73 before the change, and a black circle 112 indicates the position of the backup pin 73 after the change. When there is a black circle 112 inside the white circle 111, this indicates that the position of the backup pin 73 has not changed between before and after the change.

[0065] Fig. 8 shows a case where a component E is mounted on a board P of type A. The board P of type A is a board that is relatively narrow in width in the front-to-back and left-to-right directions, and is fixed in a working position on the rear and right side. In the example shown in Fig. 8, nine backup pins 73 are used to back up the board P of type A, and ten surplus backup pins 73 are erected in the first priority R1.

[0066] 9 shows the case where type A is switched to type B. Type B board P is wider in the left-right and front-back directions than type A, and its left-right width approximately matches the left-right width of push-up plate 70. Type B board P is fixed to the rear working position. Fourteen backup pins 73 are used to back up type B board P.

[0067] In the example shown in FIG. 9, nine backup pins 73 (backup pins 73 that were erected at the positions indicated by white circles 111 before the arrangement was changed) are erected at positions that overlap with the working positions of the board P of type B before the arrangement of the backup pins 73 is changed. Therefore, these nine backup pins 73 are used preferentially to back up the board P of type B. In this case, five backup pins 73 are in short supply. Therefore, the backup pins 73 erected in the first priority R1 are used to make up for the shortage. The backup pins 73 erected in the first priority R1 are an example of backup pins 73 erected in a surplus pin erection area with a low priority among the backup pins 73 erected at positions that do not overlap with the working positions of the board P of the type after the switch.

[0068] 10 shows a case where the product type is switched from B to C. The product type C board P is fixed in the working position on the front and right side. Twelve backup pins 73 are used to back up the product type C board P. 10, three backup pins 73 are erected at positions overlapping with the working position of the type C board P before the arrangement of the backup pins 73 is changed. In this case, nine backup pins 73 are in short supply. For this reason, among the backup pins 73 erected at positions that do not overlap with the working position of the board P after the switch, seven backup pins 73 erected in the fifth priority R5 and two backup pins 73 erected in the third priority R3 are used as the missing backup pins 73. These backup pins 73 are an example of backup pins erected in a surplus pin erection area with a low priority among the backup pins erected at positions that do not overlap with the working position of the board P after the switch.

[0069] Fig. 11 shows the case where type C is switched to type D. Type D board P is narrower in the front-to-rear width than type B, and its left-to-right width approximately matches the left-to-right width of push-up plate 70. Type D board P is fixed to the front working position. Eleven backup pins 73 are used to back up type D board P. 11, 17 backup pins 73 are installed in positions that overlap with the working position of a type D substrate P in the state before the arrangement of the backup pins 73 is changed. In this case, six backup pins 73 become surplus, and the surplus backup pins 73 are moved to the second priority R2. The second priority R2 is an example of a surplus pin installation region with a high priority among surplus pin installation regions that do not overlap with the working position of a type of substrate P after the switch. The backup pins 73 to be moved as surplus backup pins 73 may be any backup pins 73 that are installed in positions that overlap with the working position of a type D substrate P in the state before the arrangement is changed.

[0070] Fig. 12 shows the case where type D is switched to type E. Type E board P has roughly the same width in the front-to-rear direction as type A, but is narrower in the left-to-right direction than type A. Type E board P is fixed to the working position on the rear side, slightly to the right of the center in the left-to-right direction. Six backup pins 73 are used to back up type E board P. 12, before the arrangement of the backup pins 73 is changed, no backup pins 73 are provided in a position that overlaps with the working position of the type E board P. In this case, there is a shortage of six backup pins 73. For this reason, of the backup pins 73 provided in positions that do not overlap with the working position of the board P after the switch, the six backup pins 73 provided in the fifth priority R5 are used as the missing backup pins 73.

[0071] 13 shows a case where product type E is switched to product type F. Product type F board P is fixed to the rear working position. Twelve backup pins 73 are used to back up product type F board P. 13, before the arrangement of the backup pins 73 is changed, 14 backup pins 73 are erected at positions overlapping with the working positions of the board P of type F. In this case, two backup pins 73 become redundant, and therefore the redundant backup pins 73 are moved to the first priority R1.

[0072] In the example shown in Fig. 13, the two backup pins 73 that were erected under the front conveyor belt 31A are moved to the first priority R1. This is to prevent the two backup pins 73 from interfering with the front conveyor belt 31A. As a result, four backup pins 73 are moved to the first priority R1. Although not shown in the specific example described above, if the backup pins 73 are installed in positions that overlap with the margins 101, 102, 103 of the product type after the changeover before changing the arrangement of the backup pins 73, those backup pins 73 are also moved to the surplus pin installation area with a higher priority.

[0073] (6) Effects of the embodiment According to the surface mounter 14 of the first embodiment, of the backup pins 73 erected in positions overlapping with the working position of the switched board P in the state before the arrangement is changed, the surplus backup pins 73 not used to back up the switched board P are moved to surplus pin erection areas having a higher priority among the surplus pin erection areas that do not overlap with the working position of the switched board P. For this reason, if a higher priority is set for surplus pin erection areas that are less likely to overlap with the working position, the number of times that the backup pins 73 must be moved because the working position of the board P overlaps with a surplus pin erection area can be reduced. 11, if two of the six surplus backup pins 73 are moved to the fifth priority R5, which has a lower priority, instead of the second priority R2, those two backup pins 73 will likely overlap with the working position of the board P of the new type after the switch. If they are likely to overlap with the working position of the board P, it becomes more likely that they will have to be moved as surplus backup pins 73. In contrast, if they are moved to the second priority R2, which has a higher priority, the working position of the board P of the new type after the switch is less likely to overlap with the second priority R2, so it becomes less likely that they will have to be moved as surplus backup pins 73. Therefore, according to the surface mounter 14, when extra backup pins 73 are provided on the push-up plate 70 on which the backup pins 73 are provided, the total setup time can be shortened over a relatively long period of time.

[0074] According to the surface mounter 14, when there is a shortage of backup pins 73, the backup pins 73 erected in surplus pin erection areas with low priority are used preferentially among the backup pins 73 erected in positions that do not overlap with the working position of the board P of the new type. By using the backup pins 73 in the surplus pin erection areas with low priority, it is not necessary to reduce the number of backup pins 73 erected in areas that are unlikely to overlap with the board, so that the number of times that the surplus backup pins 73 must be moved can be reduced.

[0075] According to the surface mounter 14, the four first surplus pin installation areas R1 to R4 (i.e., the four corners of the plate) have a higher priority than the second surplus pin installation area R5 (i.e., the area other than the four corners), so the setup time can be shortened compared to when the first surplus pin installation area has a lower priority than the second surplus pin installation area.

[0076] According to the surface mounter 14, the four first surplus pin installation areas R1-R4 are areas within the area between the front conveyor belt 31A and the rear conveyor belt 31B when the rear conveyor belt 31B is closest to the front conveyor belt 31A when the front conveyor belt 31A is at its frontmost position, and areas within the area between the front conveyor belt 31A and the rear conveyor belt 31B when the front conveyor belt 31A is closest to the rear conveyor belt 31B when the rear conveyor belt 31B is at its rearmost position. Therefore, the working position of the board P is less likely to overlap the first surplus pin installation areas R1-R4 compared to a case where part of the first surplus pin installation areas R1-R4 is outside these areas.

[0077] According to the surface mounter 14, different priorities are set for the four first surplus pin standing regions R1 to R4. In this way, the surplus backup pins 73 are moved to the first surplus pin standing region having the highest priority among the four first surplus pin standing regions R1 to R4, which further increases the possibility of shortening the setup time.

[0078] <Other embodiments> The technology disclosed in this specification is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed in this specification.

[0079] (1) In the above embodiment, a case has been described in which backup pins 73 that are erected at positions that overlap with the working positions of substrate P of the new type before the arrangement is changed are preferentially used to back up substrate P of the new type. However, this is just one example. For example, backup pins 73 that are erected in a surplus pin erection area with a low priority may be preferentially used.

[0080] (2) In the above-described first embodiment, even if there is space in a surplus pin installation region with a higher priority, surplus backup pins 73 may be installed in a surplus pin installation region with a lower priority (e.g., FIGS. 10, 12, and 13). For this reason, after changing the arrangement of the backup pins 73, an operation may be performed to consolidate the surplus backup pins 73 installed in the surplus pin installation region with a lower priority into the surplus pin installation region with a higher priority.

[0081] (3) In the above embodiment 1, the DS conveyor in which the two conveyor belts 31 can move independently in the front-rear direction has been described as an example of the transport conveyor 21, but the transport conveyor 21 may be a single-stage transport conveyor 21 in which only one of the two conveyor belts 31 can move in the front-rear direction. In that case, for example, when only the rear conveyor belt 31B can move in the front-rear direction, only the two rear corners of the push-up plate 70 (i.e., the first surplus pin standing areas R2 and R3) may be the first surplus pin standing areas, and the rest of the area may be the second surplus pin standing areas. This is because when work is performed only at the front work position, the work positions of the board P are unlikely to overlap with the two rear corners.

[0082] (4) In the above embodiment, the backup pins 73 provided in surplus pin provision areas with a low priority among surplus pin provision areas that do not overlap with the working position of the substrate P of the new type have been described as being used preferentially as the backup pins 73 to make up for the shortage. However, any backup pins 73 provided in surplus pin provision areas that do not overlap with the working position of the substrate P of the new type may be used as the backup pins 73 to make up for the shortage, regardless of the priority.

[0083] (5) In the above embodiment, the push-up plate 70 is divided into four corner areas and the other areas as an example of dividing the push-up plate 70 into a plurality of surplus pin areas. However, this is only an example, and how to divide the push-up plate 70 into a plurality of surplus pin areas can be appropriately selected.

[0084] (6) In the above embodiment, the entire area of ​​the push-up plate 70 is used as the surplus pin standing area, but only a part of the area of ​​the push-up plate 70 may be used as the surplus pin standing area. For example, only the first surplus pin standing areas R1 to R4 may be used, and the second surplus pin standing area R5 may be excluded from the surplus pin standing areas. In that case, the backup pins that are set up in an area of ​​the second surplus pin standing area R5 that does not overlap with the working position of the substrate P are moved as surplus backup pins 73 to the first surplus pin standing area, which has a higher priority.

[0085] (7) In the above embodiment, the four first surplus pin installation areas of the push-up plate 70 are described as areas within the minimum width of the pair of conveyor belts 31. However, the front-to-rear width of the first surplus pin installation areas may be wider than the minimum width of the pair of conveyor belts 31.

[0086] (8) In the above embodiment, a different priority order is set for each of the four first surplus pin standing regions, but the priority order for all of the four first surplus pin standing regions may be the same. Alternatively, the same priority order may be set for two or more of the four first surplus pin standing regions.

[0087] (9) In the above embodiment 1, the surplus pin standing region is determined to overlap with the work position only when the entire region overlaps with the work position of the substrate P. In contrast, the surplus pin standing region may be determined to overlap with the work position only when only a part of the region overlaps with the work position.

[0088] (10) In the above embodiment 1, the surface mounter 14 has been described as an example of the board working device, but the board working device may be the screen printer 11 or the dispenser 13. Alternatively, the board working device may be any other device constituting the mounting line 1 as long as it is a device that has a backup unit. [Explanation of symbols]

[0089] 14: Surface mounter (an example of a PCB work device) 21: Transport conveyor (an example of a transport section) 24: Backup Department 25: Head unit (an example of the working and changing parts) 26: Head moving part (an example of a working part and a changing part) 29: Control section 31: A pair of conveyor belts 31A: Front conveyor belt (an example of one of the conveyor belts) 31B: Rear conveyor belt (an example of the other conveyor belt) 70: Push-up plate (example of a plate) 73: Backup pin P: Board R1 to R4: First surplus pin standing area R5: Second excess pin installation area

Claims

1. A substrate working device for working on a substrate, a transport unit that transports the substrate to a work position corresponding to the type of the substrate or the front and back sides of the substrate; a backup unit having a plurality of backup pins and a plate on which the backup pins are erected, and which uses the backup pins to back up the substrate transported to the work position by the transport unit; a working unit that performs the work on the substrate backed up by the backup unit; a change unit for changing the arrangement of the backup pins provided on the plate; A control unit; Equipped with the plate is divided into a plurality of surplus pin standing regions, and priorities are set for the plurality of surplus pin standing regions; The control unit is a change process in which the change unit changes the arrangement of the backup pins when the type or front / back of the board is changed; a moving process for moving surplus backup pins that are not used to back up the substrate after the switching among the backup pins that are erected at positions that overlap with the work position of the substrate after the switching in a state before the arrangement is changed, to a surplus pin erection region that has a higher priority among the surplus pin erection regions that do not overlap with the work position of the substrate after the switching; Run a surplus pin standing area having a smaller number of product types with which the work position has overlapped in the past is considered to be the surplus pin standing area that is less likely to overlap with the work position, and a higher priority is set for the surplus pin standing area that is less likely to overlap with the work position.

2. 2. The substrate working device according to claim 1, In the change process, if there are not enough backup pins to use for backing up the board after the switching with only the backup pins that are erected in positions that overlap with the working position of the board after the switching in the state before the arrangement is changed, the control unit uses the backup pins that are erected in the surplus pin erection area, which has a lower priority among the backup pins that are erected in positions that do not overlap with the working position of the board after the switching, as the backup pins to make up the shortage.

3. 3. The substrate working device according to claim 1, the transport unit has a pair of conveyor belts that transport the substrate, and each of the conveyor belts is configured to be movable in a direction perpendicular to a transport direction of the substrate; each of the four corners of the plate is defined as a first surplus pin standing region, and a region other than the four first surplus pin standing regions is defined as a second surplus pin standing region; A board working device, wherein a higher priority is set for the first surplus pin standing region than for the second surplus pin standing region.

4. 4. The substrate working device according to claim 3, the four first surplus pin installation areas being an area between one of the conveyor belts and the other of the conveyor belts when the one of the conveyor belts is closest to the other of the conveyor belts when the other of the conveyor belts is at the very end of the opposite side to the one of the conveyor belts, and an area between one of the conveyor belts and the other of the conveyor belts when the one of the conveyor belts is closest to the other of the conveyor belts when the other of the conveyor belts is at the very end of the opposite side to the one of the conveyor belts.

5. 5. The substrate working device according to claim 3, further comprising: A board working device, wherein different priorities are set for the four first surplus pin standing regions.

6. A method for managing surplus backup pins in a board working device that performs work on a board, comprising: The substrate working device includes: a transport unit that transports the substrate to a work position corresponding to the type of the substrate or the front and back sides of the substrate; a backup unit having a plurality of backup pins and a plate on which the backup pins are erected, and which uses the backup pins to back up the substrate transported to the work position by the transport unit; a working unit that performs the work on the substrate backed up by the backup unit; a change unit for changing the arrangement of the backup pins provided on the plate; Equipped with the plate is divided into a plurality of surplus pin standing regions, and priorities are set for the plurality of surplus pin standing regions; The management method is as follows: a changing step of changing the arrangement of the backup pins by the changing unit when the type or front / back of the board is changed; a moving step of moving surplus backup pins that are not used to back up the substrate after switching among the backup pins that are erected at positions that overlap with the work position of the substrate after switching in a state before the arrangement is changed, to a surplus pin erection region that has a higher priority among the surplus pin erection regions that do not overlap with the work position of the substrate after switching; Including, In this method, a surplus pin erection area having a smaller number of product types with which the work position has overlapped in the past is considered to be the surplus pin erection area less likely to overlap with the work position, and a higher priority is set for the surplus pin erection area less likely to overlap with the work position.

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