Disk-shaped substrate manufacturing apparatus and method for manufacturing disk-shaped substrate

Abstract

It is detected that there is no carrier in a predetermined position above the lower surface plate. [Solution] The manufacturing apparatus for disk-shaped substrates has a lower platen on which a carrier holding a disk-shaped substrate is placed, an upper platen which moves toward and away from the lower platen above the lower platen, a detection device which detects the presence or absence of a carrier at a predetermined position above the lower platen, and a control device which stops processing of the disk-shaped substrates when the detection device detects that the carrier is not at the predetermined position.

Description

[Technical field]

[0001] The present disclosure relates to a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method. [Background technology]

[0002] Patent Document 1 describes a wet polishing device having a carrier with a holding hole for loading a workpiece, and a polishing section that clamps the workpiece loaded on the carrier between an upper platen and a lower platen arranged opposite each other and polishes it while supplying a polishing liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-283457 A Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, a holding hole is formed in the carrier. The workpiece is held in this holding hole. As a result, the workpiece is subjected to processing such as polishing while being held by the carrier above the lower platen. After processing, the workpiece is carried out from above the lower platen by an unloader or the like. The unloader holds the workpiece but does not hold the carrier, so the carrier usually remains above the lower platen.

[0005] As the disk-shaped substrate as the workpiece is made thinner, the carrier that holds the disk-shaped substrate is also made thinner. If the carrier is made thinner, when the disk-shaped substrate is carried out by an unloader, the carrier adheres to the disk-shaped substrate and is easily discharged together with the disk-shaped substrate. That is, the carrier is not in a predetermined position above the lower platen. However, with the technology described in Patent Document 1, it is not possible to know that the carrier is not in a predetermined position above the lower platen. Therefore, with the technology described in Patent Document 1, the processing of the disk-shaped substrate proceeds even if the carrier is not in a predetermined position above the lower platen.

[0006] The present disclosure provides an apparatus and method for manufacturing disk-shaped substrates, which does not process the disk-shaped substrate when there is no carrier in a predetermined position above a lower platen. [Means for solving the problem]

[0007] The present disclosure includes the following aspects. <1> a lower surface plate on which a carrier for holding a disk-shaped substrate is placed; an upper surface plate that is located above the lower surface plate and moves toward and away from the lower surface plate; a detection device that detects the presence or absence of the carrier at a predetermined position above the lower surface plate; a control device that stops processing of the disk-shaped substrate when the detection device detects that the carrier is not present at the predetermined position; The manufacturing apparatus for a disk-shaped substrate has <2> a transfer device that transfers the disk-shaped substrate to the carrier in a state in which the upper surface plate is spaced from the lower surface plate, The detection device is provided on the transfer device. <1> The manufacturing apparatus for the disk-shaped substrate according to claim 1 . <3> The process stopped by the control device includes the transfer by the transfer device. <1> The manufacturing apparatus for the disk-shaped substrate according to claim 1 . <4> the transfer device includes a loading device that loads the disk-shaped substrate onto the carrier, The detection device is provided at least in the loading device. <2> or <3> The manufacturing apparatus for the disk-shaped substrate according to claim 1 . <5> The detection device includes: a contact body that is provided on the transfer device so as to be vertically movable and that moves upward relative to the transfer device by contacting the carrier from above. <2> ~ <4> 13. The apparatus for manufacturing a disk-shaped substrate according to claim 12 . <6> A method for manufacturing a disk-shaped substrate, comprising the steps of: holding a disk-shaped substrate with a carrier disposed above a lower surface plate; and polishing the disk-shaped substrate with the lower surface plate and the upper surface plate; detecting the presence or absence of the carrier at a predetermined position above the lower surface plate in a state in which the upper surface plate is separated from the lower surface plate; when it is detected that the carrier is not present at the predetermined position, the processing of the disk-shaped substrate is stopped. Method for manufacturing disk-shaped substrate Effect of the Invention

[0008] According to the present disclosure, an apparatus and method for manufacturing disk-shaped substrates are obtained in which processing of the disk-shaped substrate is not performed when there is no carrier in a predetermined position above a lower platen. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a front view showing a schematic configuration of a manufacturing system including a disk-shaped substrate manufacturing apparatus according to an embodiment. [Figure 2A] FIG. 2A is a perspective view showing a magnetic disk substrate as an example of a disk-shaped substrate. [Figure 2B] FIG. 2B is a front view showing a magnetic disk substrate as an example of a disk-shaped substrate. [Diagram 3] FIG. 3 is a cross-sectional view showing the polishing apparatus of the embodiment. [Figure 4] FIG. 4 is a perspective view showing a loader section, a polishing section, and an unloader section of the disk-shaped substrate manufacturing apparatus according to the embodiment. [Diagram 5] FIG. 5 is a cross-sectional view showing the disk-shaped substrate manufacturing apparatus according to the embodiment at the position of a detection device. [Figure 6] FIG. 6 is an enlarged cross-sectional view partially showing the disk-shaped substrate manufacturing apparatus of the embodiment at the position of a detection device. [Figure 7] FIG. 7 is an enlarged cross-sectional view partially showing the disk-shaped substrate manufacturing apparatus of the embodiment at the position of a detection device. [Figure 8] FIG. 8 is an enlarged cross-sectional view partially showing the disk-shaped substrate manufacturing apparatus of the embodiment at the position of a detection device. [Figure 9] FIG. 9 is an enlarged plan view partially showing the disk-shaped substrate manufacturing apparatus of the embodiment at the position of a detection device. [Figure 10] FIG. 10 is a block diagram showing a control device in the disk-shaped substrate manufacturing apparatus of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present disclosure will be described. However, the present disclosure is not limited to the following embodiments. When an embodiment is described with reference to the drawings in this disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. In addition, the size of the members in each drawing is conceptual, and the relative relationship between the sizes of the members is not limited to this.

[0011] In the following description of the drawings, similar parts are given similar symbols. However, the drawings are schematic, and the relationship between thickness and planar dimensions, and the ratio of thickness of each device and each member are different from the actual ones. Therefore, the specific thickness and dimensions should be determined by taking into consideration the following explanation. In addition, there are parts in which the relationship and ratio of dimensions differ between the drawings. In addition, unless otherwise specified in the specification, the number of each component of the present disclosure is not limited to one, and there may be more than one.

[0012] In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0013] In the present disclosure, a numerical range indicated using "~" includes the numerical values ​​before and after "~" as the minimum and maximum values, respectively.

[0014] In the numerical ranges described in the present disclosure in stages, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. In addition, in the numerical ranges described in the present disclosure, the upper or lower limit value of the numerical range may be replaced with a value shown in the examples.

[0015] In the present disclosure, when components are included, each component may contain multiple types of corresponding substances. When multiple types of substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified.

[0016] In the present disclosure, the particles corresponding to each component may include multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0017] In the present disclosure, the terms "layer" and "film" include cases where the layer or film is formed over the entire area when the area in which the layer or film is present is observed, as well as cases where the layer or film is formed over only a portion of the area.

[0018] <Overall configuration of the disk-shaped substrate manufacturing system> The overall configuration of a disk-shaped substrate manufacturing system 12 of this embodiment will be described with reference to FIG.

[0019] The disk-shaped substrate manufacturing system 12 is a system used to manufacture the magnetic disk substrate 102 shown in FIG. 2A. In the present disclosure, the disk-shaped substrate manufacturing system 12 may be configured to include one or more other devices necessary for manufacturing a disk-shaped substrate. The magnetic disk substrate 102 is a substrate for a hard disk in this embodiment, but may be a substrate for other applications. A through-hole 104 is formed in the center of the magnetic disk substrate 102. However, the central through-hole 104 may not be present.

[0020] As shown in FIG. 2B, the magnetic disk substrate 102 has a base material 106. The base material 106 is, for example, an aluminum plate or an aluminum alloy plate, but is not limited thereto in the present disclosure, and may be a glass plate or the like. Hereinafter, the aluminum plate, the aluminum alloy plate, the glass plate, and the like are collectively referred to as the base material 106. Plating layers 108A and 108B are formed on the first and second surfaces of the base material 106. The plating layers 108A and 108B are, for example, electroless nickel-phosphorus plating. In this case, the surface to be polished may be the plating layers 108A and 108B.

[0021] 1, the disk-shaped substrate manufacturing system 12 includes a supply unit 22, a loader unit 24, a polishing unit 26, an unloader unit 28, a cleaning / drying unit 30, and a discharge unit 32. The loader unit 24 and the unloader unit 28 are examples of a transfer device in the technology of the present disclosure. The loader unit 24 is also an example of a carry-in device. The unloader unit 28 is also an example of an unloading device.

[0022] The magnetic disk substrates 102 are transported to the supply unit 22 while being stored in a case 34. The disk-shaped substrate manufacturing system 12 polishes these magnetic disk substrates 102 in the polishing unit 26, and cleans and dries them in the cleaning and drying unit 30. The disk-shaped substrate manufacturing system 12 then stores the cleaned and dried magnetic disk substrates 102 in the case 34 and discharges them.

[0023] In the polishing section 26, it is possible to simultaneously polish a predetermined number of magnetic disk substrates 102. The magnetic disk substrates 102 may be transported from the loader section 24 to the polishing section 26 and removed from the polishing section 26 to the unloader section 28 in a batch, for example, based on the number of substrates to be polished.

[0024] The loader section 24 takes out the magnetic disk substrates 102 one by one from the case 34. The loader section 24 collectively holds a predetermined number of magnetic disk substrates 102. The loader section 24 carries the predetermined number of magnetic disk substrates 102 into the polishing section 26.

[0025] In the unloader section 28, the magnetic disk substrates 102 polished in the polishing section 26 are collectively carried out from the polishing section 26. The unloader section 28 transports the magnetic disk substrates 102 one by one to the cleaning and drying section 30. The magnetic disk substrates 102 cleaned and dried in the cleaning and drying section 30 are stored in cases 34 in groups of a predetermined number, and are discharged from the discharge section 32 to the outside of the apparatus.

[0026] The detailed configuration and operation of each part will be described below.

[0027] <Polishing section> 3, the polishing unit 26 includes a lower surface plate 36, an upper surface plate 38, a sun gear 40, and an internal gear 42. The polishing unit 26 is an example of a polishing device that polishes the magnetic disk substrate 102, and is also an example of a manufacturing device that manufactures the magnetic disk substrate 102.

[0028] The lower surface plate 36 is a disk-shaped member. The lower surface plate 36 has a horizontal upper surface that is annular. A polishing cloth 48 is attached to the upper surface of the lower surface plate 36. The lower surface plate 36 is supported so as to be rotatable about a vertical axis VA. The lower surface plate 36 is connected to a rotation drive unit (not shown). The lower surface plate 36 and the lower support member rotate by receiving the rotational force of the rotation drive unit.

[0029] The upper surface plate 38 is a disk-shaped member. The upper surface plate 38 has a horizontal annular lower surface. A polishing cloth 48 is affixed to the lower surface of the upper surface plate 38. The polishing cloth 48 affixed to the upper surface plate 38 is positioned opposite the polishing cloth 48 affixed to the lower surface plate 36. The upper surface plate 38 is supported so as to be rotatable about a vertical axis VA. The upper surface plate 38 is connected to a surface plate rotation drive unit (not shown). The upper surface plate 38 and the upper support member rotate by receiving the rotational force of the surface plate rotation drive unit.

[0030] The upper surface plate 38 and the upper support member are supported so as to be freely raised and lowered along a vertical axis VA. The upper surface plate 38 and the upper support member are raised and lowered by driving an upper surface plate lifting drive unit (not shown). The upper surface plate 38 approaches and moves away from the lower surface plate 36 by being raised and lowered. The upper surface plate 38 and the polishing cloth 48 are provided with a large number of polishing liquid supply holes and stripping fluid supply holes (neither of which are shown). The polishing liquid and stripping fluid are supplied through the polishing liquid supply holes and stripping fluid supply holes.

[0031] The sun gear 40 is provided at the center of the grinding section 26. The sun gear 40 rotates about a vertical axis VA by being driven by a sun gear rotation drive section (not shown). The sun gear 40 may be a spur gear, a pin gear, or the like, having a row of teeth integrally formed on the side surface.

[0032] The internal gear 42 is arranged concentrically with the sun gear 40. The internal gear 42 has an annular cylindrical body 50. Internal teeth are formed on the inner peripheral surface of the cylindrical body 50. As shown in FIG. 5, an annular gap GP is formed between the inner peripheral side of the cylindrical body 50 and the lower surface plate 36. The internal gear 42 of this embodiment is held non-rotatably by a holding member (not shown). Alternatively, a rotation drive unit that rotates the internal gear may be provided to rotate the internal gear around the vertical axis VA. When the internal gear 42 is rotated, the sun gear 40 may be held non-rotatably. In addition, a spur gear, a pin gear, or the like may be used for the internal gear 42.

[0033] The carrier 44 is a thin, disk-like member. External teeth are formed on the outer circumferential surface of the carrier 44. As shown in Fig. 4, the carrier 44 is formed with a plurality of holding holes 54. The magnetic disk substrates 102 are held in the holding holes 54.

[0034] A plurality of carriers 44 are disposed in the polishing section 26. The carriers 44 mesh with the sun gear 40 and the internal gear 42, and rotate on their own axis while revolving around the sun gear 40 in response to the rotation of at least one of the sun gear 40 and the internal gear 42.

[0035] In the polishing section 26, the upper surface plate 38 is positioned above the magnetic disk substrate 102 held by the carrier 44, and the lower surface plate 36 is positioned below it. By revolving and rotating the carrier 44 in this state, both the upper and lower surfaces of the magnetic disk substrate 102 are polished by the polishing cloth 48.

[0036] A fluid supplying device (not shown) is provided above the upper platen 38. The fluid supplying device supplies a polishing liquid and a stripping fluid to the polishing unit 26.

[0037] <Loader section> As shown in FIG. 4, the loader unit 24 is disposed before the polishing unit 26. The loader unit 24 has a table 56 and a transfer device 58. The table 56 is circular. The table 56 is rotatably installed on a platform (not shown). The transfer device 58 is disposed above the table 56. The transfer device 58 of the loader unit 24 is an example of a loading device of the disclosed technology.

[0038] A plurality of plates 60 are attached on the table 56. The number of plates 60 is the same as the number of carriers 44 in the polishing section 26. The arrangement of the plurality of plates 60 is the same as the arrangement of the carriers 44. Each plate 60 is provided with a plurality of trays 62. The positions of the trays 62 correspond to the holding holes 54 of the carriers 44. The magnetic disk substrates 102 can be placed on the trays 62.

[0039] The transfer device 58 has a movable base 64. The movable base 64 is capable of moving horizontally between the table 56 and the lower surface plate 36 of the polishing section 26. The movable base 64 is also capable of moving up and down relative to the lower surface plate 36. As shown in Fig. 5, gripping plates 66, the same number as the plates 60, are attached to the lower surface of the movable base 64. A gripping unit 68 is provided on the lower surface of the gripping plate 66. The gripping unit 68 has a pair of claws 68T that open and close by supplying and exhausting air, etc.

[0040] <Unloader section> The unloader section 28 is disposed after the polishing section 26. The unloader section 28 has a table 70 and a transfer device 72. The table 70 is circular. The table 70 is rotatably installed on a platform (not shown). The transfer device 72 is disposed above the table 70. The transfer device 72 of the unloader section 28 is an example of a carrying-out device of the disclosed technology.

[0041] The table 70 and the transfer device 72 of the unloader section 28 have the same configuration as the table 56 and the transfer device 58 of the loader section 24, except that each part is arranged symmetrically. In the unloader section 28, the same names as those in the loader section 24 have the same functions, so they are given the same reference numerals in Fig. 4 and detailed explanations are omitted.

[0042] <Detection device> 5 and 6, in this embodiment, the loader unit 24 has a detection device 46. The detection device 46 includes a holder 74, a contact rod 76, and a sensor 78. The contact rod 76 is an example of a contact body of the disclosed technology.

[0043] In this embodiment, the holder 74 is provided on the outer circumferential surface of the gripping plate 66. The shape of the holder 74 is not particularly limited, but for example, the holder 74 may be a rectangular parallelepiped as a whole, and the surface facing the outer circumferential surface of the gripping plate 66 may be curved along the outer circumferential surface of the gripping plate 66. The holder 74 is formed with an insertion hole 74H that passes through the holder 74 in the up-down direction. The cross-sectional shape of the insertion hole 74H in the direction perpendicular to the extension direction is not particularly limited, but is circular in this embodiment.

[0044] A contact rod 76 is inserted through the insertion hole 74H. In this embodiment, the cross-sectional shape of the contact rod 76 in a direction perpendicular to the extending direction is circular corresponding to the insertion hole 74H. Therefore, the overall shape of the contact rod 76 is cylindrical.

[0045] The outer diameter of the contact rod 76 is smaller than the inner diameter of the insertion hole 74H. The contact rod 76, while inserted into the insertion hole 74H, is vertically movable relative to the holder 74. That is, the contact rod 76 is vertically movable relative to the gripping plate 66, which is a part of the loader unit 24.

[0046] A stopper 76S is formed at the upper end of the contact rod 76. The stopper 76S also forms a part of the contact rod 76. The shape of the stopper 76S is not particularly limited, but in this embodiment, it is, for example, cylindrical. The outer diameter of the stopper 76S is larger than the inner diameter of the insertion hole 74H. The downward movement of the contact rod 76 is restricted by the stopper 76S hitting the holder 74.

[0047] For example, as shown in Fig. 6, when the gripping plate 66 is in a position separated from the carrier 44, the lower end of the contact rod 76 is not in contact with the carrier 44. Also, as shown in Fig. 8, even when the carrier 44 is not in a predetermined position above the lower surface plate 36 where it should be, the lower end of the contact rod 76 is not in contact with the carrier 44. In these states, the contact rod 76 is in a lowered position due to its own weight, and the stopper 76S is in contact with the holder 74.

[0048] 7, the length of the contact rod 76 is set so that the lower end of the contact rod 76 comes into contact with the carrier 44 when the gripping plate 66 is lowered to a predetermined position above the lower surface plate 36. When the gripping plate 66 is further lowered with the lower end of the contact rod 76 in contact with the carrier 44, the contact rod 76 slides upward relative to the holder 74 and the gripping plate 66. When the contact rod 76 slides upward, a part of the contact rod 76 including the stopper 76S is located above the upper surface of the gripping plate 66.

[0049] A sensor 78 is provided on the upper surface of the gripping plate 66. The sensor 78 can detect the presence or absence of the contact rod 76 including the stopper 76S. As shown in FIG. 6 or FIG. 8, when the contact rod 76 is in a lowered position relative to the gripping plate 66, the contact rod 76 including the stopper 76S is in a lower position than the upper surface of the gripping plate 66, and the sensor 78 does not detect the contact rod 76. In other words, the fact that the sensor 78 does not detect the contact rod 76 in this way indicates that the contact rod 76 is in a lowered position. On the other hand, as shown in FIG. 7, when the lower end of the contact rod 76 is in contact with the carrier 44 and the contact rod 76 is in an elevated position relative to the gripping plate 66, the sensor 78 detects the contact rod 76 that is in a higher position than the upper surface of the gripping plate 66. In other words, it indicates that the contact rod 76 is in an elevated position. Information regarding the position of the contact rod 76 detected by the sensor 78, ie, whether the contact rod 76 is raised or lowered, is transmitted to a control device 80 shown in FIG.

[0050] The control device 80 executes various processes on the magnetic disk substrate 102 based on information about the vertical positions of the gripping plate 66 and the contact rod 76. Then, when the sensor 78 does not detect the contact rod 76, that is, when the detection device 46 detects that the carrier 44 is not in a predetermined position on the lower base 36, these processes are stopped. In this embodiment, the processes that are stopped in this manner include the operation of the loader unit 24.

[0051] Specifically, as shown in Fig. 6, when the gripping plate 66 is separated from the carrier 44, the control device 80 continues the operation of the loader unit 24. As shown in Fig. 7, when the gripping plate 66 approaches the carrier 44 and reaches a predetermined position, and the sensor 78 detects the contact rod 76, it is determined that the carrier 44 is present above the lower platen 36. In this case, the control device 80 continues the operation of the loader unit 24.

[0052] On the other hand, when the gripping plate 66 approaches the carrier 44 and reaches a predetermined position, and the sensor 78 does not detect the contact rod 76, it can be determined that the carrier 44 is not above the lower platen 36, as shown in Fig. 8. In this case, the control device 80 stops the operation of the loader unit 24.

[0053] A display device 82 is connected to the control device 80. The control device 80 causes the display device 82 to display, for example, whether or not the carrier 44 is present above the lower surface plate 36 based on the information received from the sensor 78. The display device 82 may be, for example, a display that displays an image, or a device that can be visually recognized by an operator, such as a lamp that indicates various operating states of the polishing unit 26. Also, instead of or in addition to these visual devices, a speaker, buzzer, or the like that notifies the operator of the operating state of the polishing unit 26 by voice or the like may be used.

[0054] 9, with the gripping plate 66 in a predetermined position above the lower surface plate 36, the position of the contact rod 76 when the lower surface plate 36 is viewed from above is in the gap GP between the cylindrical body 50 of the internal gear 42 and the lower surface plate 36. If the plate 60 is lowered with the carrier 44 not above the lower surface plate 36, the lower end of the contact rod 76 is not configured to come into contact with the lower surface plate 36.

[0055] FIG. 10 shows a block diagram of the hardware configuration of the control device 80.

[0056] The control device 80 includes a computer 84. The computer 84 includes a processor 86, a memory 88, a storage 90, an input device 92, an output device 94, a storage medium reading device 96, and a communication I / F (Interface) 98. Each of these elements is connected to each other via a bus 100 so as to be able to communicate with each other.

[0057] The storage 90 stores a substrate manufacturing program 112 for manufacturing the magnetic disk substrate 102. The processor 86 is capable of executing various programs and controlling each element. Specifically, the processor 86 reads the program from the storage 90 and executes the program using the memory 88 as a working area. That is, the processor 86 controls each element and performs various arithmetic processing in accordance with the program stored in the storage 90.

[0058] The memory 88 can temporarily store programs and various data as a working area.

[0059] The storage 90 is, for example, a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), etc., and stores various programs and various data. These programs include not only application programs such as the above-mentioned substrate processing program, but also an operating system.

[0060] The input device 92 is a device for performing various inputs to the computer 84. The input device 92 includes operation switches, operation buttons, etc., and may also include a keyboard used in a personal computer, a pointing device such as a mouse, etc.

[0061] The output device 94 is a device for outputting various information from the computer 84, and includes, for example, a display, an indicator lamp, a speaker, etc. A touch panel display can also be used as the output device 94, in which case the touch panel display also functions as the input device 92.

[0062] The storage medium reader 96 is a device that reads data stored in various storage media and writes data to the storage media. Examples of storage media include a CD (Compact Disc)-ROM, a DVD (Digital Versatile Disc)-ROM, a Blu-ray disc, and a USB (Universal Serial Bus) memory.

[0063] The communication I / F 98 is an interface for communicating with other devices, and is compliant with standards such as Ethernet (registered trademark) and FDDI (Fiber Distributed Data Interface).

[0064] In this embodiment, the communication I / F 98 communicates with each of the determination unit 20, the supply unit 22, the loader unit 24, and the polishing unit 26, thereby making it possible to control these devices and obtain various statuses of these devices. This communication may be wireless or wired. The display device 82 shown in FIG. 1 may be included in the output device 94, or may be provided separately from the output device 94.

[0065] Next, the operation of the disk-shaped substrate manufacturing system 12 of this embodiment and the method for manufacturing the disk-shaped substrate will be described.

[0066] When a disk-shaped substrate is manufactured using the disk-shaped substrate manufacturing system 12, the upper surface plate 38 is 36 In a state separated from the polishing section 26, the magnetic disk substrate 102 is transported, that is, loaded, from the loader section 24 to the polishing section 26. Then, the magnetic disk substrate 102 is transferred to the holding hole 54 of the carrier 44.

[0067] With the magnetic disk substrate 102 held in the holding hole 54, the loader unit 24 is retracted from above the lower surface plate 36. Thereafter, the upper surface plate 38 is brought close to the lower surface plate 36, and the polishing cloths 48 come into contact with the upper and lower surfaces of the magnetic disk substrate 102. Then, due to the revolution and rotation of the carrier 44, both surfaces of the magnetic disk substrate 102 are polished by the polishing cloths 48.

[0068] After polishing, the upper platen 38 rises and moves away from the lower platen 36. Thereafter, the unloader section 28 carries the magnetic disk substrate 102 out of the holding hole 54 of the carrier 44, that is, unloads it, and moves it to the cleaning and drying section 30.

[0069] Here, a detailed description will be given of the case where the magnetic disk substrate 102 is transferred to the holding hole 54 of the carrier 44 by the loader unit 24. In this case, the carrier 44 is present above the lower surface plate 36. Gripping plate 66 When the loader unit 24 approaches the carrier 44 to a predetermined position, the tip of the contact rod 76 comes into contact with the carrier 44, and the contact rod 76 rises relative to the gripping plate 66. As a result, the sensor 78 detects the contact rod 76. The control device 80 then controls the loader unit 24 to continue operating.

[0070] However, there are cases where the carrier 44 is not present in a predetermined position above the lower platen 36. For example, when the unloader unit 28 unloads the magnetic disk substrate 102 from the holding hole 54 of the carrier 44, the magnetic disk substrate 102 and the carrier 44 may be unloaded together with each other while still attached to the magnetic disk substrate 102.

[0071] In this state, even if the gripping plate 66 approaches the carrier 44 to a predetermined position, the tip of the contact rod 76 does not contact the carrier 44 because the carrier 44 is not present above the lower surface plate 36. That is, the contact rod 76 is maintained in a lowered position. Because a part of the contact rod 76 does not protrude from the upper surface of the gripping plate 66, the sensor 78 does not detect the stopper 76S. In this case, the control device 80 controls the loader unit 24 to stop operating. That is, the transfer of the magnetic disk substrate 102 to the carrier 44 is stopped. Furthermore, the control device 80 displays, on the display device 82, that the carrier 44 is not present above the lower surface plate 36.

[0072] Thus, in this embodiment, when there is no carrier 44 above the lower surface plate 36, the control device 80 stops the operation of the loader unit 24. If the magnetic disk substrate 102 is transferred to the upper side of the lower surface plate 36 when there is no carrier 44 above the lower surface plate 36, there is a high possibility that a problem will occur when the polishing unit 26 is operated thereafter. However, in this embodiment, the magnetic disk substrate 102 is not transferred to the upper side of the lower surface plate 36 when there is no carrier 44 above the lower surface plate 36, so there is a low possibility that such a problem will occur. Furthermore, the reduction in problems improves the availability of the polishing unit 26.

[0073] The fact that there is no carrier 44 above the lower surface plate 36 is displayed on the display device 82. This display enables the worker to take necessary measures, such as setting the carrier 44 at a predetermined position above the lower surface plate 36. In addition, the worker can stop the transfer of the magnetic disk substrates 102 onto the carrier 44, for example, by turning off the power switch of the loader unit 24.

[0074] In addition, the position of the contact rod 76 when the plate 60 is viewed from above is in the gap GP between the cylindrical body 50 of the internal gear 42 and the lower surface plate 36. Therefore, when the carrier 44 is not above the lower surface plate 36, Gripping plate 66 When the contact rod 76 is lowered, the lower end of the contact rod 76 does not contact the lower surface plate 36. Gripping plate 66Since the carrier 44 does not rise inadvertently, the situation where the carrier 44 is mistakenly recognized as being present when it is not present is suppressed.

[0075] The above is an example of a configuration in which information regarding the vertical position of the contact rod 76 detected by the sensor 78 is transmitted to a control device, and the operation of the loader unit 24 is controlled based on this information. In this case, a sensor using visible light or infrared light, for example, can be used as the sensor 78. Also, the vertical position of the contact rod 76 may be detected by capturing an image of the contact rod 76 with an imaging device. Furthermore, a camera capturing an image of the carrier 44 may be used as the detection device, without using a contact rod. That is, the presence or absence of the carrier 44 is captured from an image captured by the imaging device. In the configuration using the contact rod 76, the contact rod 76 is detected by the sensor 78, so that the presence or absence of the carrier 74 can be detected with a simple structure.

[0076] Furthermore, the configuration for controlling the operation of the loader unit 24 depending on the presence or absence of the carrier 44 above the lower surface plate 36 is not limited to the configuration using the control device 80 described above. For example, a mechanical structure in which the electrical continuity state (conductive or insulated) or electrical resistance changes depending on the position of the contact rod 76 may be used, and the loader unit 24 may be operated or stopped based on the electrical continuity state or electrical resistance.

[0077] In the above example, the detector 46 is provided in the loader section 24. Alternatively, or in combination, the detector 46 may be provided in the unloader section 28. In the configuration in which the detector 46 is provided in the unloader section 28, for example, when the magnetic disk substrate 102 polished in the polishing section 26 is unloaded by the unloader section 28, the detector 46 may detect whether the carrier 44 is being unloaded together with the magnetic disk substrate 102. That is, when the detector 46 detects that the carrier 44 is being unloaded together with the magnetic disk substrate 102 when the magnetic disk substrate 102 is unloaded by the unloader section 28, it is found that the carrier 44 is not present above the lower surface plate 36. Furthermore, the detector 46 may be provided in the lower surface plate 36 or in the internal gear 42.

[0078] Both the loader section 24 and the unloader section 28 are examples of the transport device of the disclosed technology. Therefore, a configuration in which the detection device 46 is provided in the loader section 24 or the unloader section 28 is also an example of a configuration in which the detection device is provided in the transport device. However, the detection device does not have to be provided in the transport device, and may be provided in the polishing section 26, for example. The detection device may also be provided separately from the transport device and the polishing section 26. For example, as described above, in a configuration in which an imaging device is included as the detection device, it is possible to provide the imaging device separately from the transfer device and the polishing section 26.

[0079] In the configuration in which a detector is provided in the loader unit 24 as in the above embodiment, the presence or absence of the carrier 44 above the lower surface plate 36 can be detected in conjunction with the operation of loading the magnetic disk substrate 102 into the carrier 44 .

[0080] In a configuration in which a detector is provided in the unloader section 28, the presence or absence of the carrier 44 at a predetermined position above the lower surface plate 36 can be detected in conjunction with the operation of unloading the magnetic disk substrate 102 from the carrier 44.

[0081] In the above embodiment, the example of stopping the transport device is given as an example of the process that the control device 80 stops when there is no carrier 44 above the lower platen 36, but the process that the control device 80 stops is not limited to this. The process that the control device 80 stops may include, for example, stopping the polishing unit 26 in addition to or together with stopping the transport device. Furthermore, it may include stopping the entire disk-shaped substrate manufacturing system 12 when there is no carrier 44 above the lower platen 36. [Explanation of symbols]

[0082] 12 Manufacturing System 23 Loader section (an example of a transfer device) 28 Unloader section (an example of a transfer device) 36 Lower surface plate 38 Upper surface plate 44 Career 46 Detection Device 58 Transfer equipment 76 Contact rod (an example of a contact body) 102 Magnetic disk substrate (an example of a disk-shaped substrate)

Claims

1. a lower surface plate on which a carrier for holding a disk-shaped substrate is placed; an upper surface plate that is located above the lower surface plate and moves toward and away from the lower surface plate; a transfer device that transfers the disk-shaped substrate to the carrier in a state in which the upper surface plate is spaced apart from the lower surface plate; a detection device provided in the transfer device and configured to detect the presence or absence of the carrier at a predetermined position above the lower base; a control device that stops processing of the disk-shaped substrate when the detection device detects that the carrier is not present at the predetermined position; The manufacturing apparatus for a disk-shaped substrate has

2. The disk-shaped substrate manufacturing apparatus according to claim 1 , wherein the process stopped by the control device includes the transfer by the transfer device.

3. the transfer device includes a loading device that loads the disk-shaped substrate onto the carrier, The disk-shaped substrate manufacturing apparatus according to claim 1 , wherein the detection device is provided at least in the carry-in device.

4. The detection device includes:

2. The disk-shaped substrate manufacturing apparatus according to claim 1, further comprising a contact member that is provided on the transfer device so as to be movable up and down, and that moves upward relative to the transfer device by contacting the carrier from above.

5. A method for manufacturing a disk-shaped substrate, comprising the steps of: holding a disk-shaped substrate with a carrier disposed above a lower surface plate; and polishing the disk-shaped substrate with the lower surface plate and the upper surface plate; transferring the disk-shaped substrate to the carrier in a state in which the upper surface plate is spaced from the lower surface plate; detecting the presence or absence of the carrier at a predetermined position above the lower surface plate in a state in which the upper surface plate is separated from the lower surface plate; when it is detected that the carrier is not present at the predetermined position, the processing of the disk-shaped substrate is stopped. A method for manufacturing a disk-shaped substrate.

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